Switched capacitor assembly, voltage conversion circuit and electronic device

Abstract

Disclosed in the present application are a switched capacitor assembly, a voltage conversion circuit and an electronic device, which are used for improving dynamic performance and response rates. The switched capacitor assembly comprises Q switched capacitor modules, input ends of the Q switched capacitor modules being connected in parallel to serve as an input end of the switched capacitor assembly, and output ends of the Q switched capacitor modules being connected in parallel to serve as an output end of the switched capacitor assembly. Each switched capacitor module comprises N switched capacitor circuits, input ends of the N switched capacitor circuits being connected to the input end of the switched capacitor module, and the output ends of the N switched capacitor circuits being connected to the output end of the switched capacitor module. The output end of the switched capacitor assembly is used for connecting to a load. On the basis of a switching frequency, the switched capacitor circuits are controlled to work, which improves the dynamic performance and the response rate, and reduces output capacitances in the switched capacitor circuits, thus saving cost, reducing the area of a single board, and reducing product sizes.

Description

A switched capacitor module, voltage conversion circuit and electronic equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on January 31, 2024, with application number 202410144641.8 and application name "A switching capacitor module, voltage conversion circuit and electronic device", the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of electronic products, and in particular to a switched capacitor module, a voltage conversion circuit, and an electronic device. Background Art

[0004] With the development of information technology, data is growing exponentially, placing ever-more stringent demands on data processing capabilities. Consequently, chips such as central processing units (CPUs) and graphics processing units (GPUs) used in computer systems are required to provide high-performance processing and computing capabilities. When powering these chips, the voltage at their load input terminals is often affected by various factors, resulting in significant drops and overshoots, which can impact the performance of the chip and, ultimately, the entire computer system, and reduce power supply efficiency. To address this issue, the power supply of a computer system responds quickly to drops and overshoots, dynamically adjusting the output voltage to the target voltage. In the prior art, power supplies typically employ a switched-capacitor step-down circuit to achieve dynamic voltage adjustment. However, as chip performance in computer systems improves, the requirements for the dynamic performance and response rate of power supplies are also increasing. Conventional switched-capacitor circuits and corresponding power supplies are increasingly unable to meet these demands. Therefore, a new power supply method is needed to further improve dynamic performance and response rate.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a switched capacitor module, a voltage conversion circuit, and an electronic device for improving dynamic performance and response rate.

[0007] In a first aspect, an embodiment of the present application provides a switched capacitor module, which includes Q switched capacitor modules, the input ends of the Q switched capacitor modules are connected in parallel to serve as the input end of the switched capacitor module, and the output ends of the Q switched capacitor modules are connected in parallel to serve as the output end of the switched capacitor module. In addition, the switched capacitor module includes N switched capacitor circuits, the input ends of the N switched capacitor circuits are connected to the input end of the switched capacitor module, and the output ends of the N switched capacitor circuits are connected to the output end of the switched capacitor module. In addition, the output end of the switched capacitor module is used to connect to a load.

[0008] Among them, the Q switched capacitor modules can be used to respond to phase-shifting control, and the inverse of the load current change time is less than Q*N*Fsw. With this setting, the Q switched capacitor modules can be operated in parallel in phase shifting, which can enable the switched capacitor module to multiply the output current, build an ideal current multiplier, further enable the switched capacitor module to output a large current, reduce the delay time of the loop response, and improve dynamic performance. In addition, when the switched capacitor module is applied to a low-voltage, high-current computing system power supply scenario, when the Q switched capacitor modules are controlled in phase shifting, the load current change time is very fast, and it is necessary to convert the input side capacity to the output side as quickly as possible. Since the higher the switching frequency, the faster the energy conversion, there is a certain relationship between the switching frequency and the current change time. Based on this, when the Q switched capacitor modules are controlled in phase shifting, the inverse of the load current change time can be limited to less than Q*N*Fsw, so that the switching frequency of the switched capacitor circuit can be obtained. Based on this switching frequency, the switched capacitor circuit is controlled to work, which can enable the switched capacitor module to respond to voltage conversion in a timely manner, improving dynamic performance and response rate. Furthermore, by controlling the operation of the switched capacitor circuit based on the switching frequency, the dynamic performance and response rate can be improved, and the output capacitance in the switched capacitor circuit can be reduced, thereby saving costs, reducing the board area, and reducing the product volume.

[0009] Alternatively, the Q switched capacitor modules can also be used to respond to in-phase control, and the inverse of the load current change time is less than N*Fsw. With this arrangement, the Q switched capacitor modules can be connected in parallel in the same phase, enabling the switched capacitor module to multiply the output current, constructing an ideal current multiplier, further enabling the switched capacitor module to output a large current, reducing the delay time of the loop response, and improving the dynamic performance of the chip. In addition, when the switched capacitor module is applied to a low-voltage, high-current computing system power supply scenario, when the Q switched capacitor modules are in-phase controlled, the load current change time is very fast, and it is necessary to convert the input side capacity to the output side as quickly as possible. Since the greater the switching frequency, the faster the energy conversion, there is a certain relationship between the switching frequency and the current change time. Based on this, when the Q switched capacitor modules are in-phase controlled, the inverse of the load current change time can be limited to less than N*Fsw, so that the switching frequency of the switched capacitor circuit can be obtained. Based on the switching frequency, the switched capacitor circuit is controlled to work, which can enable the switched capacitor module to respond to voltage conversion in time, improving dynamic performance and response rate. Furthermore, by controlling the operation of the switched capacitor circuit based on the switching frequency, the dynamic performance and response rate can be improved, and the output capacitance in the switched capacitor circuit can be reduced, thereby saving costs, reducing the board area, and reducing the product volume.

[0010] Wherein, Q is an integer and Q≥1, N is an integer and N≥1, and Fsw represents the switching frequency of the switched capacitor circuit.

[0011] In some embodiments, the switched capacitor circuit is a resonant switched capacitor circuit, which can reduce losses during the step-down conversion process and achieve fine-tuning of the output voltage.

[0012] In some embodiments, a resonant switched capacitor circuit includes a first switching transistor, a second switching transistor, a third switching transistor, a third switching transistor, an energy storage capacitor, a first filter capacitor, a second filter capacitor, and an inductor, wherein the control electrode of the first switching transistor is used to receive a first switching signal, the first electrode of the first switching transistor is connected to the positive input terminal of the input terminal of the resonant switched capacitor circuit and the first electrode of the first filter capacitor, and the second electrode of the first switching transistor is connected to the first electrode of the second switching transistor and the first electrode of the energy storage capacitor. The control electrode of the second switching transistor is used to receive a second switching signal, the second electrode of the second switching transistor is connected to the first electrode of the third switching transistor and the first end of the inductor. The control electrode of the third switching transistor is used to receive a third switching signal, the second electrode of the third switching transistor is connected to the first electrode of the fourth switching transistor and the second electrode of the energy storage capacitor. The control electrode of the fourth switching transistor is used to receive a fourth switching signal, the second electrode of the fourth switching transistor is connected to the second electrode of the second filter capacitor and the negative input terminal of the input terminal of the resonant switched capacitor circuit. The second electrode of the first filter capacitor is connected to the first electrode of the second filter capacitor and the second end of the inductor. With this arrangement, a resonant switched capacitor circuit with a simple structure can be realized, which is relatively simple to apply, thereby not only reducing losses and achieving fine adjustment of the output voltage, but also reducing production costs.

[0013] In some embodiments, a resonant switched capacitor circuit includes a first switching transistor, a second switching transistor, a third switching transistor, a third switching transistor, an energy storage capacitor, a first filter capacitor, a second filter capacitor, and an inductor, wherein the control electrode of the first switching transistor is used to receive a first switching signal, the first electrode of the first switching transistor is connected to the positive input terminal of the input terminal of the resonant switched capacitor circuit and the first electrode of the first filter capacitor, and the second electrode of the first switching transistor is connected to the first electrode of the second switching transistor and the first end of the inductor. The second end of the inductor is connected to the first electrode of the energy storage capacitor, the control electrode of the second switching transistor is used to receive a second switching signal, the second electrode of the second switching transistor is connected to the first electrode of the third switching transistor, the second electrode of the first filter capacitor, and the first electrode of the second filter capacitor. The control electrode of the third switching transistor is used to receive a third switching signal, the second electrode of the third switching transistor is connected to the first electrode of the fourth switching transistor and the second electrode of the energy storage capacitor. The control electrode of the fourth switching transistor is used to receive a fourth switching signal, and the second electrode of the fourth switching transistor is connected to the second electrode of the second filter capacitor and the negative input terminal of the input terminal of the resonant switched capacitor circuit. With this arrangement, another resonant switched capacitor circuit with a simple structure can be realized, which is relatively simple to apply, thereby not only reducing losses and achieving fine adjustment of the output voltage, but also reducing production costs.

[0014] In some embodiments, the switched capacitor circuit may also be a non-resonant switched capacitor circuit. This configuration allows for a simple non-resonant switched capacitor circuit. Furthermore, in practical applications, the circuit structure of a non-resonant switched capacitor circuit is relatively mature. By configuring the switched capacitor circuit in this application as a non-resonant switched capacitor circuit, implementation is relatively simple, reducing design difficulty and production costs.

[0015] In the second aspect, an embodiment of the present application further provides a voltage conversion circuit, which includes: a DC-DC conversion circuit and a switched capacitor module, wherein the switched capacitor module is a switched capacitor module as in the first aspect or various embodiments of the first aspect. In addition, the input end of the DC-DC conversion circuit is used to receive the input voltage, the output end of the DC-DC conversion circuit is connected to the input end of the switched capacitor module, and the output end of the switched capacitor module is used to connect the load. In addition, the DC-DC conversion circuit is used to step down the input voltage and output it to the switched capacitor module, and the switched capacitor module is used to step down the input voltage and output it to the load. Thus, the voltage conversion circuit in the embodiment of the present application can form a voltage conversion circuit in the form of a two-stage architecture by setting the DC-DC conversion circuit and the switched capacitor module. In addition, the voltage conversion circuit in the embodiment of the present application can be used in a step-down scenario to supply power to the load.

[0016] The voltage conversion circuit in the embodiment of the present application can be applied in the step-down scenario. The voltage input to the voltage conversion circuit is usually high. Since the load needs to have a high dynamic response, the voltage conversion circuit is required to convert the input voltage to the output side as quickly as possible. Since the switching frequency is higher, the energy conversion is faster, and a higher switching frequency is required, resulting in higher switching losses and reduced efficiency. In addition, the voltage input to the voltage conversion circuit is high, and the voltage withstand performance requirements of the switch tube are also high (easy to break down the switch tube), and the cost is high. For this reason, the present application adopts a two-stage structure to form a voltage conversion circuit. The input voltage of the first stage (i.e., the DC-DC conversion circuit) is high, and the input voltage of the second stage (i.e., the switched capacitor module) is low. Since the input voltage of the first stage is high, in order to reduce the voltage withstand performance requirements of the switch tube, the switching frequency of the first stage can be set lower, thereby reducing the voltage withstand performance requirements of the switch tube in the first stage, and reducing the switching loss of the first stage, thereby improving system efficiency. The second stage is provided with multiple switched capacitor circuits, and it is not necessary to increase the switching frequency of each switched capacitor circuit. By connecting multiple switched capacitor circuits in parallel and controlling the operation of these switched capacitor circuits, the equivalent switching frequency of the switched capacitor module (equivalent switching frequency is equal to N*Fsw) can be increased, so that the voltage can be quickly converted from the input side to the output side to meet the dynamic performance and response rate required by the load. In addition, since the switching frequency of each switched capacitor circuit is not increased, that is, on the basis of increasing the equivalent switching frequency, the switching loss is not increased, which is equivalent to reducing the switching loss and improving efficiency. Therefore, the present application adopts a two-stage architecture to form a voltage conversion circuit, which can meet the dynamic performance and response rate required by the load and improve efficiency.

