Can-type optical module and optical transceiver

Abstract

A CAN-type optical module according to the present disclosure comprises: a stem; a lead pin that penetrates the stem; a support part that is provided on a main surface of the stem; a submount that is supported by the support part and has a mounting surface provided to be perpendicular to the main surface of the stem; a semiconductor optical integrated element that is provided on the mounting surface of the submount and has a semiconductor laser part and an optical modulator part; a series circuit that includes a matching resistor and a capacitor connected in series with each other, and that is connected in parallel with the optical modulator part; and a protective resistor that is connected in parallel with the series circuit.

Description

CAN-type optical module and optical transceiver

[0001] The present disclosure relates to a CAN-type optical module and an optical transceiver.

[0002] Patent Document 1 discloses a CAN-type optical module. This optical module includes a semiconductor optical element in which a semiconductor laser, an optical modulator, and an optical amplifier are monolithically integrated.

[0003] Japanese Patent Application Laid-Open No. 2022-99537

[0004] When a DC bias is applied to the anode of the optical modulator, a DC bias is also applied to the matching resistor connected to the optical modulator. This can result in increased power consumption due to heat generation in the matching resistor. In the CAN-type optical module of Patent Document 1, a capacitor is connected between the matching resistor and GND to reduce power consumption. This can cause the optical modulator to easily become charged, which can lead to surges and cause the optical modulator to malfunction.

[0005] An object of the present disclosure is to provide a CAN-type optical module and an optical transceiver that can suppress failures in an optical modulator section.

[0006] A CAN-type optical module according to the present disclosure includes a stem having a main surface and a surface opposite to the main surface, a lead pin penetrating the stem from the main surface to the surface opposite to the main surface, a support portion provided on the main surface of the stem, a first submount supported by the support portion and provided so that its mounting surface is perpendicular to the main surface of the stem, a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser portion and an optical modulator portion, and a second submount provided on the main surface of the stem, all of which are connected in series. the second submount is formed with a first signal line and a first GND pattern; the first submount is formed with a second signal line connecting the optical modulator section and the first signal line, and a second GND pattern; and the protective resistor is connected between the first signal line and the first GND pattern or between the second signal line and the second GND pattern.

[0007] An optical transceiver according to the present disclosure comprises a CAN-type optical module, a flexible printed circuit board connecting the CAN-type optical module and a transceiver board, and a protective resistor, wherein the CAN-type optical module comprises: a stem having a main surface and a surface opposite to the main surface; a lead pin penetrating the stem from the main surface to the surface opposite to the main surface; a support portion provided on the main surface of the stem; a first submount supported by the support portion and provided so that its mounting surface is perpendicular to the main surface of the stem; a semiconductor optical integrated device provided on the mounting surface of the first submount, the semiconductor optical integrated device having a semiconductor laser portion and an optical modulator portion; and a series circuit connected in parallel to the optical modulator portion, the series circuit including a matching resistor and a capacitor for the optical modulator portion connected in series to each other, and the protective resistor is connected in parallel to the series circuit, and is provided on the flexible printed circuit board or the transceiver board.

[0008] In the CAN-type optical module and optical transceiver according to the present disclosure, even if a surge is input, a current flows through the protective resistor, thereby preventing failure of the optical modulator unit.

[0009] FIG. 1 is a perspective view of a CAN-type optical module according to a first embodiment. FIG. 2 is a diagram illustrating the configuration of a semiconductor optical integrated device according to the first embodiment. FIG. 3 is a perspective view of the CAN-type optical module according to the first embodiment, viewed from another angle. FIG. 4 is a diagram illustrating a circuit formed by an optical modulator unit, a matching resistor, a capacitor, and a protective resistor according to the first embodiment. FIG. 5 is a diagram illustrating a protective resistor according to a second embodiment. FIG. 6 is a diagram illustrating the reflection characteristics of the CAN-type optical module according to the second embodiment. FIG. 7 is a perspective view of an optical transceiver according to a third embodiment. FIG. 8 is a diagram illustrating a protective resistor according to the third embodiment. FIG. 9 is a diagram illustrating the reflection characteristics of the optical transceiver according to the third embodiment. FIG. 10 is a diagram illustrating a protective resistor according to a fourth embodiment. FIG. 11 is a diagram illustrating a protective resistor according to a fifth embodiment. FIG. 12 is a perspective view of an optical transceiver according to a sixth embodiment. FIG. 13 is a diagram illustrating a protective resistor according to the sixth embodiment. FIG. 14 is a perspective view of a CAN-type optical module according to a seventh embodiment. FIG. 15 is a perspective view of a CAN-type optical module according to an eighth embodiment. FIG. 16 is a diagram illustrating the transmission characteristics of the CAN-type optical module according to the eighth embodiment.

