Defect detection system, method and apparatus, device, and storage medium

Abstract

A defect detection system, method and apparatus, a device, and a storage medium. The system comprises an objective table, a lighting subsystem, an imaging subsystem, a sensor and a processor. The lighting subsystem is connected to the processor, and the sensor is connected to the processor. The imaging subsystem is arranged on the objective table and is used for imaging an object to be inspected placed on the objective table. The lighting subsystem is arranged in an incident light path of the imaging subsystem, and the sensor is arranged in an imaging light path of the imaging subsystem. A target area of said object is located in an illumination area of the lighting subsystem.

Description

Defect detection system, method, device, equipment and storage medium

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 27, 2023, with application number 202311836488.7, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of optical detection technology, for example, to a defect detection system, method, apparatus, device and storage medium. Background Art

[0003] With the deepening and popularization of industrial automation and intelligence, the use of automatic optical inspection equipment (AOI) to replace traditional manual visual inspection has become a technological development trend.

[0004] AOI equipment typically includes an optical system, a material handling system, and a data processing system. The optical system primarily consists of an illumination system, an imaging lens, and a detector. The illumination system provides the light required for inspection, the imaging lens collects the optical signal from the target, and the detector converts the optical signal into a digital signal. However, due to the diverse design structures, different parts of the target often have different reflectivities. Therefore, during imaging, some areas may remain dark while others may be overexposed, seriously affecting inspection results.

[0005] Traditional AOI inspection equipment typically uses two methods to address this issue. One approach sacrifices detection effectiveness to ensure efficiency, specifically selecting an appropriate lighting intensity and accepting that some areas of the test result may be saturated or darkened. The other approach sacrifices detection efficiency to ensure detection effectiveness, specifically adjusting the lighting intensity and taking multiple photos of the target at different light intensities. The results are then processed using the appropriate light intensity for each area to obtain accurate detection results. However, multiple photos affect detection efficiency. Neither approach can guarantee both accuracy and efficiency.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a defect detection system, method, apparatus, device, and storage medium, which improve detection efficiency and ensure the accuracy of detection results.

[0008] In a first aspect, an embodiment of the present application provides a defect detection system, comprising:

[0009] An object stage, an illumination subsystem, an imaging subsystem, a sensor, and a processor; the illumination subsystem is connected to the processor, and the sensor is connected to the processor;

[0010] The imaging subsystem is arranged on the stage and is used to image the object to be inspected placed on the stage; the illumination subsystem is arranged on the incident light path of the imaging subsystem, and the sensor is arranged on the imaging light path of the imaging subsystem; the target area in the object to be inspected is located in the illumination area of ​​the illumination subsystem;

[0011] The processor is configured to control the lighting subsystem to illuminate the target area according to a first light intensity; the sensor is configured to capture an image of the first target area corresponding to the first light intensity; the processor is further configured to determine a second light intensity based on the first target area image and the first light intensity, and adjust the light intensity of the lighting subsystem according to the second light intensity to control the lighting subsystem to illuminate the target area according to the second light intensity; the sensor is further configured to capture an image of the second target area corresponding to the second light intensity; and the processor is further configured to perform defect detection based on the second target area image.

[0012] In a second aspect, an embodiment of the present application provides a defect detection method, comprising:

[0013] illuminating a target area of ​​the detected object with a first light intensity to obtain a first target area image corresponding to the first light intensity;

[0014] determining a second light intensity according to the first target area image and the first light intensity;

[0015] irradiating a target area of ​​the detected object with the second light intensity to obtain a second target area image corresponding to the second light intensity;

[0016] Defect detection is performed based on the second target area image.

[0017] In a third aspect, an embodiment of the present application further provides a defect detection device, the device comprising:

[0018] a first target area image acquisition module, configured to illuminate the target area of ​​the detected object with a first illumination intensity to obtain a first target area image corresponding to the first illumination intensity;

[0019] a light intensity determination module, configured to determine a second light intensity based on the first target area image and the first light intensity;

[0020] a second target area image obtaining module, configured to illuminate the target area of ​​the detected object with the second light intensity to obtain a second target area image corresponding to the second light intensity;

[0021] The defect detection module is configured to perform defect detection based on the second target area image.

