Powertrain and electric vehicle

Abstract

Provided in the present application is a powertrain, the powertrain comprising: a housing, a motor controller and a motor. The housing comprises two sub-chambers and a partition plate which are integrally formed, the two sub-chambers being arranged in a first direction, the partition plate being used for partitioning the two sub-chambers, one sub-chamber being used for accommodating a bus capacitor and a radiator of the motor controller, and the other sub-chamber being used for fixing a stator of the motor and accommodating a rotor of the motor. The powertrain further comprises a heat dissipation plate. In the first direction, the heat dissipation plate is arranged between the bus capacitor and the partition plate; and the interval in the first direction between the heat dissipation plate and the partition plate is larger than the interval between the heat dissipation plate and the bus capacitor. The described technical solution can achieve good heat dissipation of the bus capacitor in the scenario that the motor controller and the motor share the housing, thus prolonging the service life of the bus capacitor.

Description

Powertrain and electric vehicles

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 23, 2024, with application number 202420165018.6 and invention name “Powertrain and Electric Vehicle”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electric vehicles, and in particular to a powertrain and an electric vehicle. Background Art

[0003] Currently, integrated powertrains are commonly used as drive systems for electric vehicles. In an integrated powertrain, the motor, reducer, and motor controller share a single housing, achieving integrated, lightweight, and miniaturized powertrains. However, since the motor and motor controller share a single housing, the motor controller housing is susceptible to the temperature of the motor housing. This is especially true when the busbar capacitor is located above the motor barrel, which can increase the busbar capacitor's temperature rise and, in turn, affect its lifespan. Summary of the Invention

[0004] The present application provides a powertrain that can achieve good heat dissipation of the bus capacitor in a scenario where the motor controller and the motor share a housing, thereby extending the life of the bus capacitor.

[0005] In a first aspect, a powertrain is provided, which includes: a housing, a motor controller and a motor, the housing including two integrally formed sub-cavities and a partition, the two sub-cavities are arranged along a first direction, the partition is used to separate the two sub-cavities, one of the sub-cavities is used to accommodate a bus capacitor and a radiator of the motor controller, and the other sub-cavity is used to fix the stator of the motor and accommodate the rotor of the motor; a heat sink is arranged between the bus capacitor and the partition along the first direction, and the spacing between the heat sink and the partition along the first direction is greater than the spacing between the heat sink and the bus capacitor.

[0006] In the technical solution of the present application, the heat sink is arranged between the busbar capacitor and the partition along a first direction, and along the first direction, the spacing between the heat sink and the partition is greater than the spacing between the heat sink and the busbar capacitor. On the one hand, the spacing between the radiator, the heat sink, and the busbar capacitor along the first direction is small, which facilitates the radiator and the heat sink to better dissipate heat for the busbar capacitor. On the other hand, the large spacing between the heat sink and the partition along the first direction can increase the heat conduction path between the partition and the heat sink, thereby better insulating the busbar capacitor and extending the life of the busbar capacitor.

[0007] In conjunction with the first aspect, in one implementation of the first aspect, the bus capacitor is arranged between the heat sink and the heat sink along the first direction. Based on the above technical solution, it is possible to achieve good heat dissipation of the bus capacitor in a scenario where the motor controller and the motor share a housing, thereby extending the life of the bus capacitor.

[0008] In conjunction with the first aspect, in one implementation of the first aspect, the spacing between the heat sink and the bus capacitor along the first direction is smaller than the spacing between the heat sink and the partition along the first direction. Based on the above technical solution, in scenarios where the motor controller and motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0009] In conjunction with the first aspect, in one implementation of the first aspect, the heat sink is arranged adjacent to the bus capacitor along a second direction, the second direction being perpendicular to the first direction. Based on the above technical solution, in a scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0010] In conjunction with the first aspect, in one implementation of the first aspect, the spacing between the heat sink and the bus capacitor along the second direction is smaller than the spacing between the heat sink and the partition along the first direction. Based on the above technical solution, it is possible to achieve good heat dissipation of the bus capacitor in scenarios where the motor controller and motor share a housing, thereby extending the life of the bus capacitor.

[0011] In conjunction with the first aspect, in one implementation of the first aspect, the heat sink and the bus capacitor are stacked on the heat sink along the first direction, and the heat sink is stacked on the partition along the first direction. Based on the above technical solution, in a scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0012] In conjunction with the first aspect, in one implementation of the first aspect, the spacing between the radiator and the heat sink along the first direction is smaller than the spacing between the heat sink and the partition along the first direction. Based on the above technical solution, in a scenario where the motor controller and the motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0013] In conjunction with the first aspect, in one implementation of the first aspect, the heat sink includes an internal flow channel for transmitting coolant to dissipate heat for at least one of the bus capacitor or the partition, and the radiator includes an internal flow channel for transmitting coolant to dissipate heat for at least one of the power module of the motor controller or the bus capacitor. Based on the above technical solution, it is possible to achieve good heat dissipation of the bus capacitor in a scenario where the motor controller and the motor share a housing, thereby extending the life of the bus capacitor.

