Flexible conductor structure

Abstract

The invention relates to a method for producing an in particular flexible conductor structure (1) having two conductor tracks (10, 20) which intersect non-conductively. According to the invention, components of the conductor tracks (10, 20) as well as insulating structures are printed onto two different substrate layers (301, 302) in the region of the intersection point. Subsequently, the printed-on faces (3010, 3020) of the substrate layers (301, 302) are brought together in such an alignment that the components of the conductor tracks and the insulating structures are assembled so as to form two conductor tracks (10, 20) which intersect non-conductively.

Description

[0001] Description

[0002] Flexible conductor structure

[0003] The present invention relates to a method for producing a particularly flexible conductor structure having the features of claim 1, as well as to a flexible conductor structure having the features of claim 8. More specifically, the present invention relates to the design and production of conductor structures in which two conductor tracks are intended to cross in a non-conductive manner. Such conductor structures are used in a variety of electronic assemblies, antennas, and sensors.

[0004] Many topologies, especially printed circuit structures, have crossover points where traces must be crossed without electrically short-circuiting the conductor paths. In certain electrical systems, such as planar NFC antennas, such crossover points are unavoidable.

[0005] In integrated circuits (ICs), intersecting conductor paths are usually designed so that one of the conductor paths is redirected to an adjacent metallization layer in the area of ​​the intersection point. The metallization layers, spaced apart by a dielectric carrier layer (substrate), are then electrically connected vertically at specific points by so-called vias. The carrier layer is first provided with corresponding holes, which are then metallized to create an electrical connection between the metallization layers. Such a manufacturing process, as shown, for example, in DE 102004 005 300 A1, is complex.

[0006] However, particularly for flexible conductor track structures (such as film antennas, NFC stickers, etc.), a different bridging approach is more common. Here, a first continuous conductor track is arranged or printed on a substrate and covered with a local insulation layer in the region of the crossing point. Subsequently, a second conductor track crossing the first conductor track is arranged or printed on the substrate or the local insulation layer. An example of such a conductor track crossing is shown in CN 212034439 U. However, this has the disadvantage that the section of the second conductor track printed on the insulation layer often has a lower electrical conductivity than the other conductor sections. This is partly due to the fact that optimal adhesion cannot be achieved between the printed insulation layer and the conductor track section printed on this layer.In the application example of an (NFC) antenna, reduced conductivity can lead to a deterioration in the antenna's quality factor. Therefore, the bridges are usually chosen to be as short as possible, which represents a limitation in circuit layouts or is not always possible in some applications due to their sheer size – such as the meter-long sensor loops used in conveyor belt systems for crack detection. An example of such a sensor loop is shown in US 10150622 B1.

[0007] There is clearly a need for an improved solution for the design and manufacture of conductor structures in which two conductor tracks cross in a non-conductive manner.

[0008] The object of the present invention is therefore to provide an improved method for producing a particularly flexible conductor structure with two non-conductively intersecting conductor tracks, which at least partially mitigates the disadvantages of the prior art. At the very least, an alternative to existing solutions is to be created.

[0009] This object is achieved by a method having the features of claim 1 and a conductor structure having the features of claim 8. Preferred features are the subject of the dependent claims. Further advantages and features can be gathered from the general description and the exemplary embodiments. The method according to the invention for producing a particularly flexible conductor structure, with two non-conductively crossing conductor tracks, in particular a conductor structure according to one of claims 8 to 15, comprises the following steps: arranging, in particular printing, a conductor track section of a first conductor track interrupted by an interruption on a first side of a first carrier layer,

[0010] Arranging, in particular printing, a second conductor track extending through the interruption of the conductor track section of the first conductor track on the first side of the carrier layer,

[0011] Arranging, in particular printing, a bridging section of the first conductor track on a first side of a second carrier layer, wherein the bridging section is suitable for bridging the interrupted conductor track section,

[0012] Arranging, in particular printing, an insulator on a first side of the bridging section facing away from the second carrier layer, leaving free two contact sections spaced apart from one another on the first side of the bridging section and / or arranging the insulator on a first side of the first conductor track facing away from the first carrier layer, leaving free two end sections of the interrupted conductor track section spaced apart from one another and facing the interruption.

