Substrate processing system, inspection module, and inspection method

Abstract

The present invention relates to a technique for inspecting the fill state of a filler coated onto a laminated substrate obtained by bonding a plurality of substrates. A substrate processing system (1) comprises: a substrate holding device (2) that holds and rotates a laminated substrate (Ws) in a vertical orientation; a coating device (3) that coats a filler (F) onto a target application region (T) included in a peripheral portion of the laminated substrate (Ws); and an inspection device (5) that inspects the fill state of the filler (F) coated onto the target application region (T). The inspection device (5) comprises: a liquid tank (30) configured to hold a liquid (L) for locally immersing only the peripheral portion of the laminated substrate (Ws); and an ultrasonic imaging device (32) that generates an ultrasonic image of the target application region (T) when immersed in the liquid (L).

Description

Substrate processing system, inspection module, and inspection method

[0001] The present invention relates to a technique for inspecting the filling state of a filler applied to a laminated substrate in which a plurality of substrates are bonded together.

[0002] In recent years, in order to achieve even higher density and higher functionality in semiconductor devices, development of three-dimensional packaging technology, which stacks multiple substrates to integrate them three-dimensionally, has progressed. In three-dimensional packaging technology, for example, the device surface of a first substrate on which integrated circuits and electrical wiring are formed is bonded to the device surface of a second substrate on which integrated circuits and electrical wiring are formed. Furthermore, after bonding the first substrate to the second substrate, the second substrate is thinned using a polishing or grinding device. In this way, integrated circuits can be stacked in a direction perpendicular to the device surfaces of the first and second substrates.

[0003] In three-dimensional packaging technology, three or more substrates may be bonded together. For example, after a second substrate bonded to a first substrate is laminated, a third substrate may be bonded to the second substrate and then laminated. In this specification, a configuration in which multiple substrates are bonded together may be referred to as a "laminated substrate."

[0004] Typically, the edge of a substrate is pre-polished to a rounded or chamfered shape to prevent cracking or chipping. Grinding a second substrate having such a shape results in the formation of a sharp edge on the second substrate. This sharp edge (hereinafter referred to as a knife edge) is formed by the back surface of the ground second substrate and the outer peripheral surface of the second substrate. Such a knife edge is easily chipped by physical contact, which can damage the laminated substrate itself during transportation. Furthermore, if the bonding between the first and second substrates is insufficient, the second substrate may crack during grinding.

[0005] Therefore, to prevent cracking or chipping of the knife edge, a filler is applied to the edge of the laminated substrate before grinding the second substrate. The filler is applied to the gap between the edge of the first substrate and the edge of the second substrate. The filler supports the knife edge formed after grinding the second substrate, preventing cracking or chipping of the knife edge.

[0006] However, when applying filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate, filling defects such as insufficient or excessive application of filler may occur under preset application conditions. If the laminated substrate is processed in a subsequent process while the filling defect remains, the laminated substrate may be scratched, which may adversely affect the laminated substrate and process performance. Therefore, as described in Patent Document 1, infrared rays are used to non-destructively inspect the filling state of the filler applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate.

[0007] JP 2023-32581 A

[0008] Another method for nondestructively inspecting the filling condition of a filler applied to the gap between the edge portions of a first substrate and a second substrate involves irradiating the laminate substrate to be inspected with ultrasonic waves and detecting the reflected waves. While higher ultrasonic frequencies enable higher-resolution inspections, high-frequency ultrasonic waves tend to attenuate as they propagate. Therefore, the filler filling condition can be inspected by immersing the laminate substrate to be inspected in a liquid (e.g., pure water) that attenuates ultrasonic waves less than air.

[0009] However, if the entire laminated substrate is immersed in liquid, it takes time to dry the liquid that has adhered to the entire laminated substrate, and after drying, water marks (water stains) may appear on the surface of the laminated substrate, which can result in contamination of the laminated substrate.

[0010] Therefore, an object of the present invention is to provide a technique that can inspect the filling state of a filler applied to the peripheral portion of a laminated substrate without immersing the entire laminated substrate in a liquid.

[0011] In one aspect, a substrate processing system for applying a filler to a peripheral portion of a laminated substrate formed by bonding a first substrate and a second substrate includes a substrate holding device that holds and rotates the laminated substrate in a vertical position, a coating device that applies the filler to a target coating area included in the peripheral portion of the laminated substrate, and an inspection device that inspects the filling state of the filler applied to the target coating area, the inspection device including a liquid bath configured to hold a liquid for locally immersing only the peripheral portion of the laminated substrate, and an ultrasonic imaging device that generates an ultrasonic image of the target coating area when immersed in the liquid. In one aspect, the substrate processing system further includes a curing device that hardens the filler applied to the target coating area, the curing device being located downstream of the coating device and upstream of the ultrasonic imaging device in a rotation direction of the laminated substrate.

[0012] In one aspect, the substrate processing system further includes a control device that determines a filling state of the filler in the target application area based on the ultrasonic image. In one aspect, the control device is configured to control the operation of the application device and to terminate application of the filler to the target application area based on the filling state. In one aspect, the substrate processing system further includes a gas blower that blows gas onto the laminated substrate to remove the liquid adhering to the laminated substrate, the gas blower being located downstream of the liquid tank in a rotation direction of the laminated substrate.

[0013] In one aspect, an inspection module for inspecting the filling status of a filler applied to a peripheral portion of a laminated substrate formed by bonding a first substrate and a second substrate is provided, the inspection module including: a substrate holding device that holds and rotates the laminated substrate in a vertical position; a liquid tank configured to hold a liquid for locally immersing only the peripheral portion of the laminated substrate, including a target filler application area; and an ultrasonic imaging device that generates an ultrasonic image of the target filler application area when immersed in the liquid. In one aspect, the inspection module further includes an imaging device moving mechanism that moves the ultrasonic imaging device in a radial direction of the laminated substrate. In one aspect, the inspection module further includes a gas blower that blows gas onto the laminated substrate to remove the liquid adhering to the laminated substrate, the gas blower being located downstream of the liquid tank in the rotation direction of the laminated substrate. In one aspect, the inspection module further includes a control device that determines the filling status of the filler in the target filler application area based on the ultrasonic image.

[0014] In one aspect, a method for inspecting the filling status of a filler applied to a peripheral portion of a laminated substrate formed by bonding a first substrate and a second substrate is provided, the method including: holding the laminated substrate in a vertical position; locally immersing only the peripheral portion of the laminated substrate, including a target filler application area, in a liquid in a liquid bath; rotating the laminated substrate in a vertical position; and generating an ultrasound image of the target filler application area immersed in the liquid using an ultrasound imaging device. In one aspect, the ultrasound image of the target filler application area is generated while moving the ultrasound imaging device in a radial direction of the laminated substrate. In one aspect, the inspection method further includes blowing gas onto the laminated substrate using a gas blower to remove the liquid adhering to the laminated substrate, the gas blower being disposed downstream of the liquid bath in the rotation direction of the laminated substrate. In one aspect, the inspection method further includes determining the filling status of the target filler application area based on the ultrasound image.

[0015] In one aspect, the inspection method further includes applying the filler to the target application area while rotating the laminated substrate in a vertical position, and generating the ultrasound image using the ultrasound imaging device while applying the filler to the target application area. In one aspect, the inspection method further includes curing the filler applied to the target application area using a curing device, the curing device being located downstream of the application device and upstream of the ultrasound imaging device in the rotation direction of the laminated substrate. In one aspect, the inspection method further includes determining a filling state of the filler in the target application area based on the ultrasound image, and terminating the application of the filler to the target application area based on the filling state. In one aspect, generation of the ultrasound image is initiated after application of the filler has started, and after application of the filler has stopped, the laminated substrate is further rotated to generate the ultrasound image of the entire circumference of the target application area.

