Inspection system, semiconductor manufacturing device, and inspection method

Abstract

This inspection system comprises a table, a camera, a first movement mechanism, a second movement mechanism, and a control unit. The control unit controls each of the camera, the first movement mechanism, and the second movement mechanism such that a plurality of items of first partial image data each representing mutually different parts of an electronic component are generated. The control unit executes: first processing for subjecting each of the plurality of items of first partial image data to correction taking into account the inclination of the camera with respect to a first axis, and correction taking into account the difference between an angle formed by the first axis and a second axis and a reference angle; second processing for generating composite image data by combining the plurality of corrected items of first partial image data; and third processing for inspecting the electronic component on the basis of the composite image data.

Description

Inspection system, semiconductor manufacturing equipment, and inspection method

[0001] The present invention relates to an inspection system, a semiconductor manufacturing apparatus, and an inspection method.

[0002] Japanese Patent Laid-Open Publication No. 2023-076250 (Patent Document 1) discloses an inspection system that inspects an object based on a captured image of the object, in which, for example, four objects are included in one captured image (see Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2023-076250

[0004] When an electronic component to be inspected is large, the electronic component may not fit within the field of view of the camera. Patent Document 1 does not disclose a method for inspecting an electronic component that does not fit within the field of view of the camera.

[0005] The present invention has been made to solve such problems, and its purpose is to provide an inspection system, semiconductor manufacturing apparatus, and inspection method that are capable of inspecting electronic components that are too large to fit within the field of view of a camera with relatively high accuracy.

[0006] An inspection system according to one aspect of the present invention includes a table, a camera, a first movement mechanism, a second movement mechanism, and a control unit. The table holds an electronic component. The camera captures an image of a portion of the electronic component and generates first partial image data. The first movement mechanism moves at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera along a first axis. The second movement mechanism moves at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera along a second axis. The control unit controls the camera, the first movement mechanism, and the second movement mechanism to generate multiple first partial image data, each of which represents a different portion of the electronic component. The control unit executes a first process that applies correction to each of the multiple first partial image data, taking into account the tilt of the camera with respect to the first axis and the difference between the angle formed by the first axis and the second axis and a reference angle; a second process that generates composite image data by combining the corrected multiple first partial image data; and a third process that inspects the electronic component based on the composite image data.

[0007] A semiconductor manufacturing apparatus according to another aspect of the present invention includes the inspection system described above and a manufacturing system. The manufacturing system manufactures electronic components. The electronic components are semiconductor devices. The inspection system inspects the electronic components manufactured by the manufacturing system.

[0008] An inspection method according to another aspect of the present invention is an inspection method using an inspection system. The inspection system includes a table, a camera, a first movement mechanism, and a second movement mechanism. The table holds an electronic component. The camera captures an image of a portion of the electronic component and generates first partial image data. The first movement mechanism moves at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera along a first axis. The second movement mechanism moves at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera along a second axis. The inspection method includes the steps of generating multiple partial image data, each of which represents a different portion of the electronic component; correcting each of the multiple partial image data in consideration of an inclination of the camera with respect to the first axis and a difference between an angle formed by the first axis and the second axis and a reference angle; generating composite image data by combining the corrected multiple partial image data; and inspecting the electronic component based on the composite image data.

[0009] According to the present invention, it is possible to provide an inspection system, semiconductor manufacturing apparatus, and inspection method that are capable of inspecting electronic components that are too large to fit within the field of view of a camera with relatively high accuracy.

[0010] 8 is a plan view schematically showing a cutting device. FIG. 9 is a view including a cross section of a schematically shown illumination unit. FIG. 10 is a view schematically showing the hardware configuration of a computer. FIG. 11 is a view for explaining a problem that occurs when raw partial image data is combined when a second optical inspection camera is tilted around the Z axis with respect to an inspection table. FIG. 12 is a view for explaining a problem that occurs when raw partial image data is combined when a rectangular object is captured as a trapezoid. FIG. 13 is a view for explaining a problem that occurs when raw partial image data is combined when the movement direction of the second optical inspection camera is misaligned with the Y axis. FIG. 14 is a flowchart showing a calibration procedure in the cutting device. FIG. 15 is a view for explaining tilt around the X axis. FIG. 16 is a view for explaining an overview of adjustment of tilt around the X axis. FIG. 17 is a flowchart showing processing executed in step S100 of FIG. 7. FIG. 18 is a view for explaining the distance between dots in a captured image of the calibration plate. FIG. 19 is a view including a table showing an example of the distance between dots in five captured images. FIG. 19 is a view for explaining an overview of a virtual plane. FIG. 19 is a view for explaining a procedure for generating a virtual plane. FIG. 19 is a flowchart showing processing executed in step S110 of FIG. 7. 17 is a flowchart showing the processing executed in step S120 of FIG. 7. It is a diagram for explaining an overview of correction of distortion aberration. It is a flowchart showing the processing executed in step S400 of FIG. 17. It is a diagram for explaining an overview of rotation correction when a partial image is tilted with respect to the X axis. It is a diagram for explaining a procedure for calculating the tilt of the second optical inspection camera about the Z axis with respect to the X axis. It is a flowchart showing the processing executed in step S410 of FIG. 17. It is a diagram for explaining an overview of keystone correction when a rectangular object to be imaged is captured as a trapezoid. It is a flowchart showing the processing executed in step S420 of FIG. It is a diagram for explaining an overview of axial angle correction when there is a deviation between the movement direction of the second optical inspection camera and the Y axis. It is a diagram for explaining a procedure for calculating the tilt of the movement direction of the second optical inspection camera with respect to the Y axis.Fig. 18 is a flowchart showing the process executed in step S430 of Fig. 17. Fig. 19 is a flowchart showing the procedure for inspecting electronic components that do not fit within the field of view of the second optical inspection camera.

[0011] An embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail below with reference to the drawings. Note that identical or corresponding parts in the drawings are designated by the same reference numerals, and their description will not be repeated. Furthermore, for ease of understanding, each drawing is drawn schematically with objects appropriately omitted or exaggerated. In the drawings, the X-axis and Y-axis are mutually orthogonal, the X-axis and Z-axis are mutually orthogonal, and the Y-axis and Z-axis are mutually orthogonal.

[0012] [1. Configuration] <1-1. Overall Configuration of Cutting Apparatus> Fig. 1 is a plan view schematically showing a cutting apparatus 1 according to the present embodiment. The cutting apparatus 1 is configured to cut a package substrate (an object to be cut) to separate the package substrate into a plurality of electronic components (package components). In a package substrate, a substrate or lead frame on which a semiconductor chip is mounted is sealed with resin. Note that the object to be cut does not necessarily have to be a package substrate, and may be, for example, a substrate (including a wafer) that is not sealed with resin. Substrates that are separated by cutting an unsealed substrate are also included in the "electronic components".

[0013] Examples of package substrates include a BGA (Ball Grid Array) package substrate, an LGA (Land Grid Array) package substrate, a CSP (Chip Size Package) package substrate, an LED (Light Emitting Diode) package substrate, and a QFN (Quad Flat No-leaded) package substrate.

[0014] The cutting device 1 is also configured to inspect each of the plurality of individual electronic components. In the cutting device 1, an image of each electronic component is captured, and each electronic component is inspected based on the image. Inspection data is generated through the inspection, and each electronic component is classified as a "good product" or a "defective product." The cutting device 1 particularly inspects electronic components that are too large to fit in a single captured image. The specific inspection procedure will be described later.

