Heat dissipation film, display module and display apparatus

Abstract

Disclosed in the present disclosure are a heat dissipation film, a display module and a display apparatus. The heat dissipation film (100) comprises: a metal layer (130), an adhesive layer (110), and functional layers (120) located between the metal layer (130) and the adhesive layer (110), wherein the adhesive layer (110) has charge conduction performance, and the functional layers (120) have stress buffering performance; and on at least one side of the heat dissipation film (100), an edge of at least one functional layer (120) is retracted relative to an edge of the adhesive layer (110), such that after the heat dissipation film (100) is attached to a back film (101), the metal layer (130) comes into contact with the adhesive layer (110) on the at least one side.

Description

Heat dissipation film, display module and display device CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to Chinese patent application No. 202410077514.0, filed on January 18, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure belongs to the field of display technology and relates to a heat dissipation film, a display module and a display device. Background Art

[0003] In recent years, flexible display modules have developed rapidly and are widely used in various display products, such as curved mobile phones, curved TVs, and curved displays. However, shortly after the launch of these curved display products, low-grayscale display anomalies, such as greenish and shiny colors, began to appear, hindering their widespread market adoption. Research has found that during the use of display modules, the surface of protective layers (such as cover glass) may generate static electricity due to friction and other factors. This static electricity is then transferred and accumulated in the backing film, generating an electrostatic field within the display module, affecting transistor characteristics and potentially causing these low-grayscale display anomalies. Summary of the Invention

[0004] In a first aspect of the present disclosure, a heat dissipation film is provided for bonding to a back film of a display panel, the heat dissipation film comprising: a metal layer, an adhesive layer, and a functional layer located between the metal layer and the adhesive layer, the adhesive layer having charge conduction properties, and the functional layer having stress buffering properties; on at least one side of the heat dissipation film, an edge of at least one of the functional layers is retracted relative to an edge of the adhesive layer, so that after the heat dissipation film is bonded to the back film, the metal layer and the adhesive layer are in contact on at least one side.

[0005] In combination with the first aspect of the present disclosure, in some embodiments, there are multiple functional layers, and the multiple functional layers include: a foam layer and a support layer arranged in a stacked manner, the foam layer is arranged on the side of the adhesive layer close to the metal layer, and the support layer is arranged on the side of the foam layer away from the adhesive layer; on at least one side of the heat dissipation film, the edge of the support layer and the edge of the metal layer are retracted relative to the edge of the adhesive layer.

[0006] In combination with the first aspect of the present disclosure, in some embodiments, on at least one side of the heat dissipation film, along a direction perpendicular to the surface of the heat dissipation film, the edge of the support layer is flush with the edge of the metal layer, and the edge of the foam layer is flush with the edge of the adhesive layer.

[0007] In combination with the first aspect of the present disclosure, in some embodiments, on at least one side of the heat dissipation film, the edge of the foam layer is retracted relative to the edge of the adhesive layer; the edges of the support layer and the metal layer are retracted by a first distance relative to the edge of the adhesive layer, and the edge of the foam layer is retracted by a second distance relative to the edge of the adhesive layer, and the second distance is less than or equal to the first distance.

[0008] In combination with the first aspect of the present disclosure, in some embodiments, the first distance is greater than 150 micrometers and less than or equal to 250 micrometers.

[0009] In combination with the first aspect of the present disclosure, in some embodiments, the adhesive layer includes: a first main body and a first bending portion connected to the first main body, the first main body is parallel to the functional layer, the first bending portion is bent toward the metal layer relative to the first main body, covers the side of the functional layer, and the end of the first bending portion away from the first main body is in contact with the metal layer; or, the metal layer includes: a second main body and a second bending portion connected to the second main body, the second main body is parallel to the functional layer, the second bending portion is bent toward the adhesive layer relative to the second main body, covers the side of the functional layer, and the end of the second bending portion away from the second main body is in contact with the adhesive layer.

[0010] In conjunction with the first aspect of the present disclosure, in some embodiments, the resistance of the adhesive layer is 10 4 ~10 5 Europe.

[0011] In combination with the first aspect of the present disclosure, in some embodiments, the thickness of the adhesive layer along a direction perpendicular to the surface of the heat dissipation film is 25 to 35 micrometers.

[0012] In a second aspect of the present disclosure, a display module is provided, comprising: a display panel; a backing film disposed on the backlight side of the display panel; and the heat dissipation film provided in the first aspect of the present disclosure. The heat dissipation film has an adhesive layer attached to a side of the backing film away from the display panel, and the adhesive layer contacts a metal layer on at least one side of the heat dissipation film.

[0013] In combination with the second aspect of the present disclosure, in some embodiments, the display panel has a curved side, at least one side of the heat dissipation film is a side opposite to the curved side, and the adhesive layer covers the side of the functional layer of the heat dissipation film and contacts the metal layer.

[0014] In combination with the second aspect of the present disclosure, in some embodiments, the adhesive layer has an overflow portion, which covers the side of the functional layer and contacts the metal layer, wherein the overflow portion is formed by squeezing the adhesive layer during the bonding process.

[0015] In combination with the second aspect of the present disclosure, in some embodiments, the functional layer of the heat dissipation film includes: a foam layer and a support layer arranged in a stacked manner; the edge of the support layer is retracted relative to the edges of the foam layer and the metal layer, and the overflow portion covers the side surfaces of the foam layer and the support layer and contacts the metal layer.

[0016] In combination with the second aspect of the present disclosure, in some embodiments, the adhesive layer has an overlapping portion, which is a portion extending beyond the edge of other film layers of the heat dissipation film. The overlapping portion covers the side of the functional layer and contacts the metal layer.

[0017] In combination with the second aspect of the present disclosure, in some embodiments, the functional layer of the heat dissipation film includes: a foam layer and a support layer arranged in a stacked manner, the edge of the support layer extends beyond the edge of the foam layer, the edge of the metal layer extends beyond the edge of the support layer, and the overlapping portion covers the sides of the foam layer and the support layer and contacts the metal layer.

[0018] In combination with the second aspect of the present disclosure, in some embodiments, at least one side of the heat dissipation film is any one or more sides of the heat dissipation film, and the adhesive layer includes: a first main body and a first bending portion connected to the first main body, the first main body is parallel to the functional layer of the heat dissipation film, the first bending portion is bent toward the metal layer relative to the first main body, covering the side of the functional layer, and the end of the first bending portion away from the first main body is in contact with the metal layer; the first main body is attached to the side of the back film away from the display panel.

