Heat dissipation wired charging module for vehicle

Abstract

A heat dissipation wired charging module for a vehicle is provided. The heat dissipation wired charging module for a vehicle, according to one embodiment of the present invention, comprises: a circuit board on which mounted is a receptacle connected to a connection terminal of a power supply line connected to an external electronic device; a housing that accommodates the circuit board therein and has at least a portion made of a heat dissipation plastic; and a heat dissipation material disposed so as to occupy the remaining empty space of an accommodation portion excluding an area where the circuit board is disposed. Accordingly, even when designed with a high output of 100 W or more, high heat generated during operation can be efficiently dissipated to the outside of the module, thereby preventing a decline in wired charging efficiency caused by heat buildup within the module and blocking the transfer of the generated heat to electronic devices via wires connected to the module, which could otherwise degrade the performance of the electronic devices. In addition, concerns about electrical shorts in the circuitry within the module that may be caused by the addition of heat dissipation performance can be addressed, thereby enhancing long-term durability and safety.

Description

Heat dissipation wired charging module for vehicles

[0001] The present invention relates to a heat dissipation wired charging module for a vehicle, and more particularly, to a heat dissipation wired charging module for a vehicle that is installed inside a vehicle and provides an input terminal capable of charging an electronic device via wire.

[0002] In the past, cigarette lighter sockets installed inside vehicles were widely used to supply power to various electronic devices for vehicles, including navigation systems, black boxes, and Hi-pass terminals that were additionally installed inside the vehicle for the convenience and safety of the user.

[0003] However, recently, in addition to these in-vehicle electronic devices, the demand for in-vehicle charging of various portable electronic devices such as smartphones, tablets, and laptops has increased, and to meet the demand for fast charging speeds, wired charging modules are being installed in the form of power outlets separate from the cigarette lighter socket in the center fascia, console box, trunk, etc. to ensure a stable supply of power to various electronic devices.

[0004] Meanwhile, to achieve the demand for fast charging speed, it is usually necessary to install a wired charging module with an output of 27W. However, due to the recent increase in camping, there is a trend to use the power of various equipment used during camping as a vehicle power source, so the wired charging module is being developed to support an output of 100W or even 240W, which is higher.

[0005] However, the increase in output of the wired charging module has the problem of heat generation, and especially considering that the installation location is the interior of the car such as the center fascia or console box, there is a concern that the charging efficiency of electronic devices may be significantly reduced compared to the design output of the wired charging module due to poor heat dissipation, and if heat accumulation becomes severe, a fire may occur, which may pose a risk to vehicle safety.

[0006] The present invention has been devised in consideration of the above points, and its purpose is to provide a vehicle heat dissipation wired charging module that can dissipate high heat generated during operation to the outside of the module with excellent efficiency even when designed for high output.

[0007] In addition, another purpose of the present invention is to provide a vehicle heat dissipation wired charging module that can ensure long-term durability and safety by eliminating concerns about electrical short circuits in the module that may occur due to additional heat dissipation performance.

[0008] In order to solve the above-described problem, the present invention provides a vehicle heat dissipation wired charging module mounted inside a vehicle to supply power to an external electronic device, the vehicle heat dissipation wired charging module including a circuit part having a receptacle mounted thereon, a receiving part that receives the circuit part therein, an open hole formed on one surface so that the receptacle is exposed to the outside, and a housing at least partially made of heat dissipation plastic, and a heat dissipation material disposed so as to be in contact with at least the circuit part within a remaining empty space of the receiving part excluding an area where the circuit part is disposed.

[0009] According to one embodiment of the present invention, the housing may be formed of a first case having an open hole formed so that a receptacle is exposed to the outside, and a second case at least part of which is made of heat-dissipating plastic and is assembled with the first case.

[0010] Additionally, the outer surface of the second case may be provided with an outer surface structure having a plurality of heat dissipation fins formed thereon that protrude to a predetermined height.

[0011] Additionally, the inner surface of the second case may have an inner surface structure in which at least one of a pin and a plate protruding toward the circuit portion is formed.

[0012] Additionally, the heat-radiating plastic includes a filler dispersed within a matrix including a thermoplastic resin, and the filler may contain a first heat-radiating filler and a reinforcing filler.

[0013] Additionally, the heat-dissipating plastic may have a thickness of 0.5 to 10 mm.

[0014] Additionally, it may include 20 to 70 wt% of the first heat-radiating filler and 5 to 20 wt% of the reinforcing filler based on the weight of the heat-radiating plastic.

[0015] In addition, the first heat-radiating filler may have an average particle diameter of 1 to 350 ㎛, and the reinforcing filler may be glass fiber having an average length of 4 to 8 mm and an average diameter of 8 to 15 ㎛ or cellulose fiber having an average length of 6 to 10 mm and an average diameter of 6 to 12 ㎛.

[0016] In addition, the thermoplastic resin may contain at least one selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyamide 6 (PA 6), polyamide 66 (PA 66), polyphthalamide (PPA), polypropylene, polyethylene, polyimide (PI), liquid crystal polymer (LCP), polyphenylene sulfide (PPS), acrylonitrile butadiene styrene (ABS), polyacetal (POM), polyvinyl chloride (PVC), polystyrene (PS), polymethyl methacrylate (PMMA), and modified polyphenylene oxide (mPPO).

[0017] Additionally, the heat-radiating material may include a matrix component and 80 wt% or more of a second heat-radiating filler.

[0018] In addition, the second heat-dissipating filler has a resistance of 1×10 14 It can be more than Ω.

