Flexible printed circuit board including layer having roughness and electronic device including same

Abstract

This electronic device includes: a housing; an FPCB for connecting electronic components disposed in the housing for transmitting a signal. The FPCB includes: a non-conductive layer; a first conductive layer disposed on one surface of the non-conductive layer and including a transmission line for transmitting the signal; and a second conductive layer disposed on the other surface opposite to the one surface of the non-conductive layer, wherein the non-conductive layer may have a thickness of 3.5 to 7.5 micrometers to electrically isolate the transmission line and the second conductive layer from each other. Other various embodiments are possible.

Description

Flexible printed circuit board comprising a layer having a roughness and an electronic device comprising the same

[0001] The present disclosure relates to a flexible printed circuit board including a layer having a roughness and an electronic device including the same.

[0002] As electronic devices become smaller and thinner, the thickness and size of components within them may be limited. To achieve miniaturization, electronic devices may require reducing the size of individual electronic components and optimizing their layout.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a housing and a flexible printed circuit board (FPCB). The FPCB may be configured to connect electronic components disposed within the housing to transmit signals. The FPCB may include a non-conductive layer, a first conductive layer, and a second conductive layer. The first conductive layer may include a transmission line disposed on one surface of the non-conductive layer, the transmission line configured to transmit the signal. The second conductive layer may be disposed on a surface opposite to the one surface of the non-conductive layer. The non-conductive layer may electrically isolate the transmission line from the second conductive layer. The non-conductive layer may have a thickness of approximately 3.5 micrometers to 7.5 micrometers.

[0005] A flexible printed circuit board is disclosed. In one embodiment, the flexible printed circuit board may include a non-conductive layer, a first conductive layer, and a second conductive layer. The first conductive layer may include a transmission line configured to transmit a signal, the transmission line being disposed on one surface of the non-conductive layer. The second conductive layer may be disposed on the other surface opposite the one surface of the non-conductive layer. The non-conductive layer may electrically isolate the transmission line from the ground line. The non-conductive layer may have a thickness in a range of approximately 3.5 micrometers to 7.5 micrometers.

[0006] The features and advantages of the embodiments of the present disclosure, as described above and in other aspects, will become more apparent from the following detailed description taken in conjunction with the drawings.

[0007] FIG. 1 is a drawing showing an electronic device according to various embodiments.

[0008] FIG. 2 is an exploded perspective view of an electronic device according to various embodiments.

[0009] FIG. 3A is a rear view of an exemplary electronic device with the rear plate of the electronic device removed, according to various embodiments.

[0010] FIG. 3b is a plan view of an exemplary flexible printed circuit board electrically connecting electronic components within an electronic device, according to various embodiments.

[0011] FIG. 4A is a cross-sectional view illustrating a portion of a flexible printed circuit board cut along line AA according to various embodiments.

[0012] FIG. 4b is a cross-sectional view showing the distance relationship between each layer in a flexible printed circuit board according to various embodiments.

[0013] FIGS. 5A and 5B are cross-sectional views showing the bonding surfaces of a non-conductive layer and a conductive layer in a flexible printed circuit board according to various embodiments.

[0014] FIG. 6 is a block diagram of an exemplary electronic device within a network environment according to various embodiments.

[0015] FIG. 1 is a diagram illustrating an electronic device according to various embodiments.

[0016] Referring to FIG. 1, an electronic device (100) according to one embodiment may include a housing (110) forming an exterior of the electronic device (100). For example, the housing (110) may include a first side (or front side) (100A), a second side (or back side) (100B), and a third side (or side surface) (100C) surrounding a space between the first side (100A) and the second side (100B). In one embodiment, the housing (110) may also refer to a structure (e.g., a frame structure (140) of FIG. 2) forming at least a portion of the first side (100A), the second side (100B), and / or the third side (100C).

[0017] An electronic device (100) according to one embodiment may include a substantially transparent front plate (102). In one embodiment, the front plate (102) may form at least a portion of the first surface (100A). In one embodiment, the front plate (102) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0018] An electronic device (100) according to one embodiment may include a substantially opaque back plate (111). In one embodiment, the back plate (111) may form at least a portion of the second surface (100B). In one embodiment, the back plate (111) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0019] An electronic device (100) according to one embodiment may include a side bezel structure (or side member) (118) (e.g., a side wall (141) of a frame structure (140) of FIG. 2). In one embodiment, the side bezel structure (118) may be combined with a front plate (102) and / or a rear plate (111) to form at least a portion of a third side (100C) of the electronic device (100). For example, the side bezel structure (118) may form the entire third side (100C) of the electronic device (100), or, for example, the side bezel structure (118) may form the third side (100C) of the electronic device (100) together with the front plate (102) and / or the rear plate (111).

[0020] Unlike the illustrated embodiment, when the third side (100C) of the electronic device (100) is partially formed by the front plate (102) and / or the rear plate (111), the front plate (102) and / or the rear plate (111) may include a region that extends seamlessly from its edge toward the rear plate (111) and / or the front plate (102). The extending region of the front plate (102) and / or the rear plate (111) may be located at both ends of a long edge of the electronic device (100), for example, but is not limited to the above-described example.

[0021] In one embodiment, the side bezel structure (118) may comprise a metal and / or a polymer. In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may comprise the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (111) and the side bezel structure (118) may be formed as separate components and / or may comprise different materials.

[0022] In one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (103, 104, 107), a sensor module (not shown), a camera module (105, 112, 113), a key input device (117), a light emitting element (not shown), and / or a connector hole. In one embodiment, the electronic device (100) may omit at least one of the above components (e.g., the key input device (117) or the light emitting element (not shown)) or may additionally include other components.

[0023] In one embodiment, the display (101) (e.g., the display module (660) of FIG. 6) may be visible through a substantial portion of the front plate (102). For example, at least a portion of the display (101) may be visible through the front plate (102) forming the first surface (100A). In one embodiment, the display (101) may be disposed on the back surface of the front plate (102).

[0024] In one embodiment, the outer shape of the display (101) may be formed to be substantially the same as the outer shape of the front plate (102) adjacent to the display (101). In one embodiment, in order to expand the area in which the display (101) is to be viewed, the gap between the outer shape of the display (101) and the outer shape of the front plate (102) may be formed to be substantially the same.

[0025] In one embodiment, the display (101) (or the first surface (100A) of the electronic device (100)) may include a screen display area (101A). In one embodiment, the display (101) may provide visual information to a user through the screen display area (101A). In the illustrated embodiment, when the first surface (100A) is viewed from the front, the screen display area (101A) is depicted as being positioned on the inside of the first surface (100A) and spaced apart from the outer edge of the first surface (100A), but is not limited thereto. In one embodiment, when the first surface (100A) is viewed from the front, at least a portion of an edge of the screen display area (101A) may substantially coincide with an edge of the first surface (100A) (or the front plate (102)).

[0026] In one embodiment, the screen display area (101A) may include a sensing area (101B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (101A) includes the sensing area (101B)" may be understood to mean that at least a portion of the sensing area (101B) may overlap the screen display area (101A). For example, the sensing area (101B) may be an area capable of displaying visual information by the display (101) like other areas of the screen display area (101A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (101B) may also be formed in the key input device (117).

[0027] In one embodiment, the display (101) may include an area where a first camera module (105) (e.g., camera module (680) of FIG. 6) is positioned. In one embodiment, an opening is formed in the area of ​​the display (101), and the first camera module (105) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (100A). In this case, the screen display area (101A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (105) (e.g., an under display camera (UDC)) may be positioned under the display (101) so as to overlap the area of ​​the display (101). In this case, the display (101) can provide visual information to the user through the above area, and additionally, the first camera module (105) can obtain an image corresponding to the direction toward the first surface (100A) through the above area of ​​the display (101).

[0028] In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0029] In one embodiment, the audio module (103, 104, 107) (e.g., audio module (670) of FIG. 6) may include a microphone hole (103, 104) and a speaker hole (107).

[0030] In one embodiment, the microphone holes (103, 104) may include a first microphone hole (103) formed in a portion of the third surface (100C) and a second microphone hole (104) formed in a portion of the second surface (100B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (103, 104). The microphone may include multiple microphones to detect the direction of the sound.

