Continuous substrate processing apparatus and continuous substrate processing method using same

Abstract

The present invention provides a continuous substrate processing apparatus. The continuous substrate processing apparatus comprises: a substrate input unit which is provided at a main body, and which inputs substrates having, on each of the two surfaces thereof, a surface treatment target area and an edge area that surrounds the surface treatment target area; a transfer unit for transferring, in an upright state, along a set transfer path, the substrates input through the substrate input unit; an abrasive spray unit which is provided on the main body so as to be arranged on both sides of the transfer path, and which sprays a fine abrasive at the transferred substrates so as to grind the surface treatment target area of each of the two surfaces of the substrates; and a grinding control unit, which has a preset target grinding thickness, measures the thickness of each of the ground substrates, and controls the spray pressure of the fine abrasive sprayed through the abrasive spray unit so that the measured thickness reaches the target grinding thickness.

Description

Continuous substrate processing device and continuous substrate processing method using the same

[0001] The present invention relates to a continuous substrate processing device and a continuous substrate processing method using the same, and more particularly, to a continuous substrate processing device and a continuous substrate processing method using the same, which can easily remove BN powder used as a release agent during sintering from a silicon nitride substrate and simultaneously control the surface roughness of the substrate to a certain level, thereby allowing a subsequent metal bonding process to proceed stably.

[0002] Recently, high-power electronic circuit boards are being used in electric vehicles, wind power, solar power generation, and other fields. Insulating ceramic substrates are used to implement these circuit boards. Among these, sintered silicon nitride substrates, due to their superior mechanical strength, are rapidly increasing in use as insulating substrates in power modules for electric vehicles.

[0003] The bond strength between a copper film and a ceramic substrate is a key property that ensures the reliability of circuit boards. The presence of foreign substances, such as BN powder, a release agent used during sintering, on the ceramic substrate surface can reduce bond strength. Furthermore, if the ceramic substrate's surface roughness exceeds or falls short of the customer's requirements, this can also lead to reduced bond strength. This means that the subsequent metal bonding process cannot be performed reliably.

[0004] In conclusion, to enhance the bonding strength between ceramic substrates and metals, it is crucial to remove surface roughness and foreign matter from the ceramic substrate. This requires the complete removal of release agents and appropriate control of surface roughness during the ceramic substrate manufacturing process. Furthermore, removing foreign matter from the ceramic substrate surface prior to bonding may be crucial in the circuit board manufacturing process.

[0005] In particular, ceramic substrates are a type of electronic circuit board used in high-voltage, high-temperature, and high-frequency environments. Metal bonding is essential for ceramic substrates used in these environments.

[0006] However, BN powder, a release agent used during the sintering process, may remain on the surface of the ceramic substrate. Because BN powder reduces bonding strength after metal bonding, it is important to clean the surface of the ceramic substrate to remove the BN powder.

[0007] Surface cleaning of ceramic substrates requires a surface treatment process. This process not only removes BN powder, but also reduces surface roughness and adjusts thickness.

[0008] Conventionally, substrate surface cleaning was achieved through methods such as honing, grinding, and lapping. However, these methods require grinding a certain thickness during surface treatment to eliminate any unprocessed or missing portions due to minor warping of the substrate surface. Consequently, they lead to significant consumption of raw materials.

[0009] In particular, when grinding is performed up to a part where fine warpage has occurred, it can be very difficult to simultaneously control the required thickness of the substrate, and there is also the problem that the controlled thickness cannot be finely controlled.

[0010] Accordingly, there is a need for the development of a technology that can continuously process the surface of a substrate to achieve a set roughness while controlling the thickness of the substrate and minimizing the amount of grinding on the surface of the substrate even if there is a slight warpage on the surface of the substrate.

[0011] The present invention has been devised to solve the above-described problems, and the purpose of the present invention is as follows.

