Temperature acquisition circuit, method, and apparatus, storage medium, and charging and power distribution system assembly

Abstract

Embodiments of the present invention provide a temperature acquisition circuit, method, and apparatus, a storage medium, and a charging and power distribution system assembly. The temperature acquisition circuit comprises: a main control board and a power board, the power board being provided with a first thermistor, a second thermistor, and an optocoupler isolation circuit. The first thermistor is connected to the optocoupler isolation circuit, the optocoupler isolation circuit is connected to the main control board, and the second thermistor is connected to the main control board. In the technical solution provided by the embodiments of the present invention, two thermistors are provided on the power board of a charging and power distribution system assembly, thereby avoiding temperature measurement errors caused by a thermistor on the power board exceeding the range of the thermistor, and improving the accuracy of temperature acquisition of the charging and power distribution system assembly, thus improving the charging safety of a power battery.

Description

Temperature acquisition circuit, method, device, storage medium and charging and distribution system assembly

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on December 29, 2023, with application number 202311864406.X and application name “Temperature acquisition circuit, method, device, storage medium and charging and distribution system assembly”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the field of vehicle technology, and in particular to a temperature acquisition circuit, method, device, storage medium, and charging and distribution system assembly. Background Art

[0003] The circuit board of the vehicle's charging and distribution system assembly includes at least a main control chip, which can collect temperature signals from the charging and distribution system assembly. The traditional collection method is generally to convert the thermistor voltage value on the collection board into an on-board temperature value through analog-to-digital conversion, thereby determining the temperature of the charging and distribution system assembly during operation. However, due to the design of the charging and distribution system assembly circuit board, the thermistor is sometimes too long to avoid other electronic components. The distance between the thermistor and the sampling pin of the main control chip is sometimes too long, resulting in errors in the temperature signal collected by the main control chip, affecting the control of the charging and distribution system assembly, which may cause the charging time to be extended, pose a safety hazard, and have an adverse effect on the power battery. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a temperature acquisition circuit, method, device, storage medium, and charging and distribution system assembly to improve the accuracy of temperature acquisition of the charging and distribution system assembly, thereby improving the charging safety of the power battery.

[0005] On the one hand, an embodiment of the present invention provides a temperature acquisition circuit, including: a main control board and a power board, wherein a first thermistor, a second thermistor and an optocoupler isolation circuit are provided on the power board, the first thermistor is connected to the optocoupler isolation circuit, the optocoupler isolation circuit is connected to the main control board, and the second thermistor is connected to the main control board.

[0006] Optionally, a hysteresis comparator, an integrator and a follower are further provided on the power board, and the hysteresis comparator, the integrator and the follower constitute a triangle wave generator.

[0007] Optionally, an operational amplifier is further provided on the power board, and the operational amplifier is connected to the triangle wave generator, and the operational amplifier is connected to the first thermistor.

[0008] On the other hand, an embodiment of the present invention provides a temperature acquisition method, which is applied to the above-mentioned temperature acquisition circuit, including:

[0009] Acquire a first temperature of the first thermistor and a second temperature of the second thermistor;

[0010] The collected temperature of the charging and distribution system assembly is determined based on the first temperature and the second temperature.

[0011] Optionally, before obtaining the first temperature of the first thermistor and the second temperature of the second thermistor, the method includes:

[0012] The pulse width modulated wave signal is obtained, where the pulse width modulated wave signal is obtained based on the triangular wave signal voltage of the triangular wave generator and the first voltage of the first thermistor, and the pulse width modulated wave signal is used to represent the first temperature.

[0013] Optionally, determining the collected temperature of the charging and distribution system assembly based on the first temperature and the second temperature includes:

[0014] When the first temperature is greater than or equal to a first preset threshold and the second temperature is less than a second preset threshold, the second temperature is used as the collection temperature of the charging and distribution system assembly; or

[0015] When the first temperature is greater than or equal to a first preset threshold and the second temperature is greater than or equal to a third preset threshold, the first temperature is used as the collected temperature of the charging and distribution system assembly; or

[0016] When the first temperature is greater than or equal to a first preset threshold and the second temperature is greater than or equal to a second preset threshold and less than a third preset threshold, the first temperature is used as the collection temperature of the charging and distribution system assembly; or

[0017] When the first temperature is less than a first preset threshold, the first temperature is used as the collected temperature of the charging and distribution system assembly.