[0031] In one embodiment, a second microphone hole (104) formed in a portion of the second surface (100B) may be positioned adjacent to a camera module (105, 112, 113). For example, the second microphone hole (104) may acquire sound according to the operation of the camera module (105, 112, 113). However, the present invention is not limited thereto.

[0032] In one embodiment, the speaker hole (107) may include an external speaker hole (107) and a call receiver hole (not shown). The external speaker hole (107) may be formed on a part of the third surface (100C) of the electronic device (100). In one embodiment, the external speaker hole (107) may be implemented as a single hole with the microphone hole (103). Although not shown, the call receiver hole (not shown) may be formed on another part of the third surface (100C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (107) on the third surface (100C). For example, based on the city of FIG. 1, the external speaker hole (107) may be formed on the third surface (100C) corresponding to the lower portion of the electronic device (100), and the call receiver hole may be formed on the third surface (100C) corresponding to the upper portion of the electronic device (100). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the third surface (100C). For example, the call receiver hole may be formed by a spaced space between the front plate (102) (or, display (101)) and the side bezel structure (118).

[0033] In one embodiment, the electronic device (100) may include at least one speaker (not shown) configured to output sound to the outside of the housing (110) through an external speaker hole (107) and / or a call receiver hole (not shown).

[0034] In one embodiment, a sensor module (not shown) (e.g., sensor module (676) of FIG. 6) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] In one embodiment, a camera module (105, 112, 113) (e.g., camera module (680) of FIG. 6) may include a first camera module (105) positioned to face a first side (100A) of the electronic device (100), a second camera module (112) positioned to face a second side (100B), and a flash (113).

[0036] In one embodiment, the second camera module (112) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (112) is not necessarily limited to including multiple cameras and may include a single camera.

[0037] In one embodiment, the first camera module (105) and the second camera module (112) may include one or more lenses, image sensors, and / or image signal processors.

[0038] In one embodiment, the flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (100).

[0039] In one embodiment, a key input device (117) (e.g., input module (650) of FIG. 6) may be disposed on a third side (100C) of the electronic device (100). In one embodiment, the electronic device (100) may not include some or all of the key input devices (117), and the key input devices (117) that are not included may be implemented in another form, such as a soft key, on the display (101).

[0040] In one embodiment, a connector hole (108) may be formed on the third surface (100C) of the electronic device (100) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (678) of FIG. 6) electrically connected to the connector of the external device may be arranged within the connector hole (108). The electronic device (100) according to one embodiment may include an interface module (e.g., an interface (677) of FIG. 6) for processing electrical signals transmitted and received through the connection terminal.

[0041] In one embodiment, the electronic device (100) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (100A) of the housing (110). The light-emitting element (not shown) may provide status information of the electronic device (100) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (105). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0042] FIG. 2 is an exploded perspective view of an electronic device according to various embodiments.

[0043] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0044] Referring to FIG. 2, an electronic device (100) according to one embodiment may include a frame structure (140), a first printed circuit board (150), a second printed circuit board (152), a cover plate (160), and a battery (170).

[0045] In one embodiment, the frame structure (140) may include a side wall (141) forming an exterior of the electronic device (100) (e.g., the third side (100C) of FIG. 2) and a support portion (143) extending inwardly from the side wall (141). In one embodiment, the frame structure (140) may be disposed between the display (101) and the back plate (111). In one embodiment, the side wall (141) of the frame structure (140) may surround a space between the back plate (111) and the front plate (102) (and / or the display (101)), and the support portion (143) of the frame structure (140) may extend from the side wall (141) within the space. According to one embodiment, a side wall (141) forming a side surface of an electronic device (100) (e.g., side surface (100C) of FIG. 2) may include a speaker hole (107) connecting the inside and the outside of the electronic device (100). The speaker hole (107) may penetrate the side wall (141).

[0046] In one embodiment, the frame structure (140) may support or accommodate other components included in the electronic device (100). For example, a display (101) may be disposed on one side of the frame structure (140) facing one direction (e.g., +z direction), and the display (101) may be supported by a support portion (143) of the frame structure (140). For another example, a first printed circuit board (150), a second printed circuit board (152), a battery (170), and a second camera module (112) may be disposed on the other side of the frame structure (140) facing the opposite direction (e.g., -z direction). The first printed circuit board (150), the second printed circuit board (152), the battery (170), and the second camera module (112) can each be mounted in a recess defined by a side wall (141) and / or a support portion (143) of the frame structure (140).

[0047] In one embodiment, the first printed circuit board (150), the second printed circuit board (152), and the battery (170) may be respectively coupled to the frame structure (140). For example, the first printed circuit board (150) and the second printed circuit board (152) may be fixedly disposed to the frame structure (140) via a coupling member such as a screw. For example, the battery (170) may be fixedly disposed to the frame structure (140) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0048] In one embodiment, the cover plate (160) may be disposed between the first printed circuit board (150) and the back plate (111). In one embodiment, the cover plate (160) may be disposed on the first printed circuit board (150). For example, the cover plate (160) may be disposed on a surface of the first printed circuit board (150) facing the -z direction.

[0049] In one embodiment, the cover plate (160) may at least partially overlap the first printed circuit board (150) with respect to the z-axis. In one embodiment, the cover plate (160) may cover at least a portion of the first printed circuit board (150). In this way, the cover plate (160) may protect the first printed circuit board (150) from physical impact, or prevent or reduce detachment of a connector coupled to the first printed circuit board (150).

[0050] In one embodiment, the cover plate (160) may be fixedly positioned on the first printed circuit board (150) via a joining member (e.g., a screw), or may be joined to the frame structure (140) together with the first printed circuit board (150) via the joining member.

[0051] In one embodiment, the display (101) may be positioned between a frame structure (140) and a front plate (102). For example, the front plate (102) may be positioned on one side (e.g., in the +z direction) of the display (101), and the frame structure (140) may be positioned on the other side (e.g., in the -z direction).

[0052] In one embodiment, the front plate (102) may be coupled with the display (101). For example, the front plate (102) and the display (101) may be bonded to each other via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0053] In one embodiment, the front plate (102) may be coupled with a frame structure (140). For example, the front plate (102) may include an outer portion extending outside the display (101) when viewed in the z-axis direction, and may be adhered to the frame structure (140) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (102) and the frame structure (140) (e.g., side wall (141)). However, the present invention is not limited to the above-described example.

[0054] In one embodiment, the first printed circuit board (150) and / or the second printed circuit board (152) may be equipped with a processor (e.g., processor (620) of FIG. 6), memory (e.g., memory (630) of FIG. 6), and / or an interface (e.g., interface (677) of FIG. 6). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0055] In one embodiment, a battery (170) (e.g., battery (689) of FIG. 6 ) may power at least one component of the electronic device (100). For example, the battery (170) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (170) may be disposed substantially coplanar with the first printed circuit board (150) and / or the second printed circuit board (152).

[0056] An electronic device (100) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (697) of FIG. 6). In one embodiment, the antenna module may be disposed between the rear plate (111) and the battery (170). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0057] In one embodiment, the housing (110) of the electronic device (100) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (100). In this respect, at least a portion of the front plate (102), the frame structure (140), and / or the rear plate (111) that form the exterior of the electronic device (100) may be referred to as the housing (110) of the electronic device (100).

[0058] FIG. 3A is a rear view of an exemplary electronic device with the rear plate removed, according to various embodiments. FIG. 3B is a plan view of an exemplary flexible printed circuit board electrically connecting electronic components within an electronic device, according to various embodiments.

[0059] Referring to FIGS. 3A and 3B , the electronic device (100) may include a housing (110), a first printed circuit board (150), a second printed circuit board (152), and flexible printed circuit boards (310, 321, 322, 323). The electronic device (100) may at least partially reference the electronic device (100) of FIG. 1 and the electronic device (100) of FIG. 2 . Some of the flexible printed circuit boards (310, 321, 322, 323) may connect the first printed circuit board (150) and the second printed circuit board (152). The first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other through the flexible printed circuit boards (310, 321). The first printed circuit board (150) and the second printed circuit board (152) may at least partially reference the first printed circuit board (150) and the second printed circuit board (152) of FIG. 2.

