Photon detector and preparation method therefor

Abstract

A photon detector and a preparation method therefor. The preparation method for the photon detector comprises: acquiring an adapter board (110), and flip-chip attaching at least one chip (130) onto one side of the adapter board (110) and fixedly connecting a plurality of first connectors (120) thereto; by means of the plurality of first connectors (120), connecting and fixing said side of the adapter board (110) to a first side (141) of a detection circuit board (140), so as to realize a connection between the chip (130) and the detection circuit board (140); and fixedly connecting a photoelectric conversion member (180) to the side of the adapter board (110) that is away from the detection circuit board (140), so as to obtain the photon detector. According to said method, by means of the adapter board (110), a connection between the photoelectric conversion member (180), the chip (130) and the detection circuit board (140) can be realized to realize the detection function of the photon detector, so that the manufacturing threshold for the photon detector can be reduced, thereby reducing the cost of the photon detector.

Description

Photon detector and preparation method thereof

Technical field

[0001] The present application is applied to the technical field of photon detectors, and in particular to a photon detector and a method for preparing the same. [Background Technology]

[0002] A photon detector is a device used in medical CT (computed tomography) and is one of the most important components of a CT machine. It can directly receive X-rays and convert them into electric current pulses, which are then converted into CT images through a series of image processing technologies for doctors to use to analyze the condition.

[0003] The packaging of existing photon detectors often connects the chip and the photoelectric conversion element through TSV (through silicon via).

[0004] However, the use of TSV (Through Silicon Via) to connect chips and optoelectronic converters requires customization, which is costly.

[0005] [Summary of the invention]

[0006] The present application provides a photon detector and a method for preparing the same to solve the problem of high photon detector preparation costs.

[0007] To solve the above technical problems, the present application provides a method for preparing a photon detector, including: obtaining an adapter board, flip-chip attaching at least one chip on one side of the adapter board and fixing it with multiple first connectors; connecting and fixing one side of the adapter board to the first side of the detection circuit board through multiple first connectors to achieve connection between the chip and the detection circuit board; and fixing the photoelectric converter to the side of the adapter board away from the detection circuit board to obtain a photon detector.

[0008] Among them, the steps of flip-chip attaching at least one chip on one side of the adapter board and fixing multiple first connectors include: welding and fixing multiple first connectors on one side of the adapter board; welding the pins of the chip on one side of the adapter board and arranging them at intervals with each first connector.

[0009] The step of welding the pins of the chip to one side of the adapter board and arranging them at intervals from each first connector further includes: filling a first filling material between the chip and the adapter board until the gap between the chip and the adapter board is filled.

[0010] Among them, the step of connecting and fixing one side of the adapter board to the first side of the detection circuit board through multiple first connecting parts includes: welding the side of each first connecting part away from the adapter board to the first side of the detection circuit board; filling the second filling material between the adapter board and the detection circuit board until the gap between the adapter board and the detection circuit board is filled.

[0011] Among them, before the step of soldering the side of each first connecting member away from the adapter board to the first side of the detection circuit board, the step includes: obtaining the detection circuit board, mounting multiple electronic components and a first heat conduction member on the second side of the detection circuit board, wherein the second side is opposite to the first side.

[0012] Among them, before the step of fixing the photoelectric conversion element to the side of the adapter plate away from the detection circuit board to obtain the photon detector, the step includes: fitting a support heat dissipation base on the side of the first heat conduction element away from the detection circuit board to fix the support heat dissipation base on the second side of the detection circuit board.

[0013] The step of soldering the side of each first connector away from the adapter board to the first side of the detection circuit board includes: arranging a second heat conduction member on the first side of the detection circuit board, wherein the position of the second heat conduction member corresponds to the chip; soldering the side of each first connector away from the adapter board to the first side of the detection circuit board, and making the side of the chip away from the adapter board contact with the second heat conduction member.

[0014] Among them, the steps of fixing the photoelectric converter to the side of the adapter plate away from the detection circuit board to obtain a photon detector include: setting a plurality of second connecting members on the side of the adapter plate away from the detection circuit board; setting a plurality of bonding members corresponding to the side of the photoelectric converter based on the positions of the plurality of second connecting members; and bonding and fixing each bonding member to the corresponding second connecting member to fix the photoelectric converter to the side of the adapter plate away from the detection circuit board to obtain a photon detector.

[0015] To solve the above technical problems, the present application also provides a photon detector, which is prepared by any of the above-mentioned photon detector preparation methods, and at least includes: an adapter board, a detection circuit board and a photoelectric converter, one side of the adapter board is fixedly connected to at least one chip and a plurality of first connectors, one side of the detection circuit board is fixedly connected to one side of the adapter board through the first connector, and the photoelectric converter is fixedly connected to the side of the adapter board away from the detection circuit board.

