Controller and vehicle

Abstract

The present invention relates to the technical field of controllers. Specifically provided are a controller and a vehicle, which aim to solve the problems of the controller having a large size and it being impossible to quickly dissipate heat from chips corresponding to a downstream area of a heat dissipation air duct. To this end, the controller of the present invention comprises a circuit board and a metal radiator, wherein a plurality of chips are provided on one side of the circuit board; the metal radiator comprises a base plate and a heat dissipation structure, which is distributed on a first side surface of the base plate and extends in a direction away from the base plate; a second side surface of the base plate is in contact with the plurality of chips; an air duct enclosure plate is provided on the second side surface of the base plate; the air duct enclosure plate and the base plate enclose a heat dissipation air duct, which is parallel to the circuit board and extends in a first direction; a cooling fan is provided in the heat dissipation air duct so as to drive air to flow in the heat dissipation air duct in the first direction; and the plurality of chips are distributed in a staggered manner in the first direction. By means of such arrangement, the size of the controller is reduced, and the heat dissipation effect of the chips located in a downstream area of the heat dissipation air duct is enhanced.

Description

Controller and vehicle

[0001] This application claims priority to Chinese patent application CN202311777036.6, filed on December 21, 2023, with the invention name “Controller and Vehicle”. The entire contents of the above Chinese patent application are incorporated into this application by reference. Technical Field

[0002] The present invention relates to the technical field of controllers, and in particular provides a controller and a vehicle. Background Art

[0003] With the continuous development of technology, electric-powered new energy vehicles have become a major type of vehicle in the family car market. The controller is a key component in electric-powered new energy vehicles, communicating with the vehicle's drive system, battery management system, and cabin system.

[0004] Typically, a controller includes multiple chips, each used to calculate and process data for the new energy vehicle's drive system, battery management system, and cabin system. These chips are typically mounted on multiple circuit boards that are interconnected. The controller also includes a heat sink, which includes a baseboard and multiple fins disposed on a first side of the baseboard. The baseboard's second side contacts the chips on one side of the circuit board. A duct panel is also disposed on the second side of the baseboard. The duct panel and the baseboard form a heat dissipation duct that extends parallel to the circuit board and runs from the first end to the second end of the baseboard. A cooling fan is located within the duct to accelerate heat dissipation from the fins through airflow driven by the fan, thereby rapidly dissipating heat from the chips. The multiple chips are arranged neatly along the first end to the second end of the baseboard. This results in a low chip integration density, a larger controller, and numerous manufacturing steps, resulting in a long manufacturing cycle. Furthermore, air flowing upstream of the heat dissipation duct absorbs heat transferred from the chips in that area through the fins, becoming hotter. This hotter air, flowing through the fins in the downstream area along the heat dissipation duct, is unable to dissipate heat quickly from the fins in that area, preventing the chips in that area from dissipating heat quickly.

[0005] Therefore, this field needs a new technical solution to solve the above problems.

[0006] Summary of the Invention

[0007] The present invention aims to solve the above technical problem, namely, to solve the problem that the controller is large in size and the chips corresponding to the downstream area of ​​the heat dissipation duct cannot dissipate heat quickly.

[0008] In a first aspect, the present invention provides a controller, which includes a circuit board and a metal heat sink, wherein a plurality of chips are arranged on one side of the circuit board, the metal heat sink includes a substrate and a heat dissipation structure distributed on a first side surface of the substrate and extending in a direction away from the substrate, the second side surface of the substrate is in contact with the plurality of chips, and a duct enclosure is provided on the second side surface of the substrate, the duct enclosure and the substrate form a heat dissipation duct parallel to the circuit board and extending along a first direction, a heat dissipation fan is provided in the heat dissipation duct to drive air to flow in the heat dissipation duct along the first direction, and the plurality of chips are staggered in the first direction.

[0009] In a preferred technical solution of the above controller, the plurality of chips are staggeredly distributed along the first direction in ascending order of the highest junction temperature.