[0060] The first printed circuit board (150) and the second printed circuit board (152) may be disposed spaced apart from each other. For example, the first printed circuit board (150) and the second printed circuit board (152) may each be disposed on opposite sides of the housing (110) of the electronic device (100). For example, the first printed circuit board (150) may be disposed on one side (e.g., the top) of the housing (110) of the electronic device (100). The second printed circuit board (152) may be disposed on the other side (e.g., the bottom) of the housing (110) of the electronic device (100).

[0061] Electronic components (e.g., a camera, an optical sensor, a processor, or a memory) disposed on the top of the electronic device (100) may be disposed on or connected to the first printed circuit board (150). For example, at least one processor that controls electronic components within the electronic device (100) may be disposed on the first printed circuit board (150).

[0062] Electronic components disposed at the bottom of the electronic device (100) may be disposed or connected to a second printed circuit board (152). The second printed circuit board (152) may assist the electronic components disposed on the first printed circuit board (150). An interface (331) may be disposed or connected to the second printed circuit board (152). The interface (331) may electrically or physically connect the electronic device (100) to an external electronic device. The interface (331) may include a USB connector (330). The USB connector (330) may be connected to the interface (331) and the flexible printed circuit board (310). A signal transmitted to the interface (331) through the USB connector (330) may be transmitted to at least one processor or electronic component within the first printed circuit board (150). The USB connector (330) may transmit power transmitted to the interface (331) to a battery (170).

[0063] The flexible printed circuit board (310) can be connected to a first printed circuit board (150) through a first connector (311) and to a second printed circuit board (152) through a second connector (312). The flexible printed circuit board (310) can transmit a signal or data transmitted to the second printed circuit board (152) by the first printed circuit board (150). For example, the flexible printed circuit board (310) can be connected to a USB connector (130) disposed on the second printed circuit board (152) through the second printed circuit board (152), and can transmit a signal or data transmitted through the USB connector (130) to the first printed circuit board (150) or at least one processor.

[0064] A flexible printed circuit board (310) may be disposed between a first printed circuit board (150) and a second printed circuit board (152). The flexible printed circuit board (310) may extend from the first printed circuit board (150) to the second printed circuit board (152). The flexible printed circuit board (310) may extend along a back plate (e.g., the back plate (111) of FIG. 2) and a battery (170). For example, the flexible printed circuit board (310) may extend from a first connector (311) connected to the first printed circuit board (150), across the battery (170), and to a second connector (312) connected to the second printed circuit board (152). If the thickness of the flexible printed circuit board (310) extending along one side of the battery (170) is reduced, the capacity of the battery (170) placed under the flexible printed circuit board (310) can increase. Even if the flexible printed circuit board (310) extends along a part of one side of the battery (170), it is difficult to form a step on the surface of the battery (170), so the capacity of the battery (170) can be determined based on the thickness of the flexible printed circuit board (310) rather than the width of the flexible printed circuit board (310).

[0065] A flexible printed circuit board (310) can transmit signals, data, or power between a first printed circuit board (150) and a second printed circuit board (152). The flexible printed circuit board (310) can include a non-conductive layer (310a) and wires (310b). The flexible printed circuit board (310) can include wires (310b) composed of a plurality of signal or data lines and power lines. Some of the signal lines or data lines (340) can be lines that transmit data from the second printed circuit board (152) to the first printed circuit board. For example, some of the signal lines or data lines can be lines that transmit data obtained from a USB connected to the interface (331). The lines that transmit the data can be high-speed data lines. A data signal obtained from the USB transmitted through the high-speed data lines can be a high-frequency signal. Some of the other signal lines or data lines may be lines through which control signals of electronic components arranged on the second printed circuit board (152) are transmitted.

[0066] A flexible printed circuit board (321) can connect a first printed circuit board (150) and a second printed circuit board (152) to transmit signals for a display panel. Lines included in the flexible printed circuit board (321) can include MIPI (mobile industry processor interface) lines.

[0067] One of the flexible printed circuit boards (310) and the flexible printed circuit board (321) may include a signal line for transmitting a wireless communication signal (or a radio frequency (RF) signal) from at least one processor (e.g., processor (620) of FIG. 6) including a processing circuit disposed on the first printed circuit board (150) to an electrically connected antenna connected to the second printed circuit board (152).

[0068] FIG. 4A is a cross-sectional view illustrating a portion of a flexible printed circuit board according to various embodiments, taken along line AA of FIG. 3B. FIG. 4B is a cross-sectional view illustrating the distance relationship between each layer within a flexible printed circuit board according to various embodiments.

[0069] Referring to FIGS. 4A and 4B, a flexible printed circuit board (310) within an electronic device (100) (e.g., the electronic device (100) of FIG. 1) may include a non-conductive layer (401), a first conductive layer (410), a second conductive layer (420), a first shielding layer (431), a second shielding layer (432), a first cover layer (440), and a second cover layer (450).

[0070] For example, the non-conductive layer (401) can electrically isolate the first conductive layer (410) and the second conductive layer (420). The non-conductive layer (401) can be referred to as an insulating layer or a dielectric layer in terms of electrically isolating the first conductive layer (410) and the second conductive layer (420). The non-conductive layer (401) can be flexible as a substrate of the flexible printed circuit board (310). For example, the non-conductive layer (401) can be formed of a thin polymer material. For example, the non-conductive layer (401) formed of polyimide (PI) can be flexible. The non-conductive layer (401) can have a thickness that can maintain insulation between the first conductive layer (410) and the second conductive layer (420). For example, the thickness of the non-conductive layer (401) may be approximately 3.5 micrometers to 7.5 micrometers. By reducing the thickness of the non-conductive layer (401), the capacity of the battery disposed under the flexible printed circuit board (310) can be increased. By reducing the thickness of the non-conductive layer (401), the ductility of the flexible printed circuit board (310) can be increased. With the increased ductility, the flexible printed circuit board (310) can be disposed inside a complex electronic device. For example, the flexible printed circuit board (310) can be disposed to avoid interference with electronic components. To reduce the thickness of the flexible printed circuit board (310), the thickness of the non-conductive layer (401) can be reduced. For example, the non-conductive layer (401) can be the thinnest among the layers forming the FPCB. For example, the non-conductive layer (401) can electrically isolate between the first conductive layer (410) including transmission lines (410-1, 410-2) and the second conductive layer (420). The thickness of the non-conductive layer (401) can be approximately 3.5 micrometers to 7.5 micrometers.The factors determining the thickness of the non-conductive layer (401) are described in detail later in FIGS. 5a and 5b.

[0071] The first conductive layer (410) may be arranged on one surface of the non-conductive layer (401). The first conductive layer (410) may include transmission lines (410-1, 410-2) for transmitting a signal transmitted through a USB connector (e.g., the USB connector (330) of FIG. 3A). The transmission lines (410-1, 410-2) may be arranged close to each other to operate as strip lines. The transmission lines (410-1, 410-2) may be arranged parallel to each other. However, the present invention is not limited thereto. The transmission lines (410-1, 410-2) may be arranged at a distance from each other by a predetermined distance or more. Each of the transmission lines (410-1, 410-2) may operate as a line for transmitting a different signal.

[0072] The second conductive layer (420) may be disposed on the other side opposite to the one side of the non-conductive layer (401). For example, the non-conductive layer (401) may be disposed between the first conductive layer (410) and the second conductive layer (420). The second conductive layer (420) may be electrically connected to a conductive portion that acts as a ground within the electronic device (100). For example, the conductive flat plate of the second conductive layer (420) may be connected to a conductive portion of a housing (e.g., the housing (110) of FIG. 1). However, the present invention is not limited thereto, and the second conductive layer (420) may also include a signal transmission line. For example, a first conductive layer (410) including a plurality of first transmission lines (410-1, 410-2) and a second conductive layer (420) including a plurality of second transmission lines (420-1, 420-2) can form a line for transmitting a high-speed signal or a high-frequency signal.

