Aerogel full-edge covering and encapsulation process and device

Abstract

The present invention relates to the technical field of aerogel edge covering, in particular to an aerogel full-edge covering and encapsulation device, comprising: a hot press and a lower platen provided inside the hot press; a lower encapsulating film, being flatly laid and conveyed at the top of the lower platen; an assembling recess formed at the top of the lower platen and located underneath the lower encapsulating film; a descending hot platen, which press-fits a silica gel frame into the assembling recess, and confines and shapes the lower encapsulating film into an upward-opening U-shaped configuration; the descending hot platen film-seals the opening of the U-shaped configuration; and an edge folding die, which performs edge folding and hot pressing on the lower encapsulating film on two sides of the silica gel frame. The present invention enables the quick and efficient encapsulation of a silica gel frame, thereby improving encapsulation efficiency. Moreover, the use of an edge folding die to perform edge folding and hot-press bonding on the excess lower encapsulating film of the U-shaped configuration improves sealing and encapsulating strength between the lower encapsulating film and the silica gel frame.

Description

Aerogel full-edge encapsulation process and equipment Technical field

[0001] The present invention relates to the technical field of aerogel edge wrapping, and specifically provides an aerogel full-edge encapsulation process and equipment. Background technique

[0002] Aerogel is a heat insulation material. Compared with traditional materials such as asbestos and glass wool, it has a lower thermal conductivity and stronger flame retardant ability. Therefore, its application in the fields of battery heat insulation and fire prevention is relatively prominent.

[0003] In the prior art, such as a patent for a flame-retardant and heat-insulating aerogel blanket for power batteries and its encapsulation process in China, the silica aerogel is cut into sheet-like blanket pieces, and two PETs coated with glue are used to sandwich the blanket pieces to form an intermediate with a three-layer structure of a first PET layer - blanket piece layer - second PET layer. The intermediate is compressed and encapsulated through an encapsulation mold at a set temperature, and the flame-retardant and heat-insulating aerogel blanket for power batteries can be obtained by curing and forming. In this encapsulation structure of aerogel, there will be overlapping PET layers at the four peripheral edges of the encapsulated aerogel product. This part plays a role in sealing and bearing pressure. However, in actual use, for this overlapping part, trimming such as cutting cannot be performed, resulting in its inability to be applied to high-precision occasions. 4]

[0004] The patent publication number of the above-cited document is provided: CN116766726A. Technical problem

[0005] The present invention provides an aerogel full-edge encapsulation process and equipment, which can quickly and efficiently encapsulate the silicone frame, improve the encapsulation efficiency. Secondly, by using a hemming mold, the excess lower encapsulation film in the C-shaped state can be folded and thermally pressed and adhered, enhancing the sealing and encapsulation strength between the lower encapsulation film and the silicone frame. Technical solution

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] An aerogel full-edge encapsulation equipment includes:

[0008] A hot press and the lower mold inside it. The lower encapsulation film is laid flat and conveyed on the top of the lower mold. An assembly groove is opened on the top of the lower mold below the lower encapsulation film; A downward hot pressing mold, which can press and embed the silicone frame into the assembly groove, and restrict and convert the lower encapsulation film into a C-shaped state with the opening facing upwards. The downward hot pressing mold can perform film encapsulation on the opening of the C-shaped state; A hemming mold, which can perform hemming and thermal pressing on the lower encapsulation film on both sides of the silicone frame.

[0009] Optionally, the hemming die includes a mounting plate that is embedded and slidably mounted on the top of the lower die. The bottom plane of the mounting plate is flush with the top plane of the silicone frame, and the mounting plate can slide over the top of the silicone frame after film encapsulation. In the U-shaped state, the top of the mounting plate is covered by the lower encapsulation film.

[0010] Optionally, a second heating plate is fixedly installed inside the mounting plate. A chute is opened at the top of the lower die. An electronic slider is slidably installed inside the chute. The electronic slider is fixedly connected to the mounting plate. The travel distance of the mounting plate is greater than the wall thickness of the border of the silicone frame.

