Deformation sensing method and apparatus, and device and medium

Abstract

A deformation sensing method, comprising: determining a first deformation characteristic value corresponding to a target monitoring point and a second deformation characteristic value corresponding to a reference point (S110); on the basis of the second deformation characteristic value, compensating for the first deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point (S120); and on the basis of the third deformation characteristic value, determining a deformation degree corresponding to the target monitoring point (S130). Further disclosed are a deformation sensing apparatus, an electronic device, a computer-readable storage medium and a computer program product.

Description

Deformation sensing method, device, equipment and medium

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on the Chinese patent application with application number 202410154960.7 and application date of January 31, 2024, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby introduced into this application as a reference. Technical Field

[0003] The embodiments of the present application relate to the field of communication technologies, and in particular to a deformation sensing method, apparatus, device, medium, and computer program product. Background Art

[0004] The coexistence or integration of communication and perception functions is a key technology for next-generation mobile communication systems and a current research focus in academia and industry. Synaesthesia devices sample the propagation space by sending electromagnetic wave signals, enabling them to perceive their surroundings. Using these devices to sense micro-deformations has also become a major application area of ​​interest in the industry. For example, a synaesthesia base station installed on a rooftop can monitor the operating status of nearby buildings, such as tilt, subsidence, and swaying. It can also be used to monitor the operating status of bridges, mines, road slopes, and mountainous terrain.

[0005] Synaesthesia equipment continuously monitors target observation points, enabling it to detect micro-deformations of objects. This monitoring process can be divided into three stages: acquiring deformation information, analyzing it, and predicting future deformation trends. In real-world environments, observed deformation information not only includes the deformation of the monitoring point itself but also includes observation errors caused by environmental factors such as noise and atmospheric conditions. These errors can affect the accuracy of deformation inversion at the monitoring point to varying degrees. Eliminating or reducing the impact of observation errors on the true degree of deformation at the inverted monitoring point and accurately perceiving the degree of deformation at the monitoring point are pressing technical challenges in this field.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a deformation sensing method, apparatus, device, medium, and computer program product that can accurately sense the degree of deformation of a monitoring point.

[0008] In a first aspect, an embodiment of the present application provides a deformation perception method, the method comprising:

[0009] Determining a first deformation characteristic value corresponding to the target monitoring point and a second deformation characteristic value corresponding to the reference point;

[0010] Compensating the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point;

[0011] The deformation degree of the target monitoring point is determined according to the third deformation characteristic value.

[0012] In a second aspect, an embodiment of the present application provides a deformation sensing device, comprising:

[0013] A feature determination module, configured to determine a first deformation feature value corresponding to a target monitoring point and a second deformation feature value corresponding to a reference point;

[0014] a compensation module, configured to compensate the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point;

[0015] The deformation determination module is used to determine the deformation degree of the target monitoring point according to the third deformation characteristic value.

[0016] In a third aspect, an embodiment of the present application provides an electronic device, including:

[0017] one or more processors;

[0018] A memory having one or more programs stored thereon, wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the deformation perception method as described in the first aspect above.

[0019] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the deformation perception method as described in the first aspect above.

[0020] In a fifth aspect, an embodiment of the present application provides a computer program product, including a computer program, which, when executed by a processor, implements the deformation perception method described in the first aspect above.

[0021] The deformation perception method, apparatus, equipment and medium provided in the embodiments of the present application, the deformation perception method first determines the first deformation characteristic value corresponding to the target monitoring point and the second deformation characteristic value corresponding to the reference point, then compensates the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point, determines the deformation degree of the target monitoring point according to the third deformation characteristic value, and compensates the first deformation characteristic value of the target monitoring point by the second deformation characteristic value of the reference point, which can effectively compensate for the influence of the observation error caused by the actual environment on the inverted deformation degree of the target monitoring point, and more accurately perceive the deformation degree of the target monitoring point. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to provide a further understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0023] FIG1 is a schematic diagram of a flow chart of a deformation sensing method provided in an embodiment of the present application;

[0024] FIG2 is a schematic diagram of the sub-step flow of step S120 in FIG1 ;

[0025] FIG3 is a schematic diagram of the sub-step flow of step S110 in FIG1 ;

[0026] FIG4 is a schematic diagram of the sub-step flow of step S330 in FIG3 ;

[0027] FIG5 is a schematic diagram of the sub-step flow of step S330 in FIG3 ;

[0028] FIG6 is a schematic diagram of an implementation scenario provided by an embodiment of the present application;

[0029] FIG7 is a schematic diagram of another implementation scenario provided by an embodiment of the present application;

[0030] FIG8 is a schematic diagram of another implementation scenario provided by an embodiment of the present application;

[0031] FIG9 is a schematic structural diagram of a deformation sensing device provided in an embodiment of the present application;

[0032] FIG10 is a schematic diagram of the device structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0034] It should be understood that in the description of the embodiments of the present application, if there is a description of "first", "second", etc., it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features. "At least one" means one or more, and "more" means two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can indicate the existence of A alone, the existence of A and B at the same time, and the existence of B alone. A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following" and similar expressions refer to any group of these items, including any group of single or plural items. For example, at least one of a, b and c can indicate: a, b, c, a and b, a and c, b and c, or a, b and c, where a, b, c can be single or multiple.

[0035] In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as they do not conflict with each other.

[0036] The coexistence or integration of communication and perception functions is a key technology for next-generation mobile communication systems and a current research focus in academia and industry. Synaesthesia devices sample the propagation space by sending electromagnetic wave signals, enabling them to perceive their surroundings. Using these devices to sense micro-deformations has also become a major application area of ​​interest in the industry. For example, a synaesthesia base station installed on a rooftop can monitor the operating status of nearby buildings, such as tilt, subsidence, and swaying. It can also be used to monitor the operating status of bridges, mines, road slopes, and mountainous terrain.

[0037] Synaesthesia equipment continuously monitors target observation points, enabling it to detect micro-deformations of objects. This monitoring process can be divided into three stages: acquiring deformation information, analyzing it, and predicting future deformation trends. In real-world environments, observed deformation information not only includes the deformation of the monitoring point itself but also includes observation errors caused by environmental factors such as noise and atmospheric conditions. These errors can affect the accuracy of deformation inversion at the monitoring point to varying degrees. Eliminating or reducing the impact of observation errors on the true degree of deformation at the inverted monitoring point and accurately perceiving the degree of deformation at the monitoring point are pressing technical challenges in this field.