[0073] The first shielding layer (431) of the flexible printed circuit board (310) may be disposed on a surface of the first conductive layer (410) that is opposite to a surface of the first conductive layer (410) that is in contact with the non-conductive layer (401). The second shielding layer (432) of the flexible printed circuit board (310) may be disposed on a surface of the second conductive layer (420) that is opposite to a surface of the second conductive layer (420) that is in contact with the non-conductive layer (401). The first shielding layer (431) and the second shielding layer (432) may reduce electromagnetic interaction between signals transmitted through lines disposed in the first conductive layer (410) and the second conductive layer (420) and transmitted from the outside of the flexible printed circuit board (310). For example, the first shielding layer (431) and the second shielding layer (432) can prevent or reduce interference between electromagnetic waves transmitted from electronic components inside the electronic device (100) and signals transmitted through lines (e.g., transmission lines (410-1, 410-2)) of the flexible printed circuit board (310). The first shielding layer (431) and the second shielding layer (432) can be referred to as EMI (electro magnetic interference) shield layers in terms of preventing or reducing interference with electromagnetic waves. The first shielding layer (431) and the second shielding layer (432) can be formed of a conductive material to prevent or reduce interference between external electromagnetic waves and signals transmitted through the first transmission lines (410-1, 410-2) or the second transmission lines (420-1, 420-2). The first shielding layer (431) and the second shielding layer (432) may be a conductive thin film or a film including a shielding material (e.g., metallic magnet powder).

[0074] The first cover layer (440) of the flexible printed circuit board (310) may be disposed between the first conductive layer (410) and the first shielding layer (431). The second cover layer (450) of the flexible printed circuit board (310) may be disposed between the second conductive layer (450) and the second shielding layer (432). The first cover layer (440) and the second cover layer (450) may be formed of a non-conductive material. The first cover layer (440) and the second cover layer (450) may be formed of PI, such as the non-conductive layer (401), so as to have flexibility. The first cover layer (440) may surround the first transmission lines (410-1, 410-2). The first cover layer (440) can fill the fill-cut area created in the process of forming the first transmission lines (410-1, 410-2). The first cover layer (440) can prevent or reduce electrical connection between the first transmission lines (410-1, 410-2) and the first shielding layer (431). The second cover layer (450) can wrap the second conductive layer (420) or the second transmission lines (420-1, 420-2) included in the second conductive layer (420). The second cover layer (440) can fill the fill-cut area created in the process of forming the second transmission lines (420-1, 420-2). The second cover layer (450) can prevent or reduce electrical connection between the second conductive layer (420) and the second shielding layer (432). Each of the first cover layer (440) and the second cover layer (450) may be referred to as a protective layer in that it surrounds the first conductive layer (410) and the second conductive layer (420) and prevents or reduces the exposure of the first conductive layer (410) and the second conductive layer (420) to the outside of the flexible printed circuit board (310).

[0075] The impedance of the first transmission lines (410-1, 410-2) may vary depending on the distance (d1) between the first shielding layer (431) and the first conductive layer (410) and the distance (d3) between the second shielding layer (432) and the first conductive layer (410). The first transmission lines (410-1, 410-2) that transmit high-frequency signals or high-speed signals may be impedance matched to a specified impedance value (e.g., approximately 90 ohms (Ω) for a USB data line, approximately 50 ohms for an RF signal line, and 100 ohms for a MIPI line). When the distance (d1) between the first shielding layer (431) and the first conductive layer (410) decreases, the impedance value may decrease. In order to reduce the thickness of the flexible printed circuit board (310) while maintaining an impedance-matched impedance value, the flexible printed circuit board (310) may include a non-conductive layer (401) with a reduced thickness (dp). The non-conductive layer (401) may have the thinnest thickness among the non-conductive layer (401), the first conductive layer (410), the second conductive layer (420), the first shielding layer (431), the second shielding layer (432), the first cover layer (440), and the second cover layer (450) constituting the flexible printed circuit board (310). The thickness of the non-conductive layer (401) may be approximately 3.5 micrometers to 7.5 micrometers. The distance (d2) between the second shielding layer (432) and the second conductive layer (420) may be substantially the same as the distance (d1) between the first shielding layer (431) and the first conductive layer (410). The above description has been described based on the first signal lines (410-1, 410-2) of the first conductive layer (410), but is not limited thereto. The above description may also be applied to the second signal lines (420-1, 420-2).

[0076] The flexible printed circuit board (310) may include fill-cut areas (c1, c2). Some of the layers of the flexible printed circuit board (310) disposed next to the first transmission line (410-1, 410-2) of the first conductive layer (410) may be removed. The flexible printed circuit board (310) may fill the fill-cut areas (c1, c2) where a portion of the first conductive layer (410) or the second conductive layer (420) is removed with another material. The other material may be a non-conductive material. For example, the non-conductive material may be a portion of the first cover layer (440) and the second cover layer (450).

[0077] The flexible printed circuit board (310) may further include second transmission lines (420-1, 420-2). Some of the layers of the flexible printed circuit board (310) disposed next to the second transmission lines (420-1, 420-2) of the first conductive layer (410) may be removed. The flexible printed circuit board (310) may be formed by filling another material into the fill-cut area (c1, c2) from which a portion of the first conductive layer (410) or the second conductive layer (420) is removed. The other material may be a non-conductive material. The flexible printed circuit board (310) may be formed by filling another material into the fill-cut area (c1, c2) from which a portion of the first conductive layer (410), the second conductive layer (420), and / or the second cover layer (450) (or the first cover layer (440)) is removed. The above other material may be a non-conductive material. In the fill-cut region (c1, c2), the second conductive layer (420), which is at least a portion of the ground line of the first transmission lines (410-1, 410-2), may be removed.

[0078] The other material filled in the fill-cut areas (c1, c2) may be the same material as the non-conductive layer (401), the first cover layer (440), and the second cover layer (450). For example, the fill-cut areas (c1, c2) may be filled with the cover layers (440, 450). The cover layers (440, 450) filled in the fill-cut areas (c1, c2) may be connected to the non-conductive layer (401).

[0079] The first fill-cut region (c1) may be a region in which a portion of the first conductive layer (410) or the second conductive layer (420) applied on the non-conductive layer (401) is removed to form transmission lines (410-1, 410-2, 420-1, 420-2). For example, the first conductive layer (410) may be etched, leaving the first transmission lines (410-1, 410-2) of the first conductive layer (410). The second conductive layer (420) may be etched, leaving the second transmission lines (420-1, 420-2) of the second conductive layer (420). After a mask corresponding to the shape of the first transmission lines (410-1, 410-2) is placed on the first conductive layer (410), the first conductive layer (410) can be etched. A first adhesive member (441) of a first cover layer (440) laminated on the etched first conductive layer (420) can be filled. After a mask corresponding to the shape of the second transmission lines (420-1, 420-2) is placed on the second conductive layer (420), the second conductive layer (420) can be etched. A second adhesive member (451) of a second cover layer (450) laminated on the etched second conductive layer (420) can be filled.

[0080] The second fill cut area (c2) may remove a portion of the conductive layer disposed on a surface opposite to the surface on which the transmission lines (410-1, 410-2, 420-1, 420-2) are disposed. For example, the second fill cut area (c2) may remove a portion that acts as a ground. The second fill cut area (c2) may be an area where a portion of the second conductive layer (420) facing the first transmission lines (410-1, 410-2) is removed. The area of ​​the removed second conductive layer (420) may be an area corresponding to the first transmission lines (410-1, 410-2). The second adhesive member (451) of the second cover layer (450) laminated on the removed second conductive layer (420) may be filled. The second fill-cut area (c2) may be an area where a portion of the first conductive layer (410) facing the second transmission lines (420-1, 420-2) is removed. The area of ​​the removed first conductive layer (410) may correspond to the second transmission lines (420-1, 420-2). The first adhesive member (441) of the first cover layer (440) laminated on the removed first conductive layer (410) may be filled.

[0081] The first conductive layer (410) may include a first metal layer (411) and a first plating layer (412). The first metal layer (411) may be formed of a highly conductive metal (e.g., gold, silver, or copper) for transmitting a signal or acting as a ground, and the first plating layer (412) may be formed on one surface of the first metal layer (411). The surface of the first conductive layer (410) on which the first plating layer (412) is formed may have a lower roughness than the surface on which the plating layer is not formed and on which the first metal layer (411) is exposed. The second metal layer (421) may be formed of a highly conductive metal (e.g., gold, silver, or copper) for transmitting a signal or for electrically connecting to a conductive portion of the housing (110) that acts as a ground, and the fourth plating layer (422) may be formed on one surface of the second metal layer (421). The surface of the second conductive layer (420) on which the second plating layer (422) is formed may have a lower roughness than the surface on which the second metal layer (421) is exposed without the plating layer being formed.