[0016] Among them, multiple second connecting parts are set on the side of the adapter board away from the detection circuit board, and multiple bonding parts are correspondingly set on one side of the photoelectric converter. Each bonding part is bonded and fixed to the corresponding second connecting part to fix the photoelectric converter and the adapter board.

[0017] To address the aforementioned technical issues, the present invention's method for fabricating a photon detector securely connects the photoelectric converter to a side of an adapter plate away from the detection circuit board. This adapter plate allows for connections between the photoelectric converter, chip, and detection circuit board, thereby enabling the photon detector's detection function. The provision of the adapter plate eliminates the need for custom TSV (through-silicon-via) connection structures, lowering the manufacturing threshold and cost of photon detectors, which is beneficial to the long-term development of photon detectors and the definition of future packaging formats.

Brief Description of the Drawings

[0018] FIG1 is a schematic flow chart of an embodiment of a method for preparing a photon detector provided by the present application;

[0019] FIG2 is a schematic flow chart of another embodiment of a method for preparing a photon detector provided in the present application;

[0020] FIG3 is a schematic structural diagram of an embodiment of the upper half preparation process of FIG2;

[0021] FIG4 is a schematic structural diagram of an embodiment of the second half of the preparation process of FIG2;

[0022] FIG5 is a schematic structural diagram of an embodiment of a photon detector provided in the present application. [Specific implementation method]

[0023] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0025] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0026] Please refer to FIG1 , which is a schematic flow chart of an embodiment of a method for preparing a photon detector provided in the present application.

[0027] Step S11: obtaining an adapter board, flip-chip-attaching at least one chip on one side of the adapter board and fixing and connecting a plurality of first connectors.

[0028] The adapter board can include a single-layer or multi-layer printed circuit board. The number of layers and specific circuits can be set based on actual needs. The adapter board can be a PCB (Printed Circuit Board), an FPC (Flexible Printed Circuit), or other circuit board types, without limitation.

[0029] The chip includes an ASIC (application specific integrated circuit) chip or other photon detection chip, which is used to process the electrical signal converted after the photoelectric conversion board absorbs light.

[0030] The first connecting member is used to realize the electrical connection between the adapter board and the detection circuit board, and may include connecting structures such as copper core balls, tin balls, metal columns or metal protrusions. The materials of the metal columns and metal protrusions may include copper, aluminum, silver, nickel or alloys and other metals. The specific settings can be based on actual needs and are not limited here.

[0031] At least one chip is flip-chip attached to one side of the adapter board and fixedly connected to a plurality of first connectors. The number and position of the chips and the first connectors can be set based on actual needs and are not limited here.

[0032] Since the chip and the first connector are disposed on the same side of the adapter plate, they can be spaced apart to avoid mutual interference.

[0033] Step S12: Connect and fix one side of the adapter board to the first side of the detection circuit board through a plurality of first connectors to achieve connection between the chip and the detection circuit board.

[0034] The detection circuit board is connected to the chip and the photoelectric conversion element through the adapter board to realize the detection function of the photon detector.

[0035] The connection and fixation between the adapter plate and the detection circuit board is achieved by a first connector provided on one side of the adapter plate, thereby achieving the connection between the chip and the detection circuit board. After fixation, the chip is arranged between the adapter plate and the detection circuit board. In a specific application scenario, the height of the first connector can be greater than the height of the chip, so that when the first connector is connected to the adapter plate and the detection circuit board, the chip can be accommodated in the space supported by the first connector. At this time, the chip and the first connector are both clamped between the adapter plate and the detection circuit board, which can improve the device integration of the photon detector, reduce the volume of the entire photon detector, and thus achieve the miniaturization of the photon detector.

[0036] Step S13: The photoelectric conversion element is fixedly connected to a side of the adapter plate away from the detection circuit board to obtain a photon detector.

[0037] The photoelectric conversion plate can be a CZT (Cadmium Zinc Telluride) crystal. CdZnTe crystals can detect infrared, X-rays, gamma rays, other high-energy radiation, and nuclear radiation. At room temperature, CdZnTe crystals can convert X-ray and gamma ray photons into electrons, enabling the manufacture of room-temperature X-ray and gamma ray detectors. These detectors are used in medical imaging equipment, delivering higher-resolution images while significantly reducing radiation. CZT crystals can also be replaced with semiconductor materials such as cadmium telluride and single-crystalline silicon that can directly convert X-rays into electrical signals.