[0019] In conjunction with the second aspect of the present disclosure, in some embodiments, at least one side of the heat dissipation film is any one or more sides of the heat dissipation film, and the metal layer includes: a second main body portion and a second bent portion connected to the second main body portion, the second main body portion being parallel to the functional layer to which it is connected, and the second bent portion being bent relative to the second main body portion toward the adhesive layer, covering the side surface of the functional layer. The adhesive layer includes: a first adhesive region and a second adhesive region, the first adhesive region being the region bonded to the functional layer, the second adhesive region being located outside the first adhesive region, one side of the second adhesive region being bonded to the back film, and the other side being in contact with an end of the second bent portion that is away from the second main body portion.

[0020] In a third aspect of the present disclosure, a display device is provided, comprising: the display module provided in the second aspect above.

[0021] The above description is only an overview of the technical solutions provided by some embodiments of the present disclosure. In order to more clearly understand the technical means of the embodiments of the present disclosure, they can be implemented in accordance with the contents of the specification. In order to make the embodiments of the present disclosure more obvious and easy to understand, the specific implementation methods of the embodiments of the present disclosure are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] To more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0023] FIG1 shows a schematic structural diagram of an exemplary display module;

[0024] FIG2 shows a schematic diagram of the target side structure of a heat dissipation film according to some embodiments of the present disclosure;

[0025] FIG3 shows a schematic diagram of the target side structure of a heat dissipation film according to other embodiments of the present disclosure;

[0026] FIG4 shows a schematic diagram of the target side structure of a heat dissipation film according to some other embodiments of the present disclosure;

[0027] FIG5 shows a schematic diagram of the target side structure of a heat dissipation film according to some further embodiments of the present disclosure;

[0028] FIG6 shows a schematic diagram of the target side structure of a heat dissipation film according to some other embodiments of the present disclosure;

[0029] FIG7 shows a schematic diagram of attaching the heat dissipation film and the back film shown in FIG2 ;

[0030] FIG8 shows a schematic diagram of a partial structure of a display module according to some embodiments of the present disclosure;

[0031] FIG9 shows a schematic plan view of a display panel according to some embodiments of the present disclosure;

[0032] FIG10 shows a micrograph of a display module using the heat dissipation film shown in FIG2 ;

[0033] FIG11 is a schematic diagram showing a partial structure of a display module according to other embodiments of the present disclosure;

[0034] FIG12 is a schematic diagram showing a partial structure of a display module according to yet other embodiments of the present disclosure;

[0035] FIG13 is a schematic diagram showing a partial structure of a display module according to some further embodiments of the present disclosure; and

[0036] FIG14 shows a schematic structural diagram of a display device according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0037] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0038] It should be noted that the term "plurality" used herein includes two or more than two. "At least one" includes one or more than one. "Include" or "comprising" and similar expressions mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, but do not exclude other elements or objects. "Up," "down," "left," "right," etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0039] The terms "parallel", "perpendicular", and "equal" appearing in this document include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0040] It will be understood that in exemplary embodiments of the present disclosure, when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or there may be an intervening layer between the layer or element and the other layer or substrate.

[0041] Figure 1 shows a schematic diagram of the structure of an exemplary display module. As shown in Figure 1, the display module may include a display panel PNL, a back film BL, and a heat dissipation film SL. The back film BL is arranged on the backlight side of the display panel PNL, and the heat dissipation film SL is attached to the side of the back film BL away from the display panel PNL. The organic film materials of a display module such as an OLED mobile phone module are all polar materials. For example, the base material of the back film SL, such as PET (Polyethylene Terephthalate), is a highly polar material with a static polarization effect. It interacts with the power signal line Vss, resulting in a strong edge electric field E of the product. Furthermore, for curved display products, after the display module's 3D lamination process, the outer film material of the display panel PNL, such as the back film BL, typically extends beyond the edge of the display panel PNL. This increases the dielectric constant at the edge of the display module, thereby increasing the strength of the fringe electric field E. This pushes the charge in the display panel PNL's base substrate toward the transistor gate, opening the transistor channel and causing the abnormal area to appear brighter at low grayscale displays. Due to the stable retention of the back film BL's substrate after polarization, the electric field persists even after the static charge Q on the cover glass CG surface is eliminated.

[0042] In light of this, the inventors modified the heat dissipation film's film structure to release the charge accumulated in the backing film, thereby reducing the electrostatic field within the display module and improving the problem of abnormal low-grayscale display (such as bright and green tint) in curved display products. The following, combined with the accompanying drawings, provides a detailed description of the heat dissipation film, display module, and display device provided by some embodiments of the present disclosure.

[0043] Some embodiments of the present disclosure provide a heat dissipation film, which is used to be bonded to the back film of a display panel. In some embodiments, the display panel can be a flexible display panel having at least one curved side. Taking the application in a curved screen mobile phone as an example, the two opposite long sides of the display panel can be curved sides. The heat dissipation film can dissipate heat and buffer stress for the display panel. In some embodiments, the heat dissipation film can be a super clean foam (SCF) composite film.

[0044] The heat dissipation film has a multi-layer laminated structure. In some embodiments, the heat dissipation film may include: a metal layer, an adhesive layer, and a functional layer located between the metal layer and the adhesive layer. The functional layer has stress buffering properties, capable of buffering external stress and impact applied to the display panel. There may be one or more functional layers. During use, the heat dissipation film is attached to the backing film provided on the backlight side of the display panel via the adhesive layer. Since both the adhesive layer and the backing film are made of flexible materials, this helps avoid mold imprints and ensures a high-quality fit.

[0045] On at least one side of the heat dissipation film, the edge of at least one functional layer is recessed relative to the edge of the adhesive layer, so that after the heat dissipation film is bonded to the backing film, the metal layer and the adhesive layer are in contact on at least one of these sides. Because the heat dissipation film is attached to the backing film via the adhesive layer, and the adhesive layer has charge-conducting properties, the adhesive layer's contact with the metal layer can conduct static charges accumulated in the backing film to the metal layer. The metal layer is grounded in the display device, for example, by connecting it to the product housing through a conductive structure. This allows for the release of static charges, thereby reducing the electrostatic field within the display module and improving the problem of abnormal low-grayscale display in curved display products. Furthermore, the functional layer of the heat dissipation film typically has a relatively large dielectric constant, so recessing at least one functional layer helps reduce the edge electric field strength. Compared to methods such as applying a conductive liquid to achieve charge conduction and release, this method eliminates the need for additional equipment and processes, resulting in lower costs. Compared to directly contacting the metal layer of the heat dissipation film with the backing film, it helps reduce mold imprint and ensures bonding quality.