[0014] In conjunction with the first aspect, in one implementation of the first aspect, the internal flow channel of the heat sink is used to connect to the internal flow channel of the radiator, and the heat sink includes two side surfaces, the two side surfaces facing away from each other along the first direction, wherein: one side surface is used to fixedly connect to the partition; and the other side surface includes an inlet and an outlet of the internal flow channel of the heat sink, and the inlet and outlet of the internal flow channel of the heat sink are respectively used to connect to the internal flow channel of the radiator. Based on the above technical solution, it is possible to achieve good heat dissipation of the bus capacitor in a scenario where the motor controller and the motor share a housing, thereby extending the life of the bus capacitor.

[0015] In conjunction with the first aspect, in one implementation of the first aspect, the spacing between the inlet and outlet of the internal flow channel of the heat sink along the arrangement direction of the inlet and outlet of the internal flow channel of the heat sink is greater than the size of the bus capacitor along the arrangement direction of the inlet and outlet of the internal flow channel of the heat sink, and smaller than the size of the radiator along the arrangement direction of the inlet and outlet of the internal flow channel of the heat sink. Based on the above technical solution, it is possible to achieve good heat dissipation of the bus capacitor in a scenario where the motor controller and motor share a housing, thereby extending the life of the bus capacitor.

[0016] In conjunction with the first aspect, in one implementation of the first aspect, the internal flow channel of the radiator and the internal flow channel of the radiator are connected in series, wherein: the inlet of the internal flow channel of the heat sink is used to connect to the outlet of the internal flow channel of the radiator, and the outlet of the internal flow channel of the heat sink is used to connect to the inlet of the internal flow channel of the radiator. Based on the above technical solution, it is possible to achieve good heat dissipation of the bus capacitor in a scenario where the motor controller and the motor share a housing, thereby extending the life of the bus capacitor.

[0017] In conjunction with the first aspect, in one implementation of the first aspect, the internal flow channel of the radiator and the internal flow channel of the radiator are connected in parallel, wherein: the inlet of the internal flow channel of the heat sink is used to connect to the inlet of the internal flow channel of the radiator, and the outlet of the internal flow channel of the heat sink is used to connect to the outlet of the internal flow channel of the radiator. Based on the above technical solution, it is possible to achieve good heat dissipation of the bus capacitor in a scenario where the motor controller and the motor share a housing, thereby extending the life of the bus capacitor.

[0018] In conjunction with the first aspect, in one implementation of the first aspect, the internal flow channel of the heat sink transmits a coolant of a different working medium than the coolant transmitted by the internal flow channel of the radiator. Based on the above technical solution, it is possible to achieve good heat dissipation of the bus capacitor in scenarios where the motor controller and motor share a housing, thereby extending the life of the bus capacitor.

[0019] In conjunction with the first aspect, in one implementation of the first aspect, the internal flow channel of the heat sink is connected to the internal oil channel of the housing, and the internal flow channel of the radiator is connected to the internal water channel of the housing. Based on the above technical solution, it is possible to achieve good heat dissipation of the bus capacitor in scenarios where the motor controller and motor share a housing, thereby extending the life of the bus capacitor.

[0020] In conjunction with the first aspect, in one implementation of the first aspect, the heat sink includes two side surfaces that face away from each other along the first direction, wherein: one side surface faces the busbar capacitor; and the other side surface includes an inlet and an outlet for the internal flow channel of the heat sink, and the inlet and outlet for the internal flow channel of the heat sink are respectively configured to communicate with the internal flow channel of the housing. Based on the above technical solution, it is possible to achieve good heat dissipation of the busbar capacitor in a scenario where the motor controller and motor share a housing, thereby extending the life of the busbar capacitor.

[0021] In conjunction with the first aspect, in one implementation of the first aspect, at least one of the partition or the heat sink includes at least one support column, each of which is used to securely connect the heat sink and the partition. Based on the above technical solution, in scenarios where the motor controller and motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0022] In conjunction with the first aspect, in one implementation of the first aspect, the partition further includes an internal flow channel, and at least one of the support columns includes an internal flow channel, the internal flow channel of the support column being configured to connect the internal flow channel of the heat sink and the internal flow channel of the partition. Based on the above technical solution, in scenarios where the motor controller and motor share a common housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0023] In conjunction with the first aspect, in one implementation of the first aspect, the internal flow channels of the heat sink include multiple flow channels along at least one of the third direction or the second direction, where the first direction, the second direction, and the third direction are perpendicular to each other. Based on the above technical solution, it is possible to achieve good heat dissipation of the bus capacitor in scenarios where the motor controller and the motor share a housing, thereby extending the life of the bus capacitor.

