Substrate processing device, substrate processing method, method for manufacturing semiconductor device, program, and transfer machine

Abstract

The present invention provides a technology capable of reducing adhering of particles to a substrate.　This substrate processing device comprises: (a) a processing chamber in which a substrate held by a substrate holder is processed; (b) a transfer chamber which is adjacent to the processing chamber and in which the substrate holder can be disposed; and (c) an injector which is disposed in the transfer chamber and is configured to be movable in the longitudinal direction of a column of the substrate holder in the transfer chamber, and which injects gas toward the column.

Description

Substrate processing apparatus, substrate processing method, semiconductor device manufacturing method, program, and transfer machine

[0001] The present disclosure relates to a substrate processing apparatus, a substrate processing method, a semiconductor device manufacturing method, a program, and a transfer machine.

[0002] In substrate processing in the manufacturing process of semiconductor devices, for example, a vertical substrate processing apparatus may be used to process multiple substrates (semiconductor silicon wafers) at once. This type of substrate processing apparatus uses a boat (substrate holder) that holds multiple substrates in a horizontal position with their centers aligned in multiple stages. The boat has multiple holding members (pillars) that hold the substrates (for example, Japanese Patent Application Laid-Open No. 2023-32646).

[0003] Japanese Patent Application Laid-Open No. 2023-32646

[0004] In film formation processes, a thin film is formed on the surface of the substrate, and also on the surface of the boat. For example, when the processed substrate is unloaded, the thin film formed on the boat may peel off from the supports, turn into particles, and adhere to the substrate.

[0005] The present disclosure provides a technique capable of reducing particles adhering to a substrate.

[0006] According to one aspect of the present disclosure, there is provided a technology having: (a) a processing chamber for processing a substrate held by a substrate holder; (b) a transfer chamber adjacent to the processing chamber and capable of arranging the substrate holder; and (c) an injector disposed in the transfer chamber, configured to be movable along the longitudinal direction of a pillar of the substrate holder in the transfer chamber, and injecting gas toward the pillar.

[0007] According to the present disclosure, it is possible to reduce particles adhering to a substrate.

[0008] FIG. 1 is a perspective view of a substrate processing apparatus preferably used in an embodiment of the present disclosure. FIG. 2 is a schematic perspective view of a transfer machine preferably used in an embodiment of the present disclosure, illustrating transfer to a boat by the transfer machine. FIG. 3 is a schematic perspective view of a transfer machine preferably used in an embodiment of the present disclosure, illustrating gas injection by an injector. FIG. 4 is a top view of the transfer machine and boat shown in FIG. 3, illustrating the positional relationship between the boat and the injector during gas injection. FIG. 5 is a side view of the sensor rod shown in FIG. 3, illustrating the detailed positional relationship of the injector. FIG. 6 is a flow chart illustrating a substrate processing process applied in an embodiment of the present disclosure.

[0009] Hereinafter, one embodiment of the present disclosure will be described mainly with reference to Figures 1 to 6. Note that all drawings used in the following description are schematic, and the dimensional relationships between elements, the ratios of elements, etc. shown in the drawings do not necessarily match those in reality. Furthermore, the dimensional relationships between elements, the ratios of elements, etc. do not necessarily match between multiple drawings. Unless otherwise specified in the specification, each element is not limited to one, and multiple elements may be present.

[0010] (Outline of the Substrate Processing Apparatus) The substrate processing apparatus described in this embodiment is used in the manufacturing process of semiconductor devices, and heats the substrate to be processed (heat treatment) while the substrate is housed in a processing chamber. More specifically, it is a vertical substrate processing apparatus that simultaneously processes multiple substrates stacked vertically at a predetermined interval.

[0011] Examples of substrates processed by substrate processing apparatuses include semiconductor wafer substrates (hereinafter simply referred to as "wafers") on which semiconductor devices are fabricated. Examples of heat treatments performed by substrate processing apparatuses include oxidation, diffusion, annealing, reflow, annealing, film formation by thermal CVD (Chemical Vapor Deposition) reactions, and film quality improvement (treatment) processes.

[0012] (1) Configuration of the Substrate Processing Apparatus The entire apparatus will be described with reference to Fig. 1. Fig. 1 shows the main parts of the substrate processing apparatus.