[0046] It should be noted that the above-mentioned "at least one side of the heat dissipation film" can be one side, two sides, three sides or four sides of the heat dissipation film, etc., and can be set according to the needs of the actual product. In some embodiments, the above-mentioned "at least one side" can also be determined according to the shape of the adapted display panel and the number of curved sides. For example, the display panel adapted to the heat dissipation film is square, including a first side, a second side, a third side and a fourth side adjacent to each other in sequence, wherein the first side and the third side are arranged opposite to each other, and both are curved sides of the display panel. Correspondingly, the heat dissipation film is also a square film, and the above-mentioned at least one side is two sides, and the two sides are opposite sides, adapted to the first side and the third side respectively. For the sake of convenience of explanation, the above-mentioned "at least one side of the heat dissipation film" will be referred to as the target side of the heat dissipation film hereinafter.

[0047] In some embodiments, the heat dissipation film is used in curved display products where the display panel has a curved side. The target side can be the side of the heat dissipation film directly opposite the curved side. During the 3D lamination process of the display module, the target side of the heat dissipation film bends along the curved side of the display panel. After the 3D lamination process is complete, the adhesive layer of the heat dissipation film contacts the metal layer on the target side, enabling electrostatic charge conduction between the two.

[0048] In some embodiments, the functional layer may include a foam layer, which is disposed on the side of the adhesive layer close to the metal layer. For example, the foam layer may be made of polyurethane (PU) or other suitable materials. In some embodiments, the resistance of the foam layer may be approximately 10 10 Europe, the thickness can be about 80 microns.

[0049] In some embodiments, there are multiple functional layers between the adhesive layer and the metal layer. In addition to the above-mentioned foam layer, it can also include: a support layer, which is arranged on the side of the foam layer close to the metal layer to provide support and impact resistance. In some embodiments, the support layer can be black to enhance the integrated black effect of the product. In some embodiments, the support layer can be a black PI (Polyimide) layer or other applicable support layer materials can be used. In some embodiments, the resistance of the support layer can be about 10 10 Of course, in other embodiments, other functional layers may be included between the adhesive layer and the metal layer, which may be provided according to actual needs, and the present disclosure does not limit this.

[0050] In some embodiments, the adhesive layer may be made of embossing (EMBO) or other applicable adhesive materials. The mesh adhesive can reduce the bubbles generated when the foam layer and the display panel are bonded to each other, thereby enhancing the connection strength between the heat dissipation film and the display panel. Of course, the unused heat dissipation film may also include a protective film (also referred to as a bottom protective film), which is attached to the side of the adhesive layer away from the metal layer to protect the adhesive layer. When in use, the protective film needs to be peeled off first and then attached to the back film of the display panel.

[0051] It is understandable that the adhesive layer of traditional heat dissipation films usually uses a high impedance material, with a resistance of about 10 9 In some embodiments, the adhesive layer can be made of a material with relatively low impedance and adhesive properties, for example, a material with relatively low impedance (such as a resistance of about 10 4 Alternatively, a low-impedance adhesive layer can be formed by adding conductive materials such as carbon nanotubes or metal nanoparticles to the adhesive layer material of a traditional heat dissipation film, so that the adhesive layer has charge conduction properties. In some embodiments, the resistance of the adhesive layer can be 10 4 ~10 5 Europe, such as 10 4 Euro or 10 5 Europe, etc.

[0052] In some embodiments, the thickness of the adhesive layer in a direction perpendicular to the surface of the heat dissipation film can be 25 to 35 microns, for example, 25 microns, 30 microns, or 35 microns. The adhesive layer thickness of conventional heat dissipation films is approximately 50 to 70 microns. By reducing the thickness of the adhesive layer, the impedance of the adhesive layer can be further reduced, thereby improving the charge conduction performance of the adhesive layer, thereby better conducting the static charge accumulated in the back film to the metal layer for release.

[0053] The metal layer has heat dissipation and electrical conductivity. In some embodiments, the material of the metal layer may include copper. Of course, in other embodiments, the metal layer may also be made of other applicable metal materials such as aluminum, and this disclosure does not limit this.

[0054] Figure 2 illustrates a schematic diagram of the target-side structure of a heat dissipation film according to some embodiments of the present disclosure. As shown in Figure 2 , the heat dissipation film 100 may include an adhesive layer 110, a foam layer 121, a support layer 122, and a metal layer 130, stacked in sequence. Both the foam layer 121 and the support layer 122 are the aforementioned functional layers 120 of the heat dissipation film 100. The adhesive layer 110 is located on the side of the foam layer 121 away from the metal layer 130, while the support layer 122 is located on the side of the foam layer 121 closer to the metal layer 130. In some embodiments, the metal layer 130 and the support layer 122 may be bonded using a pressure-sensitive adhesive (PSA).

[0055] In some embodiments, on the target side of the heat dissipation film 100 , the edge of the support layer 122 and the edge of the metal layer 130 are retracted relative to the edge of the adhesive layer 110 , so that the edge of the adhesive layer 110 exceeds the edge of the support layer 122 , as shown in FIG. 2 .

[0056] During the 3D curved surface lamination process, the target side of the heat dissipation film 100 bends along with the curved side of the display panel 200. Pressure applied by the back film 101 to the heat dissipation film 100 causes the film layers to shift. Furthermore, the adhesive layer 110 is a glue layer with a certain degree of fluidity, making it prone to glue overflow under pressure. The heat dissipation film 100 structure shown in Figure 2 cleverly utilizes the shifting of the heat dissipation layers and the glue overflow of the adhesive layer 110 under the pressure of the back film 101 and foam layer 121 to achieve overlapping bonding between the adhesive layer 110 and the metal layer 130.

[0057] For ease of explanation, the retracted distance of the support layer 122 and the metal layer 130 relative to the adhesive layer 110 in Figure 2 is referred to as the first distance d1. The first distance d1 can be set according to the needs of the actual product. During the 3D bonding process, the adhesive layer 110 and the metal layer 130 can be overlapped by the overflow of the adhesive layer 110 and the staggered layers of the film layers in the heat dissipation film 100. This is not limited in the present disclosure. After DOE (Design Of Experiment) verification, in some embodiments, the first distance d1 can be greater than 150 microns and less than or equal to 250 microns. For example, it can be 160 microns, 180 microns, 200 microns, 220 microns, or 250 microns.

