Vacuum hybrid cooler for central processing unit (CPU)

Abstract

The invention provides a hybrid cooler (100) for cooling computer processors (CPU), graphics processing units (GPU) or electronic elements that reach high temperatures while operating, comprising a vacuum chamber (110) in which the processor (200) or the electronic element to be cooled is positioned to increase efficiency in terms of heat transfer, to maximise cooling performance by directly contacting the processor (200) with the cold surface of the thermoelectric cooler (115); a pressure sensor (112) positioned inside the vacuum chamber (110) to measure the pressure of the vacuum cooling medium; a temperature-humidity sensor (113) positioned inside the vacuum chamber (110) to measure the humidity and temperature of the vacuum medium; a thermoelectric module (115) positioned inside the vacuum chamber (110) that directly contacts the processor (200) in the vacuum medium to perform the active cooling process; and a vacuum pump (119) positioned at the upper part of the vacuum chamber (110) to reduce the vacuum cooling medium to the desired vacuum pressure.

Description

[0001] DESCRIPTION

[0002] VACUUM HYBRID COOLER FOR CENTRAL PROCESSING UNIT (CPU)

[0003] Technical Field

[0004] The invention relates to a hybrid cooler that is powered by a thermoelectric module that cools in a vacuum chamber and is developed for use in cooling computer processors (CPU), graphics processing units (GPU) or electronic elements that reach high temperatures while operating.

[0005] State of the Art

[0006] The central processing unit (CPU) is one of the most important hardware components of a computer. The CPU performs the calculation, control and direction operations required for the execution of programs. It is a chip with a microprocessor that processes and coordinates all data and commands in the computer. It receives data from the computer's memory, processes it, and sends its results back to the memory or output devices. A CPU comprises various components. These include basic units such as the control unit, arithmetic logic unit, register unit, and timing unit. The control unit controls the processing and direction of data and commands. The arithmetic logic unit performs mathematical and logical operations. The register unit stores temporary data used during processing. The timing unit regulates and synchronises the processor clock speed. The speed of the central processing unit is measured as the clock speed and is usually expressed in gigahertz (GHz). A CPU with a higher clock speed can process faster and provide higher performance. The central processing unit can be called the brain of the computer. All calculations, data processing and command execution operations are performed by the CPU. The CPU is the most critical component that determines the performance and processing power of the computer.

[0007] Electronic elements such as computer processors (CPU) and graphics processing units (GPU) reach high temperatures during their operation, and their performance decreases with the increase in temperature. Even hardware failures occur as a result of overheating. For this reason, it is important to cool them effectively during their work. The first solution in actively used technologies is to contact a metal cooling block with a high heat transfer coefficient and increase the heat transfer surface area, and to cool these metal cooling blocks basically with the help of a fan. The cooling rate is increased by using a fan. However, in this cooling technique, cooling blocks are used in limited sizes and can be cooled according to the ambient conditions. In this case, they are insufficient. The second active solution used is liquid cooling systems. In these systems, a cooling block with a cooling fluid passing through it is directly contacted with the processor. Basically, the heated cooling fluid is passed through the radiator-fan system, reduced to values close to the ambient temperature and sent to the processor with the help of a pump. Again, in such systems, the cooling performance of the processor directly depends on the ambient conditions. In addition, the cooling surfaces of these two systems in contact with the processor do not fall to negative values and are still insufficient in excessive processor heating. Even if it is assumed that they fall to negative values, the area where they are in contact with the processor is in direct contact with the ambient air condition. For this reason, they are not systems that can solve the problems of moisture and dew formation. Moisture and dew formation are also undesirable because they cause negativities such as short circuits, corrosion and deterioration in electronic elements.

