Interlock system, substrate processing device, interlock display method, semiconductor device manufacturing method, and program
The integration of detection and display units in substrate processing apparatuses enables easy identification of interlock causes, improving safety and efficiency by visually indicating interlock locations and preventing incorrect operations.
Patent Information
- Application Number
- PCT/JP2023/046692
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2025-07-03
AI Technical Summary
Existing semiconductor manufacturing processes face challenges in easily identifying the location of interlocks or potential interlocks within substrate processing apparatuses, leading to inefficiencies and potential safety hazards.
A detection unit in each module of the substrate processing apparatus detects physical states and outputs signals, an interlock determination unit evaluates conditions for interlocks, and a display control unit graphically displays the cause of interlocks or potential interlocks on a display unit, allowing easy identification of the affected modules.
Facilitates quick identification of interlock locations, preventing incorrect operations and reducing downtime by visually indicating the cause of interlocks, thus enhancing safety and operational efficiency.
Smart Images

Figure JP2023046692_03072025_PF_FP_ABST
Abstract
Description
Interlock system, substrate processing apparatus, interlock display method, semiconductor device manufacturing method and program
[0001] The present disclosure relates to an interlock system, a substrate processing apparatus, an interlock display method, a semiconductor device manufacturing method, and a program.
[0002] In a manufacturing process of a semiconductor device, if a gas sensor detects a leaked gas, a process of executing a corresponding interlock operation may be performed (see, for example, Patent Document 1).
[0003] Patent Publication No. 2021-52110
[0004] The present disclosure provides a technique that makes it possible to easily identify a location that is causing an interlock or a location that could become a cause of an interlock.
[0005] According to one aspect of the present disclosure, there is provided a technology comprising: a detection unit provided in each of a plurality of modules constituting a substrate processing apparatus, which detects the physical state of the substrate processing apparatus and outputs a detection signal; an interlock determination unit which stores the conditions for a predetermined interlock to be established for each of a plurality of interlocks and determines the success or failure of each of the plurality of interlocks based on the detection signal from the detection unit; and a display control unit which, when any of the plurality of interlocks is established, is capable of graphically displaying on a display unit a module corresponding to a factor that caused the interlock to be established, or a module corresponding to a factor that prevents the interlock from being established, in a manner that allows the module to be recognized in an image showing the structure of the substrate processing apparatus.
[0006] According to the present disclosure, it is possible to easily identify a location that is causing an interlock or a location that will become a cause of an interlock.
[0007] FIG. 1 is a perspective view showing an example of a substrate processing apparatus according to an embodiment of the present disclosure; FIG. 2 is a perspective view of the substrate processing apparatus according to an embodiment of the present disclosure, as seen from the rear side; FIG. 3 is a block diagram showing an example of a control configuration of the substrate processing apparatus according to an embodiment of the present disclosure; FIG. 4 is an example of an interlock condition table stored in a storage device according to an embodiment of the present disclosure; FIG. 5 is an example of an interlock display position table stored in a storage device according to an embodiment of the present disclosure; FIG. 6 is a flowchart for explaining an interlock display process of the substrate processing apparatus according to an embodiment of the present disclosure; FIG. 7 is a diagram showing an example of a display screen of a display unit according to an embodiment of the present disclosure; FIG. 8 is a diagram showing an example of a display screen of a display unit according to an embodiment of the present disclosure;
[0008] Hereinafter, one embodiment of the present disclosure will be described mainly with reference to FIGS. 1 to 8. Note that all drawings used in the following description are schematic, and the dimensional relationships between elements, the ratios of elements, and the like shown in the drawings do not necessarily correspond to the actual ones. Furthermore, the dimensional relationships between elements, the ratios of elements, and the like between multiple drawings do not necessarily correspond to the actual ones. Furthermore, the present disclosure is not limited to the following embodiment in any way, and can be implemented with appropriate modifications within the scope of the present disclosure.
[0009] In the following description, a worker refers to a person who uses a substrate processing apparatus or a person who processes substrates using the substrate processing apparatus.
[0010] First, an outline of a substrate processing apparatus 1 according to this embodiment will be described with reference to FIGS.
[0011] Fig. 1 is a perspective view showing an example of a substrate processing apparatus 1 according to this embodiment. Fig. 2 is a perspective view of the substrate processing apparatus 1 according to this embodiment as seen from the rear side. Figs. 1 and 2 show a vertical substrate processing apparatus 1 as an example of a substrate processing apparatus.
[0012] As shown in Figures 1 and 2, the substrate processing apparatus 1 has a housing 2, and an opening for maintenance is provided at the bottom of the front wall 3 of the housing 2, and the opening is opened and closed by a front maintenance door 5.
[0013] A pod loading / unloading port is opened in the front wall 3 of the housing 2 so as to communicate between the inside and outside of the housing 2, and the pod loading / unloading port is opened and closed by a front shutter 7, which is a loading / unloading port opening / closing mechanism. A load port 8, which is a substrate transport container delivery table, is installed on the front side of the pod loading / unloading port, and the load port 8 is configured to align a pod 9 placed thereon.
[0014] The pod 9 is a sealed substrate transport container, and is transported onto and out of the load port 8 by an in-process transport device.
[0015] A rotary pod shelf 11, which is a shelf for storing substrate transport containers, is installed at the top of the housing 2, approximately in the center in the front-to-rear direction, and the rotary pod shelf 11 is configured to store a plurality of pods 9.
[0016] A pod opener 14 , which is a substrate transport container lid opening / closing mechanism, is provided below the rotary pod shelf 11 . The pod opener 14 is configured to hold the pod 9 and to be able to open and close the lid of the pod 9 .
[0017] A pod transfer mechanism 15, which is a container transfer section, is installed between the load port 8 and the rotary pod shelf 11 and pod opener 14. The pod transfer mechanism 15 is capable of moving up and down while holding a pod 9 and moving back and forth horizontally. The pod transfer mechanism 15 is configured to transfer the pod 9 between the load port 8, the rotary pod shelf 11, and the pod opener 14.