[0058] In some embodiments, as shown in FIG. 2 , on the target side of the heat dissipation film 100 , along a direction perpendicular to the surface of the heat dissipation film 100 , the edge of the support layer 122 is flush with the edge of the metal layer 130 to facilitate processing.

[0059] In some embodiments, as shown in FIG2 , on the target side of the heat dissipation film 100, the edge of the foam layer 121 is flush with the edge of the adhesive layer 110. This allows the back film 101 and the foam layer 121 to squeeze the adhesive layer 110 from opposite sides during lamination, resulting in a relatively ideal overflow of the adhesive layer 110 sufficient for overlapping with the metal layer 130. In other embodiments, on the target side of the heat dissipation film 100, the edge of the foam layer 121 is also retracted relative to the edge of the adhesive layer 110. This reduces obstruction between the edge of the adhesive layer 110 and the metal layer 130, facilitating that the portion of the edge of the adhesive layer 110 protruding from the functional layer 120 is brought closer to the metal layer 130 during lamination, thereby achieving overlapping with the metal layer 130.

[0060] The edge of the foam layer 121 is retracted relative to the edge of the adhesive layer 110 by a second distance d2. In some embodiments, the second distance d2 can be less than or equal to the first distance d1. In other words, the edge of the foam layer 121 can be flush with the edges of the support layer 122 and the metal layer 130, or can be located between the edge of the support layer 122 and the edge of the adhesive layer 110.

[0061] FIG3 shows a schematic diagram of the target side structure of the heat dissipation film 100 according to other embodiments of the present disclosure. As shown in FIG3 , on the target side of the heat dissipation film 100, along a direction perpendicular to the surface of the heat dissipation film 100, the edges of the foam layer 121, the edge of the support layer 122, and the edge of the metal layer 130 are flush, that is, the second distance d2 is equal to the first distance d1. In this way, the portion of the adhesive layer 110 that extends beyond the edge of the metal layer 130 is essentially unobstructed on the side away from the back film 101 and can be used as an overlapping portion 114 to overlap the metal layer 130. During the 3D bonding process of the display module 10, the film layers on the target side of the heat dissipation film 100 will be misaligned due to bending, causing the overlapping portion 114 of the adhesive layer 110 to be close to the edge of the metal layer 130. In addition, due to the overflow of glue caused by the pressure on the adhesive layer 110, the adhesive layer 110 and the metal layer 130 can be overlapped.

[0062] Figure 4 illustrates a schematic diagram of the target-side structure of a heat dissipation film 100 according to yet other embodiments of the present disclosure. As shown in Figure 4 , on the target side of the heat dissipation film 100, the edge of the foam layer 121 is retracted relative to the edge of the adhesive layer 110, and the support layer 122 is flush with the edge of the metal layer 130 and retracted relative to the edge of the foam layer 121. This means that the second distance d2 can also be smaller than the first distance d1.

[0063] In other embodiments, the adhesive layer 110 or the metal layer 130 may be designed with a special shape on at least one side of the heat dissipation film 100, so that the adhesive layer 110 and the metal layer 130 in the heat dissipation film 100 are overlapped before being bonded, which is beneficial to ensure the reliability of the overlap between the two.

[0064] FIG5 shows a schematic diagram of the target side structure of the heat dissipation film 100 according to some further embodiments of the present disclosure. As shown in FIG5 , the adhesive layer 110 includes: a first main body portion 111 and a first bending portion 112 connected to the first main body portion 111. The first main body portion 111 is parallel to the functional layer 120, such as the foam layer 121 mentioned above. The first bending portion 112 is bent toward the metal layer 130 relative to the first main body portion 111, covering the side surfaces of each functional layer 120. The end of the first bending portion 112 away from the first main body portion 111 is in contact with the metal layer 130. By performing a special-shaped design on the adhesive layer 110, the adhesive layer 110 and the metal layer 130 are overlapped to provide a release path for static charge.

[0065] FIG6 shows a schematic diagram of the target side structure of the heat dissipation film 100 according to some other embodiments of the present disclosure. As shown in FIG6 , the metal layer 130 includes: a second main body portion 131 and a second bent portion 132 connected to the second main body portion 131. The second main body portion 131 is parallel to the functional layer 120, such as the support layer 122 described above. The second bent portion 132 is bent toward the adhesive layer 110 relative to the second main body portion 131, covering the side surfaces of each functional layer 120. The end of the second bent portion 132 away from the second main body portion 131 is in contact with the adhesive layer 110. By designing the metal layer 130 with a special shape, the adhesive layer 110 and the metal layer 130 are overlapped to provide a release path for static charge.

[0066] As shown in Figures 5 and 6 , the edges of each functional layer 120 (such as the foam layer 121 and the support layer 122) located between the adhesive layer 110 and the metal layer 130 can be flush and recessed relative to the metal layer 130 and the adhesive layer 110. In the embodiment corresponding to Figure 5 , the metal layer 130 has a protrusion 1301 protruding from the edge of the functional layer 120. The first bent portion 112 of the adhesive layer 110 covers the side surfaces of each functional layer 120 and contacts the side of the protrusion 1301 facing the adhesive layer 110. In the embodiment corresponding to Figure 6 , the adhesive layer 110 can include a first adhesive region 1101 and a second adhesive region 1102. The first adhesive region 1101 is the region bonded to the functional layer 120, and the second adhesive region 1102 is the region outside the first adhesive region 1101. One side of the second adhesive region 1102 is configured to be bonded to the back film 101 , and the other side is in contact with an end of the second bending portion 132 away from the second main body portion 131 .

[0067] The first bent portion 112 and the second bonding area 1102 have inherent bonding properties. Contact between the first bent portion 112 and the protruding portion 1301, or contact between the end of the second bent portion 132 away from the second main portion 131 and the second bonding area 1102, allows the two to adhere to each other, thereby ensuring the stability of the charge release path. In some embodiments, conductive adhesive or conductive fabric can be applied to the bonding location to further enhance the stability of the charge release path.

