Double-sided package structure, power supply apparatus and electronic device

Abstract

A double-sided package structure, a power supply apparatus and an electronic device. In the double-sided package structure, power devices are provided on both sides of a PCB substrate, and a heat conduction member is inserted into the PCB substrate and packaged into a packaged body; the packaged body comprises a heat dissipation surface, the heat dissipation surface being opposite one side of the PCB substrate; and the PCB substrate is provided with a via hole and a through hole which are connected to each other by means of a copper foil, the via hole being connected to at least the power device arranged on the other side of the PCB substrate, and the heat conduction member being inserted into the through hole, one end of the heat conduction member extending to the heat dissipation surface of the packaged body. In such an arrangement, heat from the power device located on a non-heat-dissipation-surface side can be dissipated through a low-thermal-resistance heat dissipation path constructed by the via hole, the copper foil, the through hole and the heat conduction member in sequence, effectively improving the heat dissipation performance of the power device on the non-heat-dissipation-surface side; in addition, on the basis of the structural characteristics of the inserted heat conduction member, the package width can be reduced, thus meeting the trend requirements for high-density layout.

Description

Double-sided packaging structure, power supply device and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on December 19, 2023, with application number 202311761950.1 and invention name “A double-sided packaging structure, power supply device and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the technical field of electronic component packaging, and in particular to a double-sided packaging structure, a power supply device, and an electronic device. Background Art

[0003] For double-sided packaging structures, the operating heat generated by the internal power devices needs to be dissipated in a timely manner to meet the actual output performance requirements. With the development trend of miniaturization, integration and high power consumption of devices, the heat dissipation environment faces a development bottleneck.

[0004] In order to meet the functional requirements of high-density layout, the power devices of the System in Package (SIP) have evolved from a single-sided layout to a double-sided layout. That is, the power devices are placed on both sides of the package printed circuit board (PCB), and a good heat dissipation environment is required to reasonably take into account the good performance of the SIP module and the high-density layout requirements. The double-sided packaging structure has a heat dissipation surface on the side close to the heat sink, and a non-heat dissipation surface on the other side away from the heat sink. The heat dissipation path of the power device on the heat dissipation surface side is shorter, while the heat dissipation path of the power device on the non-heat dissipation surface side is longer, and the heat dissipation capacity is relatively poor. When the heat inside the SiP cannot be discharged in time, it will affect the overall improvement of the SIP module performance.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a double-sided packaging structure, a power supply device, and an electronic device, which improve the heat dissipation performance by optimizing the double-sided packaging structure.

[0007] A first aspect of an embodiment of the present application provides a double-sided packaging structure, which includes a PCB substrate, a power device and a thermal conductor. Power devices are arranged on both side surfaces of the PCB substrate, and the thermal conductor is inserted into the PCB substrate and encapsulated to form a package body. The package body includes a heat dissipation surface, which is opposite to one side surface of the PCB substrate; the PCB substrate has vias and through holes, and the vias and through holes are connected by copper foil on the PCB substrate; wherein the vias are connected to at least the power device arranged on the other side surface of the PCB substrate, the thermal conductor is inserted into the through hole, and one end of the thermal conductor extends to the heat dissipation surface of the package body.

[0008] With this arrangement, the power devices on the other side of the PCB substrate, namely, the power devices on the non-heat-dissipating surface side, are away from the heat dissipating surface. For the power devices on the non-heat-dissipating surface side, their operating heat can be conducted to the heat dissipating surface through a first heat dissipation path constructed in sequence by vias, copper foil, through-holes, and thermal conductive members. Furthermore, the through-holes, copper foil, and thermal conductive members on the PCB board all have good thermal conductivity, resulting in a heat dissipation path with low thermal resistance. In other words, a heat dissipation path with low thermal resistance is constructed between the non-heat-dissipating surface side and the heat dissipating surface of the double-sided packaging structure, fully utilizing the heat dissipation capacity of the heat dissipation device and effectively improving the heat dissipation performance of the power devices on the non-heat-dissipating surface side. Furthermore, the power devices on the heat dissipating surface side of the double-sided packaging structure have a shorter heat dissipation path from the heat dissipating device, enabling reliable heat dissipation.

[0009] Overall, the operating heat generated by the power devices on both sides can be quickly dissipated, effectively improving heat dissipation performance. In high-power applications, such as the power SiP, the double-sided packaging structure with excellent heat dissipation performance can prevent heat accumulation and device overheating, ensuring the actual output capacity of the power SiP and effectively overcoming the impact of output derating on product performance.

[0010] Furthermore, the thermal conductor insert in this embodiment, with the walls of the through-holes on the PCB substrate providing support and positioning for the thermal conductor, allows for the use of thermal conductors with smaller cross-sectional dimensions, resulting in better pre-installation stability. This reduces board space and package width to a certain extent, meeting the trend toward high-density layouts.

[0011] Furthermore, due to the excellent pre-installed stability of the thermal conductor, the height of the thermal conductor can be determined based on the overall layout requirements of the actual product for thicker packages. Furthermore, the efficient heat dissipation path formed by the thermal conductor improves heat dissipation on the non-heat dissipating surface without increasing the thickness of the package. This allows for wide application in packages of varying thicknesses, demonstrating excellent structural versatility.

[0012] In practical applications, the heat dissipation surface of the package body can directly contact the heat dissipation device for heat exchange, or indirectly contact the heat dissipation device through an intermediate structure for heat exchange, for example but not limited to, indirectly contacting the heat dissipation device through thermal conductive gel for heat exchange.

[0013] Exemplarily, the heat conductor may be a rotating body, or other shapes that meet functional requirements.

[0014] Based on the first aspect, the present application also provides a first implementation method of the first aspect: the power devices located on both sides of the PCB substrate are connected to the vias. In other words, the power devices located on the heat dissipation surface can also be sequentially guided to the heat dissipation surface through the heat dissipation path constructed by the vias, copper foil, through-holes, and thermal conductive members, fully utilizing the constructed low thermal resistance heat dissipation path to achieve multi-path efficient heat dissipation.

[0015] Illustratively, the power device may be connected to one via or multiple vias.

[0016] In another exemplary embodiment, the via hole may be connected to a layer of copper foil or multiple layers of copper foil.

[0017] In other exemplary embodiments, the copper foil may be connected to one through-hole or multiple through-holes.

