Composite body, method for manufacturing composite body, laminate, and method for manufacturing laminate

Abstract

Provided is a technique that makes it possible to ensure insulating properties in an insulation layer that constitutes a laminate even when a circuit pattern having a thickness of 0.5 mm or greater is used.　A composite body (1) comprises: an electrical member (2) provided with a circuit portion (2a) and a gap portion (2b), the electrical member (2) having a thickness of 0.5 mm or greater; and an elastic member (3) that is disposed on one surface side of the electrical member (2) in a state in which a portion of the elastic member (3) enters the gap portion (2b).

Description

Composite, method for manufacturing composite, and method for manufacturing laminate

[0001] The present invention relates to a composite, a method for manufacturing a composite, and a method for manufacturing a laminate.

[0002] Laminates in which a metal base substrate, an insulating layer, and a circuit pattern are laminated have been known as circuit boards on which electronic components such as semiconductor chips are mounted (see, for example, Patent Document 1). This type of laminate is manufactured, for example, by preparing a resin composition containing a resin and a filler, applying the resin composition to a metal base substrate and pre-curing it, and then arranging the circuit pattern on the resin composition and performing heat pressing.

[0003] In recent years, there have been increasing opportunities to use electronic components through which large currents flow, such as high-brightness LEDs and power modules. In order to obtain a laminate that can handle large currents and that can be used with these types of electronic components, it is effective to increase the thickness of the circuit pattern so that the resistance value can be reduced and sufficient heat dissipation can be ensured when a large current flows.

[0004] JP 2002-012653 A JP 2009-206225 A

[0005] When a heat press is performed to manufacture a laminate, the resin composition in contact with the conductive portions (metal portions) constituting the circuit pattern is pressurized, while the gaps between adjacent conductive portions are not in contact with the resin composition, resulting in insufficient pressure being applied to the resin composition in these gaps. In other words, when a heat press is performed, the resin composition receives uneven pressure depending on whether or not it is in contact with the conductive portions. In the areas where the gaps are located, insufficient pressure prevents the gas contained in the resin composition from being discharged, resulting in the formation of numerous voids, which may result in insufficient insulation. As the thickness of the circuit pattern increases, the depth of these gaps increases, making insufficient pressure more likely to occur. This problem occurs particularly frequently when the thickness of the circuit pattern is 0.5 mm or more. Furthermore, in such laminates, multiple relatively thick electronic components may be used instead of the circuit pattern. In a laminate using such electronic components, the resin composition in contact with multiple electronic components is pressurized, as in the conductive portions described above, but the gap portions located between adjacent electronic components are not in contact with the resin composition, and therefore the resin composition is likely to be insufficiently pressurized in these gap portions, resulting in an increased frequency of the above-described defects.

[0006] In view of these problems, the present invention aims to provide a technology that can ensure the insulation of the insulating layer that constitutes the laminate even when a circuit pattern or multiple electronic components having a thickness of 0.5 mm or more is used. In the following description, the above-mentioned circuit pattern and multiple electronic components are collectively referred to as "electrical members," and the conductive portions of the circuit pattern and the electronic components are collectively referred to as "circuit portions."

[0007] The present invention is a composite comprising an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more, and an elastic member arranged on one side of the electrical component with a portion of the elastic member inserted into the gap portion.

[0008] The above-described composite preferably includes a mesh sheet laminated on the portion of the elastic member that fits into the gap.

[0009] The composite preferably includes a release film laminated on the other side of the electrical member relative to the mesh sheet.

[0010] The release film preferably has through holes that communicate with the mesh sheet.

[0011] The present invention also relates to a composite comprising an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more, an elastic member arranged on one side of the electrical component, and an adhesive layer laminated on the other side of the electrical component relative to the elastic member.

[0012] The present invention also provides a composite comprising: an electrical component having a thickness of 0.5 mm or more and including a circuit portion and a gap portion; an elastic member arranged on one side of the electrical component; a mesh sheet having first openings corresponding to the circuit portion and arranged on the other side of the elastic member with the circuit portion inserted into the first opening and entering the gap portion; and a release film having second openings corresponding to the circuit portion and arranged on the other side of the mesh sheet with the circuit portion inserted into the second opening and entering the gap portion.

[0013] The above-described composite preferably further comprises an adhesive layer disposed between the elastic member and the mesh sheet.

[0014] The present invention is also a method for manufacturing a composite, comprising the steps of: preparing an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more; arranging an elastic member on one side of the electrical component; and pressing the elastic member relative to the electrical component in a vacuum atmosphere at a predetermined temperature, thereby causing a portion of the elastic member to enter the gap portion.

[0015] The method for manufacturing the above-mentioned composite preferably includes the steps of preparing a mesh sheet having a first opening corresponding to the circuit portion, and laminating the mesh sheet to the elastic member on the other side of the electrical member, the step being carried out before the step of inserting a portion of the elastic member into the gap portion.

[0016] The method for manufacturing the above-mentioned composite preferably includes the steps of preparing a release film having a second opening corresponding to the circuit portion, and laminating the release film to the mesh sheet on the other side of the electrical member, the step being carried out before the step of inserting a portion of the elastic member into the gap portion.

[0017] Furthermore, it is preferable that the manufacturing method of the above-mentioned composite further comprises a step of forming a through hole in the release film at a location different from the second opening, which is carried out before the step of laminating the release film.

[0018] The present invention also provides a method for manufacturing a laminate comprising a metal base substrate, an insulating layer formed by curing a resin composition, and an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more, the method comprising the steps of: laminating the resin composition in a semi-cured state onto the metal base substrate; laminating a composite manufactured by any one of the composite manufacturing methods described above onto the semi-cured resin composition to prepare a pre-pressure laminate; curing the resin composition in a semi-cured state under a vacuum atmosphere and at a predetermined temperature surrounding the pre-pressure laminate; and removing at least the elastic member from the pre-pressure laminate to form the laminate.

[0019] The present invention also provides a method for manufacturing a laminate comprising a metal base substrate, an insulating layer formed by curing a resin composition, and an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more, the method comprising the steps of: preparing a pre-laminated laminate comprising the metal base substrate, the semi-cured resin composition, the electrical component, an adhesive layer, and an elastic component laminated in that order; curing the semi-cured resin composition in a vacuum atmosphere surrounding the pre-laminated laminate at a predetermined temperature; and removing at least the elastic component to form the laminate.

[0020] The present invention also provides a method for manufacturing a laminate comprising a metal base substrate, an insulating layer formed by curing a resin composition, and an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more, the method comprising the steps of: preparing a mesh sheet having a first opening corresponding to the circuit portion; preparing a release film having a second opening corresponding to the circuit portion; preparing a pre-pressure laminate in which the metal base substrate, the semi-cured resin composition, the electrical component, the release film located where the second opening enters the circuit portion, the mesh sheet located where the first opening enters the circuit portion, and an elastic member are laminated in this order; curing the semi-cured resin composition in a state where the pre-pressure laminate is surrounded by a vacuum atmosphere at a predetermined temperature; and removing at least the elastic member to form the laminate.

