Optical module

Abstract

An optical module (100), comprising: a circuit board (110), the circuit board (110) comprising a base material layer (111), a copper layer (112) and a solder mask layer (113), which are stacked, wherein a clearance area (114) is provided on the solder mask layer (113), and the clearance area (114) exposes the copper layer (112); a lens assembly (120) located on the side of the solder mask layer (113) facing away from the copper layer (112); and a connector (130) protruding from the surface of the lens assembly (120) facing the solder mask layer (113), the connector (130) being embedded in the clearance area (114) and being in contact with the copper layer (112). By means of providing the clearance area (114) on the solder mask layer (113), the connector (130) on the lens assembly (120) is embedded in the clearance area (114) so as to be in contact connection with the copper layer (112), thereby ensuring the coupling flatness of the lens assembly (120), and thus the manufacturing yield of optical module (100) products is improved.

Description

An optical module

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 13, 2023, with application number 202323401644.5 and invention name “A Type of Optical Module”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0003] Optical modules are tools for converting electrical and optical signals into each other and are key components in optical communication equipment. They consist of optoelectronic devices, functional circuits, and optical interfaces. Their function is to convert electrical signals into optical signals at the transmitter. After transmission through optical fiber, the optical signals are then converted back into electrical signals at the receiver.

[0004] With the rapid development of communication technology and the growing demand for cloud computing, the market demand for high-speed optical modules is increasing. As a core component of optical modules, ensuring the coupling flatness of the lens assembly is an effective way to improve the stability and reliability of the optical path of the optical module. Therefore, how to ensure the coupling flatness of the lens assembly has become a pressing issue. Utility Model Content

[0005] An embodiment of the present application provides an optical module to ensure the coupling flatness of a lens assembly.

[0006] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0007] In one aspect, an optical module is provided, comprising: a circuit board, the circuit board comprising a substrate layer, a copper layer, and a solder resist layer stacked one on another, the solder resist layer being provided with a relief area, the relief area exposing the copper layer;

[0008] a lens assembly located on a side of the solder resist layer facing away from the copper layer; and

[0009] A connecting piece is protrudingly provided on a surface of the lens component facing the solder resist layer, and the connecting piece is embedded in the avoidance area and contacts the copper layer.

[0010] In addition to or as an alternative to one or more of the features disclosed above, the lens assembly has a lens body on which an optical structure for processing light is formed and a first bonding area located next to the optical structure, and the connecting member is fixed to the first bonding area.

[0011] In addition to or as an alternative to one or more of the features disclosed above, the connecting member is embedded in the avoidance area and bonded to the copper layer.

[0012] In addition to or as an alternative to one or more of the features disclosed above, at least two connecting members are provided, each of which is cylindrical or strip-shaped and protrudes from the corners of the lens body;

[0013] The solder resist layer is provided with at least two avoidance areas, and each of the connecting members is respectively embedded in a corresponding one of the avoidance areas.

[0014] In addition to or as an alternative to one or more features disclosed above, a first protection area is provided on the circuit board and is located below the lens assembly, and the avoidance area is separated from the first protection area by the solder resist layer;

[0015] The optical module further includes an optical chip, which is disposed in the first protection area, electrically connected to the copper layer, and optically connected to the lens assembly.

[0016] In addition to or as an alternative to one or more features disclosed above, a second bonding area is provided on the substrate layer, at least a portion of the avoidance area is located within the second bonding area, the second bonding area is provided at the periphery of the first protection area, and the second bonding area is separated from the first protection area by the solder resist layer;

[0017] The first bonding area of ​​the lens assembly and the connecting member are bonded to the second bonding area by an adhesive.

[0018] In addition to or as an alternative to one or more features disclosed above, a third bonding area is provided on the solder resist layer, at least part of the avoidance area is located within the third bonding area, the third bonding area is provided at the periphery of the first protection area, and the third bonding area is separated from the first protection area by the solder resist layer;

[0019] The first bonding area of ​​the lens assembly and the connecting member are bonded to the third bonding area by an adhesive.