[0024] In conjunction with the first aspect, in one implementation of the first aspect, the projected area of ​​the heat sink along the first direction is greater than or equal to the projected area of ​​the bus capacitor along the first direction. Based on the above technical solution, in scenarios where the motor controller and motor share a housing, good heat dissipation of the bus capacitor can be achieved, thereby extending the life of the bus capacitor.

[0025] In a second aspect, an electric vehicle is provided, comprising wheels, a transmission mechanism, and a powertrain as described in the first aspect and any one of the implementations of the first aspect, wherein the powertrain drives the wheels through the transmission mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a schematic structural diagram of an electric vehicle provided in an embodiment of the present application.

[0027] FIG2 is a schematic structural diagram of a powertrain 300 provided in an embodiment of the present application.

[0028] FIG3 is a schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0029] FIG4 is a schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0030] FIG5 is a schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0031] FIG6 is a schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0032] FIG7 is a schematic diagram of a cross section of an internal flow channel of a heat dissipation plate provided in an embodiment of the present application along a second direction.

[0033] FIG8 is a schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0034] FIG9 is a schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0035] FIG10 is a schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0036] Figure numerals: 10 - vehicle; 100 - body; 200 - wheel; 300 - powertrain; 310 - housing; 311 - sub-cavity; 312 - sub-cavity; 320 - busbar capacitor; 330 - radiator; heat sink - 340; 350 - partition; 360 - thermal conductive material; 370 - support column; 380 - internal flow channel of heat sink; 381 - inlet; 382 - outlet. DETAILED DESCRIPTION

[0037] The technical solution in this application will be described below with reference to the accompanying drawings.

[0038] The “perpendicular” mentioned in this application is not strictly perpendicular, but within the allowable error range. The “parallel” is not strictly parallel, but within the allowable error range.

[0039] In the embodiments of the present application, the same reference numerals represent the same component or part. In the embodiments of the present application, for multiple identical parts, only one of the parts may be labeled with a reference numeral in the drawings as an example. The same reference numerals apply to other identical parts or components.

[0040] To facilitate understanding of the present application, before introducing the embodiments of the present application, the professional terms involved in the embodiments of the present application are first introduced in detail.

[0041] Powertrain: This refers to the series of components that generate power in a vehicle and transmit it to the road. The powertrain includes the motor, motor controller, and speed reducer. The motor controller is used to control the motor.

[0042] The motor controller, a core component of electric vehicles, is a decisive factor in the vehicle's power performance. It receives vehicle requirements from the vehicle controller and receives power from the power battery pack. Through modulation by its own inverter, it obtains the current and voltage required to control the motor and supplies it to the electric motor, ensuring that the motor's speed and torque meet the vehicle's requirements.

[0043] In an integrated powertrain, the motor, reducer, and motor controller share a single housing, achieving integrated, lightweight, and miniaturized powertrain design. However, the motor and motor controller share a common housing, making the motor controller housing susceptible to the temperature of the motor housing. This is particularly true when the busbar capacitor is located above the motor barrel, which can increase the busbar capacitor's temperature rise and, in turn, affect its lifespan.

[0044] Based on this, the embodiments of the present application aim to provide a powertrain that can solve the heat dissipation problem of the bus capacitor, thereby extending the life of the bus capacitor.

[0045] The vehicle 10 provided in the embodiment of the present application will be described in detail below with reference to FIG1 and FIG2 .

[0046] FIG1 is a schematic diagram of the structure of a vehicle 10 provided in an embodiment of the present application. As shown in FIG1 , the vehicle 10 includes a body 100, wheels 200, a battery (not shown), a transmission mechanism (not shown), and one or more powertrains 300. The wheels 200 are rotationally connected to the body 100, and the powertrain 300 is housed within the body 100. The powertrain 300 is also transmission-connected to the wheels 200, and the powertrain 300 drives the wheels 200 via the transmission mechanism.

[0047] The powertrain 300 includes a motor controller, a motor, and a speed reducer (not shown). The motor controller is connected to a battery and receives DC power from the battery via a DC input interface. It then converts the DC power into AC power and transmits it to the motor winding terminals via an AC output interface to control the motor's start / stop, forward / reverse rotation, speed increase / decrease, increase / decrease in drive torque, and increase / decrease in braking torque. The motor shaft output transmits power to the wheels of the vehicle 10 via the speed reducer, driving the wheels 200 to rotate relative to the vehicle body 100 and providing power for the vehicle 10 to travel.

[0048] It should be understood that the vehicle 10 provided in the embodiment of the present application includes a pure electric vehicle or a hybrid vehicle.

[0049] It should also be understood that the vehicle 10 provided in the embodiment of the present application includes a pure electric vehicle, a hybrid electric vehicle, an extended-range electric vehicle, a plug-in hybrid electric vehicle or a new energy vehicle, etc. Among them, a pure electric vehicle is also called a pure electric vehicle / battery electric vehicle, or simply pure EV / battery EV. A hybrid electric vehicle is also called a hybrid electric vehicle, or simply HEV. An extended-range electric vehicle is also called a range extended electric vehicle, or simply REEV. A plug-in hybrid electric vehicle is also called a plug-in hybrid electric vehicle, or simply PHEV. A new energy vehicle is also called a new energy vehicle, or simply NEV.

