Wiring board and electrical connection device

Abstract

[Problem] To enhance the heat dissipating effect of a heated wiring conductor in order to suppress a temperature rise in a wiring board. [Solution] The present invention is a wiring board which is used in an electrical connection device that electrically connects an inspection device and an object to be inspected. The wiring board includes: on one surface, a first wiring region which is connected to the inspection device; and on another surface, a second wiring region which is connected to each of a plurality of electrical contacts that come into contact with an electrode terminal of the object to be inspected. The wiring board is provided with, at least, a first annular groove part on the outer periphery of the first wiring region on the one surface and / or a second annular groove part on the outer periphery of the second wiring region on the other surface.

Description

Wiring board and electrical connection device

[0001] The present invention relates to a wiring board and an electrical connection device, and can be applied to an electrical connection device such as a probe card used for electrical testing such as an electrical test of each semiconductor integrated circuit formed on a semiconductor wafer.

[0002] For example, there are various types of wiring substrates used in probe cards. One type uses high temperature co-fired ceramics (HTCC) to increase the substrate strength. However, because it is fired at high temperatures, the wiring conductors are made of tungsten or molybdenum, which have high melting points. The melting point of tungsten is 3,422°C, and the melting point of molybdenum is 2,622°C.

[0003] International Publication No. 2017 / 081951

[0004] Generally, in a resin substrate, the wiring conductor is made of copper, and the electrical resistivity of copper is 1.68×10 －８ On the other hand, the electrical resistivity of tungsten used as the wiring conductor of the above-mentioned wiring board is 5.29×10 －８ The electrical resistivity is high at Ω·m, which is 3.14 times that of copper.

[0005] When electrical resistivity is high, the wiring conductors heat up due to applied current, and the heat causes the wiring board to expand. In the wiring board of a probe card, this thermal expansion can cause misalignment between the terminals (e.g., probe pads) of the wiring board and the electrical contacts (e.g., probes). As a result, the accuracy of electrical testing of the semiconductor integrated circuit being tested can be affected.

[0006] Therefore, in view of the above-mentioned problems, the present invention aims to provide a wiring board capable of enhancing the heat dissipation effect of heated wiring conductors in order to suppress a rise in temperature of the wiring board.

[0007] In order to solve such problems, the first invention is a wiring board used in an electrical connection device that electrically connects an inspection device and an object under test, having a first wiring area on one side that connects to the inspection device, and a second wiring area on the other side that connects to each of a plurality of electrical contacts that come into contact with the electrode terminals of the object under test, and at least a first annular groove portion on the outer periphery of the first wiring area on one side, and / or a second annular groove portion on the outer periphery of the second wiring area on the other side.

[0008] The second invention is an electrical connection device that electrically connects an inspection device and an object under test, and has a wiring board of the first invention that is electrically connected to the inspection device and electrically connected to each of a plurality of electrical contacts that contact the electrode terminals of the object under test.

[0009] According to the present invention, the temperature rise of the wiring board is suppressed, and therefore the heat dissipation effect of the heated wiring conductor can be improved.

[0010] 5 is a configuration diagram showing the configuration of an electrical connecting device according to an embodiment. A plan view of a multilayer wiring board according to an embodiment (part 1). A perspective view of a multilayer wiring board according to an embodiment (part 1). A cross-sectional view of the multilayer wiring board of FIG. 2 taken along line A-A (part 1). A plan view of a multilayer wiring board according to an embodiment (part 2). A cross-sectional view of the multilayer wiring board of FIG. 5 taken along line B-B (part 2). A cross-sectional view of a multilayer wiring board according to an embodiment (part 3). An explanatory diagram explaining heat transfer by a heat dissipation structure of a board according to an embodiment. A diagram showing a modified example of a heat dissipation structure of a multilayer wiring board according to an embodiment (part 1). A diagram showing a modified example of a heat dissipation structure of a multilayer wiring board according to an embodiment (part 2).

[0011] (A) Main Embodiments Hereinafter, embodiments of the wiring board and the electrical connecting device according to the present invention will be described in detail with reference to the drawings.

