Thermoelectric cooling device and refrigerator including same

Abstract

The thermoelectric cooling device includes: a heat emitting unit configured to emit heat and comprising a heat emitting plate and heat emitting electrodes in contact with the heat emitting plate; a heat absorbing unit configured to absorb heat and comprising a heat absorbing plate and heat absorbing electrodes in contact with the heat absorbing plate; and thermoelectric cells configured to heat the heat emitting unit and cool the heat absorbing unit and connected to the heat emitting electrodes and the heat absorbing electrodes, wherein the cross sections of the thermoelectric cells in a direction parallel to the heat emitting plate and the heat absorbing plate may include a circular shape.

Description

Thermoelectric cooling device and refrigerator including the same

[0001] The disclosure relates to a refrigerator having a thermoelectric cooling device for cooling a storage compartment.

[0002] A refrigerator is a home appliance that has a main body having a storage compartment and a cold air supply device that supplies cold air to the storage compartment to keep food fresh.

[0003] A thermoelectric cooling device that generates heat and cooling through the Peltier effect can be used as a cooling device in a refrigerator. The thermoelectric cooling device may include a thermoelectric module. The thermoelectric module has a heat generating portion formed on one side and a heat absorbing portion formed on the opposite side. When current is applied to the thermoelectric module, heat generation occurs in the heat generating portion and heat absorption occurs in the heat absorbing portion.

[0004] The thermoelectric cooling device may be equipped with a heat sink, a heat sink, a heat dissipation fan, a cooling fan, etc. to increase the efficiency of cooling the storage room through the thermoelectric cooling device.

[0005] One aspect of the disclosure discloses a refrigerator having increased cooling efficiency of a storage compartment through a thermoelectric cooling device including a thermoelectric module.

[0006] One aspect of the disclosure discloses a refrigerator comprising a thermoelectric module having improved cooling efficiency.

[0007] One aspect of the disclosure discloses a refrigerator comprising a thermoelectric cooling device with reduced production and material costs.

[0008] The technical tasks to be achieved in the disclosure are not limited to the technical tasks mentioned above, and other technical tasks not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the disclosure belongs from the description below.

[0009] A thermoelectric cooling device according to one aspect of the disclosure comprises: a heating plate configured to emit heat; a heat absorbing plate configured to absorb heat; a heating electrode in contact with the heating plate; a heat absorbing electrode in contact with the heat absorbing plate; a thermoelectric cell configured to heat the heating plate and cool the heat absorbing plate, the thermoelectric cell including an N-type semiconductor connected to the heating electrode and a P-type semiconductor connected to the heat absorbing electrode; and a common electrode electrically connected to the N-type semiconductor and the P-type semiconductor; wherein a cross-section of the thermoelectric cell in a direction parallel to the heating plate and the heat absorbing plate may include a circle.

[0010] A refrigerator according to one aspect of the disclosure may include a main body; a storage compartment formed inside the main body; and a thermoelectric module disposed on an upper side of the storage compartment, the thermoelectric module including a thermoelectric element having a heating portion, a heat-absorbing portion, a first surface connected to the heating portion, and a second surface connected to the heat-absorbing portion, and the shape of the first surface and the shape of the second surface may include a circle.

[0011] FIG. 1 is a perspective view of a refrigerator according to one embodiment of the disclosure.

[0012] FIG. 2 is a perspective view of a refrigerator according to one embodiment of the disclosure.

[0013] FIG. 3 is a perspective view of a refrigerator according to one embodiment of the disclosure.

[0014] FIG. 4 is a side cross-sectional view of a refrigerator according to one embodiment of the disclosure.

[0015] FIG. 5 is an enlarged view of a refrigerator according to one embodiment of the disclosure.

[0016] FIG. 6 is an exploded perspective view of the inner and outer surfaces of a refrigerator according to one embodiment of the disclosure.

[0017] FIG. 7 is an exploded perspective view illustrating a connecting frame of a refrigerator according to one embodiment of the disclosure.

[0018] FIG. 8 is a perspective view illustrating a joint structure of a thermoelectric module and an upper wall of a refrigerator according to one embodiment of the disclosure.

[0019] FIG. 9 is an exploded perspective view of a heat dissipation fan and a thermoelectric module according to one embodiment of the disclosure.

[0020] FIG. 10 is a perspective view of a heat sink of a thermoelectric cooling device according to one embodiment of the disclosure.

[0021] FIG. 11 is a perspective view of a heat sink according to one embodiment of the disclosure.

[0022] Fig. 12 is a perspective view of a thermoelectric module of a refrigerator according to one embodiment of the disclosure.

[0023] Fig. 13 is an exploded perspective view of a thermoelectric module of a refrigerator according to one embodiment of the disclosure.

[0024] Fig. 14 is an enlarged view of a thermoelectric module of a refrigerator according to one embodiment of the disclosure.

[0025] Fig. 15 is a cross-sectional view of a thermoelectric module of a refrigerator according to one embodiment of the disclosure.

[0026] Fig. 16 is an enlarged view of a thermoelectric module of a refrigerator according to one embodiment of the disclosure.

[0027] Fig. 17 is a table showing the efficiency of a thermoelectric module of a refrigerator according to one embodiment of the disclosure.

[0028] Fig. 18 is a flowchart of a method for manufacturing a thermoelectric module of a refrigerator according to one embodiment of the disclosure.

[0029] It should be understood that the various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but rather to encompass various modifications, equivalents, or alternatives of the embodiments.

[0030] In connection with the description of the drawings, similar reference numerals may be used for similar or related components.

[0031] The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.

[0032] In this disclosure, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0033] The term "and / or" includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0034] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0035] In addition, terms such as 'front', 'rear', 'top', 'bottom', 'side', 'left', 'right', 'upper', and 'lower' used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0036] Terms such as "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the present disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0037] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0038] When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0039] A refrigerator according to one embodiment may include a body.

[0040] The body may include insulation. The insulation may insulate the interior and exterior of the storage compartment so that the temperature inside the storage compartment can be maintained at a set temperature without being affected by the external environment of the storage compartment. In one embodiment, the insulation may include a foam insulation, such as polyurethane foam. In another embodiment, the insulation may additionally include a vacuum insulation in addition to the foam insulation, or the insulation may consist solely of the vacuum insulation instead of the foam insulation.

[0041] A storage room can store various items such as food, medicine, and cosmetics, and the storage room can be formed so that at least one side is open for taking items in and out.

[0042] A refrigerator may include one or more storage compartments. When a refrigerator includes two or more storage compartments, each compartment may have a different purpose and be maintained at different temperatures. To achieve this, each storage compartment may be separated from the others by a partition wall containing insulation.

[0043] The storage room may be designed to maintain an appropriate temperature range depending on its intended use, and may include a "refrigerator," a "freezer," or a "variable temperature room," which are distinguished by their intended use and / or temperature range. A refrigerator may be maintained at a temperature appropriate for refrigerating items, and a freezer may be maintained at a temperature appropriate for freezing items. "Refrigeration" may mean cooling items to a temperature that does not freeze them, and for example, a refrigerator may be maintained at a temperature ranging from 0 degrees Celsius to +7 degrees Celsius. "Freezing" may mean cooling items to freeze them or keep them frozen, and for example, a freezer may be maintained at a temperature ranging from -20 degrees Celsius to -1 degree Celsius. A variable temperature room may be used as either a refrigerator or a freezer, at the user's option or not.

[0044] In addition to names such as "refrigerator," "freezer," and "variable temperature room," a storage room may also be called by various other names such as "vegetable room," "fresh room," "cooling room," and "ice room." The terms "refrigerator," "freezer," and "variable temperature room" used hereinafter should be understood to encompass storage rooms having corresponding uses and temperature ranges.

[0045] In one embodiment, the refrigerator may include at least one door configured to open and close an open side of a storage compartment. The door may be configured to open and close one or more storage compartments, or a single door may be configured to open and close multiple storage compartments. The door may be installed on the front of the main body in a pivotal or sliding manner.

[0046] The door may be configured to seal the storage compartment when the door is closed. The door may include insulation, similar to the body, to insulate the storage compartment when the door is closed.

[0047] According to one embodiment, the door may include a door outer panel forming the front of the door, a door inner panel forming the back of the door and facing the storage compartment, an upper cap, a lower cap, and door insulation provided on the interior of these.

[0048] The door inner panel may be provided with a gasket that seals the storage compartment by contacting the front of the body when the door is closed. The door inner panel may include a dyke that protrudes rearward to accommodate a door basket for storing items.

[0049] In one embodiment, the door may include a door body and a front panel detachably coupled to the front side of the door body and forming the front of the door. The door body may include a door outer panel forming the front of the door body, a door inner panel forming the rear of the door body and facing the storage compartment, an upper cap, a lower cap, and door insulation provided inside these.