[0068] In some embodiments, the size of the heat dissipation film 100 is slightly smaller than that of the back film 101. FIG7 shows a schematic diagram of attaching the heat dissipation film 100 and the back film 101 shown in FIG2 . As shown in FIG7 , before the 3D bonding process is performed, the edge of the adhesive layer 110 is retracted compared to the edge of the back film 101, and the retracted distance D can be greater than 0 and less than 300 microns, for example, it can be 100 microns, 200 microns, or 250 microns. The smaller the retracted distance D of the heat dissipation film 100 compared to the back film 101, the easier it is for the various film layers of the heat dissipation film 100 to contact each other when the display module 10 is subjected to the 3D bonding process.

[0069] Figure 8 shows a partial structural diagram of a display module 10 according to some embodiments of the present disclosure. As shown in Figure 8, some embodiments of the present disclosure further provide a display module 10, which includes: a display panel 200, a back film 101, and a heat dissipation film 100 provided in any of the above embodiments.

[0070] It should be noted that, in addition to the above structure, the display module 10 may also include other materials such as the protective layer 220 and the polarizer 210 (POL) shown in Figure 8, which can be determined according to the needs of the actual product. The protective layer 220 is arranged on the light-emitting side of the display panel 200, and the polarizer 210 can be arranged between the display panel 200 and the protective layer 220. In some embodiments, the protective layer 220 can be a cover glass (Cover Glass), and the cover glass can be bonded to the side of the polarizer 210 away from the display panel 200 by a transparent optical adhesive 211 (Optically Clear Adhesive, OCA). Of course, in other embodiments, the protective layer 220 can also be made of other materials such as transparent resin materials and PET (Polyethylene terephthalate), etc., and the present disclosure does not limit this. Taking the use of cover glass as an example, when applied to curved display products, the cover glass is 3D cover glass. At least one side of the cover glass is bent, and the layers of the display module 10 are bonded together through a 3D bonding process.

[0071] FIG9 shows a planar schematic diagram of a display panel 200 according to some embodiments of the present disclosure. As shown in FIG9 , the display panel 200 may include a display area AA and a non-display area SA provided at least on one side of the display area AA. The display area AA includes a plurality of pixels arranged in an array, each pixel including a plurality of sub-pixels, each sub-pixel being able to display a single color, such as a red sub-pixel displaying red, a green sub-pixel displaying green, and a blue sub-pixel displaying blue. The brightness (grayscale) of the sub-pixels of different colors in each pixel can be adjusted, and the display of multiple colors can be achieved by color combination and superposition, thereby realizing full-color display of the display panel 200.

[0072] In some embodiments, the plurality of sub-pixels include three sub-pixels, namely a first sub-pixel, a second sub-pixel, and a third sub-pixel, and the different sub-pixels emit different colors. For example, the first sub-pixel may be a red sub-pixel, the second sub-pixel may be a green sub-pixel, and the third sub-pixel may be a blue sub-pixel. Of course, in other embodiments, each pixel may also include other numbers of sub-pixels, such as four sub-pixels, which can be set according to actual application scenarios, and the present disclosure does not limit this.

[0073] In some embodiments, the display panel 200 is a flexible display panel, for example, it can be an organic light emitting diode (OLED) display panel or a quantum dot organic light emitting diode (QLED), etc., and is specifically set according to the needs of the actual application scenario, and the present disclosure does not impose any restrictions on this.

[0074] In some embodiments, the display panel 200 may include a backplane and a display structure layer stacked on the backplane. In some embodiments, the side of the backplane away from the display structure layer may be the backlight side of the display panel 200, and the side of the display structure layer away from the backplane may be the light-emitting side of the display panel 200.

[0075] In some embodiments, the backplane may include: a base substrate and a pixel driving layer disposed on the base substrate. Of course, the backplane may also include other structures, specifically designed according to actual product needs. For example, the backplane may also include a fingerprint recognition circuit, etc., which is not limited by this disclosure.

[0076] In some embodiments, the base substrate may be a flexible substrate. For example, the flexible substrate may include a PET substrate, a PEN (Polyethylene naphthalate diformic acid glycol ester) substrate, or a PI substrate. It should be noted that the base substrate may have a single-layer structure or a multi-layer structure. For example, the base substrate may include at least one flexible substrate and at least one buffer layer, with the flexible substrates and buffer layers being alternately stacked.

[0077] The pixel driving layer is used to form a plurality of pixel driving circuits distributed in an array. The pixel driving circuit may include a plurality of electronic components such as transistors and capacitors. For example, each pixel driving circuit may include three transistors and one capacitor, forming a 3T1C (i.e., one driving transistor, two switching transistors and one capacitor). It may also include more than three transistors and at least one capacitor, such as a 4T1C (i.e., one driving transistor, three switching transistors and one capacitor), a 5T1C (i.e., one driving transistor, four switching transistors and one capacitor), or a 7T1C (i.e., one driving transistor, six switching transistors and one capacitor), etc. Among them, the transistor may be a thin film transistor (TFT), a metal oxide semiconductor (MOS), or other switching devices with the same characteristics.

[0078] It is understood that a transistor may include a control electrode, a first electrode, and a second electrode. The control electrode is the gate of the transistor, the first electrode is one of the source and drain of the transistor, and the second electrode is the other of the source and drain of the transistor. Since the source and drain of a transistor may be structurally symmetrical, their structures may be identical, and the source of the transistor may be referred to as the first electrode, or may also be referred to as the second electrode.

[0079] In some embodiments, the pixel driving layer may include an active layer, a first gate metal layer (Gate1), a second gate metal layer (Gate2), a first metal wiring layer (SD1) and a second metal wiring layer (SD2), and these film layers are configured to form transistors, capacitors and a plurality of signal lines for pixel driving in the pixel driving circuit. For example, the plurality of signal lines may include: power signal lines, data signal lines, reset signal lines, scan signal lines, enable signal lines and initialization signal lines, etc. For details, please refer to the relevant technology, which will not be described in detail here. The pixel driving layer may also include an insulating layer that separates these film layers. It should be noted that the film layers of the pixel driving layer listed above are only for illustration. In other embodiments, the pixel driving layer may also include more or fewer film layers, for example, more metal wiring layers, which are specifically set according to the needs of the actual product, and the present disclosure does not limit this.