[0022] In a fourth aspect, an embodiment of the present application further provides an electronic device, comprising:

[0023] at least one processor; and

[0024] a memory communicatively connected to the at least one processor; wherein,

[0025] The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can perform the defect detection method described in the embodiment of the present application.

[0026] In a fifth aspect, an embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the defect detection method described in the embodiment of the present application when executed. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1 is a schematic structural diagram of a defect detection system provided in Example 1 of the present application;

[0028] FIG2 is an exemplary diagram of a defect detection system provided in an embodiment of the present application;

[0029] FIG3 is a schematic diagram of the motion direction of the detected object relative to the imaging subsystem provided in an embodiment of the present application;

[0030] FIG4 is a flow chart of a defect detection method provided in Example 2 of the present application;

[0031] FIG5 is a schematic structural diagram of a defect detection device provided in Example 3 of the present application;

[0032] FIG6 is a schematic structural diagram of an electronic device provided in Example 4 of the present application. DETAILED DESCRIPTION

[0033] The present application is described below with reference to the accompanying drawings and embodiments.

[0034] Example 1

[0035] FIG1 is a schematic structural diagram of a defect detection system provided in Example 1 of the present application. This embodiment is applicable to defect detection of optical elements.

[0036] As shown in FIG1 , the defect detection system includes: a stage, an illumination subsystem, an imaging subsystem, a sensor, and a processor; the illumination subsystem is connected to the processor, and the sensor is connected to the processor.

[0037] The imaging subsystem is arranged on the stage and is used to image the object to be inspected placed on the stage; the lighting subsystem is arranged on the incident light path of the imaging subsystem, and the sensor is arranged on the imaging light path of the imaging subsystem; the target area in the object to be inspected is located in the illumination area of ​​the lighting subsystem.

[0038] In this embodiment, the imaging subsystem is a finite conjugate imaging subsystem or an infinite conjugate imaging subsystem. The number of illumination subsystems is one or two; accordingly, the number of sensors is one or two.

[0039] The illumination subsystem can be a light-emitting diode (LED), xenon lamp, laser lamp, etc., depending on the specific application. The imaging subsystem includes an objective lens and a tube lens, with the tube lens positioned above the objective lens. An infinite conjugate imaging subsystem can be one that inserts a transflective mirror between the objective lens and the tube lens to introduce illumination light, while a finite conjugate imaging subsystem can be one that inserts a transflective mirror below the objective lens to introduce illumination light. The sensor can be a device capable of capturing images, such as a camera.

[0040] In this embodiment, the working process of the defect detection system is as follows: the processor controls the lighting subsystem to illuminate the target area according to a first light intensity; the sensor collects an image of the first target area corresponding to the first light intensity; the processor is used to determine a second light intensity based on the first target area image and the first light intensity, and adjust the light intensity of the lighting subsystem according to the second light intensity to control the lighting subsystem to illuminate the target area according to the second light intensity; the sensor collects an image of the second target area corresponding to the second light intensity; and the processor performs defect detection based on the second target area image.

[0041] In another embodiment, there are two lighting subsystems, namely a first lighting subsystem and a second lighting subsystem, and there are two sensors, namely a first sensor corresponding to the first lighting subsystem and a second sensor corresponding to the second lighting subsystem.

[0042] The working process of the defect detection system is:

[0043] The target area is placed in the illumination area of ​​the first illumination subsystem, and the processor controls the first illumination subsystem to illuminate the target area according to the first illumination intensity; the first sensor collects the first target area image corresponding to the first illumination intensity; the processor is configured to determine the second illumination intensity based on the first target area image and the first illumination intensity, and adjust the position of the inspected object on the stage and / or the position of the inspected object in the imaging subsystem, so that the target area moves to the illumination area of ​​the second illumination subsystem; the processor adjusts the illumination intensity of the second illumination subsystem according to the second illumination intensity to control the second illumination subsystem to illuminate the target area according to the second light intensity; the second sensor collects the second target area image corresponding to the second light intensity; and the processor performs defect detection based on the second target area image.