[0010] The CAN-type optical module and the optical transceiver according to each embodiment will be described with reference to the drawings. The same or corresponding components are designated by the same reference numerals, and the repeated description may be omitted.

[0011] First Embodiment. Fig. 1 is a perspective view of a CAN-type optical module 100 according to a first embodiment. The CAN-type optical module 100 includes a stem 1 having a main surface 1a and a surface opposite to the main surface 1a. The stem 1 is, for example, circular in plan view. The diameter of the stem is, for example, 5.6 mm. The stem 1 is made of metal. The stem 1 is formed by plating the surface of a material with high thermal conductivity, such as Cu, with Au or the like.

[0012] The lead pins 2a to 2f penetrate the stem 1 from the main surface 1a to the surface opposite the main surface 1a. Glass 3 is generally used to secure the lead pins 2a to 2f to the stem 1. If there is an impedance mismatch, multiple reflections of the signal will deteriorate the frequency response characteristics, making high-speed modulation difficult. Therefore, the glass 3 is made of a material with a low dielectric constant.

[0013] A support portion is provided on the main surface 1a of the stem 1. The support portion includes, for example, a temperature control module 10 mounted on the main surface 1a of the stem 1, and a first support block 20 mounted on the temperature control module 10 on the side opposite to the main surface 1a of the stem 1. The first support block 20 is also called a carrier. The first support block 20 supports a first submount 30.

[0014] In the temperature control module 10, multiple thermoelectric elements made of a material such as BiTe are sandwiched between a lower substrate and an upper substrate made of a material such as AlN. The lower substrate of the temperature control module 10 has a protrusion that protrudes further than the upper substrate in a direction parallel to the main surface 1a of the stem 1. An electrode pattern for supplying power to the thermoelectric elements is provided on this protrusion. The electrode pattern is electrically connected to lead pins 2d and 2e. The temperature control module 10 may be omitted.

[0015] A first support block 20 is mounted on the top surface of the temperature control module 10. The bottom surface of the first support block 20 and the top surface of the temperature control module 10 are joined by solder or the like. The first support block 20 is made of metal. For example, the first support block 20 is formed by plating the surface of a material with high thermal conductivity, such as Cu, with Au or the like. The stem 1 and the support portion may be separate components or may be a single component.

[0016] The first submount 30 is supported by a support and is disposed so that its mounting surface is perpendicular to the main surface 1a of the stem 1. Specifically, the first submount 30 is mounted on the side surface of the first support block 20. The first submount 30 is, for example, a dielectric substrate. The first submount 30 is made of a ceramic material such as AlN and has electrical insulation and heat transfer functions. A metal pattern is formed on the mounting surface of the first submount 30.

[0017] FIG. 2 is a diagram illustrating the configuration of a semiconductor optical integrated device 50 according to the first embodiment. A semiconductor laser section 50a, an optical modulator section 50b, and an optical amplifier section 50c are provided on the mounting surface of the first submount 30. In this embodiment, an example is shown in which the semiconductor laser section 50a, the optical modulator section 50b, and the optical amplifier section 50c are integrated in the semiconductor optical integrated device 50, but the optical modulator section 50b and the optical amplifier section 50c may be provided separately. Furthermore, the optical amplifier section 50c may be omitted. As shown in FIG. 1, the semiconductor optical integrated device 50 is mounted at an angle with respect to a direction perpendicular to the main surface 1a of the stem 1.