[0016] According to the present invention, only the peripheral portion of a laminated substrate, including a target filler application area, is locally immersed in a liquid, and an ultrasonic image of the target filler application area is generated. This allows the filling status of the filler applied to the target filler application area to be inspected without immersing the entire laminated substrate in the liquid. As a result, the drying time of the laminated substrate can be shortened and contamination of the laminated substrate due to water spots or the like that occur after drying can be suppressed.

[0017] FIG. 1A is a cross-sectional view showing an example of a peripheral portion of a laminated substrate to be processed. FIG. 1B is a cross-sectional view showing an example of a peripheral portion of a laminated substrate to which a filler has been applied. FIG. 1C is a cross-sectional view showing an example of a peripheral portion of a laminated substrate that has been thinned after a filler has been applied. FIG. 1B is a front view showing an embodiment of a substrate processing system. FIG. 1C is a side view of the substrate processing system shown in FIG. 2. FIG. 1C is a schematic view showing an embodiment of a coating apparatus ... cross-sectional view showing an example of a peripheral portion of a laminated substrate in which a filler has not been applied to the target coating area. FIG. 1C is a schematic view showing an embodiment of a coating apparatus. FIG. 1C is a front view showing an embodiment of a substrate processing system. FIG. 1C is a side view of the substrate processing system shown in FIG. 2. FIG. 1C is a schematic view showing an embodiment of a coating apparatus. FIG. 1C is a schematic view showing an embodiment of a coating apparatus. FIG. 1C is a schematic view showing an embodiment of a coating apparatus. 8B is a schematic diagram showing an ultrasonic image of the entire periphery of the target application area of ​​the laminated substrate shown in FIG. 8A. FIG. 8B is a flowchart showing an embodiment of a method for inspecting the filling state of a filler applied to a target application area of ​​a laminated substrate using a substrate processing system. FIG. 8C is a flowchart showing an embodiment of a method for inspecting the filling state of a filler applied to a target application area of ​​a laminated substrate using a substrate processing system. FIG. 8D is a schematic diagram showing an embodiment of a method for inspecting the filling state of a filler applied to a target application area of ​​a laminated substrate using a substrate processing system. FIG. 8E is a schematic diagram showing an embodiment of a method for inspecting the filling state of a filler applied to a target application area of ​​a laminated substrate using a substrate processing system. FIG. 8F is a schematic diagram showing an embodiment of a method for inspecting the filling state of a filler applied to a target application area of ​​a laminated substrate using a substrate processing system.

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1A is a cross-sectional view showing an example of a peripheral portion of a laminated substrate to be processed. As shown in Fig. 1A, the laminated substrate Ws has a structure in which a flat surface (e.g., a device surface) S1 of a first substrate W1 and a flat surface (e.g., a device surface) S2 of a second substrate W2 are bonded together. The first substrate W1 and the second substrate W2 used in this embodiment are circular.

[0019] The edge portion E1 of the first substrate W1 is the outermost portion inclined with respect to the flat surface (e.g., device surface) S1 of the first substrate W1. More specifically, the edge portion E1 of the first substrate W1 has a rounded or chamfered shape. The edge portion E2 of the second substrate W2 is also the outermost portion inclined with respect to the flat surface (e.g., device surface) S2 of the second substrate W2. More specifically, the edge portion E2 of the second substrate W2 has a rounded or chamfered shape. The edge portions E1 and E2 are sometimes referred to as bevel portions.

[0020] 1A , in the laminated substrate Ws, a portion of the flat surface S1 adjacent to the edge portion E1 of the first substrate W1 and a portion of the flat surface S2 adjacent to the edge portion E2 of the second substrate W2 are not bonded together. The first substrate W1 has a non-bonded portion N1 including the non-bonded portion of the flat surface S1, and the second substrate W2 has a non-bonded portion N2 including the non-bonded portion of the flat surface S2. The peripheral portion of the laminated substrate Ws includes the edge portion E1 of the first substrate W1, the edge portion E2 of the second substrate W2, the non-bonded portion N1 of the first substrate W1, and the non-bonded portion N2 of the second substrate W2. Gaps are formed between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2, and between the non-bonded portion N1 of the first substrate W1 and the non-bonded portion N2 of the second substrate W2.

[0021] 1B is a cross-sectional view showing an example of the peripheral edge of a laminated substrate Ws to which filler F has been applied. A target application area T to which filler F should be applied is an area consisting of the gap between edge portion E1 and edge portion E2 and the gap between non-bonding portion N1 and non-bonding portion N2. Filler F is applied so as to fill the target application area T. The target application area T is formed around the entire periphery of the laminated substrate Ws and has a substantially triangular cross section. In one embodiment, the width of the target application area T in the radial direction of the laminated substrate Ws is within a range of 0.3 mm to 3 mm.

[0022] In one embodiment, the laminated substrate Ws may be formed by bonding the entire flat surface S1 of the first substrate W1 and the entire flat surface S2 of the second substrate W2. In this case, the target coating area T is the gap between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2.

[0023] 1C is a cross-sectional view showing an example of the peripheral edge of the laminated substrate Ws that has been thinned after the application of filler F. As a result of this thinning process, a knife edge Ek is formed at the edge E2 of the second substrate W2. Because the knife edge Ek is held (supported) by the filler F, the knife edge Ek is prevented from cracking or chipping.

[0024] Fig. 2 is a front view showing one embodiment of a substrate processing system 1, and Fig. 3 is a side view of the substrate processing system 1 shown in Fig. 2. The substrate processing system 1 is an apparatus for applying filler F to the peripheral portion of a laminated substrate Ws formed by joining a first substrate W1 and a second substrate W2, and for inspecting the filling state of the filler F applied to the peripheral portion of the laminated substrate Ws. The substrate processing system 1 includes a substrate holding device 2 that holds the laminated substrate Ws in a vertical position and rotates the laminated substrate Ws, an application device 3 that applies filler F to the peripheral portion of the laminated substrate Ws, a curing device 4 that hardens the filler F applied to the peripheral portion of the laminated substrate Ws, and an inspection device 5 that inspects the filling state of the filler F applied to the peripheral portion of the laminated substrate Ws.

[0025] The substrate holding device 2 includes a holding stage 12 that holds the back surface of the laminated substrate Ws, a rotation shaft 13 connected to the center of the holding stage 12, and a rotation mechanism 15 that rotates the holding stage 12 and the rotation shaft 13. The holding stage 12 is configured to hold the back surface of the laminated substrate Ws by vacuum suction. As shown in FIG. 3 , the holding stage 12 has a holding surface 12a that is perpendicular to the horizontal plane. The laminated substrate Ws is held in a vertical position by the holding stage 12. In this embodiment, the laminated substrate Ws is held by the holding surface 12a of the holding stage 12 so that its flat portion is at an angle of 90 degrees relative to the horizontal plane. However, as described below, the angle of the holding surface 12a of the holding stage 12 (i.e., the flat portion of the laminated substrate Ws) relative to the horizontal plane is not limited to this embodiment, as long as only the peripheral edge of the laminated substrate Ws can be locally immersed in liquid. In one embodiment, the angle of the holding surface 12a of the holding stage 12 (i.e., the flat portion of the laminated substrate Ws) relative to the horizontal plane may be within a range of 30 degrees to 90 degrees.

[0026] The laminated substrate Ws is held by the holding stage 12 so that the center of the laminated substrate Ws coincides with the axis Cr of the rotation shaft 13. The rotation mechanism 15 includes a motor (not shown). The rotation mechanism 15 is configured to rotate the holding stage 12 and the laminated substrate Ws together in the direction indicated by the arrow in FIG. 2 around the axis Cr of the rotation shaft 13.

[0027] In one embodiment, the substrate holding device 2 may include, instead of the holding stage 12, a plurality of (e.g., four) rollers (not shown) that can contact the peripheral edge of the laminated substrate Ws, and the laminated substrate Ws may be held in a vertical position by these rollers. In this case, instead of the rotation shaft 13 and the rotation mechanism 15, the substrate holding device 2 includes a roller rotation mechanism (not shown) that rotates each roller around its axis at the same speed in the same direction. By rotating the plurality of rollers with the roller rotation mechanism, the laminated substrate Ws is rotated around the central axis Cr of the laminated substrate Ws.