[0018] A sub-housing 16 is provided extending to the rear end at the bottom of the housing 2, approximately in the center in the front-to-rear direction. A pair of wafer loading / unloading openings, which are substrate loading / unloading openings for loading and unloading wafers 18 as substrates into and out of the sub-housing 16, are opened in a front wall 17 of the sub-housing 16, arranged vertically in two tiers, one above the other, and pod openers 14 are provided for the upper and lower wafer loading / unloading openings, respectively.
[0019] The pod opener 14 includes a mounting table 21 on which the pod 9 is mounted, and an opening / closing mechanism 22 that opens and closes the lid of the pod 9. The pod opener 14 is configured to open and close the wafer loading / unloading port of the pod 9 by opening and closing the lid of the pod 9 mounted on the mounting table 21 using the opening / closing mechanism 22.
[0020] The sub-housing 16 constitutes a transfer chamber 23 that is airtight from the space (pod transfer space) in which the pod transport mechanism 15 and the rotary pod shelf 11 are disposed. A wafer transfer mechanism 24, which is a transfer machine, is installed in the front region of the transfer chamber 23. The wafer transfer mechanism 24 is configured to load and unload wafers 18 into and from a boat 26, which is a substrate holder.
[0021] A standby section 27 is provided in the rear region of the transfer chamber 23 to accommodate the boat 26 and allow it to wait, and a vertical processing furnace 28 is provided above the standby section 27. The processing furnace 28 has a processing chamber 29 formed therein, and the lower end of the processing chamber 29 serves as a furnace opening, which is opened and closed by a furnace opening shutter. The processing furnace 28 is an example of a processing container for processing wafers 18.
[0022] A boat elevator 32, which is a substrate holder lifting mechanism for lifting and lowering the boat 26, is installed below the processing furnace 28. A seal cap 34 serving as a lid is attached horizontally to the boat elevator 32. The seal cap 34 supports the boat 26 vertically and can airtightly close the furnace throat when the boat 26 is loaded into the processing chamber 29.
[0023] The boat 26 is configured to hold multiple wafers 18 (for example, 50 to 125) in a horizontal position with their centers aligned in multiple stages. Note that in this specification, a numerical range such as "50 to 125" means that the range includes both the lower and upper limits. Thus, for example, "50 to 125" means "50 or more and 125 or less." The same applies to other numerical ranges.
[0024] A clean unit 35 is disposed opposite the boat elevator 32, and the clean unit 35 is composed of a supply fan and a dust filter to supply a purified atmosphere or clean air which is an inert gas.
[0025] A practical section 42 and an exhaust section 43 are provided on the rear wall 41 of the housing 2, each with one side surface continuing to a side surface of the housing 2. The practical section 42 and the exhaust section 43 are provided facing each other. A maintenance space 44 is formed between the practical section 42 and the exhaust section 43. The maintenance space 44 is a space where an operator can perform maintenance and inspection of the substrate processing apparatus 1. The practical section 42 is used as a utility section provided in the substrate processing apparatus 1. The exhaust section 43 can house an exhaust mechanism or the like that exhausts the atmosphere inside the housing 2.
[0026] The practical section 42 is divided into three sections in the height direction, with the upper section being used as a gas box 47 , the middle section being used as a control box 48 , and the lower section being used as a gas box 49 .
[0027] The control box 48 is provided with a process control unit 205 that controls the substrate processing apparatus 1, and a sub-operation panel 50 that is operated by an operator. The sub-operation panel 50 is used as a display unit 204 that displays the physical state of the substrate processing apparatus 1 and as an operation unit 203 that operates the substrate processing apparatus 1.
[0028] The gas box 47 is divided into two parts, left and right, and configured by being partitioned into modules 47a and 47b from the rear wall 41 side. The modules 47a and 47b are provided with openable and closable doors 51a and 51b on the front side, respectively. The doors 51a and 51b are configured to be openable and closable around connecting members 46 such as hinges provided on the outside, respectively. The modules 47a and 47b can house, for example, gas units for the gaseous source material and carrier gas, as well as their gas flow rate control units 208, piping, valves, etc.
[0029] The gas box 49 is divided into two parts, left and right, and configured as modules 49a and 49b from the rear wall 41 side. The modules 49a and 49b are provided with openable and closable doors 52a and 52b on the front side, respectively. The doors 52a and 52b are configured to be openable and closable around connecting members 46 provided on the outside, respectively. The modules 49a and 49b can house, for example, tanks for liquid raw materials and vaporizers, as well as their associated gas flow rate control units 208, piping, valves, etc.
[0030] That is, the practical section 42 is made up of a plurality of modules 47 a, 47 b, 49 a, 49 b divided into a plurality of sections, and a control box 48. An operator can open doors 51 a, 51 b, 52 a, 52 b of each of the modules 47 a, 47 b, 49 a, 49 b to perform maintenance on the gas supply system, such as the gas units for the gaseous source and carrier gas, the tanks and vaporizers for the liquid source, and the gas flow rate control units 208, piping, valves, etc.
[0031] The rear wall 41 of the housing 2 is divided into two, upper and lower, and is configured by dividing the upper section into modules 54 and 55. Each of the modules 54 and 55 is provided with a maintenance and inspection opening, and each of the maintenance and inspection openings is provided with a door 56 or 57. The doors 56 and 57 are configured to be able to open and close freely, with a connecting member 46 provided on the practical section 42 side of the rear wall 41 (the right side in FIG. 2 ) as an axis.
[0032] Sensors 53a to 53f serving as detectors for detecting the open / closed states of the doors 51a, 51b, 52a, 52b, 56, and 57 of the modules 47a, 47b, 49a, 49b, 54, and 55 and outputting detection signals are provided inside the doors 51a, 51b, 52a, 52b, 56, and 57 of the modules 47a, 47b, 49a, 49b, 54, and 55. In addition to the sensors 53a to 53f, the modules 47a, 47b, 49a, 49b, 54, and 55 are also provided with a first group of sensors for detecting the open / closed states of the valves of the modules 47a, 47b, 49a, 49b, 54, and 55 and the physical states of the substrate processing apparatus 1, such as pressure sensors, temperature sensors, flow rate sensors, and liquid leakage sensors, and outputting detection signals.