[0018] The semiconductor laser section 50a, the optical modulator section 50b, and the optical amplifier section 50c are electrically insulated from one another by a semi-insulating substrate such as Fe-doped InP, allowing current to flow independently. This improves current controllability. The semiconductor laser section 50a, the optical modulator section 50b, and the optical amplifier section 50c share a common GND.

[0019] The oscillation wavelength of the semiconductor optical integrated device 50 varies with temperature. For this reason, it is necessary to maintain the temperature of the semiconductor optical integrated device 50 as constant as possible. When the temperature of the semiconductor optical integrated device 50 rises, the temperature control module 10 cools it, while when the temperature of the semiconductor optical integrated device 50 drops, the temperature control module 10 generates heat. This makes it possible to maintain the temperature of the semiconductor optical integrated device 50 constant. Furthermore, heat generated by the semiconductor optical integrated device 50 is absorbed by the temperature control module 10 and dissipated to the back side of the stem 1 via the stem 1.

[0020] A thermistor 55 is provided on the second portion 22 of the first support block 20. The lead pin 2a is electrically connected to the thermistor 55. The thermistor 55 indirectly measures the temperature of the semiconductor optical integrated device 50 and feeds it back to the temperature control module 10. The temperature control module 10 controls the temperature of the semiconductor optical integrated device 50 based on the temperature measured by the thermistor 55.

[0021] Capacitors C0, C1, and C2 are mounted in an aligned manner on the side of the first support block 20 on which the first submount 30 is mounted. The capacitors C0, C1, and C2 may be mounted on the support portion or may be mounted on the temperature control module 10. Capacitor C0 is a capacitor for the semiconductor laser portion, and electrically connects the anode of the semiconductor laser portion 50a to the lead pin 2b. Capacitor C1 is a capacitor for the optical modulator portion. A series circuit of capacitor C1 and matching resistor R1 is connected in parallel with the optical modulator portion 50b. Capacitor C2 is a capacitor for the optical amplifier portion, and electrically connects the anode of the optical amplifier portion 50c to the lead pin 2c.

[0022] Capacitors C0 and C2 can cut power supply noise. Capacitor C1 can cut the DC component flowing through matching resistor R1, enabling an AC coupling system. As shown in FIG. 1, by placing capacitor C1 near the optical modulator section 50b, the wire between capacitor C1 and optical modulator section 50b can be shortened. This can prevent deterioration of high-frequency characteristics.

[0023] A second support block 79 and a second submount 80 are provided on the main surface 1a of the stem 1. The second submount 80 is mounted on the side of the second support block 79. The second submount 80 is, for example, a dielectric substrate. The second submount 80 is formed of a ceramic material such as AlN. A signal line 80a and a GND pattern 80b are formed on the second submount 80. Furthermore, a signal line 30a that connects the optical modulator section 50b and the signal line 80a via a wire, and a GND pattern 30b are formed on the first submount 30. The GND pattern 30b is connected to the GND pattern 80b via a wire. The lead pin 2f is connected to the signal line 80a of the second submount 80. In other words, the lead pin 2f is electrically connected to the optical modulator section 50b via the signal line 80a and the signal line 30a. The lead pin 2f is an RF power supply lead pin.

[0024] 3 is a perspective view of the CAN-type optical module 100 according to the first embodiment, viewed from a different angle. To strengthen the GND potential of the first support block 20, it is desirable to electrically connect the first support block 20 and the second support block 79 with a wire W0 or the like. The first support block 20 has, for example, a first portion 21 and a second portion 22. The first portion 21 supports the first submount 30. The second portion 22 is provided on the temperature control module 10 and protrudes from the first portion 21 on the side opposite the first submount 30.