[0050] Depending on the arrangement of the door and storage compartment, refrigerators can be classified into French door type, side-by-side type, bottom mounted freezer (BMF), top mounted freezer (TMF), or single-door refrigerator.

[0051] According to one embodiment, the refrigerator may include a cold air supply device configured to supply cold air to the storage compartment.

[0052] The cold air supply device may include a system of machines, devices, electronic devices and / or combinations thereof that can generate cold air and guide the cold air to cool the storage room.

[0053] In one embodiment, the cold air supply device can generate cold air through a refrigeration cycle that includes the processes of compression, condensation, expansion, and evaporation of a refrigerant. To this end, the cold air supply device can include a refrigeration cycle device having a compressor, a condenser, an expansion device, and an evaporator capable of driving the refrigeration cycle. In one embodiment, the cold air supply device can include a semiconductor, such as a thermoelectric module. The thermoelectric module can cool a storage compartment by generating heat and cooling through the Peltier effect.

[0054] According to one embodiment, the refrigerator may include a machine room in which at least some components belonging to the cold air supply device are arranged.

[0055] The machine room may be designed to be partitioned and insulated from the storage room to prevent heat generated by components placed within the machine room from being transferred to the storage room. The interior of the machine room may be configured to be connected to the exterior of the main body to dissipate heat from components placed within the machine room.

[0056] In one embodiment, the refrigerator may include a dispenser provided on the door to provide water and / or ice. The dispenser may be provided on the door so that it is accessible to a user without having to open the door.

[0057] In one embodiment, a refrigerator may include an ice-making device configured to produce ice. The ice-making device may include an ice-making tray configured to store water, an ice-separating device configured to separate ice from the ice-making tray, and an ice bucket configured to store ice produced in the ice-making tray.

[0058] According to one embodiment, the refrigerator may include a control unit for controlling the refrigerator.

[0059] The control unit may include a memory that stores or memorizes a program and / or data for controlling the refrigerator, and a processor that outputs a control signal for controlling a cold air supply device, etc. according to the program and / or data memorized in the memory.

[0060] Memory stores or records various information, data, commands, programs, etc. necessary for the operation of the refrigerator. Memory can store temporary data generated during the generation of control signals for controlling components within the refrigerator. Memory may include at least one of volatile memory and non-volatile memory, or a combination thereof.

[0061] The processor controls the overall operation of the refrigerator. The processor can control the components of the refrigerator by executing programs stored in memory. The processor may include a separate NPU that performs the operations of an artificial intelligence model. The processor may also include a central processing unit (CPU), a graphics processing unit (GPU), or the like. The processor may generate control signals to control the operation of the cooling system. For example, the processor may receive temperature information about the storage compartment from a temperature sensor and generate a cooling control signal to control the operation of the cooling system based on the temperature information.

[0062] Additionally, the processor may process user input of the user interface and control the operation of the user interface based on programs and / or data stored / stored in the memory. The user interface may be provided using an input interface and an output interface. The processor may receive user input from the user interface. Additionally, the processor may transmit display control signals and image data to the user interface for displaying an image on the user interface in response to the user input.

[0063] The processor and memory may be provided as a single unit or separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one subprocessor. The memory may include one or more memories.

[0064] In one embodiment, a refrigerator may include a processor and memory that control all components within the refrigerator, and may include multiple processors and multiple memories that individually control the components within the refrigerator. For example, the refrigerator may include a processor and memory that control the operation of a cooling device based on the output of a temperature sensor. Additionally, the refrigerator may separately include a processor and memory that control the operation of a user interface based on user input.

[0065] The communication module can communicate with external devices, such as servers, mobile devices, and other home appliances, via a nearby access point (AP). The AP can connect the local area network (LAN) to which the refrigerator or user device is connected to the wide area network (WAN) to which the server is connected. The refrigerator or user device can then connect to the server via the WAN.

[0066] The input interface may include keys, a touchscreen, a microphone, etc. The input interface may receive user input and transmit it to the processor.

[0067] The output interface may include a display, a speaker, etc. The output interface may output various notifications, messages, information, etc. generated by the processor.

[0068] Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the attached drawings.

[0069] FIG. 1 is a drawing illustrating a refrigerator according to one embodiment of the present disclosure. FIG. 2 is a drawing illustrating a state in which a door of a refrigerator according to one embodiment of the present disclosure is opened. FIG. 3 is a drawing illustrating the upper portion of a storage compartment of a refrigerator according to one embodiment of the present disclosure as viewed from below. FIG. 4 is a schematic side cross-sectional view of a refrigerator according to one embodiment of the present disclosure. FIG. 5 is an enlarged cross-sectional view taken along line I-I of FIG. 2.

[0070] Referring to FIGS. 1 to 5, a refrigerator (1) may include a main body (100), storage chambers (11, 12, 13) formed inside the main body (100), and doors (21, 22, 23, 24) provided to open and close the storage chambers (11, 12, 13).

[0071] The main body (100) may include an inner case (170), an outer case (180) coupled to the outer side of the inner case (170), and an insulating material (190) provided between the inner case (170) and the outer case (180) (see FIG. 6). The inner case (170) may form a storage chamber (11, 12, 13), and the outer case (180) may form the outer appearance of the main body (100).

[0072] In another aspect, the main body (100) may include an upper wall (110), a lower wall (120), a left wall (130), a right wall (140), and a rear wall (150). The upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may form an upper surface, a lower surface, a left surface, a right surface, and a rear wall of the main body (100), respectively.

[0073] Each of the upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may be formed of an inner surface (170), an outer surface (180), and an insulating material (190). For example, the upper surface of the upper wall (110) may be formed by the outer surface (180), the lower surface of the upper wall (110) may be formed by the inner surface (170), and an insulating material (190) may be provided on the inside of the upper wall (110).

[0074] The storage compartments (11, 12, 13) can accommodate items. The storage compartments (11, 12, 13) can be formed to have an open front side so that items can be put in or taken out. The main body (100) can include a horizontal partition wall (160) that divides the first storage compartment (11) from the second storage compartment (12) and the third storage compartment (13), and a vertical partition wall (161) that divides the second storage compartment (12) from the third storage compartment (13). The first storage compartment (11) can be provided at the upper part of the main body (100), and the second storage compartment (12) and the third storage compartment (13) can be provided at the lower part of the main body (100). The first storage compartment (11) can be a refrigerator compartment, the second storage compartment (12) can be a freezer compartment, and the third storage compartment (13) can be a variable temperature compartment.

[0075] Doors (21, 22, 23, 24) can open and close storage rooms (11, 12, 13). The first door (21) and the second door (22) can open and close the first storage room (11), the third door (23) can open and close the second storage room (12), and the fourth door (24) can open and close the third storage room (13). The doors (21, 22, 23, 24) can be rotatably coupled to the main body (100).

[0076] The doors (21, 22, 23, 24) may be rotatably coupled to the main body (100) by hinges. For example, the first door (21) and the second door (22) may be rotatably coupled to the main body (100) by a hinge (31) provided on the upper portion of the main body (100) and a hinge provided in the middle of the main body (100), respectively. The hinge (31) may include a hinge pin that protrudes vertically to form a rotational axis of the door. The hinge (31) may be covered by a top cover (300) provided to cover the upper front portion of the main body (100).

[0077] A rotating bar (40) may be provided on either the first door (21) or the second door (22) to cover the gap formed between the first door (21) and the second door (22) when the first door (21) and the second door (22) are closed. The rotating bar (40) may be provided rotatably on either the first door (21) or the second door (22). The rotating bar (40) may have a rod shape that is formed long in a vertical direction. The rotating bar (40) may also be referred to as a pillar, a mullion, or the like.

[0078] A guide protrusion (46) may be provided at the top of the rotating bar (40), and a rotation guide (119) that guides the rotation of the guide protrusion (46) may be provided at the top of the main body (100).

[0079] The doors (21, 22, 23, 24) may include a gasket (51). The gasket (51) may be pressed against the front of the body (100) when the doors (21, 22, 23, 24) are closed. The doors (21, 22, 23, 24) may include a ditch (52) that protrudes rearward. A door shelf (53) capable of storing items may be mounted on the ditch (52). A rotating bar (40) may be rotatably installed on the ditch (52).

[0080] Although the number and arrangement of storage compartments and the number and arrangement of doors have been described above, there is no limitation on the number and arrangement of storage compartments and the number and arrangement of doors of a refrigerator according to one embodiment of the present disclosure.

[0081] The refrigerator (1) may include a thermoelectric cooling device (400) arranged to cool the storage compartment (11).

[0082] A thermoelectric cooling device (400) may be provided on the upper side of the storage room (11) to cool the storage room (11). That is, the thermoelectric cooling device may be provided on the upper wall (110) of the main body (100).

