Circuit assembly and energy storage device

Abstract

The utility model discloses a circuit assembly and an energy storage device. The circuit assembly comprises a first circuit module, a second circuit module and a fan. The first circuit module comprises a first circuit board and a first heat dissipation module arranged on the first circuit board. The first circuit module comprises a first circuit board and a first heat dissipation module arranged on the first circuit board, the second circuit module comprises a second circuit board and a second heat dissipation module arranged on the second circuit board, a heat dissipation channel is formed between the first circuit board and the second circuit board, heat dissipation modules needing to work simultaneously in the first heat dissipation module and the second heat dissipation module are arranged in a staggered mode in the first direction, and the first direction is the thickness direction of the first circuit board; the fan is used for forming airflow flowing in the second direction in the heat dissipation channel, and the second direction intersects with the first direction. Therefore, there is no need to separately reserve a certain space for the first heat dissipation module and the second heat dissipation module to form an air duct, and the size of the circuit assembly is reduced. In addition, wind resistance is small when airflow formed by the fan passes through the heat dissipation channel, and the heat dissipation performance of the circuit assembly is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical equipment, and more specifically, to a circuit component and an energy storage device. Background Art

[0002] With the development of the new energy industry, the demand for the input power of bidirectional inverters is increasing. At the same time, with the requirement of high integration, bidirectional inverters need to integrate Maximum Power Point Tracking (MPPT). However, the bidirectional inverter integrated with MPPT generates a large amount of heat. If a certain space is reserved in the housing of the bidirectional inverter to form an air duct for dissipating heat from the heating components of the bidirectional inverter, it is likely to make the volume of the bidirectional inverter larger. Therefore, how to improve the heat dissipation performance of the bidirectional inverter integrated with MPPT and make the volume of the bidirectional inverter smaller becomes a technical problem to be solved. Summary of the Utility Model

[0003] Embodiments of the utility model provide a circuit component and an energy storage device.

[0004] The circuit component of the embodiment of the present application includes a first circuit module, a second circuit module and a fan. The first circuit module includes a first circuit board and a first heat dissipation module disposed on the first circuit board. The second circuit module includes a second circuit board and a second heat dissipation module disposed on the second circuit board. The second circuit board and the first circuit board are disposed opposite to each other, and a heat dissipation channel is formed between the first circuit board and the second circuit board. The first heat dissipation module and the second heat dissipation module are both located in the heat dissipation channel. The heat dissipation modules that need to work simultaneously in the first heat dissipation module and the second heat dissipation module are arranged in a staggered manner along a first direction, and the first direction is the thickness direction of the first circuit board. The fan is used to form an air flow flowing along a second direction in the heat dissipation channel, and the second direction intersects with the first direction.

[0005] In the circuit component of the embodiment of the present application, a heat dissipation channel is formed between the first circuit board and the second circuit board, and the first heat dissipation module and the second heat dissipation module are both located in the heat dissipation channel. In this way, there is no need to separately reserve a certain space for the first heat dissipation module and the second heat dissipation module to form an air duct, reducing the volume of the circuit component. In addition, the heat dissipation modules that need to work simultaneously in the first heat dissipation module and the second heat dissipation module are arranged in a staggered manner along the first direction, so that the air resistance when the air flow formed by the fan passes through the heat dissipation channel is small, improving the heat dissipation performance of the circuit component.

[0006] In some embodiments, the number of the first heat dissipation modules is plural, and the plural first heat dissipation modules that need to work simultaneously are arranged at intervals along a third direction, and the first direction, the second direction, and the third direction are perpendicular to each other in pairs.

[0007] In some embodiments, along the second direction, two of the first heat dissipation modules that do not need to work simultaneously are arranged on the first circuit board; and / or,

[0008] The first heat dissipation modules that need to work simultaneously are arranged in a staggered manner along the second direction.

[0009] In some embodiments, the first circuit module further includes a plurality of first inductors, and the plurality of first inductors are arranged at intervals along the third direction. Along the third direction, at least a part of the first inductors are arranged between two adjacent first heat dissipation modules, and the first inductor is arranged at an interval from one of the heat dissipation modules along the second direction.

[0010] In some embodiments, the first circuit module further includes a first capacitor, and the first capacitor is arranged in parallel with at least a part of the first heat dissipation modules along the third direction, and the first capacitor and the first inductor are arranged at intervals along the second direction.

[0011] In some embodiments, the number of the second heat dissipation modules is plural, and the plural second heat dissipation modules are arranged at intervals along the third direction. The first direction, the second direction, and the third direction are perpendicular to each other in pairs, and the plural second heat dissipation modules are arranged in a staggered manner along the second direction.

[0012] In some embodiments, the second circuit module further includes a plurality of second inductors, and the plurality of second inductors are arranged at intervals along the third direction. Along the third direction, at least a part of some of the second inductors are arranged between two of the second heat dissipation modules, and some of the second inductors are arranged on one side of the second heat dissipation module.

