Implantable ecog electrode and manufacturing method, and readable storage medium

Abstract

Disclosed in the present application are an implantable ECoG electrode and a manufacturing method, and a readable storage medium. The implantable ECoG electrode comprises: an electrode contact area and a pad area, wherein the electrode contact area comprises a plurality of electrode contacts, a hollowed-out portion is provided at a position between two adjacent electrode contacts, other than an end portion of an electrically conductive wire, in the electrode contact area, and the hollowed-out portion penetrates through the top surface and bottom surface of the electrode contact area. The electrode provided in the present application is not prone to displacement and / or dislodgement, and thus the effectiveness of the electrode can be improved.

Description

Implantable ECoG electrode, manufacturing method, and readable storage medium

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 29, 2023, with application number 202323249824.6; and the Chinese patent application filed with the China Patent Office on December 21, 2023, with application number 202311787313.1, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of brain-computer interface technology, and in particular to an implantable ECoG electrode, a manufacturing method, and a readable storage medium. Background Art

[0003] Brain-computer interfaces (BCIs) are an important technology that directly connects the brain to computers or other external devices through sensor terminals. This allows for the extraction and decoding of brain signals, ultimately converting them into command signals that can be used to control external devices, without relying on traditional output channels. A key component of BCIs is information extraction—the process of reading information from the biological brain. Currently, there are two common approaches to information extraction: non-implantable and implantable. Non-implantable methods use a scalp-mounted EEG cap to read EEG (electroencephalogram) data; implantable methods include using implantable microelectrode arrays, deep-brain electrodes, and semi-implantable ECoG (electrocorticography) electrodes to obtain EEG data. Among these technologies, ECoG electrodes have been widely used in the BCI field due to their high signal resolution, relatively long-term stability, and relatively low invasiveness. ECoG measures synchronous signals from cortical neurons by implanting an electrode array beneath the dura mater. These signals are primarily composed of low-frequency components (<200 Hz) with amplitudes ranging from microvolts to millivolts. Compared with traditional rigid MEA (multi-channel electrode array) electrodes, ECoG electrodes use flexible materials and are developing towards ultra-high-density recording, large-area recording, miniaturization, and high biocompatibility. Technical issues

[0004] Existing flexible electrodes have problems such as unreasonable structural settings, complex manufacturing processes and high equipment requirements. Technical Solutions

[0005] In view of this, the present application provides an implantable ECoG electrode and a manufacturing method, and a readable storage medium, aiming to improve at least one of the above technical problems.

[0006] In a first aspect, an embodiment of the present application provides an implantable ECoG electrode, comprising: an electrode contact area and a pad area; wherein the electrode contact area is arranged on a first side of the electrode, and the electrode contact area includes a plurality of electrode contacts; the pad area is arranged on a second side of the electrode away from the first side, and the pad area includes a plurality of solder joints; each of the electrode contacts and a corresponding solder joint is connected by a conductive wire; a hollow portion is provided between two adjacent electrode contacts on the electrode contact area, excluding the end of the conductive wire, and the hollow portion passes through the top and bottom surfaces of the electrode contact area.

[0007] In a second aspect, an embodiment of the present application provides a method for manufacturing a flexible electrode, comprising:

[0008] Arranging an electrode flexible support layer on the surface of the silicon wafer substrate;

[0009] Disposing a photoresist on the electrode flexible supporting layer, wherein the photoresist covers a portion of the surface of the electrode flexible supporting layer;

[0010] Depositing a first metal layer on the electrode flexible support layer, the first metal layer includes a metal layer on the photoresist and an electrode structure metal layer on the electrode flexible support layer, the electrode structure metal layer includes electrode contacts, leads between the electrode contacts and welding points, and electrode welding points;

[0011] removing the photoresist;

[0012] Disposing an encapsulation layer on the electrode flexible support layer, and removing a portion of the encapsulation layer above the electrode contact and the electrode welding point;

[0013] The electrode flexible supporting layer is peeled off from the silicon wafer substrate to obtain a flexible electrode.

[0014] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, which stores a program. When the program is executed by a single-core or multi-core processor, the single-core or multi-core processor executes the method for manufacturing the flexible electrode described above. Beneficial effects

[0015] The implantable ECoG electrode provided in the embodiment of the present application has the following beneficial effects: 1. The electrode contact area of ​​the implantable ECoG electrode of the present application is provided with a hollow portion, which can increase the flexibility of the electrode and / or the passage of cerebrospinal fluid, promote cerebrospinal fluid circulation, facilitate the clearance of metabolites, reduce blockage, help reduce microbial colonization, and thus reduce the risk of infection, thereby facilitating the maintenance of a healthy brain environment, significantly reducing the risk of brain disease, and providing additional health protection for patients. In addition, this hollow design also reduces the area of ​​actual contact between the electrode and the tissue, further reducing the risk of scar formation in the brain, avoiding the obstruction of excessive neural scars on the electrode recording effect, reducing the impact of scars on the quality of the electrode acquisition signal, and is beneficial to the health of long-term implantation. The hollow portion can also act as an anchor point, thereby improving the stability of the electrode on the cortex, making it difficult for the electrode to shift and / or fall off, thereby improving the effectiveness of the electrode. 2. When the electrode contacts of the implantable ECoG electrode of the present application include small contacts and large contacts, the electrode can integrate recording and stimulation functions, that is, it can also perform signal acquisition while running the signal stimulation function, which is convenient and efficient, and has good stability and reliability, and improves the resolution and accuracy of signal acquisition; it achieves miniaturization and lightweight, and has both flexibility and biocompatibility; it also allows customized electrode arrays to be designed according to clinical needs. 3. The flexible substrate and packaging layer of the implantable ECoG electrode of the present application are both polyimide layers, which have good biocompatibility, and the molding process is simple and economical. 4. The metal layer of the implantable ECoG electrode of the present application includes a gold layer, a tantalum layer, a niobium layer, an indium layer, a tungsten layer, a platinum layer and / or a titanium layer, which has no leakage risk, is harmless to the human body, and has good safety. 5. The implantable ECoG electrode of the present application has a simple structure, is easy to use, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following is a brief introduction to the drawings required for use in the embodiments. The drawings herein are incorporated into the specification and constitute a part of this specification. These drawings illustrate embodiments consistent with the present disclosure and are used together with the specification to illustrate the technical solutions of the present disclosure. It should be understood that the drawings only illustrate certain embodiments of the present disclosure and should not be regarded as limiting the scope of protection. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work. Moreover, the same reference numerals are used to represent the same components throughout the drawings. In the drawings:

[0017] FIG1 shows a schematic structural diagram of a specific embodiment of the implantable ECoG electrode of the present application.

[0018] FIG2 shows an enlarged structural diagram of Part A of the present application.

[0019] FIG3 shows a schematic structural diagram of another specific embodiment of the implantable ECoG electrode of the present application.

[0020] FIG4 shows an enlarged structural diagram of Part B of the present application.

[0021] FIG5 shows a schematic structural diagram of another specific embodiment of the implantable ECoG electrode of the present application.

[0022] FIG6 shows an enlarged structural diagram of part C of the present application.

[0023] FIG7 shows a schematic structural diagram of yet another specific embodiment of the implantable ECoG electrode of the present application.

[0024] FIG8 shows an enlarged structural diagram of part D of the present application.

[0025] FIG9 shows a schematic cross-sectional view along the length direction of a specific embodiment of the electrode contact region of the ECoG electrode of the present application.

[0026] FIG10 is a schematic structural diagram of a flexible electrode manufacturing device provided in an embodiment of the present application.

[0027] FIG11 is a schematic flow chart of a method for manufacturing a flexible electrode provided in an embodiment of the present application.

[0028] FIG12 is a cross-sectional view of a flexible electrode provided in an embodiment of the present application during the manufacturing process.

[0029] FIG13 is a cross-sectional view of another flexible electrode provided in an embodiment of the present application during the manufacturing process.

[0030] FIG14 is a cross-sectional view of a flexible electrode during the manufacturing process provided in an embodiment of the present application.

[0031] FIG15 is a cross-sectional view of another flexible electrode provided in an embodiment of the present application during the manufacturing process.

[0032] FIG16 is a cross-sectional view of a flexible electrode during the manufacturing process provided in an embodiment of the present application.

[0033] FIG17 is a cross-sectional view of another flexible electrode provided in an embodiment of the present application during the manufacturing process.

[0034] FIG18 is a cross-sectional view of a flexible electrode during the manufacturing process provided in an embodiment of the present application.

[0035] FIG19 is a flow chart of another method for removing portions of the packaging layer above the electrode contacts and electrode solder joints provided in an embodiment of the present application.

[0036] FIG20 is a cross-sectional view of a flexible electrode provided in an embodiment of the present application during the manufacturing process.

[0037] FIG21 is a cross-sectional view of another flexible electrode provided in an embodiment of the present application during the manufacturing process.

[0038] FIG22 is a cross-sectional view of a flexible electrode during the manufacturing process provided in an embodiment of the present application.

[0039] FIG23 is a cross-sectional view of another flexible electrode provided in an embodiment of the present application during the manufacturing process.

[0040] FIG24 is a cross-sectional view of a flexible electrode during the manufacturing process provided in an embodiment of the present application.

[0041] FIG25 is a cross-sectional view of another flexible electrode provided in an embodiment of the present application during the manufacturing process.

[0042] FIG26 is a cross-sectional view of a flexible electrode provided in an embodiment of the present application.

[0043] FIG27 is a cross-sectional view of another flexible electrode provided in an embodiment of the present application.

[0044] FIG28 is a structural diagram of a flexible electrode provided in an embodiment of the present application. Modes for Carrying Out the Invention

[0045] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0046] In the description of the embodiments of the present disclosure, it should be understood that terms such as "including" or "having" are intended to indicate the presence of the disclosed features, numbers, steps, actions, components, parts, or combinations thereof in the specification, and do not exclude the possibility of the presence of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0047] Unless otherwise specified, “ / ” means or. For example, A / B can mean A or B. “And / or” in this article is only a way to describe the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0048] The terms "first," "second," etc., are used solely to distinguish identical or similar technical features for ease of description and should not be construed as indicating or implying the relative importance or quantity of these technical features. Thus, a feature defined by "first," "second," etc., may explicitly or implicitly include one or more of such features. In the description of the embodiments of this application, unless otherwise specified, the term "plurality" means two or more than two.

[0049] In the description of the embodiments of the present disclosure, unless otherwise specified, the term "plurality" means two or more than two.

[0050] The directional terms used in this application, such as "first side," "second side," "length," "width," and "central region," are used solely for reference to the accompanying drawings. Therefore, the directional terms used are intended to illustrate and facilitate understanding of this application and are not intended to limit this application.

[0051] As shown in FIG. 1 to FIG. 4 , the implantable ECoG electrode of the present application includes an electrode contact area 1 and a pad area 2 .