[0033] In the substrate processing apparatus 1, multiple types of chemical substances are used when processing wafers 18. The chemical substances are classified into flammable, combustion-stimulating, toxic, corrosive, etc., and the allowable exposure concentration is determined for each substance. Therefore, the gas supply system, such as piping, is housed in gas boxes 47 and 49, and a first sensor group, etc., provided in each module 47 a, 47 b, 49 a, 49 b is configured to detect gas leaks and activate an interlock.
[0034] Here, the interlock (hereinafter referred to as ILK) refers to a safety mechanism implemented by a ladder program or the like in a PLC (Programmable Logic Controller) to prevent erroneous settings and erroneous operations that should not be performed on equipment such as a substrate processing apparatus.
[0035] In this embodiment, the ILK is set to operate by detecting physical conditions such as the open / closed states of the doors 51a, 51b, 52a, 52b, 56, and 57, the open / closed states of the valves provided in the modules 47a, 47b, 49a, 49b, 54, and 55, pressure, temperature, flow rate, and liquid leakage using a first sensor group or the like provided in each of the modules 47a, 47b, 49a, 49b, 54, and 55. Note that each of the modules 47a, 47b, 49a, 49b, 54, and 55 is partitioned so that the sensors that cause the ILK to operate and the locations that are the substantial causes of the ILK, which will be described in detail later, are located in the same module.
[0036] For example, the ILK is set to operate by detecting the open / closed states of the valves so as to prevent simultaneous opening of valves of gases that may cause an unintended reaction when mixed together. Also, the ILK is set to operate by detecting each sensor provided in the modules 54 and 55 so as to prevent the doors 56 and 57 from being opened accidentally when the processing furnace 28 is in a high temperature state, while the wafers 18 are being processed in the processing furnace 28, or while the wafers 18 are being transferred in the transfer chamber 23.
[0037] Next, the operation of the substrate processing apparatus 1 will be described.
[0038] When the pod 9 is supplied to the load port 8, the pod loading / unloading port is opened by the front shutter 7. The pod 9 on the load port 8 is carried into the housing 2 by the pod transport mechanism 15 and placed on the rotary pod shelf 11. After being temporarily stored on the rotary pod shelf 11, the pod 9 is transported by the pod transport mechanism 15 to one of the pod openers 14 and transferred to the placement table 21, or is directly transferred from the load port 8 to the placement table 21.
[0039] At this time, the wafer loading / unloading port is closed by the opening / closing mechanism 22, and clean air is circulated in the transfer chamber 23, filling it.
[0040] The open end face of the pod 9 placed on the mounting table 21 is pressed against the edge of the opening of the wafer loading / unloading port in the front wall 17 of the sub-housing 16, and the lid is removed by the opening / closing mechanism 22, opening the wafer loading / unloading port.
[0041] When the pod 9 is opened by the pod opener 14, the wafers 18 are removed from the pod 9 by the wafer transfer mechanism 24. After the wafers 18 are aligned by a notch alignment device, the wafer transfer mechanism 24 transports the wafers 18 into a waiting section 27 at the rear of the transfer chamber 23 and charges them into a boat 26.
[0042] After transferring the wafers 18 to the boat 26 , the wafer transfer mechanism 24 returns to the pod 9 and loads the next wafer 18 into the boat 26 .
[0043] While the wafer transfer mechanism 24 in one (upper or lower) pod opener 14 is loading wafers 18 into the boat 26, another pod 9 is transported from the rotary pod shelf 11 to the other (lower or upper) pod opener 14 by the pod transport mechanism 15 and transferred thereto, and the other pod opener 14 simultaneously begins opening the pod 9.
[0044] When a predetermined number of wafers 18 are loaded into the boat 26, the furnace opening of the processing furnace 28, which has been closed by the furnace opening shutter, is opened. Then, the boat 26 is raised by the boat elevator 32 and loaded into the processing chamber 29.
[0045] After loading, the furnace throat is airtightly closed by the seal cap 34. Note that, in this embodiment, at this timing (after loading), a purging step (pre-purging step) is performed in which the gas in the processing chamber 29 is replaced with an inert gas.
[0046] The processing chamber 29 is evacuated to a desired pressure (vacuum level) by the exhaust control unit 210. The processing chamber 29 is also heated to a predetermined temperature by the temperature control unit 207 to achieve a desired temperature distribution.
[0047] Furthermore, a process gas controlled at a predetermined flow rate is supplied by the gas supply mechanism, and as the process gas flows through the process chamber 29, it comes into contact with the surface of the wafer 18, and a predetermined process is performed on the surface of the wafer 18. Furthermore, the process gas after reaction is exhausted from the process chamber 29 by the exhaust mechanism. In this disclosure, the process gas means the gas supplied into the process chamber 29. This also applies to the following description.
[0048] After the preset processing time has elapsed, an inert gas is supplied by the gas supply mechanism, the processing chamber 29 is replaced with the inert gas, and the pressure in the processing chamber 29 is returned to normal pressure (after-purge process). Then, the boat 26 is lowered by the boat elevator 32 via the seal cap 34. The processing time in this disclosure refers to the time the processing continues. This also applies to the following explanations.
[0049] To remove the processed wafers 18, the wafers 18 and the pod 9 are unloaded from the housing 2 in the reverse order of the above description. Unprocessed wafers 18 are loaded into the boat 26, and batch processing of the wafers 18 is performed one or more times.