[0013] In some embodiments, the second circuit module further includes a second capacitor, and the second capacitor is arranged in parallel with at least a part of the first heat dissipation modules along the third direction, and the second capacitor and the second inductor are arranged at intervals along the third direction.

[0014] In some embodiments, the circuit assembly further includes a partition board, and the partition board connects the first circuit board and the second circuit board. The partition board, the first circuit board, and the second circuit board jointly enclose the heat dissipation channel. A low-heat-generation electrical component is arranged on the first circuit board, and the heat generation amount of the low-heat-generation electrical component is less than the heat generation amount of the first heat dissipation module. The low-heat-generation electrical component is located on one side of the partition board and outside the heat dissipation channel.

[0015] In some embodiments, the fan is disposed on the first circuit board, and the second circuit board is formed with an avoidance groove for avoiding the fan.

[0016] In some embodiments, the surface of the fan facing away from the heat dissipation channel is flush with the edge of the first circuit board or recessed relative to the edge of the first circuit board toward the heat dissipation channel.

[0017] In some embodiments, the fans are disposed on both sides of the heat dissipation channel.

[0018] In some embodiments, the circuit component further includes a housing. The first circuit module, the second circuit module, and the fan are all disposed in the housing. The housing is provided with an air outlet communicating with the heat dissipation channel, and the fan corresponds to the air outlet.

[0019] In some embodiments, there is a gap between the first circuit module and the second circuit module, and the gap forms a part of the heat dissipation channel.

[0020] The energy storage device according to the embodiment of the present utility model includes the circuit component described in any one of the above embodiments.

[0021] The additional aspects and advantages of the present utility model will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

[0023] Figure 1 is a perspective view of the circuit component according to the embodiment of the present utility model;

[0024] Figure 2 is a perspective view of the circuit component from another angle according to the embodiment of the present utility model;

[0025] Figure 3 is a perspective view of the circuit component with the housing removed according to the embodiment of the present utility model;

[0026] Figure 4 is an exploded view of the circuit component according to the embodiment of the present utility model;

[0027] Figure 5 is a perspective view of the first circuit module according to the embodiment of the present utility model;

[0028] Figure 6 is a plan view of the first circuit module according to the embodiment of the present utility model;

[0029] Figure 7 is a three-dimensional schematic diagram of the second circuit module according to an embodiment of the present utility model;

[0030] Figure 8 is a plan schematic diagram of the second circuit module according to an embodiment of the present utility model;

[0031] Figure 9 is a three-dimensional schematic diagram of the heat dissipation module according to an embodiment of the present utility model;

[0032] Figure 10 is Figure 9 an enlarged schematic diagram of part A in

[0033] Description of reference numerals:

[0034] 100 - circuit component, 10 - first circuit module, 11 - first circuit board, 12 - first heat dissipation module, 12a - No. 1 first heat dissipation module, 12b - No. 2 first heat dissipation module, 12c - No. 3 first heat dissipation module, 12d - No. 4 first heat dissipation module, 12e - No. 5 first heat dissipation module, 121 - radiator, 1211 - base body, 1212 - heat dissipation fins, 1213 - corrugated structure, 122 - MOS transistor, 123 - insulating and heat-conducting member, 13 - first inductor, 13a - No. 1 first inductor, 13b - No. 2 first inductor, 13c - No. 3 first inductor, 13d - No. 4 first inductor, 14 - first capacitor, 15 - low-heat-generating electrical component, 20 - second circuit module, 21 - second circuit board, 22 - second heat dissipation module, 22a - No. 1 second heat dissipation module, 22b - No. 2 second heat dissipation module, 23 - second inductor, 23a - No. 1 second inductor, 23b - No. 2 second inductor, 23c - No. 3 second inductor, 23d - No. 4 second inductor, 23e - No. 5 second inductor, 23f - No. 6 second inductor, 24 - second capacitor, 30 - fan, 40 - heat dissipation channel, 41 - gap, 50 - partition board, 60 - housing, 61 - air outlet, Z - first direction, Y - second direction, X - third direction. Detailed implementation manners

[0035] The following details the implementation manners of the present utility model. Examples of the implementation manners are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The implementation manners described below with reference to the drawings are exemplary only for explaining the present utility model and should not be construed as limiting the present utility model.