[0021] In the above-described method for manufacturing a laminate, it is preferable that the pre-pressure-bonded laminate further comprises an adhesive layer disposed between the elastic member and the mesh sheet.

[0022] According to the composite, the method for manufacturing the composite, and the method for manufacturing the laminate of the present invention, the insulation properties of the insulating layer constituting the laminate can be ensured even when electrical components having a thickness of 0.5 mm or more are used.

[0023] 6A is a diagram showing a composite manufactured by a composite manufacturing method according to one embodiment of the present invention. FIG. 6B is a diagram showing a laminate manufactured by a laminate manufacturing method according to one embodiment of the present invention. FIG. 6C is a diagram showing the flow of a composite manufacturing method according to one embodiment of the present invention. FIG. 6D is a diagram relating to a composite manufacturing method according to one embodiment of the present invention. FIG. 6E is a diagram showing the flow of a laminate manufacturing method according to one embodiment of the present invention. FIG. 6F is a diagram showing an example of an autoclave used in a laminate manufacturing method according to one embodiment of the present invention. FIG. 6G is a partially enlarged view of part A shown in FIG. 6A. FIG. 6G is a diagram showing the configuration of a comparative example of a composite used in a confirmation test of a laminate. FIG. 6H is a diagram showing the configuration of Test Example 1 of a composite used in a confirmation test of a laminate. FIG. 6I is a diagram showing the configuration of Test Example 2 of a composite used in a confirmation test of a laminate. FIG. 6I is a diagram showing the configuration of Test Example 3 of a composite used in a confirmation test of a laminate. FIG. 6I is a diagram showing the configuration of Test Example 4 of a composite used in a confirmation test of a laminate. FIG. 6I is a diagram showing the configurations of Test Examples 5 and 6 of composites used in a confirmation test of a laminate. FIG. 6I is a diagram showing the configuration of Test Example 7 of a composite used in a confirmation test of a laminate. FIG. 6I is a diagram showing a modified example of the assembly shown in FIG. 1. FIG. 6I is a diagram (cross-sectional view from the side) showing a modified example of the laminate shown in FIG. 2. FIG. 9A is a plan view of FIG. 9A.

[0024] Hereinafter, an embodiment of a composite, a method for manufacturing a composite, and a method for manufacturing a laminate according to the present invention will be described with reference to the accompanying drawings. The drawings are schematic, and the thickness and width of each part, the ratio of each part, and the like may differ from those actually implemented. Furthermore, for convenience, the following description will be given in the illustrated orientation, but this does not limit the orientation when manufacturing or using the composite or laminate according to the present invention. That is, for example, even when a description is given of one component being stacked on the lower surface of another component, this does not limit the manufacturing orientation, and stacking the two components upside down from the illustrated state is also included in the present invention. Furthermore, using the composite or laminate upside down from the illustrated state is also included in the present invention.

[0025] In the Japanese Industrial Standards, a "sheet" refers to a thin, flat product whose thickness is small relative to its length and width, and a "film" refers to a thin, flat product whose thickness is extremely small compared to its length and width and whose maximum thickness is arbitrarily limited, and which is usually supplied in the form of a roll (JIS K 6900). However, the boundary between a sheet and a film is generally unclear, and the term "film" includes "sheet," and the term "sheet" includes "film." Therefore, in the present invention, "film" includes "sheet," and "sheet" includes "film."

[0026] 1 is a diagram showing a composite 1 produced by the composite production method according to the present embodiment. The composite 1 includes a circuit pattern 2, an elastic member 3, an adhesive layer 4, a mesh sheet 5, and a release film 6. The circuit pattern 2 is a type of "electrical member" in this specification.

[0027] 2 is a diagram showing a laminate 11 manufactured by the laminate manufacturing method according to this embodiment. The laminate 11 includes a metal base substrate 12, an insulating layer 13, and a circuit pattern 2. The circuit pattern 2 included in the laminate 11 is provided using the composite 1 described above.

[0028] The circuit pattern 2 is obtained by forming a predetermined pattern using a conductive material. Examples of such materials include a metal plate made of copper or aluminum. The thickness of the metal plate (thickness of the circuit pattern 2) is 0.5 mm or more. There is no particular upper limit to the thickness of the metal plate (thickness of the circuit pattern 2), but an example is 2.0 mm or less. Methods for forming a predetermined pattern using a metal plate include, for example, forming a mask pattern on the metal plate and removing exposed portions of the metal plate by etching, or punching out the metal plate using a mold. Here, the metal portions of the circuit pattern 2 are referred to as conductive portions 2a, and the portions formed as gaps after the metal has been removed are referred to as gap portions 2b. The conductive portions 2a are a type of "circuit portion" in this specification.

[0029] The elastic member 3 is a member that generates elastic force when pressed, and is formed from, for example, a thermoplastic elastomer such as a urethane-based, ester-based, styrene-based, olefin-based, butadiene-based, or fluorine-based elastomer, or a thermosetting elastomer such as urethane rubber, silicone rubber, isoprene rubber, ethylene propylene rubber, natural rubber, ethylene propylene diene rubber, nitrile rubber (NBR), or styrene butadiene rubber (SBR). The elastic member 3 may be solid without any internal cavities, or may be porous (sponge or foam) with internal cavities. The cavities may be continuous or discrete within the elastic member 3. The elastic member 3 in this embodiment is polyurethane foam. Before being constructed into the composite 1, the elastic member 3 is plate-shaped as shown in FIG. 4 and has a thickness of, for example, 1 to 10 mm. The elastic member 3 in this embodiment is slightly larger than the circuit pattern 2, and as shown in FIG. 1, the outer edge of the elastic member 3 extends to the outside of the conductive portion 2a of the circuit pattern 2.

[0030] The adhesive layer 4 has adhesive properties with respect to metals and is formed from, for example, a urethane-based, acrylic-based, or silicone-based adhesive. The adhesive layer 4 in this embodiment has relatively low adhesive properties with respect to the resin composition (e.g., epoxy resin) used to form the insulating layer 13, which will be described later. Specifically, the adhesive layer 4 is a composite layer (the acrylic resin layer is located on the elastic member 3 side) composed of an acrylic resin layer formed from an acrylic adhesive and a silicone resin layer formed from a silicone adhesive. While the silicone resin layer has low adhesive properties with respect to the polyurethane foam used in the elastic member 3 in this embodiment, the acrylic resin layer has high adhesive properties, allowing the adhesive layer 4 to be firmly attached to the elastic member 3. The adhesive strength of the adhesive layer 4 (the adhesive strength of the silicone resin layer in this embodiment) is, for example, 1 to 1,000 mN / 10 mm (measured in accordance with JIS Z1528, when attached to a stainless steel plate and pulled at a peel angle of 180° and a speed of 300 mm / min). The thickness of the adhesive layer 4 is, for example, 5 to 200 μm. The adhesive layer 4 may be provided on the elastic member 3 by preparing an adhesive sheet in which an adhesive is applied to a peelable sheet, attaching it to the lower surface of the plate-like elastic member 3 shown in Fig. 4, and then removing the sheet, or by applying an adhesive to the surface of the elastic member 3. The adhesive layer 4 may be a single layer (for example, only an acrylic resin layer or only a silicone resin layer) or a multilayer.