[0020] In addition to or as an alternative to one or more of the features disclosed above, the circuit board is further provided with a second protection area, the second protection area is located at the periphery of the bonding area, and the second protection area and the bonding area are separated by the solder resist layer;

[0021] The optical module further includes: a control chip and a power chip. The control chip and the power chip are both disposed in the second protection area, and are both electrically connected to the copper layer.

[0022] In addition to or as an alternative to one or more of the features disclosed above, the lens assembly is integrally formed with the connector; or;

[0023] The connecting member is fixedly connected to the lens assembly.

[0024] In addition to or as an alternative to one or more of the features disclosed above, the optical module further comprises: a housing, an optical connector, and an optical fiber array;

[0025] The circuit board, the lens assembly, and the connector are all housed in the housing, the optical connector is optically connected to the lens assembly via the optical fiber array, and the optical connector is used to transmit optical signals to external components. In addition to or as an alternative to one or more of the features disclosed above.

[0026] One of the above technical solutions has the following advantages or beneficial effects: This application sets an avoidance area in the solder mask layer, so that the connector on the lens assembly is embedded in the avoidance area to contact and connect with the copper layer, so as to ensure the coupling flatness of the lens assembly and improve the production yield of the optical module product. At the same time, it prevents the glue dispensed on the periphery of the lens assembly from capillary to the wire bonding pads and the surface of the optical chip on the circuit board, thereby ensuring the optical path stability and reliability of the optical module, preventing the glue on the periphery of the lens assembly from directly covering the high-speed signal routing, reducing the impact on the impedance of the signal line, and improving the product performance of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0028] FIG1 is a three-dimensional structural view of an optical module provided according to an embodiment of the present application;

[0029] FIG2 is a three-dimensional structural diagram of a circuit board and a lens assembly provided according to a first specific embodiment of the present application;

[0030] FIG3 is an exploded structural diagram of a circuit board and a lens assembly according to a first specific embodiment of the present application;

[0031] FIG4 is a cross-sectional view of a circuit board and a lens assembly according to a first specific embodiment of the present application;

[0032] FIG5 is a three-dimensional structural view of a lens assembly provided according to a first specific embodiment of the present application;

[0033] FIG6 is a top view of a circuit board provided according to a first specific embodiment of the present application;

[0034] FIG7 is a top view of a circuit board provided according to a first specific embodiment of the present application;

[0035] FIG8 is an exploded structural diagram of a circuit board and a lens assembly according to a second specific embodiment of the present application;

[0036] FIG9 is a three-dimensional structural view of a lens assembly provided according to a second specific embodiment of the present application.

[0037] Description of reference numerals:

[0038] 100. Optical module;

[0039] 110, circuit board; 111, substrate layer; 112, copper layer; 1121, first protection area; 1122, second protection area; 113, solder mask layer; 114, avoidance area; 115, second bonding area; 116, third bonding area;

[0040] 120, lens assembly; 121, lens body; 1211, first bonding area;

[0041] 130. Connectors;

[0042] 140. Optical chip;

[0043] 150, housing;

[0044] 160. Optical connector;

[0045] 170. Fiber optic array. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solutions and beneficial effects of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for the purpose of explaining this application and are not intended to limit this application.

[0047] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0048] Currently, in optical modules, due to the large differences in the flatness of the green oil layer, the angle and setting position of the lens assembly coupling process do not meet the precision requirements, making it difficult to meet the lens assembly coupling requirements, affecting the stability and reliability of the optical path of the optical module; secondly, the lens assembly needs to be fixed with glue, and the adhesion of glue on different materials is different, resulting in inconsistent reliability of the lens assembly after bonding; finally, the lens assembly needs to be fixed with glue. Before curing, some substances in the glue will penetrate along the edge of the gap between copper and substrate, producing a capillary effect, resulting in discoloration of gold wires and pads at the edge of the glue, foreign matter on the PCB board surface, foreign matter in the VCSEL aperture, etc., and the glue will directly cover the exposed high-speed differential line, affecting the differential line impedance.

[0049] In order to solve the above problems, an embodiment of the present application provides an optical module that can improve the coupling flatness of the lens assembly 120, thereby ensuring the optical path stability and reliability of the optical module and improving the manufacturing yield of the optical module product.

[0050] In an embodiment of the present application, referring to FIG. 1 to FIG. 9 , the present application provides an optical module, which may include: a housing 150 , a circuit board 110 , a lens assembly 120 , a connector 130 and an optical chip 140 .