[0080] In some embodiments, the display structure layer may include a light-emitting device layer and an encapsulation layer. The light-emitting device layer is stacked on a side of the pixel driving layer away from the base substrate. The light-emitting device layer may include a pixel definition layer and a plurality of light-emitting devices. The pixel definition layer has a plurality of pixel openings, each of which defines the position of a light-emitting device. For example, the light-emitting device may be an OLED light-emitting device or a QLED light-emitting device.

[0081] Taking an OLED light-emitting device as an example, the light-emitting device may include a first electrode, a light-emitting layer, and a second electrode stacked in sequence in a direction away from the substrate. Of course, the light-emitting device may also include at least one of a hole injection layer, a hole transport layer, and an electron blocking layer disposed between the first electrode and the light-emitting layer, and at least one of an electron injection layer, an electron transport layer, and a hole blocking layer disposed between the second electrode and the light-emitting layer. The specific configurations are determined based on actual needs and are not limited in this disclosure.

[0082] In some embodiments, the first electrode may be an anode, and the second electrode may be a cathode. The structure of the anode may be a composite structure composed of a transparent conductive oxide film / a metal film / a transparent conductive oxide film stacked in sequence. The material of the transparent conductive oxide film may be, for example, any one of ITO (Indium tin oxide) and IZO (Indium zinc oxide), and the material of the metal film may be, for example, any one of gold (Au), silver (Ag), nickel (Ni), and platinum (Pt). For another example, the structure of the anode may also be a single-layer structure, and the material of the single-layer structure may be any one of ITO, IZO, Au, Ag, Ni, and Pt.

[0083] Each pixel opening exposes a portion of the anode of the corresponding light-emitting device, and at least a portion of the light-emitting layer is located within the corresponding pixel opening and is electrically connected to the corresponding anode.

[0084] For example, the cathodes of the light-emitting devices may be electrically connected to form an integrated structure. For example, the cathode material may be any one of aluminum (Al), silver (Ag), and magnesium (Mg), or any one of a magnesium-silver alloy and an aluminum-lithium alloy.

[0085] The encapsulation layer is arranged on the side of the light-emitting device layer away from the base substrate to protect the light-emitting device. In some embodiments, the display panel 200 may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. For example, the first inorganic encapsulation layer and the second inorganic encapsulation layer can be made of inorganic materials such as nitrides, oxides, nitrogen oxides, nitrates, carbides, or any combination thereof, and the preparation process can adopt a chemical vapor deposition (CVD) process, such as a plasma enhanced chemical vapor deposition (PECVD) process. For example, the organic insulating layer can be made of materials such as acrylic, hexamethyldisiloxane, polyacrylates, polycarbonates, polystyrene, etc., and the preparation process can adopt an inkjet printing (IJP) process. Of course, in other examples, other encapsulation methods can also be used, such as inorganic thin film encapsulation, and the present disclosure is not limited to this.

[0086] In some embodiments, the display structure layer may further include a color filter layer, which may be disposed on a side of the encapsulation layer away from the base substrate. In some embodiments, the color filter layer may include: a first color filter unit, a second color filter unit, and a third color filter unit. The first color filter unit, the second color filter unit, and the third color filter unit are color filter units of different colors. The first color filter unit, the second color filter unit, and the third color filter unit may have different thicknesses, or the same thickness, or two of the thicknesses may be the same and the other may be different, and this disclosure is not limited thereto.

[0087] In some embodiments, adjacent color filter units of the color filter layer do not overlap with each other, and the color filter layer further includes a black matrix disposed between adjacent color filter units to absorb ambient light, reduce ambient light reflection from the display panel 200, and achieve a dark state when the screen is off. Of course, in other embodiments, the first color filter unit and the second color filter unit may have a first overlapping area, the second color filter unit and the third color filter unit may have a second overlapping area, and the third color filter unit and the first color filter unit may have a third overlapping area. When two filter units of different colors overlap, the light transmittance of the overlapping area is low, and therefore can be used as a black matrix. In this way, the first overlapping area, the second overlapping area, and the third overlapping area of ​​the display panel 200 can all be used as a black matrix to achieve a light-shielding effect without the need for an additional black matrix.

[0088] In some embodiments, the first color filter unit is a red color filter unit, the second color filter unit is a green color filter unit, and the third color filter unit is a blue color filter unit.

[0089] In some embodiments, the display panel 200 may further include a touch layer for implementing a touch function. In some embodiments, the touch layer may be disposed between the encapsulation layer and the color filter layer to implement an in-screen touch structure, thereby reducing the thickness of the display panel 200. Of course, in other embodiments, the touch layer may also be disposed at other locations on the display panel 200, and this disclosure is not limited thereto.

[0090] The backing film 101 is disposed on the backlight side of the display panel 200, for example, on the side of the base substrate away from the pixel driving layer. The adhesive layer 110 of the heat dissipation film 100 is attached to the side of the backing film 101 away from the display panel 200. On at least one side of the heat dissipation film 100, referred to as the target side of the heat dissipation film 100, the adhesive layer 110 is in contact with the metal layer 130.

[0091] For the heat dissipation films 100 provided in the different embodiments described above, the contact method between the adhesive layer 110 and the metal layer 130 varies slightly. In some embodiments, the display panel 200 has a curved side, and the target side of the heat dissipation film 100 is the side opposite the curved side. For example, the first side 201 and the third side 202 of the display panel 200 in FIG9 are curved sides. Then, the target side of the heat dissipation film 100 includes: the side opposite the first side 201 and the side opposite the third side 202. On the target side of the heat dissipation film 100, the adhesive layer 110 covers the side surfaces of each functional layer 120 of the heat dissipation film 100 and contacts the metal layer 130. It should be noted that, for the heat dissipation film 100 provided in the embodiments corresponding to Figures 2, 3 and 4, before the 3D bonding process, the adhesive layer 110 and the metal layer 130 are in a non-contact state, and the pressure exerted on the curved side of the display panel 200 during bonding is cleverly utilized to achieve contact between the adhesive layer 110 and the metal layer 130 on the target side.