[0038] Based on this, the embodiments of the present application provide a deformation perception method, apparatus, device, medium, and computer program product that can accurately perceive the degree of deformation of a monitoring point.

[0039] The embodiment of the present application first proposes a deformation perception method, which can be applied to a synesthesia device, which has the ability to send and receive carrier signals with an integrated waveform. See Figure 7, which shows a schematic diagram of the implementation environment of a deformation perception method. As shown in Figure 7, the deformation perception method can be applied to a base station (Base Station), which transmits a carrier signal with an integrated waveform to multiple target points in the observation area and receives echo signals from the target points. Through continuous observation of the target monitoring point, the echo signal sequence of the target monitoring point in the time dimension is received, the echo signal sequence is processed and analyzed, and the deformation degree of the target monitoring point is determined.

[0040] Please see FIG. 1 , which shows a deformation sensing method provided by an embodiment of the present application. As shown in FIG. 1 , the deformation sensing method includes but is not limited to steps S110 to S130 .

[0041] Step S110 , determining a first deformation characteristic value corresponding to the target monitoring point and a second deformation characteristic value corresponding to the reference point.

[0042] It can be understood that the target monitoring point and the reference point can be a target point on an object such as a mountain, a building or a bridge, wherein the reference point can be one or more, and the target monitoring point and the reference point can be on the same object. As shown in Figure 7, the target monitoring point is the highest point of building A, and the reference point is the lowest point of building A. The target monitoring point and the reference point can also be on different objects. As shown in Figure 8, the target monitoring point is in building A, and the reference point is in building B.

[0043] It should be noted that the first deformation eigenvalue is used to describe the deformation of the target monitoring point. The first deformation eigenvalue includes the status information of the target monitoring point itself, and also includes the observation error caused by environmental factors during the observation process; and the second deformation eigenvalue is used to describe the deformation of the reference point. Compared with the first deformation eigenvalue, the target point that has not been deformed in the observation area can be selected as the reference point, so that the second deformation eigenvalue of the reference point only includes the observation error caused by environmental factors during the observation process.

[0044] Step S120 : compensating the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point.

[0045] It should be understood that the first deformation eigenvalue includes observation errors caused by environmental factors. If the deformation degree of the target monitoring point is inverted based on the first deformation eigenvalue, the deformation perception result will be inaccurate. Because the second deformation eigenvalue of the reference point only includes the observation errors caused by environmental factors during the observation process, after determining the first deformation eigenvalue corresponding to the target monitoring point and the second deformation eigenvalue corresponding to the reference point, the first deformation eigenvalue is compensated based on the second deformation eigenvalue to compensate for the impact of the observation error caused by environmental factors on the deformation perception accuracy, thereby obtaining the third deformation eigenvalue corresponding to the target monitoring point.

[0046] Step S130: determining the deformation degree of the target monitoring point according to the third deformation characteristic value.

[0047] It should be understood that compensating the first deformation eigenvalue of the target monitoring point according to the second deformation eigenvalue corresponding to the reference point effectively reduces the impact of the observation error on the inverted deformation information of the target monitoring point, and more accurately inverts the deformation degree of the target monitoring point based on the third deformation eigenvalue.

[0048] The deformation perception method provided in the embodiment of the present application first determines the first deformation characteristic value corresponding to the target monitoring point and the second deformation characteristic value corresponding to the reference point, and then compensates the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point. The deformation degree of the target monitoring point is determined according to the third deformation characteristic value, and the first deformation characteristic value of the target monitoring point is compensated by the second deformation characteristic value of the reference point. This can effectively compensate for the influence of the observation error caused by the actual environment on the deformation degree of the inverted target monitoring point, and more accurately perceive the deformation degree of the target monitoring point.

[0049] In some embodiments, the reference point represents a target point that has not been deformed, and the reference point is selected by:

[0050] A target point that meets a preset scattering parameter threshold is selected in the target area as a reference point. The scattering parameter threshold includes at least one of an amplitude fluctuation threshold, a phase fluctuation threshold, and a coherence fluctuation threshold.

[0051] It should be understood that the reference point represents an undeformed target point. A target point that satisfies a preset scattering parameter threshold within the target area can be selected as the reference point. Specifically, a target point with stable scattering characteristics within the target area can be selected as the reference point, such as an exposed rock, a building corner, or other strong scatterer. The scattering parameter threshold includes at least one of an amplitude fluctuation threshold, a phase fluctuation threshold, and a coherence fluctuation threshold.

[0052] In the process of selecting a reference point, multiple rounds of carrier signals for selecting a reference point can be transmitted to the target area, and echo signal sequences reflected by various target points in the target area are received. Then, the scattering parameters of each echo signal in the echo signal sequence are analyzed, such as the amplitude fluctuation information, phase fluctuation information or coherence fluctuation information of the echo signal in the time dimension. Based on the scattering parameter analysis results, a target point with stable scattering characteristics is selected from the target area as a reference point. For example, it is determined whether at least one of the amplitude fluctuation, phase fluctuation and coherence fluctuation of the echo signal reflected by the target point in the time dimension is less than the corresponding scattering parameter threshold.

[0053] It should also be noted that in addition to selecting target points that meet the preset scattering parameter threshold in the target area as reference points, reflective devices such as radar corner reflectors can also be deployed in the observation area and the deployed reflective devices can be used as reference points.

[0054] In an embodiment of the present application, since the reference point is a target point that has not been deformed and has stable scattering characteristics during the deformation perception observation process, the echo signal of the reference point is relatively stable in the time dimension. Based on the deformation characteristic value of the reference point, it is convenient to compensate for the deformation characteristic value of the target monitoring point, and more accurate deformation information of the target monitoring point can also be obtained.

[0055] In some embodiments, please refer to Figure 3, which shows a schematic flow chart of the sub-steps of step S110 in Figure 1. As shown in Figure 3, the first deformation characteristic value corresponding to the target monitoring point and the second deformation characteristic value corresponding to the reference point are determined, including but not limited to steps S310 to S330.

[0056] Step S310: transmitting multiple rounds of carrier signals.

[0057] Step S320: monitoring echo signals corresponding to multiple rounds of carrier signals.