[0018] Optionally, the first preset threshold includes 125 degrees Celsius, the second preset threshold includes -40 degrees Celsius, and the third preset threshold includes 25 degrees Celsius.

[0019] On the other hand, an embodiment of the present invention provides a temperature acquisition device, comprising:

[0020] A first acquisition module, configured to acquire a first temperature of the first thermistor and a second temperature of the second thermistor;

[0021] A determination module is used to determine a collection temperature of the charging and distribution system assembly based on the first temperature and the second temperature.

[0022] On the other hand, an embodiment of the present invention provides a storage medium, including: the storage medium includes a stored program, wherein when the program is running, the device where the storage medium is located is controlled to execute the above-mentioned temperature acquisition method.

[0023] On the other hand, an embodiment of the present invention provides a charging and distribution system assembly, including a memory and a processor, wherein the memory is used to store information including program instructions, and the processor is used to control the execution of the program instructions, wherein the program instructions, when loaded and executed by the processor, implement the steps of the above-mentioned temperature collection method.

[0024] The technical solution for the temperature acquisition circuit provided in an embodiment of the present invention includes: a main control board and a power board. The power board is provided with a first thermistor, a second thermistor, and an optocoupler isolation circuit. The first thermistor is connected to the optocoupler isolation circuit, which is connected to the main control board. The second thermistor is connected to the main control board. In the technical solution provided in an embodiment of the present invention, two thermistors are provided on the power board of the charging and distribution system assembly. This avoids the situation where the thermistors on the power board exceed the range and cause temperature measurement errors, improves the accuracy of temperature acquisition of the charging and distribution system assembly, and thus improves the charging safety of the power battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] FIG1 is a schematic structural diagram of a temperature acquisition circuit provided by an embodiment of the present invention;

[0027] FIG2 is a circuit diagram of a power board provided in an embodiment of the present invention;

[0028] FIG3 is a flow chart of a temperature acquisition method provided by one embodiment of the present invention;

[0029] FIG4 is a schematic diagram of obtaining a pulse width modulated wave signal according to an embodiment of the present invention;

[0030] FIG5 is a schematic diagram of waveforms of a triangular wave signal voltage and a first voltage provided by an embodiment of the present invention;

[0031] FIG6 is a schematic diagram showing the relationship between the resistance and temperature of a thermistor provided in one embodiment of the present invention;

[0032] FIG7 is a schematic structural diagram of a temperature acquisition device provided by an embodiment of the present invention;

[0033] FIG8 is a schematic diagram of a charging and distribution system assembly provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0034] In order to better understand the technical solution of the present invention, the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0035] It should be understood that the embodiments described are only a portion of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work are within the scope of protection of the present invention.

[0036] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "an", "the" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0037] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0038] Figure 1 is a structural schematic diagram of a temperature acquisition circuit provided in an embodiment of the present invention. As shown in Figure 1, the temperature acquisition circuit includes: a main control board 1 and a power board 2. A first thermistor 21, a second thermistor 22 and an optocoupler isolation circuit 23 are provided on the power board 2. The first thermistor 21 is connected to the optocoupler isolation circuit 23, the optocoupler isolation circuit 23 is connected to the main control board 1, and the second thermistor 22 is connected to the main control board 1.

[0039] In one embodiment of the present invention, the core part of the optical coupling isolation circuit 23 is an optical coupling device, which is composed of a light-emitting diode (LED) and a phototransistor (phototransistor).

[0040] In one embodiment of the present invention, the power board 2 is further provided with a hysteresis comparator 24 , an integrator 25 and a follower 26 , which form a triangle wave generator.

