Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method, the substrate processing apparatus comprising: a chamber in which a processing process for a substrate is performed; a substrate support unit that supports the substrate inside the chamber; an acquisition unit that acquires data by detecting a state of the substrate; and a control unit that determines state information of the substrate by using the data acquired by the acquisition unit, wherein the state information includes at least one of a damage state of the substrate and an unloadable state of the substrate.

Description

Substrate processing device and substrate processing method

[0001] The present invention relates to a substrate processing device that performs a processing process on a substrate, such as a deposition process or an etching process.

[0002] Typically, to manufacture semiconductor devices, display devices, solar cells, etc., a specific thin film layer, thin film circuit pattern, or optical pattern must be formed on a substrate. To this end, substrate processing processes are performed, such as a deposition process that deposits a thin film of a specific material onto the substrate, a photo process that selectively exposes the thin film using a photosensitive material, and an etching process that removes the thin film in the selectively exposed portion to form a pattern.

[0003] This processing step is performed by a substrate processing device. The substrate processing device includes a chamber in which a processing step for a substrate is performed, and a substrate supporter for supporting the substrate within the chamber. The substrate is brought into the chamber by a transport robot and supported by the substrate supporter. After the processing step is performed on the substrate while it is supported by the substrate supporter, the substrate on which the processing step has been performed is transported out of the chamber by the transport robot.

[0004] Here, there is a problem that fragments of the substrate contaminate or damage the inside of the chamber, the outside of the chamber, etc., as the work of removing the substrate from the chamber is performed in a state where the substrate is damaged, such as broken, etc. in the past.

[0005] The present invention has been devised to solve the above-described problems, and to provide a substrate processing device and a substrate processing method that can prevent the work of removing a substrate in a damaged state.

[0006] In order to solve the above-described problem, the present invention may include the following configuration.

[0007] A substrate processing device according to the present invention may include a chamber in which a processing process for a substrate is performed; a substrate support unit that supports the substrate within the chamber; an acquisition unit that detects the state of the substrate and acquires data; and a control unit that determines state information of the substrate using the data acquired by the acquisition unit. The state information may include at least one of a damaged state of the substrate and a removable state of the substrate.

[0008] In the substrate processing device according to the present invention, the control unit may include a storage unit that stores data acquired by the acquisition unit; an analysis unit that analyzes the data acquired by the acquisition unit; and a judgment unit that determines the status information using the data.

[0009] In the substrate processing device according to the present invention, the acquisition unit can acquire the data by photographing a mark formed on the substrate.

[0010] In the substrate processing device according to the present invention, the acquisition unit may include a plurality of vision units that capture a plurality of shooting areas and acquire a plurality of pieces of data. The control unit may include a judgment unit that determines the status information using the data acquired by the vision units and a plurality of marks formed on the substrate.

[0011] In the substrate processing device according to the present invention, the judgment unit can determine that the substrate can be removed if the mark is located within a preset reference area in all of the data.

[0012] In the substrate processing device according to the present invention, the judgment unit can determine that the substrate is damaged if the mark deviates from the preset reference area only in some of the data.

[0013] In the substrate processing device according to the present invention, the determination unit can determine that the substrate is damaged if, in all of the data, the marks are located within a preset reference area, but at least one of the relative positional difference between the marks and the relative direction difference between the marks is outside the preset reference range.

[0014] In the substrate processing device according to the present invention, the acquisition unit may include a plurality of vision units that acquire a plurality of first data by photographing a plurality of photographing areas before the processing process is performed, and acquire a plurality of second data by photographing the photographing areas after the processing process is performed. The control unit may include a judgment unit that compares the first data and the second data with each other to determine the status information.

[0015] In the substrate processing device according to the present invention, the determination unit calculates the positional difference and the directional difference between the marks formed on the substrate in the first data and the marks in the second data, and if the positional difference and the directional difference for all of the marks are within a preset reference range, it can be determined that the substrate can be removed.

[0016] In the substrate processing device according to the present invention, when the substrate inside the chamber is heated to perform a processing process, if there is no difference in position or direction for all of the marks, the determination unit can determine that there is an abnormality in the heating unit that heats the substrate inside the chamber or that the substrate is damaged.

[0017] In the substrate processing device according to the present invention, the determination unit calculates the positional difference and the directional difference between the marks formed on the substrate in the first data and the marks in the second data, and if the positional difference and the directional difference for only some of the marks are outside a preset reference range, the substrate can be determined to be damaged.

[0018] In the substrate processing device according to the present invention, an alarm unit that generates an alarm when the substrate is determined to be in a damaged state from the status information may be included.

[0019] A substrate processing method according to the present invention is a substrate processing method using a substrate processing apparatus including a chamber in which a processing process for a substrate is performed and a substrate support member for supporting the substrate inside the chamber, the method including: a step of obtaining a plurality of first data by photographing a plurality of photographing areas before the processing process is performed; a step of obtaining a plurality of second data by photographing the photographing areas after the processing process is performed; and a step of determining status information of the substrate using at least one of the first data and the second data.

[0020] In the substrate processing method according to the present invention, the step of determining the status information of the substrate may determine that the substrate is capable of being removed in any one of the following cases: when marks formed on the substrate in all of the second data are located within a preset reference area, and when the positional difference and the directional difference between the marks in the first data and the marks in the second data are calculated and the positional difference and the directional difference for all of the marks are within a preset reference range.

