Functional backplate and light-emitting device

Abstract

The present application relates to the technical field of display. Disclosed are a functional backplate and a light-emitting device. The functional backplate comprises a base substrate, a plurality of electronic elements, a plurality of connecting traces, and a bridging circuit structure. The bridging circuit structure comprises a substrate, an adhesive layer located on a third surface of the substrate, and a circuit layer and a protective layer located on a fourth surface of the substrate. Each bridging trace in the circuit layer is connected to one corresponding connecting trace, so that a driving signal provided by an external circuit structure connected by the bridging trace is transmitted to an electronic element by means of the connecting trace. According to the solution of embodiments of the present application, the width occupied by ends of all the bridging traces can be concentrated to be within a smaller size range, and it is not necessary to bind a relatively large number of flexible circuit boards so as to connect to an external circuit structure. The flexibility is relatively high.

Description

Functional back panel and light-emitting device Technical Field

[0001] The present application relates to the field of display technology, and in particular to a functional backplane and a light-emitting device. Background Art

[0002] Light-emitting devices are currently developing towards ultra-narrow borders or even borderless to increase the screen-to-body ratio.

[0003] Summary of the Invention

[0004] The present application provides a functional backplane and a light-emitting device, and the technical solutions are as follows:

[0005] In one aspect, a functional backplane is provided, comprising:

[0006] a substrate comprising a first surface and a second surface that are opposite to each other;

[0007] a plurality of electronic components located on a first surface of the substrate;

[0008] a plurality of connecting traces, wherein a first end of each connecting trace is located on the first surface of the substrate and connected to the electronic component, and a second end of each connecting trace is located on the second surface of the substrate;

[0009] And a bridge circuit structure, the bridge circuit structure includes a substrate, an adhesive layer, a circuit layer and a protective layer; wherein the substrate includes a third surface and a fourth surface relative to each other, the adhesive layer is located on the third surface of the substrate, and the adhesive layer is used to bond the substrate and the second surface of the base plate; the circuit layer is located on the fourth surface of the substrate, and the circuit layer includes a plurality of bridge traces corresponding to the plurality of connecting traces, the first end of each bridge trace is connected to the second end of a corresponding connecting trace, and the second end of the bridge trace is used to connect to an external circuit structure, and is used to transmit the driving signal provided by the external circuit structure to the electronic component through the connecting trace; the protective layer is located on the side of the circuit layer away from the substrate.

[0010] Optionally, the second surface of the substrate has at least one first alignment mark, and the first alignment mark is used for structural alignment;

[0011] The substrate has at least one first alignment opening corresponding to the at least one first alignment mark, the orthographic projection of the first alignment opening on the substrate exposes the first alignment mark, and the orthographic projection of the first alignment opening on the substrate does not overlap with the orthographic projections of the multiple bridge traces on the substrate.

[0012] Optionally, a distance h1 between an edge of the first alignment mark and an edge of an orthographic projection of the first alignment opening on the substrate is in a range from 20 micrometers to 1 millimeter;

[0013] The center of the first alignment mark is located in a middle area of ​​an orthographic projection of the first alignment opening on the substrate.

[0014] Optionally, the orthographic projection of the first alignment opening on the substrate is in the shape of a square, an ellipse, a circle, or a regular polygon.

[0015] Optionally, the second surface of the substrate has at least one second alignment mark, and the second alignment mark is used for structural alignment;

[0016] The adhesive layer has at least one second alignment opening corresponding to the at least one second alignment mark, and the orthographic projection of the second alignment mark on the substrate is located within the orthographic projection of the second alignment opening on the substrate.

[0017] Optionally, the adhesive layer has a plurality of strip-shaped exhaust grooves, the plurality of exhaust grooves including at least a first groove extending along a first direction and a second groove extending along a second direction, the first direction being an extension direction of a portion of the connecting trace located on the second surface, and the second direction intersecting the first direction;

[0018] The orthographic projections of the first groove and the second groove on the substrate are located on a side of the second end of the bridge trace away from the first end of the bridge trace.

[0019] Optionally, the plurality of exhaust slots include a plurality of the first slots and one second slot, and the second direction is perpendicular to the first direction;

[0020] The plurality of first slots are farther away from the bridge trace than the second slot, the plurality of first slots are arranged at intervals in the second direction, and the first end of each first slot is connected to the second slot.

[0021] Optionally, the distance between the first side of the base plate and the second side of the substrate ranges from 0.5 mm to 5 mm;

[0022] The first side of the substrate is the side closest to the connection between the first end of the connecting trace and the second end of the connecting trace, and the second side of the substrate is the side closest to the first side of the substrate.

[0023] Optionally, the angle between the second side surface and the third surface of the substrate is an acute angle, and the orthographic projection of the fourth surface of the substrate on the third surface of the substrate is located within the third surface of the substrate.

[0024] Optionally, the angle between the second side surface and the third surface ranges from 30 degrees to 75 degrees.

[0025] Optionally, the functional backplane further comprises: a pad structure located on a side of the second side of the substrate close to the first side of the base plate;

[0026] An angle between a surface of the pad structure close to the first side of the substrate and the third surface of the substrate is smaller than an angle between the second side of the substrate and the third surface of the substrate.

[0027] Optionally, the functional backplane further includes: a first connection pad and a second connection pad;

[0028] The first connection pad is located on the first surface of the substrate and is used to connect the first end of the connection line and the electronic component;

[0029] The second connection pad is located on the fourth surface of the substrate and is used to connect the second end of the connecting trace and the first end of the bridge trace;

[0030] The distance h3 between the second connection pad and the second side surface of the substrate ranges from 100 micrometers to 0.5 millimeters.

[0031] Optionally, a bridging portion is provided between the first end and the second end of the bridge trace;

[0032] The material of the protective layer is an insulating material, the protective layer is a whole layer structure, and the orthographic projection of the protective layer on the substrate covers the orthographic projection of the bridge portion on the substrate, and exposes the orthographic projections of the first end and the second end of the bridge trace on the substrate; or,

[0033] The material of the protective layer is a conductive material, and the protective layer includes a plurality of protective patterns arranged at intervals and corresponding to the plurality of bridging traces. The orthographic projection of each of the protective patterns on the substrate covers the orthographic projection of a corresponding bridging trace on the substrate board.

[0034] Optionally, the substrate includes a flexible film layer; or,

[0035] The substrate includes a first flexible film layer, a buffer layer and a second flexible film layer stacked in sequence.

