Electronic device, and composite board and preparation method therefor

Abstract

The embodiments of the present application relate to the field of board structures. Disclosed are an electronic device, and a composite board and a preparation method therefor, which aim to improve the electrical conductivity of the composite board. In a specific solution, the composite board comprises a composite layer, a carbon fiber filament layer, an electrically conductive layer and a ground plate. The composite layer is provided with a slot structure; and the carbon fiber filament layer is buried in the composite layer, and part of the carbon fiber filament layer is located in the slot structure. The electrically conductive layer and the composite layer are stacked, and the electrically conductive layer covers at least part of the slot structure and is electrically connected to the carbon fiber filament layer. The side of the electrically conductive layer that is away from the composite layer is electrically connected to the ground plate. The electrically conductive layer and the carbon fiber filament layer are electrically connected. The provision of the slot structure and the electrically conductive layer enables the carbon fiber filament layer buried in the composite layer to be electrically connected to the ground plate. Thus, electric charges in the whole carbon fiber filament layer can flow to the ground plate via the electrically conductive layer. Moreover, the whole carbon fiber filament layer has an electromagnetic compatibility protection effect. When the composite board is applied to an electronic device, the electromagnetic compatibility protection performance of the electronic device can be improved.

Description

Electronic device, composite board and preparation method thereof

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on December 28, 2023, with application number 202311847818.2 and application name “Electronic device, composite board and preparation method thereof”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of plate structures, and in particular to an electronic device, a composite plate and a preparation method thereof. Background Art

[0003] Electronic devices (such as mobile phones) require a large amount of sheet materials. For example, the back cover and midframe of electronic devices are made of sheet materials. The excellent performance of the sheet materials directly affects the performance of the electronic devices. For example, current sheet materials often suffer from poor electrical conductivity, which directly affects the application of sheet materials in electronic devices.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide an electronic device, a composite board, and a method for preparing the same, aiming to improve the conductive performance of the composite board.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions.

[0007] In a first aspect, embodiments of the present application provide a composite panel. The composite panel comprises a composite layer, a first carbon fiber layer, a conductive layer, and a floor panel. The composite layer has a slot structure; the first carbon fiber layer is embedded within the composite layer, with a portion of the first carbon fiber layer located within the slot structure. A conductive layer is stacked on the composite layer, covering at least a portion of the slot structure and electrically connected to the first carbon fiber layer. The side of the conductive layer facing away from the composite layer is electrically connected to the floor panel. This provides electrical continuity between the conductive layer and the first carbon fiber layer. The slot structure and the conductive layer electrically connect the first carbon fiber layer embedded within the composite layer to the floor panel, allowing all charges within the entire first carbon fiber layer to flow through the conductive layer to the floor panel. Furthermore, the conductive layer covers at least a portion of the slot structure and is electrically connected to the first carbon fiber layer within the slot structure, ensuring that the entire first carbon fiber layer provides electromagnetic compatibility (EMC) protection. Furthermore, the first carbon fiber layer has excellent support and ductility. This composite panel can fully utilize the excellent support and ductility of the first carbon fiber layer to provide support for other components, while also ensuring that the composite panel provides EMC protection. When the composite board is applied to electronic equipment, the electromagnetic compatibility protection performance of the electronic equipment can be improved.

[0008] In conjunction with the first aspect, in some achievable embodiments, the composite panel further includes: a second carbon fiber layer embedded within the composite layer and stacked with the first carbon fiber layer, wherein the second carbon fiber layer and the first carbon fiber layer are arranged in non-parallel directions. Thus, charge can flow between the first carbon fiber layer and the second carbon fiber layer, and the second carbon fiber layer can be electrically connected to the floor via the conductive layer. The non-parallel arrangement of the second carbon fiber layer and the first carbon fiber layer can increase the tensile strength of the composite panel in multiple directions.

[0009] In combination with the first aspect, in some achievable manners, the second carbon fiber filament layer is closer to the conductive layer than the first carbon fiber filament layer, and the groove structure runs through the second carbon fiber filament layer.

[0010] In conjunction with the first aspect, in some achievable embodiments, the composite panel further comprises: a first glass fiber layer embedded within the composite layer and stacked with the first carbon fiber layer, the first glass fiber layer being further away from the conductive layer than the first carbon fiber layer. The first glass fiber layer can improve the tensile strength of the composite panel. Furthermore, the first carbon fiber layer with excellent electrical conductivity overcomes the problems of the first glass fiber layer with poor electrical conductivity, thereby providing the composite panel with electromagnetic compatibility protection.

[0011] In conjunction with the first aspect, in some achievable embodiments, the first glass fiber layer and the first carbon fiber layer are arranged in non-parallel directions. Thus, the composite panel has excellent ductility along the arrangement direction of the first glass fiber layer. The composite panel also has excellent ductility along the arrangement direction of the first carbon fiber layer.

[0012] In combination with the first aspect, in some achievable embodiments, the composite plate further comprises: a second glass fiber layer, embedded in the composite layer and stacked with the first carbon fiber layer, the second glass fiber layer being closer to the conductive layer than the first carbon fiber layer; and the groove structure passing through the second glass fiber layer. Thus, the connecting portion of the conductive layer passes through the second glass fiber layer and is partially electrically connected to the first carbon fiber layer. The conductive layer passing through the second glass fiber layer having poor electrical conductivity enables the first carbon fiber layer having conductive properties to have electromagnetic compatibility protection and antistatic effects, thereby enabling the support plate to have electromagnetic compatibility protection and antistatic effects.

[0013] In combination with the first aspect, in some feasible embodiments, the arrangement directions of the second glass fiber layer and the first carbon fiber layer are not parallel; thus, the composite panel has excellent ductility in the arrangement directions of the second glass fiber layer and the first carbon fiber layer.

[0014] In combination with the first aspect, in some feasible embodiments, the composite plate further includes: a third carbon fiber layer, embedded in the composite layer, the third carbon fiber layer is stacked on the side of the second glass fiber layer away from the first carbon fiber layer, and the groove structure passes through the third carbon fiber layer. Thus, the provision of the third carbon fiber layer can increase the ductility of the support plate. In addition, since the groove structure passes through the third carbon fiber layer, part of the side wall of the groove structure is formed by the third carbon fiber layer. And because the conductive layer covers part of the groove structure, the conductive layer will also pass through the third carbon fiber layer and be connected to the third carbon fiber layer. Therefore, the conductive layer electrically connects the first carbon fiber layer and the third carbon fiber layer. The presence of the second glass fiber layer with poor conductive performance does not affect the electromagnetic compatibility protection performance of the composite plate.

[0015] In conjunction with the first aspect, in some achievable embodiments, the third carbon fiber layer and the second glass fiber layer are arranged in non-parallel directions, thereby enabling the composite panel to have excellent ductility in both the arrangement directions of the third carbon fiber layer and the second glass fiber layer.

[0016] In conjunction with the first aspect, in some achievable embodiments, the composite panel further includes: a third glass fiber layer embedded in the composite layer, the third glass fiber layer being arranged side by side with the first carbon fiber layer, thereby extending the length of the composite layer.

[0017] In combination with the first aspect, in some achievable embodiments, the conductive layer is a coating or a plating layer.

[0018] In conjunction with the first aspect, in some possible implementations, the composite board further comprises a conductive film connected to a side of the conductive layer remote from the composite layer, and the floor panel is electrically connected to a side of the conductive film remote from the conductive layer. Thus, the conductive film can increase the thickness of the conductive structure on the surface of the support board. Furthermore, the conductive film and the conductive layer can be formed using different processes, providing multiple options for fabricating the support board.

[0019] In a second aspect, an embodiment of the present application provides a composite plate. The composite plate includes a composite layer, a carbon fiber layer, a conductive layer, and a floor. The composite layer has a plurality of pores, and a plurality of the pores are connected. Embedded in the composite layer, part of the carbon fiber layer is located in the pore. Stacked with the composite layer; the conductive layer includes a plurality of conductive continuous phase structures, a plurality of the conductive continuous phase structures are connected, and part of the conductive continuous phase structure is located in the pore and electrically connected to the carbon fiber layer. Part of the conductive continuous phase structure is located outside the composite layer and electrically connected to the floor. Thus, the conductive continuous phase structure of the conductive layer extends into the pores to release the charge on the carbon fiber layer to the floor outside the composite layer, thereby preventing the static electricity generated on the carbon fiber layer from affecting other electronic devices (such as antennas).

[0020] In conjunction with the second aspect, in some achievable embodiments, the conductive layer is formed using a physical vapor deposition process. The conductive continuous phase structure formed by the physical vapor deposition process can pass through the pores in the composite layer and electrically connect with the carbon fiber layer, thereby improving the electrical performance of the composite board.

