Charging device
By using heat exchange components and thermal brackets in the charging device, the problems of poor heat dissipation of electronic devices inside the charging device and the hotness of users are solved, and efficient heat dissipation and safe use are achieved.
Patent Information
- Application Number
- PCT/CN2024/142519
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-05-09
- Filing Date
- 2024-12-25
- Publication Date
- 2025-07-03
AI Technical Summary
During the fast charging process, existing charging devices have problems such as poor internal electronic devices dissipating heat and users are prone to hotness when unplugging the charging device.
The first part of the heat exchange assembly is thermally connected to the internal electronic device, and is exported to the outside of the inner cavity through the second part, and is penetrated through the bottom shell through the pin to avoid the user from contacting the thermal part. The heat conduction connection is combined with the thermal bracket and the internal electronic device of the housing to export heat to the outside of the inner cavity.
It realizes good heat dissipation of electronic components inside the charging device, avoiding the phenomenon of users being hot when unplugging the charging device, and at the same time improving the heat dissipation effect under the miniaturized design.
Smart Images

Figure CN2024142519_03072025_PF_FP_ABST
Abstract
Description
Charging device Technical Field
[0001] The present application relates to the field of electronic product accessories, and in particular to a charging device. Background Art
[0002] Electronic products such as mobile phones, tablets, and computers usually need to be charged through charging devices such as power adapters. As people's requirements for charging speed change, fast charging technology has gradually matured. However, charging devices with fast charging functions often have high temperatures when working. Existing charging devices usually direct the heat of internal electronic components to various surfaces of the charging device, but this causes the temperature of the entire casing to be high, and users will feel a burning sensation when unplugging the charging device from the socket after charging.
[0003] Therefore, how to ensure good heat dissipation of the electronic components inside the charging device while avoiding the problem of being burned has become an urgent problem to be solved. Summary of the Invention
[0004] Therefore, in order to overcome at least some of the defects and shortcomings in the prior art, an embodiment of the present application provides a charging device that can ensure good heat dissipation of electronic components inside the charging device while avoiding the problem of being burned.
[0005] Specifically, on the one hand, an embodiment of the present application provides a charging device, comprising: a shell, the shell having an inner cavity and a mounting hole connected to the inner cavity; a heat exchange assembly, a first part of the heat exchange assembly being located in the inner cavity, and a second part extending out of the inner cavity through the mounting hole; an internal electronic device, disposed in the inner cavity and thermally connected to the first part of the heat exchange assembly; a pin, connected to the second part of the heat exchange assembly, one end of the pin being electrically connected to the internal electronic device in the inner cavity, and the other opposite end extending out of the inner cavity through the second part.
[0006] In some embodiments, the second portion of the heat exchange assembly includes a bottom shell, which is disposed in the mounting hole and seals the inner cavity. The surface of the bottom shell facing away from the shell is exposed outside the inner cavity, and the pins pass through the bottom shell.
[0007] In some embodiments, the first portion includes a thermally conductive support, the thermally conductive support is disposed in the inner cavity, and the thermally conductive support supports the internal electronic components.
[0008] In some embodiments, one end of the thermally conductive bracket close to the bottom shell is connected to the middle portion of the bottom shell.
[0009] In some embodiments, the internal electronic component includes a first circuit board and a second circuit board, the first circuit board and the second circuit board are perpendicular to each other, and at least one of the first circuit board and the second circuit board is connected to the thermally conductive bracket.
[0010] In some embodiments, the internal electronic device includes a target heat dissipation device, the first part includes a heat conductive extension portion, the heat conductive extension portion extends from a side of the bottom shell close to the inner cavity toward the inner cavity, and the heat conductive extension portion is thermally conductively connected to the target heat dissipation device.
[0011] In some embodiments, there are multiple target devices to be cooled, and the heat-conducting extension extends to at least one target device to be cooled among the multiple target devices to be cooled.
[0012] In some embodiments, the plurality of target heat dissipation devices include rectifier chips, and the heat-conducting extension portion includes a first extension portion, which extends to the rectifier chip.
[0013] In some embodiments, the plurality of target heat dissipation devices include a filter device and a transformer, and the heat conductive extension portion includes a second extension portion, which extends between the filter device and the transformer.
[0014] In some embodiments, the bottom case is made of an insulating material with high thermal conductivity; and / or the first portion includes a metal part and an insulating part, and the insulating part insulates the metal part from the internal electronic components.
[0015] In some embodiments, a plurality of fins are provided on a surface of the bottom shell away from the inner cavity, and the plurality of fins are spaced apart from each other.
[0016] In some embodiments, a connection hole is provided on a side of the shell facing away from the mounting hole, the internal electronic device includes an electrical connector provided corresponding to the connection hole, and an external connector can be connected to the electrical connector through the connection hole.
[0017] In some embodiments, the shell includes an outer shell and an inner shell, the inner shell is arranged around the mounting hole, and the heat exchange component also includes a thermally conductive extension extending from the second part toward the inner cavity, and the thermally conductive extension is in contact with the inner shell.
[0018] On the other hand, an embodiment of the present application provides another charging device, including: a shell having an inner cavity, wherein the inner cavity is provided with internal electronic components; a bottom shell connected to the shell, wherein the bottom shell is provided with pins electrically connected to the internal electronic components; a heat-conducting bracket located in the inner cavity, and wherein the heat-conducting bracket is thermally connected to the internal electronic components and the bottom shell respectively.