[0051] The above-mentioned circuit board 110, lens assembly 120, connector 130 and optical chip 140 are all housed in the housing 150. The lens assembly 120 and the optical chip 140 are arranged on the circuit board 110. The optical chip 140 is optically coupled to the lens assembly 120, and the optical chip 140 is electrically connected to the circuit board 110 to power the optical chip 140.

[0052] Optical chip 140 may be a light emitting chip, for example, a laser for emitting light that does not carry a signal. Optical chip 140 may also be a light receiving chip, for example, a detector or a silicon photonic chip for receiving signal light of different wavelengths. This is not specifically limited in this application and may be selected based on actual circumstances.

[0053] When the optical chip 140 is a light emitting chip, the lens assembly 120 is used to optically process the light emitted by the optical chip 140 ; ​​when the optical chip 140 is a light receiving chip, the lens assembly 120 is used to transmit and change the propagation direction of the signal light received by the optical chip 140 .

[0054] The lens assembly 120 may be in a long strip shape, but is not limited thereto.

[0055] The circuit board 110 is a rigid circuit board, but is not limited thereto.

[0056] Specifically, the above-mentioned circuit board 110 includes a base material layer 111, a copper layer 112 and a solder resist layer 113 stacked on each other, and an avoidance area 114 is opened on the solder resist layer 113, and the avoidance area 114 exposes the copper layer 112; the lens assembly 120 is located on the side of the solder resist layer 113 away from the copper layer 112; the connecting member 130 is protruded on the surface of the lens assembly 120 facing the solder resist layer 113, and the connecting member 130 is embedded in the avoidance area 114 and contacts the copper layer 112.

[0057] In other embodiments, the circuit board 110 may include multiple substrate layers 111 and multiple copper layers 112, which are stacked on top of each other to form a multi-layer circuit board structure. The copper layer 112 and solder resist layer 113 may be present on both the upper and lower surfaces of the circuit board 110. This is not specifically limited in this application and may be configured based on actual circumstances.

[0058] Among them, the material of the solder resist layer 113 can be green oil, but is not limited to this. No specific limitation is made in this application as long as it does not affect the technical effect of this application.

[0059] The lens assembly 120 and the connecting member 130 are integrally formed; the connecting member 130 can also be fixedly connected to the lens assembly 120. This application does not make specific restrictions and can be specifically configured according to actual circumstances.

[0060] The optical chip 140 can be electrically connected to the copper layer 112 via a bonding pad or gold wire bonding.

[0061] It can be understood that due to the good consistency of the copper surface, the present application sets an avoidance area 114 on the solder mask layer 113, so that the connector 130 on the lens assembly 120 is embedded in the avoidance area 114 to contact and connect with the copper layer 112, so as to ensure the coupling flatness of the lens assembly 120, improve the production yield of the optical module product, and at the same time prevent the glue dispensed on the periphery of the lens assembly 120 from capillary to the wire bonding pads and the surface of the optical chip 140 on the circuit board 110, thereby ensuring the optical path stability and reliability of the optical module, preventing the glue on the periphery of the lens assembly 120 from directly covering the high-speed signal line, reducing the impact on the signal line impedance, and improving the product performance of the optical module.

[0062] In one embodiment, the lens assembly 120 has a lens body 121 , on which is formed an optical structure (not shown) for processing light and a first bonding area 1211 located next to the optical structure, and the connector 130 is fixed to the first bonding area 1211 .

[0063] The above-mentioned optical structure may be a reflective surface for deflecting light, a lens for converging light, a spectroscope for splitting light, etc., but is not limited thereto.

[0064] The first bonding area 1211 is a plane parallel to the circuit board 110. The first bonding area 1211 includes an area for fixing the connector 130 and an area for bonding to the circuit board 110.

[0065] It can be understood that in the present application, by fixing the connector 130 in the first bonding area 1211, when the lens assembly 120 is embedded in the avoidance area 114 through the connector 130, other areas of the first bonding area 1211 can be bonded and fixed to the circuit board 110 to ensure the reliability of the bonding and fixation of the lens assembly 120, thereby ensuring the reliability of the optical module.