[0025] For example, when connecting a wire between the second support block 79 and the first portion 21, it is necessary to ensure the wire loop height from the first portion 21. Therefore, if a cap is mounted on the CAN-type optical module 100, the height of the cap's inner wall must be increased so that the wire loop does not interfere with the cap. In contrast, in this embodiment, the upper surface of the second support block 79 and the second portion 22 are connected by a wire W0. Because the second portion 22 is lower than the first portion 21, there is no need to consider the wire loop height. Therefore, it is possible to strengthen the GND potential of the first support block 20 and improve the high-frequency characteristics while reducing the height of the CAN-type optical module 100.

[0026] The first support block 20 has the role of transferring heat generated by the semiconductor optical integrated device 50 to the temperature control module 10, and it is necessary to reduce the thermal resistance of the first support block 20 as much as possible. If the height of the second portion 22 is too low, the thermal resistance will increase, which may result in an increase in the power consumption of the temperature control module 10. For this reason, it is desirable to make the second portion 22 tall enough so that the height of the wire W0 does not exceed the height of the first portion 21.

[0027] 4 is a diagram illustrating a circuit formed by an optical modulator section 50b, a matching resistor R1, a capacitor C1, and a protective resistor R2 according to the first embodiment. In FIG. 4, the optical modulator section 50b is depicted as a diode D1. As described above, a series circuit including the matching resistor R1 and the capacitor C1 connected in series is connected in parallel to the optical modulator section 50b. A protective resistor R2 is connected in parallel to this series circuit.

[0028] The resistance value of the matching resistor R1 is, for example, 50 Ω or 40 Ω. The capacitance of the capacitor C1 is, for example, 1 to 10 nF. The resistance value of the protective resistor R2 is, for example, 1000 Ω. These resistance values ​​and capacitances are not limited to the above values. It is preferable that the resistance value of the matching resistor R1 is smaller than the resistance value of the protective resistor R2.

[0029] In this embodiment, the protective resistor R2 is connected between the signal line 30a and the GND pattern 30b of the first submount 30. This results in a circuit as shown in Figure 4. The protective resistor R2 is, for example, a thin-film resistor formed on or attached to the first submount 30.

[0030] In the CAN-type optical module 100 according to this embodiment, the protective resistor R2 connected between the anode of the optical modulator section 50b and GND can prevent charging of the optical modulator section 50b. Furthermore, even if a surge is input, a current flows through the protective resistor R2. This can prevent failure of the optical modulator section 50b.

[0031] The number of wires connecting the patterns, the arrangement of the capacitors C0 to C2, the structure of the support portion, etc. are not limited to those shown in the drawings and can be changed as appropriate.

[0032] The above-described modifications can be applied as appropriate to the CAN-type optical modules and optical transceivers according to the following embodiments. Note that the CAN-type optical modules and optical transceivers according to the following embodiments have many points in common with the first embodiment, so the following description will focus on the differences from the first embodiment.

[0033] Second Embodiment. Figure 5 is a diagram illustrating a protective resistor R2 according to a second embodiment. In a CAN-type optical module 200 according to the second embodiment, the position of the protective resistor R2 differs from that of the CAN-type optical module 100 according to the first embodiment. The other structures are the same as those of the first embodiment. The protective resistor R2 according to the present embodiment is connected between the signal line 80a and the GND pattern 80b of the second submount 80. This results in a circuit as shown in Figure 4. The protective resistor R2 is, for example, a thin-film resistor formed on or attached to the second submount 80.

[0034] 6 is a diagram illustrating the reflection characteristic S11 of the CAN-type optical module 200 according to the second embodiment. Looking at the portion indicated by the arrow in the figure, it can be seen that the electromagnetic field resonance that occurred in the first embodiment does not occur in the second embodiment, and the reflection characteristic is improved. In other words, better high-frequency characteristics can be obtained by placing the protective resistor R2 on the second submount 80 rather than on the first submount 30.

[0035] In the first embodiment, the protective resistor R2 is formed by hollowing out the GND pattern 30b of the first submount 30. This may have caused the GND potential to become unstable, causing a slight change in impedance in the GSG line of the first submount 30 and deteriorating characteristics. In contrast, the line of the second submount 80 is a microstrip line, and there is no need to hollow out the GND pattern to form the protective resistor R2 as in the first embodiment. This is thought to have suppressed the impedance change and resulted in good high-frequency characteristics. The second submount 80 may also be a coplanar line.