[0012] The purpose of the present invention is to provide a continuous substrate processing device capable of simultaneously controlling foreign matter and thickness and roughness of a substrate by simultaneously performing surface treatment on both sides of the moving ceramic substrates while moving the substrates, and a continuous substrate processing method using the same.

[0013] In addition, the present invention aims to provide a continuous substrate processing device and a continuous substrate processing method using the same, which can ensure stable surface treatment in the process of performing surface treatment by spraying a surface treatment material on both sides of the substrates being moved at a certain pressure during the process of moving the ceramic substrates in an upright state.

[0014] The above-described purposes of the present invention are not limited to the aforementioned purposes. Other unmentioned purposes and advantages of the present invention can be understood through the following description and will be more clearly understood through the embodiments of the present invention. Furthermore, it will be readily apparent that the purposes and advantages of the present invention can be realized by the means and combinations thereof set forth in the claims.

[0015] To achieve the above objectives, the present invention provides a continuous substrate processing device.

[0016] The continuous substrate processing device comprises: a substrate input unit installed in a main body and inputting substrates having a surface treatment target area and an edge area surrounding the surface treatment target area on both sides; a transport unit that transports the substrates input through the substrate input unit in an upright state along a set transport path; an abrasive spray unit installed in the main body so as to be arranged on both sides of the transport path and sprays a fine abrasive onto the transported substrates to grind the surface treatment target areas on both sides of the substrates; and a grinding control unit having a target grinding thickness set in advance, measuring the thickness of each of the substrates to be ground, and controlling the spraying pressure of the fine abrasive sprayed through the abrasive spray unit so that the measured thickness reaches the target grinding thickness.

[0017] Here, the above transfer unit,

[0018] A pair of transport conveyors arranged in the main body and arranged along the transport path, and interlocked to transport along the transport path while keeping the edge areas formed on the lower sides of the substrates in close contact;

[0019] A driver for driving the pair of transfer conveyors according to the control of the above grinding control unit,

[0020] It is preferable to include guide rollers arranged at the bottom between the pair of transfer conveyors and guiding the movement of the bottom of the substrates.

[0021] And on the upper part of the above pair of transport conveyors,

[0022] It is preferable that an upper movement guide part be installed in the main body to guide movement by rolling and supporting the edge area formed on both upper sides of the above substrates.

[0023] In addition, the abrasive spraying unit

[0024] An abrasive feeder for supplying the above fine abrasive,

[0025] They are arranged at intervals along the above transport path on both sides of the above transport path,

[0026] It is preferable to include a pair of spray modules that simultaneously spray the fine abrasive supplied from the abrasive supply unit at a spray pressure set to the surface treatment target area on both sides of the moving substrates under the control of the grinding control unit.

[0027] In addition, the above grinding control unit,

[0028] It is desirable to independently control the spray pressure of the fine abrasive sprayed from each of the pair of spray modules.

[0029] In addition, the above grinding control unit,

[0030] A thickness measuring device for measuring the thickness of each of the substrates subjected to the grinding process,

[0031] A controller may be provided to variably control the spray pressure of the fine abrasive by controlling the operation of the pair of spray modules so that the measured thickness reaches the target grinding thickness.

[0032] In the above controller, a standard grinding thickness is set,

[0033] The above target grinding thickness is set to be less than or equal to the above reference grinding thickness,

[0034] The above controller,

[0035] It is preferable to control the operation of the pair of injection modules when the measured thickness is less than or equal to the reference grinding thickness.

[0036] In addition, the controller is electrically connected to a roughness meter. The roughness meter can measure the roughness of both sides of a substrate that has been ground simultaneously on both sides to achieve a target grinding thickness and transmit the measured roughness to the controller.

[0037] According to another embodiment, the present invention provides a continuous substrate processing method for continuously grinding both sides of the substrates using a continuous substrate processing device.

[0038] By means of a solution to the above problem, the present invention has the effect of simultaneously controlling foreign substances on the substrate and the thickness and roughness of the substrate by simultaneously performing surface treatment on both sides of the moving ceramic substrates while moving the ceramic substrates.