[0018] Based on the first aspect, or the first embodiment of the first aspect, the embodiment of the present application also provides a second embodiment of the first aspect: the two opposing surfaces and side surfaces of the package body are covered with metal layers, the metal layers including a surface metal layer located on the surface of the package body and a side metal layer located on the side surface of the package body, and the side metal layers are connected to the two surface metal layers respectively, and the end of the heat conductor is connected to the surface metal layer on the side thereof. Thus, the metal layer is used to establish a heat conduction path from the heat dissipation surface side to the non-heat dissipation surface side. For the power device on the non-heat dissipation surface side, the heat generated by its operation can also be transferred to the surface metal layer on the heat dissipation surface side through the surface metal layer on the non-heat dissipation surface side and the side metal layer in sequence, thereby fully utilizing the heat dissipation capacity of the heat dissipation device and using the metal layer on the surface of the package body to construct a second heat dissipation path, thereby simultaneously and quickly dissipating the heat of the power device on the non-heat dissipation surface side.

[0019] Based on the second embodiment of the first aspect, the embodiment of the present application also provides a third embodiment of the first aspect: the surface metal layer of the metal layer is patterned to form pins of a double-sided packaging structure. With this arrangement, the thermal conductor can also lead the electrical signals of the PCB substrate to the surface of the package body, and connect the functional pins formed by patterning the side surface metal layer to the system board or the power supply backplane. In other words, this low thermal resistance heat dissipation path has the function of flow, such as but not limited to communication or power supply, which meets the trend design requirements of high-density layout.

[0020] In practical applications, when the surface of the package is not covered with a metal layer, the thermal conductor can also be directly used as a functional pin of the double-sided package structure to achieve signal transmission.

[0021] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, the present application also provides a fourth embodiment of the first aspect: in the insertion direction, the other end of the thermal conductor extends to the non-heat dissipation surface of the package, and the non-heat dissipation surface and the heat dissipation surface are two surfaces of the package that are opposite to each other. In this way, based on the thermal conductor, bidirectional heat conduction capability can be achieved.

[0022] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, the embodiment of the present application further provides a fifth embodiment of the first aspect: the through hole includes a large-aperture section and a small-aperture section that are connected to each other, and the heat conductor is inserted in the large-aperture section of the through hole to achieve heat dissipation and flow, and the heat conductor does not penetrate to the other side of the PCB substrate, which can reduce the board area of ​​this side, so as to arrange more electronic components and improve the layout density; at the same time, based on the setting of the small-aperture section, in the PCB electroplating and reflow assembly processes, exhaust can be discharged through the small-aperture section. For example, in the copper plating process of the through-hole side wall, it is conducive to the exchange of potions, avoiding poor exchange of potions at the bottom of the blind hole (reducing the board area occupied by the heat conductor), affecting the plating quality of large-size buried holes; for another example, during reflow assembly, the flux can be discharged through the small-aperture section after volatilization, which can avoid the expansion of gas and the volatilization of solder paste, and effectively ensure the product yield.

[0023] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, the embodiment of the present application also provides a sixth embodiment of the first aspect: the heat conductor includes a small-sized segment and a large-sized segment connected to each other, and there is a step surface between the two; the small-sized segment is inserted into the through hole of the PCB substrate, and the step surface abuts against the board surface of the PCB substrate. In this way, based on the abutting and fitting relationship between the step surface and the board surface, an assembly positioning can be formed when the heat conductor is inserted into the PCB substrate, so that the heat conductor maintains a pre-installed angle relative to the PCB substrate, for example, but not limited to being approximately perpendicular, to avoid the heat conductor from tipping over before being fixed, and effectively ensure the product yield.

[0024] Based on the sixth embodiment of the first aspect, the present application also provides a seventh embodiment of the first aspect: multiple small-sized segments are spaced apart on the large-sized segment of the thermal conductor. In practical applications, each small-sized segment is respectively adapted to be inserted into a corresponding through-hole, effectively enhancing thermal conductivity. Furthermore, multiple small-sized segments adapted to the PCB substrate can be placed in a single assembly operation, further improving pre-assembly stability and providing better assembly processability.

[0025] In practical applications, the large-size segment of the heat conductor can be in the shape of an elongated strip, and the plurality of small-size segments are sequentially spaced along the extension direction of the large-size segment. For example, the large-size segment can be in the shape of a straight strip or a wavy strip.

[0026] In other practical applications, the large-sized segment of the thermal conductor can also be curved, with multiple small-sized segments arranged in a sequentially spaced relationship along the curved direction of the large-sized segment. For example, the large-sized segment can be roughly rectangular, or can be determined based on the actual board layout, so as to provide good heat dissipation for the power device while taking into account the original functional layout of the product, thereby having good adaptability.

[0027] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, or the seventh embodiment of the first aspect, the embodiment of the present application further provides an eighth embodiment of the first aspect: the power device includes a field effect transistor. In actual applications, the double-sided packaging structure also includes multiple electronic components, at least one of the multiple electronic components is a capacitor or a resistor, and is disposed on at least one side of the PCB substrate.

[0028] A second aspect of the present application provides a power supply device comprising a system board, a power system-in-package (SIP) module, and a heat sink. The SIP module is fabricated using the aforementioned double-sided packaging structure and soldered to the system board. The heat sink engages and exchanges heat with the other side of the SIP module. Overall, the multi-path enhanced heat dissipation achieved through this double-sided packaging structure effectively mitigates the overheating bottleneck of power SiP devices, providing a technical foundation for improving power density and efficiency.

[0029] The third aspect of the embodiment of the present application provides another power supply device, which includes a system board, a power supply backplane, a power supply system-level packaging module and a heat dissipation device. The power supply system-level packaging module is made of the double-sided packaging structure as described above and is welded to the power supply backplane. The heat dissipation device and the power supply backplane are located on the same side, and the heat dissipation device is in contact with the power supply system-level packaging module for heat exchange. In practical applications, it can also effectively improve the over-temperature bottleneck of power SiP devices and provide technical support for improving power density and efficiency.

[0030] A fourth aspect of an embodiment of the present application provides an electronic device, which includes a mainboard and the power supply device as described above, and the power supply device is arranged on the mainboard.