[0019] In some embodiments, a first extension portion is provided on the thermally conductive bracket, the internal electronic device includes a target heat dissipation device, the first extension portion extends toward the target heat dissipation device, and the first extension portion is thermally conductively connected to the target heat dissipation device.
[0020] In some embodiments, the target heat dissipation device includes a first circuit board and a rectifier chip, the first circuit board is connected to the bottom shell, the rectifier chip is arranged on the first circuit board, and the first extension portion is thermally conductively connected to the rectifier chip.
[0021] In some embodiments, the rectifier chip is disposed on a side of the first circuit board close to the inner wall of the housing, and the first extension portion extends to the rectifier chip and is in contact with and connected to the rectifier chip.
[0022] In some embodiments, the target heat dissipation device also includes a second circuit board and a filter device, the second circuit board is connected to the first circuit board; the filter device is arranged on the second circuit board, and the thermal conductive bracket is also provided with a second extension portion, and the second extension portion extends to the outer surface of the filter device.
[0023] In some embodiments, the filter device includes a first capacitor and a second capacitor, and the thermally conductive bracket further includes a third extending portion, and the third extending portion extends from the second extending portion to between the first capacitor and the second capacitor.
[0024] In some embodiments, the thermally conductive bracket includes a first end surface close to the bottom shell, the bottom shell includes a second end surface corresponding to the first end surface, and the first end surface is in contact with the second end surface.
[0025] In some embodiments, a protrusion is provided on the thermally conductive bracket, the protrusion is provided on the first end surface and protrudes toward the bottom shell, a groove is correspondingly provided on the second end surface, and the protrusion is connected to the groove.
[0026] In some embodiments, the thermally conductive bracket is an annular structure; and / or the thermally conductive bracket and the bottom shell are separate structures.
[0027] In some embodiments, a fixing bracket is provided on a side of the bottom shell close to the inner cavity, one end of the pin is connected to the fixing bracket, and the other end extends through the bottom shell and is exposed on a side of the bottom shell away from the heat-conducting bracket.
[0028] As can be seen from the above, on the one hand, in the charging device provided by the embodiment of the present application, the first part of the heat exchange component is thermally connected to the internal electronic device through the first part, and then the heat is conducted out of the inner cavity through the second part, and the plug is inserted into the second part. Therefore, when the charging device is plugged into the socket, the heat exchange component is the part of the charging device close to the socket. Therefore, after charging is completed, people will not touch the second part when unplugging the charging device from the socket. Therefore, the above arrangement enables the heat of the internal electronic device to be conducted out while preventing burns. On the other hand, in the charging device provided by the embodiment of the present application, the heat is thermally connected to the internal electronic device in the shell through a heat conductive bracket, and the heat conductive bracket is arranged in the inner cavity of the shell. After the heat conductive bracket is thermally connected to the internal electronic device, the heat is conducted out of the inner cavity through the bottom shell, so that the heat of the internal electronic device can be conducted from the inner cavity toward the bottom shell to the outside of the inner cavity, which can further solve the problem of unsatisfactory heat dissipation effect based on the miniaturization of the charging device. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0030] FIG1 is a schematic structural diagram of a charging device provided in one embodiment of the present application.
[0031] FIG2 is a schematic diagram of the exploded structure of the charging device shown in FIG1 .
[0032] FIG3 is a schematic diagram of the exploded structure of the internal electronic components of the charging device shown in FIG1 .
[0033] FIG4 is a side view of the charging device shown in FIG1 with the outer shell removed.
[0034] FIG5 is a schematic structural diagram of the charging device shown in FIG1 from another angle.
[0035] FIG6 is a partial enlarged schematic diagram of area A in FIG5 .
[0036] FIG. 7 is a schematic structural diagram of the charging device shown in FIG. 1 in another direction.
[0037] FIG8 is a schematic diagram of the exploded structure of the charging device shown in FIG7 .
[0038] FIG9 is a schematic structural diagram of a charging device provided in another embodiment of the present application.
[0039] FIG10 is a schematic diagram of the exploded structure of the charging device shown in FIG9 .
[0040] FIG11 is a schematic structural diagram of internal electronic components and a heat-conducting bracket in the charging device shown in FIG9 .
[0041] FIG12 is an exploded schematic diagram of the internal electronic components and the thermally conductive bracket shown in FIG11 .
[0042] FIG13 is an exploded schematic diagram of the bottom case and the heat-conducting bracket in the charging device shown in FIG9 .
[0043] FIG14 is a schematic structural diagram of the heat-conducting bracket in the charging device shown in FIG9 .
[0044] FIG15 is a schematic cross-sectional view of the charging device shown in FIG9 with the shell portion removed.
[0045] FIG16 is another cross-sectional schematic diagram of the charging device shown in FIG9 with the shell portion removed.