[0039] In addition, the present invention has the effect of enabling stable surface treatment in the process of spraying a surface treatment material on both sides of the substrates being moved at a certain pressure during the process of moving the ceramic substrates in an upright state.

[0040] In addition to the effects described above, specific effects of the present invention are described below while explaining specific details for carrying out the invention.

[0041] Figure 1 is a schematic side view showing the configuration of a continuous substrate processing device of the present invention.

[0042] Figure 2 is a perspective view showing the arrangement of the transport section and the abrasive spray section of the continuous substrate processing device of the present invention.

[0043] Figure 3 is a plan view showing the arrangement of the transport section and the abrasive spray section of the continuous substrate processing device of the present invention.

[0044] Figure 4 is a side view showing a transport unit according to the present invention.

[0045] Figure 5 is a side view showing a conveying unit and an abrasive spraying unit according to the present invention.

[0046] FIG. 6 is a drawing viewed from direction A of FIG. 5 showing a state in which fine abrasive is simultaneously sprayed on both sides of a substrate through an abrasive spraying unit according to the present invention.

[0047] Figure 7 is a drawing showing an example of a state in which both sides of a transferred substrate are ground.

[0048] Figure 8 is a front view showing an example in which an upper movement guide part is further formed on the upper part of the transport part according to the present invention.

[0049] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that a person having ordinary skill in the art to which the present invention pertains can easily implement the present invention.

[0050] The present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0051] In order to clearly explain the present invention, parts that are not related to the description are omitted, and the same reference numerals are used for identical or similar components throughout the specification.

[0052] Hereinafter, the phrase “any component is provided or arranged on the “upper (or lower)” of the description or “upper (or lower)” of the description means that any component is provided or arranged in contact with the upper surface (or lower surface) of the description.

[0053] Additionally, it is not limited to not including any other configuration between the above description and any configuration provided or arranged on (or under) the description.

[0054] The following describes a continuous substrate processing device and a continuous substrate processing method using the same of the present invention with reference to the attached drawings. The continuous substrate processing method will be described along with the description of the configuration and operation of the continuous substrate processing device.

[0055] Fig. 1 is a schematic side view showing the configuration of a continuous substrate processing device of the present invention. Fig. 2 is a perspective view showing the arrangement of the conveying section and the abrasive spraying section of the continuous substrate processing device of the present invention. Fig. 3 is a plan view showing the arrangement of the conveying section and the abrasive spraying section of the continuous substrate processing device of the present invention.

[0056] Referring to FIGS. 1 and 2, the continuous substrate processing device of the present invention includes a main body (100), a substrate input unit (200), a transport unit (300), an abrasive spray unit (400), and a grinding control unit (500).

[0057] The substrate input unit (200) according to the present invention is arranged on one side of the main body (100). The substrate input unit (200) sequentially inputs a ceramic substrate (10) (hereinafter referred to as a substrate) into the transfer unit (300).

[0058] A surface treatment target area (11) is formed on both sides of the substrate (10), and an edge area (12) can be formed around the surface treatment target area (11).

[0059] In the above main body (100), a transfer unit (300) can be placed downstream of the substrate input unit (200).

[0060] The above-mentioned transport unit (300) can sequentially transport the substrates (100) inputted through the substrate input unit (200) along a transport path set in an upright state.

[0061] The present invention relates to a continuous substrate processing device, which can provide an effect of effectively processing only the surface treatment target area while protecting the edge area of ​​the substrate.

[0062] According to this configuration, the present invention can prevent damage to the substrate (10) by having the edge region of the substrate (10) serve to support the upright position of the substrate (10). In addition, since only the surface treatment target region (11) of the substrate (10) can be effectively processed, processing efficiency can be improved.