[0010] In the preferred technical solution of the above controller, on the basis that the multiple chips are staggeredly distributed along the first direction in the order of the highest junction temperature from small to large, the multiple chips are staggeredly distributed along the first direction in the order of the heat generation power from small to large.

[0011] In a preferred technical solution of the above controller, the area of ​​the non-layout region surrounding each chip on the circuit board is positively correlated with the heat generation power of the chip.

[0012] In a preferred technical solution of the above controller, the plurality of chips are staggeredly distributed along the first direction in order of usage frequency from small to large.

[0013] In a preferred technical solution of the above controller, the area of ​​the non-layout region surrounding each chip on the circuit board is positively correlated with the usage frequency of the chip.

[0014] In a preferred technical solution of the controller, the heat dissipation area of ​​the heat dissipation structure facing each chip is positively correlated with the heat generation power of the chip.

[0015] In a preferred technical solution of the controller, the heat dissipation area of ​​the heat dissipation structure facing each chip is positively correlated with the frequency of use of the chip.

[0016] In the preferred technical solution of the above-mentioned controller, the controller includes a shell, the shell includes the substrate, a panel facing the substrate, and a surrounding plate arranged between the substrate and the panel and respectively connected to the substrate and the panel, the substrate, the panel and the surrounding plate form a cavity for accommodating the circuit board, the circuit board is arranged in the cavity, and the heat dissipation structure is arranged outside the shell.

[0017] When adopting the above technical solution, the controller includes a circuit board and a metal radiator. A plurality of chips are arranged on one side of the circuit board. The metal radiator includes a substrate and a heat dissipation structure distributed on a first side surface of the substrate and extending in a direction away from the substrate. The second side surface of the substrate is in contact with the plurality of chips. A duct enclosure is provided on the second side surface of the substrate. The duct enclosure and the substrate form a heat dissipation duct parallel to the circuit board and extending along the first direction. A heat dissipation fan is provided in the heat dissipation duct to drive air to flow in the heat dissipation duct along the first direction. The plurality of chips are staggered in the first direction.

[0018] This arrangement integrates the controller's multiple chips onto a single circuit board, avoiding the situation where multiple chips are distributed across different circuit boards and interconnected, resulting in a larger controller and more manufacturing steps. This improves chip integration, reduces the controller's size, simplifies the manufacturing process, and reduces manufacturing costs. The staggered distribution of the multiple chips along the air flow direction within the cooling duct reduces the effect of heat generated by chips located upstream of the duct on the heat dissipation of chips located downstream, enhancing the heat dissipation effect of chips located downstream and ensuring the reliability of the chips' normal operation.

[0019] Preferably, the plurality of chips are staggeredly distributed along the first direction in ascending order of the highest junction temperature.

[0020] Since the temperature of the air in the downstream area flowing through the heat dissipation duct is higher, the heat dissipation effect of the heat dissipation structure in the downstream area is relatively poor compared with the heat dissipation structure in the upstream area. Multiple chips are staggered along the first direction in the order of the highest junction temperature from small to large, which can reduce the risk of chip damage due to temperature exceeding the maximum junction temperature and improve the reliability of normal operation of the chip.

[0021] Preferably, on the basis that the plurality of chips are staggeredly distributed along the first direction in ascending order of the highest junction temperature, the plurality of chips are staggeredly distributed along the first direction in ascending order of the heat generation power.

[0022] Through such a setting, the chip with smaller heating power is closer to the upstream end of the heat dissipation duct, which can slow down the temperature rise of the air flowing through the upstream area of ​​the heat dissipation duct, and then reduce the influence of the heated air flowing through the upstream area of ​​the heat dissipation duct on the heat dissipation of the chip located in the downstream area of ​​the heat dissipation duct, further enhancing the heat dissipation effect of the chip located in the downstream area of ​​the heat dissipation duct, and ensuring the reliability of the normal operation of the chip.

[0023] Preferably, the area of ​​the non-layout region surrounding each chip on the circuit board is positively correlated with the heat generation power of the chip.