[0036] The protective resistor R2 is not limited to being connected between the signal line 80a and the upper GND pattern 80b, but may be connected between the signal line 80a and the lower GND pattern.

[0037] 7 is a perspective view of an optical transceiver 1000 according to a third embodiment. The optical transceiver 1000 includes a CAN-type optical module 101 and a flexible printed circuit board 70 that connects the CAN-type optical module 101 to a transceiver board (described later). The CAN-type optical module 101 can have the same structure as the CAN-type optical modules 100 and 200, except for the placement of the protective resistor R2.

[0038] In the CAN-type optical module 101, a lens cap 91 is provided on the stem 1. The lens cap 91 is omitted in Fig. 1. The flexible printed circuit board 70 is attached to the side of the stem 1 opposite to the main surface 1a.

[0039] 8 is a diagram illustrating a protective resistor R2 according to the third embodiment. FIG. 8 is a diagram illustrating a flexible printed circuit board 70 viewed from the back surface side. In this embodiment, the protective resistor R2 is provided on the flexible printed circuit board 70. Lead pins 2a to 2f protrude from the back surface of the flexible printed circuit board 70. Of these, the lead pin 2f is an RF power supply lead pin electrically connected to the optical modulator section 50b.

[0040] On the side of the flexible printed circuit board 70 opposite the stem 1, there are formed a signal line 70a connected to the lead pin 2f and a GND pattern 70b electrically connected to the rear surface of the stem 1. A protective resistor R2 connects the signal line 70a and the GND pattern 70b of the flexible printed circuit board 70. This results in a circuit as shown in Figure 4. The protective resistor R2 is, for example, a thin-film resistor formed on the flexible printed circuit board 70.

[0041] 9 is a diagram illustrating the reflection characteristic S11 of the optical transceiver 1000 according to the third embodiment. Looking at the portion indicated by the arrow in the figure, it can be seen that the reflection characteristic of the third embodiment is improved compared to that of the first embodiment. The flexible printed circuit board 70 also uses a microstrip line, eliminating the need to cut out the GND pattern to form the protective resistor R2. This is thought to have suppressed impedance changes and resulted in good high-frequency characteristics.

[0042] Fourth Embodiment. FIG. 10 is a diagram illustrating a protective resistor R2 according to a fourth embodiment. In an optical transceiver 2000 according to this embodiment, the type of protective resistor R2 differs from that of the optical transceiver 1000 according to the third embodiment. The protective resistor R2 according to this embodiment is a chip resistor. Other configurations are similar to those of the third embodiment. Depending on the manufacturer, it may be difficult to form a thin-film resistor. Furthermore, increasing the precision of the resistance value of a thin-film resistor by laser trimming may increase manufacturing costs. According to this embodiment, manufacturers can provide the protective resistor R2 by purchasing and joining a chip resistor. This simplifies the manufacturing process and reduces costs.

[0043] Fifth Embodiment Fig. 11 is a diagram illustrating a protective resistor R2 according to a fifth embodiment. In a CAN-type optical module 300 according to this embodiment, the type of protective resistor R2 is different from that in the CAN-type optical module 200 according to the second embodiment. The protective resistor R2 according to this embodiment is a chip resistor. Other configurations are the same as those in the second embodiment. As in the fourth embodiment, the manufacturing process can be simplified and costs can be reduced in this embodiment as well. The protective resistor R2 according to the first embodiment may be replaced with a chip resistor.

[0044] Sixth Embodiment. Figure 12 is a perspective view of an optical transceiver 3000 according to a sixth embodiment. In this embodiment, the arrangement of the protective resistor R2 differs from that of the third embodiment. The other configurations are the same as those of the third embodiment. In the optical transceiver 3000, a receptacle 102 for fixing an optical fiber is attached to a CAN-type optical module 101. A transceiver board 60, which mounts integrated circuits for driving the CAN-type optical module 101 and the optical receiver module 106, is connected to the CAN-type optical module 101 and the optical receiver module 106 via a flexible printed circuit board 70. In the optical transceiver 3000, the CAN-type optical module 101, the optical receiver module 106, the flexible printed circuit board 70, the receptacle 102, and the transceiver board 60 are housed in a case 105.