[0021] In a third aspect, embodiments of the present application provide an electronic device. The electronic device comprises a printed circuit board and any of the composite boards provided in the first and second aspects. The floor is disposed on the printed circuit board. Because the composite board has excellent electrical conductivity and electromagnetic compatibility protection, the housing containing the composite board also has electromagnetic compatibility protection, thereby ensuring the electrical performance of the electronic device.

[0022] In combination with the third aspect, in some feasible embodiments, the electronic device further includes: a middle frame, a display screen, and a back cover; the display screen and the back cover are both connected to the middle frame, and the middle frame and the printed circuit board are both located between the display screen and the back cover; wherein, at least one of the middle frame, the display screen, and the back cover includes the composite board.

[0023] In a fourth aspect, an embodiment of the present application provides a method for preparing a composite board. The method comprises: forming a groove structure on the surface of a composite layer; embedding a first carbon fiber filament layer in the composite layer, and partially positioning the first carbon fiber filament layer in the groove structure. Coating or plating the surface of the composite layer to form a conductive layer; wherein the conductive layer is stacked with the composite layer, the conductive layer covers at least a portion of the groove structure and is electrically connected to the first carbon fiber filament layer. The side of the conductive layer away from the composite layer is electrically connected to the floor. Thus, the preparation method can relatively accurately locate the position of the groove structure on the composite layer, thereby relatively accurately obtaining the connection position of the conductive layer and the first carbon fiber filament layer. The composite board obtained by the preparation method has the advantage of accurate positioning of the groove structure.

[0024] In conjunction with the fourth aspect, in some achievable embodiments, before forming the groove structure on the surface of the composite layer, the method further includes: inserting the first carbon fiber filament layer into the glue to form a prefabricated layer; and curing the prefabricated layer to form the composite layer. The method for preparing the composite layer is simple.

[0025] In conjunction with the fourth aspect, in some achievable embodiments, extending the first carbon fiber layer into the glue to form a prefabricated layer includes: extending the first carbon fiber layer into the glue; extending the first glass fiber layer into the glue to form the prefabricated layer; and coating or plating the surface of the composite layer to form a conductive layer includes: coating or plating the surface of the composite layer to form a conductive layer so that the first glass fiber layer is further away from the conductive layer than the first carbon fiber layer. Thus, the preparation method can embed the first glass fiber layer in the composite layer, and the provision of the first glass fiber layer does not affect the electrical connection between the conductive layer and the first carbon fiber layer.

[0026] In combination with the fourth aspect, in some feasible ways, extending the first carbon fiber layer into the glue to form a prefabricated layer includes: extending the first carbon fiber layer into the glue. Extending the second glass fiber layer into the glue to form the prefabricated layer. Forming the groove structure on the surface of the composite layer includes: forming a groove structure on the surface of the composite layer, so that the groove structure passes through the second glass fiber layer, and part of the first carbon fiber layer is located in the groove structure. Thus, the preparation method can bury the second glass fiber layer in the composite layer, the groove structure passing through the second glass fiber layer, and the conductive layer covering at least part of the groove structure to connect the first carbon fiber layer and the external circuit of the composite layer. Overcome the problem of poor conductivity of the second glass fiber layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1 is a schematic structural diagram of an electronic device.

[0028] FIG2 a is a schematic structural diagram of a housing and a printed circuit board of an electronic device.

[0029] FIG2 b is a schematic structural diagram of a display screen and a printed circuit board.

[0030] FIG3 a is a schematic structural diagram of a support plate provided in an embodiment of the present application.

[0031] FIG3 b is a schematic diagram of the exploded structure of the support plate shown in FIG3 a .

[0032] FIG3 c is a schematic structural diagram of another support plate provided in an embodiment of the present application.

[0033] FIG4 is a schematic structural diagram of another support plate provided in an embodiment of the present application.

[0034] FIG5 a is a schematic structural diagram of another support plate provided in an embodiment of the present application.

[0035] FIG5 b is a schematic diagram of the decomposed structure of the conductive layer and the composite layer in FIG5 a .

[0036] FIG6 is a schematic diagram of the structure of the composite layer and the conductive layer provided in an embodiment of the present application.

[0037] FIG7 is a schematic structural diagram of another support plate provided in an embodiment of the present application.

[0038] FIG8 is a schematic structural diagram of a first carbon fiber yarn layer and a third glass fiber yarn layer provided in an embodiment of the present application, arranged side by side.

[0039] FIG9 is another structural schematic diagram of the support plate provided in an embodiment of the present application.

[0040] FIG10 a is a schematic structural diagram of another conductive layer and composite layer provided in an embodiment of the present application.

[0041] FIG10 b is an enlarged schematic diagram of point D in FIG10 a .

[0042] FIG10c is an enlarged schematic diagram of point E in FIG10b.

[0043] FIG10 d is an electron microscope image of the support plate in FIG10 a .

[0044] FIG. 11 a is a process flow chart of a composite plate including the support plate in FIG. 4 .

[0045] FIG. 11 b is a schematic diagram of the structure after step s1 in FIG. 11 a is executed.

[0046] FIG. 12 a is a flow chart of a process for forming a composite layer.

[0047] FIG12b is a schematic structural diagram of executing s11 in FIG12a.

[0048] FIG12c is a schematic diagram of the structure of executing s12 in FIG12a.

[0049] FIG12d is a schematic diagram of the structure of executing s13 in FIG12a.

[0050] FIG12e is a schematic diagram of the structure after s13 in FIG12a is executed.

[0051] In the figure: 10-electronic device; 11-cover plate; 12-display screen; 13-printed circuit board; 14-middle frame; 15-back cover; 16-frame; 20-composite board; 101-floor; 100-support plate; 102-auxiliary board; 103-conductive member; 104-gap; 110-composite layer; 111-slot structure; 112-opening; 113-slot bottom wall; 120-conductive layer; 121-connecting portion; 122-extension portion; 130-first carbon fiber layer; 131-first carbon fiber filament; 140-second carbon fiber layer; 141 -second carbon fiber filament; 150-first glass fiber filament layer; 151-first glass fiber filament; 160-second glass fiber filament layer; 170-third carbon fiber filament layer; 180-fourth glass fiber filament layer; 202-fifth glass fiber filament layer; 201-third glass fiber filament layer; 203-conductive film; 210-conductive layer; 211-conductive continuous phase structure; 115-pores; 220-carbon fiber filament layer; 221-carbon fiber filament; 17-glue; 18-prefabricated layer; 001-support member; 002-back film; 003-display panel. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0053] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0054] Secondly, in the embodiments of the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to changes in the orientation of the components in the drawings.

[0055] In addition, in the embodiments of the present application, connection / connected: can refer to a mechanical connection relationship or a physical connection relationship, that is, A and B are connected or A and B are connected, which can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and A and B are difficult to separate.

[0056] The embodiments of the present application provide an electronic device, which may be a terminal device having an antenna and an electrical connector. The electronic device may be implemented in various forms, including but not limited to a mobile phone, a tablet computer, a desktop computer, a laptop computer, a PDA (personal digital assistant), a wearable device, a display device (such as a television), an information display device, or a smart home terminal. In the embodiments of the present application, the electronic device is described as a mobile phone.

[0057] Figure 1 is a schematic diagram of the structure of an electronic device 10. As shown in Figure 1, electronic device 10 may include a cover 11, a display 12, a printed circuit board (PCB) 13, a middle frame 14, and a rear housing 15. In some embodiments, rear housing 15 is also called a rear cover. Cover 11, display 12, and rear housing 15 are stacked.

[0058] The cover plate 11 can be placed closely against the display screen 12 to protect and prevent dust from forming on the display screen 12. The cover plate 11 can be made of glass or other materials, such as ultra-thin glass or PET.

[0059] The display screen 12 may include a liquid crystal display (LCD), a light emitting diode (LED), or an organic light emitting diode (OLED) display panel, etc., and this application does not limit this. The types of the display screen 12 include, but are not limited to, a water drop screen, a notch screen, a full screen, or a punch-hole screen.

[0060] The middle frame 14 supports the entire device. The printed circuit board 13 shown in FIG1 is disposed between the middle frame 14 and the rear housing 15. It should be understood that in some embodiments, the printed circuit board 13 may also be disposed between the middle frame 14 and the display screen 12. This embodiment of the present application does not limit this.

[0061] For example, the electronic device 10 may further include a battery (not shown). The battery may be disposed between the middle frame 14 and the rear housing 15, or between the middle frame 14 and the display screen 12, which is not limited in this application.

[0062] For example, the printed circuit board 13 carries electronic components, such as a radio frequency chip. In some embodiments, components such as input buttons, a transmitter, a processor, a memory, a battery, a charging circuit, and a system on chip (SoC) structure can be mounted on or connected to the printed circuit board 13.