[0092] The display module 10 shown in FIG8 adopts the heat dissipation film 100 shown in FIG2. As shown in FIG8, the adhesive layer 110 has an overflow portion 113, which covers the side surfaces of each functional layer 120 and contacts the metal layer 130. The overflow portion 113 is formed when the adhesive layer 110 is squeezed during the bonding process. The functional layer 120 located between the adhesive layer 110 and the metal layer 130 includes: a foam layer 121 and a support layer 122 that are stacked. Before bonding, on the target side of the heat dissipation film 100, the metal layer 130 of the heat dissipation film 100 is flush with the support layer 122, the foam layer 121 is flush with the adhesive layer 110, and the support layer 122 and the metal layer 130 are retracted relative to the adhesive layer 110. During bonding, the target side of the heat dissipation mold bends along with the curved side of the display panel 200 , and the adhesive layer 110 is squeezed by the back film 101 and the foam layer 121 and overflows from the edge, and approaches the metal layer 130 due to the bending, thereby achieving contact with the metal layer 130 .

[0093] In addition, during the 3D curved surface bonding process, the target side of the heat dissipation film 100 bends along with the curved side of the display panel 200, causing the various film layers of the heat dissipation film 100 to be misaligned on the target side. For example, with the heat dissipation film 100 shown in FIG2 , after the target side is bent, the edge of the support layer 122 retracts relative to the edges of the foam layer 121 and the metal layer 130, as shown in FIG8 . It should be noted that before bonding, the support layer 122 and the metal layer 130 of the heat dissipation film 100 are flush on the target side, as shown in FIG2 ; during bonding, the target side of the heat dissipation film 100 bends along with the curved side of the display panel 200, causing the originally flush support layer 122 and metal layer 130 to be misaligned, causing the edge of the metal layer 130 to extend beyond the edge of the support layer 122, making it easier for it to contact the overflow portion 113 of the adhesive layer 110.

[0094] Figure 10 shows a micrograph of a display module 10 employing the heat dissipation film 100 shown in Figure 2. As shown in Figure 10 , after lamination, on the target side of the heat dissipation film 100, the adhesive layer 110 is compressed and overflows from the edge, overlapping the metal layer 130 that extends beyond the edge of the support layer 122.

[0095] Figure 11 shows a partial structural schematic diagram of a display module 10 according to other embodiments of the present disclosure. The display module 10 shown in Figure 11 utilizes the heat dissipation film 100 shown in Figure 3. Because the foam layer 121, support layer 122, and metal layer 130 in the heat dissipation film 100 shown in Figure 3 are all indented relative to the adhesive layer 110 on the target side, the adhesive layer 110 also has an overlapping portion 114 on the target side, as shown in Figure 3, extending beyond the edges of the other film layers of the heat dissipation film 100. As shown in Figure 11, the overlapping portion 114 of the adhesive layer 110 covers the side surfaces of each functional layer 120 and contacts the metal layer 130. It should be noted that before bonding, the foam layer 121, the support layer 122 and the metal layer 130 of the heat dissipation film 100 are flush, as shown in Figure 3; after bonding, since the target side of the heat dissipation film 100 bends along the curved side of the display panel 200, the originally flush foam layer 121, the support layer 122 and the metal layer 130 will be staggered on the target side, so that the edge of the support layer 122 slightly exceeds the edge of the foam layer 121, and the edge of the metal layer 130 slightly exceeds the edge of the support layer 122, thereby further facilitating the overlap of the overlapping portion 114 of the adhesive layer 110 and the metal layer 130.

[0096] In some embodiments, in addition to the overlapping portion 114, the adhesive layer 110 may overflow due to compression during the 3D lamination process. The reserved overlapping portion 114 and the overflowing portion can effectively achieve contact between the adhesive layer 110 and the metal layer 130.

[0097] In other embodiments, the target side of the heat dissipation film 100 may include any one or more sides of the heat dissipation film 100. The adhesive layer 110 of the heat dissipation film 100 and the metal layer 130 themselves are in contact on at least one side of the heat dissipation film 100, without relying on the pressure exerted on the side of the heat dissipation film 100 as it bends along the curved side of the display panel 200 during lamination. In some embodiments, to better release static charge accumulated on the curved side of the back film 101, the target side of the heat dissipation film 100 may include the side directly opposite the curved side.

[0098] FIG12 shows a schematic diagram of a partial structure of a display module 10 according to yet another embodiment of the present disclosure. The display module 10 shown in FIG12 utilizes the heat dissipation film 100 shown in FIG5 . As shown in FIG12 , the target side of the heat dissipation film 100 is the side directly opposite the curved side of the display panel 200, and after lamination, it is in the curved state shown in FIG12 . The first main portion 111 of the adhesive layer 110 is attached to the side of the back film 101 away from the display panel 200. The first bent portion 112 covers the side surfaces of the functional layers 120 of the heat dissipation film 100 and contacts the protrusion 1301 of the metal layer 130, thereby forming an electrostatic charge conduction path from the back film 101 to the metal layer 130. The electrostatic charge accumulated in the back film 101 can first be transferred to the first main portion 111 of the adhesive layer 110, and then transferred to the metal layer 130 through the first bent portion 112 of the adhesive layer 110, and then released.

[0099] Figure 13 shows a partial structural schematic diagram of a display module 10 according to further embodiments of the present disclosure. The display module 10 shown in Figure 13 utilizes the heat dissipation film 100 shown in Figure 6 . As shown in Figure 13 , the target side of the heat dissipation film 100 is the side directly opposite the curved side of the display panel 200. After lamination, it assumes the curved state shown in Figure 13 . The adhesive layer 110 of the heat dissipation film 100 includes a first adhesive region 1101 and a second adhesive region 1102 . The first adhesive region 1101 is the region bonded to the functional layer 120 of the heat dissipation film 100. Specifically, one side of the first adhesive region 1101 is bonded to the backing film 101, and the other side is bonded to the functional layer 120 adjacent to the adhesive layer 110. The second adhesive region 1102 is located outside the first adhesive region 1101. One side of the second adhesive region 1102 is bonded to the backing film 101, and the other side contacts the second bent portion 132 of the metal layer 130. The second bending portion 132 of the metal layer 130 covers the side surfaces of the support layer 122 and the foam layer 121 , and the end of the second bending portion 132 away from the second main body portion 131 contacts the second bonding area 1102 , thereby forming an electrostatic charge conduction path from the back film 101 to the metal layer 130 .

[0100] Figure 14 shows a schematic diagram of the structure of a display device 1 according to some embodiments of the present disclosure. As shown in Figure 14, some embodiments of the present disclosure provide a display device 1, including a display module 10 provided in any of the embodiments described above. In some embodiments, the display device 1 can be a curved screen display product, such as a monitor, television, tablet computer, laptop computer, mobile phone, digital photo frame, navigator, or other product or component with a display function. Of course, the display device 1 provided in the embodiments of the present disclosure is not limited to the types listed above.