[0024] Through such a setting, chips with different heating power can have corresponding heat dissipation space on the basis of keeping the total area of ​​the circuit board unchanged, ensuring that different chips have sufficient heat dissipation space, avoiding the small distance between adjacent chips affecting the heat dissipation of the chips, and making each chip achieve better heat dissipation effect.

[0025] Preferably, the plurality of chips are staggeredly distributed along the first direction in order of usage frequency from small to large.

[0026] Because the more frequently a chip is used, the more heat it generates within a certain period of time. Staggering the chips along the first direction in ascending order of frequency of use can reduce the effect of heated air flowing through the upstream region of the heat dissipation duct on the chips located in the downstream region of the heat dissipation duct, further enhancing the heat dissipation effect of the chips in the downstream region of the heat dissipation duct and ensuring the reliability of the normal operation of the chips.

[0027] Preferably, the area of ​​the non-layout region surrounding each chip on the circuit board is positively correlated with the usage frequency of the chip.

[0028] Because the more frequently a chip is used, the more heat it generates within a certain period of time. By setting the area of ​​the non-distributed area surrounding each chip on the circuit board to be positively correlated with the chip's frequency of use, this ensures that chips with different usage frequencies have appropriate heat dissipation space while maintaining the total area of ​​the circuit board. This ensures that each chip has sufficient heat dissipation space, avoids the impact of small distances between adjacent chips on chip heat dissipation, and achieves good heat dissipation for each chip.

[0029] Preferably, the heat dissipation area of ​​the heat dissipation structure facing each chip is positively correlated with the heat generation power of the chip.

[0030] Because the higher the chip's heating power, the more heat it generates in a short period of time, the heat dissipation structure facing it needs to emit more heat to prevent the chip from overheating. For chips with higher heating power, the larger the heat dissipation area of ​​the heat dissipation structure facing it, the better it can meet the chip's heat dissipation needs. The heat dissipation area of ​​the heat dissipation structure facing each chip is set to be positively correlated with the chip's heating power. This ensures that the heat dissipation structure facing chips of different heating powers has a heat dissipation area that is adapted to the chip's heating power, ensuring that the heat dissipation structures facing different chips meet the chip's heat dissipation needs, so that each chip achieves a good heat dissipation effect.

[0031] Preferably, the heat dissipation area of ​​the heat dissipation structure facing each chip is positively correlated with the usage frequency of the chip.

[0032] Because the more frequently a chip is used, the more heat it generates within a certain period of time. Therefore, the heat dissipation structure facing it needs to radiate more heat to prevent the chip from overheating. For more frequently used chips, the larger the heat dissipation area of ​​the heat dissipation structure facing it, the better it can meet the chip's heat dissipation needs. By setting the heat dissipation area of ​​the heat dissipation structure facing each chip to be positively correlated with the chip's frequency of use, the heat dissipation structure facing chips of different frequencies can each have a heat dissipation area adapted to the chip's frequency of use. This ensures that the heat dissipation structures facing different chips meet the chip's heat dissipation needs, resulting in optimal heat dissipation for each chip.

[0033] Preferably, the controller includes a shell, the shell includes a substrate, a panel facing the substrate, and an enclosure arranged between the substrate and the panel and connected to the substrate and the panel respectively, the substrate, the panel and the enclosure form a cavity for accommodating the circuit board, the circuit board is arranged in the cavity, and the heat dissipation structure is arranged outside the shell.

[0034] This arrangement can protect the circuit board, reduce the materials used in manufacturing the controller housing, facilitate assembly of the controller, and further reduce manufacturing costs.

[0035] In a second aspect, the present invention further provides a vehicle, comprising the controller according to any one of the above technical solutions.

[0036] It should be noted that the vehicle has all the technical effects of the controller described in any of the above technical solutions, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

[0038] FIG1 is a schematic structural diagram of a controller according to an embodiment of the present invention;

[0039] FIG2 is an exploded view of a controller according to an embodiment of the present invention.