[0083] A thermoelectric cooling device (400) may include a thermoelectric module (530). The thermoelectric module (530) may be a semiconductor device that converts thermal energy into electrical energy using the thermoelectric effect, and may also be referred to as a thermoelectric semiconductor device, a Peltier device, or the like.

[0084] The thermoelectric module (530) includes a heating element (531, 534) and a heat absorbing element (532, 535) (see FIG. 13). When current is applied to the thermoelectric module (530), a heating action may occur in the heating element (531, 534) and a heat absorbing action may occur in the heat absorbing element (532, 535). For example, the thermoelectric module (530) may have a thin hexahedral shape. The heating element (531, 534) may be provided on one surface of the thermoelectric module (530), and the heat absorbing element (532, 535) may be provided on the opposite surface.

[0085] The heat generating portions (531, 534) may face the outside of the main body (100) and the heat absorbing portions (532, 535) may face the inside of the storage chamber (11). For example, the thermoelectric module (530) may be provided on the upper wall (110) such that the heat generating portions (531, 534) face above the thermoelectric module (530) and the heat absorbing portions (532, 535) face below the thermoelectric module (530). Accordingly, air that has been warmed through heat exchange with the heat generating portions (531, 534) may be discharged to the outside of the main body (100), and air that has been cooled through heat exchange with the heat absorbing portions (532, 535) may be supplied to the storage chamber (11).

[0086] The thermoelectric cooling device (400) may include a heat sink (520) that contacts the heat generating part (531, 534) so ​​that heat exchange between the heat generating part (531, 534) and the air outside the main body (100) is efficiently performed.

[0087] A heat sink (520) may be located outside the main body (100). The heat sink (520) may contact the heat generating portion (531, 534) to absorb heat from the heat generating portion (531, 534) and release heat to the outside of the main body (100). The heat sink (520) may also be referred to as a hot sink, a heat dissipation heat sink, a hot heat sink, etc.

[0088] The heat sink (520) may be formed of a metal material with high thermal conductivity. For example, the heat sink (520) may be formed of aluminum or copper.

[0089] A heat sink (520) may include a heat sink base (521) that contacts the heat generating portion (531, 534) and a plurality of heat sink fins (525) that protrude from the heat sink base (521) to expand the heat transfer area. The plurality of heat sink fins (525) may protrude upward from the heat sink base (521).

[0090] The thermoelectric cooling device (400) may include a heat sink (570) that contacts the heat absorbing portion (532, 535) so that heat exchange between the heat absorbing portion (532, 535) and the air inside the storage chamber (11) is efficiently performed.

[0091] A heat sink (570) may be located inside the storage compartment (11). The heat sink (570) may cool the storage compartment (11) by taking away heat from the storage compartment (11) and transferring it to the heat absorbing portion (532, 535). The heat sink (570) may also be referred to as a cold sink, a cooling sink, a cooling heat sink, a cold heat sink, a cooling heat sink, etc.

[0092] The heat sink (570) may be formed of a metal material with high thermal conductivity. For example, the heat sink (570) may be formed of aluminum or copper.

[0093] The heat sink (570) may include a heat sink base (571) that contacts the heat absorbing portions (532, 535) and a plurality of cooling fins (575) that protrude from the heat sink base (571) to expand the heat transfer area. The plurality of cooling fins (525) may protrude downward from the heat sink base (571). The heat sink base (571) and the plurality of cooling fins (575) may be formed integrally.

[0094] The thermoelectric cooling device (400) may include a heat dissipation fan (600) that circulates air to ensure efficient heat exchange between the heat dissipation sink (520) and the air outside the main body (100).

[0095] A heat dissipation fan (600) can move and / or blow air toward a heat dissipation sink (520). The heat dissipation fan (600) can be configured to be positioned horizontally with respect to the heat dissipation sink (520). The heat dissipation fan (600) can be positioned on the outside of the body (100). The heat dissipation fan (600) can be positioned on the upper side of the upper wall (110).

[0096] For example, the heat dissipation fan (600) may be a centrifugal fan that draws in air in an axial direction and discharges it in radial directions. The centrifugal fan may include a blower fan. The rotation axis (610) of the heat dissipation fan (600) may be arranged perpendicular to the upper surface of the upper wall (110).

[0097] The thermoelectric cooling device (400) may include a heat dissipation duct (700) configured to guide air flowing by a heat dissipation fan (600). The heat dissipation duct (700) may guide air from outside the main body (100) to exchange heat with the heat dissipation sink (520), and may discharge the air that has exchanged heat with the heat dissipation sink (520) back to the outside of the main body (100).

[0098] The heat dissipation duct (700) can draw in air from the external space on the upper side of the main body (100). The heat dissipation duct (700) can discharge air that has exchanged heat with the heat dissipation sink (520) to the external space on the upper side of the main body (100). The heat dissipation fan (600) can be located inside the heat dissipation duct (700). The heat dissipation sink (520) can be located inside the heat dissipation duct (700). The heat dissipation duct (700) can be provided on the upper surface of the upper wall (110).

[0099] The heat dissipation duct (700) may include an outside air intake port that draws air outside the main body (100) into the inside of the heat dissipation duct (700), and an outside air exhaust port that discharges air that has exchanged heat with the heat dissipation sink (520) to the outside of the main body (100).

[0100] The thermoelectric cooling device (400) may include a cooling fan (800) that circulates air to ensure efficient heat exchange between the heat sink (570) and the air inside the storage chamber (11).

[0101] A cooling fan (800) may move and / or blow air toward a heat sink (570). The cooling fan (800) may be configured to be positioned horizontally with respect to the heat sink (570). The cooling fan (800) may be provided inside the storage compartment (11). The cooling fan (800) may be provided on the lower side of the upper wall (110).

[0102] For example, the cooling fan (800) may be a centrifugal fan that sucks in air in an axial direction and discharges it in radial directions. The rotation axis (810) of the cooling fan (800) may be arranged perpendicular to the bottom surface of the upper wall (110).

[0103] The thermoelectric cooling device (400) may include a cooling duct (900) configured to guide air flowing by a cooling fan (800). The cooling duct (900) may guide air inside the storage chamber (11) to exchange heat with the heat sink (570), and may discharge the air that has exchanged heat with the heat sink (570) back into the storage chamber (11).

[0104] A cooling fan (800) may be located inside a cooling duct (900). A heat sink (570) may be located inside a cooling duct (900). The cooling duct (800) may be provided on the lower surface of the upper wall (110).

[0105] The cooling duct (900) may include an intake port (991) for drawing air inside the storage room (11) into the interior of the cooling duct (900), and an exhaust port (992) for discharging air that has exchanged heat with the heat sink (570) into the interior of the storage room (11).

[0106] Referring to FIG. 4, a refrigerator (1) may include a refrigeration cycle device to cool a storage compartment through a refrigeration cycle. The refrigeration cycle device may include a compressor (2), a condenser, an expansion device, and an evaporator (3). The evaporator (3) may be provided on the rear side of the storage compartment (12, 13).

[0107] The refrigerator (1) may include evaporator ducts (60, 70) that guide cold air generated in the evaporator (3). The first evaporator duct (60) may be provided on the rear side of the second storage compartment (12) and the third storage compartment (13). The second evaporator duct (70) may be provided on the rear side of the first storage compartment (11).

[0108] The cold air generated in the evaporator (3) can be sucked into the interior of the first evaporator duct (60) by the evaporator fan (80). The cold air sucked into the interior of the first evaporator duct (60) can be discharged to the second storage chamber (12) or the third storage chamber (13) through a cold air discharge port formed at the front portion of the first evaporator duct (60). In addition, the cold air sucked into the interior of the first evaporator duct (60) can be guided to the internal passage (78) of the second evaporator duct (70). The first evaporator duct (60) can be provided with a damper (61) configured to control the supply of the cold air inside the first evaporator duct (60) to the second evaporator duct (70). A connecting duct (90) may be provided between the first evaporator duct (60) and the second evaporator duct (70) to connect the first evaporator duct (60) and the second evaporator duct (70).

[0109] Cold air introduced into the internal passage (78) of the second evaporator duct (70) can be supplied to the first storage chamber (11) through the cold air discharge port (72) formed in the front part of the second evaporator duct (70).

[0110] However, unlike the above embodiment, the cold air generated in the evaporator (3) may be supplied directly to the second evaporator duct (70) without passing through the first evaporator duct (60). In addition, a separate evaporator (3) may be provided on the rear side of the first storage chamber (11) and configured to supply cold air to the second evaporator duct (70).