[0019] Additionally, the matrix component may include a first silicone resin that is an organopolysiloxane and a second silicone resin that is an organohydrogenpolysiloxane.

[0020] Additionally, the second heat-radiating filler may have an average particle diameter of 1 to 100 μm.

[0021] In addition, the second heat-radiating filler may be surface-modified with at least one functional group selected from the group consisting of an alkoxy group, an epoxy group, an amino group, a vinyl group, a methacrylic group, and an isocyanate group.

[0022] In addition, the second heat-dissipating filler may include at least one of a filler selected from the group consisting of aluminum nitride, boron nitride, silicon nitride, and silicon carbide; and a filler having a core-shell structure including a core portion and an insulating film covering the core portion.

[0023] Additionally, the core portion may be a carbon-based filler, and the insulating film may be silicon oxide.

[0024] In addition, the heat-dissipating plastic may have a thermal conductivity of 1 to 30 W / m·K, and the heat-dissipating material may have a thermal conductivity of 0.5 to 10 W / m·K.

[0025]

[0026] In addition, the present invention provides a vehicle equipped with a heat dissipation wired charging module according to the present invention.

[0027] The vehicle heat dissipation wired charging module according to the present invention can efficiently dissipate high heat generated during operation to the outside of the module even when designed for a high output of 100 W or more, thereby preventing a decrease in wired charging efficiency due to heat accumulation within the module and preventing the generated heat from being transmitted to electronic devices via wires connected to the module and lowering the performance of the electronic devices. In addition, since the additional heat dissipation performance eliminates concerns about electrical shorts in the circuits within the module that may occur, long-term durability and safety can be ensured, and thus the present invention can be widely applied as a vehicle wired charging module.

[0028] Figure 1 is a perspective view of a vehicle heat dissipation wired charging module according to one embodiment of the present invention.

[0029] Figure 2 is a cross-sectional schematic diagram along the X-X' boundary line of Figure 1.

[0030] Figure 3 is a cross-sectional schematic diagram according to another embodiment of the present invention, and

[0031] Fig. 4 is an exploded perspective view of the vehicle heat dissipation wired charging module of Fig. 1.

[0032] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description have been omitted for clarity of description, and the same reference numerals are assigned to identical or similar components throughout the specification.

[0033]

[0034] Referring to FIGS. 1 to 4, a heat-radiating wired charging module (100) according to one embodiment of the present invention is mounted inside a vehicle to supply power to an external electronic device, and includes a circuit unit (20) having a receptacle (23) mounted thereon, which is connected to a connection terminal of a power supply line connected to the external electronic device, a housing (50) that houses the circuit unit (20) inside, and has an open hole (11) formed on one surface so that the receptacle (23) is exposed to the outside, at least a portion of which is made of heat-radiating plastic, and a heat-radiating material (40) that is arranged to be in contact with at least the circuit unit (20) among the remaining empty space of the housing except for the area where the circuit unit (20) is arranged.

[0035]

[0036] First, a vehicle equipped with a heat dissipation wired charging module (100) according to one embodiment of the present invention is a general term for all known vehicles running on roads or tracks, and may be, for example, automobiles such as passenger cars, trucks, and buses, two-wheeled vehicles such as motorcycles and electric bicycles, subways, or trains, but is not limited thereto.

[0037]

[0038] In addition, external electronic devices to be supplied with power from the heat dissipation wired charging module (100) refer to electronic devices brought into the vehicle from outside by the driver and / or vehicle passengers, excluding electronic devices attached to the vehicle when the vehicle is shipped, and may include, for example, electronic devices for vehicles such as black boxes, Hi-pass terminals, navigation systems, vehicle vacuum cleaners, and vehicle air purifiers, and various portable electronic devices such as smartphones, tablets, and laptops.

[0039]

[0040] In addition, the heat dissipation wired charging module (100) may be mounted inside a vehicle so that the receptacle (23) connected to the connection terminal of the power supply line connected to the external electronic device is exposed to the outside. For example, only a part of the surface of the housing (50) where the receptacle (23) is exposed may be exposed to the outside, and the remaining surface of the housing (50) may be buried so as not to be visible from the outside, but is not limited thereto. In addition, the interior of the vehicle where the heat dissipation wired charging module (100) is mounted may be a center fascia, a console box, a trunk, etc., but is not limited thereto.

[0041]

[0042] The above heat dissipation wired charging module (100) includes a circuit unit (20) equipped with a receptacle (23) connected to a connection terminal of a power supply line connected to an external electronic device.

[0043] The circuit unit (20) above has a receptacle (23) mounted thereon that is connected to a connection terminal of a power supply line connected to an external electronic device, and the receptacle (23) may be a known type corresponding to a connection terminal that supplies power to an electronic device, and may be, for example, a receptacle corresponding to a USB A type, a USB C type, or Apple's Lightning connection terminal.

[0044]

[0045] In addition, the circuit portion (20) may include a circuit board (21), and the circuit board may be a known printed circuit board, and the present invention is not particularly limited thereto.

[0046] In addition, the circuit unit (20) may include a plurality of elements (22) that operate and control the wired charging module, and the elements (22) may be elements included in a known wired charging module, and the present invention is not particularly limited thereto. At this time, at least some of the elements (22) may be heat sources that generate heat when the wired charging module is operated.

[0047]

[0048] Next, the housing (50) that accommodates the circuit section (20) described above will be described.