[0031] Exemplarily, the heat dissipation device may be a fin air-cooled heat sink; in another exemplary embodiment, the heat dissipation device may also be a liquid-cooled cold plate heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] FIG1 is a cross-sectional view of a double-sided packaging structure provided in an embodiment of the present application;

[0033] FIG2 is a schematic diagram of a use state of the double-sided packaging structure shown in FIG1 ;

[0034] FIG3 is a schematic diagram of another usage state of the double-sided packaging structure shown in FIG1 ;

[0035] FIG4 is a schematic structural diagram of a heat conducting member provided in an embodiment of the present application;

[0036] FIG5 is a schematic structural diagram of another heat conducting member provided in an embodiment of the present application;

[0037] FIG6 is a schematic structural diagram of another heat conducting member provided in an embodiment of the present application;

[0038] FIG7 is a schematic structural diagram of another heat conducting member provided in an embodiment of the present application;

[0039] FIG8 is a cross-sectional view of another double-sided packaging structure provided in an embodiment of the present application;

[0040] FIG9 is a schematic diagram of a use state of the double-sided packaging structure shown in FIG8;

[0041] FIG10 is a schematic diagram of the assembly process of the double-sided packaging structure shown in FIG8 ;

[0042] FIG11 is a cross-sectional view of another double-sided packaging structure provided in an embodiment of the present application;

[0043] FIG12 is a schematic diagram of a use state of the double-sided packaging structure shown in FIG11;

[0044] FIG13 is a schematic diagram of an electronic device provided in an embodiment of the present application;

[0045] FIG14 is a schematic diagram of the architecture of a power supply device provided in an embodiment of the present application;

[0046] FIG15 is a schematic diagram of the architecture of another power supply device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0047] The embodiments of the present application provide a double-sided packaging structure implementation solution for application in different high power consumption scenarios.

[0048] With the development of SIP (System in Package) technology, power devices have evolved from a single-sided layout to a double-sided layout for use in miniaturized, integrated, and high-power consumption scenarios. Taking the power system-in-package (SIP) module as an example, the field-effect transistors (MOSFET or MOS) of the power SiP are arranged on both sides of the package PCB, forming a double-sided packaging structure. The MOS in the power SiP generates a lot of heat and requires good heat dissipation capabilities. In addition to MOS, the power SiP can also include electronic components such as resistors and / or capacitors.

[0049] With innovations in circuit architecture, power modules with vertical power delivery architectures achieve higher power density. Consequently, the power SiPs are increasingly positioned closer to high-temperature load chips, creating a cooling bottleneck. If internal heat cannot be removed promptly, heat accumulation can lead to device overheating, forcing the power SiPs to derate to ensure performance and lifespan. For example, a 1600W packaged power supply can deliver full power below 60°C, but output power drops to 1200W at 70°C. This clearly indicates that the heat dissipation capabilities of the package structure directly impact the continued improvement of power density.

[0050] In power SiP modules, the MOS transistor (MOS) located on the non-heat-dissipating side has a long heat path from the heat sink. Effectively dissipating the heat generated by this MOS transistor has become a key focus for ensuring the thermal performance of the package structure. Therefore, solutions are needed to effectively dissipate heat from the non-heat-dissipating side of the double-sided package structure to prevent high temperatures from impacting product performance.

[0051] Based on this, an embodiment of the present application provides a double-sided packaging structure, which includes a PCB substrate, a power device and a thermal conductor. The PCB substrate includes a first board surface and a second board surface opposite to each other, and power devices are provided on the first board surface and the second board surface. The thermal conductor is inserted into the PCB substrate and packaged to form a package body; the "packaging" here means that the PCB substrate and the power device are sealed with packaging filler to form a package body with a certain structural form. For example, but not limited to, the power device can be a MOS of a power SiP module. In other possible implementation methods, electronic components such as capacitors, resistors, inductors or integrated circuits (ICs) can also be packaged on both side surfaces of the PCB substrate.

[0052] The package includes a heat dissipation surface, which is opposite to one side of the PCB substrate (e.g., the first side) and is configured to engage in heat exchange with a heat sink. This heat dissipation surface is also the heat dissipation surface of the double-sided package structure, while the other side, facing away from the heat dissipation surface, is the non-heat dissipation surface of the double-sided package structure. The heat dissipation surface of the package can exchange heat directly with the heat sink or indirectly through an intermediate structure, such as, but not limited to, through thermally conductive gel.

[0053] The PCB substrate has vias and through-holes, which are connected to each other through copper foil on the PCB substrate. The vias are connected to at least one power device arranged on the other side surface (e.g., the second surface) of the PCB substrate. The thermal conductor is inserted into the through-hole of the PCB substrate, and one end of the thermal conductor extends to the heat dissipation surface of the package.

[0054] With this arrangement, the operating heat generated by the power devices on the other side of the double-sided packaging structure can be sequentially conducted to the heat dissipation surface through a heat dissipation path constructed by vias, copper foil, through-holes, and thermal conductive members. The through-holes, copper foil, and thermal conductive members on the PCB board all have good thermal conductivity, and the thermal resistance of the heat dissipation path formed is low. In other words, a heat dissipation path with low thermal resistance is constructed between the non-heat dissipation surface side and the heat dissipation surface side of the double-sided packaging structure, which can fully utilize the heat dissipation capacity of the heat dissipation device and effectively improve the heat dissipation performance of the power devices on the non-heat dissipation surface side. At the same time, the power devices on the first side of the double-sided packaging structure are located on the side where the heat dissipation surface is located, and the heat dissipation path from the heat dissipation device is short, which can achieve reliable heat dissipation.

[0055] Overall, the operating heat generated by the power devices on both sides is quickly dissipated, effectively improving heat dissipation performance. In high-power applications, the double-sided packaging structure with excellent heat dissipation performance can prevent heat accumulation and device overheating, ensuring the actual output capacity of the power SiP and effectively overcoming the impact of output derating on product performance.

[0056] Furthermore, the thermal conductor insert in this embodiment, with the walls of the through-holes on the PCB substrate providing support and positioning for the thermal conductor, allows for the use of thermal conductors with smaller cross-sectional dimensions, resulting in better pre-installation stability. This reduces board space and package width to a certain extent, meeting the trend toward high-density layouts.

[0057] Furthermore, due to the excellent pre-installed stability of the thermal conductor, the height of the thermal conductor can be determined based on the overall layout requirements of the actual product for thicker packages. Furthermore, the efficient heat dissipation path formed by the thermal conductor improves heat dissipation on the non-heat dissipating surface without increasing the thickness of the package. This allows for wide application in packages of varying thicknesses, demonstrating excellent structural versatility.

[0058] To better understand the technical solution and technical effects of the present application, without loss of generality, the following will describe a power SiP as the object of description and describe a specific embodiment in detail with reference to the accompanying drawings. Please refer to Figure 1, which is a cross-sectional view of a double-sided packaging structure provided in an embodiment of the present application.

[0059] As shown in Figure 1, this double-sided packaging structure 10 is a power SiP module. In the example shown, a first MOS transistor 11 is disposed on a first surface 21 of a PCB substrate 2, and a second MOS transistor 12 is disposed on a second surface 22 of the PCB substrate 2. For ease of illustration, other electronic components in the power SiP, such as, but not limited to, power devices such as capacitors, resistors, and inductors, are not shown.

