Electronic device

Abstract

The present application belongs to the technical field of electronic products. Disclosed is an electronic device. The electronic device comprises a frame, a screen, a functional assembly and a heat dissipation liquid, wherein the frame and the screen enclose an accommodating space; the functional assembly is placed in the accommodating space; the accommodating space is filled with the heat dissipation liquid; at least part of the functional assembly is immersed in the heat dissipation liquid; and the heat dissipation liquid is a non-electrically-conductive heat dissipation liquid.

Description

electronic devices

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on December 18, 2023, with application number 202311736558.1 and invention name “Electronic Device”. The entire contents of the Chinese patent application are incorporated herein by reference. Technical Field

[0003] The present application belongs to the technical field of electronic products, and specifically relates to an electronic device. Background Art

[0004] With the development of technology, more and more functions are integrated into electronic devices such as mobile phones, and the power consumption of their processors is also getting higher and higher, which causes more and more heat to be generated when the electronic devices are working.

[0005] Currently, to improve the heat dissipation capacity of electronic devices, small fans are usually installed inside the devices. However, the installation of small fans not only further reduces the space utilization inside the devices, but also easily leads to the adsorption and accumulation of dust, which greatly reduces the reliability of the electronic devices.

[0006] It can be seen that the heat dissipation structure of the electronic device in the related art has the problem of occupying a large space. Summary of the Invention

[0007] The present application aims to provide an electronic device that can solve the problem of large space occupation existing in the heat dissipation structure of the electronic device in the related art.

[0008] An embodiment of the present application proposes an electronic device, comprising: a frame, a screen, functional components, and a heat dissipation liquid, wherein the frame and the screen are arranged to form a receiving space, the functional components are placed in the receiving space, and the receiving space is filled with the heat dissipation liquid, and at least part of the functional components are immersed in the heat dissipation liquid; wherein the heat dissipation liquid is a non-conductive heat dissipation liquid.

[0009] In an embodiment of the present application, a receiving space is formed by enclosing the back cover, the frame and the screen, so that the functional components can be fixed in the receiving space by being fixed on the back cover and / or the frame. Compared with the prior art in which a middle plate is provided to carry the functional components, the design of the middle plate can be effectively avoided, and the space used for designing the middle plate can be used for the optimized layout of the functional components, thereby achieving the purpose of improving the reliability of the electronic device.

[0010] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0012] FIG1 is an exploded schematic diagram of an electronic device provided in an embodiment of the present application;

[0013] FIG2 is a schematic diagram of the structure of the electronic device shown in FIG1;

[0014] FIG3 is a partial schematic diagram of the electronic device shown in FIG1 ;

[0015] FIG4 is a second partial schematic diagram of the electronic device shown in FIG1 ;

[0016] FIG5 is a second structural schematic diagram of the electronic device shown in FIG1 . DETAILED DESCRIPTION

[0017] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0018] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0019] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0020] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0021] The electronic device provided in the embodiments of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0022] Referring to Figures 1 to 5, Figure 1 is an exploded schematic diagram of an electronic device provided in an embodiment of the present application; Figure 2 is one of the structural schematic diagrams of the electronic device shown in Figure 1; Figure 3 is one of the partial schematic diagrams of the electronic device shown in Figure 1; Figure 4 is a second partial schematic diagram of the electronic device shown in Figure 1; and Figure 5 is a second structural schematic diagram of the electronic device shown in Figure 1.

[0023] As shown in Figures 1 to 5, the electronic device provided in the embodiment of the present application includes: a frame 10, a screen 20, a functional component 30 and a heat dissipation liquid 50. The frame 10 and the screen 20 are arranged to form a receiving space 40. The functional component 30 is placed in the receiving space 40, and the receiving space 40 is filled with the heat dissipation liquid 50. At least part of the functional component 30 is immersed in the heat dissipation liquid 50. The heat dissipation liquid 50 is a non-conductive heat dissipation liquid.

[0024] The frame 10 may be understood as a rear cover shell of an electronic device, including but not limited to a rear cover 11 , a frame 12 and other structures.

[0025] The functional components 30 described above can be understood as circuit board assembly 31, speaker module 32, battery 33, etc., which are disposed within the electronic device. The circuit board assembly 31 can be a motherboard assembly of the electronic device, and multiple functional modules can be integrated on the motherboard assembly, including but not limited to a baseband chip, a power management chip, a radio frequency processor, memory, a graphics card, etc.

[0026] The non-conductive heat dissipation liquid can be understood as a low dielectric liquid. That is, the heat dissipation liquid 50 can be made of a low dielectric liquid, such as a liquid made of fluorinated hydrocarbons, hydrofluoroethers, and the like.

