Electronic device including conductive contact member and manufacturing method thereof

Abstract

An electronic device according to various embodiments of the present invention may comprise: a display configured to output image information on a surface facing a first direction; and a conductive contact member disposed on a surface facing the direction opposite to the first direction, of the display. The conductive contact member may comprise: a conductive woven layer including conductive fibers woven to cross each other; and a conductive adhesive layer positioned on one surface of the conductive woven layer and including an adhesive and conductive particles, wherein the conductive adhesive layer may include a first region and a second region in which more adhesives are positioned than the first region.

Description

Electronic device including conductive contact member and method for manufacturing same

[0001] One embodiment disclosed in this document relates to an electronic device, and more particularly, to an electronic device including a conductive contact member.

[0002] Electronic devices may include conductive contact members that provide electrical contact for grounding and / or electromagnetic interference (EMI) shielding of electrical components such as substrates, antennas, and displays. Conventionally, solderable spring materials such as beryllium foil, stainless steel foil, or copper foil have been pressed and used as ground contact terminals on electronic circuit boards. However, such structures require expensive molds for manufacturing and may lose elasticity when pressure exceeding the yield strength is applied. Therefore, conductive contact members in the form of foamed polymers (e.g., polymer foam) covered with a conductive material may be used to provide electrical contact and / or shielding between electrical components. The conductive contact members described above may be referred to as foam gaskets or conductive gaskets.

[0003] The above information may be provided as background information to aid in understanding this document. None of the above is claimed to be prior art related to this document or can be used to determine prior art.

[0004] The electrical conductivity of a conductive contact member depends on the electrical path formed when conductive particles dispersed within the adhesive layer come into contact with each other when pressure is applied to the foam gasket. Therefore, to reduce the contact resistance and increase the electrical conductivity of the foam gasket, the internal structure of the electronic device must be designed to ensure that an appropriate level of pressure is applied to the foam gasket.

[0005] However, the conductive contact member requires an excessive level of pressure to obtain sufficient electrical conductivity in a small area, so when the conductive contact member is placed on the back surface of a member such as a display, the repulsive force is excessive, so that the attachment area of ​​the conductive contact member may be visually recognized on the front surface of the display, which may deteriorate the appearance quality of the display. In addition, when the proportion of conductive particles dispersed in the adhesive layer is increased to increase the electrical conductivity of the conductive contact member, the relative specific gravity of the adhesive may decrease, which may reduce the adhesive strength of the conductive contact member.

[0006] In addition, when the adhesive force of the conductive contact member is excessively sensitive to pressure, the electrical conductivity may change depending on the change in pressure applied to the conductive contact member due to the impact or acceleration applied to the electronic device, which may cause changes in antenna radiation performance or display quality due to changes in electrical characteristics.

[0007] According to the embodiments disclosed in this document, a conductive contact member having a stable high electrical conductivity under low pressure can be provided.

[0008] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0009] An electronic device according to various embodiments of the present disclosure may include a display configured to output image information on a surface facing a first direction. The electronic device may include a conductive contact member disposed on a surface of the display facing in a direction opposite to the first direction. The conductive contact member may include a conductive woven layer including woven conductive fibers. The conductive contact member may be disposed on one surface of the conductive woven layer such that a recessed area is formed, and may include a conductive adhesive layer including an adhesive and conductive particles. The recessed area may have 10% or less of the adhesive compared to a non-recessed area of ​​the conductive adhesive layer.

[0010] A conductive contact member according to various embodiments of the present invention may include a conductive woven layer including conductive fibers woven so as to intersect each other. The conductive contact member may include a conductive adhesive layer disposed on one surface of the conductive woven layer such that a recessed region is formed, and the conductive adhesive layer includes an adhesive and conductive particles. The recessed region may have 10% or less of the adhesive compared to a non-recessed region of the conductive adhesive layer.

[0011] A method for manufacturing a conductive contact member according to various embodiments of the present invention may include a coating operation for applying an adhesive and conductive particles onto a release film. The method for manufacturing the conductive contact member may include an attachment operation for attaching the release film, the adhesive, and the conductive particles onto a conductive woven layer. The method for manufacturing the conductive contact member may include a removal operation for removing the release film from the conductive woven layer.

[0012] According to embodiments of the present invention, a conductive contact member can be provided that has low contact resistance and high electrical conductivity under low pressure, and maintains stable electrical properties against external impact or acceleration. In addition, an electronic device having the above-described advantages can be provided.

[0013] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0014] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0015] FIG. 2A is a perspective view of the front of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 2B is a perspective view of the rear surface of the electronic device of FIG. 2A, according to one embodiment of the present disclosure.

[0017] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.

[0018] FIG. 4 is a perspective view showing a conductive contact member according to various embodiments of the present invention.

[0019] FIG. 5A is a cross-sectional view showing a conductive contact member according to various embodiments of the present invention.

[0020] FIG. 5b is a cross-sectional view showing a conductive adhesive layer according to various embodiments of the present invention.

[0021] FIG. 5c is a plan view showing a conductive adhesive layer according to various embodiments of the present invention.

[0022] FIG. 5d is a plan view showing a conductive woven layer according to various embodiments of the present invention.