[0060] The via holes 23 and through holes 24 spaced apart on the PCB substrate 2 are connected by copper foil 25. In a specific implementation, the copper foil 25 can be an intermediate copper foil layer or a surface copper foil layer, and can be formed using different hole-forming processes to achieve reliable connection between the via holes 23 and the copper foil 25, and between the through holes 24 and the copper foil 25.

[0061] In a specific implementation, the via 23 used to connect to the MOS can be a through hole as shown in the figure. In other possible implementations, the via 23 can also adopt other hole types, such as buried vias, blind vias, etc., all of which can achieve the above-mentioned connection relationship. This embodiment of the present application is not limited.

[0062] The MOSs arranged on both sides of the PCB substrate 2 are connected to vias 23, and heat is transferred to through-holes 24 via copper foil 25. In a specific implementation, each MOS can be connected to one or more vias 23, with multiple vias 23 achieving higher heat transfer efficiency. One or more vias 23 corresponding to a MOS can be connected to a single layer of copper foil 25 or multiple layers of copper foil 25, with multiple layers of copper foil 25 achieving higher heat transfer efficiency. Similarly, a single layer of copper foil 25 or multiple layers of copper foil 25 can be connected to one or more through-holes 24, with heat transfer efficiency further improved by using a thermal conductor 4 compatible with the multiple through-holes 24. In other possible implementations, the number of vias 23, copper foil 25, and through-holes 24 configured as PCB copper in the heat dissipation path can be arbitrarily selected as needed.

[0063] The first MOS 11 located on the first board surface 21 and the second MOS 12 located on the second board surface 22 can be connected to the same through-hole through the same via and copper foil layer, and the heat generated by the operation of each MOS is transferred to the through-hole side by a path with low thermal resistance. In a possible implementation, each MOS can also be connected to a different through-hole through different vias and copper foil layers, as long as a heat dissipation path with low thermal resistance can be obtained. This is not limited in the present embodiment.

[0064] Specifically, without affecting the functional realization of the PCB substrate 2, the distance between the via 23 and the through hole 24 can be as small as possible to shorten the heat dissipation path of the MOS (power device) to be cooled and further optimize the heat dissipation capacity.

[0065] In a specific implementation, the MOSs on both sides of the PCB substrate 2 can be interconnected through the PCB substrate according to functional configuration requirements. This can be achieved using existing technologies, which will not be described in detail here.

[0066] It is understood that the number of MOS elements in the double-sided package structure 10 can be determined based on the overall product design. For example, but not limited to, four, six, or other pluralities can be configured. Multiple MOS elements can be disposed on two opposing surfaces of the PCB substrate 2 and encapsulated with the encapsulating filler 3 to form a package. The encapsulating filler 3 can be a resin filler material, which is not limited in this embodiment of the present application.

[0067] The heat conducting member 4 of the double-sided packaging structure 10 is inserted on the PCB substrate 2. In the insertion direction, the heat conducting member 4 is a variable cross-section structure, including a small-size segment 41 and a large-size segment 42 connected to each other, with a step surface 43 between the two.

[0068] Among them, the small-size segment 41 of the heat conductor 4 is inserted into the through hole 24 of the PCB substrate 2 and extends out of the first board surface 21. The heat conductor 4 can contact the through hole 24 through the small-size segment 41 to achieve heat transfer; the large-size segment 42 of the heat conductor 4 is located on the side of the second board surface 22, and its step surface 43 is in contact with the second board surface 22. In this way, based on the abutting and adapting relationship between the step surface 43 and the second board surface 22, an assembly positioning can be formed when the heat conductor 4 is inserted on the PCB substrate 2, so that the heat conductor 4 maintains a pre-installed angle relative to the PCB substrate 2, for example but not limited to being approximately vertical as shown in the figure, to prevent the heat conductor 4 from tipping over relative to the PCB substrate 2 before being fixed, thereby effectively ensuring the product yield. It should be understood that the "small size segment" and "large size segment" here are used to illustrate the variable cross-sectional structural size relationship of the heat conductor 4, rather than to refer to specific structural dimensions; in addition, the step surface 43 is a transitional structural surface between the "small size segment" and the "large size segment", and the shape of the step surface can be based on the hole-forming process, rather than being limited to a plane perpendicular to the axis of the through hole.

[0069] Furthermore, the thermal conductor 4 is inserted into the hole, and the wall of the via 23 on the PCB substrate 2 supports the thermal conductor 4. This allows for better pre-installation stability even with a smaller cross-sectional thermal conductor 4. Compared to traditional heat dissipation methods using surface-mounted copper pillars, which require a certain cross-sectional dimension to be stably attached to the PCB surface, the larger the height of the copper pillar, the larger its cross-sectional dimension must be to prevent instability and tipping. For double-sided packaging structures with the same heat dissipation parameters, inserting the thermal conductor 4 into the hole allows the smaller cross-sectional thermal conductor 4 to reduce board space and effectively control the package width.

[0070] In addition, the assembly positioning achieved based on the step surface 43 can reduce the processing accuracy requirements of the heat conductor 4 and the through hole 24 to a certain extent, and can reasonably control the product processing cost while ensuring the product yield.

[0071] In a specific implementation, the heat conductor 4 inserted into the through hole 24 can be assembled and fixed using a through-hole reflow process. Specifically, tin can be printed near the through hole 24, and the heat conductor 4 can be inserted into the hole. Then, it can be soldered together with other surface-mount components on the PCB substrate 2 through a reflow oven. The heat conductor 4 and the through hole 24 are fixed with solder 6, without the need for additional steps. This has the characteristics of a simple process route and controllable process costs.

[0072] As shown in Figure 1, in the insertion direction, the two protruding ends of the heat conductor 4 are respectively located on the surface of the package body on their side, that is, they penetrate the package body (PCB substrate and packaging material), one end extends to the heat dissipation surface of the package body, and the other end extends to the non-heat dissipation surface of the package body opposite to the heat dissipation surface, so as to reduce the thermal resistance of the heat dissipation path; that is, the small-size segment 41 of the heat conductor 4 extends to the first surface 10A of the package body, and the large-size segment 42 of the heat conductor 4 extends to the second surface 10B of the package body. The first surface 10A of the package body is on the same side as the first board surface 21 of the PCB substrate 2, and the second surface 10B of the package body is on the same side as the second board surface 22 of the PCB substrate 2. Thus, heat can be transferred to the two opposite surfaces of the package body through the heat conductor 4, and one of them can be selected to realize contact heat exchange with the heat dissipation device side according to the configuration requirements of the actual application scenario.

[0073] Here, the first surface 10A and the second surface 10B are two opposing surfaces of the package body. In different usage states, one is a heat dissipation surface close to the heat sink, while the other is a non-heat dissipation surface away from the heat sink. Please refer to Figures 2 and 3 , which respectively illustrate two different usage states of the double-sided package structure 10 shown in Figure 1 .