[0012] (A-1) Configuration of Electrical Connecting Device FIG. 1 is a diagram showing the configuration of an electrical connecting device according to an embodiment.

[0013] In FIG. 1, the electrical connection device 10 according to the embodiment is electrically connected to an inspection unit (tester) TE, and has a support member 11, a wiring board 12, a connection board (interposer) 13, a multilayer wiring board 14, a connection unit 15, and a probe board 16.

[0014] In the following drawings, identical or corresponding components are denoted by the same or corresponding reference numerals. It should be noted that each drawing is a schematic diagram, and the dimensions, thickness, etc. of each component may differ from the actual components. The dimensions and proportions of corresponding components also differ between drawings. The following embodiments are intended to exemplify devices and methods for embodying the technical ideas of the present disclosure, and do not limit the materials, shapes, structures, arrangements, etc., of the components of the present disclosure. Although each drawing illustrates the main components, the present disclosure is not limited to the illustrated components, and may actually include components not shown.

[0015] The electrical connecting device 10 is used for electrical testing of the device under test 83, and transmits and receives electrical signals between the device under test 83 and a tester (testing device) TE. The electrical connecting device 10 has electrical contacts (probes) that make electrical contact with electrode terminals 84 of the device under test 83.

[0016] The electrical connection device 10 is attached to the test head of the tester TE, and during testing, electrically connects the tester TE and the test subject 83 by electrically contacting corresponding electrical contactors with each electrode terminal 84 of the test subject 83.

[0017] That is, during testing, the electrical connection device 10 supplies electrical signals from the tester TE to the electrode terminals 84 of the device under test 83 via the electrical contacts, and the electrical connection device 10 also supplies electrical signals from the device under test 83 to the tester TE via the electrical contacts. In this way, the electrical connection device 10 electrically connects the device under test 83 and the tester TE, allowing the tester TE to test the electrical characteristics of the device under test 83.

[0018] [Device under test 83] The device under test 83 is an object whose electrical characteristics are to be tested by the tester TE. For example, the device under test 83 is a semiconductor integrated circuit formed on a semiconductor wafer before dicing, and is assumed to have a large number of transistors and a high allowable current during testing, such as a semiconductor integrated circuit (IC chip device). The shape of the device under test 83 is not particularly limited, and may be, for example, rectangular or triangular when viewed from above.

[0019] The object under test 83 is placed on the upper surface of a chuck 82 connected to a drive unit 81 such as a multi-axis stage, and the position of the object under test 83 on the chuck 82 can be adjusted by driving the drive unit 81. During testing, the object under test 83 on the chuck 82 and the electrical contacts of the electrical connecting device 10 are brought relatively close to each other so that each electrode terminal 84 of the object under test 83 comes into electrical contact with the corresponding electrical contact.

[0020] [Probe Board 16] The probe board 16 is a board having a plurality of probes. The probes of the probe board 16 are provided at positions corresponding to the positions of the electrode terminals of the device under test 83. The upper ends of the probes of the probe board 16 are electrically connectable to connection terminals provided on the other surface (e.g., the lower surface) of the multilayer wiring board 14.

[0021] The probes provided on the probe substrate 16 may be either vertical probes or cantilever probes.

[0022] [Supporting Member 11] The supporting member 11 is disposed in the center of the upper surface of the wiring board 12, and serves to stabilize the posture of the wiring board 12. The supporting member 11 is also called a stiffener.

[0023] [Wiring Board 12] The wiring board 12 is a substantially circular, plate-shaped printed circuit board made of a synthetic resin material such as polyimide, etc. The wiring board 12 is a test head wiring board that is electrically connected to the test head.

[0024] A wiring pattern is formed on one surface (e.g., the top surface) of the wiring board 12, and electronic components such as resistors and capacitors are provided thereon. A plurality of tester connection parts (not shown) are provided on the outer edge of the wiring board 12 for connection to the electrical circuit of the tester TE, and each tester connection part is connected to a printed wiring on the wiring board 12.