[0028] As shown in Fig. 3, the substrate processing system 1 further includes a substrate up-and-down movement mechanism 18 that moves the stacked substrate Ws held by the substrate holding device 2 up and down. The substrate up-and-down movement mechanism 18 is connected to the substrate holding device 2. The substrate up-and-down movement mechanism 18 is configured to move the substrate holding device 2 and the stacked substrate Ws held by the substrate holding device 2 in a direction perpendicular to the axis Cr of the rotation shaft 13. In other words, the substrate up-and-down movement mechanism 18 is configured to move the substrate holding device 2 and the stacked substrate Ws held by the substrate holding device 2 in the radial direction of the stacked substrate Ws. In Fig. 3, the substrate up-and-down movement mechanism 18 is illustrated schematically.

[0029] Examples of the substrate vertical movement mechanism 18 include a combination of a linear motion mechanism (such as a ball screw mechanism or a cylinder mechanism) and a motor (such as a servo motor or a stepping motor), a linear motion electric actuator (such as a linear motor), and an air cylinder.

[0030] The coating device 3 is located radially outward of the laminated substrate Ws held by the substrate holding device 2, and is disposed above the laminated substrate Ws facing the target coating area T. The coating device 3 is configured to apply the filler F to the target coating area T of the laminated substrate Ws. The coating of the filler F by the coating device 3 is performed while the laminated substrate Ws is rotated by the substrate holding device 2.

[0031] 4 is a schematic diagram showing one embodiment of the coating device 3. The coating device 3 includes a syringe 21 for discharging the filler F, a piston 22 that can reciprocate within the syringe 21, and a syringe movement mechanism (not shown) that moves the syringe 21 toward or away from the laminated substrate Ws. This syringe movement mechanism enables the coating device 3 to adjust the distance between the laminated substrate Ws and the filler discharge port 21a of the coating device 3. In one embodiment, the coating device 3 may omit the syringe movement mechanism. In this case, the distance between the laminated substrate Ws and the filler discharge port 21a is determined in advance so that the filler F is appropriately injected into the target coating region T of the laminated substrate Ws.

[0032] Syringe 21 has a hollow structure and is configured to be filled with filler F. Piston 22 is disposed within syringe 21. Syringe 21 has a filler discharge port 21a at its tip for discharging filler F. The tip of syringe 21 including filler discharge port 21a may be configured to be detachable. An appropriate shape for filler discharge port 21a is selected depending on the physical properties (e.g., viscosity) of the filler F to be applied. Filler discharge port 21a is disposed so as to face a target application region T of laminated substrate Ws.

[0033] The coating device 3 includes a gas supply line 25 connected to a gas supply source and a pressure adjustment device 26 disposed on the gas supply line 25. The syringe 21 is connected to the gas supply source via the gas supply line 25. When gas (e.g., dry air or nitrogen gas) is supplied from the gas supply source to the syringe 21, the piston 22 advances within the syringe 21. As the piston 22 advances, the filler F in the syringe 21 is discharged from the filler discharge port 21a. The amount of filler F discharged from the filler discharge port 21a per unit time can be adjusted by adjusting the pressure of the gas supplied from the gas supply source to the syringe 21 using the pressure adjustment device 26. When the filler F is discharged from the filler discharge port 21a, it falls toward the target coating area T of the laminated substrate Ws. In this manner, the coating device 3 can coat the filler F on the target coating area T of the laminated substrate Ws.

[0034] In one embodiment, the application device 3 may include a screw feeder instead of the combination of the syringe 21 and the piston 22 .

[0035] As shown in FIG. 2 , the curing device 4 is located radially outward of the laminated substrate Ws held by the substrate holding device 2, and is arranged opposite the target coating area T of the laminated substrate Ws. The curing device 4 is arranged downstream of the coating device 3 in the rotation direction of the laminated substrate Ws and upstream of the ultrasonic imaging device 32 of the inspection device 5, which will be described later. The curing device 4 is configured to heat and harden the filler F applied to the target coating area T of the laminated substrate Ws by the coating device 3. The hardening of the filler F by the curing device 4 is performed while the laminated substrate Ws is rotated by the substrate holding device 2. In this embodiment, the filler F is a thermosetting filler. An example of such a filler is a thermosetting resin.

[0036] Filler F includes a binder, a solvent, particles, and the like. Particles are dispersed in a binder dissolved in a solvent. For example, the composition of filler F is determined by the type of binder, the amount of solvent, the amount of particles, and the particle size. Examples of binders include inorganic binders containing alkali metal silicates, organic binders made of silicone resins or epoxy resins, and inorganic-organic hybrid binders. The particles are, for example, silica or alumina particles. The particles are mixed into the binder to increase the volume of filler F and to adjust the viscosity of filler F. In order to lower the viscosity of filler F, particles may not be included in filler F.

[0037] The curing device 4 in this embodiment is an air heater, and is configured to blow hot air toward the filler F applied to the laminated substrate Ws. The filler F heated by the hot air is cured by a crosslinking reaction. If the filler F contains a solvent, the solvent is volatilized by heating. The curing device 4 is not limited to an air heater, and may be a lamp heater or other configuration as long as it can heat and cure the filler F.

[0038] In this embodiment, the filler F is a thermosetting filler, but in one embodiment, the filler F may be an ultraviolet-curable filler. In this case, the curing device 4 may be a UV irradiation device that irradiates ultraviolet light to cure the filler F. If the filler F contains a solvent, the filler F may be heated using an air heater or the like in combination to volatilize the solvent.

[0039] The substrate processing system 1 further includes a control device 10 that controls the operations of the substrate holding device 2, the substrate vertical movement mechanism 18, the coating device 3, and the curing device 4. The substrate holding device 2, the substrate vertical movement mechanism 18, the coating device 3, and the curing device 4 are electrically connected to the control device 10.

[0040] The control device 10 is composed of at least one computer. The control device 10 includes a storage device 10a in which a program is stored and a processing device 10b that executes calculations according to instructions included in the program. The storage device 10a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the processing device 10b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the control device 10 is not limited to these examples.

[0041] 2 and 3 , the inspection device 5 includes a liquid tank 30 configured to hold a liquid L for locally immersing only the peripheral portion of the laminated substrate Ws, including the target application area T of the filler F, and an ultrasonic imaging device 32 for generating an ultrasonic image of the target application area T of the laminated substrate Ws when immersed in the liquid L in the liquid tank 30. The laminated substrate Ws held by the substrate holding device 2 is lowered by the substrate up-and-down movement mechanism 18 described above, and only the peripheral portion of the laminated substrate Ws is locally immersed in the liquid L in the liquid tank 30. More specifically, of the laminated substrate Ws held by the substrate holding device 2, only the lower portion of the peripheral portion of the laminated substrate Ws is locally immersed in the liquid L in the liquid tank 30.

[0042] 5 is a schematic diagram showing how the ultrasonic imaging device 32 generates an ultrasonic image of the target application area T of the laminated substrate Ws. The peripheral portion of the laminated substrate Ws is the outer circumferential region of the laminated substrate Ws that is immersed in the liquid L in the liquid tank 30. In one embodiment, the peripheral portion of the laminated substrate Ws is the region extending from the outermost end to 10 mm inward in the radial direction of the laminated substrate Ws. When only the peripheral portion of the laminated substrate Ws is locally immersed in the liquid L in the liquid tank 30, other portions of the laminated substrate Ws, including the central region, are not in contact with the liquid L.

[0043] When only the peripheral edge of the laminated substrate Ws is locally immersed in the liquid L in the liquid tank 30, the bottom surface 30a of the liquid tank 30 is located below the laminated substrate Ws held by the substrate holding device 2. That is, the depth of the liquid L in the liquid tank 30 is greater than the width of the peripheral edge of the laminated substrate Ws in the radial direction. The liquid level La of the liquid L in the liquid tank 30 is located higher than the target application area T of the laminated substrate Ws. An example of the liquid L is pure water, but the liquid L is not limited to this example and may be any other liquid as long as it can propagate ultrasonic waves.