[0074] In one specific implementation, as shown in Figure 2 , the double-sided package structure 10 is soldered to a system board 30 , with the pins located on the second surface 10B of the package, and the soldering surface of the package located on the side of the second surface 10B. The heat sink 20 is disposed on the side of the first surface 10A of the package for contact heat exchange, with the heat dissipation surface of the package located on the side of the first surface 10A. In other words, the soldering surface and the heat dissipation surface are located on opposite sides of the package. In the double-sided package structure 10 shown in Figure 2 , the first MOS 11 disposed on the first board surface is a power device on the heat dissipation side, while the second MOS 12 disposed on the second board surface is a power device on the non-heat dissipation side.

[0075] The heat generated by the second MOS 12 on the non-heat dissipation side can be transferred through the vias and copper foil on the PCB substrate 2 to the through-hole side. Specifically, the heat conduction direction is shown by the dotted arrow in Figure 2, and then transferred to the heat sink 20 through the thermal conductor 4. In this way, the heat dissipation capacity of the heat sink 20 is fully utilized to establish a first heat dissipation path with low thermal resistance: PCB copper (via 23, copper foil 25, through-hole 24) → thermal conductor 4 → heat sink 20, quickly dissipating the heat from the power devices on the non-heat dissipation side.

[0076] In a specific implementation, the structural form of the heat sink 20 can be determined based on the configuration requirements of the application scenario, such as, but not limited to, a heat sink cold plate. To improve heat conduction efficiency, the heat sink 20 can be in contact with the heat dissipation surface of the double-sided packaging structure 10 through a thermally conductive medium 40 for heat exchange. For example, but not limited to, the thermally conductive medium 40 can be a thermally conductive gel, which fills the gaps while conducting heat, thereby reducing the absolute thermal resistance of the heat sink structure and achieving low thermal resistance and high thermal conductivity heat dissipation.

[0077] In other possible implementations, the heat dissipation device 20 may adopt a liquid cooling structure or an air cooling structure, which is not limited in the present embodiment.

[0078] As shown in Figures 1 and 2, in order to further improve the heat dissipation capability of the double-sided packaging structure 10, optionally, the first surface 10A, the second surface 10B and the side surfaces of the package body are covered with a metal layer 5, and the side metal layer 51 located on the side is respectively connected to the surface metal layer 52 located on the first surface 10A and the second surface 10B, so as to use the metal layer 5 to establish a heat conduction path from the heat dissipation surface side to the non-heat dissipation surface side.

[0079] The heat generated by the second MOS 12 on the non-heat dissipation surface can also be transferred to the surface metal layer 52 on the first surface 10A through the surface metal layer 52 and the side metal layer 51 on the second surface 10B. Specifically, as shown by the solid arrow in Figure 2, the heat conduction direction fully utilizes the heat dissipation capacity of the heat sink 20 and utilizes the metal layer 5 on the surface of the package to form a second heat dissipation path: surface metal layer 52 → side metal layer 51 → heat sink 20, thereby simultaneously and quickly dissipating heat from the power devices on the non-heat dissipation surface.

[0080] Furthermore, the surface metal layer 52 located on the first surface 10A and the second surface 10B, respectively, contacts and exchanges heat with the small-sized segment 41 and the large-sized segment 42 of the thermal conductor 4. The metal layer 5 forms a continuous heat conduction path that can transfer heat to both the heat sink 20 and the system board 30, thereby balancing, transferring, and dissipating heat from the thermal conductor 4. Overall, this double-sided packaging structure 10 enhances heat dissipation through multiple paths, effectively alleviating the overheating bottleneck of power SiP devices and providing technical support for improving power density and efficiency.

[0081] A temperature simulation test was conducted using a heat dissipation solution using surface-mounted copper pillars on the non-heat dissipation side as a comparative example. Under the same test scenario, the double-sided packaging structure 10 described in Figure 1 was applied. The MOS temperature on the non-heat dissipation side can be reduced by about 25°C, and the heat dissipation enhancement effect is more significant.

[0082] In a specific implementation, the metal layer 5 can be formed by surface deposition, for example but not limited to, a solderable metal plating layer such as a copper layer.

[0083] As shown in FIG. 1 and FIG. 2 , the heat conducting member 4 located on the first heat dissipation path may further have a signal transmission function.

[0084] The thermal conductor 4 can be soldered to the through-hole 24 of the PCB substrate 2, with its large-sized segment 42 extending to the second surface 10B of the package body and exchanging heat with the surface metal layer 52 on the second surface 10B side. Furthermore, the surface metal layer 52 on the second surface 10B side can be patterned to form pins on the soldering surface of the double-sided package structure 10, with the connected large-sized segments 42 fulfilling the pin function. In other words, the thermal conductor 4 can also conduct electrical signals from the PCB substrate 2 to the surface of the package body and connect to the surface metal layer 52. The patterned surface metal layer 52 serves as the functional pin of the double-sided package structure 10 and is connected to the system board 30.

[0085] Of course, in the case where the surface of the package body is not covered with a metal layer, the large-size segment 42 can also be directly used as a functional pin of the double-sided package structure 10 to achieve signal transmission, such as but not limited to communication or power supply.

[0086] In another specific implementation, as shown in FIG3 , the double-sided package structure 10 is soldered to a power supply backplane 50 , with the pins located on the second surface 10B of the package, and the soldering surface of the package located on the side of the second surface 10B. The heat sink 20 is disposed on the side of the second surface 10B of the package and is in contact with the package for heat exchange, with the heat dissipation surface of the package located on the side of the second surface 10B. In other words, the soldering surface and the heat dissipation surface are located on the same side of the package. In the double-sided package structure 10 shown in FIG3 , the first MOS 11 disposed on the first board surface is a power device on the non-heat dissipation side, and the second MOS 12 disposed on the second board surface is a power device on the heat dissipation side.

[0087] The heat generated by the first MOS 11 on the non-heat dissipation surface can be transferred through the vias and copper foil on the PCB substrate 2 to the through-hole side, specifically in the heat conduction direction indicated by the dotted arrows in Figure 3, and then transferred to the heat dissipation device 20 through the heat conductor 4. In this way, the heat dissipation capacity of the heat dissipation device 20 is fully utilized to establish a first heat dissipation path with low thermal resistance, quickly dissipating the heat of the power components on the non-heat dissipation surface.

