Photovoltaic module, photovoltaic system and manufacturing method for photovoltaic module

Abstract

A photovoltaic module, a photovoltaic system and a manufacturing method for the photovoltaic module. The photovoltaic module comprises a first substrate (10), a second substrate (20), a packaging layer (40), a sealing layer (50) and a spacer layer (60). The first substrate (10) and the second substrate (20) are arranged in a first direction. The packaging layer (40) is arranged between the first substrate (10) and the second substrate (20) and is used for fixing a photovoltaic cell (30). The sealing layer (50) is located on the outer side of the packaging layer (40) in a second direction and is arranged around the packaging layer (40); the sealing layer (50) is used for sealing a gap between the first substrate (10) and the second substrate (20), the second direction (F2) being perpendicular to the first direction (F1). The spacer layer (60) is arranged between the packaging layer (40) and the sealing layer (50), so as to prevent the molten packaging layer (40) from flowing towards the sealing layer (50).

Description

Photovoltaic module, photovoltaic system and method for manufacturing photovoltaic module

[0001] Cross-references

[0002] This application claims priority to Chinese patent application No. 2023117362916, filed on December 15, 2023, entitled “Photovoltaic Module, Photovoltaic System and Method for Manufacturing Photovoltaic Module,” the entire text of which is incorporated herein by reference. Technical Field

[0003] The present application relates to the field of photovoltaic technology, and in particular to a photovoltaic module, a photovoltaic system, and a method for manufacturing a photovoltaic module. Background Art

[0004] In some related technologies, the adhesive film used in photovoltaic modules is mainly ethylene-vinyl acetate copolymer (EVA), but EVA has a high water vapor permeability and water absorption rate. During the long-term use of photovoltaic modules, water vapor can easily penetrate from the edge to the surface of the battery, causing the battery power to attenuate and resulting in a decrease in power generation.

[0005] Some other related technologies use butyl rubber edge sealing to improve water vapor resistance. However, butyl rubber is prone to glue penetration, resulting in a small actual water barrier size, which reduces the water vapor resistance of photovoltaic module products.

[0006] Summary of the Invention

[0007] According to various embodiments of the present application, a photovoltaic module, a photovoltaic system, and a method for manufacturing a photovoltaic module are provided.

[0008] In a first aspect, the present application provides a photovoltaic module, comprising:

[0009] A first substrate and a second substrate, the first substrate and the second substrate are arranged along a first direction; an encapsulation layer, the encapsulation layer is arranged between the first substrate and the second substrate and is used to fix the photovoltaic cell; a sealing layer, the sealing layer is located on the outside of the encapsulation layer along a second direction and is arranged around the encapsulation layer, the sealing layer is used to seal the gap between the first substrate and the second substrate, the second direction is perpendicular to the first direction; a separation layer, the separation layer is arranged between the encapsulation layer and the sealing layer to prevent the molten encapsulation layer from flowing toward the sealing layer.

[0010] According to some embodiments of the present application, at a set temperature, the viscosity of the encapsulation layer is lower than the viscosity of the sealing layer, and the viscosity of the separation layer is higher than the viscosity of the encapsulation layer.

[0011] According to some embodiments of the present application, at a set temperature, the viscosity of the separation layer is greater than the viscosity of the sealing layer.

[0012] According to some embodiments of the present application, the separation layer is a single layer, and two ends of the separation layer along the first direction are in contact with and cooperate with the first substrate and the second substrate respectively.

[0013] According to some embodiments of the present application, the separation layer is multi-layered and arranged along the second direction, at least one layer of the separation layer is in contact with the first substrate at one end along the first direction, and at least one layer of the separation layer is in contact with the second substrate at one end along the first direction.

[0014] According to some embodiments of the present application, along the first direction, the encapsulation layer, the sealing layer, and the separation layer have the same size.

[0015] According to some embodiments of the present application, along the first direction, the size of the encapsulation layer is H1, the size of the sealing layer is H2, and the size of the separation layer is H3, wherein H1<H2, H1≤H3≤H2.

[0016] According to some embodiments of the present application, the photovoltaic module further includes: an auxiliary adhesive layer, wherein the auxiliary adhesive layer is provided between the encapsulation layer and the second substrate.

[0017] According to some embodiments of the present application, at a set temperature, the viscosity of the auxiliary adhesive layer is greater than the viscosity of the encapsulation layer.

[0018] According to some embodiments of the present application, a groove is provided on a side of at least one of the first substrate, the second substrate, and the separation layer facing the encapsulation layer, and the encapsulation layer is partially embedded in the groove.

[0019] According to some embodiments of the present application, the separation layer is a porous structure.

[0020] According to some embodiments of the present application, along the second direction, the size of the sealing layer is 8 to 12 mm.

[0021] According to some embodiments of the present application, along the second direction, the size of the separation layer is 0.1-0.5 mm.

[0022] According to some embodiments of the present application, the material of the encapsulation layer includes EVA.

[0023] According to some embodiments of the present application, the material of the sealing layer includes at least one of butyl rubber, butyl tape, and POE.

[0024] According to some embodiments of the present application, the material of the separation layer includes at least one of PP, PET, and POE.

[0025] According to some embodiments of the present application, the encapsulation layer covers and fixes the photovoltaic cell.

[0026] In a second aspect, the present application provides a photovoltaic system having the above-mentioned photovoltaic assembly.

[0027] A photovoltaic system according to an embodiment of the present application includes a support assembly and a photovoltaic assembly according to an embodiment of the present application, wherein the photovoltaic assembly is mounted on the support assembly.

[0028] Thirdly, the present application also proposes a method for manufacturing a photovoltaic module.

[0029] According to the manufacturing method of the photovoltaic module of the embodiment of the present application, the photovoltaic module is the photovoltaic module according to the embodiment of the present application, and the manufacturing method includes: providing a first substrate, a second substrate, a photovoltaic cell, a packaging material, a sealing material and a separator material; arranging the photovoltaic cell, the packaging material, the sealing material and the separator material between the first substrate and the second substrate, and making the sealing material located outside the packaging material along the second direction and arranged around the packaging material, and the separator material located between the packaging material and the sealing material; performing a lamination process to bond the photovoltaic cell, the packaging material, the sealing material, the separator material, the first substrate and the second substrate into one, so that the packaging material forms a packaging layer and fixes the photovoltaic cell, the sealing material forms a sealing layer and seals between the first substrate and the second substrate, and the separator material forms a separator layer.

[0030] According to some embodiments of the present application, before the lamination process, the size of the sealing material along the first direction is larger than the size of the packaging material along the first direction, and the size of the separation material along the first direction is larger than or equal to the size of the packaging material along the first direction.

[0031] According to some embodiments of the present application, before the lamination process, a size of the separation material along the first direction is smaller than a size of the sealing material along the first direction.

[0032] According to some embodiments of the present application, before the lamination process, multiple layers of the separation material are stacked along the second direction and cross-arranged along the first direction, and the spacing between the two ends of the multiple layers of the separation material along the first direction is equal to the size of the sealing material along the first direction.

[0033] According to some embodiments of the present application, before the lamination process, the separation material is two layers, wherein one layer of the separation material is in contact with the first substrate at one end along the first direction and is spaced apart from the second substrate at the other end, and the other layer of the separation material is in contact with the second substrate at one end along the first direction and is spaced apart from the first substrate at the other end, and the two layers of the separation material partially cross along the first direction.

[0034] According to some embodiments of the present application, before the lamination process, the packaging material is placed in contact with the second substrate, and during the lamination process, the relative movement distance between the first substrate and the second substrate is greater than or equal to the distance between the packaging material and the first substrate.

[0035] According to some embodiments of the present application, the packaging layer is placed in contact with the second substrate, and during the lamination process, the relative movement distance between the first substrate and the second substrate is smaller than the distance between the packaging material and the first substrate.

[0036] According to some embodiments of the present application, before the lamination process, the packaging material is arranged between the photovoltaic cell and the first substrate, and the auxiliary glue is arranged between the photovoltaic cell and the second substrate to form an auxiliary glue layer bonded to the packaging layer after the lamination process.

[0037] According to some embodiments of the present application, before the lamination process, the separation material is pre-fixed to the first substrate or the second substrate by adhesive.

[0038] According to some embodiments of the present application, before the lamination process, the separation material is adhered to a side of the sealing material facing the packaging material.

[0039] The details of one or more embodiments of the present application are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the present application will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in conventional technologies, the following is a brief introduction to the drawings required for use in the specific implementation methods or conventional technical descriptions. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] FIG1 is a schematic diagram of a photovoltaic module in the related art;

[0042] FIG2 is a cross-sectional view of FIG1 taken along line AA;

[0043] FIG3 is a schematic diagram of a photovoltaic module according to an embodiment of the present application;

[0044] FIG4 is a cross-sectional view of the photovoltaic assembly according to the first embodiment of the present application along the direction indicated by line BB in FIG3 ;

[0045] FIG5 is an enlarged schematic diagram of the structure of circle C in FIG4 ;

[0046] FIG6 is a schematic diagram of a photovoltaic module according to the first embodiment of the present application before lamination;

[0047] FIG7 is a partial cross-sectional view of a photovoltaic module according to a second embodiment of the present application;

[0048] FIG8 is a partial cross-sectional view of a photovoltaic module according to a third embodiment of the present application;

[0049] FIG9 is a schematic diagram of a photovoltaic module according to the second or third embodiment of the present application before lamination;

[0050] FIG10 is a partial cross-sectional view of a photovoltaic module according to a fourth embodiment of the present application;

[0051] FIG11 is a partial cross-sectional view of a photovoltaic module according to a fifth embodiment of the present application;

[0052] FIG12 is a flow chart of a method for manufacturing a photovoltaic module according to an embodiment of the present application.

[0053] Explanation of the accompanying drawings: Photovoltaic module 100'; first substrate 10'; second substrate 20'; photovoltaic cell 30'; photoelectric conversion component 31'; EVA adhesive layer 40'; butyl adhesive layer 50'; photovoltaic module 100; first substrate 10; second substrate 20; photovoltaic cell 30; photoelectric conversion component 31; encapsulation layer 40; sealing layer 50; partition layer 60; auxiliary adhesive layer 70; encapsulation material 40a; sealing material 50a; partition material 60a; first direction F1; second direction F2. DETAILED DESCRIPTION

[0054] The following will clearly and completely describe the technical solutions of this application in conjunction with the embodiments. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0055] To facilitate understanding of this embodiment, this embodiment is described in detail below with reference to the accompanying drawings.