[0044] In this embodiment, since the area of ​​the object to be inspected is usually much larger than the illumination area of ​​the lighting subsystem, such as a silicon wafer, when inspecting the entire object to be inspected, it is necessary to divide the object to be inspected into multiple target areas and inspect each target area separately. In the case of two lighting subsystems, during the inspection process, it is necessary to adjust the position of the object to be inspected on the stage and / or the position in the imaging subsystem so that the target area moves to the illumination area of ​​the second lighting subsystem. The position of the imaging subsystem can be fixed and the object to be inspected can be moved, or the position of the object to be inspected can be fixed and the imaging subsystem can be moved, so that the object to be inspected and the imaging subsystem finally form relative motion. In the case where the number of lighting subsystems is one, during the process of detecting the target area, the position of the object to be inspected on the stage and the position in the imaging subsystem remain unchanged.

[0045] FIG2 is an exemplary diagram of a defect detection system provided in an embodiment of the present application. As shown in FIG2 , the defect detection system includes a stage, an illumination subsystem 1, an illumination subsystem 2, an objective lens, a tube lens, a transflector, a reflector, a sensor 1, a sensor 2, and a processor. The illumination subsystem and the sensor are both connected to the processor.

[0046] For example, the light generated by illumination subsystems 1 and 2 passes through a transflective mirror and then an objective lens onto the stage, thereby forming two illumination areas. When an object to be inspected moves into the illumination area, the light reflected by the object passes through the objective lens, the transflective mirror, and the tube lens, and is then imaged by sensors 1 and 2. When the sensors receive light signals, they convert them into electrical signals, which are then converted into grayscale values, and then output as images.

[0047] Figure 3 is a schematic diagram illustrating the direction of motion of an object under inspection relative to the imaging subsystem, as provided in an embodiment of the present application. As shown in Figure 3, when the object under inspection is moving in a positive direction relative to the imaging subsystem, illumination subsystem 2 serves as the first illumination subsystem, and illumination subsystem 1 serves as the second illumination subsystem. When the object under inspection is moving in a negative direction relative to the imaging subsystem, illumination subsystem 1 serves as the first illumination subsystem, and illumination subsystem 2 serves as the second illumination subsystem.

[0048] Optionally, the illumination areas of the illumination subsystem 1 and the illumination subsystem 2 are of the same size and are symmetrically distributed about an axis orthogonal to the motion axis. The illumination areas are square, and one side of the square illumination area is parallel to the motion axis.

[0049] For example, assuming that the object to be detected is divided into three target areas, namely area 1, area 2 and area 3, in the process of detecting the target areas, positive detection can be performed on area 1, area 2 and area 3, or positive and negative detection can be interspersed.

[0050] Optionally, when forward detection is performed on areas 1, 2, and 3, lighting subsystem 2 is the first lighting subsystem and lighting subsystem 1 is the second lighting subsystem. Area 1 is placed in the illumination area of ​​lighting subsystem 2, and the processor controls lighting subsystem 2 to illuminate area 1 according to a first light intensity; sensor 2 collects an image of area 1 corresponding to the first light intensity; the processor is used to determine a second light intensity based on the image of area 1 and the first light intensity, and move area 1 to the illumination area of ​​lighting subsystem 1; the processor adjusts the light intensity of lighting subsystem 1 according to the second light intensity to control lighting subsystem 1 to illuminate area 1 according to the second light intensity; sensor 1 collects an image of area 1 corresponding to the second light intensity; the processor performs defect detection based on the image of area 1 collected by sensor 1. Similarly, for areas 2 and 3, defect detection is performed according to the above process.

