Information processing method, machining method, machining control device, and computer program for machining control

Abstract

In the present invention, executed is an information processing method including: determining whether it is possible to image at least a portion of irradiation positions on an object which are subjected to beam irradiation, and / or at least a portion of molten pools formed on the object by the irradiation with the beam; and setting, on the basis of results of the determination, control information pertaining to the control of machining including irradiation of the object with the beam. Optionally executed is an information processing method including: determining whether at least a portion of the irradiation positions and / or at least a portion of the molten pools can be imaged by the imaging unit; and generating display data for causing a display device to display the results of the determination.

Description

Information processing method, machining method, machining control device, and machining control computer program

[0001] The present disclosure relates to an information processing method, a processing method, a processing control device, and a computer program for processing control for controlling the processing of an object.

[0002] An example of a processing device for processing an object is described in Patent Document 1.

[0003] US Patent Application Publication No. 2015 / 0034266

[0004] The information processing method disclosed herein includes determining whether at least one of at least a portion of the irradiation position on an object where a beam is irradiated and at least a portion of a molten pool formed on the object by irradiating the beam can be imaged by an imaging unit, and setting control information related to controlling processing including irradiating the object with the beam based on the result of the determination.

[0005] The information processing method disclosed herein includes determining whether at least one of at least a portion of the irradiation position on an object where a beam is irradiated and at least a portion of the molten pool formed on the object by irradiating the beam can be imaged by an imaging unit, and generating display data for displaying the results of the determination on a display device.

[0006] The processing control device according to the present disclosure includes a determination unit that determines whether at least one of at least a portion of the irradiation position on the object where the beam is irradiated and at least a portion of the molten pool formed on the object by the irradiation of the beam can be imaged by an imaging unit, and a generation unit that generates display data for displaying the results of the determination on a display device.

[0007] The processing control device according to the present disclosure includes a determination unit that determines whether at least one of at least a portion of the irradiation position on the object where the beam is irradiated and at least a portion of the molten pool formed on the object by the irradiation of the beam can be imaged by an imaging unit, and a generation unit that generates display data for displaying the results of the determination on a display device.

[0008] The computer program for processing control according to the present disclosure causes a computer to perform processing including determining whether at least a portion of the irradiation position on an object where the beam is irradiated and at least a portion of the molten pool formed on the object by the beam irradiation can be imaged by an imaging unit, and setting display information regarding control of processing including the irradiation of the beam on the object based on the result of the determination.

[0009] The computer program for processing control according to the present disclosure causes a computer to execute processing including determining whether at least one of at least a portion of the irradiation position on an object where the beam is irradiated and at least a portion of the molten pool formed on the object by the beam irradiation can be imaged by an imaging unit, and generating display data for displaying the results of the determination on a display device.

[0010] FIG. 1 is a schematic diagram showing the overall configuration of a machining system. FIG. 2 is a block diagram showing the configuration of a machining device included in the machining system. FIG. 3 is a schematic diagram illustrating an example of machining performed by the machining device. FIG. 4 is a schematic diagram showing an example of imaging of an irradiation position or a molten pool by a head sensor. FIG. 5 is a schematic diagram showing a first example of an image output by the head sensor. FIG. 6 is a schematic diagram showing a second example of an image output by the head sensor. FIG. 7 is a schematic diagram showing a third example of an image output by the head sensor. FIG. 8 is a schematic diagram showing the general configuration of a machining control device. FIG. 9 is a diagram showing an example of information included in machining information. FIG. 10 is a diagram showing an example of information included in control information. FIG. 11 is a flowchart of a machining control process. FIG. 12 is a flowchart of a control information setting process. FIG. 13 is a flowchart showing the flow of a molten pool feedback control operation. FIG. 14 is a diagram showing a molten pool image. FIG. 15 is a diagram showing multiple molten pool images and an added image acquired as time-series data.

[0011] Hereinafter, an information processing method, a processing method, a processing control device, and a computer program for processing control according to the present disclosure will be described in detail with reference to the drawings.

[0012] FIG. 1 is a schematic diagram showing the overall configuration of a processing system 100.

[0013] In this embodiment, the machining system 100 includes a machining apparatus 1, a measuring apparatus 2, a display device 3, and a machining control device 4. The machining apparatus 1, the measuring apparatus 2, the display device 3, and the machining control device 4 are communicatively connected via a communication network NW. The communication network NW includes a wired local area network. The communication network NW may include a wireless local area network, a wireless wide area network, or other communication networks. The number of each of the machining apparatus 1, the measuring apparatus 2, the machining control device 4, and the machining control device 4 included in the machining system 100 is not limited to one, and may be two or more. Furthermore, the number of each of the apparatuses does not have to be the same.

[0014] In the processing system 100, the measuring device 2 measures the workpiece W to be processed by the processing device 1, and generates measurement information representing the measurement results. The processing control device 4 controls the operation of the entire processing system 100. The processing control device 4 makes a predetermined judgment regarding, for example, control of processing of the workpiece W by the processing device 1, and sets control information regarding control of processing of the workpiece W. The control information may be set based on the measurement information of the workpiece W. The display device 3 displays the result of the judgment in the processing control device 4. The processing device 1 processes the workpiece W using the control information. The workpiece W is an example of an object to be processed by the processing device 1.

[0015] The processing device 1 can perform processing on each of a plurality of processing targets included in the workpiece W. The processing device 1 may be configured to perform at least one of various processes on the processing targets, including cutting, welding, screwing, polishing, and painting. The position of the processing target on the workpiece W can also be called a target position. In other words, the workpiece W may have a plurality of target positions.

[0016] The processing apparatus 1 of this embodiment performs additive processing on a processing target, which is a workpiece W. That is, the processing apparatus 1 adds material to the processing target on the surface of the workpiece W to form a structure on the workpiece W. The structure formed on the surface of the workpiece W by the processing apparatus 1 may be, for example, a three-dimensional structure ST having a size in all three-dimensional directions. The three-dimensional structure ST may be integrated with the workpiece W or may be separable from the workpiece W.

[0017] The processing apparatus 1 may perform additive processing using any additive processing method capable of forming a shaped object. Examples of additive processing methods include laser metal deposition (LMD), powder bed fusion (PBB) methods such as selective laser sintering (SLS), binder jetting, material jetting, stereolithography, and laser metal fusion (LMF). Note that laser metal deposition may also be referred to as directed energy deposition (DED).

[0018] The workpiece W may be an item that has a missing portion and needs to be repaired. In this case, the processing device 1 may perform repair processing to repair (in other words, restore) the item that needs to be repaired by performing additional processing to form a shaped object to fill the missing portion. In other words, the additional processing performed by the processing device 1 may include additional processing to add to the workpiece W a three-dimensional structure ST that corresponds to the shaped object to fill the missing portion. An example of an item that has a missing portion and needs to be repaired is a worn turbine blade.

[0019] The workpiece W may be a base for forming a three-dimensional structure ST. In this case, the processing device 1 may manufacture (in other words, newly create) the three-dimensional structure ST from scratch by performing additional processing to form the three-dimensional structure ST on the workpiece W. As an example, the processing device 1 may newly create a turbine blade by performing additional processing to form a three-dimensional structure ST corresponding to a turbine blade on the workpiece W.

[0020] The workpiece W may be an intermediate product produced in the process of forming a three-dimensional structure ST. In this case, the processing device 1 may perform additional processing on the workpiece W, which is an intermediate product of the three-dimensional structure ST, to complete the three-dimensional structure ST, thereby producing the three-dimensional structure ST from the intermediate product. As an example, the processing device 1 may perform additional processing on the workpiece W, which is an intermediate product of a turbine blade, to complete the turbine blade, thereby producing a finished turbine blade from the intermediate product of the turbine blade.

[0021] The processing device 1 may be configured to perform subtractive processing on the workpiece W in addition to or instead of performing additive processing. That is, the processing device 1 may be capable of performing subtractive processing to remove a portion of the workpiece W. Note that the processing device 1 may perform subtractive processing on a shaped object formed on the workpiece W by the processing device 1 in addition to or instead of performing subtractive processing on the workpiece W. The processing device 1 may also repair a workpiece W that needs repair by performing subtractive processing. The processing device 1 may perform repair by subtractive processing in combination with repair by additive processing.

[0022] The processing apparatus 1 has a chamber space 1A capable of accommodating a workpiece W for processing. The workpiece W is accommodated in the chamber space 1A prior to processing, and is removed from the chamber space 1A after processing is completed.

[0023] The measuring device 2 measures the workpiece W before the processing device 1 starts processing the workpiece W. In this embodiment, the measuring device 2 measures the three-dimensional shape of the workpiece W. The measuring device 2 has a measurement space (not shown) that can accommodate the workpiece W for measurement. The workpiece W is accommodated in the measurement space prior to measurement. Note that by measuring the three-dimensional shape of the workpiece W, the measuring device 2 can identify the position of the workpiece W (e.g., the position of the surface of the workpiece W) in three-dimensional space in the measurement coordinate system of the measuring device 2. For this reason, measuring the three-dimensional shape of the workpiece W can be said to be essentially equivalent to measuring the position of the workpiece W.

[0024] The measuring device 2 outputs (i.e., transmits via the communication network NW) measurement information representing the results of measuring the workpiece W to the processing control device 4. The measurement information may be information relating to the shape of the workpiece W.

[0025] After the three-dimensional shape of the workpiece W is measured by the measuring device 2, it is transported from the measuring device 2 to the processing device 1. Specifically, the workpiece W is removed from the measurement space of the measuring device 2, and the removed workpiece W is transported to the processing device 1. For example, the workpiece W may be transported from the measuring device 2 to the processing device 1 by a transport device (not shown). Note that the workpiece W may also be transported from the measuring device 2 to the processing device 1 by a user of the processing system 100 (in other words, by means other than the transport device). In other words, the processing system 100 does not need to be equipped with a transport device. The workpiece W transported to the processing device 1 is placed (in other words, placed or attached) in the chamber space 1A of the processing device 1. As a result, the processing device 1 can process the workpiece W.

[0026] 1, the processing system 100 includes a processing apparatus 1 and a measuring apparatus 2, which are separate devices. However, the processing system 100 may include an apparatus in which the processing apparatus 1 and the measuring apparatus 2 are integrated. In other words, the processing apparatus 1 and the measuring apparatus 2 may be integrated. In this case, at least a part of the measurement space and the chamber space 1A may be common.

[0027] FIG. 2 is a block diagram showing the configuration of the processing device 1 included in the processing system 100, and FIG. 3 is a schematic diagram illustrating an example of processing performed by the processing device 1.

[0028] The processing device 1 included in the processing system 100 of this embodiment, which will be described below, is a processing device that performs additional processing using a laser build-up welding method.

[0029] In the following description, the positional relationships of the various components constituting the processing apparatus 1 will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes as the processing coordinate system. For ease of explanation, the X-axis direction and the Y-axis direction are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0030] The processing device 1 performs additive processing on the workpiece W by processing a modeling material M using the processing light EL. The modeling material M is a material that can be melted by irradiation with the processing light EL exceeding a predetermined intensity. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. However, materials other than metallic materials and resinous materials may also be used as the modeling material M. The modeling material M is a powder or granular material. In other words, the modeling material M is a powder or granular material. However, the modeling material M does not have to be a powder or granular material. For example, at least one of a wire-like material and a gaseous material may be used as the modeling material M. In additive processing based on the DED method, the processing device 1 supplies the modeling material M near the focal point of the processing light EL and adheres the melted modeling material M to the workpiece by irradiation with the processing light EL, or supplies the modeling material M to a molten pool formed on the workpiece by the processing light EL, melts the modeling material M, and then cools and solidifies it. In this way, a shaped object is formed on the workpiece W.

[0031] The processing apparatus 1 uses a laser build-up welding method to sequentially form multiple structural layers, thereby forming a three-dimensional structure ST in which multiple structural layers are stacked. The processing apparatus 1 first sets the surface of the workpiece W as the build surface on which the object is actually built, and builds a first structural layer on that build surface. The processing apparatus 1 then sets the surface of the first structural layer as a new build surface and builds a second structural layer on that build surface. Thereafter, the processing apparatus 1 repeats the same operation to build a three-dimensional structure in which multiple structural layers are stacked. At this time, a target position for processing the workpiece W may be set for each structural layer. For example, a target position above the target position of the first structural layer may be set in a structural layer to be built on the first structural layer, separate from a target position in the first structural layer.

[0032] The processing apparatus 1 includes a material supply source 11, a gas supply source 12, a mixing unit 13, a processing unit 14, a stage unit 15, a light source 16, an imaging unit 171, and a control unit 18. The processing apparatus 1 also includes a housing 17 having a chamber space 1A therein. The processing unit 14 and the stage unit 15 are housed in the chamber space 1A. Note that at least one of the processing unit 14 and the stage unit 15 does not necessarily have to be housed in the chamber space 1A.