[0045] In order to increase the amount of heat transfer between the CAN-type optical module 101 and the case 105, it is preferable to attach a heat dissipation block 103 between the CAN-type optical module 101 and the case 105. The heat dissipation block 103 desirably has a semicircular structure that allows the CAN-type optical module 101 to be fixed over the entire length of its side surface. Furthermore, a heat dissipation block 104 may be attached to the CAN-type optical module 101. Like the heat dissipation block 103, the heat dissipation block 104 has a semicircular structure that allows the CAN-type optical module 101 to be fixed over the entire length of its side surface. Furthermore, the heat dissipation block 104 has a fin-shaped side opposite the CAN-type optical module 101.

[0046] FIG. 13 is a diagram illustrating a protective resistor R2 according to a sixth embodiment. FIG. 13 is an enlarged view of region A1 in FIG. 12. The protective resistor R2 of this embodiment is provided on a transceiver board 60. The transceiver board 60 is provided with a plurality of electrodes 61, each connected to a signal line 70a and a GND pattern 70b of a flexible printed circuit board 70. The protective resistor R2 connects the plurality of electrodes 61. This results in a circuit as shown in FIG. 4. The protective resistor R2 is, for example, a thin-film resistor formed on the transceiver board 60. The protective resistor R2 may also be a chip resistor.

[0047] In this embodiment as well, even if a surge is input, a current flows through the protective resistor R2, which prevents the optical modulator section 50b from breaking down.

[0048] Seventh Embodiment Fig. 14 is a perspective view of a CAN-type optical module 400 according to a seventh embodiment. The CAN-type optical module 400 includes a wire W1 that connects a GND pattern 10a formed on the surface of the temperature control module 10 on which the first support block 20 is provided, to the stem 1. The top surface of the temperature control module 10 is electrically connected to the GND patterns of the first support block 20 and the first submount 30, and is at GND potential. By connecting the top surface of the temperature control module 10 to the stem 1 with the wire W1, the GND on the top surface of the temperature control module 10 can be strengthened, further improving high-frequency characteristics.

[0049] Eighth Embodiment Figure 15 is a perspective view of a CAN-type optical module 500 according to an eighth embodiment. This embodiment differs from the seventh embodiment in the shape of the first support block 520 and the position of the wire for strengthening the GND. The other configurations are the same as those of the seventh embodiment. The first support block 520 has a first portion 521 that supports the first submount 30, and a second portion 522 that is provided on the temperature control module 10 and protrudes from the first portion 521 toward the first submount 30. The first support block 520 can also be said to be inverted T-shaped.

[0050] The CAN-type optical module 500 includes a wire W2 that connects the second portion 522 of the first support block 520 to the stem 1. The CAN-type optical module 500 also includes a wire W3 that connects the second portion 522 of the first support block 520 to the GND pattern 80c of the second submount 80. In this embodiment as well, the GND on the upper surface side of the temperature control module 10 can be strengthened, further improving the high-frequency characteristics. Note that only one or both of the wires W2 and W3 may be provided.

[0051] 16 is a diagram illustrating the transmission characteristic S21 of the CAN-type optical module 500 according to the eighth embodiment. The solid line indicates the case where the wires W2 and W3 are present, and the dashed line indicates the case where the wires W2 and W3 are not present. Looking at the portion indicated by the arrow in the diagram, it can be seen that providing the wires W2 and W3 can suppress resonance in the transmission characteristic.

[0052] 14 and 15 , the protective resistor R2 is provided at the position shown in the second embodiment, but wires W1, W2, and W3 may be provided in any of the embodiments. Furthermore, the wire W0 described in the first embodiment may be combined with at least one of the wires W1, W2, and W3 and applied to each embodiment. For example, the first support block 520 may be provided on the temperature control module 10 and have a third portion 523 that protrudes from the first portion 521 on the side opposite the first submount 30, and the top surface of the second support block 79 may be connected to the third portion 523 by the wire W0.