[0041] Specifically, the output of the operational amplifier 27 is added to the inverting input of the integrator 25 for integration, and the output of the integrator 25 is fed back to the non-inverting input of the hysteresis comparator 24 to control the high and low level conversion of the hysteresis comparator 24. Among them, the triangle wave generator can generate a 200Hz triangle wave.

[0042] In one embodiment of the present invention, an operational amplifier 27 is further provided on the power board 2 . The operational amplifier 27 is connected to the triangle wave generator, and the operational amplifier 27 is connected to the first thermistor 21 .

[0043] FIG2 is a circuit diagram of a power board provided in an embodiment of the present invention. As shown in FIG2 , an operational amplifier 27 includes five pins. A first pin 272 of the operational amplifier 27 is connected to a first pin 261 of the follower 26, a third pin 263 of the follower 26, and a second pin 252 of the integrator 25. A second pin 273 of the operational amplifier 27 is connected to resistors R259 and R263. A third pin 271 of the operational amplifier 27 is connected to resistors R259 and R262. A fourth pin 274 of the operational amplifier 27 is connected to capacitors C35, C43, R260, and R264, with the other ends of capacitors C35 and C43 connected to ground (DGND). A fifth pin 275 of the operational amplifier 27 is connected to ground (DGND). A second pin 262 of the follower 26 is connected to resistors R261 and R260, with the other end of resistor R261 connected to ground (DGND). A first pin 251 of the integrator 25 is connected to resistors R262 and C40. The third pin 253 of the integrator 25 is connected to the capacitor C40, the second pin 242 of the hysteresis comparator 24, and the resistor R263. The first pin 241 of the hysteresis comparator 24 is connected to the resistors R264 and R265. The resistor R265 is connected to the capacitor C48 and the resistor R288. The other end of the capacitor C48 is grounded to DGND. The resistor R288 is connected to the first thermistor 21, and the other end of the first thermistor 21 is grounded to DGND. The third pin 243 of the hysteresis comparator 24 is connected to the resistor R266. The resistor R266 is grounded to DGND via the optocoupler isolation circuit 23. The resistor R267 is grounded to GND via the optocoupler isolation circuit 23. The resistor R267 is connected to the resistor R295, which is connected to the capacitor C80, and the other end of the capacitor C80 is grounded to GND. The resistor R295 is connected to the first output T_DCDC_MCU.

[0044] Resistor R66 is connected to resistor R65, capacitor C9, and the second output T2_BAN_MCU. The other end of capacitor C9 is grounded to GND. Resistor R65 is connected to the second thermistor 22. The other end of the second thermistor 22 is grounded to GND. The first output T_DCDC_MCU and the second output T2_BAN_MCU can be connected to the main control board 1.

[0045] In the technical solution provided by the embodiment of the present invention, the temperature acquisition circuit includes: a main control board and a power board. The power board is provided with a first thermistor, a second thermistor, and an optocoupler isolation circuit. The first thermistor is connected to the optocoupler isolation circuit, which is connected to the main control board, and the second thermistor is connected to the main control board. In the technical solution provided by the embodiment of the present invention, two thermistors are provided on the power board of the charging and distribution system assembly. This avoids the situation where the thermistor on the power board exceeds the range and causes temperature measurement errors, improves the accuracy of temperature acquisition of the charging and distribution system assembly, and thus improves the charging safety of the power battery.

[0046] Based on the temperature acquisition circuit in FIG1 , an embodiment of the present invention provides a temperature acquisition method. FIG3 is a flow chart of a temperature acquisition method provided by an embodiment of the present invention. As shown in FIG3 , the method includes:

[0047] Step 102 : Obtain a pulse width modulated wave signal. The pulse width modulated wave signal is obtained based on the triangular wave signal voltage of the triangular wave generator and the first voltage of the first thermistor. The pulse width modulated wave signal is used to represent the first temperature.

[0048] In one embodiment of the present invention, each step may be executed by a main control board of the charging and distribution system assembly. For example, the main control board includes a microcontroller unit (MCU).