[0111] In this way, since the refrigerator (1) according to one embodiment of the present disclosure includes a thermoelectric cooling device and a refrigeration cycle device for cooling the storage compartment (11), a method of supplying cold air to the storage compartment (11) may include a first method of supplying only cold air generated by the thermoelectric cooling device (400), a second method of supplying only cold air generated by the refrigeration cycle device, and a third method of supplying both cold air generated by the thermoelectric cooling device and cold air generated by the refrigeration cycle device.

[0112] The refrigerator (1) can supply cold air to the storage compartment (11) in an appropriate manner depending on external and internal conditions. For example, the refrigerator (1) can cool the storage compartment (11) in one of the manners depending on the temperature of the room in which the refrigerator (1) is installed. For example, when the room temperature is higher than a predetermined temperature and cooling by a refrigeration cycle is more efficient than cooling by a thermoelectric cooling device (400), the storage compartment (11) can be cooled only by the cold air generated by the refrigeration cycle device. Conversely, when the room temperature is lower than a predetermined temperature and cooling by a thermoelectric cooling device (400) is more efficient than cooling by a refrigeration cycle device, the storage compartment (11) can be cooled only by the cold air generated by the thermoelectric cooling device (400). The refrigerator (1) can operate only the thermoelectric cooling device (400) when noise reduction is required. When it is necessary to rapidly cool the storage room (11), the refrigerator (1) can simultaneously supply cold air generated through the thermoelectric cooling device (400) and cold air generated through the refrigeration cycle device to the storage room (11).

[0113] In this way, according to one embodiment of the present disclosure, the refrigerator may include a thermoelectric cooling device (400) and a refrigeration cycle device, but is not limited thereto, and the refrigerator may include only a thermoelectric cooling device (400).

[0114] FIG. 6 is a diagram illustrating an inner casing, an outer casing, and a connecting frame according to an embodiment of the present disclosure. FIG. 7 is a diagram illustrating a connecting frame according to an embodiment of the present disclosure. FIG. 8 is a perspective view illustrating a coupling structure of a thermoelectric module and an upper wall of a refrigerator according to an embodiment of the present disclosure. FIG. 9 is an exploded view illustrating a heat dissipation fan and a thermoelectric module according to an embodiment of the present disclosure. FIG. 10 is a diagram illustrating a heat dissipation sink according to an embodiment of the present disclosure. FIG. 11 is a diagram illustrating a heat absorption sink according to an embodiment of the present disclosure.

[0115] Referring to FIGS. 6 to 11, the configuration of a thermoelectric module of a thermoelectric cooling device according to one embodiment of the present disclosure and the installation structure of the thermoelectric module are described.

[0116] The main body (100) of the refrigerator (1) may include an inner case (170) forming a storage compartment (11) and an outer case (180) coupled to the outside of the inner case (170). An insulating material (190) for insulating the storage compartment (11) may be provided between the inner case (170) and the outer case (180). The inner case (170) may include an inner opening (171). The outer case (180) may include an outer opening (181).

[0117] The inner opening (171) may be formed larger than the outer opening (181). However, unlike the present embodiment, the inner opening (171) and the outer opening (181) may be formed to have the same size. In this case, the connecting frame (200) described later may be composed of only the connecting frame body (270) without the connecting frame base (210).

[0118] The main body (100) may include a connecting frame (200) provided between the inner case (170) and the outer case (180) to form a through hole (115) penetrating the upper wall (110) by connecting the inner case opening (171) and the outer case opening (181).

[0119] One side of the connecting frame (200) may be supported on the inner surface (the surface facing the insulation material) of the inner case (170), and the other side of the connecting frame (200) may be supported on the inner surface (the surface facing the insulation material) of the outer case (180).

[0120] When the connecting frame (200) is placed between the inner case (170) and the outer case (180), an insulating space can be formed by the inner case (170), the outer case (180), and the connecting frame (200). For example, the inner case (170), the outer case (180), and the connecting frame (200) can be connected to each other by filling and foaming a foam insulation material in the insulating space. The connecting frame (200) can be formed of a material with low thermal conductivity. The connecting frame (200) can be formed of a resin material.

[0121] The connecting frame (200) may include a frame base (210) connected to the inner opening (171) and a frame body (270) protruding from the upper surface of the frame base (210) and connected to the outer opening (181).

[0122] The frame base (210) may have a size corresponding to the size of the inner opening (171). The frame base (210) may include a frame base opening (211). The frame base opening (211) may have a size corresponding to the outer opening (181).

[0123] For example, the frame body (270) may have a rectangular frame shape with a predetermined thickness. The frame body (270) may include a frame body opening (271). The frame body opening (271) may have a size corresponding to the external opening (181). The frame base opening (211) and the frame body opening (271) may form a through hole (115) of the upper wall (110).

[0124] The frame base (210) and the frame body (270) may be provided separately and coupled to each other. The frame base (210) and the frame body (270) may be coupled through a frame coupling member (201). To this end, a coupling hole (240) may be formed in the frame base (210) and a coupling hole (280) may be formed in the frame body (270). For example, the frame coupling member (201) may be a coupling mechanical element such as a screw, a pin, a bolt, a rivet, etc. However, the frame base (210) and the frame body (270) may also be formed integrally.

[0125] The frame base (210) may include an upwardly protruding base projection (230). A receiving space may be formed in a recessed manner on the lower surface of the base projection (230) to receive a portion of the cooling duct (900).

[0126] The thermoelectric cooling device (400) may include a thermoelectric module (500).

[0127] A thermoelectric element (530), a heat dissipation sink (520), and a heat absorption sink (570) can be assembled integrally to form a thermoelectric module (500). For example, the thermoelectric module (500) can include a thermoelectric element (530), a heat dissipation sink (520), a heat absorption sink (570), and a module plate (550).

[0128] As illustrated in Fig. 8, the thermoelectric module (500) can be coupled to the upper wall (110) of the main body (100) via a separate coupling member (S). The thermoelectric module (500) can be provided to penetrate the through hole (115) of the upper wall (110) such that the heat dissipation sink (520) is positioned outside the main body (100) and the heat absorption sink (570) is positioned inside the storage chamber (11). A sealing member (560) for sealing can be provided between the module plate (550) of the thermoelectric module (500) and the upper surface of the upper wall (110).

[0129] The module plate (550) can serve as a frame for the thermoelectric module. The module plate (550) can be formed of a resin material having low thermal conductivity. The module plate (550) can maintain a gap between the heat dissipation sink (520) and the heat absorption sink (570) and support the heat dissipation sink (520) and the heat absorption sink (570). For example, the module plate (550) can be formed integrally with a fan case (650) to be described later. However, the module plate (550) can also be provided separately from the fan case (650).

[0130] The module plate (550) may include a heat sink support (552) that supports a heat sink (520).

[0131] The module plate (550) may include a module plate opening (551). The thermoelectric element (530) may be disposed inside the module plate opening (551). The vertical length of the module plate opening (551) may be greater than the vertical length of the thermoelectric element (530), and the thermoelectric element (530) may be disposed on the upper side of the module plate opening (551). The reason why the thermoelectric element (530) is disposed on the upper side inside the module plate opening (551) is because the heat generation amount of the thermoelectric element (530) is typically higher than the heat absorption amount, and the positioning of the thermoelectric element (530) on the upper side of the module plate opening (551) is advantageous for heat dissipation of the heat generating parts (531, 534).

[0132] Accordingly, since the thermoelectric element (530) is placed on the upper side of the module plate opening (551), the heat sink (570) may include a cooling conductive portion (574) protruding from the heat sink base (571) for contact with the heat absorbing portion (532, 535) of the thermoelectric element (530).

[0133] The thermoelectric module (500) may include a module plate (550) and an element insulation material (540) that insulates the thermoelectric element (530). The element insulation material (540) may be placed in the module plate opening (551) to prevent the side surfaces of the thermoelectric element (530) from contacting the module plate (550). The element insulation material (540) may surround the thermoelectric element (530). The element insulation material (540) includes an element insulation opening (541), and the thermoelectric element (530) may be accommodated in the element insulation opening (541).

[0134] The thermoelectric module (500) may include a sink insulation (580) disposed between the module plate (550) and the heat sink (570). The sink insulation (580) may prevent heat from being transferred between the heat dissipation sink (520) and the heat absorption sink (570) through the module plate (550). The sink insulation (580) may include a sink insulation opening (581). However, the sink insulation (580) may be omitted, in which case the heat dissipation sink (520) may be supported on the upper surface of the module plate (550), and the heat absorption sink (570) may be supported on the lower surface of the module plate (550).

[0135] Referring to FIGS. 8 to 10, the thermoelectric cooling device (400) may include a fan case (650) that guides air blown by a heat dissipation fan (600). The heat dissipation fan (600) may be installed in the fan case (650). The fan case (650) may be formed integrally with the module plate (550) described above, or may be provided separately.