[0036] On the other hand, a light emitting device is provided, comprising: a power supply component and the functional backplane as described in the above aspect;

[0037] Wherein, the power supply component is used to supply power to the functional backplane. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0039] FIG1 is a schematic structural diagram of a functional backplane provided in an embodiment of the present application;

[0040] FIG2 is a schematic structural diagram of a bridge circuit structure provided in an embodiment of the present application;

[0041] FIG3 is a schematic structural diagram of another functional backplane provided in an embodiment of the present application;

[0042] FIG4 is a top view of a base plate and a substrate provided in an embodiment of the present application;

[0043] FIG5 is a top view of a bridge circuit structure provided in an embodiment of the present application;

[0044] FIG6 is a top view of an adhesive layer provided in an embodiment of the present application;

[0045] FIG7 is a top view of another bridge circuit structure provided in an embodiment of the present application;

[0046] FIG8 is a top view of another adhesive layer provided in an embodiment of the present application;

[0047] FIG9 is a schematic diagram of a bridge circuit structure, a first protective film, and a second protective film provided in an embodiment of the present application;

[0048] FIG10 is a schematic diagram of another bridge circuit structure, a first protective film, and a second protective film provided in an embodiment of the present application;

[0049] FIG11 is a schematic diagram of another bridge circuit structure, a first protective film, and a second protective film provided in an embodiment of the present application;

[0050] FIG12 is a schematic diagram of a connection trace climbing on a flexible circuit board without a cushion structure provided by an embodiment of the present application;

[0051] FIG13 is a schematic diagram of a connection trace climbing on a flexible circuit board in the presence of a cushion structure, provided by an embodiment of the present application;

[0052] FIG14 is a schematic diagram of a connection trace climbing on a substrate without a pad structure provided by an embodiment of the present application;

[0053] FIG15 is a schematic diagram of a connection trace climbing on a substrate without a pad structure provided by an embodiment of the present application;

[0054] FIG16 is a top view of a connection trace climbing on a substrate without a pad structure provided by an embodiment of the present application;

[0055] FIG17 is a top view of a connection trace climbing on a substrate in the presence of a pad structure, provided by an embodiment of the present application;

[0056] FIG18 is a top view of a functional backplane provided in an embodiment of the present application;

[0057] FIG19 is a cross-sectional view taken along the AA direction in FIG18;

[0058] FIG20 is a top view of another functional backplane provided in an embodiment of the present application;

[0059] FIG21 is a cross-sectional view of FIG20 along the BB direction. DETAILED DESCRIPTION

[0060] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0061] Some embodiments of the present application provide a light-emitting device, which includes a functional backplane and may of course also include other components. For example, it may include a circuit for providing an electrical signal to the functional backplane to drive the functional backplane to emit light. This circuit can be called a control circuit and may include a circuit board and / or an integrated circuit (IC) electrically connected to the functional backplane.

[0062] Optionally, the lighting device may further include a power supply component, which may be used to supply power to the functional backplane.

[0063] In some embodiments, the light emitting device may be a lighting device, in which case the light emitting device is used as a light source to achieve a lighting function. For example, the light emitting device may be a backlight module in a liquid crystal display device, a lamp for internal or external lighting, or various signal lights.

[0064] In other embodiments, the light-emitting device may be a display device, in which case the functional backplane is a display substrate for realizing the function of displaying an image (i.e., a picture). The light-emitting device may include a display or a product including a display. The display may be a flat panel display (FPD), a microdisplay, and the like. If divided according to whether the user can see the back of the display, the display may be a transparent display or an opaque display. If divided according to whether the display can be bent or curled, the display may be a flexible display or an ordinary display (which may be called a rigid display). For example, products including displays may include: computer monitors, televisions, billboards, laser printers with display functions, telephones, mobile phones, personal digital assistants (PDAs), laptop computers, digital cameras, camcorders, viewfinders, vehicles, large-area walls, theater screens, or stadium signs.

[0065] Some embodiments of the present disclosure provide a functional backplane, as shown in Figure 1, which includes: a substrate, and at least one electronic component arranged on the substrate. The electronic component can be a micro light emitting diode, a micro integrated circuit chip, a micro sensor, and a micro driver, etc., which are not limited here.

[0066] In some embodiments, taking the electronic components as micro light emitting diodes as an example, the functional backplane can be used as a backlight source or a display device. In the case where the functional backplane is used as a backlight source, a passive display panel can be used to display a full-color picture, such as a liquid crystal display panel (LCD). At this time, the functional backplane as a whole can emit monochromatic light or polychromatic light (such as white light). By arranging multiple micro light emitting diodes in a matrix and combining them with regional dimming technology, more refined brightness control and higher color contrast can be achieved. In the case where the functional backplane is used as a display device, micro light emitting diodes capable of emitting light of different colors can be provided on the functional backplane, which cooperate with each other to achieve the display of a full-color picture with higher brightness and contrast.

[0067] At present, considering the process yield and manufacturing cost, when preparing large-size products, multiple functional back panels can be spliced ​​together. In order to avoid the sense of separation between adjacent functional back panels due to splicing, which may affect the user experience, the functional back panels are designed with ultra-narrow borders or even borderless to present a seamless splicing effect. This is the development direction in the field.

[0068] Micro-LED display technology is widely recognized as a very promising third-generation display technology, making it easier to implement small-size splicing technology to assemble infinitely larger displays. Micro-LED displays can be Micro LED (Micro Light Emitting Diode) or Mini LED (Mini Light Emitting Diode).

[0069] In order to achieve ultra-narrow bezel display, the external circuit structure can be set on the back of the substrate, and the electronic components on the front of the substrate and the external circuit structure on the back of the substrate are connected through connecting lines (located on the side of the substrate).

[0070] FIG1 is a schematic diagram of the structure of a functional backplane provided in an embodiment of the present application. Referring to FIG1 , the functional backplane 10 includes: a substrate 101, a plurality of electronic components 102, a plurality of connecting traces 103, and a bridge circuit structure 104. The substrate 101 includes a first surface 101a and a second surface 101b opposite each other, and the plurality of electronic components 102 are located on the first surface 101a of the substrate 101. The first end of each connecting trace 103 is located on the first surface 101a of the substrate 101 and is connected to the electronic component 102, and the second end of each connecting trace 103 is located on the second surface 101b of the substrate 101.