[0021] In the substrate processing method according to the present invention, the step of determining the state information of the substrate may determine that the substrate is in a damaged state in any one of the following cases: when only some of the second data have marks formed on the substrate outside a preset reference area; when all of the second data have marks located within the reference area but at least one of the relative positional difference between the marks and the relative directional difference between the marks is outside a preset reference range; and when the positional difference and the directional difference between the marks in the first data and the marks in the second data are calculated and only the positional difference and the directional difference for some of the marks are outside the reference range.

[0022] In the substrate processing method according to the present invention, the step of determining the state information of the substrate may include calculating the positional difference and the directional difference between the marks formed on the substrate in the first data and the marks in the second data when performing a processing process by heating the substrate inside the chamber, and if there is no positional difference and the directional difference for all of the marks, it may be determined that there is an abnormality in the heating unit that heats the substrate inside the chamber or that the substrate is damaged.

[0023] According to the present invention, the following effects can be achieved.

[0024] The present invention is implemented so that the acquisition unit detects the state of the substrate and acquires data, thereby enabling confirmation of changes in the state of the substrate, such as damage such as cracking or sliding of the substrate. Accordingly, the present invention can reduce the risk of substrate fragments contaminating or damaging the interior or exterior of the chamber during the process of transporting the substrate out of the chamber.

[0025] Figure 1 is a schematic side cross-sectional view of a substrate processing device according to the present invention.

[0026] Figure 2 is a schematic plan view showing an example of a substrate used in a substrate processing device according to the present invention.

[0027] Figure 3 is a conceptual diagram showing an example of data acquired by an acquisition unit in a substrate processing device according to the present invention.

[0028] Figure 4 is a schematic side cross-sectional view of a substrate processing device according to the present invention.

[0029] Figure 5 is a schematic flowchart of a substrate processing method according to the present invention.

[0030] Hereinafter, an embodiment of a substrate processing device according to the present invention will be described in detail with reference to the attached drawings.

[0031] Referring to FIG. 1, a substrate processing device (1) according to the present invention performs a processing process on a substrate (100). The substrate (100) may be a glass substrate. The substrate (100) may also be a silicon substrate, a metal substrate, etc. The substrate processing device (1) according to the present invention may perform a deposition process for depositing a thin film on the substrate (100), an etching process for removing a portion of the thin film deposited on the substrate (100), etc. Hereinafter, an embodiment in which the substrate processing device (1) according to the present invention performs the deposition process will be described, but it will be apparent to those skilled in the art to which the present invention pertains to derive an embodiment in which the substrate processing device (1) according to the present invention performs other processing processes, such as the etching process, therefrom.

[0032] A substrate processing device (1) according to the present invention may include a chamber (2) and a substrate support unit (3).

[0033] Referring to FIG. 1, the chamber (2) can provide a processing space (200). In the processing space (200), a processing process for the substrate (100) can be performed. The processing space (200) can be arranged inside the chamber (2). The substrate support member (3) can be arranged inside the chamber (2). An exhaust port (not shown) for exhausting gas or the like from the processing space (200) can be coupled to the chamber (2).

[0034] Referring to Fig. 1, the substrate support unit (3) can support the substrate (100). The substrate support unit (3) can support one substrate (100). The substrate support unit (3) can also support a plurality of substrates (100). When the substrate support unit (3) supports a plurality of substrates (100), the substrate processing device (1) according to the present invention can perform a processing process on a plurality of substrates (100) at a time. The substrate support unit (3) can be coupled to the chamber (2). The substrate support unit (3) can be placed inside the chamber (2).

[0035] The processing process can be performed while the substrate (100) is supported on the substrate support member (3). The substrate (100) can be supported on the substrate support member (3) after being brought into the chamber (2) by a transport robot (not shown). After the processing process is performed in this state, the substrate (100) can be taken out of the chamber (2) by the transport robot (not shown). In this case, during the process of the substrate (100) being brought into the chamber (2) and supported on the substrate support member (3), during the process of performing the processing process, etc., damage such as cracking may occur to the substrate (100), and the substrate (100) may slide and move, thereby changing the position and direction of the substrate (100). In this way, the state of the substrate (100) may change during the process of being introduced into the chamber (2) and supported by the substrate support member (3), during the process of performing the processing, etc., and if the substrate (100) is damaged, there is a risk that fragments of the damaged substrate (100) may contaminate or damage the inside of the chamber (2), the outside of the chamber (2), etc. during the process of removing the substrate (100) from the chamber (2). In addition, depending on the position and direction in which the substrate (100) slides, the substrate (100) may collide with other structures, etc. during the process of removing the substrate (100), and as a result, there is a risk that fragments of the substrate (100) may contaminate or damage the inside of the chamber (2), the outside of the chamber (2), etc.

[0036] To prevent this, the substrate processing device (1) according to the present invention may include an acquisition unit (4) and a control unit (5).