[0038] Through the above steps, the photon detector fabrication method of this embodiment securely connects the photoelectric converter to the side of the adapter plate away from the detection circuit board. This allows the adapter plate to connect the photoelectric converter, chip, and detection circuit board, thereby enabling the photon detector's detection function. The provision of the adapter plate eliminates the need for custom TSV (through-silicon via) connection structures, lowering the manufacturing threshold and cost of photon detectors, which is beneficial to the long-term development of photon detectors and the definition of future packaging formats.

[0039] Please refer to Figures 2-4. Figure 2 is a schematic diagram of another embodiment of the method for preparing a photon detector provided in this application. Figure 3 is a schematic diagram of the structure of an embodiment of the upper half of the preparation process of the embodiment of Figure 2. Figure 4 is a schematic diagram of the structure of an embodiment of the lower half of the preparation process of the embodiment of Figure 2.

[0040] Step S21: Obtain an adapter board, and weld and fix a plurality of first connectors on one side of the adapter board; weld the pins of the chip on one side of the adapter board, and space them apart from each first connector.

[0041] Referring to 3a in FIG3 , first obtain the adapter board 110, solder a plurality of first connectors 120 to one side of the adapter board 110, and solder the pins 131 of the chip 130 to one side of the adapter board 110. That is, the chip 130 and the first connectors 120 are soldered and fixed to the same side of the adapter board 110. The chip 130 and the first connectors 120 are spaced apart to avoid mutual interference.

[0042] In a specific application scenario, the first connecting members 120 may be evenly distributed on one side of the adapter plate 110 , so as to subsequently flatly support the adapter plate 100 and the detection circuit board.

[0043] The first connector 120 may include a copper core ball, a solder ball, a metal column, or a metal protrusion. This embodiment uses a copper core ball as an example for the first connector 120. If the first connector 120 uses other connection structures, the installation and connection are similar to this embodiment and will not be described in detail. This embodiment uses two chips 130 as an example for illustration. In actual applications, the number of chips 130 can be any other number, such as one, three, four, or five, and is not limited here.

[0044] Step S22: Filling a first filling material between the chip and the adapter plate until the gap between the chip and the adapter plate is completely filled.

[0045] Please further refer to 3b in Figure 3. A first filling material 133 is filled between the chip 130 and the adapter plate 110 until the gap between the chip 130 and the adapter plate 110 is filled and the pins 131 are covered. The first filling material 133 is used to improve the structural stability between the chip 130 and the adapter plate 110, reduce the occurrence of loose connections, and improve the reliability of the photon detector.

[0046] The first filling material 133 may include one or more insulating materials such as filling glue, epoxy resin, polyester resin (PET), polyimide, polyimide, polycarbonate (PC), bismaleimide triazine (BT), ceramic-based materials, etc.

[0047] At this time, the chip 130 , the first connector 120 and the adapter plate 110 can constitute a semi-finished product for standby use and can be directly used in subsequent processes.

[0048] Step S23: Obtain a detection circuit board, and mount a plurality of electronic components and a first heat conducting member on a second side of the detection circuit board.

[0049] In this step, the detection circuit board is first obtained. In other embodiments, the detection circuit board can be a rigid-flexible board, specifically including a main rigid part, at least one flexible part and at least one side rigid part. The flexible part is arranged perpendicularly to the main rigid part, so that the corresponding side rigid part is arranged perpendicularly on the side of the detection circuit board away from the adapter board, so as to arrange electronic components and adapter boards on opposite sides of the main rigid part of the detection circuit board. One flexible part can be connected to one side rigid part, that is, the number of flexible parts and side rigid parts can be the same, and the specific number can be set based on the installation requirements of the electronic components, which is not limited here.

[0050] In a specific application scenario, after obtaining the detection circuit board, multiple electronic components are mounted on the opposite sides of the lateral rigid part and / or on the side of the main rigid part close to the lateral rigid part. The electronic components can be positioned anywhere on the opposite sides of the lateral rigid part and / or on the side of the main rigid part close to the lateral rigid part, and are not specifically limited here. Among them, the side of the main rigid part away from the lateral rigid part needs to be connected to the adapter plate.

[0051] In order to increase the surface area of ​​the detection circuit board in this application scenario, the side rigid parts are added to meet the installation requirements of electronic components. At the same time, in order to reduce the horizontal area of ​​the detection circuit board, the flexible parts are set to achieve the vertical setting between the side rigid parts and the main rigid parts, thereby reducing the horizontal area of ​​the entire detection circuit board. The horizontal area of ​​the entire detection circuit board can be made less than or equal to the horizontal area of ​​the adapter board, thereby reducing the horizontal area of ​​the entire detection circuit board while ensuring the functional requirements of the detection circuit board, and then reducing the horizontal area of ​​the photon detector, thereby further realizing the miniaturization of the photon detector.