[0040] List of reference numerals: 1. Shell; 11. Bottom panel; 12. Enclosure; 121. Connector; 2. Circuit board; 21. Vehicle control chip; 22. Gateway chip; 23. Intelligent driving chip; 24. Cockpit control chip; 25. Communication chip; 31. Substrate; 32. Fin; 4. Duct enclosure; 41. Side panel; 411. Air inlet; 42. Cover; 5. Cooling fan; 6. Conductive foam. DETAILED DESCRIPTION

[0041] First, those skilled in the art should understand that the embodiments described below are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0042] It should be noted that in the description of the invention, terms such as "upper," "lower," "left," "right," "front," and "rear" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. These are merely for ease of description and are not intended to indicate or imply that the device or component described must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0043] Furthermore, it should be noted that, in the description of this invention, unless otherwise expressly specified or limited, the term "connection" should be understood broadly. For example, it can refer to a fixed connection, a detachable connection, an integral connection, a direct connection, or an indirect connection. Those skilled in the art will understand the specific meanings of these terms in this invention based on the specific circumstances. "Maximum junction temperature" refers to the maximum allowable actual operating temperature.

[0044] Based on the problems mentioned in the background technology that the controller is large in size and the chips corresponding to the downstream area of ​​the heat dissipation duct cannot dissipate heat quickly, the present invention provides a controller, which includes a circuit board and a metal radiator. Multiple chips are arranged on one side of the circuit board. The metal radiator includes a substrate and a heat dissipation structure distributed on the first side of the substrate and extending away from the substrate. The second side of the substrate is in contact with the multiple chips. A duct enclosure is provided on the second side of the substrate. The duct enclosure and the substrate form a heat dissipation duct parallel to the circuit board and extending along the first direction. A heat dissipation fan is provided in the heat dissipation duct to drive air to flow in the heat dissipation duct along the first direction. Multiple chips are staggered in the first direction.

[0045] This arrangement integrates the controller's multiple chips onto a single circuit board, avoiding the situation where multiple chips are distributed across different circuit boards and interconnected, resulting in a larger controller and more manufacturing steps. This improves chip integration, reduces the controller's size, simplifies the manufacturing process, and reduces manufacturing costs. The staggered distribution of the multiple chips along the air flow direction within the cooling duct reduces the effect of heat generated by chips located upstream of the duct on the heat dissipation of chips located downstream, enhancing the heat dissipation effect of chips located downstream and ensuring the reliability of the chips' normal operation.

[0046] The controller of the present invention is described below with reference to Figures 1 and 2. Figure 1 is a schematic structural diagram of a controller according to an embodiment of the present invention, and Figure 2 is an exploded view of a controller according to an embodiment of the present invention.

[0047] As shown in Figures 1 and 2, the controller includes a housing 1, in which a circuit board 2 is disposed. A vehicle control chip 21, a gateway chip 22, an intelligent driving chip 23, a cockpit control chip 24, and a communication chip 25 are disposed on the upper side of the circuit board 2. The vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cockpit control chip 24, and the communication chip 25 are configured with a metal heat sink. The metal heat sink includes a substrate 31 and a plurality of fins 32 distributed on the upper side of the substrate 31 and extending upward. The lower side of the substrate 31 is in contact with the vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cockpit control chip 24, and the communication chip 25. The upper ends of all the fins 32 are electrically connected via conductors.