[0136] The fan case (650) may include a case bottom (660) on which a heat dissipation fan (600) is rotatably installed, and a case scroll portion (670) extending upward from the edge of the case bottom (660) to guide air blown from the heat dissipation fan (600) toward a heat dissipation sink (520). The heat dissipation fan (600) is a centrifugal fan, and may be installed on the case bottom (660) so that the rotation axis (610) is perpendicular to the case bottom (660). In addition, the heat dissipation sink (520) may be positioned in one radial direction of the heat dissipation fan (600). With this structure, the overall vertical length of the thermoelectric cooling device (400) can be shortened, and the thermoelectric cooling device (400) can be made compact.

[0137] The case scroll portion (670) may be formed to surround the heat dissipation fan (600). The case scroll portion (670) may have a scroll portion opening (673) open toward the heat dissipation sink (520). The case scroll portion (670) may include a downstream end (671) along the rotational direction (R) of the heat dissipation fan (600) and an upstream end (672) along the rotational direction (R).

[0138] The downstream end (671) and the upstream end (672) are spaced apart from each other, and a scroll opening (673) can be formed between the downstream end (671) and the upstream end (672).

[0139] The air blown from the heat dissipation fan (600) can be discharged in the radial directions of the heat dissipation fan (600) and move along the inner surface of the case scroll part (670) toward the heat dissipation sink (520). Therefore, the air blown from the heat dissipation fan (600) can flow more around the downstream end (671) of the case scroll part (670) than around the upstream end (672) of the case scroll part (670).

[0140] The fan case (650) may include a case guide (680) provided to guide air flowing from the heat dissipation fan (600) to the area around the downstream end (671) of the case scroll section (670).

[0141] The case guide (680) may protrude upward from the case bottom (660). The case guide (680) may be spaced apart from the case scroll unit (670). The case guide (680) may guide air flowing around the downstream end (671) of the case scroll unit (670) toward the upstream end (672) of the case scroll unit (670). Therefore, the air blown from the heat dissipation fan (600) may be evenly distributed to the heat dissipation channels (528) of the heat dissipation sink (520) by the case guide (680), and the heat exchange efficiency of the heat dissipation sink (520) may be increased.

[0142] Referring to FIG. 10, a plurality of heat dissipation fins (525) may protrude from the upper surface (522) of the heat dissipation sink base (521). The plurality of heat dissipation fins (525) may protrude in a first direction (526) perpendicular to the upper surface (522) of the heat dissipation sink base (521).

[0143] A plurality of heat dissipation fins (525) may be formed to extend in a second direction (527) parallel to the upper surface (522) of the heat dissipation sink base (521). The second direction (527) may be perpendicular to the first direction (526). Heat dissipation channels (528) may be formed between adjacent plurality of heat dissipation fins (525). The heat dissipation channels (528) may extend in the second direction (527) like the plurality of heat dissipation fins (525). Some of the heat dissipation channels (529) among the heat dissipation channels (528) may have a larger width than other heat dissipation channels.

[0144] Air flowing by the heat dissipation fan (600) can pass through the heat dissipation channels (528) and exchange heat with a plurality of heat dissipation fins (525). The airflow (A) flowing by the heat dissipation fan (600) can pass through the heat dissipation channels (528) in a direction parallel to the second direction (527).

[0145] Referring to FIG. 11, a plurality of cooling fins (575) may protrude from the lower surface (572) of the heat sink base (571). The plurality of cooling fins (575) may protrude in a first direction (576) perpendicular to the lower surface (572) of the heat sink base (571).

[0146] A plurality of cooling fins (575) may be formed to extend in a second direction (577) parallel to the lower surface (572) of the heat sink base (571). The second direction (577) may be perpendicular to the first direction (576). Cooling channels (578) may be formed between adjacent cooling fins (575). Some cooling channels (579) among the cooling channels (578) may have a larger width than other cooling channels (578).

[0147] Air flowing by the cooling fan (800) can pass through the cooling channels (578) and exchange heat with a plurality of cooling fins (575). The airflow (B) flowing by the cooling fan (800) can pass through the cooling channels (578) in a direction parallel to the second direction (577).

[0148] The thermoelectric cooling device (400) may further include a fastening member (596). The fastening member (596) may penetrate the heat sink (520) and the heat absorption sink (570) to couple, fasten, and / or secure the heat sink (520) and the heat absorption sink (570). For example, the fastening member (596) may penetrate the heat sink base (521) and the heat absorption sink base (571) to couple the heat sink base (521) and the heat absorption sink base (571). The fastening member (596) may include a plurality of fastening members (596).

[0149] The fastening member (596) may extend in one direction. For example, the fastening member (596) may extend in a vertical direction. For example, the head of the fastening member (596) may be positioned on the side of the heat sink (520), and the extension portion (596b) may penetrate the heat sink (520) and the heat absorption sink (570).

[0150] The thermoelectric cooling device (400) may further include an insulating member (593, 594). The insulating member (593, 594) may reduce heat transfer between the heat sink (520) and the heat sink (570) via the fastening member (596). The insulating member (593, 594) may include a material having a low heat transfer coefficient. For example, the insulating member (593, 594) may include plastic.

[0151] Insulating members (593, 594) may be positioned between a plurality of heat dissipation fins (525) and / or a plurality of cooling fins (575). The insulating members (593, 594) may be configured to surround the fastening member (596). The insulating members (593, 594) may extend along the extension direction of the fins. The insulating members (593, 594) may be referred to as insulating washers.

[0152] The insulating member (593, 594) may include a plurality of insulating members (593, 594). The plurality of insulating members (593, 594) may include a first insulating member (593) and a second insulating member (594).

[0153] A first insulating member (593) may be inserted and / or seated in a heat sink base (521). The first insulating member (593) may be disposed between a plurality of heat dissipation fins (525). The first insulating member (593) may be disposed on the heat sink base (521). For example, the first insulating member (593) may surround a fastening member (596) on the upper portion of the heat sink base (521). The first insulating member (593) may include a plurality of first insulating members (593). For example, the number of first insulating members (593) may correspond to the number of fastening members (596). The first insulating member (593) may be referred to as a heat dissipation insulating member.

[0154] A second insulating member (594) may be inserted and / or seated in the heat sink base (571). The second insulating member (594) may be disposed between a plurality of cooling fins (575). The second insulating member (594) may be disposed below the heat sink base (571). For example, the second insulating member (594) may surround the fastening member (596) at the bottom of the heat sink base (571). The second insulating member (594) may include a plurality of second insulating members (594). For example, the number of second insulating members (594) may correspond to the number of fastening members (596). The second insulating member (594) may be referred to as a cooling insulating member.

[0155] The thermoelectric cooling device (400) may further include a blocking unit (590). The blocking unit (590) may block current supplied to the thermoelectric element (530) based on overheating of the thermoelectric element (530). For example, the blocking unit (590) may block current supplied to the thermoelectric element (530) based on overheating of the temperature of the heat sink (520). The blocking unit (590) may be electrically connected to the thermoelectric element (530). Additionally, the blocking unit (590) may be connected to a control unit via a cable (595).

[0156] The blocking member (590) may be adjacent to the heat generating members (531, 534). For example, the blocking member (590) may be positioned between a plurality of heat dissipation fins (525). The blocking member (590) may be secured by a first insulating member (593). The blocking member (590) may include a fuse, a switch (590), and / or a sensor (590).

[0157] For example, the fuse (590) may be thermally short-circuited based on the thermoelectric element (530) overheating. Since the fuse (590) is electrically connected to the thermoelectric element (530), the current supplied to the thermoelectric element (530) may be cut off based on the fuse (590) being short-circuited.

[0158] In one embodiment of the refrigerator, at least one of the motors driving the heat dissipation fan (600) and the cooling fan (800) may fail. In this case, the fans (600, 800) cannot lower the temperature of the thermoelectric element (530), so the thermoelectric cooling device (400) may overheat. If the thermoelectric cooling device (400) overheats, the module plate (500), the fan case (650), the connecting frame (200), the heat dissipation duct (700), the cooling duct (900), and / or the temperature sensors (591, 592) constituting the thermoelectric cooling device (400) may be damaged.

[0159] Additionally, if the temperature sensor (591, 592) fails, the thermoelectric element (530) and the thermoelectric cooling device (400) may overheat, and the elements of the thermoelectric cooling device (400) may be damaged.

[0160] In a refrigerator according to one embodiment, the cutoff unit (590) can cut off the current supplied to the thermoelectric element (530) based on the temperature of the thermoelectric element (530) rising. Therefore, the cutoff unit (590) can prevent the thermoelectric element (530) from overheating, thereby preventing the thermoelectric cooling device (400) including the temperature sensors (591, 592) from being damaged, and thus the safety of use can be increased. In addition, since damage to the components of the thermoelectric cooling device (400) is prevented, the need to replace the temperature sensors (591, 592) is reduced, thereby reducing the user's usage cost.