[0013] The substrate processing apparatus 1 includes a housing 13. A pod 21, which is a sealed substrate container, is carried into and out of the substrate processing apparatus 1 by an in-process transport device (not shown).

[0014] A sub-housing 28 is provided along the rear end of the lower portion of the housing 13, near the rear in the front-to-rear direction. A pair of wafer loading / unloading openings 32 are provided in a front wall 29 of the sub-housing 28, arranged vertically in two tiers, one above the other, for loading and unloading wafers 31 into and out of the sub-housing 28. Pod openers 26 are provided for the upper and lower wafer loading / unloading openings 32, respectively.

[0015] The pod opener 26 includes a mounting table 33 on which the pod 21 is mounted, and an opening / closing mechanism 34 that opens and closes the lid of the pod 21. The pod opener 26 is configured to open and close the wafer entrance / exit of the pod 21 by opening and closing the lid of the pod 21 mounted on the mounting table 33 using the opening / closing mechanism 34.

[0016] The sub-housing 28 forms a transfer chamber (loading chamber, loading area) 35 that is airtight from the space in which the pod opener 26 is disposed. A transfer machine 36 is installed in the front region of the transfer chamber 35. The transfer machine 36 is equipped with wafer loading plates (substrate grippers) 37 for holding the required number of wafers 31 (five in the illustrated example). The wafer loading plates 37 are movable in a horizontal direction, rotatable in a horizontal direction, and movable up and down in a vertical direction. The transfer machine 36 is configured to load and unload wafers 31 onto a boat (substrate holder) 38. The wafer loading plates 37 are also called hands, end effectors, chucks, forks, or tweezers, and may be configured with, for example, five loading plates.

[0017] A vertical processing furnace 12 is installed above the transfer chamber 35. The processing furnace 12 has a processing chamber 14 formed therein, and the lower end of the furnace port near the bottom of the processing chamber 14 is open and can be opened and closed by a furnace port shutter (not shown). The processing chamber 14 heat-treats the wafers 31 held in a boat 38.

[0018] A boat elevator 42 for raising and lowering the boat 38 is installed on the side of the sub-housing 28. A seal cap 44 serving as a lid is horizontally attached to an arm (not shown) connected to the lifting platform of the boat elevator 42. The seal cap 44 supports the boat 38 vertically and can airtightly close the furnace throat when the boat 38 is loaded into the processing furnace 12. The transfer chamber 35 is adjacent to the processing chamber 14 and transports wafers 31 together with the boat 38 between them. The boat 38 is configured to hold multiple wafers 31 (e.g., approximately 50 to 175) horizontally and in multiple stages, with their centers aligned. As shown in FIG. 2, the boat 38 includes support columns 38a to 38c serving as columns for holding the wafers 31. The support columns 38a to 38c are provided with grooves (slots) for holding the wafers 31.

[0019] A rotation mechanism 46 is installed on the opposite side of the seal cap 44 from the processing chamber 14, to rotate the boat 38 around a central axis corresponding to the center of the wafers 31. The rotation axis of the rotation mechanism 46 passes through the seal cap 44 and is connected to the boat 38. The rotation mechanism 46 is configured to rotate the boat 38, thereby rotating the wafers 31.

[0020] A clean unit (not shown) is disposed at a position (the first side surface 28a side of the sub-housing 28) opposite the boat elevator 42 (the second side surface 28b side of the sub-housing 28). The clean unit is composed of a supply fan and a dust filter to supply clean air, which is purified air or inert gas. The first side surface 28a of the sub-housing 28 (i.e., the first side surface of the transfer chamber 35) has a clean air outlet. A notch alignment device (not shown) can be installed between the transfer machine 36 and the clean unit as a substrate alignment device that aligns the circumferential position of the wafer 31.

[0021] After circulating through the notch alignment device, the transfer machine 36, and the boat 38, part of the clean air blown out from the clean unit is sucked in by a local exhaust duct (or a common exhaust duct) or the like provided on the second side surface of the transfer chamber 35 and exhausted to the outside of the housing 13 through the exhaust duct. The second side surface 28b of the sub-housing 28 (i.e., the second side surface of the transfer chamber 35) has an exhaust port. The other part is blown out again into the transfer chamber 35 by the clean unit.