[0015] In this example, a package substrate P1 is used as the object to be cut, and the package substrate P1 is singulated into a plurality of electronic components S1 by the cutting device 1. Hereinafter, of the two surfaces of the package substrate P1, the resin-sealed surface will be referred to as the mold surface, and the surface opposite the mold surface will be referred to as the ball / lead surface. Note that when the object to be cut is a substrate that is not resin-sealed, the surface facing upward during cutting (cut surface) corresponds to the ball / lead surface in this embodiment, and the surface opposite the cut surface corresponds to the mold surface in this embodiment.

[0016] As shown in FIG. 1 , the cutting apparatus 1 includes, as its components, a cutting module A1 and an inspection and storage module B1. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1. The inspection and storage module B1 is configured to inspect each of the manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting apparatus 1, each component is detachable and replaceable with respect to the other components.

[0017] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6, and a transport unit 7.

[0018] The substrate supply unit 3 pushes out the package substrates P1 one by one from a magazine M1 that accommodates a plurality of package substrates P1, thereby supplying the package substrates P1 one by one to the positioning unit 4. At this time, the package substrate P1 is positioned with the ball / lead surface facing upward.

[0019] The positioning unit 4 positions the package substrate P1 by placing the package substrate P1 pushed out from the substrate supply unit 3 on the rail portion 4a. Thereafter, the positioning unit 4 transports the positioned package substrate P1 to the cutting table 5.

[0020] The cutting table 5 holds the package substrate P to be cut. In this example, a cutting device 1 having a twin-cut table configuration with two cutting tables 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotation mechanism 5b, and a movement mechanism 5c. The holding member 5a holds the package substrate P1 transported by the positioning unit 4 by suction from below. The rotation mechanism 5b can rotate the holding member 5a in the θ1 direction in the figure (i.e., rotate it in the XY horizontal plane in FIG. 1). The movement mechanism 5c can move the holding member 5a along the Y axis in the figure.

[0021] The spindle unit 6 cuts the package substrate P1 to separate the package substrate P1 into a plurality of electronic components S1. In this example, the cutting device 1 has a twin-spindle configuration having two spindle units 6. The spindle units 6 are movable along the X-axis and Z-axis in the figure. However, the cutting device 1 may also have a single-spindle configuration having one spindle unit 6.

[0022] The spindle portion 6 includes a blade 6a and a rotating shaft 6c. The blade 6a cuts the package substrate P1 by rotating at high speed, dividing the package substrate P1 into a plurality of electronic components S1. The blade 6a is attached to the rotating shaft 6c while being sandwiched between first and second flanges (not shown). The first and second flanges are fixed to the rotating shaft 6c by fastening members (not shown), such as nuts. The first flange is also referred to as a rear flange, and the second flange is also referred to as an outer flange.

[0023] The spindle 6 is provided with a cutting water nozzle, a cooling water nozzle, a cleaning water nozzle (none of which are shown), etc. The cutting water nozzle sprays cutting water toward the blade 6a rotating at high speed. The cooling water nozzle sprays cooling water. The cleaning water nozzle sprays cleaning water to wash away cutting chips and the like.

[0024] After the cutting table 5 has adsorbed the package substrate P1, the first position confirmation camera 5d captures an image of the package substrate P1 and confirms the position of the package substrate P1. The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the package substrate P1. The mark is, for example, a mark for determining the cutting position of the package substrate P1.

[0025] The cutting table 5 then moves toward the spindle unit 6 along the Y-axis in the figure. After the cutting table 5 moves below the spindle unit 6, it is aligned, and then the cutting table 5 and the spindle unit 6 are moved relative to each other to cut the package substrate P1. Every time the package substrate P1 is cut by the blade 6a of the spindle unit 6, the package substrate P1 is imaged and confirmed by the second position confirmation camera 6b provided on the spindle unit 6. Confirmation using the second position confirmation camera 6b includes, for example, confirmation of the cut position and cut width of the package substrate P1.

[0026] After cutting of the package substrate P1 is completed, the cutting table 5, with the plurality of singulated electronic components S1 held by suction, moves along the Y axis in the direction away from the spindle unit 6. During this movement, the first cleaner 5e cleans and dries the top surfaces (ball / lead surfaces) of the electronic components S1.

[0027] The transport unit 7 picks up the electronic component S1 held on the cutting table 5 from above and transports the electronic component S1 to the inspection table 11 of the inspection and storage module B1. During this transport process, the second cleaner 7a cleans and dries the lower surface (mold surface) of the electronic component S1.

[0028] The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, illumination units 16 and 17, a placement unit 14, and an extraction unit 15. The first optical inspection camera 12 may be provided in the cutting module A1.

[0029] The inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis in the figure. The inspection table 11 can also be turned upside down. The inspection table 11 is provided with a holding member that holds the electronic component S1 by suction. The surface of the inspection table 11 that holds the electronic component S1 is made of, for example, black rubber. The color of the rubber does not have to be black and may be, for example, white.

[0030] The first optical inspection camera 12 and the second optical inspection camera 13 capture images of the mold surface and the ball / lead surface of the electronic component S1, respectively. Various inspections of the electronic component S1 are performed based on the captured images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are each positioned near the inspection table 11 so as to capture images above. The first optical inspection camera 12 and the second optical inspection camera 13 are each movable along the Y axis in the figure. As will be described in detail later, the direction in which the first optical inspection camera 12 and the second optical inspection camera 13 move may not be completely parallel to the Y axis. The captured images generated by the first optical inspection camera 12 and the second optical inspection camera 13 are, for example, grayscale (256-level) images.

[0031] The first optical inspection camera 12 captures an image of the mold surface of the electronic component S1 being transported to the inspection table 11 by the transport unit 7. The transport unit 7 then places the electronic component S1 on a holding member of the inspection table 11. The inspection table 11 is then turned upside down after suctioning the electronic component S1. The inspection table 11 moves above the second optical inspection camera 13, and the ball / lead surface of the electronic component S1 is imaged by the second optical inspection camera 13.

[0032] An illumination unit 16 is provided above the first optical inspection camera 12, and an illumination unit 17 is provided above the second optical inspection camera 13. Each of the illumination units 16, 17 is configured, for example, as a so-called coaxial illumination and / or a dome-shaped illumination. The illumination unit 16 is configured to irradiate light onto the electronic component S1 on the inspection table 11 during inspection by the first optical inspection camera 12. The illumination unit 17 is configured to irradiate light onto the electronic component S1 on the inspection table 11 during inspection by the second optical inspection camera 13. Since the illumination units 16, 17 have, for example, the same configuration, the configuration of the illumination unit 17 will be described below as a representative example.

[0033] 2 is a diagram including a schematic cross section of the illumination unit 17. As shown in FIG. 2, in inspection by the second optical inspection camera 13, light emitted by the illumination unit 17 is irradiated onto the electronic component S1. With the light irradiated onto the electronic component S1, the second optical inspection camera 13 generates a captured image of the electronic component S1. Based on this captured image, the electronic component S1 is inspected.