[0056] Photovoltaic modules 100 are important devices that utilize the photovoltaic effect to convert solar energy into electrical energy. In today's society, the conflict between the environment and energy is becoming increasingly prominent. Among all new energy sources, solar energy boasts large reserves, is renewable, and is environmentally friendly, making photovoltaic power generation a key development direction for new energy.

[0057] Photovoltaic module 100 includes a photovoltaic cell 30, which can generate photovoltaic energy, converting light energy into electrical energy. For example, photovoltaic cell 30 can include silicon wafer photovoltaic cells 30 and thin-film photovoltaic cells 30. Silicon wafer photovoltaic cells 30 include photoelectric conversion components 31 made from single-crystal silicon ingots or polycrystalline silicon ingots. Photoelectric conversion components 31 used in thin-film photovoltaic cells 30 are deposited on a geometries or ferroelectric material using methods such as sputtering or deposition. For example, in some embodiments, photovoltaic cell 30 can be a heterojunction (HJT) cell, which has a high theoretical maximum efficiency.

[0058] The photovoltaic cell 30 may include one photoelectric conversion component 31 or a plurality of photoelectric conversion components 31 , and the plurality of photoelectric conversion components 31 may be electrically connected to each other to form a cell string.

[0059] The photovoltaic cell 30 is fragile, so the photovoltaic module 100 includes a support component for supporting and protecting the photovoltaic cell 30. For example, the support component includes a first substrate 10 and a second substrate 20. The photovoltaic cell 30 is encapsulated between the first substrate 10 and the second substrate 20 by an encapsulation layer 40 to protect the photovoltaic cell 30 from damage from the external environment and form an integrated module.

[0060] One of the first substrate 10 and the second substrate 20 can be a translucent substrate, and the other can be a backlight panel. The backlight panel can be made of a translucent or non-translucent material. External light can pass through the translucent substrate and illuminate the photovoltaic cell 30. The first substrate 10 and the second substrate 20 can be made of a rigid material such as glass, a flexible material such as a metal film or sheet, or other water-resistant material.

[0061] In some related technologies, the encapsulation layer used in photovoltaic modules is primarily made of ethylene-vinyl acetate copolymer (EVA). EVA has advantages such as a low melting point, good fluidity, high transparency, and a mature lamination process. However, EVA has a high water vapor transmission rate and water absorption rate. During the long-term use of photovoltaic modules, water vapor can easily penetrate from the edges and enter the surface of the photovoltaic cells, causing power degradation of the photovoltaic cells and a reduction in power generation. This is especially true for HJT cells, as the transparent oxide layer on their surface is sensitive to water vapor and easily corroded by it, resulting in increased resistance and severe power degradation of the modules.

[0062] In other related technologies, as shown in Figures 1 and 2, a photovoltaic module 100' encapsulates a photovoltaic cell 30', comprising a photoelectric conversion component 31', between a first substrate 10' and a second substrate 20' using an EVA adhesive layer 40'. A butyl adhesive layer 50' is used for edge sealing to improve water vapor resistance. Specifically, the butyl adhesive layer 50' seals the peripheral gap between the first substrate 10' and the second substrate 20'. However, due to the high fluidity of the EVA adhesive layer 40', when the distance between the EVA adhesive layer 40' and the butyl adhesive layer 50' is small, the EVA adhesive layer 40' is prone to overflowing during the lamination process and flowing into the butyl adhesive layer 50', causing glue penetration and reducing the actual water-blocking dimension of the butyl adhesive layer 50' (i.e., the minimum width in the inward-outward direction). Furthermore, when the distance between the EVA adhesive layer 40' and the butyl adhesive layer 50' is large, bubbles are easily generated between the EVA adhesive layer 40' and the butyl adhesive layer 50', affecting the appearance and reliability of the photovoltaic module 100'. In addition, since butyl rubber is usually black, it is difficult to detect the penetration of the rubber from the outside. Therefore, the penetration problem is difficult to monitor in actual production, which reduces the water vapor resistance of the photovoltaic module 100 ′.

[0063] Based on this, the present application proposes a photovoltaic module 100 that can greatly improve the glue penetration problem of the sealing layer 50, thereby improving the water vapor resistance of the photovoltaic module 100.

[0064] The photovoltaic module 100 according to the embodiment of the present application can be used in photovoltaic power stations in areas such as building roofs, deserts, grasslands, etc., such as ground-based power stations, rooftop power stations, and water-based power stations. It can also be used in equipment or devices that use solar energy to generate electricity, such as user solar power supplies, solar street lights, solar cars, and solar buildings. Of course, it is understood that the application scenarios of the photovoltaic module 100 include but are not limited to these, that is, the photovoltaic module 100 can be used in all fields that require the use of solar energy for power generation.

[0065] A photovoltaic assembly 100 according to an embodiment of the present application will be described below with reference to the accompanying drawings.

[0066] 3 to 11 , a photovoltaic module 100 according to an embodiment of the present application may include: a first substrate 10 , a second substrate 20 , an encapsulation layer 40 , a sealing layer 50 and a spacer layer 60 .

[0067] Specifically, as shown in Figures 3-5, 7-8, and 10-11, a first substrate 10 and a second substrate 20 are arranged along a first direction F1. An encapsulation layer 40 is disposed between the first and second substrates 10, 20 and is used to secure the photovoltaic cells 30. A sealing layer 50 is disposed outside the encapsulation layer 40 along a second direction F2 and surrounds the encapsulation layer 40. The sealing layer 50 is used to seal the gap between the first and second substrates 10, 20. The second direction F2 is perpendicular to the first direction F1. A separator layer 60 is disposed between the encapsulation layer 40 and the sealing layer 50 to prevent molten encapsulation layer 40 from flowing toward the sealing layer 50.

[0068] During the lamination process, heating is required to melt the material so that the photovoltaic components 100 can be bonded together. Therefore, the "molten encapsulation layer 40" here refers to the encapsulation layer 40 in a molten state during the lamination process, and does not limit the encapsulation layer 40 to being in a molten state in the product state.

[0069] As shown in Figure 4, the first substrate 10 and the second substrate 20 are used to protect the photovoltaic cell 30. One of the first substrate 10 and the second substrate 20 is a light-transmitting substrate, and the other is a backlight. The backlight provides support for the photovoltaic module 100, and the light-transmitting substrate transmits light, allowing the photovoltaic cell 30 to convert light energy into electrical energy.

[0070] The material of the encapsulation layer 40 includes, but is not limited to, EVA, and only needs to be able to secure the photovoltaic cell 30. Methods for securing the encapsulation layer 40 to the photovoltaic cell 30 include, but are not limited to, single-sided bonding, multi-sided bonding, and overall wrapping. The encapsulation layer 40 can be bonded to the first substrate 10, the second substrate 20, or both to secure the photovoltaic cell 30.

[0071] The first direction F1 is perpendicular to the second direction F2. For example, as shown in Figures 3 and 4, the first direction F1 is the up-down direction, and the second direction F2 is any direction within a plane perpendicular to the first direction F1, such as the front-to-back direction or the left-to-right direction. The outer side of the encapsulation layer 40 along the second direction F2, that is, the side away from the center of the encapsulation layer 40 in the second direction F2, is considered the outer side. Of course, the first substrate 10 and the second substrate 20 can be rectangular plates, as shown in Figure 3, or any other shape, such as circular plates. For circular plates, the first direction F1 can be the axial direction of the circular plate, and the second direction F2 can be the radial direction of the circular plate.

[0072] As shown in Figures 3-5, the sealing layer 50 is located outside the encapsulation layer 40 along the second direction F2 and is arranged around the encapsulation layer 40. In other words, the sealing layer 50 is arranged in the same layer as the encapsulation layer 40 between the first substrate 10 and the second substrate 20, and the sealing layer 50 is annular. The encapsulation layer 40 is located within the area enclosed by the annular sealing layer 50. Thus, the sealing layer 50 seals the gap between the first substrate 10 and the second substrate 20, so that the first substrate 10, the second substrate 20, and the sealing layer 50 cooperate to define a sealed space. The encapsulation layer 40 and the photovoltaic cell 30 are both located within this sealed space. The sealing layer 50 reduces the possibility of external moisture passing through the encapsulation layer 40 and contacting the photovoltaic cell 30. The material of the sealing layer 50 includes, but is not limited to, butyl rubber and other materials, and only needs to be able to achieve a seal between the first substrate 10 and the second substrate 20.

[0073] Furthermore, as shown in Figures 3-5, 7-8, and 10-11, a spacer layer 60 is disposed between the encapsulation layer 40 and the sealing layer 50. This minimizes the distance between the encapsulation layer 40 and the sealing layer 50 during the lamination process in the manufacture of the photovoltaic module 100, thereby reducing the generation of bubbles. For example, the encapsulation layer 40 is bonded to the spacer layer 60, and the sealing layer 50 is bonded to the spacer layer 60, thereby improving the appearance and connection reliability. The spacer layer 60 blocks the molten encapsulation layer 40, making it difficult for the molten encapsulation layer 40 to flow toward the sealing layer 50. Even if the encapsulation layer 40 does flow outward to some extent, it directly impacts the spacer layer 60 rather than the sealing layer 50.

[0074] In this way, the problem of glue penetration of the sealing layer 50 caused by overflow of the encapsulation layer 40 during the lamination process can be reduced or avoided, and the size of the sealing layer 50 along the second direction F2 can be made closer to or equal to the design size, thereby increasing the actual water-blocking size of the sealing layer 50 and improving the water vapor resistance of the photovoltaic module 100.

[0075] Moreover, since the risk of glue penetration is reduced, there is no need to monitor glue penetration during the production process. The color selection of the sealing layer 50 is more flexible. Transparent materials can be selected or any desired color materials such as white, black, etc. can be selected, which reduces the manufacturing difficulty, saves production processes, and is conducive to improving production efficiency.

