Electromagnetic wave transmission heater for selectively transmitting frequency

Abstract

An electromagnetic wave transmission heater for selectively transmitting a frequency is disclosed. The transmission heater comprises: patches which are arranged at predetermined intervals on one side of a substrate, and which is formed of a conductive material; and a heating unit which is spaced apart from the patches, and which generates heat so as to transfer the heat to the patches, wherein the patches are arranged to have a frequency characteristic interval for selectively transmitting a predetermined frequency, and unit structures having the heating unit and at least one patch adjacent to the heating unit are repeatedly arranged.

Description

Electromagnetic wave transparent heater for selectively transmitting frequencies

[0001] The present disclosure relates to an electromagnetic wave penetrating heater for selectively transmitting frequencies, and more particularly, to a penetrating heater for selectively transmitting frequencies by additionally arranging a patch for imparting frequency-selective characteristics to a heating wire.

[0002]

[0003] A radome is a device formed outside a radar to protect the antenna from external environmental influences. However, if the radome surface is covered with snow, ice, or moisture, its electromagnetic wave penetration characteristics can deteriorate rapidly. Therefore, heating devices or components can be incorporated into the radome to address this issue.

[0004] However, the heat wires formed from conductive materials can degrade electromagnetic wave transmission characteristics. Therefore, to minimize the deterioration or loss of electromagnetic wave transmission characteristics due to these conductive materials, the radome must be designed to selectively transmit electromagnetic wave frequencies.

[0005] In addition, in order to minimize the change in the frequency characteristics of electromagnetic waves due to the radome, it is necessary to secure the frequency characteristics according to the change in the frequency characteristics depending on the polarization and incidence angle.

[0006]

[0007] The technical problem of the present disclosure is to provide a transmission heater that selectively transmits frequencies by additionally arranging a patch to impart frequency-selective characteristics to the heating wire.

[0008] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0009]

[0010] According to one aspect of the present disclosure, a selective frequency penetrating heater is disclosed. The penetrating heater comprises patches formed of a conductive material and arranged at predetermined intervals on one side of the substrate, and a heating element that generates heat to transfer heat to the patches arranged at a distance from the patches, wherein the patches are arranged to have a frequency characteristic interval that selectively transmits a predetermined frequency, and a unit structure composed of the heating element and at least one of the patches adjacent to the heating element is repeatedly arranged.

[0011] According to another aspect of the present disclosure, a radome equipped with a penetration heater is disclosed. The radome includes an antenna and the penetration heater for protecting the antenna from an external environment, the penetration heater includes patches formed of a conductive material and arranged at a predetermined interval on one side of the substrate, and the heating unit for generating heat to transfer heat to the patches arranged at a distance from the patches, the patches being arranged to have a frequency characteristic interval that selectively transmits a predetermined frequency, and the unit structure composed of the heating unit and at least one patch adjacent to the heating unit is repeatedly arranged.

[0012] According to one aspect of the present disclosure, the patches are arranged at predetermined intervals on one side and the other side of the substrate.

[0013] According to one aspect of the present disclosure, the heating unit is disposed on the same side as the patch and spaced apart from the patch.

[0014] According to one aspect of the present disclosure, the heating unit is arranged in a grid structure with respect to the substrate.

[0015] According to one aspect of the present disclosure, the frequency characteristic interval is determined based on any one of the frequency characteristic, the incident angle characteristic, or the heat generation characteristic of the predetermined frequency.

[0016] According to one aspect of the present disclosure, the frequency characteristic interval is formed by adjusting the size of the patch so as to selectively transmit the predetermined frequency.

[0017] According to one aspect of the present disclosure, the size of the patch may be formed differently for each patch.

[0018] According to one aspect of the present disclosure, the patch may be formed into a polygon.

[0019] The features briefly summarized above regarding the present disclosure are merely exemplary aspects of the detailed description of the present disclosure that follows and do not limit the scope of the present disclosure.

[0020]

[0021] According to the present disclosure, a transmission heater that selectively transmits frequencies can be provided by additionally arranging a patch to impart frequency-selective characteristics to the heating wire.

[0022] In addition, according to the present disclosure, electromagnetic waves in a specific band can be transmitted or blocked, and by being applied to a radome, deterioration of the characteristics of an internal antenna due to an external environment such as freezing can be minimized.