[0027] In this embodiment, the receiving space 40 is filled with heat dissipation liquid 50 so that at least part of the functional components 30 placed in the receiving space 40 can be immersed in the heat dissipation liquid 50, so that the heat generated by at least part of the functional components 30 during operation can be quickly conducted to the outside through the heat dissipation liquid 50, thereby improving the heat dissipation effect of the electronic device; moreover, since the heat dissipation liquid 50 can be filled in the receiving space 40 except for the space used to accommodate the functional components 30, that is, the heat dissipation liquid 50 is filled in the gap between the functional components 30 and the inner wall of the receiving space 40, that is, no additional space for filling the heat dissipation liquid 50 is required in the receiving space 40. Compared with the conventional method of setting a small heat dissipation fan, the space required for setting the heat dissipation liquid 50 inside the electronic device is effectively reduced.

[0028] In addition, since the heat dissipation liquid 50 is non-conductive, the provision of the heat dissipation liquid 50 will not affect the use of at least part of the functional components 30 immersed in the heat dissipation liquid 50 .

[0029] Furthermore, compared with conventional fan heat dissipation methods that require the setting of a heat exchange structure such as an air outlet that is connected to the outside world, the receiving space 40 used to fill the heat dissipation liquid 50 in this application is a closed space and can effectively block external water, dust, etc. from entering the receiving space 40, thereby improving the waterproof and dustproof performance of the electronic equipment.

[0030] In one embodiment, the electronic device further includes a driving component disposed in the receiving space 40 , and the driving component is used to drive the heat dissipation liquid 50 to flow in the receiving space 40 .

[0031] In this embodiment, a driving component is provided to drive the heat dissipation liquid 50 to flow in the receiving space 40 , thereby improving the heat exchange effect between the heat dissipation liquid 50 and the outside, thereby further improving the heat dissipation capacity of the heat dissipation liquid 50 .

[0032] The driving component may be a hydraulic pump disposed in the receiving space 40 , and the hydraulic pump may apply pressure to the heat dissipation liquid 50 so as to make the heat dissipation liquid 50 flow in the receiving space 40 .

[0033] In one embodiment, the driving component includes an electromagnetic driving component 60 and non-conductive magnetic particles. The electromagnetic driving component 60 is arranged in the receiving space 40, and the non-conductive magnetic particles are arranged in the heat dissipation liquid 50. The electromagnetic driving component 60 drives the non-conductive magnetic particles to drive the heat dissipation liquid 50 to flow in the receiving space 40.

[0034] In this embodiment, the electromagnetic driving component 60 can be arranged on the frame 10 or in the heat dissipation liquid 50, and the electromagnetic driving component 60 is also electrically connected to the power supply structure of the electronic device, and power can be supplied to the electromagnetic driving component 60 through the power supply structure, so that the electromagnetic driving component 60 generates a magnetic field, thereby causing the non-conductive magnetic particles arranged in the heat dissipation liquid 50 to move under the action of magnetism, and then the heat dissipation liquid 50 is driven to flow in the receiving space 40 through the movement of the non-conductive magnetic shell, so as to achieve the effect of improving the heat exchange between the heat dissipation liquid 50 and the outside world.

[0035] The electromagnetic driving member 60 may be an electromagnet that generates a magnetic field when energized, and may be fixed to the frame 10 by bonding or snapping, or immersed in the heat dissipation liquid 50 by suspension.

[0036] The non-conductive magnetic particles may be magnetic particles such as ferrite, which can generate magnetism under the action of an electromagnetic field and move accordingly, thereby driving the heat dissipation liquid 50 to flow.

[0037] The ferrite mentioned above mainly refers to a non-conductive ferrimagnetic ceramic material and can be extracted from hematite (Fe2O3) or magnetite (Fe3O4).

[0038] In one embodiment, the frame 10 includes a back cover 11 and a frame 12 . The back cover 11 , the frame 12 , and the screen 20 are arranged to form a receiving space 40 , and at least part of the functional components 30 are fixedly disposed in the receiving space 40 by the back cover 11 and / or the frame 12 .

[0039] The back cover 11 and the screen 20 are used to form the bottom wall and the top wall of the receiving space 40 respectively, and the frame 12 is used to form the side wall of the receiving space 40 .

[0040] The above-mentioned back cover 11 and screen 20 can be used to form the bottom wall and top wall of the receiving space 40 respectively, that is, the back cover 11 and screen 20 can be understood as the bottom wall and top wall of the receiving space 40; the above-mentioned frame 12 can be used to form the side wall of the receiving space 40, that is, the frame 12 can be understood as the side wall of the receiving space 40.