[0050] 1 and 2 , the substrate processing apparatus 1 includes a control unit 100, which controls the substrate processing apparatus 1. The control unit 100 may be built into the substrate processing apparatus 1, or may be provided so as to be accessible to the substrate processing apparatus 1 from outside the substrate processing apparatus 1. In the following, a case where the control unit 100 according to this embodiment is applied to the substrate processing apparatus 1 will be described, but the control unit 100 may also control apparatuses other than the substrate processing apparatus 1.
[0051] Next, the configuration of a control system of the substrate processing apparatus 1 according to this embodiment will be described with reference to Fig. 3. Fig. 3 is a block diagram showing an example of the functional configuration of the substrate processing apparatus 1 according to this embodiment.
[0052] As shown in FIG. 3, the substrate processing apparatus 1 includes a control unit 100 which is a main controller, an external communication unit 201, an external memory unit 202, an operation unit 203, a display unit 204, a process control unit 205, and a transport control unit 206.
[0053] The control unit 100 is configured as a computer including a CPU (Central Processing Unit) 102, a memory 103, a storage device 104 as a storage unit, and an I / O port (hereinafter referred to as I / O) 105. The control unit 100 is connected to a network such as the Internet, a LAN (Local Area Network), or a WAN (Wide Area Network) using an external communication unit 201, and is capable of communicating with external devices via the network.
[0054] The control unit 100 is connected to a process control unit 205 and a transport control unit 206 via an I / O 105 .
[0055] The control unit 100 is also connected to an external host computer via an external communication unit 201. Therefore, even if the substrate processing apparatus 1 is installed in a clean room, the host computer can be located in an office or the like outside the clean room. The control unit 100 is also connected to an external storage unit 202 as an attachment unit into which a USB (Universal Serial Bus) memory or the like, which is an example of a recording medium, is inserted and removed.
[0056] The display unit 204 is a display device such as a liquid crystal display panel that displays a screen. The operation unit 203 performs operation input using an input device such as a keyboard. The operation unit 203 and the display unit 204 can be integrated into one unit, for example, in the case of a touch panel. In this embodiment, the sub-operation panel 50 is used as the operation unit 203 and the display unit 204.
[0057] The display unit 204 displays a screen for checking the status of the substrate process system controlled by the process control unit 205 and the substrate transport system controlled by the transport control unit 206. The display unit 204 can also display on the screen various operation buttons as an input unit for inputting operation instructions to the substrate process system and the substrate transport system.
[0058] The process control unit 205 is connected to the substrate process system of the substrate processing apparatus 1, including a temperature control unit 207, a gas flow rate control unit 208, a pressure control unit 209, an exhaust control unit 210, a rotation unit 211, a boat elevator 32, a first sensor group and valve 212, a first safety PLC 213, and an alarm 214. The first sensor group and valve 212 includes sensors 53a to 53f as well as sensors and valves provided in the gas boxes 47 and 49, the processing furnace 28, and the standby unit 27. The process control unit 205 is configured to control each of the temperature control unit 207, the gas flow rate control unit 208, the pressure control unit 209, the exhaust control unit 210, the rotation unit 211, the boat elevator 32, and the alarm 214. The alarm 214 is, for example, a buzzer that emits a warning sound or a rotating light. The process control unit 205 is also configured to transmit detection signals from the first sensor group and valve 212 to the CPU 102 via the I / O 105. The temperature control unit 207, gas flow rate control unit 208, pressure control unit 209, exhaust control unit 210, and first safety PLC 213 each constitute a sub-controller and are electrically connected to the process control unit 205. The process control unit 205 and each sub-controller (the temperature control unit 207, gas flow rate control unit 208, pressure control unit 209, exhaust control unit 210, and first safety PLC 213) may be configured separately or integrally. A power circuit breaker 215 is connected to the first safety PLC 213.
[0059] The transfer control unit 206 is connected to the substrate transfer system of the substrate processing apparatus 1, including the pod transfer mechanism 15, the wafer transfer mechanism 24, the second sensor group and valve 216, and the second safety PLC 217. The second sensor group and valve 216 includes sensors and valves provided in the transfer chamber 23 and the like, excluding the gas boxes 47 and 49, the processing furnace 28, and the standby unit 27. The transfer control unit 206 is configured to control the pod transfer mechanism 15 and the wafer transfer mechanism 24, each of which includes a plurality of servo motors. The transfer control unit 206 is also configured to transmit detection signals from the second sensor group and valve 216 to the CPU 102 via the I / O 105. The second safety PLC 217 constitutes a sub-controller and is electrically connected to the transfer control unit 206. The transfer control unit 206 and the second safety PLC 217, which serves as a sub-controller, may be configured separately or integrally. A power circuit breaker 218 is connected to the second safety PLC 217.
[0060] The first safety PLC 213 and the second safety PLC 217 are sequencers conforming to standards such as ISO 13849-1 and IEC 61508, and are used as safety interlock devices that implement logic capable of determining whether multiple ILK conditions are met. The first safety PLC 213 is configured to output the results of calculations of each definition equation to the alarm 214, display unit 204, power supply circuit breaker 215, etc. of the substrate processing apparatus 1 based on detection signals from the first sensor group and the valve 212. The second safety PLC 217 is configured to output the results of calculations of each definition equation to the display unit 204, power supply circuit breaker 218, pod transport mechanism 15, wafer transfer mechanism 24, etc. based on detection signals from the second sensor group and the valve 216. The first safety PLC 213, the second safety PLC 217, and the control unit 100 are implemented by hardware that is independent of each other. The first safety PLC 213 and the second safety PLC 217 may be interconnected or integrated into one PLC. The first safety PLC 213 and the second safety PLC 217 are described in ladder.
[0061] That is, the control unit 100 is configured to receive detection signals from the first sensor group and valve 212 or the second sensor group and valve 216 via the process control unit 205 or the transport control unit 206, and I / O 105, respectively, and is equipped with an interlock determination program that determines the success or failure of each of the multiple ILKs, and to make the same determination as the first safety PLC 213 and the second safety PLC 217. This makes it possible to operate the ILKs even if a malfunction occurs in the control unit 100, the first safety PLC 213, or the second safety PLC 217.