[0050] An embodiment of the present application provides a powertrain. The powertrain 300 provided in the embodiment of the present application is described in detail below with reference to FIG. 2 to FIG. 10 .

[0051] FIG2 is a schematic structural diagram of a powertrain 300 provided in an embodiment of the present application.

[0052] As shown in Figure 2, the powertrain 300 includes a housing 310, a motor controller, and a motor (not shown). In the embodiment of the present application, the housing 310 includes two integrally formed sub-cavities and a partition 350. The two sub-cavities are arranged along a first direction, and the partition 350 is used to separate the two sub-cavities.

[0053] As shown in FIG2 , sub-cavities 311 and 312 are arranged along a first direction, and partition 350 is used to separate sub-cavity 311 and sub-cavity 312. One sub-cavity (e.g., 311) is used to accommodate the motor controller, bus capacitor 320 of the motor controller, and heat sink 330, while the other sub-cavity (e.g., 312) is used to fix the stator of the motor and accommodate the rotor of the motor. In other words, the other sub-cavity is used to accommodate the motor.

[0054] In one embodiment, the housing 310, the two sub-cavities and the partition 350 are an integrally formed structure. The housing 310, the two sub-cavities and the partition 350 are made using an integral die-casting process.

[0055] As shown in FIG2 , the powertrain 300 further includes a heat sink 340 . The heat sink 340 is arranged between the bus capacitor 320 and the partition 350 along a first direction, and the distance between the heat sink 340 and the partition 350 along the first direction is greater than the distance between the heat sink 340 and the bus capacitor 320 .

[0056] The heat dissipation plate 340 is arranged along the first direction between the bus capacitor 320 and the partition 350 .

[0057] In one embodiment, the bus capacitor 320 , the heat sink 340 , and the partition 350 are arranged adjacent to each other in sequence along the first direction.

[0058] In one embodiment, a projected area of ​​the heat sink 340 along the first direction is larger than a projected area of ​​the bus capacitor 320 along the first direction, as shown in FIG2( a ).

[0059] In one embodiment, the projected area of ​​the heat dissipation plate 340 along the first direction is equal to the projected area of ​​the bus capacitor 320 along the first direction, as shown in FIG2( b ).

[0060] In one embodiment, a thermal conductive material 360 , such as a thermal pad, is further provided between the bus capacitor 320 and the heat sink 340 .

[0061] As shown in Figure 2, the heat sink 330 is arranged on the side of the partition 350 facing the motor controller. Along the first direction, the heat sink 330 is stacked on the partition 350 and not stacked on the heat dissipation plate 340. In one embodiment, a thermally conductive material 360 is also provided between the heat sink 330 and the partition 350.

[0062] Figure 3 is a schematic diagram of a powertrain according to an embodiment of the present application. As shown in Figure 3, busbar capacitor 320 is arranged along a first direction between heat sink 330 and heat sink 340. Heat sink 340, busbar capacitor 320, and heat sink 330 are stacked in sequence along the first direction on spacer 350.

[0063] In one embodiment, the distance between the radiator 330 and the bus capacitor 320 along the first direction is smaller than the distance between the heat sink 340 and the partition 350 along the first direction, that is, the distance between the heat sink 340 and the partition 350 along the first direction is greater than the distance between the radiator 330 and the bus capacitor 320 along the first direction.

[0064] In the embodiment of the present application, the spacing between the heat sink 340 and the partition 350 along the first direction is greater than the spacing between the heat sink 340 and the bus capacitor 320, and the spacing between the radiator 330 and the bus capacitor 320. On the one hand, the small spacing between the radiator 330, the heat sink 340, and the bus capacitor 320 along the first direction facilitates the radiator 330 and the heat sink 340 to better dissipate heat for the bus capacitor 320. On the other hand, the large spacing between the heat sink 340 and the partition 350 along the first direction can increase the heat conduction path between the partition 350 and the heat sink 340, thereby better insulating the bus capacitor 320.

[0065] In one embodiment, a projected area of ​​the heat sink 340 along the first direction is larger than a projected area of ​​the bus capacitor 320 along the first direction, as shown in FIG3( a ).

[0066] In one embodiment, the projected area of ​​the heat dissipation plate 340 along the first direction is equal to the projected area of ​​the bus capacitor 320 along the first direction, as shown in FIG3( b ).

[0067] FIG4 is a schematic structural diagram of a powertrain 300 provided in yet another embodiment of the present application.

[0068] As shown in Figure 4, the heat sink 330 is arranged adjacent to the bus capacitor 320 along the second direction. In one embodiment, the second direction is perpendicular to the first direction.