[0031] The mesh sheet 5 is a sheet in which synthetic resin fibers are arranged in a mesh pattern. Examples of such sheets include woven fabric, mesh fabric, and nonwoven fabric. The synthetic resin fibers used for the mesh sheet 5 preferably have a relatively high melting point, for example, 200°C or higher. A lower melting point would cause the fibers to melt and adhere during the fifth step described below, impairing the breathability of the mesh sheet 5. The thickness of the mesh sheet 5 is, for example, 100 to 200 μm. In this embodiment, the mesh sheet 5 is slightly larger than the circuit pattern 2. As shown in FIG. 1, the outer edge of the mesh sheet 5 extends beyond the conductive portions 2a of the circuit pattern 2. As shown in FIG. 4, the mesh sheet 5 has openings (first openings 5a) corresponding to the conductive portions 2a.

[0032] The release film 6 is a synthetic resin film having releasability on one or both sides. In this embodiment, the release property is provided on one side of the synthetic resin film (the lower surface of the release film 6 shown in FIG. 4). Examples of such a release film 6 include a synthetic resin film surface-treated with a release agent such as a silicone-based release agent or a non-silicone-based release agent such as a long-chain alkyl resin or an olefin-based resin. The thickness of the release film 6 is, for example, 10 to 200 μm. In this embodiment, the release film 6 is slightly larger than the circuit pattern 2. As shown in FIG. 1, the outer edge of the release film 6 extends to the outside of the conductive portion 2 a of the circuit pattern 2. As shown in FIG. 4, the release film 6 has an opening (second opening 6 a) corresponding to the conductive portion 2 a, and a through-hole 6 b is further provided at a location different from the second opening 6 a.

[0033] The metal base substrate 12 is formed of a metal such as copper, aluminum, or iron (which may be a single metal or an alloy). The metal base substrate 12 may have a single-layer structure or a multi-layer structure, and may be composed of a single member or a combination of multiple members. The metal base substrate 12 of this embodiment is plate-shaped, but it may also be a heat sink with comb-shaped fins. The metal base substrate 12 may also include a structure that improves the effect of dissipating heat to the outside, such as a metal plate with a vapor chamber or heat pipe embedded in it.

[0034] The insulating layer 13 is formed from an insulating material and is provided so as to cover the surface of the metal base substrate 12. The insulating layer 13 may cover the entire surface of the metal base substrate 12, or may cover only a part of the surface.

[0035] The insulating layer 13 is formed from a resin composition containing a thermosetting resin. Examples of the thermosetting resin include epoxy resin, phenol resin, melamine resin, urea resin, unsaturated polyester resin, alkyd resin, cyanate resin, etc. One type of thermosetting resin may be used alone, or two or more types may be used in combination.

[0036] As the epoxy resin, any monomer, oligomer, or polymer having two or more epoxy groups in one molecule can be used, regardless of its molecular weight or molecular structure. Specific examples of such epoxy resins include bisphenol-type epoxy resins such as bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol E-type epoxy resin, bisphenol S-type epoxy resin, hydrogenated bisphenol A-type epoxy resin, bisphenol M-type epoxy resin (4,4'-(1,3-phenylenediisopridiene)bisphenol-type epoxy resin), bisphenol P-type epoxy resin (4,4'-(1,4-phenylenediisopridiene)bisphenol-type epoxy resin), and bisphenol Z-type epoxy resin (4,4'-cyclohexidienebisphenol-type epoxy resin); novolac-type epoxy resins such as phenol novolac-type epoxy resin, brominated phenol novolac-type epoxy resin, cresol novolac-type epoxy resin, tetraphenol-group ethane-type novolac-type epoxy resin, and novolac-type epoxy resin having a condensed ring aromatic hydrocarbon structure; biphenyl-type epoxy resin; and xylylene-type epoxy resin. aralkyl-type epoxy resins such as naphthylene ether-type epoxy resins, naphthol-type epoxy resins, naphthalene-type epoxy resins, naphthalenediol-type epoxy resins, difunctional to tetrafunctional epoxy-type naphthalene resins, binaphthyl-type epoxy resins, and naphthalene aralkyl-type epoxy resins; epoxy resins having a naphthalene skeleton such as naphthylene ether-type epoxy resins, naphthol-type epoxy resins, naphthalene-type epoxy resins, binaphthyl-type epoxy resins, and naphthalene aralkyl-type epoxy resins; anthracene-type epoxy resins; phenoxy-type epoxy resins; dicyclopentadiene-type epoxy resins; norbornene-type epoxy resins; adamantane-type epoxy resins; fluorene-type epoxy resins, phosphorus-containing epoxy resins, alicyclic epoxy resins, aliphatic linear epoxy resins, bisphenol A novolac-type epoxy resins, bixylenol-type epoxy resins, triphenolmethane-type epoxy resins, trihydroxyphenylmethane-type epoxy resins, tetraphenylolethane-type epoxy resins, and heterocyclic epoxy resins such as triglycidyl isocyanurate;Examples of the epoxy resin include glycidyl amines such as N,N,N',N'-tetraglycidyl meta-xylenediamine, N,N,N',N'-tetraglycidyl bisaminomethylcyclohexane, and N,N-diglycidylaniline, copolymers of glycidyl (meth)acrylate and compounds having an ethylenically unsaturated double bond, epoxy resins having a butadiene structure, diglycidyl ethers of bisphenols, diglycidyl ethers of naphthalenediol, and glycidyl ethers of phenols. One type of epoxy resin may be used alone, or two or more types may be used in combination.

[0037] A curing agent is blended into the resin composition of this embodiment. The curing agent is selected depending on the type of thermosetting resin, and is not particularly limited as long as it reacts with the thermosetting resin. For example, when an epoxy resin is used, examples of the curing agent include an amine-based curing agent, an imidazole-based curing agent, and a phenol-based curing agent.

[0038] The resin composition of this embodiment also contains a filler (inorganic filler). The filler preferably has excellent insulating properties and high thermal conductivity, and examples thereof include aluminum oxide, silica, aluminum nitride, boron nitride, silicon nitride, and magnesium oxide. One type of filler may be used alone, or two or more types may be used in combination.

[0039] Furthermore, the resin composition of this embodiment contains a curing accelerator. The curing accelerator is not particularly limited, and examples thereof include benzoxazine compounds, borate complexes, organometallic salts such as zinc naphthenate, cobalt naphthenate, tin octoate, cobalt octoate, cobalt bisacetylacetonate (cobalt(II)), and cobalt triacetylacetonate (cobalt(III)), phenolic compounds such as phenol, bisphenol A, and nonylphenol, tertiary amines, tertiary amine salts, phosphines, and phosphonium salts.