[0062] The control unit 100, the process control unit 205, and the transport control unit 206 according to this embodiment can be realized using a normal computer system, rather than a dedicated system. For example, each controller that executes a predetermined process can be configured by installing a program for executing the above-described processes from a recording medium (CD-ROM, USB, etc.) that stores the program into a general-purpose computer.
[0063] The means for supplying these programs is arbitrary. As described above, they can be supplied via a predetermined recording medium, or, for example, they can be supplied via a communication network.
[0064] A recipe file containing processing conditions for substrate processing such as a recipe may be acquired from another device via the external communication unit 201, or may be acquired from a recording medium such as a USB via the external storage unit 202.
[0065] The storage device 104 is, for example, an auxiliary storage device such as a hard disk drive (HDD), a solid state drive (SSD), a flash memory, etc. The storage device 104 stores a recording medium for recording an operation program executed by the CPU 102 and a recording medium for recording a recipe file. The operation program stored in the storage device 104 is transferred to the memory 103 of the control unit 100 and executed, for example, when the substrate processing apparatus 1 is started up.
[0066] The storage device 104 also stores a display processing program for executing processing for displaying the occurrence of ILK according to this embodiment. The display processing program is, for example, pre-installed in the substrate processing apparatus 1. The display processing program may be realized by recording it on a non-volatile recording medium or distributing it via a network and installing it appropriately in the substrate processing apparatus 1. Examples of non-volatile recording media include CD-ROMs, magneto-optical disks, HDDs, DVD-ROMs, flash memories, memory cards, and USBs.
[0067] The storage device 104 also stores an interlock condition table in which conditions for a preset ILK to be satisfied are associated with each of a plurality of ILKs. The storage device 104 also stores image data of an image showing the structure of the substrate processing apparatus 1 and image data of information showing a plurality of ILKs.
[0068] FIG. 4 is a diagram showing an example of an interlock condition table stored in the storage device 104. As shown in FIG. 4, the storage device 104 stores preset conditions for the establishment of ILK for each of multiple ILKs. Specifically, an ID, which is an identification number indicating the content of the ILK, an alarm ID identifying the alarm content, one factor that establishes the ILK or one factor that prevents the ILK from being established, the location where the ILK occurs, and the output content of the ILK are stored in association with each other. The location where the ILK occurs is based on a detection signal from the first sensor group or valve 212 or the second sensor group or valve 216, which is one factor that establishes the ILK or one factor that prevents the ILK from being established. Furthermore, when there are multiple factors that establish the ILK, the condition is defined by a combination of Boolean algebra and timer processing. Furthermore, the condition for the ILK to be established may be switched depending on the state of the substrate processing apparatus 1, such as during substrate processing, cleaning processing, idling, or maintenance.
[0069] As the output content of the ILK, if the cause of the ILK is in the substrate process system, a power control system ILK such as a buzzer, a display on the display unit 204, or cutting off the power supply to the entire apparatus or the power supply to each unit connected to the process control unit 205 is set. Also, if the cause of the ILK is in the substrate transport system, a transport system ILK such as a buzzer, a display on the display unit 204, or cutting off the power supply to each unit connected to the transport control unit 206 is set. Also, if the cause of the ILK is a gas leak or the like, a gas system ILK such as a buzzer, a display on the display unit 204, or closing the corresponding valve or all valves is set.
[0070] The storage device 104 also stores image data of an image showing the structure of the substrate processing apparatus 1, and an interlock display position table that holds positions in the image showing the structure of the substrate processing apparatus 1 corresponding to modules corresponding to each factor that establishes an ILK or each factor that prevents the establishment of an ILK. The interlock display position table also stores substantial factors (also called essential factors) that are not direct factors that establish an ILK but are fundamental factors, in association with IDs, etc. In other words, the interlock display position table can also be called a substantial factor table that holds, for each of multiple ILKs, the substantial factor that establishes the ILK as one factor that establishes the ILK.
[0071] Here, substantial causes also include a manual valve or the like that is not detected by the first sensor group and valve 212 or the second sensor group and valve 216. In other words, even if a location that is not detected by the first sensor group and valve 212 or the second sensor group and valve 216 is a cause of ILK, it is possible to identify the location that is the cause of ILK.
[0072] 5 is a diagram showing an example of an interlock display position table stored in the storage device 104. As shown in Fig. 5, the storage device 104 stores an interlock display position table that holds positions in an image showing the structure of the substrate processing apparatus 1 that correspond to modules corresponding to each factor that establishes an ILK or modules corresponding to each factor that prevents the establishment of an ILK. Specifically, an ID, an alarm ID, a graphic number of image data of the image showing the structure of the substrate processing apparatus 1 used when displaying on the display unit 204, a module ID identifying the module corresponding to the factor that establishes an ILK or the module corresponding to the factor that prevents the establishment of an ILK, the actual factor of the ILK, display coordinates of information indicating the ILK, and coordinates indicating the hatched area of the module corresponding to the factor that establishes an ILK or the module corresponding to the factor that prevents the establishment of an ILK, all of which are stored in association with each other.
[0073] Here, images showing the structure of the substrate processing apparatus 1 can include images of a three-dimensional model of the substrate processing apparatus 1 projected or viewed from a specified viewpoint, as well as images such as photographs of an apparatus with substantially the same configuration as the substrate processing apparatus 1.
[0074] Then, under the control of the control unit 100, the display unit 204 can graphically display, in a recognizable manner on an image showing the structure of the substrate processing apparatus 1, a module corresponding to one factor that caused the ILK to be established when any of the multiple ILKs is established, or a module corresponding to one factor that prevents the ILK from being established when an ILK occurs when one more physical state satisfies the conditions.
[0075] Furthermore, under the control of the control unit 100, the display unit 204 can display information indicating ILK, including at least one of the occurrence of ILK, the location of ILK occurrence, ID, ILK event, and ILK cause, superimposed on an image showing the structure of the substrate processing apparatus 1 at a position corresponding to a module corresponding to each cause. Here, image data can be used as the information indicating ILK.