[0008] Today, active cooling cannot be done below the ambient temperature in the systems used for cooling the central processing unit. Air or water cooling systems can cool up to the ambient temperature values at which they work the most. Since the dew problem caused by humidity cannot be prevented in systems using thermoelectric coolers, cooling cannot be done at negative temperatures and efficient cooling cannot be provided. Many studies have been carried out and new systems have been developed in order to eliminate these problems. One of these studies is the invention subject to the patent application numbered KR100463519B1 . The invention relates to cooling the central processing unit (CPU) with a thermoelectric module (TEM). The invention is characterised in that the CPU is cooled just above the dew point temperature with a humidity sensor. In this system, the thermoelectric module cools the CPU. The power supply keeps the temperature of the TEM just above the dew point by making on-off control with a microcomputer. Since dew formation depends on the humidity rate in the air in the outside environment as well as the temperature, it is not possible for this system to provide more effective cooling with TEM than the air cooling or liquid cooling systems currently used in regions with humid weather conditions. In an environment with high humidity, the probability of dew formation increases when the TEM surface falls below the ambient temperature. For this reason, the system shuts down the TEM and as a result, stable cooling is prevented. Since the TEM in the system is cooled by air, it becomes difficult for the TEM to perform at negative values.

[0009] Another study is the invention that is the subject of the patent application numbered CN1470013A. The invention aims to actively cool the central processing unit (CPU) of a computer with a motherboard and an empty card slot on the motherboard. The system basically consists of a card, a plastic hose and a cooling unit. In this system, the CPU comes into contact with the heat spreader through thermal paste. The other surface of the heat spreader comes into contact with the cold surface of the TEM. The heat generated on the hot surface of the TEM is transferred to the air through the heat sink. The air is drawn from inside the computer case with the fan and transferred to the card through the plastic hose and from there to the outside environment through the outlet. The card is connected to the empty slot of the motherboard with the connection input. In this way, the cooling unit is activated when the computer is turned on. The card is connected to a separate power grid and provides the necessary power to the TEM. The connection cable provides the communication of the TEM with the microprocessor inside the card and the necessary power transmission for the TEM. The temperature sensor measures the processor temperature and the microprocessor inside the card controls the cooling profile of the TEM according to this temperature. The system consists of the assembly of a TEM to a heat spreader block placed on the CPU. A temperature sensor is adapted to the heat spreader block between the CPU and the TEM. The temperature measurement made on the heat spreader in contact with the processor in the system does not show the instantaneous real core temperature of the processor. It is not suitable for controlling sudden temperature increases or decreases in the processor with values taken from the block.

[0010] Another study is the invention subject to patent application numbered US2002191430A1 . The invention aims to cool the central processing unit and consists of at least one TEM, heat sink and heat exchanger. In said system, the hot surface of the TEMs is cooled by fan heat sinks. The cold surfaces of the TEMs come into contact with the heat exchangers. The CPU comes into contact with the heat exchanger. The refrigerant completes the circuit by passing through all heat exchangers via the pump and insulated pipe. In this way, the heat transferred from the processor to the refrigerant is transferred to the TEMs, providing cooling. It has been emphasised that TEM can also be used in the heat exchanger on the processor if extra cooling is desired. In the invention, TEMs are used to cool a refrigerant, and this fluid is cooled by passing through a metal heat exchanger mounted on the CPU.

[0011] Another study is the invention subject to patent application number US10345875B2. The invention is basically a system consisting of TEM, cooling fins and a control unit to cool computer processors. This system has two options: passive and active mode. In passive mode, TEM does not work and only the processor is cooled with cooling fins. In active mode, TEM comes into play and provides hybrid cooling with cooling fins. The air passing through the cooling fins in the first region with the help of the fan also passes through the cooling fins in contact with the hot surface of the TEM in the second region and transfers the heat transferred to the hot surface of the TEM to the air. Thus, the processor is actively cooled by the cold surface of the TEM. The system can also control the fan or open and close the TEM according to the upper and lower threshold temperature values determined by the control unit requesting the temperature values from the processor. The TEM is cooled by the air coming out of the cooling fins in the first region as heated. This situation will prevent the efficient operation of the TEM and makes it impossible to achieve low temperatures, especially a temperature below zero degrees. This has the potential to provide better processor cooling performance compared to air cooling, but will most likely cause poor performance compared to liquid cooling. Even if it is assumed that the TEM drops to sub-zero temperatures in this system, there is no mechanism to prevent moisture formation.