[0071] FIG2 is a schematic diagram of a bridge circuit structure provided in an embodiment of the present application. Referring to FIG2 , the bridge circuit structure 104 includes a substrate 1041, an adhesive layer 1042, a circuit layer 1043, and a protective layer 1044. The substrate 1041 includes a third surface 1041a and a fourth surface 1041b , which are opposed to each other. The adhesive layer 1042 is located on the third surface 1041a of the substrate 1041 and is used to bond the substrate 1041 to the second surface 101b of the base plate 101. The circuit layer 1043 is located on the fourth surface 1041b of the substrate 1041 and includes a plurality of bridge traces (not shown) corresponding to the plurality of connecting traces 103. The first end of each bridge trace is connected to the second end of a corresponding connecting trace 103. The second end of the bridge trace is used to connect to an external circuit structure to transmit a drive signal provided by the external circuit structure to the electronic component 102 via the connecting trace 103. The protective layer 1044 is located on a side of the circuit layer 1043 away from the substrate 1041 . The orthographic projection of the protective layer 1044 on the substrate 1041 covers at least a portion of the circuit layer 1043 , thereby protecting at least a portion of the circuit layer 1043 .

[0072] In the embodiment of the present application, the main function of the substrate 1041 is to carry the bridging traces. After the substrate 1041 is attached to the second surface 101b of the substrate 101 through the adhesive layer 1042, the connecting traces 103 can be formed by coating or printing to achieve effective connection between the electronic components 102 and the bridging traces.

[0073] Referring to FIG1 , the connecting trace 103 includes portions sequentially disposed on the first surface 101a, the first side surface 101c, and the second surface 101b. Alternatively, referring to FIG3 , a through hole is disposed on the substrate 101, and the connecting trace 103 extends from the first surface 101a to the second surface 101b through the through hole. In both the embodiments shown in FIG1 and FIG3 , a bridge circuit structure 104 may be disposed on the second surface 102b, and the connecting trace 103 is connected to a bridge trace within the bridge circuit structure 104.

[0074] 1 and 2 , the fourth surface 1041b of the substrate 1041 is further away from the base plate 101 than the third surface 1041a, and the circuit layer 1043 is located on the side of the substrate 1041 away from the base plate 101. Therefore, in order to connect the connecting trace 103 with the bridge trace in the circuit layer 1043, it is necessary to make the connecting trace 103 climb along the side of the substrate 1041 to the surface of the substrate 1041 away from the base plate 101, thereby connecting the second end of the connecting trace 103 to the bridge trace located on the fourth surface 1041b of the substrate 1041 to achieve signal transmission.

[0075] In the embodiment of the present application, the bridge traces in the bridge circuit structure 104 can be fabricated through an exposure process. The exposure process is highly precise and stable, enabling the fabrication of bridge traces with smaller line widths and line spacings. Consequently, the widths occupied by the ends of all bridge traces can be concentrated within a smaller size range. Furthermore, when a flexible printed circuit (FPC) is used for connection to an external circuit structure, a smaller FPC can be used, increasing design flexibility while reducing costs.

[0076] In summary, an embodiment of the present application provides a functional backplane, which includes a substrate, a plurality of electronic components, a plurality of connecting traces and a bridge circuit structure. The bridge circuit structure includes a substrate, an adhesive layer located on the third surface of the substrate, and a circuit layer and a protective layer located on the fourth surface of the substrate. Each bridge trace in the circuit layer is connected to a corresponding connecting trace, and then the driving signal provided by the external circuit structure connected to the bridge trace is transmitted to the electronic component through the connecting trace. The solution of the embodiment of the present application can concentrate the width occupied by the ends of all bridge traces into a smaller size range, and there is no need to bind a large number of flexible circuit boards to connect with the external circuit structure, which has higher flexibility.

[0077] In the embodiment of the present application, both the connecting trace 103 and the bridging trace can be metal traces. The material of the metal trace can be a three-layer structure of Ti (titanium), Al (aluminum) and Ti, denoted as Ti / Al / Ti. Alternatively, the material of the metal trace can be a three-layer structure of Mo (molybdenum), Al and Mo, denoted as Mo / Al / Mo. Alternatively, the material of the metal trace can be a three-layer structure of Ti, Cu (copper) and Ti, denoted as Ti / Cu / Ti. Alternatively, the material of the metal trace can be a three-layer structure of Mo, Cu and Mo, denoted as Mo / Cu / Mo. Alternatively, the material of the metal trace can be a three-layer structure of MoNb (molybdenum-niobium alloy), Al and MoNb, denoted as MoNb / Al / MoNb. Alternatively, the material of the metal trace can be a three-layer structure of MoNb, Cu and MoNb, denoted as MoNb / Cu / MoNb. Of course, the material of the metal trace can also be other materials, and the embodiment of the present application does not limit this.

[0078] Optionally, the thickness of the metal traces needs to be measured and designed based on product performance or user needs. Typically, the thickness of the metal traces ranges from 0.5 μm (micrometers) to 2 μm.

[0079] Figure 4 is a top view of a substrate and underlay provided in an embodiment of the present application. Referring to Figure 4 , the second surface 101b of the substrate 101 has at least one first alignment mark J1 (two first alignment marks J1 are shown in Figure 4 ). This first alignment mark J1 can be used for structural alignment. For example, this first alignment mark J1 can be used for alignment when the substrate 101 and the bridge substrate 104 are bonded together.

[0080] The first alignment mark J1 needs to be identified in order to play its role. However, if the substrate 1041 covers the first alignment mark J1, the first alignment mark J1 cannot be identified. Therefore, it is necessary to set an alignment opening in the substrate 1041 and the adhesive layer 1042 of the bridging substrate 104 at a position corresponding to the first alignment mark J1. As shown in Figure 4, the bridging substrate 104 has at least one first alignment opening K1 corresponding to at least one first alignment mark J1. The orthographic projection of the first alignment opening K1 on the substrate 101 exposes the first alignment mark J1. In addition, the orthographic projection of the first alignment opening K1 on the substrate 101 and the orthographic projection of the multiple bridge traces on the substrate 101 do not overlap, thereby ensuring the normal wiring of the bridge traces on the substrate 1041.

[0081] Optionally, the distance h1 between the edge of the first alignment mark J1 and the edge of the orthographic projection of the first alignment opening K1 on the substrate 101 can range from 20 μm to 1 mm. This ensures that the first alignment opening K1 fully exposes the first alignment mark J1, ensuring effective recognition of the first alignment mark J1. The distance h1 ranging from 20 μm to 1 mm can mean that the distance h1 is greater than or equal to 20 μm and less than or equal to 1 mm. That is, 20 μm ≤ h1 ≤ 1 mm.