[0049] The above housing (50) includes a receiving portion that receives the circuit portion (20) therein. In addition, an open hole (11) is formed on one surface of the housing (50) so that the receptacle (23) mounted on the above-described circuit portion (20) is exposed to the outside.

[0050] In addition, the housing (50) may have the shape of a known wired charging module for a vehicle, and the present invention is not particularly limited thereto.

[0051] For example, the housing (50) may be composed of a first case (10) in which an open hole (11) is formed so that a receptacle (23) is exposed to the outside, and a second case (30) assembled with the first case (10), and the first case (10) and the second case (30) may have a shape that allows them to be assembled to form a receiving portion inside. In addition, the first case (10) in which the open hole (11) is formed may be exposed to the outside when mounted on a vehicle, and the second case (30) may be embedded inside the vehicle so as not to be visible from the outside.

[0052]

[0053] The first case (10) and the second case (30) may be known materials used in vehicle wired charging modules, and may be, for example, plastics, and as non-limiting examples thereof, may include a thermoplastic resin including at least one selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyamide 6 (PA 6), polyamide 66 (PA 66), polypropylene, polyethylene, polyimide (PI), liquid crystal polymer (LCP), polyphenylene sulfide (PPS), acrylonitrile butadiene styrene (ABS), polyphthalamide (PPA), polyacetal (POM), polyvinyl chloride (PVC), polystyrene (PS), polymethyl methacrylate (PMMA), and modified polyphenylene oxide (mPPO).

[0054]

[0055] In addition, at least a portion of the housing (50) may include a heat-dissipating plastic, for example, at least a portion of the second case (30) may include a heat-dissipating plastic, and preferably, the entire second case (30) may be integrally injection-molded or molded heat-dissipating plastic. Meanwhile, the first case (10) may also be composed of a heat-dissipating plastic, but in this case, heat may be transferred to the side of the first case (10) exposed to the outside, causing discomfort to the driver or passengers, and there is a concern that heat may be more easily transferred to external electronic devices.

[0056]

[0057] In addition, an external surface structure (A) including a plurality of heat dissipation fins protruding to a predetermined height may be formed on the external surface of the second case (30), specifically, the external surface of the portion composed of heat dissipation plastic, and the external surface structure (A) may be advantageous in further improving heat dissipation performance by increasing the specific surface area of ​​the external surface. The external surface structure (A) includes heat dissipation fins, and the fins may have various fin shapes employed in conventional heat sinks, for example, continuous fins, strip fins, and the present invention is not particularly limited thereto.

[0058] In addition, referring to FIG. 3, according to one embodiment of the present invention, when the second case (30) is formed of a heat-dissipating plastic, the inner surface of the second case (30) may include a plurality of fins or plate-shaped inner surface structures (B) protruding toward the circuit portion (20). The inner surface structures (B) formed on the inner surface allow heat generated from the circuit portion (20) to be transferred to the second case (30) in a complex manner through the heat-dissipating material (40) and the inner surface structures (B), thereby advantageously dissipating heat generated from the circuit portion (20) more effectively to the outside. In addition, the inner surface structure (B) is advantageous in positioning the heat dissipation material (40) accommodated inside the housing (50) on the intended circuit section (20) and fixing it so that it does not move from the position, thereby preventing the heat dissipation material (40) from moving due to shock, vibration, etc. that occur during vehicle operation and the resulting deterioration of heat dissipation performance when the heat dissipation material (40) is not provided in the entire area of ​​the accommodation section inside the housing (50).

[0059]

[0060] Meanwhile, the heat-dissipating plastic provided in the housing (50) may be a known heat-dissipating plastic having heat-dissipating properties.

[0061] For example, the heat-dissipating plastic includes a filler (34) dispersed within a matrix (31) containing a thermoplastic resin, and the filler (34) may include a first heat-dissipating filler (32) and a reinforcing filler (33).

[0062] First, the matrix (31) provides the shape and mechanical strength of the heat-dissipating plastic, and may include a known thermoplastic resin that can be molded by injection molding or the like. The thermoplastic resin may be, for example, one compound selected from the group consisting of polyamide, polyester, polyketone, liquid crystal polymer, polyolefin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphenylene oxide (PPO), polyether sulfone (PES), acrylonitrile-butadiene-styrene copolymer (ABS), polyetherimide (PEI), and polyimide, or a mixture or copolymer of two or more. As a specific example, the polyamide may be a known polyamide-based compound such as nylon 6, nylon 66, nylon 11, nylon 610, nylon 12, nylon 46, nylon 9T (PA-9T), polyphthalamide (PPA), quina, and aramid. In addition, the polyester may be a known polyester compound such as polyethylene terephthalate (PET), polytrimethylene terephthalate (PTT), polybutylene terephthalate (PBT), polycarbonate, etc. In addition, the polyolefin may be a known polyolefin compound such as polyethylene, polypropylene, polystyrene, polyisobutylene, ethylene vinyl alcohol, etc. In addition, the liquid crystal polymer may be used without limitation as long as it is a polymer that exhibits liquid crystallinity in a solution or dissolved state, and may be a known type, so the present invention is not particularly limited thereto.

[0063] Preferably, the thermoplastic resin may include at least one selected from the group consisting of polycarbonate (PC), polybutylene terephthalate (PBT), polyamide 6 (PA 6), polyamide 66 (PA 66), polypropylene, liquid crystal polymer (LCP), polyphenylene sulfide (PPS), and polyphthalamide (PPA).