[0161] The case where the temperature of the thermoelectric cooling device (400) including the thermoelectric element (530) is overheated is not limited to the above-described example.

[0162] The thermoelectric cooling device (400) may further include a temperature sensor (591, 592). The temperature sensor (591, 592) may detect the temperature of a component of the thermoelectric cooling device (400). For example, the temperature sensor (591, 592) may detect the temperature of the heat sink (520) and / or the heat sink (570). Additionally, for example, the temperature sensor (591, 592) may sense the temperature of the thermoelectric element (530).

[0163] The temperature sensor (591, 592) can detect the temperature of the thermoelectric element (530) and transmit temperature-related information to the control unit. The control unit can control the thermoelectric element (530), the compressor (2), and / or the user interface based on the temperature value detected by the temperature sensor (591, 592).

[0164] The temperature sensor (591, 592) may include a plurality of temperature sensors (591, 592). The plurality of temperature sensors (591, 592) may include a first temperature sensor (591) and a second temperature sensor (592).

[0165] The first temperature sensor (591) may be coupled and / or mounted on the heat sink base (521). The first temperature sensor (591) may be disposed on the side of the heat sink fin (525a) that is disposed at the outermost end among the plurality of heat sink fins (525). The first temperature sensor (591) may be disposed on the heat sink base (521). For example, the first temperature sensor (591) may be coupled to the heat sink (520) by a coupling member on the upper portion of the heat sink base (521). The first temperature sensor (591) may be referred to as a heat sink temperature sensor.

[0166] The second temperature sensor (592) may be coupled and / or mounted on the heat sink base (571). The second temperature sensor (592) may be disposed on the side of the cooling fin (575a) that is disposed at the outermost end among the plurality of cooling fins (575). The second temperature sensor (592) may be disposed below the heat sink base (571). For example, the second temperature sensor (592) may be coupled to the heat sink (520) by a coupling member at the bottom of the heat sink base (571). The second temperature sensor (592) may be referred to as a cooling temperature sensor.

[0167] Fig. 12 is a perspective view of a thermoelectric element of a refrigerator according to one embodiment of the disclosure. Fig. 13 is an exploded perspective view of a thermoelectric element of a refrigerator according to one embodiment of the disclosure. Fig. 14 is an enlarged view of a thermoelectric element of a refrigerator according to one embodiment of the disclosure. Fig. 15 is a cross-sectional view of a thermoelectric element of a refrigerator according to one embodiment of the disclosure. Fig. 16 is an enlarged view of a thermoelectric element of a refrigerator according to one embodiment of the disclosure.

[0168] Fig. 14 is an enlarged view of area B shown in Fig. 13. Fig. 15 is a cross-sectional view taken along line A-A' of the thermoelectric element shown in Fig. 12. Fig. 16 is an enlarged view of area C shown in Fig. 15.

[0169] Referring to FIGS. 12 to 16, a thermoelectric cooling device (400) of a refrigerator according to one embodiment may include a thermoelectric element (530). The thermoelectric element (530) may be connected to a control unit via a cable (537). The thermoelectric element (530) may include a heating unit (531, 534) and a heat absorbing unit (532, 535). For example, the heating unit (531, 534) may include a heating plate (531), and the heat absorbing units (532, 535) may include a heat absorbing plate (532). The heating plate (531) and the heat absorbing plate (532) may include a substantially flat plate shape. For example, the heating plate (531) and the heat absorbing plate (532) may include a ceramic plate. The heat absorbing part (532, 535) can be a cooling part (532, 535), the heat absorbing plate (532) can be a cooling plate (532), and the heat absorbing electrode (535) can be a cooling electrode (535).

[0170] The thermoelectric element (530) may further include a thermoelectric cell (533). The thermoelectric cell (533) may heat the heat generating portion (531, 534) and cool the heat absorbing portion (532, 535). The thermoelectric cell (533) may be supplied with current through a cable (537). The thermoelectric cell (533) may be in contact with at least one electrode (534, 535) to exchange current with each other. For example, the thermoelectric cell (533) may be composed of a pair of P-type cells (533a) and N-type cells (533b), and when current flows through the P-type cells (533a) and N-type cells (533b), heat may be released from the heat generating portion (531, 534) and absorbed by the heat absorbing portion (532, 535). In one embodiment, the heat generating portion (531, 534) is provided above the heat absorbing portion (532, 535), but if the current flowing in the P-type cell (533a) and the N-type cell (533b) flows in opposite directions, the heat generating portion may be provided below the heat absorbing portion. The P-type cell (533a) may be referred to as a P-type semiconductor (533a), and the N-type cell (533b) may be referred to as an N-type semiconductor (533b).

[0171] The thermoelectric cell (533) may be surrounded by a sealing member (536). The thermoelectric cell (533) may be placed in an internal space (536b) formed by the sealing member (536). For example, the thermoelectric cell (533) may be placed below the heat generating portion (531, 534) and above the heat absorbing portion (532, 535). In addition, the thermoelectric cell (533) may be placed below the first electrode (534) and above the second electrode (535).

[0172] The thermoelectric cell (533) may have a circular shape. For example, the cross-section of the thermoelectric cell (533) may have a circular shape. The cross-section of the thermoelectric cell (533) in a direction parallel to the heating plate (531) and / or the heat absorbing plate (532) may have a circular shape. For example, the cross-section of the thermoelectric cell (533) cut in a horizontal direction may have a circular shape. The thermoelectric cell (533) may have a cylindrical shape. For example, when cut in a horizontal direction, the cross-section of the thermoelectric cell (533) in a vertical direction may have a circular shape.

[0173] Additionally, a cross-section of the thermoelectric cell (533) cut in a direction parallel to the heating plate (531) and / or the heat-absorbing plate (532) may include an oval or approximately square shape. Additionally, the thermoelectric cell (533) may be provided in multiple forms, and a plurality of thermoelectric cells (533) may be combined to form a thermoelectric element (530) having circular, oval, and / or square cross-sections.

[0174] Since the thermoelectric cell (533) has a circular cross-section, the mechanical strength of the thermoelectric cell (533) can be improved, thereby reducing the possibility of breakage of the thermoelectric cell (533). In addition, the manufacturing yield of the thermoelectric cell (533) can be improved. In addition, the cooling efficiency and energy efficiency of the thermoelectric element (530) can be improved.

[0175] The thermoelectric element (530) may further include electrodes (534, 535). The electrodes (534, 535) may include a plurality of electrodes (534, 535). The plurality of electrodes (534, 535) may include a first electrode (534) and a second electrode (535). For example, the heating unit (531, 534) may include a first electrode (534), and the heat absorbing unit (532, 535) may include a second electrode (535). The first electrode (534) may be a heating electrode (534), and the second electrode (535) may be a heat absorbing electrode (535). The plurality of electrodes (534, 535) may include a common electrode (534, 535). A common electrode (534, 535) can connect a P-type cell (533a) and an N-type cell (533b).

[0176] The heating electrode (534) may be in contact with and connected to the heating plate (531). The heat-absorbing electrode (535) may be in contact with and connected to the heat-absorbing plate (532). The heat-absorbing electrode (535) may be electrically connected to the cable (537). For example, the heat-absorbing electrode (535) and the cable (537) may be soldered. A soldering portion (537a) may be provided at the heat-absorbing electrode (535) to which the cable (537) is electrically and physically connected. However, the cable (537) may also be connected to the heating electrode (534). Each of the heating electrode (534) and the heat-absorbing electrode (535) may be provided in plurality. The heating electrode (534) may include a plurality of heating electrodes (534). The heat-absorbing electrode (535) may include a plurality of heat-absorbing electrodes (535). The heating electrode (534) and the heat-absorbing electrode (535) may be wrapped by a sealing member (536). The heating electrode (534) and the heat-absorbing electrode (535) may be placed in an internal space (536b) formed by the sealing member (536). The heating electrode (534) may be placed on the lower surface of the heating plate (531, 534) via an adhesive, and the heat-absorbing electrode (535) may be placed on the upper surface of the heat-absorbing plate (532) via an adhesive.

[0177] The thermoelectric element (530) may further include a sealing member (536). The sealing member (536) may surround elements of the thermoelectric element (530). For example, the sealing member (536) may surround a thermoelectric cell (533), a heating electrode (534), and a heat-absorbing electrode (535). The thermoelectric cell (533), the heating electrode (534), and the heat-absorbing electrode (535) may be arranged in an internal space (536b) formed by the sealing member (536). A through hole (536a) may be formed in the sealing member (536). A cable (537) may pass through the through hole (536a) to be electrically connected to the thermoelectric cell (533). The sealing member (536) may include silicone.