[0037] Referring to FIGS. 1 to 3, the acquisition unit (4) can detect the state of the substrate (100). The state of the substrate (100) may include the position of the substrate (100) and the direction of the substrate (100). The position of the substrate (100) and the direction of the substrate (100) may refer to the positions and directions of each of a plurality of parts of the substrate (100). The acquisition unit (4) can detect the state of the substrate (100) and acquire data. The acquisition unit (4) can provide the acquired data to the control unit (5). For example, the acquisition unit (4) can acquire the data by photographing parts of the substrate (100) to acquire images. In this case, the data may be implemented as an image in which the appearances of the parts of the substrate (100) are displayed.

[0038] By the above acquisition unit (4) detecting the state of the substrate (100) and acquiring the data, the substrate processing device (1) according to the present invention is implemented so that it can confirm that the state of the substrate (100) has changed, such as that the substrate (100) is broken or that the substrate (100) is slid and moved during the process of the substrate (100) being brought into the chamber (2) and supported by the substrate support unit (3), or during the process of performing the processing process. Accordingly, the substrate processing device (1) according to the present invention can reduce the risk of fragments of the substrate (100) contaminating or damaging the inside of the chamber (2), the outside of the chamber (2), etc.

[0039] The above-described acquisition unit (4) can detect the state of the substrate (100) on which the processing has been performed and acquire the data before the substrate (100) is removed from the chamber (2) after the processing has been performed on the substrate (100). Accordingly, when the state of the substrate (100) changes during the processing, the acquisition unit (4) can acquire the data by detecting the state of the substrate (100) whose state has changed. Accordingly, the substrate processing device (1) according to the present invention is implemented so that it can confirm before the removal operation that the state of the substrate (100) has changed, such as that the substrate (100) is broken or slides during the processing, before the removal operation is performed. Accordingly, the substrate processing device (1) according to the present invention can reduce the risk of fragments of the substrate (100) contaminating or damaging the interior of the chamber (2), the exterior of the chamber (2), etc. during the process of carrying out the carrying out operation. In addition, the substrate processing device (1) according to the present invention can improve the stability of the carrying out operation.

[0040] The above acquisition unit (4) can acquire the data by photographing a mark (110) formed on the substrate (100). The mark (110) can be formed on the substrate (100) in an intaglio or relief manner. The mark (110) can be formed in a cross shape as shown by a dotted line in FIG. 3. Accordingly, the state of the substrate (100) can be detected using the mark (110) indicated on the data. In this case, the position of the substrate (100) can be detected using the position of the mark (110), and the direction of the substrate (100) can be detected using the direction of the mark (110). A plurality of marks (110) can be formed on the substrate (100). For example, as shown in FIG. 2, when the substrate (100) has a rectangular shape, four marks (110) can be formed on the substrate (100). The marks (110) above may be arranged at each of the four corners of the substrate (100). The first mark (110a) and the second mark (110b) may be arranged at two corners spaced apart from each other along the first axis direction (X-axis direction), and the third mark (110c) and the fourth mark (110d) may be arranged at two corners spaced apart from each other along the first axis direction (X-axis direction). The first mark (110a) and the third mark (110c) may be arranged at two corners spaced apart from each other along the second axis direction (Y-axis direction) perpendicular to the first axis direction (X-axis direction). The second mark (110b) and the fourth mark (110d) may be arranged at two corners spaced apart from each other along the second axis direction (Y-axis direction).

[0041] The above acquisition unit (4) may include a plurality of vision units (41).

[0042] The above-described vision units (41) can acquire multiple data by photographing multiple shooting areas (40, illustrated in FIG. 3). Depending on the state of the substrate (100), the positions and directions of the marks (110) within the shooting areas (40) may be arranged differently. Accordingly, the positions and directions of the marks (110) may be displayed differently in the data depending on the state of the substrate (100). Depending on the state of the substrate (100), all or part of the marks (110) may not be arranged within the shooting areas (40). Accordingly, all or part of the marks (110) may not be displayed in the data depending on the state of the substrate (100).

[0043] For example, if the substrate (100) is supported in the correct position with respect to the substrate support member (3) without damage, the mark (110) may be displayed at the exact center of each of the data acquired by the vision units (41), as shown by the dotted line in FIG. 3. If the substrate (100) is out of the correct position due to damage to the substrate (100) or sliding movement of the substrate (100), the mark (110', shown in FIG. 3) may be displayed at a position spaced apart from the exact center of each of the data acquired by the vision units (41). In this case, depending on the degree to which the substrate (100) is out of the correct position, the mark (110) may not be displayed in each of the data acquired by the vision units (41). If the above substrate (100) is out of position, the mark (110", shown in FIG. 3) may be displayed in a direction tilted at a predetermined angle while being spaced from the center of each of the data acquired by the vision units (41).

[0044] The above vision units (41) can acquire the data for different parts of the substrate (100) by photographing different photographing areas (40).

[0045] For example, when four marks (110) are formed on the substrate (100) as illustrated in FIG. 2, the acquisition unit (4) may include four vision units (41). In FIG. 2, the squares indicated by a dashed line on the outer side of each of the marks (110a, 110b, 110c, 110d) indicate the photographing areas (40a, 40b, 40c, 40d) photographed by the vision units (41a, 41b, 41c, 41d).

[0046] First, the first vision unit (41a) can acquire the data by capturing the first shooting area (40a). In this case, the data acquired by the first vision unit (41a) can be implemented as an image showing the appearance of a portion of the substrate (100) placed within the first shooting area (40a). In the data acquired by the first vision unit (41a), depending on the state of the substrate (100), the first mark (110a) may be displayed in the correct position, or the position and direction of the first mark (110a) may be displayed deviating from the correct position, or the first mark (110a) may not be displayed.