[0063] In some embodiments, the printed circuit board 13 is divided into a main board and a sub-board, and the battery can be arranged between the main board and the sub-board, wherein the main board can be arranged between the middle frame 14 and the upper edge of the battery, and the sub-board can be arranged between the middle frame 14 and the lower edge of the battery.

[0064] In some embodiments, electronic device 10 may further include a frame 16, which may be formed of a conductive material such as metal. Frame 16 may be disposed between display screen 12 and rear housing 15 and extend circumferentially around display screen 12. Frame 16 may have four sides surrounding display screen 12, and the four sides may help secure display screen 12.

[0065] In Figure 1 , the frame 16 and the middle frame 14 are connected as an integrally formed part, and together they support the entire electronic device 10. The rear housing 15 and the cover 11 are respectively attached along opposite sides of the frame 16 to form the outer shell or housing of the electronic device. In other embodiments, the frame 16 and the middle frame 14 may be connected by means of spring clips, screws, welding, or the like.

[0066] In some embodiments, the rear housing 15, cover 11, bezel 16, and middle frame 14 may be collectively referred to as the outer shell or housing of the electronic device 10. It should be understood that the term "outer shell or housing" may refer to part or all of any one of the rear housing 15, cover 11, bezel 16, and middle frame 14, or to part or all of any combination of the rear housing 15, cover 11, bezel 16, and middle frame 14. In the embodiments of the present application, the rear housing 15 is described as the outer shell of the electronic device 10 as an example.

[0067] In some embodiments of the present application, the electronic device 10 further includes a floor 101. The floor 101 may generally refer to at least a portion of any grounding layer, or grounding plate, or grounding metal layer, etc., in an electronic device (such as a mobile phone), or at least a portion of any combination of any of the above-mentioned grounding layers, or grounding plates, or grounding components, etc. The floor 101 may be used for grounding components in the electronic device 10. Exemplarily, the floor 101 may include a grounding layer of a printed circuit board 13, a grounding metal layer formed by a metal film on the side of the display screen 12 facing the rear housing 15, a conductive grounding layer of a battery, and conductive parts or metal parts electrically connected to the above-mentioned grounding layer / grounding plate / metal layer. The embodiments of the present application are described by taking the floor 101 as the grounding layer of the printed circuit board 13 as an example.

[0068] The electronic device 10 also includes a composite panel 20, which can be provided at multiple locations on the electronic device 10. For example, the composite panel 20 can be provided on at least one of the rear housing 15, the display screen 12, and the middle frame 14. In other words, in some embodiments, the rear housing 15 includes the composite panel 20. In some embodiments, the display screen 12 includes the composite panel 20. In some embodiments, the middle frame 14 includes the composite panel 20. It will be appreciated that including the composite panel 20 in the rear housing 15, the display screen 12, and the middle frame 14 does not conflict with each other. Depending on the needs, one or both of the composite panels 20 can be provided, or all of them can be provided.

[0069] Figure 2a is a structural diagram of a housing and a printed circuit board 13 of an electronic device. In Figure 2a, the rear shell 15 is electrically connected to the floor 101. In other words, the rear shell 15 is grounded to the floor 101. Therefore, the charge (such as static electricity) on the rear shell 15 can be discharged to the floor 101, avoiding the influence of static electricity on other structures (such as display screens or antennas). In addition, when the user holds or touches the rear shell 15 of the electronic device, the static electricity of the rear shell 15 is discharged to the floor 101, which can avoid the static electricity from being discharged to the user and affecting the user experience. In addition, the rear shell 15 is grounded, so that the rear shell 15 has an electromagnetic compatibility (EMC) protection function, thereby improving the electrical performance of the electronic device. Alternatively, in some embodiments, part of the antenna of the electronic device or the entire antenna can be integrated on the rear shell 15, so that the rear shell 15 can also take into account the function of the antenna.

[0070] Since the rear housing 15 is electrically connected to the floor 101, the portion of the rear housing 15 that is connected to the floor 101 needs to be conductive. In some embodiments, the rear housing 15 includes a support plate 100 and an auxiliary plate 102 that are connected. The support plate 100 is conductive and electrically connected to the floor 101.

[0071] The embodiments of the present application do not limit the conductive properties of the auxiliary plate 102. For example, the auxiliary plate 102 may be conductive, or the auxiliary plate 102 may not be conductive. The embodiments of the present application do not limit the connection method between the auxiliary plate 102 and the support plate 100. For example, the auxiliary plate 102 and the support plate 100 may be bonded, welded, screwed, or clamped. In embodiments where the auxiliary plate 102 is conductive, the support plate 100 and the auxiliary plate 102 may be connected to form an integrally formed part. In other words, the auxiliary plate 102 and the support plate 100 may be considered a single plate structure.

[0072] In addition, the embodiments of the present application do not limit the relative positions of the auxiliary plate 102 and the support plate 100. For example, the auxiliary plate 102 can be arranged around the support plate 100. Alternatively, the support plate 100 can be arranged around the auxiliary plate 102. Alternatively, the auxiliary plate 102 can be located on one side of the support plate 100. Alternatively, the support plate 100 and the auxiliary plate 102 can be stacked. In the example where the support plate 100 and the auxiliary plate 102 are stacked, the support plate 100 can be closer to the floor 101 relative to the auxiliary plate 102, or the support plate 100 can be farther away from the floor 101 relative to the auxiliary plate 102.

[0073] The dimensions of the support plate 100 and the auxiliary plate 102 along the same direction may be the same or different. In an embodiment where the dimensions of the support plate 100 and the auxiliary plate 102 along the same direction are different, the dimension of the support plate 100 in that direction may be much larger than the dimension of the auxiliary plate 102 in that direction. Alternatively, the dimension of the support plate 100 in that direction may be much smaller than the dimension of the auxiliary plate 102 in that direction.

[0074] The embodiment of the present application does not limit the shapes of the auxiliary plate 102 and the support plate 100 , and they can be adaptively adjusted according to the shape of the electronic device.

[0075] It is understood that the rear housing 15 may also include structures other than the auxiliary plate 102 and the support plate 100. For example, the rear housing 15 may also include a decorative piece, which may be connected to the auxiliary plate 102 or the support plate 100. This embodiment of the present application does not limit this.

[0076] In the embodiment of the present application, the composite panel 20 includes the aforementioned support plate 100 and a floor panel 101. For example, the floor panel 101 may be integrated with the rear housing 15, or the floor panel 101 and the rear housing 15 may be independently provided.

[0077] The embodiments of the present application do not limit the method for electrically connecting the support plate 100 and the floor 101. In some embodiments, the support plate 100 and the floor 101 abut against each other, thereby achieving electrical continuity between the support plate 100 and the floor 101. In other embodiments, as shown in FIG2a , the composite plate 20 further includes a conductive member 103, and the support plate 100 and the floor 101 are electrically connected via the conductive member 103.

[0078] The embodiment of the present application does not limit the structure of the conductive member 103 . For example, the conductive member 103 may be a conductive sheet, a conductive adhesive layer, a conductive foam, a conductive spring, or a conductive bolt.

[0079] The embodiment of the present application does not limit the number of the conductive members 103. For example, the number of the conductive members 103 can be one, two, three, four or more. In the embodiment where there are multiple conductive members 103, the multiple conductive members 103 are arranged at intervals.

[0080] In Figure 2a, a gap 104 is defined between the support plate 100 and the floor 101. The present embodiment does not impose any restrictions on the size or shape of this gap 104. In some embodiments, this gap 104 can accommodate components of an electronic device, such as a camera. It is understood that in some embodiments, this gap 104 is not essential and may be omitted, for example, when the support plate 100 and the floor 101 are aligned.

[0081] 2a, the floor 101 is located on the side of the printed circuit board 13 facing the support plate 100. It is understood that in other embodiments, the floor 101 may be located on the side of the printed circuit board 13 facing away from the support plate 100, and this embodiment of the application does not limit this.

[0082] As described above, support plate 100 is electrically conductive. It includes a composite layer 110 and a conductive layer 120, which is connected to composite layer 110. Conductive layer 120 is electrically conductive, and the side of conductive layer 120 facing away from composite layer 110 is electrically connected to floor 101. For example, conductive layer 120 is electrically connected to the end of conductive member 103 facing away from floor 101.

[0083] Figure 2b is a schematic diagram of the structure of the display screen 12 and the printed circuit board 13. Referring to Figure 2b, the display screen 12 includes a support member 001, a backing film 002, and a display panel 003. The support member 001, backing film 002, and display panel 003 are stacked in this order. Specifically, the support member 001 is used to support the backing film 002 and the display panel 003. The display panel 003 is used to emit light, and the backing film 002 is used to protect the display panel 003. In Figure 2b, the support member 001 includes a composite board 20. The structure of the composite board 20 is described in Figure 2a. In the composite board 20, the floor 101 is disposed on the printed circuit board 13, and the conductive layer 120 is disposed on the side of the composite layer 110 facing away from the display panel 003.