[0012] As a result, the need for a hybrid cooler that eliminates the disadvantages of the state of the art and the inadequacy of the current solutions have made it necessary to make a development in the relevant technical field. Brief Description of The Invention

[0013] The present invention relates to a hybrid cooler powered by a thermoelectric module that meets the above-mentioned requirements, eliminates all disadvantages and provides some additional advantages, is developed for use in cooling computer processors (CPU), graphic processing units (GPU) or electronic elements that reach high temperatures while operating, and performs cooling in a vacuum chamber.

[0014] By looking at the state of the art, the aim of the invention is to increase the efficiency in terms of heat transfer by cooling the CPU or the electronic element to be cooled in a vacuum chamber in the hybrid cooler developed for use in all electronic elements that reach high temperatures and require cooling, and to maximise the cooling performance by directly contacting the cold surface of the CPU and the TEM.

[0015] The aim of the invention is to eliminate the active effect of external air conditions on heat transfer by means of the vacuum environment.

[0016] Another aim of the invention is to eliminate the humidity or dew situation by vacuuming the air inside, thus ensuring that the TEM can operate at high performance, in other words, that the cooling surface of the TEM can operate safely at negative values.

[0017] Another aim of the invention is to instantly measure the humidity and pressure changes of the vacuum chamber and to ensure that the vacuum environment is kept stable by immediately activating the vacuum pump when they reach critical values.

[0018] Another aim of the invention is to enable the speed of the fans in the system, the speed of the pump and the operation of the TEM to be adjusted according to the processor temperature by reading the processor temperatures from the USB.

[0019] Another aim of the invention is to use the processor core temperature values received via the USB connection as feedback and to provide more stable cooling. Another aim of the invention is to provide controllable cooling depending on the processor temperature while actively cooling the processor through direct contact.

[0020] The structural and characteristic features and all the advantages of the invention will be understood more clearly by means of the figures given below and the detailed description written with references to these figures, and therefore the evaluation should be made by taking these figures and the detailed explanation into consideration.

[0021] Brief Description of the Drawings

[0022] In order to for the embodiment of the present invention and its advantages with additional elements to be understood in the best way, it should be evaluated together with the figures described below.

[0023] Figure-1 is a schematic general view of the disassembled state of the hybrid cooler.

[0024] Figure-2 is a schematic general view of the disassembled state of the vacuum chamber.

[0025] Figure 3 is a drawing showing the workflow of the operating method of the hybrid cooler that is the subject of the invention.

[0026] Reference Numerals

[0027] 100. Hybrid cooler

[0028] 110. Vacuum chamber

[0029] 111 . Top cover

[0030] 112. Pressure sensor

[0031] 113. Temperature-humidity sensor

[0032] 114. Liquid cooling block

[0033] 115. Thermoelectric cooler

[0034] 116. Intermediate seal

[0035] 117. Bottom cover ottom seal acuum pump heck valve quid pump adiator an ontrol unit rocessor

[0036] 2000. Activating the system

[0037] 2010. Running the computer

[0038] 2020. Running system elements

[0039] 2030. Reading processor core temperatures via USB connection to the control unit

[0040] 2040. Checking whether these are less than or equal to the lower critical temperature value determined for effective operation of the processor

[0041] 2041 . Disabling thermoelectric cooler by control unit

[0042] 2042. The system waiting for a short time

[0043] 2043. Reading humidity and pressure values from humidity - temperature and pressure sensor

[0044] 2044. Checking whether the humidity rate and pressure value of the cooling chamber are less than or equal to the critical humidity rate and critical pressure value.

[0045] 2045. Shutting off vacuum pump by control unit

[0046] 2050. Controlling the cooling performance by control unit according to processor temperature.

[0047] 2060. The temperature-humidity sensor reading the humidity rate while the pressure sensor reading the pressure value.