[0053] The technical features described in each embodiment may be used in appropriate combination.

[0054] 1 stem, 1a main surface, 2a to 2f lead pins, 3 glass, 10 temperature control module, 10a GND pattern, 20 first support block, 21 first part, 22 second part, 30 first submount, 30a signal line, 30b GND pattern, 50 semiconductor optical integrated element, 50a semiconductor laser section, 50b optical modulator section, 50c optical amplifier section, 55 thermistor, 60 transceiver substrate, 61 electrode, 70 flexible printed circuit board, 70a signal line, 70b GND pattern, 79 second support block, 80 second submount, 80a signal line, 80b, 80c GND pattern, 91 cap, 100, 101 CAN type optical module, 102 receptacle, 103, 104 heat dissipation block, 105 case, 106 Optical receiver module, 200, 300, 400, 500 CAN type optical module, 520 First support block, 521 First part, 522 Second part, 523 Third part, 1000, 2000, 3000 Optical transceiver, C0, C1, C2 Capacitor, D1 Diode, R1 Matching resistor, R2 Protection resistor, W0 to W3 Wires

Claims

1. A CAN type optical module comprising: a stem having a main surface and a surface opposite to the main surface; a lead pin penetrating the stem from the main surface to the surface opposite to the main surface; a support portion provided on the main surface of the stem; a first submount supported by the support portion such that a mounting surface thereof is perpendicular to the main surface of the stem; a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser portion and an optical modulator portion; a second submount provided on the main surface of the stem; a series circuit including a matching resistor and a capacitor for the optical modulator portion connected in series with each other and connected in parallel with the optical modulator portion; and a protection resistor connected in parallel with the series circuit, wherein a first signal line and a first GND pattern are formed on the second submount, a second signal line connecting the optical modulator portion and the first signal line and a second GND pattern are formed on the first submount, and the protection resistor is connected between the first signal line and the first GND pattern or between the second signal line and the second GND pattern.

2. The CAN type optical module according to claim 1, wherein the protection resistor is connected between the first signal line and the first GND pattern of the second submount.

3. The CAN type optical module according to claim 1, wherein the protection resistor is connected between the second signal line and the second GND pattern of the first submount.

4. The CAN type optical module according to any one of claims 1 to 3, wherein the protection resistor is a chip resistor.

5. The CAN type optical module according to any one of claims 1 to 4, wherein the support portion includes a temperature control module mounted on the main surface of the stem and a first support block mounted on the surface opposite to the main surface of the stem of the temperature control module and supporting the first submount.

6. The CAN type optical module according to claim 5, further comprising a second support block provided on the main surface of the stem, wherein the second submount is mounted on a side surface of the second support block.

7. The CAN type optical module according to claim 6, further comprising a wire connecting a GND pattern formed on a surface of the temperature control module where the first support block is provided and the stem.

8. The first support block has a first portion that supports the first submount, and a second portion that is provided on the temperature control module and protrudes on the side opposite to the first submount with respect to the first portion. The CAN type optical module according to claim 6 or 7, further comprising a wire connecting an upper surface of the second support block and the second portion.

9. The first support block has a first portion that supports the first submount, and a second portion that is provided on the temperature control module and protrudes from the first portion toward the first submount side. The CAN type optical module according to claim 6, further comprising at least one of a wire connecting the second portion and the stem, and a wire connecting the second portion and a GND pattern of the second submount.

10. The first support block has a third portion that is provided on the temperature control module and protrudes on the side opposite to the first submount with respect to the first portion. The CAN type optical module according to claim 9, further comprising a wire connecting an upper surface of the second support block and the third portion.

11. The CAN type optical module according to any one of claims 1 to 10, wherein the semiconductor optical integrated device has an optical amplifier section.