[0051] Optionally, in the case of positive and negative interlaced detection of area 1, area 2 and area 3: first, area 1 is placed in the illumination area of ​​the lighting subsystem 2, and the processor controls the lighting subsystem 2 to illuminate area 1 according to the first light intensity; the sensor 2 collects an image of area 1 corresponding to the first light intensity; the processor is set to determine the second light intensity based on the image of area 1 and the first light intensity, and move area 1 to the illumination area of ​​the lighting subsystem 1; the processor adjusts the light intensity of the lighting subsystem 1 according to the second light intensity to control the lighting subsystem 1 to irradiate area 1 according to the second light intensity; the sensor 1 collects the image of area 1 corresponding to the second light intensity; the processor performs defect detection based on the image of area 1 collected by the sensor 1. Next, area 2 is placed in the illumination area of ​​the lighting subsystem 1, and the processor controls the lighting subsystem 1 to illuminate area 2 according to the first light intensity; the sensor 1 collects an image of area 2 corresponding to the first light intensity; the processor is configured to determine a second light intensity based on the image of area 2 and the first light intensity, and move area 2 to the illumination area of ​​the lighting subsystem 2; the processor adjusts the light intensity of the lighting subsystem 2 according to the second light intensity to control the lighting subsystem 2 to illuminate area 2 according to the second light intensity; the sensor 2 collects an image of area 2 corresponding to the second light intensity; and the processor performs defect detection based on the image of area 2 collected by the sensor 2. Finally, area 3 is placed in the illumination area of ​​lighting subsystem 2, and the processor controls lighting subsystem 2 to illuminate area 3 according to a first light intensity; sensor 2 collects an image of area 3 corresponding to the first light intensity; the processor is configured to determine a second light intensity based on the image of area 3 and the first light intensity, and move area 3 to the illumination area of ​​lighting subsystem 1; the processor adjusts the light intensity of lighting subsystem 1 according to the second light intensity to control lighting subsystem 1 to illuminate area 3 according to the second light intensity; sensor 1 collects an image of area 3 corresponding to the second light intensity; and the processor performs defect detection based on the image of area 3 collected by sensor 1.

[0052] The technical solution of this embodiment uses a processor to control the illumination subsystem to illuminate a target area at a first light intensity. A sensor then captures an image of the first target area corresponding to the first light intensity. Based on the first target area image and the first light intensity, the processor determines a second light intensity and adjusts the illumination subsystem's light intensity to illuminate the target area at the second light intensity. The sensor then captures an image of the second target area corresponding to the second light intensity, and the processor performs defect detection based on the second target area image. This ensures the accuracy of detection results and improves detection efficiency.

[0053] Example 2

[0054] FIG4 is a flow chart of a defect detection method provided in Example 2 of the present application. This embodiment is applicable to defect detection of optical components. The method can be performed by a defect detection device, which can be implemented in the form of software and / or hardware. Optionally, it can be implemented by an electronic device, which can be a mobile terminal, a personal computer (PC), or a server. Specifically, the method includes the following steps:

[0055] S110 , irradiating a target area of ​​the detected object with a first light intensity to obtain a first target area image corresponding to the first light intensity.

[0056] In this embodiment, the target area of ​​the detected object is illuminated by the illumination subsystem according to the first illumination intensity, and the first target area image corresponding to the first illumination intensity is obtained by the sensor.

[0057] S120: Determine a second light intensity according to the first target area image and the first light intensity.

[0058] In this embodiment, the second light intensity may be determined according to the first target area image and the first light intensity by extracting the brightness value of each pixel in the first target area image; and determining the second light intensity based on the brightness value and the first light intensity.

[0059] For example, assuming the first illumination intensity is I1, the actual brightness value is a, and the expected brightness value is b, the second illumination intensity I2 is obtained according to the formula I2=b / a*K*I1. The coefficient K is calibrated in advance.

[0060] S130 , irradiating a target area of ​​the detected object with a second light intensity to obtain a second target area image corresponding to the second light intensity.

[0061] In this embodiment, the target area of ​​the detected object is illuminated by the illumination subsystem according to the second illumination intensity, and the second target area image corresponding to the second illumination intensity is obtained by the sensor.