[0046] [Explanation of the accompanying drawings] 100, charging device; 10, shell; 12, outer shell; 13, inner cavity; 14, inner shell; 15, mounting hole; 16, connecting hole; 17, fixing bracket; 20, internal electronic device; 21, target heat dissipation device; 211, rectifier chip; 212, transformer; 213, filter device; 2131, first capacitor; 2132, second capacitor; 22, first circuit board; 23, second circuit board; 24, electrical connector; 30, pin; 40, heat exchange component; 41, thermally conductive bracket; 4101, first end face; 42, thermally conductive extension portion; 421, first extension portion; 422, second extension portion; 423, third extension portion; 4231, first surface; 4232, second surface; 43, bottom shell; 4301, second end face; 431, fin; 432, storage slot; 433, groove portion; 44, protrusion. DETAILED DESCRIPTION
[0047] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present application, not all embodiments. Based on the embodiments described in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.
[0048] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, top, and bottom) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0049] In the embodiments of this application, the terms "first," "second," and so on are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one of these features.
[0050] Referring to FIG1 , an embodiment of the present application provides a charging device 100, which includes a housing 10, a heat exchange assembly 40, an internal electronic device 20 (refer to FIG2 ), and a pin 30. Referring to FIG2 , the housing 10 has an inner cavity 13 and a mounting hole 15 connected to the inner cavity 13. The internal electronic device 20 is disposed in the inner cavity 13, the first portion of the heat exchange assembly 40 is disposed in the inner cavity 13 and is thermally connected (i.e., heat-conductively connected) to the internal electronic device 20, and the second portion of the heat exchange assembly 40 extends out of the inner cavity 13 through the mounting hole 15. The pin 30 is connected to the second portion of the heat exchange assembly 40, one end of the pin 30 is electrically connected to the internal electronic device 20 in the inner cavity 13, and the other end thereof extends out of the inner cavity 13 through the second portion.
[0051] The charging device 100 provided in the embodiment of the present application is, for example, a power adapter or charging energy stick that can charge various electronic products (such as mobile phones, computers, tablets, portable thermostats, etc.). The pin 30 is used to be inserted into a socket to conduct current to the internal electronic device 20. The internal electronic device 20 includes, for example, a power management circuit, components that constitute the power management circuit, a circuit board that provides support and contacts for the power management circuit, and an output interface for outputting current to the electronic product to be charged. When using the charging device 100 provided in this embodiment to charge the electronic product to be charged, the pin 30 is inserted into the socket, and the input current is adjusted by the internal electronic device 20 and output from the output interface to the electronic product to be charged to achieve charging. During charging, because the first portion of the heat exchange component 40 is thermally connected to the internal electronic device 20 and the second portion extends outside the inner cavity 13, the heat generated by the internal electronic device 20 can be quickly conducted through the first portion to the second portion and finally dissipated outside the inner cavity 13. 5 , the second portion is provided with a receiving groove 432 for accommodating the pin 30 , and the pin 30 is movably connected to the second portion of the heat exchange assembly 40 . After charging is completed, the pin 30 can be stored in the receiving groove, for example, to facilitate storage of the charging device 100 .
[0052] Because the pins 30 extend through the second portion and out of the inner cavity 13, when the charging device 100 is plugged into an outlet via the pins 30, the second portion of the heat exchange assembly 40 is located on the side of the housing 10 facing the outlet, i.e., on the side that is not touched by the user. Therefore, the heat exchange assembly 40 can dissipate heat to an unconventional contact surface. During charging and when the charging device 100 is unplugged from the outlet after charging, the user will not touch the side where the pins 30 are located, i.e., the second portion of the heat exchange assembly 40, thereby avoiding burns. The housing 10, for example, includes an outer shell 12. For example, the outer shell 12 can be made of a material with poor thermal conductivity, or the outer shell 12 can be spaced apart from the internal electronic components 20. Alternatively, a thermally insulating material can be provided between the outer shell 12 and the internal electronic components 20. Alternatively, the housing 10 can include an outer shell 12 and an inner shell 14, with the outer shell 12 being isolated from the internal electronic components 20 by the inner shell 14, to ensure that heat is primarily dissipated from the second portion of the heat exchange assembly 40 and not directed to the surface of the outer shell 12.
[0053] In some embodiments, referring to Figures 7 and 8 , a connection hole 16 is provided on the side of the housing 10 facing away from the mounting hole 15. The internal electronic device 20 includes an electrical connector 24 corresponding to the connection hole 16. An external connector can be connected to the electrical connector 24 through the connection hole 16. The electrical connector 24 is an output interface electrically connected to the internal power management circuit. The external connector, for example, is a charging interface on the device to be charged, or an input interface on a data cable or charging cable. During charging, the external connector needs to be connected to the electrical connector 24 through the connection hole 16 to charge the device to be charged. When charging is complete, the external connector needs to be disconnected from the charging device 100, potentially contacting the housing 10. In this embodiment, the connection hole 16 is disposed on the side of the housing 10 away from the mounting hole 15, i.e., away from the second portion of the heat exchange assembly 40. This ensures that the connection hole 16 is as far away from heat dissipation as possible to prevent burns when disconnecting the external connector.
[0054] In the aforementioned embodiment, the second portion of the heat exchange assembly 40 includes, for example, a bottom shell 43. The bottom shell 43 is positioned within the mounting hole 15 and seals the inner cavity 13. The surface of the bottom shell 43 facing away from the housing 10 is exposed to the outside of the inner cavity 13, and the pins 30 extend through the bottom shell 43. Therefore, heat dissipated from the second portion can be dissipated into the air through the surface of the bottom shell 43 facing away from the housing 10, contacting the air outside the inner cavity 13. In some embodiments, referring to Figures 5 and 6, a plurality of fins 431 are provided on the surface of the bottom shell 43 facing away from the inner cavity 13. The fins 431 are spaced apart from each other. The provision of multiple fins 431 increases the contact area between the bottom shell 43 and the air, achieving better heat conduction.