[0022] An example of the configuration of the transfer machine will be described with reference to Fig. 2. Fig. 2 shows a state in which wafers 31 are transferred to a boat 38 by a transfer machine 36. That is, a wafer loading plate (end effector) 37 of the transfer machine 36 faces the support columns 38a and 38c of the boat 38.

[0023] The transfer machine 36 has a guide 360 ​​provided along the vertical direction (Z-axis direction), a Z-axis direction drive unit 361, a Y-axis rotation drive unit 362, an X-axis direction drive unit 363, and a V-axis direction drive unit 364. Each of the drive units 361 to 364 can be referred to as a drive system.

[0024] The Z-axis direction drive unit 361 is provided at the lower end or upper end of the guide 360 ​​to move the mount 360 a up and down (Z-axis direction, vertical direction) along the guide 360 ​​.

[0025] The Y-axis rotation drive unit 362 is installed on the upper surface of the mount 360a so that it can rotate in the Y-axis direction itself, in order to rotate clockwise or counterclockwise horizontally (rotate around the Y-axis) while supporting the X-axis drive unit 363 so that the X-axis and Y-axis are perpendicular to each other. The range of rotation is generally about 180 degrees, since the pod 21 is usually positioned between the direction of the boat 38 and the opposite direction when viewed from the Y-axis.

[0026] The X-axis direction drive unit 363 is provided integrally with or inside the Y-axis rotation drive unit 362 in order to move the V-axis direction drive unit 364 back and forth in the horizontal direction (X-axis direction) while supporting the V-axis direction drive unit 364. Note that the X-axis direction is defined as the "forward" direction in which the wafer mounting plate 37 moves protruding from the Y-axis rotation drive unit 362 in order to enter the boat 38 or the pod 21.

[0027] The V-axis direction drive unit 364 is provided on the X-axis direction drive unit 363, and is configured to horizontally support the five wafer mounting plates 37 while being able to adjust the spacing between them in the Z-axis direction.

[0028] This allows the transfer machine 36 to remove the wafers 31 from the pod 21 using the wafer loading plate 37 and charge them into the boat 38. After any processing is performed on the wafers 31 in the processing furnace 12, the transfer machine 36 can remove (discharge) the wafers 31 from the boat 38 using the wafer loading plate 37 and charge them into the pod 21. The Y-axis rotation drive unit 362 has an outer shape that provides a rotation radius that is equal to or slightly larger than the minimum rotation radius around the Y-axis of the wafer loading plate 37 and the V-axis drive unit 364. For example, the length of the Y-axis rotation drive unit 362 in the X-axis direction is equal to or slightly larger than the combined length of the wafer loading plate 37 and the V-axis drive unit 364, and the Y-axis rotation drive unit 362 has a side surface that is parallel to the X-axis.

[0029] The transfer machine 36 further includes sensor rods 50a and 50b as arms provided on both sides of the Y-axis rotation drive unit 362, and forward and backward drive units 365a and 365b that move the sensor rods 50a and 50b in the X-axis direction.

[0030] The sensor rods 50a, 50b extend upward along both side surfaces of the Y-axis rotation drive unit 362 to approximately the same height as one of the wafer mounting plates 37, and are configured to bend at approximately a right angle in the direction opposite to the mounting direction of the wafer mounting plate 37 to the X-axis drive unit 363, i.e., backward along the X-axis. The sensor rods 50a, 50b hold fiber sensors 51a, 51b as mapping sensors and injectors 52a, 52b.

[0031] The tips of the sensor rods 50a and 50b are equipped with light transmitting and receiving units 54a and 54b of fiber sensors 51a and 51b, respectively. The fiber sensors 51a and 51b are a pair of transmission-type sensors, one of which transmits light and the other of which receives it. The fiber sensors 51a and 51b can be positioned so that the optical path (optical axis) formed between the light transmitting and receiving units 54a and 54b is parallel to the tangent of the wafer 31. By detecting interruptions in the optical path, the fiber sensors 51a and 51b count the number of wafers 31 loaded in the pod 21 or boat 38 and perform mapping to detect normal or abnormal conditions, such as protruding wafers. When the sensor rods 50a and 50b advance, the optical axes remain aligned and horizontal. The sensor rods 50a and 50b may be connected to each other by passing through the Y-axis rotation drive unit 362 so that they move in tandem with each other. In this case, only one of the forward and backward drive units 365a and 365b is required.