[0025] For example, a plurality of through holes penetrating in the thickness direction (Z-axis direction) are formed in the wiring board 12. Conductive connectors are inserted into the through holes and connected to connection terminals on the probe board 16. This allows electrical connection between the wiring board 12 and the probe board 16 via the conductive connectors.

[0026] [Connection Unit 15] The connection unit 15 is a member that connects the connection board 13 and the multilayer wiring board 14 to the probe board 16. The connection unit 15 supports the connection board 13 and the multilayer wiring board 14 and enables the attachment of the probe board 16, thereby electrically connecting the upper end of each probe (probe needle) of the probe board 16 to a plurality of terminal portions on the underside of the wiring board 12.

[0027] For example, the connection unit 15 includes a connection board 13 and a multilayer wiring board 14 described later between one surface (e.g., the upper surface) of the probe board 16 and the other surface (e.g., the lower surface) of the wiring board 12, and electrically connects each probe to each terminal portion on the lower surface of the wiring board 12 via the connection board 13 and the multilayer wiring board 14.

[0028] [Connection Board 13] The connection board 13 is a board that includes connection terminals such as pogo pins, and electrically connects the connection terminals formed on the other surface (e.g., the bottom surface) of the wiring board 12 with the connection terminals formed on one surface (e.g., the top surface) of the multilayer wiring board 14. Note that, although an example will be described here in which well-known pogo pins formed to be elastically deformable in the axial direction are used as the connection terminals, this is not limiting. As connection terminals other than pogo pins, for example, well-known terminals, connectors, etc. formed from simple rod or plate material can also be used.

[0029] [Multilayer wiring board 14] The multilayer wiring board 14 is a board that electrically connects the upper ends of the multiple probes provided on the probe board 16 to the connection terminals on the other surface (e.g., the lower surface) of the connection board 13.

[0030] For example, the multilayer wiring board 14 is an insulating board having connection terminals on one surface (e.g., the top surface) and connection terminals on the other surface (e.g., the bottom surface). Furthermore, wiring paths are formed inside the multilayer wiring board 14, connecting the multiple connection terminals provided on one surface with the connection terminals provided on the other surface. The connection terminals on the other surface of the multilayer wiring board 14 are provided at positions corresponding to the positions of the probes of the probe board 16. Therefore, each probe of the probe board 16 can be electrically connected to each connection terminal on the other surface (the bottom surface) of the multilayer wiring board 14.

[0031] The wiring conductor of the multilayer wiring board 14 is a conductive metal, and although it depends on the type and manufacturing method of the multilayer wiring board 14, it can be, for example, copper, copper alloy, tungsten, molybdenum, etc.

[0032] For example, in the case of multilayer wiring board 14 formed from a resin such as polyimide, the wiring conductors used for the wiring patterns, connection terminals, internal wiring paths, etc. formed on the board can be made of copper, copper alloys, etc. Also, for example, when multilayer wiring board 14 is formed by simultaneously firing ceramics and wiring conductors using a high-temperature co-fired ceramics manufacturing method, firing is performed at a high temperature, so in this case the wiring conductors can be made of tungsten, molybdenum, etc.

[0033] (A-2) Heat Dissipation Structure of Multilayer Wiring Board 14 (Part 1) The heat dissipation structure of multilayer wiring board 14 will be described below. This structure effectively dissipates Joule heat that is generated in the wiring conductors when a current is passed through the wiring conductors during electrical testing of device under test 83. Therefore, it is not limited to the type of wiring conductor, and is not limited to multilayer wiring board 14, but can be widely applied to any board that has a wiring conductor.

[0034] 2 is a plan view of the multilayer wiring board 14, FIG. 3 is a perspective view of the multilayer wiring board 14, and FIG. 4 is a cross-sectional view of the multilayer wiring board 14 taken along line AA of FIG.

[0035] 2 to 4, the multilayer wiring board 14 is a substantially rectangular plate-like substrate, but the shape of the multilayer wiring board 14 is not limited to a rectangle.