[0082] The first cover layer (440) and the second cover layer (450) may be attached to the first conductive layer (410) and the second conductive layer (420) via adhesive members (441, 451). For example, the first cover layer (440) may include a non-conductive layer (442) and an adhesive member (441). The adhesive member (441) may include an adhesive, a pressure-sensitive adhesive, an adhesive film, or a double-sided tape. The non-conductive layer (442) may include PI for insulation. For example, the second cover layer (450) may include a non-conductive layer (452) and an adhesive member (451). The adhesive member (451) may include an adhesive, an adhesive film, or a double-sided tape. The non-conductive layer (452) may include PI for insulation. The adhesive member (441, 451) can fill the fill cut area (c1, c2).

[0083] According to the above-described embodiment, the flexible printed circuit board (310) can reduce the thickness of the flexible printed circuit board (310) while maintaining impedance matching. The electronic device (100) can secure a mounting space for internal components of the electronic device (100) through the flexible printed circuit board (310) with a reduced thickness. Based on the reduced thickness of the flexible printed circuit board (310), the capacity of the battery (170) placed inside the electronic device (100) can be increased.

[0084] FIGS. 5A and 5B are cross-sectional views showing the bonding surfaces of a non-conductive layer and a conductive layer in a flexible printed circuit board according to various embodiments.

[0085] Referring to FIGS. 5A and 5B, the surface of the non-conductive layer (401) in contact with each of the conductive layers (410, 420) may be rough. For example, the surface of the conductive layers (410, 420) in contact with the non-conductive layer (401) may be rough. For example, the surface of the plating layers (412, 422) among the conductive layers (410, 420) may be smooth, but the surface of the portion of the conductive layers (410, 420) on which the plating layers (412, 422) are not applied (e.g., the portion where the metal layers (411, 421) are exposed) may be rough. For example, the roughness of one side (e.g., a side formed of a metal layer (411)) of the transmission lines (e.g., transmission lines (410-1, 410-2) of FIG. 4B) of the first conductive layer (410) facing the non-conductive layer (401) may be greater than the roughness of the other side (e.g., a side formed of a plating layer (412)) of the transmission lines (410-1, 410-2) of the first conductive layer (410). The roughness of one side (e.g., a side formed of a metal layer (421)) of the ground line of the second conductive layer (420) facing the non-conductive layer (401) may be greater than the roughness of the other side (e.g., a side formed of a plating layer (422)) of the ground line of the second conductive layer (420).

[0086] Some areas of the flexible printed circuit board (310) may include signal lines in the second conductive layer (420) and ground lines or ground in the first conductive layer (410). For example, the roughness of one side (e.g., a side formed of a metal layer (421)) of the transmission lines (e.g., the second transmission lines (420-1, 420-2) of FIG. 4B) of the second conductive layer (420) facing the non-conductive layer (401) may be greater than the roughness of the other side (e.g., a side formed of a plating layer (422)) of the second transmission lines (420-1, 420-2) of the second conductive layer (420). The roughness of one side of the ground line of the first conductive layer (410) facing the non-conductive layer (401) (e.g., the side formed of the metal layer (411)) may be greater than the roughness of the other side of the ground line of the first conductive layer (410) (e.g., the side formed of the plating layer (412)).

[0087] One side of the first conductive layer (410) facing the non-conductive layer (401) and one side of the second conductive layer (420) facing the non-conductive layer (401) may include a peak (P) protruding from the surface. The protruding peak may be formed on a rough surface that is formed during the manufacturing of the metal. For example, the first conductive layer (410) and the second conductive layer (420) may be copper foil layers. The first conductive layer (410) and the second conductive layer (420), which are copper foil layers, may be precipitated from an electrolyte. For example, the electrolyte may be a sulfuric acid-copper sulfate aqueous solution. The positive electrode plate and the negative electrode drum may be at least partially immersed in the electrolyte. The positive electrode plate may be formed of a titanium (Ti) plate coated (or covered) with platinum, and the negative electrode drum may be formed of titanium. By flowing current between the anode and cathode, copper can be deposited from the electrolyte onto the surface of the cathode drum. The deposited copper can be formed into a copper foil through rotation of the drum. The formed copper foil can be used as a first conductive layer (410) and a second conductive layer (420). The roughness of the surfaces of the first conductive layer (410) and the second conductive layer (420) can be adjusted by adding an additive to the electrolyte to adjust the roughness and the density between peaks. The additive can include at least one of a surfactant (e.g., polyoxyethylene), an active organic compound such as sulfonate, and a chlorine ion.

[0088] The first conductive layer (410) and the second conductive layer (420) may include first peaks (501) and second peaks (502) protruding into the non-conductive layer (401). For example, the first conductive layer (410) may include a plurality of first peaks (501) protruding from the transmission line (e.g., transmission lines (410-1, 410-2) of FIG. 4B) into the non-conductive layer (401). The second conductive layer (420) may include a plurality of second peaks (502) protruding into the non-conductive layer (401). The peaks (501, 502) may be formed on the surface during the production process of the first non-conductive layer (410) and the second conductive layer (420).

[0089] The non-conductive layer (401) may be spaced apart to insulate the first conductive layer (410) and the second conductive layer (420). The non-conductive layer (401) may have a thickness (dp) to secure an insulating distance.

[0090] The distance (d2) between one first peak (501-1) among the plurality of first peaks (501) and one second peak (502-1) among the plurality of second peaks (502) corresponding to the first peak (501-1) may be approximately 1.0 micrometer to 5.5 micrometers. For insulation between the one first peak (501-1) and the one second peak (502-1), the minimum distance for insulation may be approximately 1.0 micrometer or more.

[0091] If the height of the peaks is long, the insulation distance between the peaks formed in the first conductive layer (410) and the peaks formed in the second conductive layer (420) may be reduced. In order to maintain insulation between the first conductive layer (410) and the second conductive layer (420), the heights of the peaks protruding from the first conductive layer (410) and the second conductive layer (420) may be limited. For example, the height (d1) of the plurality of first peaks (501) protruding from the surface of the transmission lines (410-1, 410-2) of the first conductive layer (410) and the height (d1) of the plurality of second peaks (502) protruding from the surface of the second conductive layer (420) may be approximately 1.0 micrometer to 2.5 micrometers.

[0092] Each of the first conductive layer (410) and the second conductive layer (420) may be bonded to the non-conductive layer (401). For example, the first conductive layer (410) may be pressed, thermally pressed, or thermally bonded to one surface of the non-conductive layer (401). The second conductive layer (420) may be pressed, thermally pressed, or thermally bonded to the other surface of the non-conductive layer (401). The bonding force between the first conductive layer (410) and the non-conductive layer (401) may be proportional to the surface area of ​​the surface on which the first peaks (501) are formed. The bonding force between the second conductive layer (420) and the non-conductive layer (401) may be proportional to the surface area of ​​the surface on which the second peaks (502) are formed. If the height of the peaks (501, 502) decreases, the bonding force between the non-conductive layer (401) and the first conductive layer (410) and the second conductive layer (420) may be weak. The number of peaks (501, 502) may be increased to increase the reduced surface area due to the decreased height of the peaks (501, 502). For example, by increasing the density of the peaks (501, 502), the bonding force between the first conductive layer (410) and the non-conductive layer (401) may be increased, and the bonding force between the second conductive layer (410) and the non-conductive layer (401) may be increased. For example, the distance between one of the first peaks (501) and a peak located next to the one peak and the distance between one of the second peaks (502) and another peak of the second peaks located next to the one of the second peaks may be approximately 0.2 micrometers to 0.6 micrometers.