[0011] Optionally, the hemming die includes a wing plate that is rotatably mounted on the top of the lower die. When the wing plate is in the vertical state, the outer wall of the wing plate cooperates with the inner wall of the assembly groove to limit the lower encapsulation film to a U-shaped state. When the wing plate rotates, the outer wall at the lowest part of the wing plate is at the same horizontal plane as the top of the silicone frame.

[0012] Optionally, a third heating plate is installed inside the wing plate. An electromagnetic bearing is installed on the lower die. A rotor is rotatably installed inside the electromagnetic bearing. The wing plate is fixedly installed on the outer wall of the rotor. The part of the wing plate that extends beyond the border of the lower die is greater than the border thickness of the silicone frame.

[0013] Optionally, a concave plate cavity is opened inside the lower die. A concave first heating plate is installed inside the plate cavity. The heating range of the first heating plate covers the inner wall of the assembly groove. The lower die on both sides of the opening of the first heating plate is configured with an opening design, and the opening design provides a discharge path for the encapsulated silicone frame.

[0014] Optionally, the downward hot pressing die includes an upper die. The upper die is slidably mounted up and down on a hot press. Two assembly rollers are rotatably mounted on the upper die through bearing seats. The two assembly rollers are symmetrically designed. An upper encapsulation film is conveyed flatly between the two assembly rollers. The bottom of the upper die is designed with a convex part. The convex part extends the upper encapsulation film downward into a convex shape, and the bottom of the convex part is assembled and matched with the assembly groove. A fourth heating plate is installed inside the upper die.

[0015] Optionally, a hydraulic system is installed inside the hot press. A plurality of guide columns are designed on the hot press. The upper die is slidably mounted vertically on the outer walls of the plurality of guide columns. The output end of the hydraulic system controls the overall downward movement and pressing of the upper die.

[0016] Aerogel full-edge encapsulation process, which includes the aerogel full-edge encapsulation equipment, and also includes an aerogel felt bonded inside the silicone frame to form a heat insulation body, and includes the following steps:

[0017] S1. Use a manipulator or electrical tooling to place the heat insulation body on the top of the lower encapsulation film conveyed flatly. The PET layer of the lower encapsulation film contacts the bottom of the heat insulation body, and ensure that the outer frame part of the heat insulation body is directly above the assembly groove;

[0018] S2. Drive the downward hot pressing die to displace downward. Through the heat insulation body, the lower encapsulation film is restricted to a U-shaped state with the opening facing upward, so that the PET layer of the lower encapsulation film fits against the bottom of the heat insulation body, and the downward hot pressing die makes the upper encapsulation film fit against the top of the heat insulation body;

[0019] S3. After hot pressing and encapsulation, control the hemming die to perform hemming and hot pressing on the part of the lower encapsulation film that extends beyond the heat insulation body towards the top of the heat insulation body to improve the encapsulation strength of the heat insulation body.

[0020] Specifically, in S2, it further includes:

[0021] V1. The upper die restricts the upper encapsulation film to a downward convex state, and makes the convex part of the upper encapsulation film a flat surface to facilitate matching with the top of the heat insulation body;

[0022] V2. The hydraulic system controls the upper die and the upper encapsulation film thereon to displace downward to complete the fitting and hot pressing processes;

[0023] V3. Hydraulic reset to separate the PET layer of the upper encapsulation film from the base paper layer. Beneficial effects