[0032] Further, the advance / retract drive units 365a and 365b are arranged on both sides of the Y-axis rotation drive unit 362 and support the sensor rods 50a and 50b so that they can move in the X-axis direction between a protruding position and a retracted position. That is, the wafer mounting plate 37 and the sensor rods 50a and 50b are arranged back-to-back with respect to the Y-axis rotation drive unit 362 and can move independently of each other on the X-axis. The sensor rods 50a and 50b can be moved by the Z-axis drive unit 361 along the longitudinal direction (up and down direction, Z direction) of the support columns 38a to 38c of the boat 38.

[0033] This allows the transfer machine 36 to map the wafers 31 in the pod 21 using the fiber sensors 51 a and 51 b. The transfer machine 36 can also map the wafers 31 in the boat 38 using the fiber sensors 51 a and 51 b.

[0034] The injectors 52a and 52b are arranged along the sensor rods 50a and 50b. A gas supply pipe 60 is connected to at least one of the injectors 52a and 52b via a flexible pipe 61 or the like. A mass flow controller (MFC) 62 and a valve 63 serving as an on-off valve are provided in the gas supply pipe 60 in this order from the upstream side of the gas flow. A clean gas serving as a cleaning gas is supplied to the injectors 52a and 52b. For example, nitrogen (N ) which constitutes the atmosphere in the transfer chamber 35 may be used as the clean gas. ２ The flexible piping 61 is laid through the guide 360 ​​or its cover, the mount 360a, and the inside of the Y-axis rotation drive unit 362, and has flexibility that does not impede the operation of the Y-axis rotation drive unit 362 or the forward / backward drive units 365a and 365b (described later).

[0035] 3 to 5, cleaning of the boat 38 by the injector 52a will be described assuming that the gas supply pipe 60 is connected to the injector 52a. Fig. 3 shows a state in which the injector 52a of the transfer machine 36 is cleaning the supports 38a to 38c of the boat 38. In this state, no wafers 31 are loaded into the boat 38. Fig. 5 shows an example of the sensor rod 50a, but the sensor rod 50b has a similar configuration.

[0036] 3, the sensor rods 50a, 50b of the transfer machine 36 are moved by the Y-axis rotation drive unit 362 in a direction approaching the boat 38, that is, in a direction in which the X-axis points toward the center of the boat 38. In addition, the boat 38 is rotated by the rotation mechanism 46 so that one of the supports 38a to 38c of the boat 38 is positioned closest to the transfer machine 36. In FIG. 3, the support 38b is positioned closest to the Y-axis of the transfer machine 36, that is, on the X-axis.

[0037] As shown in Figure 4, the injection holes 53a, 53b of the injectors 52a, 52b are arranged at the tip ends of the sensor rods 50a, 50b. In other words, the injection holes 53a, 53b of the injectors 52a, 52b are provided adjacent to the light transmitting and receiving units 54a, 54b of the fiber sensors 51a, 51b. As shown in Figure 5, the injector 52a is a pipe bent into a shape similar to that of the sensor rod 50a, and its horizontal portion is arranged below the sensor rod 50a. The injector 52a has an injection hole 53a on its side near the tip, and the other end is connected to a flexible pipe 61. The optical window 55a and injection hole 53a of the light transmitting and receiving unit 54a are arranged side by side, one above the other, facing substantially in the same direction.

[0038] 4, the sensor rods 50a, 50b shown by dashed lines are in the retracted position. At this time, the radius of rotation of the sensor rods 50a, 50b around the Y axis is smaller than that of the Y axis rotation drive unit 362. On the other hand, the sensor rods 50a, 50b shown by solid lines are in the extended position, and at this time, the radius of rotation of the sensor rods 50a, 50b around the Y axis is larger than that of the Y axis rotation drive unit 362.