[0064] In addition, the thermoplastic resin may be contained in an amount of 25 to 60 wt% based on the total weight of the heat-dissipating plastic, which is advantageous in achieving the purpose of the present invention.

[0065] In addition, the matrix (31) may further include other additives such as an impact modifier, an antioxidant, a heat stabilizer, a light stabilizer, a plasticizer, a dispersant, an activator, a coupling agent, a UV absorber, an antistatic agent, a flame retardant, etc., in addition to the thermoplastic resin described above.

[0066] The above impact modifier can be used without limitation as long as it is a known component that can improve the impact resistance by expressing the flexibility and stress relaxation of the heat-dissipating plastic, and for example, it can include one or more components from among thermoplastic polyurethane (TPU), thermoplastic polyolefin (TPO), maleic acid grafted EPDM, core / shell structured elastic particles, and rubber-based resins. The thermoplastic polyolefin is a group of materials similar to rubber, and can be a linear polyolefin block copolymer having a polyolefin block such as polypropylene or polyethylene and a rubbery block, or a blend of polypropylene and ethylene-propylene-diene monomer (EPDM), which is an ethylene-based elastomer. Since a known thermoplastic polyolefin can be used, a description of its specific types will be omitted in the present invention. In addition, since a known thermoplastic polyurethane can also be used, a description of its specific types will be omitted. In addition, the elastic particles of the core / shell structure may, for example, use an allylic resin for the core, and the shell portion may be a polymer resin having a functional group capable of reacting to increase compatibility and bonding strength with a thermoplastic polymer compound. The impact modifier may be contained in an amount of, for example, 0.1 to 3 wt% based on the weight of the heat-dissipating plastic in the matrix (31), but is not limited thereto.

[0067] In addition, the antioxidant is provided to prevent the main chain of the thermoplastic resin from being broken by suppressing the generation of radicals due to heat and / or shear stress during extrusion and injection, and to prevent discoloration due to heat generated during secondary processing. The antioxidant may be any known antioxidant without limitation, and non-limiting examples thereof include organic phosphites such as tris(nonyl phenyl) phosphite, tris(2,4-di-t-butylphenyl) phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, or the like; alkylated monophenols or polyphenols; tetrakis[methylene(3,5-di-tert-butyl-4-hydroxyhydrocinnamate)] methane, or the like, such as alkylated reaction products of polyphenols having a diene; Butylated reaction products of para-cresol or dicyclopentadiene; alkylated hydroquinones; hydroxylated thiodiphenyl ethers; alkylidene-bisphenols; benzyl compounds; esters of beta-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionic acid with monohydric or polyhydric alcohols; esters of beta-(5-tert-butyl-4-hydroxy-3-methylphenyl)-propionic acid with monohydric or polyhydric alcohols; Esters of thioalkyl or thioaryl compounds such as distearyl thiopropionate, dilauryl thiopropionate, ditridecyl thiopropionate, octadecyl-3-(3,5-di-tert-butyl-1-4-hydroxyphenyl)propionate, pentaerythrityl-tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate or the like; amides of beta-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid or the like, or mixtures thereof. The antioxidant may be contained in an amount of, for example, 0.05 to 3 wt% based on the weight of the heat-dissipating plastic in the matrix (31), but is not limited thereto.

[0068] In addition, the heat stabilizer may be any known heat stabilizer without limitation, but non-limiting examples thereof include organic phosphites such as triphenyl phosphite, tris-(2,6-dimethylphenyl)phosphite, tris-(mixed mono-and di-nonylphenyl)phosphite, or the like; phosphonates such as dimethylbenzene phosphonate or the like; phosphates such as trimethyl phosphate or the like; or mixtures thereof. The heat stabilizer may be contained in an amount of, for example, 0.05 to 3 wt% based on the weight of the heat-radiating plastic in the matrix (31), but is not limited thereto.

[0069] In addition, the light stabilizer may be used without limitation in the case of a known light stabilizer, but non-limiting examples thereof include benzotriazoles such as 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-5-tert-octylphenyl)benzotriazole, and 2-hydroxy-4-n-octoxy benzophenone, or other similar ones, or mixtures thereof. In addition, the light stabilizer may be contained in an amount of, for example, 0.01 to 3 wt% based on the weight of the heat-dissipating plastic in the matrix (31), but is not limited thereto.

[0070] In addition, the plasticizer may be used without limitation in the case of a known plasticizer, but non-limiting examples thereof include phthalic acid esters such as dioctyl-4,5-epoxy-hexahydrophthalate, tris-(octoxycarbonylethyl)isocyanurate, tristearin, epoxidized soybean oil, or other similar ones, or mixtures thereof. The plasticizer may be contained in an amount of, for example, 0.01 to 3 wt% based on the weight of the heat-dissipating plastic in the matrix (31), but is not limited thereto.

[0071] In addition, the antistatic agent may be any known antistatic agent without limitation, and non-limiting examples thereof include glycerol monostearate, sodium stearyl sulfonate, sodium dodecylbenzenesulfonate, polyether block amide, or mixtures thereof, which are commercially available from, for example, BASF under the trademark Irgastat; Arkema under the trademark PEBAX; and Sanyo Chemical industries under the trademark Pelestat. The antistatic agent may be contained in an amount of, for example, 0.01 to 3 wt% based on the weight of the heat-dissipating plastic in the matrix (31), but is not limited thereto.