[0055] The first portion of the heat exchange assembly 40 may be, for example, a thermally conductive adhesive filled between the bottom shell 43 and the internal electronic device 20 , or other thermally conductive materials.
[0056] In some embodiments, the first portion of the heat exchange assembly 40 includes a thermally conductive bracket 41, which is disposed within the inner cavity 13 and supports the internal electronic device 20. Referring to Figures 2 and 3, the internal electronic device 20 includes, for example, a first circuit board 22 and a second circuit board 23. A plurality of components are disposed on the first circuit board 22 and the second circuit board 23, respectively. The first circuit board 22 and the second circuit board 23 are disposed perpendicular to each other, which can make the structure more compact. At least one of the first circuit board 22 and the second circuit board 23 is connected to the thermally conductive bracket 41, so that the thermally conductive bracket 41 provides support for the first circuit board 22 and the second circuit board 23, so that the internal electronic device 20 is assembled into a whole for easy assembly. While providing support, the thermally conductive bracket 41 has a large contact area with the first circuit board 22 and the second circuit board 23, which is conducive to conducting the heat generated by the internal electronic device 20 to the bottom shell 43 through the thermally conductive bracket 41, thereby achieving a better heat conduction effect. The above solution provided in this embodiment combines the supporting function and the heat conducting function into one body of the heat conducting bracket 41 , which can realize the rational utilization of the space in the inner cavity 13 , making the structure of the charging device 100 more compact, reducing the volume and saving materials.
[0057] In some embodiments, one end of the heat-conducting bracket 41 close to the bottom shell 43 is connected to the middle of the bottom shell 43. That is, the heat-conducting bracket 41 guides the heat generated by the internal electronic device 20 to the middle of the bottom shell 43 and then evenly conducts it from the bottom shell 43, resulting in faster heat conduction and better effect.
[0058] In some embodiments, the internal electronic device 20 includes a target heat dissipation device 21, and the first portion of the heat exchange assembly 40 includes a thermally conductive extension portion 42. The thermally conductive extension portion 42 extends from the side of the bottom shell 43 close to the inner cavity 13 toward the inner cavity 13, and the thermally conductive extension portion 42 is thermally connected to the target heat dissipation device 21. The target heat dissipation device 21 refers to a component that generates a high amount of heat when the charging device 100 is in operation, such as a transformer, capacitor, chip, etc. The number of target heat dissipation devices 21 is, for example, multiple, and the thermally conductive extension portion 42 extends to at least one target heat dissipation device 21 among the multiple target heat dissipation devices 21. By providing the thermally conductive extension portion 42, heat conduction can be focused on the area with higher heat generation in the internal electronic device 20, thereby achieving rapid heat dissipation.
[0059] For example, referring to Figure 2 , the multiple target heat dissipation components 21 include a rectifier chip 211. The heat-conducting extension 42 includes a first extension 421 that extends to the rectifier chip 211. When the charging device 100 is in operation, the plug 30 is inserted into the socket to direct AC power to the internal electronic components 20. This AC power needs to be rectified and filtered. The rectifier chip 211, composed of multiple diodes, is the part of the internal electronic components 20 that rectifies the AC power and adjusts the current flow. In this embodiment, the first extension 421 is provided for the rectifier chip 211 to quickly dissipate heat from the rectifier chip 211 to the bottom case 43.
[0060] In some embodiments, referring to FIG. 4 , the plurality of target heat dissipation devices 21 include a filter device 213 and a transformer 212. The heat-conducting extension 42 includes a second extension 422 that extends between the filter device 213 and the transformer 212. The filter device 213 is, for example, one of the circuit components in the charging device 100 responsible for converting high-voltage power, converting the pulsating DC high voltage input by the rectifier circuit into a stable DC high voltage suitable for use by the transformer 212. The transformer 212 is responsible for further converting the DC high voltage transmitted by the filter device 213 into a DC low voltage suitable for use by the electronic product to be charged. In this embodiment, by disposing the second extension portion 422 between the filter device 213 and the transformer 212, on the one hand, the heat from the filter device 213 and the transformer 212 can be simultaneously dissipated by the second extension portion 422. On the other hand, the second extension portion 422 can also serve as an insulating structure to isolate the filter device 213 and the transformer 212, so that the distance between the filter device 213 and the transformer 212 meets safety regulations. This allows the filter device 213 and the transformer 212 to be arranged closer, such as stacked on top of each other or close together with the second extension portion 422 between them, which can make the structure more compact and reduce the size of the charging device 100. In some embodiments, the second extension portion 422 can also be configured to surround the transformer 212 or the filter device 213, such as the L-shape shown in Figure 4.