[0041] At least part of the above-mentioned functional components 30 are fixedly arranged in the receiving space 40 through the back cover 11 and / or the frame 12. It can be understood that one or more of the circuit board assembly 31, the speaker module 32, the battery 33, etc. can be fixedly connected to the back cover 11 and / or the frame 12, so that one or more of the circuit board assembly 31, the speaker module 32, the battery 33, etc. are fixedly arranged in the receiving space 40, thereby realizing the fixed support function of the frame 10 on the functional component 30.

[0042] In this embodiment, a receiving space 40 is formed by enclosing the back cover 11, the frame 12 and the screen 20, so that the functional component 30 can be fixed in the receiving space 40 by being fixed on the back cover 11 and / or the frame 12. Compared with the prior art in which a main upper or middle plate is provided to carry the functional components, the design of the main upper or middle plate can be effectively avoided, and the space used for designing the main upper or middle plate can be used for the optimized layout of the functional components, thereby improving the layout effect of the functional component 30 in the electronic device.

[0043] Among them, the above-mentioned back cover 11 and frame 12 can be made of metal or other materials, and have good structural strength and stability; they can not only provide the electronic device with an appearance shape, but also provide the electronic device with the ability to resist deformation and damage.

[0044] In one embodiment, the battery 33 may be fixedly mounted on the rear cover 11 , and the battery 33 is also located in the receiving space 40 .

[0045] In this embodiment, the back cover 11 can be understood as a battery back cover.

[0046] The battery 33 can be fixed to the back cover 11 or to the screen 20 by bonding. In addition, during the assembly process of the battery 33, it can be electrically connected to the circuit board assembly 31 to provide power to the circuit board assembly 31.

[0047] In one embodiment, the functional component 30 includes a circuit board assembly 31 . The circuit board assembly 31 is connected to the frame 10 via an elastic member 70 and is immersed in the heat dissipation liquid 50 .

[0048] In this embodiment, the circuit board assembly 31 can be connected to the frame 10 through an elastic member 70 so that the circuit board assembly 31 can be immersed in the heat dissipation liquid 50, and the elastic member 70 can also provide an elastic buffering force for the movement of the circuit board assembly 31 in the heat dissipation liquid 50, so as to reduce the impact on the reliability of the circuit board assembly 31 after the electronic device falls and collides.

[0049] The elastic member 70 may be a spring, a memory metal connector or other connector with telescopic function.

[0050] In one embodiment, the elastic member 70 is a memory metal connector, one end of which is connected to the circuit board assembly 31 and the other end is connected to the frame 10;

[0051] When the electronic device is in a dropped state, current is output to the memory metal connector to adjust the position of the circuit board assembly 31 in the receiving space 40 through the memory metal connector.

[0052] In this embodiment, the change in the contraction state of the memory metal connector after power is applied can be used to adjust the position of the circuit board assembly 31 in the receiving space 40, so that when the electronic device is in a falling state, the circuit board assembly 31 has sufficient buffer space in the receiving space 40, and the impact of the electronic device on the reliability of the circuit board assembly 31 after a fall or collision can be further reduced.

[0053] In one embodiment, memory metal connectors are provided between the circuit board assembly 31 and multiple side walls of the receiving space 40 so that the circuit board assembly 31 can be adjusted in multiple directions by utilizing the contraction state changes of the memory metal connectors.

[0054] In one embodiment, the circuit board assembly 31 may also be provided with sensors such as a gyroscope and an accelerometer to detect the electronic device's drop and calculate the drop angle. Upon receiving the detected sensor data, the processor on the circuit board assembly 31 may output a current to the memory metal connector to adjust the position of the circuit board assembly 31 within the receiving space 40. This allows the circuit board assembly 31 to have sufficient buffer space within the receiving space 40, thereby minimizing damage to the circuit board assembly 31 caused by the electronic device's drop and collision, thereby improving the reliability of the electronic device.

[0055] In one embodiment, the circuit board assembly 31 may be suspended at a specific position in the receiving space 40 by electromagnetic control or a method of spring support plus screw support, which is not specifically limited here.

[0056] In one embodiment, the memory metal connector can be fixed by screwing, welding, snapping, etc. to achieve the connection between the circuit board assembly 31 and the frame 10.

[0057] It is understandable that the speaker module 32 may also be connected to the frame 10 via a memory metal connector, so that the speaker module 32 can also move within the receiving space 40 .