[0013] Bringing the carrier layers together in such a way that o the first side of the first carrier layer faces the first side of the second carrier layer, o the contact sections of the bridging section each form an electrical connection with one of the end sections of the interrupted conductor track section, o the insulator electrically insulates the bridging section of the first conductor track and the second conductor track from one another.

[0014] The invention is based on the idea of ​​arranging the bridging section on a separate carrier layer and then combining this separate carrier layer with the carrier layer on which the remaining conductor track sections are arranged, so that the bridging section bridges the interrupted conductor track section of the first conductor track and is simultaneously insulated from the second conductor section.

[0015] This approach offers many advantages. Firstly, the conductivity of the bridging section, which can be understood, for example, as an additional conductor track section of the first conductor track, is not impaired because the adhesion of the bridging section to the second carrier layer is, or can be, optimized in the same way as the adhesion of the remaining conductor track sections to the first carrier layer. Secondly, a particularly flat and robust conductor structure can be produced in just a few additive steps, without subtractive processing such as drilling vias or perforating a film substrate. The conductor tracks are enclosed between the two carrier layers and are thus simultaneously insulated on both sides and / or protected against external influences, so that a further process step for producing a corresponding insulation or protective layer can be omitted.A further advantage is that the conductor structure can be easily produced in large quantities using an automated process due to its simple design.

[0016] In principle, different materials can be considered for the first and second carrier layers, provided they are non-conductive and flexible. The material of the carrier layer preferably contains at least one polymer. The material of the carrier layer is preferably selected from the group consisting of polyamide (PA), e.g. PA6, PA6.6, PA11, PA12, PA6.10, PA6.12, and / or copolyamides and / or polyester (PES) and / or rayon and / or polyethylene terephthalate (PET) and / or polyethylene naphthalate (PEN) and / or polybutylene terephthalate (PBT) and / or polycarbonate (PC) and / or unsaturated polyester resin (UP) and / or poly(1,4-cyclohexanedimethylene terephthalate) (PCDT) and / or polyvinyl alcohol (PVAL) and / or polyoxybenzonaphtoate and / or polyvinyl acetal (PVA) and / or polyetheretherketone (PEEK) and / or polyethylene-2,6-naphthalate (PEN) and / or polyphenylene and / or polyphenylene oxide (PPO) and / or polyphenylene sulfide (PPS) and / or polyphenylene ether and / or polybenzoxazole (PBO) and / or polyoxadiazole (POD) and / or polyetherimide (PEI) and / or m-aramid and / or p-aramid and / or cellulose and / or paper and / or basalt and / or ceramic and / or wool and / or cotton and / or polypropylene and / or polyethylene and / or melamine and / or modified viscose and / or highly crystalline polymer fibers and / or fluoropolymers, such as fluorosilicone, polytetrafluoroethylene (PTFE) and perfluoroethylenepropylene (FEP), and / or fluoro-copolymers and / or styrene-butadiene rubber (SBR) and / or ethylene-propylene-diene rubber (EPDM), and / or a thermoplastic Elastomer such as TPV or TPU. Preferably, the material of the first carrier layer is identical to the material of the second carrier layer.

[0017] Preferably, the material of the first and / or second carrier layer is a polyethylene terephthalate (PET), in particular a PET film.

[0018] PET has a good surface quality, good wettability of printing inks, enables good adhesive strengths, is highly transparent, has a good moisture and oxygen barrier, and is recyclable. Alternatively, the material of the first and / or second carrier layer is preferably a thermoplastic polyurethane (TPU), in particular a TPU film. Compared to other substrates, TPU is particularly elastic, stretchable, abrasion-resistant and tear-resistant, resistant to oils and lubricants, and is lightweight. Furthermore, TPU exhibits good printability and can be easily bonded to other polymeric materials (for example, with low-melting intermediate films). Alternatively, the material is preferably a polycarbonate (PC), in particular a PC film. PC has high chemical resistance, good printability (i.e., enables good wetting and adhesion properties of printing inks), good

[0019] Temperature resistance, high elasticity and high impact resistance.