[0052] In this embodiment, the detection circuit board may be in the form of a sheet, and the electronic components and the adapter board are respectively disposed on two opposite sides of the detection circuit board.

[0053] Please refer to 3c in Figure 3 for a diagram of the detection circuit board 140. Multiple electronic components 144 and a first heat transfer member 143 are mounted on the second side 142 of the detection circuit board 140. The second side 142 is opposite the first side 141. The electronic components 144 assist the photon detector in performing its detection function, while the first heat transfer member 143 facilitates heat transfer to a subsequent supporting and heat dissipating base.

[0054] Electronic components 144 may include, but are not limited to, connectors, resistors, capacitors, inductors, transformers, light-emitting diodes, crystal diodes, transistors, semiconductors, optocouplers, integrated circuits, chips, or relays. First heat conducting member 143 may be made of a highly thermally conductive material, including, but not limited to, metal, ceramic, polymer, or graphite. Examples of polymer materials include, but are not limited to, polystyrene or polyurethane.

[0055] The position of the first heat conducting member 143 corresponds to the position of the subsequent support heat sink. The electronic component 144 can be arranged at the edge of the second side 142 of the detection circuit board 140 to avoid the position of the subsequent support heat sink to prevent stress collision.

[0056] Step S24: soldering the side of each first connector away from the adapter board to the first side of the detection circuit board.

[0057] Referring further to 3d in FIG. 3 , a second heat conducting member 150 can be disposed on the first side 141 of the detection circuit board 140 . The second heat conducting member 150 is positioned corresponding to the chip 130 . The second heat conducting member 150 is also made of a highly thermally conductive material, including but not limited to metal, ceramic, polymer, or graphite. Examples of polymer materials include but are not limited to polystyrene or polyurethane.

[0058] The side of each first connector 120 away from the adapter board 110 is welded to the first side 141 of the detection circuit board 140, and the side of the chip 130 away from the adapter board 110 is in contact with the second heat conduction member 150, so that the heat generated by the operation of the chip 130 can be conducted to the detection circuit board 140 through the second heat conduction member 150, and then dissipated through the detection circuit board 140, thereby improving the heat dissipation efficiency of the chip 130.

[0059] Specifically, solder paste can be printed on the first side 141 of the detection circuit board 140 at a position corresponding to the first connector 120, and then the first connector 120 of the previous semi-finished product can be soldered to the corresponding solder paste, so that the semi-finished product including the chip 130, the first connector 120 and the adapter board 110 is fixedly connected to the detection circuit board 140.

[0060] The height of the first connector 120 can be greater than the height of the chip 130, so that when the first connector 120 is connected to the adapter board 110 and the detection circuit board 140, the chip 130 can be accommodated in the space provided by the first connector 120. In this case, the chip 130 and the first connector 120 are both sandwiched between the adapter board 110 and the detection circuit board 140, which can improve the device integration of the photon detector, reduce the volume of the entire photon detector, and thus achieve miniaturization of the photon detector.

[0061] At this time, the adapter board 110 , the chip 130 and the detection circuit board 140 are stacked in sequence, and the detection circuit board 140 can be connected to the chip 130 through the adapter board 110 .

[0062] Step S25: filling a second filling material between the adapter plate and the detection circuit board until the gap between the adapter plate and the detection circuit board is completely filled.

[0063] Please further refer to FIG. 4 a , the second filling material 160 is filled between the adapter plate 110 and the detection circuit board 140 until the gap between the adapter plate 110 and the first side 141 of the detection circuit board 140 is completely filled and the first connector 120 is covered.

[0064] The second filling material 160 may include one or more insulating materials such as filling glue, epoxy resin, polyester resin (PET), polyimide, polyimide, polycarbonate (PC), bismaleimide triazine (BT), and ceramic-based materials.

[0065] Filling the gap between the adapter plate 110 and the detection circuit board 140 with the second filler material 160 enhances the structural rigidity between the adapter plate 110 and the detection circuit board 140, thereby increasing the bending strength between the adapter plate 110 and the detection circuit board 140 and improving the structural stability of the photon detector. Furthermore, the gap between the adapter plate 110 and the detection circuit board 140 filled with the second filler material 160 is smoother, ensuring smoothness during subsequent installation of the photoelectric converter, facilitating installation of the converter.

[0066] Step S26: a supporting heat dissipation base is disposed on a side of the first heat conducting member away from the detection circuit board, so as to fix the supporting heat dissipation base on the second side of the detection circuit board.