[0039] The sensor rods 50a, 50b are moved to a protruding position on the boat 38 side by the forward / backward drive units 365a, 365b, and one of the support columns 38a-38c is positioned between the injection holes 53a, 53b. In FIG. 4, the support column 38b is positioned between the injection holes 53a, 53b of the injectors 52a, 52b. In other words, the positions of the injectors 52a, 52b in the X direction approach a position where the distance (d) from the central axis of the boat 38 is shorter than the maximum distance (dm) from the central axis to the support columns 38a-38c. As an example, the injection direction of the injection holes 53a, 53b is set horizontally perpendicular to the X axis, and the distance d is set substantially equal to the distance from the central axis to the centers of the support columns 38a-38c. This allows the injectors 52a, 52b to approach the support columns to be cleaned without coming into contact with them, and to inject gas toward the centers of the support columns to be cleaned. The advance / retract drive units 365a, 365b constitute an injector drive unit that changes the distance from the central axis of the boat 38 to the injectors 52a, 52b. Furthermore, it can be said that the Y-axis rotation drive unit 362 or the entire transfer machine 36 is an injector drive unit that moves the injectors 52a, 52b. This eliminates the need to provide separate drive units for moving the injectors 52a, 52b up and down and forward and backward.

[0040] The injection holes 53a inject cleaning gas toward one of the support columns 38a-38c from a tangential direction of a circle centered on the central axis of the boat 38 and passing through the support columns 38a-38c. Figure 4 shows an example in which cleaning gas is injected toward support column 38b. Because gas is sprayed from a tangential direction of the boat 38, sufficient gas flows between the slots (grooves) formed in the support columns 38a-38c, enabling particle sources to be removed. This suppresses particle generation from the grooves. Furthermore, when gas is injected in a tangential direction of the boat 38, the gas that flows around the support columns quickly exits the boat 38, allowing detached particle sources to be discharged without adhering to the boat 38.

[0041] The injector 52a is moved by the Z-axis direction driver 361 along the longitudinal direction (up-down direction, central axis direction) of the columns 38a to 38c of the boat 38, and injects gas toward the columns 38a to 38c. In other words, the injector driver is configured to be able to move the injectors 52a, 52b along the columns 38a to 38c extending in the central axis direction of the boat 38. This allows the injectors 52a, 52b to move up and down between the uppermost and lowermost slots of the columns 38a to 38c that hold the wafers 31.

[0042] If the boat 38 does not have a ring or other structure on the side of the columns 38a to 38c, one of the injectors 52a, 52b can be moved closer to the columns 38a to 38c by shifting the X-axis from a direction pointing toward the center of the boat 38. For example, if the distance from the Y-axis to the injection hole 53a in FIG. 4 is set to be approximately equal to the distance from the Y-axis to the center of the column 38b, the injection hole 53a can be made to directly face the side of the column 38b by rotating the Y-axis so that the injector 52a is closest to the column 38b, just before contacting the column 38b. In this case, the injection hole 53a injects gas from a position slightly inward relative to the tangent of a circle centered on the central axis of the boat and passing through the column, allowing the gas to hit the bottom of the groove formed in the column 38b.

[0043] The cleaning gas injected from the injectors 52a and 52b physically (by wind pressure) removes solid matter (particle sources) that cause particles from the support columns 38a to 38c. Therefore, the gauge pressure of the cleaning gas injected from the injectors 52a and 52b is preferably 100 kPa or higher. This enhances the particle source removal effect. Temporally varying the gas flow or pressure on the surfaces of the support columns 38a to 38c can further enhance the particle removal effect. For example, the gas supply flow rate or flow velocity at the injection holes 53a and 53b of the injectors 52a and 52b may be varied over time by the MFC 62. Alternatively, the flow rate or flow velocity may be set to create an oscillatory flow (turbulent flow). To facilitate vibration, the injectors 52a and 52b may be supported by an elastic body such as a spring, or a vortex generator may be disposed in front of the injection holes. Alternatively, the relative positions and orientations of the injectors 52a, 52b with respect to the support columns 38a to 38c may be changed by swinging one or more of the shafts of the transfer machine 36 or the rotation shafts of the rotation mechanism 46.

[0044] When mapping is performed on the wafer 31 that has been processed in the processing chamber 14 and taken out of the transfer chamber 35, a small amount of inert gas may be discharged from the injectors 52a, 52b as a cooling gas. That is, the injectors 52a, 52b have discharge holes for discharging the inert gas to the fiber sensors 51a, 51b, respectively, and the light transmitting and receiving units 54a, 54b are cooled with the inert gas, thereby making it possible to perform mapping on wafers that are at higher temperatures.