[0084] In FIG2b , the charge (e.g., static electricity) on the display panel 003 can be discharged to the floor 101, preventing the static electricity from affecting the display panel 003. In addition, the composite board 20 is grounded, which provides electromagnetic compatibility (EMC) protection for the support member 001 and improves the electrical performance of the electronic device.

[0085] In some embodiments, the display screen 12 may further include a polarizer and a transparent cover plate. The polarizer is located on the side of the display panel 003 facing away from the back film 002, and the transparent cover plate is located on the side of the polarizer facing away from the display panel 003.

[0086] In the embodiment of the present application, the display screen 12 may be a flexible screen or a non-flexible screen. In the embodiment where the electronic device is a foldable device, the display screen 12 is a flexible screen, and thus the support member 001 has a bendable property.

[0087] The relationship between the composite plate 20 and the rear housing 15 is similar to that described above. In the embodiment of the present application, the entire support member 001 is composed of the composite plate 20. In some embodiments, the support member 001 may further include other components in addition to the composite plate 20. For example, the support member 001 may further include a metal plate, which may be arranged side by side with the composite plate 20, or the metal plate and the composite plate 20 may be stacked. This embodiment of the present application does not impose any limitations on this.

[0088] In the embodiments of the present application, the support plate 100 has various examples.

[0089] Figure 3a is a schematic structural diagram of a support plate 100 provided in an embodiment of the present application. Referring to Figure 3a, the support plate 100 further includes a first carbon fiber filament layer 130, which is embedded within the composite layer 110. The conductive layer 120 and the composite layer 110 are stacked. In the embodiment of the present application, for ease of description, the direction in which the conductive layer 120 and the composite layer 110 are stacked is defined as the z-direction, i.e., the conductive layer 120 and the composite layer 110 are stacked along the z-direction. In Figure 3a, the z-direction also represents the thickness direction of the composite layer 110.

[0090] Figure 3b is a schematic diagram of the exploded structure of support plate 100 shown in Figure 3a. Referring to Figure 3b, composite layer 110 is provided with a slot structure 111. First carbon fiber layer 130 is partially located within slot structure 111. Conductive layer 120 covers at least a portion of slot structure 111 and is electrically connected to first carbon fiber layer 130.

[0091] In this way, the conductive layer 120 and the first carbon fiber layer 130 are electrically conductive. The arrangement of the slot structure 111 and the conductive layer 120 electrically connects the first carbon fiber layer 130 embedded in the composite layer 110 to the floor 101 (as shown in FIG2 a). This allows all charges within the entire first carbon fiber layer 130 to flow through the conductive layer 120 to the floor 101, preventing static electricity on the first carbon fiber layer 130 from affecting the electrical performance of other components. Furthermore, the conductive layer 120 covers at least a portion of the slot structure 111 and is electrically connected to the first carbon fiber layer 130 within the slot structure 111. Furthermore, the first carbon fiber layer 130 is electrically connected to the floor 101, ensuring that the entire first carbon fiber layer 130 provides electromagnetic compatibility protection. Furthermore, the first carbon fiber layer 130 has excellent support and ductility. This embodiment of the present application can fully utilize the excellent support and ductility of the first carbon fiber layer 130 to provide support for other components (such as the display screen 12), while also ensuring that the first carbon fiber layer 130 provides electromagnetic compatibility protection. The rear housing 15 (as shown in FIG. 2 a ) has multiple functions.

[0092] Exemplarily, the first carbon fiber layer 130 includes a plurality of aligned first carbon fiber filaments 131. The plurality of aligned first carbon fiber filaments 131 are electrically conductive. In Figure 2a, the first carbon fiber layer 130 is arranged in the a1 direction. That is, the plurality of first carbon fiber filaments 131 are arranged in the a1 direction. Adjacent first carbon fiber filaments 131 may partially contact each other, and a gap may exist between them. In some examples, the gap may be filled with glue.

[0093] The aforementioned first carbon fiber layer 130 being embedded in the composite layer 110 means that the plurality of arranged first carbon fiber filaments 131 are all located in the composite layer 110. It is understood that the first carbon fiber filaments 131 located at the edge of the composite layer 110 may be partially exposed on the surface of the composite layer 110.

[0094] The aforementioned first carbon fiber filament layer 130 being partially located within the slot structure 111 includes: a portion of the first carbon fiber filaments 131 in the first carbon fiber filament layer 130 having a portion thereof located within the slot structure 111. This embodiment of the present application does not impose any limitation on the size ratio of the portion of the first carbon fiber filament layer 130 located within the slot structure 111 to the portion of the first carbon fiber filament layer 130 not located within the slot structure 111. The size ratio can be set based on the shape and size of the slot structure 111.

[0095] The embodiment of the present application does not limit the shape of the first carbon fiber filaments 131. The first carbon fiber filaments 131 can be cylindrical, prismatic, or irregularly shaped. The embodiment of the present application also does not limit the extension path of the first carbon fiber filaments 131. For example, the extension path of the first carbon fiber filaments 131 can be straight or curved.

[0096] In some embodiments, the diameter of the first carbon fiber filaments 131 is 3 μm (micrometers) to 5 μm. For example, the diameter of the first carbon fiber filaments 131 is 3 μm, 4 μm, or 5 μm. The diameter of the first carbon fiber filaments 131 within the above range can provide the first carbon fiber filament layer 130 with good ductility. In other embodiments, the diameter of the first carbon fiber filaments 131 may not be within the above range, and this embodiment of the application is not limited to this.

[0097] Exemplarily, the maximum distance between two adjacent first carbon fiber filaments 131 is less than or equal to 50 μm. This facilitates the transfer of charge between two adjacent first carbon fiber filaments 131. Static charge and the like are more easily transmitted within the first carbon fiber layer 130, thereby increasing the conductivity of the first carbon fiber layer 130. Exemplarily, the maximum distance between two adjacent first carbon fiber filaments 131 can be 4 μm, 5 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 25 μm, 30 μm, 34 μm, 38 μm, 42 μm, or 50 μm, etc.

[0098] Exemplarily, the groove structure 111 has an opening 112 and a groove bottom wall 113. The opening 112 is provided on the surface of the composite layer 110. The opening 112 and the groove bottom wall 113 are arranged relative to each other. The embodiment of the present application does not limit the shape of the opening 112. For example, the opening 112 may be square, circular, elliptical or irregular in shape. The embodiment of the present application does not limit the shape of the groove bottom wall 113. For example, the groove bottom wall 113 may be square, circular, elliptical or irregular in shape. It is understandable that the shapes of the opening 112 and the groove bottom wall 113 may be the same or different. For example, the opening 112 may be square, and the groove bottom wall 113 may be irregular or stepped.

[0099] The conductive layer 120 covering at least a portion of the slot structure 111 includes: the conductive layer 120 covering the entire slot structure 111. In other words, the entire bottom wall 113 of the slot structure 111 is covered by the conductive layer 120. Alternatively, the conductive layer 120 covers a portion of the slot structure 111. In other words, the bottom wall 113 of the slot structure 111 is partially covered by the conductive layer 120, while partially uncovered.

[0100] Illustratively, the conductive layer 120 includes a connecting portion 121 and an extending portion 122. The connecting portion 121 and the extending portion 122 are connected, for example, as an integrally formed part. The extending portion 122 and the composite layer 110 are stacked along the z-direction. The connecting portion 121 covers at least a portion of the slot structure 111 and is electrically connected to the first carbon fiber filament layer 130. It will be appreciated that the portion of the conductive layer 120 covering at least a portion of the slot structure 111 is designated as the connecting portion 121, and the remaining portion is designated as the extending portion 122.

[0101] The embodiment of the present application does not limit the relative sizes of the conductive layer 120 and the composite layer 110. For example, the conductive layer 120 covers the entire surface of the composite layer 110 facing the conductive layer 120, or the conductive layer 120 covers a portion of the surface of the composite layer 110 facing the conductive layer 120.

[0102] In the example of Figure 3b, the surface K surface of the conductive layer 120 away from the composite layer 110 is not a plane. For example, the surface K surface of the conductive layer 120 away from the composite layer 110 is a concave surface. Alternatively, the surface K surface of the conductive layer 120 away from the composite layer 110 can be a convex surface, a wedge-shaped surface, or an irregular plane. Figure 3c is a structural schematic diagram of another support plate 100 provided in an embodiment of the present application. In Figure 3c, the surface K surface of the conductive layer 120 away from the composite layer 110 is a plane. Thus, in Figure 3c, the connecting portion 121 of the conductive layer 120 fills the entire groove structure 111, and the surface of the connecting portion 121 away from the groove structure 111 and the surface of the extending portion 122 away from the composite layer 110 are coplanar. The surface K surface of the conductive layer 120 away from the composite layer 110 is smoother.