[0061] In some embodiments, the bottom shell 43 is, for example, a high thermal conductivity insulating material. That is, the bottom shell 43 can be made of a high thermal conductivity insulating material. For example, the high thermal conductivity insulating material can be, for example, a composition of polycarbonate, graphite and a phosphorus-containing flame retardant, wherein the concentration (i.e., mass fraction) of polycarbonate is 70%-80%, the concentration of graphite is less than or equal to 25%, the concentration of the phosphorus-containing flame retardant is less than or equal to 5%, and the phosphorus-containing flame retardant is, for example, a phosphate flame retardant. It should be understood that the bottom shell 43 is not limited to the high thermal conductivity insulating material of the above components, as long as the bottom shell 43 has a material with good thermal conductivity and insulation. The high thermal conductivity insulating material has super thermal conductivity under certain temperature conditions and can transfer heat at a faster rate, thereby achieving the effect of rapid heat conduction through the bottom shell 43.
[0062] In some embodiments, the first portion of the heat exchange component 40 includes a high thermal conductivity insulating material. That is, the first portion of the heat exchange component 40 can be made of a high thermal conductivity insulating material. For example, the aforementioned thermally conductive bracket 41 is made of a high thermal conductivity insulating material. Or the thermally conductive extension 42 is made of a high thermal conductivity insulating material. This embodiment is not limiting. Selecting a high thermal conductivity insulating material can design the first portion to conduct heat along the length direction to achieve a better thermal conductivity effect. For example, the thermally conductive extension 42 can be set to conduct heat in a direction extending from the bottom shell 43 to the target heat dissipation device 21, so that heat can be conducted to the bottom shell 43 more quickly.
[0063] In other embodiments, the heat exchange assembly 40 includes a metal member and an insulating member, and the insulating member insulates the metal member from the internal electronic device 20. For example, an insulating layer may be wrapped around the metal member, or the insulating member may be provided on the side of the metal member closer to the internal electronic device 20, thereby utilizing the thermal conductivity of the metal to achieve rapid heat conduction while ensuring safety through the insulating member.
[0064] In some embodiments, the housing 10 includes an outer shell 12 and an inner shell 14. The inner shell 14 is disposed around the mounting hole 15. The heat exchange assembly 40 includes a thermally conductive extension 42 extending from the second portion toward the inner cavity 13. The thermally conductive extension 42 contacts the inner shell 14. This arrangement allows the inner shell 14 to absorb heat dissipated from the internal electronic components 20 into the inner cavity 13. The thermally conductive extension 42 conducts the heat absorbed by the inner shell 14 to the second portion of the heat exchange assembly 40, which then conducts the heat out of the inner cavity 13. This reduces heat transfer through the outer shell 12 and prevents users from getting burned when touching the outer shell 12.
[0065] Referring to Figures 9-15 , another embodiment of the present application provides a charging device 100. This charging device 100 differs from the previous embodiment primarily in the structure of the heat-conducting bracket 41. This embodiment of the charging device 100 includes, for example, a housing 10, a bottom housing 43, a heat-conducting bracket 41, internal electronic components 20, and plugs 30. As shown in Figure 10 , the housing 10 includes, for example, an outer housing 12 and an inner housing 14. The outer housing 12 is positioned within the inner housing 14. The housing 10 has an inner cavity 13 and a mounting hole 15 communicating with the inner cavity 13. In this embodiment, the inner cavity 13 is formed within the inner housing 14, and the mounting hole 15 is also provided in the inner housing 14. The bottom housing 43 is connected to the housing 10 and can be sealed therewith. The inner cavity 13 is formed by the seal between the bottom housing 43 and the housing 10. The heat-conducting bracket 41 is connected to the bottom housing 43 and positioned within the inner cavity 13. The internal electronic components 20 are positioned within the inner cavity 13 and are thermally conductively connected to the heat-conducting bracket 41. The pin 30 is disposed on the bottom shell 43 , one end of the pin 30 is electrically connected to the internal electronic device 20 in the inner cavity 13 , and the other end thereof extends through the bottom shell 43 and is exposed on a side of the bottom shell 43 away from the heat conducting bracket 41 .
[0066] Specifically, the pin 30 is used to be inserted into the socket and conduct current to the internal electronic device 20. The internal electronic device 20 includes, for example, a power management circuit, components that constitute the power management circuit, a circuit board that provides support and contacts for the power management circuit, and an output interface for outputting current to the electronic product to be charged. When using the charging device 100 provided in this embodiment to charge the electronic product to be charged, the pin 30 is plugged into the socket, and the input current is adjusted by the internal electronic device 20 and output from the output interface to the electronic product to be charged to achieve charging. During charging, since the heat-conducting bracket 41 is thermally connected to the internal electronic device 20 and the heat-conducting bracket 41 is connected to the bottom shell 43, the heat generated by the internal electronic device 20 can be quickly conducted to the bottom shell 43 through the heat-conducting bracket 41, and the heat generated by the internal electronic device 20 can be quickly conducted to the outside of the inner cavity 13. As shown in Figure 13, a side of the bottom shell 43 away from the inner cavity 13 has a receiving groove 432 for accommodating the pins 30. The pins 30 are movably connected to the bottom shell 43. After charging is completed, for example, the pins 30 can be stored in the receiving groove, which facilitates the storage of the charging device 100. The outer shell 12 is made of a transparent material, and the inner shell 14 is made of a plastic material. The inner shell 14 can be made of a transparent material or an opaque material. The outer shell 12 is isolated from the internal electronic device 20 by the inner shell 14.