[0045] It is preferable that one of the injectors 52a, 52b inject gas in a direction from the first side surface to the second side surface of the transfer chamber 35. This can increase the effectiveness of removing particle sources removed from the columns 38a to 38c from the transfer chamber 35 using clean gas from the clean unit. In this case, the injector 52a or 52b, which injects gas in the opposite direction to the flow of clean air, can be omitted. Alternatively, if valves 63 and piping 61 are provided for each of the injectors 52a, 52b and the injectors are configured to inject gas alternately, the cleaning gas can be directed at both sides of the columns 38a to 38c, which is expected to increase the removal effect.

[0046] The control unit (controller) 311 is configured as a computer including a CPU (Central Processing Unit) and a storage device. The storage device is configured as a computer-readable recording medium.

[0047] The storage device readably stores a control program for controlling the operation of the substrate processing apparatus, a process recipe describing the procedures and conditions for substrate processing, etc., which will be described later. The process recipe is a combination of procedures in the substrate processing step, which will be described later, that are executed by the control unit 311 to obtain a predetermined result, and functions as a program. Hereinafter, the process recipe, control program, etc. will be collectively referred to simply as a program. In this specification, the term "program" may refer to a process recipe alone, a control program alone, or both.

[0048] The CPU is configured to read and execute a control program from the storage device and to read a process recipe. The CPU is configured to control the wafer transfer operation, mapping operation, and cleaning operation by the transfer machine 36, and the rotation and rotation speed adjustment operation of the boat 38 by the rotation mechanism 46, in accordance with the contents of the read process recipe. The CPU is also configured to control the lifting and lowering operation of the boat 38 by the boat elevator 42, the flow rate adjustment operation of the inert gas by the MFC 62, the opening and closing operation of the valve 63, etc.

[0049] (2) Substrate Processing Process An outline of the substrate processing process for processing substrates using the substrate processing apparatus 1 as a semiconductor manufacturing apparatus will be described below. This substrate processing process is, for example, one process for manufacturing semiconductor devices. In the following description, the operation and processing of each component of the substrate processing apparatus 1 are controlled by a control unit 311.

[0050] (Substrate Loading Step: S10 ) When the pod 21 is supplied to the substrate processing apparatus 1 , it is transferred onto the mounting table 33 .

[0051] The open end face of the pod 21 placed on the mounting table 33 is pressed against the edge of the opening of the wafer loading / unloading port 32 in the front wall 29 of the sub-housing 28, and the lid is removed by the opening / closing mechanism 34, opening the wafer entrance / exit.

[0052] When the pod 21 is opened by the pod opener 26, the sensor rods 50a, 50b of the transfer machine 36 are moved to the protruding position (in the direction approaching the pod 21) by the advance / retract drive units 365a, 365b. Then, the sensor rods 50a, 50b are moved up and down at a constant speed by the Z-axis direction drive unit 361, and the wafers 31 are mapped by the fiber sensors 51a, 51b, thereby detecting the wafers 31 in the pod 21 in order.

[0053] After the mapping operation is completed, the sensor rods 50 a and 50 b are returned to their retracted positions. Then, by sequentially repeating the advance, elevation, and retreat of the wafer loading plate 37, the rotation of the Y-axis rotary drive unit 362, and the advance, elevation, and retreat of the wafer loading plate 37, the wafers 31 are picked up from the pod 21 through the wafer loading / unloading port 32 and charged into the boat 38.

[0054] After the loading is completed, the lower end of the processing furnace 12, which had been closed by the furnace port shutter, is opened by the furnace port shutter. Then, the boat 38 holding the wafers 31 is loaded from the transfer chamber 35 into the processing furnace 12 by the boat elevator 42 raising the seal cap 44 (boat up).

[0055] (Film Forming Step: S20) After loading, the wafers 31 are subjected to heat treatment in the processing chamber 14 in the processing furnace 12.

[0056] (Substrate Unloading Step: S30) Next, the boat 38 on which the heat-treated wafers 31 are placed is unloaded (boat unloaded) from the processing chamber 14 to the transfer chamber 35. Then, the boat 38 cools the wafers 31 after the heat treatment.