[0076] According to the photovoltaic module 100 of the embodiment of the present application, by setting a partition layer 60 between the encapsulation layer 40 and the sealing layer 50, the flow of the molten encapsulation layer 40 to the sealing layer 50 during the lamination process can be slowed down or avoided, thereby improving the problem of the encapsulation layer 40 overflowing and causing the sealing layer 50 to penetrate the glue, which is beneficial to improving the actual water-blocking size of the sealing layer 50, improving the water vapor resistance and service life of the photovoltaic module 100, and helping to eliminate the glue penetration monitoring process, thereby improving production efficiency and production quality.

[0077] According to some embodiments of the present application, at a set temperature, the viscosity of the encapsulation layer 40 is lower than the viscosity of the sealing layer 50, and the viscosity of the separation layer 60 is higher than the viscosity of the encapsulation layer 40. In other words, at a set temperature, the fluidity of the encapsulation layer 40 is higher than the fluidity of the sealing layer 50, and the fluidity of the separation layer 60 is lower than the fluidity of the encapsulation layer 40.

[0078] Here, the set temperature refers to the heating temperature required during the lamination process, and the specific value may be determined according to the specific process. For example, in some specific embodiments, the set temperature may be 140° C. or 155° C., etc.

[0079] Viscosity is a measure of a liquid's stickiness, a reflection of the frictional forces acting on it. Higher viscosity results in greater friction for the same flow rate gradient, meaning the material becomes more difficult to flow. Viscosity testing methods include flow curve testing, viscoelasticity testing, cure testing, and viscosity-temperature testing.

[0080] By making the viscosity of the encapsulation layer 40 lower than that of the sealing layer 50 , the encapsulation layer 40 has better fluidity and is easier to flow to fill gaps during the lamination process, reducing bubbles, achieving a more stable fixation effect for the photovoltaic cell 30 and improving the appearance and reliability of the photovoltaic module 100.

[0081] By making the viscosity of the separator layer 60 greater than that of the encapsulation layer 40, the separator layer 60 has a lower viscosity than the encapsulation layer 40. Therefore, during the lamination process, when the encapsulation layer 40 flows toward the separator layer 60, the separator layer 60 is less likely to deform, thereby reducing the interference of the deformation of the separator layer 60 on the sealing layer 50. Furthermore, compared with the encapsulation layer 40, the separator layer 60 is less likely to flow toward the sealing layer 50 and cause the sealing layer 50 to penetrate, thereby effectively alleviating the problem of the sealing layer 50 having a small actual water-blocking dimension.

[0082] In some embodiments, at a set temperature, the viscosity of the separation layer 60 is greater than the viscosity of the sealing layer 50. In other words, at a set temperature, the fluidity of the separation layer 60 is less than the fluidity of the sealing layer 50.

[0083] Therefore, during the lamination process, the separation layer 60 is less likely to flow toward the sealing layer 50 under pressure, thereby further reducing the risk of the separation layer 60 overflowing and causing the sealing layer 50 to penetrate the glue, and better improving the effective water-blocking size of the sealing layer 50.

[0084] In the embodiment of the present application, the difference in viscosity among the encapsulation layer 40 , the separation layer 60 , and the sealing layer 50 can be achieved by selecting different types of materials.

[0085] In some embodiments, the material of the encapsulation layer 40 includes EVA, etc. EVA has the advantages of low melting point, good fluidity, high transparency, and mature lamination process, which is conducive to improving the fixing reliability and light transmission effect of the photovoltaic cell 30 and improving the lamination efficiency.

[0086] In some embodiments, the material of the sealing layer 50 may include at least one of butyl rubber, butyl tape, and POE (a polyolefin material with a relatively high melting point, a copolymer of ethylene and octene). In other words, the sealing layer 50 may be made of one or a combination of butyl rubber, butyl tape, and POE.

[0087] Butyl rubber offers excellent airtightness, low cost, and resistance to heat, ozone, aging, and chemicals. It also provides excellent shock absorption and electrical insulation. Sealing the gap between the first and second substrates 10 and 20 with butyl rubber effectively blocks moisture, improving the stability of the encapsulation layer 40 and the power stability of the photovoltaic cell 30.

[0088] Butyl tape is a tape of a certain width and thickness with a relatively regular shape. Using this tape between the first substrate 10 and the second substrate 20 not only allows for more accurate positioning and easier placement of the sealing layer 50, but also facilitates the placement of the separator layer 60 adjacent to the sealing layer 50. For example, the separator layer 60 can be pre-placed on the inner side of the butyl tape, and then the butyl tape with the separator layer 60 can be laid between the first substrate 10 and the second substrate 20, simplifying the placement of the separator layer 60.

[0089] Among them, POE is a polyolefin material with a high melting point, low fluidity, good waterproofness, high transparency, and beneficial resistance to heat, itching and aging.

[0090] In some embodiments, the material of the separator 60 may include at least one of PP (polypropylene, or PETP), PET (polyethylene terephthalate), and POE. In other words, the separator 60 may be made of one or a combination of PP, PET, and POE.

[0091] PP is a semi-crystalline thermoplastic with very low or even no fluidity, providing a better barrier effect against the encapsulation layer 40 and allowing for easy pre-positioning between the encapsulation layer 40 and the sealing layer 50 prior to lamination. PP also has high impact resistance, mechanical toughness, resistance to various organic solvents, acids, and bases, and offers excellent molding properties. For example, it can be easily processed to form a grooved separator layer 60, thereby providing a space for the encapsulation layer 40 to overflow, effectively reducing the risk of overflow from the encapsulation layer 40 to the sealing layer 50.

[0092] PET plastic has very low or even no fluidity, providing a better barrier effect on the encapsulation layer 40 and facilitating pre-positioning between the encapsulation layer 40 and the sealing layer 50 prior to lamination. Furthermore, PET has high film-forming and moldability, making it easy to process into a separator layer 60 of suitable size and shape, meeting separation requirements while facilitating pre-fixation of the separator layer 60.

[0093] By adopting the above materials, the separation layer 60 can have lower fluidity, which can not only effectively slow down the flow of the packaging layer 40 toward the sealing layer 50 and reduce the occurrence of glue penetration, but also effectively reduce the flow of the separation layer 60 toward the sealing layer 50, further reducing the occurrence of glue penetration.

[0094] For example, in some embodiments, encapsulation layer 40 is made of EVA, sealing layer 50 is made of butyl rubber, and separator layer 60 is a barrier film made of PP or PET. The barrier film is placed between the butyl rubber and the EVA to prevent the EVA from penetrating the butyl rubber. The barrier film can be placed on the side of the butyl rubber closest to the EVA film after the butyl rubber is laid. Alternatively, butyl tape can be used, with the barrier film placed inside the butyl tape, and the butyl tape with the barrier film directly laid.

[0095] For example, in some embodiments, encapsulation layer 40 is made of EVA, sealing layer 50 is made of butyl rubber, and separator layer 60 is a low-flow film. The low-flow film can be a polyolefin material with a relatively high melting point, such as POE. A small strip of low-flow film is placed between the EVA and butyl rubber. During the lamination process, the low-flow film is less likely to flow into the butyl rubber and also inhibits the flow of EVA into the butyl rubber, reducing the risk of glue penetration.

[0096] According to some embodiments of the present application, as shown in Figures 5, 10, and 11, the spacer layer 60 is a single layer, and both ends of the spacer layer 60 along the first direction F1 are in contact with the first substrate 10 and the second substrate 20. For example, as shown in Figure 5, the upper end of the spacer layer 60 is in contact with the first substrate 10, and the lower end of the spacer layer 60 is in contact with the second substrate 20.

[0097] Here, contact cooperation should be understood in a broad sense. For example, the cooperation between the separation layer 60 and the first substrate 10 can be direct contact or adhesive bonding, which are all within the protection scope of the present application. It is only necessary to ensure that there is no gap between the separation layer 60 and the first substrate 10.

[0098] It should be noted that the contact and cooperation between the separator layer 60 and the first substrate 10 refers to the contact and cooperation between the separator layer 60 and the first substrate 10 after manufacturing is completed, that is, after the lamination process. Before or during the lamination process, the separator layer 60 and the first substrate 10 may be in contact and cooperate, or they may be separated by a predetermined gap. The contact and cooperation between the separator layer 60 and the second substrate 20 is similar and will not be further described here.

[0099] In addition, it should be noted that the separation layer 60 may extend in a straight line along the first direction F1 as shown in FIG. 5 , FIG. 10 and FIG. 11 , or may extend in an arc shape along the first direction F1 , both of which are within the protection scope of the present application.

[0100] By having the two ends of the separation layer 60 contact and cooperate with the first substrate 10 and the second substrate 20 respectively, at least during the cross-linking process of the encapsulation layer 40 (that is, after the first substrate 10 and the second substrate 20 move relative to each other to be laminated into place), the separation layer 60 can completely separate the encapsulation layer 40 from the sealing layer 50, and prevent the encapsulation layer 40 from flowing from the gap between the separation layer 60 and the first substrate 10 or the second substrate 20 to the sealing layer 50.

[0101] According to some embodiments of the present application, as shown in Figures 7 and 8, the spacer layer 60 is multi-layered, and the multi-layer spacer layers 60 are arranged along the second direction F2. At least one spacer layer 60 contacts and cooperates with the first substrate 10 at one end along the first direction F1, and at least one spacer layer 60 contacts and cooperates with the second substrate 20 at one end along the first direction F1.

[0102] The multiple separator layers 60 can cooperate with each other to increase the area of ​​the encapsulation layer 40 blocked in the first direction F1 during the lamination process. For example, the multiple separator layers 60 can be partially staggered along the first direction F1 so that the overall extension of the multiple separator layers 60 along the first direction F1 is greater than the extension of a single separator layer 60, thereby improving the anti-penetration effect. At least one separator layer 60 contacts and cooperates with the first substrate 10 to prevent the encapsulation layer 40 from flowing through the gap between the separator layer 60 and the first substrate 10 to the sealing layer 50. At least one separator layer 60 contacts and cooperates with the second substrate 20 to prevent the encapsulation layer 40 from flowing through the gap between the separator layer 60 and the second substrate 20 to the sealing layer 50.