[0066] In the specific embodiment 1 of the application:

[0067] 2 to 7 , at least two connecting members 130 are provided. The at least two connecting members 130 are respectively protruded from the corner areas of the lens body 121 , and the connecting members 130 are in an elongated strip shape.

[0068] At least two avoidance regions 114 are provided, and each connecting member 130 is embedded in a corresponding avoidance region 114 and contacts the copper layer 112 .

[0069] It can be understood that the present application increases the contact area between the connecting member 130 and the avoidance area 114 by configuring the connecting member 130 to be in a long strip shape, thereby further ensuring the coupling flatness of the lens assembly 120 .

[0070] In one embodiment, the circuit board 110 is provided with a first protection area 1121 located below the lens assembly 120 , and the avoidance area 114 and the first protection area 1121 are separated by a solder resist layer 113 .

[0071] Specifically, the optical chip 140 is disposed in the first protection region 1121 , and the optical chip 140 is electrically connected to the copper layer 112 .

[0072] Among them, in this application, the avoidance area 114 and the first protection area 1121 can be separated only by the solder resist layer 113 to achieve local protection. In this application, the solder resist layer 113 can also be set in other areas except the avoidance area 114 and the first protection area 1121 to achieve separation between the two and realize the full protection function of the first protection area 1121.

[0073] It is understandable that the lens assembly 120 needs to be fixed with glue. Before curing, some substances in the glue will penetrate along the edge of the gap between the copper layer 112 and the substrate layer 111, producing a capillary effect, thereby causing the gold wire to discolor in the place where the glue comes into contact, the gold pad to discolor, foreign matter to appear on the surface of the circuit board 110, and foreign matter in the VCSEL aperture. In this application, the avoidance area 114 and the first protection area 1121 are separated by a solder mask layer 113 to isolate the two, thereby preventing the glue dispensed on the periphery of the lens assembly 120 from capillary to the wire bonding pads and the surface of the optical chip 140 located inside the lens assembly 120, thereby ensuring the optical path stability and reliability of the optical module 100, preventing the glue on the periphery of the lens assembly 120 from covering the high-speed signal wiring, reducing the impact on the impedance of the signal line, and improving the product performance of the optical module 100.

[0074] Furthermore, referring to Figures 6 and 7 , the lens assembly 120 requires adhesive fixation, and different materials have different adhesive strengths. In one embodiment, when the avoidance area 114 and the first protection area 1121 are separated only by the solder mask layer 113 to achieve local protection, a portion of the substrate layer 111 is exposed. When the lens assembly 120 is mounted on the circuit board 110, a portion of the first bonding area 1211 of the lens assembly 120 can be bonded and fixed to the substrate layer 111.

[0075] Further, referring to Figure 6 , a second bonding area 115 is provided on the substrate layer 111. At least a portion of the avoidance area 114 is located within the second bonding area 115. The second bonding area 115 is provided on the periphery of the first protective area 1121 and is separated from the first protective area 1121 by the solder resist layer 113. The first bonding area 1211 of the lens assembly 120 and the connector 130 are bonded to the second bonding area 115 via an adhesive. Specifically, the connector 130 is bonded to the copper layer 112 in the avoidance area 114 via the adhesive, and the first bonding area 1211 of the lens assembly 120 is bonded to the second bonding area 115 of the substrate layer 111 via the adhesive, thereby achieving mounting and securing of the lens assembly 120 to the circuit board 110.

[0076] The adhesive is glue, but is not limited thereto.

[0077] It can be understood that since the bonding effect of the substrate layer 111 is good, in this application, the first bonding area 1211 of the lens assembly 120 and the connecting member 130 are bonded to the second bonding area 115 using an adhesive, that is, the lens assembly 120 is bonded to the substrate layer 111 to ensure the reliability of the bonding and fixation of the lens assembly 120, thereby ensuring the reliability of the optical module.

[0078] In another embodiment, please refer to Figure 7. In this application, a solder resist layer 113 is set in all areas except the avoidance area 114 and the first protection area 1121 to achieve the full protection function of the first protection area 1121. At this time, when the lens assembly 120 is installed on the circuit board 110, the first bonding area 1211 of the lens assembly 120 can be bonded and fixed to the solder resist layer 113.