[0069] In one embodiment, the heat sink 330 and the bus capacitor 320 are stacked on the heat sink 340 along a first direction, and the heat sink 340 is stacked on the partition 350 along the first direction. The heat sink 330 and the bus capacitor 320 are adjacently arranged along a second direction, and both the heat sink 330 and the bus capacitor 320 are arranged on the heat sink 340 along the first direction.

[0070] As shown in FIG2(b), the busbar capacitor 320 and the heat sink 340 are stacked on the partition 350 in the first direction, and the heat sink 330 is stacked on the partition 350 in the first direction. The heat sink 330 and the busbar capacitor 320 are arranged adjacent to each other in the second direction, the busbar capacitor 320 is stacked on the heat sink 340 in the first direction, and the heat sink 330 is stacked on the partition 350 in the first direction.

[0071] In one embodiment, the distance between the heat sink 330 and the bus capacitor 320 along the second direction is smaller than the distance between the heat sink 340 and the partition 350 along the first direction. In one embodiment, the distance between the heat sink 340 and the partition 350 along the first direction is larger than the distance between the heat sink 330 and the bus capacitor 320 along the second direction.

[0072] In the embodiment of the present application, the spacing between the heat sink 340 and the partition 350 along the first direction is greater than the spacing between the radiator 330 and the bus capacitor 320 along the second direction and the spacing between the heat sink 340 and the bus capacitor 320 along the first direction. On the one hand, the small spacing between the heat sink 330 and the bus capacitor 320 along the second direction facilitates the heat sink 330 to better dissipate heat for the bus capacitor 320. In addition, the small spacing between the heat sink 340 and the bus capacitor 320 along the first direction can also better dissipate heat for the bus capacitor 320. On the other hand, the large spacing between the heat sink 340 and the partition 350 along the first direction can increase the heat conduction path between the partition 350 and the heat sink 340, thereby better insulating the bus capacitor 320.

[0073] 4 , the distance between the radiator 330 and the heat dissipation plate 340 along the first direction is smaller than the distance between the heat dissipation plate 340 and the partition 350 along the first direction. In one embodiment, the distance between the heat dissipation plate 340 and the partition 350 along the first direction is larger than the distance between the radiator 330 and the heat dissipation plate 340 along the first direction.

[0074] In the embodiment of the present application, the distance between the heat sink 330 and the heat dissipation plate 340 along the first direction is small, allowing the heat sink 330 to quickly remove heat from the heat dissipation plate 340, thereby dissipating heat from the bus capacitor 320. Furthermore, the distance between the heat dissipation plate 340 and the partition 350 along the first direction is large, which increases the heat conduction path between the partition 350 and the heat dissipation plate 340, thereby better insulating the bus capacitor 320.

[0075] In one embodiment, at least one of the heat sink 340 or the partition 350 includes one or more support columns 370, and each support column 370 is used to fixedly connect the heat sink 340 and the partition 350, so that a gap is provided between the heat sink 340 and the partition 350, thereby achieving thermal insulation of the bus capacitor 320.

[0076] In one embodiment, at least one of the partition plate 350 or the heat sink 340 includes one or more support pillars 370. In one embodiment, the partition plate 350 includes one or more support pillars 370. In one embodiment, the side of the partition plate 350 facing the heat sink 340 includes one or more support pillars 370. As shown in FIG5 , the side of the partition plate 350 facing the heat sink 340 includes two support pillars 370.

[0077] In one embodiment, the heat sink 340 includes a plurality of support columns 370. In one embodiment, the side of the heat sink 340 facing the partition 350 includes a plurality of support columns 370. As shown in Figures 2 to 4, the side of the heat sink 340 facing the partition 350 includes two support columns 370.

[0078] In one embodiment, both the partition 350 and the heat sink 340 include one or more support columns 370. In one embodiment, the side of the partition 350 facing the heat sink 340 includes one or more support columns 370, and the side of the heat sink 340 facing the partition 350 also includes one or more support columns 370.

[0079] In one embodiment, the number of support columns 370 included in the partition plate 350 and the number of support columns 370 included in the heat dissipation plate 340 are equal. In one embodiment, the number of support columns 370 included in the partition plate 350 and the number of support columns 370 included in the heat dissipation plate 340 are unequal.

[0080] It should be noted that the partition 350 includes one or more support columns 370. In one embodiment, the partition 350 and the one or more support columns 370 are an integrally molded structure. In one embodiment, the partition 350 and the support columns 370 are formed through a single process. In one embodiment, the partition 350 and the one or more support columns 370 are formed using an integral casting process. In one embodiment, the partition 350 and the support columns 370 are two separately molded structures, and the support columns 370 are welded to the surface of the partition 350 by welding or other means.

[0081] In one embodiment, the heat sink 340 includes one or more support columns 370. In one embodiment, the heat sink 340 and one or more support columns 370 are an integrally formed structure. In one embodiment, the heat sink 340 and the support columns 370 are formed in a single process. In one embodiment, the heat sink 340 and the support columns 370 are formed using an integral casting process. In one embodiment, the heat sink 340 and the support columns 370 are two separately formed structures, and the support columns 370 are welded to the surface of the heat sink 340 by welding or other methods.