[0057] After cooling, the sensor rods 50a, 50b of the transfer machine 36 are moved to the protruding position by the advance / retract drive units 365a, 365b. Then, the sensor rods 50a, 50b are moved up and down by the Z-axis direction drive unit 361, and the fiber sensors 51a, 51b perform a mapping operation on the wafer 31. Then, when the mapping is completed, the sensor rods 50a, 50b return to the stored position, and the wafer 31 is transported by the wafer loading plate 37 and unloaded into the pod 21. Thereafter, the pod 21 is unloaded to the outside of the housing 13.

[0058] (Boat support cleaning step: S40) (Transfer machine rotation step: S401) After all of the wafers 31 held in the boat 38 are transferred to the pod 21, the sensor rods 50a and 50b are rotated by the Y-axis rotation drive unit 362 so as to face toward the boat 38. In other words, the wafer mounting plate 37 is rotated by the Y-axis rotation drive unit 362 so as to face away from the boat 38.

[0059] (Boat Rotation Step: S402) The boat 38 is rotated by the rotation mechanism 46 so that one of the supports 38a to 38b of the boat 38 is positioned closest to the transfer machine 36.

[0060] (Sensor Rod Protruding Step: S403) The sensor rods 50a and 50b are protruded toward the boat 38 by the forward and backward driving parts 365a and 365b, and the injection holes 53a and 53b of the injectors 52a and 52b are disposed at predetermined positions.

[0061] (Gas injection process: S404) The injectors 52a and 52b move up and down between the top and bottom slots holding the wafers 31 in the boat 38 by the Z-axis direction drive unit 361 while injecting cleaning gas onto one of the supports 38a to 38c.

[0062] (Sensor rod storing step: S405) The sensor rods 50a and 50b are retracted from the boat 38 by the advance / retract drive units 365a and 365b.

[0063] (Determination step: S405) It is determined whether all of the pillars 38a to 38c have been cleaned, and if cleaning of all of the pillars 38a to 38c has not been completed (NO), the process returns to step S402. As a result, the boat 38 is rotated so that the pillars 38a to 38b of the boat 38 are positioned in the spray direction of the injectors 52a and 53b, one after the other, for cleaning. If cleaning of all of the pillars 38a to 38c has been completed (YES), the process ends.

[0064] Boat support cleaning is performed when the boat 38 is in the home position (fully lowered and in the transfer chamber 35) and transfer is not in progress (for example, while the pod 21 is being unloaded), so that the throughput of substrate processing (the number of substrates processed in one cycle divided by the time from loading the pod 21 to unloading it) is not affected.

[0065] According to this aspect, one or more of the following effects can be obtained.

[0066] (a) Compared with a multi-hole nozzle, it is possible to inject gas from a single injection hole at close range and at a high flow rate, which can improve the effect of removing particle sources from the surface of the boat support pillars.

[0067] (b) It is possible to carry out automatic maintenance more frequently than manual maintenance using an air gun, and the particle suppression effect can be improved.

[0068] Although the embodiments of the present disclosure have been specifically described above, the present disclosure is not limited to the above-described embodiments and can be modified in various ways without departing from the spirit of the present disclosure. For example, the injectors 52a, 52b are not limited to those attached to the sensor rods 50a, 50b, but may be directly provided on the advance / retract drive units 365a, 365b. The fiber sensors 51a, 51b are not limited to those attached to the sensor rods 50a, 50b, but may be attached to the injectors 52a, 52b that also serve as sensor rods.

[0069] In the above-described embodiment, an example of heat treatment using a batch-type substrate processing apparatus that processes multiple substrates at a time has been described. The present disclosure is not limited to the above-described embodiment and can be suitably applied, for example, to heat treatment using a single-wafer substrate processing apparatus that processes one or several substrates at a time. Furthermore, in the above-described embodiment, an example of film formation using a substrate processing apparatus having a hot-wall processing furnace has been described. The present disclosure is not limited to the above-described embodiment and can be suitably applied to heat treatment using a substrate processing apparatus having a cold-wall processing furnace.

[0070] When using these substrate processing apparatuses, each process can be performed under the same process procedures and conditions as in the above-described embodiment, and the same effects as in the above-described embodiment can be obtained.

[0071] 1: Substrate processing apparatus 14: Processing chamber 35: Transfer chamber 52a, 52b: Injectors

Claims

1. A substrate processing apparatus comprising: (a) a processing chamber for processing a substrate held by a substrate holder; (b) a transfer chamber adjacent to the processing chamber and capable of disposing the substrate holder; and (c) an injector disposed in the transfer chamber and configured to be movable along the longitudinal direction of a column of the substrate holder in the transfer chamber, the injector being configured to inject gas toward the column.