[0023] FIG. 5e is a plan view showing a conductive adhesive layer according to various embodiments of the present invention.

[0024] FIGS. 6A and 6B are cross-sectional views showing a state in which pressure is applied to a conductive contact member according to various embodiments of the present invention.

[0025] FIG. 7a is a graph showing the surface resistance of a conductive contact member according to various embodiments.

[0026] FIG. 7b is a graph showing the adhesive strength of a conductive contact member according to various embodiments.

[0027] Figure 7c is a graph showing the change in surface resistance according to pressure of a conductive contact member according to the present invention and a comparative example.

[0028] FIG. 8a is a flowchart showing a manufacturing process of a conductive contact member according to various embodiments.

[0029] FIG. 8b is a schematic diagram showing the manufacturing operation of a conductive contact member according to various embodiments.

[0030] FIG. 8c is a schematic diagram showing the manufacturing operation of a conductive contact member according to various embodiments.

[0031] FIG. 8d is a schematic diagram showing the manufacturing operation of a conductive contact member according to various embodiments.

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. In these drawings, for example, the sizes and shapes of components may be exaggerated for convenience and clarity of explanation. In actual implementation, variations in the depicted shapes may be expected. Therefore, embodiments of the present invention should not be construed as limited to the specific shapes of the regions illustrated in this specification.

[0033] Reference numerals in the drawings refer to the same elements throughout the drawings. Furthermore, as used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

[0034] The embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. The following embodiments may be modified in various ways, and the scope of the present invention is not limited to the embodiments described below. Rather, these embodiments are provided to more faithfully and completely explain the present disclosure and fully convey the spirit of the present invention to those skilled in the art.

[0035] The terminology used herein is used to describe embodiments and is not intended to limit the scope of the present invention. In addition, even if the singular is described herein, the plural form may be included unless the context clearly indicates the singular. In addition, the terms "comprise" and / or "comprising" as used herein specify the presence of mentioned features, numbers, steps, operations, elements, components and / or groups thereof, and do not exclude the presence or addition of other features, numbers, operations, elements, components and / or groups.

[0036] In this specification, relative terms such as "below," "above," "upper," "lower," "horizontal," or "vertical" may be used to describe the relationship of one component, layer, or region to another component, layer, or region, as depicted in the drawings. It should be understood that these terms encompass directions other than those depicted in the drawings.

[0037] In this document, phrases such as "A or B," "at least one of A and B," "or at least one of B," "A, B, or C," "at least one of A, B, and C," and "or at least one of C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0038] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with the electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0039] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0040] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0041] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0042] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0043] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0044] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0045] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0046] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0047] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0051] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0053] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0056] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197). According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0057] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0058] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0059] FIG. 2A is a perspective view of the front of an electronic device (200) (e.g., the electronic device (100) of FIG. 1 ) according to one embodiment of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A according to one embodiment of the present disclosure.

[0060] The electronic device (200) described below may include at least one of the components of the electronic device (101) described above in FIG. 1.

[0061] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 2A . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (218) (or “side member”) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0062] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0063] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0064] The display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first side (210A) and the first region (210D) of the side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0065] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The audio output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), the speakers (207, 214), and the connector (208) may be arranged at least partially in the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone (203) and the speakers (207, 214). In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

[0066] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., a home key button), a portion of the second surface (210B), and / or under the display (201). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0067] The camera modules (205, 212) may include a first camera module (205) disposed on a first side (210A) of the electronic device (200), a second camera module (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (200).

[0068] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0069] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light (e.g., a light-emitting element). In another embodiment, the light-emitting element may provide a light source that is linked to the operation of the camera module (205), for example. The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0070] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0071] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be visually exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). According to one embodiment, an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (201) facing the sensor module may not require a perforated opening.

[0072] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device", "slidable electronic device", "stretchable electronic device" and / or "rollable electronic device" may refer to an electronic device that is capable of bending deformation of a display (e.g., a display (330) of FIG. 3) so that at least a portion thereof is folded, wound or rolled, at least a portion thereof is expanded, and / or can be housed inside a housing (e.g., a housing (210) of FIGS. 2A and 2B). The foldable electronic device, the slidable electronic device, the stretchable electronic device and / or the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside, depending on the needs of the user.

[0073] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.

[0074] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIGS. 2A and 2B, or may include other embodiments of the electronic device.

[0075] Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (200) of FIG. 2A or FIG. 2B) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or a support structure), a front plate (320) (e.g., a front cover), a display (330) (e.g., the display (201) of FIG. 2A), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2A or FIG. 2B, and any redundant description thereof will be omitted below.

[0076] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (311) may have a display (330) coupled to one surface and a substrate (340) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the substrate (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0077] The memory may include, for example, volatile memory or non-volatile memory.

[0078] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0079] The battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as the substrate (340), for example. The battery (350) may be integrally disposed within the electronic device (300). In another embodiment, the battery (350) may be disposed so as to be detachable from the electronic device (300).

[0080] The antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a part or a combination of the side bezel structure (310) and / or the first support member (311).

[0081] In various embodiments, the electronic device (300) may include a conductive contact member (401). The conductive contact member (401) may be disposed on a surface of a member, such as a display (330), a frame (e.g., a first support member (311)), a substrate (340), an antenna (370), and / or a back plate (380), to form electrical contact with other members facing the members.