[0052] in,

[0053] The electrode contact region 1 is provided on a first side of the electrode, and the electrode contact region 1 includes a plurality of electrode contacts 11 .

[0054] The pad region 2 is disposed on a second side of the electrode away from the first side, and includes a plurality of solder joints 21 .

[0055] Each electrode contact 11 is connected to a corresponding welding point 21 via a conductive wire 3 .

[0056] A hollow portion 12 is provided between two adjacent electrode contacts 11 on the electrode contact area 1 , excluding the end portion of the conductive wire 3 . The hollow portion 12 penetrates the top surface and the bottom surface of the electrode contact area 1 .

[0057] During use, the electrode contact area 1 can contact the subdural cortex. The pad area 2 can be welded to the FPC (flexible printed circuit) connector and is responsible for extracting the EEG signals collected by the contacts. The hollow portion 12 can increase the flexibility of the electrode and / or the passage of cerebrospinal fluid, and the hollow portion 12 can act as an anchor point, thereby improving the stability of the electrode on the cortex, making it less likely to shift and / or fall off, thereby improving the effectiveness of the electrode.

[0058] In a specific embodiment, as shown in Figures 1 to 4, there are multiple hollow portions 12, and the multiple hollow portions 12 are arranged at intervals, which can further increase the flexibility of the electrode and / or the passage of cerebrospinal fluid, and can further improve the stability of the electrode on the cortex, making it less likely for the electrode to shift and / or fall off, thereby further improving the effectiveness of the electrode.

[0059] In a specific embodiment, as shown in Figures 1 to 8, the electrode contact 11 includes a small contact 111 and / or a large contact 112. The small contact can be used for recording, for example, signal acquisition. The large contact can be used for stimulation, for example, signal stimulation. When the electrode contact includes a small contact and a large contact, the electrode can integrate the recording and stimulation functions, that is, it can also perform signal acquisition while performing the signal stimulation function, which is convenient and efficient, and has good stability and reliability.

[0060] In a specific embodiment, as shown in Figures 3, 4, 7, and 8, when the plurality of electrode contacts 11 are a plurality of small contacts 111, the plurality of small contacts 111 are arranged in an array, and adjacent small contacts 111 are arranged at equal intervals, which can improve the recording effect of the electrode. For example, the electrode signal acquisition has good uniformity and high sensitivity.

[0061] In a specific embodiment, when the plurality of electrode contacts 11 are a plurality of large contacts 112, the plurality of large contacts 112 are arranged in an array, and two adjacent large contacts 112 are arranged at equal intervals, which can improve the stimulation effect of the electrode. For example, the electrode signal stimulation is more uniform and has higher sensitivity.

[0062] In a specific embodiment, as shown in Figures 1, 2, 5, and 6, when the plurality of electrode contacts 11 are a plurality of small contacts 111 and a plurality of large contacts 112, the plurality of small contacts 111 and the plurality of large contacts 112 are arranged in an array, the small contacts 111 and the large contacts 112 are arranged in an alternating arrangement, and adjacent small contacts 111 and / or large contacts 112 are arranged at equal intervals, which can improve the recording and stimulation effects of the electrode. For example, the electrode signal acquisition has good uniformity, the signal stimulation has good uniformity, and both have high sensitivity.

[0063] In a specific embodiment, as shown in Figures 1 to 8, the outer diameter of the small contact 111 is 5 to 500 microns, which provides a good recording effect of the electrode. The outer diameter of the large contact 112 is 500 to 2500 microns, which provides a good stimulation effect of the electrode.

[0064] In a specific embodiment, as shown in FIG. 1 , FIG. 3 , FIG. 5 , and FIG. 7 , the number of electrode contacts 11 is the same as the number of welding points 21 , which facilitates connection using conductive wires 3 .

[0065] In a specific embodiment, as shown in Figures 1 to 8, the number of electrode contacts is 16 to 1024, and the recording and / or stimulation effect of the electrode is good. For example, the number of electrode contacts is 32, 64, 128, or 256.

[0066] In a specific embodiment, as shown in Figures 1 to 8, the width of the middle region 31 of the conductive line 3 is smaller than the width of the electrode contact region 1 and the width of the pad region 2, and the width of the pad region 2 is smaller than the width of the electrode contact region 1, which can improve the compactness of the electrode layout and facilitate electrode miniaturization.

[0067] In a specific embodiment, as shown in FIG9 , the electrode is configured as a sheet-like film. The electrode includes a flexible substrate 4, a metal layer 5, and an encapsulation layer 6.

[0068] The flexible substrate 4 is arranged at the bottom of the electrode;

[0069] An encapsulation layer 6 is provided on top of the electrodes.

[0070] The metal layer 5 includes electrode contacts 11, solder joints 21, and conductive wires 3. The conductive wires 3 are disposed between the flexible substrate 4 and the packaging layer 6. The electrode contacts 11 and solder joints 21 are exposed outside the packaging layer 6.

[0071] The hollow portion 12 penetrates the top surface of the packaging layer 6 in the electrode contact region 1 and the bottom surface of the flexible substrate 4 .

[0072] The flexible substrate 4 improves the electrode's flexibility. The encapsulation layer 6 enhances the electrode's safety and strength. Electrode contacts 11, exposed through the encapsulation layer 6, can contact tissue and record and / or stimulate electrical signals. Solder pads 21, exposed through the encapsulation layer 6, can contact corresponding solder pads on the flexible printed circuit board.