[0047] Next, the second vision unit (41b) can capture the second shooting area (40b) to obtain the data. In this case, the data acquired by the second vision unit (41b) can be implemented as an image showing the appearance of a portion of the substrate (100) placed within the second shooting area (40b). In the data acquired by the second vision unit (41b), depending on the state of the substrate (100), the second mark (110b) may be displayed in the correct position, or the position and direction of the second mark (110b) may be displayed deviating from the correct position, or the second mark (110b) may not be displayed.

[0048] Next, the third vision unit (41c) can acquire the data by capturing the third shooting area (40c). In this case, the data acquired by the third vision unit (41c) can be implemented as an image showing the appearance of a portion of the substrate (100) placed within the third shooting area (40c). In the data acquired by the third vision unit (41c), depending on the state of the substrate (100), the third mark (110c) may be displayed in the correct position, or the position and direction of the third mark (110c) may be displayed deviating from the correct position, or the third mark (110c) may not be displayed.

[0049] Next, the fourth vision unit (41d) can capture the fourth shooting area (40d) to obtain the data. In this case, the data acquired by the fourth vision unit (41d) can be implemented as an image showing the appearance of a portion of the substrate (100) placed within the fourth shooting area (40d). In the data acquired by the fourth vision unit (41d), depending on the state of the substrate (100), the fourth mark (110d) may be displayed in the correct position, or the position and direction of the fourth mark (110d) may be displayed deviating from the correct position, or the fourth mark (110d) may not be displayed.

[0050] Meanwhile, the first shooting area (40a) and the second shooting area (40b) may be arranged to be spaced apart from each other along the first axis direction (X-axis direction). The third shooting area (40c) and the fourth shooting area (40d) may be arranged to be spaced apart from each other along the first axis direction (X-axis direction). The first shooting area (40a) and the third shooting area (40c) may be arranged to be spaced apart from each other along the second axis direction (Y-axis direction). The second shooting area (40b) and the fourth shooting area (40d) may be arranged to be spaced apart from each other along the second axis direction (Y-axis direction).

[0051] The above vision parts (41) may be arranged outside the chamber (2). In this case, the vision parts (41) can photograph the photographing areas (40) through the through holes (21) formed in the chamber (2). When the vision parts (41) are arranged on the lower side of the substrate support part (3), the vision parts (41) can photograph the photographing areas (40) through the through holes (21) formed in the chamber (2) and the through holes (31) formed in the substrate support part (3). When the through hole (31) formed in the substrate support part (3) is smaller than the through hole (21) formed in the chamber (2), the size of the photographing area (40) may be determined by the size of the through hole (31). When the vision parts (41) are arranged on the lower side of the substrate support part (3), the through hole (21) may be formed by penetrating the bottom of the chamber (2). In this case, the vision parts (41) may be coupled to the bottom of the chamber (2) from the outside of the chamber (2). Although not shown, the vision parts (41) may be arranged on the upper side of the substrate support part (3) to photograph the photographing areas (40). Although not shown, the vision parts (41) may also be arranged inside the chamber (2).

[0052] The above-described vision units (41) can acquire multiple data by photographing the photographing areas (40) while the substrate (100) is supported on the substrate support member (3). Accordingly, the substrate processing device (1) according to the present invention is implemented so that it can confirm that the state of the substrate (100) has changed, such as when the substrate (100) is broken or when the substrate (100) is slid, before separating the substrate (100) from the substrate support member (3). Therefore, the substrate processing device (1) according to the present invention can reduce the risk of fragments of the substrate (100) contaminating or damaging the inside of the chamber (2), the outside of the chamber (2), etc., during the process of separating the substrate (100) from the substrate support member (3).

[0053] Referring to FIGS. 1 to 3, the control unit (5) can determine the status information of the substrate using the data acquired by the acquisition unit (4). The control unit (5) can determine the status information regarding the occurrence of damage, such as cracking, in the substrate (100), the change in the position and direction of the substrate (100) due to sliding movement of the substrate (100), etc. using the data. Accordingly, the substrate processing apparatus (1) according to the present invention can reduce the risk of fragments of the substrate (100) contaminating or damaging the inside of the chamber (2), the outside of the chamber (2), etc. The status information can include at least one of the damage status of the substrate (100) and the possibility of removing the substrate (100). The control unit (5) can receive the data from the acquisition unit (4) through wired communication, wireless communication, etc. When the above acquisition unit (4) includes a plurality of vision units (41), the control unit (5) can receive data acquired by the vision units (41).

[0054] The above control unit (5) may include a judgment unit (51).

[0055] The above judgment unit (51) can determine the status information using the above data. In this case, the judgment unit (51) can determine the status information using the data acquired by the vision units (41) and the marks (110) formed on the substrate (100). This will be described in detail as follows. Below, an example corresponds to a case where four marks (110a, 110b, 110c, 110d) are formed on the substrate (100) and the acquisition unit (4) includes four vision units (41a, 41b, 41c, 41d).