[0040] The resin composition of this embodiment also contains a solvent. The solvent is not particularly limited, and examples thereof include N-methylpyrrolidone, dimethylacetamide, tetrafluoroisopropanol, methyl ethyl ketone, ethylene diglycol acetate, propylene glycol monomethyl ether acetate, methyl isobutyl ketone, ethylene glycol monomethyl ether, tetrahydrofuran, chloroform, toluene, xylene, acetone, dioxane, and dimethyl sulfoxide.

[0041] The resin composition may contain additives such as stabilizers, ion scavengers, and softening agents.

[0042] Next, a method for producing the composite 1 will be described with reference to Figures 2 and 3. In the following description, the first step, the second step, and so on will be described in that order, but the present invention is not limited to carrying out the steps in this order, and the order may be reversed as long as each step is effective, or each step may be carried out simultaneously.

[0043] 2 is carried out. In the first step, the circuit pattern 2 is prepared. In this step, the circuit pattern 2 having the conductive portions 2a and the gap portions 2b is formed by using the above-mentioned etching or other technique.

[0044] In the second step, the elastic member 3 and the adhesive layer 4 are laminated together. In this embodiment, a plate-shaped elastic member 3 is prepared as shown in Fig. 4. Then, as described above, for example, an adhesive sheet is prepared by applying an adhesive to a peelable sheet, and the elastic member 3 and the adhesive layer 4 are laminated together using a method such as adhering the adhesive sheet to the elastic member 3 and then removing the sheet.

[0045] In the third step, the mesh sheet 5 and the release film 6 are laminated together. In this embodiment, the mesh sheet 5 and the release film 6 are laminated together with an adhesive layer interposed between them. Specifically, an adhesive sheet is prepared by applying an acrylic adhesive to a PET sheet to form an adhesive layer. The mesh sheet 5 is then attached to this adhesive sheet to transfer the adhesive layer to the mesh sheet 5. The mesh sheet 5 with the adhesive layer is then attached to the non-releasable side of the release film 6 (the upper surface of the release film 6 shown in FIG. 4). The adhesive layer may also be transferred to the release film 6 and laminated on the mesh sheet 5. The first openings 5a and the second openings 6a may be formed in the mesh sheet 5 and the release film 6 before the mesh sheet 5 is attached to the release film 6, or they may be formed by attaching the mesh sheet 5 to the release film 6 and then processing the mesh sheet 5 and the release film 6 to penetrate them in the thickness direction. The through holes 6b are preferably formed in the release film 6 before the mesh sheet 5 and the release film 6 are laminated together. The shape of the first openings 5a formed in the mesh sheet 5 and the shape of the portions connecting adjacent first openings 5a basically correspond to the shapes of the conductive portions 2a and the gap portions 2b (the same applies to the shape of the second openings 6a formed in the release film 6 and the shape of the portions connecting adjacent second openings 6a), but they do not have to match perfectly. For example, with respect to the gap portion 2b located between two conductive portions 2a, if the gap of this gap portion 2b is narrow, the width of the portion connecting adjacent first openings 5a will also be narrow, making it difficult to form this connecting portion. In such a case, a single opening surrounding the entire two conductive portions 2a may be formed as the first opening 5a.

[0046] In the fourth step, the circuit pattern 2, the laminate of the elastic member 3 and the adhesive layer 4, and the laminate of the mesh sheet 5 and the release film 6 are arranged in a predetermined orientation. In this embodiment, as shown in FIG. 4 , the laminate of the elastic member 3 and the adhesive layer 4 is arranged so that the top surface of the circuit pattern 2 faces the adhesive layer 4, and the laminate of the mesh sheet 5 and the release film 6 is arranged so that the adhesive layer 4 faces the mesh sheet 5. The laminate of the elastic member 3 and the adhesive layer 4 is positioned relative to the circuit pattern 2 so that the first opening 5a and the second opening 6a are inserted into the conductive portion 2a. Furthermore, the cushioning material 21, the resin sheet 22, and the metal plate 23 shown in FIG. 4 are also arranged as shown. The cushioning material 21 is used to facilitate the insertion of the elastic member 3 into the gap portion 2b in the process described below. The resin sheet 22 is used to protect the underside of the conductive portion 2a. Although FIG. 4 shows the components as having vertical gaps, in reality, the components are in contact with each other in the vertical direction. At this time, since the circuit pattern 2 and the mesh sheet 5 are attached to the adhesive layer 4, it is possible to prevent misalignment between them.

[0047] In the fifth step, the elastic member 3 is pressed relative to the circuit pattern 2 in a vacuum atmosphere at a predetermined temperature. In this embodiment, the components shown in Figure 4 are arranged inside a vacuum press device in the illustrated arrangement, and then the device is evacuated to create a vacuum atmosphere, and a hot plate is used to press one metal plate 23 against the other metal plate 23 for a predetermined time. The temperature of the hot plate is 100 to 300°C, the pressing force is 0.1 to 20 MPa, and the pressing time is 0.5 to 20 minutes.

[0048] By performing steps 1 to 5 as described above, the elastic member 3 is pressed into the gap 2b and the conductive portion 2a, and a composite 1 can be manufactured in which a portion of the elastic member 3 penetrates into the gap 2b and the conductive portion 2a as shown in FIG. 1 (in this embodiment, a portion of the adhesive layer 4 penetrates into the gap 2b and the conductive portion 2a). When a portion of the elastic member 3 penetrates into the gap 2b and the conductive portion 2a, the upper surface of the elastic member 3 around the gap 2b and the conductive portion 2a is locally recessed, which may result in insufficient pressing into the gap 2b and the conductive portion 2a. However, in this embodiment, the elastic member 3 is pressed via the cushion material 21, so that a portion of the elastic member 3 can be sufficiently pressed into the gap 2b and the conductive portion 2a. Furthermore, because the lower surface of the conductive portion 2a is covered by the resin sheet 22, the lower surface of the conductive portion 2a can be protected even when the elastic member 3 is pressed relative to the circuit pattern 2. The thickness of the elastic member 3 that penetrates into the gap portion 2b and the outside of the conductive portion 2a (in this embodiment, the thickness of the elastic member 3 including the adhesive layer 4) is preferably 10 to 100% of the depth of the gap portion 2b (the thickness of the circuit pattern 2), more preferably 30 to 100%, and even more preferably 50 to 100%.

[0049] In this embodiment, before carrying out the fifth step, the mesh sheet 5 and the release film 6 are laminated onto the plate-shaped elastic member 3 provided with the adhesive layer 4. However, the fifth step may be carried out without laminating the mesh sheet 5 and the release film 6, and the laminate of the elastic member 3 and the adhesive layer 4 may be laminated onto the part of the elastic member 3 that has entered the gap portion 2b (or the mesh sheet 5 and the release film 6 may be laminated in that order).