[0103] Exemplarily, the conductive layer 120 includes a conductive material, which may be any of the following materials: copper, aluminum, stainless steel, brass, and alloys thereof, or graphite powder, etc. Alternatively, the conductive material may be a solidified conductive paste, including but not limited to silver paste or copper paste.

[0104] The embodiment of the present application does not limit the material of the composite layer 110. Exemplarily, the material of the composite layer 110 includes at least one of epoxy resin, polyurethane glue, acrylic glue and silicone glue.

[0105] The present embodiment does not limit the connection method between the conductive layer 120 and the composite layer 110. For example, conductive adhesive bonding can be used. Alternatively, the conductive layer 120 can be formed on the surface of the composite layer 110 and within the groove structure 111 by coating, electroplating, chemical plating, or physical vapor deposition (PVD).

[0106] In some embodiments of the present application, a second carbon fiber layer may be embedded in the composite layer 110. FIG4 is a schematic structural diagram of another support plate 100 provided in an embodiment of the present application. FIG4 differs from FIG3a in that the support plate 100 in FIG4 may further include a second carbon fiber layer 140.

[0107] In Figure 4 , the second carbon fiber layer 140 is stacked with the first carbon fiber layer 130, and the second carbon fiber layer 140 is embedded in the composite layer 110. The first carbon fiber layer 130 is closer to the conductive layer 120 than the second carbon fiber layer 140. In other words, the second carbon fiber layer 140, the first carbon fiber layer 130, and the conductive layer 120 are stacked in sequence along the z-direction. The second carbon fiber layer 140 is arranged in the a2 direction, which is non-parallel to the a1 direction.

[0108] The second carbon fiber layer 140 and the first carbon fiber layer 130 are electrically conductive. Because the connecting portion 121 of the conductive layer 120 is electrically connected to the first carbon fiber layer 130, the second carbon fiber layer 140 can be electrically conductive to the floor 101 (as shown in Figure 2a) through the conductive layer 120. The non-parallel arrangement of the second carbon fiber layer 140 and the first carbon fiber layer 130 can increase the tensile strength of the support plate 100 in multiple directions. For example, the support plate 100 has excellent mechanical properties in both the a1 direction and the a2 direction.

[0109] Among them, the second carbon fiber yarn layer 140 includes multiple second carbon fiber yarns 141, and the arrangement direction of the multiple second carbon fiber yarns 141 is not parallel to the arrangement direction of the multiple first carbon fiber yarns 131 in the first carbon fiber yarn layer 130, which means that: the projection of the second carbon fiber yarn 141 in the z direction intersects with the projection of the first carbon fiber yarn 131 in the z direction.

[0110] It will be appreciated that, in some examples, a portion of the second carbon fiber filaments 141 may be exposed on the surface of the composite layer 110 facing away from the conductive layer 120. For example, a portion of the second carbon fiber filaments 141 in the second carbon fiber layer 140, which are located away from the first carbon fiber layer 130, along their lengths may be exposed on the surface of the composite layer 110 facing away from the conductive layer 120. The structure of the second carbon fiber layer 140 is described above with reference to the first carbon fiber layer 130 and will not be further elaborated here.

[0111] The a2 direction is not parallel to the a1 direction. For example, the angle between the a2 direction and the a1 direction is not 0°. In some embodiments, the angle between the a2 direction and the a1 direction is 70°-100°. For example, the angle between the a2 direction and the a1 direction can be 70°, 75°, 80°, 85°, 88°, 89°, 90°, 92°, 97°, or 100°. The following description of the non-parallel arrangement directions is similar to the aforementioned non-parallel arrangement directions of the first carbon fiber layer 130 and the second carbon fiber layer 140, and will not be repeated here.

[0112] The embodiment of the present application does not limit the size relationship along the z-direction between the second carbon fiber layer 140 and the first carbon fiber layer 130. For example, the size along the z-direction of the second carbon fiber layer 140 and the first carbon fiber layer 130 can be equal, or the size along the z-direction of the second carbon fiber layer 140 can be much larger or much smaller than the size along the z-direction of the first carbon fiber layer 130. In addition, the size, shape, and other properties of the second carbon fiber filaments 141 and the first carbon fiber filaments 131 can be the same or different.

[0113] In other embodiments, the aforementioned second carbon fiber yarn layer 140 may be a first glass fiber yarn layer 150. The first glass fiber yarn layer 150 includes a plurality of first glass fiber yarns 151. The first glass fiber yarn layer 150 has poor electrical conductivity, but the electrical conductivity of the first carbon fiber yarn layer 130 can overcome the problem of poor electrical conductivity of the first glass fiber yarn layer 150, so that the support plate 100 has electrical conductivity, thereby making the composite plate 20 (as shown in FIG2 a ) including the support plate 100 have EMC protection and anti-static effects. In addition, the first glass fiber yarn layer 150 has excellent supporting performance, which can improve the supporting performance of the support plate 100. Therefore, the support plate 100 including the first glass fiber yarn layer 150 and the first carbon fiber yarn layer 130 has excellent electrical conductivity and supporting performance.

[0114] The embodiment of the present application does not restrict the extension path of the first glass fiber filaments 151. For example, the extension path of the first glass fiber filaments 151 can be straight or curved. The embodiment of the present application also does not restrict the size of the first glass fiber filament layer 150 along the z-direction. It can be set according to the size requirements of the support plate 100 along the z-direction.

[0115] It is understood that the arrangement direction of the first glass fiber layer 150 and the arrangement direction of the first carbon fiber layer 130 may be parallel. Alternatively, the arrangement direction of the first glass fiber layer 150 and the arrangement direction of the first carbon fiber layer 130 may not be parallel.

[0116] In some embodiments, more layers of structures may be embedded in the composite layer 110 to increase the thickness or mechanical strength of the composite layer 110 .

[0117] Figure 5a is a schematic structural diagram of another support plate 100 provided in an embodiment of the present application. The difference between Figure 5a and Figure 4 is that in Figure 5a, the support plate 100 further includes a second glass fiber layer 160. The second glass fiber layer 160 is stacked with the first carbon fiber layer 130 along the z-direction, and the second glass fiber layer 160 is embedded within the composite layer 110. The second glass fiber layer 160 is closer to the conductive layer 120 than the first carbon fiber layer 130. The second glass fiber layer 160 is arranged in the a3 direction. The groove structure 111 extends through the second glass fiber layer 160.

[0118] As described above, because a portion of the first carbon fiber layer 130 is located within the slot structure 111, the connecting portion 121 of the conductive layer 120 covers a portion of the slot structure 111 and is electrically connected to a portion of the first carbon fiber layer 130. The slot structure 111 penetrates the second glass fiber layer 160. Thus, the connecting portion 121 of the conductive layer 120 penetrates the second glass fiber layer 160 and electrically connects a portion of the first carbon fiber layer 130. The conductive layer 120 passing through the second glass fiber layer 160, which has poor conductivity, enables the conductive first carbon fiber layer 130 to have EMC protection and anti-static properties, thereby providing the support plate 100 with EMC protection and anti-static properties.

[0119] In some embodiments, the a3 direction and the a1 direction are not parallel, so that the support plate 100 has good ductility in both the a3 direction and the a1 direction. In other embodiments, the a3 direction and the a1 direction can be parallel.

[0120] In the example of Figure 5a, directions a2 and a3 are parallel. In other embodiments, directions a2 and a3 may not be parallel. For example, the angle between directions a2 and a3 may be 5°-30°, such as 5°, 8°, 10°, 13°, 17°, 20°, 25°, or 30°. Furthermore, in some embodiments, directions a2, a3, and a1 are not parallel to each other. As a result, the support plate 100 has better ductility in directions a2, a3, and a1, making the ductility of the support plate 100 in multiple directions close to the same, thereby improving the mechanical performance of the support plate 100.

[0121] Figure 5b is a schematic diagram of the exploded structure of conductive layer 120 and composite layer 110 in Figure 5a. In Figure 5b, slot structure 111 extends through second glass fiber layer 160. Portions of first carbon fiber filaments 131 in first carbon fiber layer 130 are exposed within slot structure 111. Connecting portions 121 of conductive layer 120 extend into slot structure 111, contacting first carbon fiber filaments 131 exposed within slot structure 111 to achieve electrical connection.

[0122] It is understandable that, in the example of FIG5a, the second carbon fiber yarn layer 140 (or the first glass fiber yarn layer 150) is not necessary, and the support plate 100 in FIG5a may also not be provided with the second carbon fiber yarn layer 140 (or the first glass fiber yarn layer 150).