[0020] In particular, the first or the second carrier layer has a layer thickness of 1 μm to 500 μm, preferably of 5 μm to 250 μm, particularly preferably of 50 μm to 150 μm. In this way, a particularly compact design of the conductor structure can be realized. At the same time, the weight of the conductor structure according to the invention can be kept low. The joining or unification of the carrier layers with their sides carrying the respective conductor track sections takes place by contacting, in particular wherein the carrier layers are fastened to one another. This can be done, for example, using rollers or rolls in a lamination or covering process. The joining or unification of the carrier layers can also take place with the supply of heat and pressure. The rollers or rolls can be heated.The insulation layer can serve as an adhesion promoter layer, which is dried or cured by applying heat (and pressure) or radiation (UV, IR). The adhesion promoter layer can undergo reactive or chemical cross-linking for improved mechanical and adhesion properties.

[0021] For the conductor tracks or conductor track sections of the conductor structure (including the bridging section), various inorganic materials (such as metals) and organic materials (such as conductive polymers, carbon, graphite, graphene, etc.), as well as combinations thereof, are generally considered, provided they are conductive and can be processed using printing methods (e.g., as ink or paste). The thickness of the first and / or second conductor track is preferably between 1 nm and 50 pm. In this way, a particularly compact design of the conductor structure can be realized.

[0022] The thickness of the first and / or second conductor track is particularly preferably 500 nm to 50 pm, so that the conductor tracks can be reliably produced using proven printing processes. The thickness of a conductor track is understood here to be the dimension of the conductor track measured transversely to the layer plane of the carrier layer. Preferably, the interrupted conductor track section of the first conductor track, the bridging section of the first conductor track, and / or the second conductor track are printed onto the respective carrier layer. Printing—also known as 3D printing or additive processes—is particularly well suited for the precise production of conductive structures and can be advantageously combined with the method according to the invention.

[0023] In principle, various materials can be used for the insulator, provided they are not conductive (i.e. dielectric). The material of the insulator preferably contains at least one polymer. In particular, the material of the insulator can be processed using a printing process, as a result of which the insulator can be produced in a particularly thin, efficient, and reliable manner. The layer thickness of the insulator is preferably 100 nm to 800 pm, preferably 1 pm to 100 pm, particularly preferably 1 pm to 15 pm. The layer thickness of the insulation layer is preferably 100 nm to 800 pm, preferably 1 pm to 100 pm, particularly preferably 1 pm to 15 pm. The insulator is preferably printed on the first side of the bridging section and / or on the first side of the first conductor track.In particular, if the insulator is to be arranged on a printed structure, such as the interrupted conductor track section of the first conductor track, the bridging section of the first conductor track and / or the second conductor track, the respective printed structure or all printed structures are preferably cured by a curing process - which, depending on the selected material of the printed structures, may include, for example, drying, reactive crosslinking, sintering and / or baking - before the insulator is arranged.

[0024] In a preferred embodiment of the invention, the method comprises the following step:

[0025] Arranging, in particular printing, an insulating layer on the first side of the second carrier layer and / or on the first side of the first carrier layer while leaving the end sections of the interrupted conductor track section free.

[0026] In this way, the first carrier layer is spaced apart from the second carrier layer, allowing a conductor structure with a substantially constant thickness or height to be produced. Preferably, the insulation layer is printed on the first side of the second carrier layer and / or on the first side of the first carrier layer.

[0027] In principle, various materials can be considered for the insulation layer, provided they are non-conductive (i.e., dielectric). The insulation layer material preferably contains at least one polymer. The insulation layer material is preferably identical to the insulator material.

[0028] In particular, the material of the insulation layer can be processed using a printing process, allowing the insulation layer to be produced particularly thinly, efficiently, and reliably. This allows the insulator and the insulation layer to be manufactured in a single operation.