[0048] 2070. Checking whether the humidity rate and pressure value of the cooling chamber are less than or equal to the critical humidity rate and critical pressure value.

[0049] 2071 . Shutting off vacuum pump by control unit

[0050] 2080. Running the vacuum pump by the control unit

[0051] 2090. Checking whether the processor temperature is greater than or equal to the upper critical temperature by the control unit. 2091 . Control unit giving high temperature warning for processor

[0052] 2092. Checking whether the computer power button is pressed

[0053] 2093. Shutting down the system

[0054] Detailed Description of the Invention

[0055] In this detailed description, a hybrid cooler (100) that is powered by a thermoelectric cooler (115) that cools in a vacuum chamber (110) and is developed for use in cooling computer processors (CPU), graphic processor units (GPU) or electronic elements that reach high temperatures while operating is explained only as an example for a better understanding of the subject and in a way that does not create any limiting effect.

[0056] The hybrid cooler (100) shown in Figure-1 , which is the subject of the invention, can be used in all electronic elements that reach high temperatures and need cooling and is a system that can be adapted with geometric changes. Said hybrid cooler (100) is characterised in that it increases the efficiency in terms of heat transfer, maximises the cooling performance by directly contacting the processor (200) with the cold surface of the thermoelectric cooler (115), and cools the processor (200) or the electronic element to be cooled in the vacuum chamber (110). A top cover (111 ) is positioned on the upper part of the vacuum chamber (110) where the elements such as temperature-humidity sensor (113), thermoelectric cooler (115) are located, and a bottom cover (117) is positioned on the lower part. A flexible material intermediate seal (116) is positioned between said top cover (111 ) and said bottom cover to ensure the sealing of the vacuum environment. The bottom cover (117) shown in Figure-2 and the bottom seal (118) made of flexible material that can be crushed on the edge of the processor (200), which is the electronic element to be cooled, provide sealing in the formation of the vacuum volume. Inside said vacuum chamber (110), there is a pressure sensor (112) to measure the pressure of the vacuum cooling medium, a temperature-humidity sensor (113) to measure the humidity and temperature of the vacuum medium, and a thermoelectric module (115) and liquid cooling block (114) that perform the active cooling process by directly contacting the processor (200) in the vacuum medium. The refrigerant passes through the metal liquid cooling block (114) that is in contact with the hot surface of said thermoelectric module (115) with a high heat transfer coefficient and ensures stable and effective operation of the thermoelectric module (115). A vacuum pump (119) is connected to the upper part of the vacuum chamber (110) to reduce said vacuum cooling medium to the desired vacuum pressure. Between said vacuum pump (119) and the vacuum chamber (110), a pneumatic check valve (120) that allows one-way air outlet from the vacuum environment is positioned. While the vacuum pump (119) performs vacuuming in the vacuum chamber (110) in accordance with the operating system, said check valve (120) prevents air entry into the vacuum chamber (110) when the vacuum pump (119) is not operating. A liquid pump (130) that rotates the refrigerant in the system is positioned between said vacuum chamber (110) and the radiator (140), which is used to reduce the refrigerant to temperatures close to ambient conditions. At the bottom of said radiator (140), there is a fan (150) that cools the radiator (140) with air in order to increase the heat transfer rate. The electronic control unit (160), which basically comprises a microcontroller, power supply, motor drivers, voltage regulator, relay, USB connection output and necessary electronic circuit elements, controls the operation of the hybrid cooler (100) and carries out its operation in line with the operating system.

[0057] The hybrid cooler (100) is operated by pressing the on / off button after connecting it to the computer, preferably via USB. For this reason, the person does not need to receive any training for its use. After placing the intermediate seal (116) on the processor (200), the user applies the thermal paste on the processor (200) and mounts the head of the hybrid cooler (100) to the motherboard with a screw, similar to liquid cooling systems. Here, the surface of the processor (200) to be cooled enters the vacuum chamber (110), which is a vacuum volume, and the cooling process takes place here. After this assembly is completed and the USB connection is made, the hybrid cooler (100) is run.