[0017] In some embodiments, the DC-DC conversion circuit is further configured to adjust the voltage at the output end of the DC-DC conversion circuit in response to the voltage at the output end of the DC-DC conversion circuit not meeting the first voltage threshold. With this arrangement, the DC-DC conversion circuit adjusts the voltage at its own output based on the feedback of its own output voltage, thereby maintaining the stability of its own output voltage through voltage regulation. Furthermore, the switched capacitor module is configured to adjust the voltage at the output end of the switched capacitor module in response to the voltage at the output end of the switched capacitor module not meeting the second voltage threshold. With this arrangement, the switched capacitor module adjusts the voltage at its own output based on the feedback of its own output voltage, thereby maintaining the stability of its own output voltage through voltage regulation. Based on this, combining two stages for separate voltage regulation can quickly stabilize the load voltage.

[0018] In some embodiments, the DC-DC converter circuit is further configured to adjust the voltage at the output of the DC-DC converter circuit in response to the voltage at the output of the switched capacitor module failing to meet a second voltage threshold. Furthermore, the switched capacitor module is configured to adjust the voltage at the output of the switched capacitor module in response to the voltage at the output of the switched capacitor module failing to meet the second voltage threshold. With this arrangement, the DC-DC converter circuit and the switched capacitor module each adjust their own output voltage based on feedback from the voltage at the output of the switched capacitor module, thereby combining two stages of voltage regulation to quickly stabilize the load voltage.

[0019] In some embodiments, the switched capacitor module can quickly respond to the voltage at its output end and achieve rapid adjustment. Although Uout can be adjusted in this way, the switched capacitor module will not be able to operate at the optimal working efficiency point. In order to make the switched capacitor module work at the optimal working efficiency point again, the switched capacitor module is also used to respond to the switched capacitor module to adjust the voltage at its output end and send a linkage voltage regulation instruction to the DC-DC conversion circuit. In addition, the DC-DC conversion circuit is also used to adjust the voltage at the output end of the DC-DC conversion circuit in response to the linkage voltage regulation instruction. With this arrangement, through two-stage linkage control, the switched capacitor module is made to work at the optimal power point again, thereby improving the working efficiency of the switched capacitor module.

[0020] In some embodiments, the switched capacitor module is further configured to send a coordinated voltage regulation instruction carrying voltage reduction information to the DC-DC converter circuit in response to the switched capacitor module adjusting the voltage reduction at its output terminal. Furthermore, the DC-DC converter circuit is further configured to reduce the voltage at the output terminal of the DC-DC converter circuit in response to the coordinated voltage regulation instruction carrying the voltage reduction information. With this arrangement, since the switched capacitor module adjusts the voltage reduction at its output terminal, it is necessary to control the DC-DC converter circuit to reduce the voltage at its output terminal so that the switched capacitor module can resume operation at the optimal power point.

[0021] In some embodiments, the switched capacitor module is further configured to send a coordinated voltage regulation instruction carrying voltage boost information to the DC-DC converter circuit in response to the switched capacitor module adjusting the voltage increase at its output terminal. Furthermore, the DC-DC converter circuit is further configured to increase the voltage at the output terminal of the DC-DC converter circuit in response to the coordinated voltage regulation instruction carrying the voltage boost information. With this arrangement, since the switched capacitor module adjusts the voltage increase at its output terminal, it is necessary to control the DC-DC converter circuit to increase the voltage at its output terminal so that the switched capacitor module can resume operation at the optimal power point.

[0022] In some embodiments, the switched capacitor module is also used to control one or more of the phase, switching frequency, and duty cycle corresponding to the switched capacitor circuit to be adjusted from a set value to a target value in response to the voltage at the output end of the switched capacitor module not meeting the second voltage threshold, thereby adjusting the voltage at its output end; and after the DC-DC conversion circuit adjusts the voltage at its output end in response to the linkage voltage regulation instruction, one or more of the phase, switching frequency, and duty cycle is adjusted from the target value to the set value. With this arrangement, the switched capacitor module can adjust the voltage change at its output end by adjusting the set value. However, since the voltage change at its output end caused by the switched capacitor module adjusting the voltage change causes the set value to change, the target value can be readjusted to the set value by linkage controlling the DC-DC conversion circuit voltage regulation, thereby allowing the switched capacitor module to operate at the optimal power point again.

[0023] In some embodiments, the DC-DC converter circuit is further configured to adjust the voltage at the output of the DC-DC converter circuit in response to the voltage at the output of the switched capacitor module failing to meet a second voltage threshold. With this configuration, the DC-DC converter circuit adjusts its output voltage based on feedback from the output voltage of the switched capacitor module, maintaining the stability of its output voltage through voltage regulation and achieving load voltage stability.

[0024] In some embodiments, to maintain a stable voltage Uout, the switched capacitor module (especially a resonant switched capacitor circuit) directly adjusts the voltage at its output, which reduces the efficiency of the switched capacitor module and, consequently, the efficiency of the entire voltage conversion circuit. Therefore, the DC-DC converter circuit is further configured to adjust the voltage at the output of the DC-DC converter circuit based on the current at the output of the switched capacitor module, thereby enabling the switched capacitor module to convert the adjusted voltage at the output of the DC-DC converter circuit into a stable voltage, thereby improving operating efficiency.

[0025] In some embodiments, the voltage at the output of the DC-DC converter circuit can be adjusted based on load requirements, so that the voltage at the output of the switched capacitor module meets the load requirements. Based on this, the DC-DC converter circuit is further configured to adjust the voltage at the output of the DC-DC converter circuit based on the current at the output of the switched capacitor module and a first voltage regulation instruction output by the load, so that the switched capacitor module converts the adjusted voltage at the output of the DC-DC converter circuit into a stable voltage, thereby improving operating efficiency.

[0026] For example, the first voltage regulation instruction may be sent by the load to the DC-DC converter circuit via a communication connection or physical continuity. Alternatively, the first voltage regulation instruction may be sent by the load to the switched capacitor module via a communication connection or physical continuity, and the switched capacitor module may then send the instruction to the DC-DC converter circuit via a communication connection or physical continuity.

[0027] In some embodiments, the DC-DC conversion circuit can also adjust the voltage at its output end according to the second voltage regulation instruction output by the load, and then convert the adjusted voltage at the output end of the DC-DC conversion circuit through the switching capacitor module to meet the load requirements.

[0028] For example, during the process of the DC-DC conversion circuit regulating the voltage according to the second voltage regulation instruction, the voltage at the output end of the switching capacitor module can be fine-tuned in combination with the above-mentioned control method to improve the working efficiency of the switching capacitor module and the dynamic performance of the chip.

[0029] In some embodiments, the switched capacitor module can adjust the voltage at its output terminal according to a third voltage regulation instruction output by the load to meet the demand of the load.

[0030] For example, when the switched capacitor module is regulating voltage according to the third voltage regulation instruction, the voltage at the output end of the switched capacitor module can be fine-tuned in combination with the above control method to improve the working efficiency of the switched capacitor module and the dynamic performance of the chip.

[0031] In some embodiments, the DC-DC conversion circuit includes: an LLC resonant converter or a current-doubler-rectifier converter. In practical applications, since the circuit topology of the LLC resonant converter or the current-doubler-rectifier converter is relatively mature, by configuring the DC-DC conversion circuit in this application as an LLC resonant converter or a current-doubler-rectifier converter, implementation is relatively simple, which can reduce design difficulty and production costs.

[0032] In a third aspect, embodiments of the present application further provide an electronic device, comprising: a circuit board and a voltage conversion circuit, wherein the voltage conversion circuit is disposed on the circuit board. The voltage conversion circuit is the voltage conversion circuit described in the second aspect or various embodiments of the second aspect. Due to the superior performance of the voltage conversion circuit, the electronic device including the voltage conversion circuit also has superior performance.

[0033] In addition, the technical effects of the corresponding scheme in the third aspect can refer to the technical effects that can be obtained by the corresponding scheme in the first aspect or the second aspect, and the repeated parts will not be described in detail. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0035] FIG2 is a block diagram of an equivalent circuit of a voltage conversion circuit provided in an embodiment of the present application;

[0036] FIG3 a is a block diagram of an equivalent circuit of a switched capacitor module in an embodiment of the present application;

[0037] FIG3 b is a block diagram of an equivalent circuit of a switched capacitor module in an embodiment of the present application;

[0038] FIG4 a is a schematic diagram of a circuit topology of a resonant switched capacitor circuit in an embodiment of the present application;

[0039] FIG4 b is a schematic diagram of another circuit topology of the resonant switched capacitor circuit in an embodiment of the present application;

[0040] FIG4 c is a schematic diagram of a circuit topology of a non-resonant switched capacitor circuit according to an embodiment of the present application;

[0041] FIG5 is a signal timing diagram of a switched capacitor circuit provided in an embodiment of the present application;

[0042] FIG6 is an equivalent circuit diagram of a resonant switched capacitor circuit provided in an embodiment of the present application;

[0043] FIG7 is an equivalent circuit diagram of a non-resonant switched capacitor circuit provided in an embodiment of the present application;

[0044] FIG8 is a diagram showing the relationship between current change and time in an embodiment of the present application;

[0045] FIG9a is a signal timing diagram of a switched capacitor module provided in an embodiment of the present application;

[0046] FIG9 b is another signal timing diagram of the switched capacitor module provided in an embodiment of the present application;

[0047] FIG9c is another signal timing diagram of the switched capacitor module provided in an embodiment of the present application;

[0048] 10a to 10j are circuit diagrams of a control method in an embodiment of the present application;

[0049] FIG11a is a schematic diagram showing simulation results of the efficiency of the entire voltage conversion circuit in an embodiment of the present application;

[0050] FIG11 b is a schematic diagram showing simulation results of the efficiency of the switched capacitor module in an embodiment of the present application;

[0051] FIG11c is a schematic diagram showing simulation results of the efficiency of the DC-DC conversion circuit in an embodiment of the present application;

[0052] FIG12a is a schematic diagram of another simulation result of the efficiency of the entire voltage conversion circuit in an embodiment of the present application;

[0053] FIG12 b is a schematic diagram of another simulation result of the efficiency of the DC-DC conversion circuit in the embodiment of the present application;

[0054] 13a to 13g are structural block diagrams of a voltage conversion circuit and a first chip provided in an embodiment of the present application;

[0055] FIG14a is a schematic structural diagram of a voltage conversion circuit and a first chip provided in an embodiment of the present application;

[0056] FIG14b is a schematic diagram of an equivalent circuit of the voltage conversion circuit and the first chip shown in FIG14a;

[0057] FIG15a is another structural diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application;

[0058] FIG15b is a schematic diagram of an equivalent circuit of the voltage conversion circuit and the first chip shown in FIG15a;

[0059] FIG16a is another structural diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application;

[0060] FIG16b is a schematic diagram of an equivalent circuit of the voltage conversion circuit and the first chip shown in FIG16a;

[0061] 17 to 23 are schematic diagrams of another structure of the voltage conversion circuit and the first chip provided in the embodiments of the present application.

[0062] Figure markings: 100-shell; 210-circuit board; 220-load; 230-voltage conversion circuit; 211-first chip; 212-second chip; 221-first substrate; 222-second substrate; 231-DC-DC conversion circuit; 232-switching capacitor module; 2321_1~2321_Q-switching capacitor module; 23211_1~23211_N-switching capacitor circuit; 233-DC converter; 241 / 242-first conductive part; 251 / 252-second conductive part; 261 / 262 / 263 / 264-signal line; 311 / 312-resonant switching capacitor circuit; 313-non-resonant switching capacitor circuit; C1-power output capacitor; C2-power input capacitor; C3-input filter capacitor; C4-output filter capacitor; Uin / Umid / Uout-voltage; K1-first through hole; K2-second through hole. DETAILED DESCRIPTION

[0063] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings. The specific operating methods in the method embodiments can also be applied to device embodiments or system embodiments. It should be noted that in the description of the present application, "multiple" can be understood as "at least two". In addition, it should be understood that in the description of the present application, words such as "first" and "second" are only used to distinguish the purpose of description, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order.

[0064] It should be noted that the same reference numerals in the drawings of this application represent the same or similar structures, and thus their repeated description will be omitted. The words expressing positions and directions described in this application are all explained using the drawings as examples, but they can be modified as needed, and such modifications are included in the scope of protection of this application. The drawings of this application are only for illustrative purposes and do not represent true proportions.