[0036] A wiring pattern is formed on one surface (e.g., the top surface) of the multilayer wiring board 14, and a plurality of connection terminals 21 are provided to connect to the wiring pattern. Each of the plurality of connection terminals 21 can be connected to a connection terminal, such as a pogo pin, of the connection board 13. The region on one surface of the multilayer wiring board 14 where the wiring pattern and connection terminals 21 are provided is called a first wiring region 142.

[0037] A wiring pattern is also formed on the other surface (e.g., the bottom surface) of the multilayer wiring board 14, and a plurality of connection terminals 22 are provided to connect to the wiring pattern. Each of the plurality of connection terminals 22 is connectable to a probe of the probe board 16. As illustrated in Fig. 4, the region on the other surface of the multilayer wiring board 14 where the wiring pattern and connection terminals 22 are provided is called a second wiring region 144.

[0038] 4, the connection terminal 21 on one surface and the connection terminal 22 on the other surface are electrically connected via an internal wiring path 23. Also, as shown in FIG. 4, a power supply layer 24 is provided inside the multilayer wiring board 14 to apply a power supply current as a main power supply when inspecting the device under test 83. A relatively large power supply current is applied to the power supply layer 24, which can be said to be one of the sources of heat generation.

[0039] 2 to 4, an annular groove portion (hereinafter also referred to as a "first annular groove portion") 141 is provided along four edge portions 143 on one surface of the multilayer wiring substrate 14. In other words, the groove portion 141 is provided around a substantially rectangular first wiring region 142.

[0040] 4 , the groove 141 is provided at a position corresponding to a part of the power supply layer 24 inside the multilayer wiring board 14. For example, the groove 141 is provided at a position corresponding to the position of the end 241 of the power supply layer 24. In this example, the groove 141 is provided above the position of the end 241 of the power supply layer 24.

[0041] In this way, by providing the groove portion 141 at a position corresponding to the position of the end portion 241 of the power supply layer 24, the heat generated in the power supply layer 24 as a heat source is transmitted to the groove portion 141 through the base material, and the heat is transmitted into the air from the groove portion 141 which is open at the top, allowing it to be dissipated.

[0042] Furthermore, by providing a ring-shaped groove 141 on one surface of the multilayer wiring board 14 so as to surround the first wiring region 142, it is possible to dissipate heat uniformly over the entire board.

[0043] Furthermore, in the second wiring region 144 on the other surface of the multilayer wiring board 14, the second wiring region 144 is the side that connects to probes that are spaced at a narrow pitch, and the connection terminals 22 are also spaced at a narrow pitch. In contrast, the connection terminals 21 in the first wiring region 142 on one surface are also spaced at a narrow pitch, but not as narrow as the pitch of the connection terminals 22 in the second wiring region 144. Therefore, by providing a ring-shaped groove 141 on one surface of the multilayer wiring board 14, heat generated throughout the entire board can be dissipated effectively and uniformly.

[0044] Here, in order to avoid being affected by noise, the bottom of the groove 141 is set so as not to reach the power supply layer 24. For example, if the power supply layer 24 is provided at a position about several mm (e.g., 4 to 6 mm) from one surface of the multilayer wiring board 14, the depth of the groove 141 is set so as not to reach the power supply layer 24 (e.g., about 3.5 to 5.5 mm in this example).

[0045] In the examples of Figures 2 to 4, an edge portion 143 of the multilayer wiring board 14 is provided for the convenience of mounting the multilayer wiring board 14, but the edge portion 143 may not be provided in order to enhance the heat dissipation effect.

[0046] (A-3) Heat Dissipation Structure of Multilayer Wiring Board 14 (Part 2) Next, a heat dissipation structure of multilayer wiring board 14 (Part 2) will be described with reference to FIGS. 5 and 6. FIG.

[0047] FIG. 5 is a plan view of the multilayer wiring board 14 of the embodiment, and FIG. 6 is a cross-sectional view of the multilayer wiring board 14 taken along line BB of FIG.