[0082] For example, referring to FIG4 , the first alignment mark J1 may be a cross structure, and the edge of the first alignment mark J1 may be the end of a branch of the cross structure. The distance h1 between the edge of the first alignment mark J1 and the edge of the orthographic projection of the first alignment opening K1 on the substrate 101 may be the distance between the end of the branch and the edge of the orthographic projection of the first alignment opening K1 on the substrate 101. Of course, the first alignment mark J1 may also have other shapes.

[0083] Optionally, the cross structure may include two mutually perpendicular branches, wherein the distance h11 between the first branch and the first edge of the first alignment opening K1 is equal to the distance h12 between the second branch and the second edge of the first alignment opening K1. The first branch extends perpendicularly to the first edge, and the second branch extends perpendicularly to the second edge.

[0084] Of course, the distance h11 between the first branch and the first edge of the first alignment opening K1 and the distance h12 between the second branch and the second edge of the first alignment opening K1 may also be unequal, which is not limited in the embodiment of the present application.

[0085] For example, when the distance h1 between the end of any branch and the edge of the positive projection of the first alignment opening K1 on the substrate 101 is greater than or equal to 0.5 mm, the distance h11 between the first branch and the first edge of the first alignment opening K1 may be unequal to the distance h12 between the second branch and the second edge of the first alignment opening K1.

[0086] In the embodiment of the present application, the center of the first alignment mark J1 can be located in the middle area of ​​the orthographic projection of the first alignment opening K1 on the substrate 101. In this way, the size of the first alignment opening K1 can be minimized while fully exposing the first alignment mark J1, thereby avoiding affecting the routing of the bridge traces.

[0087] Optionally, the orthographic projection of the first alignment opening K1 on the substrate 101 may be a regular polygon, an ellipse, a circle, or the like. The regular polygon may be a square, a regular pentagon, a regular hexagon, or the like. For example, referring to FIG. 4 , the orthographic projection of the first alignment opening K1 on the substrate 101 may be a square. Of course, the orthographic projection of the first alignment opening K1 on the substrate 101 may also be other shapes, which are not limited in this embodiment of the present application.

[0088] Figure 5 is a partial top view of a bridge circuit structure provided in an embodiment of the present application. Referring to Figure 5 , the second surface 101b of the substrate 1041 has at least one second alignment mark J2 (two second alignment marks J2 are shown in Figure 5 ). The second alignment mark J2 can be used for structural alignment. For example, the second alignment mark J2 can be used for alignment during bonding of the substrate 101 and the bridge substrate 104.

[0089] Typically, because bubbles and texture in the adhesive layer 1042 on the side of the substrate 1041 closest to the base plate 101 can affect the recognition of the second alignment mark J2, a second alignment opening K2 can be designed in the adhesive layer 1042 at a position corresponding to the second alignment mark J2 to ensure effective recognition of the second alignment mark J2. Referring to Figure 6, the adhesive layer 1042 has at least one second alignment opening K2 corresponding to the at least one second alignment mark J2. The orthographic projection of the second alignment mark J2 on the base plate 101 is located within the orthographic projection of the second alignment opening K2 on the base plate 101.

[0090] Optionally, the distance h2 between the edge of the second alignment mark J2 and the edge of the orthographic projection of the second alignment opening K2 on the substrate 101 can range from 20 μm to 1 mm. This ensures that there is no adhesive layer 1042 material beneath the second alignment mark J2, preventing bubbles from forming during the attachment of the adhesive layer 1042 or any surface texture on the adhesive layer 1042 that could affect the recognition of the second alignment mark J2. The distance h2 ranging from 20 μm to 1 mm can mean that the distance h2 is greater than or equal to 20 μm and less than or equal to 1 mm. That is, 20 μm ≤ h2 ≤ 1 mm.

[0091] For example, referring to FIG6 , the second alignment mark J2 may be a cross structure, and the edge of the second alignment mark J2 may be the end of a zigzag branch of the cross structure. The distance h2 between the edge of the second alignment mark J2 and the edge of the orthographic projection of the second alignment opening K2 on the substrate 101 may be the distance between the end of the branch and the edge of the orthographic projection of the second alignment opening K2 on the substrate 101. Of course, the second alignment mark J2 may also have other shapes.

[0092] Optionally, the cross structure may include two mutually perpendicular branches, wherein the distance h21 between the first branch and the third edge of the second alignment opening K2 is equal to the distance h22 between the second branch and the fourth edge of the second alignment opening K2. The first branch extends perpendicularly to the third edge, and the second branch extends perpendicularly to the fourth edge.

[0093] Of course, the distance h21 between the first branch and the third edge of the second alignment opening K2 and the distance h22 between the second branch and the fourth edge of the second alignment opening K2 may also be different, which is not limited in this embodiment of the present application.

[0094] For example, when the distance h2 between the end of any branch and the edge of the positive projection of the second alignment opening K2 on the substrate 101 is greater than or equal to 0.5 mm, the distance h21 between the first branch and the third edge of the second alignment opening K2 may be unequal to the distance h22 between the second branch and the fourth edge of the second alignment opening K2.

[0095] In the embodiment of the present application, the center of the second alignment mark J2 can be located in the middle area of ​​the orthographic projection of the second alignment opening K2 on the substrate 101. This can minimize the size of the second alignment opening K2 while ensuring that there is no adhesive layer 1042 material below the second alignment mark J2, thereby avoiding affecting the adhesive effect of the adhesive layer 1042.

[0096] 6 , the orthographic projection of the second alignment opening K2 on the substrate 101 may be a square. Of course, the orthographic projection of the second alignment opening K2 on the substrate 101 may also be other shapes, such as an ellipse, a circle, or a regular polygon, etc., which is not limited in this embodiment of the present application.

[0097] Typically, during the manufacturing process, the functional backplane 10 undergoes multiple high-temperature treatments after bonding the bridge circuit structure 104 to the substrate 101. However, during this high-temperature treatment, the functional backplane 10 may warp due to the significant difference in the thermal expansion coefficients of the adhesive layer 1042 and the substrate 1041.

[0098] Optionally, after the bridge circuit structure 104 and the substrate 101 are bonded, the bonding layer 1042 needs to be cured at a temperature of 150°C; after the connecting trace 103 is formed, the material forming the connecting trace 103 needs to be cured at a temperature below 200°C (a temperature below 200°C is convenient for stable production). For example, assuming that the material of the connecting trace 103 is a mixture of silver powder and resin, it can be cured at a temperature of 150°C for 30 minutes; after the trace protection layer 105 for protecting the connecting trace 103 is formed, it needs to be cured at a temperature below 200°C (a temperature below 200°C is convenient for stable production). For example, assuming that the material of the trace protection layer 105 is epoxy resin, it can be cured at a temperature of 150°C for 30 minutes; and the fixed connection between the electronic component 102 and the substrate 101 needs to be achieved through a solid crystal process at a temperature of 270°C.