[0048] As shown in Figures 1 and 2, the housing 1 specifically includes a base plate 31, a bottom panel 11 positioned below the base plate 31, and a panel 12 disposed between and connected to the base plate 31 and the bottom panel 11. The base plate 31, bottom panel 11, and panel 12 define a cavity that houses the circuit board 2, which is positioned within the cavity, with the fins 32 positioned outside. A connector 121 is connected to the front edge of the circuit board 2, with the front end of the connector 121 protruding from the front side of the panel 12. The underside of the base plate 31 contacts the vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cabin control chip 24, and communication chip 25. Multiple fins 32 extend upward from the upper side of the base plate 31, each extending in a left-to-right direction. An air duct panel 4 is also disposed above the base plate 31. The air duct panel 4 and the base plate 31 form a heat dissipation duct that runs parallel to the circuit board 2 and extends from left to right. The duct enclosure 4 includes a side panel 41 and a cover panel 42. The side panel 41 includes a front portion, a left portion, and a rear portion that are connected to each other. The edge of the cover panel 42 abuts against the upper edge of the side panel 41 and is fixedly connected via a snap-fit ​​structure. An air inlet 411 is formed on the left portion, communicating with the cooling duct. An air outlet (not shown) communicating with the cooling duct is formed between the right end of the front portion, the right end of the rear portion, the right end of the base plate 31, and the right end of the cover panel 42. A cooling fan 5 is installed to the left of the fins 32 within the cooling duct. The wiring harness for the cooling fan 5 passes through a cutout in the side panel 41 and connects to the connector 121. Driven by the cooling fan 5, air flows from the air inlet 411 into the cooling duct, flows rightward through the fins 32, and then out through the air outlet. A long strip of conductive foam 6, serving as a conductor, is sandwiched between the cover plate 42 and the upper ends of the fins 32. The conductive foam 6 is squeezed by the corresponding fins 32 and the cover plate 42, and is electrically connected to the upper ends of the fins 32. The enclosure 12, base plate 31, side plates 41, and fins 32 are integrally formed.

[0049] As shown in FIG2 , the vehicle control chip 21 , gateway chip 22 , intelligent driving chip 23 , cockpit control chip 24 and communication chip 25 on the upper side of the circuit board 2 are staggered in the direction from left to right.

[0050] The vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24 and communication chip 25 are integrated on a circuit board 2, avoiding the situation where multiple chips are distributed on different circuit boards and communicate with multiple circuit boards, resulting in a larger controller size and more manufacturing processes. This improves the chip integration, reduces the size of the controller, simplifies the manufacturing process of the controller, and reduces manufacturing costs.

[0051] The vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24 and communication chip 25 on the upper side of the circuit board 2 are staggered in the direction from left to right, that is, staggered along the extension direction of the heat dissipation duct, which reduces the influence of the heat generated by the chips located in the upstream area of ​​the heat dissipation duct on the heat dissipation of the chips located in the downstream area of ​​the heat dissipation duct, enhances the heat dissipation effect of the chips located in the downstream area of ​​the heat dissipation duct, and ensures the reliability of the normal operation of the chips.

[0052] The upper ends of the multiple fins 32 are electrically connected through the conductive foam 6, so that these fins 32 no longer produce multiple antenna amplification effects, thereby weakening the amplification effect of the fins 32 on electromagnetic radiation, and then weakening the intensity of the electromagnetic radiation emitted by the controller toward the surrounding environment. Through such a setting, there is no need to arrange multiple metal shrapnel around the vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24 and communication chip 25 on the circuit board 2 and ground them to weaken the electromagnetic radiation of the vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24 and communication chip 25. This avoids the situation where the area of ​​the circuit board 2 is too large due to the area reserved for connecting multiple metal shrapnel around the vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24 and communication chip 25 on the circuit board 2, thereby reducing the area of ​​the circuit board 2 and reducing the manufacturing cost.

[0053] The shell 1 includes a substrate 31, a bottom panel 11 located below the substrate 31, and a surrounding panel 12 arranged between the substrate 31 and the bottom panel 11 and connected to the substrate 31 and the bottom panel 11 respectively. The substrate 31, the bottom panel 11 and the surrounding panel 12 form a cavity for accommodating the circuit board 2. The circuit board 2 is arranged in the cavity and the fins 32 are located outside the cavity. This can protect the circuit board, reduce the manufacturing materials of the controller shell 1, facilitate the assembly of the controller, further reduce the manufacturing cost, and improve the heat dissipation effect of the metal radiator.