[0065] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Referring to Figure 1 , in this embodiment of the present application, the electronic device includes a housing 100 and a circuit board 210 disposed within the housing 100. The circuit board 210 is provided with a voltage conversion circuit 230 and a load 220. The voltage conversion circuit 230 is configured to supply power to the load 220. Furthermore, the electronic device further includes a power module disposed within the housing 100. The power module is connected to the voltage conversion circuit 230 and can convert electrical energy provided by a power source and input the converted electrical energy into the voltage conversion circuit 230.

[0066] Exemplarily, the electronic device may be a computer device having a processor chip, such as a server, a desktop computer, a personal computer, etc., or may be a portable electronic device having a processor chip, such as a mobile phone, a tablet computer, a vehicle-mounted device, etc. The load 220 includes, for example, but is not limited to, a chip. Exemplarily, the chip may be a graphics processing unit (GPU), or a central processing unit (CPU), an artificial intelligence (AI) chip, a system on chip (SoC), etc. having logic computing capabilities, or may be other types of application-specific integrated circuits (ASIC), programmable logic devices such as field programmable gate arrays (FPGA), transistor logic devices, hardware components, or any combination thereof. In addition, the circuit board includes, for example, but is not limited to, a printed circuit board (PCB). In the embodiment of the present application, the load is described as a chip as an example.

[0067] For example, existing GPUs have numerous transistors. As performance increases, so do power requirements, which have become the limiting factor in GPU computing performance. As chip computing power increases and chip size increases, the current required by the chip increases. Furthermore, the pulse current in the power supply chain of the power delivery network (PDN) that powers the CPU is difficult to reduce, causing transient voltage fluctuations on the chip's power pins. These voltage fluctuations can lead to performance and power consumption issues for the CPU.

[0068] To this end, an embodiment of the present application provides a voltage conversion circuit that can be applied to the above-mentioned electronic device. The voltage conversion circuit includes a DC-DC conversion circuit and a switching capacitor module. The DC-DC conversion circuit and the switching capacitor module output a large current to the chip, reduce the pulsating current, and improve the current stability, thereby reducing voltage fluctuations and improving chip performance.

[0069] The working process of the voltage conversion circuit provided in the embodiment of the present application is described in detail below in conjunction with the equivalent circuit block diagram.

[0070] FIG2 is a block diagram of an equivalent circuit of a voltage conversion circuit provided in an embodiment of the present application. Referring to FIG2 , the input end of a direct current-direct current (DC-DC) conversion circuit 231 can receive an input voltage Uin, the output end of the DC-DC conversion circuit 231 is connected to the input end of a switch capacitor module 232, and the output end of the switch capacitor module 232 is connected to the first chip 211 (i.e., a load). In a specific implementation, the input end of the DC-DC conversion circuit 231 can be connected to a power module of an electronic device, and according to the different power supply voltages output by the power module, the transformation ratio of the DC-DC conversion circuit 231 can have different implementation forms. For example, if the input voltage Uin output by the power module is 48V, the DC-DC conversion circuit 231 can have a transformation ratio of 48:n. For example, if the DC-DC conversion circuit 231 has a transformation ratio of 48:1.8, the DC-DC conversion circuit 231 can step down the 48V voltage Uin to a voltage Umid of 1.8V and output it. Furthermore, the switched capacitor module 232 also has a transformation ratio: n: 1, then the switched capacitor module 232 can output a voltage Uout after step-down conversion of the voltage Umid according to the transformation ratio, and output the voltage Uout to the first chip 211 (i.e., load). For example, if the voltage Umid is 1.8V, and the transformation ratio of the switched capacitor module 232 is 2: 1, the voltage Uout is 0.9V. Furthermore, if the current input by the switched capacitor module 232 is Imid, the current output by the switched capacitor module 232 is 2Imid. Thus, the voltage conversion circuit in the embodiment of the present application, by arranging the DC-DC conversion circuit 231 and the switched capacitor module 232, can form a voltage conversion circuit in the form of a two-stage architecture. Furthermore, the voltage conversion circuit in the embodiment of the present application can be applied in a step-down scenario to power the first chip 211.

[0071] Exemplarily, the DC-DC conversion circuit can be set to, for example, an LLC resonant converter (Resonant LLC Converter) or a current doubler rectifier converter (CDR). In practical applications, since the circuit topology of the LLC resonant converter or the current doubler rectifier converter is relatively mature, by setting the DC-DC conversion circuit in this application as an LLC resonant converter or a current doubler rectifier converter, it is relatively simple to implement, which can reduce the design difficulty and production cost. It is worth mentioning that the LLC resonant converter and CDR are only feasible examples of implementing the DC-DC conversion circuit. In practical applications, the circuit topology of the DC-DC conversion circuit can also be in other forms, which are not specifically limited here.

[0072] The structure and working process of the switched capacitor module are described in detail below.

[0073] FIG3 a is an equivalent circuit block diagram of a switched capacitor module in an embodiment of the present application. Referring to FIG3 a , the switched capacitor module 232 may include: Q switched capacitor modules 2321_1 to 2321_Q, the input ends of the Q switched capacitor modules 2321_1 to 2321_Q being connected in parallel to serve as the input end of the switched capacitor module 232, and the output end signals of the Q switched capacitor modules 2321_1 to 2321_Q being connected in parallel to serve as the output end of the switched capacitor module 232. Specifically, the positive input end of each switched capacitor module 2321_1 to 2321_Q is connected to each other to serve as the positive input end of the input end of the switched capacitor module 232, and the negative input end of each switched capacitor module 2321_1 to 2321_Q is connected to each other to serve as the negative input end of the input end of the switched capacitor module 232. Furthermore, the positive output terminals of the output terminals of each switching capacitor module 2321_1 to 2321_Q are connected to each other as the positive output terminals of the output terminals of the switching capacitor module 232, and the negative output terminals of the output terminals of each switching capacitor module 2321_1 to 2321_Q are connected to each other as the negative output terminals of the output terminals of the switching capacitor module 232. With this arrangement, each switching capacitor module can receive the voltage Umid, and each switching capacitor module can step down the voltage Umid to Uout and output it. It is understandable that the number of switching capacitor modules is Q, Q is an integer and Q≥1, for example, Q can be 1, 2, 3, 4 or more. In a specific implementation, the specific value of Q can be determined according to the actual application scenario and is not limited here. Figure 3a is illustrated by taking Q as an integer greater than 1.

[0074] FIG3 b is an equivalent circuit block diagram of a switched capacitor module in an embodiment of the present application. Referring to FIG3 b , the switched capacitor module 2321_1 may include: N switched capacitor circuits 23211_1 to 23211_N, the input terminals of the N switched capacitor circuits 23211_1 to 23211_N being connected to the input terminal of the switched capacitor module 2321_1, and the output terminals of the N switched capacitor circuits 23211_1 to 23211_N being connected to the output terminal of the switched capacitor module 2321_1. Specifically, the positive input terminal of each of the input terminals of the switched capacitor circuits 23211_1 to 23211_N is connected to the positive input terminal of the input terminal of the switched capacitor module 2321_1, and the negative input terminal of each of the input terminals of the switched capacitor circuits 23211_1 to 23211_N is connected to the negative input terminal of the input terminal of the switched capacitor module 2321_1. Furthermore, the positive output terminal of each of the output terminals of the switched capacitor circuits 23211_1 to 23211_N is connected to the positive output terminal of the output terminal of the switched capacitor module 2321_1, and the negative output terminal of each of the output terminals of the switched capacitor circuits 23211_1 to 23211_N is connected to the negative output terminal of the output terminal of the switched capacitor module 2321_1. It is understandable that the number of switched capacitor circuits 23211 is N, where N is an integer and N≥1. For example, N can be 1, 2, 3, 4, or more. In specific implementations, the specific value of N can be determined based on the actual application scenario and is not limited here. Figure 3b illustrates an example where N is an integer greater than 1. In addition, the implementation of the switched capacitor modules 2321_2 to 2321_Q can refer to the implementation of the switched capacitor module 2321_1, and the specific details are not repeated here.

[0075] In a specific implementation, a capacitor and a switch tube are provided in the switched capacitor circuit, and the conduction and disconnection of the switch tube can be controlled by a switch signal to realize the charging and discharging process of the capacitor, so that the voltage conversion function can be realized by utilizing the conduction and disconnection of the switch tube and the charging and discharging characteristics of the capacitor, thereby making the switched capacitor circuit have the advantages of simple structure, flexible control and fast response speed. Due to the large number of circuit topologies of the switched capacitor circuit, for example, there are resonant switched capacitor circuits and non-resonant switched capacitor circuits. The switched capacitor circuit in the embodiment of the present application can be a resonant switched capacitor circuit or a non-resonant switched capacitor circuit. In some examples, when the switched capacitor circuit is set to a resonant switched capacitor circuit, it is possible to reduce losses and achieve fine-tuning of the output voltage during the step-down conversion process. The following is an example of the structure of the switched capacitor module using a switched capacitor circuit with a transformation ratio of 2:1.

[0076] FIG4 a is a schematic diagram of a circuit topology of a resonant switched capacitor circuit in an embodiment of the present application. For example, referring to FIG4 a , the switched capacitor circuit can be configured as a resonant switched capacitor circuit 311, wherein the resonant switched capacitor circuit 311 may include: a first switching transistor Q1, a second switching transistor Q2, a third switching transistor Q3, a fourth switching transistor Q4, an energy storage capacitor Ces, a first filter capacitor Cst1, a second filter capacitor Cst2, and an inductor Lx. A control electrode of the first switching transistor Q1 is configured to receive a first switching signal Φ1. A first electrode of the first switching transistor Q1 is connected to the positive input terminal of the input terminal of the resonant switched capacitor circuit 311 and the first electrode of the first filter capacitor Cst1. A second electrode of the first switching transistor Q1 is connected to the first electrode of the second switching transistor Q2 and the first electrode of the energy storage capacitor Ces. A control electrode of the second switching transistor Q2 is configured to receive a second switching signal Φ2. A second electrode of the second switching transistor Q2 is connected to the first electrode of the third switching transistor Q3 and the first end of the inductor Lx. The control electrode of the third switch transistor Q3 is used to receive the third switching signal Φ3. The second electrode of the third switch transistor Q3 is connected to the first electrode of the fourth switch transistor Q4 and the second electrode of the energy storage capacitor Ces. The control electrode of the fourth switch transistor Q4 is used to receive the fourth switching signal Φ4. The second electrode of the fourth switch transistor Q4 is connected to the second electrode of the second filter capacitor Cst2, the negative input terminal of the input terminal of the resonant switch capacitor circuit 311, and the negative output terminal of the output terminal of the resonant switch capacitor circuit 311. The second electrode of the first filter capacitor Cst1 is connected to the first electrode of the second filter capacitor Cst2, the second end of the inductor Lx, and the positive output terminal of the output terminal of the resonant switch capacitor circuit 311. This arrangement allows the switch capacitor circuit in the embodiment of the present application to be implemented using a resonant switch capacitor circuit 311 with a simple structure. Moreover, in actual applications, the circuit structure of the resonant switch capacitor circuit 311 is relatively mature. By setting the switch capacitor circuit in the present application as a resonant switch capacitor circuit 311, not only can the loss be reduced and the output voltage can be fine-tuned, but it can also be relatively simple to implement, reducing the design difficulty and reducing the production cost.