[0058] When the computer begins working, the hybrid cooler (100) also begins working. The hybrid cooler (100) begins running the temperature-humidity sensor (113) and pressure sensor (112), liquid pump (130), vacuum pump (119) and fans (150) within itself. Then, the control unit (160) reads the processor (200) core temperatures via the USB connection. According to the feedback it receives from the processor (200), it checks whether the processor (200) temperature is less than or equal to the lower critical temperature value determined for its effective operation. If the processor (200) core temperature is less than or equal to the lower critical temperature limit, the control unit (160) disables the thermoelectric cooler (115) and pauses cooling. After waiting for a short time (e.g. 3 seconds), the temperature-humidity sensor (113) reads the humidity rate in the vacuum cooling volume, while the pressure sensor (112) reads the pressure value. If the humidity rate is below or equal to the critical value at which dew formation will be observed and the pressure value is less than or equal to the determined critical pressure value, the vacuum pump (119) is turned off and the processor (200) temperature reading stage is resumed. If the humidity rate and pressure value read do not meet the conditions, the hybrid cooler (100) directly returns to the processor (200) temperature reading stage without turning off the vacuum pump (119). If the processor (200) core temperature is greater than the lower critical temperature limit, the thermoelectric cooler (115) is turned on and the cooling performance is controlled depending on the processor temperature. Then, the humidity rates are begun to be read with the temperature-humidity sensor (113) and the pressure values are begun to be read with the pressure sensor (112). If the humidity rate is below or equal to the critical value at which dew formation will be observed and the pressure value is less than or equal to the determined critical pressure value, the vacuum pump (119) is turned off and while the cooling continues, and whether the processor (200) temperature is greater than the upper critical temperature is checked. If the contrary conditions are observed for the humidity rate and pressure value, the vacuum pump (119) is kept on or turned on if it is off. Then, while the cooling continues, whether the processor (200) temperature is greater than the upper critical temperature is checked. If the processor (200) core temperature is greater than or equal to the upper limit, the hybrid cooler (100) gives a warning with the help of a buzzer and continues the cooling process. If the processor (200) temperature is less than the upper critical temperature, the hybrid cooler (100) continues cooling without warning. In addition, the cooling process can be completed by the user pressing the computer on / off button.

[0059] Said hybrid cooler (100) is characterised in that the processor (200) (CPU or electronic element to be cooled) is cooled in the vacuum chamber (110). In this way, efficiency is increased in terms of heat transfer, and the cold surface of the CPU and the thermoelectric cooler (115) directly contacts, maximising the cooling performance. The active effect of external weather conditions on heat transfer is eliminated by the vacuum environment created in the vacuum chamber (110). Since the air inside is vacuumed, the humidity or dew is eliminated. In this way, the thermoelectric cooler (115) can operate at high performance. In other words, it can safely perform cooling in negative values in terms of humidity. In addition, since the humidity and pressure changes of the vacuum environment are measured instantly, the vacuum pump (119) is immediately activated when they reach critical values. In this way, the vacuum environment is kept stable.

[0060] The operating method of the hybrid cooler (100) which is the subject of the invention for cooling computer processors (CPU), graphic processing units (GPU) or electronic elements that reach high temperatures while operating is as follows.

[0061] - Activating the system (2000)

[0062] - Running the computer (2010)

[0063] - Running system elements (2020) o The elements mentioned here are the humidity temperature sensor, pressure sensor, water pump, vacuum pump and fan.