[0036] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may also include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0037] The following disclosure provides many different embodiments or examples for implementing different structures of the present utility model. To simplify the disclosure of the present utility model, the components and settings of specific examples are described hereinafter. Of course, they are only examples and are not intended to limit the present utility model. In addition, the present utility model may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between various embodiments and / or settings discussed. In addition, the present utility model provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0038] Please refer to Figures 1-4 , the circuit assembly 100 of the embodiment of the present utility model includes a first circuit module 10, a second circuit module 20 and a fan 30. The first circuit module 10 includes a first circuit board 11 and a first heat dissipation module 12 disposed on the first circuit board 11; the second circuit module 20 includes a second circuit board 21 and a second heat dissipation module 22 disposed on the second circuit board 21. The second circuit board 21 and the first circuit board 11 are disposed opposite to each other, and a heat dissipation channel 40 is formed between the first circuit board 11 and the second circuit board 21. Both the first heat dissipation module 12 and the second heat dissipation module 22 are located in the heat dissipation channel 40. The heat dissipation modules that need to work simultaneously in the first heat dissipation module 12 and the second heat dissipation module 22 are arranged in a staggered manner along a first direction Z, and the first direction Z is the thickness direction of the first circuit board 11; the fan 30 is used to form an air flow flowing along a second direction Y in the heat dissipation channel 40, and the second direction Y intersects with the first direction Z.

[0039] Specifically, the circuit assembly 100 is integrated with an inverter and an MPPT module. The inverter is used for AC-DC conversion, and can convert mains power into direct current to charge the battery, or convert the battery current into alternating current for external power supply. The MPPT module is used for DC-DC conversion, and can detect the generated voltage of the solar panel in real time and track the maximum voltage and current value (VI), so that the system can charge the battery with the maximum power output.

[0040] Both the first circuit module 10 and the second circuit module 20 can perform functions such as filtering and rectifying to convert alternating current into direct current, or convert direct current into alternating current. The circuit component 100 adopts the method of two circuit modules. Compared with a single circuit module, the size of the circuit component 100 in one direction can be reduced. For example, the length of the circuit component 100 can be reduced, thereby avoiding the problem of the circuit component 100 being too long or too wide.

[0041] Both the first circuit board 11 and the second circuit board 21 can be printed circuit boards (PCBs). The first circuit board 11 and the second circuit board 21 can mount electrical components and enable the electrical components to achieve electrical connection. The first circuit board 11 and the second circuit board 21 are arranged opposite to each other, that is, the first circuit board 11 and the second circuit board 21 are spaced apart along the thickness direction of the circuit board, so as to form a heat dissipation channel 40 between the first circuit board 11 and the second circuit board 21.

[0042] The first heat dissipation module 12 and the second heat dissipation module 22 can be modules integrating heating elements and heat sinks 121, so that the heat generated by the heating elements can be dissipated in time, improving the reliability of the normal operation of the heating elements. Both the first heat dissipation module 12 and the second heat dissipation module 22 are located in the heat dissipation channel 40. That is, the first circuit module 10 and the second module adopt an up-and-down buckling installation method, and there is no need to separately reserve a heat dissipation air duct on one side of the first heat dissipation module 12 and the second heat dissipation module 22.

[0043] The heat dissipation modules that need to work simultaneously in the first heat dissipation module 12 and the second heat dissipation module 22 are arranged in a staggered manner along the first direction Z. Or rather, in the thickness direction of the first circuit board 11, there will be no two heat dissipation modules that need to work simultaneously, so that the heat generated by the heat dissipation modules will not concentrate on a certain part in the heat dissipation channel 40, which is beneficial to heat dissipation. In addition, the heat dissipation modules that need to work simultaneously in the first heat dissipation module 12 and the second heat dissipation module 22 are arranged in a staggered manner, making it easy to form a turbulent flow in the heat dissipation channel 40, increasing the turbulence and improving the heat dissipation performance of the circuit component 100.

[0044] In summary, in the circuit component 100 of the embodiment of the present application, a heat dissipation channel 40 is formed between the first circuit board 11 and the second circuit board 21, and both the first heat dissipation module 12 and the second heat dissipation module 22 are located in the heat dissipation channel 40. In this way, there is no need to separately reserve a certain space for the first heat dissipation module 12 and the second heat dissipation module 22 to form an air duct, reducing the volume of the circuit component 100. In addition, the heat dissipation modules that need to work simultaneously in the first heat dissipation module 12 and the second heat dissipation module 22 are arranged in a staggered manner along the first direction Z, so that the air resistance of the airflow formed by the fan 30 passing through the heat dissipation channel 40 is small, improving the heat dissipation performance of the circuit component 100.

[0045] It should be noted that in the implementation mode of the present application, the second direction Y can be perpendicular to the first direction Z. The heat dissipation modules that need to work simultaneously are the heat dissipation modules that work simultaneously among all the heat dissipation modules when the circuit component 100 is working.

[0046] Please refer to Figure 5 , in some implementation modes, the number of the first heat dissipation modules 12 is multiple, and the multiple first heat dissipation modules 12 that need to work simultaneously are arranged at intervals along the third direction X. The first direction Z, the second direction Y, and the third direction X are perpendicular to each other in pairs. In this way, on the first circuit module 10, the multiple first heat dissipation modules 12 that need to work simultaneously are arranged at intervals along the third direction X, so that the airflow formed by the fan 30 can flow through each first heat dissipation module 12 to a great extent, thereby improving the heat dissipation performance of the circuit component 100.