[0049] FIG4 is a schematic diagram of obtaining a pulse width modulated wave signal according to an embodiment of the present invention. As shown in FIG4 , a 200 Hz triangular wave generated by a triangular wave generator can be used as the non-inverting input signal of a hysteresis comparator, and the first voltage of the first thermistor can be used as the inverting input signal of the hysteresis comparator. Since the resistance signal of the first thermistor changes with temperature, when the temperature of the power board decreases, the resistance of the first thermistor increases, and when the temperature of the power board increases, the resistance of the thermistor decreases. Therefore, the voltage at the inverting input terminal of the hysteresis comparator is a voltage that changes with temperature. When the voltage of the triangular wave signal is higher than the first voltage of the first thermistor, the hysteresis comparator outputs a high voltage. When the voltage of the triangular wave signal is lower than the first voltage of the first thermistor, the hysteresis comparator outputs a low voltage. When the voltage of the triangular wave signal is equal to the first voltage of the first thermistor, the hysteresis comparator outputs the voltage at the previous moment. Thus, a 200 Hz pulse width modulation (PWM) wave signal with a duty cycle that changes with temperature can be obtained. The PWM wave signal is used to feedback the temperature on the power board of the charging and distribution system assembly.

[0050] Figure 5 is a waveform diagram of the triangular wave signal voltage and the first voltage provided by an embodiment of the present invention. As shown in Figure 5, the vertical axis in Figure 5 is voltage, and the horizontal axis is time. The solid line in Figure 5 represents the triangular wave signal voltage, and the dotted line represents the first voltage.

[0051] Specifically, an optocoupler isolation circuit can be used to transmit the PWM wave signal on the power board to the PWM pin of the main control board to be used as a temperature judgment signal.

[0052] Step 104: Acquire a first temperature of the first thermistor and a second temperature of the second thermistor.

[0053] In one embodiment of the present invention, the first thermistor is a thermistor disposed on the power board. Because the resistance signal of the thermistor changes with temperature, when the temperature decreases, the resistance of the thermistor increases, and when the temperature increases, the resistance of the thermistor decreases. Therefore, the resistance of the first thermistor can be calculated based on its first voltage. The resistance value then reflects the temperature of the power board based on the relationship between the resistance and temperature of the thermistor in Figure 5. The voltage of the first thermistor is the first voltage.

[0054] FIG6 is a schematic diagram showing the relationship between the resistance and temperature of a thermistor provided in one embodiment of the present invention. As shown in FIG6 , the abscissa of FIG6 is the temperature of the thermistor in degrees Celsius, and the ordinate is the resistance of the thermistor in ohms. The resistance of the thermistor decreases as its temperature increases.

[0055] To prevent the thermistor on the power board from over-ranging and causing temperature measurement errors, a second thermistor is added to the power board. This second thermistor is located near the inter-board connector on the power board to avoid long cable transmission. The second thermistor operates on the same principle as the first thermistor, and its voltage value reflects the onboard temperature. The voltage across the second thermistor is the second voltage, and the corresponding second temperature is the onboard temperature of the charging and distribution system assembly.

[0056] Step 106: Determine the collected temperature of the charging and distribution system assembly based on the first temperature and the second temperature.

[0057] Specifically, when the first temperature is greater than or equal to the first preset threshold and the second temperature is less than the second preset threshold, the second temperature is used as the collection temperature of the charging and distribution system assembly; or, when the first temperature is greater than or equal to the first preset threshold and the second temperature is greater than or equal to the third preset threshold, the first temperature is used as the collection temperature of the charging and distribution system assembly; or, when the first temperature is greater than or equal to the first preset threshold and the second temperature is greater than or equal to the second preset threshold and less than the third preset threshold, the first temperature is used as the collection temperature of the charging and distribution system assembly; or, when the first temperature is less than the first preset threshold, the first temperature is used as the collection temperature of the charging and distribution system assembly.

[0058] In one embodiment of the present invention, the first preset threshold, the second preset threshold, and the third preset threshold can be set according to actual conditions. As an optional solution, the first preset threshold is 125 degrees Celsius, the second preset threshold is -40 degrees Celsius, and the third preset threshold is 25 degrees Celsius.