[0082] In one embodiment, the distance between adjacent two support pillars in the plurality of support pillars 370 is equal. In one embodiment, the distance between adjacent two support pillars in the plurality of support pillars 370 is unequal. In one embodiment, the plurality of support pillars 370 are arranged in a single row on at least one of the partition 350 or the heat sink 340. In one embodiment, the plurality of support pillars 370 are arranged in multiple rows on at least one of the partition 350 or the heat sink 340.

[0083] In one embodiment, the heat sink 330 is arranged adjacent to the bus capacitor 320. In one embodiment, a gap is provided between the heat sink 330 and the bus capacitor 320. In one embodiment, no gap exists between the heat sink 330 and the bus capacitor 320. A gap is also referred to as a gap or a gap.

[0084] Figure 6 is a schematic structural diagram of a powertrain 300 provided in another embodiment of the present application. Figure 6 takes as an example a heat sink 340, a bus capacitor 320, and a radiator 330 stacked on a partition 350 along a first direction.

[0085] As shown in FIG6 , the heat sink 340 further includes an internal flow channel 380. The internal flow channel 380 is used to transport coolant to dissipate heat for at least one of the bus capacitor 320 or the partition 350. The radiator 330 also includes an internal flow channel (not shown) to transport coolant to dissipate heat for at least one of the power modules (not shown) of the motor controller or the bus capacitor 320.

[0086] In one embodiment, the internal flow channel 380 of the heat dissipation plate 340 includes a plurality of flow channels along at least one of the second direction or the third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

[0087] It should be noted that the arrangement structure of the internal flow channels 380 of the heat dissipation plate 340 is a three-dimensional structure. Figure 7 is a schematic diagram of a cross section of the internal flow channels of the heat dissipation plate provided in an embodiment of the present application along the second direction.

[0088] As shown in (a) to (c) of FIG. 7 , the cross section of the internal flow channel 380 of the heat dissipation plate 340 along the second direction includes an S-shape, an L-shape, or a ring-shape.

[0089] In one embodiment, the coolant medium transmitted by the internal flow channel 380 of the heat sink 340 is different from the coolant medium transmitted by the internal flow channel of the radiator 330. In one embodiment, when the internal flow channel 380 of the heat sink 340 is not connected to the internal flow channel of the radiator 330, the coolant medium transmitted by the internal flow channel 380 of the heat sink 340 is different from the coolant medium transmitted by the internal flow channel of the radiator 330.

[0090] In one embodiment, the internal flow channel 380 of the heat sink 340 is used to connect to the internal oil channel of the housing 310, and the internal flow channel of the radiator 330 is used to connect to the internal water channel of the housing 310. In this case, the internal flow channel 380 of the heat sink 340 is used to transmit cooling oil, and the internal flow channel of the radiator 330 is used to transmit coolant.

[0091] In one embodiment, the internal flow channel 380 of the heat dissipation plate 340 is used to communicate with the internal flow channel of the radiator 330. For example, the internal flow channel 380 of the heat dissipation plate 340 is connected to the internal flow channel of the radiator 330 through a pipe.

[0092] FIG8 is a schematic structural diagram of a powertrain 300 provided in another embodiment of the present application, taking as an example a radiator 330 , a bus capacitor 320 , and a heat sink 340 stacked on a partition 350 along a first direction.

[0093] As shown in Figure 8 , the heat sink 340 includes two side surfaces that face away from each other along a first direction. One side surface (e.g., S1) is fixedly connected to the partition 350, and the other side surface (e.g., S2) includes an inlet 381 and an outlet 382 for the internal flow channel 380 of the heat sink 340. The inlet 381 and outlet 382 are respectively connected to the internal flow channel (not shown) of the radiator 330.

[0094] In one embodiment, the internal flow channel 380 of the heat sink 340 and the internal flow channel of the heat sink 330 are connected in series.

[0095] In one embodiment, the inlet 381 of the internal flow channel 380 of the heat sink 340 is connected to the outlet 382 of the internal flow channel of the radiator 330, and the outlet 382 of the internal flow channel 380 of the heat sink 340 is connected to the inlet 381 of the internal flow channel of the radiator 330. In one embodiment, the inlet 381 of the internal flow channel 380 of the heat sink 340 is connected to the outlet 382 of the internal flow channel of the radiator 330 via a pipe, and the outlet 382 of the internal flow channel 380 of the heat sink 340 is connected to the inlet 381 of the internal flow channel of the radiator 330 via another pipe.

[0096] In one embodiment, the internal flow channel 380 of the heat sink 340 and the internal flow channel of the heat sink 330 are connected in parallel.