[0024] Compared with the prior art, the present invention provides an aerogel fully wrapped edge encapsulation device, which can enable the silica gel frame to replace the overlapping part, and at the same time will shorten the originally longer overlapping part as much as possible. It can not only reduce the overlapping part, but also improve the encapsulation strength between the PET layer and the aerogel. At the same time, the silica gel frame can also enhance the strength and shape retention of the outer edge of the aerogel. Secondly, through the cooperation of the lower die, the assembly groove and the downward hot pressing die, the silica gel frame can be quickly and efficiently encapsulated, improving the encapsulation efficiency without manual calibration and fitting. Thirdly, by designing the hemming die, the redundant lower encapsulation film in the U-shaped state can be hemmed and hot pressed for fitting to enhance the sealing and encapsulation strength between the lower encapsulation film and the silica gel frame. Brief description of the drawings

[0025] Figure 1 is a schematic external three-dimensional structure diagram of the present invention;

[0026] Figure 2 is a schematic structural assembly diagram of the lower die and the hemming die in the first embodiment of the present invention;

[0027] Figure 3 is a right view structural diagram of Figure 2 of the present invention;

[0028] Figure 4 is a sectional structural diagram taken along the A-A direction in Figure 3 of the present invention;

[0029] Figure 5 is a schematic diagram of the structural disassembly of the lower mold and the hemming mold in the first embodiment of the present invention;

[0030] Figure 6 is a schematic diagram of the structural assembly of the lower mold and the hemming mold in the second embodiment of the present invention;

[0031] Figure 7 is a schematic diagram of the state after the wing plate is flipped in the present invention;

[0032] Figure 8 is a schematic diagram of the structure of the downward hot pressing mold in the present invention;

[0033] Figure 9 is a schematic right view structure diagram of Figure 8 of the present invention;

[0034] Figure 10 is a schematic sectional view taken along the C-C in Figure 9 of the present invention;

[0035] Figure 11 is a schematic diagram of the silica gel frame encapsulation of aerogel in the prior art.

[0036] In the figure: 1. Hot press; 2. Lower mold; 3. Assembly groove; 4. Lower encapsulation film; 5. Silica gel frame; 6. Aerogel felt; 7. First heating plate; 8. Assembly plate; 9. Second heating plate; 11. Slide groove; 12. Electronic slider; 13. Wing plate; 14. Third heating plate; 15. Upper mold; 16. Upper encapsulation film; 17. Assembly roller; 18. Fourth heating plate. The best implementation mode of the present invention

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0038] Please refer to Figures 1 to 11. The present invention provides a technical solution: An aerogel full-edge encapsulation device, including:

[0039] A hot press 1 and the lower mold 2 inside it. The lower encapsulation film 4 is laid flat and conveyed on the top of the lower mold 2. An assembly groove 3 is opened on the top of the lower mold 2 below the lower encapsulation film 4; A downward hot pressing mold that can press and embed the silica gel frame 5 into the assembly groove x3 and restrict and convert the lower encapsulation film 4 into a U-shaped state with the opening facing upwards can perform film encapsulation on the opening of the U-shaped state; A hemming mold that can perform hemming hot pressing on the lower encapsulation film 4 on both sides of the silica gel frame 5.

[0040] In the prior art, in the encapsulation method of the PET layer - aerogel - PET layer structure, there will be overlapping parts around the aerogel, which causes inconvenience for customers during processing and affects subsequent precise operations. In the present invention, by designing the silicone frame 5, the silicone frame 5 can replace the overlapping parts, and at the same time, the originally long overlapping parts can be shortened as much as possible. This can not only reduce the overlapping parts but also improve the encapsulation strength between the PET layer and the aerogel. At the same time, the silicone frame 5 can also enhance the strength and shape retention of the outer edge of the aerogel. Secondly, through the cooperation of the lower mold 2, the assembly groove 3 and the downward hot pressing mold, the silicone frame 5 can be quickly and efficiently encapsulated, improving the encapsulation efficiency without manual calibration and fitting. Thirdly, by designing the hemming mold, the redundant lower encapsulation film 4 in the C-shaped state can be hemmed and hot pressed and adhered, enhancing the sealing and encapsulation strength between the lower encapsulation film 4 and the silicone frame 5.