12. The CAN type optical module according to any one of claims 1 to 11, wherein the semiconductor optical integrated device is mounted in an inclined manner with respect to a direction perpendicular to the main surface of the stem.

13. The CAN type optical module according to claim 11, further comprising a capacitor for semiconductor laser section connected to the semiconductor laser section, and a capacitor for optical amplifier section connected to the optical amplifier section.

14. The CAN type optical module according to claim 13, wherein the capacitor for semiconductor laser section, the capacitor for optical amplifier section, and the capacitor for optical modulator section are mounted in alignment with the support section.

15. A CAN type optical module, a flexible printed circuit board connecting the CAN type optical module and a transceiver substrate, and a protection resistor, wherein the CAN type optical module includes a stem having a main surface and a surface opposite to the main surface, a lead pin penetrating the stem from the main surface to the surface opposite to the main surface, a support portion provided on the main surface of the stem, a first submount supported by the support portion and provided such that a mounting surface is perpendicular to the main surface of the stem, a semiconductor optical integrated element provided on the mounting surface of the first submount and having a semiconductor laser portion and an optical modulator portion, a series circuit including a matching resistor and a capacitor for the optical modulator portion connected in series with each other and connected in parallel with the optical modulator portion, and the protection resistor is connected in parallel with the series circuit and provided on the flexible printed circuit board or the transceiver substrate. The optical transceiver is characterized by the above structure.

16. The lead pin includes an RF power supply lead pin electrically connected to the optical modulator portion. A signal line and a GND pattern connected to the RF power supply lead pin are formed on the flexible printed circuit board. The protection resistor connects the signal line of the flexible printed circuit board and the GND pattern of the flexible printed circuit board. The optical transceiver according to claim 15 is characterized by the above structure.

17. The protection resistor is provided on the transceiver substrate. The optical transceiver according to claim 15 is characterized by the above structure.

18. The protection resistor is a chip resistor. The optical transceiver according to any one of claims 15 to 17 is characterized by the above structure.

19. The support portion includes a temperature control module mounted on the main surface of the stem, and a first support block mounted on the side of the temperature control module opposite to the main surface of the stem and supporting the first submount. The optical transceiver according to any one of claims 15 to 18 is characterized by the above structure.

20. The CAN type optical module includes a second support block provided on the main surface of the stem, and a second submount mounted on a side surface of the second support block. The optical transceiver according to claim 19 is characterized by the above structure.

21. The optical transceiver according to claim 20, further comprising a wire connecting a GND pattern formed on a surface of the temperature control module where the first support block is provided and the stem.

22. The first support block has a first portion that supports the first submount and a second portion that is provided on the temperature control module and protrudes on the side opposite to the first submount with respect to the first portion. The CAN type optical module according to claim 20 or 21, further comprising a wire connecting the upper surface of the second support block and the second portion.

23. The first support block has a first portion that supports the first submount and a second portion that is provided on the temperature control module and protrudes from the first portion toward the first submount side. The optical transceiver according to claim 20, wherein the CAN type optical module includes at least one of a wire connecting the second portion and the stem and a wire connecting the second portion and a GND pattern of the second submount.

24. The first support block has a third portion that is provided on the temperature control module and protrudes on the side opposite to the first submount with respect to the first portion. The optical transceiver according to claim 23, wherein the CAN type optical module includes a wire connecting the upper surface of the second support block and the third portion.

25. The optical transceiver according to any one of claims 15 to 24, wherein the semiconductor optical integrated device includes an optical amplifier section.

26. The optical transceiver according to any one of claims 15 to 25, wherein the semiconductor optical integrated device is mounted at an inclination with respect to a direction perpendicular to the main surface of the stem.

27. The optical transceiver according to claim 25, wherein the CAN type optical module includes a capacitor for a semiconductor laser section connected to the semiconductor laser section and a capacitor for an optical amplifier section connected to the optical amplifier section.

28. The optical transceiver according to claim 27, wherein the capacitor for the semiconductor laser section, the capacitor for the optical amplifier section, and the capacitor for the optical modulator section are mounted in alignment with the support section.

Images