[0077] FIG4 b is a schematic diagram of another circuit topology of a resonant switched capacitor circuit in an embodiment of the present application. For example, referring to FIG4 b , the switched capacitor circuit can be configured as a resonant switched capacitor circuit 312, wherein the resonant switched capacitor circuit 312 may include: a first switching transistor Q1, a second switching transistor Q2, a third switching transistor Q3, a fourth switching transistor Q4, an energy storage capacitor Ces, a first filter capacitor Cst1, a second filter capacitor Cst2, and an inductor Lx. A control electrode of the first switching transistor Q1 is configured to receive a first switching signal Φ1. A first electrode of the first switching transistor Q1 is connected to the positive input terminal of the input terminal of the resonant switched capacitor circuit 312 and the first electrode of the first filter capacitor Cst1. A second electrode of the first switching transistor Q1 is connected to the first electrode of the second switching transistor Q2 and the first end of the inductor Lx. The second end of the inductor Lx is connected to the first electrode of the energy storage capacitor Ces. The control electrode of the second switch tube Q2 is used to receive the second switching signal Φ2, and the second electrode of the second switch tube Q2 is connected to the first electrode of the third switch tube Q3, the second electrode of the first filter capacitor Cst1, the first electrode of the second filter capacitor Cst2, and the positive output terminal of the output terminal of the resonant switch capacitor circuit 312. The control electrode of the third switch tube Q3 is used to receive the third switching signal Φ3, and the second electrode of the third switch tube Q3 is connected to the first electrode of the fourth switch tube Q4 and the second electrode of the energy storage capacitor Ces. The control electrode of the fourth switch tube Q4 is used to receive the fourth switching signal Φ4, and the second electrode of the fourth switch tube Q4 is connected to the second electrode of the second filter capacitor Cst2, the negative input terminal of the input terminal of the resonant switch capacitor circuit 312, and the negative output terminal of the output terminal of the resonant switch capacitor circuit 312. With this arrangement, the switch capacitor circuit in the embodiment of the present application can be implemented using a resonant switch capacitor circuit 312 with a simple structure. Moreover, in actual applications, the circuit structure of the resonant switched capacitor circuit 312 is relatively mature. By setting the switched capacitor circuit in this application as a resonant switched capacitor circuit 312, not only can the loss be reduced and the output voltage be fine-tuned, but it can also be relatively simple to implement, which can reduce the design difficulty and reduce the production cost.

[0078] FIG4 c is a schematic diagram of a circuit topology of a non-resonant switched capacitor circuit in an embodiment of the present application. For example, referring to FIG4 c , the switched capacitor circuit can be configured as a non-resonant switched capacitor circuit 313, wherein the non-resonant switched capacitor circuit 313 may include: a first switch transistor Q1, a second switch transistor Q2, a third switch transistor Q3, a fourth switch transistor Q4, an energy storage capacitor Ces, a first filter capacitor Cst1, and a second filter capacitor Cst2. The control electrode of the first switch transistor Q1 is configured to receive a first switching signal Φ1. The first electrode of the first switch transistor Q1 is connected to the positive input terminal of the input terminal of the non-resonant switched capacitor circuit 313 and the first electrode of the first filter capacitor Cst1. The second electrode of the first switch transistor Q1 is connected to the first electrode of the second switch transistor Q2 and the first electrode of the energy storage capacitor Ces. The control electrode of the second switch transistor Q2 is configured to receive a second switching signal Φ2. The second electrode of the second switch transistor Q2 is connected to the first electrode of the third switch transistor Q3, the second electrode of the first filter capacitor Cst1, the first electrode of the second filter capacitor Cst2, and the positive output terminal of the output terminal of the non-resonant switched capacitor circuit 313. The control electrode of the third switch tube Q3 is used to receive the third switch signal Φ3, and the second electrode of the third switch tube Q3 is connected to the first electrode of the fourth switch tube Q4 and the second electrode of the energy storage capacitor Ces. The control electrode of the fourth switch tube Q4 is used to receive the fourth switch signal Φ4, and the second electrode of the fourth switch tube Q4 is connected to the second electrode of the second filter capacitor Cst2, the negative input end of the input end of the non-resonant switch capacitor circuit 313, and the negative output end of the output end of the non-resonant switch capacitor circuit 313. With this arrangement, the switch capacitor circuit in the embodiment of the present application can be implemented using a non-resonant switch capacitor circuit 313 with a simple structure. Moreover, in actual applications, the circuit structure of the non-resonant switch capacitor circuit 313 is relatively mature. By setting the switch capacitor circuit in the present application as a non-resonant switch capacitor circuit 313, it is relatively simple to implement, which can reduce the design difficulty and reduce the production cost.

[0079] FIG5 is a signal timing diagram of a switch capacitor circuit provided in an embodiment of the present application. Referring to FIG5 , the first switch signal Φ1, the second switch signal Φ2, the third switch signal Φ3, and the fourth switch signal Φ4 can be pulse width modulation (PWM) signals, respectively. Taking the resonant switch capacitor circuit 311 shown in FIG4a as an example, the first switch signal Φ1 controls the conduction and disconnection of the first switch tube Q1, the second switch signal Φ2 controls the conduction and disconnection of the second switch tube Q2, the third switch signal Φ3 controls the conduction and disconnection of the third switch tube Q3, and the fourth switch signal Φ4 controls the conduction and disconnection of the fourth switch tube Q4. The above-mentioned switching frequency may refer to the frequency of the first switch signal Φ1, the second switch signal Φ2, the third switch signal Φ3, and the fourth switch signal Φ4, and the frequencies of the first switch signal Φ1, the second switch signal Φ2, the third switch signal Φ3, and the fourth switch signal Φ4 are the same. During operation, if the first switch tube Q1, the second switch tube Q2, the third switch tube Q3, and the fourth switch tube Q4 are turned on under the control of a high-level signal and turned off under the control of a low-level signal, the first switch tube Q1 and the third switch tube Q3 can be controlled to be turned on in phase, the second switch tube Q2 and the fourth switch tube Q4 can be controlled to be turned on in phase, and the first switch tube Q1 and the second switch tube Q2 are turned on in reverse phase, and the third switch tube Q3 and the fourth switch tube Q4 are turned on in reverse phase, thereby achieving the voltage Umid being stepped down to the voltage Uout and then output. In addition, for the resonant switched capacitor circuit 311, the working mode of the first switch tube Q1 to the third switch tube Q4 can be adjusted by adjusting one or more of the duty cycle, switching frequency, and phase of the signals Φ1 to Φ4, thereby adjusting the output voltage Uout. In addition, the working process of the resonant switched capacitor circuit 312 and the non-resonant switched capacitor circuit 313 can refer to the working process of the resonant switched capacitor circuit 311, and the specific details are not repeated here.

[0080] Based on this, in embodiments of the present application, the operation of the switched capacitor circuit can be controlled by controlling one or more of the switching frequency and phase of the switching signal. Furthermore, in the present application, the switching frequencies corresponding to the switched capacitor circuits in the same switched capacitor module can be the same, thereby enabling unified control of the switched capacitor circuits in the same switched capacitor module and avoiding voltage fluctuations.

[0081] Moreover, since the switched capacitor module is used in low-voltage and high-current application scenarios, in actual work, when the load changes slightly (for example, the load does not short-circuit), the current input by the load will be relatively stable, so that the voltage input by the load (which can be regarded as voltage Uout) is usually relatively stable. However, when the load changes greatly (for example, the load short-circuits), the current input by the load will change accordingly (for example, increase), causing the voltage input by the load (which can be regarded as voltage Uout) to fluctuate, especially when the current input by the load changes greatly, it will cause the voltage input to the first chip to drop or overshoot. However, the current change time Δt of the current input by the first chip 211 (i.e., the load) is usually very fast. In order to improve the problem of voltage drop or overshoot of the input to the first chip, when controlling the Q switched capacitor modules, it is necessary to transfer the capacity of the input side to the output side as quickly as possible. Moreover, since the greater the switching frequency, the faster the energy transfer, there is a certain relationship between the switching frequency and the current change time Δt.

[0082] In some embodiments, the Q switched capacitor modules can be staggered to enable the Q switched capacitor modules to operate in staggered parallel. Furthermore, when the Q switched capacitor modules are staggered, the inverse of the time of change of the current of the first chip 211 (i.e., the load) (i.e., 1 / Δt) can be limited to less than Q*N*Fsw, which can reduce the equivalent output impedance, thereby enabling each switched capacitor circuit to complete at least one switching cycle within the time of Δt, thereby achieving real-time rapid provision of load dynamic current from input to output, reducing the delay time of the loop response, and improving the dynamic performance of the chip. Wherein, Fsw represents the switching frequency of the switched capacitor circuit, and Δt represents the time of change of the current.

[0083] For example, taking the resonant switched capacitor circuit 312 shown in FIG4b as an example, combined with the equivalent circuit diagram shown in FIG6, FIG6(a) is an equivalent circuit when the first switch tube Q1 and the third switch tube Q3 are turned on at the same time, ZO is the total equivalent resistance of the resonant switched capacitor circuit 312 when it is working, IO is the current at the output end of the resonant switched capacitor circuit 312, wherein Veq = Umid / 2, Uout = Veq-IO*R ZO , R ZO Represents the resistance value of the total equivalent resistance ZO.

[0084] (b) in Figure 6 is the equivalent circuit of the resonant switched capacitor circuit 312 when the inverse of the change time of the current of the first chip 211 (i.e., the load) is limited to less than Q*N*Fsw. The equivalent resistance ZOE represents the sum of the equivalent resistance of the first switch tube Q1, the equivalent resistance of the third switch tube Q3, and the equivalent series resistance of the energy storage capacitor Ces, ZLx represents the equivalent series resistance of the inductor Lx, Cces represents the equivalent capacitance of the energy storage capacitor Ces, Ccst represents the total equivalent capacitance when the first filter capacitor Cst1 and the second filter capacitor Cst2 are connected in parallel, and Zcst represents the equivalent series resistance of the total equivalent capacitance Ccst.

[0085] The equivalent resistance values ​​R of the first to fourth switch tubes Q1 to Q4 are on Taking the same example, R ZOE =2R on +R ces , R ZOE Represents the resistance value of the equivalent resistor ZOE, R ces Represents the resistance value of the equivalent series resistance of the energy storage capacitor Ces.

[0086] R Zcst =(R cst1 *R cst2 ) / (R cst1 +R cst2 ), R Zcst Represents the resistance value of the equivalent series resistance Zcst, R cst1 represents the equivalent series resistance of the first filter capacitor Cst1, R cst2 Represents the resistance value of the equivalent series resistance of the second filter capacitor Cst2.

[0087] C ccst =C cst1 +C cst2 , C ccst Represents the capacitance value of the total equivalent capacitance Ccst, C cst1 represents the capacitance value of the first filter capacitor Cst1, C cst2 Represents the capacitance value of the second filter capacitor Cst2.

[0088] And, R ZO =(R A *R B ) / (R A +R B ) / (Q*N), R A =R Zcst +1 / (s*C ccst ), R B =R ces +2R on +s*Llx +1 / (s*C cces ), C cces represents the capacitance value of the equivalent capacitance of the energy storage capacitor Ces, s represents the Laplace transform coefficient, and Llx represents the inductance value of the inductor Lx. In addition, when the second switch tube Q2 and the fourth switch tube Q4 are turned on at the same time, R ZO The same reasoning can be obtained, so I will not elaborate on it here.

[0089] (c) in FIG6 is an equivalent circuit when the reciprocal of the change time of the current of the first chip 211 (i.e., the load) (i.e., 1 / Δt) is limited to be greater than Q*N*Fsw, and the resonant switched capacitor circuit 312 is working. Ccst represents the total equivalent capacitance when the first filter capacitor Cst1 and the second filter capacitor Cst2 are connected in parallel, and Zcst represents the equivalent series resistance of the total equivalent capacitance Ccst. Where, R Zcst =R cst1 *R cst2 ) / (R cst1 +R cst2 ), C ccst =C cst1 +C cst2 . And, R ZO =[R Zcst +1 / (s*C ccst )] / (Q*N), where s represents the Laplace transform coefficient. Furthermore, when 1 / Δt>Q*N*Fsw, each switch in each switched capacitor circuit can be made open-circuited during the time Δt.

[0090] For example, taking the non-resonant switched capacitor circuit 313 shown in FIG4c as an example, combined with the equivalent circuit diagram shown in FIG7, FIG7(a) is the equivalent circuit of the non-resonant switched capacitor circuit 313 when it is working, ZO is the total equivalent resistance of the non-resonant switched capacitor circuit 313 when it is working, IO is the current at the output end of the non-resonant switched capacitor circuit 313, wherein Veq = Umid / 2, Uout = Veq-IO*R ZO , R ZO Represents the resistance value of the total equivalent resistance ZO.