[0072] In addition, the above-mentioned lubricant is used to improve processability by improving fluidity during molding, and any known lubricant can be used without limitation. Non-limiting examples thereof include metal stearate, stearyl stearate, pentaerythritol tetrastearate, beeswax, montan wax, paraffin wax, polyethylene wax, or other similar ones or mixtures thereof. The above-mentioned lubricant may be contained in an amount of 0.1 to 3 wt% based on the weight of the heat-dissipating plastic in the matrix (31), but is not limited thereto.

[0073] In addition, the UV absorber may be any known UV absorber without limitation, and non-limiting examples thereof include hydroxybenzophenones; hydroxybenzotriazoles; hydroxybenzotriazines; cyanoacrylates; oxanilides; benzoxazinones; 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3,-tetramethylbutyl)-phenol; 2-hydroxy-4-n-octyloxybenzophenone; 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-(octyloxy)-phenol; 2,2'-(1,4-phenylene)bis(4H-3,1-benzoxazin-4-one); 1,3-bis[(2-cyano-3,3-diphenylacryloyl)oxy]-2,2-bis[[(2-cyano-3, 3-biphenylacryloyl)oxy]methyl]propane; 2,2'-(1,4-phenylene) bis(4H-3,1-benzoxazin-4-one); 1,3-bis[(2-cyano-3,3-diphenylacryloyl)oxy]-2,2-bis[[(2-cyano-3,3-diphenylacryloyl)oxy]methyl]propane; nano-sized inorganic materials such as titanium oxide, cerium oxide, and zinc oxide having a particle size of less than 100 nm; or other similar materials, or mixtures thereof. The UV absorber may be contained in an amount of, for example, 0.1 to 3 wt% based on the weight of the heat-radiating plastic in the matrix (31), but is not limited thereto.

[0074] In addition, the dispersant may be used without limitation if it is a known component as a dispersant of the filler described below. Non-limiting examples thereof include polyester-based dispersants, polyphenylene ether-based dispersants; polyolefin-based dispersants, acrylonitrile-butadiene-styrene copolymer dispersants, polyarylate-based dispersants, polyamide-based dispersants, polyamideimide-based dispersants, polyarylsulfone-based dispersants, polyetherimide-based dispersants, polyethersulfone-based dispersants, polyphenylene sulfide-based dispersants, and polyimide-based dispersants. Examples thereof include polyetherketone-based dispersants, polybenzoxazole-based dispersants, polyoxadiazole-based dispersants, polybenzothiazole-based dispersants, polybenzimidazole-based dispersants, polypyridine-based dispersants, polytriazole-based dispersants, polypyrrolidine-based dispersants, polydibenzofuran-based dispersants, polysulfone-based dispersants, polyurea-based dispersants, polyurethane-based dispersants, and polyphosphazene-based dispersants, and these may be used alone or as a mixture or copolymer of two or more selected from these. The dispersant may be contained in an amount of, for example, 0.1 to 3 wt% based on the weight of the heat-radiating plastic in the matrix (31), but is not limited thereto.

[0075] In addition, the coupling agent is intended to increase compatibility between the matrix and the filler described below, and any known coupling agent can be used without limitation. As a non-limiting example thereof, at least one selected from the group consisting of a silane coupling agent, an amine coupling agent, maleic acid graft polypropylene (MAH-g-PP), and maleic acid graft EPDM (MAH-g-EPDM) can be used in combination. In addition, the coupling agent can be contained in an amount of, for example, 0.1 to 3 wt% based on the weight of the heat-dissipating plastic in the matrix (31), but is not limited thereto.

[0076] In addition, the flame retardants are, for example, halogenated flame retardants, like tretabromo bisphenol A oligomers such as BC58 and BC52, brominated polystyrene or poly(dibromo-styrene), brominated epoxies, decabromodiphenyleneoxide, pentabromophenyl acrylate monomer, pentabromobenzyl acrylate polymer, ethylene-bis(tetrabromophthalimide), bis(pentabromobenzyl)ethane, metal hydroxides such as Mg(OH)2 and Al(OH)3, phosphor-based FR systems such as melamine cyanurate, red phosphorus, melamine polyphosphate, phosphate esters, metal phosphinates, ammonium polyphosphate, expandable graphite, sodium or potassium perfluorobutane sulfate, sodium or potassium Perfluorooctane sulfate, sodium or potassium diphenylsulfonesulfonate and sodium- or potassium-2,4,6-trichlorobenzonate and N-(p-tolylsulfonyl)-p-toluenesulfimide potassium salt, N-(N'-benzylaminocarbonyl) sulfanilimide potassium salt, or mixtures thereof, but are not limited thereto. In addition, the flame retardant may be contained in an amount of, for example, 0.01 to 5 wt% based on the weight of the heat-resistant plastic in the matrix (31), but is not limited thereto.

[0077]

[0078] Next, the filler (34) dispersed in the matrix (31) of the heat-dissipating plastic will be described.

[0079] The above filler (34) may include a first heat dissipation filler (32) for the purpose of heat dissipation and a reinforcing filler (33) for improving strength.

[0080] First, the first heat dissipation filler (32) may include at least one of a carbon-based filler, a metal and / or alloy filler, and a ceramic filler. First, the carbon-based filler is known, and non-limiting examples thereof may include at least one selected from the group consisting of carbon black, Chechen black, activated carbon, carbon nanotubes (CNTs), graphite, graphene, and fullerene. In addition, the graphite may include any one of graphite flakes, expanded graphite, and spherical graphite. In addition, the carbon-based filler may be a graphite composite containing metal nanoparticles on graphite, or metal nanoparticles and a polydopamine component on graphite. In addition, the metal or alloy filler may be a metal such as iron, copper, aluminum, zinc, silver, gold, platinum, tin, lead, magnesium, tungsten, molybdenum, nickel, and chromium, or an alloy containing at least one of these. In addition, the ceramic filler may include at least one selected from the group consisting of silicon carbide, aluminum nitride, silicon nitride, boron nitride, magnesium oxide, titania, alumina, silica, zinc oxide, beryllium oxide, manganese oxide, zirconia, boron oxide, single crystal silicon, barium titanate, and strontium titanate.