[0056] First, the judgment unit (51) can determine that the substrate can be removed if the mark (110) is located within a preset reference area (401, illustrated in FIG. 3) in all of the data. The reference area (401) can be arranged within the photographing area (40) and formed to a smaller size than the photographing area (40). The reference area (401) relates to a position of the mark (110) where fragments of the substrate (100) are not generated during the process of removing the substrate (100), and can be derived through a preliminary test or the like and stored in advance in the judgment unit (51) by the operator. For example, the judgment unit (51) can determine that the substrate (100) can be removed if the mark (110) is located within the reference area (401) in all of the four data. The above judgment unit (51) can determine that the substrate (100) can be removed if the preset reference area of ​​the mark (110) is located within the reference area (401) and the remaining portion is outside the reference area (401). The reference area is a position of the mark (110) where fragments of the substrate (100) are not generated during the process of removing the substrate (100), and can be derived through a preliminary test or the like and stored in advance in the judgment unit (51) by an operator. For example, the reference area can be set to half of the total area of ​​the mark (110). The judgment unit (51) can provide the judgment result to the transport robot. When the transport robot receives a signal from the judgment unit (51) indicating that the substrate (100) can be removed, the substrate (100) can be removed outside the chamber (2).

[0057] In addition, the judgment unit (51) can determine that the substrate can be removed if the mark (110) is located within the reference area (401) and is tilted within a preset reference angle in all of the data. The reference angle relates to the direction of the mark (110) in which fragments of the substrate (100) are not generated during the process of removing the substrate (100), and can be derived through a preliminary test or the like and stored in advance in the judgment unit (51) by the operator.

[0058] Meanwhile, the judgment unit (51) may determine that the removal of the substrate is unsuitable if the mark (110) is located within the reference area (401) in all of the data and is tilted outside the reference angle. In this case, the judgment unit (51) may provide the judgment result to the transport robot. If the transport robot receives a signal from the judgment unit (51) that the removal of the substrate (100) is unsuitable, it does not remove the substrate (100) from the chamber (2). In this case, the judgment unit (51) may also provide the judgment result to the alarm unit (6). If the alarm unit (6) determines that the removal of the substrate (100) is unsuitable based on the status information, it may generate an alarm to notify the operator that the removal of the substrate (100) is unsuitable. The alarm unit (6) may output a message on the display or emit a sound.

[0059] Next, the judgment unit (51) can determine that the substrate (100) is damaged if the mark (110) is outside the reference area (401) only in some of the data. For example, the judgment unit (51) can determine that the substrate (100) is damaged if there is a mark (110', illustrated in FIG. 3) outside the reference area (401) only in one or more but not more than three data among four data. In this case, the judgment unit (51) can determine that the substrate (100) is damaged if the mark (110) is located within the reference area (401) only in three or fewer data among four data. The judgment unit (51) can provide the judgment result to the transport robot and the alarm unit (6). Meanwhile, the judgment unit (51) may determine that the substrate (100) is not suitable for removal if the mark (110) deviates from the reference area (401) only in some of the data. In addition, the judgment unit (51) may determine that the substrate (100) is damaged if the mark (110) is tilted outside the reference angle only in some of the data. For example, the judgment unit (51) may determine that the substrate (100) is damaged if there is a mark (110", illustrated in FIG. 3) tilted outside the reference angle only in one or more but not more than three of four data.

[0060] Next, the judgment unit (51) may determine that the removal of the substrate (100) is unsuitable if the mark (110) is out of the reference area (401) in all of the data. For example, the judgment unit (51) may determine that the removal of the substrate (100) is unsuitable if the mark (110) is out of the reference area (401) in all of the four data. In this case, the judgment unit (51) may provide the judgment result to the transport robot and the alarm unit (6). Meanwhile, the judgment unit (51) may determine that the substrate (100) is damaged if the mark (110) is out of the reference area (401) in all of the data.

[0061] Next, the judgment unit (51) can determine that the substrate (100) is damaged if at least one of the relative positional difference between the marks (110) and the relative direction difference between the marks (110) is outside a preset reference range even though the marks (110) are located within the reference area (401) in all of the data. The reference range reflects an error as the distance between the marks (110) and the direction in which the marks (110) are facing are deformed due to thermal expansion or the like during the processing, and can be derived through a preliminary test or the like and stored in advance in the judgment unit (51) by a worker. For example, even if all of the marks (110a, 110b, 110c, 110d) in all of the above data are located within the reference area (401), if the distance between the first mark (110a) and the second mark (110b) is outside the reference range, the substrate (100) can be determined to be damaged. For example, even if all of the marks (110a, 110b, 110c, 110d) in all of the above data are located within the reference area (401), if the distance between the first mark (110a) and the second mark (110b) is outside the reference range, such as when the first mark (110a) and the second mark (110b) are tilted in opposite directions, the substrate (100) can be determined to be damaged.

[0062] Referring to FIGS. 1 to 3, the vision units (41) may acquire a plurality of first data by photographing the photographing areas (40) before the processing process is performed, and may acquire a plurality of second data by photographing the photographing areas (40) after the processing process is performed. In this case, the judgment unit (51) may compare the first data and the second data to determine the status information.

[0063] The above judgment unit (51) calculates the positional difference and the direction difference between the marks (110) formed on the substrate (100) in the first data and the marks (110) in the second data, and then can use the positional difference and the direction difference between the marks (110) to judge the state information as follows.