[0047] In the implementation mode of the present application, the first direction Z can be the thickness direction of the first circuit board 11, the second direction Y can be the width direction of the first circuit board 11, and the third direction X can be the length direction of the first circuit board 11. It should be noted that the multiple first heat dissipation modules 12 that need to work simultaneously are arranged at intervals along the third direction X, which can mean that the multiple first heat dissipation modules 12 that need to work simultaneously are arranged in alignment along the third direction X, or at least some of the multiple first heat dissipation modules 12 that need to work simultaneously are arranged in a staggered manner along the third direction X.

[0048] In the implementation mode of the present application, the number of the first heat dissipation modules 12 can be 2, 3, 4, 5, 6, 7, etc. The present application does not limit the specific number of the first heat dissipation modules 12.

[0049] Please refer to Figure 5 , in some implementation modes, along the second direction Y, two first heat dissipation modules 12 that do not need to work simultaneously are arranged on the first circuit board 11. In this way, while not affecting the heat dissipation of the first heat dissipation module 12, the space utilization rate of the first circuit board 11 can be improved, making the volume of the first circuit module 10 smaller.

[0050] Please refer to Figure 5 , in some implementation modes, the first heat dissipation modules 12 that need to work simultaneously are arranged in a staggered manner along the second direction Y. Or rather, the multiple first heat dissipation modules 12 that need to work simultaneously are not arranged simultaneously along the second direction Y, so that the airflow formed by the fan 30 can flow through each first heat dissipation module 12 to a great extent, thereby improving the heat dissipation performance of the circuit component 100.

[0051] Such as Figure 5 and Figure 6In an embodiment, the number of the first heat dissipation modules 12 is five. For the convenience of description, the five first heat dissipation modules 12 are respectively denoted as the first heat dissipation module 12a of No. 1, the first heat dissipation module 12b of No. 2, the first heat dissipation module 12c of No. 3, the first heat dissipation module 12d of No. 4, and the first heat dissipation module 12e of No. 5. Among them, the first heat dissipation module 12a of No. 1 can form a balancing circuit. The first heat dissipation module 12a of No. 1 and the first heat dissipation module 12b of No. 2 are heat dissipation modules that do not need to work simultaneously. The first heat dissipation module 12a of No. 1 and the first heat dissipation module 12b of No. 2 are arranged in alignment along the second direction Y.

[0052] The first heat dissipation module 12b of No. 2, the first heat dissipation module 12c of No. 3, the first heat dissipation module 12d of No. 4, and the first heat dissipation module 12e of No. 5 are first heat dissipation modules 12 that need to work simultaneously. The first heat dissipation module 12b of No. 2, the first heat dissipation module 12c of No. 3, the first heat dissipation module 12d of No. 4, and the first heat dissipation module 12e of No. 5 are arranged at intervals along the third direction X. Among them, the first heat dissipation module 12c of No. 3, the first heat dissipation module 12d of No. 4, and the first heat dissipation module 12e of No. 5 are arranged in alignment along the third direction X. The first heat dissipation module 12b of No. 2 and the first heat dissipation module 12c of No. 3 are arranged in a staggered manner along the third direction X.

[0053] As used in this application, "aligned arrangement" means that the projections of two components along a predetermined direction have an overlapping area greater than or equal to 50%, and "staggered arrangement" means that the projections of two components along a predetermined direction have an overlapping area less than 50%.

[0054] Please refer to Figure 5 and Figure 6 In some embodiments, the first circuit module 10 further includes a plurality of first inductors 13. The plurality of first inductors 13 are arranged at intervals along the third direction X. Along the third direction X, at least a part of the first inductor 13 is arranged between two adjacent first heat dissipation modules 12. The first inductor 13 is arranged at an interval from one of the heat dissipation modules along the second direction Y.

[0055] As mentioned above, the fan 30 forms an air flow along the second direction Y. At least a part of the first inductor 13 is arranged between two first heat dissipation modules 12. The first inductor 13 is arranged at an interval from one of the heat dissipation modules along the second direction Y. Thus, the overlapping area of the first heat dissipation module and the first inductor 13 along the second direction Y is small, and the air flow can smoothly pass through the first heat dissipation module and the first inductor 13, thereby dissipating heat from the first heat dissipation module and the first inductor 13.

[0056] Along the third direction X, at least a part of the first inductor 13 being arranged between two first heat dissipation modules 12 may mean that, along the third direction X, the first inductor 13 and two adjacent first heat dissipation modules 12 may be arranged in alignment or in a staggered manner. As Figure 5In the manner shown, the first inductor 13 and two adjacent first heat dissipation modules 12 are arranged in a staggered manner along the third direction X, and the arrangement order is the first heat dissipation module 12, the first inductor 13, and the first heat dissipation module 12 in sequence.