[0099] In order to solve the problem of warping of the functional backplane 10, a material with better temperature resistance can be selected as the material of the adhesive layer 1042. Better temperature resistance can mean that the expansion amount is smaller at high temperatures (such as 270°C). Alternatively, a plurality of strip-shaped exhaust slots W as shown in Figures 7 and 8 can be further provided on the adhesive layer 1042. During the subsequent high-temperature treatment process, the exhaust slots W can provide expansion space for the expansion of the adhesive layer 1042, and the expansion space can accommodate a part of the capacity of the adhesive layer 1042, thereby avoiding the warping of the functional backplane due to the large difference in the expansion amount of the adhesive layer 1042 and the substrate 1041, thereby ensuring the yield of the functional backplane.

[0100] Referring to FIG8 , the plurality of exhaust slots W include at least a first slot W1 extending along a first direction X, and a second slot W2 extending along a second direction Y. The first direction X is the direction in which the portion of the connecting trace 103 located on the second surface 101 b extends. The second direction Y intersects the first direction X. For example, the second direction Y may be perpendicular to the first direction X. The orthographic projections of the first slot W1 and the second slot W2 on the substrate 101 are both located on the side of the second end of the bridge trace away from the first end of the bridge trace.

[0101] Furthermore, referring to FIG8 , the plurality of exhaust slots W include a plurality of first slots W1 and a second slot W2. The plurality of first slots W1 are further away from the bridge trace than the second slots W2. The plurality of first slots W1 are spaced apart in the second direction Y, and the first end of each first slot W1 is connected to the second slot W2.

[0102] Generally, the functional back panel 10 is more likely to warp in the second direction Y. Therefore, by designing a plurality of first grooves W1 extending along the first direction X and arranged along the second direction Y, it is possible to provide a large amount of expansion space for the adhesive layer 1042 in the second direction Y, thereby reducing the total expansion of the adhesive layer 1042 in the second direction Y. This can reduce the possibility of the functional back panel warping in the second direction Y.

[0103] Optionally, the length of the second groove W2 (the length of the second groove W2 along the second direction Y) can be equal to the length of the bridge circuit structure 104 in the second direction Y. The width d1 of the second groove W2 (the length of the second groove W2 along the first direction X) can range from 1 mm to 3 mm. The distance d2 between the second groove W2 and the bridge circuit structure 104 and the edge of the connecting trace 103 ranges from 5 mm to 15 mm.

[0104] Optionally, the first slot W1 may extend from the position of the second slot W2 in a direction away from the connecting trace 103 to the edge of the bridge circuit structure 104, that is, the length d2 of the first slot W1 (the length of the first slot W1 along the first direction X) is equal to the distance between the second slot W2 and the edge of the bridge circuit structure 104 away from the connecting trace 103. The width d3 of the first slot W1 (the length of the first slot W1 along the second direction Y) may range from 1 mm to 3 mm. The distance d4 between adjacent first slots W1 may range from 2 mm to 6 mm. In addition, the ratio d4 / d3 of d4 to d3 is greater than or equal to 1.5 and less than or equal to 3, that is, 1.5≤d4 / d3≤3.

[0105] Furthermore, a distance d5 between the side surface 1042 a of the adhesive layer 1042 away from the exhaust slot W and the first alignment opening K1 along the first direction X is greater than or equal to 2 mm, thereby ensuring the bonding effect of the adhesive layer 1042 .

[0106] Optionally, the thickness of the adhesive layer 1042 can range from 20 μm to 100 μm, that is, the thickness of the adhesive layer 1042 is greater than or equal to 20 μm and less than or equal to 100 μm. In other words, the thickness of the adhesive layer 1042 should be neither too thin nor too thick. If it is too thin, the bonding effect between the substrate 1041 and the base plate 101 cannot be guaranteed; if it is too thick, the total thickness of the adhesive layer 1042 and the substrate 1041 will be too high, that is, the climbing height of the connecting trace 103 will be too high, and the yield rate of the connecting trace 103 will be low.

[0107] In the embodiment of the present application, referring to FIG4 , the distance h3 between the first side surface 101c of the substrate 101 and the second side surface 1041c of the substrate 1041 ranges from 0.5 mm to 5 mm. The first side surface 101c of the substrate 101 is the side of the substrate 101 closest to the connection between the first end of the connecting trace 103 and the second end of the connecting trace 103. The second side surface 1041c of the substrate 1041 is the side of the substrate 1041 closest to the first side surface 101c of the substrate 101. The distance h3 ranging from 0.5 mm to 5 mm may mean that the distance h3 is greater than or equal to 0.5 mm and less than or equal to 5 mm. That is, 0.5 mm ≤ h3 ≤ 5 mm.

[0108] For example, in Figure 1 , the first side surface 101c of the substrate 101 is the side surface around which the connection portion of the connection trace 103 passes. In Figure 3 , the first side surface 101c of the substrate 101 is the side surface closest to the through hole.

[0109] Because the second end of the connecting trace 103 needs to be disposed on the second surface 101b of the substrate 101 and slope along the second side surface 1041c of the substrate 1041, the distance between the first side surface 101c of the substrate 101 and the second side surface 1041c of the substrate 1041 is designed to be greater than or equal to 0.5 mm. This provides a routing buffer for the connecting trace 103, prevents the connecting trace 103 from sloped over a short distance, and ensures the yield of the connecting trace 103. In addition, the distance between the first side surface 101c of the substrate 101 and the second side surface 1041c of the substrate 1041 is less than or equal to 5 mm, which prevents the resistance of the connecting trace 103 from being too high due to the excessive distance, thereby improving signal transmission efficiency.

[0110] Furthermore, since the distance h3 between the first side surface 101c of the substrate 101 and the second side surface 1041c of the substrate 1041 is not a fixed value, the position of the first alignment opening K1 on the substrate 1041 is also not fixed. Therefore, before designing the first alignment opening K1 on the substrate 1041, the fixed distance h3 between the first side surface 101c of the substrate 101 and the second side surface 1041c of the substrate 1041 can be determined. The specific position of the first alignment opening K1 can then be designed, assuming that the first alignment opening K1 exposes the first alignment mark J1. Alternatively, the center of the first alignment mark J1 can be located in the middle of the orthographic projection of the first alignment opening K1 on the substrate 101.