[0044] The ultrasonic imaging device 32 includes an ultrasonic probe 32a that transmits and receives ultrasonic waves, and an image processing unit 32b that generates an ultrasonic image from a reflected signal output from the ultrasonic probe 32a. The ultrasonic imaging device 32 penetrates a sidewall 30b of the liquid tank 30. The ultrasonic probe 32a is disposed within the liquid tank 30 and immersed in the liquid L held in the liquid tank 30. A seal member 33 is disposed between the ultrasonic imaging device 32 and the sidewall 30b where the ultrasonic imaging device 32 penetrates the sidewall 30b, and the seal member 33 seals the liquid L in the liquid tank 30 so as to prevent leakage. In one embodiment, the ultrasonic imaging device 32 is waterproof, and the entire ultrasonic imaging device 32 may be disposed within the liquid tank 30.

[0045] The ultrasonic imaging device 32 is disposed perpendicular to the laminated substrate Ws and faces the back surface of the laminated substrate Ws (the non-bonding surface of the first substrate W1). In one embodiment, the ultrasonic imaging device 32 may be disposed facing the front surface of the laminated substrate Ws (the non-bonding surface of the second substrate W2). The ultrasonic probe 32a is configured to irradiate the peripheral portion of the laminated substrate Ws with ultrasonic waves and receive ultrasonic waves reflected from the laminated substrate Ws. The ultrasonic waves irradiated from the ultrasonic probe 32a propagate through the liquid L in the liquid vat 30 and are reflected from the laminated substrate Ws. A portion of the ultrasonic waves further propagate within the laminated substrate Ws and are reflected from the interface between the first substrate W1 and the target coating region T (filler F or voids) and the interface between the target coating region T (filler F or voids) and the second substrate W2.

[0046] In one embodiment, the frequency of the ultrasonic waves emitted from the ultrasonic probe 32a is in the range of 20 kHz to 300 MHz, and preferably in the range of 10 MHz to 100 MHz. The depth to which ultrasonic waves can penetrate into the material being inspected varies depending on their frequency. This is because the higher the frequency of the ultrasonic waves, the more easily the sound pressure attenuates as they travel through the material being inspected. Ultrasonic waves of the above frequencies are suitable for inspecting the target coating area T of the laminated substrate Ws in this embodiment.

[0047] Furthermore, the inspection resolution of ultrasonic waves varies depending on the frequency. In one embodiment, the ultrasonic probe 32a that emits ultrasonic waves in the range of 10 MHz to 100 MHz can perform inspection with an accuracy of approximately 10 μm to 100 μm. For example, the ultrasonic probe 32a that emits ultrasonic waves in the range of 10 MHz to 100 MHz can detect voids of approximately 10 μm to 100 μm that exist in the target application area T.

[0048] The ultrasonic probe 32a receives ultrasonic waves reflected from the laminated substrate Ws, outputs a reflected signal, and transmits the reflected signal to the image processing unit 32b. The image processing unit 32b is configured to generate an ultrasonic image of the target coating area T of the laminated substrate Ws from the reflected signal output from the ultrasonic probe 32a. However, the specific configuration of the ultrasonic imaging device 32 may be different as long as it is capable of generating an ultrasonic image of the target coating area T of the laminated substrate Ws.

[0049] The ultrasonic imaging device 32 generates an ultrasonic image of the target coating area T while the laminated substrate Ws is rotated by the substrate holding device 2. This allows the ultrasonic imaging device 32 to scan the entire circumference of the target coating area T and generate an ultrasonic image of the entire circumference of the target coating area T. The ultrasonic imaging device 32 is electrically connected to the control device 10, and the ultrasonic image of the entire circumference of the target coating area T of the laminated substrate Ws generated by the ultrasonic imaging device 32 is sent to the control device 10.

[0050] 6A is a cross-sectional view showing an example of the peripheral portion of a laminated substrate Ws in which filler F is not applied to the target application region T, and FIG. 6B is a schematic diagram showing an ultrasound image of the entire periphery of the target application region T of the laminated substrate Ws shown in FIG. 6A. The symbol D shown in FIGS. 6A and 6B indicates the imaging region by the ultrasound imaging device 32. The peripheral portion of the laminated substrate Ws includes the imaging region D, and the imaging region D includes the target application region T. In one embodiment, the imaging region D may include only the target application region T. In one embodiment, the imaging region D is a region extending from the outermost end to 5 mm inward in the radial direction of the laminated substrate Ws.

[0051] The laminated substrate Ws shown in Figure 6A is in a state before the filler F is applied to the target application area T, and the filling state of the filler F is "unfilled." As shown in Figure 6B, the target application area T, which has not been applied with filler F, appears on the ultrasound image in a color close to white. On the other hand, the portion other than the target application area T within the imaging area D, i.e., the portion where the first substrate W1 and the second substrate W2 are bonded, appears on the ultrasound image in a color close to black. This is because the intensity of the ultrasonic waves reflected from the laminated substrate Ws at each frequency differs between the portion where the first substrate W1 and the second substrate W2 are not bonded (i.e., the target application area T) and the portion where the first substrate W1 and the second substrate W2 are bonded.

[0052] FIG. 7A is a cross-sectional view showing an example of the peripheral portion of a laminated substrate Ws in which a target application region T is coated with filler F, and FIG. 7B is a schematic diagram showing an ultrasound image of the entire periphery of the target application region T of the laminated substrate Ws shown in FIG. 7A. The laminated substrate Ws shown in FIG. 7A is in a state in which the entire target application region T is filled with filler F, and the filling state of the filler F is "filled." As shown in FIG. 7B, the target application region T coated with filler F appears in an ultrasound image in a color close to black. As can be seen from a comparison between FIG. 6B and FIG. 7B, the target application region T appears in different colors on the ultrasound image depending on whether or not filler F is present. This is because the intensity of the ultrasonic waves reflected at each frequency from the laminated substrate Ws differs between the portion not coated with filler F and the portion coated with filler F.

[0053] FIG. 8A is a cross-sectional view showing an example of the peripheral portion of a laminated substrate Ws in which voids have occurred in part of the target coating area T, and FIG. 8B is a schematic diagram showing an ultrasound image of the entire periphery of the target coating area T of the laminated substrate Ws shown in FIG. 8A. The laminated substrate Ws shown in FIG. 8A has voids in part of the target coating area T, and the filling state of the filler F is "insufficient filling." The symbol V shown in FIGS. 8A and 8B indicates voids (voids) that have occurred in the target coating area T. As shown in FIG. 8B, voids V in the target coating area T where filler F has not been applied appear in a color close to white on the ultrasound image. In the example shown in FIGS. 8A and 8B, band-shaped voids V have occurred throughout the entire target coating area T, but voids V may also occur locally in part of the target coating area T.

[0054] Although the ultrasound images of the entire circumference of the target application area T of the laminated substrate Ws shown in Figures 6B, 7B, and 8B are circular, in one embodiment, the ultrasound images of the entire circumference of the target application area T of the laminated substrate Ws may be strip-shaped. Furthermore, the colors that appear on the ultrasound images described with reference to Figures 6B, 7B, and 8B are merely examples, and the colors that appear on the ultrasound images are not limited to these examples.

[0055] The control device 10 is configured to determine the filling status of the target application area T with filler F based on an ultrasonic image of the target application area T of the laminated substrate Ws generated by the ultrasonic imaging device 32. More specifically, the control device 10 is configured to detect the presence or absence of filler F in the target application area T from differences in color that appear in the ultrasonic image of the target application area T, and to determine the filling status of the filler F in the target application area T. In one embodiment, the control device 10 calculates the filling rate of filler F in the target application area T based on the ultrasonic image of the target application area T sent from the ultrasonic imaging device 32, and determines the filling status of the filler F in the target application area T based on the filling rate of filler F in the target application area T.