[0033] The material supply source 11 supplies the modeling material M required for the processing unit 14 to perform additive processing. The material supply source 11 supplies a predetermined amount of modeling material M to the mixing unit 13 (described later) in accordance with the amount required per unit time for the additive processing so that the processing unit 14 can supply the amount of modeling material M required per unit time for the additive processing.

[0034] The gas supply source 12 supplies an inert gas such as nitrogen or argon. The inert gas supplied by the gas supply source 12 is supplied to the mixing unit 13 via a supply pipe 121, mixed with the modeling material supplied from the material supply source 11, and supplied to the processing unit 14. The inert gas supplied by the gas supply source 12 is also supplied to the chamber space 1A via a supply pipe 122 connecting the gas supply source 12 to a supply port 172 formed in the housing 17. As a result, the chamber space 1A becomes a space filled with the inert gas. The inert gas supplied by the gas supply source 12 is used to purge the chamber space 1A, and therefore can also be called a purge gas. The inert gas supplied to the chamber space 1A may be discharged from an exhaust port (not shown) formed in the housing 17. The gas supply source 12 is a gas cylinder containing the inert gas. When the inert gas is nitrogen gas, the gas supply source 12 may be a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material.

[0035] The mixing unit 13 mixes the modeling material M supplied from the material supply source 11 with the inert gas supplied from the gas supply source 12 as a conveying gas (which may also be referred to as a pressurized gas), and pressure-feeds the mixed gas to the processing unit 14 via the supply pipe 131. The pressure-feed gas may be a gas supplied from a gas supply source different from the gas supply source 12. Note that the modeling material M may be supplied directly from the material supply source 11 to the processing unit 14 without being mixed with the pressure-feed gas. In this case, the processing apparatus 1 does not need to have the mixing unit 13.

[0036] The machining unit 14 performs additional machining by processing the modeling material supplied from the material supply source 11 to form a model on the workpiece W. To perform additional machining, the machining unit 14 includes a machining head 141 and a head drive system 142. The machining head 141 further includes an irradiation optical system 1411 and a material nozzle 1412. In the example shown in FIGS. 2 and 3 , the machining head 141 includes a single irradiation optical system 1411, but the machining head 141 may include multiple irradiation optical systems 1411. In the example shown in FIGS. 2 and 3 , the machining head 141 includes a single material nozzle 1412, but the machining head 141 may include multiple material nozzles 1412. The machining unit 14 may also include a position sensor (e.g., a rotary encoder) for measuring the position of the machining head 141.

[0037] The irradiation optical system 1411 is an optical system (e.g., a focusing optical system) for emitting the processing light EL. Specifically, the irradiation optical system 1411 is optically connected to the light source 16 that emits the processing light EL via a light transmission member 161 such as an optical fiber or a light pipe. The irradiation optical system 1411 emits the processing light EL propagated from the light source 16 via the light transmission member 161. The irradiation optical system 1411 irradiates the processing light EL downward from the irradiation optical system 1411 (i.e., toward the −Z side).

[0038] A stage 151 is disposed below the irradiation optical system 1411. When a workpiece W is placed on the stage 151, the irradiation optical system 1411 irradiates the workpiece W with the processing light EL. Specifically, the irradiation optical system 1411 can irradiate the processing light EL onto a target irradiation area EA that is set on or near the workpiece W as an area to be irradiated (typically, focused) with the processing light EL. Furthermore, under the control of the control unit 18, the state of the irradiation optical system 1411 can be switched between a state in which the processing light EL is irradiated onto the target irradiation area EA and a state in which the processing light EL is not irradiated onto the target irradiation area EA.

[0039] The material nozzle 1412 supplies (e.g., ejects, jets, or sprays) the building material M. The material nozzle 1412 is physically connected to the material supply source 11, which is a source of the building material M, via the supply pipe 131 and the mixing unit 13. The material nozzle 1412 supplies the building material M supplied from the material supply source 11. The building material M from the material supply source 11 may be mixed with a pressurized gas by the mixing unit 13 and then pressurized to the material nozzle 1412 via the supply pipe 131. In this case, the material nozzle 1412 supplies the building material M together with the pressurized gas. The pressurized gas may be a purge gas supplied from the gas supply source 12 to purge the chamber space 1A.

[0040] The material nozzle 1412 supplies the modeling material M downward (i.e., toward the −Z side) from the material nozzle 1412. The stage 151 is disposed below the material nozzle 1412. When the workpiece W is placed on the stage 151, the material nozzle 1412 supplies the modeling material M toward the workpiece W or the vicinity of the workpiece W.

[0041] In the processing apparatus 1 of this embodiment, the material nozzle 1412 supplies the modeling material M to the irradiation position of the processing light EL (i.e., the target irradiation area EA irradiated with the processing light EL from the irradiation optical system 1411). Therefore, the material nozzle 1412 and the irradiation optical system 1411 are aligned so that a target supply area MA, which is set on or near the workpiece W as the area to which the material nozzle 1412 supplies the modeling material M, coincides with (or at least partially overlaps with) the target irradiation area EA. In this case, the modeling material M supplied from the material nozzle 1412 is irradiated with the processing light EL emitted by the irradiation optical system 1411. As a result, the modeling material M supplied from the material nozzle 1412 melts, and a molten pool MP containing the molten modeling material M is formed on the workpiece W. The molten modeling material M in the molten pool MP cools and solidifies (i.e., solidifies). As a result, a model composed of the solidified modeling material M is deposited on the modeling surface.

[0042] The material nozzle 1412 may supply the modeling material M to a molten pool MP formed by the processing light EL emitted by the irradiation optical system 1411. For example, the processing device 1 may supply the modeling material M to a molten pool MP formed by irradiating the workpiece W with the processing light EL to melt a material on the surface of the workpiece W. In addition, the processing device 1 may melt the modeling material M supplied from the material nozzle 1412 with the processing light EL before the modeling material M reaches the workpiece W, and adhere the molten modeling material M to the workpiece W.

[0043] The irradiation optical system 1411 of the processing head 141 can be said to supply processing light EL for processing the workpiece W. The material nozzle 1412 of the processing head 141 can be said to supply the modeling material M for processing the workpiece W. The material nozzle 1412 can also be said to supply pressurized gas for processing the workpiece W. Therefore, the processing head 141 can supply at least one of the processing light EL, the modeling material M, and the pressurized gas for processing the workpiece W.

[0044] The imaging unit 171 is an example of a sensor included in the processing system 100. The imaging unit 171 outputs values ​​related to at least one of the processing device 1 and the workpiece W in time series. The imaging unit 171 is located above the workpiece W (i.e., on the +Z side). The output of values ​​related to at least one of the processing device 1 and the workpiece W by the imaging unit 171 can also be said to be measurement of at least one of the processing device 1 and the workpiece W by the imaging unit 171. The output of values ​​by the imaging unit 171 may be intermittent or continuous.

[0045] The imaging unit 171 is a camera capable of outputting an image representing at least one of the irradiation position of the workpiece W irradiated with the processing light EL by the irradiation optical system 1411 and the molten pool MP formed by the irradiation of the processing light EL. The imaging unit 171 includes an imaging optical system having an optical axis different from that of the processing light EL. For example, the optical axis of the imaging optical system of the imaging unit 171 may be parallel to the optical axis of the processing light EL. The imaging optical system receives light R reflected by the mirror 171M from at least one of the irradiation position and the molten pool MP and forms an image on the imaging surface of an imaging element (not shown). In other words, light traveling from the irradiation position or the molten pool MP in a direction intersecting the irradiation direction of the processing light EL enters the imaging unit 171. The imaging element of the imaging unit 171 outputs an image corresponding to the formed light. The imaging unit 171 and the mirror 171M may also be referred to as an imaging unit. The output of an image by the imaging unit 171 may also be referred to as imaging. The imaging unit 171 captures images of the irradiation position and the molten pool MP from an oblique angle, and can therefore acquire the height of the molten pool MP on the workpiece W. The acquired height of the molten pool MP can be used to control the processing light EL based on the state of the molten pool or to determine whether or not the molten pool MP can be imaged.

[0046] The head drive system 142 moves the machining head 141 under the control of the control unit 18. That is, the head drive system 142 moves the irradiation optical system 1411 and the material nozzle 1412 under the control of the control unit 18. The head drive system 142 moves the machining head 141, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the head drive system 142 moves the machining head 141, the relative positions of the machining head 141, the stage 151, and the workpiece W placed on the stage 151 change. As a result, the target irradiation area EA and the target supply area MA (and further the molten pool MP) move relative to the workpiece W.

[0047] The head drive system 142 may move the machining head 141 to a height higher than the height at which machining is performed on the machining target (i.e., to the +Z side) between machining one machining target and machining another machining target on the workpiece W. By the head drive system 142 moving the machining head 141 in this way, it is possible to avoid interference between the machining head 141 and the workpiece W or the object formed on the workpiece W when the machining head 141 moves from a machining position where one machining target is machined to a machining position where another machining target is machined.

[0048] When the imaging unit 171 outputs values ​​intermittently, the head drive system 142 may move the machining head 141 so that the imaging unit 171 outputs values ​​when the machining head 141 is at a height higher than the height at which the machining target is machined (i.e., on the +Z side). It can also be said that the head drive system 142 moves the imaging unit 171 in a direction increasing the distance from the workpiece W before machining by the machining head 141. By moving the machining head 141 in this manner, the distance between the measurement target and the imaging unit 171 during measurement can be set to an appropriate distance. It is preferable that the height to which the machining head 141 is moved when the imaging unit 171 outputs values ​​is lower (i.e., on the -Z side) than the height to which the machining head 141 is moved to move the machining head from a machining position where one machining target is machined to a machining position where another machining target is machined.

[0049] The imaging unit 171 may be fixed in position relative to the processing head 141. For example, the imaging unit 171 may be provided at a position in the chamber space 1A different from that of the processing head 141 (for example, on the stage 151, the inner frame of the housing 17, etc.). In this case, the imaging unit 171 may be moved by an imaging unit drive system (not shown) in the same manner as the processing head 141 is moved by the head drive system 142. Alternatively, the imaging unit 171 may be fixed to the processing head 141.

[0050] In the processing device 1, the processing head 141 having the irradiation optical system 1411 can change its relative position with respect to the workpiece W.

[0051] Figure 4 is a schematic diagram showing an example of imaging of the irradiation position or molten pool MP, and Figures 5-7 are examples of images output by the imaging unit 171. The imaging in Figures 4-7 does not have to be performed during actual machining, but may be performed as a simulation prior to machining. In this case, the irradiation position and molten pool MP can also be called virtual irradiation position and virtual molten pool. Figures 5-7 virtually show the orientation of the machining coordinate system for the irradiation position and molten pool MP corresponding to the image, which is different from the orientation of the image coordinate system.

[0052] A plurality of target irradiation areas EA1-3 are set on the workpiece W. The machining head 141 of the machining device 1 sequentially irradiates the plurality of target irradiation areas EA1-3 with the machining light EL from relative positions relative to the workpiece W that are appropriate for machining each of the plurality of target irradiation areas EA1-3. The molten pool MP1-3 is formed in response to the irradiation of the plurality of target irradiation areas EA1-3 with the machining light EL.

[0053] The machining device 1 may receive light R1-3 directed from at least one of the plurality of target irradiation areas EA1-3 and the molten pool MP1-3 toward the imaging unit 171 using the imaging unit 171, and output a corresponding image. When machining each of the plurality of target irradiation areas EA1-3, the relative positional relationship between the machining head 141 and the workpiece W is different. Therefore, the trajectories of light R1-3 directed from at least one of the plurality of target irradiation areas EA1-3 and the molten pool MP1-3 toward the imaging unit 171 are different.

[0054] The workpiece W has a protruding portion WA that protrudes upward (i.e., toward the Z+ side). Light R1 and light R2 are not blocked by the protruding portion WA. On the other hand, light R3 is blocked by the protruding portion WA. The extended area EW represents an area (virtual area) obtained by expanding the shape of the workpiece W by a predetermined amount.

[0055] The imaging unit 171 receives light R1 directed toward the imaging unit 171 from at least one of the target irradiation area EA1 and the molten pool MP1, and outputs a corresponding image P1. Since the light R1 is not blocked by the shape of the workpiece W (particularly the protruding portion WA), the entire target irradiation area EA1 and the molten pool MP1 are shown in the image P1.

[0056] The imaging unit 171 receives light R2 directed toward it from at least one of the target irradiation area EA2 and the molten pool MP2 and outputs a corresponding image P2. Part of the light R2 is blocked by the shape of the workpiece W (particularly the protruding portion WA). Therefore, part of the protruding portion WA of the workpiece W is visible in the image P2. In the image P2, the target irradiation area EA2 is entirely visible, while part of the molten pool MP2 (the right side, or +Y side in FIG. 6 ) is blocked by the protruding portion WA and is not visible. Note that the light from the target irradiation area EA2 is not blocked by the shape of the workpiece W, but is blocked by the extended area EW. This indicates that in actual machining, the target irradiation area EA2 may not be imageable by the imaging unit 171.