[0067] In this embodiment, the heat is thermally connected to the internal electronic device 20 through a heat-conducting bracket 41, and the heat-conducting bracket 41 is arranged on the bottom shell 43. After the heat is thermally connected to the internal electronic device 20 through the heat-conducting bracket 41, the heat is discharged to the outside of the inner cavity 13 through the bottom shell 43 connected to the heat-conducting bracket 41, so that the heat of the internal electronic device 20 can be discharged, which can solve the problem of unsatisfactory heat dissipation effect based on the miniaturization of the charging device 100.
[0068] As shown in Figures 10-12, the thermally conductive bracket 41 is provided with a first extension portion 421. The first extension portion 421 extends toward the internal electronic device 20 and is thermally conductively connected to the internal electronic device 20. The internal electronic device 20 may include, for example, a target heat dissipation device 21. Target heat dissipation device 21 refers to electronic components of the charging device 100 that generate a high level of heat during operation, such as transformers, capacitors, and chips. The first extension portion 421 is thermally conductively connected to the target heat dissipation device 21, thereby facilitating directional heat dissipation from the target heat dissipation device 21.
[0069] Furthermore, the target heat dissipation device 21 includes, for example, a first circuit board 22 and a rectifier chip 211. The first circuit board 22 is connected to the bottom case 43. The rectifier chip 211 is disposed on the first circuit board 22, and the first extension portion 421 extends to the rectifier chip 211 and is thermally conductively connected to the rectifier chip 211. In the present application, the internal electronic components 20 in the charging device 100 all generate heat during operation. However, some electronic components emit relatively high amounts of heat during operation, thus forming high-heat-dissipation electronic components. The rectifier chip 211 in the present application is an example of a high-heat-dissipation electronic component. When the charging device 100 is operating, the plug 30 is plugged into the socket to direct alternating current (AC) into the internal electronic components 20. The rectifier chip 211 then rectifies the AC power and adjusts the current flow, converting the input AC power into pulsating DC power. By extending the first extension portion 421 to the rectifier chip 211, heat from the rectifier chip 211 can be quickly dissipated through the first extension portion 421 to the bottom case 43, achieving targeted heat dissipation.
[0070] Specifically, as shown in Figures 11 and 12, the rectifier chip 211 is disposed on a side of the first circuit board 22 close to the inner wall of the housing 10, and the first extension portion 421 extends to the rectifier chip 211 and is in contact with and connected to the rectifier chip 211. By disposing the rectifier chip 211 on the side of the first circuit board 22 close to the inner wall of the housing 10, heat from the rectifier chip can be more easily conducted out of the cavity through the thermally conductive bracket 41, thereby achieving the purpose of further directional heat dissipation and heat conduction.
[0071] Furthermore, the target heat dissipation device 21 also includes, for example, a second circuit board 23 and a filter element 213. The second circuit board 23 is connected to the first circuit board 22, and the second circuit board 23 is connected to the bottom shell 43. The first circuit board 22 and the second circuit board 23 are used to integrate the internal electronic device 20 into a whole, which is convenient for assembly to the bottom shell 43 and thermally connected to the heat-conducting bracket 41. At the same time, the provision of the first circuit board 22 and the second circuit board 23 can increase the contact area between the heat-conducting bracket 41 and the first circuit board 22 and the second circuit board 23. The filter element 213 is provided on the second circuit board 23, and the heat-conducting bracket 41 is further provided with a second extension portion 422, which extends to the outer surface of the filter element 213. The filter element 213 is, for example, one of the circuit components in the charging device 100 responsible for converting high-voltage power. By extending the second extension portion 422 to the outer surface of the filter element 213, the heat generated by the filter element 213 can be quickly taken away to the bottom shell 43 and discharged outside the inner cavity 13.
[0072] In some embodiments, the first circuit board 22 and the second circuit board 23 may be arranged perpendicular to each other, which may make the structure of the internal electronic device 20 more compact.
[0073] Furthermore, as shown in Figures 11 and 12, the filter device 213 includes a first capacitor 2131 and a second capacitor 2132, and the first capacitor 2131 and the second capacitor 2132 are spaced apart and arranged on the second circuit board 23. The heat-conducting bracket 41 also includes a third extension portion 423, and the third extension portion 423 extends from the second extension portion 422 to between the first capacitor 2131 and the second capacitor 2132. The first capacitor 2131 and the second capacitor 2132 are, for example, electrolytic capacitors in the circuit responsible for converting high-voltage power in the charging device 100. By arranging the third extension portion 423 between the gap between the first capacitor 2131 and the second capacitor 2132, the heat generated by the first capacitor 2131 and the second capacitor 2132 can be further quickly conducted to the outside of the inner cavity 13, thereby achieving the purpose of rapid heat dissipation.
[0074] Furthermore, as shown in Figures 11-13, the third extension portion 423 and the second extension portion 422 are perpendicular to each other. The third extension portion 423 has a first surface 4231 and a second surface 4232 arranged opposite each other. The first surface 4231 is in contact with the side surface of the first capacitor 2131, the second surface 4232 is in contact with the side surface of the second capacitor 2132, and the second extension portion 422 is in contact with the end surfaces of the first capacitor 2131 and the second capacitor 2132, respectively. By arranging the second extension portion 422 and the third extension portion 423 to contact the surfaces of the first capacitor 2131 and the second capacitor 2132, respectively, the purpose of further heat dissipation and heat conduction of the filter device 213 can be achieved.