[0073] In a specific embodiment, as shown in FIG9 , the flexible substrate 4 and the encapsulation layer 6 are both polyimide layers, which have good biocompatibility, a simple molding process, and good economy.

[0074] In a specific embodiment, as shown in FIG9 , the metal layer 5 includes a gold layer, a tantalum layer, a niobium layer, an indium layer, a tungsten layer, a platinum layer and / or a titanium layer, which has no leakage risk, is harmless to the human body, and has good safety.

[0075] In a specific embodiment, as shown in FIG9 , the thickness of the encapsulation layer 6 is less than or equal to the thickness of the flexible substrate 4 , which can improve the support stability and reliability of the electrode.

[0076] In a specific embodiment, as shown in Figure 9, the thickness of the flexible substrate 4 is 0.1 to 100 microns, which provides good electrode support stability and reliability. The thickness of the packaging layer 6 is 0.1 to 100 microns, which provides good electrode packaging stability and reliability.

[0077] In a specific embodiment, as shown in FIG9 , the thickness of the metal layer 5 is 10 to 1000 nanometers, and the metal properties have good stability and reliability.

[0078] During use, the electrode contact area 1 is brought into contact with the subdural cortex, and the pad area 2 is soldered to the flexible circuit board connector. The hollow portion 12 can increase the electrode's flexibility and / or facilitate the passage of cerebrospinal fluid. It also serves as an anchor point, thereby improving the electrode's stability on the cortex and making it less likely to shift and / or fall off, thereby enhancing its effectiveness. Signal acquisition and / or stimulation can also be performed based on the electrode's actual needs.

[0079] As shown in FIG10 , FIG10 is a schematic structural diagram of a flexible electrode manufacturing device provided in an embodiment of the present application.

[0080] It should be noted that Figure 10 is a schematic diagram of the structure of the hardware operating environment of the flexible electrode manufacturing equipment. The flexible electrode manufacturing equipment in the embodiment of the present application can be a terminal device such as a PC, a portable computer, etc.

[0081] As shown in Figure 10, the manufacturing equipment of the flexible electrode may include: a processor 1001, such as a CPU, a network interface 1004, a user interface 1003, a memory 1005, and a communication bus 1002. Among them, the communication bus 1002 is used to realize the connection and communication between these components. The user interface 1003 may include a display screen (Display), an input unit such as a keyboard (Keyboard), and the user interface 1003 may also include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a WI-FI interface). The memory 1005 may be a high-speed RAM memory, or it may be a stable memory (non-volatile memory), such as a disk memory. The memory 1005 may optionally be a storage device independent of the aforementioned processor 1001.

[0082] Those skilled in the art will understand that the flexible electrode manufacturing equipment structure shown in Figure 10 does not constitute a limitation on the flexible electrode manufacturing equipment, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0083] See Figure 11, which is a schematic flow chart of a method for manufacturing a flexible electrode provided in an embodiment of the present application. In this flow, from the perspective of the device, the execution subject can be one or more electronic devices, and from the perspective of the program, the execution subject can correspondingly be the program installed on these electronic devices.

[0084] As shown in FIG11 , an embodiment of the present application provides a method for manufacturing a flexible electrode, comprising:

[0085] S201: Arranging an electrode flexible support layer on the surface of the silicon wafer substrate.

[0086] As shown in Figures 12 and 13, the present application can set an electrode flexible support layer 2a on the surface of the silicon wafer substrate 1a. In the embodiment of the present application, the thickness of the electrode flexible support layer can be between 1um and 1000um. The material of the electrode flexible support layer includes at least one of polyimide, SU-8, liquid crystal polymer, and Parylene-C. As an example, the thickness of the electrode flexible support layer 2a can be 1um, 2um, 4um, 6um and 9um, etc. or any thickness within the range of 0.1um-1000um. In actual applications, the electrode flexible support layer 2a can be coated on the silicon wafer substrate 1a, and the coating method includes spin coating, spraying, etc.

[0087] S202: Disposing a photoresist on the electrode flexible supporting layer, wherein the photoresist covers a portion of the surface of the electrode flexible supporting layer.

[0088] As shown in Figure 14, the present application can set a photoresist 3a on the electrode flexible supporting layer 2a. In the embodiment of the present application, a photoresist 3a of a preset pattern can be formed on the electrode flexible supporting layer 2a after photolithographic development. The area not covered by the photoresist 3a corresponds to the area where the electrode structure metal layer of the flexible electrode finished product is located. As a possible embodiment, the formation of the photoresist in the embodiment of the present application can adopt a positive photoresist inversion process and an undercut process, and the edge profile cross-section of the preset pattern of the photoresist after development is an inverted trapezoid. It should be noted that the edge profile cross-section of the pattern formed after development is an inverted trapezoid. Compared with the process in which the edge profile cross-section of the pattern is square, this shape leaves a gap near the bottom layer after the metal layer is deposited, which is convenient for liquid to flow in and is more conducive to the subsequent stripping process.

[0089] After providing a photoresist on the electrode flexible supporting layer, as shown in FIG15 , the present application may further perform plasma treatment on the upper surface of the electrode flexible supporting layer 2a covered with the photoresist 3a. As a possible implementation, the embodiment of the present application may perform hydrogen plasma treatment on the upper surface of the electrode flexible supporting layer 2a covered with the photoresist 3a to form structure 4a. Structure 4a exists on both the surface of the electrode flexible supporting layer and the surface of the photoresist. Structure 4a is used to increase the roughness of the upper surface of the electrode flexible supporting layer, remove surface impurities, and increase the bonding force between the subsequently deposited metal and the upper surface of the electrode flexible supporting layer.