[0178] Referring to FIGS. 15 and 16, the thermoelectric cell (533) may include a first thermoelectric cell (533a) and a second thermoelectric cell (533b). The first thermoelectric cell (533a) may include a P-type cell (533a), and the second thermoelectric cell (533b) may include an N-type cell (533b). The thermoelectric cell (533) may be composed of a P-type cell (533a) and an N-type cell (533b).

[0179] The P-type cell (533a) and the N-type cell (533b) can be electrically connected by a heat generating electrode (534) and a heat absorbing electrode (535). For example, adjacent P-type cells (533a) and N-type cells (533b) can be electrically connected through at least one electrode.

[0180] A thermoelectric cell (533) may include a first surface (533aa, 533ba) and a second surface (533ab, 533bb). For example, a P-type cell (533a) may include a first surface (533aa) and a second surface (533ab), and an N-type cell (533b) may include a first surface (533ba) and a second surface (533bb).

[0181] The first surface (533aa) of the thermoelectric cell (533) may be the upper surface, and the second surface (533ab) of the thermoelectric cell (533) may be the lower surface. The first surface (533aa, 533ba) of the thermoelectric cell (533) may be in contact with and connected to the heating electrode (534). The second surface (533ba, 533bb) of the thermoelectric cell (533) may be in contact with and connected to the heat-absorbing electrode (535). The first surface (533aa, 533ba) and the second surface (533ba, 533bb) of the thermoelectric cell (533) may be formed in a circular shape. For example, the area may not substantially change from the first surface (533aa, 533ba) of the thermoelectric cell (533) to the second surface (533ba, 533bb), and may continue to include a circular cross-section.

[0182] A plurality of thermoelectric cells (533) may be provided. Accordingly, the thermoelectric element (533) may include a plurality of P-type cells (533a) and N-type cells (533b).

[0183] Since the thermoelectric cell (533) has a circular cross-section, the mechanical strength of the thermoelectric cell (533) can be improved, thereby reducing the possibility of breakage. In addition, the manufacturing yield of the thermoelectric cell (533) can be improved. In addition, the cooling efficiency and energy efficiency of the thermoelectric element (530) can be improved.

[0184] Fig. 17 is a table showing the efficiency of a thermoelectric element of a refrigerator according to one embodiment of the disclosure.

[0185] Referring to FIG. 17, the efficiency improvement according to the temperature difference (ΔT) between the temperature (Th) of the heat generating parts (531, 534) and the temperature (Tc) of the heat absorbing parts (532, 535) is described. For example, the degree of improvement in efficiency is described based on the COP minimum value (COP min). The degree of improvement in efficiency of the COP minimum value can be calculated as (COP of one embodiment / COP of the existing product). In addition, for example, the cross-section of the thermoelectric cell of the existing product may be square, and in one embodiment, the cross-section of the thermoelectric cell (533) may be circular. In addition, for example, the number of thermoelectric cells of the existing product is 241, and in one embodiment, the number of thermoelectric cells (533) is 199, so the number of thermoelectric cells (533) may be reduced.

[0186] Referring to FIG. 17(a), in one embodiment of the disclosure, when the temperature (Tc) of the heat absorbing portion (532, 535) is -5 degrees, the temperature (Th) of the heat generating portion (531, 534) is 25 degrees, and the temperature difference (ΔT) is 30 degrees, the COP minimum value can be improved by about 10%. In addition, when the temperature (Th) of the heat generating portion (531, 534) is 35 degrees, and the temperature difference (ΔT) is 45 degrees, the COP minimum value can be improved by about 13.6%. In addition, when the temperature (Th) of the heat generating portion (531, 534) is 45 degrees, and the temperature difference (ΔT) is 50 degrees, the COP minimum value can be improved by about 11.8%.

[0187] Referring to FIG. 17(b), in one embodiment of the disclosure, when the temperature (Tc) of the heat absorbing portion (532, 535) is 0 degrees, the temperature (Th) of the heat generating portion (531, 534) is 25 degrees, and the temperature difference (ΔT) is 25 degrees, the COP minimum value can be improved by about 2.97%. In addition, when the temperature (Th) of the heat generating portion (531, 534) is 30 degrees, and the temperature difference (ΔT) is 30 degrees, the COP minimum value can be improved by about 6.83%. In addition, when the temperature (Th) of the heat generating portion (531, 534) is 40 degrees, and the temperature difference (ΔT) is 40 degrees, the COP minimum value can be improved by about 14.17%.

[0188] Referring to FIG. 17(c), in one embodiment of the disclosure, when the temperature (Tc) of the heat absorbing portion (532, 535) is 5 degrees, the temperature (Th) of the heat generating portion (531, 534) is 30 degrees, and the temperature difference (ΔT) is 25 degrees, the COP minimum value can be improved by about 6.28%. In addition, when the temperature (Th) of the heat generating portion (531, 534) is 35 degrees, and the temperature difference (ΔT) is 30 degrees, the COP minimum value can be improved by about 7.46%. In addition, when the temperature (Th) of the heat generating portion (531, 534) is 45 degrees, and the temperature difference (ΔT) is 40 degrees, the COP minimum value can be improved by about 9.68%.

[0189] Fig. 18 is a flowchart of a method for manufacturing a thermoelectric element of a refrigerator according to one embodiment of the disclosure.

[0190] Referring to FIG. 18, a method for manufacturing a thermoelectric element (530) according to one embodiment may include manufacturing an ingot (1810). For example, manufacturing the ingot (1810) may include mixing raw materials for a thermoelectric cell (533) and forming an ingot.

[0191] A method for manufacturing a thermoelectric element (530) according to one embodiment may further include manufacturing a powder (1820). For example, manufacturing the powder (1820) may include crushing an ingot and pulverizing the ingot. The crushing may make the crushed particles more uniform. For example, the crushing may be primary crushing, and the pulverizing may be secondary crushing. Additionally, the crushing may be primary crushing, and the pulverizing may be secondary crushing.

[0192] A method for manufacturing a thermoelectric element (530) according to one embodiment may further include manufacturing (1830) a material for a thermoelectric cell (533). Manufacturing (1830) the material may include manufacturing pellets, hot extruding the manufactured pellets, insulating-coating the extruded material, and inspecting the insulating-coated material. The pellets may have a cylindrical shape. Inspecting the material may include inspecting the resistance and Seebeck coefficient of the material.

[0193] A method for manufacturing a thermoelectric element (530) according to one embodiment may further include manufacturing a thermoelectric cell (533) (1840). Manufacturing a thermoelectric cell (533) (1840) may include cutting a hot-extruded and insulation-coated material, washing and plating the cut material, and inspecting the thermoelectric cell (533) thus completed. Inspecting the thermoelectric cell (533) may include checking for cracks, cracks, dents, etc. in the thermoelectric cell (533) and checking the flatness.

[0194] A method for manufacturing a thermoelectric element (530) according to one embodiment may further include connecting (1850) a thermoelectric cell (533), a heat generating part (531, 534), and a heat absorbing part (532, 535). Connecting the thermoelectric cell (533) and the heat generating portion (531, 534) and the heat absorbing portion (532, 535) (1850) may include attaching the thermoelectric cell (533) to the heat generating plate (531) to which the heat generating electrode (534) is attached and to the heat absorbing plate (532) to which the heat absorbing electrode (534) is attached, soldering the heat generating portion (531, 534) to which the thermoelectric cell (533) is attached and the heat absorbing portion (532, 535), assembling the cable (537), placing a sealing member (536) to seal the side of the thermoelectric cell (533), and performing a final inspection of the thermoelectric element (530). Inspecting the thermoelectric element (530) may include inspecting the appearance of the thermoelectric element (530) for cracks, etc., or inspecting whether the efficiency of the thermoelectric element (530) is above a specific value.

[0195] Additionally, the higher the temperature outside the main body (100), the more the energy efficiency of the refrigerator according to one embodiment can be improved.

[0196] A thermoelectric cooling device (400) according to one embodiment, according to one aspect of the disclosure, comprises: a heating plate (531) configured to emit heat; a heat absorbing plate (535) configured to absorb heat; a heating electrode (532) in contact with the heating plate; a heat absorbing electrode (534) in contact with the heat absorbing plate; a thermoelectric cell (533) configured to heat the heating plate and cool the heat absorbing plate, the thermoelectric cell (533) including an N-type semiconductor (533b) connected to the heating electrode and a P-type semiconductor (533a) connected to the heat absorbing electrode; and a common electrode (534, 535) electrically connected to the N-type semiconductor and the P-type semiconductor; wherein a cross-section of the thermoelectric cell in a direction parallel to the heating plate and the heat absorbing plate may include a circle.

[0197] The above thermoelectric cell may have a cylindrical shape.