[0067] Referring further to 4 b in FIG. 4 , a support heat sink base 170 is mounted on the second side 142 of the detection circuit board 140 to support the subsequent installation of the photoelectric converter. The support heat sink base 170 may include, but is not limited to, a rigid plate such as a metal plate or a glass plate to provide support and heat dissipation for the subsequent installation of the photoelectric converter.

[0068] Specifically, a heat dissipation support base 170 is disposed on the side of the first heat conducting member 143 away from the detection circuit board 140 to fix the heat dissipation support base 170 on the second side 142 of the detection circuit board 140. The heat dissipation support base 170 is spaced apart from the electronic component 144.

[0069] One side of the detection circuit board 140 is connected to the support heat dissipation base 170 through the first heat conduction member 143 , thereby accelerating heat dissipation through the first heat conduction member 143 and the support heat dissipation base 170 and improving the heat dissipation efficiency of the detection circuit board 140 .

[0070] Step S27: arranging a plurality of second connecting members on a side of the adapter plate away from the detection circuit board; and arranging a plurality of bonding members correspondingly on one side of the photoelectric conversion element based on the positions of the plurality of second connecting members.

[0071] Please further refer to 4 c in FIG. 4 , a plurality of second connectors 111 are provided on a side of the adapter plate 110 away from the detection circuit board 140 ; ​​a plurality of bonding members 181 are correspondingly provided on one side of the photoelectric conversion element 180 based on the positions of the plurality of second connectors 111 .

[0072] The second connector 111 may be a metal bump, a metal pad, a metal pillar, or other connection structures. The bonding member 181 may be, but is not limited to, copper paste, silver paste, indium pillars, solder paste, or anisotropic conductive tape. By bonding multiple second connectors 111 to multiple bonding members 181 at low temperatures, the connection between the photoelectric converter 180 and the adapter board 110 can be achieved.

[0073] Photoelectric converter 180 may be a CZT (Cadmium Zinc Telluride) crystal. CdZnTe crystals can detect infrared, X-rays, gamma rays, other high-energy radiation, and nuclear radiation. At room temperature, CdZnTe crystals can convert X-ray and gamma ray photons into electrons, enabling the manufacture of room-temperature X-ray and gamma ray detectors. These detectors are used in medical imaging equipment, delivering higher-resolution images while significantly reducing radiation. CZT crystals can also be replaced with semiconductor materials such as cadmium telluride and single-crystalline silicon that can directly convert X-rays into electrical signals.

[0074] The number of the photoelectric converter 180 can be one or more, which is set based on actual needs and is not limited here. The horizontal area of ​​the photoelectric converter 180 does not exceed the adapter plate 110 to ensure the horizontal area of ​​the photon detector.

[0075] Step S28: bonding and fixing each bonding member to the corresponding second connecting member to fix the photoelectric conversion member to the side of the adapter plate away from the detection circuit board to obtain a photon detector.

[0076] Each bonding member 181 is bonded and fixed to the corresponding second connecting member 111 to fix the photoelectric conversion element 180 to the side of the adapter plate 110 away from the detection circuit board 140 to obtain a photon detector.

[0077] During the bonding and fixing process, the heat dissipation base 170 supports the detection circuit board 140 and the adapter board 110, thereby improving the stability and flatness of the detection circuit board 140 and the adapter board 110, facilitating the bonding and fixing of the bonding member 181 and the corresponding second connecting member 111, and ensuring a stable and reliable connection.

[0078] At this time, the photoelectric conversion element 180 can be connected to the chip 130 through the bonding element 181, the second connecting element 111 and the adapter board 110 in sequence, and can be connected to the detection circuit board 140 through the bonding element 181, the second connecting element 111, the adapter board 110 and the first connecting element 120 in sequence.

[0079] Through the above structure, the photon detector of this embodiment realizes the connection between the photoelectric converter, the chip and the detection circuit board through the adapter plate, thereby realizing the detection function of the photon detector. Among them, the setting of the adapter plate can make the photon detector do not need to specially customize the TSV (through silicon via) connection structure, which lowers the manufacturing threshold of the photon detector, reduces the cost of the photon detector, and is conducive to the long-term development of the photon detector and the definition of the future packaging form. In addition, this embodiment uses a first filling material to fill the gap between the chip and the adapter plate, improves the structural stability between the chip and the adapter plate, reduces the occurrence of loose connections, and improves the reliability of the photon detector. By filling the gap between the adapter plate and the detection circuit board with a second filling material, the structural rigidity between the adapter plate and the detection circuit board can be enhanced, thereby improving the bending strength between the adapter plate and the detection circuit board, thereby improving the structural stability of the photon detector. The flatness between the adapter plate filled with the second filling material and the detection circuit board can also be improved, thereby ensuring the flatness during the subsequent installation of the photoelectric converter, facilitating the installation of the photoelectric converter. By placing the side of the chip away from the adapter plate in contact with a second heat-conducting member, heat generated by the chip's operation can be transferred through the second heat-conducting member to the detection circuit board, where it is then dissipated, thereby improving the chip's heat dissipation efficiency. Furthermore, one side of the detection circuit board is connected to a supporting heat sink via a first heat-conducting member, further accelerating heat dissipation through the first heat-conducting member and the supporting heat sink, further improving the chip's heat dissipation efficiency.