[0029] The layer thickness of the insulation layer is preferably 100 nm to 800 pm, preferably 1 pm to 100 pm, particularly preferably 1 pm to 10 pm.

[0030] In a further preferred embodiment of the invention, the interrupted conductor track section of the first conductor track and the second conductor track have essentially the same layer height. This makes bridging the second conductor track easier. Furthermore, a conductor structure with a substantially constant thickness or height can be produced.

[0031] In a further preferred embodiment of the invention, the method comprises the following step:

[0032] Arranging, in particular printing, a conductive column structure on a first side of each end section of the interrupted conductor track section facing away from the first carrier layer and / or on the contact sections of the bridging section.

[0033] This facilitates the electrical contacting of the bridging section with the interrupted conductor track section. For example, the bridging section and the interrupted conductor track section can each be manufactured with a substantially uniform layer thickness. Due to the insulator arranged between the second conductor track and the bridging section, a gap exists between the bridging section and the interrupted conductor track section in the vertical direction or height direction, which can be bridged with the conductive column structures.

[0034] In principle, various inorganic materials (such as metals) and organic materials (such as conductive polymers, carbon, graphite, graphene, etc.) as well as combinations thereof can be used for the conductive column structures, provided they are conductive and can preferably be processed (e.g. as ink or paste) using printing and / or dispensing methods. The thickness of the conductive column structures is preferably 1 nm to 150 pm, particularly preferably 5 pm to 75 pm. The material used for the conductive column structures, in particular the ink or paste used therefor, preferably contains no volatile components. The conductive column structure is preferably reactively cured or dried before the carrier layers are brought together and / or before the insulation layer and / or the insulator are applied to the first carrier layer.

[0035] If the structure on which the conductive column structures are arranged, in particular printed, is itself produced by means of a printing process, the structure should be cured by an appropriate curing process (such as drying, sintering, baking) before the column structure is arranged.

[0036] In a further preferred embodiment of the invention, the insulator and / or the insulation layer is flowable or liquid when the carrier layers are brought together or combined, and is cured after the carrier layers have been brought together by a curing process which, depending on the material of the insulator or the insulation layer, can include irradiation (e.g. with UV light), drying and / or heating. In this way, the material of the insulator and / or the insulation layer can be distributed more evenly when the carrier layers are brought together and, for example, flow into any cavities or gaps that may be present, so that a robust composite structure is obtained. In individual cases, this can increase the flexibility for positioning the flowable material, for example on the carrier layers, which simplifies the design and manufacture of the conductor structure. Furthermore, the cured material of the insulator and / or the insulation layer can be used for adhesion orThey can contribute to or create the attachment of individual components of the conductor structure. For example, the two carrier layers can be attached to each other by the cured insulation layer. According to what has been described above and further below, the object posed at the outset is also achieved by a flexible conductor structure having the features of claim 8.

[0037] The flexible conductor structure according to the invention has a first and a second carrier layer, wherein a first side of the first carrier layer faces a first side of the second carrier layer.The following is arranged between the carrier layers: two non-conductively crossing conductor tracks which are arranged on the first side of the first carrier layer, wherein a first conductor track has a conductor track section interrupted by an interruption, wherein a second conductor track extends through the interruption of the conductor track section of the first conductor track, a bridging section which is arranged on the first side of the second carrier layer, wherein two spaced-apart contact sections are arranged on a first side of the bridging section facing away from the second carrier layer in such a way that they each establish an electrical connection with an end section of the interrupted conductor track section facing the interruption, an insulator which electrically insulates the bridging section and the second conductor track from one another.

[0038] In a preferred embodiment of the conductor structure according to the invention, it has an insulation layer spacing the first carrier layer from the second carrier layer, in particular wherein the insulation layer fastens the first carrier layer and the second carrier layer to one another.

[0039] In a further preferred embodiment of the inventive

[0040] In the conductor structure, the interrupted conductor track section of the first conductor track and the second conductor track have substantially the same layer height. In a further preferred embodiment of the conductor structure according to the invention, a conductive column structure is arranged between the contact sections of the bridging section and the end sections of the interrupted conductor track section.