[0091] (b) in Figure 7 is an equivalent circuit when the non-resonant switched capacitor circuit 313 is working (taking the case where the first switch tube Q1 and the third switch tube Q3 are turned on at the same time as an example) when the inverse of the change time of the current of the first chip 211 (i.e., the load) (i.e., 1 / Δt) is limited to less than Q*N*Fsw. The equivalent resistance ZOE represents the sum of the equivalent resistance of the first switch tube Q1, the equivalent resistance of the third switch tube Q3, and the equivalent series resistance of the energy storage capacitor Ces, Cces represents the equivalent capacitance of the energy storage capacitor Ces, Ccst represents the total equivalent capacitance when the first filter capacitor Cst1 and the second filter capacitor Cst2 are connected in parallel, and Zcst represents the equivalent series resistance of the total equivalent capacitance Ccst.

[0092] The equivalent resistance values ​​R of the first to fourth switch tubes Q1 to Q4 are on Taking the same example, R ZOE =2R on +R ces , R ZOE Represents the resistance value of the equivalent resistor ZOE, R ces Represents the resistance value of the equivalent series resistance of the energy storage capacitor Ces.

[0093] R Zcst =(R cst1 *R cst2 ) / (R cst1 +R cst2 ), R Zcst Represents the resistance value of the equivalent series resistance Zcst, R cst1 represents the equivalent series resistance of the first filter capacitor Cst1, R cst2 Represents the resistance value of the equivalent series resistance of the second filter capacitor Cst2.

[0094] C ccst =C cst1 +C cst2 , C ccst Represents the capacitance value of the total equivalent capacitance Ccst, C cst1 represents the capacitance value of the first filter capacitor Cst1, C cst2 Represents the capacitance value of the second filter capacitor Cst2.

[0095] And, R ZO =(R A *R B ) / (R A +R B ) / (Q*N), R A =R Zcst +1 / (s*C ccst ), R B =R ces +2R on+1 / (s*C cces ), C cces represents the capacitance value of the equivalent capacitance of the energy storage capacitor Ces, and s represents the Laplace transform coefficient. In addition, when the second switch tube Q2 and the fourth switch tube Q4 are turned on at the same time, R ZO The same reasoning can be obtained, so I will not elaborate on it here.

[0096] (c) in FIG7 is an equivalent circuit when the inverse of the change time of the current of the first chip 211 (i.e., the load) (i.e., 1 / Δt) is limited to be greater than Q*N*Fsw, and the non-resonant switched capacitor circuit 313 is working. Ccst represents the total equivalent capacitance when the first filter capacitor Cst1 and the second filter capacitor Cst2 are connected in parallel, and Zcst represents the equivalent series resistance of the total equivalent capacitance Ccst. Where, R Zcst =R cst1 *R cst2 ) / (R cst1 +R cst2 ), C ccst =C cst1 +C cst2 . And, R ZO =[R Zcst +1 / (s*C ccst )] / (Q*N), where s represents the Laplace transform coefficient. Furthermore, when 1 / Δt>Q*N*Fsw, each switch in each switched capacitor circuit can be made open-circuited during the time Δt.

[0097] In summary, in combination with Figures 6 and 7, regardless of whether the switching capacitor circuit in the present application is set as a resonant switching capacitor circuit or a non-resonant switching capacitor circuit, when Q switching capacitor modules are connected in parallel and the Q switching capacitor modules are staggered, the equivalent output impedance of each switching capacitor circuit can be reduced by limiting the inverse of the change time of the current of the first chip 211 (i.e., the load) (i.e., 1 / Δt) to less than Q*N*Fsw, so that each switching capacitor circuit can complete the switching of at least one switching cycle within the time of Δt, thereby realizing that the Q switching capacitor modules can quickly provide load dynamic current from input to output in real time.

[0098] In other embodiments, the Q switching capacitor modules can also be controlled in phase so that the Q switching capacitor modules can work in parallel in phase. In addition, when the Q switching capacitor modules are controlled in phase, the inverse of the change time of the current of the first chip 211 (i.e., the load) (i.e., 1 / Δt) can be limited to less than N*Fsw, which can reduce the equivalent output impedance, so that each switching capacitor circuit can complete the switching of at least one switching cycle within the time of Δt, thereby realizing real-time rapid provision of load dynamic current from input to output, reducing the delay time of the loop response, and improving the dynamic performance of the chip. Wherein, Fsw represents the switching frequency of the switching capacitor circuit, and Δt represents the change time of the current.

[0099] Furthermore, when the Q switching capacitor modules are in phase control, when the switching capacitor circuit in the embodiment of the present application is set to a resonant switching capacitor circuit (e.g., 312), its equivalent circuit can also be shown in FIG6, wherein, when the inverse of the change time of the current of the first chip 211 (i.e., the load) (i.e., 1 / Δt) is limited to less than N*Fsw, R ZO =(R A *R B ) / (R A +R B ) / N,R A =R Zcst +1 / (s*C ccst ), R B =R ces +2R on +s*L lx +1 / (s*C cces When the inverse of the change time of the current of the first chip 211 (ie, the load) (ie, 1 / Δt) is limited to be greater than N*Fsw, R ZO =[R Zcst +1 / (s*C ccst )] / N.

[0100] And, when the Q switching capacitor modules are in-phase controlled, when the switching capacitor circuit in the embodiment of the present application is set to a non-resonant switching capacitor circuit (for example, 313), its equivalent circuit can also be shown in FIG7, wherein, when the inverse of the change time of the current of the first chip 211 (ie, the load) (ie, 1 / Δt) is limited to less than N*Fsw, R ZO =(R A *R B ) / (R A +R B ) / N,R A =R Zcst +1 / (s*C ccst ), R B =R ces +2Ron +1 / (s*C cces When the inverse of the change time of the current of the first chip 211 (ie, the load) (ie, 1 / Δt) is limited to be greater than N*Fsw, R ZO =[R Zcst +1 / (s*C ccst )] / N.

[0101] In summary, regardless of whether the switching capacitor circuit in the present application is set as a resonant switching capacitor circuit or a non-resonant switching capacitor circuit, when Q switching capacitor modules are connected in parallel and the Q switching capacitor modules are controlled in phase, the equivalent output impedance of each switching capacitor circuit can be reduced by limiting the inverse of the change time of the current of the first chip 211 (i.e., the load) (i.e., 1 / Δt) to less than Q*N*Fsw, so that each switching capacitor circuit can complete the switching of at least one switching cycle within the time of Δt, thereby enabling the Q switching capacitor modules to quickly provide load dynamic current from input to output in real time.

[0102] In addition, when the Q switching capacitor modules are out of phase control, the inverse of the change time of the current of the first chip 211 (i.e., the load) (i.e., 1 / Δt) can be limited to less than Q*N*Fsw. And, when the Q switching capacitor modules are in phase control, the inverse of the change time of the current of the first chip 211 (i.e., the load) (i.e., 1 / Δt) can be limited to less than N*Fsw. With this setting, the switching frequency of the switching capacitor circuit can be obtained, and the operation of the switching capacitor circuit can be controlled based on the switching frequency, which can enable the switching capacitor module to respond to voltage conversion in time and improve dynamic performance and response rate. And, based on the switching frequency, the operation of the switching capacitor circuit can be controlled, which can not only improve dynamic performance and response rate, but also reduce the output capacitance in the switching capacitor circuit, thereby saving costs, reducing single board area, and reducing product volume.

[0103] For example, the current change time Δt can be the time between two adjacent stable states of the current input by the load. For example, the current change time Δt can be the current rise time t r Or current fall time t f The current change time Δt is explained below in conjunction with Figure 8. Referring to Figure 8, I1, I2, and I3 represent the currents of the load input in a stable state. In actual applications, due to changes in the load, the load input current increases from I1 to I2. The time between the current increasing from I1 to I2 is the current rise time t r However, in actual applications, due to changes in load, the load input current may also decrease from I2 to I3. The time between the current decreasing from I2 to I3 is the current fall time t fIn addition, it is understandable that, in practical applications, a current detection device or an existing current detection method can be used to detect the change in the load input current, thereby obtaining the current change time Δt through the detected change in the load input current.

[0104] It is worth mentioning that the switched capacitor module in the embodiment of the present application is integrated with multiple switched capacitor circuits. Since the switched capacitor circuit is generally higher than the conversion efficiency of the LLC resonant converter and the CDR under the same working conditions, the conversion efficiency of the switched capacitor module in the embodiment of the present application is also higher, thereby improving the power supply efficiency. In addition, by forming a switched capacitor module in parallel with multiple switched capacitor circuits, it is possible not only to expand the output current capacity of the switched capacitor module, but also to achieve the equivalent switching frequency of the switched capacitor module (equivalent switching frequency equal to N*Fsw) without additionally increasing the switching frequency of each switched capacitor circuit, thereby reducing the pulsating current, improving the current stability, and reducing the voltage fluctuation, thereby improving the power supply performance of the chip. In addition, it is possible to ensure a lower ripple while not increasing the switching frequency of the switched capacitor circuit, thereby not increasing more switching losses and driving losses. In addition, in actual operation, the voltage Uout output by the switched capacitor module fluctuates due to changes in the load, especially when the load current has a large mutation, which will cause the voltage input to the first chip to drop or overshoot. For this problem, it is usually possible to increase the switching frequency and increase the control bandwidth to improve the dynamic performance of the power supply. However, in the embodiment of the present application, the switching frequency of a single switched capacitor circuit is not additionally increased. Instead, multiple switched capacitor circuits are connected in parallel to increase the equivalent switching frequency of the switched capacitor module, which can also help to increase the control bandwidth.

[0105] Furthermore, the transformation ratio of the switched capacitor module 232 is typically n:1. By using multiple switched capacitor circuits in parallel to form the switched capacitor module 232, a high input voltage can be converted to a low output voltage, and a high output current and high dynamic range can be converted to a low input current and low dynamic range. This improves the dynamic control performance of the combined DC-DC converter circuit 231 and the switched capacitor module 232, thereby improving the power supply performance of the chip. Furthermore, the switched capacitor module 232 can rapidly transfer energy from the high-voltage input side to the low-voltage output side, achieving transient input and output current response and outputting high current to the first chip 211.

[0106] Also, the voltage conversion circuit in the embodiment of the present application can be applied in the step-down scenario. The voltage input to the voltage conversion circuit is usually high. Since the load needs to have a high dynamic response, the voltage conversion circuit is required to convert the input voltage to the output side as quickly as possible. Since the switching frequency is higher, the energy conversion is faster, and a higher switching frequency is required, resulting in higher switching losses and reduced efficiency. In addition, the voltage input to the voltage conversion circuit is high, and the voltage withstand performance requirements of the switch tube are also high (easy to break down the switch tube), and the cost is high. For this reason, the present application adopts a two-stage structure to form a voltage conversion circuit. The input voltage of the first stage (i.e., the DC-DC conversion circuit) is high, and the input voltage of the second stage (i.e., the switched capacitor module) is low. Since the input voltage of the first stage is high, in order to reduce the voltage withstand performance requirements of the switch tube, the switching frequency of the first stage can be set lower, thereby reducing the voltage withstand performance requirements of the switch tube in the first stage, and reducing the switching loss of the first stage, thereby improving system efficiency. The second stage is provided with multiple switched capacitor circuits, and it is not necessary to increase the switching frequency of each switched capacitor circuit. By connecting multiple switched capacitor circuits in parallel and controlling the operation of these switched capacitor circuits, the equivalent switching frequency of the switched capacitor module (equivalent switching frequency is equal to N*Fsw) can be increased, so that the voltage can be quickly converted from the input side to the output side to meet the dynamic performance and response rate required by the load. In addition, since the switching frequency of each switched capacitor circuit is not increased, that is, on the basis of increasing the equivalent switching frequency, the switching loss is not increased, which is equivalent to reducing the switching loss and improving efficiency. Therefore, the present application adopts a two-stage architecture to form a voltage conversion circuit, which can meet the dynamic performance and response rate required by the load and improve efficiency.