[0034] The illumination unit 17 is configured as a dome-shaped illumination and includes a dome 17a and multiple LEDs 17b. The dome-shaped illumination may be, but is not necessarily, a so-called dome illumination. It is sufficient that the illumination unit includes a dome-shaped (umbrella-shaped) component and multiple light-emitting components (e.g., LEDs) arranged within the component. The dome 17a has a dome shape, and the shape of the dome 17a is circular in a plan view. Multiple LEDs 17b are arranged on the inner surface of the dome 17a. The illumination unit 17 has multiple segments (Ch01 to Ch08) formed radially from the inside to the outside of the dome 17a. The illumination unit 17 is a so-called multi-channel illumination in which the brightness of each segment can be individually adjusted. In each of the multiple segments, multiple LEDs 17b are arranged at predetermined intervals around the circumference of the dome 17a.

[0035] 1, the inspected electronic component S1 is placed on the placement unit 14. The placement unit 14 is movable along the Y axis in the figure. The inspection table 11 places the inspected electronic component S1 on the placement unit 14.

[0036] The extraction unit 15 transfers the electronic components S1 placed in the placement unit 14 to a tray. The electronic components S1 are sorted into "good products" or "defective products" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each electronic component S1 to a good product tray 15a or a defective product tray 15b based on the results of the sorting. That is, good products are stored in the good product tray 15a, and defective products are stored in the defective product tray 15b. When the good product tray 15a and the defective product tray 15b are each filled with electronic components S1, they are replaced with new trays.

[0037] The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is configured with a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor, for example.

[0038] The computer 50 controls the operation of each part of the cutting module A1 and the inspection and storage module B1, for example, the board supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the transport unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the lighting units 16 and 17, the placement unit 14, the extraction unit 15, and the monitor 20.

[0039] Furthermore, the computer 50 performs various inspections of the electronic component S1 based on, for example, image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. Next, the computer 50 will be described in detail.

[0040] <1-2. Hardware Configuration of Computer> Fig. 3 is a diagram schematically illustrating the hardware configuration of the computer 50. As shown in Fig. 3, the computer 50 includes a control unit 70, an input / output I / F (interface) 90, a reception unit 95, and a storage unit 80, and each component is electrically connected via a bus.

[0041] The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, and a ROM (Read Only Memory) 76. The control unit 70 is configured to control the components in the computer 50 and the components in the cutting device 1 in accordance with information processing.

[0042] The input / output I / F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input / output I / F 90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50. The reception unit 95 is configured to receive instructions from a user. The reception unit 95 is configured with, for example, some or all of a touch panel, a keyboard, a mouse, and a microphone.

[0043] The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store, for example, a control program 81. The control program 81 is executed by the control unit 70 to realize various operations in the cutting device 1. When the control unit 70 executes the control program 81, the control program 81 is loaded into the RAM 74. The control unit 70 then controls each component by using the CPU 72 to interpret and execute the control program 81 loaded into the RAM 74.

[0044] [2. Inspection of Electronic Components Too Large to Fit Within the Camera's Field of View] As described above, the cutting device 1 inspects electronic components. Specifically, various inspections of the electronic component S1 are performed based on captured images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. The following describes inspection using the second optical inspection camera 13 as a representative example. Note that similar processing is also performed in inspection using the first optical inspection camera 12.

[0045] It is conceivable that each electronic component S1 held on the inspection table 11 is large in size and does not fit within the field of view (angle of view) of the second optical inspection camera 13. In such a case, in the cutting device 1, multiple partial image data, each representing a different portion of the electronic component S1, are generated by the second optical inspection camera 13, and the partial image data are combined. The partial image data are combined to generate composite image data. The composite image data represents an image of the entire electronic component S1. In the cutting device 1, the electronic component S1 is inspected based on the composite image data.

[0046] If the unprocessed partial image data are combined, there may be a large misalignment of the images at the boundaries (seams) between the partial images. Examples of factors that cause the misalignment include distortion of the lens included in the second optical inspection camera 13, tilt of the second optical inspection camera 13 about the Z axis (relative to the X axis) with respect to the inspection table 11, a phenomenon in which the rectangular electronic component S1 is captured as a trapezoid even if the misalignment caused by the lens distortion and the tilt of the second optical inspection camera 13 is corrected, and a misalignment between the movement direction of the second optical inspection camera 13 and the Y axis.

[0047] 4 is a diagram illustrating a problem that occurs when raw partial image data is combined when the second optical inspection camera 13 is tilted about the Z axis with respect to the inspection table 11. Referring to FIG. 4, when the second optical inspection camera 13 is tilted about the Z axis with respect to the inspection table 11, partial images tilted about the X axis are captured. Each of the partial images PI1, PI2, and PI3, for example, represents a different portion of the imaged object. When the partial images PI1, PI2, and PI3 are combined, a composite image IM1 is generated. In the composite image IM1, for example, a line that originally extends in a straight line parallel to the X axis becomes discontinuous at the boundary between the partial images.

[0048] FIG. 5 is a diagram illustrating a problem that occurs when raw partial image data is combined when a rectangular object is captured as a trapezoid. Referring to FIG. 5 , for example, even if distortions caused by lens distortion aberrations of the second optical inspection camera 13 are corrected, the rectangular object may still be captured as a trapezoid. In partial image PI4, for example, a 100 mm range is captured on the left side and a 105 mm range is captured on the right side. As a result, the rectangular object is captured as a trapezoid. In such a case, for example, when a partial image showing the left half of the object and a partial image showing the right half of the object are combined, a composite image IM2 is generated. In composite image IM2, for example, a line that originally extends in a straight line becomes discontinuous at the boundary between the partial images.

[0049] FIG. 6 is a diagram illustrating a problem that occurs when raw partial image data is combined when the movement direction of the second optical inspection camera 13 is misaligned with the Y axis. Referring to FIG. 6 , as described above, the movement direction of the second optical inspection camera 13 may not be completely parallel to the Y axis. In such a case, for example, assume that partial images PI5, PI6, PI7, PI8, and PI9 are captured consecutively. The partial images PI5, PI6, PI7, PI8, and PI9 represent, for example, different portions of the imaged object. When the partial images PI5, PI6, PI7, PI8, and PI9 are combined, a composite image IM3 is generated. In the composite image IM3, for example, a line that would normally extend diagonally upward becomes discontinuous at the boundaries of the partial images.

[0050] When the unprocessed partial image data are combined, the misalignment of the images at the boundaries between the partial images may become significant. In the cutting device 1, each partial image data is corrected before combining the partial image data. Specifically, each partial image data is corrected to account for the tilt of the second optical inspection camera 13 relative to the X-axis and the difference between the angle formed by the axis corresponding to the movement direction of the second optical inspection camera 13 and the X-axis and a reference angle (e.g., 90°). The partial image data are then combined after various corrections have been applied. Because the partial image data are combined after various corrections have been applied, misalignment that may occur at the boundaries between the partial image data in the combined image data is suppressed. Therefore, the cutting device 1 can inspect the electronic component S1 based on the combined image data with relatively high accuracy.

[0051] In the cutting device 1, correction of the partial image is performed by using various correction data. The various correction data is generated in advance through calibration of the cutting device 1. In the cutting device 1, inspection of the electronic component S1 is performed by using the various correction data generated in advance. The calibration operation and the inspection operation will be described below in order.

[0052] 7 is a flowchart showing the calibration procedure in the cutting apparatus 1. Referring to FIG. 7, the operator adjusts the tilt of the second optical inspection camera 13 (step S100). For example, the tilt of the second optical inspection camera 13 is adjusted so that the tilt of the second optical inspection camera 13 with respect to the inspection table 11 around the X-axis (hereinafter also referred to as the "tilt about the X-axis") and the tilt of the second optical inspection camera 13 with respect to the inspection table 11 around the Y-axis (hereinafter also referred to as the "tilt about the Y-axis") each approach 0°.