[0103] Moreover, the partially staggered separation layers 60 can also move relative to each other as the distance between the first substrate 10 and the second substrate 20 decreases during the lamination process, thereby reducing the overall extension size of the multi-layer separation layer 60 along the first direction F1 to avoid hard contact between the separation layer 60 and the first substrate 10 and the second substrate 20, thereby reducing the obstruction of the separation layer 60 to lamination.

[0104] In some specific embodiments, the orthographic projection of the multi-layer spacer layer 60 along the second direction F2 on the same projection plane coincides with the orthographic projection of the sealing layer 50 along the second direction F2 on the same projection plane. In other words, the multi-layer spacer layer 60 completely covers the gap between the first substrate 10 and the second substrate 20. For example, in an embodiment where the spacer layer 60 comprises two layers, the spacer layer 60 in contact with the first substrate 10 and the spacer layer 60 in contact with the second substrate 20 are arranged in an intersecting manner, so that the two spacer layers 60 completely separate the encapsulation layer 40 and the sealing layer 50, and the encapsulation layer 40 is unlikely to flow from the gap between the two spacer layers 60 into the sealing layer 50.

[0105] In the embodiment of the present application, the arrangement position and size of the encapsulation layer 40 can be flexibly set as needed.

[0106] In some embodiments of the present application, as shown in FIG4 , an encapsulation layer 40 encapsulates and secures the photovoltaic cell 30. Encapsulation herein means that the encapsulation layer 40 completely wraps around all surfaces of the photovoltaic cell 30, isolating the photovoltaic cell 30 from the outside of the encapsulation layer 40. The encapsulation layer 40 effectively secures the photovoltaic cell 30, ensuring that the relative positions of the multiple photoelectric conversion components 31 of the photovoltaic cell 30 are stable and the connection structure is secure. Furthermore, the encapsulation layer 40 can better isolate the photovoltaic cell 30 from external moisture.

[0107] According to some embodiments of the present application, as shown in Figures 4 and 5 , along the first direction F1, the encapsulation layer 40, the sealing layer 50, and the spacer layer 60 have equal dimensions. That is, ignoring process errors, in the first direction F1, the encapsulation layer 40 completely fills the gap between the first substrate 10 and the second substrate 20, and the sealing layer 50 completely fills the gap between the first substrate 10 and the second substrate 20. This allows the encapsulation layer 40 to more firmly secure the photovoltaic cell 30, and the combination of the encapsulation layer 40 and the sealing layer 50 can achieve a better seal for the photovoltaic cell 30, enhancing the water-blocking effect. The spacer layer 60 also completely fills the gap between the first substrate 10 and the second substrate 20 in the first direction F1, thereby more fully separating the encapsulation layer 40 and the sealing layer 50, and effectively preventing the encapsulation layer 40 from penetrating the sealing layer 50.

[0108] According to other embodiments of the present application, as shown in Figures 10 and 11 , along the first direction F1 , the size of the encapsulation layer 40 is H1, the size of the sealing layer 50 is H2, and the size of the separation layer 60 is H3, where H1<H2, H1≤H3≤H2.

[0109] In other words, along the first direction F1, the size of the encapsulation layer 40 is thinned so that the thickness of the encapsulation layer 40 is smaller than the thickness of the sealing layer 50. Then, during the lamination process, the degree of extrusion on the encapsulation layer 40 is small, thereby reducing the flow of the encapsulation layer 40 toward the sealing layer 50, thereby further improving the problem of glue penetration of the sealing layer 50.

[0110] Furthermore, in some embodiments where the encapsulation layer 40 is thinned, the required size of the spacer layer 60 along the first direction F1 can be appropriately reduced. For example, ignoring process errors, the size of the spacer layer 60 can be equal to the size of the encapsulation layer 40, or between the size of the encapsulation layer 40 and the size of the sealing layer 50. This allows for more space between the first substrate 10 and the second substrate 20 for arranging the encapsulation layer 40 and the sealing layer 50, thereby improving sealing. For example, the sealing layer 50 can fill the gap between the spacer layer 60 and the substrate (first substrate 10 or second substrate 20). Of course, the size of the spacer layer 60 along the first direction F1 can also be equal to the size of the sealing layer 50 along the first direction F1 to prevent the encapsulation layer 40 from expanding during the lamination process and causing it to overflow from the gap between the spacer layer 60 and the substrate.

[0111] It should be noted that in the embodiment where the encapsulation layer 40 is thinned, the encapsulation layer 40 can be connected to one of the first substrate 10 and the second substrate 20 and spaced apart from the other of the first substrate 10 and the second substrate 20 to facilitate fixing the photovoltaic cell 30 on one of the substrates.

[0112] In some embodiments, an air layer may be provided between the encapsulation layer 40 and the other of the first substrate 10 and the second substrate 20, as shown in FIG10 , to improve light transmittance. Here, the size of the encapsulation layer 40 along the first direction F1 may be half the distance between the first substrate 10 and the second substrate 20, as shown in FIG10 , or may be greater than half the distance between the first substrate 10 and the second substrate 20, or less than half the distance between the first substrate 10 and the second substrate 20. The encapsulation layer 40 may be located on one side of the photovoltaic cell 30 along the first direction F1, as shown in FIG10 , or may be located on both sides of the photovoltaic cell 30 along the first direction F1.

[0113] Alternatively, in other embodiments, as shown in FIG11 , the photovoltaic module 100 further includes an auxiliary adhesive layer 70. The auxiliary adhesive layer 70 is disposed between the encapsulation layer 40 and the second substrate 20. In other words, the auxiliary adhesive layer 70 and the encapsulation layer 40 are stacked and arranged between the first substrate 10 and the second substrate 20, with the first substrate 10, the encapsulation layer 40, the auxiliary adhesive layer 70, and the second substrate 20 being arranged in the order along the first direction F1.

[0114] In the above embodiment, the size of the encapsulation layer 40 along the first direction F1 is reduced to improve the problem of glue penetration. The auxiliary glue layer 70 cooperates with the encapsulation layer 40 to increase the amount of encapsulation glue applied to the photovoltaic cell 30, thereby improving the encapsulation reliability of the photovoltaic cell 30. Here, the encapsulation layer 40 and the auxiliary glue layer 70 can be located on either side of the photovoltaic cell 30 along the first direction F1, as shown in Figure 11, to facilitate separate laying during the manufacturing process and reduce operational difficulty. Of course, the photovoltaic cell 30 can also be in contact with only the encapsulation layer 40 and secured by the encapsulation layer 40.

[0115] Furthermore, by arranging the encapsulation layer 40 and the auxiliary adhesive layer 70 along the first direction F1, during application, the encapsulation layer 40 can be located on the light-facing side of the auxiliary adhesive layer 70. That is, the first substrate 10 serves as the light-facing substrate, and the second substrate 20 serves as the backlight panel. Light passes through the first substrate 10 and the encapsulation layer 40 and irradiates the photovoltaic cells 30. This allows for greater flexibility in the material selection for the auxiliary adhesive layer 70, with lower requirements for light transmittance. For example, materials for the auxiliary adhesive layer 70 include, but are not limited to, pre-crosslinked EVA, butyl rubber, POE, and the like.

[0116] In some specific embodiments, at a set temperature, the viscosity of the auxiliary adhesive layer 70 is greater than the viscosity of the encapsulation layer 40. In other words, at a set temperature, the fluidity of the auxiliary adhesive layer 70 is less than the fluidity of the encapsulation layer 40. For example, the encapsulation layer 40 may be made of EVA, and the auxiliary adhesive layer 70 may be made of butyl rubber, or the auxiliary adhesive layer 70 may be EVA that has been pre-crosslinked by irradiation with a UV lamp before lamination.

[0117] In the above embodiment, the low-flow auxiliary adhesive layer 70 itself is not easily flowed toward the sealing layer 50, thereby preventing the auxiliary adhesive layer 70 from overflowing toward the sealing layer 50 and causing adhesive penetration. The separation layer 60 may be partially located between the auxiliary adhesive layer 70 and the sealing layer 50 to provide a barrier to the auxiliary adhesive layer 70; the separation layer 60 may also be staggered with respect to the auxiliary adhesive layer 70 in the first direction F1, all of which are within the scope of protection of the present application.

[0118] According to some embodiments of the present application, at least one of the first substrate 10, the second substrate 20, and the spacer layer 60 has a groove on a side facing the encapsulation layer 40, and the encapsulation layer 40 is partially embedded in the groove. The groove is a slot with a single opening facing the encapsulation layer 40, so that the encapsulation layer 40 embedded in the groove does not penetrate the substrate or the spacer layer 60 in which the groove is located.

[0119] For example, the lower surface of the first substrate 10 is provided with an upwardly concave groove, which can provide an overflow space for the encapsulation layer 40. During the lamination process, the molten encapsulation layer 40 can flow and embed into the groove, thereby reducing the pressure of the encapsulation layer 40 toward the sealing layer 50, slowing down the flow of the encapsulation layer 40 toward the sealing layer 50, and reducing the occurrence of glue penetration. In addition, since the groove provides an overflow space, the size of the encapsulation layer 40 along the first direction F1 can be larger and less prone to glue penetration, thereby improving the packaging reliability of the photovoltaic cell 30. Based on the above description, the embodiment in which the grooves are provided in the second substrate 20 and the partition layer 60 is understandable to those skilled in the art and will not be repeated here.

[0120] This application does not impose any particular restrictions on the depth and shape of the grooves. Taking the grooves provided on the first substrate 10 as an example, the grooves may be multiple and arranged in an array perpendicular to the first direction F1 on the first substrate 10; alternatively, the grooves may be elongated strips extending perpendicular to the first direction F1; or alternatively, the grooves may be mesh-shaped grooves, etc. These can increase the distribution area and uniformity of the grooves on the first substrate 10, thereby improving the uniformity of the flow of the encapsulation layer 40 into the grooves from different regions during the lamination process and preventing excessive local pressure on the encapsulation layer 40 from causing glue penetration.

[0121] According to some embodiments of the present application, the separation layer 60 has a porous structure. The porous structure means that the separation layer 60 has holes inside, for example, the holes can form a three-dimensional network channel.