[0107] In an embodiment of the present application, the dynamic performance of the chip can be improved by performing phase-shifting control on Q switched capacitor modules. Among them, the switch tube at the same position of each switched capacitor circuit in different switched capacitor modules is used as the target switch tube, and the phase-shifting control can be such that the switching signals corresponding to the target switch tubes are sequentially staggered by a certain phase difference. For example, the target switch tubes of the N switched capacitor circuits in the same switched capacitor module are sequentially staggered by the same phase difference ΔΦ1, and ΔΦ1 can be 180 / N degrees. Based on this, the target switch tubes of different switched capacitor modules can be controlled in phase or in phase. It is understandable that, taking the structures shown in Figures 4a to 4c as an example, the target switch tube can be the first switch tube Q1, the second switch tube Q2, the third switch tube Q3 or the fourth switch tube Q4.

[0108] Taking the target switch tube as the first switch tube Q1 and the switching signal corresponding to the first switch tube Q1 as an example, the following method can be used to perform phase-shifting control on Q switched capacitor modules:

[0109] In the first way, the first switching signals Φ1 corresponding to the N switching capacitor circuits in the same switching capacitor module are staggered with the same phase difference ΔΦ1 in sequence, and the first switching signals Φ1 corresponding to different switching capacitor modules are also staggered with the same phase difference ΔΦ2 in sequence. Among them, ΔΦ1 can be 180 / N degrees. And, ΔΦ2 can be 180 / (Q*N) degrees, or, ΔΦ2 can also be 180 / N degrees, or, ΔΦ2 can also be other values, which are not limited here. For example, taking Q=2 and N=2 as an example, refer to Figure 9a, Figure 9a is a signal timing diagram of the switching capacitor module provided in an embodiment of the present application, Φ1_11 represents the first switching signal of the switching capacitor circuit 23211_1 in the switching capacitor module 2321_1, Φ1_12 represents the first switching signal of the switching capacitor circuit 23211_2 in the switching capacitor module 2321_1, Φ1_21 represents the first switching signal of the switching capacitor circuit 23211_1 in the switching capacitor module 2321_2, and Φ1_22 represents the switching capacitor. The first switching signal of the switched capacitor circuit 23211_2 in the switched capacitor module 2321_2 is represented by I_11, which represents the current output by the switched capacitor circuit 23211_1 in the switched capacitor module 2321_1, I_12 represents the current output by the switched capacitor circuit 23211_2 in the switched capacitor module 2321_1, I_21 represents the current output by the switched capacitor circuit 23211_1 in the switched capacitor module 2321_2, and I_22 represents the current output by the switched capacitor circuit 23211_2 in the switched capacitor module 2321_4. The phase difference ΔΦ between Φ1_11 and Φ1_12 is 90°, the phase difference ΔΦ between Φ1_21 and Φ1_22 is also 90°, the phase difference ΔΦ between Φ1_11 and Φ1_21 is also 90°, and the phase difference ΔΦ between Φ1_12 and Φ1_22 is also 90°, thereby achieving staggered phase control.

[0110] In the second way, the first switching signals Φ1 corresponding to the N switching capacitor circuits in the same switching capacitor module are staggered in sequence with the same phase difference ΔΦ1, and the phases of the first switching signals Φ1 corresponding to different switching capacitor modules are the same. And, ΔΦ1 is 180 / N degrees. For example, taking Q=2 and N=2 as an example, referring to Figure 9b, Figure 9b is another signal timing diagram of the switching capacitor module provided in an embodiment of the present application, Φ1_11 represents the first switching signal of the switching capacitor circuit 23211_1 in the switching capacitor module 2321_1, Φ1_12 represents the first switching signal of the switching capacitor circuit 23211_2 in the switching capacitor module 2321_1, Φ1_21 represents the first switching signal of the switching capacitor circuit 23211_1 in the switching capacitor module 2321_2, and Φ1_22 represents the switch The first switching signal of the switched capacitor circuit 23211_2 in the capacitor module 2321_2, I_11 represents the current output by the switched capacitor circuit 23211_1 in the switched capacitor module 2321_1, I_12 represents the current output by the switched capacitor circuit 23211_2 in the switched capacitor module 2321_1, I_21 represents the current output by the switched capacitor circuit 23211_1 in the switched capacitor module 2321_2, and I_22 represents the current output by the switched capacitor circuit 23211_2 in the switched capacitor module 2321_4. The phase difference ΔΦ between Φ1_11 and Φ1_12 is 90°, and the phase difference ΔΦ between Φ1_21 and Φ1_22 is also 90°. Φ1_11 and Φ1_21 are in phase, and Φ1_12 and Φ1_22 are also in phase, thereby achieving staggered phase control.

[0111] In the embodiment of the present application, the dynamic performance of the chip can also be improved by performing in-phase control on Q switched capacitor modules. The switch transistors at the same position in each switched capacitor circuit in different switched capacitor modules are used as target switches. The in-phase control can be to ensure that the phases of the switching signals corresponding to the target switches are the same. It is understood that, taking the structures shown in Figures 4a to 4c as an example, the target switch transistors can be the first switch transistor Q1, the second switch transistor Q2, the third switch transistor Q3, or the fourth switch transistor Q4.

[0112] Taking the first switching signal Φ1 as an example, the following method can be used to control the Q switching capacitor modules in the same phase: the phases of the first switching signals Φ1 corresponding to the N switching capacitor circuits in the same switching capacitor module are the same, and the phases of the first switching signals Φ1 corresponding to different switching capacitor modules are the same. For example, taking Q=2 and N=2 as an example, referring to Figure 9c, Figure 9c is another signal timing diagram of the switching capacitor module provided in an embodiment of the present application, Φ1_11 represents the first switching signal of the switching capacitor circuit 23211_1 in the switching capacitor module 2321_1, Φ1_12 represents the first switching signal of the switching capacitor circuit 23211_2 in the switching capacitor module 2321_1, Φ1_21 represents the first switching signal of the switching capacitor circuit 23211_1 in the switching capacitor module 2321_2, and Φ1_22 represents the switching The first switching signal of the switched capacitor circuit 23211_2 in the capacitor module 2321_2, I_11 represents the current output by the switched capacitor circuit 23211_1 in the switched capacitor module 2321_1, I_12 represents the current output by the switched capacitor circuit 23211_2 in the switched capacitor module 2321_1, I_21 represents the current output by the switched capacitor circuit 23211_1 in the switched capacitor module 2321_2, and I_22 represents the current output by the switched capacitor circuit 23211_2 in the switched capacitor module 2321_4. The phases of Φ1_11, Φ1_12, Φ1_21, and Φ1_22 are all the same, thereby achieving in-phase control.

[0113] The switch tube in the embodiment of the present application can be one or more of various types of switching devices such as a metal oxide semiconductor field effect transistor (MOSFET), a bipolar junction transistor (BJT), an insulated gate bipolar transistor (IGBT), a silicon carbide (SiC) MOSFET, etc., which are not listed one by one in the embodiment of the present application. In addition, each switch tube can include a first electrode, a second electrode and a control electrode, wherein the control electrode is used to control the closing or opening of the switch tube. When the switch tube is closed, current can be transmitted between the first electrode and the second electrode of the switch tube. When the switch tube is disconnected, current cannot be transmitted between the first electrode and the second electrode of the switch tube. Taking MOSFET as an example, the control electrode of the switch tube is the gate, the first electrode of the switch tube can be the source, the second electrode can be the drain, or the first electrode can be the drain and the second electrode can be the source.

[0114] It can be understood that the above is only an example to illustrate the specific structure of the resonant switched capacitor circuit and the non-resonant switched capacitor circuit provided in the embodiments of the present application. In specific implementation, the specific structure of the resonant switched capacitor circuit and the non-resonant switched capacitor circuit is not limited to the above structure provided in the embodiments of the present application, and can also be other structures known to those skilled in the art, which is not limited here.

[0115] Since the voltage Uout output by the switched capacitor module fluctuates due to changes in the load during actual operation, in order to reduce the fluctuation, the voltage Uout can also be adjusted to compensate for the dynamic performance of the first chip (i.e., the load). The following example illustrates the control method for achieving the compensation voltage Uout.

[0116] The first control mode: The DC-DC conversion circuit 231 can adjust the voltage of its own output terminal according to the voltage Umid output by its output terminal. For example, referring to Figure 10a, Figure 10a is a circuit diagram of a control mode in an embodiment of the present application. The DC-DC conversion circuit 231 only obtains the voltage Umid of its output terminal and uses the voltage Umid as the feedback voltage Uf2, so that the DC-DC conversion circuit 231 can determine whether the feedback voltage Uf2 meets the first voltage threshold based on the relationship between the feedback voltage Uf2 and the first voltage threshold. Among them, if the feedback voltage Uf2 does not meet the first voltage threshold, there are two cases: the feedback voltage Uf2 is greater than the first voltage threshold, and the feedback voltage Uf2 is less than the first voltage threshold. When the feedback voltage Uf2 is greater than the first voltage threshold, the voltage at the output terminal of the DC-DC conversion circuit 231 is adjusted to obtain the adjusted voltage Umid. Based on this, the switched capacitor module 232 converts the voltage Uout according to the adjusted voltage Umid to achieve the compensation voltage Uout, improve the stability of the voltage Uout, and then dynamically determine the dynamic performance of the first chip 211 through the DC-DC conversion circuit 231. When the feedback voltage Uf2 is less than the first voltage threshold, the voltage at the output end of the DC-DC conversion circuit 231 can also be adjusted to obtain the adjusted voltage Umid. If the feedback voltage Uf2 meets the first voltage threshold, there is no need to adjust the voltage at the output end of the DC-DC conversion circuit 231, thereby reducing power consumption. It is understandable that the first voltage threshold can be ±ΔV1, and the feedback voltage Uf2 being greater than the first voltage threshold means that the feedback voltage Uf2 is greater than +ΔV1, and the feedback voltage Uf2 being less than the first voltage threshold means that the feedback voltage Uf2 is less than -ΔV1. In addition, the specific values ​​of ±ΔV1 can be determined according to the application scenario and are not limited here. Similarly, they will not be described one by one below.

[0117] Second control mode: The DC-DC conversion circuit 231 can also adjust the voltage of its own output terminal according to the voltage Uout output by the output terminal of the switch capacitor module 232. For example, referring to Figure 10b, Figure 10b is a circuit diagram of another control mode in an embodiment of the present application. It is also possible to make the DC-DC conversion circuit 231 only obtain the voltage Uout at the output terminal of the switch capacitor module 232, and use the voltage Uout as the feedback voltage Uf2, so that the DC-DC conversion circuit 231 can determine whether the feedback voltage Uf2 meets the second voltage threshold based on the relationship between the feedback voltage Uf2 and the second voltage threshold. If the feedback voltage Uf2 does not meet the second voltage threshold, there are two cases: the feedback voltage Uf2 is greater than the second voltage threshold, and the feedback voltage Uf2 is less than the second voltage threshold. When the feedback voltage Uf2 is greater than the second voltage threshold, the voltage at the output terminal of the DC-DC conversion circuit 231 is adjusted to obtain the adjusted voltage Umid. The rest of the working process of this control mode can refer to the description in the first control mode and will not be repeated here. Furthermore, by directly using voltage Uout as feedback voltage Uf2 to adjust the voltage output by the DC-DC converter circuit 231, the voltage at its output terminal is maintained stable through voltage regulation. This improves the accuracy of the compensation voltage Uout and further enhances the stability of voltage Uout. If the feedback voltage Uf2 is less than the second voltage threshold, the voltage at the output terminal of the DC-DC converter circuit 231 can also be adjusted to obtain an adjusted voltage Umid. If the feedback voltage Uf2 meets the second voltage threshold, there is no need to adjust the voltage at the output terminal of the DC-DC converter circuit 231, thereby reducing power consumption. It is understood that the second voltage threshold can be ±ΔV2, and a feedback voltage Uf2 greater than the second voltage threshold means that the feedback voltage Uf2 is greater than +ΔV2, and a feedback voltage Uf2 less than the second voltage threshold means that the feedback voltage Uf2 is less than -ΔV2. In addition, the specific values ​​of ±ΔV2 can be determined based on the application scenario and are not limited here. Similarly, no detailed description will be given below.