[0023] In addition, according to the present disclosure, an improved wireless communication environment can be provided by manufacturing a unit structure having a transmittance optimized for frequency characteristics and utilizing it in a radome.

[0024] In addition, according to the present disclosure, it is possible to minimize the deterioration of the radio wave transmission characteristics of the radome due to the conductive material.

[0025] The technical effects to be achieved in the present disclosure are not limited to the technical effects mentioned above, and other technical effects not mentioned will be clearly understood by a person having ordinary skill in the technical field to which the present disclosure pertains from the description below.

[0026]

[0027] FIG. 1 is a drawing illustrating a patch and a heating element arranged in a unit structure according to one embodiment of the present disclosure.

[0028] FIG. 2 is a drawing illustrating patches and heating elements arranged on both sides of a substrate according to one embodiment of the present disclosure.

[0029] FIG. 3 is a drawing illustrating a patch and a heating element arranged in a unit structure according to another embodiment of the present disclosure.

[0030] FIGS. 4 and 5 are diagrams illustrating frequency characteristics such as reflection and transmission according to the frequency of electromagnetic waves according to one embodiment of the present disclosure.

[0031] FIG. 6 is a drawing illustrating a patch according to one embodiment of the present disclosure receiving heat from a heating element.

[0032] FIG. 7 is a drawing illustrating a penetration heater mounted on a radome according to one embodiment of the present disclosure.

[0033]

[0034] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein.

[0035] In describing embodiments of the present disclosure, detailed descriptions of known configurations or functions will be omitted if they are deemed to obscure the gist of the present disclosure. Furthermore, portions unrelated to the description of the present disclosure in the drawings have been omitted, and similar portions have been designated with similar reference numerals.

[0036] In the present disclosure, when a component is said to be "connected," "coupled," or "connected" to another component, this may include not only a direct connection but also an indirect connection in which another component exists in between. Furthermore, when a component is said to "include" or "have" another component, unless otherwise specifically stated, this does not exclude the other component, but rather implies that the other component may be included.

[0037] In this disclosure, terms such as first, second, etc. are used only for the purpose of distinguishing one component from another, and do not limit the order or importance of components, unless specifically stated otherwise. Accordingly, within the scope of this disclosure, a first component in one embodiment may be referred to as a second component in another embodiment, and similarly, a second component in one embodiment may be referred to as a first component in another embodiment.

[0038] In this disclosure, distinct components are used to clearly illustrate their respective characteristics, and do not necessarily imply that the components are separated. That is, multiple components may be integrated into a single hardware or software unit, or a single component may be distributed into multiple hardware or software units. Therefore, even if not specifically mentioned, such integrated or distributed embodiments are also included within the scope of this disclosure.

[0039] In this disclosure, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, C or combination thereof" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0040] In the present disclosure, the components described in various embodiments are not necessarily essential components, and some may be optional components. Therefore, embodiments comprising a subset of the components described in one embodiment are also within the scope of the present disclosure. Furthermore, embodiments including other components in addition to the components described in various embodiments are also within the scope of the present disclosure.

[0041] The advantages and features of the present invention, and the methods for achieving them, will become clearer with reference to the embodiments described in detail below, along with the accompanying drawings. However, the present invention is not limited to the embodiments presented below and may be implemented in various different forms. These embodiments are provided solely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the invention of the scope of the invention.

[0042] Hereinafter, an electromagnetic wave transmitting heater for selectively transmitting frequencies according to one embodiment of the present disclosure will be described with reference to the attached drawings.

[0043] FIG. 1 is a drawing illustrating a patch and a heating element arranged in a unit structure according to one embodiment of the present disclosure.

[0044] The heating element (101) of the penetrating heater according to the present disclosure may be formed by a heating wire having a combination of curved and straight lines, and both ends of the heating wire are connected to a power source, so as to generate Joule heat. In addition, the heating element (101) may be configured such that one end is connected to a power source formed on one side of the substrate, and the other end is connected to a power source formed on the other side of the substrate, so as to generate Joule heat. Such a shape will be described later with reference to FIG. 3.