[0081] At this time, preferably, the first heat dissipation filler (32) may include graphite in consideration of heat dissipation characteristics, electromagnetic wave shielding, electrical conductivity, flame retardancy, etc.

[0082] In addition, the first heat-radiating filler (32) may be included in an amount of 20 wt% or more, more preferably 40 wt% or more, based on the total weight of the heat-radiating plastic, thereby exhibiting sufficient heat-radiating characteristics at the desired level. If it is included in an amount of less than 20 wt%, it may be difficult to obtain the desired heat-radiating characteristics. However, the heat-radiating filler may be included in an amount of preferably 90 wt% or less, more preferably 70 wt% or less, thereby advantageously maintaining mechanical strength that can be used as a housing, and having the advantage of maintaining heat-radiating characteristics.

[0083] In addition, the first heat-radiating filler (32) may have a spherical shape, a plate-shaped granular shape, or an irregularly shaped granular shape. In addition, the first heat-radiating filler (32) may have an average particle diameter of 1 to 350 μm, and more preferably, the average particle diameter may be 1 to 300 μm, 1 to 200 μm, 1 to 100 μm, 1 to 50 μm, 10 to 50 μm, or 10 to 30 μm. When the particle diameter of the first heat-radiating filler is adjusted to an appropriate level, it becomes easy to provide the first heat-radiating filler at a high content in the heat-radiating plastic, the dispersibility of the first heat-radiating filler can be improved, the surface quality of the heat-radiating plastic can be improved, and there is an advantage in that the heat-radiating filler can be prevented from being detached, such as coming off from the surface. Meanwhile, the first heat-radiating filler (32) may have an average particle diameter of 1㎛ or more, which can further increase the dispersibility and content within the matrix, thereby having the advantage of further improving thermal conductivity. However, if the average particle diameter exceeds 350㎛, it may cause an increase in the pressure inside the extruder during the compounding process, which may result in a decrease in productivity. In addition, a problem of reduced fluidity (MFR) may occur during injection molding, which may result in short molding, surface defects, etc. Meanwhile, in the present invention, the particle diameter of the heat-radiating filler is the diameter when the shape is spherical, and means the longest straight-line distance between two different points on the surface when the shape is polyhedral or irregular.

[0084]

[0085] In addition, the reinforcing filler (33) is for improving the mechanical properties of the heat-dissipating plastic, and may be a known reinforcing filler contained in a plastic molded product, and may be, for example, carbon fiber, glass fiber, and / or cellulose fiber.

[0086] The glass fiber may be any known glass fiber composition without limitation. For example, the glass fiber may contain one or more elemental oxides selected from the group consisting of silicon, boron, aluminum, calcium, magnesium, lithium, sodium, potassium, titanium, and iron. Specifically, the glass fiber may contain 55 to 75 wt% of SiO2, 15 to 25 wt% of B2O3, and 1 to 25 wt% of other oxides, preferably 60 to 75 wt% of SiO2, and 16 to 24 wt% of B2O3. Meanwhile, the other oxides may contain one or more components selected from Al2O3, CaO, MgO, Li2O, Na2O, K2O, TiO2, and Fe2O3. The glass fibers may have, for example, an average aspect ratio of 300 or more, which is the ratio of the major axis to the minor axis, and preferably, an average diameter of 8 to 15 ㎛ and an average length of 4 to 8 ㎜, which may be advantageous in achieving the purpose of the present invention, such as improving mechanical properties. In addition, the glass fibers may have a polygonal cross-section, such as a circle, an oval, or a rectangle, and the present invention is not particularly limited thereto. In addition, the glass fibers may be surface-treated with a silane compound such as epoxysilane or an olefin such as polyethylene in order to improve dispersibility and flowability within the matrix component and compatibility between different materials.

[0087] In addition, since known carbon fibers or cellulose fibers can be used, the present invention does not limit the specific type thereof. In addition, the cellulose fibers or carbon fibers may be, for example, those having an average aspect ratio of the major axis to the minor axis exceeding 100, and preferably, those having an average length of 6 to 10 mm and an average diameter of 6 to 12 μm can be used, which may be advantageous in achieving the purpose of the present invention, such as by improving mechanical properties.

[0088] In addition, the reinforcing filler (33) is contained in an amount of 5 to 25 wt% based on the weight of the heat-dissipating plastic, and more preferably, it can be contained in an amount of 10 to 20 wt%. If the reinforcing filler is contained in an amount of less than 5 wt%, the mechanical properties may deteriorate, and in particular, there is a concern that the flexural modulus may be significantly reduced. In addition, if the reinforcing filler exceeds 25 wt%, it may be difficult to control the shrinkage characteristics in each direction during molding such as injection molding, and the content of the matrix component is relatively reduced, so there is a concern that the mechanical properties may deteriorate or the surface quality may deteriorate.

[0089]

[0090] In addition, the heat-dissipating plastic can be formed to a thickness of, for example, 0.5 to 10 mm, which is advantageous in exhibiting heat-dissipating properties while having sufficient mechanical strength as a housing.