[0048] The heat dissipation structure of the substrate illustrated in Figures 5 and 6 has a Peltier element 31 as a cooling member provided in the groove 141 illustrated in Figures 2 to 4. Also, as illustrated in Figure 6, it has a terminal 32 for supplying a direct current to the Peltier element 31 provided in the groove 141 and a terminal 33 for outputting the flowing current.

[0049] The Peltier element 31 is an element having an n-type semiconductor (indicated as "N" in FIG. 6), a p-type semiconductor (indicated as "P" in FIG. 6), and a metal electrode, and has the property of absorbing heat (cooling) on ​​one side of the element and dissipating heat on the other side when a direct current is passed through it in a certain direction.

[0050] 6 , one surface (heat absorption surface) of the Peltier element 31 faces the power supply layer 24, which is the heat source, and the other surface (heat dissipation surface) of the Peltier element 31 faces the opening of the groove 141. As a result, the Peltier element 31 provided in the groove 141 absorbs heat generated by the power supply layer 24, and further dissipates the heat toward the opening of the groove 141.

[0051] The heat dissipation effect can be improved by providing a ring-shaped groove 141 on one side of the multilayer wiring board 14, but the heat dissipation effect can be further improved by providing a Peltier element 31 in the groove 141, passing a direct current through the Peltier element 31, and allowing the Peltier element 31 to function as a heat transfer element.

[0052] In this embodiment, in order to dissipate heat uniformly from the substrate, the Peltier element 31 is embedded in the entire groove portion 141 formed in a ring shape on one side of the multilayer wiring substrate 14, but in order to dissipate heat from only a portion of the substrate, the Peltier element 31 may be provided in only a portion of the groove portion 141.

[0053] (A-4) Heat Dissipation Structure of Multilayer Wiring Board 14 (Part 3) Next, a heat dissipation structure of multilayer wiring board 14 (Part 3) will be described with reference to FIGS. 7 and 8. FIG.

[0054] FIG. 7 is a cross-sectional view of the multilayer wiring board 14 according to the embodiment, and FIG. 8 is an explanatory diagram illustrating heat transfer by the heat dissipation structure.

[0055] The heat dissipation structure of the substrate illustrated in Figures 7 and 8 has a ring-shaped groove portion (hereinafter also referred to as a "second ring-shaped groove portion") 145 provided in the outer region of a second wiring region 144 in the center of the other surface (e.g., the bottom surface) of the multilayer wiring substrate 14.

[0056] On the other surface of the multilayer wiring board 14, the second wiring area 144 has connection terminals 22 arranged at a narrow pitch. Therefore, it is difficult to provide grooves within the second wiring area 144 for heat dissipation. However, on the other surface of the multilayer wiring board 14, outside the area of ​​the second wiring area 144 (outside area), there is a support area 146 for ensuring support by the connection unit 15.

[0057] 7 and 8, a groove 145 is provided in a support region 146 of the multilayer wiring board 14. The groove 145 is provided at a position corresponding to a part of the power supply layer 24 inside the multilayer wiring board 14. For example, the groove 145 is provided at a position corresponding to the position of the end 241 of the power supply layer 24. In this example, the groove 145 is provided below the position of the end 241 of the power supply layer 24.

[0058] Furthermore, a Peltier element 31 is provided in the groove 145 , with one surface (heat absorption surface) of the Peltier element 31 facing the power supply layer 24 and the other surface (heat dissipation surface) of the Peltier element 31 facing the open side of the groove 145 .

[0059] Here, the support region 146 is the portion supported by the connection unit 15. However, as illustrated in Fig. 8 , the Peltier element 31 provided in the groove portion 145 transfers heat to the connection unit 15, and the connection unit 15 further transfers the heat to the support member 11, and the support member 11 dissipates the heat into the air.

[0060] At this time, in order to improve the transfer of heat through the connection unit 15 and the support member 11, a heat conductive paste may be applied to the surfaces of the connection unit 15 and the support member 11.