[0053] 8 is a diagram for explaining tilt about the X-axis. Referring to Fig. 8, in this example, the second optical inspection camera 13 is tilted about the X-axis at an angle θ1 with respect to the inspection table 11. When adjusting the tilt of the second optical inspection camera 13, a calibration plate is set on the inspection table 11.

[0054] 9 is a diagram schematically illustrating a plane of the calibration plate PL1. As shown in FIG. 9, a plurality of dots of the same size are aligned at equal intervals in the vertical and horizontal directions on the calibration plate PL1. In the cutting device 1, calibration is performed based on the shapes of the dots in the captured image.

[0055] 8, in this example, the inspection table 11 is not completely flat but is slightly warped. In this case, the tilt around the X axis changes as the second optical inspection camera 13 moves in the X and Y directions.

[0056] FIG. 10 is a diagram for explaining an overview of the adjustment of the tilt around the X-axis. Referring to FIG. 10 , the diagram on the left shows tilt information AN1 for each imaging position before the adjustment of the tilt around the X-axis, and the diagram on the right shows tilt information AN1 for each imaging position after the adjustment of the tilt around the X-axis. Each piece of tilt information AN1 indicates the tilt around the X-axis at each imaging position. For example, each piece of tilt information AN1 is calculated using various known methods based on the captured image. The tilt around the X-axis is adjusted by manually adjusting the tilt of the second optical inspection camera 13 around the X-axis. For example, the tilt information AN1 for each imaging position is displayed on the monitor 20, and the operator adjusts the tilt of the second optical inspection camera 13 while checking the monitor 20. When it is determined that the tilt around the X-axis for each imaging position falls within the desired range, the operator ends the adjustment of the tilt around the X-axis. For example, after completing the adjustment of the tilt around the X axis, the operator may adjust the tilt around the Y axis using the same procedure as for adjusting the tilt around the X axis, or may adjust the tilt around the Y axis using the same procedure as for adjusting the tilt around the X axis in parallel with the adjustment of the tilt around the X axis.

[0057] 11 is a flowchart showing the processing executed in step S100 of FIG. 7. In the cutting device 1, a plurality of imaging positions (imaging positions) during calibration are determined in advance. The imaging positions (imaging positions) refer to the positions of the second optical inspection camera 13 on the XY plane. In this example, the tilt around the X axis is adjusted first, and then the tilt around the Y axis is adjusted. Since the procedures for adjusting the tilt around the X axis and the Y axis are substantially the same, only the procedure for adjusting the tilt around the X axis will be described here.

[0058] 11 , the control unit 70 controls the second optical inspection camera 13 to begin capturing an image of the calibration plate PL1 held on the inspection table 11 (step S200). The control unit 70 controls at least one of the inspection table 11 and the second optical inspection camera 13 to move to an imaging position among a plurality of predetermined imaging positions that has not yet been imaged (step S210). The control unit 70 controls the second optical inspection camera 13 to perform autofocus (AF) (step S220). The autofocus is performed by adjusting the position of the second optical inspection camera 13 on the Z axis. When the second optical inspection camera 13 is in focus, the control unit 70 acquires coordinate information of the second optical inspection camera 13 on the Z axis (step S230).

[0059] The control unit 70 determines whether or not imaging at all predetermined imaging positions has been completed (step S240). If it is determined that imaging at all predetermined imaging positions has not been completed (NO in step S240), the control unit 70 executes the process of step S210 again.

[0060] On the other hand, if it is determined that imaging has been completed at all of the predetermined imaging positions (YES in step S240), control unit 70 determines whether imaging has been performed a predetermined number of times at all of the imaging positions (step S250).If it is determined that imaging has not been performed a predetermined number of times at all of the imaging positions (NO in step S250), control unit 70 executes the process of step S200 again.

[0061] On the other hand, if it is determined that imaging has been performed the predetermined number of times at all imaging positions (YES in step S250), control unit 70 extracts an average image taken at each imaging position and calculates the tilt about the X axis at each imaging position based on the average image taken (step S260). The calculation result is displayed on monitor 20, for example.

[0062] Even if images of the calibration plate PL1 are taken at the same imaging position, the positions of the dots in the captured image will be slightly shifted due to the mechanical accuracy and image processing accuracy of the inspection table 11 and the second optical inspection camera 13. Taking such circumstances into consideration, images are taken a predetermined number of times at all imaging positions, and the tilt about the X-axis is calculated based on the average captured image. Note that which captured image corresponds to the average captured image is determined based on the distance between dots in the captured image.

[0063] 12 is a diagram illustrating the inter-dot distance in a captured image of the calibration plate PL1. Referring to FIG. 12, the inter-dot distance includes a distance AD1 between the dots DO1 in the X-axis direction and a distance BD1 between the dots DO1 in the Y-axis direction. For example, the captured image in which the distance AD1 and the distance BD1 are closest to the average value is extracted as the average captured image.

[0064] 13 is a diagram including a table showing an example of inter-dot distances in five captured images. In this example, in the captured image with n=3, the distances AD1 and BD1 are closest to the average values. Therefore, the captured image with n=3 is extracted as the average captured image.

[0065] 11 , after the process of step S260 is executed, the operator checks the tilt about the X-axis at each imaging position displayed on the monitor 20 and determines whether the tilt about the X-axis at each imaging position satisfies a predetermined criterion (step S270). If it is determined that the tilt about the X-axis at each imaging position satisfies the predetermined criterion (YES in step S270), the tilt adjustment of the second optical inspection camera 13 is completed.

[0066] On the other hand, if it is determined that the tilt around the X-axis at each imaging position does not satisfy the predetermined standard (NO in step S270), the operator issues an instruction to readjust the tilt of second optical inspection camera 13, for example, via reception unit 95 of computer 50. When the readjustment instruction is issued, control unit 70 controls second optical inspection camera 13 so that it moves to a position with an average tilt around the X-axis among the multiple imaging positions (step S280). Thereafter, the operator manually adjusts the tilt around the X-axis of second optical inspection camera 13 (step S290). When the manual adjustment is completed, the process of step S200 is executed again.

[0067] 7 , once the tilt adjustment of second optical inspection camera 13 is completed, control unit 70 of computer 50 generates a virtual plane based on the multiple partial image data generated by second optical inspection camera 13 (step S110). The virtual plane is a plane for estimating the focus position (z) for each imaging position (x, y). The focus position is the position of second optical inspection camera 13 on the Z axis when in focus.

[0068] 14 is a diagram for explaining an overview of the virtual plane. For example, when the inspection table 11 is slightly tilted, the focus position of the second optical inspection camera 13 differs depending on the imaging position. For example, the focus positions at the positions of the second optical inspection camera 13 shown at both ends are actually detected, and the focus position at the position of the second optical inspection camera 13 shown in the center is estimated based on the virtual plane VP1.

[0069] FIG. 15 is a diagram for explaining the procedure for generating a virtual plane. Referring to FIG. 15, the upper left diagram shows points D1, D2, D3, and D4 on the XY plane. Each of points D1, D2, D3, and D4 corresponds to an imaging position by second optical inspection camera 13. A calibration plate PL1 is set on inspection table 11 when the virtual plane is generated. For example, if inspection table 11 is warped even slightly, it is assumed that the focus positions (positions on the Z axis) at points D1, D2, D3, and D4 are different from one another. First, the focus positions at points D1, D2, D3, and D4 are detected.