[0041] The following provides two implementation schemes of the hemming mold: <000,091>Embodiment 1:

[0043] The hemming mold includes an assembly plate 8 that is embedded and slidably installed on the top of the lower mold 2. The bottom plane of the assembly plate 8 is flush with the top plane of the silicone frame 5, and the assembly plate 8 can slide over to the top of the silicone frame 5 after film encapsulation. In the C-shaped state, the top of the assembly plate 8 is covered by the lower encapsulation film 4. Please refer to FIGS. 2 to 5. In this embodiment, a translation method is used for hemming and hot pressing. Specifically, by setting the assembly plate 8, the lower encapsulation film 4 that extends beyond the top of the lower mold 2 is pushed and adhered to the top of the silicone frame 5 by the translation of the assembly plate 8. Before this, the top and bottom of the silicone frame 5 have both been film-encapsulated. At this time, the two ends of the lower encapsulation film 4 are used to cover and adhere the film on the upper layer of the silicone frame 5, and then the adhered part is hot pressed by hot pressing equipment, thereby improving the quality and strength of the overall encapsulation.

[0044] Among them, through the pushing of the assembly plate 8, continuous right-angled encapsulation can be formed on both sides of the top of the silicone frame 5. Based on the C-shaped state of the lower encapsulation film 4, all four edges on both sides of the silicone frame 5 can be continuously covered without a disconnection process. Please refer to FIG. 11, which shows the defects of the existing encapsulation method. The weak area at the edge of the silicone frame 5 is a weak point in encapsulation. In the present invention, by setting the C-shaped lower encapsulation film 4, the weak area will be covered by the lower encapsulation film 4 during encapsulation. At the same time, the hemming mold can make the folded part of the lower encapsulation film 4 form a fitting assembly with the upper PET layer, assisted by hot pressing or glue coating, thereby ensuring the firmness of the hemmed part and improving the quality and strength of the overall encapsulation.

[0045] On the basis of Embodiment 1, a second heating plate 9 is fixedly installed inside the assembly plate 8. A chute 11 is opened at the top of the lower mold 2. An electronic slider 12 is slidably installed inside the chute 11. The electronic slider 12 is fixedly connected to the assembly plate 8. The travel distance of the assembly plate 8 is greater than the wall thickness of the border of the silica gel frame 5. Please refer to FIGS. 2 to 5. In this embodiment, through the cooperation of the chute 11, the electronic slider 12 and the assembly plate 8, the translation of the assembly plate 8 can be more easily controlled. At the same time, by designing the second heating plate 9, after hemming, the two layers of PET can be bonded and hot-pressed. It should be noted that before hemming, the downward hot-pressing die needs to be withdrawn to peel off the PET layer and the base paper.

[0046] Embodiment 2:

[0047] The hemming die includes a wing plate 13 rotatably installed at the top of the lower mold 2. When the wing plate 13 is in a vertical state, the outer wall of the wing plate 13 cooperates with the inner wall of the assembly groove 3 to limit the lower encapsulation film 4 to a U-shaped state. When the wing plate 13 rotates, the outer wall at the lowest part of the wing plate 13 is at the same horizontal plane as the top of the silica gel frame 5. Please refer to FIGS. 6 and 7. Different from Embodiment 1, this embodiment adopts a hemming method of flipping. When the lower encapsulation film 4 is in a U-shaped state with the opening facing upward, the wing plate 13 serves as a fitting for the U-shaped state of the lower encapsulation film 4. When the hot-pressing encapsulation is completed, the wing plate 13 is transformed from a fitting to a functional part. At this time, the wing plate 13 deflects, driving the part of the lower encapsulation film 4 that exceeds the top of the silica gel frame 5 to rotate, so that the PET layer of the lower encapsulation film 4 can be hemmed and cover the top of the silica gel frame 5, so that the PET layer can be bonded and encapsulated with the PET layer on the top of the hot-pressed silica gel frame 5, and then the two can be fixed by hot-pressing or glue coating.