[0058] Step S330 : determining a first deformation characteristic value corresponding to the target monitoring point and a second deformation characteristic value corresponding to the reference point according to the multiple echo signals.

[0059] It should be understood that the deformation perception method can be applied to telepathic equipment with an integrated waveform transmission, such as a communication perception integrated base station. In the process of determining the first deformation characteristic value corresponding to the target monitoring point and the second deformation characteristic value corresponding to the reference point, the telepathic equipment first transmits multiple rounds of carrier signals to the area where the target monitoring point is located, and then monitors the echo signals corresponding to the multiple rounds of carrier signals, that is, the echo signals reflected by various target points in the area where the target monitoring point is located. By processing and analyzing the monitored multiple rounds of echo signals, the first deformation characteristic value corresponding to the target monitoring point and the second deformation characteristic value corresponding to the reference point are determined.

[0060] In a specific embodiment, the first deformation characteristic value is the phase difference of the echo signal reflected by the target monitoring point, and the second deformation characteristic value is the phase difference of the echo signal reflected by the reference point.

[0061] It is understandable that since the phase information of the echo signals reflected by the target monitoring point before and after deformation is different, the deformation information of the target monitoring point is obtained by inverting the phase changes of multiple rounds of echo signals. However, in the actual environment, the phase difference of the echo signal not only contains the state information of the target monitoring point itself, but also includes the phase error introduced by environmental factors such as noise and atmospheric medium in the actual environment. It needs to be compensated when analyzing the deformation degree of the target monitoring point to more accurately perceive the deformation degree of the target monitoring point. Among them, the phase error caused by noise can be compensated or reduced by improving the signal-to-noise ratio or filtering processing. The phase error caused by the atmosphere refers to the influence of the atmospheric medium under different time and space conditions, temperature, humidity and atmospheric pressure, etc. during the propagation of electromagnetic wave signals, which causes the atmospheric refractive index to change, resulting in the deflection of the propagation direction of the electromagnetic wave, and then causes the propagation time to be delayed. This phase error will be superimposed on the actual deformation phase of the target. The phase difference of the echo signal reflected by the target monitoring point is used as the first deformation characteristic value of the target monitoring point, and the phase difference of the echo signal reflected by the reference point is used as the second deformation characteristic value of the reference point. By using the second deformation characteristic value to compensate for the first deformation characteristic value, the influence of the phase error caused by the atmosphere on the deformation degree of the inversion monitoring point is compensated.

[0062] In addition, other signal characteristic information in the echo signal can be selected as the deformation characteristic value of the target monitoring point and the reference point to describe the deformation of the target monitoring point and the reference point, as long as the signal characteristic information changes with the deformation of the target monitoring point itself and can be used to invert the deformation degree of the target monitoring point.

[0063] In a specific embodiment, the deformation degree of the target monitoring point is measured by the deformation size d, and the third deformation characteristic value of the target monitoring point, that is, the actual deformation phase difference of the target monitoring point, is calculated. Determine the deformation degree of the target monitoring point. The deformation size d of the target monitoring point can be determined by formula (1):

[0064] Where λ is the wavelength of the carrier signal. If the carrier frequency of the carrier signal is f c , the corresponding wavelength is c / f c .

[0065] In some embodiments, please refer to Figure 4, which shows a sub-step flow chart of step S330 in Figure 3. As shown in Figure 4, based on multiple rounds of echo signals, the first deformation characteristic value corresponding to the target monitoring point and the second deformation characteristic value corresponding to the reference point are determined, including steps S410 to S430.

[0066] Step S410, for the echo signal corresponding to each round of carrier signal, determine the signal points corresponding to the target monitoring point and the reference point in the echo signal respectively according to the distance values ​​corresponding to the target monitoring point and the reference point respectively, determine the first echo signal value according to the signal point corresponding to the target monitoring point, and determine the second echo signal value according to the signal point corresponding to the reference point.

[0067] Step S420 : determining a first deformation characteristic value according to a plurality of first echo signal values ​​of a plurality of rounds of echo signals corresponding to the target monitoring point.

[0068] Step S430 : determining a second deformation characteristic value according to a plurality of second echo signal values ​​of a plurality of rounds of echo signals corresponding to the reference point.

[0069] It is understood that, as shown in FIG8 , a beam of carrier signals transmitted by the base station can be used to simultaneously monitor a target monitoring point in building A and a reference point in building B. The deformation characteristic values ​​of the target monitoring point and the reference point will be formed in the echo signal of the same beam. Therefore, in the echo signals corresponding to multiple rounds of carrier signals, for each round of carrier signals, the signal points corresponding to the target monitoring point and the reference point in the echo signal are determined based on the distance between the target monitoring point, the reference point, and the telepathic device. For example, the deformation characteristic value of the target monitoring point is formed at signal point A in the echo signal, while the deformation characteristic value of the reference point is formed at signal point B in the echo signal. Then, a first echo signal value of the target monitoring point is determined based on signal point A, and a second echo signal value of the reference point is determined based on signal point B. Finally, a first deformation characteristic value is determined based on the multiple first echo signal values ​​of the multiple rounds of echo signals corresponding to the target monitoring point, and a second deformation characteristic value is determined based on the multiple second echo signal values ​​of the multiple rounds of echo signals corresponding to the reference point.

[0070] In a specific embodiment, the first echo signal value and the second echo signal are phase values, the first deformation characteristic value is the phase difference of the echo signal reflected by the target monitoring point, and the second deformation characteristic value is the phase difference of the echo signal reflected by the reference point.

[0071] Specifically, according to the distance value between the target monitoring point and the reference point and the telepathic device, the signal point A corresponding to the target monitoring point and the signal point B corresponding to the reference point of the echo signal in the time domain are determined, and then the phase value α of the echo signal at signal point A and the phase value β of the echo signal at signal point B are obtained. According to the multiple phase values ​​α in the multi-round echo signals corresponding to the target monitoring point, the phase difference of the echo signal reflected by the target monitoring point is determined, and according to the multiple phase values ​​β in the multi-round echo signals corresponding to the reference point, the phase difference of the echo signal reflected by the reference point is determined.