[0070] The diagram on the upper right shows points D1, D2, D3, and D4 in XYZ space from a diagonal upward angle. The (x, y) of each of points D1, D2, D3, and D4 indicates a coordinate position on the XY plane, and the (z) of each of points D1, D2, D3, and D4 indicates a focus position. A tetrahedron is formed by connecting points D1, D2, D3, and D4. In this case, consider a virtual plane for estimating the focus position of point DX1(x, y). When viewed from directly above, point DX1 intersects with two faces of the tetrahedron.

[0071] That is, point DX1 intersects with plane FA1 as shown in the lower left diagram, and also intersects with plane FA3 as shown in the lower center diagram. In this case, the focus position at point DX1 is likely to be located on the midplane between planes FA1 and FA3.

[0072] The diagram on the lower right is a diagram for explaining a method for deriving the intermediate plane between the surfaces FA1 and FA3. The intermediate plane between the surfaces FA1 and FA3 is a plane connecting points D1, D2, and D5. The coordinates of point D5 are the average of the coordinates of points D1, D2, D3, and D4. The equation representing the intermediate plane between the surfaces FA1 and FA3 is derived, for example, by using various known methods based on the coordinates of each of points D1, D2, and D5. The focus position at point DX1 is estimated by substituting (x, y) of point DX1 into the equation representing the intermediate plane. In other words, this intermediate plane is used as a virtual plane. Note that the method for deriving the virtual plane is not limited to this. For example, the virtual plane may be derived based on the (x, y, z) of four or more points surrounding the imaging position.

[0073] Fig. 16 is a flowchart showing the process executed in step S110 of Fig. 7. Referring to Fig. 16, the processes from step S300 to step S340 are the same as the processes from step S200 to step S240 of Fig. 11, respectively, and therefore description thereof will not be repeated.

[0074] If it is determined in step S340 that imaging at all predetermined imaging positions has been completed (YES in step S340), the control unit 70 generates a virtual plane based on each imaging position and the focus position (step S350). Note that the virtual plane does not necessarily have to be generated in advance; the (x, y, z) coordinates at each imaging position may simply be stored in the storage unit 80. During inspection of the electronic component S1, the virtual plane may be generated each time based on the (x, y, z) coordinates at each of at least three points surrounding the imaging position captured by the second optical inspection camera 13.

[0075] 7, once the virtual plane is generated, the control unit 70 uses the generated virtual plane to acquire various correction data (step S120), including distortion correction data, rotation correction data, trapezoid correction data, and axis angle correction data.

[0076] Fig. 17 is a flowchart showing the process executed in step S120 of Fig. 7. Referring to Fig. 17, control unit 70 executes a process for acquiring distortion correction data (step S400).

[0077] FIG. 18 is a diagram for explaining an overview of distortion correction. Referring to FIG. 18 , in this example, pincushion distortion is corrected. The distortion to be corrected may be barrel distortion. The distortion correction data is data for correcting distortion. The distortion correction data is acquired, for example, by using various known methods based on the image captured by the second optical inspection camera 13.

[0078] Fig. 19 is a flowchart showing the process executed in step S400 of Fig. 17. Referring to Fig. 19, the processes of steps S500, S510, S540 and S550 are the same as the processes of steps S200, S210, S240 and S250 of Fig. 11, respectively, and therefore description thereof will not be repeated.

[0079] In step S510, when the second optical inspection camera 13 has completed moving to an imaging position among the predetermined plurality of imaging positions where an image has not yet been captured, the control unit 70 controls the second optical inspection camera 13 to adjust the Z-axis coordinate position based on the virtual plane (step S520). After completing the adjustment of the Z-axis coordinate position, the control unit 70 controls the second optical inspection camera 13 to capture a partial image of the calibration plate PL1 (step S530).

[0080] If it is determined that imaging has been performed the predetermined number of times at all imaging positions (YES in step S550), the control unit 70 extracts an average image captured at each imaging position (step S560), and generates distortion correction data based on the extracted average image (step S570).

[0081] Referring again to FIG. 17, once the distortion correction data is acquired, control unit 70 executes a process for acquiring rotation correction data (step S410).

[0082] FIG. 20 is a diagram illustrating an overview of rotation correction when a partial image is tilted with respect to the X-axis. Referring to FIG. 20 , in this example, each of the partial images PI10 and PI11 is tilted by an angle θ2 with respect to the X-axis. In the cutting device 1, rotation correction of each partial image is performed by cutting out an area parallel to the X-axis from each partial image. Because of this rotation correction, adjacent partial images PI10 and PI11 partially overlap. The rotationally corrected partial images PI10 and PI11 are combined to generate a composite image IM4. To perform this rotation correction, it is necessary to calculate the tilt of the second optical inspection camera 13 around the Z-axis with respect to the X-axis (angle θ2: rotation correction data).

[0083] FIG. 21 is a diagram illustrating a procedure for calculating the tilt of the second optical inspection camera 13 around the Z axis with respect to the X axis. Referring to FIG. 21 , the axis AX1 is, for example, a row of dots DO1 shown on the calibration plate PL1. The partial images PI12 and PI13 have different X coordinates for their imaging positions, but the same Y coordinates. Factors that cause the dots DO1 to be imaged obliquely in each of the partial images PI12 and PI13 include (1) the tilt of the second optical inspection camera 13 around the Z axis with respect to the X axis, and (2) the tilt of the calibration plate PL1 on the inspection table 11. In other words, the angle of the axis AX1 in each of the partial images PI12 and PI13 is the sum of the above factors (1) and (2).

[0084] On the other hand, in this example, when focusing on a specific dot DO1, as the imaging position moves X1 on the X axis, the position of the specific dot DO1 moves Y1 on the Y axis. The resulting tilt (angle θ3) is due to (2) above. Therefore, (1) above can be calculated by subtracting angle θ3 from the angle of axis AX1 in each of partial images PI12 and PI13.

[0085] Fig. 22 is a flowchart showing the processing executed in step S410 of Fig. 17. Referring to Fig. 22, the processing of steps S600, S610, S620, S630, S650, S660, and S670 is the same as the processing of steps S500, S510, S520, S530, S540, S550, and S560 of Fig. 19, respectively, and therefore description thereof will not be repeated.

[0086] When the partial images are captured in step S630, the control unit 70 performs distortion correction on the partial image data using the distortion correction data (step S640).When the average captured images at each imaging position are extracted in step S670, the control unit 70 generates rotation correction data based on the extracted average captured images (step S680).

[0087] Referring again to FIG. 17, once the rotation correction data is acquired, control unit 70 executes a process for acquiring keystone correction data (step S420).

[0088] FIG. 23 is a diagram illustrating an overview of keystone correction when a rectangular object is captured as a trapezoid. Referring to FIG. 23 , as described above, for example, even if distortions due to lens distortion aberration of the second optical inspection camera 13 are corrected, the rectangular object may still be captured as a trapezoid. In the partial image PI14, for example, a 100 mm range is captured on the left side and a 105 mm range is captured on the right side. As a result, the rectangular object is captured as a trapezoid. In the keystone correction, for example, correction is performed on the partial image PI14 so that the captured ranges on the left side and the right side are the same, and the captured ranges on the top side and the bottom side are the same. As a result, the rectangular object has an accurate shape in the corrected partial image PI15. The keystone correction data required for such correction can be obtained using various known methods, such as affine transformation.