[0057] The imaging unit 171 receives light R3 directed toward the imaging unit 171 from at least one of the target irradiation area EA3 and the molten pool MP3, and outputs a corresponding image P3. Part of the light R3 is blocked by the shape of the workpiece W (particularly the protruding portion WA). Therefore, part of the protruding portion WA of the workpiece W is shown in the image P3. In the image P3, the target irradiation area EA3 and the molten pool MP3 are blocked by the protruding portion WA and are not shown.

[0058] The imaging unit 171 may output a value representing a characteristic related to processing in which a beam is irradiated onto the workpiece W. The imaging unit 171 may include, for example, a temperature sensor that outputs a value indicating the temperature of the workpiece W. The imaging unit 171 may include, for example, an oxygen concentration sensor that outputs a value indicating the oxygen concentration inside the chamber space 1A.

[0059] The imaging unit 171 may output a value representing a characteristic related to the processing light EL irradiated onto the workpiece W. The imaging unit 171 may be, for example, a light intensity sensor that outputs a value indicating the light intensity of the processing light EL emitted from the irradiation optical system 1411. The light intensity sensor may output a value indicating the light intensity of light branched from the processing light EL by a light path branching member included in the irradiation optical system 1411.

[0060] The stage unit 15 includes a stage 151 and a stage drive system 152 .

[0061] The workpiece W is placed on the stage 151. When placing the workpiece W, it is preferable that the upper surface (which can also be called the installation surface) of the stage 151 is horizontal. The stage 151 is capable of supporting the workpiece W placed on it. The stage 151 may also be capable of holding the workpiece W placed on it. In this case, the stage 151 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, etc. to hold the workpiece W. Alternatively, the stage 151 may not be capable of holding the workpiece W placed on it. In this case, the workpiece W may be placed on the stage 151 in a clampless manner. The workpiece W may also be held by a holding device such as a jig, or a holding device attached to the workpiece W may be placed, supported, or held on the stage 151. The stage 151 may also have a gripping unit that grips the workpiece W. In this case, multiple gripping units may be provided so as to grip at least two of the multiple processing objects included in the workpiece W. The workpiece W does not have to be placed on the stage 151, but may be placed on the floor, for example.

[0062] The stage drive system 152 moves the stage 151 under the control of the control unit 18. The stage drive system 152 moves the stage 151, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the stage drive system 152 moves the stage 151, the relative positions of the stage 151 and the workpiece W placed on the stage 151, and the machining head 141 change. As a result, the target irradiation area EA and the target supply area MA (and further the molten pool MP) move relative to the workpiece W.

[0063] When the stage drive system 152 moves the stage 151 along at least one of the θX direction, the θY direction, and the θZ direction, the installation surface may be tilted from the horizontal. In this disclosure, the term "installation surface" used without any particular explanation of the tilt refers to the installation surface (typically in a horizontal state) on which the workpiece W is placed.

[0064] The light source 16 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. The light source 16 may also emit other types of light as the processing light EL. The processing light EL can also be called a beam. The processing light EL may include at least one pulsed light. The processing light EL may also include at least one continuous light (CW: Continuous Wave). The processing light EL may be laser light. In this case, the light source 16 may be, for example, a semiconductor laser such as a laser diode (LD: Laser Diode), a fiber laser, a CO ２ The light source 16 may include a laser light source such as a laser, a YAG laser, or an excimer laser. The processing light EL does not have to be laser light. The light source 16 may include any light source such as an LED (Light Emitting Diode) or a discharge lamp.

[0065] The housing 17 has a chamber space 1A therein that can accommodate the processing unit 14 and the stage unit 15 .

[0066] The control unit 18 controls the operation of the processing device 1. For example, the control unit 18 may control the processing unit 14 (e.g., at least one of the processing head 141 and the head drive system 142) so as to process each of the multiple processing targets on the workpiece W. The control unit 18 may also control the stage unit 15 (e.g., the stage drive system 152) so that each of the multiple processing targets on the workpiece W can be processed by the processing unit 14.

[0067] The control unit 18 receives control information (processing control information) related to control of processing of the workpiece W by the processing device 1 from the processing control device 4. The control unit 18 controls processing of the workpiece W in accordance with the processing control information. Processing of the workpiece W includes irradiating the workpiece W with processing light EL.

[0068] The control unit 18 may include, for example, a memory 181 and a processor 182. The processor 182 includes, for example, a CPU (Central Processing Unit). The processor 182 may further include a GPU (Graphics Processing Unit). The memory 181 includes, for example, a memory. The control unit 18 functions as a unit that controls the operation of the machining apparatus 1 by the processor 182 executing a computer program. This computer program is a computer program that causes the processor 182 to perform (i.e., execute) the operations that the control unit 18 should perform to control the operation of the machining apparatus 1. In other words, this computer program is a computer program that causes the control unit 18 to function so as to cause the machining apparatus 1 to perform operations for machining the workpiece W. The computer program executed by the processor 182 may be stored in a storage device (i.e., a storage medium) included in the control unit 18, or may be stored in any storage medium (e.g., a hard disk drive or semiconductor memory) that is built into the control unit 18 or that can be externally attached to the control unit 18. Alternatively, the processor 182 may download the computer program to be executed from a device external to the control unit 18 via a communication interface provided in the control unit 18 .

[0069] The control unit 18 may control the emission mode of the processing light EL by the irradiation optical system 1411. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes at least one pulsed light, the emission mode may include, for example, at least one of the emission duration of each pulsed light, the emission cycle of each pulsed light, and the ratio of the emission duration of each pulsed light to the emission cycle (so-called duty ratio). The control unit 18 may also control the movement mode of the processing head 141 by the head drive system 142. The control unit 18 may also control the movement mode of the stage 151 by the stage drive system 152. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). The control unit 18 may also control the supply mode of the modeling material M by the material nozzle 1412. The supply mode may include, for example, at least one of the supply amount of the modeling material M (particularly, the supply amount per unit time) and the supply timing (supply time).

[0070] The control unit 18 does not have to be provided inside the processing apparatus 1. For example, the control unit 18 may be provided outside the processing apparatus 1 as a server or the like. In this case, the control unit 18 and the processing apparatus 1 are communicatively connected via a wired and / or wireless communication network (or a data bus and / or a communication line). The wired communication network may be a network using a communication standard conforming to Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless communication network may be a communication network using radio waves. Examples of communication networks using radio waves include communication standards conforming to IEEE802.11 (e.g., wireless LAN) and Bluetooth (registered trademark). The wireless communication network may be a communication network using infrared rays or a communication network using optical communication. The wired data bus may be a serial bus-type data bus, such as at least one of IEEE1394, RS-232, RS-422, RS-423, RS-485, and USB. The wired data bus may be a parallel bus type data bus, the wired communication line may be an optical network, or the wireless communication line may be a wide area wireless communication network such as 4G or 5G.

[0071] The control unit 18 provided outside the processing device 1 is configured to be able to transmit information such as commands and control parameters to the processing device 1 via a communication network. The processing device 1 may include a receiving unit capable of receiving information such as commands and control parameters from the control unit 18 via the communication network. The processing device 1 may also include a transmitting device that transmits information such as commands and control parameters to the control unit 18 via the communication network (i.e., an output device that outputs information to the control unit 18). Alternatively, a first control unit that performs part of the processing performed by the control unit 18 may be provided inside the processing device 1, and a second control unit that performs another part of the processing performed by the control unit 18 may be provided outside the processing device 1.

[0072] The control unit 18 may be implemented with a computational model that can be constructed by machine learning. The computational model can be implemented by a computing device executing a predetermined computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning the computational model may include learning parameters of the neural network (e.g., at least one of weights and biases). The control unit 18 may control the operation of the processing device 1 using the computational model. That is, the operation of controlling the operation of the processing device 1 may include the operation of controlling the operation of the processing device 1 using the computational model. The control unit 18 may be implemented with a computational model that has been constructed by offline machine learning using training data. The computational model implemented in the control unit 18 may be updated by online machine learning in the control unit 18. Alternatively, the control unit 18 may control the operation of the processing device 1 using a computational model implemented in a device external to the control unit 18 (i.e., a device provided outside the processing device 1) in addition to or instead of the computational model implemented in the control unit 18.

[0073] The storage medium for storing the computer program executed by the control unit 18 may be at least one of optical disks such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark), magneto-optical disks such as MO, magnetic media such as flexible disks (floppy disks) or magnetic tapes, semiconductor memory such as USB memory, and other non-transitory computer-readable media. The storage medium may include a device capable of storing a computer program (for example, a general-purpose device or a dedicated device on which a computer program is implemented in an executable state in the form of at least one of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control unit 18 when the control unit 18 (i.e., the computer) executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA: Field Programmable Gate Array, ASIC: Application Specific Integrated Circuit) provided in the control unit 18, or may be realized in a form that mixes logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0074] The display device 3 performs display based on the display information generated by the processing control device 4. The display device 3 may be a computer having a communication interface, a memory, a display, and a processor. The display device 3 may receive the display information from the processing control device 4 via the communication interface and the communication network NW. The display device 3 may store the display information received from the processing control device 4 in its memory. The processor executes a computer program stored in the memory to display an image generated according to the display information stored in the memory on the display. The display device 3 may be a display included in the processing control device 4. In this case, data transmission and reception between the display device 3 and the processing control device 4 does not need to go through the communication network NW. The generation of display information by the processing control device 4 will be described later.

[0075] 8 is a schematic diagram showing the overall configuration of the machining control device 4. The machining control device 4 controls the operation of the entire machining system 100. For example, the machining control device 4 controls the operation of the machining device 1. The machining control device 4 may also control the operation of the measuring device 2. The machining control device 4 is a computer having a communication interface 41, a memory 42, and a processor 43.

[0076] The machining control device 4 generates machining information for controlling the machining device 1 to machine the workpiece W. The machining control device 4 may receive the machining information from another device. The machining information may be generated based on data representing the three-dimensional shape of the workpiece W (e.g., three-dimensional CAD data).

[0077] The machining information may include, for example, machining path information. The machining path information may indicate a target movement path, which is a path of a target irradiation area to be irradiated with the machining light EL in order to machine the workpiece W. This target movement path may be referred to as a machining path or a tool path. In this case, the machining information may be a G-code indicating the machining path or the tool path. The machining control device 4 may generate or receive, as the machining information, a data file with an extension such as gcode or gco.

[0078] The processing control device 4 sets control information related to the control of processing on the workpiece W. The control information can also be said to be control information for controlling processing including irradiation of the workpiece W with the processing light EL.

[0079] The control information may be information in which at least a part of the processing information has been changed. In this case, the set control information is transmitted from the processing control device 4 to the processing device 1 via the communication network NW, instead of the processing information. The processing device 1 receives (i.e., acquires) the control information transmitted from the processing control device 4. Having received the control information, the processing device 1 processes the workpiece W based on the received control information.

[0080] Furthermore, the control information may be information for changing at least a part of the control of the processing device 1 based on the processing information. In this case, the set control information is transmitted from the processing control device 4 to the processing device 1 via the communication network NW, in addition to the processing information. The processing device 1 receives (i.e., acquires) the processing information and control information transmitted from the processing control device 4. Having received the processing information and control information, the processing device 1 processes the workpiece W based on the received processing information and control information.

[0081] FIG. 9 is a diagram showing an example of information included in the processing information, and FIG. 10 is a diagram showing an example of information included in the control information.

[0082] The information included in the processing information is expressed, for example, as in a table 900. The processing information may be data in a table format, or may be data in another format such as text data or binary data.

[0083] Table 900 shows values ​​of the machining head position PH, which indicates the position and direction in the machining coordinate system of a reference point set in the machining head 141, the stage position PS, which indicates the position and direction in the machining coordinate system of a reference point set in the stage 151, the beam light intensity VEL, which indicates the light intensity of the machining light EL irradiated onto the workpiece W from the irradiation optical system 1411 of the machining head 141, the material flow rate FM, which indicates the amount of modeling material M supplied per unit time from the material nozzle 1412 of the machining head, and the duration D of the irradiation of the machining light EL and the supply of the modeling material M. The machining device 1 processes the workpiece W in accordance with the contents of each row, starting from the top row of table 900.

[0084] Table 900 shows information related to the processing of the target irradiation areas EA1-EA3 of the workpiece W described in FIG. 4. The processing head 141 is first moved to a position corresponding to above (in the +Z direction) the target irradiation area EA1. The processing head 141 is then moved from above the target irradiation area EA1 toward the target irradiation area EA1 (in the -Z direction), where the processing light EL is emitted and the modeling material M is supplied. Thereafter, the processing head 141 is moved to a position corresponding to above (in the +Z direction) the target irradiation area EA2, and the target irradiation areas EA2 and EA3 are processed in the same manner.