[0061] 9, an annular groove 141 may be provided on one surface of the multilayer wiring board 14, and a Peltier element 31 may be provided in the groove 141, and an annular groove 145 may be provided on the other surface, and a Peltier element 31 may be provided in the groove 145. This can further enhance the heat dissipation effect.

[0062] Although Figure 9 illustrates an example in which a Peltier element 31 is provided in a groove portion 141 on one surface of the multilayer wiring board 14, it is also possible to provide only the groove portion 141 without providing the Peltier element 31 in the groove portion 141.

[0063] Also, as shown in FIG. 10, the multilayer wiring board 14 may have, instead of the annular groove portion 141, four recesses 147 (147a to 147d) formed in a substantially symmetrical arrangement on the outer periphery of one surface of the multilayer wiring board 14.

[0064] For example, on one surface of the multilayer wiring board 14, partitions 148 (148a to 148d) are provided in a groove along the periphery, and the recesses divided by the partitions 148 are called recesses 147a to 147d. Here, the term "approximately symmetrical arrangement" means, for example, that recesses 147a and 147c are provided in positions facing each other on one surface of the multilayer wiring board 14, and such an arrangement is considered to be a symmetrical arrangement. Similarly, recesses 147b and 147d are located in positions facing each other on one surface of the multilayer wiring board 14, and are arranged in a substantially symmetrical arrangement. Note that the substantially symmetrical arrangement is not limited to the arrangement of recesses 147 in FIG. 10.

[0065] In this way, by providing recesses 147 formed in a substantially symmetrical arrangement, when multilayer wiring board 14 has recesses 147, it is possible to ensure the thickness of multilayer wiring board 14 and increase its rigidity. Furthermore, Peltier elements 31 may be provided at appropriate positions in recesses 147.

[0066] (A-6) Effects of the Embodiments As described above, according to the embodiments, the temperature rise of the multilayer wiring board is suppressed, and therefore the heat dissipation effect of the heated wiring conductor can be improved.

[0067] 10: electrical connecting device, 11: support member, 12: wiring board, 13: connection board, 14: multilayer wiring board, 15: connection unit, 16: probe board, 21: connection terminal, 22: connection terminal, 23: wiring path, 24: power supply layer, 31: Peltier element, 32: terminal, 33: terminal, 81: drive unit, 82: chuck, 83: object under test, 84: electrode terminal, 141: groove portion, 142: first wiring area, 143: edge portion, 144: second wiring area, 145: groove portion, 146: support area, 147 (147a to 147d): recess, 148 (148a to 148d): partition portion, 241: end portion, TE: tester.

Claims

1. A wiring board used in an electrical connection device that electrically connects an inspection device and an object under test, the wiring board having, on one side, a first wiring area that connects to the inspection device, and on the other side, a second wiring area that connects to each of a plurality of electrical contacts that contact the electrode terminals of the object under test, and at least a first annular groove portion on the periphery of the first wiring area on the one side, and / or a second annular groove portion on the periphery of the second wiring area on the other side.

2. The wiring board according to claim 1, further comprising a power supply layer inside the wiring board for applying current between the first wiring region and the second wiring region, and the first annular groove and / or the second annular groove being provided at a position corresponding to a position of a portion of the power supply layer.

3. The wiring board according to claim 2, characterized in that the first annular groove portion and / or the second annular groove portion have a cooling member that absorbs heat generated in the power supply layer and transfers the heat to dissipate it.

4. The wiring board as described in claim 1, characterized in that the second annular groove portion is provided on the outer periphery of the second wiring region on the other surface, the second annular groove portion having a cooling member that absorbs heat and transfers the heat to dissipate it, the second annular groove portion being provided at the end of the other surface, in a support region supported by an external support member, and the heat absorbed by the cooling member of the second annular groove portion is transferred to the external support member to dissipate it.

5. An electrical connection device that electrically connects an inspection device and an object to be inspected, comprising a wiring board according to any one of claims 1 to 4, which is electrically connected to the inspection device and is electrically connected to each of a plurality of electrical contacts that contact the electrode terminals of the object to be inspected.

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