[0091] In addition, the heat-dissipating plastic described above may have a thermal conductivity of, for example, 1 to 30 W / m·K, and through this, heat generated in the circuit of a high-output wired charging module can be transferred, thereby easily exhibiting heat dissipation performance.

[0092]

[0093] In addition, the heat-dissipating plastic described above can be manufactured using a known method that can be manufactured to have a predetermined thickness, area, and shape using a thermoplastic plastic material, and can be manufactured using a method such as extrusion molding or injection molding, and the present invention is not particularly limited to a method for manufacturing the heat-dissipating plastic.

[0094]

[0095] Next, the heat dissipating material (40) that fills the receiving portion in the housing (50) will be described.

[0096] Specifically, the heat dissipation material (40) is arranged to fill at least part, and preferably all, of the remaining empty space of the housing (50) except for the area where the circuit part (20) is arranged.

[0097] The above heat dissipating material (40) may be a known heat dissipating material having a function of mediating heat transfer to transfer heat generated from the circuit unit (20) to the heat dissipating plastic side, and may include, for example, a matrix component (41) and a second heat dissipating filler (42).

[0098] The above heat dissipating material (40) can be implemented as a heat dissipating material forming composition and can include a matrix forming component and a second heat dissipating filler.

[0099] The above matrix forming component may include a curable resin. In addition, the curable resin may be any known curable resin without limitation, and may include, for example, one or more of an epoxy resin, an unsaturated polyester resin, a silicone resin, and a polyurethane resin. Preferably, the curable resin may include a silicone resin capable of exhibiting elasticity to minimize cracking due to heat-induced shrinkage and expansion of the matrix after curing and to increase durability against vibrations generated during vehicle operation.

[0100] In addition, the curable resin may be included in an amount of 5 to 20 wt% based on the total weight of the heat-dissipating material to be implemented, but is not limited thereto, and may be appropriately modified depending on the specific resin type and the level of desired physical properties.

[0101] Specifically, the curable resin may contain, for example, a silicone resin. The silicone resin may preferably include a first silicone resin that is an organopolysiloxane and a second silicone resin that is an organohydrogenpolysiloxane. For example, the first silicone resin may be contained in an amount of 5 to 15 wt% based on the total weight of the heat-dissipating material to be implemented, and the second silicone resin may be contained in an amount of 0.1 to 3 wt%. Through this, it is advantageous to implement a high viscosity to improve the thixotropic properties of the heat-dissipating material forming composition, and through this, it is easy to control the flowability, thereby improving the workability, and there is an advantage that the reworkability is improved and room temperature curing is possible, so it may be advantageous to achieve the object of the present invention.

[0102]

[0103] In addition, the matrix forming component may further include additives such as a curing agent, a curing retardant, a catalyst, a thickener, a filler, a reinforcing agent, etc., as needed, and the specific type and content of each additive may be appropriately modified depending on the purpose, and thus the present invention is not particularly limited thereto. However, as an example, each functional component included in the additive may be included in the matrix component in an amount of 2 wt% or less based on the weight of the heat-dissipating material.

[0104]

[0105] In addition, the second heat-radiating filler (42) may be a known heat-radiating filler contained in plastic, and the type described in the first heat-radiating filler (32) described above may be used without limitation. However, in order to eliminate concerns about electrical shorts that may occur when in contact with various elements (22) included in the circuit unit (20), the second heat-radiating filler (42) may have a resistance of, for example, 1X1014 It may be Ω or more. In addition, as a specific example, the second heat-dissipating filler (42) may include at least one of silicon carbide, magnesium oxide, titanium dioxide, silicon dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, aluminum hydroxide, silica, zinc oxide, barium titanate, strontium titanate, beryllium oxide, and manganese oxide, and as a more specific example, it may be aluminum hydroxide. Alternatively, the second heat-dissipating filler (42) may be a heat-dissipating filler having a structure including a core portion and an insulating film covering the core portion, and the core portion may contain a carbon-based or metal / alloy having high thermal conductivity, and by having an insulating film, it is advantageous to prevent an electrical short through contact with the circuit portion. For example, the core portion may be a carbon-based filler such as graphite, and the insulating film may be silicon oxide.

[0106] In addition, the second heat-radiating filler (42) may be included in an amount of 80 to 95 wt% based on the total weight of the heat-radiating material (40), and this may be advantageous in more efficiently transferring heat generated from a high-output circuit part to the housing, particularly the heat-radiating plastic side.

[0107] Meanwhile, the second heat-dissipating filler (42) may have a reduced thermal conductivity at the interface formed with the matrix component (41) due to low compatibility with the matrix component (41) and the heterogeneous material. Accordingly, the surface of the second heat-dissipating filler (42) may be surface-treated or surface-modified to improve the interfacial properties with the matrix component.

[0108] The above surface treatment may be to remove foreign inorganic substances or impurities adhering to the surface, and through such surface treatment, the thermal conductivity characteristics of the second heat-dissipating filler itself may be fully exhibited and may be advantageous in improving the interface characteristics with the matrix component.

[0109] In addition, the surface modification can be used without limitation in the case of a known modification that can increase the compatibility between the components forming the second heat-radiating filler (42) and the matrix component (41). For example, the surface modification can be a modification that provides the surface of the second heat-radiating filler (42) with at least one functional group selected from the group consisting of an alkoxy group, an epoxy group, an amino group, a vinyl group, a methacrylic group, and an isocyanate group, and with respect to a specific modification method, a known method can be appropriately employed in consideration of the type of functional group to be modified, and the present invention is not particularly limited thereto.