[0090] S203: depositing a first metal layer on the electrode flexible supporting layer, wherein the first metal layer includes a metal layer on the photoresist and an electrode structure metal layer on the electrode flexible supporting layer.

[0091] As shown in Figure 16, the present application can deposit a first metal layer 5a on the electrode flexible support layer 2a. The first metal layer 5a includes a metal layer on the photoresist and an electrode structure metal layer on the electrode flexible support layer. After the first metal layer 5a is formed, the structure 4a is no longer visible. In practical applications, the present application can deposit the first metal layer 5a on the electrode flexible support layer 2a through a thin film deposition process.

[0092] It should be noted that the thin film deposition process may include any one of electron beam evaporation, thermal evaporation and magnetron sputtering. In an embodiment of the present application, the metal layer of the electrode structure includes electrode contacts, leads between the electrode contacts and the solder joints, and electrode solder joints. The diameter of the electrode contacts may be between 10 microns and 1500 microns. The first metal layer may include at least one of gold, aluminum, tungsten, platinum and titanium. The thickness of the first metal layer may be between 1 nanometer and 2000 nanometers. The size of the electrode contacts in the present application is designed to be at the micron level, which can be closer to neuronal tissue and closer in size to the cortical functional column of our research object. The size of the cortical functional column is between 100 and 500 microns, which is considered to be the basic unit of information processing. The size of the electrode contacts in the present application can obtain higher spatial resolution and finer information, and has better biocompatibility.

[0093] S204: removing the photoresist.

[0094] In actual applications, the present application can use acetone or N-methylpyrrolidone (NMP) to strip the photoresist through a heated water bath, and the metal layer on the photoresist is stripped along with the photoresist. As an example, the photoresist can be stripped by heating the product in a 90°C water bath with N-methylpyrrolidone. As shown in Figure 17, after the present application uses acetone or N-methylpyrrolidone to strip the photoresist 3a through a heated water bath, the electrode flexible supporting layer 2a remains with the first metal layer 5a as the electrode structure metal layer on the electrode flexible supporting layer 2a.

[0095] S205: Disposing a packaging layer on the electrode flexible support layer, and removing a portion of the packaging layer above the electrode contacts and the electrode welding points.

[0096] As shown in FIG18 , in this embodiment of the present application, an encapsulation layer 6a can be further provided on the electrode flexible support layer 2a. The electrode structure metal layer in the first metal layer 5a is encapsulated in the encapsulation layer 6a. The material of the encapsulation layer 6a can include at least one of polyimide, SU-8, silicon carbide, liquid crystal polymer, Parylene-C, ceramic, and silicon dioxide.

[0097] In this application, an encapsulation layer is provided on the electrode flexible support layer, and it is also necessary to remove the portion of the encapsulation layer above the electrode contacts and electrode solder joints. As a possible implementation, referring to FIG. 19 , the specific method provided in this embodiment of the application for removing the portion of the encapsulation layer above the electrode contacts and electrode solder joints may include:

[0098] S1001: Disposing a photoresist on the encapsulation layer, wherein the photoresist covers a portion of the surface of the encapsulation layer.

[0099] As shown in FIG20 , the present application can set a photoresist 7a on the encapsulation layer 6a, and the photoresist 7a covers part of the surface of the encapsulation layer 6a. In the embodiment of the present application, the photoresist 7a can be formed by a positive photoresist inversion process and an undercut process, and the edge profile cross-section of the preset pattern of the photoresist after development is an inverted trapezoid. It should be noted that the edge profile cross-section of the pattern formed after development is an inverted trapezoid. Compared with the process of forming a square edge profile cross-section of the pattern, this shape leaves a gap near the bottom layer after the metal layer is deposited, which facilitates the inflow of liquid and is more conducive to the subsequent stripping process.

[0100] After providing a photoresist on the electrode flexible support layer, as shown in FIG21 , the present application may further perform plasma treatment on the upper surface of the encapsulation layer 6a covered with the photoresist 7a. As a possible implementation, the embodiment of the present application may perform hydrogen plasma treatment on the upper surface of the encapsulation layer 6a covered with the photoresist 7a to form a structure 8a. The structure 8a exists on both the surface of the encapsulation layer 6a and the surface of the photoresist 7a. The structure 8a is used to increase the roughness of the upper surface of the encapsulation layer 6a, remove surface impurities, and increase the bonding strength between the subsequently deposited metal and the upper surface of the encapsulation layer 6a.

[0101] S1002: depositing a second metal layer on the packaging layer, where the second metal layer includes a metal layer on the photoresist and a metal layer on the packaging layer.

[0102] As shown in FIG22 , in an embodiment of the present application, a second metal layer 9a may be deposited on the encapsulation layer 6a. The second metal layer 9a includes a metal layer on the photoresist 7a and a metal layer on the encapsulation layer 6a. After the second metal layer 9a is formed, the structure 8a is no longer visible. The present application may deposit the second metal layer 9a on the encapsulation layer 6a using a physical vapor deposition process. The material of the second metal layer 9a may include at least one of cadmium, aluminum, copper, tungsten, platinum, and titanium.

[0103] S1003: removing the photoresist.

[0104] As shown in Figure 23, after removing the photoresist, the metal layer on the photoresist is also removed. The area on the second metal layer 9a originally covered by the photoresist 7a includes the electrode groove area 11a and the area 10a corresponding to the electrode structure metal layer. The step of removing the photoresist in step S1003 of the present application is similar to step S204. The specific implementation of step S1003 can refer to step S204.