[0045] The heating elements (101) formed of a conductive material can be arranged in parallel at regular intervals on one side of the substrate, and the heating elements (101) arranged in parallel can be connected to a heating element (101) formed in a curve. In addition, the heating elements (101) can be arranged on both sides of the substrate, and accordingly, the patches (102) can also be arranged on both sides of the substrate. In addition, a mesh structure having visual transparency can be applied to the heating elements (101).

[0046] Patches (102) formed of a conductive material can be arranged in a unit structure (103) with frequency characteristic intervals according to frequency characteristics so as to selectively transmit a predetermined frequency.

[0047] Specifically, in order to selectively transmit frequencies, patches (102) can be arranged at a predetermined interval on one side of the substrate, and can be arranged in a form in which unit structures (103) are repeated, spaced apart from the heating unit (101) at a predetermined interval. Similarly, patches (102) can be arranged on both sides of the substrate, and can be formed in a polygonal structure such as a square or a busbar, but are not limited thereto, and can be formed in a form including a curved portion. Accordingly, only frequencies that resonate in the corresponding frequency characteristic interval can be selectively transmitted, and in order to secure the characteristics of the frequencies that resonate in the corresponding frequency characteristic interval, the permittivity and thickness of the substrate and the radome can be modeled, and parameter optimization can be performed.

[0048] For example, parameter optimization can be used to determine the size of a patch (102) based on the resonant frequency along the frequency characteristic interval, for example, by adjusting the size to selectively transmit a target frequency band.

[0049] Specifically, in order to selectively transmit the target frequency band, electromagnetic waves are incident on patches (102) arranged in a unit structure (103) according to frequency characteristic intervals, and frequency characteristics according to transmission coefficient, reflection coefficient, etc. are analyzed to analyze the resonant frequency. In addition, reflection and transmission characteristics according to the incident angle at the resonant frequency obtained through this can be analyzed, and the heating characteristics by the heating unit (101) can be taken into consideration.

[0050] As another example, when there are multiple target frequency bands, the sizes of the patches (102) may be formed differently. However, since the size of the patches (102) is adjusted to adjust the frequency characteristic interval, even when selectively transmitting one frequency band, the sizes of the patches (102) may be different if the frequency characteristic interval is constant. Similarly, when the frequency characteristic interval is constant so that the same unit structure can be repeated, the shapes of the patches (102) may be formed differently.

[0051] The substrate can be designed as CCP (Copper-Clad Polymide) or FED (Fluorinated Ethylene Propylene), but is not limited thereto, and any material that does not impair frequency characteristics can be used.

[0052] Hereinafter, the arrangement structure of the heating element (101) and the patch (102) arranged as a unit structure (103) to selectively transmit the frequency will be specifically described through Fig. 2.

[0053] FIG. 2 is a drawing illustrating patches and heating elements arranged on both sides of a substrate according to one embodiment of the present disclosure.

[0054] Referring to FIG. 2, P_x and P_y denote the sizes of the unit structure (103) in the x-axis and y-axis directions, respectively. W_x and W_y denote the sizes of the patch (102) in the x-axis and y-axis directions, respectively. The patch (102) may be placed on one side and the other side of the substrate, or may be placed on only one side. The interval between the one side and the other side, i.e., h_subtrate, denotes the height of the substrate, and the height of the substrate may be adjusted according to parameter optimization to selectively transmit a target frequency band.

[0055] g_x and g_y may denote the width of the heating unit (101), and the heating units (101) arranged on one side and the other side of the substrate may have widths of different sizes, and may be arranged in a grid structure based on the substrate.

[0056] h-radome means the height of the radome, and in Fig. 2, the height of the patch (102) is not shown because it is a small value compared to the height of the radome and can be ignored, and the illustrated hexahedron is for visually expressing the numerical value for the size of the patch (102), substrate, heating element (101), or radome, and does not necessarily mean that each component must be arranged without being spaced apart in the z-axis direction.

[0057] FIG. 3 is a drawing illustrating a patch and a heating element arranged in a unit structure according to another embodiment of the present disclosure.

[0058] For the convenience of understanding, Fig. 3 shows only one side of the substrate, and as described in Fig. 2, the heating part (101) on the other side can be arranged in a grid structure based on the heating part (101) on one side and the substrate.