2. The substrate processing apparatus according to claim 1, further comprising: (d) a rotation mechanism for rotatably supporting the substrate holder around a central axis corresponding to the center of the substrate; and (e) a control unit capable of sequentially controlling the rotation mechanism so that the column is positioned in the injection direction of the injector with respect to a plurality of the columns, and controlling the injector to inject the gas.

3. The substrate processing apparatus according to claim 2, wherein the injection hole of the injector injects the cleaning gas toward the column from a tangential direction of a circle centered on the central axis and passing through the column.

4. The substrate processing apparatus according to claim 2, further comprising: (f) an injector driving unit for changing a distance from the central axis to the injector, the injector approaching a position where a distance from the central axis of the substrate holder is shorter than a maximum distance from the central axis to the column.

5. The substrate processing apparatus according to claim 2, further comprising: (f) an injector driving unit for changing a distance from the central axis to the injector.

6. The substrate holder holds a plurality of substrates in multiple stages along the central axis, and the injector driving unit is configured to be movable along the column extending in the central axis direction. The substrate processing apparatus according to claim 4.

7. The injector driving unit is a transfer machine for transferring a substrate between the substrate holder. The substrate processing apparatus according to claim 4.

8. The injector driving unit is a rotation driving unit provided in a transfer machine, and an injection hole of the injector is disposed at a tip side of an arm rotated by the rotation driving unit. The substrate processing apparatus according to claim 5.

9. The gas is an inert gas and physically removes solids causing particles from the column. The substrate processing apparatus according to claim 3.

10. The injector driving unit is a rotation driving unit for moving a mapping sensor forward and backward with respect to a substrate, and an injection hole of the injector is provided in the mapping sensor rotated around a predetermined rotation axis parallel to a plane perpendicular to the central axis by the rotation driving unit. The substrate processing apparatus according to claim 5.

11. The substrate processing apparatus according to claim 3, wherein the gauge pressure of the gas injected from the injector is 100 kPa or more.

12. The substrate processing apparatus according to claim 1, wherein the flow rate or flow velocity of the gas at the injection holes of the injector is changed over time.

13. The substrate processing apparatus according to claim 1, wherein when mapping is performed on the substrate that has been processed in the processing chamber and taken out to the transfer chamber, a cooling gas is discharged from the injector.

14. The transfer chamber has a first side surface having an outlet for clean air and a second side surface facing the first side surface and having an exhaust port, and the injector injects gas in a direction from the first side surface toward the second side surface. The substrate processing apparatus according to claim 1.

15. A substrate processing method comprising: (a) a step of processing a substrate held by a substrate holder in a processing chamber; (b) a step of loading and unloading the substrate together with the substrate holder between the processing chamber and a transfer chamber disposed adjacent to the processing chamber; and (c) a step of injecting gas toward the column by an injector disposed in the transfer chamber and configured to be movable along the longitudinal direction of the column of the substrate holder in the transfer chamber.

16. A method for manufacturing a semiconductor device comprising: (a) a step of processing a substrate held by a substrate holder in a processing chamber; (b) a step of loading and unloading the substrate together with the substrate holder between the processing chamber and a transfer chamber disposed adjacent to the processing chamber; and (c) a step of injecting gas toward the column by an injector disposed in the transfer chamber and configured to be movable along the longitudinal direction of the column of the substrate holder in the transfer chamber.

17. A program for causing a computer to execute on a substrate processing apparatus: (a) a procedure of processing a substrate held by a substrate holder when processing the substrate in a processing chamber; (b) a procedure of loading and unloading the substrate together with the substrate holder between the processing chamber and a transfer chamber disposed adjacent to the processing chamber; and (c) a procedure of injecting gas toward the column by an injector disposed in the transfer chamber and configured to be movable along the longitudinal direction of the column of the substrate holder in the transfer chamber.

18. A transfer machine having a substrate gripping portion for loading and unloading a substrate on a substrate holder for holding the substrate when processing the substrate in a processing chamber, and an injector configured to be movable along the longitudinal direction of the column of the substrate holder and to inject gas toward the column.

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