[0072] In some embodiments, multiple rounds of carrier signals are transmitted, and echo signals corresponding to the multiple rounds of carrier signals are monitored, including: in each round of transmission, carrier signals of different frequencies are transmitted to multiple target points in the target area, and the multiple target points include target monitoring points and reference points.

[0073] It should be understood that the embodiment of the present application adopts frequency division multiple access to transmit carrier signals of different frequencies to multiple target points in the target area, wherein the multiple target points include target monitoring points and reference points. As shown in FIG7 , the base station transmits carrier signals of different frequencies to multiple target points in building A, and the frequencies are divided into f1, f2, ..., f n , where the target point at the bottom of the building is taken as the reference point, and the frequency of the carrier signal corresponding to the reference point is f n , taking the target point on the top of the building as the target monitoring point, the frequency of the carrier signal corresponding to the target monitoring point is f1. Therefore, when monitoring the echo signals corresponding to multiple rounds of carrier signals, the echo signals reflected by the target monitoring point and the reference point can be obtained by frequency division. Through down-conversion, filtering, and Fourier transform processing, the deformation characteristic values ​​of the target monitoring point and the reference point can be obtained, and then the deformation degree of the target monitoring point can be determined.

[0074] In some embodiments, the frequency of the carrier signal transmitted to the target monitoring point is a first frequency, and the frequency of the carrier signal transmitted to the reference point is a second frequency.

[0075] Correspondingly, please refer to Figure 5, which shows a schematic diagram of the sub-step flow of step S330 in Figure 3. As shown in Figure 5, based on multiple rounds of echo signals, the first deformation characteristic value corresponding to the target monitoring point and the second deformation characteristic value corresponding to the reference point are determined, including steps S510 to S550.

[0076] Step S510 : Acquire an echo signal of a first frequency and an echo signal of a second frequency from echo signals corresponding to each round of carrier signals.

[0077] Step S520: For the echo signal of the first frequency obtained in each round of monitoring, determine the signal point corresponding to the target monitoring point in the echo signal of the first frequency according to the distance value corresponding to the target monitoring point, and determine the first echo signal value according to the signal point corresponding to the target monitoring point.

[0078] Step S530: For the echo signal of the second frequency obtained in each round of monitoring, determine the signal point corresponding to the reference point in the echo signal of the second frequency according to the distance value corresponding to the reference point, and determine the second echo signal value according to the signal point corresponding to the reference point.

[0079] Step S540 : determining a first deformation characteristic value according to a plurality of first echo signal values ​​of the echo signals of the target monitoring point corresponding to a plurality of rounds of the first frequency.

[0080] Step S550 : determining a second deformation characteristic value according to a plurality of second echo signal values ​​of a plurality of rounds of echo signals of a second frequency corresponding to the reference point.

[0081] It can be understood that frequency division multiple access is used to transmit carrier signals of different frequencies to multiple target points in the target area, and the frequencies are divided into f1, f2, ..., f n In the echo signals obtained in each round of monitoring, the scattering parameters of the echo signals are analyzed, for example, the amplitude fluctuation, phase fluctuation or coherence fluctuation of the echo signals in the time dimension are analyzed, and based on the analysis results, the target points with stable scattering characteristics in the target area are regarded as reference points. For example, by judging whether at least one of the amplitude fluctuation, phase fluctuation and coherence fluctuation of the echo signal reflected by the target point in the time dimension is less than the corresponding scattering parameter threshold, it is determined whether the target point can be used as a reference point, and then the frequencies of the echo signals reflected by the target monitoring point and the reference point are distinguished. For example, the first frequency of the echo signal reflected by the target monitoring point is f1, and the second frequency of the echo signal reflected by the reference point is f n Finally, the echo signal of the first frequency f1 reflected by the target monitoring point and the second frequency f reflected by the reference point are obtained by frequency division. n echo signal.

[0082] The echo signal of the first frequency f1 is the echo signal reflected by the target monitoring point. Therefore, for the echo signal of the first frequency f1 obtained in each round of monitoring, the signal point corresponding to the target monitoring point in the echo signal of the first frequency f1 is determined according to the distance value between the target monitoring point and the telepathic device, and then the first echo signal value is determined according to the signal point corresponding to the target monitoring point.

[0083] The second frequency f n The echo signal is the echo signal reflected from the reference point. Therefore, for each round of monitoring, the second frequency f nThe echo signal of the reference point is determined according to the distance between the reference point and the telepathic device. n The corresponding signal point in the echo signal of the reference point is determined, and then the second echo signal value is determined according to the washed point corresponding to the reference point.

[0084] Finally, the first deformation characteristic value is determined based on multiple first echo signal values ​​of the target monitoring point corresponding to multiple rounds of echo signals of the first frequency, and the second deformation characteristic value is determined based on multiple second echo signal values ​​of the reference point corresponding to multiple rounds of echo signals of the second frequency.

[0085] In a specific embodiment, the first echo signal value and the second echo signal are phase values, the first deformation characteristic value is the phase difference of the echo signal reflected by the target monitoring point, and the second deformation characteristic value is the phase difference of the echo signal reflected by the reference point.

[0086] Specifically, according to the distance value between the target monitoring point and the synesthesia device, the echo signal of the first frequency is determined to correspond to the signal point A of the target monitoring point at the time domain level. According to the distance value between the reference point and the synesthesia device, the echo signal of the second frequency is determined to correspond to the signal point B of the reference point at the time domain level. Then, the phase value α of the echo signal of the first frequency at signal point A and the phase value β of the echo signal of the second frequency at signal point B are determined. According to the multiple phase values ​​α of the multiple rounds of the echo signal of the first frequency corresponding to the target monitoring point, the phase difference of the echo signal of the first frequency reflected by the target monitoring point is determined. According to the multiple phase values ​​β in the multiple rounds of the echo signal of the second frequency corresponding to the reference point, the phase difference of the echo signal of the second frequency reflected by the reference point is determined.

[0087] In some embodiments, the reference point is located in the target area where the target monitoring point is located.

[0088] Correspondingly, compensating the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point includes: subtracting the second deformation characteristic value from the first deformation characteristic value to obtain the third deformation characteristic value corresponding to the target monitoring point.