[0059] As described above in Fig. 1, the heating unit (101) may be configured to generate heat by having one end connected to a power source formed on one side of the substrate and the other end connected to a power source formed on the other side of the substrate. The heating unit (101) may be connected in a straight line to a power source formed on one or the other side of the substrate, and each heating unit (101) may be arranged in parallel and at equal intervals.

[0060] In addition, the patches (102) can be arranged at a predetermined interval on one side of the substrate so as to selectively transmit frequencies, and can be arranged in a form in which the unit structures (103) are repeated, spaced apart from the heating unit (101) at a predetermined interval. Similarly, the patches (102) can be arranged on both sides of the substrate, and can be formed in a polygonal structure such as a square or a busbar, but is not limited thereto, and can be formed in a form including a curved portion. Accordingly, only the frequencies that resonate in the corresponding frequency characteristic interval can be selectively transmitted, and in order to secure the characteristics of the frequencies that resonate in the corresponding frequency characteristic interval, the permittivity and thickness of the substrate and the radome can be modeled, and parameter optimization can be performed.

[0061] Although Fig. 3 only shows the heating element (101) and the nearest patch (102) spaced apart at a predetermined interval, it is not limited thereto and can be arranged on the entire substrate according to the frequency characteristic interval in order to selectively transmit the target frequency band.

[0062] FIGS. 4 and 5 are diagrams illustrating frequency characteristics such as reflection and transmission according to the frequency of electromagnetic waves according to one embodiment of the present disclosure.

[0063] The patch (102) size or frequency characteristic spacing can be determined through a parameter optimization process so that the target frequency band can be selectively transmitted at the resonant frequency.

[0064] Specifically, an electromagnetic wave is applied to the patches (102) and heat wires arranged to form a unit structure (103) to determine whether resonance occurs in the target frequency band. If resonance does not occur in the target frequency band, the size of the patches (102) or the height of the substrate can be adjusted.

[0065] Referring to FIG. 4, assuming that the frequency band to be selectively transmitted is 35 GHz, if the resonant frequency band is outside the frequency band, the size of the patch (102) or the height of the substrate can be adjusted so that resonance occurs at 35 GHz.

[0066] Next, referring to FIG. 5, the frequency characteristics can be calculated through analysis of the penetrating size according to the incident angle of the electromagnetic wave, thereby adjusting the size of the patch (102) or adjusting the height of the substrate.

[0067] In addition, an angle is applied to the patch (102) attached to the substrate so that electromagnetic waves can be transmitted according to an incidence angle optimized for electromagnetic waves of a frequency band to be selectively transmitted.

[0068] FIG. 6 is a drawing illustrating a patch according to one embodiment of the present disclosure receiving heat from a heating element.

[0069] Referring to FIG. 6, patches (102) are arranged in a unit structure (103) on a substrate, so that they can selectively transmit electromagnetic waves of a target frequency band and also serve as a heating element (101).

[0070] Specifically, the patch (102) is heated by heat transfer such as conduction, convection, or radiation from the heating unit (101) and can perform the role of the heating unit (101) without a separate power source. The principle by which the patch (102) is heated from the heating unit (101) is not limited to heat transfer, and may also include induction heating, i.e., heating through electromagnetic induction.

[0071] FIG. 7 is a drawing illustrating a penetration heater mounted on a radome according to one embodiment of the present disclosure.

[0072] Radomes can be designed with materials that effectively transmit electromagnetic waves without damage. For example, they can utilize composite materials, such as fiber reinforced plastic (FRP) or glass fibers, or carbon fibers, embedded in a plastic matrix. Furthermore, they can be designed with materials that allow electromagnetic waves to pass through, such as glass, ceramic, or plastic.

[0073] The patch (102), substrate, and heating element (101) of the penetration heater are mounted on the radome to prevent the radio wave penetration characteristics from being reduced due to the external environment.

[0074] While the exemplary methods of the present disclosure described above are presented as a series of operations for clarity of description, this is not intended to limit the order in which the steps are performed, and individual steps may be performed simultaneously or in different orders, if desired. To implement a method according to the present disclosure, additional steps may be included in addition to the exemplified steps, some steps may be excluded and the remaining steps may be included, or some steps may be excluded and additional steps may be included.