[0048] On the basis of Embodiment 2, a third heating plate 14 is installed inside the wing plate 13. An electromagnetic bearing is installed on the lower mold 2. A rotor is rotatably installed inside the electromagnetic bearing. The wing plate 13 is fixedly installed on the outer wall of the rotor. The part of the wing plate 13 that exceeds the border of the lower mold 2 is greater than the border thickness of the silica gel frame 5. In this embodiment, the rotation of the wing plate 13 is controlled through the cooperation of the electromagnetic bearing and the rotor, so as to accurately control the flipping angle of the wing plate 13. Secondly, the length of the wing plate 13 can ensure that the hot-pressing range is sufficient and ensure the strength of hemming and hot-pressing. In this process, since a single-layer PET layer has been bonded to the top of the silica gel frame 5 during the initial hot-pressing, at this time, since the outer wall at the lowest part of the wing plate 13 is at the same horizontal plane as the top of the silica gel frame 5, when the wing plate 13 is flipped to the horizontal state, the lower encapsulation film 4 and the PET layer have been pressed, so that the hot-pressing is completed with high quality without setting up additional tooling.

[0049] In the first and second embodiments, both ends of the lower encapsulation film 4 are connected to a conveying device or a material pulling device with a tension structure, ensuring that the lower encapsulation film 4 remains taut during the downward displacement of the silica gel frame 5.

[0050] In a more preferred embodiment, a concave plate cavity is provided inside the lower mold 2, and a concave first heating plate 7 is installed in the plate cavity. The heating range of the first heating plate 7 covers the inner wall of the assembly groove 3. The lower mold 2 on both sides of the opening of the first heating plate 7 is configured with an opening design, and the opening design provides a discharging path for the silica gel frame ⑤ after encapsulation.

[0051] In a more preferred embodiment, the downward hot pressing die includes an upper die 15, which is slidably installed up and down on the hot press 1. Two assembly rollers 17 are rotatably installed on the upper die 15 through bearing seats. The two assembly rollers 17 are symmetrically designed. An upper encapsulation film 16 is conveyed flatly between the two assembly rollers 17. The upper die 15 has a convex portion at the bottom, and the convex portion extends the upper encapsulation film 16 downward into a convex shape, and the bottom of the convex portion is assembled and matched with the assembly groove 3. A fourth heating plate 18 is installed inside the upper die 15. Referring to FIGS. 8 to 10, in this embodiment, the cooperation between the convex portion of the upper die 15 and the upper encapsulation film 16 enables a part of the upper encapsulation film 16 to protrude downward. The PET layer of the protruding part of the upper encapsulation film 16 can follow the downward displacement of the upper die 1 to fit with the top of the silica gel frame 5, thereby completing precise hot pressing. During this process, the upper die 1 will also first displace the silica gel frame 5 loaded with the aerogel felt 6 downward to drive the lower encapsulation film 4 into a U-shaped state with the opening facing upward, and then complete the encapsulation structure and perform hot pressing and fixation. Similarly, both ends of the upper encapsulation film 16 are associated with a feeding and discharging device having a tension mechanism.

[0052] Based on the embodiment of the downward hot pressing die, referring to FIG. 1, a hydraulic system is installed inside the hot press 1. The hot press 1 is provided with a plurality of guide columns, and the upper die 15 is vertically slidably installed on the outer walls of the plurality of guide columns. The output end of the hydraulic system controls the overall downward pressure application of the upper die 15.

[0053] With the cooperation of the above structures, the silica gel frame can be encapsulated quickly and efficiently, improving the encapsulation efficiency. Secondly, with the hemming die, the redundant lower encapsulation film 4 in the U-shaped state can be hemmed and thermally pressed and adhered, enhancing the sealing and encapsulation strength between the lower encapsulation film 4 and the silica gel frame 5.