[0089] It is understandable that the reference point is located in the target area where the target monitoring point is located, indicating that the reference point and the target monitoring point are in a similar environment, and the effects of environmental factors such as the atmospheric medium on the deformation perception of the target monitoring point and the reference point are approximately the same. Specifically, it is possible to determine whether the reference point is located in the target area where the target monitoring point is located based on the position information such as the distance and direction of the reference point relative to the target monitoring point. The target area can be a spherical, square or irregular area centered on the target monitoring point, and its size can be determined by the actual environment where the target monitoring point is located; or, based on the environmental information in the observation scene, the observation area is divided into different target areas, and the same target area has a similar environment. When the reference point is located in the target area where the target monitoring point is located, it is considered that the reference point and the target monitoring point are in a similar environment, that is, the temperature, humidity and atmospheric pressure in the environment are considered to be approximately the same.

[0090] It should be noted that the echo signal reflected by the target monitoring point will be affected by the deformation of the target monitoring point itself and by environmental factors. When the reference point is located in the target area where the target monitoring point is located, it is considered that the reference point and the target monitoring point are in a similar environment, that is, the echo signals reflected by the reference point and the target monitoring point are affected by the same environmental factors. From the above, it can be seen that the first deformation eigenvalue includes the state information of the target monitoring point due to itself, and also includes the observation error caused by the influence of environmental factors during the observation process, while the second deformation eigenvalue only includes the observation error caused by the influence of environmental factors during the observation process. It is considered that the observation errors corresponding to the reference point and the target monitoring point are the same. By subtracting the second deformation eigenvalue from the first deformation eigenvalue, the influence of the observation error caused by environmental factors on the deformation degree of the inverted target monitoring point can be compensated to obtain the third deformation eigenvalue corresponding to the target monitoring point.

[0091] When the first deformation characteristic value is the phase difference of the echo signal reflected by the target monitoring point, and the second deformation characteristic value is the phase difference of the echo signal emitted by the reference point, the phase information in the echo signal not only contains the state information of the target point itself, but also includes phase errors introduced by noise, atmospheric media, and other factors in the actual environment. On the one hand, during the deformation perception observation process, the phase error caused by noise in the echo signal can be minimized by maintaining a good signal-to-noise ratio in the observation area or through filtering. On the other hand, since the reference point is located in the target area where the target monitoring point is located, it can be assumed that the environmental conditions of the reference point and the target monitoring point are similar, that is, the temperature, humidity, and atmospheric pressure are approximately the same. In other words, the phase error caused by the atmosphere in the echo signals reflected by the reference point and the target monitoring point is the same. Therefore, the third deformation characteristic value corresponding to the target monitoring point can be obtained by subtracting the second deformation characteristic value of the reference point from the first deformation characteristic value of the target monitoring point to compensate for the impact of the phase error caused by the atmosphere on the deformation perception accuracy of the target monitoring point.

[0092] For example, the phase difference of the echo signal reflected by the target monitoring point in the time dimension is It can be expressed as follows by formula (2):

[0093] in, Indicates the phase error caused by deformation in the echo signal reflected from the target monitoring point. It represents the phase error caused by noise in the echo signal reflected from the target monitoring point. It represents the phase error caused by the atmosphere in the echo signal reflected from the target monitoring point.

[0094] Phase difference of the echo signal reflected from the reference point in the time dimension It can be expressed as follows by formula (3):

[0095] in, Indicates the phase error caused by noise in the echo signal reflected from the reference point. Indicates the phase error caused by the atmosphere in the echo signal reflected from the reference point.

[0096] During the deformation perception observation process, the noise phase error in the echo signal can be reduced as much as possible by maintaining a good signal-to-noise ratio in the observation area or by filtering. and Therefore, the influence of noise phase error can be ignored and only the atmospheric phase error is considered. and impact.

[0097] At the same time, the reference point is located in the target area where the target monitoring point is located. It can be considered that the environmental conditions of the reference point and the target monitoring point are similar, that is, the temperature, humidity and atmospheric pressure are approximately the same, and the influence of the atmosphere on the deformation perception observation of the target monitoring point and the reference point is the same, that is, and Therefore, the atmospheric phase error of the reference point can be used to compensate the atmospheric phase error of the target monitoring point to obtain the third deformation eigenvalue corresponding to the target monitoring point, that is, the true deformation phase at the deformation point, and the third deformation eigenvalue of the target monitoring point. It can be calculated by formula (4):

[0098] In a specific embodiment, the reference point is located in the target area where the target monitoring point is located, and the deformation characteristic values ​​of the reference point and the target monitoring point are formed in the echo signal of the same beam. As shown in Figure 8, a beam of carrier signals transmitted by the base station can be used to simultaneously monitor the target monitoring point in building A and the reference point in building B. According to the distance value between the target monitoring point, the reference point and the telepathic device, the first deformation characteristic value corresponding to the target monitoring point and the second deformation characteristic value corresponding to the reference point are determined from the echo signal.

[0099] In one specific embodiment, the reference point is located in the target area where the target monitoring point is located, and in each round of carrier signal transmission, carrier signals of different frequencies are transmitted to the reference point and the target monitoring point. As shown in Figure 7, the base station transmits a carrier signal of a first frequency to the target monitoring point and a carrier signal of a second frequency to the reference point. From the echo signals corresponding to the monitoring carrier signals, the base station obtains the echo signal of the first frequency reflected by the target monitoring point and the echo signal of the second frequency reflected by the reference point in a frequency division manner. The first deformation characteristic value of the target monitoring point is determined from the echo signal of the first frequency, and the second deformation characteristic value of the reference point is determined from the echo signal of the second frequency.

[0100] In some embodiments, the number of reference points is multiple.

[0101] Correspondingly, please refer to Figure 2, which shows a schematic diagram of the sub-step process of step S120 in Figure 1. As shown in Figure 2, the first deformation characteristic value is compensated according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point, including but not limited to steps S210 to S240.

[0102] Step S210: Obtain distance values ​​corresponding to multiple reference points.

[0103] Step S220 , performing fitting processing on the second deformation feature values ​​and distance values ​​corresponding to the plurality of reference points to obtain a target fitting function.

[0104] Step S230 : determining a target compensation value according to the target fitting function and the distance value corresponding to the target monitoring point.

[0105] Step S240 : subtracting the target compensation value from the first deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point.