[0064] - Reading processor core temperatures via USB connection to the control unit (2030)

[0065] - Checking whether these are less than or equal to the lower critical temperature value determined for effective operation of the processor (2040) o Disabling thermoelectric cooler by control unit (2041 ) o The system waiting for a short time (2042)

[0066] ■ For example, here the system waits for 3 seconds. o Reading humidity and pressure values from humidity - temperature and pressure sensor (2043) o Checking whether the humidity rate and pressure value of the cooling chamber are less than or equal to the critical humidity rate and critical pressure value (2044) o Shutting off vacuum pump by control unit (2045)

[0067] - Controlling the cooling performance by control unit according to processor temperature (2050)

[0068] - The temperature-humidity sensor reading the humidity rate while the pressure sensor reading the pressure value (2060) - Checking whether the humidity rate and pressure value of the cooling chamber are less than or equal to the critical humidity rate and critical pressure value (2070) o Shutting off vacuum pump by control unit (2071 )

[0069] - Running the vacuum pump by the control unit (2080)

[0070] - Checking whether the processor temperature is greater than or equal to the upper critical temperature by the control unit (2090) o System giving high temperature warning for processor (2091 ) o Checking whether the computer power button is pressed (2092) o Shutting down the system (2093)

[0071] The hot surface of the thermoelectric cooler (115) is cooled with liquid cooling in the vacuum chamber (110) and temperatures below zero degrees are obtained on the cold surface. The formation of moisture due to being below zero degrees is prevented since it is inside the vacuum chamber (110).

[0072] Another feature of the hybrid cooler (100) is that the processor (200) temperatures can be received from USB as feedback. Thus, the speed of the fans (150) in the system, the speed of the vacuum pump (119) and the operation of the thermoelectric cooler (115) can be adjusted according to the processor (200) temperature.

Claims

CLAIMS1. A hybrid cooler (100) for cooling computer processors (CPU), graphics processing units (GPU) or electronic elements that reach high temperatures while operating, comprising- a vacuum chamber (110) in which the processor (200) or the electronic element to be cooled is positioned to increase efficiency in terms of heat transfer and to maximise cooling performance by directly contacting the processor (200) with the cold surface of the thermoelectric cooler (115);- a pressure sensor (112) that is positioned inside the vacuum chamber (110) for measuring the pressure of the vacuum cooling medium;- a temperature-humidity sensor (113) that is positioned inside the vacuum chamber (110) for measuring the humidity and temperature of the vacuum environment;- a thermoelectric module (115) that is positioned inside the vacuum chamber (110) and is in direct contact with the processor (200) in a vacuum environment to perform the active cooling process; and- A vacuum pump (119) that is located to the upper part of the vacuum chamber (110) to reduce said vacuum cooling medium to the desired vacuum pressure.

2. A hybrid cooler (100) according to Claim 1 , comprising a top cover (111 ) positioned on the top of the vacuum chamber (110).

3. A hybrid cooler (100) according to Claim 1 , comprising a bottom cover (117) positioned at the bottom.

4. A hybrid cooler (100) according to Claim 1 , comprising an intermediate seal (116) that is made of flexible material and is positioned between the top cover (111 ) and the bottom cover to ensure the sealing of the vacuum environment.

5. A hybrid cooler (100) according to Claim 1 , comprising a bottom seal (118) that is made of flexible material that can be crushed and is positioned on the edge of the processor (200), which is the electronic element to be cooled, andthe bottom cover (117) to ensure sealing in the formation of the vacuum volume.

6. A hybrid cooler (100) according to Claim 1 , comprising a metal liquid cooling block (114) with high heat transfer coefficient that is in contact with the hot surface of the thermoelectric module (115) and has a cooling liquid passing through it for stable and effective operation of the thermoelectric module (115).

7. A hybrid cooler (100) according to Claim 1 , comprising a pneumatic check valve (120) that performs vacuuming in accordance with the feedback received from the pressure sensor (112) in the vacuum chamber (110) in order to keep the vacuum chamber (110) within the desired pressure range, is positioned between the vacuum pump (119) and the vacuum chamber (110) and allows one-way air outlet from the vacuum environment.

8. A hybrid cooler (100) according to Claim 1 , comprising a radiator (140) to cool the coolant to temperatures close to ambient conditions.

9. A hybrid cooler (100) according to Claim 1 , comprising a liquid pump (130) that is positioned between the vacuum chamber (110) and the radiator (140) to circulate the refrigerant in the system.