[0093] For example, high peaks (591, 592) may have a high surface area of ​​one peak, which may increase the bonding strength. However, as the height of the peak increases, the insulating distance may decrease. For example, the distance (d2') between high peaks (591, 592) may be the difference between the sum of the thickness (dp) of the non-conductive layer (401) and the height (d1') of the peaks (591, 592). To reduce the thickness (dp) of the non-conductive layer (401), the height of the peaks (501-1) may be reduced. To compensate for the weakened bonding strength due to the reduced peaks (501, 502), the spacing between the peaks (501, 502) may be reduced. The densely arranged peaks (501, 502) can improve the bonding strength between the first conductive layer (410) and the non-conductive layer (401) and the bonding strength between the second conductive layer (420) and the non-conductive layer (401). The thickness (dp) of the non-conductive layer (401) can be approximately 3.5 micrometers to 7.5 micrometers. The thickness of the non-conductive layer can be determined according to the distance between a peak (501-1) arranged in the first conductive layer (410) and another peak (501-2) arranged in the second conductive layer (420) corresponding to the peak. For example, when the height (d1) of the peak (501-1) disposed on the first conductive layer (410) and the peak (501-2) disposed on the second conductive layer (420) is 1 micrometer, the thickness (dp) of the non-conductive layer (401) may be approximately 3 micrometers or more in consideration of the insulating distance of 1 micrometer. When the height (d1) of the peak (501-1) disposed on the first conductive layer (410) and the peak (501-2) disposed on the second conductive layer (420) is 2.5 micrometers, the thickness (dp) of the non-conductive layer (401) may be approximately 6 micrometers or more in consideration of the insulating distance of 1 micrometer.

[0094] According to one embodiment, a flexible printed circuit board including a layer having a roughness and an electronic device including the same can reduce the thickness of the flexible printed circuit board. The flexible printed circuit board including a layer having a roughness and an electronic device including the same can reduce the thickness of the flexible printed circuit board while maintaining bonding strength between layers forming the flexible printed circuit board. The flexible printed circuit board including a layer having a roughness and an electronic device including the same can provide a mounting space for electronic components within the electronic device by including a thinned flexible printed circuit board. The flexible printed circuit board including a layer having a roughness and an electronic device including the same can increase the capacity of a battery disposed under the flexible printed circuit board, thereby increasing the usage time of the electronic device.

[0095] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary knowledge in the technical field to which this document pertains.

[0096] According to one embodiment, an electronic device (e.g., the electronic device (100) of FIG. 3A) may include a housing (e.g., the housing (110) of FIG. 3A). The electronic device may further include an FPCB (e.g., the FPCB (310) of FIG. 3A). The FPCB may connect electronic components disposed within the housing for transmitting signals. The FPCB may include a non-conductive layer (e.g., the non-conductive layer (401) of FIG. 4A). The FPCB may further include a first conductive layer (e.g., the first conductive layer (410) of FIG. 4A). The first conductive layer (410) may include a transmission line configured to transmit the signal disposed on one surface of the non-conductive layer. The FPCB (310) may further include a second conductive layer (e.g., the second conductive layer (420) of FIG. 4A). The second conductive layer may be disposed on the other side opposite to one side of the non-conductive layer. The thickness of the non-conductive layer may be in the range of approximately 3.5 micrometers to 7.5 micrometers to electrically isolate or isolate between the transmission line and the second conductive layer.

[0097] According to the above-described embodiment, the electronic device can secure mounting space within the electronic device by including a thin flexible printed circuit board. The size or capacity of the battery placed under the flexible printed circuit board can be determined by the thickness of the flexible printed circuit board. The electronic device can increase the usage time of the electronic device by increasing the capacity of the battery placed under the flexible printed circuit board.

[0098] According to one embodiment, the first conductive layer may include a plurality of first peaks (e.g., first peaks (501) of FIG. 5B) protruding from the transmission line into the non-conductive layer.

[0099] In one embodiment, the second conductive layer may include a plurality of second peaks (e.g., second peaks (502) of FIG. 5B) protruding into the non-conductive layer.

[0100] In one embodiment, the first conductive layer and the second conductive layer may include a rough surface including peaks. The first conductive layer may be coupled to the non-conductive layer through the rough surface including the peaks, and the second conductive layer may be coupled to the non-conductive layer through the rough surface including the peaks.

[0101] According to one embodiment, the distance between one first peak of the plurality of first peaks and one second peak of the plurality of second peaks corresponding to the first peak (e.g., d1 in FIG. 5b)) may be 1.0 micrometer to 1.5 micrometers.

[0102] A flexible printed circuit board of an electronic device may be configured to maintain an insulating distance by spacing apart a distance between a first peak and a first peak corresponding to the first peak. The first conductive layer and the second conductive layer, where the insulating distance is maintained, are not electrically connected and can be operated.

[0103] According to one embodiment, the height of the plurality of first peaks protruding from the surface of the transmission line (e.g., height (d1) in FIG. 5b) and the height of the plurality of second peaks protruding from the surface of the second conductive layer (e.g., height (d1) in FIG. 5b) may be 1 micrometer to 2.5 micrometers.

[0104] According to the above-described embodiment, the electronic device can be configured such that the heights of the plurality of peaks are formed within a specified range, thereby securing an insulating distance while maintaining a bonding force between the first conductive layer and the non-conductive layer and a bonding force between the second conductive layer and the non-conductive layer.

[0105] In one embodiment, the distance between one of the first peaks and a peak located next to the one peak and the distance between one of the second peaks and another of the second peaks located next to the one of the second peaks may be 0.2 micrometers to 0.6 micrometers.

[0106] According to the above-described embodiment, the electronic device can increase the density of peaks (or the density of surface roughness) by narrowing the gaps between a plurality of peaks arranged in a single layer. As the density of peaks increases, the surface area of ​​the side facing the non-conductive layer can be increased. Based on the increased surface area, the bonding strength between the first conductive layer and the non-conductive layer and the bonding strength between the second conductive layer and the non-conductive layer can be improved, despite the height of the peaks being reduced.

[0107] In one embodiment, the second conductive layer may be electrically connected to a conductive portion that acts as a ground within the electronic device.

[0108] According to the above-described embodiment, a flexible printed circuit board is configured to transmit a high-speed signal, and the lines arranged on the first conductive layer can be formed as strip lines. The second conductive layer can function as a ground line arranged below the strip lines.

[0109] According to one embodiment, the FPCB may further include a first shielding layer (e.g., shielding layer (440) of FIG. 4A). The first shielding layer may be disposed on a surface of the first conductive layer opposite to a surface of the first conductive layer that contacts the non-conductive layer.

[0110] In one embodiment, the FPCB may further include a second shielding layer (e.g., the second shielding layer (432) of FIG. 4A). The second shielding layer may be disposed on a surface of the second conductive layer opposite to a surface of the second conductive layer that contacts the non-conductive layer.

[0111] According to the above-described embodiment, the first shielding layer and the second shielding layer can prevent interference of signals caused by electromagnetic waves due to external signals. The distance between the first shielding layer and the first conductive layer can affect the impedance value.

[0112] According to one embodiment, the FPCB may further include a first cover layer (e.g., the first cover layer (440) of FIG. 4A). The first cover layer may be disposed between the first conductive layer and the first shielding layer.

[0113] According to one embodiment, the FPCB may further include a second cover layer (e.g., the second cover layer (450) of FIG. 4A). The second cover layer may be disposed between the second conductive layer and the second shielding layer.

[0114] In one embodiment, the first cover layer and the second cover layer may be attached to the first conductive layer and the second conductive layer via an adhesive member including an adhesive. In one embodiment, the first cover layer may wrap the transmission line.

[0115] According to one embodiment, the FPCB includes a first cover layer and a second cover layer including an insulating material, thereby maintaining electrical isolation between the first shielding layer and the first conductive layer and electrical isolation between the second shielding layer and the second conductive layer.

[0116] According to one embodiment, the electronic device may further include a first PCB (e.g., the first printed circuit board (150) of FIG. 2). The first PCB may be disposed on an upper portion of the electronic device.

[0117] According to one embodiment, the electronic device may further include a second PCB (e.g., the second printed circuit board (152) of FIG. 2). The second PCB may be disposed at a bottom of the electronic device.

[0118] According to one embodiment, the FPCB can be connected to the first PCB and the second PCB.

[0119] According to the above-described embodiment, the FPCB can connect a first PCB and a second PCB that are spaced apart from each other within an electronic device.

[0120] According to one embodiment, the electronic device may include an interface (e.g., interface (331) of FIG. 3A). The interface may be connected to the second PCB (152) and may be connected to an external electronic device. The signal may include a high-frequency signal and may pass between the interface and the first PCB.

[0121] In one embodiment, the roughness of one side of the transmission line of the first conductive layer facing the non-conductive layer may be greater than the roughness of the other side of the transmission line of the first conductive layer.

[0122] According to one embodiment, one side of the first conductive layer can be bonded to the non-conductive layer without an adhesive member based on the roughness of one side of the first conductive layer being greater than the roughness of the other side.