[0122] The holes can provide overflow space for the encapsulation layer 40. During the lamination process, the molten encapsulation layer 40 can flow into the holes, thereby reducing the pressure of the encapsulation layer 40 toward the sealing layer 50 and reducing the occurrence of glue penetration. In addition, the holes can slow down the flow of the encapsulation layer 40 to a certain extent, thereby preventing the encapsulation layer 40 from passing through the separation layer 60 and flowing into the sealing layer 50, thereby reducing glue penetration.

[0123] In some embodiments of the present application, as shown in FIG. 5 , along the second direction F2 , the size of the sealing layer 50 is 8 to 12 mm, that is, 8 mm ≤ L1 ≤ 12 mm.

[0124] The size of the sealing layer 50 along the second direction F2 refers to the direction passing through the measurement position, perpendicular to the first direction F1 and away from the encapsulation layer 40. For example, as shown in Figure 3, the sealing layer 50 includes a first part located on the left side of the encapsulation layer 40, a second part on the right side, a third part on the front side and a fourth part on the rear side. The size of the first part and the second part along the second direction F2 refers to the size along the left-right direction, and the size of the third part and the fourth part along the second direction F2 refers to the size along the front-back direction.

[0125] If the sealing layer 50's dimensions along the second direction F2 are too small, the water-blocking capacity will be too small, weakening its water-blocking capability. If the sealing layer 50's dimensions along the second direction F2 are too large, it will occupy the space for the encapsulation layer 40 and the photovoltaic cells 30, reducing space utilization. Within the aforementioned range, however, the water-blocking effect is improved, further enhancing the photovoltaic module 100's water vapor resistance. Furthermore, the photovoltaic module 100 can provide more space for the photovoltaic cells 30, thereby increasing power generation. For example, in some specific embodiments, the sealing layer 50's dimensions along the second direction F2 may be 8 mm, 9 mm, 10 mm, 11 mm, or 12 mm, among others.

[0126] It should be noted that the sizes of the sealing layer 50 in different regions along the second direction F2 may be equal or different, as long as they are within the above value range.

[0127] In some embodiments of the present application, as shown in FIG. 5 , along the second direction F2 , the size of the separation layer 60 is 0.1-0.5 mm, that is, 0.1 mm≤L2≤0.5 mm.

[0128] If the separator layer 60 is too small along the second direction F2, it will be too thin and prone to deformation, thereby reducing its barrier effect on the encapsulation layer 40. If the separator layer 60 is too large along the second direction F2, it will occupy too much space, which is not conducive to improving space utilization. It will also increase the distance between the encapsulation layer 40 and the sealing layer 50 in the second direction F2, resulting in a layered effect. In addition, in embodiments where the separator layer 60 is made of PP or PET, there is no connection between the separator layer 60 and the first substrate 10 and the second substrate 20. Excessive size of the separator layer 60 in the second direction F2 will affect the connection reliability.

[0129] Within the above value range, the spacer layer 60 has a good barrier effect on the encapsulation layer 40, effectively improves the glue penetration of the sealing layer 50, and is unlikely to form delamination between the encapsulation layer 40 and the sealing layer 50, which helps to ensure the reliability of the connection between the first substrate 10 and the second substrate 20. For example, in some specific embodiments, the dimension of the spacer layer 60 along the second direction F2 can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, etc.

[0130] The photovoltaic system according to the embodiment of the present application includes a support assembly and a photovoltaic assembly 100 according to the embodiment of the present application, and the photovoltaic assembly 100 is mounted on the support assembly. Since the photovoltaic assembly 100 according to the embodiment of the present application has the above-mentioned beneficial technical effects, the photovoltaic system according to the embodiment of the present application, by providing a separation layer 60 between the encapsulation layer 40 and the sealing layer 50, can slow down or prevent the flow of the molten encapsulation layer 40 toward the sealing layer 50 during the lamination process, thereby improving the problem of the encapsulation layer 40 overflowing and causing the sealing layer 50 to penetrate the glue, which is beneficial to increasing the actual water-blocking size of the sealing layer 50, improving the water vapor resistance and service life of the photovoltaic assembly 100, and facilitating the omission of the glue penetration monitoring process, thereby improving production efficiency and production quality.

[0131] In addition, in the above embodiment, by installing the photovoltaic assembly 100 on the bracket assembly, on the one hand, the structural strength and impact and deformation resistance of the photovoltaic assembly 100 can be improved; on the other hand, it is convenient to install the photovoltaic system in the application environment.

[0132] For example, in an embodiment where the photovoltaic system is used on a building roof, the bracket assembly can be used to secure the photovoltaic assembly 100 to the building roof; in an embodiment where the photovoltaic system is used in a solar street light, the bracket assembly can be used to mount the photovoltaic assembly 100 on the street light pole. Furthermore, the bracket assembly can be used to adjust the tilt angle of the photovoltaic assembly 100 to maximize the time and area of ​​sunlight exposure each day, thereby improving solar energy conversion efficiency.

[0133] The specific structure of the bracket assembly is not limited. For example, the bracket assembly may include a frame having a slot that plugs into the edge of the photovoltaic module 100. Inserting the edge of the photovoltaic module 100 into the slot not only secures the module, but also shields the sealing layer 50 through the frame, thereby reducing the risk of external liquids such as rainwater flowing into the sealing layer 50 and further improving the photovoltaic module's resistance to water vapor. Furthermore, the frame can also clamp and secure the edge of the photovoltaic module 100, preventing deformation that could cause cracking in the sealing layer 50.

[0134] For another example, the bracket assembly may include a frame composed of a rod, a plate, or a combination of a rod and a plate. The photovoltaic component 100 is installed on the frame. The bracket assembly has high structural strength and good stability, and it is easy to adjust the tilt angle of the photovoltaic component 100.

[0135] In other embodiments, structural members of a building can be used as support components. For example, roof support beams can be used as support components to support photovoltaic modules 100. This ensures that the inclination direction of photovoltaic modules 100 is roughly the same as the inclination direction of the roof, and the inclination angle of photovoltaic modules 100 is also roughly the same as the inclination angle of the roof. This not only helps increase the area exposed to sunlight, but also helps to simplify and clean the structure of the building roof, improving the visual effect. Of course, depending on actual needs, photovoltaic modules 100 can also be used as at least a portion of the roof to reduce building components and reduce costs.

[0136] In some embodiments, a photovoltaic system may include one or more photovoltaic assemblies 100 , and multiple photovoltaic assemblies 100 may be spliced ​​together through a bracket assembly to form a photovoltaic array.

[0137] In some embodiments, the photovoltaic system may also include a combiner box and an inverter. The photovoltaic array is connected to the combiner box, which can combine the current generated by the photovoltaic array. The combined current flows through the inverter and is converted into the alternating current required by the mains power grid and then connected to the mains power network to achieve solar power supply.

[0138] The following describes a method for manufacturing a photovoltaic module according to an embodiment of the present application in conjunction with the accompanying drawings. The photovoltaic module 100 according to the embodiment of the present application can be manufactured using the method for manufacturing a photovoltaic module according to the embodiment of the present application, or can be manufactured using other manufacturing methods. The method for manufacturing a photovoltaic module according to the embodiment of the present application can be used to manufacture the photovoltaic module 100 according to the embodiment of the present application, or can be used to manufacture other photovoltaic modules. The following describes the method for manufacturing a photovoltaic module according to the present application using the method for manufacturing the photovoltaic module 100 according to the present application as an example.

[0139] As shown in FIG3 to FIG12 , the manufacturing method of the photovoltaic module 100 according to the embodiment of the present application includes:

[0140] S1: providing a first substrate 10, a second substrate 20, a photovoltaic cell 30, an encapsulation material 40a, a sealing material 50a and a separation material 60a.

[0141] One of the first substrate 10 and the second substrate 20 may be a light-transmitting substrate, and the other may be a backlight panel. The light-transmitting substrate may be made of a fully transparent or semi-transparent material. The photovoltaic cell 30 may include one or more photoelectric conversion components 31 electrically connected to each other.

[0142] The encapsulating material 40a, the sealing material 50a, and the separator 60a can be in a colloid or solid form. For example, the encapsulating material 40a can be a rectangular sheet-like solid structure, which is convenient for placement between the first substrate 10 and the second substrate 20 and can be melted during the lamination process. The sealing material 50a can be a colloid or adhesive tape, which facilitates pre-fixation with the first substrate 10, the second substrate 20, and the separator 60a, thereby preventing misalignment during the lamination process. The separator 60a can be a solid material such as PP or PET, or a POE thermoplastic elastomer.

[0143] S2: The photovoltaic cell 30, the packaging material 40a, the sealing material 50a and the separator 60a are arranged between the first substrate 10 and the second substrate 20, and the sealing material 50a is located outside the packaging material 40a along the second direction F2 and arranged around the packaging material 40a, and the separator 60a is located between the packaging material 40a and the sealing material 50a.

[0144] It is worth noting that "the photovoltaic cell 30, the packaging material 40a, the sealing material 50a and the separator 60a are arranged between the first substrate 10 and the second substrate 20" does not limit the order of assembly of the various parts. For example, during assembly, the photovoltaic cell 30, the packaging material 40a, the sealing material 50a and the separator 60a can be laid on the upper side of the second substrate 20 first, and then the first substrate 10 can be laid on the upper side of the whole; the photovoltaic cell 30, the packaging material 40a, the sealing material 50a and the separator 60a can be laid on the upper side of the first substrate 10 first, and then the second substrate 20 can be laid on the upper side of the whole; or part of the photovoltaic cell 30, the packaging material 40a, the sealing material 50a and the separator 60a can be laid on the first substrate 10, and the other part can be laid on the second substrate 2 0, and then stack the two parts along the first direction F1; the first substrate 10 and the second substrate 20 can also be arranged apart along the first direction F1, and then the photovoltaic cell 30, the packaging material 40a, the sealing material 50a and the separator material 60a are laid between the first substrate 10 and the second substrate 20, and so on. This is all within the scope of protection of the present application. It only needs to meet the requirement that after the laying of each part is completed, the sealing material 50a is located outside the packaging material 40a along the second direction F2 and is arranged around the packaging material 40a, and the separator material 60a is located between the packaging material 40a and the sealing material 50a.

[0145] The packaging material 40a can be arranged on one side of the photovoltaic cell 30 close to the first substrate 10 along the first direction F1, or on one side of the photovoltaic cell 30 close to the second substrate 20 along the first direction F1, or on both sides of the photovoltaic cell 30 along the first direction F1.