[0063] The substrate input unit (200) sequentially inputs the substrate (10) into the transfer unit (300). The transfer unit (300) sequentially transfers the substrate (10) along a transfer path set in an upright state. The abrasive spray unit (400) can perform surface treatment by spraying an abrasive at a certain pressure onto the surface treatment target area (11) formed on both sides of the substrate (10) transferred in an upright state through the transfer unit (300).

[0064]

[0065] Fig. 4 is a side view showing a conveying unit according to the present invention. Fig. 5 is a side view showing a conveying unit and an abrasive spraying unit according to the present invention.

[0066] Referring to FIGS. 4 and 5, the transport unit (300) according to the present invention may include a pair of transport conveyors (310), a driver (320), and guide rollers (330).

[0067] The above pair of transport conveyors (310) has a fixed length and is configured such that both ends are rotatably supported by drive rollers (311). The above pair of transport conveyors (310) is in an upright state, and the inner sides of the pair of transport conveyors (310) are arranged at a fixed interval from each other.

[0068] That is, the substrate (10) can be placed in an upright state between a pair of transfer conveyors (310).

[0069] The drive shafts (311a) of the drive rollers (311) that support the two ends of each of the above pair of transfer conveyors (310) can be simultaneously rotated by the rotational drive of each driver (320). Each of the above drivers (320) can be driven by the control of the controller (600) described below.

[0070] Here, a plurality of guide rollers (330) can be rotatably arranged on the floor between the pair of transport conveyors (310). The guide rollers (330) can support the lower part of the upright substrate with a cloud to guide transport.

[0071] When the substrate (10) is fed into the space between one side of a pair of transfer conveyors (310) in an upright state through the substrate input section (200), the edge area (12) formed on both sides of the lower side of the fed substrate (10) is supported in close contact with the inner side of the pair of transfer conveyors (310) that are rotated by the driving of each driver (320), and can be fed along the other side by the pair of transfer conveyors (310) that are rotated along the transport path.

[0072] The effects of this composition are as follows:

[0073] The transfer stability of the substrate (10) can be improved. When polishing the substrate (10) while it is standing vertically, the substrate (10) may shake due to the physical impact of the sprayed abrasive.

[0074] A transport unit (300) according to the present invention includes a pair of transport conveyors (310), a driver (320), and guide rollers (330). The pair of transport conveyors (310) support a substrate (10) on both sides, and the driver (320) simultaneously drives the pair of transport conveyors (310). The guide rollers (330) guide the transport path of the substrate (10).

[0075] Due to this configuration, the substrate (10) is supported on both sides, and a pair of transport conveyors (310) are driven simultaneously, thereby improving the transport stability of the substrate (10).

[0076] The present invention can efficiently transport the substrate (10) in an upright state because the substrate (10) is supported on both sides, a pair of transport conveyors (310) are driven simultaneously, and guide rollers (330) at the bottom guide the transport.

[0077]

[0078] FIG. 6 is a drawing viewed from direction A of FIG. 5 showing a state in which fine abrasive is simultaneously sprayed on both sides of a substrate through an abrasive spraying unit according to the present invention.

[0079] Referring to FIGS. 3, 5 and 6, the abrasive spraying unit according to the present invention can be installed in the main body so as to be positioned on both sides of the conveying unit.

[0080] The above abrasive spraying unit (400) can simultaneously spray fine abrasives onto the substrates (10) being transported to grind the surface treatment target area (11) on both sides of the substrates (10).

[0081] The abrasive spraying unit (400) may be equipped with an abrasive supply unit (410) that supplies the fine abrasive, and a pair of spraying modules (420) that are arranged at intervals along the transport path on both sides of the transport path and, under the control of the grinding control unit (500), simultaneously spray the fine abrasive supplied from the abrasive supply unit (410) onto the surface treatment target areas on both sides of the moving substrates (10) at a spraying pressure set to be set.

[0082] Each of the above pair of injection modules (420) has injectors (421) arranged at intervals along the transport path of the substrate (10).