[0111] In an embodiment of the present application, referring to FIG9 , before the bridge circuit structure 104 and the substrate 101 are bonded together, a first protective film may be provided on the side of the adhesive layer 1042 of the bridge circuit structure 104 that is away from the substrate 1041. The first protective film can support and protect the adhesive layer 1042, thereby preventing foreign matter from being present on the adhesive layer 1042 before the bridge circuit structure 104 and the substrate 101 are bonded together, and ensuring the bonding effect of the adhesive layer 1042.

[0112] Optionally, the thickness of the first protective film can be greater than 50 μm, so that the first protective film has a certain support performance and ensures the load-bearing effect on the adhesive layer 1042. In addition, to ensure that the first protective film does not separate from the adhesive layer 1042 before the bridge circuit structure 104 is bonded to the substrate 101, the first protective film must have an adhesion force greater than 5 gf / 25 mm (grams-force per millimeter). At the same time, the first protective film can be flush with the adhesive layer 1042, further preventing the first protective layer and the adhesive layer 1042 from separating.

[0113] 9 , the side of the protective layer 1044 of the bridge circuit structure 104 away from the substrate 1041 may have a second protective film. The second protective film can increase the stiffness of the bridge circuit structure 104 and reduce deformation when the bridge circuit structure 104 and the substrate 101 are bonded.

[0114] In the embodiment of the present application, the side of the bridge circuit structure 104 close to the first side surface 101c of the substrate 101, the side of the first protective film, and the side of the second protective film can be formed by cutting in a single process. The side of the bridge circuit structure 104 close to the first side surface 101c of the substrate 101 includes not only the second side surface 1041c of the substrate 1041 but also the side of the adhesive layer 1042.

[0115] Optionally, referring to FIG9 , the side of the bridge circuit structure 104 close to the first side surface 101c of the substrate 101, the side of the first protective film, and the side of the second protective film may be perpendicular to the supporting surface of the substrate 1041. Alternatively, referring to FIG10 and FIG11 , the angle α between the side of the bridge circuit structure 104 close to the first side surface 101c of the substrate 101 and the third surface 1041a of the substrate 1041 is an acute angle, and the orthographic projection of the fourth surface 1041b of the substrate 1041 on the third surface 1041a of the substrate 1041 is located within the third surface 1041a of the substrate 1041.

[0116] Referring to FIG10 , when cutting to form the side surface of the bridge circuit structure 104 close to the first side surface 101c of the substrate 101, only the side surface of the bridge circuit structure 104 close to the first side surface 101c of the substrate 101 can be cut into a bevel, so that the angle between them is acute. Alternatively, referring to FIG11 , when cutting to form the side surface of the bridge circuit structure 104 close to the first side surface 101c of the substrate 101, both the side surface of the bridge circuit structure 104 close to the first side surface 101c of the substrate 101 and the side surface of the first protective film can be cut into bevels, so that the angle between them is acute. Optionally, the angle between the second side surface 1041c and the third surface 1041a ranges from 30 degrees to 75 degrees.

[0117] In the embodiment of the present application, by making the side surface of the bridge circuit structure 104 close to the first side surface 101c of the substrate 101 an inclined surface, the second end of the connecting trace 103 can be easily climbed on the inclined surface, thereby improving the yield of the connecting trace 103.

[0118] In addition, substrate 1041 includes a flexible film layer. For example, substrate 1041 is a single-layer polyimide (PI) film layer. Alternatively, as shown in FIG2 , substrate 1041 includes a first flexible film layer, a buffer layer (barrier), and a second flexible film layer stacked in sequence. For example, substrate 1041 is a sandwich structure of a polyimide film layer, a buffer layer, and a polyimide film layer, denoted as PI / barrier / PI.

[0119] Regardless of whether substrate 1041 is a single-layer PI film or a PI / barrier / PI sandwich structure, the thickness of substrate 1041 can range from 10 μm to 30 μm. In other words, the thickness of substrate 1041 can be greater than or equal to 10 μm and less than or equal to 30 μm. Furthermore, because substrate 1041 is made of PI, bridge circuit structure 104 can also be referred to as a PI bridge.

[0120] In conjunction with Figures 12 to 15, the thickness of the substrate 1041 of the bridge circuit structure 104 provided in the embodiment of the present application is thinner than that of an ordinary flexible circuit board (FPC). Therefore, by setting the bridge circuit structure 104, the embodiment of the present application can make it easier for the connecting trace 103 to climb, and the defect of the connecting trace 103 breaking will not occur, and the production yield is high.

[0121] Referring to FIG15 , the functional backplane 10 may further include: a cushion structure 106 located on a side of the second side 1041c of the substrate 1041 close to the first side 101c of the substrate 101. The angle between the surface of the cushion structure 106 close to the first side 101c of the substrate 101 and the third surface 1041a of the substrate 1041 is smaller than the angle between the second side 1041c of the substrate 1041 and the third surface 1041a of the substrate 1041. In other words, after the bridge circuit structure 104 is attached to the second surface 101b of the substrate 101, the second end of the connecting trace 103 needs to climb to connect with the bridge trace on the substrate 1041.

[0122] In Figure 12, the flexible circuit board is thicker, and without a cushioning structure, the step difference is larger, resulting in a lower yield rate for the connection traces. In Figure 14, the substrate 1041 is thinner, and without a cushioning structure, the step difference is smaller, resulting in a higher yield rate for the connection traces. If this solution is improved, as shown in Figures 13 and 15, by adding a cushioning structure 106 to the ends of the flexible circuit board and substrate 1041, respectively, where the second connection pads 108 are located, the yield rate for the connection traces 103 can be improved.

[0123] Furthermore, referring to FIG16 , without the pad layer structure 106, the line uniformity of the connecting traces 103 is poor, and the connecting traces 103 are piled up at the end of the substrate 1041 near the first side surface 101c (where the line width is significantly increased), which easily causes a short circuit between two adjacent connecting traces 103. Referring to FIG17 , with the pad layer structure 106, the line uniformity of the connecting traces 103 is better, and the connecting traces 103 at the end of the substrate 1041 near the first side surface 101c only show slight line width variations.

[0124] That is, for the climbing design, the cushion structure 106 can be provided to increase the gentleness, thereby making the climbing of the second end of the connecting wire 103 smoother, further improving the yield of the connecting wire 103 .