[0082] FIG. 4 is a perspective view showing a conductive contact member (401) according to various embodiments of the present invention.

[0083] Referring to FIG. 4, the conductive contact member (401) may include a conductive woven layer (430) and a conductive adhesive layer (440).

[0084] The conductive woven layer (430) may be a layer that includes a conductive material and wraps around at least a portion of the outer periphery of the conductive contact member (401) to form a path through which current flows. For example, the conductive contact member (401) may be in contact with the display (330) in a first direction (e.g., a +z direction in the drawing) and in contact with a frame (e.g., a first support member (311)) in a second direction opposite to the first direction (e.g., a -z direction in the drawing), and the conductive woven layer (430) may form a ground path between the display (330) and the frame.

[0085] The conductive adhesive layer (440) may be formed on at least a portion of one side of the conductive woven layer (430) and may be a layer that electrically contacts the conductive contact member (401) while adhering it to a counterpart (402) (e.g., a display (330) and / or a first support member (311)) that is in contact with the conductive contact member (401). The detailed configuration of the conductive adhesive layer (440) and the conductive woven layer (430) will be described later.

[0086] In various embodiments, the conductive contact member (401) may include a foamed polymer layer (410). The foamed polymer layer (410) may include a porous material formed by foaming a polymer material such as, for example, polyurethane, polystyrene, ethylene-vinyl acetate, nitrile butadiene rubber (NBR), and / or polyolefin to form a plurality of pores. The foamed polymer layer (410) may impart elasticity to the conductive contact member (401). In various embodiments, the conductive contact member (401) may include a first adhesive layer (420) that mutually adheres the foamed polymer layer (410) and the conductive woven layer (430).

[0087] FIG. 5a is a cross-sectional view showing a conductive contact member (401) according to various embodiments of the present invention.

[0088] FIG. 5b is a cross-sectional view showing a conductive adhesive layer (440) according to various embodiments of the present invention.

[0089] FIG. 5c is a plan view showing a conductive adhesive layer (440) according to various embodiments of the present invention.

[0090] FIG. 5d is a plan view showing a conductive woven layer (430) according to various embodiments of the present invention.

[0091] FIG. 5e is a plan view showing a conductive adhesive layer (440) according to various embodiments of the present invention.

[0092] Fig. 5a is an enlarged view of area A of Fig. 4. Fig. 5a is also a cross-sectional view showing a state in which no pressure (pressure (P) of Figs. 6a and 6b) is applied to the conductive contact member (401).

[0093] Referring to FIGS. 5A to 5E , the conductive woven layer (430) may include conductive fibers (431). The conductive fibers (431) may include fibers having a conductive material (e.g., carbon fibers, metal fibers, and / or conductive polymer fibers), fibers of a composite material including a conductor, and / or fibers having a conductive coating (e.g., a deposited metal layer). The conductive fibers (431) may include weft fibers (432) and warp fibers (433). The weft fibers (432) and warp fibers (433) may be woven so as to intersect each other at an angle (e.g., substantially at a right angle). In some embodiments, the weft fibers (432) and warp fibers (433) may be woven so as to intersect each other in a unit of multiple fibers (e.g., five fibers), as illustrated in FIGS. 5A and 5D .

[0094] The conductive adhesive layer (440) may include an adhesive (441) and conductive particles (442). The adhesive (441) may adhere the conductive woven layer (430) of the conductive contact member (401) to a contacted counterpart (402) (e.g., the display (330) and / or the first support member (311)) so that the adhesive is fixed thereto. The conductive particles (442) may be a component that forms a conductive path by electrically contacting the contacted counterpart (402) and the conductive woven layer (430) with the conductive contact member (401). The conductive particles (442) may be suspended in the adhesive (441). The conductive particles (442) may include particles of a conductive material such as, for example, copper, aluminum, silver, gold, nickel, or stainless steel. The diameter of the conductive particle (442) may be, for example, 2 micrometers or less based on D50 (medium particle size).

[0095] In various embodiments, the conductive adhesive layer (440) may include a conductive nonwoven fabric (443). The conductive nonwoven fabric (443) may be a layer formed by intertwining fibers of the same or similar material as the conductive fibers (431) of the conductive woven layer (430). The conductive nonwoven fabric (443) may be at least partially immersed or dispersed within the adhesive (441) of the conductive adhesive layer (440). The adhesive (441) may be at least partially impregnated into the conductive nonwoven fabric (443).