[0062] S140: Perform defect detection based on the second target area image.

[0063] For example, defect detection is performed on the second target area image to detect whether the inspected object has dimensional deviations or surface defects that may cause the product to not meet standard specifications. Surface defects include pitting, scratches, chipping, bubbles, stains, impurities, etc.

[0064] The technical solution of this embodiment is to illuminate the target area of ​​the detected object with a first light intensity to obtain a first target area image corresponding to the first light intensity; determine a second light intensity based on the first target area image and the first light intensity; illuminate the target area of ​​the detected object with the second light intensity to obtain a second target area image corresponding to the second light intensity; and perform defect detection based on the second target area image. The defect detection method provided in the embodiment of the present application obtains the second light intensity based on the first target area image and the first light intensity, and illuminates the target area of ​​the detected object with the second light intensity to obtain a second target area image, and then performs defect detection on the second target area image, thereby ensuring the accuracy of the detection results and improving the detection efficiency.

[0065] Example 3

[0066] FIG5 is a schematic diagram of the structure of a defect detection device provided in Example 3 of the present application. As shown in FIG5 , the device includes:

[0067] A first target area image obtaining module 210 is configured to illuminate the target area of ​​the detected object with a first light intensity to obtain a first target area image corresponding to the first light intensity;

[0068] an illumination intensity determination module 220 configured to determine a second illumination intensity based on the first target area image and the first illumination intensity;

[0069] A second target area image obtaining module 230 is configured to illuminate the target area of ​​the detected object with a second illumination intensity to obtain a second target area image corresponding to the second illumination intensity;

[0070] The defect detection module 240 is configured to perform defect detection based on the second target area image.

[0071] Optionally, the illumination intensity determination module 220 is further configured to:

[0072] Extracting the brightness value of each pixel in the first target area image; and determining the second illumination intensity based on the brightness value and the first illumination intensity.

[0073] The above device can execute the methods provided by all the above embodiments of this application, and has the functional modules and effects corresponding to the execution of the above methods. For technical details not fully described in this embodiment, please refer to the methods provided by all the above embodiments of this application.

[0074] Example 4

[0075] FIG6 shows a block diagram of an electronic device 10 that can be used to implement an embodiment of the present application. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and / or required herein.

[0076] As shown in FIG6 , the electronic device 10 includes at least one processor 11 and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12 and a random access memory (RAM) 13. The memory stores a computer program that can be executed by the at least one processor, and the processor 11 can perform a variety of appropriate actions and processes according to the computer program stored in the ROM 12 or the computer program loaded from the storage unit 18 into the RAM 13. Various programs and data required for the operation of the electronic device 10 can also be stored in the RAM 13. The processor 11, ROM 12, and RAM 13 are connected to each other via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0077] Multiple components in the electronic device 10 are connected to the I / O interface 15, including an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a magnetic disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0078] Processor 11 can be a variety of general-purpose and / or specialized processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the methods and processes described above, such as the defect detection method.

[0079] In some embodiments, the defect detection method may be implemented as a computer program tangibly embodied in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the defect detection method described above may be performed. Alternatively, in other embodiments, processor 11 may be configured to perform the defect detection method in any other suitable manner (e.g., via firmware).

[0080] Various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard parts (ASSPs), system on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0081] Computer programs for implementing the methods of the present application may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0082] In the context of the present application, computer-readable storage medium can be a tangible medium that can contain or store a computer program for use by an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage medium can include but is not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage medium can be a machine-readable signal medium. A more specific example of a machine-readable storage medium can include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory RAM, a read-only memory ROM, an erasable programmable read-only memory (EPROM) or a flash memory, an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device or any suitable combination of the foregoing.

[0083] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a cathode ray tube (CRT) or a liquid crystal display (LCD) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0084] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with embodiments of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0085] A computing system may include a client and a server. The client and server are generally remote from each other and typically interact via a communication network. The client-server relationship arises through computer programs running on the respective computers and establishing a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, a host product within a cloud computing service ecosystem that addresses the management difficulties and limited business scalability of traditional physical hosts and virtual private servers (VPS).