[0056] The filling rate of filler F in the target application area T is the ratio of the area coated with filler F to the entire target application area T. The filling rate of filler F in the target application area T is expressed, for example, as a rate of 0 to 100%. The control device 10 detects the size of the target application area T that appears on the ultrasound image (i.e., the area of ​​the target application area T) and the size of the portion of the target application area T that is coated with filler F (i.e., the area of ​​the portion of the target application area T that is coated with filler F). The control device 10 calculates the filling rate of filler F in the target application area T from the detected size of the target application area T and the size of the portion of the target application area T that is coated with filler F.

[0057] The control device 10 determines that the filling state of the filler F in the target application area T is "filled completely" when the filling rate of the filler F in the target application area T reaches a predetermined threshold value (e.g., 100%). The control device 10 determines that the filling state of the filler F in the target application area T is "filled incomplete" when the filling rate of the filler F in the target application area T does not reach a predetermined threshold value (e.g., 100%).

[0058] The control device 10 detects a void V that has occurred in the target application area T based on an ultrasound image of the target application area T sent from the ultrasound imaging device 32, and when a void V is detected within the target application area T, it determines that the filling state of the filler F into the target application area T is ``poor filling.''

[0059] In this embodiment, the ultrasonic imaging device 32 generates an ultrasonic image of the entire circumference of the target application area T of the laminated substrate Ws, and the control device 10 determines the filling status of the filler F into the target application area T based on the ultrasonic image of the entire circumference of the target application area T. However, in one embodiment, the ultrasonic imaging device 32 may generate an ultrasonic image of a portion of the target application area T in the rotational direction of the laminated substrate Ws, and the control device 10 may determine the filling status of the filler F into the target application area T based on the ultrasonic image of a portion of the target application area T.

[0060] In one embodiment, the control device 10 is electrically connected to a display device (not shown) provided in the substrate processing system 1, and may display on the display device an ultrasonic image of the target application area T and / or a determination result of the filling state of the filler F in the target application area T. The display device may be located at a location remote from the substrate processing system 1.

[0061] 2 and 3, the inspection device 5 further includes a gas blower 40 that blows gas G onto the laminated substrate Ws. In this embodiment, the inspection device 5 includes three gas blowers 40, which blow gas G onto the laminated substrate Ws from the front side, back side, and side side of the laminated substrate Ws, respectively. In one embodiment, each gas blower 40 is configured to form a curtain-like gas jet. The number of gas blowers 40 is not limited to that in this embodiment, and may be two or less or four or more.

[0062] The gas blower 40 is disposed downstream of the ultrasonic imaging device 32 and the liquid tank 30 in the rotation direction of the laminated substrate Ws. Liquid L adheres to a portion of the laminated substrate Ws that is downstream of the liquid tank 30 in the rotation direction of the laminated substrate Ws. The gas blower 40 is configured to blow gas G onto the laminated substrate Ws to remove the liquid L adhering to the laminated substrate Ws. More specifically, the gas blower 40 is configured to blow the gas G obliquely downward toward the laminated substrate Ws. This causes the liquid L adhering to the laminated substrate Ws to flow downward together with the gas G, thereby removing the liquid L adhering to the laminated substrate Ws. The gas blower 40 is electrically connected to the control device 10, and the operation of the gas blower 40 is controlled by the control device 10. Examples of the gas G include air and inert gas.

[0063] 9 and 10 are flowcharts showing an embodiment of a method for inspecting the filling state of the filler F applied to the target application area T of the laminated substrate Ws by the substrate processing system 1. In this embodiment, the coating device 3 applies the filler F to the target application area T while the laminated substrate Ws makes one rotation. The curing device 4 hardens the filler F applied to the target application area T while the laminated substrate Ws makes one rotation. The ultrasonic imaging device 32 generates an ultrasonic image of the entire circumference of the target application area T while the laminated substrate Ws makes one rotation.

[0064] 9 , in step S101, the control device 10 commands the substrate holding device 2 to hold the laminated substrate Ws to be processed in a vertical position. In step S102, the control device 10 commands the substrate up-and-down movement mechanism 18 to lower the laminated substrate Ws held by the substrate holding device 2, thereby locally immersing only the peripheral edge of the laminated substrate Ws in the liquid L in the liquid tank 30. In step S103, the control device 10 commands the rotation mechanism 15 of the substrate holding device 2 to start rotating the laminated substrate Ws held by the substrate holding device 2. In step S104, the control device 10 commands the gas blower 40 to start blowing gas G onto the laminated substrate Ws, thereby removing the liquid L adhering to the laminated substrate Ws.

[0065] In step S105, the control device 10 issues a command to the pressure adjustment device 26 of the coating device 3 to supply gas from the gas supply source to the syringe 21 of the coating device 3, causing the coating device 3 to start coating the filler F on the target coating area T of the laminated substrate Ws. The coating device 3 applies the filler F while the substrate holding device 2 rotates the laminated substrate Ws. In step S106, the control device 10 issues a command to the curing device 4 to start curing the filler F applied to the target coating area T. The curing device 4 hardens the filler F while the substrate holding device 2 rotates the laminated substrate Ws. In step S107, the ultrasonic imaging device 32 starts generating an ultrasonic image of the target coating area T of the laminated substrate Ws immersed in the liquid L in the liquid tank 30. The ultrasonic imaging device 32 generates an ultrasonic image of the target coating area T while the substrate holding device 2 rotates the laminated substrate Ws.

[0066] In step S108, the control device 10 stops the application of filler F to the target application area T by the coating device 3 when the laminated substrate Ws has rotated once since the application of filler F to the target application area T of the laminated substrate Ws started. Specifically, when the laminated substrate Ws has rotated once since the application of filler F to the target application area T started, the control device 10 issues a command to the pressure adjustment device 26 of the coating device 3 to stop the supply of gas from the gas supply source to the syringe 21 of the coating device 3. From the time when generation of an ultrasonic image of the target application area T is started in step S107 until the time when application of filler F to the target application area T by the coating device 3 is stopped in step S108, the ultrasonic imaging device 32 generates an ultrasonic image of the target application area T while the coating device 3 applies filler F to the target application area T. The substrate holding device 2 continues to rotate the laminated substrate Ws even after the coating of filler F to the target application area T by the coating device 3 has stopped. In step S109, when the laminated substrate Ws has rotated once since the control device 10 started hardening the filler F applied to the target application area T, the control device 10 issues a command to the curing device 4 to stop hardening the filler F on the target application area T of the laminated substrate Ws.

[0067] 10 , in step S110, the ultrasonic imaging device 32 stops generating an ultrasonic image of the target application area T immersed in the liquid L in the liquid tank 30 when the laminated substrate Ws has rotated once since starting to generate an ultrasonic image of the target application area T. This generates an ultrasonic image of the entire circumference of the target application area T. The ultrasonic image of the entire circumference of the target application area T generated by the ultrasonic imaging device 32 is sent to the control device 10. In step S111, the control device 10 determines the filling status of the filler F in the target application area T based on the ultrasonic image of the target application area T of the laminated substrate Ws. In one embodiment, as described above, the control device 10 calculates the filling rate of the filler F in the target application area T based on the ultrasonic image of the target application area T, and determines the filling status of the filler F in the target application area T based on the calculated filling rate of the filler F in the target application area T.

[0068] In step S111, when the control device 10 determines that the filling state of the filler F in the target application area T is "filling completed" or "filling incomplete," the operations from step S112 onward are performed to terminate the application of the filler F to the target application area T. In step S111, when the control device 10 determines that the filling state of the filler F in the target application area T is "filling incomplete," the processing flow returns to step S105. Thereafter, the operations of steps S105 to S111 are repeated.