[0096] Referring to FIGS. 5b and 5c, the conductive adhesive layer (440) may include a depression region (440a) and a non-depression region (440b). The depression region (440a) may be a region in which a relatively smaller amount of adhesive (441) (e.g., less than 10% of the amount of adhesive (441)) is disposed compared to the non-depression region (440b). The non-depression region (440b) may be a region of the conductive adhesive layer (440) other than the depression region (440a). The non-depression region (440b) may be a region in which a relatively larger amount of adhesive (441) is disposed compared to the non-depression region (440b). For example, the sunken area (440a) may be an area where all or part of the adhesive (441) applied to the conductive adhesive layer (440) is removed. The first region may be referred to as a crater since all or part (e.g., 90% or more) of the adhesive (441) is removed. The recessed region (440a) and the non-recessed region (440b) may be formed one or more times in the conductive adhesive layer (440). The recessed region (440a) and the non-recessed region (440b) may be arranged regularly or irregularly within the conductive adhesive layer (440). In FIG. 5c, the recessed region (440a) and the non-recessed region (440b) are shown regularly, but this is exemplary and does not limit the present invention. The conductive adhesive layer (440) may be formed by forming a recessed region (440a) in which less adhesive (441) is disposed or at least part of it is removed, and a non-recessed region (440b) in which more adhesive (441) is disposed than the recessed region (440a). By including the regions (440b), the adhesive (441) can be easily flowed when pressure is applied to the conductive adhesive layer (440), as described below with reference to FIGS. 6A and 6B. In various embodiments, the thickness of the conductive adhesive layer (440) can be 7 micrometers or more.When the thickness of the conductive adhesive layer (440) is less than 7 micrometers, the flow of the adhesive (441) may not be smooth. In one embodiment, when the thickness of the conductive adhesive layer (440) is less than 7 micrometers, the application of the adhesive (441) may become difficult.

[0097] Referring again to FIGS. 5A and 5D , the conductive woven layer (430) may have a region (430a) where weft fibers (432) and warp fibers (433) intersect and a gap (430b) formed between the weft fibers (432) and the warp fibers (433). Since the region (430a) where the weft fibers (432) and the warp fibers (433) intersect is thicker than other regions of the conductive woven layer (430), the distance between the conductive contact member (401) and the counterpart (402) (e.g., the display (330) and / or the first support member (311)) with which it is in contact is short, so that electrical contact can be easily formed.

[0098] Referring to FIGS. 5c and 5d, the recessed region (440a) of the conductive adhesive layer (440) can be arranged to at least partially overlap with the region (430a) where the weft fibers (432) and the warp fibers (433) of the conductive woven layer (430) intersect. As described below, since the recessed region (440a) is arranged in the intersecting region (430a) where the distance from the counterpart (402) is short and electrical contact with the counterpart (402) is easily formed, the thickness of the adhesive (441) layer can be reduced and the proportion of the conductive particles (442) can be relatively increased, thereby reducing the surface resistance between the conductive contact member (401) and the counterpart (402). Additionally, in various embodiments, the conductive woven layer (430), the conductive nonwoven fabric (443), and the counterpart (402) may be in direct contact with each other at the recessed region (440a), thereby reducing the surface resistance between the conductive contact member (401) and the counterpart (402). The non-recessed region (440b) of the conductive adhesive layer (440) may at least partially overlap with the gap (430b) formed between the weft fibers (432) and the warp fibers (433) of the conductive woven layer (430). For example, the recessed region (440a) may correspond to the region (430a) of the conductive woven layer (430) where the weft fibers (432) and the warp fibers (433) intersect, and the non-recessed region (440b) may correspond to the gap (430b) between the fibers. Therefore, when pressure is applied to the conductive contact member (401) described later, it may be easy for the adhesive to penetrate into the gap (430b) between the fibers of the conductive woven layer (430).

[0099] Referring to FIG. 5E, in various embodiments, the recessed region (440a) may be irregular. For example, the non-recessed region (440b) may be formed by the aggregation of the adhesive (441) due to the aggregation of the conductive particles (442), and the recessed region (440a) may be formed in an area where at least a portion of the adhesive (441) is exhausted by the aggregation of the adhesive (441) into the non-recessed region (440b). The recessed regions (440a) may be separated from each other by the non-recessed region (440b). In various embodiments, the areal number density of the conductive particles (442) in the recessed region (441a) may be 70% or less of that in the non-recessed region (440b).

[0100] FIG. 6a and FIG. 6b are cross-sectional views showing a state in which pressure is applied to a conductive contact member (401) according to various embodiments of the present invention.

[0101] Although FIG. 6a is illustrated with the conductive nonwoven fabric (443) omitted for clarity, it will be apparent to those skilled in the art that the conductive nonwoven fabric (443) as illustrated in FIGS. 5a and 6b can be additionally combined with the embodiment illustrated in FIG. 6a.

[0102] Referring to FIG. 6A, a pressure (P) may be applied to the conductive contact member (401). The pressure may cause the adhesive (441) of the conductive adhesive layer (440) to penetrate into the gap (430b) formed between the weft fibers (432) and the warp fibers (433) of the conductive woven layer (430). As the adhesive (441) penetrates into the gap (430b) of the conductive woven layer (430), the adhesive (441) of the conductive adhesive layer (440) may flow (F) from the area (430a) where the weft fibers (432) and the warp fibers (433) intersect to the gap (430b). For example, due to the flow (F) of the adhesive (441), the adhesive (441) may be completely or partially removed from a region of the adhesive layer (440) that overlaps with a region (430a) where the weft fibers (432) and the warp fibers (433) intersect. Accordingly, the proportion of the adhesive (441) may relatively decrease, and the proportion of the conductive particles (442) may relatively increase, in a region of the conductive adhesive layer (440) that overlaps with a region (430a) where the weft fibers (432) and the warp fibers (433) intersect. Due to the relative increase in the proportion of the conductive particles (442) in a region of the adhesive layer, the formation of a conductive path (E) between the conductive woven layer (430) and the counterpart (402) (e.g., the display (330) and / or the first support member (311)) in that region may be facilitated.