[0080] Please refer to FIG5 , which is a schematic structural diagram of an embodiment of a photon detector provided in the present application.

[0081] The photon detector 200 of this embodiment includes an adapter board 210 , a detection circuit board 240 , and a photoelectric conversion element 280 .

[0082] At least one chip 230 and a plurality of first connectors 220 are fixedly connected to one side of the adapter board 210. One side of the detection circuit board 240 is fixedly connected to one side of the adapter board 210 via the first connector 220. The photoelectric converter 280 is fixedly connected to the side of the adapter board 210 away from the detection circuit board 240.

[0083] The photon detector 200 is manufactured by the method for manufacturing a photon detector according to any of the above embodiments.

[0084] Through the above-described structure, this embodiment achieves the detection function of the photon detector by connecting the photoelectric converter, chip, and detection circuit board via an adapter plate. The provision of the adapter plate eliminates the need for custom TSV (through-silicon via) connection structures for the photon detector, lowering the manufacturing threshold and cost of the photon detector, which is beneficial to the long-term development of photon detectors and the definition of future packaging formats.

[0085] In other embodiments, a plurality of second connecting members 211 are provided on a side of the adapter plate 210 away from the detection circuit board 240, and a plurality of bonding members 281 are correspondingly provided on one side of the photoelectric conversion member 280. Each bonding member 281 is bonded and fixed to the corresponding second connecting member 211 to fixedly connect the photoelectric conversion member 280 and the adapter plate 210.

[0086] The second connector 211 may be a metal bump, a metal pad, a metal pillar, or other connection structures. The bonding member 281 may be, but is not limited to, copper paste, silver paste, indium pillars, solder paste, or anisotropic conductive tape. By bonding multiple second connectors 211 to multiple bonding members 281 at low temperatures, the photoelectric converter 280 and the adapter board 210 can be connected.

[0087] Photoelectric converter 280 may be a CZT (Cadmium Zinc Telluride) crystal. CdZnTe crystals can detect infrared, X-rays, gamma rays, other high-energy radiation, and nuclear radiation. At room temperature, CdZnTe crystals can convert X-ray and gamma ray photons into electrons, enabling the manufacture of room-temperature X-ray and gamma ray detectors. These detectors are used in medical imaging equipment, delivering higher-resolution images while significantly reducing radiation. CZT crystals can also be replaced with semiconductor materials such as cadmium telluride and single-crystalline silicon that can directly convert X-rays into electrical signals.

[0088] In other embodiments, a plurality of electronic components 244 and a first heat conducting member 243 are mounted on the side of the detection circuit board 240 away from the adapter board 210. The electronic components 244 are used to assist the photon detector in realizing the detection function, and the first heat conducting member 243 is used to conduct heat with the subsequent supporting heat dissipation base.

[0089] Electronic components 244 may include, but are not limited to, connectors, resistors, capacitors, inductors, transformers, light-emitting diodes, crystal diodes, transistors, semiconductors, optocouplers, integrated circuits, chips, or relays. First heat conducting member 243 may be made of a highly thermally conductive material, including, but not limited to, metal, ceramic, polymer, or graphite. Examples of polymer materials include, but are not limited to, polystyrene or polyurethane.

[0090] The position of the first heat conducting member 243 corresponds to the position of the support heat dissipation base 270. The electronic component 244 can be arranged at the edge of the detection circuit board 240 to avoid the position of the support heat dissipation base 270 to prevent stress collision.

[0091] One side of the detection circuit board 240 is connected to the support heat dissipation base 270 through the first heat conduction member 243 , thereby accelerating heat dissipation through the first heat conduction member 243 and the support heat dissipation base 270 and further improving the heat dissipation efficiency of the detection circuit board 240 .