[0097] In one embodiment, the inlet 381 of the internal flow channel 380 of the heat sink 340 is connected to the inlet 381 of the internal flow channel of the radiator 330, and the outlet 382 of the internal flow channel 380 of the heat sink 340 is connected to the outlet 382 of the internal flow channel of the radiator 330. In one embodiment, the inlet 381 of the internal flow channel 380 of the heat sink 340 is connected to the inlet 381 of the internal flow channel of the radiator 330 via a pipe, and the outlet 382 of the internal flow channel 380 of the heat sink 340 is connected to the outlet 382 of the internal flow channel of the radiator 330 via another pipe.

[0098] As shown in Figure 8 , the distance between the inlet 381 and outlet 382 of the internal flow channel 380 of the heat sink 340 is greater than the dimension of the bus capacitor 320 along the direction in which the inlet 381 and outlet 382 of the internal flow channel 380 of the heat sink 340 are arranged. When coolant flows through the internal flow channel 380 of the heat sink 340, it can better dissipate heat for the bus capacitor 320.

[0099] In one embodiment, along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340, the spacing between the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340 is greater than the size of the bus capacitor 320 along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340.

[0100] FIG9 is a schematic structural diagram of a powertrain 300 provided in an embodiment of the present application, taking as an example a case where a radiator 330 and a bus capacitor 320 are arranged adjacent to each other along the second direction, and the radiator 330 and the bus capacitor 320 are stacked on a heat sink 340 along the first direction.

[0101] As shown in Figure 9, along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340, the spacing between the inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340 is larger than the size of the bus capacitor 320 along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel of the heat sink 340, and smaller than the size of the radiator 330 along the arrangement direction of the inlet 381 and the outlet 382 of the internal flow channel of the heat sink 340.

[0102] In one embodiment, the heat sink 340 includes two side surfaces that face away from each other along a first direction. One side surface (e.g., S2) faces the busbar capacitor 320, and the other side surface (e.g., S1) includes an inlet 381 and an outlet 382 of an internal flow channel 380 of the heat sink 340. The inlet 381 and the outlet 382 of the internal flow channel 380 of the heat sink 340 are respectively connected to the internal flow channel of the housing 310.

[0103] In one embodiment, the partition 350 includes an internal flow channel, and at least one support column 370 also includes an internal flow channel. The internal flow channel of the support column 370 is used to connect the internal flow channel of the heat dissipation plate 340 and the internal flow channel of the partition 350 .

[0104] In one embodiment, the heat sink 340 is made of a metal material with good thermal conductivity, such as aluminum, copper, etc. In one embodiment, the heat sink 340 is called a heat sink metal plate, metal plate, or metal tray.

[0105] In one embodiment, a thermally conductive material 360 is disposed between the bus capacitor 320 , the heat sink 330 , and the heat sink 340 .

[0106] In one embodiment, a thermally conductive material 360 is disposed between the bus capacitor 320 and the heat sink 340 , and a thermally conductive material 360 is also disposed between the heat sink 330 and the heat sink 340 .

[0107] In one embodiment, a thermally conductive material 360 is disposed between the bus capacitor 320 and the heat sink 340 , and a thermally conductive material 360 is also disposed between the heat sink 330 and the bus capacitor 320 .

[0108] In one embodiment, the radiator 330 is a single-sided liquid-cooled radiator. In another embodiment, the radiator 330 is a double-sided liquid-cooled radiator.

[0109] In one embodiment, the motor controller further includes a circuit board and a power module (not shown in the figure). The circuit board is used to fix the power module, and the power module is used to package at least one power transistor.

[0110] In the embodiments of the present application, the circuit board is also referred to as a printed circuit board assembly, which is also referred to as a printed circuit board assembly, or PCBA for short.

[0111] The power transistors involved in the embodiments of the present application include, but are not limited to, power semiconductor devices and devices with heat dissipation. For example, the power transistors are insulated gate bipolar transistors (IGBTs) or power inductors. Insulated gate bipolar transistors are also called insulated gate bipolar transistors (IGBTs).

[0112] In one embodiment, the motor controller described above further includes a connector (not shown in the figure), which is used to electrically connect the circuit board and the motor.

[0113] In one embodiment, the power assembly 300 described above further includes a reducer, and the input shaft of the reducer is drivingly connected to the motor shaft of the motor.

[0114] According to the powertrain provided in the embodiment of the present application, it is possible to achieve good heat dissipation of the bus capacitor in a scenario where the motor controller and the motor share a housing, thereby extending the life of the bus capacitor.

[0115] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A powertrain, characterized in that, The powertrain includes: A housing, a motor controller, and a motor. The housing includes two integrally formed sub-cavities and a partition. The two sub-cavities are arranged in a first direction. The partition is used to separate the two sub-cavities. One of the sub-cavities is used to accommodate the bus capacitors and the radiator of the motor controller, and the other sub-cavity is used to fix the stator of the motor and accommodate the rotor of the motor; A heat dissipation plate. Along the first direction, the heat dissipation plate is arranged between the bus capacitors and the partition. Along the first direction, the interval between the heat dissipation plate and the partition is greater than the interval between the heat dissipation plate and the bus capacitors.