[0103] In addition, as the adhesive (441) flows into the gap (430b) formed between the warp fibers (433) and weft fibers (432) of the conductive woven layer (430), the proportion of the adhesive (441) may relatively increase and the proportion of the conductive particles (442) may relatively increase in the region of the conductive adhesive layer (440) overlapping the gap (430b). Accordingly, the adhesive strength of the conductive adhesive layer (440) may be improved in the region, so that the conductive woven layer (430) and the counterpart (402) (e.g., the display (330) and / or the first support member (311)) may be effectively fixed to each other.

[0104] In general, the adhesiveness and electrical conductivity of the conductive adhesive layer (440) of the conductive contact member (401), such as a foam gasket, are in a trade-off relationship. For example, when the proportion of the adhesive (441) is relatively increased to improve the adhesiveness of the conductive adhesive layer (440), the proportion of the conductive particles (442) may relatively decrease, which may result in a decrease in electrical conductivity and an increase in sheet resistance. In addition, when the proportion of the conductivity is relatively increased to improve the electrical conductivity of the conductive adhesive layer (440), the proportion of the adhesive (441) may relatively decrease, which may result in a decrease in adhesiveness. In addition, in order to achieve both high adhesiveness and high electrical conductivity, the conductive contact member (401) may need to be pressed against the counterpart (402) with excessively strong pressure so that the conductive particles (442) can come into contact with each other to form a conductive path. Therefore, there is a risk that the counterpart (402) may be damaged, or the area pressed by the conductive contact member (401) on the back of the display (330) may be visible from the front, thereby deteriorating the appearance quality of the display (330).

[0105] According to the present invention, when pressure is applied to the conductive adhesive layer (440), the proportion of conductive particles (442) increases in the area overlapping with the area (430a) where the weft fibers (432) and warp fibers (433) of the conductive woven layer (430) intersect, so that an electrical conduction path is easily formed, thereby achieving low surface resistance and high electrical conductivity, and the proportion of adhesive (441) increases in the area overlapping with the gap (430b) between the weft fibers (432) and warp fibers (433), thereby increasing adhesive strength, so that both high electrical conductivity and high adhesive strength can be achieved.

[0106] Referring to FIG. 6b, when pressure (P) is applied to the conductive contact member (401), the conductive woven layer (430) can be in direct contact with the conductive nonwoven fabric (443). For example, by the flow (F) of the adhesive of the conductive adhesive layer (440) illustrated in FIG. 6a and / or by the overlapping of the gap (430b) and the recessed area (440a) as illustrated in FIGS. 5c and 5d, the area (430a) where the conductive fibers (431) of the conductive woven layer (430) intersect can be in direct contact with the conductive nonwoven fabric (443) to form a conductive path (E). Since the thickness of the conductive woven layer (430) is relatively thicker in the area (430a) where the conductive fibers (431) intersect, the above-described direct contact can be easily achieved, thereby reducing the contact resistance between the conductive contact member (401) and the counterpart (402).

[0107] The formation of a conductive path (E) by the conductive particles (442) illustrated in FIG. 6a and the formation of a conductive path (E) by direct contact between the conductive woven layer (430) and the conductive nonwoven fabric (443) illustrated in FIG. 6b are not contradictory to each other, and it will be apparent to those skilled in the art that various embodiments of the present invention may include the embodiments illustrated in FIG. 6a or FIG. 6b or a combination thereof.

[0108] Referring to FIGS. 5E, 6A, and 6B, the interior of the recessed region (440a) may be a space closed by an adhesive (441). For example, the recessed region may be a space closed by the first adhesive layer (420) at the top, the adhesive (441) at the sides, and the adhesive (441) and / or the counterpart (402) at the bottom. Accordingly, the inflow of corrosion-inducing elements such as external oxygen and / or moisture into the interior of the recessed region (440a) may be limited or blocked. Accordingly, the electrical contact formed in the recessed region (440a) may have its performance degradation (increase in contact resistance) of the electrical contact reduced or prevented due to corrosion of conductive elements (e.g., conductive particles (442), conductive fibers (431), and / or conductive nonwoven fabrics (443)).

[0109] FIG. 7a is a graph showing the surface resistance of a conductive contact member (401) according to various embodiments.

[0110] FIG. 7b is a graph showing the adhesive force of a conductive contact member (401) according to various embodiments.

[0111] Figure 7c is a graph showing the change in surface resistance according to pressure of a conductive contact member according to the present invention and a comparative example.

[0112] Referring to FIG. 7a, the area ratio of the recessed region (440a) in the conductive adhesive layer (440) of the conductive contact member (401) may be 30% or more. In various embodiments, when a pressure of 30 gf / mm² is applied to the conductive contact member (401), it can be seen that the sheet resistance rapidly decreases until the area ratio of the recessed region (440a) reaches 30%. In addition, referring to FIG. 7b, the area ratio of the recessed region (440a) may be 70% or less. It can be seen that when the area ratio of the recessed region (440a) exceeds 70%, the adhesive force rapidly decreases to 400 g / in or less. Therefore, when the area ratio of the recessed region (440a) of the conductive adhesive layer (440) of the present invention is 30% to 70%, good adhesive force and electrical conductivity (i.e., low sheet resistance) can be obtained.