[0123] Figure 6 is a schematic diagram of the structure of the composite layer 110 and the conductive layer 120 provided in an embodiment of the present application. The difference between Figure 6 and Figure 5a is that the support plate 100 in Figure 6 also includes a third carbon fiber layer 170. The third carbon fiber layer 170 is embedded in the composite layer 110, and the third carbon fiber layer 170 is stacked on the side of the second glass fiber layer 160 away from the first carbon fiber layer 130. In other words, the first carbon fiber layer 130, the second glass fiber layer 160, the third carbon fiber layer 170 and the conductive layer 120 are stacked along the z-direction. The arrangement directions of the third carbon fiber layer 170 and the second glass fiber layer 160 are not parallel, and the groove structure 111 runs through the third carbon fiber layer 170 and the second glass fiber layer 160.

[0124] The arrangement directions of the third carbon fiber layer 170 and the second glass fiber layer 160 are not parallel. The provision of the third carbon fiber layer 170 can increase the ductility of the support plate 100. In addition, since the groove structure 111 passes through the third carbon fiber layer 170, part of the side wall of the groove structure 111 is formed by the third carbon fiber layer 170. The connecting portion 121 of the conductive layer 120 covers part of the groove structure 111, and the connecting portion 121 can also pass through the third carbon fiber layer 170 and connect to the third carbon fiber layer 170. Therefore, the conductive layer 120 electrically connects the first carbon fiber layer 130 and the third carbon fiber layer 170. This ensures that both the first carbon fiber layer 130 and the third carbon fiber layer 170 of the support plate 100 have EMC protection. In this way, the presence of the second glass fiber layer 160 with poor conductivity does not affect the EMC protection of the support plate 100.

[0125] In Figure 6, the arrangement direction of the third carbon fiber filament layer 170 is the a4 direction, which is not parallel to the a3 direction of the arrangement direction of the second glass fiber filament layer 160. In other embodiments, the a4 direction and the a3 direction may also be parallel. The embodiment of the present application does not limit the relationship between the a4 direction and the a1 direction, or the a4 direction and the a2 direction. For example, in Figure 6, the a4 direction and the a1 direction are parallel, and the a4 direction and the a2 direction are perpendicular to each other.

[0126] There are no limitations on the size of the channels formed by the slot structure 111 penetrating the third carbon fiber filament layer 170 and the size of the channels formed by the slot structure 111 penetrating the second glass fiber filament layer 160. In the example of FIG6 , the size of the channels formed by the slot structure 111 penetrating the third carbon fiber filament layer 170 is larger than the size of the channels formed by the slot structure 111 penetrating the second glass fiber filament layer 160, resulting in the slot structure 111 having a stepped shape. It will be appreciated that in other embodiments, the size of the channels formed by the slot structure 111 in the third carbon fiber filament layer 170 can be equal to the size of the channels formed by the slot structure 111 in the second glass fiber filament layer 160.

[0127] Figure 7 is a schematic structural diagram of another support plate 100 provided in an embodiment of the present application. The difference between Figure 7 and Figure 6 is that the support plate 100 in Figure 7 further includes a fourth glass fiber layer 180. The fourth glass fiber layer 180 is embedded within the composite layer 110 and is stacked on the side of the third carbon fiber layer 170 away from the second glass fiber layer 160. In other words, the first carbon fiber layer 130, the second glass fiber layer 160, the third carbon fiber layer 170, and the fourth glass fiber layer 180 are stacked along the z-direction. The fourth glass fiber layer 180 and the third carbon fiber layer 170 are arranged in non-parallel directions, and the groove structure 111 extends through the fourth glass fiber layer 180, the third carbon fiber layer 170, and the second glass fiber layer 160. The fourth glass fiber layer 180 is arranged in the a5 direction, which is non-parallel to the a4 direction of the third carbon fiber layer 170. In other embodiments, the a4 and a5 directions can also be parallel.

[0128] Similarly, the provision of the fourth glass fiber layer 180 can improve the support strength of the support plate 100. Furthermore, the connection portion 121 of the conductive layer 120 penetrates the fourth glass fiber layer 180, the third carbon fiber layer 170, and the second glass fiber layer 160, and is electrically connected to the first carbon fiber layer 130. This allows electrical conduction between the first carbon fiber layer 130 and the third carbon fiber layer 170 via the conductive layer 120, thereby providing the support plate 100 with excellent electrical properties. For example, when the conductive layer 120 is electrically connected to the floor 101, the charge of the support plate 100 can be released to the floor 101, while also providing EMC protection.

[0129] Similar to the example of FIG6 , in FIG7 , the groove structure 111 may be stepped, or, along the z-direction, the sizes of the cross sections of the groove structure 111 may be the same, which is not limited in the embodiment of the present application.

[0130] It can be understood that, similar to the example of FIG. 3 c , the surface K of the conductive layer 120 facing away from the composite layer 110 in the examples of FIG. 4 , FIG. 5 a , FIG. 6 and FIG. 7 can be a plane.

[0131] In some embodiments of the present application, the carbon fiber filament layer may be spliced ​​with the glass fiber filament layer. In other words, the carbon fiber filament layer and the glass fiber filament layer may be arranged side by side.

[0132] Figure 8 is a schematic diagram of a structure in which a first carbon fiber layer 130 and a third glass fiber layer 201 are arranged side by side, as provided in an embodiment of the present application. Figure 8 differs from Figure 7 in that the support plate 100 in Figure 8 also includes a third glass fiber layer 201. The third glass fiber layer 201 is embedded within the composite layer 110, with the first carbon fiber layer 130 and the third glass fiber layer 201 arranged side by side. The provision of the third glass fiber layer 201 can thus increase the length of the support plate 100.

[0133] In Figure 8 , the extension 122 of the conductive layer 120 can extend to the orthographic projection of the third glass fiber layer 201 on the surface of the composite layer 110. In other words, the extension 122 of the conductive layer 120 and the third glass fiber layer 201 are stacked along the z-direction. This allows the conductive layer 120 to extend to the side of the third glass fiber layer 201, which has poor conductivity.

[0134] Based on the side-by-side arrangement of the first carbon fiber layer 130 and the third glass fiber layer 201, the embodiments of the present application do not limit the positional relationship between the first carbon fiber layer 130 and the third glass fiber layer 201. In some embodiments, the first carbon fiber layer 130 is located on one side of the third glass fiber layer 201. In other embodiments, the first carbon fiber layer 130 is disposed around the periphery of the third glass fiber layer 201. In still other embodiments, the third glass fiber layer 201 is disposed around the periphery of the first carbon fiber layer 130.

[0135] The present embodiment does not limit the size relationship between the first carbon fiber layer 130 and the third glass fiber layer 201. In some embodiments, the first carbon fiber layer 130 and the third glass fiber layer 201 have equal dimensions along the z-direction. This allows the first carbon fiber layer 130 and the third glass fiber layer 201 to be arranged side by side and to be relatively flat.

[0136] The embodiment of the present application does not limit the relationship between the arrangement directions of the first carbon fiber layer 130 and the third glass fiber layer 201. For example, the arrangement direction of the first carbon fiber layer 130 and the arrangement direction of the third glass fiber layer 201 are parallel, or the arrangement direction of the first carbon fiber layer 130 and the arrangement direction of the third glass fiber layer 201 are not parallel, for example, they may be perpendicular.

[0137] Similarly, in FIG8 , support plate 100 may further include a fifth glass fiber layer 202. Fifth glass fiber layer 202 is embedded within composite layer 110, and is arranged side by side with third carbon fiber layer 170. The provision of fifth glass fiber layer 202 can thus increase the length of support plate 100.

[0138] The relationship between the fifth glass fiber yarn layer 202 and the third carbon fiber yarn layer 170 can be referred to the description of the first carbon fiber yarn layer 130 and the third glass fiber yarn layer 201. This embodiment of the present application does not limit this.

[0139] Similarly, in some embodiments, the second carbon fiber layer 140 may be spliced ​​with a glass fiber layer. The second glass fiber layer 160 and the fourth glass fiber layer 180 may also be spliced ​​with carbon fiber layers. Detailed description is omitted here.

[0140] In some embodiments, the support plate 100 may further be provided with other conductive structures, which are connected to the conductive layer 120 . The conductive structures may be adjusted accordingly according to size or position requirements to meet various requirements of the support plate 100 .

[0141] It is understood that in some embodiments of the present application, the support plate 100 may further include a greater number of carbon fiber layers or a greater number of glass fiber layers. In embodiments where the support plate 100 includes multiple carbon fiber layers, the dimensions of the slot structure 111 along the thickness direction of the support plate 100 may be adjusted so that the carbon fiber layer farthest from the conductive layer 120 in the multiple carbon fiber layers is electrically connected to the conductive layer 120, thereby improving the electromagnetic shielding performance of the support plate 100.