[0076] That is, in this embodiment, the control unit 100 functions as a display control unit capable of controlling the display unit 204. The control unit 100 also functions as an interlock determination unit that stores the conditions for establishing preset ILKs for each of the plurality of ILKs and determines the success or failure of each of the plurality of ILKs based on detection signals from the first sensor group and valve 212 and the second sensor group and valve 216. The control unit 100 also functions as a preliminary detection unit that, when an ILK occurs when one more physical state among the plurality of ILKs satisfies the condition, detects a module corresponding to a factor preventing the establishment of the ILK. That is, the control unit 100 can be called an interlock system that determines an ILK based on detection signals from sensors, etc., and graphically displays on the display unit 204 a module corresponding to a factor that caused the ILK to be established or a module corresponding to a factor preventing the ILK from being established so that the module can be recognized in an image showing the structure of the substrate processing apparatus 1.
[0077] Next, the display process of ILK during operation of the substrate processing apparatus 1 will be described with reference to FIGS.
[0078] In step S101, the control unit 100 detects ILK in a preliminary determination using the first sensor group and valve 212 or the second sensor group and valve 216. Then, when the control unit 100 determines that ILK will be activated when one more physical state satisfies the condition based on the interlock condition table stored in the storage device 104 (Yes in step S101), in step S102, it identifies the module corresponding to one factor that is preventing the establishment of the ILK.
[0079] Specifically, the first sensor group and the valve 212, or the second sensor group and the valve 216, respectively detect the physical states of the substrate processing apparatus 1 and output the detected signals to the CPU 102 via the process control unit 205, the transport control unit 206, and the I / O 105. When it is determined based on the detection signals from the first sensor group and the valve 212, or the second sensor group and the valve 216, that the ILK will be activated if one more physical state satisfies the condition, the control unit 100 identifies, in step S102, a module corresponding to one factor that prevents the ILK from being established based on the detection signal.
[0080] Then, in step S103, the control unit 100 graphically displays, on the display unit 204, a module corresponding to one factor preventing the establishment of the detected unestablished ILK, so that the module is recognizable in the image showing the structure of the substrate processing apparatus 1. That is, the control unit 100 graphically displays the module identified in step S102 so that the module is recognizable in the image showing the structure of the substrate processing apparatus 1. This allows the operator to recognize the operation to activate the ILK before the ILK is activated, and makes it possible to prevent erroneous operation to activate the ILK.
[0081] 7, the display unit 204 displays an image showing the structure of the rear side of the substrate processing apparatus 1, in a manner that enables identification of the location where the ILK will occur. For example, the doors 56 and 57 on the rear side of the substrate processing apparatus 1 are displayed hatched based on the interlock display position table stored in the storage device 104, and information indicating the ILK, such as "Opening this door will activate the interlock," is superimposed on the image. In this way, a warning (also called a caution display) is displayed to prevent the ILK from being activated before the ILK is activated, so that the doors are not accidentally opened and the ILK is not activated.
[0082] Then, in step S104, the control unit 100 determines whether each of the multiple ILKs is successful or not based on the interlock condition table stored in the storage device 104. If any of the multiple ILKs is successful (Yes in step S104), in step S106, the control unit 100 identifies a module corresponding to one factor that caused the ILK to be successful. At this time, the control unit 100 also performs output based on the factor via the process control unit 205 or the transport control unit 206 based on the interlock condition table. Specifically, it performs operations such as sounding a buzzer, cutting off the power supply to each unit or the entire device, closing the corresponding valve or all valves, etc.
[0083] Furthermore, if the control unit 100 determines that none of the multiple ILKs are established (No in step S104), in step S105, it erases the display in step S103 and returns to the processing of step S101.
[0084] Then, in step S107, the control unit 100 graphically displays the modules identified in step S106 in a recognizable manner on the image showing the structure of the substrate processing apparatus 1.
[0085] Specifically, for example, when a liquid leak is detected by a liquid leak sensor, the ID, alarm ID, and location of the ILK are identified using an interlock condition table stored in the memory device 104, and a buzzer and a corresponding valve-close ILK are activated. Based on the identified ID or alarm ID, the interlock display position table stored in the memory device 104 identifies that the substantial cause of the liquid leak is the carburetor, and also identifies the display coordinates of the ILK, the display coordinates of information indicating the ILK, and the coordinates indicating the hatched area of the module corresponding to the cause of the ILK. As shown in FIG. 8 , the module in the practical section 42 corresponding to the cause of the ILK is displayed as hatched based on the identified ILK display coordinates and the coordinates indicating the hatched area. Information indicating the ILK, such as the occurrence of the ILK, the ID, the substantial cause (also referred to as the cause) of the ILK, and the ILK event, is superimposed on the image of the hatched module in the practical section 42.
[0086] In this way, by graphically displaying the location of ILK on an image showing the structure of the substrate processing apparatus 1 and superimposing information indicating the ILK, such as the occurrence of ILK, the cause of the ILK, and the ILK phenomenon, on top of that, it is possible to easily identify the location of the ILK occurrence and the actual cause of the ILK, thereby reducing the amount of time the apparatus is down. Note that, although Fig. 8 shows a simplified view of the internal structure of the practical section 42, the image showing the structure of the practical section 42 may be an image obtained by projecting or perspectively viewing a three-dimensional model of the practical section 42 from a predetermined viewpoint, or an image obtained by photographing an apparatus having substantially the same configuration as the practical section 42.
[0087] Then, in step S108, the control unit 100 determines whether the ILK has been released. That is, after completing the replacement of the part that is the actual cause of the ILK, the worker releases the ILK by pressing the reset switch. If the control unit 100 determines in step S108 that the ILK has not been released, the process returns to step S107.