[0113] Referring to FIG. 7c, it can be seen that the conductive contact member (401) according to the present invention has lower sheet resistance and higher electrical conductivity than the comparative example within all pressure ranges. Specifically, it can be seen that the conductive contact member of the comparative example requires a pressure of about 75 gf / mm² or more to have a sheet resistance of 200 milliohms / mm². Such a high pressure may cause a pressing mark to be visible on the front surface of the display (330) when the conductive contact member is applied to the back surface of the display (330), thereby deteriorating the appearance quality of the display (330). In addition, it can be seen that the sheet resistance is excessively high when a pressure of 25 gf / mm² or less is applied.

[0114] In contrast, it can be seen that the conductive contact member (401) according to the present invention has a surface resistance of 200 milliohm / mm² or less (e.g., about 110 ohm / mm²) at a pressure of 25 gf / mm². Therefore, it can be seen that the conductive contact member (401) of the present invention can have sufficient electrical conductivity under low pressure, so that the risk of excessive pressing marks occurring when applied to the back surface of the display (330) is reduced.

[0115] FIG. 8a is a flowchart showing a manufacturing process of a conductive contact member (401) according to various embodiments.

[0116] FIG. 8b is a schematic diagram showing the manufacturing operation of a conductive contact member (401) according to various embodiments.

[0117] FIG. 8c is a schematic diagram showing the manufacturing operation of a conductive contact member (401) according to various embodiments.

[0118] FIG. 8d is a schematic diagram showing the manufacturing operation of a conductive contact member (401) according to various embodiments.

[0119] Referring to FIG. 8A, the conductive contact member (401) can be manufactured by an operation including an operation of applying an adhesive (441) and conductive particles (442) onto a release film (601) (an application operation (501)), an operation of attaching the adhesive (441) and conductive particles (442) applied onto the release film (601) onto a conductive woven layer (430) (an attachment operation (502)), and an operation of removing the release film (601) from the conductive woven layer (430) (a removal operation (503)). In some embodiments, after the adhesive (441) and conductive particles (442) are applied onto the release film (601), an operation of impregnating the adhesive (441) onto a conductive nonwoven fabric (443) can be performed.

[0120] Referring to FIG. 8b, the operation (501) of applying an adhesive (441) and conductive particles (442) on a release film (601) may include an operation of applying an adhesive (441) in which conductive particles (442) are dispersed on the release film (601) using a device such as a comma coater.

[0121] In various embodiments, a coating layer (602) (e.g., a silicone material coating) having low interfacial energy with respect to the adhesive (441) is formed on the release film (601), so that the release film (601) and the adhesive (441) can be easily separated when the release film (601) is removed in a removal operation.

[0122] In various embodiments, the conductive particles (442) dispersed in the adhesive (441) can cause the adhesive (441) to agglomerate to have an uneven thickness on the release film (601). For example, since the release film (601) has low interfacial energy with respect to the adhesive (441) and the conductive particles (442) have relatively high interfacial energy, the release film (601) can agglomerate around the conductive particles (442). Accordingly, a recessed region (440a) and a non-recessed region (440b) having different amounts of adhesive (441) applied can be formed in the conductive adhesive layer (440). In various embodiments, the conductive particles (442) can have a particle size of 2 micrometers or less based on D50 (median particle size) to promote agglomeration of the adhesive (441).

[0123] Referring to FIG. 8C, in various embodiments, the coating layer (602) of the release film (601) may have a defect area (602a). The defect area (602a) may be an area where a defect (e.g., damage, denaturation, and / or at least partial removal of the film) is formed in a portion of the coating layer (602) by the adhesive (441). The defect may be generated by means such as, for example, laser, heat, and / or corona discharge. Since the defect area (602a) has a higher interfacial energy with respect to the adhesive (441) than the coating layer (602), when the adhesive (441) is applied on the release film including the defect area (602a), the adhesive (441) may clump around the defect area (602a). Accordingly, the arrangement of the recessed area (440a) of the conductive adhesive layer (440) can be adjusted through the arrangement of the defective area (602a). For example, by adjusting the arrangement of the defective area (602a) of the release paper, the recessed area (440a) can be formed in a portion of the conductive adhesive layer (440) that overlaps the area (430a) where the warp and weft yarns of the conductive woven layer (430) intersect.

[0124] Referring to FIG. 8D, in various embodiments, the adhesive (441) and the conductive particles (442) may be applied onto the release film (601) by the roller (603). For example, the roller (603) includes a groove (604) that accommodates the adhesive (441) in which the conductive particles (442) are dispersed, and the adhesive (441) and the conductive particles (442) may be applied to a specific position on the release film (601) by the roller (603) in which the groove (604) is formed. Therefore, the position at which the recessed region (440a) of the conductive adhesive layer (440) is formed can be adjusted by arranging the groove (604) of the roller (603). For example, a recessed area (440a) can be formed in a portion of the conductive adhesive layer (440) that overlaps the area (430a) where the warp and weft yarns of the conductive woven layer (430) intersect.