[0105] S1004: Etching the area on the packaging layer that is not covered by the second metal layer, thereby removing the portion of the packaging layer above the electrode contacts and the electrode solder joints.

[0106] The embodiment of the present application can use a reactive ion etching process to etch the area on the packaging layer that is not covered by the second metal layer. The area on the packaging layer that is not covered by the second metal layer includes the area 10a corresponding to the electrode structure metal layer and the electrode groove area 11a. The present application etches the area on the packaging layer that is not covered by the second metal layer, thereby removing the portion of the packaging layer above the electrode contact and the electrode solder joint, and a product as shown in Figure 24 can be obtained, in which the portion of the packaging layer 6a above the area 10a corresponding to the electrode contact and the electrode solder joint and the electrode flexible support layer 2a and the packaging layer 6a in the electrode groove area 11a are removed. Gases that can be used in the reactive ion etching process include oxygen, oxygen and sulfur hexafluoride, oxygen and carbon tetrafluoride, etc., which are not limited in the embodiment of the present application.

[0107] The technical solution of this application designs an electrode slot area 11a on the flexible electrode to help better maintain a good brain environment. The opening design of the electrode slot area 11a can promote the circulation of cerebrospinal fluid, help maintain brain health, cleanliness and normal function of the brain, thereby reducing the abnormal deposition and aggregation of harmful proteins and reducing the risk of other brain diseases. In the technical solution of this application, after etching the area on the packaging layer not covered by the second metal layer, this application can also remove the second metal layer 9a to obtain the product shown in Figure 25.

[0108] S206: Peeling the electrode flexible support layer from the silicon wafer substrate to obtain a flexible electrode.

[0109] In an embodiment of the present application, as shown in FIG26 , the electrode flexible support layer 2a can be peeled off from the silicon wafer substrate 1a to obtain a flexible electrode. As a possible embodiment, as shown in FIG27 , the present application can also deposit metal on the flexible electrode by electroplating, so that a metal layer 12a is added to the electrode contact 5a, so that the electrode contact is flush with the packaging layer or the electrode contact is higher than the packaging layer. In actual applications, the present application can connect the flexible electrode to a PCB board through a connector, and then connect it to an electrochemical workstation via the PCB board. A suitable solution is prepared, such as a PEDOT or PEDOT:PSS solution, and a metal layer 12a is generated by depositing metal on the removed flexible electrode using an electroplating method by means of electrochemical polymerization. It should be noted that the electrode contact area of ​​the flexible electrode in the present application can be parallel to or higher than the insulating layer, which is more conducive to the collection of neural signals.

[0110] The flexible electrode manufactured in the embodiment of the present application can be used to measure the electroencephalographic signals of a living being. After the flexible electrode is manufactured, the flexible electrode can be released into pure water.

[0111] In the embodiment of the present application, the structural diagram of the obtained flexible electrode can be seen in Figure 28. As shown in Figure 28, the metal area of ​​the flexible electrode includes an electrode contact 5a, a solder joint connected to a flexible printed circuit board (FPC), and a wire area. The flexible electrode also includes an encapsulation layer 6, a hollow electrode slot area 11a, a pad area 13a, a single electrode outline slot area 16a, an electrode contact-solder point connection line routing area 14a, and a solder point area window pattern 15a. Among them, the pad area 13a is used for welding with an FPC connector. The cross-sectional structure of the single electrode outline slot area 16a is consistent with that of the electrode slot area 11.

[0112] The shape of the electrode contacts in the embodiments of the present application can be one of square, rectangular, triangular, diamond, elliptical or polygonal shapes. The flexible electrode in the present application has at least one electrode contact, and the number of electrode contacts is at most 100,000. At least one electrode contact in the flexible electrode is used for signal acquisition. At least one electrode contact in the flexible electrode is used for electrical stimulation. The electrode contact for electrical stimulation has a charge injection capacity (CIC) of 10mC / cm2 to -0.01mC / cm2. The electrode contact for electrical stimulation has a charge storage capacity of 10mC / cm2-100mC / cm2. The impedance of the stimulation electrode contact can be between 100 ohms and 10 megohms. The shape of the opening in the flexible electrode can be one of square, rectangular, circular, elliptical or polygonal shapes.

[0113] The flexible electrode manufactured in the embodiment of the present application adopts a flexible material, and an opening is provided on the electrode to reduce the strength of the electrode, making it easy to deform, increasing its compliance, improving the adaptability and compliance of the electrode to the cortical tissue, reducing the risk of potential inflammatory response, and being more suitable for long-term in vivo recording.

[0114] To sum up, the manufacturing method of the flexible electrode provided in the embodiment of the present application is through setting a photoresist on the electrode flexible support layer, and then depositing a first metal layer on the electrode flexible support layer, the first metal layer includes a metal layer on the photoresist and an electrode structure metal layer on the electrode flexible support layer, and removing the photoresist, and the metal layer on the photoresist is also removed together with the photoresist, which can omit the dealloying treatment step in the related technology, so that the manufacturing process of the flexible electrode is relatively simple and the equipment requirements are relatively low.

[0115] In the description of this specification, the description with reference to the terms "some possible embodiments", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application, and the above terms do not necessarily represent the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0116] About the method flow chart of the present application embodiment, some operations are described as the different steps performed in a certain order.Such flow chart belongs to illustrative and non-restrictive.Some steps described in this article can be grouped together and performed in a single operation, or some steps can be divided into multiple sub-steps and can be performed in an order different from that shown in this article.The various steps shown in the flow chart can be realized in any way by any circuit structure and / or tangible mechanism (for example, by the software, hardware (for example, the logical function realized by processor or chip) etc. running on computer equipment and / or its any combination).