[0092] In other embodiments, a support heat sink base 270 is mounted on a side of the detection circuit board 240 away from the adapter board 210 to support the installation of the photoelectric converter 280. The support heat sink base 270 may include, but is not limited to, a rigid plate such as a metal plate or a glass plate to provide support for the subsequent installation of the photoelectric converter 280.

[0093] In other embodiments, a second heat conducting member 250 is disposed on a side of the detection circuit board 240 away from the supporting heat dissipation base 270; the second heat conducting member 250 is positioned corresponding to the chip 230. The second heat conducting member 250 is made of a highly thermally conductive material, including but not limited to metal, ceramic, polymer, or graphite. Examples of polymer materials include but are not limited to polystyrene or polyurethane.

[0094] The side of the chip 230 away from the adapter board 210 is in contact with the second heat conduction member 250, so that the heat generated by the operation of the chip 230 can be conducted to the detection circuit board 240 through the second heat conduction member 250, and then dissipated through the detection circuit board 240 and the supporting heat dissipation base 270, thereby improving the heat dissipation efficiency of the chip 230.

[0095] In other embodiments, the first filling material 233 is filled between the pins 231 of the chip 230 and the adapter board 210 to improve the structural stability between the chip 230 and the adapter board 210 through the first filling material 233, reduce the occurrence of loose connections, and improve the reliability of the photon detector.

[0096] In other embodiments, the space between the adapter plate 210 and the detection circuit board 240 is completely filled with a second filler material 260. By filling the gap between the adapter plate 210 and the detection circuit board 240 with the second filler material 260, the structural rigidity between the adapter plate 210 and the detection circuit board 240 can be enhanced, thereby increasing the bending strength between the adapter plate 210 and the detection circuit board 240, thereby improving the structural stability of the photon detector 200. Furthermore, the flatness between the adapter plate 210 and the detection circuit board 240 filled with the second filler material 260 can be improved, thereby ensuring flatness during the subsequent installation of the photoelectric converter 280 and facilitating the installation of the photoelectric converter 280.

[0097] Through the above structure, the photon detector of this embodiment realizes the connection between the photoelectric converter, the chip and the detection circuit board through the adapter plate, thereby realizing the detection function of the photon detector. Among them, the setting of the adapter plate can make the photon detector do not need to specially customize the TSV (through silicon via) connection structure, which lowers the manufacturing threshold of the photon detector, reduces the cost of the photon detector, and is conducive to the long-term development of the photon detector and the definition of the future packaging form. In addition, this embodiment uses a first filling material to fill the gap between the chip and the adapter plate, improves the structural stability between the chip and the adapter plate, reduces the occurrence of loose connections, and improves the reliability of the photon detector. By filling the gap between the adapter plate and the detection circuit board with a second filling material, the structural rigidity between the adapter plate and the detection circuit board can be enhanced, thereby improving the bending strength between the adapter plate and the detection circuit board, thereby improving the structural stability of the photon detector. The flatness between the adapter plate filled with the second filling material and the detection circuit board can also be improved, thereby ensuring the flatness during the subsequent installation of the photoelectric converter, facilitating the installation of the photoelectric converter. By placing the side of the chip away from the adapter plate in contact with a second heat-conducting member, heat generated by the chip's operation can be transferred through the second heat-conducting member to the detection circuit board, where it is then dissipated, thereby improving the chip's heat dissipation efficiency. Furthermore, one side of the detection circuit board is connected to a supporting heat sink via a first heat-conducting member, further accelerating heat dissipation through the first heat-conducting member and the supporting heat sink, further improving the chip's heat dissipation efficiency.

[0098] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for preparing a photon detector, characterized in that: The preparation method of the photon detector comprises: Obtain an adapter board, flip-chip-attach at least one chip on one side of the adapter board and fix and connect a plurality of first connectors; Connecting and fixing one side of the adapter board to the first side of the detection circuit board through a plurality of first connectors to achieve connection between the chip and the detection circuit board; The photoelectric conversion element is fixedly connected to a side of the adapter plate away from the detection circuit board to obtain the photon detector.

2. The method for preparing a photon detector according to claim 1, characterized in that: The step of flip-chipping at least one chip on one side of the adapter board and fixing and connecting a plurality of first connectors comprises: Welding and fixing a plurality of first connecting members on one side of the adapter plate; The pins of the chip are welded on one side of the adapter board and are spaced apart from each of the first connectors.

3. The method for preparing a photon detector according to claim 2, characterized in that: The step of welding the pins of the chip on one side of the adapter board and arranging them at intervals from each of the first connectors also includes: A first filling material is filled between the chip and the adapter board until the gap between the chip and the adapter board is fully filled.