[0146] The second direction F2 is perpendicular to the arrangement of the first substrate 10 and the second substrate 20. For example, as shown in Figures 3 and 4 , the first direction F1 is the up-down direction, and the second direction F2 is the inward-outward direction perpendicular to the up-down direction, including but not limited to the front-back direction and the left-right direction. The inward-outward direction refers to the direction toward and away from the center of the encapsulation material 40a.

[0147] By adopting the above-mentioned arrangement of the sealing material 50a, the packaging material 40a and the separator material 60a, the relative positions of the three materials are fixed during the lamination process. The separator material 60a can separate the packaging material 40a to prevent the packaging material 40a from melting and flowing toward the sealing material 50a during the lamination process, causing glue penetration.

[0148] S3: Perform lamination processing to bond the photovoltaic cell 30, packaging material 40a, sealing material 50a, separator material 60a, first substrate 10 and second substrate 20 together, so that the packaging material 40a forms a packaging layer 40 and fixes the photovoltaic cell 30, the sealing material 50a forms a sealing layer 50 and is sealed between the first substrate 10 and the second substrate 20, and the separator material 60a forms a separator layer 60.

[0149] The lamination process may include heating to a set temperature to melt the meltable materials in the encapsulating material 40a, the sealing material 50a, and the separator material 60a; applying pressure along a first direction F1 to the first substrate 10 and the second substrate 20 to reduce the distance between the first substrate 10 and the second substrate 20 and squeeze the materials between the first substrate 10 and the second substrate 20, so that the gap between the first substrate 10 and the second substrate 20 is gradually filled with the sealing material 50a and the encapsulating material 40a; and gradually increasing the crosslinking degree of each material, thereby bonding the photovoltaic cell 30, the encapsulating material 40a, the sealing material 50a, the separator material 60a, the first substrate 10 and the second substrate 20 together. After the lamination process is completed, the encapsulating material 40a forms the encapsulating layer 40, the sealing material 50a forms the sealing layer 50, and the separator material 60a forms the separator layer 60.

[0150] During the above-mentioned lamination process, the separator material 60a can separate the packaging material 40a from the sealing material 50a by the outer periphery of the packaging material 40a. When the packaging material 40a melts and has a flow tendency under the extrusion of the first substrate 10 and the second substrate 20, the separator material 60a plays a blocking role on the packaging material 40a to prevent the packaging material 40a from flowing toward the sealing material 50a. The packaging material 40a is not easy to flow into the interior of the sealing material 50a and cause glue penetration, which is beneficial to increase the size of the final sealing layer 50 that actually has a water-blocking effect along the second direction F2, thereby improving the water vapor resistance of the photovoltaic module 100.

[0151] Furthermore, due to the barrier effect of the separator 60a, even when a large amount of encapsulating material 40a is used, penetration is less likely to occur. This helps reduce the distance between the encapsulating material 40a and the separator 60a in the second direction F2, thereby reducing the generation of bubbles and improving structural reliability and appearance. Reducing the risk of penetration also helps eliminate the penetration monitoring step during the production process, improves the production yield of the photovoltaic module 100, and enhances product quality and long-term reliability.

[0152] In some embodiments, the lamination process may further include vacuuming to extract air from the photovoltaic assembly 100 , thereby reducing the generation of bubbles, improving the bonding reliability of each part, and improving the filling uniformity of the packaging material 40 a , the separator material 60 a , and the sealing material 50 a .

[0153] According to the manufacturing method of the photovoltaic module 100 of the embodiment of the present application, by arranging a separator material 60a between the packaging material 40a and the sealing material 50a, the flow of the molten packaging material 40a to the sealing material 50a during the lamination process can be slowed down or avoided, thereby improving the problem of the packaging material 40a overflowing and causing the sealing layer 50 to penetrate the glue, which is beneficial to improving the actual water-blocking size of the sealing layer 50, improving the water vapor resistance and service life of the photovoltaic module 100, and helping to eliminate the glue penetration monitoring process and improve production efficiency and production quality.

[0154] According to some embodiments of the present application, as shown in Figures 6 and 9, before the lamination process, the size of the sealing material 50a along the first direction F1 is larger than the size of the packaging material 40a along the first direction F1, and the size of the separating material 60a along the first direction F1 is greater than or equal to the size of the packaging material 40a along the first direction F1.

[0155] In other words, the size of the sealing material 50a along the first direction F1 before the lamination process is larger, so that during the lamination process, the first substrate 10 and the second substrate 20 first squeeze the sealing material 50a and then squeeze the packaging material 40a, which is beneficial to reduce the pressure exerted by the packaging material 40a on the separation material 60a and the sealing material 50a, thereby reducing the occurrence of glue penetration.

[0156] Here, the size of the encapsulation layer 40 obtained after the lamination process along the first direction F1 can be equal to the distance between the first substrate 10 and the second substrate 20 as shown in Figures 5 and 7-8, so as to improve the fixation reliability of the photovoltaic cell 30; it can also be smaller than the distance between the first substrate 10 and the second substrate 20 as shown in Figures 10 and 11, so as to further reduce the risk of glue penetration.

[0157] In addition, the size of the separation material 60a along the first direction F1 is greater than or equal to the size of the packaging material 40a along the first direction F1, so that the separation material 60a can cover the packaging material 40a in a larger range and better prevent the packaging material 40a from flowing toward the sealing material 50a.

[0158] Here, the separation layer 60 obtained after the lamination process can have a size along the first direction F1 that is less than or equal to the distance between the first substrate 10 and the second substrate 20. In the embodiment where the size is equal to the distance between the first substrate 10 and the second substrate 20, the separation layer 60 can extend in a straight line along the first direction F1 as shown in Figure 5, or it can extend in a certain arc. For example, the separation material 60a can be formed by bending to a certain extent under the extrusion of the first substrate 10 and the second substrate 20 to form the separation material 60a.

[0159] In some embodiments, as shown in FIG. 6 , before the lamination process, a dimension of the separation material 60 a along the first direction F1 is smaller than a dimension of the sealing material 50 a along the first direction F1 .

[0160] The size of the separation material 60a along the first direction F1 is relatively small, which can reduce the resistance of the separation material 60a to the first substrate 10 and the second substrate 20 in the first direction F1, avoid the formation of hard contact, and ensure smooth lamination; and can also reduce the deformation of the separation material 60a under the extrusion of the first substrate 10 and the second substrate 20, thereby reducing the pressure on the sealing material 50a, so as to further reduce the occurrence of glue penetration.

[0161] It should also be noted that since the two sides of the packaging material 40a are bonded to the first substrate 10 and the second substrate 20, the position where glue penetration is easy usually occurs in the middle of the packaging material 40a along the first direction F1. Therefore, even if the size of the separation material 60a along the first direction F1 is relatively small, it can still have a good anti-glue penetration effect.

[0162] In addition, in an embodiment where the partition material 60a is in contact with the backlight panel and separated from the translucent substrate, even if a small amount of packaging material 40a flows over the partition material 60a toward the sealing material 50a, the flow path of the packaging material 40a can be changed by setting the partition material 60a, so that the glue penetration position occurs in an area close to the translucent substrate, which makes it easy to monitor whether glue penetration occurs through the translucent substrate and reduces the difficulty of monitoring.

[0163] In the embodiments of the present application, the separator material 60a may be provided in one or more layers. In some embodiments in which multiple layers of separator material 60a are provided, as shown in FIG9 , before lamination, the multiple layers of separator material 60a may be stacked in the second direction F2 and intersecting in the first direction F1, with the spacing between the ends of the multiple layers of separator material 60a in the first direction F1 being equal to the dimension of the sealing material 50a in the first direction F1.

[0164] The cross-arrangement of multiple layers of separator materials 60a along the first direction F1 means that the multiple layers of separator materials 60a are partially staggered and partially unstaggered in the first direction F1. For example, as shown in FIG9 , in a two-layer separator material 60a, the upper portion of the inner separator material 60a is staggered with the lower portion of the outer separator material 60a in the first direction F1, while the lower portion of the inner separator material 60a is not staggered with the upper portion of the outer separator material 60a in the first direction F1, so that the two layers of separator materials 60a form a cross-arrangement structure. For another example, in a three-layer separator material 60a, in the first direction F1, the lower portion of the inner separator material 60a is not staggered with the upper portion of the middle separator material 60a, and the lower portion of the middle separator material 60a is not staggered with the upper portion of the outer separator material 60a. The upper portion of the inner separator material 60a, the middle portion of the middle separator material 60a, and the lower portion of the outer separator material 60a are all staggered relative to the other portions. The cross arrangement enables the multiple layers of separation material 60a to continuously block the packaging material 40a in the first direction F1, so that the packaging material 40a is not likely to flow from the gap between two adjacent layers of separation material 60a to the sealing material 50a.

[0165] The spacing between the ends of the multilayer separator material 60a along the first direction F1 refers to the maximum span of the multilayer separator material 60a as a whole along the first direction F1, for example, the spacing between the upper end of the inner separator material 60a and the lower end of the outer separator material 60a along the first direction F1 as shown in Figure 9. The spacing between the ends of the multilayer separator material 60a along the first direction F1 is equal to the size of the sealing material 50a along the first direction F1, allowing both ends of the multilayer separator material 60a to contact the first substrate 10 and the second substrate 20, respectively. This prevents the encapsulation material 40a from flowing from the gap between the separator material 60a and the substrates to the sealing material 50a.

[0166] Furthermore, the multiple layers of separator material 60a are stacked along the second direction F2, making it less likely that the layers of separator material 60a will interfere with each other's movement in the first direction F1. When the first substrate 10 and the second substrate 20 are pressing the multiple layers of separator material 60a, adjacent layers of separator material 60a can move relative to each other along the first direction F1, reducing the overall span of the multiple layers of separator material 60a along the first direction F1 and preventing hard contact with the first and second substrates 10, 20 that could hinder lamination. Furthermore, the relative movement of adjacent separator materials 60a reduces deformation of the separator material 60a, making it less likely that the separator material 60a will bend or flow toward the sealing material 50a, further reducing the risk of penetration of the sealing material 50a.