[0085] 4, the molten pools MP2 and MP3 formed by irradiating the target irradiation areas EA2 and EA3 with the processing light EL cannot be imaged by the imaging unit 171. The machining control device 4 sets control information so that these molten pools can be imaged by the imaging unit 171.

[0086] The information included in the control information is represented, for example, as shown in Table 1000. The processing information may be data in a table format, or may be data in other formats such as text data or binary data. In this example, the control information is information in which part of the processing information has been changed. Explanation of the unchanged part will be omitted.

[0087] According to the information in table 1000, when the machining head 141 is moved to a position corresponding to the information (+Z direction) of the target irradiation area EA2, the stage 151 is rotated 180 degrees in the θZ direction (around an axis parallel to the Z axis). As a result, the protruding portion WA of the workpiece W in Figure 4 is positioned on the left side (-Y side) of Figure 4. Because the machining head 141 is not rotated, the directions of the lights R2 and R3 are not changed, and as a result, the molten pools MP2 and MP3 can be observed from the right side (+Y side) of Figure 4.

[0088] If the molten pool cannot be observed even by changing the orientation of the machining head 141 or the machining path, the machining device 1 may perform control such as turning off control of the machining light EL based on the state of the molten pool, turning off imaging by the imaging unit 171, or setting the beam amount of the machining light EL to a predetermined fixed value. In addition, the machining device 1 may notify the user that the blind spot cannot be eliminated (there is a molten pool that cannot be observed).

[0089] The processing information including the information shown in Table 900 and the control information shown in Table 1000 can also be considered as path information that indicates, as a path, the order in which the processing light EL is irradiated onto each of the target irradiation areas EA of the workpiece W. Note that the imaging information including the orientation and direction of the imaging unit 171 may be included in the path information or may be separate data.

[0090] 8, the communication interface 41 is an example of a communication unit, and has an interface circuit for receiving data to be processed by the processing control device 4 or outputting data processed by the processing control device 4. The communication interface 41 includes, for example, a communication interface circuit for connecting the processing control device 4 to the communication network NW.

[0091] The memory 42 is an example of a storage unit and includes a volatile semiconductor memory and a non-volatile semiconductor memory. The memory 42 stores various data used in processing by the processor 43, such as log data acquired from the processing device 1. The memory 42 also stores various computer programs 420, such as a log data processing computer program that processes the log data. The computer program 420 provides logic and routines that enable the execution of the processing described below.

[0092] The processor 43 is an example of a control unit and includes one or more processors and their peripheral circuits. The processor 43 may further include other arithmetic circuits, such as a logic unit, a numerical calculation unit, or a graphics processing unit. The processor 43 may also be referred to as a processing circuit. The processor 43 executes the computer program 420 stored in the memory 42, causing the machining control device 4 to perform various processes described in this embodiment. As a result, logical functional blocks for executing operations to be performed by the machining control device 4 may be realized within the processor 43. In this way, the processor 43 can function as a controller for realizing the logical functional blocks for executing operations to be performed by the machining control device 4. In this case, any device (typically, a computer) that executes the computer program 420 can function as the machining control device 4. At least one of the memory 42 and the processor 43 may be referred to as a control circuit (or circuit).

[0093] The processor 43 determines whether at least a portion of the target irradiation area EA on the workpiece W onto which the processing light EL is irradiated and at least a portion of the molten pool MP formed on the workpiece W by irradiation with the processing light EL can be imaged by the imaging unit 171.

[0094] For example, for the target irradiation area EA1 and the molten pool MP1 shown in FIG. 4, the processor 43 determines that the entire target irradiation area processor 43EA1 and the entire molten pool MP1 can be imaged by the imaging unit 171.

[0095] For example, with respect to the target irradiation area EA2 and the molten pool MP2 shown in FIG. 4, the processor 43 determines that the entire target irradiation area EA2 and a part of the molten pool MP2 can be imaged by the imaging unit 171.

[0096] For example, with respect to the target irradiation area EA3 and the molten pool MP3 shown in FIG. 4, the processor 43 determines that the entire target irradiation area EA3 and the entire molten pool MP3 cannot be imaged by the imaging unit 171.

[0097] The processor 43 may determine whether at least one of at least a portion of the target irradiation area EA and at least a portion of the molten pool MP can be imaged by the imaging unit 171 before the workpiece W is machined. Before the workpiece W is machined, for example, it may be before the workpiece W is placed in the chamber space 1A of the machining device 1, or before the first target irradiation area EA of the workpiece W is irradiated with the machining light EL.

[0098] The target irradiation area EA set for the workpiece W is an estimated irradiation position where the processing light EL is irradiated until the processing light EL is actually irradiated, and can be referred to as a virtual irradiation position. The processor 43 may estimate a molten pool (virtual molten pool) formed on the workpiece W when the processing light EL is irradiated at the virtual irradiation position in accordance with the processing control information. The processor 43 may determine whether at least a portion of the target irradiation area EA and at least a portion of the molten pool MP can be imaged by the imaging unit 171 based on at least one of the virtual irradiation position and the virtual molten pool. The processor 43 may determine whether imaging by the imaging unit 171 is obstructed by the workpiece W. The processor 43 may determine whether imaging by the imaging unit 171 is obstructed by an in-progress shape of an object, including a three-dimensional structure ST, added to the workpiece W by irradiation with the processing light EL. The processor 43 may make this determination based on at least one of information representing the in-progress shape and path information indicating the order in which the processing light EL is irradiated onto the multiple target irradiation areas EA set on the workpiece W.

[0099] The processor 43 may estimate the virtual molten pool based on processing information related to processing of the workpiece W stored in the memory 42. The estimation of the virtual molten pool can also be referred to as simulating the virtual molten pool. The processing information may be information related to at least one of the position and movement of the processing head 141 in the processing device 1 that can irradiate the processing light EL toward the workpiece W. The processing information may also include path information that indicates, as a path, the order in which the processing light EL is irradiated onto multiple target irradiation areas EA set on the workpiece W. The path information included in the processing information may be referred to as first path information.

[0100] The machining information may be set based on information about the shape of the workpiece W. For example, the processor 43 of the machining control device 4 stores in the memory 42 measurement information including information about the shape of the workpiece W received from the measuring device 2 via the communication interface 41. The machining control device 4 may receive data files from devices other than the measuring device 2 via the communication interface 41 and the communication network NW, or may accept user operations on an input device connected to the communication interface 41. The processor 43 of the machining control device 4 may generate machining information based on the information about the shape of the workpiece W stored in the memory 42, and store the generated machining information in the memory 42.

[0101] The processor 43 may determine whether at least a portion of the target irradiation area EA and / or at least a portion of the molten pool MP can be imaged by the imaging unit 171 based on imaging information related to imaging by the imaging unit 171. The imaging information may include at least one of the position of the imaging unit 171 and the direction in which the imaging unit 171 images. The imaging information may also include at least one of the range in which the imaging unit 171 can image, the range of the workpiece W imaged by the imaging unit 171, and the distance between the imaging unit 171 and the molten pool MP. The imaging information may also include the distance between the imaging unit 171 and the target irradiation area EA.

[0102] The processor 43 may determine whether at least a portion of the target irradiation area EA and / or at least a portion of the weld pool MP can be imaged by the imaging unit 171 based on information about the size of the weld pool MP. The information about the size of the weld pool MP may include information about the weld pool MP represented in the image. The information about the weld pool MP represented in the image may be, for example, the number of pixels in the image corresponding to the weld pool MP that have a brightness exceeding a predetermined brightness threshold. Furthermore, the information about the size of the weld pool MP may be information representing the size of the weld pool MP estimated based on imaging parameters such as the focal length of the imaging optical system, the pixel size of the imaging element, and the distance between the imaging unit 171 and the weld pool MP.

[0103] The processor 43 may determine that at least a portion of the molten pool MP can be imaged by the imaging unit 171 when the target irradiation area EA can be imaged by the imaging unit 171.

[0104] The processor 43 may determine whether at least a portion of the target irradiation area EA and / or at least a portion of the molten pool MP can be imaged by the imaging unit 171 based on the imaging information and information related to the shape of the workpiece W. For example, the processor 43 may determine that at least a portion of the molten pool MP cannot be imaged by the imaging unit 171 when it is determined based on the imaging information that imaging of at least a portion of the molten pool MP by the imaging unit 171 will be obstructed by the shape of the workpiece W identified based on the information related to the shape of the workpiece W. In this case, the processor 43 may identify an area of ​​the image generated by the imaging unit 171 that is determined to be obstructed by the shape of the workpiece W, and may determine that imaging by the imaging unit 171 will be obstructed by the shape of the workpiece W if the size of the identified area is larger than a predetermined size threshold. The processor 43 may identify the area determined to be obstructed by the shape of the workpiece W as an area other than an area not obstructed by the shape of the workpiece W. In this case, the processor 43 may treat the area where the image captured by the imaging unit 171 is blocked by an area obtained by expanding the shape of the workpiece W by a predetermined amount as the area where the image captured by the imaging unit 171 is blocked by the shape of the workpiece W. The images used in these determinations may not be images actually generated by the imaging unit 171, but may be images obtained by simulating the imaging of a predetermined target irradiation area EA by the imaging unit 171. The processor 43 may perform such simulations using a ray tracing method. Performing a simulation using the ray tracing method allows for accurate determination of whether or not imaging is possible based on the shape of the workpiece W. The processor 43 may use, as information regarding the shape of the workpiece W, a 3D model of the object to be machined or an estimated shape of the object being machined obtained by slicing the 3D model. The processor 43 may also use, as information regarding the shape of the workpiece W, 3D data obtained by measuring the shape of the object currently being machined using a 3D scanner.

[0105] If the workpiece W has multiple target irradiation areas EA that are sequentially irradiated with the processing light EL, the processor 43 may identify, among the multiple target irradiation areas EA, a target irradiation area EA that corresponds to a molten pool determined to be imageable by the imaging unit 171. Furthermore, if the workpiece W has multiple target irradiation areas EA that are sequentially irradiated with the processing light EL, the processor 43 may identify, among the multiple target irradiation areas EA, a target irradiation area EA that corresponds to a molten pool determined to be incapable of being imaged by the imaging unit 171. At this time, the processor 43 may identify the target irradiation areas EA that are determined to be imageable and determine the other target irradiation areas EA as incapable of being imaged. Furthermore, the processor 43 may identify the target irradiation areas EA that are determined to be incapable of being imaged and determine the other target irradiation areas EA as imageable. Furthermore, the processor 43 may identify the molten pools determined to be imageable and the molten pools determined to be incapable of being imaged in addition to, or instead of, the target irradiation areas EA corresponding to the molten pools determined to be imageable and the target irradiation areas EA corresponding to the molten pools determined to be incapable of being imaged.

[0106] Instead of or in addition to determining whether at least one of at least a portion of the target irradiation area EA and at least a portion of the molten pool MP can be imaged by the imaging unit 171, the processor 43 may determine whether at least one of at least a portion of the target irradiation area EA and at least a portion of the molten pool MP is represented in the image generated by the imaging unit 171.

[0107] The processor 43 sets control information related to control of processing of the workpiece W based on the result of the determination in the processor 43. The processing of the workpiece W may include irradiating the workpiece W with processing light EL. The control information may include information related to control of the processing device 1 that irradiates the workpiece W with the processing light EL. The information related to control of the processing device 1 may be information related to the irradiation intensity of the processing light EL.

[0108] With regard to the processing of a workpiece W having a plurality of target irradiation areas EA that are sequentially irradiated with processing light EL, the control information may further include information (first control information) regarding the control (first control) of processing in the target irradiation area EA corresponding to the molten pool MP that is determined to be imageable by the imaging unit 171 among the plurality of target irradiation areas EA.

[0109] The first control may include causing the imaging unit 171 to capture an image of the molten pool MP determined to be imageable by the imaging unit 171, and changing the irradiation intensity of the processing light EL based on the state of the molten pool MP depicted in the image generated by the imaging so that the size of the molten pool MP becomes a target size. The size of the molten pool MP includes the size (diameter, radius, length in the X-axis direction, length in the Y-axis direction, etc.) and depth (length in the Z-axis direction) of the molten pool MP in a plane parallel to the installation surface. The first control information may include information for controlling the irradiation intensity of the processing light EL to be increased when the size of the molten pool MP depicted in the image is smaller than the target size. The first control information may also include information for controlling the irradiation intensity of the processing light EL to be decreased when the size of the molten pool MP depicted in the image is larger than the target size. The first control may also be referred to as molten pool feedback control.

[0110] With regard to the processing of a workpiece W having a plurality of target irradiation areas EA that are sequentially irradiated with processing light EL, the control information may further include information (second control information) regarding the control (second control) of processing in the target irradiation area EA corresponding to the molten pool MP that is determined to be unable to be imaged by the imaging unit 171 among the plurality of target irradiation areas EA.