[0106] It should be understood that if a reference point cannot be found within the target area where the target monitoring point is located, multiple reference points can be selected within the observation area, and the first deformation characteristic value can be compensated based on the second deformation characteristic values ​​corresponding to the multiple reference points to obtain a third deformation characteristic value corresponding to the target monitoring point. For example, as shown in FIG9 , the reference points include reference point 1, reference point 2, and reference point 3, where reference point 1 is located at mountain A, reference point 2 is located at mountain B, and reference point 3 is located at building B.

[0107] Since the environment in which the reference point is located may be inconsistent with the environment in which the target monitoring point is located, the observation error caused by environmental factors in the second deformation eigenvalue of the reference point may be inconsistent with that of the target monitoring point. Therefore, it is necessary to first fit the second deformation eigenvalues ​​and distance values ​​corresponding to multiple reference points to obtain a target fitting function, determine the relationship between the observation error from the target monitoring point and the observation error from the reference point, then determine a target compensation value based on the target fitting function and the distance value corresponding to the target monitoring point, and then subtract the compensation value from the first deformation eigenvalue to completely compensate for the observation error of the target monitoring point to obtain a third deformation eigenvalue corresponding to the target monitoring point. By fitting the relationship between the deformation eigenvalue and the distance of each reference point and further inferring the target compensation value of the target monitoring point, that is, inferring the observation error caused by environmental factors in the first deformation eigenvalue of the target monitoring point, the first deformation eigenvalue including the state information of the target monitoring point itself and the observation error caused by environmental factors is subtracted from the target compensation value to obtain the true deformation eigenvalue of the target monitoring point.

[0108] When the first deformation characteristic value is the phase difference of the echo signal reflected by the target monitoring point, and the second deformation characteristic value is the phase difference of the echo signal emitted by the reference point, the phase error caused by noise is ignored, and the phase difference of the reference point only includes the phase error caused by the atmosphere. By establishing a polynomial relationship between the atmospheric phase error and the distance of each reference point, the influence of the atmospheric phase error is fitted, and the atmospheric phase error in the phase difference corresponding to the target monitoring point is inferred.

[0109] Specifically, the phase difference of the echo signal reflected by the target monitoring point in the time dimension It can be expressed as follows by formula (5):

[0110] in, Indicates the phase error caused by deformation in the echo signal reflected from the target monitoring point. is the phase error caused by the atmosphere in the echo signal reflected from the target monitoring point, It is calculated from the polynomial relationship between the atmospheric phase error and the distance of the reference point. The phase difference corresponding to the target monitoring point Subtract the estimated atmospheric phase error The true deformation phase of the target monitoring point can be obtained

[0111] In one specific embodiment, there are multiple reference points, and in each round of carrier signal transmission, carrier signals of different frequencies are sent to multiple reference points and target monitoring points. As shown in Figure 9, the base station transmits a carrier signal with a frequency of f1 to the target monitoring point, a carrier signal with a frequency of f2 to reference point 1, and a carrier signal with a frequency of f3 to reference point 2. From the echo signals corresponding to the monitoring carrier signals, the echo signal with a frequency of f1 reflected by the target monitoring point, the echo signal with a frequency of f2 reflected by reference point 1, and the echo signal with a frequency of f3 reflected by reference point 2 are obtained by frequency division. The first deformation characteristic value of the target monitoring point is determined from the echo signal with a frequency of f1, the second deformation characteristic value of reference point 1 is determined from the echo signal with a frequency of f2, and the second deformation characteristic value of reference point 2 is determined from the echo signal with a frequency of f3. Furthermore, the distance values ​​corresponding to reference point 1 and reference point 2 are obtained, and the second deformation characteristic values ​​and distance values ​​corresponding to reference point 1 and reference point 2 are fitted to obtain the target fitting function. According to the target fitting function and the distance value corresponding to the target monitoring point, the target compensation value is determined, and the target compensation value is subtracted from the first deformation characteristic value to obtain the third deformation characteristic value corresponding to the target monitoring point.

[0112] In one specific embodiment, there are multiple reference points. In each round of carrier signal transmission, carrier signals of different frequencies are transmitted to multiple reference points and target monitoring points. The deformation characteristic values ​​of at least one reference point and the target monitoring point are formed in the echo signal of the same beam. As shown in Figure 9, the base station transmits a carrier signal with a frequency of f1 to the target monitoring point, a carrier signal with a frequency of f2 to reference point 1, and a carrier signal with a frequency of f3 to reference point 2. Simultaneously, the carrier signal with a frequency of f1 is also used to monitor reference point 3. That is, the beams corresponding to the target monitoring point and reference point 3 have the same carrier frequency. From the echo signals corresponding to the monitoring carrier signals, the echo signal with a frequency of f1, the echo signal with a frequency of f2 reflected from reference point 1, and the echo signal with a frequency of f3 reflected from reference point 2 are obtained by frequency division. The first deformation characteristic value of the target monitoring point and the second deformation characteristic value of reference point 3 are determined from the echo signal with a frequency of f1 based on the distance between the target monitoring point, reference point 3, and the base station. A second deformation eigenvalue of reference point 1 is determined from the echo signal at frequency f2, and a second deformation eigenvalue of reference point 2 is determined from the echo signal at frequency f3. Furthermore, distance values ​​corresponding to reference points 1, 2, and 3 are obtained, and the second deformation eigenvalues ​​and distance values ​​corresponding to reference points 1, 2, and 3 are fitted to obtain a target fitting function. A target compensation value is determined based on the target fitting function and the distance value corresponding to the target monitoring point. The target compensation value is subtracted from the first deformation eigenvalue to obtain a third deformation eigenvalue corresponding to the target monitoring point.

[0113] The deformation perception method provided in the embodiments of the present application is described below through specific examples.

[0114] Example 1

[0115] As shown in Figure 6, the deformation perception method is applied to the base station. The base station transmits a multi-round carrier signal of the first frequency to the target monitoring point on Building A, and sends a multi-round carrier signal of the second frequency to the reference point on Building A. The target monitoring point is the highest point of Building A, and the reference point is the lowest point of Building A. The reference point is located in the target area where the target monitoring point is located.

[0116] For the echo signal corresponding to each round of carrier signals, an echo signal of a first frequency from the target monitoring point and an echo signal of a second frequency from the reference point are obtained from the echo signals corresponding to multiple rounds of carrier signals in a frequency division manner.