[0123] In one embodiment, the non-conductive layer may be the thinnest among the layers forming the FPCB.

[0124] According to one embodiment, the non-conductive layer can secure an insulating distance by having low heights of peaks formed on the rough surface of the first conductive layer and peaks formed on the rough surface of the second conductive layer, despite its thin thickness.

[0125] According to one embodiment, some of the layers of the FPCB disposed next to the transmission line of the first conductive layer may be empty.

[0126] According to one embodiment, the non-conductive layer (401) comprising PI (polyimide) may have flexibility.

[0127] According to one embodiment, a flexible printed circuit board can provide various shapes that can be arranged to avoid electronic components by including PI having flexible properties. Based on the flexibility of the flexible printed circuit board, the degree of freedom in arrangement of electronic components can be improved.

[0128] According to one embodiment, the FPCB may include connectors. The connector of the FPCB may be connected to an end of the transmission line.

[0129] The flexible printed circuit board according to the above-described embodiment can provide data signals and / or power signals through transmission lines by being connected to printed circuit boards through connectors.

[0130] According to one embodiment, a flexible printed circuit board (e.g., a flexible printed circuit board (310) of FIG. 3A) may include a non-conductive layer (401). The flexible printed circuit board may connect electronic components disposed within the housing for transmitting signals. The flexible printed circuit board may include a non-conductive layer (e.g., a non-conductive layer (401) of FIG. 4A). The flexible printed circuit board may further include a first conductive layer (e.g., a first conductive layer (410) of FIG. 4A). The first conductive layer may include a transmission line (410-1; 410-2) configured to transmit the signal and disposed on one surface of the non-conductive layer. The flexible printed circuit board may further include a second conductive layer (e.g., a second conductive layer (420) of FIG. 4A). The second conductive layer may be disposed on a surface opposite to one surface of the non-conductive layer. The thickness of the non-conductive layer may be 3.5 micrometers to 7.5 micrometers to electrically isolate the transmission line from the second conductive layer.

[0131] According to the above-described embodiment, when a thin flexible printed circuit board is placed within an electronic device, the mounting space within the electronic device can be increased. The size or capacity of a battery placed beneath the flexible printed circuit board can be determined by the thickness of the flexible printed circuit board. An electronic device in which a thin flexible printed circuit board is placed can increase the capacity of the battery placed beneath the flexible printed circuit board, thereby increasing the operating time of the electronic device.

[0132] According to one embodiment, the first conductive layer may include a plurality of first peaks (e.g., first peaks (501) of FIG. 5B) protruding from the transmission line into the non-conductive layer.

[0133] In one embodiment, the second conductive layer may include a plurality of second peaks (e.g., second peaks (502) of FIG. 5B) protruding into the non-conductive layer.

[0134] In one embodiment, the first conductive layer and the second conductive layer may include a rough surface including peaks. The first conductive layer may be coupled to the non-conductive layer through the rough surface including the peaks, and the second conductive layer may be coupled to the non-conductive layer through the rough surface including the peaks.

[0135] According to one embodiment, the distance between one first peak of the plurality of first peaks and one second peak of the plurality of second peaks corresponding to the first peak (e.g., d1 in FIG. 5b)) may be 1.0 micrometer to 1.5 micrometers.

[0136] According to the above-described embodiment, the flexible printed circuit board of the electronic device can maintain an insulating distance by separating a distance between a first peak and a first peak corresponding to the first peak. The first conductive layer and the second conductive layer, for which the insulating distance is maintained, are not electrically connected and can be operated.

[0137] According to one embodiment, the height of the plurality of first peaks protruding from the surface of the transmission line (e.g., height (d1) in FIG. 5b) and the height of the plurality of second peaks protruding from the surface of the second conductive layer (e.g., height (d1) in FIG. 5b) may be 1 micrometer to 2.5 micrometers.

[0138] According to the above-described embodiment, the electronic device can secure an insulating distance while maintaining the bonding force between the first conductive layer and the non-conductive layer and the bonding force between the second conductive layer and the non-conductive layer by forming the heights of the plurality of peaks within a specified range.

[0139] In one embodiment, the distance between one of the first peaks and a peak located next to the one peak and the distance between one of the second peaks and another of the second peaks located next to the one of the second peaks may be 0.2 micrometers to 0.6 micrometers.

[0140] In one embodiment, an electronic device can increase the density of peaks (or the density of surface roughness) by narrowing the gaps between a plurality of peaks arranged in a single layer. As the density of peaks increases, the surface area of ​​the side facing the non-conductive layer can increase. Based on the increased surface area, the bonding strength between the first conductive layer and the non-conductive layer and the bonding strength between the second conductive layer and the non-conductive layer can be improved, despite the height of the peaks being reduced.

[0141] In one embodiment, the second conductive layer may be electrically connected to a conductive portion that acts as a ground within the electronic device.

[0142] According to one embodiment, the FPCB may further include a first shielding layer (e.g., the shielding layer (440) of FIG. 4A). The first shielding layer (431) may be disposed on a surface of the first conductive layer (410) opposite to a surface of the first conductive layer (410) that contacts the non-conductive layer (401).

[0143] According to one embodiment, the FPCB (310) may further include a second shielding layer (e.g., the second shielding layer (432) of FIG. 4A). The second shielding layer may be disposed on a surface of the second conductive layer opposite to a surface of the second conductive layer that contacts the non-conductive layer.

[0144] A flexible printed circuit board may be configured to transmit high-speed signals by forming lines disposed on a first conductive layer as strip lines. The second conductive layer may function as a ground line disposed beneath the strip lines.

[0145] In one embodiment, the first shielding layer and the second shielding layer can prevent interference of a signal due to electromagnetic waves caused by an external signal. The distance between the first shielding layer and the first conductive layer can affect the impedance value.

[0146] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0147] FIG. 6 is a block diagram of an exemplary electronic device (601) within a network environment (600), according to various embodiments.

[0148] Referring to FIG. 6, in a network environment (600), an electronic device (601) may communicate with an electronic device (602) via a first network (698) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (604) or a server (608) via a second network (699) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (601) may communicate with the electronic device (604) via the server (608). According to one embodiment, the electronic device (601) may include a processor (620), a memory (630), an input module (650), an audio output module (655), a display module (660), an audio module (670), a sensor module (676), an interface (677), a connection terminal (678), a haptic module (679), a camera module (680), a power management module (688), a battery (689), a communication module (690), a subscriber identification module (696), or an antenna module (697). In some embodiments, the electronic device (601) may omit at least one of these components (e.g., the connection terminal (678)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (676), the camera module (680), or the antenna module (697)) may be integrated into one component (e.g., the display module (660)).

[0149] The processor (620) may include various processing circuits and / or multiple processors. For example, a “processor” as used in this disclosure, including the claims, may include at least one processor and various processing circuits, wherein one or more of the at least one processor may be configured to individually, in a distributed manner, or collectively perform various functions described herein. When “processor,” “at least one processor,” and “one or more processors” as used herein are described as being configured to perform a number of functions, for example, these terms include, without limitation, situations where one processor performs some of the recited functions, other processor(s) perform other recited functions, and a single processor may perform all of the recited functions. The at least one processor may include a combination of processors that perform various recited / disclosed functions (e.g., in a distributed manner). The at least one processor may execute program instructions to achieve or perform various functions. The processor (620) may, for example, execute software (e.g., a program (640)) to control at least one other component (e.g., a hardware or software component) of the electronic device (601) connected to the processor (620) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (620) may store commands or data received from other components (e.g., a sensor module (676) or a communication module (690)) in a volatile memory (632), process the commands or data stored in the volatile memory (632), and store result data in a non-volatile memory (634).According to one embodiment, the processor (620) may include a main processor (621) (e.g., a central processing unit or an application processor) or an auxiliary processor (623) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (621). For example, when the electronic device (601) includes the main processor (621) and the auxiliary processor (623), the auxiliary processor (623) may be configured to use less power than the main processor (621) or to be specialized for a given function. The auxiliary processor (623) may be implemented separately from the main processor (621) or as a part thereof.