[0088] The heat generated by the first MOS 11 on the non-heat dissipation surface can also be transferred to the surface metal layer 52 on the second surface 10B through the surface metal layer 52 on the first surface 10A and the side metal layer 51. Specifically, as shown by the solid arrows in FIG3 , the heat dissipation capacity of the heat sink 20 is fully utilized, and the second heat dissipation path formed by the metal layer 5 on the surface of the package body is used to simultaneously and quickly dissipate the heat from the power devices on the non-heat dissipation surface.

[0089] It should be noted that in the implementation described in FIG1 , the MOS (power devices) arranged on both sides of the PCB substrate 2 are connected to the vias. In other possible implementations, only the MOS on the non-heat dissipation side can be connected to the vias (not shown in the figure), providing a reliable heat dissipation path for the power devices on the non-heat dissipation side of the double-sided packaging structure. In other words, the MOS on the side away from the heat dissipation device establishes a low thermal resistance path through the vias, copper foil and through-holes. For example, the first board surface 21 of the package body is close to the heat dissipation device, and the second MOS 12 on the second board surface 22 is connected to the via; for another example, the second board surface 22 of the package body is close to the heat dissipation device, and the first MOS 11 on the first board surface 21 is connected to the via.

[0090] Optionally, other electronic components (not shown) are integrated and packaged within the double-sided packaging structure 10. For example, but not limited to, these electronic components may be resistors and / or capacitors disposed on the PCB substrate 2 to achieve corresponding functions according to the overall module design requirements. In addition to MOS, other electronic components with high heat generation may also be used as power devices and configured with corresponding vias (not shown). The heat generated by their operation is transferred to the corresponding thermal conductors through the PCB copper (vias, copper foil, through-holes).

[0091] For the columnar heat conducting element 4 with variable cross-section, different structural forms can be adopted in specific implementation.

[0092] Please refer to Figure 4, which is a schematic diagram of the structure of a heat conductor provided in an embodiment of the present application. As shown in Figure 4, the heat conductor 4a is a rotating body, with a small-sized segment 41 and a large-sized segment 42 both being rotating bodies, with a stepped surface 43 formed between them. The small-sized segment 41 is configured to be inserted into the through hole 24 of the PCB substrate 2 to form a heat dissipation path, and the stepped surface 43 is configured to abut against the surface of the PCB substrate to form an assembly position.

[0093] Please refer to Figure 5, which is a schematic diagram of the structure of another heat conducting member provided in an embodiment of the present application. As shown in Figure 5, the large-size section 42 of the heat conducting member 4b is a rectangular parallelepiped, and the small-size section 41 is a column with an irregular cross-section. Similarly, a step surface 43 is formed between the two.

[0094] The heat conducting members described in Figures 4 and 5 above each include a small-sized segment. In order to improve both heat conducting capacity and operability, the heat conducting member may optionally include multiple small-sized segments.

[0095] Please refer to Figure 6, which is a schematic diagram of the structure of another thermal conductor provided in an embodiment of the present application. As shown in Figure 6, the large-size segment 42 of the thermal conductor 4c is elongated. Three small-size segments 41 are spaced apart on the elongated large-size segment 42. Each small-size segment 41 can be respectively inserted into three through holes 24 of the PCB substrate 2 (not shown in the figure). In other implementations, a plurality of other small-size segments 41 can be provided on the large-size segment 42. This is not limited to the embodiment of the present application.

[0096] In this way, the structural form of arranging multiple small-size segments on the large-size segment 42 can effectively enhance the thermal conductivity, and multiple small-size segments 41 adapted to the PCB substrate 2 can be placed in one operation, and the pre-installation stability can be further improved, with better assembly processability.

[0097] It should be noted that the long strip-shaped large-size segment 42 is not limited to the straight strip shown in the figure. In actual application scenarios, it can be avoided according to the actual board layout, such as but not limited to a wavy long strip.

[0098] Please refer to Figure 7, which is a schematic diagram of the structure of another thermal conductor provided in an embodiment of the present application. As shown in Figure 7, the large-size segment 42 of the thermal conductor 4d is bent. Three small-size segments 41 are spaced apart on the bent large-size segment 42. Each small-size segment 41 can be inserted into three through-holes 24 of the PCB substrate 2 (not shown in the figure). In other implementations, a plurality of other small-size segments 41 can be provided on the large-size segment 42. This is not limited to the embodiment of the present application.

[0099] It should also be noted that the bent large-size segment 42 is not limited to the roughly right-angled shape shown in the figure. In actual application scenarios, it can be determined according to the actual board layout to provide good heat dissipation capabilities for power devices while taking into account the original functional layout of the product, and has good adaptability.

[0100] For the MOS to be heat-dissipated in the double-sided packaging structure 10, the specific number and placement of the thermal conductors 4 can be adjusted based on the layout of the power devices. Please refer to Figures 8 and 9 , where Figure 8 is a cross-sectional view of another double-sided packaging structure provided in an embodiment of the present application, and Figure 9 is a schematic diagram of the double-sided packaging structure shown in Figure 8 in a state of use. To clearly illustrate the differences and connections between this embodiment and the solution described in Figure 1 , components or structures with the same functions are indicated with the same reference numerals in the figures.

[0101] Compared to the double-sided package structure described in FIG1 , the double-sided package structure 10a shown in FIG8 includes two first MOS 11, two second MOS 12, and two thermal conductors 4. It should be understood that FIG8 is a cross-sectional view of the double-sided package structure 10a, and the increased number of components, such as the first MOS 11, the second MOS 12, and the thermal conductor 4, is not limited to the number shown in the cross-sectional view.

[0102] As shown in Figure 9, the double-sided packaging structure 10a is soldered to the system board 30. Based on the thermal conductor 4, PCB copper (vias, copper foil, through-holes) and metal layer 5, two continuous heat conduction paths are formed as shown by the dotted arrows in the figure. One path is transferred to one side of the heat sink 20, and the other path is transferred to the side of the system board 30, thereby playing the role of heat equalization, heat transfer and heat dissipation of the heat conducted by the thermal conductor 4. In a specific implementation, the overall layout of the double-sided packaging structure 10a can be determined according to different application scenarios. This is not limited in the present embodiment.

[0103] The other structures and implementation methods of the double-sided packaging structure 10a may be the same as those described in FIG1 , and thus will not be described in detail.

[0104] The following takes the double-sided packaging structure shown in FIG. 8 as an example and briefly describes the assembly process of the double-sided packaging structure 10 a in conjunction with FIG. 10 .

[0105] Step S601: assemble the first MOS 11 on the first surface 21 of the PCB substrate 2. For example, but not limited to, the SMT (Surface Mounted Technology) process can be used to complete the assembly and fixation of the above components.

[0106] Step S602 , assembling the second MOS 12 and the heat conducting member 4 on the second board surface 22 of the PCB substrate 2 , and SMT can also be used to complete the above assembly and fixation.