[0086] The various forms of processes shown above can be used to reorder, add, or delete steps. For example, the multiple steps described in this application can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of this application can be achieved. This document is not limited here.

Claims

1. A defect detection system, comprising: A stage, an illumination subsystem, an imaging subsystem, a sensor, and a processor; The illumination subsystem is connected to the processor, and the sensor is connected to the processor; The imaging subsystem is disposed above the stage and is configured to image a detected object placed on the stage; the illumination subsystem is disposed on the incident light path of the imaging subsystem, and the sensor is disposed on the imaging light path of the imaging subsystem; a target area in the detected object is located in the irradiation area of the illumination subsystem; The processor is configured to control the illumination subsystem to irradiate the target area with a first light intensity; the sensor is configured to acquire a first target area image corresponding to the first light intensity; the processor is further configured to determine a second light intensity based on the first target area image and the first light intensity, and adjust the light intensity of the illumination subsystem according to the second light intensity to control the illumination subsystem to irradiate the target area with the second light intensity; the sensor is further configured to acquire a second target area image corresponding to the second light intensity; the processor is further configured to perform defect detection based on the second target area image.

2. The system according to claim 1, wherein The number of the illumination subsystems is one or two; the number of the sensors is one or two.

3. The system according to claim 2, wherein When the number of the illumination subsystems is one and the number of the sensors is one, during the process of detecting the target area, the position of the detected object on the stage and the position of the imaging subsystem remain unchanged.

4. The system according to claim 2, wherein, The number of the illumination subsystems is two, namely a first illumination subsystem and a second illumination subsystem; the number of the sensors is two, namely a first sensor corresponding to the first illumination subsystem and a second sensor corresponding to the second illumination subsystem; The processor is configured to place the target area in the irradiation area of the first illumination subsystem and control the first illumination subsystem to irradiate the target area with a first light intensity; The first sensor is configured to acquire a first target area image corresponding to the first light intensity; The processor is further configured to determine a second light intensity based on the first target area image and the first light intensity, and adjust at least one of the position of the detected object on the stage and the position of the detected object in the imaging subsystem, so that the target area moves to the irradiation area of the second illumination subsystem; And the processor adjusts the light intensity of the second illumination subsystem according to the second light intensity to control the second illumination subsystem to irradiate the target area with the second light intensity; The second sensor is configured to acquire a second target area image corresponding to the second light intensity; The processor is further configured to perform defect detection based on the second target area image.

5. The system according to claim 1, wherein The imaging subsystem is a finite conjugate imaging subsystem or an infinite conjugate imaging subsystem.

6. A defect detection method, which is executed by the defect detection system according to any one of claims 1-5, and includes: Irradiate the target area of the object to be detected with a first light intensity to obtain a first target area image corresponding to the first light intensity; Determine a second light intensity according to the first target area image and the first light intensity; Irradiate the target area of the object to be detected with the second light intensity to obtain a second target area image corresponding to the second light intensity; Perform defect detection based on the second target area image.

7. The method according to claim 6, wherein Determining the second light intensity according to the first target area image and the first light intensity includes: Extract the brightness value of each pixel point in the first target area image; Determine the second light intensity based on the brightness value and the first light intensity.

8. A defect detection device, comprising: A first target area image acquisition module configured to irradiate the target area of the object to be detected with a first light intensity to obtain a first target area image corresponding to the first light intensity; A light intensity determination module configured to determine a second light intensity according to the first target area image and the first light intensity; A second target area image acquisition module configured to irradiate the target area of the object to be detected with the second light intensity to obtain a second target area image corresponding to the second light intensity; A defect detection module configured to perform defect detection based on the second target area image.

9. An electronic device, the electronic device comprising: At least one processor; And A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the defect detection method according to any one of claims 6 and 7.

10. A computer-readable storage medium, the computer-readable storage medium stores computer instructions, and the computer instructions are used to cause a processor to implement the defect detection method according to any one of claims 6 and 7 when executed.

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