[0111] The second control is different from the first control. The processor 43 may set the second control information so that the size of the molten pool MP determined to be unimageable by the imaging unit 171 becomes the target size. That is, if the molten pool cannot be imaged, the processor 43 may turn off the molten pool feedback control. Continuing the molten pool feedback control when the molten pool cannot be imaged may result in excessive output of the machining light EL, preventing proper machining. When the molten pool feedback control is turned off, the processor 43 may stop or continue imaging by the imaging unit 171. When the molten pool feedback control is turned off, the processor 43 may execute the molten pool feedback control by inputting dummy data indicating that the molten pool has reached the target size.

[0112] The second control information may include information for setting the irradiation intensity of the processing light EL to a fixed value in a target irradiation area EA corresponding to a molten pool MP determined not to be imageable by the imaging unit 171 among the multiple target irradiation areas EA. This fixed value may be set based on the irradiation intensity of the processing light EL in a target irradiation area EA corresponding to a molten pool MP determined to be imageable, which is a position where the processing light EL was irradiated before the target irradiation area EA corresponding to a molten pool MP determined not to be imageable by the imaging unit 171 among the multiple target irradiation areas EA.

[0113] Furthermore, the second control information may include information for not controlling the processing light EL based on the imaging results of the molten pool MP in the target irradiation area EA corresponding to the molten pool MP that has been determined not to be imageable by the imaging unit 171. Controlling the processing light EL based on the imaging results of the molten pool MP may include, for example, changing the irradiation intensity of the processing light EL based on the state of the molten pool MP shown in the image generated by imaging so that the size of the molten pool MP becomes the target size.

[0114] The second control information may further include information related to imaging by the imaging unit 171. For example, the processor 43 may output control information including second control information that further identifies a direction in which at least one molten pool determined not to be imageable by the imaging unit 171 can be imaged by the imaging unit 171, and includes information related to imaging that causes the imaging unit 171 to image each molten pool in the identified direction for each molten pool. The second control information may also be information for capturing multiple images and selecting one of the multiple images that more appropriately depicts the molten pool. The imaging unit 171 may have multiple mirrors to capture multiple images.

[0115] The processor 43 may output control information including second control information that includes, as information regarding imaging, information for stopping, for a first period, imaging of the molten pool determined to be unimageable by the imaging unit 171. The first period may be a period longer than the time from the start of processing in the target irradiation area EA corresponding to the molten pool MP determined to be unimageable to the start of processing in the target irradiation area EA corresponding to the molten pool MP that is first determined to be imageable by the imaging unit 171 after the molten pool MP.

[0116] The processor 43 may set position control information as control information for changing the relative positional relationship between the stage 151 on which the workpiece W is placed in the processing device 1 that performs processing and the processing head 141 that has an irradiation optical system 1411 that irradiates the processing light EL.

[0117] The position control information may include information for changing the position of at least one of the stage 151 and the machining head 141. The position control information may be information for changing the position of at least one of the stage 151 and the machining head 141 so that at least one of a target irradiation area EA determined to be unable to be imaged by the imaging unit 171 among the multiple target irradiation areas EA and a molten pool MP formed when the target irradiation area EA is irradiated with the machining light EL can be imaged.

[0118] The processor 43 may further specify a direction in which the molten pool MP can be imaged, even though it has been determined that the molten pool MP cannot be imaged by the imaging unit 171. For example, in the example of Figure 4, the processor 43 may specify a direction from left to right (from the -Y side to the +Y side) as the direction in which the molten pool MP3 can be imaged. In this case, the processor 43 may set, as the control information, position control information including information for changing the position of at least one of the stage 151 and the machining head 141 based on the specified direction.

[0119] The processor 43 may further specify an imaging direction that enables imaging of at least one of the following: among the multiple target irradiation areas EA of the workpiece W, at least one unimageable position that is determined to be unimageable by the imaging unit 171; and at least one unimageable molten pool position where the molten pool MP formed when the processing light EL is irradiated onto the target irradiation area EA is determined to be an unimageable molten pool that cannot be imaged by the imaging unit 171. In this case, the unimageable molten pool position may be imageable.

[0120] 4, the target irradiation area EA3 is determined to be an unimageable position where imaging is not possible. The target irradiation area EA2 and the target irradiation area EA3 are determined to be unimageable molten pools because at least a portion of the molten pools MP2 and MP3 formed when the processing light EL is irradiated thereto cannot be observed. In this case, the target irradiation area EA2 can be imaged, and the processor 43 does not determine such a target irradiation area EA as an unimageable position.

[0121] The processor 43 that identifies an imaging direction that enables imaging of at least one of the at least one unimaging position and at least one unimaging molten pool position may set, as the control information, position control information including information for changing the position of at least one of the stage 151 and the machining head 141 based on the identified direction for each of the at least one unimaging position and at least one unimaging molten pool position. When identifying an imaging direction that enables imaging of at least one of the at least one unimaging position and at least one unimaging molten pool position, the processor 43 may set, as the control information, position control information including information for changing the positions of the stage 151 and the machining head 141 so that they are different when irradiating the machining light EL to the corresponding target irradiation area EA.

[0122] Changing the positions of the stage 151 and the machining head 141 based on the information included in the position control information may include rotating at least one of the stage 151 and the machining head 141 around a predetermined rotation axis. The rotation around the predetermined rotation axis can be represented by, for example, θX (rotation around the X axis), θY (rotation around the Y axis), or θZ (rotation around the Z axis).

[0123] The processor 43 may generate the control information based on the positional relationship between the stage 151 and the machining head 141 that is changed by the position control information. In other words, the control information generated by the processor 43 may include information that is generated based on the changed positional relationship.

[0124] The processor 43 may set control information including path information indicating a path along which the processing light EL is irradiated. The path information may indicate a path through which at least one of the molten pools MP formed when the processing light EL is irradiated onto each of the multiple target irradiation areas EA and determined not to be imageable by the imaging unit 171 can be imaged.

[0125] The processing information regarding the processing of the workpiece W may include first path information indicating, as a path, the order in which each of the multiple target irradiation areas EA is irradiated with the processing light EL. The processor 43 may set control information indicating, as a path, the order in which each of the multiple target irradiation areas EA is irradiated with the processing light EL and including second path information different from the first path information. In other words, the order in which each of the multiple target irradiation areas EA is irradiated with the processing light EL differs between the first path information included in the processing information and the second path information set by the processing control device 4.

[0126] In the path indicated by the second path information, it is preferable that the number of times that it is determined that the molten pool formed when the processing light EL is irradiated onto each of the multiple target irradiation areas EA cannot be imaged by the imaging unit 171 is less than the number of times that it is determined that the molten pool formed when the processing light EL is irradiated onto each of the multiple target irradiation areas EA cannot be imaged by the imaging unit 171 in the path indicated by the first path information. In other words, according to the second path information set by the processing control device 4, it is possible to further reduce the number of molten pools determined to be unable to be imaged.

[0127] The processor 43 may identify, among the molten pools MP formed when each of the multiple target irradiation areas EA is irradiated with the processing light EL, those determined to be unimageable along the path indicated by the first path information, those determined to be unimageable along the path indicated by the second path information included in the control information generated based on the processing information including the first path information. In this case, the processor 43 may generate updated control information based on the control information including the second path information, including third path information indicating, as a path, the order in which each of the multiple target irradiation areas EA is irradiated with the processing light EL, so that the molten pools determined to be unimageable (even in the second path information) become imageable. By generating the updated control information by the processor 43, the processing control device 4 can reduce the number of molten pools determined to be unimageable.

[0128] The processor 43 generates display data for displaying the results of the determination by the processor 43 on the display device 3. The display data may include data for displaying at least one of information about the shape of the object and path information indicating the path along which the processed light EL is irradiated. The path information can also be said to be information indicating, as a path, the order in which each of the multiple target irradiation areas EA is irradiated with the processed light EL.

[0129] The display data may include information for displaying at least one of a portion of the shape of the workpiece W that blocks imaging by the imaging unit 171 and a target irradiation area EA, among the multiple target irradiation areas EA on the route indicated in the route information, that corresponds to a molten pool MP that cannot be imaged by the imaging unit 171. The portion of the shape of the workpiece W that blocks imaging by the imaging unit 171 may be identified by the processor 43.

[0130] The display data may include information for displaying multiple pieces of route information, each of which has a different route. For example, the display data may include route information indicating a route including a first route and a second route, each of which has a different route. In this case, the distance required to process the object along the second route may be longer than the distance required to process the object along the first route. Furthermore, the time required to process the object along the second route may be longer than the time required to process the object along the first route.

[0131] When the processor 43 determines that at least a portion of the target irradiation area EA and / or at least a portion of the molten pool MP cannot be imaged by the imaging unit 171, the processor 43 may include data for causing the display device 3 to display a message urging the user of the machining system 100 to take action. The message urging the user to take action may be, for example, changing the machining path, modifying a model representing the three-dimensional shape of the workpiece W or re-measuring it using the measuring device 2, changing the imaging conditions, or the like. The message urging the user to take action may be any message that can ultimately trigger the user to take action. The message urging the user to take action may be a message that directly instructs the user to take action, such as a string of text such as "Please consider changing the machining path."

[0132] The processor 43 may generate display data including data indicating the path along which the processing light EL is irradiated, so that at least one of the target irradiation area EA and the molten pool MP, at least a portion of which has been determined to be incapable of being imaged by the imaging unit 171, can be imaged.

[0133] The processor 43 may generate display data when a predetermined display condition is satisfied. The predetermined display condition may be, for example, that the number or proportion of target irradiation areas EA included in the workpiece W that are determined to be unimageable exceeds a predetermined unimageable threshold.

[0134] The processor 43 may generate display data for notifying the user when the processor 43 cannot set control information that enables imaging of at least one of the target irradiation area EA and the molten pool MP, at least a portion of which has been determined not to be imageable by the imaging unit 171. This display data may include information for displaying to prompt the user to change the model representing the three-dimensional shape of the workpiece W.

[0135] The processor 43 may generate display data for displaying, as route information, control information including the information represented in table 1000 shown in Fig. 10. The processor 43 may also generate display data for displaying, as route information, the control information and processing information including the information represented in table 900 shown in Fig. 9. In this case, the route indicated by the information represented in table 900 can be referred to as a first route, and the route indicated by the information represented in table 1000 can be referred to as a second route.

[0136] The machining control device 4 does not need to have the processor 43. In this case, the machining control device 4 sets control information related to control of machining in the machining device 1 based on the result of determination by the processor 43. It can be said that such machining control device 4 and machining device 1 constitute a machining system that machines the workpiece W.

[0137] The machining control device 4 does not need to have a processor 43. In this case, the machining control device 4 generates display data to be displayed on the display device 3 based on the result of determination by the processor 43. Such machining control device 4 and display device 3 can be said to constitute a display system that displays information related to the machining of the workpiece W.

[0138] The processing control device 4 may be configured as a cloud server. In this case, the processing control device 4 is communicably connected to at least one of the processing device 1 and the measuring device 2 via the communication network NW and the Internet (not shown).

[0139] 11 is a flowchart of the machining control process by the processor 43 of the machining control device 4. The processor 43 of the machining control device 4 executes the machining control process related to the machining of the workpiece W in accordance with the following flowchart.

[0140] The processor 43 of the processing control device 4 acquires processing information (step S11), acquires shape information (step S12), and acquires imaging information (step S13). The order in which these pieces of information are acquired is not limited to the order shown in this flowchart and can be changed.

[0141] Next, the processor 43 sets the control information based on the acquired information (step S14). The control information setting process for setting the control information will be described later.

[0142] Then, the processor 43 controls the machining device based on the set control information (step S15), and ends the machining control process.

[0143] 12 is a flowchart of the control information setting process. The processor 43 of the machining control device 4 executes the control information setting process as step S14 of the machining control process.

[0144] The processor 43 of the machining control device 4 sets N to 1 as an initial value (step S21). N represents the order of the layers to be machined by the machining device 1.

[0145] The processor 43 determines whether or not each point on the Nth layer can be imaged (step S22). If each point on the Nth layer can be imaged (step S22: Yes), the processor 43 ends the control information setting process.

[0146] If any of the points on the Nth layer cannot be imaged (step S22: No), the processor 43 determines whether control information that enables the image of the points that cannot be imaged can be set (whether the blind spot can be eliminated) (step S23). If the blind spot can be eliminated (step S23: Yes), the processor 43 sets the first control information as the control information (step S24). If the blind spot cannot be eliminated (step S23: No), the processor 43 sets the second control information as the control information (step S25).

[0147] The processor 43 determines whether there is a next layer to be processed (step S26). If there is a next layer (step S26: Yes), the process by the processor 43 returns to step S22, and N is set to N+1 (for the layer one level above), and the processes of steps S22 to S26 are repeated. If there is no next layer (step S26: No), the processor 43 ends the control information setting process and executes step S15 of the processing control process.

[0148] By executing the machining control process in this manner, the machining control device 4 can appropriately control the machining of the workpiece W.