[0110]

[0111] In addition, the average particle diameter of the second heat-radiating filler (42) may be 1 to 100 μm, which may be advantageous in achieving the purpose of the present invention.

[0112]

[0113] The heat dissipation material (40) described above may have, for example, a thermal conductivity of 0.5 to 10 W / m·K, and may be advantageous in transferring heat generated in the circuit section of a high-output wired charging module to the housing side.

[0114]

[0115] In addition, the heat-radiating material (40) may be formed of a heat-radiating material forming composition as described above, and the heat-radiating material forming composition may have a viscosity of 150,000 to 300,000 cps at a temperature of 25°C. As the heat-radiating material forming composition satisfies the viscosity range at the temperature of 25°C, it may have excellent thixotropic properties, may be easy to control flowability, may improve workability, and may have the advantage of improved reworkability and room temperature curing, which may be advantageous in achieving the purpose of the present invention.

[0116]

[0117] Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiment presented in this specification, and a person skilled in the art who understands the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

Claims

1. A vehicle heat dissipation wired charging module installed inside a vehicle to supply power to external electronic devices. A circuit part having a receptacle mounted thereon, which is connected to a terminal of a power supply line connected to an external electronic device; A housing including a receiving portion that receives the circuit portion inside, an open hole formed on one side so that the receptacle is exposed to the outside, and at least a portion of which is made of heat-dissipating plastic; and A vehicle heat dissipation wired charging module including a heat dissipation material arranged at least in contact with the circuit portion within the remaining empty space of the receiving portion excluding the area where the circuit portion is arranged.

2. In paragraph 1, A vehicle heat-dissipating wired charging module, wherein the housing comprises a first case having an open hole formed so that a receptacle is exposed to the outside, and a second case at least partly made of heat-dissipating plastic and assembled with the first case.

3. In paragraph 1, A vehicle heat dissipation wired charging module having an external surface structure having a plurality of heat dissipation fins formed on the external surface of the second case to a predetermined height.

4. In paragraph 1, A vehicle heat dissipation wired charging module having an inner surface structure in which at least one of a pin and a plate protruding toward a circuit section is formed on the inner surface of the second case.

5. In paragraph 1, A vehicle heat-radiating wired charging module, wherein the heat-radiating plastic comprises a filler dispersed within a matrix including a thermoplastic resin, and the filler comprises a first heat-radiating filler and a reinforcing filler.

6. In paragraph 1, The above heat-dissipating plastic is a vehicle heat-dissipating wired charging module with a thickness of 0.5 to 10 mm.

7. In paragraph 5, A vehicle heat-radiating wired charging module comprising 20 to 70 wt% of a first heat-radiating filler and 5 to 20 wt% of a reinforcing filler based on the weight of the heat-radiating plastic.

8. In paragraph 5, The above first heat-radiating filler has an average particle diameter of 1 to 350㎛, The above reinforcing filler is a vehicle heat dissipation wired charging module, which is made of glass fiber having an average length of 4 to 8 mm and an average diameter of 8 to 15 μm or cellulose fiber having an average length of 6 to 10 mm and an average diameter of 6 to 12 μm.

9. In paragraph 5, A vehicle heat dissipation wired charging module containing at least one selected from the group consisting of the thermoplastic resin, polycarbonate (PC), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyamide 6 (PA 6), polyamide 66 (PA 66), polyphthalamide (PPA), polypropylene, polyethylene, polyimide (PI), liquid crystal polymer (LCP), polyphenylene sulfide (PPS), acrylonitrile butadiene styrene (ABS), polyacetal (POM), polyvinyl chloride (PVC), polystyrene (PS), polymethyl methacrylate (PMMA), and modified polyphenylene oxide (mPPO).

10. In paragraph 1, A vehicle heat-radiating wired charging module comprising a matrix component and 80 wt% or more of a second heat-radiating filler, wherein the heat-radiating material is 11. In paragraph 10, The above second heat-radiating filler has a resistance of 1Х10 14 Ω A heat-dissipating wired charging module for vehicles with an ideal design.

12. In paragraph 10, A vehicle heat dissipation wired charging module, wherein the matrix component comprises a first silicone resin which is organopolysiloxane and a second silicone resin which is organohydrogenpolysiloxane.

13. In paragraph 10, The above second heat-radiating filler is a vehicle heat-radiating wired charging module having an average particle diameter of 1 to 100㎛.

14. In paragraph 10, The above second heat-radiating filler is a vehicle heat-radiating wired charging module surface-modified with at least one functional group selected from the group consisting of an alkoxy group, an epoxy group, an amino group, a vinyl group, a methacrylic group, and an isocyanate group.

15. In the 10th paragraph, the second heat-radiating filler At least one filler selected from the group consisting of aluminum nitride, boron nitride, silicon nitride and silicon carbide; and A vehicle heat dissipation wired charging module comprising at least one of a core-shell structure filler including a core portion and an insulating film covering the core portion.

16. In paragraph 15, A vehicle heat dissipation wired charging module in which the core part is a carbon-based filler and the insulating film is silicon oxide.

17. In paragraph 1, The above heat-dissipating plastic has a thermal conductivity of 1 to 30 W / m K, and the above heat-dissipating material has a thermal conductivity of 0.5 to 10 W / m K. A vehicle heat-dissipating wired charging module.

18. A vehicle equipped with a heat dissipation wired charging module according to Article 1.

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