[0083] Each of the sprayers (421) of the pair of spray modules (420) is connected to an abrasive supply unit (410) and abrasive supply pipes (430). Valves (431) are installed in each of the abrasive supply pipes (430). The controller (600) can variably control the spray pressure of the fine abrasive sprayed from the sprayers (421) of each of the pair of spray modules (420) by controlling the degree of opening and closing of the valves (431).

[0084] The above injectors (421) can be arranged to face each other with the transport path as the boundary.

[0085] And the above-mentioned injectors (421) can be fixed to a separate bracket (not shown) on the main body (100).

[0086] The above-mentioned sprayers (421) can spray fine abrasives such as ceramic particles at a certain spray pressure toward the surface treatment target area (11) on both sides of the substrate (10) being transported under the control of the controller (600).

[0087] Although not shown in the drawing, the spraying direction of the above-mentioned injectors (421) can be variably adjusted by adjusting the rotation angle by connecting the rotation axis of a separate vertical rotation motor.

[0088] Conventional substrate processing devices often polish substrates (10) one by one. In this case, in order to polish both sides of the substrate (10), the substrate (10) must be turned over and polished again. This increases the transport time of the substrate (10) and has the problem that the substrate (10) may be damaged. The continuous substrate processing device according to the present invention polishes the substrate (10) while transporting it in an upright state, so that both sides of the substrate (10) can be polished simultaneously. This shortens the transport time of the substrate (10) and prevents damage to the substrate (10).

[0089]

[0090] Figure 7 is a drawing showing an example of a state in which both sides of a transferred substrate are ground.

[0091] Referring to FIG. 7, the grinding control unit (500) according to the present invention can measure the thickness of each of the substrates (10) to be ground, with a target grinding thickness set in advance, and control the spraying pressure of the fine abrasive sprayed through the abrasive spray unit (400) so that the measured thickness reaches the target grinding thickness.

[0092] In addition, the grinding control unit (500) can independently control the spraying pressure of the fine abrasive sprayed from each of the pair of spraying modules (420).

[0093] In addition, the grinding control unit (500) may include a thickness measuring device (510) that measures the thickness of each of the substrates (10) subjected to the grinding process, and the controller (600) described above that variably controls the spraying pressure of the fine abrasive by controlling the operation of the pair of spraying modules (420) so that the measured thickness reaches the target grinding thickness.

[0094] Meanwhile, the controller (600) is electrically connected to a luminance measuring device (520) that measures the luminance of both sides of each of the substrates (10) that have undergone grinding processing and transmits the measured luminance to the controller (600). The controller (600) can determine whether the measured luminance conforms to a preset reference luminance.

[0095] Meanwhile, the controller (600) may be electrically connected to a roughness measuring device (520) that measures the roughness of the surface treatment target area of ​​each of the substrates (10) subjected to the grinding process. Through this, the controller (600) may control the operation of the pair of spray modules (420) so that the measured roughness reaches a preset reference roughness, thereby variably controlling the spraying pressure of the fine abrasive.

[0096] Furthermore, a reference grinding thickness can be set in the above controller (600).

[0097] The above target grinding thickness can be set to be less than or equal to the above reference grinding thickness.

[0098] The above controller (600) can control the operation of the pair of injection modules (420) when the measured thickness is less than or equal to the reference grinding thickness. Here, the reference grinding thickness can be set to 5 um or less.

[0099] The grinding control unit (500) according to the present invention can measure the thickness of each of the substrates (10) to be ground, with a target grinding thickness set in advance, and control the spraying pressure of the fine abrasive sprayed through the abrasive spray unit (400) so that the measured thickness reaches the target grinding thickness.

[0100] In addition, the grinding control unit (500) can independently control the spraying pressure of the fine abrasive sprayed from each of the pair of spraying modules (420).

[0101] That is, the grinding control unit (500) measures the thickness of the substrate (10) through the thickness measuring device (510), and when the measured thickness reaches the target grinding thickness, reduces the spraying pressure of the fine abrasive sprayed from each of the pair of spraying modules (420) to end the grinding of the substrate (10).