[0142] Figure 9 is another structural schematic diagram of the support plate 100 provided in an embodiment of the present application. In Figure 9, the support plate 100 may further include a conductive film 203. The conductive film 203 is connected to the side of the conductive layer 120 away from the composite layer 110, and the floor 101 (as shown in Figure 2a) is electrically connected to the side of the conductive film 203 away from the conductive layer 120. In this way, the conductive film 203 can increase the thickness of the conductive structure on the surface of the support plate 100. In addition, the conductive film 203 and the conductive layer 120 can be formed using different processes, providing a variety of options for the preparation of the support plate 100. For example, the conductive film 203 and the conductive layer 120 can be connected by a conductive adhesive layer, a welding layer, etc.

[0143] The embodiments of the present application do not limit the method for forming the conductive film 203. For example, the conductive film 203 can be formed by forging or die-casting. Alternatively, the conductive film 203 can be formed by coating or plating. In embodiments where the conductive film 203 is formed in the same manner as the conductive layer 120, the conductive film 203 and the conductive layer 120 can be formed using a single process, i.e., the conductive film 203 and the conductive layer 120 are connected to form an integrally formed part. Alternatively, the conductive film 203 and the conductive layer 120 can be formed using two processes, which is not limited in the embodiments of the present application.

[0144] The embodiments of the present application do not limit the relative positional relationship between the conductive film 203 and the conductive layer 120. For example, the conductive film 203 may cover the side of the connecting portion 121 facing away from the composite layer 110, or the conductive film 203 may not cover the side of the connecting portion 121 facing away from the composite layer 110. In some embodiments, the orthographic projection of the conductive film 203 on the surface of the composite layer 110 is located outside the orthographic projection of the conductive layer 120 on the surface of the composite layer 110. In this way, the conductive film 203 can increase the area of ​​the conductive surface of the support plate 100.

[0145] In some embodiments, the surface of the composite layer 110 has pores, and a portion of the conductive layer 120 can pass through the pores on the surface of the composite layer 110 to be electrically connected to the carbon fiber layer.

[0146] Figure 10a is a schematic structural diagram of another composite panel 20 provided in an embodiment of the present application. In Figure 10a, the composite panel 20 includes a floor panel 101 and a support panel 100. The support panel 100 includes a composite layer 110, a carbon fiber filament layer 220, and a conductive layer 210. The carbon fiber filament layer 220 is embedded in the composite layer 110. One end of the conductive layer 210 away from the composite layer 110 is electrically connected to the floor panel 101. For example, the floor panel 101 and the conductive layer 210 are electrically connected via an electrical connector 103. The carbon fiber filament layer 220 includes a plurality of carbon fiber filaments 221, which are arranged side by side.

[0147] Figure 10b is an enlarged schematic diagram of point D in Figure 10a. Referring to Figure 10b, conductive layer 210 partially extends into composite layer 110, while another portion of conductive layer 210 is located outside composite layer 110. The portion of conductive layer 210 extending into composite layer 110 is electrically connected to carbon fiber layer 220. For example, carbon fiber filaments 221 in carbon fiber layer 220 have excellent electrical conductivity. The electrical connection between carbon fiber layer 220 and conductive layer 210 allows static charges on carbon fiber filaments 221 to be transferred to flooring 101 (as shown in Figure 10a).

[0148] Figure 10c is an enlarged schematic diagram of point E in Figure 10b. Referring to Figure 10c, composite layer 110 has a plurality of interconnected pores 115. Carbon fiber filament layer 220 is partially located within pores 115. Conductive layer 210 includes a plurality of interconnected conductive continuous phase structures 211. Portions of conductive continuous phase structures 211 are located within pores 115 and electrically connected to carbon fiber filament layer 220. Portions of conductive continuous phase structures 211 are located outside composite layer 110 and electrically connected to floor panel 101 (shown in Figure 10a).

[0149] The conductive continuous phase structure includes, but is not limited to, a structure in which metal atoms on the surface of metal particles diffuse to the interface of adjacent metal particles and fuse, thereby fusing two or more metal particles into a single integrated structure. The present application does not limit the process for forming the atomic diffusion and fusion. For example, a PVD process may be used.

[0150] Thus, the conductive continuous phase structure 211 of the conductive layer 210 extends into the pores 115, allowing the charge on the carbon fiber filament layer 220 to be released to the floor 101 outside the composite layer 110 (as shown in FIG10 a), thereby preventing the static electricity generated on the carbon fiber filament layer 220 from affecting other electronic devices (such as antennas). In addition, the composite layer 110 does not need to be provided with the aforementioned groove structure, which can reduce the process flow.

[0151] The embodiments of the present application do not limit the size and shape of the multiple pores 115 in the composite layer 110, and are set based on the material and formation process of the composite layer 110. For example, in an embodiment where the composite layer 110 comprises epoxy resin, the epoxy resin has the aforementioned pores 115. It is understood that the shape and size of each pore 115 can vary. Similarly, the size and shape of each conductive continuous phase structure 211 of the conductive layer 210 can also vary. The embodiments of the present application do not limit this.

[0152] For example, the carbon fiber filaments 221 of the carbon fiber filament layer 220 form the inner walls of the pores 115, and the conductive continuous phase structure 211 located within the pores 115 adheres to the carbon fiber filaments 221 within the pores 115, electrically connecting the conductive continuous phase structure 211 and the carbon fiber filaments 221. Furthermore, because the conductive continuous phase structure 211 located outside the composite layer 110 is electrically connected to the conductive continuous phase structure 211 located within the pores 115, electrons on the carbon fiber filaments 221 can be transferred to the outside of the composite layer 110 through the conductive continuous phase structure 211.

[0153] For example, the structure of the carbon fiber layer 220 can be found in the description of the first carbon fiber layer 130 , and the connection between the conductive layer 210 and the floor 101 can be found in the description in FIG. 2 a , which will not be repeated here.

[0154] Figure 10d is an electron micrograph of the support plate in Figure 10a. The conductive layer in the support plate in Figure 10d is formed using a PVD process. Figure 10d shows multiple carbon fiber filaments 221, connected to the conductive continuous phase structure 211. The distance between adjacent grid lines in Figure 10d is 500.00 μm.

[0155] It is understandable that the composite plate 20 of FIG. 10 a may also be provided with the second carbon fiber filament layer 140 (or the first glass fiber filament layer 150 ) shown in FIG. 4 .

[0156] In the embodiment of the present application, there are multiple processes for preparing the composite plate 20 . In the embodiment of the present application, the process for forming the composite plate 20 including the support plate 100 in FIG. 4 is exemplified.

[0157] FIG11a is a process flow chart of a composite plate including the support plate 100 in FIG4. Referring to FIG11a, the preparation process of the support plate 100 includes:

[0158] s1. As shown in FIG11 b , a groove structure 111 is formed on the surface of the composite layer 110 .

[0159] Figure 11b is a schematic diagram of the structure after executing step s1 in Figure 11a. Here, a first carbon fiber layer 130 is embedded within the composite layer 110, and a portion of the first carbon fiber layer 130 is located within the groove structure 111. In other words, during the process of forming the groove structure 111, a portion of the first carbon fiber layer 130 embedded within the composite layer 110 is exposed within the groove structure 111.

[0160] The embodiment of the present application does not limit the method for forming the groove structure 111. For example, the groove structure 111 can be formed by laser engraving, computer numerical control (CNC) machining, grinding, sandblasting, or other processes.

[0161] During step s1, forming the groove structure 111 minimally changes the shape of the composite layer 110. A composite layer 110 with a preset shape can be selected based on the intended use of the support plate 100 before forming the groove structure 111. Furthermore, the groove structure 111 can be formed relatively precisely on the surface of the composite layer 110, facilitating positioning of the groove structure 111.

[0162] In FIG11 b , a second carbon fiber layer 140 may be further embedded in the composite layer 110, and the second carbon fiber layer 140 is located on a side of the first carbon fiber layer 130 away from the slot structure 111. Alternatively, a first glass fiber layer 150 may be further embedded in the composite layer 110, and the first glass fiber layer 150 is located on a side of the first carbon fiber layer 130 away from the slot structure 111.

[0163] In the embodiment of the present application, there are multiple ways to form the composite layer 110. The following illustrates a process for forming the composite layer 110 in conjunction with FIG12a. FIG12a is a flow chart of a process for forming the composite layer 110. In FIG12a, the process for forming the composite layer 110 includes:

[0164] s11. As shown in FIG12 b , insert the second carbon fiber layer 140 (or the first glass fiber layer 150 ) into the glue 17 .

[0165] The second carbon fiber layer 140 (or first glass fiber layer 150) includes a plurality of second carbon fiber filaments 141 (or glass fiber filaments 151) arranged side by side. For example, the adhesive 17 is contained in a container (not shown). The present embodiment of the application does not limit the material of the adhesive 17. For example, the adhesive 17 may include epoxy resin.

[0166] s12. As shown in FIG12c, the first carbon fiber layer 130 is extended into the glue 17 to form a prefabricated layer 18 as shown in FIG12d.