[0069] In step S112, the control device 10 issues a command to the rotation mechanism 15 of the substrate holding device 2 to temporarily stop the rotation of the laminated substrate Ws. In step S113, the control device 10 issues a command to the substrate up-and-down movement mechanism 18 to raise the laminated substrate Ws immersed in the liquid L in the liquid bath 30 and pull the laminated substrate Ws out of the liquid bath 30. In step S114, the control device 10 issues a command to the rotation mechanism 15 of the substrate holding device 2 to rotate the laminated substrate Ws again. In step S115, after the liquid L adhering to the laminated substrate Ws pulled out of the liquid bath 30 is removed by the gas blower 40, the control device 10 issues a command to the gas blower 40 to stop blowing the gas G onto the laminated substrate Ws. In step S116, the control device 10 issues a command to the rotation mechanism 15 of the substrate holding device 2 to stop the rotation of the laminated substrate Ws.

[0070] According to this embodiment, by locally immersing only the peripheral portion of the laminated substrate Ws in the liquid L and generating an ultrasonic image of the target application area T immersed in the liquid L, it is possible to inspect the filling state of the filler F applied to the target application area T included in the peripheral portion of the laminated substrate Ws without immersing the entire laminated substrate Ws in the liquid L. As a result, it is possible to shorten the drying time of the laminated substrate Ws and suppress contamination of the laminated substrate due to watermarks and the like that occur after drying.

[0071] In addition, since the liquid L adhering to the laminated substrate Ws is removed by the gas blower 40 of the inspection device 5, there is no need to provide a separate drying process, and throughput can be improved. Furthermore, since the liquid L is removed by the gas blower 40 immediately after it adheres to the laminated substrate Ws, watermarks are less likely to occur.

[0072] In one embodiment, the coating device 3 may coat the target coating area T with the filler F while the laminated substrate Ws makes multiple rotations, and the curing device 4 may harden the filler F coated on the target coating area T while the laminated substrate Ws makes multiple rotations. In this case, the ultrasonic imaging device 32 may generate an ultrasonic image of the target coating area T while the laminated substrate Ws makes one final rotation.

[0073] In one embodiment, the control device 10 may detect position information of a portion of the target coating area T where the filler F has not been applied, based on an ultrasound image of the target coating area T. The control device 10 may perform additional application of filler F to the target coating area T based on the detected position information when the portion of the target coating area T where the filler F has not been applied faces the filler discharge port 21 a of the syringe 21 of the coating device 3. The control device 10 can adjust the position of the portion of the target coating area T of the laminated substrate Ws where the filler F has not been applied relative to the filler discharge port 21 a of the syringe 21 of the coating device 3 by controlling the operation of the rotation mechanism 15 of the substrate holding device 2.

[0074] FIG. 11 is a side view showing another embodiment of the substrate processing system 1. The configuration and operation of this embodiment, unless otherwise specifically described, are the same as those of the above-described embodiment, and therefore redundant description will be omitted. As shown in FIG. 11 , the inspection apparatus 5 of this embodiment further includes an imaging device moving mechanism 35 that moves the ultrasonic imaging device 32 in the radial direction of the laminated substrate Ws. Examples of the imaging device moving mechanism 35 include a combination of a linear motion mechanism (such as a ball screw mechanism or a cylinder mechanism) and a motor (such as a servo motor or a stepping motor), or a linear motion electric actuator (such as a linear motor).

[0075] FIG. 12 is a schematic diagram showing how the imaging device moving mechanism 35 moves the ultrasonic imaging device 32. As shown in FIG. 12 , a seal member 33 is disposed between the ultrasonic imaging device 32 and the side wall 30b where the ultrasonic imaging device 32 penetrates the side wall 30b. The seal member 33 seals the liquid L in the liquid tank 30 to prevent leakage. The seal member 33 is fixed to the ultrasonic imaging device 32. When the imaging device moving mechanism 35 moves the ultrasonic imaging device 32 in the radial direction of the laminated substrate Ws, the seal member 33 also moves in the radial direction of the laminated substrate Ws to maintain a sealed state. In one embodiment, the distance the ultrasonic imaging device 32 is moved by the imaging device moving mechanism 35 is within a range of 10 mm or less. In FIGS. 11 and 12 , the imaging device moving mechanism 35 is depicted schematically.

[0076] In one embodiment, the ultrasound imaging device 32 has waterproof properties, and the entire ultrasound imaging device 32 may be placed in the liquid bath 30. In this case, the imaging device moving mechanism 35 may also be placed in the liquid bath 30 together with the ultrasound imaging device 32.

[0077] In this embodiment, the ultrasonic imaging device 32 generates an ultrasonic image while the substrate holding device 2 rotates the laminated substrate Ws and while the imaging device moving mechanism 35 moves the ultrasonic imaging device 32 in the radial direction of the laminated substrate Ws. This makes it possible to scan the entire target coating area T in the radial direction of the laminated substrate Ws even when the scanning area of ​​the ultrasonic imaging device 32 is small, thereby generating an ultrasonic image of the entire target coating area T. The imaging device moving mechanism 35 is electrically connected to the control device 10, and the operation of the imaging device moving mechanism 35 is controlled by the control device 10.

[0078] In one embodiment, the control device 10 may intermittently rotate the laminated substrate Ws using the substrate holding device 2. In this case, the generation of an ultrasound image by the ultrasound imaging device 32 may be performed while the imaging device moving mechanism 35 moves the ultrasound imaging device 32 in the radial direction of the laminated substrate Ws at a timing when the rotation of the laminated substrate Ws by the substrate holding device 2 is stopped.

[0079] FIG. 13 is a schematic diagram showing another embodiment of the substrate processing system 1. In the embodiments described so far, the application of filler F to the target coating area T of the laminated substrate Ws and the inspection of the filling state of the filler F applied to the target coating area T are performed by the substrate processing system 1 as a single module. The substrate processing system 1 of this embodiment includes a coating module 100 for applying filler F to the target coating area T of the laminated substrate Ws and an inspection module 200 for inspecting the filling state of the filler F applied to the target coating area T. The substrate processing system 1 also includes a transport device 300 for transporting the laminated substrate Ws between the coating module 100 and the inspection module 200. After the coating module 100 applies filler F to the target coating area T, the laminated substrate Ws is transported by the transport device 300 to the inspection module 200, where the inspection module 200 inspects the filling state of the filler F applied to the target coating area T.

[0080] 14 is a front view showing one embodiment of a coating module 100. The coating module 100 includes a substrate holding device 102 that holds the laminated substrate Ws in a vertical position and rotates the held laminated substrate Ws, a coating device 103 that applies filler F to the peripheral portion of the laminated substrate Ws, and a curing device 104 that hardens the filler F applied to the peripheral portion of the laminated substrate Ws. The substrate holding device 102 includes a holding stage 112 that holds the back surface of the laminated substrate Ws, a rotating shaft 113 connected to the center of the holding stage 112, and a rotation mechanism (not shown in FIG. 14 ) that rotates the holding stage 112 and the rotating shaft 113. The laminated substrate Ws is held in a vertical position by the substrate holding device 102.

[0081] The configurations and operations of the substrate holding device 102, the coating device 103, and the curing device 104 of this embodiment are similar to those of the substrate holding device 2, the coating device 3, and the curing device 4 of the above-described embodiment, and therefore redundant description thereof will be omitted. The coating module 100 further includes a first control device 110 that controls the operations of the substrate holding device 102, the coating device 103, and the curing device 104. The substrate holding device 102, the coating device 103, and the curing device 104 are electrically connected to the first control device 110. In one embodiment, the transport device 300 may be electrically connected to the first control device 110, and the operation of the transport device 300 may be controlled by the first control device 110.

[0082] The first control device 110 is composed of at least one computer. The first control device 110 includes a storage device 110a storing a program and a processing device 110b that executes calculations according to instructions included in the program. The storage device 110a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the processing device 110b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the first control device 110 is not limited to these examples.