[0089] Fig. 24 is a flowchart showing the processing executed in step S420 of Fig. 17. Referring to Fig. 24, the control unit 70 performs rotation correction on the average captured image at each imaging position extracted in step S670 of Fig. 22 (step S700). The control unit 70 generates keystone correction data such that, in the captured image after rotation correction, the imaging range on the left side and the imaging range on the right side are the same and the imaging range on the top side and the imaging range on the bottom side are the same (step S710).

[0090] Referring again to FIG. 17, once the keystone correction data is acquired, the control unit 70 executes a process for acquiring shaft angle correction data (step S430).

[0091] 25 is a diagram for explaining an overview of axial angle correction when there is a misalignment between the movement direction of second optical inspection camera 13 and the Y axis. Referring to FIG. 25, when there is a misalignment between the movement direction of second optical inspection camera 13 and the Y axis, partial images PI16 and PI17 are corrected by adjusting (offsetting) the image cutout position in each of the partial images. The corrected partial images are combined to generate a composite image IM5.

[0092] 26 is a diagram for explaining the procedure for calculating the tilt of the movement direction of second optical inspection camera 13 relative to the Y axis. The offset amount of the cutout position is determined based on the tilt of the movement direction of second optical inspection camera 13 relative to the Y axis.

[0093] 26 , the axis AX2 is, for example, the row of dots DO1 shown on the calibration plate PL1. The partial images PI18 and PI19 have the same X coordinate for their imaging positions, but different Y coordinates. Factors that cause the dots DO1 to be imaged obliquely in each of the partial images PI18 and PI19 include (A) the inclination of the movement direction of the second optical inspection camera 13 relative to the Y axis (axis angle correction data) and (B) the inclination of the calibration plate PL1 on the inspection table 11. In other words, the angle of the axis AX2 in each of the partial images PI18 and PI19 is the sum of the above factors (A) and (B).

[0094] On the other hand, in this example, when focusing on a specific dot DO1, as the imaging position moves Y2 on the Y axis, the position of the specific dot DO1 moves X2 on the X axis. The resulting tilt (angle θ4) is due to (B) above. Therefore, (A) above can be calculated by subtracting angle θ4 from the angle of axis AX2 in each of partial images PI18 and PI19.

[0095] Fig. 27 is a flowchart showing the processing executed in step S430 of Fig. 17. Referring to Fig. 27, the processing of steps S800, S810, S820, S830, S850, S860, and S870 is the same as the processing of steps S600, S610, S620, S630, S650, S660, and S670 of Fig. 22, respectively, and therefore description thereof will not be repeated.

[0096] When the partial images are captured in step S830, the control unit 70 performs distortion correction using the distortion correction data, rotation correction using the rotation correction data, and keystone correction using the keystone correction data, in that order, on the partial image data (step S840). When the average captured images at each imaging position are extracted in step S870, the control unit 70 generates axis angle correction data based on the extracted average captured images (step S880). In this way, a virtual plane and various correction data are generated through calibration.

[0097] 28 is a flowchart showing the procedure for inspecting an electronic component S1 that does not fit within the field of view of the second optical inspection camera 13. The process shown in this flowchart is executed by the control unit 70 of the computer 50 at a predetermined interval.

[0098] 28 , the control unit 70 determines a plurality of imaging positions based on the layout information of the electronic component S1 to be inspected (step S900). The control unit 70 controls the second optical inspection camera 13 to start imaging the electronic component S1 held on the inspection table 11 (step S910). The control unit 70 controls at least one of the inspection table 11 and the second optical inspection camera 13 to move to an imaging position among the plurality of predetermined imaging positions that has not yet been imaged (step S920).

[0099] The control unit 70 calculates the Z-axis coordinate position based on the virtual plane and controls the second optical inspection camera 13 to move to the calculated Z-axis coordinate position (step S930). After completing the adjustment of the Z-axis coordinate position, the control unit 70 controls the second optical inspection camera 13 to capture a partial image of the electronic component S1 (step S940). In this way, in the cutting device 1, the focus position of the second optical inspection camera 13 along the Z-axis is individually adjusted when generating the partial image data. The control unit 70 performs distortion correction using the distortion correction data, rotation correction using the rotation correction data, and keystone correction using the keystone correction data on the partial image data in this order (step S950).

[0100] The control unit 70 determines whether or not imaging at all predetermined imaging positions has been completed (step S960). If it is determined that imaging at all predetermined imaging positions has not been completed (NO in step S960), the control unit 70 executes the process of step S920 again.

[0101] On the other hand, if it is determined that imaging at all predetermined imaging positions has been completed (YES in step S960), the control unit 70 performs offset (axis correction) of the partial image data using the axis correction data (step S970). The control unit 70 generates composite image data by combining the partial image data that have been subjected to various corrections (step S980). The control unit 70 inspects and measures the electronic component S1 based on the composite image data (step S990). Inspection of the electronic component S1 includes an appearance inspection of the electronic component S1, and measurement of the electronic component S1 includes measuring the length of each portion of the electronic component S1.

[0102] [4. Features] As described above, in the cutting device 1, each of the plurality of partial image data is subjected to correction that takes into account the tilt of the camera with respect to the X-axis, as well as correction that takes into account the difference between the angle formed by the axis along the movement direction of the second optical inspection camera 13 and the X-axis and the reference angle (90°), and then the plurality of partial image data are combined. Because the plurality of partial image data are combined after various corrections have been applied, deviations that may occur at the boundaries between the partial image data in the combined image data are suppressed. Therefore, the cutting device 1 can inspect the electronic component S1 based on the combined image data with relatively high accuracy.

[0103] Furthermore, in the cutting apparatus 1, the focus position is adjusted individually when each of the plurality of partial image data is generated. Therefore, the cutting apparatus 1 can generate each of the plurality of partial image data by using the second optical inspection camera 13 set to an appropriate focus position. As a result, the cutting apparatus 1 can inspect the electronic component S1 with relatively high accuracy.

[0104] In the cutting device 1, a correction that takes into account the tilt of second optical inspection camera 13 with respect to the X-axis and a correction that takes into account the difference between the angle formed by the movement direction of second optical inspection camera 13 and the X-axis and the reference angle (90°) (the tilt of the movement direction of second optical inspection camera 13 with respect to the Y-axis) are applied to each of the multiple partial image data in this order. The reason for applying the corrections in this order is as follows. As described above, the tilt of second optical inspection camera 13 with respect to the X-axis can be calculated based on the image captured by second optical inspection camera 13, even without correction that takes into account the tilt of the movement direction of second optical inspection camera 13 with respect to the Y-axis. On the other hand, the tilt of the movement direction of second optical inspection camera 13 with respect to the Y-axis cannot be calculated based on the image captured by second optical inspection camera 13 when correction that takes into account the tilt of second optical inspection camera 13 with respect to the X-axis has not been applied. This is because a captured image that has not been corrected to take into account the tilt of second optical inspection camera 13 relative to the X-axis is affected by both the tilt of second optical inspection camera 13 relative to the X-axis and the tilt of second optical inspection camera 13 relative to the Y-axis, which is the direction of movement of second optical inspection camera 13. Therefore, in cutting device 1, correction that takes into account the tilt of the camera relative to the X-axis is performed first. Because multiple partial image data are combined after the corrections are performed in the appropriate order, misalignment that may occur at the boundaries between partial image data in the combined image data is suppressed. Therefore, cutting device 1 can inspect electronic component S1 based on the combined image data with relatively high accuracy.