[0198] The thermoelectric cell includes a first surface (533aa, 533ba) that is in contact with the heating electrode and a second surface (533ab, 533bb) that is in contact with the heat-absorbing electrode, and the shape of the first surface and the shape of the second surface may include a circle.

[0199] The thermoelectric cell may have the heat generating portion disposed above the thermoelectric cell and the heat absorbing portion disposed below the thermoelectric cell. The thermoelectric cooling device may include a heat sink (520) connected to the heat generating portion, and the heat sink may include a heat sink base (521) that contacts the heat generating portion, and a plurality of heat dissipation fins (525) that protrude in a first direction perpendicular to an upper surface of the heat dissipation sink base and are arranged in a second direction parallel to an upper surface of the heat dissipation sink base.

[0200] The thermoelectric cooling device includes a heat dissipation fan (600) that generates air flow, and the heat dissipation fan can blow air toward the heat sink in the second direction.

[0201] The above heat dissipation fan is a centrifugal fan that sucks in air in an axial direction and discharges it in radial directions, and the heat dissipation sink can be located in one radial direction of the heat dissipation fan.

[0202] The thermoelectric cooling device may include a fan case (650) in which the heat dissipation fan is installed and which guides air blown from the heat dissipation fan toward the heat sink.

[0203] The above thermoelectric cooling device may include a heat dissipation duct (700) provided on the upper side of the main body to guide the air flowing by the heat dissipation fan to exchange heat with the heat dissipation sink.

[0204] The thermoelectric cooling device may include a heat sink (570) connected to the heat absorbing portion, and the heat sink may include a heat sink base (571) that contacts the heat absorbing portion, and a plurality of heat dissipation fins (575) that protrude in a first direction perpendicular to a lower surface of the heat sink base and are arranged in a second direction parallel to a lower surface of the heat sink base.

[0205] The thermoelectric cooling device may further include a fuse (590) configured to cut off current supplied to the thermoelectric cell based on the heat sink exceeding a predetermined temperature.

[0206] The thermoelectric cooling device further includes a heat sink (520) that absorbs heat from the heat generating part and releases the heat to the outside, and the fuse can be placed in the heat sink.

[0207] The heat sink includes a heat sink base (521) that comes into contact with the heat generating part; and a plurality of heat sink fins (525) that protrude from the heat sink base to the outside of the main body; and the fuse can be placed between the plurality of heat sink fins.

[0208] A heat sink (570) that receives heat and transfers heat to the heat absorbing part, the heat sink (570) including a heat absorbing sink base (571) that contacts the heat absorbing part and a plurality of cooling fins (575) that protrude from the heat absorbing sink base; a fastening member (596) that penetrates the heat dissipation sink base and the heat absorbing sink base to couple the heat dissipation sink and the heat absorbing sink; and an insulating member (593) that is arranged between the plurality of heat dissipation fins and is configured to fix the fastening member.

[0209] The above fuse may be placed between the heat sink base and the insulating member.

[0210] According to one embodiment, a refrigerator may include a main body (100); a storage compartment (11, 12, 13) formed inside the main body; and a thermoelectric element (530) disposed on an upper side of the storage compartment, the thermoelectric element (530) including a thermoelectric cell (533) having a heating portion (531, 534), a heat-absorbing portion (532, 535), a first surface (533aa, 533ba) connected to the heating portion, and a second surface (533ab, 533bb) connected to the heat-absorbing portion; and the shape of the first surface and the shape of the second surface may include a circle.

[0211] The above-mentioned heating part may include a heating electrode (534) electrically connected to the first surface; and a heating plate (531) in contact with the heating electrode, and the heat absorption part may include a heat absorption electrode (535) electrically connected to the second surface; and a heat absorption plate (532) in contact with the heat absorption electrode.

[0212] It further includes a heat sink (520) that absorbs heat from the heat generating part and releases heat to the outside of the main body, and the heat sink may include a heat sink base (521) that contacts the heat generating part; and a plurality of heat sink fins (525) that protrude from the heat sink base to the outside of the main body.

[0213] It may further include a heat sink (570) that receives heat from the storage room and transfers the heat to the heat absorbing unit, and the heat sink may include a heat sink base (571) that contacts the heat absorbing unit; and a plurality of cooling fins (575) that protrude from the heat sink base into the storage room.

[0214] The thermoelectric device may further include a fuse (590) arranged between the plurality of heat dissipation fins, the fuse being configured to cut off the current supplied to the thermoelectric device based on the thermoelectric device exceeding a predetermined temperature.

[0215] According to one aspect of the disclosure, a refrigerator including a thermoelectric cell having a circular cross-section and thus improved cooling efficiency can be provided, and a refrigerator having a reduced production cost and material cost can be provided because the number of thermoelectric cells can be reduced.

[0216] The effects according to one aspect of the disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description below.

[0217] The above has illustrated and described specific embodiments. However, the present invention is not limited to the above-described embodiments, and those skilled in the art will appreciate that various modifications and implementations can be made without departing from the spirit and scope of the technical ideas of the present invention as set forth in the claims below.

Claims

1. A heating plate configured to radiate heat; An absorbent plate configured to absorb heat; A heating electrode in contact with the above heating plate; An absorbing electrode in contact with the absorbing plate; A thermoelectric cell configured to heat the heating plate and cool the heat-absorbing plate, the thermoelectric cell including an N-type semiconductor connected to the heating electrode and a P-type semiconductor connected to the heat-absorbing electrode; and A common electrode electrically connected to the N-type semiconductor and the P-type semiconductor; A thermoelectric cooling device having a cross-section parallel to the heating plate and the heat absorbing plate of the thermoelectric cell, the cross-section including a circle.

2. In paragraph 1, The above thermoelectric cell is a thermoelectric cooling device including a cylindrical shape.

3. In paragraph 2, The thermoelectric cell includes a first surface in contact with the heating electrode and a second surface in contact with the absorbing electrode, A thermoelectric cooling device wherein the shape of the first surface and the shape of the second surface include a circle.

4. In paragraph 3, The above thermoelectric cell is a thermoelectric cooling device in which the heat generating part is positioned above the thermoelectric cell and the heat absorbing part is positioned below the thermoelectric cell.

5. In paragraph 4, Further comprising a heat sink connected to the above heat generating unit, The above heat sink, A thermoelectric cooling device comprising a heat sink base that contacts the heat generating portion, and a plurality of heat sink fins that protrude in a first direction perpendicular to an upper surface of the heat sink base and are arranged in a second direction parallel to an upper surface of the heat sink base.

6. In paragraph 5, Includes a heat dissipation fan that generates airflow; The above heat dissipation fan is a thermoelectric cooling device that blows air toward the heat sink in the second direction.

7. In paragraph 6, The above-mentioned heat dissipation fan is a centrifugal fan that sucks in air in the axial direction and discharges it in the radial directions. The above heat sink is a thermoelectric cooling device positioned in a radial direction of the above heat dissipation fan.

8. In paragraph 6, A thermoelectric cooling device including a fan case in which the heat dissipation fan is installed and which guides air blown from the heat dissipation fan toward the heat sink.

9. In paragraph 6, A thermoelectric cooling device including a heat dissipation duct provided on the upper side of the main body to guide heat exchange between the air flowing by the heat dissipation fan and the heat dissipation sink.

10. In paragraph 5, Including a heat sink connected to the above heat absorbing part, The above heat sink is a thermoelectric cooling device including a heat sink base that contacts the heat absorbing part, and a plurality of heat dissipation fins that protrude in a first direction perpendicular to the lower surface of the heat sink base and are arranged in a second direction parallel to the lower surface of the heat sink base.

11. In paragraph 3, A thermoelectric cooling device further comprising a fuse configured to cut off current supplied to the thermoelectric cell based on the heat sink exceeding a predetermined temperature.

12. In paragraph 11, Further comprising a heat sink that absorbs heat from the above-mentioned heat generating unit and releases the heat to the outside; The above fuse is a thermoelectric cooling device arranged on the above heat sink.

13. In paragraph 12, The above heat sink, A heat sink base in contact with the above heat generating part; and comprising a plurality of heat dissipation fins protruding from the heat dissipation sink base; The above fuse is a thermoelectric cooling device arranged between the plurality of heat dissipation fins.

14. In paragraph 13, A heat sink that receives heat and transfers the heat to the heat absorbing portion, the heat sink including a heat absorbing sink base in contact with the heat absorbing portion and a plurality of cooling fins protruding from the heat absorbing sink base; A fastening member penetrating the heat sink base and the heat sink base to connect the heat sink and the heat sink; and A thermoelectric cooling device comprising: an insulating member arranged between the plurality of heat dissipation fins and configured to secure the fastening member; 15. In paragraph 14, The above fuse is a thermoelectric cooling device disposed between the heat sink base and the insulating member.

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