[0054] The cooling fan 5 is arranged at a position on the left side of the fin 32 in the cooling air duct. Compared with the method in which the cooling fan 5 is arranged at other positions in the cooling air duct, it can avoid the situation in which the temperature of the cooling fan 5 is too high when the air in the cooling air duct heats up and flows through the cooling fan 5, thereby affecting the normal operation of the cooling fan 5.

[0055] The conductive foam 6, acting as a conductor, is sandwiched between the cover plate 42 and the upper ends of the fins 32. Squeezed between the fins 32 and the cover plate 42, the conductive foam 6 electrically connects to the upper ends of the fins 32. This facilitates the installation and connection of the conductive foam 6, simplifies the manufacturing process, and further reduces manufacturing costs. The conductive foam 6, acting as a conductor, is sandwiched between the cover plate 42 and the upper ends of the fins 32, enhancing the reliability of the contact between the conductive foam 6 and the fins 32 and, in turn, ensuring a reliable electrical connection between the fins 32. Furthermore, this arrangement ensures a reliable electrical connection between the conductive foam 6 and the fins 32 even when the assembly tolerances of the duct enclosure 4 are large.

[0056] It should be noted that the conductive foam 6 is used as a conductor, which is only a specific configuration and can be adjusted in actual applications. For example, the conductor can be an iron bar, a copper bar, or other suitable conductor, etc. The conductor can also be connected to the upper ends of the multiple fins 32 by welding. In addition, the side panels 41 and the base plate 31 are integrally formed, and the cover plate 42 is connected to the side panels 41 by snap-fitting. This is only a specific configuration and can be adjusted in actual applications. For example, the cover plate 42 and the side panels 41 are integrally formed, and the side panels 41 are fixedly connected to the base plate 31 by snap-fitting, screwing, or other suitable methods. In addition, the fins 32 serve as a heat dissipation structure, which is only a specific configuration and can be adjusted in actual applications. For example, the heat dissipation structure can be a heat dissipation column extending upward from the upper side of the base plate 31.

[0057] In another more preferred embodiment, different from the above embodiment, the vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24 and communication chip 25 on the upper side of the circuit board 2 are staggered from left to right in the order of the highest junction temperature from small to large.

[0058] Since the temperature of the air in the downstream area flowing through the heat dissipation duct is higher, the heat dissipation effect of the heat dissipation structure in the downstream area is relatively poor compared with the heat dissipation structure in the upstream area. Multiple chips are staggered along the first direction in the order of the highest junction temperature from small to large, which can reduce the risk of chip damage due to temperature exceeding the maximum junction temperature and improve the reliability of normal operation of the chip.

[0059] On the basis that the vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24, and communication chip 25 are staggered along the left-to-right direction in ascending order of maximum junction temperature, the vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24, and communication chip 25 are staggered along the first direction in ascending order of heat output. In other words, on the premise that the vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24, and communication chip 25 are staggered along the left-to-right direction in ascending order of maximum junction temperature, the heat output of each chip is further considered, so that the chip with lower heat output is arranged to the left of the chip with relatively higher heat output.

[0060] Through such a setting, the chip with smaller heating power is closer to the upstream end of the heat dissipation duct, which can slow down the temperature rise of the air flowing through the upstream area of ​​the heat dissipation duct, and then reduce the influence of the heated air flowing through the upstream area of ​​the heat dissipation duct on the heat dissipation of the chip located in the downstream area of ​​the heat dissipation duct, further enhancing the heat dissipation effect of the chip located in the downstream area of ​​the heat dissipation duct, and ensuring the reliability of the normal operation of the chip.

[0061] In another preferred embodiment, different from the above embodiments, the area of ​​the non-layout region surrounding each chip on the circuit board 2 is positively correlated with the heat generation power of the chip.