[0054] An aerogel full-edge encapsulation process further includes an aerogel felt 6 bonded inside the silica gel frame 5 to form a heat insulation body, and includes the following steps:

[0055] S1. Use a manipulator or electrical tooling to place the heat insulation body on the top of the lower encapsulation film 4 being conveyed flatly. The PET layer of the lower encapsulation film 4 contacts the bottom of the heat insulation body, and ensure that the outer frame part of the heat insulation body is directly above the assembly groove 3;

[0056] S2. Drive the downward hot pressing die to displace downward. Through the heat insulation body, the lower encapsulation film 4 is restricted to a U-shaped state with the opening facing upward, so that the PET layer of the lower encapsulation film 4 fits against the bottom of the heat insulation body, and the downward hot pressing die makes the upper encapsulation film 16 fit against the top of the heat insulation body;

[0057] S3. After hot pressing and encapsulation, control the hemming die to perform hemming and hot pressing on the part of the lower encapsulation film 4 that extends beyond the heat insulation body towards the top of the heat insulation body to improve the encapsulation strength of the heat insulation body.

[0058] Specifically, in S2, it further includes:

[0059] V1. The upper die 15 restricts the upper encapsulation film 16 to a downward convex state, and makes the convex part of the upper encapsulation film 16 a flat surface to facilitate matching with the top of the heat insulation body;

[0060] V2. The hydraulic system controls the upper die 15 and the upper encapsulation film 16 thereon to displace downward to complete the fitting and hot pressing processes;<***********>

[0061] V3. Hydraulic reset to separate the PET layer of the upper encapsulation film 16 from the base paper layer.

[0062] In this process, the automation of the aerogel full-edge encapsulation equipment can be utilized for rapid, efficient, and accurate assembly and hot pressing encapsulation, which not only improves the encapsulation efficiency but also enhances the product quality.

[0063] The standard parts used in this embodiment can be directly purchased from the market. For the non-standard structural components described according to the instructions and drawings, they can also be directly processed without doubt based on the existing technical knowledge. At the same time, the connection methods of each component adopt the mature conventional means in the existing technology, and the machines, parts, and equipment all adopt the conventional models in the existing technology, so no specific description will be made here. Embodiments of the present invention

[0064] Type in the description paragraph of the embodiments of the present invention here. Industrial applicability [[ID=****************]]

[0065] Type in the description paragraph of industrial applicability here. Free content of the sequence list

[0066] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An aerogel full-edge encapsulation device, characterized in that: Including: A hot press (1) and a lower mold (2) inside it. The lower mold (2) has a flat top surface on which a lower encapsulation film (4) is conveyed. An assembly groove (3) is formed in the top of the lower mold (2) below the lower encapsulation film (4). A downward hot pressing mold, which can press and embed a silicone frame (5) into the assembly groove (3), and limit and transform the lower encapsulation film (4) into a U-shaped state with the opening facing upward. The downward hot pressing mold can perform film encapsulation on the opening of the U-shaped state. A hemming mold, which can perform hemming hot pressing on the lower encapsulation film (4) on both sides of the silicone frame (5).

2. The aerogel full-edge encapsulation device according to claim 1, wherein: The hemming mold includes an assembly plate (8) slidably and embeddedly installed on the top of the lower mold (2). The bottom plane of the assembly plate (8) is flush with the top plane of the silicone frame (5), and the assembly plate (8) can slide over the top of the silicone frame (5) after film encapsulation. In the U-shaped state, the top of the assembly plate (8) is covered by the lower encapsulation film (4).

3. The aerogel full-edge encapsulation device according to claim 2, characterized in that: A second heating plate (9) is fixedly installed inside the assembly plate (8). A chute (11) is formed in the top of the lower mold (2). An electronic slider (12) is slidably installed inside the chute (11). The electronic slider (12) is fixedly connected to the assembly plate (8). The traveling distance of the assembly plate (8) is greater than the wall thickness of the border of the silicone frame (5).