[0057] As Figure 5 and Figure 6 In the example of, the number of the first inductors 13 is 4, and the 4 first inductors 13 are arranged along the third direction X. For the convenience of description, the 4 first inductors 13 are respectively denoted as the first inductor 13a of No. 1, the first inductor 13b of No. 2, the first inductor 13c of No. 3, and the first inductor 13d of No. 4. Among them, the first inductor 13a of No. 1 is located between the second heat dissipation module 12b of No. 2 and the third heat dissipation module 12c of No. 3, the first inductor 13b of No. 2 is located between the third heat dissipation module 12c of No. 3 and the fourth heat dissipation module 12d of No. 4, and both the first inductor 13b of No. 2 and the first inductor 13d of No. 4 are located between the fourth heat dissipation module 12d of No. 4 and the fifth heat dissipation module 12e of No. 5. By arranging the first heat dissipation module 12 and the first inductor 13 alternately, the air flow of the whole first circuit module 10 becomes smoother.

[0058] Please refer to Figure 5 and Figure 6 In some embodiments, the first circuit module 10 further includes a first capacitor 14. The first capacitor 14 is arranged in parallel with at least part of the first heat dissipation modules 12 along the third direction X, and the first capacitor 14 and the first inductor 13 are arranged at intervals along the second direction Y.

[0059] Specifically, the first capacitor 14 is a capacitor with a relatively large volume and a relatively low temperature resistance rating in the first circuit module 10. The first capacitor 14 is arranged in parallel with at least part of the first heat dissipation modules 12 along the third direction X, or rather, the first capacitor 14 is arranged in alignment with at least part of the first heat dissipation modules 12 along the third direction X. The first capacitor 14 and the first inductor 13 are not in contact along the second direction Y. In this way, the first capacitor 14, the first heat dissipation module 12, and the first inductor 13 can be reasonably arranged, so that the air flow formed by the fan 30 can pass through the first capacitor 14, the first heat dissipation module 12, and the first inductor 13, improving the heat dissipation efficiency of the first circuit module 10.

[0060] Please refer to Figure 7 and Figure 8 In some embodiments, the number of the second heat dissipation modules 22 is multiple. The multiple second heat dissipation modules 22 are arranged at intervals along the third direction X. The first direction Z, the second direction Y, and the third direction X are perpendicular to each other in pairs, and the multiple second heat dissipation modules 22 are arranged in a staggered manner along the second direction Y.

[0061] Thus, on the second circuit module 20, the multiple second heat dissipation modules 22 are not arranged simultaneously along the second direction Y, but are arranged at intervals along the third direction X, so that the airflow formed by the fan 30 can flow through each second heat dissipation module 22 to a great extent, thereby improving the heat dissipation performance of the circuit component 100.

[0062] It should be noted that the multiple second heat dissipation modules 22 being arranged at intervals along the third direction X can mean that the multiple second heat dissipation modules 22 are arranged in alignment along the third direction X, or that the multiple second heat dissipation modules 22 are arranged in a staggered manner along the third direction X.

[0063] In the embodiment of the present application, the number of the second heat dissipation modules 22 can be 2, 3, 4, 5, 6, 7, etc., and the present application does not limit the specific number of the second heat dissipation modules 22.

[0064] As Figure 8 In the embodiment of, the number of the second heat dissipation modules 22 is 2. For the convenience of description, the 2 second heat dissipation modules 22 are respectively denoted as the first second heat dissipation module 22a and the second second heat dissipation module 22b, and the first second heat dissipation module 22a and the second second heat dissipation module 22b are arranged in a staggered manner along the third direction X.

[0065] Please refer to Figure 7 and Figure 8 , in some embodiments, the second circuit module 20 further includes multiple second inductors 23, the multiple second inductors 23 are arranged at intervals along the third direction X, and along the third direction X, at least a part of some of the first inductors 13 is arranged between two second heat dissipation modules 22, and some of the second inductors 23 are arranged on one side of the second heat dissipation module 22.

[0066] Thus, the overlapping area of the second heat dissipation module 22 and the second inductor 23 along the second direction Y is small, and the airflow can smoothly pass through the second heat dissipation module 22 and the second inductor 23, thereby dissipating heat from the second heat dissipation module 22 and the first inductor 13.

[0067] Along the third direction X, at least a part of the second inductor 23 being arranged between two second heat dissipation modules 22 can mean that, along the third direction X, the second inductor 23 and the adjacent two second heat dissipation modules 22 can be arranged in alignment, or can be arranged in a staggered manner. As Figure 7 and Figure 8 In the manner shown in, one of the second inductors 23 and the adjacent two second heat dissipation modules 22 are arranged in a staggered manner along the third direction X, and the arrangement order is the second heat dissipation module 22, the second inductor 23, and the second heat dissipation module 22 in sequence.