[0102] The effects of this configuration are as follows:

[0103] The grinding quality of the substrate (10) can be improved. Conventional substrate processing devices often preset the thickness of the substrate (10) and do not measure the thickness of the substrate (10) during the process of grinding the substrate (10). In this case, the thickness of the substrate (10) may not reach the target thickness or may exceed the target thickness.

[0104] The grinding control unit (500) according to the present invention measures the thickness of the substrate (10) and terminates grinding when the thickness of the substrate (10) reaches the target thickness. Therefore, by accurately controlling the thickness of the substrate (10), the grinding quality of the substrate (10) can be improved.

[0105] The grinding efficiency of the substrate (10) can be improved. Conventional substrate processing devices often preset the thickness of the substrate (10) and do not measure the thickness of the substrate (10) during the process of grinding the substrate (10). In this case, if the thickness of the substrate (10) does not reach the target thickness, the substrate (10) must be ground again.

[0106] The grinding control unit (500) according to the present invention measures the thickness of the substrate (10) and terminates grinding when the thickness of the substrate (10) reaches the target thickness. Therefore, by accurately controlling the thickness of the substrate (10), the grinding efficiency of the substrate (10) can be improved.

[0107] And after the grinding of the substrates (10) is completed using the illuminance meter (520), the illuminance on both sides of the substrate (10) is measured and transmitted to the controller (600), and the controller (600) can determine whether the measured illuminance matches the preset reference illuminance.

[0108] Meanwhile, in the present invention, the controller (600) may variably control the spray pressure of the fine abrasive by controlling the operation of the pair of spray modules (420) so that the measured roughness reaches a preset reference roughness. That is, the grinding control unit (500) measures the roughness of the surface treatment target area of ​​the substrate (10) through the roughness measuring device (520), and when the measured roughness reaches the reference roughness, the grinding of the substrate (10) may be terminated by reducing the spray pressure of the fine abrasive sprayed from each of the pair of spray modules (420).

[0109]

[0110] Figure 8 is a front view showing an example in which an upper movement guide part is further formed on the upper part of the transport part according to the present invention.

[0111] Referring to FIG. 8, an upper movement guide (310') that guides movement by rolling and supporting the edge area (12) formed on both upper sides of the substrates (10) may be further installed on the upper portion of a pair of transfer conveyors (310) according to the present invention on the main body (100).

[0112] The above upper moving guide (310') may be substantially identical to the configuration of a pair of transfer conveyors (310), or may be composed of a pair of guide plates (not shown).

[0113] The upper moving guide (310') may be a belt that guides the transport by contacting the edge area (12) formed on both upper sides of the substrate (10) without separate power. Through this, the substrate (10) being transported can be more effectively maintained in a stable upright state while being subjected to grinding processing.

[0114] The effects of this configuration are as follows:

[0115] The upper movement guide (310') according to the present invention guides movement by rolling and supporting the edge region (12) formed on both upper sides of the substrate (10). Accordingly, the substrate (10) can be stably supported by the upper movement guide (310') and maintained in an upright state.

[0116] If the substrate (10) remains stably upright, the surface of the substrate (10) can be evenly ground. Therefore, the grinding quality can be improved. In addition, if the substrate (10) remains stably upright, the grinding time and process of the substrate (10) can be shortened. Therefore, the grinding efficiency can be improved.

[0117] Specifically, the upper movement guide (310') guides movement by rolling and supporting the edge area (12) formed on both sides of the upper side of the substrate (10). Therefore, the substrate (10) can be stably supported by the upper movement guide (310') and maintained in an upright state.

[0118] In this state, when both sides of the substrate (10) are polished simultaneously, the surface of the substrate (10) can be evenly ground. In addition, if the substrate (10) is maintained in a stable upright state, the grinding time and process of the substrate (10) can be shortened. Therefore, the grinding efficiency can be improved.