[0083] 15 is a side view showing one embodiment of the inspection module 200. The inspection module 200 further includes a substrate holding device 202 that holds the laminated substrate Ws in a vertical position and rotates the held laminated substrate Ws, a substrate up-and-down movement mechanism 218 that moves the laminated substrate Ws held by the substrate holding device 202 up and down, a liquid tank 230 configured to hold a liquid L for locally immersing only the peripheral portion of the laminated substrate Ws, including the target application region T of the filler F, an ultrasonic imaging device 232 that generates an ultrasonic image of the target application region T of the laminated substrate Ws when immersed in the liquid L in the liquid tank 230, and a gas blower 240 (three gas blowers 240 in this embodiment) that blows gas G onto the laminated substrate Ws.

[0084] The substrate holding device 202 includes a holding stage 212 that holds the back surface of the laminated substrate Ws, a rotation shaft 213 connected to the center of the holding stage 212, and a rotation mechanism 215 that rotates the holding stage 212 and the rotation shaft 213. The laminated substrate Ws is held in a vertical position by the substrate holding device 202. The configurations and operations of the substrate holding device 202, substrate up-and-down movement mechanism 218, liquid vat 230, ultrasonic imaging device 232, and gas blower 240 of this embodiment are similar to those of the substrate holding device 2, substrate up-and-down movement mechanism 18, liquid vat 30, ultrasonic imaging device 32, and gas blower 40 of the above-described embodiment, and therefore, redundant description thereof will be omitted.

[0085] The inspection module 200 further includes a second control device 210 that controls the operations of the substrate holding device 202, the substrate vertical movement mechanism 218, and the gas blower 240. The substrate holding device 202, the substrate vertical movement mechanism 218, and the gas blower 240 are electrically connected to the second control device 210.

[0086] The second control device 210 is composed of at least one computer. The second control device 210 includes a storage device 210a in which a program is stored and a processing device 210b that executes calculations according to instructions included in the program. The storage device 210a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the processing device 210b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the second control device 210 is not limited to these examples.

[0087] In one embodiment, the second control device 210 may be configured integrally with the first control device 110. That is, the first control device 110 and the second control device 210 may be configured by at least one computer including a storage device in which a program is stored and a processing device that executes calculations according to instructions included in the program.

[0088] The ultrasonic imaging device 232 is configured to generate an ultrasonic image of the filler F applied to the target application area T of the laminated substrate Ws by the application module 100. The ultrasonic imaging device 232 generates an ultrasonic image while the laminated substrate Ws is rotated by the substrate holding device 202. This allows the ultrasonic imaging device 232 to scan the entire circumference of the target application area T and generate an ultrasonic image of the entire circumference of the target application area T. The ultrasonic imaging device 232 is electrically connected to the second control device 210, and the ultrasonic image of the entire circumference of the target application area T of the laminated substrate Ws generated by the ultrasonic imaging device 232 is sent to the second control device 210.

[0089] 11 and 12 , the inspection module 200 may further include an imaging device moving mechanism that moves the ultrasonic imaging device 232 in the radial direction of the laminated substrate Ws. In this case, the ultrasonic image may be generated by the ultrasonic imaging device 232 while the substrate holding device 202 rotates the laminated substrate Ws and while the imaging device moving mechanism moves the ultrasonic imaging device 232 in the radial direction of the laminated substrate Ws.

[0090] The second control device 210 is configured to determine the filling state of the filler F applied to the target application area T based on an ultrasound image of the target application area T. In one embodiment, the second control device 210 calculates the filling rate of the filler F in the target application area T based on the ultrasound image of the target application area T sent from the ultrasound imaging device 232, and determines the filling state of the filler F in the target application area T based on the calculated filling rate of the filler F in the target application area T. The operation of the second control device 210 of this embodiment to determine the filling state of the filler F in the target application area T is similar to that of the control device 10 of the above-described embodiment, and therefore a redundant description thereof will be omitted.

[0091] In one embodiment, when the second control device 210 determines that the filling state of the filler F in the target application area T is "incomplete," the transport device (not shown) transports the laminated substrate Ws again to the application module 100, and the application module 100 applies additional filler F to the target application area T of the laminated substrate Ws.

[0092] In one embodiment, the second control device 210 may detect position information of a portion of the target coating area T where the filler F has not been applied, based on an ultrasound image of the target coating area T. In this case, the second control device 210 may be electrically connected to the first control device 110, and the second control device 210 may send the detected position information to the first control device 110. The first control device 110 may perform additional application of filler F to the target coating area T when the portion of the target coating area T where the filler F has not been applied faces the filler discharge port of the syringe of the coating device 103, based on the position information sent from the second control device 210. The first control device 110 can adjust the position of the portion of the target coating area T of the laminated substrate Ws where the filler F has not been applied, relative to the filler discharge port of the syringe of the coating device 103, by controlling the operation of the rotation mechanism of the substrate holding device 102.

[0093] In one embodiment, the second control device 210 is electrically connected to a display device (not shown) provided in the inspection module 200, and may display on the display device an ultrasound image of the target application area T and / or a determination result of the filling state of the filler F into the target application area T. The display device may be located at a location remote from the inspection module 200.

[0094] 16 and 17 are flowcharts showing an embodiment of a method for inspecting the filling state of the filler F applied to the target application area T of the laminated substrate Ws by the substrate processing system 1 described with reference to FIGS. 13 to 15 . As shown in FIG. 16 , in step S201, the first control device 110 issues a command to the substrate holding device 102 of the coating module 100 to hold the laminated substrate Ws to be processed in a vertical position and rotate the held laminated substrate Ws. In step S202, the first control device 110 issues a command to the pressure adjustment device of the coating device 103 to supply gas from the gas supply source to the syringe of the coating device 103, causing the coating device 103 to apply the filler F to the target application area T of the laminated substrate Ws. The coating of the filler F by the coating device 103 is performed while the laminated substrate Ws is rotated by the substrate holding device 102.

[0095] In step S203, the first control device 110 issues a command to the curing device 104 to harden the filler F applied to the target application area T. The hardening of the filler F by the hardening device 104 is performed while the laminated substrate Ws is rotated by the substrate holding device 102. The application of the filler F to the target application area T by the coating device 3 and the hardening of the filler F by the hardening device 4 may be performed during one rotation of the laminated substrate Ws, or may be performed during multiple rotations of the laminated substrate Ws. In step S204, the first control device 110 issues a command to the substrate holding device 102 to stop the rotation of the laminated substrate Ws, thereby ending the coating process of the laminated substrate Ws by the coating module 100.

[0096] In step S205, the transport device 300 transports the stacked substrate Ws from the coating module 100 to the inspection module 200. In step S206, the second control device 210 issues a command to the substrate holding device 202 of the inspection module 200 to hold the stacked substrate Ws in a vertical position. In step S207, the second control device 210 issues a command to the substrate vertical movement mechanism 218 to lower the stacked substrate Ws held by the substrate holding device 202 so that only the peripheral edge of the stacked substrate Ws is locally immersed in the liquid L in the liquid tank 230. In step S208, the second control device 210 issues a command to the rotation mechanism 215 of the substrate holding device 202 to rotate the stacked substrate Ws held by the substrate holding device 202. In step S209, the second control device 210 issues a command to the gas blower 240 to blow the gas G onto the multilayer substrates Ws and start removing the liquid L adhering to the multilayer substrates Ws.

[0097] 17 , in step S210, the ultrasonic imaging device 232 generates an ultrasonic image of the entire circumference of the target coating area T of the stacked substrate Ws immersed in the liquid L in the liquid tank 230. The ultrasonic imaging device 232 generates an ultrasonic image of the entire circumference of the target coating area T while the substrate holding device 202 rotates the stacked substrate Ws. The ultrasonic image of the entire circumference of the target coating area T generated by the ultrasonic imaging device 232 is sent to the second control device 210. In step S211, the second control device 210 issues a command to the rotation mechanism 215 of the substrate holding device 202 to temporarily stop the rotation of the stacked substrate Ws held by the substrate holding device 202. In step S212, the second control device 210 issues a command to the substrate up-down movement mechanism 218 to raise the stacked substrate Ws immersed in the liquid L in the liquid tank 230 and pull the stacked substrate Ws out of the liquid tank 230.