[0068] As Figure 8In the example, the number of the second inductors 23 is six, and the six second inductors 23 are arranged along the third direction X. For the convenience of description, the six second inductors 23 are respectively denoted as the first second inductor 23, the second second inductor 23, the third second inductor 23, the fourth second inductor 23, the fifth second inductor 23, and the sixth second inductor 23. Among them, the first second inductor 23 is located between the first second heat dissipation module 22a and the second second heat dissipation module 22b, and the second to sixth second inductors 23 are located on one side of the second second heat dissipation module 22b. By arranging the second heat dissipation module 22 and the second inductors 23 at different positions in the third direction X, the airflow of the entire second circuit module 20 becomes smoother.

[0069] Please refer to Figure 7 and Figure 8 , in some embodiments, the second circuit module 20 further includes a second capacitor 24. The second capacitor 24 is arranged in parallel with at least part of the first heat dissipation module 12 along the third direction X, and the second capacitor 24 and the second inductors 23 are arranged at intervals along the third direction X.

[0070] Specifically, the second capacitor 24 is a capacitor with a relatively large volume and a relatively low temperature resistance rating in the second circuit module 20. The second capacitor 24 is arranged in parallel with at least part of the second heat dissipation module 22 along the third direction X, or in other words, the second capacitor 24 is arranged in alignment with at least part of the second heat dissipation module 22 along the third direction X. The second capacitor 24 and the second inductors 23 are not in contact along the second direction Y. In this way, the second capacitor 24, the second heat dissipation module 22, and the second inductors 23 can be reasonably arranged, so that the airflow formed by the fan 30 can pass through the second capacitor 24, the second heat dissipation module 22, and the second inductors 23, ensuring a certain ventilation volume and improving the heat dissipation efficiency of the second circuit module 20.

[0071] Please refer to Figures 3-5 , in some embodiments, the circuit assembly 100 further includes a partition 50. The partition 50 connects the first circuit board 11 and the second circuit board 21. The partition 50, the first circuit board 11, and the second circuit board 21 jointly enclose a heat dissipation channel 40. A low-heat-generation electrical component 15 is arranged on the first circuit board 11, and the heat generation amount of the low-heat-generation electrical component 15 is less than that of the first heat dissipation module 12. The low-heat-generation electrical component 15 is located on one side of the partition 50 and outside the heat dissipation channel 40.

[0072] In this way, by arranging the low-heat-generation electrical component 15 outside the heat dissipation channel 40, the air volume brought by the fan 30 can flow through the heat dissipation channel 40 to the maximum extent, so as to dissipate heat from heat-generating components such as the first heat dissipation module 12 and the second heat dissipation module 22, and improve the heat dissipation efficiency of the circuit assembly 100.

[0073] In some embodiments, the partition 50 can be made of materials such as PC sheets, epoxy boards, and mylar sheets.

[0074] Please refer to again Figure 3 Figure 3 , in some embodiments, the fan 30 is disposed on the first circuit board 11, and the second circuit board 21 is formed with an avoidance groove for avoiding the fan 30. In this way, both the first circuit board 11 and the second circuit board 21 are tightly connected to the fan 30, which not only makes it easy for the fan 30 to form an air flow in the heat dissipation channel 40, but also makes the structure of the circuit assembly 100 more compact.

[0075] Specifically, the fan 30 can be fixed on the first circuit board 11 by means of screws or the like. The fan 30 can be partially located in the avoidance groove of the second circuit board 21.

[0076] Please refer to again Figure 3 Figure 3 , in some embodiments, the surface of the fan 30 facing away from the heat dissipation channel 40 is flush with the edge of the first circuit board 11 or recessed toward the heat dissipation channel 40 relative to the edge of the first circuit board 11. Or rather, the fan 30 does not protrude from the edge of the first circuit board 11, which makes the cooperation between the fan 30 and the first circuit board 11 compact.

[0077] Please refer to Figure 3 and Figure 4 Figure 4 , in some embodiments, fans 30 are disposed on both sides of the heat dissipation channel 40. In this way, the fans 30 located on both sides of the heat dissipation channel 40 are an intake fan 30 and an exhaust fan 30 respectively, which can increase the ventilation volume of the heat dissipation channel 40 and improve the heat dissipation efficiency of the circuit assembly 100.

[0078] Specifically, the number of fans 30 on one side of the heat dissipation channel 40 can be multiple, and the multiple fans 30 are arranged at intervals along the third direction X. For example, the total number of fans 30 is 8, and 4 fans 30 are arranged on each side of the heat dissipation channel 40.

[0079] Please refer to Figure 9 and Figure 10 Figure 10 , in some embodiments, the first heat dissipation module 12 and / or the second heat dissipation module 22 includes a heat sink 121 and a MOS transistor 122, and the MOS transistor 122 is thermally connected to the heat sink 121. For example, the first heat dissipation module 12 can include a heat sink 121 and a MOS transistor 122; again, the second heat dissipation module 22 can include a heat sink 121 and a MOS transistor 122; furthermore, both the first heat dissipation module 12 and the second heat dissipation module 22 can include a heat sink 121 and a MOS transistor 122

[0080] Since the MOS transistor 122 generates a relatively large amount of heat, the MOS is thermally connected to the heat sink 121 to form a heat dissipation module. In this way, the heat sink 121 can dissipate the heat of the MOS transistor 122, and then the airflow formed by the fan 30 dissipates the heat of the heat sink 121. This can reduce the temperature rise of the MOS transistor 122, keep the temperature inside the circuit component 100 within a reasonable range, and improve the working reliability of the circuit component 100.