[0058] In one embodiment, the functional component 30 includes a first component provided with a shielding structure. The suspension height of the first component in the heat dissipation liquid 50 is positively correlated with the volume of the shielding structure. The suspension height is the depth of the first component immersed in the heat dissipation liquid 50 .

[0059] In this embodiment, the suspension height of the first component in the heat dissipation liquid 50 can be adjusted by adjusting the volume of the shielding structure, and the suspension principle is similar to that of a fish bladder. Moreover, by suspending the first component in the heat dissipation liquid 50, the heat dissipation liquid 50 can provide impact cushioning for the first component and reduce the impact of the falling collision of the electronic device on the reliability of the circuit board assembly 31.

[0060] The first component may be a mainboard component, and the shielding structure may be a shielding cover provided on some functional modules of the mainboard component.

[0061] In one embodiment, the electronic device further includes a temperature sensor and a control module, wherein the control module is electrically connected to the temperature sensor and the electromagnetic driving member 60 respectively;

[0062] The control module is used to process the sensor data detected by the temperature sensor to obtain a temperature detection result, and determine the corresponding electromagnetic control parameters based on the temperature detection result, and output the electromagnetic control parameters to the electromagnetic driving component 60 so that the electromagnetic driving component 60 generates a magnetic field according to the electromagnetic control parameters.

[0063] In this embodiment, by detecting the internal temperature of the electronic device, the magnetic field strength generated by the electromagnetic driver 60 can be adjusted in real time, thereby controlling the flow path and speed of the heat dissipation liquid 50, thereby improving the heat dissipation effect of the heat dissipation liquid 50 on the functional components 30, etc.

[0064] The electromagnetic driving member 60 can be understood as an electromagnetic pole disposed in the receiving space 40 , which can generate a magnetic field for driving the non-conductive electromagnetic particles to move.

[0065] It can be understood that the receiving space 40 formed by the back cover 11, the frame 12 and the screen 20 is a closed space. After the heat dissipation liquid 50 is filled in the receiving space 40, the electromagnetic driving component 60 can be used to drive the heat dissipation liquid 50 to flow in the receiving space 40, and bring the heat generated by the above-mentioned functional component 30 to the low-temperature area in the receiving space 40, so as to enhance the heat dissipation effect of the functional component 30.

[0066] Moreover, since the back cover 11 and the frame 12 can be made of materials with good thermal conductivity, the heat carried by the heat dissipation liquid 50 can be dissipated into the outside air through the back cover 11 and the frame 12, that is, dissipated to the outside of the electronic device, which greatly improves the heat dissipation capacity of the electronic device. At the same time, it can also ensure the computing power of the processor of the electronic device and improve the user experience.

[0067] In one embodiment, the flow path of the heat dissipation liquid 50 in the receiving space 40 can be designed based on the layout of the functional component 30 in the receiving space 40, and based on the flow path of the heat dissipation liquid 50, multiple electromagnetic driving components 60 can be placed in the receiving space 40 so that the magnetic field generated by the multiple electromagnetic driving components 60 can drive the non-conductive magnetic particles to move, thereby driving the heat dissipation liquid 50 to flow along the preset flow path, so as to achieve the purpose of improving the heat dissipation capacity of the electronic device.

[0068] In practical applications, the position and speed of the non-conductive magnetic reservoir disposed in the heat dissipation liquid 50 can be controlled by precisely adjusting the magnetic field strength and direction of different electromagnetic drive components 60, thereby achieving directional flow and manipulation of the heat dissipation liquid 50.

[0069] In one embodiment, the electronic device further includes a camera assembly 80 , and the side of the back cover 11 facing away from the screen 20 is recessed toward the receiving space 40 to form a receiving groove 111 , and the camera assembly 80 is detachably assembled in the receiving groove 111 .

[0070] In this embodiment, the provision of the receiving groove 111 allows the back cover 11 to isolate the receiving groove 111 from the receiving space 40, thereby reducing the interference of the camera assembly 80 on functional components immersed or suspended in the heat dissipation liquid 50. Furthermore, by detachably mounting the camera assembly 80 in the receiving groove 111, it is also convenient to replace the camera assembly 80 with other accessories during use of the electronic device, or to facilitate maintenance of the camera assembly 80.

[0071] In one embodiment, the camera assembly 80 includes a camera module 81 and a housing 82 adapted to the receiving slot 111 , and the camera module 81 is assembled in the housing 82 ;

[0072] A first adsorption component 1111 is provided in the receiving groove 111 , and a second adsorption component 821 is provided on the shell 82 . Through the adsorption connection between the first adsorption component 1111 and the second adsorption component 821 , the camera assembly 80 can be detachably assembled in the receiving groove 111 .