[0167] The first carbon fiber layer 130 includes a plurality of first carbon fiber filaments 131 arranged side by side. The arrangement direction of the first carbon fiber layer 130 is not parallel to the arrangement direction of the second carbon fiber layer 140 (or the first glass fiber layer 150).

[0168] The prefabricated layer 18 in Figure 12d includes glue 17 and a first carbon fiber filament layer 130. The first carbon fiber filament layer 130 is embedded in the glue 17. The prefabricated layer 18 may also include a second carbon fiber filament layer 140 (or a first glass fiber filament layer 150), which is embedded in the glue 17.

[0169] In some embodiments, the second carbon fiber filament layer 140 (or the first glass fiber filament layer 150 ) is not necessary, and the aforementioned step s11 may not be performed.

[0170] s13. As shown in FIG12d, the prefabricated layer 18 is cured to form a composite layer 110 as shown in FIG12e.

[0171] Figure 12e is a schematic diagram of the structure after executing s13 in Figure 12a. In Figure 12e, two layers of structures are embedded in the composite layer 110, namely the first carbon fiber layer 130 and the second carbon fiber layer 140 (or the first glass fiber layer 150). It is understood that in some embodiments, the composite layer 110 can also include more layers of structures, such as a third carbon fiber layer, a fourth glass fiber layer, etc. The embodiment of the present application does not limit the method of curing the prefabricated layer 18. For example, the composite layer 110 is obtained by curing the prefabricated layer 18 by compression molding.

[0172] The example shown in FIG. 12 a is only one process for forming the composite layer 110 . It will be appreciated that, in other embodiments, the composite layer 110 may be formed by other processes.

[0173] Please return to Figure 11a. After executing s1, the following steps are also included:

[0174] s2. Forming a conductive layer 120 as shown in FIG. 4 on the surface of the composite layer 110 .

[0175] The structure after step s2 in FIG11a is shown in FIG4. The conductive layer 120 and the composite layer 110 are stacked, and the conductive layer 120 covers at least a portion of the slot structure 111 and is electrically connected to the first carbon fiber layer 130. For the remaining structure, please refer to the description of FIG4.

[0176] The present embodiment does not limit the method for forming the conductive layer 120. In some embodiments, a conductive paste is applied by brushing, spraying, or pad printing on the surface of the composite layer 110. After the conductive paste cures, the conductive paste is electrically connected to the first carbon fiber layer 130 within the slot structure 111 to achieve good conductivity. For example, the conductive paste may be silver paste, copper paste, or conductive paint. In other embodiments, the conductive layer 120 may be formed on the surface of the composite layer 110 through a plating process.

[0177] s3. Electrically connect the side of the conductive layer 120 away from the composite layer 110 to the floor 101.

[0178] The structure after executing steps s3 in Figure 11a is shown in Figure 2a. Thus, after steps s1, s2, and s3 in Figure 11a, a composite plate 20 is formed. The composite plate 20 provided in this embodiment of the present application has excellent electrical conductivity. Furthermore, the charge on the composite plate 20 is electrically connected to the floor 101, providing EMC protection. Furthermore, static electricity on the composite plate 20 can be discharged to the floor 101.

[0179] It is understandable that the composite plate 20 including the support plate 100 in FIG. 3 a , FIG. 5 a , FIG. 6 , FIG. 7 or FIG. 8 may also be formed using the process shown in FIG. 11 a , which will not be described in detail here.

[0180] For example, the manufacturing process of support plate 100 in FIG10a may not include step s1 in FIG11a , that is, groove structure 111 may not be formed on composite layer 110. For example, conductive layer 120 may be formed on the surface of composite layer 110 through PVD to obtain support plate 100 shown in FIG10a . For the remaining process steps, please refer to FIG11a .

[0181] The above is only a specific embodiment of the present application, but the scope of protection of this application is not limited to this. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A composite board, characterized in that, The composite board includes: a composite layer, wherein the composite layer is provided with a groove structure; a first carbon fiber filament layer, embedded in the composite layer, and a part of the first carbon fiber filament layer is located in the groove structure; a conductive layer, stacked with the composite layer, the conductive layer covering at least part of the groove structure and electrically connected to the first carbon fiber filament layer; and a floor, electrically connected to a side of the conductive layer away from the composite layer.

2. The composite board according to claim 1, wherein The composite board further includes: a second carbon fiber filament layer, embedded in the composite layer and stacked with the first carbon fiber filament layer, and the arrangement directions of the second carbon fiber filament layer and the first carbon fiber filament layer are not parallel.

3. The composite board according to claim 2, characterized in that, The second carbon fiber filament layer is closer to the conductive layer than the first carbon fiber filament layer, and the groove structure penetrates through the second carbon fiber filament layer.

4. The composite board according to any one of claims 1-3, characterized in that, The composite board further includes: a first glass fiber filament layer, embedded in the composite layer and stacked with the first carbon fiber filament layer, and the first glass fiber filament layer is farther from the conductive layer than the first carbon fiber filament layer.

5. The composite board according to any one of claims 1-4, characterized in that, The composite board further includes: a second glass fiber filament layer, embedded in the composite layer and stacked with the first carbon fiber filament layer, and the second glass fiber filament layer is closer to the conductive layer than the first carbon fiber filament layer; the groove structure penetrates through the second glass fiber filament layer.

6. The composite board according to claim 5, wherein, The composite board further includes: a third carbon fiber filament layer, embedded in the composite layer, the third carbon fiber filament layer being stacked on a side of the second glass fiber filament layer away from the first carbon fiber filament layer, and the groove structure penetrates through the third carbon fiber filament layer.

7. The composite board according to any one of claims 1-6, characterized in that, The composite board further includes: a third glass fiber filament layer, embedded in the composite layer, and the third glass fiber filament layer is arranged side by side with the first carbon fiber filament layer.

8. The composite board according to any one of claims 1-7, characterized in that, The conductive layer is a coating or a plating layer.

9. The composite board according to any one of claims 1-8, characterized in that, The composite board further includes: a conductive thin film, connected to a side of the conductive layer away from the composite layer, and the floor is electrically connected to a side of the conductive thin film away from the conductive layer.

10. A composite board, characterized in that, The composite board includes: a composite layer, the composite layer having a plurality of pores, and the plurality of pores communicating with each other; a carbon fiber filament layer, embedded in the composite layer; a conductive layer, stacked with the composite layer; the conductive layer includes a plurality of conductive continuous phase structures, the plurality of conductive continuous phase structures being connected, and part of the conductive continuous phase structures being located in the pores and electrically connected to the carbon fiber filament layer; and a floor, electrically connected to part of the conductive continuous phase structures located outside the composite layer.

11. The composite board according to claim 10, characterized in that, The conductive layer is formed by a physical vapor deposition process.

12. An electronic device, characterized in that, The electronic device includes: a printed circuit board and the composite board according to any one of claims 1-11, and the floor is disposed on the printed circuit board.

13. The electronic device according to claim 12, characterized in that, The electronic device further includes: a middle frame, a display screen, and a rear case; the display screen and the rear case are both connected to the middle frame, and both the middle frame and the printed circuit board are located between the display screen and the rear case; wherein at least one of the middle frame, the display screen, and the rear case includes the composite board.

14. A method for preparing a composite board, characterized in that, Including: forming a groove structure on the surface of the composite layer; A first carbon fiber filament layer is embedded in the composite layer, and a part of the first carbon fiber filament layer is located in the groove structure; A conductive layer is formed by coating or plating on the surface of the composite layer; wherein, the conductive layer is stacked with the composite layer, the conductive layer covers at least a part of the groove structure and is electrically connected to the first carbon fiber filament layer; One side of the conductive layer away from the composite layer is electrically connected to the floor.

15. The method for preparing a composite board according to claim 14, characterized in that, Before forming the groove structure on the surface of the composite layer, it further includes: Inserting the first carbon fiber filament layer into the glue to form a prefabricated layer; Curing the prefabricated layer to form the composite layer.

16. The method for preparing a composite board according to claim 15, wherein The step of inserting the first carbon fiber filament layer into the glue to form a prefabricated layer includes: Inserting the first carbon fiber filament layer into the glue; Inserting a first glass fiber filament layer into the glue to form the prefabricated layer; The step of forming a conductive layer by coating or plating on the surface of the composite layer includes: Forming a conductive layer by coating or plating on the surface of the composite layer so that the first glass fiber filament layer is farther away from the conductive layer than the first carbon fiber filament layer.

17. The method for preparing a composite board according to claim 15, characterized in that, The step of inserting the first carbon fiber filament layer into the glue to form a prefabricated layer includes: Inserting the first carbon fiber filament layer into the glue; Inserting a second glass fiber filament layer into the glue to form the prefabricated layer; The step of forming a groove structure on the surface of the composite layer includes: Forming a groove structure on the surface of the composite layer, so that the groove structure penetrates through the second glass fiber filament layer, and a part of the first carbon fiber filament layer is located in the groove structure.

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