[0149] The machining system 100 may perform a weld pool feedback control operation based on the weld pool image generated by the imaging unit 171 in parallel with the above-described additional machining operation. That is, the machining system 100 may perform a weld pool feedback control operation during at least a portion of the period during which the above-described additional machining operation is being performed. The weld pool feedback control operation is an operation for controlling the machining unit 14 based on the weld pool image so that the size of the weld pool area MPA in the weld pool image becomes a target size. The weld pool area MPA will be described in detail later.

[0150] The flow of the molten pool feedback control operation will be described below with reference to Fig. 13. Fig. 13 is a flowchart showing the flow of the molten pool feedback control operation.

[0151] 13 , the control unit 18 acquires a molten pool image IMG from the imaging unit 171 (step S31). Specifically, the imaging unit 171 captures an image of the workpiece W or the structural layer SL on which molten pools MP#1 and MP#2 are formed. That is, the imaging unit 171 captures images of the molten pools MP#1 and MP#2. As a result, the imaging unit 171 generates a molten pool image IMG in which the molten pools MP#1 and MP#2 are captured. The imaging unit 171 outputs the generated molten pool image IMG to the control unit 18. As a result, the control unit 18 acquires the molten pool image IMG.

[0152] The imaging unit 171 images the molten pools MP#1 and MP#2 so that they fall within the imaging range of the imaging unit 171. Specifically, the imaging unit 171 may be aligned with the workpiece W or the structural layer SL on which the molten pools MP#1 and MP#2 are formed so that the molten pools MP#1 and MP#2 fall within the imaging range of the imaging unit 171. The imaging unit 171 may be aligned with the machining head 21 so that the molten pools MP#1 and MP#2 formed on the build surface MS by the machining head 21 fall within the imaging range of the imaging unit 171. As a result, the imaging unit can properly image the molten pools MP#1 and MP#2.

[0153] The imaging unit 171 may repeatedly capture images of the workpiece W or the structural layer SL on which the molten pool MP is formed at a predetermined imaging rate. That is, the imaging unit may capture images of the workpiece W or the structural layer SL on which the molten pool MP is formed multiple times consecutively at the predetermined imaging rate. The imaging rate may be an index value indicating the number of times the imaging unit 171 captures images of the workpiece W or the structural layer SL per unit time (e.g., per second). In other words, the imaging unit 171 may repeatedly capture images of the workpiece W or the structural layer SL each time a predetermined imaging cycle elapses. For example, the imaging unit 171 may capture an image of the workpiece W or the structural layer SL at a first time, and then capture the image of the workpiece W or the structural layer SL at a second time, a predetermined imaging cycle after the first time. The imaging cycle may be the reciprocal of the imaging rate. In this case, the imaging unit 171 may generate multiple molten pool images IMG as time-series data. The control unit 18 may acquire multiple molten pool images IMG as time-series data.

[0154] Note that, when the imaging unit 171 repeatedly captures images of the workpiece W or the structural layer SL, the imaging unit 171 may be considered to expose the imaging element to light from the workpiece W or the structural layer SL multiple times. In this case, multiple exposures in a single imaging session to capture one image of the imaging element may be referred to as multiple exposures. That is, the imaging unit 171 may generate multiple molten pool images IMG as time-series data by performing multiple exposures of the imaging element. In other words, the imaging unit 171 may generate multiple molten pool images IMG as time-series data by performing multiple exposures of the molten pool MP using the imaging element. That is, the imaging unit 171 may generate multiple molten pool images IMG as a result of the multiple exposures by performing multiple exposures of the molten pool MP using the imaging element.

[0155] Thereafter, the control unit 18 generates weld pool image information MPI based on at least one weld pool image IMG acquired in step S31 (step S32). The weld pool image information MPI is information about the weld pools MP#1 and MP#2 that appear in the weld pool image IMG.

[0156] The control unit 18 may generate information about the weld pool area MPA as an example of the weld pool image information MPI. The weld pool area MPA may include an area in the weld pool image IMG where the weld pools MP#1 and MP#2 are captured, as shown in FIG. 14 .

[0157] To generate information about the weld pool area MPA, the control unit 18 may use at least two of the multiple weld pool images IMG acquired as time-series data in step S31. In other words, the control unit 18 may generate information about the weld pool area MPA using multiple weld pool images IMG corresponding to at least some of the multiple weld pool images IMG acquired as time-series data in step S31.

[0158] Specifically, the left side of Figure 15 shows multiple weld pool images IMG acquired as time-series data. As shown on the left side of Figure 15, if the weld pool MP#1 moves due to irradiation with the processing light EL, the position at which the weld pool MP#1 is captured may change among the multiple weld pool images IMG. This is because, as described above, if the weld pool MP#1 moves due to irradiation with the processing light EL, the imaging unit 171 may capture the weld pool MP#1 formed at a first position on the build surface MS at a first time, and then capture the weld pool MP#1 formed at a second position on the build surface MS different from the first position at a second time different from the first time. In particular, if the exposure time of the imaging unit 171 is shorter than a certain time, the position at which the weld pool MP#1 is captured may change among the multiple weld pool images IMG. For the same reason, if the weld pool MP#2 moves due to irradiation with the processing light EL, the position at which the weld pool MP#2 is captured may change among the multiple weld pool images IMG.

[0159] In this case, the control unit 18 may generate an added image IMG_C by adding at least two consecutive weld pool images IMG out of the multiple weld pool images IMG acquired in step S31 to generate information about the weld pool area MPA, as shown in Fig. 15. In other words, the control unit 18 may generate an added image IMG_C by combining at least two consecutive weld pool images IMG. The added image IMG_C may also be referred to as a composite image.

[0160] Specifically, the control unit 18 may add at least two successive weld pool images IMG in pixel units. For example, the control unit 18 may add the signal values ​​of at least two successive weld pool images IMG in pixel units. An example of the signal value of the weld pool image IMG is a value related to brightness (i.e., brightness value). The number of weld pool images IMG to be added may be set in advance. The number of weld pool images IMG to be added may be set as appropriate by the control unit 18. The number of weld pool images IMG to be added may be set as appropriate by the user of the machining system 100.

[0161] In this case, the additive image IMG_C may be an image in which the signal value of each pixel in the additive image IMG_C is the sum of the signal values ​​of each pixel in the at least two added weld pool images IMG. Specifically, the additive image IMG_C may be an image in which the signal value of the pixel in the xth row and yth column of the additive image IMG_C is the sum of the signal values ​​of the pixel in the xth row and yth column of the at least two added weld pool images IMG. Note that x is a variable that is 1 or greater and indicates an integer that is equal to or less than the total number of horizontal pixels in the additive image IMG_C and the weld pool image IMG. y is a variable that is 1 or greater and indicates an integer that is equal to or less than the total number of vertical pixels in the additive image IMG_C and the weld pool image IMG.

[0162] The control unit 18 typically acquires the weld pool image IMG represented by a digital signal from the imaging unit. In this case, the control unit 18 may add together the multiple weld pool images IMG by adding together multiple digital signals representing the multiple weld pool images IMG. For example, the control unit 18 may add together the multiple digital signals using an adder (i.e., a hardware adder) that adds input digital signals. For example, the control unit 18 may add together the multiple weld pool images IMG by storing the digital signals in a buffer and then adding the digital signals stored in the buffer (i.e., adding the digital signals as software processing). Alternatively, the control unit 18 may add together the multiple weld pool images IMG by performing predetermined image processing on the multiple weld pool images IMG and then adding together multiple digital signals representing the multiple weld pool images IMG that have undergone the predetermined image processing. Examples of the predetermined signal processing include at least one of gamma processing, noise reduction processing, and HDR (High Dynamic Range) processing.

[0163] Alternatively, the control unit 18 may acquire the weld pool image IMG represented by an analog signal from the imaging unit. In this case, the control unit 18 may add together the multiple weld pool images IMG by adding together multiple analog signals representing the multiple weld pool images IMG. Alternatively, the control unit 18 may convert the analog signal into a digital signal. Thereafter, the control unit 18 may add together the multiple weld pool images IMG by adding together multiple digital signals representing the multiple weld pool images IMG, similar to the case where the control unit 18 acquires the weld pool image IMG represented by a digital signal from the imaging unit.

[0164] Thereafter, the control unit 18 may detect the weld pool area MPA in the additive image IMG_C, in which the weld pools MP#1 and MP#2 are reflected. Specifically, as shown on the left side of FIG. 15 , the signal value of the area in the weld pool image IMG where the weld pool MP is reflected differs from the signal value of the area in which the weld pool MP is not reflected. This is because the weld pool MP emits strong light. Therefore, the luminance value of the area in the weld pool image IMG where the weld pool MP is reflected differs from the luminance value of the area in which the weld pool MP is not reflected. Typically, the luminance value of the area in the weld pool image IMG where the weld pool MP is reflected is higher than the luminance value of the area in which the weld pool MP is not reflected. Therefore, as shown on the right side of FIG. 15 , the signal value of the area in the additive image IMG_C where the weld pool MP is reflected differs from the signal value of the area in which the weld pool MP is not reflected. In other words, the signal value of the weld pool area MPA in the additive image IMG_C differs from the signal value of the area other than the weld pool area MPA. Typically, the brightness value of the weld pool region MPA is higher than the brightness value of regions other than the weld pool region MPA. Therefore, the control unit 18 may detect the weld pool region MPA in the additive image IMG_C by comparing the signal value (e.g., brightness value) of each pixel in the additive image IMG_C with a predetermined binarization threshold. For example, the control unit 18 may detect pixels in the additive image IMG_C that have a signal value (e.g., brightness value) greater than the predetermined binarization threshold. In other words, the control unit 18 may detect pixels in the additive image IMG_C whose added signal value (e.g., brightness value) is greater than the predetermined binarization threshold. In this case, the control unit 18 may detect the region including the detected pixel as the weld pool region MPA.

[0165] The binarization threshold may be set to an appropriate value that allows the weld pool area MPA and an area other than the weld pool area MPA to be distinguished from each other based on the signal value (e.g., brightness value). The binarization threshold may be set in advance. The binarization threshold may be set as appropriate by the control unit 18. The binarization threshold may be set as appropriate by the user of the machining system 100.

[0166] The weld pool area MPA detected in the additive image IMG_C may be considered to be substantially equivalent to the area through which the weld pools MP#1 and MP#2 moved. In particular, the weld pool area MPA detected in the additive image IMG_C may be considered to be substantially equivalent to the area through which the weld pools MP#1 and MP#2 moved during the period when the at least two weld pool images IMG used to generate the additive image IMG_C were captured. Therefore, the weld pool area MPA may refer to the area through which the weld pools MP#1 and MP#2 moved.

[0167] The molten pool area MPA detected in the additive image IMG_C may be considered to be substantially equivalent to the area where the processing system 100 successively forms the molten pools MP#1 and MP#2 at different positions. Therefore, the molten pool area MPA may refer to the area where the processing system 100 successively forms the molten pools MP#1 and MP#2 at different positions.

[0168] The control unit 18 may then generate information about the weld pool region MPA as weld pool image information MPI based on the detection result of the weld pool region MPA. For example, the control unit 18 may generate information about the size of the weld pool region MPA as an example of the information about the weld pool region MPA. As an example, the control unit 18 may calculate the area of ​​the weld pool region MPA and generate information about the calculated area of ​​the weld pool region MPA as information about the size of the weld pool region MPA. In this case, the control unit 18 may calculate the number of pixels constituting the weld pool region MPA as the area of ​​the weld pool region MPA. That is, the control unit 18 may generate information about the size of the weld pool region MPA by calculating the number of pixels having a signal value (e.g., brightness value) greater than a predetermined binarization threshold based on the additive image IMG_C.

[0169] However, instead of using multiple weld pool images IMG, the control unit 18 may generate information about the weld pool area MPA using a single weld pool image IMG. Specifically, the control unit 18 may detect the weld pool area MPA in the weld pool image IMG by comparing the signal value (e.g., brightness value) of each pixel in the weld pool image IMG with a predetermined binarization threshold. For example, the control unit 18 may detect pixels in the weld pool image IMG that have a signal value (e.g., brightness value) greater than the predetermined binarization threshold. In this case, the control unit 18 may detect the area including the detected pixel as the weld pool area MPA. Then, the control unit 18 may generate information about the weld pool area MPA as weld pool image information MPI based on the detection result of the weld pool area MPA.