10. A hybrid cooler (100) according to Claim 1 , comprising a fan (150) that is positioned at the bottom of the radiator (140) and cools the radiator (140) with air to increase the heat transfer rate.

11. A hybrid cooler (100) according to Claim 1 , comprising an electronic control unit (160) which basically comprises microcontroller, power supply, motor drivers, voltage regulator, relay, USB connection output and necessary electronic circuit elements.12.The working method of the hybrid cooler (100) for cooling computer processors (CPU), graphics processing units (GPU) or electronic elements that reach high temperatures while operating, comprising the process steps of:- Activating the system (2000),- Running the computer (2010),- Running system elements (2020),- Reading processor core temperatures via , USB connection to the control unit (2030)- Checking whether these are less than or equal to the lower critical temperature value determined for effective operation of the processor (2040)- Controlling the cooling performance by control unit according to processor temperature (2050)- The temperature-humidity sensor reading the humidity rate while the pressure sensor reading the pressure value (2060)- Checking whether the humidity rate and pressure value of the cooling chamber are less than or equal to the critical humidity rate and critical pressure value (2070)- Running the vacuum pump by the control unit (2080)- Checking whether the processor temperature is greater than or equal to the upper critical temperature by the control unit (2090). The working method according to Claim 12, comprising the process step of disabling the thermoelectric cooler (115) and interrupting cooling process by the control unit (160) if the core temperature is less than or equal to the lower critical temperature limit. The working method according to Claim 12, comprising the process step of turning the vacuum pump (119) off and checking whether the processor (200) temperature is greater than the upper critical temperature while cooling continues if the humidity rate measured by the temperature-humidity sensor (113) is below or equal to the critical value at which dew formation will be observed and the pressure value is less than or equal to the determined critical pressure value, and keeping the vacuum pump (119) on or turning it on if it is off if the opposite conditions are observed for the humidity rate and pressure value, in the case where the processor (200) core temperature is greater than the lower critical temperature limit. The working method according to Claim 12, comprising, in the process step where the control unit checks whether the processor temperature is greaterthan or equal to the upper critical temperature (2090); the process step of giving a high temperature warning for the processor with the help of a buzzer (2091 ) by means of the system if the processor (200) core temperature is greater than or equal to the upper limit. The working method according to Claim 12, comprising the process step of continuing the cooling without warning if the processor (200) temperature is lower than the upper critical temperature. The working method according to Claim 12, wherein the elements mentioned in the process step of running the system elements (2020) are humidity temperature sensor, pressure sensor, water pump, vacuum pump and fan.The working method according to Claim 12, comprising, in the process steps of checking whether these are less than or equal to the lower critical temperature value determined for effective operation of the processor (2040), if the lower critical temperature is less than or equal to the value determined for effective operation, the process steps of:- Disabling thermoelectric cooler by control unit (2041 )- The system waiting for a short time (2042)- Reading humidity and pressure values from humidity - temperature and pressure sensor (2043)- Checking whether the humidity rate and pressure value of the cooling chamber are less than or equal to the critical humidity rate and critical pressure value (2044) and- Shutting off vacuum pump by control unit (2045). The working method according to Claim 12, comprising, in the process steps of checking whether the processor temperature is greater than or equal to the upper critical temperature by the control unit (2090), if the processor temperature is higher than the upper critical temperature, the process steps of:- Checking whether the computer power button is pressed (2092) and- Shutting down the system (2093).20.The working method according to Claim 12 or Claim 18, wherein in the process step of the system waiting for a short time (2042), the system waits for 3 seconds.

21. The working method according to Claim 12, comprising, in the process steps of checking whether the humidity rate and pressure value of the cooling chamber are less than or equal to the critical humidity rate and critical pressure value (2070), the process step of shutting off the vacuum pump by control unit (2045) if the humidity rate is less than or equal to the critical pressure value and humidity rate, and the critical pressure value and humidity rate are less than or equal to the critical pressure.

Images