[0050] 7B to 7E. That is, the present invention also includes a composite 1 in which an elastic member 3 and an adhesive layer 4 are laminated and then laminated in a plate form on a circuit pattern 2 as shown in Fig. 7B, a composite in which parts of the elastic member 3 and the adhesive layer 4 enter the gaps 2b as shown in Fig. 7C, a composite in which parts of the elastic member 3 and the adhesive layer 4 enter the gaps 2b and a mesh sheet 5 is further laminated thereon as shown in Fig. 7D, and a composite in which parts of the elastic member 3 and the adhesive layer 4 enter the gaps 2b and a mesh sheet 5 and a release film 6 (without through holes 6b) are further laminated thereon as shown in Fig. 7E.

[0051] Next, a method for producing the laminate 11 using the composite 1 will be described with reference to FIGS. 5, 6A, and 6B.

[0052] First, the sixth step shown in FIG. 5 is carried out. In the sixth step, a thermosetting resin and a curing agent are placed in a container and stirred at a predetermined temperature for a predetermined time. This allows the thermosetting resin and the curing agent to react with each other. Depending on the stirring temperature and stirring time, the thermosetting resin and the curing agent reacting in the sixth step can be made into a prepolymer state. However, this can be selected appropriately depending on the degree of curing of the thermosetting resin in the steps described below, and it is not necessarily necessary to make the thermosetting resin and the curing agent into a prepolymer state in the sixth step.

[0053] In the seventh step, the stirred thermosetting resin is mixed with the curing agent, filler, curing accelerator, and solvent to produce a resin composition. The resin composition in the seventh step is in a semi-cured state.

[0054] In the eighth step, the produced resin composition is applied to the surface of a thin substrate and then dried to volatilize the solvent. The substrate is not particularly limited as long as it can be peeled from the resin composition in the step described below, and as an example, a long PET sheet can be used. There are also no particular restrictions on carrying out the eighth step, but when using an apparatus equipped with a delivery section from which the long substrate is delivered, a coating section provided downstream in the delivery direction that applies the resin composition to the front side of the substrate, and a heating section provided upstream in the delivery direction that heats the passing resin composition at a predetermined temperature, the application and drying of the resin composition can be carried out continuously, which is advantageous in that the eighth step can be carried out efficiently.

[0055] In the ninth step, the long substrate coated with the resin composition is cut to a predetermined size to form a sheet material in which the resin composition and the substrate are laminated. Note that if a substrate cut to a predetermined size in advance is used in the eighth step, the ninth step can be omitted.

[0056] In step 10, the resin composition applied to the substrate is heated at a predetermined temperature for a predetermined time. This increases the molecular weight (weight average molecular weight) of the semi-cured resin composition. Although the molecular weight of the resin composition increases in steps after step 10, increasing the molecular weight of the resin composition in advance in step 10 can shorten the overall time required to manufacture the laminate 11. Furthermore, if the molecular weight of the resin composition required has already been secured in a step prior to step 10, step 10 may be omitted. One specific example of performing step 10 involves preparing multiple sheets of the above-described resin composition and substrate laminated together and heating them together in a heating furnace.

[0057] In step 11, a compressive force is applied to the semi-cured resin composition. Before step 11, the resin composition contains many voids due to the drying in step 8. However, by performing step 11, the density is increased, reducing the voids. Consequently, when the resin composition is formed into an insulating layer through the steps described below, high insulating properties can be obtained. One specific example of performing step 11 is to overlap the above-described sheet material with the metal base substrate 12 shown in FIG. 1 so that the resin composition contacts the metal base substrate 12, place the overlapped metal base substrate 12 and the sheet material in a vacuum press, for example, and then press the overlapped metal base substrate 12 and the sheet material while the interior of the press is in a vacuum atmosphere and at a predetermined temperature. This allows the semi-cured resin composition to be transferred to the metal base substrate 12 and apply a compressive force to the resin composition. Note that the metal base substrate 12 is not necessarily required for step 11. For example, a separately prepared substrate and the above-described sheet material may be overlapped and pressed, or a single sheet material may be pressed.

[0058] Although gas can be released from a semi-cured resin composition by performing the autoclave step (Step 13) described below, the inventors of the present application have found that if the resin composition is overcured, performing Step 13 may not sufficiently release gas from the resin composition. Furthermore, even if Step 13 is performed when the resin composition has a low density and contains many voids, it may be difficult to completely reduce the voids to a level that allows for sufficient voltage resistance. In light of these issues, the inventors have conducted extensive research into the optimal ranges for the molecular weight (weight-average molecular weight) and density of the resin composition. They found that good results were obtained when the increase in the weight-average molecular weight of the resin composition was 30% or less after Step 11 (after applying compressive force) compared to the increase before Step 11 (before applying compressive force). Further research into the increase in the weight-average molecular weight of the resin composition was found to be more favorable when it was 25% or less, and even more favorable when it was 20% or less. Furthermore, the density of the resin composition was good when it was 85% or more after step 11 (after applying compressive force) based on the actual density of the finally formed insulating layer. Further investigation of the density of the resin composition revealed that a density of 90% or more gave better results, and a density of 95% or more gave even better results. The weight-average molecular weight is a polystyrene-equivalent value measured by GPC (gel permeation chromatography).

[0059] In step 12, the substrate is peeled off from the semi-cured resin composition transferred to the metal base substrate 12, or if the resin composition has not yet been transferred to the metal base substrate 12, the substrate is peeled off from the resin composition after transferring the resin composition. The composite 1 shown in FIG. 1 is then superimposed on the resin composition to form a pre-bonding laminate 11A (see FIG. 6A). In this step, the composite 1 superimposed on the resin composition may be heat-pressed to temporarily adhere the composite 1 to the resin composition. The reference numeral 13A in FIG. 6A denotes a semi-cured resin composition.

[0060] In the thirteenth step, the semi-cured resin composition 13A laminated on the pre-press laminate 11A is cured using an autoclave 30 and a film (bagging film) 31, for example, configured as shown in FIG. 6A. The autoclave 30 of this embodiment includes a main body 30a and a lid 30b. The main body 30a is provided with an exhaust passage 30c, and the lid 30b is provided with a pressurization passage 30d. A heater or the like is provided in either or both of the main body 30a and the lid 30b to raise the temperature inside the autoclave 30. The film 31 is preferably a fluorine-based resin film that is flexible and has excellent peelability. This step does not necessarily require the use of the film 31 alone; cushioning material or breather cloth may also be used in combination with the film 31.

[0061] In the thirteenth step, the pre-compression laminate 11A is placed on the main body 30a and covered with the film 31, the lid 30b is closed, and the film 31 is sandwiched between the main body 30a and the lid 30b. Next, the inside of the film 31 is evacuated by suction through the exhaust passage 30c, and pressurized gas (air, nitrogen, etc.) is introduced through the pressurization passage 30d to increase the pressure inside the autoclave 30. Furthermore, the temperature inside the autoclave 30 is increased by the heater. This state is maintained for a predetermined time, thereby allowing the semi-cured resin composition 13A to be cured.