[0170] Alternatively, when the exposure time of the imaging unit is longer than a certain time, there is a high possibility that a weld pool area MPA similar to the weld pool area MPA reflected in the additive image IMG_C will be reflected in one weld pool image IMG. For example, when the exposure time of the imaging unit is longer than a certain time determined according to the period of the periodic movement of the weld pools MP#1 and MP#2, there is a high possibility that a weld pool area MPA similar to the weld pool area MPA reflected in the additive image IMG_C will be reflected in one weld pool image IMG. As an example, when the exposure time of the imaging unit is longer than one period of the periodic movement of the weld pools MP#1 and MP#2, there is a high possibility that a weld pool area MPA similar to the weld pool area MPA reflected in the additive image IMG_C will be reflected in one weld pool image IMG. For this reason, when the exposure time of the imaging unit is longer than a certain time, the control unit 18 may generate weld pool image information MPI without using multiple weld pool images IMG. The control unit 18 may generate the weld pool image information MPI using a single weld pool image IMG that includes the weld pool area MPA.

[0171] The exposure time of the imaging unit may refer to the time during which the imaging element of the imaging unit is exposed to light. For example, if the imaging unit has a mechanical shutter, the exposure time of the imaging unit may refer to the time during which the mechanical shutter is in an open state. In other words, the exposure time of the imaging unit may refer to the time from when the mechanical shutter is switched to an open state to when the mechanical shutter is switched to a closed state. The open state may refer to the state in which the mechanical shutter is open. The closed state may refer to the state in which the mechanical shutter is closed. Alternatively, if the imaging unit has an electronic shutter, the exposure time of the imaging unit may refer to the time during which the electronic shutter is in an on state. In other words, the exposure time of the imaging unit may refer to the time from when the electronic shutter is switched to an on state to when the electronic shutter is switched to an off state. The on state may refer to the state in which the electronic shutter is on. The state in which the electronic shutter is on may refer to a state in which each pixel of the image sensor is exposed to light in one image capture and each pixel of the image sensor can accumulate electric charge based on the amount of light.

[0172] Alternatively, if the imaging unit is equipped with a mechanical shutter, the imaging unit may open and close the mechanical shutter multiple times at timing synchronized with the imaging rate. Even in this case, the imaging unit may be considered to be performing multiple exposures. The imaging unit may then read out the charges accumulated in each pixel of the imaging element. Even in this case, there is a high possibility that a single weld pool image IMG generated by the imaging unit will include a weld pool area MPA similar to the weld pool area MPA captured in the additive image IMG_C. Therefore, the control unit 18 may generate the weld pool image information MPI using a single weld pool image IMG that includes the weld pool area MPA.

[0173] Even if the imaging unit is equipped with an electronic shutter, the imaging unit may turn the electronic shutter on and off multiple times in synchronization with the imaging rate. In this case, the imaging unit may be considered to be performing multiple exposures. The imaging unit may then read out the charges accumulated in each pixel of the imaging element. Even in this case, there is a high possibility that a single weld pool image IMG generated by the imaging unit will include a weld pool area MPA similar to the weld pool area MPA captured in the additive image IMG_C. Therefore, the control unit 18 may generate the weld pool image information MPI using a single weld pool image IMG that includes the weld pool area MPA. However, the imaging unit may also read out the charges accumulated in each pixel of the imaging element each time the electronic shutter is turned on and off. In this case, the imaging unit may be considered to be essentially generating multiple weld pool images IMG as time-series data.

[0174] 13, the control unit 18 then controls the machining system 100 based on the molten pool image information MPI generated in step S32 (step S33). For example, as shown in FIG. 13, the control unit 18 controls the machining system 100 based on the molten pool image information MPI so that the size of the molten pool area MPA becomes a predetermined target size.

[0175] As an example, the control unit 18 may control the intensity of the processing light emitted by the light source so that the size of the weld pool area MPA becomes a predetermined target size. That is, the control unit 18 may perform DC modulation control, which controls the DC component of the intensity of the processing light EL. That is, when the intensity of the processing light EL changes, the size of the weld pool MP#1 changes. For example, the higher the intensity of the processing light EL, the greater the amount of the building material M (or the material that constitutes the building surface MS) melted by the processing light EL. Therefore, the higher the intensity of the processing light EL, the larger the size of the weld pool MP. When the sizes of the weld pools MP#1 and MP#2 change, the size of the weld pool area MPA reflected in the weld pool image IMG or the added image IMG_C changes.

[0176] As another example, the control unit 18 may control the galvanometer mirrors provided in the irradiation optical system to move each of the weld pools MP#1 and MP#2 so that the size of the weld pool area MPA becomes a predetermined target size. When the range over which the galvanometer mirror moves the weld pool MP#1 changes, the size of the weld pool area MPA reflected in the weld pool image IMG or the added image IMG_C changes. Similarly, when the range over which the galvanometer mirror 2156 moves the weld pool MP#2 changes, the size of the weld pool area MPA reflected in the weld pool image IMG or the added image IMG_C changes. Therefore, the control unit 18 can control the size of the weld pool area MPA by controlling the galvanometer mirrors.

[0177] The operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes the target size may include an operation of controlling the processing system 100 so that the difference between the size of the weld pool region MPA and the target size becomes smaller. In other words, the operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes the target size may include an operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes closer to the target size. Furthermore, the operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes the target size may include an operation of controlling the processing system 100 so that the difference between the size of the weld pool region MPA and the target size becomes zero. In other words, the operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes the target size may include an operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes equal to the target size. In either case, the control unit 18 may be considered to be performing feedback control of the processing system 100 based on the size of the weld pool region MPA.

[0178] As a result, the size of the weld pool area MPA is maintained at the target size. As described above, the weld pool area MPA corresponds to the area through which the weld pools MP#1 and MP#2 move. Therefore, the size of the weld pool area MPA is essentially correlated with the sizes of the machining unit areas BSA#1 and BSA#2 through which the weld pools MP#1 and MP#2 move, respectively. Therefore, when the size of the weld pool area MPA is maintained at the target size, the sizes of the machining unit areas BSA#1 and BSA#2 are also maintained at sizes corresponding to the target sizes. As a result, the size (typically, width) of a linear object formed by moving the machining unit areas BSA#1 and BSA#2 on the building surface MS is also maintained at a size corresponding to the target size. This is because the size of the linear object is correlated with the sizes of the machining unit areas BSA#1 and BSA#2. Therefore, by performing the weld pool feedback control operation, the machining system 100 can form a linear object having a desired size (typically, a desired width). In other words, by performing the molten pool feedback control operation, the machining system 100 reduces the possibility of erroneously forming a linear object having a size different from the desired size, and therefore the machining system 100 can form an object with high forming accuracy.

[0179] In the above description, the control unit 18 generates the molten pool image information MPI that correlates with the sizes of the machining unit areas BSA#1 and BSA#2 by adding together at least two molten pool images IMG. However, the control unit 18 may calculate an index value that correlates with the sizes of the machining unit areas BSA#1 and BSA#2 (i.e., the sizes of the areas through which the molten pools MP#1 and MP#2 move) from at least two molten pool images IMG without adding together at least two molten pool images IMG. In this case, the control unit 18 may control the machining system 100 in step S33 of FIG. 13 so that the calculated index value becomes the above-mentioned target size (or a value corresponding to the target size).

[0180] As an example, the control unit 18 may calculate the sizes of at least two weld pools MP that appear in at least two weld pool images IMG. For example, the control unit 18 may calculate the size of the weld pool MP that appears in the first weld pool image IMG, and also calculate the sizes of weld pools MP#1 and MP#2 that appear in a second weld pool image IMG that is different from the first weld pool image IMG. The control unit 18 may then add together the calculated sizes of at least two weld pools MP. For example, the control unit 18 may add together the sizes of the weld pools MP#1 and MP#2 that appear in the first weld pool image IMG and the sizes of the weld pools MP#1 and MP#2 that appear in the second weld pool image IMG. In this case, the value obtained by adding together the sizes of the at least two weld pools MP may be used as an index value that correlates with the sizes of the machining unit areas BSA#1 and BSA#2 (i.e., the size of the area through which the weld pools MP#1 and MP#2 move).

[0181] As another example, the control unit 18 may calculate the positions of at least two weld pools MP that appear in at least two weld pool images IMG. For example, the control unit 18 may calculate the positions of weld pools MP#1 and MP#2 that appear in a first weld pool image IMG, and also calculate the positions of weld pools MP#1 and MP#2 that appear in a second weld pool image IMG that is different from the first weld pool image IMG. The control unit 18 may then calculate the sizes of the machining unit areas BSA#1 and BSA#2 (i.e., the sizes of the areas through which weld pools MP#1 and MP#2 move) based on the calculated positions of at least two weld pools MP. For example, as described above, because the target irradiation area EA#1 periodically moves along one direction within the machining unit area BSA#1, the weld pool MP#1 also periodically moves along one direction. In this case, the control unit 18 may calculate the positions of both ends in one direction of the area through which the weld pool MP#1 moves based on the calculated position of the weld pool MP#1. For example, the control unit 18 may calculate the position where the coordinate indicating the position of the molten pool MP#1 is maximum and the position where the coordinate indicating the position of the molten pool MP#1 is minimum as the positions of both ends in one direction of the area through which the molten pool MP#1 moves. Then, the control unit 18 may calculate the distance between the calculated positions of both ends as an index value correlating with the size of the machining unit areas BSA#1 and BSA#2 (i.e., the size of the area through which the molten pools MP#1 and MP#2 move). In this case, the control unit 18 may control the machining system 100 in step S33 of FIG. 13 so that the calculated index value becomes a distance corresponding to the above-mentioned target size.

[0182] The following additional notes are provided regarding the above-described embodiment.

[0183] [Supplementary Note 1] An information processing method, in a processing system that processes an object by irradiating the object with a beam, comprising: determining whether an imaging unit of the processing system can capture an image of at least one of an irradiation position selected from at least one target position of the object to be irradiated with the beam and a molten pool formed on the object by irradiating the object with the beam; and setting control information for the processing system based on the determination result.

[0184] [Supplementary Note 2] In a processing system that processes an object by irradiating the object with a beam, an information processing method includes: determining whether or not an imaging unit of the processing system is obstructing an imaging of at least one of an irradiation position selected from at least one target position of the object to be irradiated with the beam and a molten pool formed on the object by irradiating the object with the beam, by the shape of the object; and setting control information for the processing system based on the determination result.

[0185] [Supplementary Note 3] An information processing method, in a processing system that processes an object by irradiating the object with a beam, comprising: determining whether or not at least one of an irradiation position selected from at least one target position on the object to be irradiated with the beam and a molten pool formed on the object by irradiating the object with the beam is shown in an image generated by an imaging unit of the processing system; and setting control information for the processing system based on the determination result.

[0186] [Supplementary Note 4] An information processing method including: acquiring processing information for processing an object from a processing system that processes the object by irradiating the object with a beam; and determining, based on the processing information, whether a molten pool formed on the object by irradiating the object with the beam can be imaged by an imaging unit of the processing system.

[0187] At least some of the components of the above-described embodiments can be appropriately combined with at least some of the components of the above-described embodiments. Some of the components of the above-described embodiments may not be used. It should be understood that those skilled in the art can make various changes, substitutions, and alterations to the present disclosure without departing from the spirit and scope of the present disclosure.

[0188] 100 Machining system 1 Machining device 2 Measuring device 3 Display device 4 Machining control device

Claims

1. Determining whether at least part of the irradiation position on the object where the beam is irradiated and / or at least part of at least part of the molten pool formed on the object by the irradiation of the beam can be imaged by the imaging unit; and setting control information regarding the control of processing including the irradiation of the beam onto the object based on the result of the determination. An information processing method including the above.

2. The determining is performed before the object is processed. The information processing method according to claim 1.

3. The determining is performed based on at least one of a virtual irradiation position which is an irradiation position estimated to be irradiated with the beam and a virtual molten pool estimated to be formed on the object when the beam is irradiated. The information processing method according to claim 1 or 2.

4. The virtual molten pool is simulated based on processing information regarding the processing of the object. The information processing method according to claim 3.

5. The control information includes information regarding the irradiation intensity of the beam irradiated onto the object, which is set based on information regarding at least one of the virtual irradiation position and the virtual molten pool. The information processing method according to claim 3 or 4.

6. The determining includes simulating whether at least one of the irradiation position and the molten pool can be imaged by the imaging unit. The information processing method according to any one of claims 1 - 5.

7. The determining is performed during the processing of the object. The information processing method according to claim 1.

8. The determining is performed based on processing information regarding the processing of the object. The information processing method according to any one of claims 1 - 7.

9. The processing apparatus for performing the processing includes at least a processing head capable of irradiating the beam toward the object. The processing information includes information regarding at least one of the position and movement of the processing head. The information processing method according to claim 8.

10. The processing information includes path information indicating the path along which the beam is irradiated, which is set based on information regarding the shape of the object. The information processing method according to claim 8 or 9.

11. The determining is performed based on information regarding the shape of the object. The information processing method according to any one of claims 1 - 10.

12. The information processing method according to any one of claims 1 to 11, wherein the determining includes determining whether imaging by the imaging unit is blocked by the object.