[0059] In one embodiment of the present invention, when the ambient temperature is -40 degrees Celsius, a table lookup shows that the resistance of the first thermistor 21 is 195.652K. The voltage of the first pin 241 of the hysteresis comparator 24 can be calculated as 4.87V through resistance voltage division. Compared with the maximum voltage of the pulse signal of 5V at the second pin 242 of the hysteresis comparator 24, the third pin 243 of the hysteresis comparator 24 should output a PWM wave signal with a duty cycle of 2.5%. However, due to the small duty cycle and errors, the third pin 243 of the hysteresis comparator 24 will output a low level, resulting in the MCU actually collecting T_DCDC_MCU as a high level. The temperature at this time should be 125 degrees through circuit conversion, which is inconsistent with the actual -40 degrees. Therefore, a second thermistor 22 is provided on the power board. When the sampling temperature of the PWM wave signal is greater than or equal to 125 degrees Celsius, and the sampling temperature of the second thermistor 22 is less than or equal to -40 degrees Celsius, the ambient temperature is low, and the sampling temperature of the charging and distribution system assembly can be based on the onboard temperature (second temperature). When the sampling temperature of the PWM wave signal is greater than or equal to 125 degrees Celsius, and the sampling temperature of the second thermistor 22 is greater than or equal to 25 degrees Celsius, the ambient temperature is high, and the sampling temperature of the charging and distribution system assembly can be based on the first temperature corresponding to the PWM wave signal. When the sampling temperature of the PWM wave signal is less than 125 degrees Celsius, the sampling temperature of the charging and distribution system assembly can be based on the first temperature corresponding to the PWM wave signal.

[0060] In the technical solution provided by the embodiment of the present invention, the temperature acquisition circuit includes: a main control board and a power board. The power board is provided with a first thermistor, a second thermistor, and an optocoupler isolation circuit. The first thermistor is connected to the optocoupler isolation circuit, which is connected to the main control board, and the second thermistor is connected to the main control board. In the technical solution provided by the embodiment of the present invention, the two thermistors are provided on the power board of the charging and distribution system assembly. This avoids the situation where the thermistor on the power board exceeds the range and causes temperature measurement errors, improves the accuracy of temperature acquisition of the charging and distribution system assembly, and thus improves the charging safety of the power battery.

[0061] In the technical solution provided by the embodiment of the present invention, the temperature on the board of the charging and distribution system is collected by using multiple electronic components, and the first temperature is compared with the second temperature, thereby improving the temperature collection accuracy.

[0062] In the technical solution provided in the embodiment of the present invention, a redundant design is used, and two thermistors are provided on the power board of the charging and distribution system assembly. This avoids the situation where the thermistor on the power board exceeds the range and causes temperature measurement errors, thereby ensuring the validity of the temperature signal.

[0063] The technical solution provided in the embodiment of the present invention proposes a method for obtaining PWM wave signals, which quickly and accurately feedback the temperature on the power board. This not only provides a reference for determining the collected temperature of the entire charging and distribution system assembly, but also provides technical guidance for subsequent temperature collection in other systems in the vehicle.

[0064] In the technical solution provided by the embodiment of the present invention, during the process of collecting the temperature of the power board, a 200Hz PWM wave signal whose duty cycle changes with temperature can be obtained by inputting high voltage and low voltage under different conditions through the operational amplifier. This eliminates the need to use too many devices and eliminates the influence of line resistance on the collection accuracy.

[0065] FIG7 is a schematic diagram of the structure of a temperature acquisition device provided by an embodiment of the present invention. As shown in FIG7 , the device includes: a first acquisition module 61 and a determination module 62 .

[0066] The first acquisition module 61 is used to acquire a first temperature of the first thermistor and a second temperature of the second thermistor.

[0067] The determination module 62 is used to determine the collected temperature of the charging and distribution system assembly based on the first temperature and the second temperature.