[0125] An electronic device according to various embodiments of the present invention may include a display (330) configured to output image information on a surface facing a first direction. The electronic device may include a conductive contact member (401) disposed on a surface of the display (330) facing in a direction opposite to the first direction. The conductive contact member (401) may include a conductive woven layer (430) including woven conductive fibers (431). The conductive contact member (401) may be disposed on one surface of the conductive woven layer (430) such that a recessed area (440a) is formed, and may include a conductive adhesive layer (440) including an adhesive (441) and conductive particles (442). The recessed area (440a) may have 10% or less of the adhesive (441) compared to a non-recessed area (440b) of the conductive adhesive layer (440).

[0126] In various embodiments, the conductive adhesive layer (440) may have an area ratio occupied by the recessed region (440a) of 30% to 70% when viewed in the first direction.

[0127] In various embodiments, the recessed region (440a) may have 70% or less of the conductive particles per unit area compared to the non-recessed region (440b).

[0128] In various embodiments, the recessed area (440a) may be a crater formed by a roller (603) having a groove (604).

[0129] In various embodiments, the sunken areas (440a) may be separated from each other by the non-sunken areas (440b).

[0130] In various embodiments, the conductive contact member (401) may be configured to have a surface resistance of 200 milliohm / mm² or less when a pressure of 25 gf / mm² is applied in the first direction.

[0131] In various embodiments, the conductive woven layer (430) may include weft fibers (432) and warp fibers (433) that intersect the weft fibers (432) at an angle.

[0132] The conductive woven layer (430) may include a gap (430b) formed between the weft fibers (432) and the warp fibers (433). The adhesive layer may be configured so that the adhesive (441) penetrates into the gap (430b) when pressure is applied to the one surface of the conductive woven layer (420).

[0133] In various embodiments, the recessed area (440a) is positioned to at least partially overlap the area (430a) where the weft fibers (432) and the warp fibers (433) intersect,

[0134] The second region (440b) may be positioned to at least partially overlap the gap (430b).

[0135] In various embodiments, the conductive adhesive layer (440) may further include a conductive nonwoven fabric (443). The conductive woven layer (420) may form direct electrical contact with the conductive nonwoven fabric (443) in an area where the weft fibers (432) and the warp fibers (433) intersect when pressure is applied to the one surface.

[0136] In various embodiments, the thickness of the conductive adhesive layer (440) may be 7 micrometers or greater.

[0137] A conductive contact member (401) according to various embodiments of the present invention may include a conductive woven layer (430) including conductive fibers (431) woven so as to intersect each other.

[0138] The conductive contact member (401) is disposed on one side of the conductive woven layer (430) so that a recessed area (440a) is formed, and may include a conductive adhesive layer (440) including an adhesive (441) and conductive particles (442).

[0139] The above-mentioned sunken area (440a) may have 10% or less of the adhesive (441) compared to the non-sunken area (440b) of the conductive adhesive layer (440).

[0140] In various embodiments, the conductive adhesive layer (440) may have an area ratio occupied by the recessed region (440a) of 30% to 70% when viewed in the first direction.

[0141] In various embodiments, the recessed region (440a) may have 70% or less of the conductive particles per unit area compared to the non-recessed region (440b).

[0142] In various embodiments, the recessed area (440a) may be a crater formed by a roller (603) having a groove (604).

[0143] In various embodiments, the sunken areas (440a) may be separated from each other by the non-sunken areas (440b).

[0144] In various embodiments, the conductive contact member (401) may be configured to have a surface resistance of 200 milliohm / mm² or less when a pressure of 25 gf / mm² is applied in the first direction.

[0145] In various embodiments, the conductive woven layer (430) may include weft fibers (432) and warp fibers (433) that intersect the weft fibers (432) at an angle.

[0146] The conductive woven layer may include a gap (430b) formed between the weft fibers (432) and the warp fibers (433). The conductive adhesive layer (440) may be configured so that when pressure is applied to the one surface of the conductive woven layer (420), the adhesive (441) penetrates into the gap (430b).

[0147] In various embodiments, the recessed area (440a) is positioned to at least partially overlap the area (430a) where the weft fibers (432) and the warp fibers (433) intersect,

[0148] The second region (440b) may be positioned to at least partially overlap the gap (430b).

[0149] In various embodiments, the conductive adhesive layer (440) further includes a conductive nonwoven fabric (443), and the conductive woven layer (420) can form direct electrical contact with the conductive nonwoven fabric (443) in an area where the warp fibers (433) and the weft fibers (432) intersect when pressure is applied to the one surface.

[0150] In various embodiments, the thickness of the conductive adhesive layer (440) may be 7 micrometers or greater.

[0151] A method for manufacturing a conductive contact member (401) according to various embodiments of the present invention may include a coating operation (501) of coating an adhesive (441) and conductive particles (442) on a release film (601).

[0152] The method for manufacturing the conductive contact member (401) may include an attachment operation (502) of attaching the release film (601), the adhesive (441), and the conductive particles (442) onto a conductive woven layer (430).