[0062] When carrying out the 13th step, the pressure inside the autoclave 30 is preferably 1 MPa or more and 3.0 MPa or less, the temperature inside the autoclave 30 is preferably 150 to 200°C, and the time for maintaining the increased pressure and temperature is preferably 1 to 30 minutes. The pressure and temperature inside the autoclave 30 can be changed for the purpose of ensuring that the curing of the resin composition 13A proceeds appropriately, and may be set to be kept constant for the above-mentioned time period or may be set to change over time.

[0063] By performing the 13th step, the film 31 adheres to the outer surface of the pre-press laminate 11A and presses it. At this time, the elastic member 3 in contact with the film 31 is also pressed, forcing the elastic member 3 into the gap 2b. Therefore, the resin composition 13A in contact with the circuit pattern 2 is not only pressed by the conductive portion 2a via the elastic member 3, but also by a portion of the elastic member 3 pressed into the gap 2b. In other words, since the pressure within the autoclave 30 is applied over the entire area of ​​the resin composition 13A, gas (gas contained in voids and residual solvent, volatile low-molecular-weight components, gas generated during the curing reaction, etc.) can be discharged from the entire area of ​​the resin composition 13A. In particular, in this embodiment, a portion of the elastic member 3 enters the gap 2b before performing the 13th step. Furthermore, a mesh sheet 5 and a release film 6 are laminated on the portion of the elastic member 3 that has entered the gap 2b. Therefore, since pressure can be applied more effectively in the gap 2b, gas can be more effectively discharged from the resin composition 13A.

[0064] In this embodiment, the release film 6 is provided with through holes 6b, and therefore, the gas discharged from the resin composition 13A is discharged through the through holes 6b without accumulating between the release film 6 and the resin composition 13A. Here, the release film 6 is laminated with the mesh sheet 5, and the through holes 6b are in communication with the mesh sheet 5. In other words, since the mesh sheet 5 has high breathability, the gas from the resin composition 13A discharged through the through holes 6b can be efficiently discharged to the outside of the pre-press laminate 11A.

[0065] Then, in step 14, the elastic member 3 and the like are removed from the laminate 11 with the remaining elastic member 3 and the like. In this embodiment, the release film 6 is in contact with the resin composition 13A where the gap portion 2b is located. However, because the lower surface of the release film 6 has releasability, the release film 6 can be easily peeled off from the resin composition 13A. This allows the mesh sheet 5 and the elastic member 3 with the adhesive layer 4 to be removed from the laminate 11 together with the release film 6. Note that because the mesh sheet 5 and the release film 6 are laminated in the gap portion 2b, the elastic member 3 does not generally come into contact with the resin composition 13A. However, depending on the positioning accuracy when producing the composite 1 and the pressing state in the autoclave 30, the elastic member 3 may come into contact with the resin composition 13A. If the adhesive layer 4 is not laminated on the elastic member 3, there is a risk that the elastic member 3 will come into contact with the resin composition 13A and the two will become stuck together. However, since the adhesiveness of the adhesive layer 4 in this embodiment is relatively low compared to the resin composition 13A, the elastic member 3 can be removed without any problems even in such cases.

[0066] In step 15, the laminate 11 removed from the autoclave 30 is fully cured. One specific example of performing step 15 is to place the laminate 11 removed from the autoclave 30 in a heating furnace and heat it at a predetermined temperature for a predetermined period of time. This allows the semi-cured resin composition 13A to be fully cured. Note that step 15 is performed when the fully cured resin composition 13A has not been completed in step 13. If the fully cured resin composition 13A has been completed in step 13, step 15 is omitted. Furthermore, step 14, in which the elastic member 3 and the like are removed, may be performed after step 15.

[0067] In the sixteenth step, the laminate 11 on which the resin composition 13A has been fully cured and the insulating layer 13 has been formed is washed and subjected to various inspections.

[0068] When the laminate 11 manufactured through the above steps was checked, it was confirmed to have a high withstand voltage, as will be described later. Furthermore, even when the laminate 11 was repeatedly heated, no peeling between the insulating layer 13 and the circuit pattern 2 was observed, and the results were satisfactory.

[0069] The following describes confirmation tests carried out to confirm the effects of the present invention, but the present invention is not limited to the conditions of the following confirmation tests.

[0070] First, a comparative example for comparison with the present invention and test examples 1 to 7 according to the present invention were prepared as composite 1. Here, in the comparative example, as shown in FIG. 7A, a plate-shaped elastic member 3 (without an adhesive layer 4) was laminated on a circuit pattern 2. In test example 1, as shown in FIG. 7B, an elastic member 3 and an adhesive layer 4 were laminated together and then laminated on the circuit pattern 2 in a plate-like form. In test example 2, as shown in FIG. 7C, the fifth step was performed with the circuit pattern 2, elastic member 3, and adhesive layer 4 laminated together. In test example 3, as shown in FIG. 7D, the fifth step was performed with the circuit pattern 2, elastic member 3, adhesive layer 4, and mesh sheet 5 laminated together. In test example 4, as shown in FIG. 7E, the fifth step was performed with the circuit pattern 2, elastic member 3, adhesive layer 4, mesh sheet 5, and release film 6 (without through-holes 6b) laminated together. In test examples 5 and 6, as shown in FIG. 7F, the first to fifth steps were performed. In Test Example 8, as shown in FIG. 7G, an elastic member 3, an adhesive layer 4, a mesh sheet 5, and a release film 6 were laminated together, and the laminate was then laminated on a circuit pattern 2 while still in a plate form (the above-mentioned steps 1 to 4 were carried out).

[0071] In the comparative example and test examples 1 to 7, the circuit pattern 2 has a thickness of 1 mm and the width (gap) of the gap portion 2b is 0.8 mm. In the comparative example 1 and test examples 1 to 7, the elastic member 3 is made of polyurethane foam, has a thickness of 5 mm, and a density of 80 kg / m ３The 25% compressive stress was approximately 0.05 MPa. In Test Examples 2 to 6, the thickness of the elastic member 3 that entered the gap 2b (the thickness of the elastic member 3 including the adhesive layer 4 if the adhesive layer 4 is provided) was 80% of the depth of the gap 2b (the thickness of the circuit pattern 2). In Test Examples 1 to 5, the adhesive layer 4 was a composite layer composed of an acrylic resin layer and a silicone resin layer (the acrylic resin layer was located on the elastic member 3 side), and the adhesive strength on the silicone resin layer side was 0.11 N / 25 mm, and the thickness was 20 μm. The adhesive strength of the adhesive layer 4 was measured using a measurement method generally in accordance with JIS Z1528. Specifically, an adhesive layer 4 was prepared with a 100 μm-thick PET sheet backed on the acrylic resin layer side. This adhesive layer 4 was placed on a stainless steel plate (with the silicone resin layer in contact with the stainless steel plate) and a 2 kg rubber roller was rolled back and forth to adhere the two together. After one minute, the peel force was measured at a peel angle of 180° and a speed of 300 mm / min (measured at a temperature of 23°C and a humidity of 50% RH). The adhesive layer 4 in Test Examples 6 and 7 was the same material and adhesive strength as in Test Examples 1 to 5, but had a thickness of 85 μm. In Test Examples 3 to 6, the mesh sheet 5 was a nonwoven fabric containing PET fibers with a melting point of 260°C. The thickness of the mesh sheet 5 varied within the sheet plane, from 150 μm at its minimum thickness to 200 μm at its maximum thickness, with an average thickness of 175 μm. In Test Examples 4 to 7, the release film 6 was a PET film whose one side (the side opposite the mesh sheet 5) was surface-treated with a silicone-based release agent to give it releasability, and had a thickness of 75 μm.