4. The aerogel full-edge encapsulation device according to claim 1, characterized in that: The hemming mold includes a wing plate (13) rotatably installed on the top of the lower mold (2). When the wing plate (13) is in the vertical state, the outer wall of the wing plate (13) cooperates with the inner wall of the assembly groove (3) to limit the lower encapsulation film (4) to a U-shaped state. When the wing plate (13) rotates, the outer wall at the lowest part of the wing plate (13) is at the same horizontal plane as the top of the silicone frame (5).

5. The aerogel full-edge encapsulation device according to claim 4, characterized in that: A third heating plate (14) is installed inside the wing plate (13). An electromagnetic bearing is installed on the lower mold (2). A rotor is rotatably installed inside the electromagnetic bearing. The wing plate (13) is fixedly installed on the outer wall of the rotor. The part of the wing plate (13) exceeding the border of the lower mold (2) is greater than the border thickness of the silicone frame (5).

6. The aerogel full-edge encapsulation device according to claim 1, characterized in that: A concave plate cavity is formed inside the lower mold (2). A concave first heating plate (7) is installed inside the plate cavity. The heating range of the first heating plate (7) covers the inner wall of the assembly groove (3). The lower mold (2) on both sides of the opening of the first heating plate (7) is configured with an opening design, and the opening design provides a discharging path for the encapsulated silicone frame (5).

7. The aerogel full-edge encapsulation device according to any one of claims 1-6, characterized in that: The downward hot pressing mold includes an upper mold (15). The upper mold (15) is slidably installed up and down on the hot press (1). Two assembly rollers (17) are rotatably installed on the upper mold (15) through bearing seats. The two assembly rollers (17) are symmetrically designed. An upper encapsulation film (16) is conveyed between the two assembly rollers (17). The bottom of the upper mold (15) is designed with a protrusion. The protrusion extends the upper encapsulation film (16) downward into a convex shape, and the bottom of the protrusion is assembled and matched with the assembly groove (3). A fourth heating plate (18) is installed inside the upper mold (15).

8. The aerogel full-edge encapsulation device according to claim 7, wherein: A hydraulic system is installed inside the hot press (1). A plurality of guide columns are designed on the hot press (1). The upper die (15) is vertically and slidably installed on the outer walls of the plurality of guide columns. The output end of the hydraulic system controls the downward movement and pressing of the entire upper die (15).

9. A process for encapsulating an aerogel with a full edge wrap, which includes the aerogel full-edge encapsulation device described in claim 8, and further includes an aerogel felt (6) bonded inside a silica gel frame (5) to form a heat-insulating body, and is characterized in that: It includes the following steps: S1, Use a manipulator or electrical tooling to place the heat insulator on the top of the flatly conveyed lower encapsulation film (4). The PET layer of the lower encapsulation film (4) is in contact with the bottom of the heat insulator, and ensure that the outer frame part of the heat insulator is directly above the assembly groove (3); S2, Drive the downward hot pressing die to move downward. Through the heat insulator, the lower encapsulation film (4) is restricted to a U-shaped state with the opening facing upward, so that the PET layer of the lower encapsulation film (4) is in contact with the bottom of the heat insulator, and the downward hot pressing die makes the upper encapsulation film (16) in contact with the top of the heat insulator; S3, After hot pressing and encapsulation, control the hemming die to perform hemming hot pressing on the part of the lower encapsulation film (4) that exceeds the heat insulator to the top of the heat insulator to improve the encapsulation strength of the heat insulator.

10. The aerogel full-edge encapsulation process according to claim 9, wherein: In S2, it also includes: V1, The upper die (15) restricts the upper encapsulation film (16) to a downward convex state, and makes the convex part of the upper encapsulation film (16) a plane to facilitate matching with the top of the heat insulator; V2, The hydraulic system controls the downward movement of the upper die (15) and the upper encapsulation film (16) thereon to complete the fitting and hot pressing process; V3, Hydraulic reset to separate the PET layer of the upper encapsulation film (16) from the base paper layer.

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