[0081] Specifically, in a heat dissipation module, the number of MOS transistors 122 can be multiple, and the number of heat sinks 121 can be one. Multiple MOS transistors 122 are all arranged on the heat sink 121.

[0082] In some embodiments, the first heat dissipation module 12 and / or the second heat dissipation module 22 further includes an insulating heat conducting member 123, and the insulating heat conducting member 123 connects the heat sink 121 and the MOS transistor 122. Generally, the heat sink 121 is made of a metal material, such as aluminum, aluminum alloy, copper, etc. The insulating heat conducting member 123 can not only enable the MOS transistor 122 to transfer heat to the heat sink 121, but also prevent the MOS transistor 122 from contacting and short-circuiting with the heat sink 121.

[0083] In some embodiments, the insulating heat conducting member 123 can be a ceramic sheet, a heat conducting silicone pad, etc.

[0084] In some embodiments, the heat sink 121 includes a base body 1211 and a plurality of heat dissipation fins 1212 arranged on the base body 1211. The plurality of heat dissipation fins 1212 are arranged at intervals, and the MOS transistor 122 is thermally connected to the base body 1211. In this way, the plurality of heat dissipation fins 1212 can increase the surface area of the heat sink 121, thereby improving the heat dissipation capacity of the heat sink 121 and facilitating the heat dissipation of the MOS transistor 122.

[0085] Please refer to Figure 10 , in some embodiments, a corrugated structure 1213 is formed on the surface of the heat dissipation fin 1212. Specifically, the corrugated structure 1213 is a structure similar to a wave formed on the surface of the heat dissipation fin 1212. The bottom depth of the corrugated structure 1213 can be 0.1 mm - 0.3 mm. The corrugated structure 1213 can increase the surface area of the heat sink 121, thereby improving the heat dissipation capacity of the heat sink 121.

[0086] Please refer to again Figure 1 , Figure 2 and Figure 4 , in some embodiments, the circuit component 100 further includes a housing 60. The first circuit module 10, the second circuit module 20 and the fan 30 are all arranged in the housing 60. The housing 60 is provided with an air outlet 61 communicating with the heat dissipation channel 40, and the fan 30 corresponds to the air outlet 61.

[0087] In this way, the housing 60 protects the first circuit module 10, the second circuit module 20 and the fan 30, improving the safety of the circuit assembly 100.

[0088] Specifically, the housing 60 can be made of a metal material, which can ensure the strength of the housing 60, also play a role in signal shielding, and is beneficial to the heat dissipation of the circuit assembly 100. To reduce the assembly difficulty, the housing 60 can include a plurality of detachable parts.

[0089] It can be understood that the air outlet 61 can be an air inlet and an air outlet according to the air inlet direction. The first capacitor 14 and the second capacitor 24 have a lower temperature tolerance level, and the first inductor 13 and the second inductor 23 have a higher temperature tolerance level. Therefore, the first capacitor 14 and the second capacitor 24 can be arranged close to the air inlet, and the first inductor 13 and the second inductor 23 can be arranged close to the air outlet to facilitate the heat dissipation of the capacitors and inductors.

[0090] In addition, since the heat flux density of the heat dissipation module (including the first heat dissipation module 12 and the second heat dissipation module 22) is relatively large, the heat dissipation module can be arranged near the air outlet 61, and the heat of the heat dissipation module is taken away by the fan 30.

[0091] In some embodiments, the opening ratio of the air outlet 61 is 60%-90%, which ensures that the housing 60 has a certain strength and at the same time prevents foreign objects such as human fingers from entering the housing 60.

[0092] Please refer to Figure 3 , in certain embodiments, there is a gap 41 between the first circuit module 10 and the second circuit module 20, and the gap 41 forms a part of the heat dissipation channel 40. The gap 41 between the first circuit module 10 and the second circuit module 20 is the gap 41 formed between the electrical components with the closest distance in the first circuit module 10 and the second circuit module 20. This gap 41 can ensure the safety distance and meet the withstand voltage level.

[0093] In some embodiments, the distance of the gap 41 between the first circuit module 10 and the second circuit module 20 is 10 mm - 15 mm.