[0079] Specifically, a third bonding area 116 is provided on the solder resist layer 113. At least a portion of the avoidance area 114 is located within the third bonding area 116. The third bonding area 116 is provided on the periphery of the first protective area 1121 and is separated from the first protective area 1121 by the solder resist layer 113. The lens assembly 120 and the connector 130 are bonded to the third bonding area 116 via an adhesive. Specifically, the connector 130 is bonded to the copper layer 112 in the avoidance area 114 via an adhesive, and the first bonding area 1211 of the lens assembly 120 is bonded to the third bonding area 116 of the solder resist layer 113 via an adhesive, thereby achieving mounting and fixing of the lens assembly 120 to the circuit board 110.

[0080] It can be understood that in the present application, the lens assembly 120 and the connector 130 are bonded to the third bonding area 116 using an adhesive, that is, the lens assembly 120 is bonded to the solder mask layer 113, so as to further prevent the glue dispensed on the periphery of the lens assembly 120 from flowing to the wire bonding pads and the surface of the optical chip 140 located inside the lens assembly 120, thereby ensuring the optical path stability and reliability of the optical module 100, preventing the glue on the periphery of the lens assembly 120 from covering the high-speed signal lines, reducing the impact on the impedance of the signal lines, and improving the product performance of the optical module 100.

[0081] In one embodiment, referring to Figures 6 to 7, the circuit board 110 is further provided with a second protection area 1122, the second protection area 1122 is located at the periphery of the bonding area, and the second protection area 1122 and the bonding area are separated by the solder resist layer 113; specifically, the second protection area 1122 is located at the periphery of the second bonding area 115 or the third bonding area 116, and the second protection area 1122 and the second bonding area 115 or the third bonding area 116 are separated by the solder resist layer 113.

[0082] The optical module 100 further includes a control chip and a power chip. Both the control chip and the power chip are disposed in the second protection area 1122 , and both the control chip and the power chip are electrically connected to the copper layer 112 .

[0083] The control chip mentioned above may be a TEC control chip, a DSP (digital signal processing) chip, etc., but is not limited thereto.

[0084] It can be understood that in this application, a second protection area 1122 is set for placing the control chip and the power chip, and the second protection area 1122 and the bonding area are separated by a solder mask layer 113 to prevent the glue dispensed on the periphery of the lens assembly 120 from flowing into other protection areas and affecting other electronic components, thereby improving the product performance of the optical module 100.

[0085] It should be understood that the above-mentioned circuit board 110 is not limited to setting the first protection area 1121 and the second protection area 1122. Other protection areas can be additionally set according to actual needs. For example, the third protection area and the fourth protection area for placing other battery components should also be regarded as embodiments of the present application.

[0086] In one embodiment, referring to FIG. 1 , the optical module 100 further includes an optical connector 160 and an optical fiber array 170 . The optical connector 160 is optically connected to the lens assembly 120 via the optical fiber array 170 . The optical connector 160 is used to transmit optical signals to external components.

[0087] The optical connector 160 may be an active optical cable to directly connect the optical port of the silicon photonic chip to an external component. Alternatively, the optical connector 160 may be a fiber optic receptacle to optically connect the optical port of the silicon photonic chip to an external component via a plug-in connection. This is not specifically limited in this application and may be selected based on actual circumstances.

[0088] In the second specific embodiment of the present application:

[0089] 8 to 9 , at least four connectors 130 are provided. The connectors 130 are cylindrical, and each connector 130 is protruded from a corner area of ​​the lens body 121 . The solder resist layer 113 is provided with at least four avoidance areas 114 , and each connector 130 is embedded in a corresponding avoidance area 114 and contacts the copper layer 112 .

[0090] It is understandable that in this application, considering the limitations of the circuit board design, it is impossible to reserve sufficient avoidance area 114 on the circuit board 110 to realize the installation of the lens assembly 120. Since the cylindrical connector 130 occupies a small space and has a small contact surface with the circuit board 110. In this application, by setting four raised connectors 130 in the corner areas of the lens assembly 120 and by setting four avoidance areas 114 on the solder mask layer 113, the lens assembly 120 is installed on the copper layer of the circuit board. Under the premise of ensuring the coupling flatness of the lens assembly 120, the space occupied by the connector 130 and the avoidance area 114 is saved, thereby realizing convenient installation of the lens and improving the installation efficiency of the lens assembly 120.