[0064] Next, the judgment unit (51) can determine that the substrate (100) can be removed if both the positional differences and the directional differences for all of the marks (110) are within the reference range. In this case, if both the positional differences and the directional differences for all of the marks (110) are within the reference range, even if the marks (110) are outside the reference area in all of the second data, the judgment unit (51) can determine that the substrate (100) can be removed. On the other hand, if the marks (110) are outside the reference area in only some of the second data, the judgment unit (51) can determine that the substrate (100) is damaged.

[0065] Next, the judgment unit (51) can determine that the removal of the substrate (100) is unsuitable if both the positional differences and the directional differences for all of the marks (110) are outside the reference range. In this case, if both the positional differences and the directional differences for all of the marks (110) are outside the reference range, even if the marks (110) are located within the reference area in all of the second data, the judgment unit (51) can determine that the removal of the substrate (100) is unsuitable. On the other hand, if only some of the second data have the marks (110) outside the reference area, the judgment unit (51) can determine that the substrate (100) is damaged.

[0066] Next, the judgment unit (51) can determine that the substrate (100) is damaged if only the positional differences and directional differences of some of the marks (110) among the marks (110) are outside the reference range. In this case, if the positional differences and directional differences of some of the marks (110) among the marks (110) are outside the reference range, even if the marks (110) are located within the reference area in all of the second data, the judgment unit (51) can determine that the substrate (100) is damaged.

[0067] Next, when performing the processing by heating the substrate (100) inside the chamber (2), the determination unit (51) can determine that there is an abnormality in the heating unit (22) that heats the substrate (100) inside the chamber (2) if there is no difference in position or direction for all of the marks (110). The heating unit (22) can directly heat the substrate (100) inside the chamber (2). The heating unit (22) can also heat the substrate (100) by heating at least one of the inside of the chamber (2) and the substrate support unit (3). The heating unit (22) can be implemented as a lamp heater that emits heating light or a circulation unit that circulates and moves a heated fluid. If the above processing process is performed by heating the substrate (100) inside the chamber (2), a difference in position and direction should occur for all of the marks (110) due to the thermal expansion of the substrate (100). If there is no difference in position and direction for all of the marks (110), it can be assumed that the heating unit (22) is not operating normally during the processing process, and therefore the determination unit (51) can determine that there is an abnormality in the heating unit (22). In this case, the determination unit (51) can also determine that the substrate (100) is damaged. If there is no difference in position and direction for all of the marks (110) during the processing process, even though the substrate (100) inside the chamber (2) is heated, it can be assumed that a breakage, etc., has occurred in the substrate (100) during the processing process, and therefore the determination unit (51) can determine that the substrate (100) is damaged.

[0068] Referring to FIGS. 1 to 4, the vision units (41) may acquire a plurality of additional data by photographing the photographing areas (40) when a plurality of lift pins (32, shown in FIG. 4) separate the substrate (100) from the substrate support unit (3) after the processing is performed. The judgment unit (51) may determine the state information using the additional data. Accordingly, even if the judgment unit (51) determines that the substrate (100) is capable of being removed because the substrate (100) is broken but the broken portions of the substrate (100) are not separated from each other, the judgment unit (51) may determine that the substrate (100) is broken using the additional data because the broken portions of the substrate (100) are separated from each other in the process in which the lift pins (32) separate the substrate (100) from the substrate support unit (3). In this way, the substrate processing device (1) according to the present invention determines the status information after the processing process is performed, separates the substrate (100) from the substrate support member (3), and then determines the status information again, thereby further reducing the risk of fragments of the substrate (100) contaminating or damaging the inside of the chamber (2), the outside of the chamber (2), etc.

[0069] Meanwhile, the fact that the vision units (41) photograph the photographing areas (40) while the lift pins (32) separate the substrate (100) from the substrate support member (3) and obtain the additional data roughly corresponds to the fact that the vision units (41) photograph the photographing areas (40) while the substrate (100) is supported on the substrate support member (3) and obtain the data, so a detailed description thereof will be omitted. In addition, the fact that the judgment unit (51) determines the status information using the additional data roughly corresponds to the fact that the judgment unit (51) determines the status information using the data, so a detailed description thereof will be omitted.

[0070] Meanwhile, the lift pins (32) may be arranged at positions spaced apart from each other to support different parts of the substrate (100). By raising and lowering at least one of the lift pins (32) and the substrate support member (3), the substrate (100) may be supported by the substrate support member (3) and may be spaced apart from the substrate support member (3). When the substrate (100) is supported by the substrate support member (3), the lift pins (32) may be arranged inside the substrate support member (3) so as not to protrude from the substrate support member (3). Insertion holes into which the lift pins (32) are inserted may be formed in the substrate support member (3). The insertion holes may be arranged at positions spaced apart from the through holes (31).

[0071] Referring to FIGS. 1 to 4, the control unit (5) may include a storage unit (52) and an analysis unit (53).

[0072] The storage unit (52) can store data acquired by the acquisition unit (4). The acquisition unit (4) can provide data acquired through wireless communication, wired communication, etc. to the storage unit (52). The judgment unit (51) can determine the status information using the data stored in the storage unit (52).