[0094] In summary, in one embodiment, in the embodiment of the present application, the heat dissipation modules are distributed in the first circuit module 10 and the second circuit module 20, so that the size of the circuit component 100 is reduced in height; in addition, by arranging the heat dissipation modules in a staggered and crosswise manner, the length direction of the circuit component 100 is reduced; further, a fan 30 is placed in the width direction (the second direction Y) of the circuit component 100 to reduce the ventilation path, reduce the temperature cascade, and improve the heat dissipation capacity of the circuit component 100. Further, a heat dissipation channel 40 is formed between the first circuit board 11 and the second circuit board 21, so that there is no need to separately add an air duct for the heat dissipation module on the housing, and the assembly difficulty of the circuit component 100 is reduced.

[0095] The energy storage device according to the embodiment of the present invention includes the circuit component 100 of any one of the above embodiments. The energy storage device is, for example, a photovoltaic energy storage device. The energy storage device may further include a battery connected to the circuit component 100, and the battery can be used for energy storage or discharging through the circuit component 100.

[0096] In the description of the embodiments of the present invention, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present invention, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0097] In the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0098] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A circuit assembly for current conversion, characterized in that: include: A first circuit module, the first circuit module comprising a first circuit board and a first heat dissipation module arranged on the first circuit board; a second circuit module, the second circuit module comprising a second circuit board and a second heat dissipation module arranged on the second circuit board, the second circuit board and the first circuit board are arranged opposite to each other, a heat dissipation channel is formed between the first circuit board and the second circuit board, the first heat dissipation module and the second heat dissipation module are both located in the heat dissipation channel, and the heat dissipation modules of the first heat dissipation module and the second heat dissipation module that need to work simultaneously are arranged in a staggered manner along a first direction, and the first direction is a thickness direction of the first circuit board; and A fan is used to form an airflow in the heat dissipation channel that flows along a second direction, and the second direction intersects with the first direction.

2. The circuit assembly according to claim 1, characterized in that There are multiple first heat dissipation modules, and the multiple first heat dissipation modules that need to work simultaneously are arranged at intervals along the third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

3. The circuit assembly according to claim 2, characterized in that Along the second direction, two first heat dissipation modules which do not need to work simultaneously are arranged on the first circuit board; and / or, The first heat dissipation modules that need to work simultaneously are arranged in a staggered manner along the second direction.

4. The circuit assembly according to claim 2, characterized in that The first circuit module also includes a plurality of first inductors, which are arranged at intervals along the third direction. Along the third direction, the first inductors are at least partially arranged between two adjacent first heat dissipation modules, and the first inductors and one of the heat dissipation modules are arranged at intervals along the second direction.

5. The circuit assembly according to claim 4, characterized in that The first circuit module further includes a first capacitor, which is arranged in parallel with at least a portion of the first heat dissipation module along the third direction, and the first capacitor and the first inductor are arranged at intervals along the second direction.

6. The circuit assembly according to claim 4, characterized in that There are multiple second heat dissipation modules, and the multiple second heat dissipation modules are arranged at intervals along the third direction. The first direction, the second direction and the third direction are perpendicular to each other, and the multiple second heat dissipation modules are arranged in a staggered manner along the second direction.

7. The circuit assembly according to claim 6, characterized in that The second circuit module also includes a plurality of second inductors, which are arranged at intervals along the third direction. Along the third direction, at least a portion of some of the first inductors are arranged between two of the second heat dissipation modules, and some of the second inductors are arranged on one side of the second heat dissipation module.

8. The circuit assembly according to claim 7, characterized in that The second circuit module further includes a second capacitor, which is arranged in parallel with at least a portion of the first heat dissipation module along the third direction, and the second capacitor and the second inductor are arranged at intervals along the third direction.

9. The circuit assembly according to claim 1, wherein: The circuit assembly also includes a partition, which connects the first circuit board and the second circuit board. The partition, the first circuit board and the second circuit board together form the heat dissipation channel. A low-heat-generating electrical component is arranged on the first circuit board. The heat generated by the low-heat-generating electrical component is less than the heat generated by the first heat dissipation module. The low-heat-generating electrical component is located on one side of the partition and outside the heat dissipation channel.

10. The circuit assembly according to claim 1, wherein: The fan is arranged on the first circuit board, and the second circuit board is formed with an avoidance groove for avoiding the fan.

11. The circuit assembly according to claim 10, characterized in that A surface of the fan facing away from the heat dissipation channel is flush with an edge of the first circuit board or is recessed toward the heat dissipation channel relative to the edge of the first circuit board.

12. The circuit assembly according to claim 10, characterized in that The fans are arranged on both sides of the heat dissipation channel.

13. The circuit assembly according to claim 1, wherein: The circuit assembly further includes a housing, the first circuit module, the second circuit module and the fan are all arranged in the housing, the housing is provided with an air outlet communicating with the heat dissipation channel, and the fan corresponds to the air outlet.

14. The circuit assembly according to claim 1, wherein: There is a gap between the first circuit module and the second circuit module, and the gap forms a part of the heat dissipation channel.

15. An energy storage device, characterized in that: The energy storage device comprises the circuit assembly according to any one of claims 1-14.

Images