[0150] The auxiliary processor (623) may control at least a portion of functions or states associated with at least one component (e.g., a display module (660), a sensor module (676), or a communication module (690)) of the electronic device (601), for example, on behalf of the main processor (621) while the main processor (621) is in an inactive (e.g., sleep) state, or together with the main processor (621) while the main processor (621) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (623) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (680) or a communication module (690)). In one embodiment, the auxiliary processor (623) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (601) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (608)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0151] The memory (630) can store various data used by at least one component (e.g., the processor (620) or the sensor module (676)) of the electronic device (601). The data can include, for example, software (e.g., the program (640)) and input data or output data for commands related thereto. The memory (630) can include a volatile memory (632) or a non-volatile memory (634).

[0152] The program (640) may be stored as software in the memory (630) and may include, for example, an operating system (642), middleware (644), or an application (646).

[0153] The input module (650) can receive commands or data to be used in a component of the electronic device (601) (e.g., a processor (620)) from an external source (e.g., a user) of the electronic device (601). The input module (650) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0154] The audio output module (655) can output audio signals to the outside of the electronic device (601). The audio output module (655) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0155] The display module (660) can visually provide information to an external party (e.g., a user) of the electronic device (601). The display module (660) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (660) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0156] The audio module (670) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (670) can acquire sound through the input module (650), output sound through the sound output module (655), or an external electronic device (e.g., electronic device (602)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (601).

[0157] The sensor module (676) can detect the operating status (e.g., power or temperature) of the electronic device (601) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (676) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0158] The interface (677) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (601) with an external electronic device (e.g., the electronic device (602)). In one embodiment, the interface (677) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0159] The connection terminal (678) may include a connector through which the electronic device (601) may be physically connected to an external electronic device (e.g., the electronic device (602)). According to one embodiment, the connection terminal (678) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0160] The haptic module (679) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (679) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0161] The camera module (680) can capture still images and videos. According to one embodiment, the camera module (680) may include one or more lenses, image sensors, image signal processors, or flashes.

[0162] The power management module (688) can manage power supplied to the electronic device (601). According to one embodiment, the power management module (688) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0163] A battery (689) may power at least one component of the electronic device (601). In one embodiment, the battery (689) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0164] The communication module (690) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (601) and an external electronic device (e.g., electronic device (602), electronic device (604), or server (608)), and the performance of communication through the established communication channel. The communication module (690) may operate independently from the processor (620) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (690) may include a wireless communication module (692) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (694) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (604) via a first network (698) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (699) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (692) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (696) to verify or authenticate the electronic device (601) within a communication network such as the first network (698) or the second network (699).

[0165] The wireless communication module (692) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (692) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (692) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (692) may support various requirements specified in the electronic device (601), an external electronic device (e.g., the electronic device (604)), or a network system (e.g., the second network (699)). According to one embodiment, the wireless communication module (692) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0166] The antenna module (697) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (697) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (697) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (698) or the second network (699), may be selected from the plurality of antennas by, for example, the communication module (690). A signal or power may be transmitted or received between the communication module (690) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (697).

[0167] According to various embodiments, the antenna module (697) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0168] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0169] According to one embodiment, commands or data may be transmitted or received between the electronic device (601) and an external electronic device (604) via a server (608) connected to a second network (699). Each of the external electronic devices (602 or 604) may be the same or a different type of device as the electronic device (601). According to one embodiment, all or part of the operations executed in the electronic device (601) may be executed in one or more of the external electronic devices (602, 604, or 608). For example, when the electronic device (601) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (601) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (601). The electronic device (601) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (601) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (604) may include an Internet of Things (IoT) device. The server (608) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (604) or the server (608) may be included in the second network (699).The electronic device (601) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0170] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0171] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0172] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0173] Various embodiments of the present document may be implemented as software (e.g., a program (640)) including one or more instructions stored in a storage medium (e.g., an internal memory (636) or an external memory (638)) readable by a machine (e.g., an electronic device (601)). For example, a processor (e.g., a processor (620)) of the machine (e.g., an electronic device (601)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0174] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0175] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0176] While the present disclosure has been described and illustrated with reference to various embodiments, it should be understood that the various embodiments are intended for non-limiting purposes. Those skilled in the art will further appreciate that various changes in form and detail may be made without departing from the spirit and scope of the present disclosure, including the claims and their equivalents. Furthermore, it should be understood that the embodiments described herein can be used in conjunction with other embodiments described herein.

Claims

1. In an electronic device (100), Housing (110); and It includes an FPCB (310) (flexible printed circuit board) configured to connect electronic components arranged in the housing (110) that transmits signals; The above FPCB (310) is Non-challenging layer (401); A first conductive layer (410) including a transmission line (410-1; 410-2) configured to transmit the signal arranged on one side of the non-conductive layer (401); A second conductive layer (420) is disposed on the other side opposite to one side of the non-conductive layer (401); In order to electrically isolate between the transmission line (410-1; 410-2) and the second conductive layer (420), the thickness of the non-conductive layer (401) is within 3.5 micrometers to 7.5 micrometers. Electronic devices (100).

2. In paragraph 1, The above first challenge layer (410) is It comprises a plurality of first peaks (501) protruding from the transmission line (410-1; 410-2) into the non-conductive layer (401), The above second challenging layer (420) is comprising a plurality of second peaks (502) protruding into the non-conductive layer (401); Electronic devices (100).

3. In paragraph 2, The distance between one first peak (501-1) of the plurality of first peaks (501) and one second peak (502-1) of the plurality of second peaks (502) corresponding to the first peak is, Within the range of 1.0 micrometer to 1.5 micrometer, Electronic devices (100).

4. In paragraph 2, The height of the plurality of first peaks (501) protruding from the surface of the transmission line (410-1; 410-2) and the height of the plurality of second peaks (502) protruding from the surface of the second conductive layer (420) are Within the range of 1 micrometer to 2.5 micrometers, Electronic devices (100).

5. In paragraph 2, The distance between one first peak of the plurality of first peaks (501) and another first peak of the plurality of first peaks (501) located next to the one first peak and the distance between one second peak of the plurality of second peaks (502) and another second peak of the plurality of second peaks (502) located next to the one second peak are, Within the range of 0.2 micrometer to 0.6 micrometer Electronic devices (100).

6. In paragraph 1, The above second challenging layer (420) is Electrically connected to a conductive portion that functions as a ground of the above electronic device (100), Electronic devices (100).

7. In paragraph 1, The above FPCB (310) is A first shielding layer (431) arranged on a surface of the first conductive layer (410) opposite to a surface of the first conductive layer (410) that contacts the non-conductive layer (401); and A second shielding layer (432) disposed on a surface of the second conductive layer (420) opposite to a surface of the second conductive layer (420) that contacts the non-conductive layer (401); Electronic devices (100).

8. In paragraph 7, The above FPCB (310) is A first cover layer disposed between the first conductive layer (410) and the first shielding layer (431); and A second cover layer disposed between the second conductive layer (420) and the second shielding layer (432); The first cover layer and the second cover layer are attached to the first conductive layer (410) and the second conductive layer (420) through an adhesive member including an adhesive material, The above first cover layer surrounds the transmission line (410-1; 410-2). Electronic devices (100).

9. In paragraph 1, A first PCB (printed circuit board) positioned on the top of the electronic device (100); Further comprising a second PCB placed at the bottom of the electronic device (100); The above FPCB (310) connects the first PCB and the second PCB. Electronic devices (100).

10. In paragraph 9, Further comprising an interface connected to the second PCB and configured to be connected to an external electronic device (100); The above signal includes a high frequency signal and passes between the interface and the first PCB, Electronic devices (100).

11. In paragraph 1, The roughness of one side of the transmission line (410-1; 410-2) of the first conductive layer (410) facing the non-conductive layer (401) is The roughness of the other side of the transmission line (410-1; 410-2) of the first conductive layer (410) is greater than that of the other side of the transmission line (410-1; 410-2). Electronic devices (100).

12. In paragraph 1, The above non-conductive layer (401) is The thinnest of the layers included in the above FPCB (310), Electronic devices (100).

13. In paragraph 1, Some of the layers of the FPCB (310) arranged next to the transmission line (410-1; 410-2) of the first conductive layer (410) are empty. Electronic devices (100).

14. In paragraph 1, The non-conductive layer (401) containing PI (polyimide) is Having flexibility, Electronic devices (100).

15. In paragraph 1, The above FPCB (310) is Including connectors connected to the ends of the above transmission lines (410-1; 410-2), Electronic devices (100).

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