[0075] As shown in FIG14 , the thermally conductive bracket 41 includes a first end surface 4101 proximate to the bottom case 43. The bottom case 43 includes a second end surface 4301 corresponding to the first end surface 4101. The first end surface 4101 is in contact with the second end surface 4301. The contact and connection between the first end surface 4101 and the second end surface 4301 allows the thermally conductive bracket 41 to be aligned with and fixedly connected to the bottom case 43.
[0076] In some embodiments, the thermally conductive bracket 41 is an annular structure; and / or, the thermally conductive bracket 41 and the bottom shell 43 are separate structures.
[0077] The heat-conducting bracket 41 is configured as a ring structure, so that the heat absorbed by the heat-conducting bracket 41 can be conducted along the ring direction, achieving a rapid heat-dissipating effect and avoiding the phenomenon of being scalded due to excessive local temperature.
[0078] The thermally conductive bracket 41 and the bottom shell 43 are designed as separate components, allowing the thermally conductive bracket 41 to be produced separately through injection molding, reducing the complexity of the injection mold and improving production efficiency. In some embodiments, the thermally conductive bracket 41 can be fixedly connected to the bottom shell 43 using adhesive, ultrasonic welding, or other methods. In other embodiments, the thermally conductive bracket 41 and the bottom shell 43 are detachably connected, facilitating assembly and disassembly of the thermally conductive bracket 41 and the bottom shell 43. Furthermore, when the charging device 100 is upgraded, that is, when the arrangement of the internal electronic components 20 changes, only the thermally conductive bracket 41 can be replaced with the corresponding one, reducing the production cost of the charging device 100.
[0079] Furthermore, as shown in FIG14 , the heat-conducting bracket 41 is provided with a protrusion 44 that protrudes toward the bottom case 43. The protrusion 44 is provided on the first end face 4101, and a corresponding groove 433 is provided on the second end face 4301. The protrusion 44 is connected to the groove 433. In this embodiment, the heat-conducting bracket is, for example, an annular bracket having a hollow configuration. The hollow portion is used to house the internal electronic device 20. In other words, the heat-conducting bracket 41 can be mounted on the outside of the internal electronic device 20. Due to the annular shape of the heat-conducting bracket 41, its first end face 4101 that contacts the bottom case 43 is similar to a hollow rectangle, and its heat-conducting area is fixed. The protrusion 44 provided on the heat-conducting bracket 41 increases the contact area with the bottom case, that is, increases the heat-conducting connection area, thereby allowing the heat-conducting bracket 41 to transfer more heat to the bottom case 43 and then dissipate it from the bottom case 43. In addition, the arrangement of the protrusion 44 and the groove 433 can facilitate the assembly of the heat-conducting bracket 41 and the bottom shell 43 , and can also play a fool-proof role to avoid assembly failure.
[0080] In some embodiments, as shown in Figure 15, the outer surface of the thermally conductive bracket 41 is inclined from the four sides toward the center, and the outer surface of the bottom shell 43 is also inclined from the four sides toward the center. Through such an arrangement, the thermally conductive bracket 41 and the bottom shell 43 can be more conveniently assembled with the shell 10, so that the thermally conductive bracket 41 can be conveniently assembled into the inner cavity 13.
[0081] The heat-conducting bracket 41 and the bottom shell 43 can be made of, for example, a heat-conducting material. That is, the heat-conducting bracket 41 and the bottom shell 43 can be made of a heat-conducting material. For example, the heat-conducting material can be a heat-conducting material known in the art. The heat-conducting material, for example, has exceptionally strong thermal conductivity, allowing it to transfer heat extremely quickly, thereby achieving rapid heat transfer through the heat-conducting bracket 41 and the bottom shell 43.
[0082] Furthermore, as shown in FIG14 , a fixing bracket 17 is provided on one side of the bottom shell 43 close to the inner cavity 13 , and one end of the pin 30 electrically connected to the internal electronic device 20 is connected to the fixing bracket 17 .
[0083] In some embodiments, the outer surface of the thermally conductive bracket 41 is flush with the outer surface of the bottom case 43 .
[0084] Specifically, as shown in Figure 16, the outer surface of the thermally conductive bracket 41 is flush with the outer surface of the bottom shell 43, and the outer surfaces between the thermally conductive bracket 41 and the bottom shell 43 are flush, which can facilitate the assembly of the thermally conductive bracket 41 and the bottom shell 43. The thermally conductive bracket 41 and the bottom shell 43 can be assembled first, and then the assembled combination of the thermally conductive bracket 41 and the bottom shell 43 can be assembled into the inner cavity 13, thereby improving the assembly efficiency.
[0085] In addition, it can be understood that the aforementioned embodiments are merely illustrative descriptions of the present application. On the premise that the technical features do not conflict, the structures do not contradict, and the purpose of the invention of the present application is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used in combination.
[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A charging device, characterized in that, Comprising: A housing having an inner cavity and a mounting hole communicating with the inner cavity; A heat exchange component, a first part of the heat exchange component being located within the inner cavity and a second part extending out of the inner cavity through the mounting hole; Internal electronic devices disposed within the inner cavity and thermally connected to the first part of the heat exchange component; Pins connected to the second part of the heat exchange component, one end of the pins being electrically connected to the internal electronic devices within the inner cavity and the opposite end extending out of the inner cavity through the second part.