[0041] In a further preferred embodiment of the conductor structure according to the invention, the insulator and / or the insulation layer are printed and in particular cured by a curing process.

[0042] In a further preferred embodiment of the conductor structure according to the invention, the interrupted conductor track section of the first conductor track and / or the second conductor track are printed onto the first carrier layer and, in particular, cured by a curing process; and / or the bridging section of the first conductor track is printed onto the second carrier layer and, in particular, cured by a curing process.

[0043] In a further preferred embodiment of the conductor structure according to the invention, it forms an antenna and / or a sensor or a part thereof. The present invention enables the simple production of extremely thin-layer conductor structures that are electrically and mechanically protected by the two carrier layers and are particularly suitable for thin (NFC) antennas or sensor loops for crack detection in conveyor belts.

[0044] It is expressly pointed out that the embodiments of the invention explained above can be combined individually or in any technically reasonable combination with each other with the subject matter of the independent claims.

[0045] Modifications and embodiments of the invention, as well as further advantages and details of the invention, can be found in the following description and the drawings. The schematic figures show:

[0046] Fig. 1 shows a part of a conductor structure according to an embodiment of the

[0047] Invention in a plan view;

[0048] Fig. 2a shows the part of the conductor structure according to the embodiment of Fig. 1 without conductor tracks in a sectional view along line AA;

[0049] Fig. 2b shows the part of the conductor structure according to the embodiment of Fig. 1 in a sectional view along line AA;

[0050] Fig. 2c shows the part of the conductor structure from Fig. 2b with added column structures;

[0051] Fig. 3a shows a further part of the conductor structure according to the embodiment of the invention in a sectional view;

[0052] Fig. 3b shows the part of the conductor structure from Fig. 3b with added bridging section;

[0053] Fig. 3b shows the part of the conductor structure from Fig. 3c with added insulator and added insulation layer; and

[0054] Fig. 4 a conductor structure according to the invention, obtained by

[0055] Merging or uniting the parts from Fig. 2c and Fig. 3c.

[0056] Parts that have the same or similar functions are provided with identical reference numbers where appropriate.

[0057] Individual technical features of the embodiments described below can also be combined with previously described embodiments as well as the features of the independent claims and any further claims to form subject matter according to the invention.

[0058] Fig. 1 shows a plan view of part of a conductor structure 1 with two non-conductively intersecting conductor tracks 10, 20 according to an embodiment of the invention. Printed on a first side 3010 of a first carrier layer 301 are a conductor track section 101 of the first conductor track 10 interrupted by an interruption U, as well as a second conductor track 20 extending through the interruption U of the conductor track section 101 of the first conductor track 10. The interrupted conductor track section 101 is to be electrically bridged without short-circuiting the conductor tracks 10, 20.

[0059] 2a to 2c show various manufacturing phases of part of the conductor structure 1 from Fig. 1 in a sectional view along line AA. Fig. 2a shows the first carrier layer 301 with its first side 3010 to be printed. The interrupted conductor track section 101 and the second conductor track 20 are printed onto this first side 3010 at the same layer height H1, as can be seen in Fig. 2b. The printed structures are then cured by a curing process - such as drying, sintering and / or baking. The interrupted conductor track section 101 has, on its first side 1010 facing away from the first carrier layer 301, two end sections 1011, 1012 facing the interruption U. A conductive column structure 103 is applied to each of these two end sections 1011, 1012, as can be seen in Fig. 2c.