[0117] Those skilled in the art will understand that, in the method described in the above specific embodiments, the writing order of each step does not mean a strict execution order, and the specific execution order of each step should be determined by its function and possible internal logic.

[0118] According to the manufacturing method of the flexible electrode provided in the above embodiment, the embodiment of the present application further provides a flexible electrode. The flexible electrode is manufactured by the manufacturing method of the flexible electrode provided in the above embodiment.

[0119] It should be noted that the flexible electrode in the embodiment of the present application is manufactured through the various processes of the embodiment of the aforementioned method and achieves the same effects and functions, which will not be repeated here.

[0120] According to some embodiments of the present application, a non-volatile computer storage medium for a method of manufacturing a flexible electrode is provided, on which computer executable instructions are stored. The computer executable instructions are configured to execute the method of the above embodiment when executed by a processor.

[0121] Computer-readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. The information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer-readable storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory, read-only memory, electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, CD-ROM, digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device. In addition, although the operations of the method of the present application are described in a specific order in the accompanying drawings, this does not require or imply that these operations must be performed in this specific order, or that all shown operations must be performed to achieve the desired result. In addition, certain steps may be omitted, multiple steps may be combined into one step, and / or a step may be broken down into multiple substeps.

[0122] It should also be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0123] Although the spirit and principles of the present disclosure have been described above with reference to several specific embodiments, it should be understood that the present disclosure is not limited to the specific embodiments disclosed, and the division into various aspects does not mean that the features of these aspects cannot be combined. The present disclosure is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. An implantable ECoG electrode, wherein: include: Electrode contact area and pad area; wherein, The electrode contact area is arranged on a first side of the electrode, and the electrode contact area includes a plurality of electrode contacts; The pad area is arranged on a second side of the electrode away from the first side, and the pad area includes a plurality of welding points; Each of the electrode contacts is connected to a corresponding welding point via a conductive wire; A hollow portion is provided between two adjacent electrode contacts on the electrode contact area except for the end of the conductive line, and the hollow portion penetrates the top surface and the bottom surface of the electrode contact area.

2. The implantable ECoG electrode according to claim 1, wherein: The number of the hollow parts is multiple, and the multiple hollow parts are arranged at intervals.

3. The implantable ECoG electrode according to claim 1, wherein: The electrode contacts include small contacts and / or large contacts.

4. The implantable ECoG electrode according to claim 3, wherein: When the plurality of electrode contacts are the plurality of small contacts, the plurality of small contacts are arranged in an array, and two adjacent small contacts are arranged at equal intervals.

5. The implantable ECoG electrode according to claim 3, wherein: When the plurality of electrode contacts are a plurality of large contacts, the plurality of large contacts are arranged in an array, and two adjacent large contacts are arranged at equal intervals.

6. The implantable ECoG electrode according to claim 3, wherein: When the plurality of electrode contacts are a plurality of small contacts and a plurality of large contacts, the plurality of small contacts and the plurality of large contacts are arranged in an array, the small contacts and the large contacts are arranged in an alternating manner, and two adjacent small contacts and / or large contacts are arranged at equal intervals.

7. The implantable ECoG electrode according to claim 3, wherein: The outer diameter of the small contact is 5 to 500 microns, and the outer diameter of the large contact is 500 to 2500 microns.

8. The implantable ECoG electrode according to claim 1, wherein: The number of the electrode contacts is the same as the number of the welding points.

9. The implantable ECoG electrode according to claim 8, wherein: The number of the electrode contacts is 16-1024.

10. The implantable ECoG electrode according to claim 1, wherein: The width of the electrode contact area and the width of the pad area are both greater than the width of the middle area of ​​the conductive line, and the width of the electrode contact area is greater than the width of the pad area.

11. The implantable ECoG electrode according to claim 1, wherein: The electrode is configured as a sheet-like film, and the electrode comprises a flexible substrate, a metal layer and a packaging layer; wherein, The flexible substrate is arranged at the bottom of the electrode; The encapsulation layer is disposed on top of the electrode; The metal layer includes the electrode contacts, the solder joints and the conductive wires; the conductive wires are arranged between the flexible substrate and the packaging layer; the electrode contacts and the solder joints are exposed outside the packaging layer; The hollow portion penetrates the top surface of the packaging layer in the electrode contact area and the bottom surface of the flexible substrate.

12. The implantable ECoG electrode according to claim 11, wherein: The flexible substrate and the packaging layer are both polyimide layers.

13. The implantable ECoG electrode according to claim 11, wherein: The metal layer includes a gold layer, a tantalum layer, a niobium layer, an indium layer, a tungsten layer, a platinum layer and / or a titanium layer.

14. The implantable ECoG electrode according to claim 11, wherein: The thickness of the packaging layer is less than or equal to the thickness of the flexible substrate.

15. The implantable ECoG electrode according to claim 14, wherein: The thickness of the flexible substrate is 0.1 to 100 micrometers, and the thickness of the packaging layer is 0.1 to 100 micrometers.

16. The implantable ECoG electrode according to claim 11, wherein: The thickness of the metal layer is 10 to 1000 nanometers.