[0091] At the same time, the other technical features in the specific embodiment 2 of the present application are the same as those in the above-mentioned specific embodiment 1. In view of the fact that the features have been described in detail in the above-mentioned specific embodiment 1, the specific embodiment 2 in the present application will not be described accordingly, and reference may be made to the description in the specific embodiment 1.

[0092] To sum up, the optical module in this application can ensure the coupling flatness of the component 120, improve the manufacturing yield of the optical module 100 product, and at the same time prevent the glue dispensed on the periphery of the component 120 from flowing to the wire bonding pads and the surface of the optical chip inside the component 120, thereby ensuring the optical path stability and reliability of the optical module 100, preventing the glue on the periphery of the lens component 120 from directly covering the high-speed signal lines, reducing the impact on the signal line impedance, and improving the product performance of the optical module.

[0093] The above steps are merely provided to help understand the method, structure, and core concept of the present application. A person skilled in the art may make several improvements and modifications to the present application without departing from the principles of the present application, and such improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. An optical module, characterized in that: include: A circuit board, the circuit board comprising a substrate layer, a copper layer and a solder resist layer stacked on each other, a relief area being provided on the solder resist layer, and the relief area exposing the copper layer; A lens assembly is located on a side of the solder resist layer facing away from the copper layer; as well as A connecting piece is protrudingly arranged on a surface of the lens component facing the solder resist layer, and the connecting piece is embedded in the avoidance area and contacts the copper layer.

2. The optical module according to claim 1, wherein: The lens assembly comprises a lens body, an optical structure for processing light and a first bonding area located next to the optical structure are formed on the lens body, and the connecting member is fixed on the first bonding area.

3. The optical module according to claim 2, characterized in that The connecting piece is embedded in the avoidance area and is bonded and fixed to the copper layer.

4. The optical module according to claim 2, characterized in that: At least two connecting members are provided, and the connecting members are cylindrical or strip-shaped, and the connecting members are respectively convexly arranged at the corner areas of the lens body; The solder resist layer is provided with at least two avoidance areas, and each of the connecting members is respectively embedded in a corresponding one of the avoidance areas.

5. The optical module according to claim 2, characterized in that: The circuit board is provided with a first protection area located below the lens assembly, and the avoidance area and the first protection area are separated by the solder resist layer; The optical module further includes: an optical chip, which is disposed in the first protection area, electrically connected to the copper layer, and optically connected to the lens assembly.

6. The optical module according to claim 5, characterized in that: A second bonding area is provided on the substrate layer, at least part of the avoidance area is located in the second bonding area, the second bonding area is provided at the periphery of the first protection area, and the second bonding area is separated from the first protection area by the solder resist layer; The first bonding area of ​​the lens assembly and the connecting member are bonded to the second bonding area by an adhesive.

7. The optical module according to claim 5, characterized in that: A third bonding area is provided on the solder resist layer, at least part of the avoidance area is located in the third bonding area, the third bonding area is provided at the periphery of the first protection area, and the third bonding area is separated from the first protection area by the solder resist layer; The first bonding area of ​​the lens assembly and the connecting member are bonded to the third bonding area by an adhesive.

8. The optical module according to any one of claims 6 or 7, characterized in that: The circuit board is also provided with a second protection area, the second protection area is located at the periphery of the bonding area, and the second protection area and the bonding area are separated by the solder resist layer; The optical module further includes: a control chip and a power chip, wherein the control chip and the power chip are both disposed in the second protection area, and the control chip and the power chip are both electrically connected to the copper layer.

9. The optical module according to claim 1, wherein: The lens assembly and the connecting member are integrally formed; or; The connecting member is fixedly connected to the lens assembly.

10. The optical module according to claim 1, wherein: The optical module also includes: a housing, an optical connector and an optical fiber array; The circuit board, the lens assembly and the connecting member are all accommodated in the housing. The optical connector is optically connected to the lens assembly via the optical fiber array. The optical connector is used to transmit optical signals to external components.

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