[0068] In one embodiment of the present invention, the device further includes: a second acquisition module 63 .

[0069] The second acquisition module 63 is used to acquire a pulse width modulated wave signal. The pulse width modulated wave signal is acquired according to the triangle wave signal voltage of the triangle wave generator and the first voltage of the first thermistor. The pulse width modulated wave signal is used to represent the first temperature.

[0070] In one embodiment of the present invention, the second acquisition module 62 is specifically used to use the second temperature as the collection temperature of the charging and distribution system assembly when the first temperature is greater than or equal to the first preset threshold and the second temperature is less than the second preset threshold; or, when the first temperature is greater than or equal to the first preset threshold and the second temperature is greater than or equal to the third preset threshold, use the first temperature as the collection temperature of the charging and distribution system assembly; or, when the first temperature is greater than or equal to the first preset threshold and the second temperature is greater than or equal to the second preset threshold and less than the third preset threshold, use the first temperature as the collection temperature of the charging and distribution system assembly; or, when the first temperature is less than the first preset threshold, use the first temperature as the collection temperature of the charging and distribution system assembly.

[0071] In one embodiment of the present invention, the first preset threshold includes 125 degrees Celsius, the second preset threshold includes -40 degrees Celsius, and the third preset threshold includes 25 degrees Celsius.

[0072] In the technical solution provided by the embodiment of the present invention, the temperature acquisition circuit includes: a main control board and a power board. The power board is provided with a first thermistor, a second thermistor, and an optocoupler isolation circuit. The first thermistor is connected to the optocoupler isolation circuit, which is connected to the main control board, and the second thermistor is connected to the main control board. In the technical solution provided by the embodiment of the present invention, two thermistors are provided on the power board of the charging and distribution system assembly. This avoids the situation where the thermistor on the power board exceeds the range and causes temperature measurement errors, improves the accuracy of temperature acquisition of the charging and distribution system assembly, and thus improves the charging safety of the power battery.

[0073] The temperature acquisition device provided in this embodiment can be used to implement the temperature acquisition method in FIG3 . For a detailed description, please refer to the embodiment of the temperature acquisition method described above, and the description will not be repeated here.

[0074] An embodiment of the present invention provides a storage medium, which includes a stored program. When the program is running, the device where the storage medium is located is controlled to execute the steps of the embodiment of the above-mentioned temperature acquisition method. For detailed description, please refer to the embodiment of the above-mentioned temperature acquisition method.

[0075] An embodiment of the present invention provides a charging and distribution system assembly, including a memory and a processor. The memory is used to store information including program instructions, and the processor is used to control the execution of the program instructions. When the program instructions are loaded and executed by the processor, the steps of the embodiment of the above-mentioned temperature collection method are implemented. For a specific description, please refer to the embodiment of the above-mentioned temperature collection method.

[0076] Figure 8 is a schematic diagram of a charging and distribution system assembly provided in an embodiment of the present invention. As shown in Figure 8, the charging and distribution system assembly 70 of this embodiment includes: a processor 71, a memory 72, and a computer program 73 stored in the memory 72 and executable by the processor 71. When executed by the processor 71, the computer program 73 implements the temperature acquisition method of the embodiment. To avoid repetition, the details are not described here. Alternatively, when executed by the processor 71, the computer program implements the functions of each model / unit in the temperature acquisition device of the embodiment. To avoid repetition, the details are not described here.

[0077] The charging and distribution system assembly 70 includes, but is not limited to, a processor 71 and a memory 72. Those skilled in the art will appreciate that FIG8 is merely an example of the charging and distribution system assembly 70 and does not limit the charging and distribution system assembly 70 . The charging and distribution system assembly 70 may include more or fewer components than shown, or a combination of certain components, or different components. For example, the charging and distribution system assembly may also include input and output devices, network access devices, buses, etc.

[0078] The processor 71 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor.