4. The method for preparing a photon detector according to claim 3, characterized in that: The first filling material includes one or more insulating materials such as filling glue, epoxy resin, polyester resin, polyimide, polyimide, polycarbonate, bismaleimide triazine, ceramic base, etc.

5. The method for preparing a photon detector according to claim 1, characterized in that: The step of connecting and fixing one side of the adapter board to the first side of the detection circuit board through a plurality of first connecting members comprises: Welding a side of each of the first connecting members away from the adapter board to a first side of the detection circuit board; Fill the second filling material between the adapter plate and the detection circuit board until the second filling material is filled. A gap between the adapter plate and the detection circuit board.

6. The method for preparing a photon detector according to claim 5, characterized in that: Before the step of welding the side of each first connecting member away from the adapter board to the first side of the detection circuit board, the step includes: A detection circuit board is obtained, and a plurality of electronic components and a first heat conduction member are mounted on a second side of the detection circuit board, wherein the second side is an opposite side to the first side.

7. The method for preparing a photon detector according to claim 6, characterized in that: The electronic components include connectors, resistors, capacitors, inductors, transformers, light emitting diodes, crystal diodes, transistors, semiconductors, photocouplers, integrated circuits, chips or relays.

8. The method for preparing a photon detector according to claim 6, characterized in that: The detection circuit board is a rigid-flex board, comprising a main rigid portion, at least one flexible portion and at least one lateral rigid portion; The flexible portion is vertically arranged to the main rigid portion, one flexible portion is correspondingly connected to one side rigid portion, and the number of the flexible portions and the number of the side rigid portions are the same.

9. The method for preparing a photon detector according to claim 6, characterized in that: Before the step of fixing the photoelectric converter to a side of the adapter plate away from the detection circuit board to obtain the photon detector, the method includes: A support heat dissipation base is disposed on the side of the first heat conduction member away from the detection circuit board, so that the support heat dissipation base is fixedly disposed on the second side of the detection circuit board.

10. The method for preparing a photon detector according to claim 6, characterized in that: The step of welding the side of each first connecting member away from the adapter board to the first side of the detection circuit board comprises: A second heat conducting member is disposed on the first side of the detection circuit board, wherein the position of the second heat conducting member corresponds to the chip; The side of each first connecting member away from the adapter board is welded to the first side of the detection circuit board, and the side of the chip away from the adapter board is in contact with the second heat conducting member.

11. The method for preparing a photon detector according to claim 10, characterized in that: The first heat conducting member and the second heat conducting member both include metal material, ceramic material, polymer material or graphite material.

12. The method for preparing a photon detector according to claim 1, characterized in that: The step of fixing the photoelectric converter to a side of the adapter plate away from the detection circuit board to obtain the photon detector comprises: A plurality of second connecting members are arranged on a side of the adapter plate away from the detection circuit board; Disposing a plurality of bonding members correspondingly on one side of the photoelectric conversion member based on the positions of the plurality of second connecting members; Each of the bonding components is bonded and fixed to the corresponding second connecting component, so as to fix the photoelectric conversion component to a side of the adapter board away from the detection circuit board, thereby obtaining the photon detector.

13. A photon detector, characterized in that: The photon detector is prepared by the method for preparing a photon detector according to any one of claims 1 to 12, and at least comprises: An adapter board, one side of which is fixedly connected with at least one chip and a plurality of first connectors; A detection circuit board, one side of which is fixedly connected to one side of the adapter board via the first connecting member; A photoelectric conversion element is fixedly connected to a side of the adapter plate away from the detection circuit board.

14. The photon detector according to claim 13, characterized in that: A plurality of second connectors are arranged on one side of the adapter plate away from the detection circuit board, and a plurality of bonding components are correspondingly arranged on one side of the photoelectric converter. Each bonding component is bonded and fixed to the corresponding second connector to fix the photoelectric converter and the adapter plate.

15. The photon detector according to claim 14, characterized in that The bonding element includes copper paste, silver paste, indium column, solder paste or anisotropic conductive tape.

16. The photon detector according to claim 13, characterized in that A plurality of electronic components and a first heat conducting member are mounted on a side of the detection circuit board away from the adapter board, and one side of the detection circuit board is connected to a supporting heat dissipation base through the first heat conducting member.

17. The photon detector according to claim 13, characterized in that The height of the first connecting member is greater than the height of the chip, so that the chip can be accommodated in the space supported by the first connecting member.

18. The photon detector according to claim 13, characterized in that: The photoelectric conversion element includes cadmium zinc telluride, cadmium telluride or single crystal silicon.

19. The photon detector according to claim 13, characterized in that: The first connecting member includes a copper core ball, a solder ball, a metal column or a metal protrusion.

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