[0075] The various embodiments of the present disclosure are not intended to list all possible combinations but rather to illustrate representative aspects of the present disclosure, and the matters described in the various embodiments may be applied independently or in combinations of two or more.

[0076] Furthermore, although the embodiments of the present disclosure have been described with limited drawings, those skilled in the art will appreciate that various technical modifications and variations can be applied based on the above. For example, appropriate results can be achieved even if the components of the described systems, structures, devices, circuits, etc. are combined or combined in forms other than those described, or replaced or substituted with other components or equivalents. Therefore, other implementations, other embodiments, and equivalents of the claims also fall within the scope of the claims described below.

[0077] Additionally, various embodiments of the present disclosure may be implemented by hardware, firmware, software, or a combination thereof. In the case of hardware implementation, the embodiments may be implemented by one or more ASICs (Application Specific Integrated Circuits), DSPs (Digital Signal Processors), DSPDs (Digital Signal Processing Devices), PLDs (Programmable Logic Devices), FPGAs (Field Programmable Gate Arrays), general processors, controllers, microcontrollers, microprocessors, etc.

[0078] The scope of the present disclosure includes software or machine-executable instructions (e.g., operating systems, applications, firmware, programs, etc.) that cause operations according to the methods of various embodiments to be executed on a device or a computer, and a non-transitory computer-readable medium having such software or instructions stored thereon and executable on the device or computer.

[0079]

[0080] The present invention can be used in a radome as a transmission heater that selectively transmits frequencies by additionally arranging a patch to impart frequency-selective characteristics to the heating wire of the radome.

Claims

1. In a selective frequency transmitting heater, Patches arranged at a predetermined interval on one side of the above substrate and formed of a conductive material; It includes a heating part that generates heat to transfer heat to the patch that is spaced apart from the above patch, A penetration heater in which the patches are arranged to have a frequency characteristic interval that selectively transmits a predetermined frequency, and unit structures composed of the heating section and at least one of the patches adjacent to the heating section are repeatedly arranged.

2. In paragraph 1, The above patch, A penetration heater arranged at a predetermined interval on one side and the other side of the above substrate.

3. In paragraph 2, The above heating part, A penetration heater positioned on the same side as the above patch and spaced apart from the above patch.

4. In paragraph 3, The above heating part, A penetration heater arranged in a grid structure based on the above substrate.

5. In paragraph 1, The above frequency characteristic interval is, A penetration heater, wherein the penetration heater is determined based on any one of the frequency characteristics, incident angle characteristics, or heat generation characteristics of the above-mentioned predetermined frequency.

6. In paragraph 1, The above frequency characteristic interval is, A penetration heater formed by adjusting the size of the patch so as to selectively transmit the above-described frequency.

7. In paragraph 6, The size of the above patch is, A penetration heater which can be formed differently for each of the above patches.

8. In paragraph 1, The above patch, A permeating heater that can be formed into a polygon.

9. Antenna; and Including the penetration heater that protects the antenna from the external environment, The above-mentioned penetration heater, The patches are arranged at a predetermined interval on one side of the substrate and formed of a conductive material; Including the heating part that generates heat so as to transfer heat to the patch that is spaced apart from the above patch, A radome in which the patches are arranged to have the frequency characteristic interval that selectively transmits the predetermined frequency, and the unit structure composed of the heating part and at least one of the patches adjacent to the heating part is repeatedly arranged.

10. In paragraph 9, The above patch, A radome arranged at a predetermined interval on one side and the other side of the above substrate.

11. In paragraph 10, The above heating part, A radome positioned on the same side as the above patch and spaced apart from the above patch.

12. In paragraph 11, The above heating part, A radome arranged in the grid structure based on the above substrate.

13. In paragraph 9, The above frequency characteristic interval is, A radome, wherein the frequency characteristic of the given frequency, the incidence angle characteristic or the heat generation characteristic is determined based on any one of the above.

14. In paragraph 9, The above frequency characteristic interval is, A radome formed by adjusting the size of the patch so as to selectively transmit the above-described frequency.

15. In paragraph 14, The size of the above patch is, A radome that can be formed differently for each of the above patches.

16. In paragraph 9, The above patch, A radome which can be formed into the above polygon.

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