[0062] Through such a setting, chips with different heating power can have a heat dissipation space adapted to them on the basis of keeping the total area of ​​the circuit board 2 unchanged, ensuring that different chips have sufficient heat dissipation space, avoiding the small distance between adjacent chips affecting the heat dissipation of the chips, and ensuring that each chip achieves a better heat dissipation effect.

[0063] In another more preferred embodiment, different from the above embodiment, the vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24 and communication chip 25 on the upper side of the circuit board 2 are staggered from left to right in order of frequency of use.

[0064] Because the more frequently a chip is used, the more heat it generates within a certain period of time. Staggering multiple chips from left to right in ascending order of frequency can reduce the effect of heated air flowing through the upstream area of ​​the cooling duct on the chips located downstream of the duct. This further enhances the cooling effect of the chips in the downstream area of ​​the cooling duct and ensures the reliability of the normal operation of the chips.

[0065] In another preferred embodiment, different from the above embodiment, the area of ​​the non-layout region surrounding each chip on the circuit board 2 is positively correlated with the usage frequency of the chip.

[0066] Because the higher the frequency of chip use, the more heat it generates within a certain period of time. The area of ​​the non-layout area surrounding each chip on the circuit board 2 is set to be positively correlated with the frequency of chip use. This ensures that chips with different usage frequencies have appropriate heat dissipation space while maintaining the total area of ​​the circuit board. This ensures that each chip has sufficient heat dissipation space, avoids the impact of small distances between adjacent chips on chip heat dissipation, and achieves a good heat dissipation effect for each chip.

[0067] Based on the above embodiments, preferably, the heat dissipation area of ​​the fins 32 facing each chip is positively correlated with the heat generation power of the chip.

[0068] Because the higher the chip's heating power, the more heat it generates in a short period of time, the fins 32 facing it need to emit more heat to prevent the chip from overheating. For chips with higher heating power, the larger the heat dissipation area of ​​the fins 32 facing it, the better it can meet the chip's heat dissipation needs. The heat dissipation area of ​​the fins 32 facing each chip is set to be positively correlated with the chip's heating power. This ensures that the fins 32 facing chips of different heating powers all have a heat dissipation area that is compatible with the chip's heating power, ensuring that the fins 32 facing different chips meet the chip's heat dissipation needs, and each chip achieves a good heat dissipation effect.

[0069] Based on the above embodiments, preferably, the heat dissipation area of ​​the fins 32 facing each chip is positively correlated with the usage frequency of the chip.

[0070] Because the more frequently a chip is used, the more heat it generates within a certain period of time. Therefore, the fins 32 facing it need to radiate more heat to prevent the chip from overheating. For more frequently used chips, the larger the heat dissipation area of ​​the fins 32 facing it, the better it can meet the chip's heat dissipation needs. The heat dissipation area of ​​the fins 32 facing each chip is set to be positively correlated with the chip's frequency of use. This ensures that the fins 32 facing chips of different frequencies each have a heat dissipation area adapted to the chip's frequency of use, ensuring that the fins 32 facing different chips meet the chip's heat dissipation needs and achieving optimal heat dissipation for each chip.

[0071] In another feasible embodiment, different from the above embodiment, the substrate of the metal radiator is not part of the shell, and the entire metal radiator is arranged inside the shell. The first side of the substrate of the metal radiator is in contact with the vehicle control chip 21, gateway chip 22, intelligent driving chip 23, cockpit control chip 24 and communication chip 25 on the circuit board 2, and the fins of the metal radiator are arranged on the second side of the substrate. The shell is provided with a heat dissipation port that is connected to the space between the second side of the substrate and the shell.

[0072] In another feasible embodiment, the controller does not include the housing 1 of the above embodiment. Specifically, the bottom panel 11 and the enclosure 12 of the above embodiment are not provided. The circuit board 2 is fixedly connected to the base plate 31 of the metal heat sink by screws. The lower side of the base plate 31 is in contact with the vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24, and the communication chip 25.