17. A method for manufacturing a flexible electrode, wherein: include: Arranging an electrode flexible support layer on the surface of the silicon wafer substrate; Disposing a photoresist on the electrode flexible supporting layer, wherein the photoresist covers a portion of the surface of the electrode flexible supporting layer; Depositing a first metal layer on the electrode flexible support layer, the first metal layer includes a metal layer on the photoresist and an electrode structure metal layer on the electrode flexible support layer, the electrode structure metal layer includes electrode contacts, leads between electrode contacts and welding points, and electrode welding points; removing the photoresist; Disposing a packaging layer on the electrode flexible support layer, and removing the portion of the packaging layer above the electrode contact and the electrode welding point; The electrode flexible support layer is peeled off from the silicon wafer substrate to obtain a flexible electrode.

18. The method according to claim 17, wherein: The step of providing a photoresist on the electrode flexible support layer comprises: A photoresist with a preset pattern is formed on the electrode flexible support layer after photolithography and development.

19. The method according to claim 18, wherein: The photoresist is formed by a positive photoresist inversion process, and the edge profile cross-section of the photoresist of the preset pattern after development is an inverted trapezoid.

20. The method according to claim 17, wherein: After providing photoresist on the electrode flexible support layer, the method further comprises: Plasma treatment is performed on the upper surface of the electrode flexible support layer covered with the photoresist.

21. The method according to claim 17, wherein: The step of depositing a first metal layer on the electrode flexible support layer comprises: A first metal layer is deposited on the electrode flexible supporting layer by a thin film deposition process.

22. The method according to claim 21, wherein: The thin film deposition process includes any one of electron beam evaporation, thermal evaporation and magnetron sputtering.

23. The method according to claim 17, wherein: The removing of the photoresist comprises: The photoresist is stripped by using acetone or N-methylpyrrolidone in a heated water bath, and the metal layer on the photoresist is stripped along with the photoresist.

24. The method of claim 17, wherein: The removing of the portion of the packaging layer above the electrode structure metal layer comprises: Disposing a photoresist on the encapsulation layer, wherein the photoresist covers a portion of the surface of the encapsulation layer; Depositing a second metal layer on the encapsulation layer, wherein the second metal layer includes a metal layer on the photoresist and a metal layer on the encapsulation layer; removing the photoresist; The area on the packaging layer not covered by the second metal layer is etched, so as to remove the portion of the packaging layer above the electrode contact and the electrode pad.

25. The method according to claim 24, wherein: After etching the area on the packaging layer not covered by the second metal layer, the method further comprises: The second metal layer is removed.

26. The method according to claim 24, wherein: The area on the packaging layer not covered by the second metal layer includes the area corresponding to the electrode structure metal layer and the electrode groove area; The etching of the area on the packaging layer not covered by the second metal layer, thereby removing the portion of the packaging layer above the electrode contact and the electrode welding point, comprises: The area on the packaging layer not covered by the second metal layer is etched, so as to remove the portion of the packaging layer above the electrode contact and the electrode welding point and the electrode flexible supporting layer and the packaging layer in the electrode groove area.

27. The method according to claim 24, wherein: The etching of the area on the packaging layer not covered by the second metal layer comprises: A reactive ion etching process is used to etch the area on the packaging layer that is not covered by the second metal layer.

28. The method of claim 24, wherein: After providing photoresist on the encapsulation layer, the method further comprises: Plasma treatment is performed on the upper surface of the packaging layer covered with the photoresist.

29. The method of claim 24, wherein: The material of the second metal layer includes at least one of cadmium, aluminum, copper, tungsten, platinum and titanium.

30. The method of claim 17, wherein: The method further comprises: Metal is deposited on the flexible electrode by electroplating, so that the electrode contact is flush with the packaging layer or the electrode contact is higher than the packaging layer.

31. The method according to claim 30, wherein: The diameter of the electrode contact is between 10um and 1500um.

32. The method according to any one of claims 17 to 31, wherein: The first metal layer includes at least one of gold, tungsten, platinum and titanium.

33. The method according to any one of claims 17 to 31, wherein: The thickness of the first metal layer is between 1 nanometer and 2000 nanometers.

34. The method according to any one of claims 17 to 31, wherein: The thickness of the electrode flexible support layer is between 1um and 1000um.

35. The method according to any one of claims 17 to 31, wherein: The material of the electrode flexible support layer includes at least one of polyimide, SU-8, liquid crystal polymer and Parylene-C.

36. The method of claim 17, wherein: The removing of the portion of the encapsulation layer above the electrode structure metal layer comprises: providing a photoresist on the encapsulation layer, wherein the photoresist covers a portion of the surface of the encapsulation layer; Depositing a second metal layer on the encapsulation layer, wherein the second metal layer includes a metal layer on the photoresist and a metal layer on the encapsulation layer; removing the photoresist; Etching the area on the packaging layer that is not covered by the second metal layer, thereby removing the portion of the packaging layer above the electrode contact and the electrode pad; The area on the packaging layer not covered by the second metal layer includes the area corresponding to the electrode structure metal layer and the electrode groove area; The etching of the area on the packaging layer not covered by the second metal layer, thereby removing the portion of the packaging layer above the electrode contact and the electrode welding point, comprises: The area on the packaging layer not covered by the second metal layer is etched, so as to remove the portion of the packaging layer above the electrode contact and the electrode welding point and the electrode flexible supporting layer and the packaging layer in the electrode groove area.

37. A computer-readable storage medium storing a program, which, when executed by a single-core or multi-core processor, enables the single-core or multi-core processor to execute the method according to any one of claims 17 to 36.

38. A flexible electrode, wherein: Prepared by the method according to any one of claims 17 to 36.

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