[0118] The third control method: Compared with the DC-DC conversion circuit 231, the switched capacitor module 232 can quickly respond to the voltage Uout at its output end. Based on this, the switched capacitor module 232 and the DC-DC conversion circuit 231 can be used to regulate the voltage at its output end respectively. For example, referring to Figure 10c, Figure 10c is a circuit diagram of another control method in an embodiment of the present application. The DC-DC conversion circuit 231 only obtains the voltage Umid at its output end and uses the voltage Umid as the feedback voltage Uf2, so that the DC-DC conversion circuit 231 can adjust the voltage at the output end of the DC-DC conversion circuit 231 according to the relationship between the feedback voltage Uf2 and the first voltage threshold. If the feedback voltage Uf2 is greater than the first voltage threshold, the voltage at the output end of the DC-DC conversion circuit 231 is adjusted to obtain the adjusted voltage Umid. The switched capacitor module 232 obtains the voltage Uout of the output terminal of the switched capacitor module 232, and uses the voltage Uout as the feedback voltage Uf1, so that the switched capacitor module 232 can be adjusted according to the relationship between the feedback voltage Uf1 and the second voltage threshold. If the feedback voltage Uf1 is greater than the second voltage threshold, the voltage at the output terminal of the switched capacitor module 232 is adjusted to obtain the adjusted voltage Uout. Thus, the DC-DC converter circuit 231 adjusts the output voltage Umid based on the feedback of its own output terminal voltage Umid, and maintains the stability of its own output terminal voltage Umid by voltage regulation. Moreover, the switched capacitor module 232 adjusts the output voltage Uout based on the feedback of its own output terminal voltage Uout, and maintains the stability of its own output terminal voltage Uout by voltage regulation. Based on this, voltage regulation is performed separately in combination with the two-stage architecture, which can quickly stabilize the voltage Uout and thus improve the load voltage stability. Of course, if the feedback voltage Uf2 is less than the first voltage threshold, the voltage at the output terminal of the DC-DC converter circuit 231 can also be adjusted to obtain the adjusted voltage Umid. If the feedback voltage Uf1 is less than the second voltage threshold, the voltage at the output of the switched capacitor module 232 can also be adjusted to obtain the adjusted voltage Uout. If the feedback voltage Uf2 meets the first voltage threshold, there is no need to adjust the voltage at the output of the DC-DC converter circuit 231, thereby reducing power consumption. Furthermore, if the feedback voltage Uf1 meets the second voltage threshold, there is no need to adjust the voltage at the output of the switched capacitor module 232. It is understandable that the feedback voltage Uf1 being greater than the second voltage threshold means that the feedback voltage Uf1 is greater than +ΔV2, and the feedback voltage Uf1 being less than the second voltage threshold means that the feedback voltage Uf1 is less than -ΔV2.

[0119] The fourth control mode: Based on the third control mode, since the switched capacitor module 232 can quickly respond to the voltage Uout at its output end, rapid adjustment is achieved. Although the voltage Uout can be adjusted in this way, the switched capacitor module 232 will not be able to work at the optimal working efficiency point, which reduces efficiency. In order to make the switched capacitor module 232 work at the optimal working efficiency point again, the switched capacitor module 232 can send a linkage voltage regulation instruction to the DC-DC conversion circuit 231 to control the DC-DC conversion circuit 231 to adjust the voltage Umid at its output end so that the switched capacitor module 232 can work at the optimal power point. Based on this, on the basis of the switched capacitor module 232 and the DC-DC conversion circuit 231 respectively regulating the voltage based on the voltage at their own output ends, two-stage linkage control is achieved to improve the working efficiency of the switched capacitor module 232, thereby further improving the working efficiency of the system. For example, referring to Figure 10d, Figure 10d is a circuit diagram of another control method in an embodiment of the present application. The working process of the switching capacitor module 232 and the DC-DC conversion circuit 231 respectively regulating the voltage at their output terminals can refer to the content in the third control method, and the specific details are not repeated here. The two-stage linkage control process is described below. The switching capacitor module 232 can respond to the adjustment of the voltage at its output terminal and can send a linkage voltage regulation instruction UZ to the DC-DC conversion circuit 231. The DC-DC conversion circuit 231 can adjust the voltage Umid at the output terminal of the DC-DC conversion circuit 231 in response to the linkage voltage regulation instruction UZ. The switching capacitor module 232 then converts the adjusted voltage Uout according to the adjusted voltage Umid, thereby improving the stability of the voltage Uout and returning itself to the optimal working efficiency point.

[0120] In some examples, the switched capacitor module 232 can send a linkage voltage regulation instruction UZ carrying voltage reduction information to the DC-DC conversion circuit 231 in response to the switched capacitor module 232 adjusting the voltage Uout at its output end to be reduced. The DC-DC conversion circuit 231 can respond to the linkage voltage regulation instruction UZ carrying voltage reduction information to reduce the voltage Umid at the output end of the DC-DC conversion circuit 231, and the switched capacitor module 232 then converts the reduced voltage Uout according to the reduced voltage Umid. With this arrangement, since the switched capacitor module 232 adjusts the voltage reduction at its output end, it is necessary to control the DC-DC conversion circuit 231 to reduce the voltage at its output end so that the switched capacitor module 232 can operate at the optimal power point again.

[0121] In some other examples, the switched capacitor module 232 can send a linkage voltage regulation instruction UZ carrying boost information to the DC-DC conversion circuit 231 in response to the switched capacitor module 232 adjusting the voltage Uout at its output end to increase. The DC-DC conversion circuit 231 can increase the voltage Umid at the output end of the DC-DC conversion circuit 231 in response to the linkage voltage regulation instruction UZ carrying boost information. The switched capacitor module 232 then converts the increased voltage Uout according to the increased voltage Umid. With this arrangement, the switched capacitor module 232 needs to control the DC-DC conversion circuit 231 to increase the voltage at its output end due to the increase in the voltage at its output end, so that the switched capacitor module 232 can operate at the optimal power point again.

[0122] For example, in actual applications, the phase, switching frequency, and duty cycle corresponding to the switched capacitor circuit are set to set values, that is, the phase corresponds to the set value X0, the switching frequency corresponds to the set value F0, and the duty cycle corresponds to the set value Z0, so that the switched capacitor circuit can perform voltage conversion under the control of the set values ​​X0, F0, and Z0, and operate at the optimal efficiency point. However, when the switched capacitor module 232 adjusts its output voltage Uout, the set value X0 can be adjusted to the target value X0', the set value F0 can be adjusted to the target value F0', and the set value Z0 can be adjusted to the target value Z0', so that the output voltage Uout is adjusted to the first target voltage Uout'. Because the target values ​​X0', F0', and Z0' deviate from the corresponding set values ​​X0, F0, and Z0, respectively, the switched capacitor circuit in the switched capacitor module 232 does not operate at the optimal efficiency point. To this end, the switched capacitor module 232 sends a coordinated voltage regulation instruction to the DC-DC converter circuit 231. In response to the coordinated voltage regulation instruction, the DC-DC converter circuit 231 adjusts the voltage Umid at its output terminal to the second target voltage Umid'. Furthermore, after the voltage Umid at the output terminal of the DC-DC converter circuit 231 is adjusted to the second target voltage Umid', the switched capacitor module 232 can readjust the target values ​​X0', F0', and Z0' to the set values ​​X0, F0, and Z0, thereby enabling the switched capacitor circuit to operate at the optimal efficiency point and ensuring conversion efficiency. It is understandable that when the switched capacitor module 232 adjusts its output voltage Uout, it may only need to adjust the set value X0 to the target value X0', and then adjust the target value X0' back to the set value X0, or adjust the set value F0 to the target value F0', and then adjust the target value F0' back to the set value F0, or adjust the set value Z0 to the target value Z0', and then adjust the target value Z0' back to the set value Z0, or adjust the set values ​​X0, F0, and Z0 in pairs to the target value, and then adjust each target value back to the corresponding set value. The details are not repeated here. Based on this, the switched capacitor circuit can be adjusted to reduce or increase the voltage Uout by adjusting one or more of the phase, switching frequency, and duty cycle corresponding to the switched capacitor circuit.

[0123] The fifth control mode: The DC-DC conversion circuit 231 and the switched capacitor module 232 can also be respectively adjusted according to the voltage Uout at the output end of the switched capacitor module 232 to improve work efficiency and improve the dynamic performance of the chip. For example, referring to Figure 10e, Figure 10e is a circuit diagram of another control mode in an embodiment of the present application, and the difference between the working process of this control mode and the working process of the third control mode is that the DC-DC conversion circuit 231 obtains the voltage Uout at the output end of the switched capacitor module 232 and uses the voltage Uout as the feedback voltage Uf2, so that the DC-DC conversion circuit 231 can adjust the voltage Umid at the output end of the DC-DC conversion circuit 231 according to the relationship between the feedback voltage Uf2 and the second voltage threshold. If the feedback voltage Uf2 does not meet the second voltage threshold, the voltage Umid is adjusted to obtain the adjusted voltage Umid. The remaining working processes of this control mode and the working process of the third control mode are not described in detail here.

[0124] The sixth control method: Based on the fifth control method, since the switched capacitor module 232 can quickly respond to the voltage Uout at its output end, rapid adjustment is achieved. Although the voltage Uout can be adjusted in this way, the switched capacitor module 232 will not be able to work at the optimal working efficiency point. In order to make the switched capacitor module 232 work at the optimal working efficiency point again, the switched capacitor module 232 can send a linkage voltage adjustment instruction to the DC-DC conversion circuit 231 to control the DC-DC conversion circuit 231 to adjust the voltage Umid at its output end so that the switched capacitor module 232 can work at the optimal power point. Based on this, on the basis of the switched capacitor module 232 and the DC-DC conversion circuit 231 respectively adjusting the voltage based on the voltage Uout, two-stage linkage control is achieved to improve the working efficiency of the switched capacitor module 232, thereby further improving the working efficiency of the system. For example, referring to Figure 10f, Figure 10f is a circuit diagram of another control method in an embodiment of the present application. The working process of the switch capacitor module 232 and the DC-DC conversion circuit 231 for voltage regulation according to the voltage Uout can refer to the content of the fifth control method, and will not be described in detail here. The two-stage linkage control process is described below. The switch capacitor module 232 can respond to the adjustment of the voltage at its output end and can send a linkage voltage regulation instruction UZ to the DC-DC conversion circuit 231. The DC-DC conversion circuit 231 can adjust the voltage Umid at the output end of the DC-DC conversion circuit 231 in response to the linkage voltage regulation instruction UZ. The switch capacitor module 232 then converts the adjusted voltage Uout according to the adjusted voltage Umid, thereby improving the stability of the voltage Uout and returning itself to the optimal working efficiency point. The remaining working processes of this control method and the working process of the sixth control method are not described in detail here.

[0125] The seventh control method: In order to maintain the voltage Uout stable, the switched capacitor module 232 (especially the resonant switched capacitor circuit) directly adjusts the voltage Uout at its output end, which will reduce the efficiency of the switched capacitor module 232, thereby reducing the efficiency of the entire voltage conversion circuit. To this end, the DC-DC conversion circuit 231 can be adjusted based on the current IO at the output end of the switched capacitor module 232 to adjust the voltage Umid at the output end of the DC-DC conversion circuit, so that the switched capacitor module 232 converts a stable voltage Uout according to the adjusted Umid, thereby improving working efficiency. For example, referring to FIG10g, FIG10g is a circuit diagram of another control method in an embodiment of the present application, wherein the switched capacitor module 232 can feedback the current IO of the output terminal of the switched capacitor module 232 to the DC-DC conversion circuit 231. In order to stabilize Uout, the DC-DC conversion circuit 231 can calculate the voltage Umid that needs to be adjusted based on the current IO and the formula Umid=n*Uout+IO*n*ROw, thereby controlling the DC-DC conversion circuit 231 to work according to the calculated voltage Umid, so that the DC-DC conversion circuit 231 converts the voltage Uin into the adjusted voltage Umid, thereby converting the switched capacitor module 232 into a stable voltage Uout according to the adjusted Umid, thereby eliminating the need to control the switched capacitor module 232 for voltage regulation, thereby improving efficiency. Wherein, n represents the transformation ratio of the switched capacitor module 232, and Row represents the equivalent DC output resistance of the switched capacitor module 232 in steady state (i.e., the current input by the load is relatively stable).