2. The charging device according to claim 1, characterized in that The second part of the heat exchange component includes a bottom case disposed in the mounting hole and sealing the inner cavity; a surface of the bottom case facing away from the housing is exposed outside the inner cavity; the pins penetrate through the bottom case.
3. The charging device according to claim 2, wherein The first part includes a heat conducting bracket disposed within the inner cavity and supporting the internal electronic devices.
4. The charging device according to claim 3, wherein, One end of the heat conducting bracket close to the bottom case is connected to the middle of the bottom case.
5. The charging device according to claim 3, characterized in that The internal electronic devices include a first circuit board and a second circuit board, the first circuit board and the second circuit board are perpendicular to each other and at least one of the first circuit board and the second circuit board is connected to the heat conducting bracket.
6. The charging device according to claim 2, wherein The internal electronic devices include target devices to be cooled, the first part includes a heat conducting extension extending from a side of the bottom case close to the inner cavity into the inner cavity, and the heat conducting extension is in thermal conduction connection with the target devices to be cooled.
7. The charging device according to claim 6, characterized in that The number of the target devices to be cooled is multiple, and the heat conducting extension extends to at least one of the multiple target devices to be cooled.
8. The charging device according to claim 7, wherein The multiple target devices to be cooled include rectifier chips, and the heat conducting extension includes a first extension extending to the rectifier chips.
9. The charging device according to claim 7, wherein, The multiple target devices to be cooled include filtering devices and transformers, and the heat conducting extension includes a second extension extending between the filtering devices and the transformers.
10. The charging device according to any one of claims 2-9, characterized in that, The bottom case is made of a high thermal conductivity insulating material; and / or, the first part includes a metal part and an insulating part, and the insulating part insulates the metal part from the internal electronic devices.
11. The charging device according to claim 2, characterized in that, A plurality of fins are provided on a surface of the bottom case away from the inner cavity, and the plurality of fins are spaced apart from each other.
12. The charging device according to claim 2, wherein, A receiving groove is provided on the bottom case, and the pins are movably connected to the bottom case and can be received in the receiving groove.
13. The charging device according to claim 1, characterized in that, A connection hole is provided on a side of the housing facing away from the mounting hole, the internal electronic devices include an electrical connector corresponding to the connection hole, and an external connector can be connected to the electrical connector through the connection hole.
14. The charging device according to claim 1, characterized in that, The housing includes an outer housing and an inner housing, the inner cavity is provided in the inner housing, the heat exchange component further includes a heat conducting extension extending from the second part into the inner cavity, and the heat conducting extension is in contact with the inner housing.
15. A charging device, characterized in that, Comprising: A housing having an inner cavity in which internal electronic devices are provided; A bottom case connected to the housing, the bottom case being provided with pins electrically connected to the internal electronic devices; The heat-conducting bracket is located inside the inner cavity, and the heat-conducting bracket is thermally conductively connected to the internal electronic device and the bottom case respectively.
16. The charging device according to claim 15, wherein A first extension part is arranged on the heat-conducting bracket. The internal electronic device includes a target device to be cooled. The first extension part extends towards the target device to be cooled, and the first extension part is thermally conductively connected to the target device to be cooled.
17. The charging device according to claim 16, wherein, The target device to be cooled includes a first circuit board and a rectifying chip. The first circuit board is connected to the bottom case. The rectifying chip is arranged on the first circuit board. The first extension part is thermally conductively connected to the rectifying chip.
18. The charging device according to claim 17, wherein The rectifying chip is arranged on one side of the first circuit board close to the inner wall of the housing. The first extension part extends to the rectifying chip and is in contact connection with the rectifying chip.
19. The charging device according to claim 17, wherein The target device to be cooled further includes a second circuit board and a filtering device. The second circuit board is connected to the first circuit board. The filtering device is arranged on the second circuit board. The heat-conducting bracket further has a second extension part, and the second extension part extends to the outer surface of the filtering device.
20. The charging device according to claim 19, wherein, The filtering device includes a first capacitor and a second capacitor. The heat-conducting bracket further includes a third extension part, and the third extension part extends from the second extension part between the first capacitor and the second capacitor.
21. The charging device according to claim 15, characterized in that, The heat-conducting bracket includes a first end face close to the bottom case. The bottom case includes a second end face corresponding to the first end face. The first end face is in contact connection with the second end face.
22. The charging device according to claim 21, characterized in that, A convex part is arranged on the heat-conducting bracket. The convex part is arranged on the first end face and protrudes towards the bottom case. A groove part is correspondingly arranged on the second end face, and the convex part is connected to the groove part.
23. The charging device according to claim 15, characterized in that, The heat-conducting bracket is of an annular structure; and / or, the heat-conducting bracket and the bottom case are of a split structure.
24. The charging device according to claim 15, characterized in that, A fixing bracket is arranged on one side of the bottom case close to the inner cavity. One end of the pin is connected to the fixing bracket, and the opposite other end passes through the bottom case and extends and exposes on the side of the bottom case away from the heat-conducting bracket.
Citation Information
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