[0079] The memory 72 can be an internal storage unit of the charging and distribution system assembly 70, such as a hard disk or memory of the charging and distribution system assembly 70. The memory 72 can also be an external storage device of the charging and distribution system assembly 70, such as a plug-in hard disk equipped on the charging and distribution system assembly 70, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. Furthermore, the memory 72 can also include both an internal storage unit of the charging and distribution system assembly 70 and an external storage device. The memory 72 is used to store computer programs and other programs and data required by the charging and distribution system assembly. The memory 72 can also be used to temporarily store data that has been output or is to be output.

[0080] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0081] In the several embodiments provided by the present invention, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, which may be electrical, mechanical or other forms.

[0082] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0083] In addition, the functional units in the various embodiments of the present invention may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or hardware plus software functional units.

[0084] The above-mentioned integrated unit implemented in the form of a software functional unit can be stored in a computer-readable storage medium. The above-mentioned software functional unit is stored in a storage medium and includes a number of instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) or a processor to perform some steps of the method described in various embodiments of the present invention. The aforementioned storage medium includes: a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, etc., various media that can store program code.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A temperature acquisition circuit, characterized in that, Including: A main control board and a power board, wherein a first thermistor, a second thermistor and an opto-isolation circuit are arranged on the power board, the first thermistor is connected to the opto-isolation circuit, the opto-isolation circuit is connected to the main control board, and the second thermistor is connected to the main control board.

2. The circuit according to claim 1, wherein A hysteresis comparator, an integrator and a follower are further arranged on the power board, and the hysteresis comparator, the integrator and the follower form a triangular wave generator.

3. The circuit according to claim 2, wherein An operational amplifier is further arranged on the power board, the operational amplifier is connected to the triangular wave generator, and the operational amplifier is connected to the first thermistor.

4. A temperature acquisition method, characterized in that, Applied to the temperature acquisition circuit according to any one of claims 1 to 3, including: Obtaining a first temperature of the first thermistor and a second temperature of the second thermistor; Determining the acquisition temperature of the power distribution and charging system assembly according to the first temperature and the second temperature.

5. The method according to claim 4, characterized in that, Before obtaining the first temperature of the first thermistor and the second temperature of the second thermistor, including: Obtaining the pulse width modulation wave signal, which is obtained according to the triangular wave signal voltage of the triangular wave generator and the first voltage of the first thermistor, and the pulse width modulation wave signal is used to characterize the first temperature.

6. The method according to claim 1, wherein The determining the acquisition temperature of the power distribution and charging system assembly according to the first temperature and the second temperature includes: When the first temperature is greater than or equal to a first preset threshold and the second temperature is less than a second preset threshold, using the second temperature as the acquisition temperature of the power distribution and charging system assembly; or, When the first temperature is greater than or equal to a first preset threshold and the second temperature is greater than or equal to a third preset threshold, using the first temperature as the acquisition temperature of the power distribution and charging system assembly; or, When the first temperature is greater than or equal to a first preset threshold and the second temperature is greater than or equal to the second preset threshold and less than the third preset threshold, using the first temperature as the acquisition temperature of the power distribution and charging system assembly; or, When the first temperature is less than the first preset threshold, using the first temperature as the acquisition temperature of the power distribution and charging system assembly.

7. The method according to claim 6, wherein The first preset threshold includes 125 degrees Celsius, the second preset threshold includes -40 degrees Celsius, and the third preset threshold includes 25 degrees Celsius.

8. A temperature acquisition device, characterized in that, Including: A first acquisition module, configured to acquire a first temperature of the first thermistor and a second temperature of the second thermistor; A determination module, configured to determine the acquisition temperature of the power distribution and charging system assembly according to the first temperature and the second temperature.

9. A storage medium, characterized in that, Including: The storage medium includes a stored program, wherein when the program runs, it controls the device where the storage medium is located to execute the temperature acquisition method according to any one of claims 4 to 7.

10. A charging and power distribution system assembly, comprising a memory and a processor, the memory being used for storing information including program instructions, and the processor being used for controlling the execution of the program instructions, characterized in that, When the program instructions are loaded and executed by a processor, the steps of the temperature acquisition method according to any one of claims 4 to 7 are implemented.

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