[0088] In step S108, when the control unit 100 receives an operation to cancel the ILK and determines that the ILK has been canceled, the control unit 100 erases the display of the canceled ILK in step S109 and ends the process. The operation to cancel the ILK can be performed from a screen that displays a list of IDs and alarm IDs, or can also be performed by clicking on a module on which information indicating the ILK is superimposed in an image showing the structure of the substrate processing apparatus 1 displayed on the display unit 204.
[0089] In this way, by displaying the location where the ILK is occurring or the location where the ILK is to occur on an image showing the structure of the device, the worker can easily identify the location where the ILK is occurring or the location where the ILK is to occur.Furthermore, by further displaying information indicating the ILK, it becomes easier to investigate the cause of the ILK, and the time during which the device is down can be reduced.Furthermore, when multiple ILKs occur, the worker can infer the commonality of the actual causes from the proximity of the ILK occurrence locations.
[0090] FIG. 9 shows a modified example of the display screen of ILK on the display unit 204. In FIG.
[0091] FIG. 9 shows a case where a plurality of ILKs occur in the same module of the substrate processing apparatus 1.
[0092] When another ILK to be displayed is established before the displayed preceding ILK is released, information indicating each of the preceding and succeeding ILKs is superimposed and displayed at positions corresponding to the modules corresponding to the respective factors on the display unit 204 under the control of the control unit 100. That is, when positions corresponding to modules corresponding to the respective factors are close to each other in the image showing the structure of the substrate processing apparatus 1, the control unit 100 superimposes and displays one display so that the other display hides the other.
[0093] This modification also provides the same effects as the above-described embodiment. Furthermore, in this modification, the worker can estimate the commonality of the substantial causes of the ILK from the proximity of the occurrence locations of the ILK displayed on the display unit 204. Furthermore, because the displays are superimposed, the displays are consolidated and easy to see, making it easier for the worker to identify the occurrence locations of the ILK.
[0094] The configuration of the substrate processing apparatus 1 and the display control of the display unit 204 described in the above embodiments and modifications are merely examples, and may be changed depending on the situation without departing from the spirit of the invention.
[0095] In the above embodiment, an example has been described in which the practical unit 42 is divided into a plurality of modules, and a module corresponding to one factor that has established ILK or one factor that has prevented ILK from being established is graphically displayed on the display unit 204 so as to be recognizable in an image showing the structure of the substrate processing apparatus 1. The present disclosure is not limited to this, and the exhaust unit 43 or other components that make up the substrate processing apparatus 1 may be divided into a plurality of modules, and a module corresponding to one factor that has established ILK or one factor that has prevented ILK from being established may be graphically displayed on the display unit 204 so as to be recognizable in an image showing the structure of the substrate processing apparatus 1.
[0096] In the above embodiment, the control unit 100 is used as an interlock determination unit and a display control unit. However, the present disclosure is not limited to this. The interlock determination unit and the display control unit may be provided in a host computer shared by multiple apparatuses. In this case, the host computer may receive sensor information and information indicating the ILK from the substrate processing apparatus 1, determine whether the ILK has been established, and control the display unit to display the result. Furthermore, a mobile terminal such as a tablet terminal may be used as the display unit 204.
[0097] In the above embodiment, an example has been described in which a module corresponding to one factor that has established ILK or a module corresponding to one factor that is preventing ILK from being established is graphically displayed on the display unit 204 so as to be recognizable in an image showing the structure of the substrate processing apparatus 1. The present disclosure is not limited to this, and an augmented reality device may be used that displays an image indicative of ILK superimposed on an actual image of the substrate processing apparatus 1 so as to be recognizable by human vision.
[0098] Furthermore, the processing flow described in the above embodiment is also an example, and unnecessary steps may be deleted, new steps may be added, or the processing order may be changed within the scope of the main idea.
[0099] In the above embodiment, the processing according to the embodiment is realized by a software configuration using a computer by executing a program, but the present invention is not limited to this. The above embodiment may be realized by a hardware configuration or a combination of a hardware configuration and a software configuration, for example.
[0100] The present disclosure can be applied not only to substrate manufacturing apparatuses for semiconductor manufacturing, but also to apparatuses for processing glass substrates, such as LCD (Liquid Crystal Display) manufacturing apparatuses, and other substrate manufacturing apparatuses. The substrate processing may include not only film formation processes such as CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), epitaxial growth films, oxide films, nitride films, metal-containing films, etc., but also annealing processes, oxidation processes, diffusion processes, etching processes, exposure processes, lithography, coating processes, molding processes, development processes, dicing processes, wire bonding processes, inspection processes, etc.
[0101] In the above-described embodiment, an example of processing substrates using a vertical (also referred to as a batch type) substrate processing apparatus that processes multiple substrates at a time has been described. The present disclosure is not limited to the above-described embodiment and can be suitably applied, for example, to a case where substrates are processed using a single-wafer type substrate processing apparatus that processes one or several substrates at a time. Furthermore, in the above-described embodiment, an example of processing substrates using a substrate processing apparatus having a hot-wall type processing furnace has been described. The present disclosure is not limited to the above-described embodiment and can be suitably applied to a case where substrates are processed using a substrate processing apparatus having a cold-wall type processing furnace.
[0102] When using these substrate processing apparatuses, each process can be performed using the same processing procedures and conditions as in the above-described embodiments and modifications, and the same effects as in the above-described embodiments and modifications can be obtained.
[0103] The above-described embodiments and modifications may be used in combination as appropriate. The processing procedures and processing conditions in such a case may be the same as those of the above-described embodiments and modifications, for example.
[0104] 1 Substrate processing apparatus 45a, 45b, 47a, 47b, 54, 55 Modules 53a to 53f Sensors (detection units) 100 Control unit 204 Display unit
Claims
1. A detection unit provided in each of a plurality of modules constituting a substrate processing apparatus, which detects the physical state of the substrate processing apparatus and outputs it as a detection signal; an interlock determination unit that stores the conditions for the establishment of a preset interlock for each of the plurality of interlocks, and determines whether each of the plurality of interlocks is established based on the detection signal from the detection unit; and a display control unit that can graphically display, on a display unit so as to be recognizable in an image showing the structure of the substrate processing apparatus, a module corresponding to one factor that established the interlock when any one of the plurality of interlocks is established, or a module corresponding to one factor that prevents the establishment of the interlock when the interlock occurs if the physical state satisfies the conditions. An interlock system comprising the above components.