[0072] In the fifth step in Test Examples 2 to 6, the inside of the vacuum press was made into a vacuum atmosphere, and the metal plate 23 shown in FIG. 4 was pressed with a hot plate (temperature: 180°C). The pressing force during pressing was 15 MPa, and the pressing time was 13 minutes. The cushioning material 21 (see FIG. 4) used in the fifth step was made of a highly heat-resistant fiber (the basis weight of the main body was 1000 g / m ２ ) and a fluorine-based film is provided on both sides of the main body, and the total thickness is 1.9 mm (0.2 kg / cm ２The resin sheet 22 (see FIG. 4) is a PET sheet having a thickness of 100 μm, and the metal plate 23 is made of SUS.

[0073] To form the insulating layer 13, bisphenol A epoxy resin (manufactured by DIC Corporation) was prepared as the thermosetting resin, diethyltoluenediamine (manufactured by Lonza) was prepared as the curing agent, aluminum oxide, boron nitride aggregates, and boron nitride fine powder were prepared as the filler, triphenylphosphine (manufactured by Hokko Chemical Industry Co., Ltd.) was prepared as the curing accelerator, and 3-ethyl ethoxypropionate was prepared as the solvent.

[0074] The thermosetting resin and curing agent were then stirred at 70°C for 11 hours to form a prepolymer (Step 6). Next, the prepolymer thermosetting resin was blended with the filler, curing accelerator, and solvent, and mixed in a mixer to form a semi-cured resin composition (Step 7).

[0075] The resulting resin composition was applied to a long PET sheet and heated at 80°C for 40 minutes (Step 8). The PET sheet coated with the resin composition was then cut to a predetermined size (Step 9). The cut sheet material was then heated at 80°C for 20 minutes (Step 10).

[0076] The sheet material after the tenth step was then placed on the metal base substrate 12 with the resin composition in contact with the metal base substrate 12, and this was placed inside a vacuum press. The inside of the press was then in a vacuum atmosphere at 90°C, and the layered metal base substrate and sheet material were pressed at 23 MPa for 30 seconds (eleventh step).

[0077] Next, the PET sheet was peeled off from the semi-cured resin composition transferred to the metal base substrate 12, and the composites 1 of the above-mentioned comparative examples and test examples 1 to 6 were stacked to form a pre-press laminate (step 12).

[0078] Thereafter, as shown in Fig. 6A, the pre-bonded laminate was placed on the body of an autoclave and covered with a film. After closing the lid of the autoclave, the inside of the film was evacuated and the pressure and temperature inside the autoclave were increased (13th step).

[0079] In the thirteenth step, the temperature inside the autoclave is maintained at 190° C. (the temperature of the laminate before compression bonding is 160° C.) for 13 minutes, and the internal pressure at this time is 1.8 MPa.

[0080] Next, the elastic member and the like were removed from the laminate taken out of the autoclave (14th step), and then the laminate was heated at 185°C under no pressure (atmospheric pressure) for 1 hour (15th step), after which it was washed and subjected to a predetermined inspection (16th step).

[0081] The laminates manufactured through the above steps were then subjected to a voltage resistance test. The results are shown in Table 1. The laminates using composite 1 in Test Examples 1 to 7 exhibited a voltage resistance of 3 kV or more, which was a good result. The laminates using composite 1 in Test Examples 2 to 7 exhibited a voltage resistance of 5 kV or more, which was particularly good, and the laminates using composite 1 in Test Examples 5 and 6 exhibited a voltage resistance of 9 kV or more, which was even better. On the other hand, in the comparative example, when removing the elastic member 3 in step 14, the elastic member 3 was adhered to the resin composition 13A, which damaged the resin composition 13A, making it impossible to measure the voltage resistance. Furthermore, in the comparative example, the elastic member 3 in contact with the circuit pattern 2 sometimes adhered to the circuit pattern 2, which sometimes required work to remove the adhered elastic member 3 from the circuit pattern 2. Furthermore, in Test Example 3, the voltage resistance was good, but the mesh sheet 5 sometimes adhered slightly to the resin composition 13A, which sometimes impaired the releasability when removing the elastic member 3. In addition, the results of the withstand voltage and peelability were also good in the laminate using the composite in Test Example 7 shown in FIG. 7G, in which the adhesive layer 4 was omitted.

[0082]

[0083] Although one embodiment of the present invention has been described above, the present invention is not limited to the specific embodiment, and various modifications and changes are possible within the scope of the spirit of the present invention as set forth in the claims unless otherwise specifically limited in the above description. Furthermore, the effects of the above embodiment are merely examples of the effects resulting from the present invention, and do not mean that the effects of the present invention are limited to the above effects.

[0084] For example, in the fifth step described above, the elastic member 3 was pressed relative to the circuit pattern 2 in a vacuum atmosphere at a predetermined temperature using a vacuum press, but this step may also be performed using an autoclave using a film. Furthermore, in the thirteenth step, the resin composition was cured in an autoclave using a film, but this step may also be performed using a vacuum press. When using a vacuum press, the pressure inside the device is preferably higher than when using an autoclave, and is preferably set to, for example, 1 to 10 MPa.

[0085] Furthermore, glass cloth impregnated with fluororesin may be used instead of the mesh sheet 5 and the release film 6 provided in the composite 1. Glass cloth is a sheet in which glass fibers are arranged in a mesh pattern. Glass cloth impregnated with fluororesin has releasability and breathability. When such glass cloth impregnated with fluororesin was used instead of the mesh sheet 5 and the release film 6, it was confirmed that the same effects as when the mesh sheet 5 and the release film 6 were used were obtained.

[0086] The circuit pattern 2 provided in the composite 1 and the laminate 11 may be a plurality of electronic components having a thickness of 0.5 mm or more. The composite 41 shown in Fig. 8 and the laminate 42 shown in Figs. 9A and 9B have a configuration similar to that of the composite 1 shown in Fig. 1 and the laminate 11 shown in Fig. 2, and include a plurality of electronic components 43 instead of the circuit pattern 2 provided in the composite 1 and the laminate 11.