[0105] According to the cutting device 1, the calibration plate PL1 is imaged multiple times at the same imaging position, and correction data is obtained based on the average captured image, so that image synthesis can be performed based on more accurate correction data. Note that, depending on the object to be imaged, the captured image that is closest to the median of the variation in the multiple captured images may be used as the basis, rather than the average of the multiple captured images.

[0106] The cutting device 1 can correct multiple captured images and then create a single composite image. Therefore, even when a conventional device requires a camera capable of capturing an image with a wider field of view to inspect electronic components that are too large to fit within the camera's field of view, the cutting device 1 can handle the task with the camera of the conventional device.

[0107] The inspection table 11 is an example of a "table" in the present invention, and each of the first optical inspection camera 12 and the second optical inspection camera 13 is an example of a "camera" in the present invention. The mechanism that moves the inspection table 11 along the X-axis is an example of a "first moving mechanism" in the present invention, and each of the mechanisms that move the first optical inspection camera 12 and the second optical inspection camera 13 along the Y-axis is an example of a "second moving mechanism" in the present invention. The control unit 70 is an example of a "control unit" in the present invention, and each of the mechanisms that move the first optical inspection camera 12 and the second optical inspection camera 13 along the Z-axis is an example of a "third moving mechanism" in the present invention.

[0108] [5. Other Embodiments] The concept of the above embodiment is not limited to the embodiment described above. Hereinafter, an example of another embodiment to which the concept of the above embodiment can be applied will be described.

[0109] In the above embodiment, the technology for inspecting an inspection object that does not fit within the field of view of a camera is applied to a cutting device. However, the scope of application of the technology is not limited thereto. For example, the technology may be applied to a resin molding device that manufactures resin molded products. For example, the technology may be applied to inspect resin molded products that do not fit within the field of view of a camera. The technology may be applied to semiconductor manufacturing devices such as cutting devices and resin molding devices.

[0110] In the above embodiment, the imaging positions of the cameras are adjusted by moving the inspection table 11 along the X axis and moving each of the first optical inspection camera 12 and the second optical inspection camera 13 along the Y axis. However, the method for adjusting the imaging positions of the cameras is not limited to this. For example, the imaging positions of the cameras may be adjusted by moving each camera along both the X axis and the Y axis, or the imaging positions of the cameras may be adjusted by moving the inspection table 11 along both the X axis and the Y axis.

[0111] The above describes exemplary embodiments of the present invention. That is, the detailed description and the accompanying drawings are disclosed for the purpose of illustrative explanation. Therefore, some of the components described in the detailed description and the accompanying drawings may be non-essential components for solving the problems. Therefore, just because these non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately recognized that these non-essential components are essential.

[0112] Furthermore, the above-described embodiments are merely illustrative of the present invention in all respects. Various improvements and modifications to the above-described embodiments are possible within the scope of the present invention. For example, at least a portion of the configuration of any of the embodiments may be combined with at least a portion of the configuration of any of the other embodiments. In other words, when implementing the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0113] [6. Supplementary Notes] <Technology 1> (Configuration) An inspection system comprising: a table that holds an electronic component; a camera that images a portion of the electronic component and generates first partial image data; a first movement mechanism that moves at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera about a first axis; a second movement mechanism that moves at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera about a second axis; and a control unit that controls each of the camera, the first movement mechanism, and the second movement mechanism so as to generate a plurality of first partial image data each indicating a different portion of the electronic component, wherein the control unit executes a first process of applying a correction that takes into account an inclination of the camera with respect to the first axis and a correction that takes into account a difference between an angle formed by the first axis and the second axis and a reference angle to each of the plurality of first partial image data; a second process of generating composite image data by combining the corrected plurality of first partial image data; and a third process of inspecting the electronic component based on the composite image data.

[0114] (Effects, etc.) In this inspection system, a correction that takes into account the tilt of the camera with respect to the first axis and a correction that takes into account the difference between the angle formed by the first axis and the second axis and the reference angle are applied to each of the plurality of first partial image data, and then the plurality of first partial image data are combined. Because the plurality of first partial image data are combined after various corrections have been applied, deviations that may occur at the boundaries between the first partial image data in the combined image data are suppressed. Therefore, this inspection system can inspect electronic components based on the combined image data with relatively high accuracy.

[0115] <Technology 2> (Configuration) The inspection system according to Technology 1, wherein the reference angle is 90°.

[0116] (Advantages, etc.) In this inspection system, if the angle formed by the first axis and the second axis deviates from a right angle, correction is applied to each of the multiple first partial image data. Since the multiple first partial image data are combined after the correction, deviations that may occur at the boundaries between the first partial image data in the combined image data are suppressed. Therefore, this inspection system can inspect electronic components based on the combined image data with relatively high accuracy.

[0117] <Technology 3> (Configuration) The inspection system described in Technology 1 or Technology 2, wherein the camera includes a lens, and in the first processing, correction taking into account distortion of the lens is further applied to each of the plurality of first partial image data.

[0118] (Effects, etc.) In this inspection system, corrections that take lens distortion into account are further applied to each of the multiple first partial image data, and then the multiple first partial image data are combined. Because the multiple first partial image data are combined after various corrections have been applied, misalignment that may occur at the boundaries between the first partial image data in the combined image data is suppressed. Therefore, this inspection system can inspect electronic components based on the combined image data with relatively high accuracy.

[0119] <Technology 4> (Configuration) The inspection system according to any one of Technology 1 to Technology 3, further comprising a third movement mechanism that moves the camera along a third axis that is perpendicular to each of the first axis and the second axis, and wherein the control unit controls the third movement mechanism so that the focus position of the camera along the third axis is individually adjusted when each of the plurality of first partial image data is generated.

[0120] (Effects, etc.) For example, if the table is not perfectly flat, the focus position may differ depending on the imaging position of the electronic component. In this inspection system, the focus position is adjusted individually when generating each of the multiple first partial image data. Therefore, this inspection system can generate each of the multiple first partial image data by using a camera set to an appropriate focus position. As a result, this inspection system can inspect electronic components with relatively high accuracy.

[0121] <Technology 5> (Configuration) The inspection system described in Technology 4, wherein the control unit controls the third moving mechanism so that the focus position is adjusted by referring to a virtual plane, and the virtual plane is generated based on the focus positions at at least three points surrounding an imaging position of the camera.

[0122] (Advantages, etc.) In this inspection system, the focus position of the camera is adjusted with relatively high precision by referring to the virtual plane. Therefore, with this inspection system, each of the multiple first partial image data can be generated by using a camera set at an appropriate focus position. As a result, with this inspection system, it is possible to inspect electronic components with relatively high precision.

[0123] <Technology 6> (Configuration) An inspection system described in any one of Technology 1 to Technology 5, wherein in the first processing, the control unit applies a correction that takes into account the tilt of the camera with respect to the first axis, and a correction that takes into account the difference between the angle formed by the first axis and the second axis and the reference angle, in this order, to each of the plurality of first partial image data.

[0124] (Effects, etc.) In this inspection system, a correction that takes into account the tilt of the camera with respect to the first axis and a correction that takes into account the difference between the angle formed by the first axis and the second axis and the reference angle are applied to each of the multiple first partial image data in this order. That is, in this inspection system, a correction that takes into account the tilt of the camera with respect to the first axis, which is not affected by the difference between the angle formed by the first axis and the second axis and the reference angle, is applied first. Because the multiple first partial image data are combined after the corrections are applied in the appropriate order, deviations that may occur at the boundaries between the first partial image data in the combined image data are suppressed. Therefore, this inspection system enables inspection of electronic components based on the combined image data with relatively high accuracy.