[0060] 3a to 3c show various manufacturing phases of a further part of the conductor structure 1 according to the embodiment of the invention. Fig. 3a shows a second carrier layer 302 with its first side 3020 to be printed. A bridging section 102 of the first conductor track 10 is printed onto this first side 3020. The bridging section 102 is dimensioned and arranged on the second carrier layer 302 such that it can bridge the interrupted conductor track section 101. In particular, the bridging section 102 can correspond to the interrupted conductor track section 101 with regard to its material, width, and / or layer height. The printed bridging section 102 is cured by a curing process—such as drying, sintering, and / or baking.On its first side 1020 facing away from the second carrier layer 302, the bridging section 102 has two spaced-apart contact sections 1021, 1022 for the electrical connection to the end sections 1011, 1012 of the interrupted conductor track section 101 (see Fig. 2b). In the present case, the electrical connection is to be established indirectly via the column structures 103. An insulator 401 is printed onto the first side 1020 of the cured bridging section 102, leaving the two contact sections 1021, 1022 exposed, as shown in Fig. 3c. The insulator 401 is intended to electrically insulate the bridging section 102 from the second conductor track 20. Aside from the bridging section 102, an insulation layer 402 is further printed on the first side 3020 of the second carrier layer 302.The insulator 401 and the insulation layer 402 are preferably made of the same dielectric material and are applied in the same document.

[0061] Fig. 4 shows a conductor structure 1 according to the invention, as it is produced by bringing together or uniting the first carrier layer 301 from Fig. 2c and the second carrier layer 302 from Fig. 3c. The carrier layers 301, 302 are aligned such that the first side 3010 of the first carrier layer 301 faces the first side 3020 of the second carrier layer 302, the contact sections 1021, 1022 of the bridging section 102 each establish an electrical connection with an end section 1011, 1012 of the interrupted conductor track section 101 (indirectly via the conductive column structures 103), and the insulator 401 electrically insulates the bridging section 102 of the first conductor track 10 and the second conductor track 20 from one another. The insulator 401 and the insulation layer 402 are in a flowable, e.g., viscous, state when the carrier layers 301, 302 are brought together.In this way, the material of the insulator 401 can flow into the spaces between the end sections 1011, 1012 of the interrupted conductor track section 101 and the second conductor track 20, thus ensuring reliable electrical insulation of the intersecting conductor tracks 10, 20. Furthermore, the material of the insulation layer 402 can adhere to the first carrier layer 301 and the structures printed thereon, so that after curing of the insulation layer 402, the carrier layers 301, 302 together with the insulation layer 402 form a solid composite structure.

[0062] With the present invention, conductor structures 1 can be produced in a few manufacturing steps, in which the conductor tracks 10, 20 are enclosed or “sandwiched” between the two carrier layers 301, 302 and are thus electrically insulated on both sides and / or protected against external influences.

[0063] Although the method according to the invention can be used particularly advantageously in conjunction with printing technologies, other additive manufacturing processes, thin-film and vacuum technologies such as sputtering, evaporation (PVD, physical vapor deposition), chemical vapor deposition (CVD) are in principle also compatible with the invention described here.

[0064] It should also be noted that “having” does not exclude other elements or steps, and “a” or “an” does not exclude a plurality.

[0065] The scope of protection of the present invention is given by the claims and is not limited by the features explained in the description or shown in the figures.

Claims

Patent claims 1. A method for producing a particularly flexible conductor structure (1), with two non-conductively crossing conductor tracks (10, 20), in particular a conductor structure (1) according to one of claims 8 to 15, comprising the following steps - arranging a conductor track section (101) of a first conductor track (10) interrupted by an interruption (U) on a first side (3010) of a first carrier layer (301), - Arranging a second conductor track (20) extending through the interruption (U) of the conductor track section (101) of the first conductor track (10) on the first side (3010) of the carrier layer (301 ), - arranging a bridging section (102) of the first conductor track (10) on a first side (3020) of a second carrier layer (302), wherein the bridging section (102) is suitable for bridging the interrupted conductor track section (101), - Arranging an insulator (401) on one of the second carrier layers (302) facing away from the first side (1020) of the bridging section (102), leaving free two contact sections (1021, 1022) spaced apart from one another on the first side (1020) of the bridging section (102) and / or arranging the insulator (401) on a first side (2010) of the first conductor track (10) facing away from the first carrier layer (301), leaving free two end sections (1011, 1012) of the interrupted conductor track section (101) spaced apart from one another and facing the interruption (U), - Bringing together the carrier layers (301, 302) in such a way that o the first side (3010) of the first carrier layer (301) faces the first side (3020) of the second carrier layer (302), o the contact sections (1021, 1022) of the bridging section (102) each form an electrical connection with one of the end sections (1011, 1012) of the interrupted conductor track section (101), o the insulator (401) electrically insulates the bridging section (102) of the first conductor track (10) and the second conductor track (20) from each other.