[0087] The electronic component 43 is used, for example, as a high-brightness LED or a power semiconductor (e.g., an IGBT (insulated gate bipolar transistor), a MOSFET (metal-oxide-semiconductor field-effect transistor), a diode, etc.). The electronic component 43 of this embodiment is formed by providing chip components, wiring, etc., on the circuit pattern 2 (e.g., 2.0 mm thick) and sealing it with synthetic resin. The external thickness of the portion sealed with synthetic resin is 0.5 mm or more. There is no particular upper limit to the external thickness of the electronic component 43, but it is, for example, 5.0 mm or less. As shown in FIG. 9B , the electronic component 43 of this embodiment has three external terminals 43 b extending outward from the center in the thickness direction on the side surface of the rectangular parallelepiped main body 43 a. The external terminals 43 b are, for example, an emitter electrode, a collector electrode, a base electrode, a source electrode, a drain electrode, and a gate electrode when the electronic component 43 is a power semiconductor. Although not shown, a lower terminal having the function of dissipating heat generated by the electronic component 43 to the outside may be provided on the lower surface of the main body 43a.

[0088] As shown in the figure, the composite 41 and laminate 42 of this embodiment include three electronic components 43, with gaps 44 provided between adjacent electronic components 43. The multiple electronic components 43 (three electronic components 43 in this embodiment) are a type of "electrical member" in this specification, and each of the electronic components 43 is a type of "circuit portion" in this specification.

[0089] Such composite 41 and laminate 42 can also be obtained by carrying out the above-described steps 1 to 16. Various tests (tests using the configurations shown in FIGS. 7B to 7G and their modified examples) were also carried out on composite 41 and laminate 42 using electronic component 43, and it was confirmed that similar results were obtained.

[0090] 1 and 8, the sizes of the elastic member 3, adhesive layer 4, mesh sheet 5, and release film 6 are slightly larger than the size of the circuit pattern 2 and the size of the plurality of electronic components 43 collectively, and although the elastic member 3 and the like are partially inserted not only into the gaps 2b and 44 but also into the outside of the conductive portions 2a and the electronic components 43, the elastic member 3 and the like may be partially inserted only into the gaps 2b and 44. In other words, the size of the elastic member 3 and the like may be smaller than in the illustrated example, and may be large enough to cover the entire gaps 2b of the circuit pattern 2 or the entire gaps 44 located between the plurality of electronic components 43.

[0091] DESCRIPTION OF SYMBOLS 1: Composite 2: Circuit pattern (electrical member) 2a: Conductive portion (circuit portion) 2b: Gap portion 3: Elastic member 4: Adhesive layer 5: Mesh sheet 5a: First opening 6: Release film 6a: Second opening 6b: Through hole 11: Laminate 11A: Laminate before pressure-bonding 12: Metal base substrate 13: Insulating layer 43: Electronic component (electrical member, circuit portion) 44: Gap portion

Claims

1. A composite body comprising: an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more; and an elastic member arranged on one side of the electrical component with a portion of the elastic member inserted into the gap portion.

2. The composite body according to claim 1, further comprising a mesh sheet laminated to the portion of said elastic member which fits into said gap.

3. The composite according to claim 2, further comprising a release film laminated to the other side of said electrical member against said mesh sheet.

4. The composite according to claim 3, wherein said release film has through holes communicating with said mesh sheet.

5. A composite comprising: an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more; an elastic member disposed on one side of the electrical component; and an adhesive layer laminated on the other side of the electrical component against the elastic member.

6. A composite comprising: an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more; an elastic member arranged on one side of the electrical component; a mesh sheet having a first opening corresponding to the circuit portion and arranged on the other side of the elastic member with the circuit portion inserted into the first opening and entering the gap portion; and a release film having a second opening corresponding to the circuit portion and arranged on the other side of the mesh sheet with the circuit portion inserted into the second opening and entering the gap portion.

7. The composite of claim 6, further comprising an adhesive layer disposed between said elastic member and said mesh sheet.

8. A method for manufacturing a composite, comprising the steps of: preparing an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more; arranging an elastic member on one side of the electrical component; and pressing the elastic member relative to the electrical component in a vacuum atmosphere at a predetermined temperature, so that a portion of the elastic member fits into the gap portion.

9. A method for producing a composite as described in claim 8, comprising the steps of: preparing a mesh sheet having a first opening corresponding to said circuit portion; and laminating said mesh sheet to said elastic member on the other side of said electrical member, said step being carried out before the step of inserting a portion of said elastic member into said gap portion.

10. A method for producing a composite as described in claim 9, comprising the steps of: preparing a release film having a second opening corresponding to said circuit portion; and laminating said release film to said mesh sheet on the other side of said electrical component, said step being carried out before the step of inserting a portion of said elastic member into said gap portion.

11. The method for producing a composite according to claim 10, further comprising a step of providing a through hole in said release film at a location different from said second opening, said step being carried out before said step of laminating said release film.

12. A method for manufacturing a laminate comprising a metal base substrate, an insulating layer formed by curing a resin composition, and an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more, the method comprising the steps of: laminating the resin composition in a semi-cured state onto the metal base substrate; preparing a pre-compression laminate by laminating a composite manufactured by the composite manufacturing method described in any one of claims 8 to 11 onto the semi-cured resin composition; curing the resin composition in a semi-cured state under a vacuum atmosphere and at a predetermined temperature surrounding the pre-compression laminate; and removing at least the elastic member from the pre-compression laminate to form the laminate.

13. A method for manufacturing a laminate in which a metal base substrate, an insulating layer formed by curing a resin composition, and an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more are laminated, the method comprising the steps of: preparing a pre-compression laminate in which the metal base substrate, the resin composition in a semi-cured state, the electrical component, an adhesive layer, and an elastic component are laminated in that order; curing the resin composition in a semi-cured state in a vacuum atmosphere surrounding the pre-compression laminate at a predetermined temperature; and removing at least the elastic component to form the laminate.

14. A method for manufacturing a laminate in which a metal base substrate, an insulating layer formed by curing a resin composition, and an electrical component having a circuit portion and a gap portion and a thickness of 0.5 mm or more are laminated, the method comprising the steps of: preparing a mesh sheet having a first opening corresponding to the circuit portion; preparing a release film having a second opening corresponding to the circuit portion; preparing a pre-compression laminate in which the metal base substrate, the resin composition in a semi-cured state, the electrical component, the release film located where the second opening enters the circuit portion, the mesh sheet located where the first opening enters the circuit portion, and an elastic member are laminated in this order; curing the resin composition in a semi-cured state under a vacuum atmosphere surrounding the pre-compression laminate at a predetermined temperature; and forming the laminate by removing at least the elastic member.

15. The method for manufacturing a laminate according to claim 14, wherein the pre-pressure-bonded laminate further comprises an adhesive layer disposed between the elastic member and the mesh sheet.

Images