[0107] Step S603, double-sided packaging to form a package body, based on the packaging filler 3, the arrangement spacing or gaps between the first MOS 11, the second MOS 12, the thermal conductor 4 and the PCB substrate 2 are completely filled, and the PCB substrate 2 and the first MOS 11, the second MOS 12 and the thermal conductor 4 and other devices are coupled into one.

[0108] Step S604 , grinding the plastic package body, so that both ends of the heat conductor 4 are exposed on both side surfaces of the package body; that is, the grinding process enables the two protruding ends of the heat conductor 4 to be located on the package body surface on their respective sides.

[0109] Step S605: metallizing the surface of the package.

[0110] In a specific implementation, a metallization process may be used to deposit a continuous metal coating 5A on the surface, sidewalls and end faces of the package body and the heat conducting member 4 .

[0111] Step S606: patterning to form a metal layer 5.

[0112] In a specific implementation, after graphic processing and surface treatment, the metal coating is formed into a desired solderable pattern. The metal layer 5 formed by the graphic treatment can serve as a continuous heat conduction path and at the same time serve as the pin of the double-sided packaging structure 10.

[0113] It should be understood that step S604 is an optional process. In other possible implementations, the packaging process accuracy can be used to ensure that the extended end of the heat conducting member 4 is located on the surface of the packaging body on the side.

[0114] In the aforementioned embodiment, both protruding ends of the heat conductor extend to the surface of the package body on that side. In other implementations, the heat conductor may also extend to the heat dissipation surface of the package body at only one end. Please refer to Figures 11 and 12, wherein Figure 11 is a cross-sectional view of another double-sided packaging structure provided in an embodiment of the present application, and Figure 12 is a schematic diagram of a usage state of the double-sided packaging structure shown in Figure 11. In order to clearly illustrate the differences and connections between this embodiment and the solutions described in Figures 1 and 8, components or structures with the same functions are indicated in the figures with the same reference numerals.

[0115] As shown in Figure 11, the double-sided packaging structure 10b can also be a power SiP module. MOSs are provided on both sides of the PCB substrate 2. A first MOS 11 is provided on the first surface 21 of the PCB substrate 2, and a second MOS 12 is provided on the second surface 22 of the PCB substrate 2.

[0116] The vias 23 and through-holes 24b spaced apart on the PCB substrate 2 are connected by copper foil 25. In a specific implementation, the copper foil 25 can be an intermediate copper foil layer. The MOS transistors on both sides of the PCB substrate 2 are connected to the vias 23, and heat is transferred to the through-holes 24 through the copper foil 25.

[0117] In this embodiment, the through hole 24b is a stepped hole, including a large-diameter section 241b and a small-diameter section 242b that are connected to each other; wherein, the large-diameter section 241b is close to the first board surface 21, and the heat conductor 4b is inserted in the large-diameter section 241b of the through hole 24b to achieve heat dissipation and flow; the small-diameter section is close to the second board surface 22, where the heat conductor 4b does not penetrate to the side where the second board surface 22 is located, which can reduce the occupied board area, so that more electronic components 7 can be arranged on the second board surface 22, thereby improving the layout density.

[0118] In addition, during the PCB electroplating and reflow assembly processes, exhaust can be achieved through the small-aperture section 242b. For example, during the copper plating process on the sidewalls of the through-holes, it is beneficial to the exchange of chemicals, thus avoiding poor exchange of chemicals at the bottom of blind holes (reducing the area occupied by the thermal conductors on the board), which affects the electroplating quality of large-size buried holes. For another example, during reflow assembly, the flux can be discharged through the small-aperture section after volatilization, thus avoiding the possibility that the gas expansion and volatilization will squeeze the solder paste, which may cause the solder paste and the thermal conductors to fail to overlap and affect the welding yield.

[0119] In the insertion direction, the heat conductor 4b has a variable cross-section structure, including a small-sized segment 41 and a large-sized segment 42 connected to each other, with a stepped surface 43 between them. When the heat conductor 4 is inserted into the PCB substrate 2, the assembly is positioned, so that the heat conductor 4 maintains the pre-installed angle relative to the PCB substrate 2, and also has good pre-installed stability.

[0120] As shown in Figure 12, the double-sided packaging structure 10b is soldered to the power supply backplane 50. The first MOS 11, located on the first board surface, is the power device on the non-heat dissipation side, while the second MOS 12, located on the second board surface, is the power device on the heat dissipation side. The heat dissipation path of the power device (first MOS) on the non-heat dissipation side, formed by the thermal conductor 4b, the PCB copper (vias, copper foil, through-holes), and the metal layer 5, is shown as the dotted arrow in the figure.

[0121] It is understandable that the power device (second MOS) on the heat dissipation surface side can also achieve heat dissipation based on the thermal conductor 4b, PCB copper and metal layer 5. In order to clearly illustrate the heat dissipation path on the non-heat dissipation surface side, it is not explicitly shown in the drawing.

[0122] The other structures and implementations of the double-sided packaging structure 10b may be the same as those described in FIG. 1 and FIG. 8 , and thus will not be described in detail.

[0123] A temperature simulation test was conducted using a heat dissipation solution using surface-mounted copper pillars on the non-heat dissipation side as a comparative example. Under the same test scenario, when the comparative surface-mounted copper pillar solution was used, the MOS temperature on the non-heat dissipation side reached 125°C, which could not meet the product thermal derating. Using the double-sided packaging structure 10b described in Figure 11, the heat generated by each MOS was transferred to the heat conductor 4b through the PCB copper, and then efficiently transferred to the heat dissipation device 20 by the heat conductor 4b. The temperature gain on the non-heat dissipation side was 6.5°C, and the temperature gain on the heat dissipation side was 8°C, with a more significant heat dissipation enhancement effect.

[0124] At the same time, taking the implementation method of inserting the heat conductive part through the through hole as a comparative example, the double-sided packaging structure 10b described in Figure 11 is adopted, and the through hole 24b on the PCB substrate adopts a large and small hole structure. The board area occupied by the non-heat dissipation side can be reduced by 85%, and the layout area benefit is significant.

[0125] In the aforementioned implementation, the heat conductor 4 has a variable cross-section structure in the insertion direction, so as to provide support and positioning through the stepped surface. In other possible implementations, the heat conductor may also have a uniform cross-section structure, such as but not limited to a cylindrical shape (not shown in the figure), which can also achieve a heat dissipation path with low thermal resistance. This is not limited in the present embodiment.

[0126] The double-sided packaging structure implementation scheme described in the above embodiments can be widely applied to various electronic devices including power devices to be cooled. Please refer to Figure 13, which is a schematic diagram of an electronic device provided in an embodiment of the present application.