[0125] <Technology 7> (Configuration) An inspection system according to any one of Technology 1 to Technology 6, wherein first correction data is used for correction taking into account the tilt of the camera relative to the first axis, and second correction data is used for correction taking into account the difference between the angle formed by the first axis and the second axis and the reference angle, each of the first correction data and the second correction data is generated in advance, the camera captures an image of a calibration plate and generates second partial image data, and the second correction data is generated based on the second partial image data after correction using the first correction data has been applied.

[0126] (Effects, etc.) In this inspection system, the second correction data is generated based on the second partial image data after the tilt of the camera with respect to the first axis has been corrected. Therefore, in this inspection system, relatively high-precision second correction data is generated in advance. As a result, in this inspection system, multiple first partial image data are combined after correction using the relatively high-precision second correction data, thereby suppressing deviations that may occur at the boundaries between the first partial image data in the combined image data. Therefore, this inspection system can inspect electronic components based on the combined image data with relatively high precision.

[0127] <Technology 8> (Configuration) A semiconductor manufacturing apparatus comprising: the inspection system according to any one of Technology 1 to Technology 7; and a manufacturing system that manufactures the electronic components, wherein the electronic components are semiconductor devices, and the inspection system inspects the electronic components manufactured by the manufacturing system.

[0128] (Effects, etc.) In this semiconductor manufacturing apparatus, a correction that takes into account the tilt of the camera with respect to the first axis and a correction that takes into account the difference between the angle formed by the first axis and the second axis and the reference angle are applied to each of the plurality of first partial image data, and then the plurality of first partial image data are combined. Because the plurality of first partial image data are combined after various corrections have been applied, deviations that may occur at the boundaries between the first partial image data in the combined image data are suppressed. Therefore, this semiconductor manufacturing apparatus can inspect electronic components based on the combined image data with relatively high accuracy.

[0129] <Technology 9> (Configuration) An inspection method using an inspection system, the inspection system comprising: a table for holding an electronic component; a camera for capturing an image of a portion of the electronic component and generating partial image data; a first movement mechanism for moving at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera about a first axis; and a second movement mechanism for moving at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera about a second axis, the inspection method comprising: a step of generating a plurality of partial image data each showing a different portion of the electronic component; a step of applying a correction to each of the plurality of partial image data taking into account an inclination of the camera with respect to the first axis and a correction taking into account a difference between an angle formed by the first axis and the second axis and a reference angle; a step of generating composite image data by combining the plurality of partial image data after correction; and a step of inspecting the electronic component based on the composite image data.

[0130] (Effects, etc.) In this inspection method, a correction that takes into account the tilt of the camera with respect to the first axis and a correction that takes into account the difference between the angle formed by the first axis and the second axis and the reference angle are applied to each of the plurality of first partial image data, and then the plurality of first partial image data are combined. Because the plurality of first partial image data are combined after various corrections have been applied, deviations that may occur at the boundaries between the first partial image data in the combined image data are suppressed. Therefore, according to this inspection method, it is possible to inspect electronic components based on the combined image data with relatively high accuracy.

[0131] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5 Cutting table, 5a Holding member, 5b Rotation mechanism, 5c Moving mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Spindle unit, 6a Blade, 6b Second position confirmation camera, 6c Rotation axis, 7 Conveying unit, 7a Second cleaner, 11 Inspection table, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Placement unit, 15 Extraction unit, 15a Tray for good products, 15b Tray for defective products, 16, 17 Illumination unit, 17a Dome, 17b LED, 20 Monitor, 50 Computer, 70 Control unit, 72 CPU, 74 RAM, 76 ROM, 80 Storage unit, 81 Control program, 90 Input / output I / F, 95 Reception unit, A1 Cutting module, AN1 Tilt information, AX1 Axis, B1 inspection and storage module, D1-D5, DX1 points, DO1 dots, FA1-FA4 surfaces, M1 magazine, P1 package board, PI1-PI19 partial images, IM1-IM5 composite images, PL1 calibration plate, S1 electronic components, VP1 virtual plane.

Claims

1. An inspection system comprising: a table for holding an electronic component; a camera for capturing an image of a portion of the electronic component and generating first partial image data; a first movement mechanism for moving at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera on a first axis; a second movement mechanism for moving at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera on a second axis; and a control unit for controlling each of the camera, the first movement mechanism and the second movement mechanism so as to generate a plurality of first partial image data each indicating a different portion of the electronic component, wherein the control unit executes a first process of applying a correction that takes into account the inclination of the camera with respect to the first axis and a correction that takes into account the difference between the angle formed by the first axis and the second axis and a reference angle to each of the plurality of first partial image data; a second process of generating composite image data by combining the plurality of first partial image data after correction; and a third process of inspecting the electronic component based on the composite image data.

2. The inspection system of claim 1, wherein the reference angle is 90 degrees.

3. An inspection system as described in claim 1 or claim 2, wherein the camera includes a lens, and in the first processing, correction taking into account distortion of the lens is further applied to each of the plurality of first partial image data.

4. An inspection system as described in any one of claims 1 to 3, further comprising a third movement mechanism that moves the camera along a third axis perpendicular to each of the first axis and the second axis, wherein the control unit controls the third movement mechanism so that the focus position of the camera along the third axis is individually adjusted when each of the multiple first partial image data is generated.

5. The inspection system described in claim 4, wherein the control unit controls the third moving mechanism so as to adjust the focus position by referring to a virtual plane, and the virtual plane is generated based on the focus position at each of at least three points surrounding the imaging position by the camera.

6. An inspection system as described in any one of claims 1 to 5, wherein in the first processing, the control unit applies a correction that takes into account the inclination of the camera relative to the first axis, and a correction that takes into account the difference between the angle formed by the first axis and the second axis and the reference angle, in that order, to each of the multiple first partial image data.

7. An inspection system as described in any one of claims 1 to 6, wherein first correction data is used for correction taking into account the inclination of the camera relative to the first axis, and second correction data is used for correction taking into account the difference between the angle formed by the first axis and the second axis and the reference angle, each of the first correction data and the second correction data is generated in advance, the camera images a calibration plate and generates second partial image data, and the second correction data is generated based on the second partial image data after correction using the first correction data has been applied.

8. A semiconductor manufacturing apparatus comprising: an inspection system according to any one of claims 1 to 7; and a manufacturing system for manufacturing the electronic components, the electronic components being semiconductor devices; and the inspection system inspecting the electronic components manufactured by the manufacturing system.

9. An inspection method using an inspection system, the inspection system comprising: a table for holding an electronic component; a camera for capturing an image of a portion of the electronic component and generating partial image data; a first movement mechanism for moving at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera along a first axis; and a second movement mechanism for moving at least one of the table and the camera so as to change a relative positional relationship between the electronic component and the camera along a second axis, the inspection method comprising the steps of: generating a plurality of partial image data, each of which indicates a different portion of the electronic component; applying a correction to each of the plurality of partial image data that takes into account the inclination of the camera with respect to the first axis and a correction to take into account the difference between the angle formed by the first axis and the second axis and a reference angle; generating composite image data by combining the plurality of partial image data after correction; and inspecting the electronic component based on the composite image data.

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