[0153] The method for manufacturing the conductive contact member (401) may include a removal operation (503) of removing the release film (601) from the conductive woven layer (430).

[0154] The above-mentioned heterogeneous film (601) may include a coating layer (602) configured to cause the applied adhesive (441) to clump together unevenly.

[0155] In various embodiments, the conductive particles (442) may have a particle size of 2 micrometers or less based on D50.

[0156] In various embodiments, the heterogeneous film (601) may have a defect formed in a portion of the coating layer (602).

[0157] In various embodiments, the applying operation (501) may include applying the adhesive (441) and the conductive particles (442) onto the release film (601) by a roller (603) having grooves (604) formed to accommodate the adhesive (441) and the conductive particles (442).

[0158] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, A display (330) configured to output image information on a surface facing the first direction; and A conductive contact member (401) is disposed on a surface of the display (330) facing in the opposite direction to the first direction, The above-mentioned challenging contact member (401) is A conductive woven layer (430) comprising woven conductive fibers (431); A conductive adhesive layer (440) is disposed on one side of the conductive woven layer (430) so that a sunken area (440a) is formed, and includes an adhesive (441) and conductive particles (442). An electronic device in which the above-mentioned recessed area (440a) has 10% or less of the adhesive (441) compared to the non-recessed area (440b) of the above-mentioned conductive adhesive layer (440).

2. In paragraph 1, The above-mentioned challenging adhesive layer (440) is An electronic device in which the area ratio occupied by the sunken area (440a) is 30% to 70% when viewed from the first direction.

3. In paragraph 1, An electronic device in which the above-depressed region (440a) has 70% or less of the conductive particles per unit area compared to the non-depressed region (440b).

4. In paragraph 1, An electronic device in which the above-mentioned sunken area (440a) is a crater formed by a roller (603) having a groove (604).

5. In paragraph 1, An electronic device in which the above-mentioned sunken areas (440a) are separated from each other by the above-mentioned non-sunken areas (440b).

6. In paragraph 1, The above-mentioned challenging contact member (401) is An electronic device configured to have a surface resistance of 200 milliohms / mm² or less when a pressure of 25 gf / mm² is applied to the first direction.

7. In paragraph 1, The above challenging woven layer (430) is Seed fiber (432); Warp fibers (433) intersecting the above weft fibers (432) at an angle; and Including a gap (430b) formed between the above weft fibers (432) and the above warp fibers (433), An electronic device in which the conductive adhesive layer (440) is configured such that when pressure is applied to one surface of the conductive woven layer (420), the adhesive (441) penetrates into the gap (430b).

8. In paragraph 7, The above-mentioned sunken area (440a) is positioned to at least partially overlap with the area (430a) where the above-mentioned weft fibers (432) and the above-mentioned warp fibers (433) intersect, An electronic device wherein the second region (440b) is positioned to at least partially overlap the gap (430b).

9. In paragraph 7, The above conductive adhesive layer (440) further includes a conductive nonwoven fabric (443), An electronic device in which the conductive woven layer (420) forms direct electrical contact with the conductive nonwoven fabric (443) in the area where the weft fibers (432) and the warp fibers (433) intersect when pressure is applied to the one surface.

10. In paragraph 1, An electronic device wherein the thickness of the above-mentioned challenging adhesive layer (440) is 7 micrometers or more.

11. As a challenging contact absence (401), A conductive woven layer (430) comprising conductive fibers (431) woven so as to intersect each other; and A conductive adhesive layer (440) is disposed on one side of the conductive woven layer (430) so that a sunken area (440a) is formed, and includes an adhesive (441) and conductive particles (442). A conductive contact member having the adhesive (441) in the recessed area (440a) of 10% or less compared to the non-recessed area (440b) of the conductive adhesive layer (440).

12. In paragraph 11, The above challenging woven layer (430) is Seed fiber (432); Warp fibers (433) intersecting the above weft fibers (432) at an angle; and Including a gap (430b) formed between the above weft fibers (432) and the above warp fibers (433), The conductive adhesive layer (440) is a conductive contact member configured such that when pressure is applied to the one surface of the conductive woven layer (420), the adhesive (441) penetrates into the gap (430b).

13. In a method for manufacturing a challenging contact member (401), An application operation (501) of applying an adhesive (441) and conductive particles (442) on a heteromorphic film (601); An attachment operation (502) of attaching the above-mentioned heteromorphic film (601), the adhesive (441) and the conductive particles (442) onto a conductive woven layer (430); Including a removal operation (503) for removing the release film (601) from the above-mentioned challenging woven layer (430), A method for manufacturing a conductive contact member (401), wherein the above-mentioned heterogeneous film (601) includes a coating layer (602) configured to cause the applied adhesive (441) to clump together unevenly.

14. In paragraph 13, A method for manufacturing a conductive contact member (401), wherein a defect is formed in a part of the coating layer (602) of the above-mentioned heteromorphic film (601).

15. In paragraph 13, The above application operation (501) is: A method for manufacturing a conductive contact member (401), comprising an operation of applying the adhesive (441) and the conductive particles (442) onto the release film (601) by a roller (603) having a groove (604) formed to accommodate the adhesive (441) and the conductive particles (442).

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