2. The method according to claim 1, wherein the method comprises the following step: - Arranging an insulation layer (402) on the first side (3020) of the second carrier layer (302) and / or on the first side (3010) of the first carrier layer (301) while leaving the end sections (1011, 1012) of the interrupted conductor track section (101) free.

3. The method according to claim 1 or 2, wherein the interrupted conductor track section (101) of the first conductor track (10) and the second conductor track (20) have substantially the same layer height (H1).

4. A method according to any one of the preceding claims, wherein the method comprises the following step: - Arranging a respective conductive column structure (103) on a first side (1010) of each end section (1011, 1012) of the interrupted conductor track section (101) facing away from the first carrier layer (301) and / or on the contact sections (1021, 1022) of the bridging section (102).

5. Method according to one of the preceding claims, wherein the insulator (401) and / or the insulation layer (402) is flowable or liquid when the carrier layers (301, 302) are brought together and is cured by a curing process after the carrier layers (301, 302) have been brought together.

6. Method according to one of the preceding claims, wherein the interrupted conductor track section (101) of the first conductor track (10), the bridging section (102) of the first conductor track (10) and / or the second conductor track (20) is printed on the respective carrier layer (301, 302).

7. Method according to one of the preceding claims, wherein the bridging section (102) of the first conductor track (10), the interrupted conductor track section (101) of the first conductor track (10) and / or the second conductor track (20) is cured by a curing process before the insulator (401) is arranged.

8. Flexible conductor structure (1) with a first and a second carrier layer (301, 302), wherein a first side (3010) of the first carrier layer (301) faces a first side (3020) of the second carrier layer (302), between which the following is arranged: - two non-conductively crossing conductor tracks (10, 20) which are arranged on the first side (3010) of the first carrier layer (301), wherein a first conductor track (10) has a conductor track section (101) interrupted by an interruption (U), wherein a second conductor track (20) extends through the interruption (U) of the conductor track section (101) of the first conductor track (10), - a bridging section (102) arranged on the first side (3020) of the second carrier layer (302), wherein two contact sections (1021, 1022) spaced apart from one another are arranged on a first side (1020) of the bridging section (102) facing away from the second carrier layer (302) in such a way that they each establish an electrical connection with an end section (1011, 1012) of the interrupted conductor track section (101) facing the interruption (U), - an insulator (401) electrically insulating the bridging section (102) and the second conductor track (20) from one another.

9. Flexible conductor structure (1) according to claim 8, comprising a first carrier layer (301) spaced from the second carrier layer (302) Insulation layer (402), in particular wherein the insulation layer (402) fastens the first carrier layer (301) and the second carrier layer (302) to one another.

10. Flexible conductor structure (1) according to claim 8 or 9, wherein the interrupted conductor track section (101) of the first conductor track (10) and the second conductor track (20) have substantially the same layer height (H1).

11. Flexible conductor structure (1) according to one of claims 8 to 10, wherein a conductive column structure (103) is arranged between the contact sections (1021, 1022) of the bridging section (102) and the end sections (1011, 1012) of the interrupted conductor track section (101).

12. Flexible conductor structure (1) according to one of claims 8 to 11, wherein the insulator (401) and / or the insulation layer (402) are printed and in particular cured by a curing process.

13. Flexible conductor structure (1) according to one of claims 8 to 12, wherein the interrupted conductor track section (101) of the first conductor track (10) and / or the second conductor track (20) are printed onto the first carrier layer (301) and in particular are cured by a curing process; and / or wherein the bridging section (102) of the first conductor track (10) is printed onto the second carrier layer (301) and in particular is cured by a curing process.

14. Flexible conductor structure (1) according to one of claims 8 to 13, which forms an antenna (or a part thereof) and / or a sensor (or a part thereof).

Images