[0125] In the embodiment of the present application, referring to Figures 1, 3, and 4, the functional backplane 10 further includes a first connection pad 107 and a second connection pad 108. The first connection pad 107 is located on the first surface 101a of the substrate 101 and is used to connect the first end of the connection trace 103 to the electronic component 102. The second connection pad 108 is located on the fourth surface 1041b of the substrate 1041 and is used to connect the second end of the connection trace 103 to the first end of the bridge trace.

[0126] 15 , the pad structure 106 can be located not only on the second side surface 1041c of the substrate 1041, facilitating the connection trace 103 to climb along the second side surface 1041c of the substrate 1041, but can also be located on the side of the second connection pad 108, facilitating the connection trace 103 to climb along the side of the second connection pad 108, thereby enabling signal transmission to and from the second connection pad 108. In other words, the starting and ending positions of the pad structure 106 are located on either side of the second side surface 1041c of the substrate 1041, respectively. The design of the pad structure 106 can improve the climbing effect of the connection trace 103.

[0127] Optionally, the functional backplane 10 includes a plurality of first connection pads 107 spaced apart in the second direction Y, and each first connection pad 107 is connected to a corresponding connection trace 103. Furthermore, the functional backplane includes a plurality of second connection pads 108 spaced apart in the second direction Y, and each second connection pad 108 is connected to a corresponding connection trace 103 and a corresponding bridge trace.

[0128] Optionally, the distance A between the second connection pad 108 and the second side surface 1041c of the substrate 1041 ranges from 100 μm to 0.5 mm. The distance A ranges from 100 μm to 0.5 mm, which may mean that the distance A is greater than or equal to 100 μm and less than or equal to 0.5 mm, i.e., 100 μm ≤ A ≤ 0.5 mm.

[0129] If distance A is less than 100 μm, the bridging traces in circuit layer 1043 may be cut when cutting the side surfaces of bridge circuit structure 104, affecting signal transmission. If distance A is greater than 0.5 mm, the printed path of connecting trace 103 on substrate 1041 is too long, affecting the resistance of connecting trace 103.

[0130] In the embodiment of the present application, the distance B between the second end of the bridge trace and the third side surface 1041d of the substrate 1041 (the third side surface 1041d is the surface of the substrate 1041 farthest from the first side surface 101c) can range from 0 mm to 20 mm. The range of distance B being 0 mm to 20 mm can mean that: distance B is greater than or equal to 0 mm and less than or equal to 20 mm, that is, 0 mm ≤ B ≤ 20 mm. It will be understood that a distance B equal to 0 means that the second end of the bridge trace is located at the intersection of the fourth surface 1041b of the substrate 1041 and the third side surface 1041d.

[0131] Optionally, a distance C between the side of the second protective film proximal to the third side 1041d of the substrate 1041 and the third side 1041d of the substrate 1041 ranges from 3 mm to 10 mm. The distance C range of 3 mm to 10 mm may mean that distance C is greater than or equal to 3 mm and less than or equal to 10 mm, i.e., 3 mm ≤ C ≤ 10 mm. Providing the second protective film protrudes beyond the third side 1041d of the substrate 1041 facilitates subsequent removal of the second protective film.

[0132] Optionally, the length E of the substrate 1041 along the second direction Y can be related to the length of the product, and the length F of the substrate 1041 along the first direction X can be related to the width of the product. For example, the length E of the substrate 1041 along the second direction Y satisfies: 60 mm ≤ E ≤ 200 mm. The length F of the substrate 1041 along the first direction X satisfies: 15 mm ≤ F ≤ 60 mm.

[0133] In the embodiment of the present application, a bridge portion is provided between the first end and the second end of the bridge trace. The bridge portion may be a bridge circuit formed on the substrate 1041 , and its function is to transmit the driving signal received from the second end to the first end.

[0134] As an optional implementation, the material of the protective layer 1044 is an insulating material. The function of the protective layer 1044 is to isolate water and oxygen, thereby preventing water and oxygen from corroding the product. In this case, referring to Figures 18 and 19, the protective layer 1044 can be a whole layer structure, and the orthographic projection of the protective layer 1044 on the substrate 1041 covers the orthographic projection of the bridge portion on the substrate 1041, so that the protective layer 1044 can protect the bridge portion. In addition, since the first end of the bridge trace needs to be connected to the second end of the connecting trace 103 through the second connection pad 108, and the second end of the bridge trace needs to be connected to the external circuit structure, the first and second ends of the bridge trace cannot be covered by insulating material, otherwise signal conduction cannot be achieved. That is, the orthographic projection of the protective layer 1044 on the substrate 1041 exposes the orthographic projections of the first and second ends of the bridge trace on the substrate 1041.

[0135] Optionally, the insulating material may be SiNx (silicon nitride), SiOx (silicon oxide), or a mixed material of SiNx and SiOx.

[0136] As another optional implementation, the material of the protective layer 1044 is a conductive material, for example, the material of the protective layer 1044 is indium tin oxide (ITO). In this case, to prevent multiple bridge traces from short-circuiting through the conductive protective layer 1044, referring to Figures 20 and 21, the protective layer 1044 includes multiple protective patterns 10441 that are spaced apart and correspond to the multiple bridge traces. The orthographic projection of each protective pattern 10441 on the substrate 1041 covers the orthographic projection of a corresponding bridge trace 10431 on the substrate 1041. Furthermore, because the material of the protective layer 1044 is a conductive material, even if the protective layer 1044 covers the first and second ends of the bridge trace 10431, it will not affect signal conduction.

[0137] In addition, referring to FIG. 19 and FIG. 21 , it can be seen that the bridge circuit structure 104 may further include a buffer layer located between the substrate 1041 and the circuit layer 1043 .

[0138] 1 and 3 , the functional backplane 10 further includes an encapsulation layer 109. The encapsulation layer 109 is located on a side of the electronic components 102 away from the substrate 101 and can be used to encapsulate the electronic components 102 to prevent them from being corroded by water and oxygen.

[0139] In summary, an embodiment of the present application provides a functional backplane, which includes a substrate, a plurality of electronic components, a plurality of connecting traces and a bridge circuit structure. The bridge circuit structure includes a substrate, an adhesive layer located on the third surface of the substrate, and a circuit layer and a protective layer located on the fourth surface of the substrate. Each bridge trace in the circuit layer is connected to a corresponding connecting trace, and then the driving signal provided by the external circuit structure connected to the bridge trace is transmitted to the electronic component through the connecting trace. The solution of the embodiment of the present application can concentrate the width occupied by the ends of all bridge traces into a smaller size range, and there is no need to bind a large number of flexible circuit boards to connect with the external circuit structure, which has higher flexibility.