2. The interlock system according to claim 1, further comprising a storage unit that stores a display position table that holds the image data of the image showing the structure of the substrate processing apparatus and the positions in the image showing the structure of the substrate processing apparatus corresponding to the modules corresponding to the respective factors that establish the interlock, or the modules corresponding to the respective factors that prevent the establishment of the interlock. The display control unit controls to display information indicating the interlock on the image showing the structure of the substrate processing apparatus by superimposing it on the positions corresponding to the modules corresponding to the respective factors.
3. The interlock system according to claim 2, wherein the information indicating the interlock is image data.
4. The interlock system according to claim 2, wherein the storage unit further stores a substantial factor table that holds, for each of the plurality of interlocks, the substantial factor that established the interlock as one factor that established the interlock.
5. The interlock system according to claim 1, further comprising a preliminary detection unit that detects a module corresponding to a factor that prevents the establishment of an interlock when the subsequent physical state among the plurality of interlocks satisfies the condition; and the display control unit graphically displays, on the display unit in a recognizable manner in an image showing the structure of the substrate processing apparatus, a module corresponding to a factor that prevents the establishment of the interlock for the unestablished interlock detected by the preliminary detection unit.
6. The interlock system according to claim 1, wherein the plurality of modules are obtained by dividing at least one of a utility unit and an exhaust unit provided in the substrate processing apparatus into a plurality of sections.
7. The interlock system according to claim 1, wherein the image showing the structure of the substrate processing apparatus includes at least one of an image obtained by projecting or perspective-projecting a three-dimensional model of the substrate processing apparatus from a predetermined viewpoint and an image obtained by photographing an apparatus having substantially the same configuration as the substrate processing apparatus.
8. The interlock system according to claim 1, wherein the display unit is an augmented reality device that displays the image such that an image indicating an interlock is superimposed on a real image of the substrate processing apparatus and recognized by human vision.
9. The interlock system according to claim 1, further comprising a safety interlock device that implements a logic capable of determining whether the conditions of the plurality of interlocks are satisfied and outputs, based on a detection signal from the detection unit, the calculation results of respective definitions to at least one of a warning sound of the substrate processing apparatus, the display control unit, a power breaker, a container transfer unit, a transfer machine, and a valve; and the interlock determination unit is implemented by a control unit that executes a program for making the same determination as the safety interlock device.
10. The interlock system according to claim 1, wherein when another interlock to be displayed is established before the displayed previous interlock is released, the display control unit superimposes information indicating the previous and subsequent interlocks on positions corresponding to the modules corresponding to the respective factors, and when the positions corresponding to the modules corresponding to the respective factors in the image showing the structure of the substrate processing apparatus are close to each other, controls to superimpose and display such that one display is hidden by the other display.
11. The interlock system according to claim 9, wherein the safety interlock device and the control unit are implemented by hardware independent of each other.
12. A substrate processing apparatus comprising: a plurality of modules; a detection unit provided in each of the plurality of modules to detect a physical state of the apparatus and output it as a detection signal; an interlock determination unit that stores, for each of a plurality of interlocks, conditions for the preset interlocks to hold, and determines whether or not each of the plurality of interlocks holds based on the detection signal from the detection unit; and a display control unit that, when any one of the plurality of interlocks holds, graphically displays, on a display unit, a module corresponding to one factor that has caused the interlock to hold, or, when an interlock occurs when a physical state satisfies a condition, a module corresponding to one factor that has prevented the interlock from holding, so as to be recognizable in an image showing the structure of the apparatus.
13. An interlock display method comprising: a step of detecting, by a detection unit provided in each of a plurality of modules constituting a substrate processing apparatus, a physical state of the substrate processing apparatus and outputting it as a detection signal; a step of storing, for each of a plurality of interlocks, conditions for the preset interlocks to hold, and determining whether or not each of the plurality of interlocks holds based on the detection signal from the detection unit; and a step of graphically displaying, on a display unit, a module corresponding to one factor that has caused the interlock to hold, or, when an interlock occurs when a physical state satisfies a condition, a module corresponding to one factor that has prevented the interlock from holding, so as to be recognizable in an image showing the structure of the substrate processing apparatus.
14. A step of processing a substrate; a step of detecting the physical state of the apparatus by detection units respectively provided in a plurality of modules constituting the apparatus and outputting it as a detection signal; a step of storing the conditions for establishing a preset interlock for each of the plurality of interlocks, and determining whether each of the plurality of interlocks is established based on the detection signal from the detection unit; a step of graphically displaying, on a display unit so as to be recognizable in an image showing the structure of the apparatus, a module corresponding to one factor that has established the interlock when any one of the plurality of interlocks is established, or a module corresponding to one factor that prevents the establishment of the interlock when the physical state satisfies the conditions and the interlock occurs. A method for manufacturing a semiconductor device having these steps.
15. A procedure of detecting the physical state of the substrate processing apparatus by detection units respectively provided in a plurality of modules constituting the substrate processing apparatus and outputting it as a detection signal; a procedure of storing the conditions for establishing a preset interlock for each of the plurality of interlocks, and determining whether each of the plurality of interlocks is established based on the detection signal from the detection unit; a procedure of graphically displaying, on a display unit so as to be recognizable in an image showing the structure of the substrate processing apparatus, a module corresponding to one factor that has established the interlock when any one of the plurality of interlocks is established, or a module corresponding to one factor that prevents the establishment of the interlock when the physical state satisfies the conditions and the interlock occurs. A program for causing the substrate processing apparatus to execute these procedures.
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