[0073] The above analysis unit (53) can analyze the data acquired by the acquisition unit (4). The acquisition unit (4) can provide data acquired through wireless communication, wired communication, etc. to the analysis unit (53). The analysis unit (53) can also analyze data stored in the storage unit (52). The analysis unit (53) can provide the analysis result to the judgment unit (51). In this case, the analysis unit (53) can individually analyze data for the shooting areas (40) and then provide the analysis result to the judgment unit (51). The judgment unit (51) can determine the status information based on the analysis result provided from the analysis unit (53).

[0074] Although not shown, the substrate processing device (1) according to the present invention may include an injection unit. The injection unit can inject gas toward the substrate support unit (3). The injection unit can be disposed inside the chamber (2). The injection unit can be disposed opposite the substrate support unit (3). The injection unit can be disposed above the substrate support unit (3). The processing space (200) can be disposed between the injection unit and the substrate support unit (3). The injection unit can be coupled to a lid (not shown). The lid can be coupled to the chamber (2) so as to cover the upper portion of the chamber (2). The substrate processing device (1) according to the present invention can perform a processing process on the substrate (100) using the gas injected by the injection unit.

[0075] Hereinafter, an embodiment of a substrate processing method according to the present invention will be described in detail with reference to the attached drawings. The substrate processing method according to the present invention can be performed using the substrate processing apparatus according to the present invention described above.

[0076] Referring to FIGS. 1 to 5, the substrate processing method according to the present invention may include the following steps.

[0077] First, before the above processing is performed, a plurality of shooting areas (40) are photographed to obtain a plurality of first data (S10). This step (S10) can be performed by having the vision unit (41) photograph the shooting areas (40) to obtain the first data after the substrate (100) is brought into the chamber (2) from the outside and then seated on the substrate support member (3).

[0078] Next, after the above processing step is performed, the photographing areas (40) are photographed to obtain a plurality of second data (S20). This step (S20) can be performed by having the vision unit (41) photograph the photographing areas (40) to obtain the second data after the above processing step is performed but before the substrate (100) is taken out of the chamber (2).

[0079] Next, the status information of the substrate is determined using at least one of the first data and the second data (S30). This step (S30) can be performed by the control unit (5) determining the status information using at least one of the first data and the second data. The step (S30) of determining the status information of the substrate may also be performed by the determination unit (51).

[0080] Through the above steps (S10, S20, S30), the substrate processing method according to the present invention is implemented so that it can be confirmed that the substrate (100) is damaged, such as broken, or that the state of the substrate (100) is changed, such as the substrate (100) slidingly moving, during the process in which the substrate (100) is introduced into the chamber (2) and supported by the substrate support member (3), during the process in which the processing process is performed, etc. Accordingly, the substrate processing method according to the present invention can reduce the risk of fragments of the substrate (100) contaminating or damaging the inside of the chamber (2), the outside of the chamber (2), etc.

[0081] Although not shown, the substrate processing method according to the present invention may include a step of performing the processing process. The step of performing the processing process may be performed after the step of acquiring the first data (S10) is performed. In this case, the step of performing the processing process may be performed before the step of acquiring the second data (S20) is performed.

[0082] Here, the step (S30) of determining the status information of the substrate can be determined to be in a state where the substrate (100) can be removed if any of the following cases applies.

[0083] First, in the step (S30) of determining the status information of the substrate, if the marks (110) in all of the second data are located within the reference area (401), it can be determined that the substrate (100) is in a state where removal is possible.

[0084] Next, in the step (S30) of determining the status information of the substrate, if the marks (110) in all of the second data are located within the reference area (401) and are tilted within the reference angle, it can be determined that the substrate (100) is in a state where removal is possible.

[0085] Next, the step (S30) of determining the status information of the substrate calculates the positional difference and the direction difference between the marks (110) in the first data and the marks (110) in the second data, and if the positional difference and the direction difference for all of the marks (110) are within the reference range, it can be determined that the substrate (100) is in a state where it can be removed.

[0086] Here, the step (S30) of determining the status information of the substrate can determine that the substrate (100) is damaged if any of the following cases applies.

[0087] First, in the step (S30) of determining the status information of the substrate, if only some of the marks (110) among the second data deviate from the reference area (401), the substrate (100) can be determined to be damaged.

[0088] Next, in the step (S30) of determining the status information of the substrate, if the marks (110) are located within the reference area (401) in all of the second data, and at least one of the relative positional difference between the marks (110) and the relative direction difference between the marks (110) is outside the reference range, the substrate (100) can be determined to be damaged.

[0089] Next, the step (S30) of determining the status information of the substrate calculates the positional difference and the directional difference between the marks (110) in the first data and the marks (110) in the second data, and if only the positional difference and the directional difference for some of the marks (110) among the marks (110) are outside the reference range, the substrate (100) can be determined to be in a damaged state.

[0090] Here, the step (S30) of determining the status information of the substrate may determine that the substrate (100) is not suitable for removal if any of the following cases applies.

[0091] First, in the step (S30) of determining the status information of the substrate, if the marks (110) in all of the second data are located within the reference area (401) and deviate from the reference angle, it can be determined that the substrate (100) is not suitable for removal.

[0092] Next, in the step (S30) of determining the status information of the substrate, if the marks (110) in all of the second data are outside the reference area (401), it can be determined that the removal of the substrate (100) is not appropriate.