[0073] In this embodiment, the camera assembly 80 can be detachably assembled in the receiving groove 111 by means of adsorption connection.

[0074] The first adsorption member 1111 and the second adsorption member 821 may be magnetic adsorption members, that is, the first adsorption member 1111 and the second adsorption member 821 may be adsorbed and connected by magnetic attraction.

[0075] In one embodiment, the camera module 81 includes a substrate 811 , a first camera 812 , a second camera 813 , a camera auxiliary device 814 and a lens 815 , and the first camera 812 , the second camera 813 and the camera auxiliary device 814 can all be set on the substrate 811 .

[0076] Among them, the above-mentioned camera auxiliary device 814 can be understood as a fill light of the camera module 81.

[0077] In one embodiment, the camera assembly 80 can be detachably assembled in the receiving groove 111 by means of a snap connection or a threaded connection.

[0078] In one embodiment, the heat dissipation liquid 50 may be filled into the receiving space 40 before the screen 20 is assembled, or the heat dissipation liquid 50 may be filled or injected into the receiving space 40 through the one-way flow holes after the screen 20 is assembled on the frame 10 .

[0079] The connection between the screen 20 and the frame 10 includes, but is not limited to, bonding, welding, screw fixing and other connection and fixing methods.

[0080] The electronic device may be a mobile phone, tablet computer, laptop computer, PDA, vehicle-mounted electronic device, wearable device, ultra-mobile personal computer (UMPC), netbook or personal digital assistant (PDA), etc.

[0081] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0082] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising: A frame, a screen, functional components and a heat dissipation liquid, wherein the frame and the screen are arranged to form a receiving space, the functional components are placed in the receiving space, and the receiving space is filled with the heat dissipation liquid, and at least part of the functional components are immersed in the heat dissipation liquid; Wherein, the heat dissipation liquid is a non-conductive heat dissipation liquid.

2. The electronic device according to claim 1, wherein: The electronic device further comprises a driving component disposed in the receiving space, and the driving component is used for driving the heat dissipation liquid to flow in the receiving space.

3. The electronic device according to claim 2, wherein: The driving component includes an electromagnetic driving component and non-conductive magnetic particles. The electromagnetic driving component is arranged in the receiving space, and the non-conductive magnetic particles are arranged in the heat dissipation liquid. The electromagnetic driving component drives the non-conductive magnetic particles to drive the heat dissipation liquid to flow in the receiving space.

4. The electronic device according to claim 1, wherein: The frame includes a back cover and a frame, the back cover, the frame and the screen are arranged to form the receiving space, and at least part of the functional components are fixedly arranged in the receiving space through the back cover and / or the frame; The back cover and the screen are used to form the bottom wall and the top wall of the receiving space respectively, and the frame is used to form the side wall of the receiving space.

5. The electronic device according to claim 4, wherein: The functional component comprises a circuit board component, which is connected to the frame body through an elastic member and immersed in the heat dissipation liquid.

6. The electronic device according to claim 5, wherein: The elastic member is a memory metal connector, one end of which is connected to the circuit board assembly, and the other end of which is connected to the frame; When the electronic device is in a falling state, current is output to the memory metal connector to adjust the position of the circuit board assembly in the receiving space through the memory metal connector.

7. The electronic device according to any one of claims 1 to 4, wherein: The functional components include a first component provided with a shielding structure, and the suspension height of the first component in the heat dissipation liquid is positively correlated with the volume of the shielding structure, and the suspension height is the depth of the first component immersed in the heat dissipation liquid.

8. The electronic device according to claim 4, wherein: The electronic device further comprises a camera assembly. The side of the back cover facing away from the screen is recessed toward the receiving space to form a receiving groove. The camera assembly is detachably assembled in the receiving groove.

9. The electronic device according to claim 8, wherein: The camera assembly comprises a camera module and a shell adapted to the receiving slot, wherein the camera module is assembled in the shell; A first adsorption component is arranged in the receiving groove, and a second adsorption component is arranged on the shell. Through the adsorption connection between the first adsorption component and the second adsorption component, the camera assembly can be detachably assembled in the receiving groove.

10. The electronic device according to claim 3, wherein: The electronic device further comprises a temperature sensor and a control module, wherein the control module is electrically connected to the temperature sensor and the electromagnetic driving component respectively; The control module is used to process the sensor data detected by the temperature sensor to obtain a temperature detection result, determine corresponding electromagnetic control parameters based on the temperature detection result, and output the electromagnetic control parameters to the electromagnetic driving component so that the electromagnetic driving component generates a magnetic field according to the electromagnetic control parameters.

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