[0101] In the heat dissipation film, display module and display device provided by some embodiments of the present disclosure, an adhesive layer with charge conduction properties is provided, and on at least one side of the heat dissipation film, the edge of at least one functional layer between the adhesive layer and the metal layer is retracted relative to the edge of the adhesive layer, so that after the heat dissipation film is bonded to the back film, the metal layer and the adhesive layer are in contact on at least one side of the heat dissipation film, so that the static charge accumulated in the back film is conducted to the metal layer through the adhesive layer and released, effectively reducing the accumulation of static charge on the back film, reducing the electrostatic field generated inside the display module, and helping to improve the low grayscale display abnormality problem of curved display products.

[0102] It should be noted that the drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures can refer to general designs. In the absence of conflict, the embodiments of the present disclosure and the features therein can be combined with each other to obtain new embodiments.

[0103] Although some embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the present disclosure.

Claims

1. A heat dissipation film for adhering to the back film of a display panel, the heat dissipation film comprising: A metal layer, an adhesive layer, and a functional layer located between the metal layer and the adhesive layer, the adhesive layer having charge conduction performance, and the functional layer having stress buffering performance; On at least one side of the heat dissipation film, the edge of at least one of the functional layers is recessed relative to the edge of the adhesive layer, so that after the heat dissipation film is attached to the back film, the metal layer and the adhesive layer are in contact on the at least one side.

2. The heat dissipation film according to claim 1, wherein, There are multiple functional layers, and the multiple functional layers include: a foam layer and a support layer arranged in a stacked manner, the foam layer is arranged on the side of the adhesive layer close to the metal layer, and the support layer is arranged on the side of the foam layer away from the adhesive layer; On at least one side of the heat dissipation film, the edge of the support layer and the edge of the metal layer are recessed relative to the edge of the adhesive layer.

3. The heat dissipation film according to claim 2, wherein, On at least one side of the heat dissipation film, in a direction perpendicular to the surface of the heat dissipation film, the edge of the support layer is flush with the edge of the metal layer, and the edge of the foam layer is flush with the edge of the adhesive layer.

4. The heat dissipation film according to claim 2, wherein, On at least one side of the heat dissipation film, the edge of the foam layer is recessed relative to the edge of the adhesive layer; the inner recessed distance of the edges of the support layer and the metal layer relative to the edge of the adhesive layer is a first distance, and the inner recessed distance of the edge of the foam layer relative to the edge of the adhesive layer is a second distance, and the second distance is less than or equal to the first distance.

5. The heat dissipation film according to claim 4, wherein, The first distance is greater than 150 microns and less than or equal to 250 microns.

6. The heat dissipation film according to claim 1, wherein, The adhesive layer includes: a first main body portion and a first bent portion connected to the first main body portion, the first main body portion is parallel to the functional layer, the first bent portion bends towards the metal layer relative to the first main body portion, covering the side surface of the functional layer, and the end of the first bent portion away from the first main body portion is in contact with the metal layer; or, The metal layer includes: a second main body portion and a second bent portion connected to the second main body portion, the second main body portion is parallel to the functional layer, the second bent portion bends towards the adhesive layer relative to the second main body portion, covering the side surface of the functional layer, and the end of the second bent portion away from the second main body portion is in contact with the adhesive layer.

7. The heat dissipation film according to claim 1, wherein, The resistance value of the bonding layer is 10 4 ~10 5 ohms.

8. The heat dissipation film according to claim 1, wherein, In a direction perpendicular to the surface of the heat dissipation film, the thickness of the adhesive layer is 25 to 35 microns.

9. A display module, comprising: A display panel; A back film disposed on the backlight side of the display panel; And The heat dissipation film according to any one of claims 1-8, the adhesive layer of the heat dissipation film is attached to the side of the back film away from the display panel, and on at least one side of the heat dissipation film, the adhesive layer of the heat dissipation film is in contact with the metal layer.

10. The display module according to claim 9, wherein, The display panel has a curved side, at least one side of the heat dissipation film is the side facing the curved side, the adhesive layer covers the side surface of the functional layer of the heat dissipation film and is in contact with the metal layer.

11. The display module according to claim 10, wherein, The adhesive layer has an overflow portion, the overflow portion covers the side surface of the functional layer and is in contact with the metal layer; the overflow portion is formed by the adhesive layer being squeezed during the fitting process.

12. The display module according to claim 11, wherein, The functional layer includes: a foam layer and a support layer arranged in a stacked manner; the edge of the support layer is retracted relative to the edges of the foam layer and the metal layer, and the overflow portion covers the side surfaces of the foam layer and the support layer and contacts the metal layer.

13. The display module according to claim 10, wherein The adhesive layer has a lapping portion, which is the part exceeding the edges of other film layers of the heat dissipation film. The lapping portion covers the side surface of the functional layer and contacts the metal layer.

14. The display module according to claim 13, wherein, The functional layer includes: a foam layer and a support layer arranged in a stacked manner. The edge of the support layer exceeds the edge of the foam layer, and the edge of the metal layer exceeds the edge of the support layer. The lapping portion covers the side surfaces of the foam layer and the support layer and contacts the metal layer.

15. The display module according to claim 9, wherein, At least one side of the heat dissipation film refers to any one side or multiple sides of the heat dissipation film. The adhesive layer includes: a first main body portion and a first bending portion connected to the first main body portion. The first main body portion is parallel to the functional layer of the heat dissipation film. The first bending portion bends towards the metal layer relative to the first main body portion, covers the side surface of the functional layer, and the end of the first bending portion away from the first main body portion contacts the metal layer. The first main body portion is attached to the side of the back film away from the display panel.

16. The display module according to claim 9, wherein, At least one side of the heat dissipation film refers to any one side or multiple sides of the heat dissipation film. The metal layer includes: a second main body portion and a second bending portion connected to the second main body portion. The second main body portion is parallel to the connected functional layer. The second bending portion bends towards the adhesive layer relative to the second main body portion and covers the side surface of the functional layer. The adhesive layer includes: a first adhesive area and a second adhesive area. The first adhesive area is the area adhered to the functional layer. The second adhesive area is located outside the first adhesive area. One side of the second adhesive area is adhered to the back film, and the other side contacts the end of the second bending portion away from the second main body portion.

17. A display device, comprising: The display module according to any one of claims 9-16.

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