13. The processing is additive processing for adding a three-dimensional structure to the object by supplying a material to a molten pool formed by irradiating the irradiation position sequentially selected from a plurality of target positions of the object with the beam, and the determining includes determining whether imaging by the imaging unit is blocked by an intermediate shape of the object including the three-dimensional structure added by the irradiation of the beam in the processing. The information processing method according to any one of claims 1 to 11.

14. The information processing method according to claim 13, wherein the determining is performed based on at least one of information representing the intermediate shape and path information representing a path along which the beam is irradiated to the irradiation position sequentially selected from the plurality of target positions.

15. The information processing method according to any one of claims 1 to 14, wherein an optical axis of an imaging optical system of the imaging unit is different from an optical axis of the beam.

16. The information processing method according to claim 15, wherein light traveling in a direction intersecting the irradiation direction of the beam is incident on the imaging unit from the irradiation position or the molten pool.

17. The information processing method according to any one of claims 1 to 16, wherein the imaging unit is provided in a processing apparatus that processes the object by irradiating the object with a beam from a processing head capable of changing a relative position with respect to the object.

18. The information processing method according to claim 17, wherein a positional relationship of the imaging unit with respect to the processing head is fixed.

19. The information processing method according to claim 18, wherein the imaging unit is fixed to the processing head.

20. The information processing method according to any one of claims 1 to 19, wherein the determining is performed based on imaging information regarding imaging by the imaging unit.

21. The information processing method according to claim 20, wherein the imaging information includes at least one of a position of the imaging unit, a direction in which the imaging unit images, and an angle.

22. The imaging information includes at least one of a range that can be imaged by the imaging unit, a range of the object imaged by the imaging unit, and a distance between the imaging unit and the melting bath, according to the information processing method of claim 21.

23. The setting is performed based on information regarding the size of the melting bath, according to the information processing method of any one of claims 1 - 22.

24. Further including generating, based on a determination that at least a part of the melting bath is imageable by the imaging unit, an image representing at least a part of the melting bath by the imaging unit, wherein the information regarding the size of the melting bath includes information regarding the melting bath represented in the image, according to the information processing method of claim 23.

25. In the determination, when the irradiation position is imageable by the imaging unit, it is determined that at least a part of the melting bath is imageable by the imaging unit, according to the information processing method of any one of claims 1 - 24.

26. The determination is performed based on imaging information regarding imaging by the imaging unit and information regarding the shape of the object, according to the information processing method of any one of claims 1 - 25.

27. The determination includes determining that at least a part of the melting bath is not imageable by the imaging unit when it is determined, based on the imaging information, that imaging of at least a part of the melting bath by the imaging unit is blocked by the shape of the object specified based on the information regarding the shape of the object, according to the information processing method of claim 26.

28. The determination includes specifying a region determined to be blocked by the shape of the object in the image generated by imaging by the imaging unit, and determining that the imaging by the imaging unit is blocked by the shape of the object when the size of the specified region is larger than a predetermined size threshold, according to the information processing method of claim 27.

29. In specifying a region blocked by the shape of the object in the image generated by imaging by the imaging unit, a region blocked by the imaging by the imaging unit in a region where the shape of the object is expanded by a predetermined amount is treated as a region blocked by the shape of the object in the imaging by the imaging unit, according to the information processing method of claim 28.

30. The information processing method according to claim 28 or 29, wherein identification of a region blocked by imaging by the imaging unit due to the shape of the object is performed by a ray tracing method.

31. The object has a plurality of target positions that are sequentially irradiated with the beam, and the determining includes at least one of identifying a target position corresponding to the molten pool determined to be imageable by the imaging unit among the plurality of target positions and identifying a target position corresponding to the molten pool determined not to be imageable by the imaging unit among the plurality of target positions. The information processing method according to any one of claims 1 - 30.

32. The processing includes forming a molten pool in the object by irradiating the object with a beam and supplying a material to the molten pool. The information processing method according to any one of claims 1 - 31.

33. The control information includes information related to control of a processing apparatus that irradiates the object with the beam. The information processing method according to any one of claims 1 - 32.

34. The control information is information related to the irradiation intensity of the beam. The information processing method according to claim 33.

35. The object has a plurality of target positions that are sequentially irradiated with the beam, the control information further includes first control information related to first control of processing at a target position corresponding to the molten pool determined to be imageable by the imaging unit among the plurality of target positions, and the first control includes causing the imaging unit to image the molten pool determined to be imageable by the imaging unit and changing the irradiation intensity of the beam so that the size of the molten pool becomes a target size based on the state of the molten pool represented in the image generated by the imaging. The information processing method according to claim 34.

36. The first control information includes at least one of information for controlling the irradiation intensity of the beam to increase when the size of the molten pool represented in the image is smaller than the target size and information for controlling the irradiation intensity of the beam to decrease when the size of the molten pool represented in the image is larger than the target size. The information processing method according to claim 35.

37. The control information includes second control information regarding second control of processing at a target position corresponding to the molten pool determined to be non-imaginable by the imaging unit among the plurality of target positions, and the second control is different from the first control. The information processing method according to claim 35 or 36.

38. In the setting, the second control information is set such that the size of the molten pool determined to be non-imaginable by the imaging unit becomes the target size. The information processing method according to claim 37.

39. The second control information includes information for setting the irradiation intensity of the beam to a fixed value at a target position corresponding to the molten pool determined to be non-imaginable by the imaging unit among the plurality of target positions. The information processing method according to claim 37 or 38.

40. The fixed value is a position where the beam was irradiated before a target position corresponding to the molten pool determined to be non-imaginable by the imaging unit among the plurality of target positions and is determined to be imaginable, and is set based on the irradiation intensity of the beam at the target position corresponding to the molten pool determined to be imaginable. The information processing method according to claim 39.

41. The second control information includes information for not performing control of the beam based on an imaging result of the molten pool at the irradiation position corresponding to the molten pool determined to be non-imaginable by the imaging unit. The information processing method according to any one of claims 37 - 40.

42. The second control information further includes information regarding imaging by the imaging unit. The information processing method according to any one of claims 37 - 41.

43. Further including specifying a direction in which at least one of the molten pools determined to be non-imaginable by the imaging unit becomes imaginable by the imaging unit, and the information regarding imaging includes information for the imaging unit to image each molten pool in the specified direction for each molten pool. The information processing method according to claim 42.

44. The information regarding imaging includes information for stopping imaging of the molten pool determined to be non-imaginable by the imaging unit for a first period. The information processing method according to claim 42 or 43.

45. The information processing method according to claim 44, wherein the first period is longer than the time from the start of processing at a target position corresponding to the molten pool determined to be non-imaginable to the start of processing at a target position corresponding to the molten pool determined to be first imaginable by the imaging unit after the molten pool.

46. The information processing method according to any one of claims 35 to 45, wherein the control information is position control information for changing a relative positional relationship between a stage on which the object is placed and a processing head having an irradiation optical system for irradiating the beam in the processing apparatus that performs the processing.

47. The information processing method according to claim 46, wherein the position control information includes information for changing the position of at least one of the stage and the processing head.

48. The information processing method according to claim 47, wherein the position control information is information for changing the position of at least one of the stage and the processing head so that at least one of the target position determined to be non-imaginable by the imaging unit among the plurality of target positions and the molten pool formed when the beam is irradiated to the target position becomes imaginable.

49. The information processing method according to claim 48, further including specifying an imaging direction in which the molten pool determined to be non-imaginable by the imaging unit becomes imaginable, and the position control information includes information for changing the position of at least one of the stage and the processing head based on the specified direction.

50. The information processing method according to claim 49, further including specifying an imaging direction in which at least one non-imaging position determined to be non-imaginable by the imaging unit among the plurality of target positions and at least one non-imaging molten pool position determined to be a non-imaging molten pool that is not imaginable by the imaging unit when the beam is irradiated to the target position become imaginable, respectively, and the position control information includes information for changing the position of at least one of the stage and the processing head based on the respectively specified imaging direction for each of at least one of the non-imaging positions and at least one of the non-imaging molten pool positions.

51. The information processing method according to any one of claims 46-50, wherein the change in the relative positional relationship includes rotating at least one of the stage and the processing head about a predetermined rotation axis.

52. The information processing method according to any one of claims 46-51, wherein the control information includes information generated based on the changed positional relationship.

53. The information processing method according to any one of claims 37-52, wherein the control information includes path information indicating a path along which the beam is irradiated.

54. The path information indicates a path in which at least one of the molten pools determined to be non-imaginable by the imaging unit among the molten pools formed when the beam is irradiated to each of the plurality of target positions becomes imaginable. The information processing method according to claim 53.

55. The determination is made based on processing information including first path information indicating, as the path, the order in which each of the plurality of target positions is irradiated with the beam. The control information includes second path information indicating, as the path, the order in which each of the plurality of target positions is irradiated with the beam and different from the first path information. The information processing method according to claim 53 or 54.

56. In the path indicated by the second path information, the number of times the molten pool formed when each of the plurality of target positions is irradiated with the beam is determined to be non-imaginable by the imaging unit is less than the number of times the molten pool formed when each of the plurality of target positions is irradiated with the beam is determined to be non-imaginable by the imaging unit in the path indicated by the first path information. The information processing method according to claim 55.

57. Among the molten pools formed when the beam is irradiated to each of the plurality of target positions, a molten pool determined to be non-imaging in the path indicated by the first path information is identified. Among the molten pools, a molten pool is determined to be non-imaging in the path indicated by the second path information included in the control information generated based on the processing information including the first path information. Update control information including third path information indicating the order in which each of the plurality of target positions is irradiated with the beam such that the molten pool determined to be non-imaging becomes imaging is generated based on the control information including the second path information. The information processing method according to claim 55 or 56 further includes this.

58. The information processing method according to any one of claims 1 to 57 further includes generating display data for causing a display device to display the result of the determination.

59. A processing method including processing the object using the control information set by the information processing method according to any one of claims 1 to 58.

60. Determining whether at least one of at least a part of the irradiation position on the object where the beam is irradiated and at least a part of at least a part of the molten pool formed on the object by the irradiation of the beam is imageable by the imaging unit; Generating display data for causing a display device to display the result of the determination. An information processing method including this.

61. The display data includes data for displaying at least one of information regarding the shape of the object and path information indicating, as a path, the order in which the beam is irradiated to each of the plurality of target positions on the object where the beam is irradiated. The information processing method according to claim 60.

62. The display data includes information for displaying at least one of a portion of the shape of the object that blocks imaging by the imaging unit and a target position corresponding to a molten pool that is not imageable by the imaging unit among the plurality of target positions in the path indicated by the path information. The information processing method according to claim 61.

63. The display data includes information for displaying a plurality of the path information, each having a different path. The information processing method according to claim 61 or 62.

64. The path includes a first path and a second path, and the distance required for processing the object according to the second path is longer than the distance required for processing the object according to the first path. The information processing method according to claim 63.

65. The time required for processing the object according to the second path is longer than the time required for processing the object according to the first path. The information processing method according to claim 64.

66. The display data includes information indicating at least one of the target position corresponding to the molten pool determined to be non-imaginable by the imaging unit among the plurality of target positions and the target position corresponding to the molten pool determined to be imaginable by the imaging unit among the plurality of target positions. The information processing method according to any one of claims 61 - 65.

67. In the determination, when it is determined that at least one of at least a part of the irradiation position and at least a part of the molten pool is non-imaginable, in the generation, the display data including data for causing the display device to display a prompt for the user to take an action is generated. The information processing method according to any one of claims 60 - 66.

68. The display data includes data indicating the path along which the beam is irradiated such that at least one of the irradiation position and the molten pool determined to be at least partially non-imaginable by the imaging unit becomes imaginable. The information processing method according to any one of claims 60 - 67.

69. A display method including displaying on the display device using the display data generated by the information processing method according to any one of claims 60 - 68.

70. A processing control device including: a determination unit that determines whether at least one of at least a part of the irradiation position where the beam is irradiated on the object and at least a part of the molten pool formed on the object by the irradiation of the beam is imaginable by the imaging unit; and a setting unit that sets control information regarding the control of the processing including the irradiation of the beam on the object based on the result of the determination. TOS system.

71. A processing control device comprising: a determination unit that determines whether at least one of at least a part of an irradiation position on an object where a beam is irradiated and at least a part of at least a part of a molten pool formed on the object by the irradiation of the beam can be imaged by an imaging unit; and a generation unit that generates display data for causing a display device to display the result of the determination.

72. A computer program for machining control for causing a computer to execute a process including: determining whether at least one of at least a part of an irradiation position on an object where a beam is irradiated and at least a part of at least a part of a molten pool formed on the object by the irradiation of the beam can be imaged by an imaging unit; and setting control information regarding control of machining including irradiation of the beam onto the object based on the result of the determination.

73. A computer program for machining control for causing a computer to execute a process including: determining whether at least one of at least a part of an irradiation position on an object where a beam is irradiated and at least a part of at least a part of a molten pool formed on the object by the irradiation of the beam can be imaged by an imaging unit; and generating display data for causing a display device to display the result of the determination.

Images