[0098] In step S213, the second control device 210 issues a command to the rotation mechanism 215 of the substrate holding device 202 to rotate the laminated substrate Ws again. In step S214, after the liquid L adhering to the laminated substrate Ws pulled up from the liquid tank 230 is removed by the gas blower 240, the second control device 210 issues a command to the gas blower 240 to stop blowing the gas G onto the laminated substrate Ws. In step S215, the second control device 210 issues a command to the rotation mechanism 215 of the substrate holding device 202 to stop the rotation of the laminated substrate Ws.

[0099] In step S216, the second control device 210 determines the filling status of the target application area T with filler F based on the ultrasonic image of the target application area T of the laminated substrate Ws. In one embodiment, the second control device 210 calculates the filling rate of the filler F in the target application area T based on the ultrasonic image of the target application area T, and determines the filling status of the filler F in the target application area T based on the filling rate of the filler F in the target application area T. In one embodiment, the determination of the filling status of the filler F in the target application area T by the second control device 210 may be performed immediately after the generation of the ultrasonic image of the target application area T by the ultrasonic imaging device 232 in step S210.

[0100] In step S216, when the second control device 210 determines that the filling state of the filler F in the target coating area T is "filling completed" or "filling incomplete," the processing of the stacked substrates Ws by the substrate processing system 1 is terminated. In step S216, when the second control device 210 determines that the filling state of the filler F in the target coating area T is "filling incomplete," the transport device 300 transports the stacked substrates Ws to the coating module 100 again (step S217), and the processing flow returns to step S201. Thereafter, the operations of steps S201 to S216 are repeated.

[0101] According to this embodiment, by locally immersing only the peripheral portion of the laminated substrate Ws in the liquid L and generating an ultrasonic image of the target application area T immersed in the liquid L, it is possible to inspect the filling state of the filler F applied to the target application area T included in the peripheral portion of the laminated substrate Ws without immersing the entire laminated substrate Ws in the liquid L. As a result, it is possible to shorten the drying time of the laminated substrate Ws and suppress contamination of the laminated substrate due to watermarks and the like that occur after drying.

[0102] In addition, since the liquid L adhering to the laminated substrate Ws is removed by the gas blower 240 of the inspection module 200, there is no need to provide a separate drying process, thereby improving throughput. Furthermore, since the liquid L is removed by the gas blower 40 immediately after it adheres to the laminated substrate Ws, watermarks are less likely to occur.

[0103] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would be obvious to a person skilled in the art, and the technical concept of the present invention may be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical concept defined by the claims.

[0104] The present invention can be used in a technique for inspecting the filling state of a filler applied to a laminated substrate in which a plurality of substrates are bonded together.

[0105] REFERENCE SIGNS LIST 1 Substrate processing system 2 Substrate holding device 3 Coating device 4 Curing device 5 Inspection device 10 Control device 10a Storage device 10b Processing device 12 Holding stage 12a Holding surface 13 Rotation shaft 15 Rotation mechanism 18 Substrate up and down movement mechanism 21 Syringe 21a Filler discharge port 22 Piston 25 Gas supply line 26 Pressure adjustment device 30 Liquid tank 32 Ultrasonic imaging device 32a Ultrasonic probe 32b Image processing unit 33 Sealing member 35 Imaging device moving mechanism 40 Gas blower 100 Coating module 102 Substrate holding device 103 Coating device 104 Curing device 110 First control device 110a Storage device 110b Processing device 112 Holding stage 113 Rotation shaft 200 Inspection module 202 Substrate holding device 210 Second control device 210a Storage device 210b Processing device 212 Holding stage 213 Rotation axis 215 Rotation mechanism 218 Substrate vertical movement mechanism 230 Liquid tank 232 Ultrasonic imaging device 240 Gas blower

Claims

1. A substrate processing system for applying a filler to a peripheral portion of a laminated substrate formed by bonding a first substrate and a second substrate, comprising: a substrate holding device that holds and rotates the laminated substrate in a vertical position; a coating device that applies the filler to a target coating area included in the peripheral portion of the laminated substrate; and an inspection device that inspects the filling state of the filler applied to the target coating area, wherein the inspection device comprises a liquid tank configured to hold a liquid for locally immersing only the peripheral portion of the laminated substrate; and an ultrasonic imaging device that generates an ultrasonic image of the target coating area when immersed in the liquid.

2. The substrate processing system of claim 1, further comprising a curing device for curing the filler applied to the target application area, the curing device being disposed downstream of the application device and upstream of the ultrasonic imaging device in the rotation direction of the laminated substrate.

3. The substrate processing system according to claim 1, further comprising a control device that determines a filling state of the filler in the target application area based on the ultrasonic image.

4. The substrate processing system of claim 3, wherein the control device is configured to control the operation of the coating device and is configured to terminate the application of the filler to the target coating area based on the filling state.

5. The substrate processing system of claim 1, further comprising a gas blower that blows gas onto the laminated substrate to remove the liquid adhering to the laminated substrate, the gas blower being positioned downstream of the liquid tank in the direction of rotation of the laminated substrate.

6. An inspection module for inspecting the filling state of a filler applied to a peripheral portion of a laminated substrate formed by bonding a first substrate and a second substrate, comprising: a substrate holding device that holds and rotates the laminated substrate in a vertical position; a liquid tank configured to hold liquid for locally immersing only the peripheral portion of the laminated substrate including a target application area of ​​the filler; and an ultrasonic imaging device that generates an ultrasonic image of the target application area when immersed in the liquid.

7. The inspection module according to claim 6, further comprising an imaging device moving mechanism for moving the ultrasonic imaging device in a radial direction of the laminated substrate.

8. The inspection module according to claim 6, further comprising a gas blower that blows gas onto the laminated substrate to remove the liquid adhering to the laminated substrate, the gas blower being positioned downstream of the liquid tank in the direction of rotation of the laminated substrate.

9. The inspection module according to claim 6, further comprising a control device that determines a filling state of the filler in the target application area based on the ultrasound image.

10. A method for inspecting the filling state of a filler applied to a peripheral portion of a laminated substrate formed by joining a first substrate and a second substrate, comprising: holding the laminated substrate in a vertical position; locally immersing only the peripheral portion of the laminated substrate including a target application area of ​​the filler in liquid in a liquid tank; rotating the laminated substrate in a vertical position; and generating an ultrasonic image of the target application area immersed in the liquid using an ultrasonic imaging device.

11. The inspection method of claim 10, further comprising: generating the ultrasonic image of the target coating area while moving the ultrasonic imaging device in a radial direction of the laminate substrate.

12. The inspection method according to claim 10, further comprising blowing gas onto the laminated substrate with a gas blower to remove the liquid adhering to the laminated substrate, the gas blower being disposed downstream of the liquid tank in the rotation direction of the laminated substrate.

13. The inspection method according to claim 10, further comprising determining a filling state of the filler in the target application area based on the ultrasound image.

14. The inspection method described in claim 10, further comprising applying the filler to the target application area while rotating the laminated substrate in a vertical position, and generating the ultrasonic image by the ultrasonic imaging device while applying the filler to the target application area.

15. The inspection method according to claim 14, further comprising hardening the filler applied to the target application area by a curing device, the curing device being disposed downstream of the application device and upstream of the ultrasonic imaging device in the rotation direction of the laminated substrate.

16. The inspection method of claim 14, further comprising: determining a filling status of the filler in the target application area based on the ultrasound image; and terminating application of the filler to the target application area based on the filling status.

17. The inspection method of claim 14, further comprising: initiating generation of the ultrasonic image after initiating application of the filler; and further rotating the laminate substrate after stopping application of the filler to generate the ultrasonic image of the entire circumference of the target application area.

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