2. The powertrain according to claim 1, wherein, Along the first direction, the bus capacitors are arranged between the radiator and the heat dissipation plate.

3. The powertrain according to claim 2, characterized in that, The interval between the radiator and the bus capacitors along the first direction is less than the interval between the heat dissipation plate and the partition along the first direction.

4. The powertrain according to claim 1, characterized in that, Along a second direction perpendicular to the first direction, the radiator and the bus capacitors are arranged adjacent to each other.

5. The powertrain according to claim 4, characterized in that, The interval between the radiator and the bus capacitors along the second direction is less than the interval between the heat dissipation plate and the partition along the first direction.

6. The powertrain according to claim 4 or 5, characterized in that, Along the first direction, the radiator and the bus capacitors are stacked on the heat dissipation plate, and along the first direction, the heat dissipation plate is stacked on the partition.

7. The powertrain according to claim 6, characterized in that, The interval between the radiator and the heat dissipation plate along the first direction is less than the interval between the heat dissipation plate and the partition along the first direction.

8. The powertrain according to claim 1, characterized in that, The heat dissipation plate includes an internal flow channel. The internal flow channel of the heat dissipation plate is used to transport coolant to dissipate heat for at least one of the bus capacitors or the partition. The radiator includes an internal flow channel. The internal flow channel of the radiator is used to transport coolant to dissipate heat for at least one of the power modules of the motor controller or the bus capacitors.

9. The powertrain according to claim 8, characterized in that, The internal flow channel of the heat dissipation plate is used to communicate with the internal flow channel of the radiator. The heat dissipation plate includes two sides that face away from each other along the first direction, where: One of the sides is used for fixedly connecting to the partition; The other side includes an inlet and an outlet of the internal flow channel of the heat dissipation plate. The inlet and the outlet of the internal flow channel of the heat dissipation plate are respectively used to communicate with the internal flow channel of the radiator.

10. The powertrain according to claim 9, characterized in that, Along the arrangement direction of the inlet and the outlet of the internal flow channel of the heat dissipation plate, the interval between the inlet and the outlet of the internal flow channel of the heat dissipation plate is greater than the dimension of the bus capacitors along the arrangement direction of the inlet and the outlet of the internal flow channel of the heat dissipation plate, and less than the dimension of the radiator along the arrangement direction of the inlet and the outlet of the internal flow channel of the heat dissipation plate.

11. The powertrain according to claim 9, characterized in that, The internal flow channel of the heat dissipation plate and the internal flow channel of the radiator are connected in series, where: The inlet of the internal flow channel of the heat dissipation plate is used to communicate with the outlet of the internal flow channel of the radiator, and the outlet of the internal flow channel of the heat dissipation plate is used to communicate with the inlet of the internal flow channel of the radiator.

12. The powertrain according to claim 9, characterized in that, The internal flow channel of the radiator and the internal flow channel of the radiator are connected in parallel, where: The inlet of the internal flow channel of the heat dissipation plate is used to communicate with the inlet of the internal flow channel of the radiator, and the outlet of the internal flow channel of the heat dissipation plate is used to communicate with the outlet of the internal flow channel of the radiator.

13. The powertrain according to claim 8, characterized in that, The working medium of the coolant transmitted by the internal flow channel of the heat dissipation plate is different from the working medium of the coolant transmitted by the internal flow channel of the radiator.

14. The powertrain according to claim 13, characterized in that, The internal flow channel of the heat dissipation plate is used to communicate with the internal oil channel of the housing, and the internal flow channel of the radiator is used to communicate with the internal water channel of the housing.

15. The powertrain according to claim 13, characterized in that, The heat dissipation plate includes two sides, and the two sides face away from each other in the first direction, where: One side faces the bus capacitor; the other side includes the inlet and outlet of the internal flow channel of the heat dissipation plate, and the inlet and outlet of the internal flow channel of the heat dissipation plate are respectively used to communicate with the internal flow channel of the housing.

16. The powertrain according to claim 1 or 13, characterized in that, At least one of the partition or the heat dissipation plate includes at least one support column, and each support column is used to fixedly connect the heat dissipation plate and the partition.

17. The powertrain according to claim 16, characterized in that, The partition includes an internal flow channel, and at least one of the support columns includes an internal flow channel. The internal flow channel of the support column is used to communicate the internal flow channel of the heat dissipation plate and the internal flow channel of the partition.

18. The powertrain according to claim 8, characterized in that, The internal flow channel of the heat dissipation plate includes a plurality of flow channels along at least one of the third direction or the second direction, and the first direction, the second direction, and the third direction are perpendicular to each other.

19. The powertrain according to claim 1, characterized in that, The projected area of the heat dissipation plate in the first direction is greater than or equal to the projected area of the bus capacitor in the first direction.

20. An electric vehicle, characterized in that, The electric vehicle includes wheels, a transmission mechanism, and a power assembly as described in any one of claims 1 to 19, and the power assembly drives the wheels through the transmission mechanism.

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