[0073] In other feasible embodiments, unlike the above embodiments, the air inlet 411 on the left side of the side panel 41 is replaced with an air outlet, and the air outlet formed by the right end of the front and rear sides of the side panel 41, the right end of the base plate 31, and the right end of the cover plate 42 is replaced with an air inlet. The cooling fan 5 is configured to blow air to the left. Driven by the cooling fan 5, air enters the cooling duct from the right air inlet, flows through the fins 32, and then flows out from the left air outlet. Accordingly, the chip arrangement direction in the above embodiments is changed from "from left to right" to "from right to left."

[0074] In some other feasible embodiments, the difference between the above embodiments is that the cooling fan 5 is arranged in the middle position of the cover plate 42, and the cooling fan 5 sucks the air above the cover plate 42 and blows it into the cooling duct, and the air flows to the two ends of the cooling duct in the cooling duct, and the two ends of the cooling duct serve as the air outlets of the cooling duct; or the cooling fan 5 is arranged in the middle position of the cover plate 42, and the cooling fan 5 blows air above the cover plate 42, and the two ends of the cooling duct serve as the air inlet of the cooling duct, and the air is sucked into the cooling duct through the air inlets at both ends of the cooling duct and flows to the middle of the cooling duct, and finally blown out toward the top of the cover plate 42 through the cooling fan 5; accordingly, the arrangement direction of the chips in the above embodiments is changed from "from left to right" to "along the flow direction of the air in the cooling duct".

[0075] In addition, the present invention also provides a vehicle, which includes the controller in any one of the above embodiments.

[0076] It should be noted that the controller of the present invention can be used not only in vehicles, but also in other devices that require a controller. When the controller is applied to other devices that require a controller, the types of multiple chips on the controller's circuit board are adjusted according to the specific usage scenario.

[0077] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A controller, characterized in that: The controller includes a circuit board and a metal heat sink, a plurality of chips are arranged on one side of the circuit board, the metal heat sink includes a substrate and a heat dissipation structure distributed on a first side of the substrate and extending in a direction away from the substrate, and a second side of the substrate is in contact with the plurality of chips. A duct enclosure is arranged on the second side surface of the substrate, and the duct enclosure and the substrate enclose a heat dissipation duct parallel to the circuit board and extending along a first direction. A heat dissipation fan is arranged in the heat dissipation duct to drive air to flow in the heat dissipation duct along the first direction, and the multiple chips are staggered in the first direction.

2. The controller according to claim 1, characterized in that: The plurality of chips are staggeredly distributed along the first direction in ascending order of highest junction temperature.

3. The controller according to claim 2, characterized in that: On the basis that the plurality of chips are staggeredly distributed along the first direction in the order of the highest junction temperature from small to large, the plurality of chips are staggeredly distributed along the first direction in the order of the heat generation power from small to large.

4. The controller according to claim 3, characterized in that: The area of ​​the non-layout region surrounding each chip on the circuit board is positively correlated with the heat generation power of the chip.

5. The controller according to claim 1, characterized in that: The plurality of chips are staggeredly distributed along the first direction in order of usage frequency from small to large.

6. The controller according to claim 5, characterized in that: The area of ​​the non-layout region surrounding each chip on the circuit board is positively correlated with the usage frequency of the chip.

7. The controller according to claim 3 or 4, characterized in that: The heat dissipation area of ​​the heat dissipation structure facing each chip is positively correlated with the heat generation power of the chip.

8. The controller according to claim 5 or 6, characterized in that: The heat dissipation area of ​​the heat dissipation structure facing each chip is positively correlated with the use frequency of the chip.

9. The controller according to any one of claims 1 to 6, characterized in that: The controller includes a shell, which includes the substrate, a panel facing the substrate, and an enclosure arranged between the substrate and the panel and connected to the substrate and the panel respectively. The substrate, the panel and the enclosure form a cavity for accommodating the circuit board, the circuit board is arranged in the cavity, and the heat dissipation structure is arranged outside the shell.

10. A vehicle, characterized in that: The vehicle comprises the controller according to any one of claims 1 to 9.

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