[0119] According to the above configuration and operation, the present invention can simultaneously control foreign substances on the substrate and the thickness and roughness of the substrate by simultaneously performing surface treatment on both sides of the moving ceramic substrates while moving the ceramic substrates.

[0120] In addition, the present invention can ensure stable surface treatment in the process of spraying a surface treatment material on both sides of the substrates being moved at a certain pressure during the process of moving the ceramic substrates in an upright state.

[0121] The present invention is not limited to the specific preferred embodiments described above, and anyone with ordinary skill in the art to which the present invention pertains can make various modifications without departing from the gist of the present invention claimed in the claims, and such modifications are within the scope of the claims.

[0122] 10: Substrate

[0123] 100: Body

[0124] 200: Substrate input section

[0125] 300: Transport section

[0126] 400: Abrasive spraying section

[0127] 500: Grinding control unit

[0128] 600: Controller

Claims

1. A substrate input section installed in the main body, into which substrates having a surface treatment target area on both sides and an edge area surrounding the surface treatment target area are input; A transport unit that transports the substrates input through the substrate input unit in an upright state along a set transport path; An abrasive spraying unit installed in the main body so as to be arranged on both sides of the transport path, and spraying fine abrasive onto the substrates being transported to grind the surface treatment target areas on both sides of the substrates; and A grinding control unit characterized in that it includes a target grinding thickness set in advance, measures the thickness of each of the substrates to be ground, and controls the spraying pressure of the fine abrasive sprayed through the abrasive spray unit so that the measured thickness reaches the target grinding thickness. Continuous substrate processing equipment.

2. In paragraph 1, The above transfer part, A pair of transfer conveyors arranged in the main body and arranged along the transfer path, and interlocked to transfer along the transfer path while keeping the edge areas formed on the lower sides of the substrates in close contact; A driver for driving the pair of transfer conveyors according to the control of the above grinding control unit, characterized in that it comprises guide rollers positioned at the bottom between the pair of transfer conveyors and guiding the movement of the bottom of the substrates. Continuous substrate processing equipment.

3. In paragraph 2, On the upper part of the above pair of transport conveyors, It is characterized in that an upper movement guide part is installed in the main body to guide movement by rolling and supporting the edge area formed on both upper sides of the above substrates. Continuous substrate processing equipment.

4. In paragraph 1, The above abrasive spraying unit, An abrasive supply device for supplying the above fine abrasive, They are arranged at intervals along the above transport path on both sides of the above transport path, According to the control of the grinding control unit, it is characterized by including a pair of spraying modules that simultaneously spray the fine abrasive supplied from the abrasive supply unit to the surface treatment target areas on both sides of the moving substrates at a spraying pressure set. Continuous substrate processing equipment.

5. In paragraph 4, The above grinding control unit, Characterized in that the spray pressure of the fine abrasive sprayed from each of the pair of spray modules is independently controlled, Continuous substrate processing equipment.

6. In paragraph 4, The above grinding control unit, A thickness measuring device for measuring the thickness of each of the substrates subjected to the grinding process, It is characterized by having a controller that variably controls the spray pressure of the fine abrasive by controlling the operation of the pair of spray modules so that the measured thickness reaches the target grinding thickness. Continuous substrate processing equipment.

7. In paragraph 6, The above controller, Each of the above ground substrates is electrically connected to a roughness measuring device for measuring the roughness of the surface treatment target area, Characterized in that it determines whether the measured illuminance meets the preset standard illuminance. Continuous substrate processing equipment.

8. In paragraph 7, In the above controller, a standard grinding thickness is set, The above target grinding thickness is set to be less than or equal to the above reference grinding thickness, The above controller, characterized in that the driving of the pair of injection modules is controlled when the measured thickness is less than or equal to the reference grinding thickness. Continuous substrate processing equipment.

9. A continuous substrate processing method characterized by continuously grinding both sides of the substrates using the continuous substrate processing device of any one of claims 1 to 8.

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