[0127] As shown in Figure 13, the electronic device includes a shell 100 and a mainboard 200 and a power supply device 300 arranged in the shell 100. The power supply device 300 is electrically connected to the mainboard 200 and is used to supply power to the mainboard and the power devices on the mainboard. The power supply device 300 includes a power system-level packaging module, which can be the double-sided packaging structure described in the aforementioned embodiments.

[0128] Please refer to Figure 14, which is a schematic diagram of the architecture of a power supply device 300a provided in an embodiment of the present application.

[0129] The power supply device 300a includes a system board 30, a power system-level packaging module 10a and a heat dissipation device 20. The power system-level packaging module 10a is made of the double-sided packaging structure described in Figures 1 to 12 above and is welded on the system board 30. The heat dissipation device 20 is in contact with the other side of the power system-level packaging module 10a for heat exchange.

[0130] Please refer to Figure 15, which is a schematic diagram of the architecture of another power supply device 300b provided in an embodiment of the present application.

[0131] The power supply device 300b includes a system board 30, a power supply backplane 50, a power supply system-level packaging module 10b and a heat dissipation device 20. The power supply system-level packaging module 10b is made of the double-sided packaging structure described in Figures 1 to 12 above and is welded on the power supply backplane 50. The heat dissipation device 20 and the power supply backplane 50 are located on the same side, and the heat dissipation device 20 is in contact with the power supply system-level packaging module 10b for heat exchange.

[0132] Of course, the power supply devices 300a and 300b also include a chip and a tertiary power SIP. To achieve better heat dissipation, a heat sink is also provided on the chip side. The other functional components mentioned above can be implemented using existing technologies and will not be described in detail herein.

[0133] In a specific implementation, the electronic device may be a smartphone, a smart TV, a smart TV set-top box, a personal computer (PC), a wearable device, a smart broadband device, etc. This is not limited by the embodiments of the present application. Based on the double-sided packaging structure provided in each embodiment of the present application, the heat generated by the power device on the non-heat dissipation side can be quickly dissipated to provide a good ambient temperature, thereby improving product performance while ensuring stable and reliable operation of the electronic device.

[0134] It should be understood that other main functional components of the electronic device can be implemented using existing technologies, so they will not be described in detail in this article.

[0135] It should be noted that in actual application scenarios, the heat dissipation device corresponding to the heat dissipation surface of the power module can be a finned air-cooled heat sink or a liquid-cooled cold plate heat sink. Alternatively, the heat dissipation surface of the power module can be exposed to the application environment, that is, the heat dissipation surface side of the package directly exchanges heat with the air. This is not limited in the present embodiment.

[0136] The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A double-sided packaging structure, characterized in that: It comprises a PCB substrate, a power device and a heat-conducting member, wherein the power device is arranged on both side surfaces of the PCB substrate, the heat-conducting member is inserted on the PCB substrate and packaged to form a package body, and the package body comprises a heat dissipation surface, and the heat dissipation surface is opposite to one side surface of the PCB substrate; The PCB substrate is provided with via holes and through holes, and the via holes and through holes are connected via copper foil on the PCB substrate; The via hole is at least connected to the power device disposed on the other side of the PCB substrate, the heat conductor is inserted into the via hole, and one end of the heat conductor extends to the heat dissipation surface of the package body.

2. The double-sided packaging structure according to claim 1, characterized in that: The power devices located on both side surfaces of the PCB substrate are connected to the via holes.

3. The double-sided packaging structure according to claim 1 or 2, characterized in that: The power device is connected to one or more of the vias.

4. The double-sided packaging structure according to any one of claims 1 to 3, characterized in that: The via is connected to one or more layers of the copper foil.

5. The double-sided packaging structure according to any one of claims 1 to 4, characterized in that: The copper foil is connected to one or more of the through holes.

6. The double-sided packaging structure according to any one of claims 1 to 5, characterized in that: The two opposite surfaces and the side surfaces of the package body are covered with metal layers, and the metal layers include a surface metal layer located on the surface of the package body and a side metal layer located on the side surface of the package body, and the side metal layers are respectively connected to the two surface metal layers; the end of the heat conductor is connected to the surface metal layer on the side.

7. The double-sided packaging structure according to claim 6, characterized in that: The surface metal layer of the metal layer is patterned to form the pins of the double-sided packaging structure.

8. The double-sided packaging structure according to any one of claims 1 to 7, characterized in that: In the insertion direction, the other end of the heat conducting member extends to the non-heat dissipation surface of the package body, and the non-heat dissipation surface and the heat dissipation surface are two surfaces of the package body that are opposite to each other.

9. The double-sided packaging structure according to any one of claims 1 to 7, characterized in that: The through hole comprises a large-diameter section and a small-diameter section which are connected to each other, and the heat-conducting member is inserted into the large-diameter section of the through hole.

10. The double-sided packaging structure according to any one of claims 1 to 9, characterized in that: The heat conducting member comprises a small-sized segment and a large-sized segment connected to each other, and a step surface is provided between the two; the small-sized segment is inserted into the through hole of the PCB substrate, and the step surface abuts against the board surface of the PCB substrate.

11. The double-sided packaging structure according to claim 10, characterized in that: A plurality of the small-size segments are arranged at intervals on the large-size segment.

12. The double-sided packaging structure according to claim 11, characterized in that: The large-size segment is in the shape of a long strip or a bent shape.

13. The double-sided packaging structure according to any one of claims 1 to 12, characterized in that: The power device includes a field effect transistor.

14. The double-sided packaging structure according to any one of claims 1 to 13, characterized in that: The double-sided packaging structure also includes a plurality of electronic components; at least one of the plurality of electronic components is a capacitor or a resistor, and is at least arranged on one side of the PCB substrate.

15. A power supply device, characterized in that: The power supply device includes a system board, a power system-level packaging module and a heat dissipation device. The power system-level packaging module is made of the double-sided packaging structure described in any one of claims 1 to 14 and is welded on the system board. The heat dissipation device is in contact with the other side of the power system-level packaging module for heat exchange.

16. A power supply device, characterized in that: The power supply device includes a system board, a power supply backplane, a power supply system-level packaging module and a heat dissipation device. The power supply system-level packaging module is made of the double-sided packaging structure described in any one of claims 1 to 14 and is welded on the power supply backplane. The heat dissipation device is located on the same side as the power supply backplane, and the heat dissipation device is in contact with the power supply system-level packaging module for heat exchange.

17. An electronic device, characterized in that: It comprises a mainboard and the power supply device according to claim 15 or 16, wherein the power supply device is arranged on the mainboard.

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