[0167] It can be understood that after lamination is completed, the multi-layer separation material 60a can be completely offset along the first direction F1 as shown in Figure 7, so that the two ends of each layer of separation material 60a are in contact with the first substrate 10 and the second substrate 20 respectively, so as to improve the blocking effect on the packaging material 40a; or there can still be a small amount of offset along the first direction F1 as shown in Figure 8, so as to better reduce hard contact and reduce the deformation of the separation material 60a.

[0168] In some specific embodiments, as shown in FIG9 , before the lamination process, the separation material 60 a is composed of two layers, wherein one layer of the separation material 60 a contacts and cooperates with the first substrate 10 at one end along the first direction F1 and is spaced apart from the second substrate 20 at the other end, and the other layer of the separation material 60 a contacts and contacts the second substrate 20 at one end along the first direction F1 and is spaced apart from the first substrate 10 at the other end, and the two layers of the separation material 60 a partially intersect along the first direction F1.

[0169] In the above embodiment, the two layers of separator material 60a can block the encapsulating material 40a throughout the gap between the first substrate 10 and the second substrate 20, preventing the encapsulating material 40a from flowing outward from between the separator material 60a and the substrates, or from the gaps between adjacent separator materials 60a. This effectively reduces the risk of sealant 50a penetrating the sealant. Furthermore, the two layers of separator material 60a can move relative to each other in the first direction F1, reducing resistance to the first substrate 10 and the second substrate 20 while also minimizing deformation of the separator material 60a along the second direction F2, further enhancing the effectiveness of preventing penetrating the sealant.

[0170] In order to reduce or avoid dislocation of the separation material 60a during the lamination process, the separation material 60a may be pre-fixed before the lamination process.

[0171] In some embodiments, before lamination, the separator material 60a is pre-fixed to the first substrate 10 or the second substrate 20, for example, to the backlight panel, by adhesive. This allows the separator material 60a to be fixed by the first substrate 10 or the second substrate 20 and is not likely to move and affect the effect of blocking the encapsulation material 40a.

[0172] Among them, in the embodiment where the separating material 60a is an isolation film such as PP, PET, etc., the separating material 60a can be pre-fixed to the first substrate 10 or the second substrate 20 by additional adhesive; in the embodiment where the separating material 60a is a colloid, the separating material 60a can be pre-fixed to the first substrate 10 or the second substrate 20 by its own adhesion.

[0173] In other embodiments, before lamination, a separator material 60a is adhered to the side of the sealing material 50a facing the encapsulating material 40a. This allows the separator material 60a to be pre-fixed by the sealing material 50a, making it less likely to misalign and reduce its barrier effect on the encapsulating material 40a. It also reduces the likelihood of gaps forming between the separator material 60a and the sealing material 50a, which could lead to air bubbles. The sealing material 50a can also be used to adjust the placement of the separator material 60a along the first direction F1. The separator material 60a and the sealing material 50a can be directly adhered to each other, leveraging the adhesive properties of the sealing material 50a or the separator material 60a for pre-fixation. Alternatively, pre-fixation can be achieved using an additional adhesive.

[0174] For example, in an embodiment where the separator material 60a is a single layer, as shown in FIG6 , the separator material 60a can be attached to the inner side surface of the sealing material 50a, and the separator material 60a can be in contact with the second substrate 20. For another example, in an embodiment where the separator material 60a is a multilayered layer, as shown in FIG9 , the multilayered separator material 60a can be arranged crosswise along the first direction F1 and attached to different areas of the inner side surface of the sealing material 50a along the first direction F1, thereby pre-fixing the multilayered separator material 60a in the first direction F1 and the second direction F2. It should be noted that FIG9 is only a schematic diagram of the arrangement of two layers of separator material 60a. In practice, the inner separator material 60a can be pre-fixed to the sealing material 50a by attaching it through the gap between the outer separator material 60a and the first substrate 10.

[0175] In an embodiment of the present application, the size of the encapsulation layer 40 along the first direction F1 in the final product photovoltaic module 100 can be controlled by controlling the lamination movement distance, which is the relative movement distance between the first substrate 10 and the second substrate 20 from the initial position where the first substrate 10 and the second substrate 20 are initially in contact with both sides of the sealing material 50a to the final position where the lamination is completed.

[0176] 6 , before lamination, the encapsulation material 40a is placed in contact with the second substrate 20. During lamination, the relative movement distance between the first substrate 10 and the second substrate 20 is greater than or equal to the distance between the encapsulation material 40a and the first substrate 10.

[0177] Thus, during the lamination process, the first and second substrates 10, 20 move relative to each other for a certain distance along the first direction F1, simultaneously contacting both sides of the encapsulation material 40a. Continued relative movement compresses the encapsulation material 40a, gradually filling the gap between the first and second substrates 10, 20 and reducing the generation of bubbles. As shown in Figures 4 and 5, the encapsulation layer 40 is formed, with both sides connected to the first and second substrates 10, 20, respectively. This results in a more reliable overall bond for the photovoltaic module 100, and a more secure encapsulation and fixation of the photovoltaic cells 30 by the encapsulation layer 40.

[0178] In other embodiments, the encapsulation layer 40 is placed in contact with the second substrate 20 , and during the lamination process, the relative movement distance between the first substrate 10 and the second substrate 20 is smaller than the distance between the encapsulation material 40 a and the first substrate 10 .

[0179] Thus, as shown in FIG10 , the formed encapsulation layer 40 is bonded to the second substrate 20 and is separated from the first substrate 10 by a predetermined gap to reduce the pressure on the encapsulation material 40a during the lamination process, thereby slowing down the pressure of the encapsulation material 40a on the sealing material 50a, making it difficult for the encapsulation material 40a to flow toward the sealing material 50a, and thus achieving a better anti-penetration effect.

[0180] In some other embodiments, as shown in FIG11 , before lamination, an encapsulation material 40a is disposed between the photovoltaic cell 30 and the first substrate 10. An auxiliary adhesive is disposed between the photovoltaic cell 30 and the second substrate 20, so that after lamination, the auxiliary adhesive forms an auxiliary adhesive layer 70 bonded to the encapsulation layer 40.

[0181] In the above embodiment, the required encapsulation material 40a is relatively small in the first direction F1, which helps to alleviate the problem of glue penetration. Furthermore, the gap between the photovoltaic cell 30 and the second substrate 20 is filled with auxiliary glue, and the photovoltaic cell 30 and the second substrate 20 are bonded together by the formed auxiliary glue layer 70, thereby improving the encapsulation reliability of the photovoltaic cell 30. The encapsulation material 40a and the auxiliary glue are laid on both sides of the photovoltaic cell 30 and can be bonded together after lamination, thereby providing a stronger coverage of the photovoltaic cell 30 and reducing the difficulty of operation.

[0182] In addition, the encapsulation layer 40 is located between the photovoltaic cell 30 and the first substrate 10 and can be made of a translucent material; while the auxiliary glue is located between the photovoltaic cell 30 and the second substrate 20, on the backlight side, and the material selection is more flexible, and can be a translucent material or a non-translucent material.

[0183] For example, the auxiliary adhesive can be made of a material with greater viscosity than the encapsulating material 40a, that is, a material with less fluidity than the encapsulating material 40a. Alternatively, the auxiliary adhesive can be pre-crosslinked before lamination to reduce its fluidity. This can reduce the flow of the auxiliary adhesive into the sealing material 50a and improve the problem of glue penetration. As needed, the separator 60a can be arranged between the auxiliary adhesive and the sealing material 50a, or on the side of the auxiliary adhesive closest to the first substrate 10.

[0184] A comparative example, a photovoltaic assembly 100 according to a specific embodiment of the present application, and a method for manufacturing the same are described in detail below with reference to the accompanying drawings. It is worth noting that the following description is merely illustrative and should not be construed as limiting the application.

[0185] Lamination treatment method:

[0186] (1) The laminator is heated to a set temperature (any temperature between 140°C and 155°C, such as 140°C) and kept constant;

[0187] (2) After preliminary assembly of the various parts of the photovoltaic module 100, place them in a laminator;

[0188] (3) vacuuming the preliminarily assembled photovoltaic module 100 to remove all gases and form a cavity;

[0189] (4) The laminator applies pressure to the preliminarily assembled photovoltaic module 100, and as the pressure increases, the voids are gradually filled with the encapsulation material 40a;

[0190] (5) After the pressure stabilizes, the cross-linking stage begins, and the degree of cross-linking of the packaging material 40a gradually increases;

[0191] (6) After the set time, the lamination process is completed.

[0192] As shown in Figures 1 and 2, the comparative example photovoltaic module 100 is manufactured using the above-described lamination method and includes a photovoltaic cell 30 formed by a first substrate 10, a second substrate 20, and a photoelectric conversion component 31, an EVA adhesive layer 40', and a butyl adhesive layer 50'. The photovoltaic cell 30 is a heterojunction cell, and the first substrate 10 and the second substrate 20 are both made of transparent glass. The EVA adhesive layer 40' covers the photovoltaic cell 30 and is bonded to the first substrate 10 and the second substrate 20. The butyl adhesive layer 50' is located between the first substrate 10 and the second substrate 20 and is bonded to the periphery of the EVA adhesive layer 40', thereby sealing the gap between the first substrate 10 and the second substrate 20.

[0193] EVA adhesive layer 40' exhibits excellent fluidity during melting. As shown in Figure 2, during the lamination process, EVA adhesive layer 40' overflows and flows into butyl adhesive layer 50', causing adhesive penetration. The effective water-blocking dimension of the central portion of butyl adhesive layer 50' is significantly reduced, reducing its water vapor resistance. This makes photovoltaic module 100 susceptible to water vapor, leading to power degradation.

[0194] As shown in Figures 3-6, a photovoltaic module 100 according to the first embodiment of the present application includes a photovoltaic cell 30 formed by a first substrate 10, a second substrate 20, and a photoelectric conversion component 31, an encapsulation layer 40, a separator layer 60, and a sealing layer 50. The photovoltaic cell 30 is a heterojunction cell, and both the first substrate 10 and the second substrate 20 are made of transparent glass. The encapsulation layer 40 is made of EVA, the sealing layer 50 is made of butyl rubber, and the separator layer 60 is an isolation film made of PP or PET.