[0117] According to the distance value between the target monitoring point and the base station, the signal point of the target monitoring point in the echo signal of the first frequency is determined, and the first phase value of the signal point corresponding to the target monitoring point is determined. Then, according to the multiple first phase values ​​of the echo signals of the first frequency corresponding to the target monitoring point in multiple rounds, the first phase difference of the echo signal reflected by the target detection point during the observation process is determined.

[0118] According to the distance value between the reference point and the base station, the signal point of the reference point in the echo signal of the second frequency is determined, and the second phase value of the signal point corresponding to the reference point is determined. Then, according to the multiple second phase values ​​of the echo signals of the second frequency corresponding to the reference point in multiple rounds, the second phase difference of the echo signal reflected by the reference point during the observation process is determined.

[0119] The second phase difference is subtracted from the first phase difference to obtain a true deformation phase difference corresponding to the target monitoring point, and the deformation degree of the target monitoring point is determined according to the true deformation phase difference.

[0120] Example 2

[0121] As shown in Figure 7, the deformation sensing method is applied to the base station. The base station transmits multiple rounds of carrier signals to the target monitoring point on Building A. The same beam of carrier signals is also used to monitor the reference point located on Building B. The observation errors between the target monitoring point and the reference point are formed in the same beam of echo signals. The reference point is located in the target area where the target monitoring point is located.

[0122] For each round of echo signals corresponding to the carrier signal, the signal points corresponding to the target monitoring point and the reference point in the echo signal are determined according to the distance values ​​between the target monitoring point and the reference point and the base station.

[0123] The first phase value of the signal point corresponding to the target monitoring point is determined, and then the first phase difference of the echo signal reflected by the target detection point during the observation process is determined based on multiple first phase values ​​of the multiple rounds of echo signals corresponding to the target monitoring point.

[0124] The second phase value of the signal point corresponding to the reference point is determined, and then the second phase difference of the echo signal reflected by the reference point during the observation process is determined based on multiple second phase values ​​of the echo signals corresponding to the reference point.

[0125] The second phase difference is subtracted from the first phase difference to obtain a true deformation phase difference corresponding to the target monitoring point, and the deformation degree of the target monitoring point is determined according to the true deformation phase difference.

[0126] Example 3

[0127] As shown in FIG8 , the deformation sensing method is applied to a base station, and the base station sends carrier signals of different frequencies to multiple target points within an observation area, where the multiple target points include target monitoring points and reference points.

[0128] For the echo signal corresponding to each round of carrier signals, the echo signal with a frequency of f1 from the target monitoring point, the echo signal with a frequency of f2 from the reference point 1, and the echo signal with a frequency of f3 from the reference point 2 are obtained from the echo signals corresponding to multiple rounds of carrier signals in a frequency division manner, wherein the phase difference between the reference point 3 and the target monitoring point is formed in the echo signal with a frequency of f1.

[0129] For the echo signal corresponding to each round of carrier signal, determine the signal points corresponding to the target monitoring point and reference point 3 at the echo signal with a frequency of f1 respectively according to the distance value between the target monitoring point and reference point 3 and the base station; determine the first phase value of the signal point corresponding to the target monitoring point, and determine the first phase difference of the echo signal reflected by the target detection point during the observation process according to the multiple first phase values ​​of the echo signal with a frequency of f1 corresponding to the target monitoring point in multiple rounds; determine the second phase value of the signal point corresponding to the reference point 3, and then determine the second phase difference of the echo signal reflected by the reference point 3 during the observation process according to the multiple second phase values ​​of the echo signal with a frequency of f1 corresponding to the reference point 3 in multiple rounds.

[0130] According to the distance value between reference point 1 and the base station, the signal points corresponding to the echo signals of reference point 1 at frequency f2 are determined, and then the second phase value of the signal point corresponding to reference point 1 is determined. According to the multiple second phase values ​​of the echo signals with frequency f2 corresponding to reference point 1 in multiple rounds, the second phase difference of the echo signal reflected by reference point 1 during the observation process is determined.

[0131] According to the distance value between reference point 2 and the base station, the signal points corresponding to the echo signals of reference point 2 at frequency f3 are determined, and then the second phase value of the signal point corresponding to reference point 2 is determined. According to the multiple second phase values ​​of the echo signals with frequency f3 corresponding to reference point 2 in multiple rounds, the second phase difference of the echo signal reflected by reference point 2 during the observation process is determined.

[0132] The second phase values ​​and distance values ​​corresponding to reference points 1, 2, and 3 are fitted to obtain the target fitting function. The phase compensation value is determined based on the target fitting function and the distance value corresponding to the target monitoring point. The phase compensation value is subtracted from the first phase value to obtain the true deformation phase difference corresponding to the target monitoring point. The deformation degree of the target monitoring point is determined based on the true deformation phase difference.

[0133] The embodiment of the present application further provides a deformation sensing device. As shown in FIG9 , the deformation sensing device 100 includes a feature determination module 110 , a compensation module 120 and a deformation determination module 130 .

[0134] The feature determination module 110 is configured to determine a first deformation feature value corresponding to the target monitoring point and a second deformation feature value corresponding to the reference point.

[0135] The compensation module 120 is configured to compensate the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point.

[0136] The deformation determination module 130 is configured to determine the deformation degree of the target monitoring point according to the third deformation characteristic value.

[0137] It should be noted that the information interaction, execution process, etc. between the modules of the above-mentioned device are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0138] The embodiment of the present application further provides an electronic device, as shown in FIG10 , wherein the electronic device 1000 includes:

[0139] one or more processors 1010;

[0140] The memory 1020 stores one or more programs. When the one or more programs are executed by the one or more processors 1010, the one or more processors 1010 implement the deformation perception method.

[0141] The memory 1020 is a non-transient network system that can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory 1020 may include a high-speed random access memory and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1020 may optionally include a memory 1020 remotely located relative to the processor 1010, and these remote memories 1020 may be connected to the processor 1010 via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0142] The memory 1020 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 1020 can store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 1020 and is called by the processor 1010 to execute the methods of the embodiments of this application.

[0143] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application.