[0140] The terms used in the embodiments of this application are only used to explain the embodiments of this application and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should have the common meaning understood by people with ordinary skills in the field to which this application belongs.

[0141] The terms used in the embodiments of this application are intended solely to illustrate the embodiments of this application and are not intended to limit this application. Unless otherwise defined, technical or scientific terms used in the embodiments of this application should have the same ordinary meaning as those understood by persons of ordinary skill in the art to which this application belongs. The terms "first," "second," "third," and similar terms used in this patent specification and claims do not denote any order, quantity, or importance, but are simply used to distinguish between different components. Similarly, terms such as "a" or "an" do not denote a limitation of quantity, but rather denote the presence of at least one. Terms such as "include" or "comprising" and similar terms mean that the elements or objects listed before "include" or "comprising" include the elements or objects listed after "include" or "comprising," and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "connected" are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used solely to indicate relative positions. When the absolute position of the described objects changes, the relative positions may also change accordingly.

[0142] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A functional backplane, characterized in that, the functional backplane includes: a substrate, the substrate including opposite first and second surfaces; a plurality of electronic components located on the first surface of the substrate; a plurality of connecting traces, a first end of each connecting trace being located on the first surface of the substrate and connected to the electronic component, and a second end of each connecting trace being located on the second surface of the substrate; and a bridging circuit structure, the bridging circuit structure including a substrate, an adhesive layer, a circuit layer, and a protective layer; wherein, the substrate includes opposite third and fourth surfaces, the adhesive layer is located on the third surface of the substrate, and the adhesive layer is used to bond the substrate and the second surface of the substrate; the circuit layer is located on the fourth surface of the substrate, the circuit layer includes a plurality of bridging traces corresponding to the plurality of connecting traces, a first end of each bridging trace is connected to a second end of a corresponding connecting trace, and a second end of the bridging trace is used to be connected to an external circuit structure, and is used to transmit a driving signal provided by the external circuit structure to the electronic component through the connecting trace; the protective layer is located on a side of the circuit layer away from the substrate.

2. The functional backplane according to claim 1, characterized in that, the second surface of the substrate has at least one first alignment mark for structural alignment; the substrate has at least one first alignment opening corresponding to the at least one first alignment mark, a positive projection of the first alignment opening on the substrate exposes the first alignment mark, and a positive projection of the first alignment opening on the substrate does not overlap with a positive projection of the plurality of bridging traces on the substrate.

3. The functional backplane according to claim 2, characterized in that, a distance h1 between an edge of the first alignment mark and an edge of a positive projection of the first alignment opening on the substrate ranges from 20 micrometers to 1 millimeter; a center of the first alignment mark is located in a middle region of a positive projection of the first alignment opening on the substrate.

4. The functional backplane according to claim 3, characterized in that, a shape of a positive projection of the first alignment opening on the substrate is a square, an ellipse, a circle, or a regular polygon.

5. The functional backplane according to claim 1, characterized in that, the second surface of the substrate has at least one second alignment mark for structural alignment; the adhesive layer has at least one second alignment opening corresponding to the at least one second alignment mark, and a positive projection of the second alignment mark on the substrate is located within a positive projection of the second alignment opening on the substrate.

6. The functional backplane according to claim 1, characterized in that, the adhesive layer has a plurality of strip-shaped exhaust slots, the plurality of exhaust slots at least include a first slot extending in a first direction and a second slot extending in a second direction, the first direction is an extending direction of a portion of the connecting trace located on the second surface, and the second direction intersects with the first direction. The orthographic projections of the first slot and the second slot on the substrate are located on the side where the second end of the bridging trace is away from the first end of the bridging trace.

7. The functional backplane according to claim 6, wherein, the plurality of exhaust slots include a plurality of the first slots and one second slot, and the second direction is perpendicular to the first direction; a plurality of the first slots are farther from the bridging trace than the second slot, the plurality of the first slots are arranged at intervals in the second direction, and the first end of each first slot communicates with the second slot.

8. The functional backplane according to any one of claims 1 to 7, wherein, the range of the distance between the first side surface of the substrate and the second side surface of the substrate is 0.5 mm to 5 mm; wherein, the first side surface of the substrate is the side surface of the substrate that is closest to the connecting portion between the first end of the connecting trace and the second end of the connecting trace, and the second side surface of the substrate is the side surface of the substrate that is closest to the first side surface of the substrate.

9. The functional backplane according to claim 8, wherein, the included angle between the second side surface and the third surface of the substrate is an acute angle, and the orthographic projection of the fourth surface of the substrate on the third surface of the substrate is located within the third surface of the substrate.

10. The functional backplane according to claim 9, wherein, the range of the included angle between the second side surface and the third surface is 30 degrees to 75 degrees.

11. The functional backplane according to claim 8, wherein, the functional backplane further includes: a cushion structure located on the side of the second side surface of the substrate close to the first side surface of the substrate; the included angle between the surface of the cushion structure close to the first side surface of the substrate and the third surface of the substrate is smaller than the included angle between the second side surface of the substrate and the third surface of the substrate.

12. The functional backplane according to claim 8, wherein, the functional backplane further includes: a first connection pad and a second connection pad; the first connection pad is located on the first surface of the substrate and is used for connecting the first end of the connecting trace and the electronic component; the second connection pad is located on the fourth surface of the substrate and is used for connecting the second end of the connecting trace and the first end of the bridging trace; wherein, the range of the distance h3 between the second connection pad and the second side surface of the substrate is 100 microns to 0.5 mm.

13. The functional backplane according to any one of claims 1 to 7, wherein, there is a bridging portion between the first end and the second end of the bridging trace; the material of the protective layer is an insulating material, the protective layer is a whole layer structure, and the orthographic projection of the protective layer on the substrate covers the orthographic projection of the bridging portion on the substrate and exposes the orthographic projections of the first end and the second end of the bridging trace on the substrate; or, The material of the protective layer is a conductive material. The protective layer includes a plurality of protective patterns arranged at intervals and corresponding to the plurality of bridging traces. The orthographic projection of each protective pattern on the substrate covers the orthographic projection of a corresponding one of the bridging traces on the substrate board.

14. The functional backplane according to any one of claims 1 to 7, characterized in that the substrate includes a flexible film layer; or, the substrate includes a first flexible film layer, a buffer layer, and a second flexible film layer laminated in sequence.

15. A light-emitting device, characterized in that the light-emitting device includes: a power supply component and the functional backplane according to any one of claims 1 to 14; wherein, the power supply component is used to supply power to the functional backplane.

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