[0093] Next, the step (S30) of determining the status information of the substrate calculates the positional difference and the directional difference between the marks (110) in the first data and the marks (110) in the second data, and if the positional difference and the directional difference for all of the marks (110) are outside the reference range, the substrate (100) can be determined to be in a damaged state.

[0094] Meanwhile, the substrate processing method according to the present invention may include a step of generating an alarm. The step of generating an alarm may be performed by generating an alarm when the substrate (100) is determined to be damaged in the step (S30) of determining the status information of the substrate. The step of generating the alarm may be performed by the alarm unit.

[0095] The present invention described above is not limited to the above-described embodiments and the attached drawings, and it will be apparent to a person skilled in the art to which the present invention pertains that various substitutions, modifications, and changes are possible within a scope that does not depart from the technical spirit of the present invention.

Claims

1. A chamber where a processing process for a substrate is performed; A substrate support member supporting the substrate inside the chamber; An acquisition unit that detects the state of the above substrate and acquires data; and Includes a control unit that determines the status information of the substrate using the data acquired by the acquisition unit, A substrate processing device, characterized in that the above status information includes at least one of a damaged status of the substrate and a removeable status of the substrate.

2. In paragraph 1, the control unit A storage unit that stores data acquired by the above acquisition unit; An analysis unit that analyzes the data acquired by the above acquisition unit; A substrate processing device characterized by including a judgment unit that judges the status information using the above data.

3. In paragraph 1, A substrate processing device characterized in that the above acquisition unit acquires the data by photographing a mark formed on the substrate.

4. In paragraph 1, The above acquisition unit includes a plurality of vision units that acquire a plurality of data by photographing a plurality of shooting areas, A substrate processing device, characterized in that the control unit includes a judgment unit that judges the status information using the data acquired by the vision units and a plurality of marks formed on the substrate.

5. In paragraph 4, A substrate processing device characterized in that the above judgment unit determines that the substrate can be removed if the mark is located within a preset reference area in all of the above data.

6. In paragraph 4, A substrate processing device characterized in that the judgment unit determines that the substrate is damaged if the mark deviates from the preset reference area only in some of the data.

7. In paragraph 4, A substrate processing device characterized in that the above judgment unit determines that the substrate is damaged if at least one of the relative positional difference between the marks and the relative direction difference between the marks is outside the preset reference range even though the marks are located within the preset reference area in all of the above data.

8. In paragraph 1, The above acquisition unit includes a plurality of vision units that acquire a plurality of first data by photographing a plurality of photographing areas before the processing process is performed, and acquire a plurality of second data by photographing the photographing areas after the processing process is performed. A substrate processing device, characterized in that the control unit includes a judgment unit that compares the first data and the second data with each other to determine the status information.

9. In paragraph 8, A substrate processing device characterized in that the above judgment unit calculates the positional difference and the directional difference between the marks formed on the substrate in the first data and the marks in the second data, and if the positional difference and the directional difference for all of the marks are within a preset reference range, it determines that the substrate can be removed.

10. In paragraph 9, A substrate processing device characterized in that the judgment unit determines that, when performing a processing process by heating the substrate inside the chamber, there is no difference in position or direction for all of the marks, there is a problem with the heating unit that heats the substrate inside the chamber or that the substrate is damaged.

11. In paragraph 8, A substrate processing device characterized in that the above judgment unit calculates the positional difference and the directional difference between the marks formed on the substrate in the first data and the marks in the second data, and determines that the substrate is damaged if the positional difference and the directional difference for only some of the marks are outside a preset standard range.

12. In paragraph 1, A substrate processing device characterized by including an alarm unit that generates an alarm when the substrate is determined to be in a damaged state from the above status information.

13. A substrate processing method using a substrate processing device including a chamber in which a processing process for a substrate is performed and a substrate support member that supports the substrate inside the chamber, Before the above processing is performed, a step of photographing a plurality of shooting areas to obtain a plurality of first data; After the above processing process is performed, a step of photographing the photographing areas to obtain multiple second data; and A substrate processing method comprising a step of determining the status information of the substrate by using at least one of the first data and the second data.

14. In the 13th paragraph, the step of determining the status information of the substrate is In all of the above second data, if the marks formed on the substrate are located within the preset reference area, and Calculate the positional difference and the direction difference between the marks in the first data and the marks in the second data, and if the positional difference and the direction difference for all of the marks are within a preset reference range, A substrate processing method characterized in that in any one of the cases, it is determined that the substrate can be removed.

15. In the 13th paragraph, the step of determining the status information of the substrate is If only some of the marks formed on the substrate among the above second data are outside the preset reference area, In all of the above second data, if the marks are located within the reference area, but at least one of the relative positional difference between the marks and the relative direction difference between the marks is outside the preset reference range, and The positional difference and the directional difference between the marks in the first data and the marks in the second data are calculated, and if only the positional difference and the directional difference for some of the marks are outside the reference range, A substrate processing method characterized in that in any one of the cases, the substrate is judged to be in a damaged state.

16. In the 13th paragraph, the step of determining the status information of the substrate is A substrate processing method characterized in that, when performing a processing process by heating a substrate inside the chamber, the positional difference and the directional difference between the marks formed on the substrate in the first data and the marks in the second data are calculated, and if there is no positional difference and the directional difference for all of the marks, it is determined that there is a problem with the heating unit that heats the substrate inside the chamber or that the substrate is damaged.

Images