[0144] In some embodiments, the electronic device further comprises:

[0145] Input / output interface, used to realize information input and output;

[0146] Communication interface, used to realize communication interaction between this device and other devices, which can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, Wi-Fi, Bluetooth, etc.);

[0147] A bus that transmits information between various components of the device (e.g., processor 1010, memory 1020, input / output interfaces, and communication interfaces);

[0148] The processor 1010 , the memory 1020 , the input / output interface, and the communication interface can be communicatively connected to each other within the device via a bus.

[0149] An embodiment of the present application further provides a computer-readable storage medium storing computer-executable instructions, which are used to execute the deformation perception method provided in the embodiment of the present application.

[0150] An embodiment of the present application also provides a computer program product, including a computer program or computer instructions, which are stored in a computer-readable storage medium. The processor of a computer device reads the computer program or computer instructions from the computer-readable storage medium, and the processor executes the computer program or computer instructions, so that the computer device executes the deformation perception method provided in the embodiment of the present application.

[0151] The system architecture and application scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of the system architecture and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are equally applicable to similar technical problems.

[0152] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0153] Those skilled in the art will appreciate that all or some of the steps and systems in the method disclosed above can be implemented as software, firmware, hardware, and appropriate combinations thereof. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, and the computer-readable medium can include computer storage media (or non-transitory media) and communication media (or temporary media). As known to those skilled in the art, the term computer storage media is included in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data) and is volatile and non-volatile, removable, and non-removable. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory, or other memory technology, CD-ROM, digital versatile disks (DVD), or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage, or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, as is well known to those skilled in the art, communication media typically embodies computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0154] The above description of some embodiments of the present application with reference to the accompanying drawings does not limit the scope of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and essence of the present application shall be within the scope of the present application.

Claims

1. A deformation perception method, comprising: Determining a first deformation characteristic value corresponding to the target monitoring point and a second deformation characteristic value corresponding to the reference point; Compensating the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point; The deformation degree of the target monitoring point is determined according to the third deformation characteristic value.

2. The method according to claim 1, wherein The reference point is located in the target area where the target monitoring point is located; The compensating the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point includes: The second deformation characteristic value is subtracted from the first deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point.

3. The method according to claim 1, wherein The number of the reference points is multiple; and the compensating the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point includes: Obtaining distance values corresponding to a plurality of reference points; performing fitting processing on the second deformation feature values and distance values corresponding to the plurality of reference points to obtain a target fitting function; Determining a target compensation value according to the target fitting function and the distance value corresponding to the target monitoring point; The target compensation value is subtracted from the first deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point.

4. The method according to claim 1, wherein The determining of the first deformation characteristic value corresponding to the target monitoring point and the second deformation characteristic value corresponding to the reference point includes: Transmitting multiple rounds of carrier signals; monitoring echo signals corresponding to the multiple rounds of carrier signals; According to the multiple rounds of echo signals, a first deformation characteristic value corresponding to the target monitoring point and a second deformation characteristic value corresponding to the reference point are determined.

5. The method according to claim 4, wherein The determining, based on the multiple rounds of echo signals, a first deformation characteristic value corresponding to the target monitoring point and a second deformation characteristic value corresponding to the reference point includes: For each round of echo signals corresponding to the carrier signal, determining the signal points corresponding to the target monitoring point and the reference point in the echo signals according to the distance values corresponding to the target monitoring point and the reference point respectively, determining a first echo signal value according to the signal point corresponding to the target monitoring point, and determining a second echo signal value according to the signal point corresponding to the reference point; determining the first deformation feature value according to a plurality of first echo signal values corresponding to a plurality of rounds of echo signals at the target monitoring point; The second deformation feature value is determined according to a plurality of second echo signal values corresponding to a plurality of rounds of echo signals at the reference point.

6. The method according to claim 4, wherein: The transmitting multiple rounds of carrier signals and monitoring echo signals corresponding to the multiple rounds of carrier signals include: In each round of transmission, carrier signals of different frequencies are transmitted to a plurality of target points in a target area, wherein the plurality of target points include the target monitoring point and the reference point.

7. The method according to claim 6, wherein: The frequency of the carrier signal transmitted to the target monitoring point is a first frequency, and the frequency of the carrier signal transmitted to the reference point is a second frequency; and determining the first deformation characteristic value corresponding to the target monitoring point and the second deformation characteristic value corresponding to the reference point based on the multiple rounds of echo signals includes: Acquire an echo signal of a first frequency and an echo signal of a second frequency from the echo signals corresponding to the carrier signal in each round; For the echo signal of the first frequency obtained in each round of monitoring, determining, according to the distance value corresponding to the target monitoring point, a signal point corresponding to the target monitoring point in the echo signal of the first frequency, and determining a first echo signal value according to the signal point corresponding to the target monitoring point; For the echo signal of the second frequency obtained in each round of monitoring, determining, according to the distance value corresponding to the reference point, a signal point corresponding to the reference point in the echo signal of the second frequency, and determining a second echo signal value according to the signal point corresponding to the reference point; determining the first deformation characteristic value according to a plurality of first echo signal values of the echo signals of the target monitoring point corresponding to a plurality of rounds of the first frequency; The second deformation characteristic value is determined according to a plurality of second echo signal values of the echo signals of the second frequency corresponding to a plurality of rounds of the reference point.

8. The method according to claim 1, wherein The reference point represents a target point that has not been deformed, and the reference point is selected in the following manner: A target point that meets a preset scattering parameter threshold is selected in the target area as the reference point, where the scattering parameter threshold includes at least one of an amplitude fluctuation threshold, a phase fluctuation threshold, and a coherence fluctuation threshold.

9. A deformation sensing device, comprising: A feature determination module, configured to determine a first deformation feature value corresponding to a target monitoring point and a second deformation feature value corresponding to a reference point; a compensation module, configured to compensate the first deformation characteristic value according to the second deformation characteristic value to obtain a third deformation characteristic value corresponding to the target monitoring point; The deformation determination module is used to determine the deformation degree of the target monitoring point according to the third deformation characteristic value.

10. An electronic device comprising: one or more processors; A memory having one or more programs stored thereon, wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the deformation perception method according to any one of claims 1-8.

11. A computer-readable storage medium having a computer program stored thereon, wherein when the program is executed by a processor, the deformation sensing method according to any one of claims 1 to 8 is implemented.

12. A computer program product, comprising a computer program, wherein when the computer program is executed by a processor, the deformation perception method according to any one of claims 1 to 8 is implemented.

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