[0195] Before lamination, butyl rubber is placed on the edge of the second substrate 20, EVA is laid inside, and a barrier film is placed between the butyl rubber and the EVA to prevent outward flow of the EVA. The barrier film can be placed after the butyl rubber is laid, on the side where the butyl rubber abuts the EVA. Alternatively, butyl tape can be used, with a barrier film placed on the inside of the butyl tape, and the butyl tape with the barrier film directly laid. Lamination is then performed using the aforementioned lamination method, as shown in Figure 5. During the lamination process, the barrier film can slow down the EVA from flowing toward the butyl rubber, reducing the risk of rubber penetration.

[0196] The photovoltaic module 100 according to the second embodiment of the present application differs from the first embodiment in that the separator layer 60 is made of a relatively high-melting-point polyolefin material, POE (Polyolefin Emulsion). Before lamination, a small strip of POE is placed between the EVA and butyl adhesive. During the lamination process, the POE prevents the EVA from flowing into the butyl adhesive and also inhibits the flow of the EVA into the butyl adhesive, reducing the risk of glue penetration.

[0197] It is understood that in the first embodiment, the PP or PET separator has no fluidity, thus forming relatively clear boundaries between the separator layer 60 and the sealing layer 50, and between the separator layer 60 and the encapsulation layer 40. In the second embodiment, the POE low-fluidity adhesive has relatively poor fluidity, resulting in a certain degree of compatibility between POE and EVA, and between POE and butyl rubber.

[0198] In summary, compared with the comparative example, taking Example 1 and Example 2 as an example, the technical solution of the present application can slow down the flow of the encapsulation layer 40 to the sealing layer 50 during the lamination process by setting a separation layer 60 between the encapsulation layer 40 and the sealing layer 50, reduce the occurrence of glue penetration of the sealing layer 50, ensure the actual water-blocking size of the sealing layer 50, improve the water vapor resistance of the photovoltaic module 100, and improve the production yield and long-term reliability.

[0199] Other structures and operations of the photovoltaic assembly 100 and the photovoltaic system according to the embodiment of the present application are well known to those skilled in the art and will not be described in detail here.

[0200] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0201] In addition, in the description of the embodiments of this application, unless otherwise specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0202] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0203] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A photovoltaic module (100), characterized in that: include: A first substrate (10) and a second substrate (20), wherein the first substrate (10) and the second substrate (20) are arranged along a first direction (F1); An encapsulation layer (40), the encapsulation layer (40) being disposed between the first substrate (10) and the second substrate (20) and being used to fix the photovoltaic cell (30); a sealing layer (50), the sealing layer (50) being located outside the encapsulation layer (40) along a second direction (F2) and being arranged around the encapsulation layer (40), the sealing layer (50) being used to seal a gap between the first substrate (10) and the second substrate (20), the second direction (F2) being perpendicular to the first direction (F1); and A separation layer (60) is provided between the encapsulation layer (40) and the sealing layer (50) to prevent the melted encapsulation layer (40) from flowing toward the sealing layer (50).

2. The photovoltaic module (100) according to claim 1, characterized in that: At a set temperature, the viscosity of the encapsulation layer (40) is lower than the viscosity of the sealing layer (50), and the viscosity of the separation layer (60) is higher than the viscosity of the encapsulation layer (40).

3. The photovoltaic module (100) according to claim 1, characterized in that: At a set temperature, the viscosity of the separation layer (60) is greater than the viscosity of the sealing layer (50).

4. The photovoltaic module (100) according to claim 1, characterized in that: The separation layer (60) is a single layer, and two ends of the separation layer (60) along the first direction (F1) are in contact with and cooperate with the first substrate (10) and the second substrate (20) respectively.

5. The photovoltaic module (100) according to claim 1, characterized in that: The separation layer (60) is multi-layered and arranged along the second direction (F2); one end of at least one layer of the separation layer (60) along the first direction (F1) is in contact with the first substrate (10); and one end of at least one layer of the separation layer (60) along the first direction (F1) is in contact with the second substrate (20).

6. The photovoltaic module (100) according to claim 1, characterized in that: Along the first direction (F1), the encapsulation layer (40), the sealing layer (50) and the separation layer (60) are of equal size.

7. The photovoltaic module (100) according to claim 1, characterized in that: Along the first direction (F1), the size of the encapsulation layer (40) is H1, the size of the sealing layer (50) is H2, and the size of the separation layer (60) is H3, wherein: H1<H2, H1≤H3≤H2.

8. The photovoltaic assembly (100) according to claim 7, characterized in that: Also includes: An auxiliary adhesive layer (70), the auxiliary adhesive layer (70) being arranged between the packaging layer (40) and the second substrate (20).

9. The photovoltaic assembly (100) according to claim 8, characterized in that: At a set temperature, the viscosity of the auxiliary adhesive layer (70) is greater than the viscosity of the encapsulation layer (40).

10. The photovoltaic module (100) according to claim 1, characterized in that: At least one of the first substrate (10), the second substrate (20) and the separation layer (60) is provided with a groove on a side facing the encapsulation layer (40), and the encapsulation layer (40) is partially embedded in the groove.

11. The photovoltaic module (100) according to claim 1, characterized in that: The separation layer (60) is a porous structure.

12. The photovoltaic assembly (100) according to claim 1, characterized in that: Along the second direction (F2), the size of the sealing layer (50) is 8 to 12 mm.

13. The photovoltaic module (100) according to claim 1, characterized in that: Along the second direction (F2), the size of the separation layer (60) is 0.1-0.5 mm.

14. The photovoltaic assembly (100) according to any one of claims 1 to 13, characterized in that: The material of the packaging layer (40) includes EVA.

15. The photovoltaic assembly (100) according to any one of claims 1 to 13, characterized in that: The material of the sealing layer (50) includes at least one of butyl rubber, butyl tape, and POE.

16. The photovoltaic assembly (100) according to any one of claims 1 to 13, characterized in that: The material of the separation layer (60) includes at least one of PP, PET and POE.

17. The photovoltaic assembly (100) according to claim 1, characterized in that: The encapsulation layer (40) covers and fixes the photovoltaic cell (30).

18. A photovoltaic system, characterized in that: It comprises a support assembly and a photovoltaic assembly (100) according to any one of claims 1 to 17, wherein the photovoltaic assembly (100) is installed on the support assembly.

19. A method for manufacturing a photovoltaic module (100), characterized in that: The photovoltaic assembly (100) is a photovoltaic assembly (100) according to any one of claims 1 to 17, and the manufacturing method comprises: Providing a first substrate (10), a second substrate (20), a photovoltaic cell (30), a packaging material (40a), a sealing material (50a) and a separator material (60a); The photovoltaic cell (30), the packaging material (40a), the sealing material (50a) and the partition material (60a) are arranged between the first substrate (10) and the second substrate (20), and the sealing material (50a) is located outside the packaging material (40a) along the second direction (F2) and arranged around the packaging material (40a), and the partition material (60a) is located between the packaging material (40a) and the sealing material (50a); A lamination process is performed to bond the photovoltaic cell (30), the packaging material (40a), the sealing material (50a), the separator material (60a), the first substrate (10) and the second substrate (20) together, so that the packaging material (40a) forms a packaging layer (40) and fixes the photovoltaic cell (30), the sealing material (50a) forms a sealing layer (50) and is sealed between the first substrate (10) and the second substrate (20), and the separator material (60a) forms a separator layer (60).

20. The method for manufacturing a photovoltaic module (100) according to claim 19, characterized in that: Before the lamination process, the size of the sealing material (50a) along the first direction (F1) is greater than the size of the packaging material (40a) along the first direction (F1), and the size of the separation material (60a) along the first direction (F1) is greater than or equal to the size of the packaging material (40a) along the first direction (F1).

21. The method for manufacturing a photovoltaic module (100) according to claim 19, characterized in that: Before the lamination process, the size of the separation material (60a) along the first direction (F1) is smaller than the size of the sealing material (50a) along the first direction (F1).

22. The method for manufacturing a photovoltaic module (100) according to claim 19, characterized in that: Before the lamination process, the multiple layers of the separation material (60a) are stacked along the second direction (F2) and cross-arranged along the first direction (F1), and the spacing between the two ends of the multiple layers of the separation material (60a) along the first direction (F1) is equal to the size of the sealing material (50a) along the first direction (F1).

23. The method for manufacturing a photovoltaic module (100) according to claim 22, characterized in that: Before the lamination process, the separation material (60a) is composed of two layers, wherein one end of one layer of the separation material (60a) along the first direction (F1) is in contact with the first substrate (10) and the other end is spaced apart from the second substrate (20), and another end of the separation material (60a) along the first direction (F1) is in contact with the second substrate (20) and the other end is spaced apart from the first substrate (10), and the two layers of the separation material (60a) partially cross each other along the first direction (F1).

24. The method for manufacturing a photovoltaic module (100) according to claim 19, characterized in that: Before the lamination process, the packaging material (40a) is placed in contact with the second substrate (20), and during the lamination process, the relative movement distance between the first substrate (10) and the second substrate (20) is greater than or equal to the distance between the packaging material (40a) and the first substrate (10).

25. The method for manufacturing a photovoltaic module (100) according to claim 19, characterized in that: The encapsulation layer (40) is placed in contact with the second substrate (20), and during the lamination process, the relative movement distance between the first substrate (10) and the second substrate (20) is smaller than the distance between the encapsulation material (40a) and the first substrate (10).

26. The method for manufacturing a photovoltaic module (100) according to claim 19, characterized in that: Before the lamination process, the packaging material (40a) is arranged between the photovoltaic cell (30) and the first substrate (10), and the auxiliary glue is arranged between the photovoltaic cell (30) and the second substrate (20), so as to form an auxiliary glue layer (70) bonded to the packaging layer (40) after the lamination process.

27. The method for manufacturing a photovoltaic module (100) according to any one of claims 19 to 26, characterized in that: Before the lamination process, the separation material (60a) is pre-fixed on the first substrate (10) or the second substrate (20) by adhesive.

28. The method for manufacturing a photovoltaic module (100) according to any one of claims 19 to 26, characterized in that: Before the lamination process, the separation material (60a) is adhered to the side of the sealing material (50a) facing the packaging material (40a).

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