[0126] In addition, based on this control method, when the input current of the load (i.e., the current IO at the output end of the switched capacitor module 232) changes, the voltage Umid is adjusted by the DC-DC conversion circuit 231, so that the switched capacitor module 232 can operate in a relatively ideal resonant mode within the full load range, satisfying zero voltage switching (Zero Voltage Switch, ZVS) or zero current switching (Zero Current Switch, ZCS), which can greatly improve the efficiency of the switched capacitor module 232, thereby improving the overall efficiency of the voltage conversion circuit. Compared with the solution without linked voltage regulation, the loss is reduced by 50% or more, the full load efficiency is increased by 8% or more, and the current density of the switched capacitor module 232 is increased by 40% or more. In addition, in actual applications, the full load efficiency can be increased by 5% or more, solving the problem of decreased voltage regulation efficiency of the resonant switched capacitor circuit. It can be used in computing scenarios to improve computing power or power consumption ratio and improve battery life.

[0127] The embodiment of the present application also compares the efficiency of the seventh control method with the control method in which the switched capacitor module 232 directly adjusts the voltage Uout at its output end through simulation. The simulation results refer to Figures 11a to 11c. Figure 11a is a schematic diagram of the simulation results of the efficiency of the entire voltage conversion circuit, Figure 11b is a schematic diagram of the simulation results of the efficiency of the switched capacitor module 232, and Figure 11c is a schematic diagram of the simulation results of the efficiency of the DC-DC conversion circuit 231. In Figures 11a to 11c, the solid line represents the efficiency of the voltage conversion circuit when using the seventh control method, and the dotted line represents the efficiency of the voltage conversion circuit when using the switched capacitor module 232 to directly adjust the voltage Uout at its output end. It can be seen from Figures 11a to 11c that when the voltage conversion circuit adopts the seventh control method, compared with the control method of adopting the switching capacitor module 232 to directly adjust the voltage Uout at its output end, the efficiency of the DC-DC conversion circuit 231 remains basically unchanged, the efficiency of the switching capacitor module 232 is improved (for example, increased by 9% or more), and the overall efficiency of the voltage conversion circuit is also improved (for example, increased by 8.5% or more).

[0128] Eighth control method: Based on the seventh control method, the voltage at the output end of the DC-DC converter circuit 231 can be adjusted according to the requirements of the first chip 211, so that the voltage at the output end of the switched capacitor module 232 meets the requirements of the first chip 211. For example, the DC-DC converter circuit 231 can adjust the voltage Umid at the output end of the DC-DC converter circuit based on the current IO at the output end of the switched capacitor module 232 and the first voltage regulation instruction output by the first chip 211, so that the switched capacitor module 232 converts the adjusted Umid into a stable voltage Uout, thereby improving work efficiency. For example, referring to FIG10h, FIG10h is a circuit diagram of another control method in an embodiment of the present application. The switched capacitor module 232 can feedback the current IO at the output end of the switched capacitor module 232 to the DC-DC converter circuit 231. In order to make Uout meet the requirements of the first chip 211, the DC-DC converter circuit 231 can calculate the voltage Umid that needs to be adjusted based on the first voltage regulation instruction output by the first chip 211, the current IO, and the formula Umid=n*Uout+IO*n*ROw+n*ΔVAVS. The DC-DC converter circuit 231 is controlled to operate according to the calculated voltage Umid, so that the DC-DC converter circuit 231 converts the voltage Uin into the adjusted voltage Umid, thereby causing the switched capacitor module 232 to convert the voltage Uout that meets the requirements of the first chip 211 according to the adjusted Umid. In this way, there is no need to control the switched capacitor module 232 for voltage regulation, thereby improving efficiency. Wherein, ΔVAVS is the voltage adjustment step obtained according to the first voltage regulation instruction. Exemplarily, ΔVAVS may be obtained through a formula or through a lookup table, which is not specifically limited herein.

[0129] For example, the first voltage regulation instruction may be sent by the first chip 211 to the DC-DC converter circuit 231 via a communication connection or physical continuity. Alternatively, the first voltage regulation instruction may be sent by the first chip 211 to the switched capacitor module 232 via a communication connection or physical continuity, and the switched capacitor module 232 may then send the instruction to the DC-DC converter circuit 231 via a communication connection or physical continuity.

[0130] In addition, based on this control method, when the output voltage Uout needs to be adjusted, the output voltage Umid is adjusted through the DC-DC conversion circuit 231, so that the output voltage Uout of the switched capacitor module 232 still operates near Umid / n, which is a relatively ideal resonant mode, meeting ZVS or ZCS, and can greatly improve the efficiency of the switched capacitor module 232, thereby ensuring high efficiency while meeting the wide range of changes in the output voltage Uout. In practical applications, it can improve the full load efficiency by 5% or more, solve the problem of reduced voltage regulation efficiency of the resonant switched capacitor circuit, and be used in computing scenarios to improve computing power or power consumption ratio, thereby improving battery life.

[0131] The embodiment of the present application also takes n=2 as an example, and compares the efficiency when the eighth control method is used to adjust the voltage Uout to 0.8V, 0.9V and 1.0V respectively through simulation. The simulation results refer to Figures 12a and 12b. Figure 12a is a schematic diagram of the simulation results of the efficiency of the entire voltage conversion circuit, and Figure 12b is a schematic diagram of the simulation results of the efficiency of the DC-DC conversion circuit 231. Among them, L11 represents the efficiency of the entire voltage conversion circuit when Uout is 0.8V, L12 represents the efficiency of the entire voltage conversion circuit when Uout is 0.9V, and L13 represents the efficiency of the entire voltage conversion circuit when Uout is 1.0V. L21 represents the efficiency of the entire voltage conversion circuit when Umid is 1.6V, L22 represents the efficiency of the entire voltage conversion circuit when Umid is 1.8V, and L23 represents the efficiency of the entire voltage conversion circuit when Umid is 2.0V. As shown in Figures 12a and 12b, when the voltage conversion circuit uses the eighth control method to adjust the voltage Uout to different values, the efficiency trend of the entire voltage conversion circuit is basically the same, with no significant change. Furthermore, the efficiency trend of the DC-DC conversion circuit 231 is also basically the same, with no significant change.

[0132] Ninth control method: The voltage at the output end of the DC-DC conversion circuit 231 can also be adjusted according to the needs of the first chip 211, so that the voltage at the output end of the switch capacitor module 232 meets the needs of the first chip 211. For example, referring to Figure 10i, Figure 10i is a circuit diagram of another control method in an embodiment of the present application. The DC-DC conversion circuit 231 can adjust the voltage Umid at its output end according to the second voltage regulation instruction output by the first chip 211, and then convert the adjusted voltage Umid into a voltage Uout through the switch capacitor module 232 to meet the voltage required by the first chip 211. Furthermore, in the process of the DC-DC conversion circuit 231 regulating the voltage according to the second voltage regulation instruction, the voltage Uout can be fine-tuned in combination with one of the control methods from the first control method to the sixth control method to improve the working efficiency of the switch capacitor module 232 and improve the dynamic performance of the chip.

[0133] The tenth control method: The voltage at the output end of the switch capacitor module 232 can also be adjusted according to the needs of the first chip 211 to meet the needs of the first chip 211. For example, referring to Figure 10j, Figure 10j is a circuit diagram of another control method in an embodiment of the present application. The switch capacitor module 232 can adjust the voltage Uout at its output end according to the third voltage regulation instruction output by the first chip 211 to meet the voltage required by the first chip 211. Furthermore, in the process of the switch capacitor module 232 regulating the voltage according to the third voltage regulation instruction, one of the control methods from the first control method to the sixth control method can be combined to fine-tune the voltage Uout to improve the working efficiency of the switch capacitor module 232 and improve the dynamic performance of the chip.

[0134] Furthermore, the ninth control method and the tenth control method can be combined with each other to further achieve fine-tuning of the output voltage Uout through linkage control, improve the working efficiency of the switch capacitor module, and improve the dynamic performance of the chip.

[0135] It is understandable that for the first and second control modes, since there is no need to control the switched capacitor circuit to fine-tune the output voltage Uout, based on this, the switched capacitor circuit in the switched capacitor module is set to a resonant switched capacitor circuit or a non-resonant switched capacitor circuit. However, for the third to tenth control modes, since it is necessary to control the switched capacitor circuit to fine-tune the output voltage Uout, based on this, the switched capacitor circuit is set to a resonant switched capacitor circuit to achieve fine-tuning of the output voltage Uout.

[0136] The switching capacitor module 232 in the present application can work alone, in parallel, in series, or flexibly in combination with other different power converters, including but not limited to the connection methods shown in Figures 13a to 13g below, and can also be a combination or a variation thereof.

[0137] Figure 13a is a structural block diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. Referring to Figure 13a, the voltage conversion circuit 230 includes multiple DC-DC conversion circuits 231 and multiple switching capacitor modules 232. The multiple DC-DC conversion circuits 231 and the multiple switching capacitor modules 232 can be connected one-to-one, and the output ends of the multiple switching capacitor modules 232 are all connected to the power pins of the first chip 211 to power the first chip 211.

[0138] Figure 13b is another structural block diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. Referring to Figure 13b, the voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switching capacitor module 232 connected to each other, and the switching capacitor module 232 is connected to the first chip 211 to provide power to the first chip 211.

[0139] Figure 13c is another structural block diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. Referring to Figure 13c, the voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and multiple switching capacitor modules 232. The input ends of the multiple switching capacitor modules 232 are connected in parallel to the input end of the DC-DC conversion circuit 231, and the output ends of the multiple switching capacitor modules 232 are all connected to the power pins of the first chip 211 to power the first chip 211.

[0140] Figure 13d is another structural block diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. Referring to Figure 13d, the voltage conversion circuit 230 includes multiple DC-DC conversion circuits 231 and multiple switching capacitor modules 232. There are also multiple first chips 211. The multiple DC-DC conversion circuits 231, the multiple switching capacitor modules 232 and the multiple first chips 211 are connected one-to-one, so that the corresponding first chips 211 are powered by the DC-DC conversion circuits 231 and the switching capacitor modules 232.

[0141] Figure 13e is another structural block diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. Referring to Figure 13e, the voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and multiple switching capacitor modules 232. The first chip 211 is also one. The multiple switching capacitor modules 232 can be connected in series in sequence and then connected to the first chip 211 to power the first chip 211.

[0142] Figure 13f is another structural block diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. Referring to Figure 13f, the voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and multiple switching capacitor modules 232. There are also multiple first chips 211. The multiple switching capacitor modules 232 and the multiple first chips 211 can be connected one-to-one, and the input ends of the multiple switching capacitor modules 232 are all connected to the output ends of the DC-DC conversion circuit 231 to provide power for each first chip 211.

[0143] FIG13g is another structural block diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. Referring to FIG13g, the voltage conversion circuit 230 includes a DC-DC conversion circuit 231, one or more switched capacitor modules 232, and one or more DC converters 233. There are one or more first chips 211, and the voltage conversion circuit further includes one or more second chips 212, wherein the one or more switched capacitor modules 232 and the one or more first chips 211 can be connected one-to-one, and the input end of the switched capacitor module 232 is connected to the output end of the DC-DC conversion circuit 231 to realize power supply for each first chip 211. The one or more DC converters 233 and the one or more second chips 212 can be connected one-to-one, and the input end of the DC converter 233 is connected to the output end of the DC-DC conversion circuit 231 to realize power supply for each second chip 212. For example, the DC converter 233 can have the same structure as the DC-DC conversion circuit.

[0144] The specific structure of the voltage conversion circuit provided in the embodiment of the present application is described in detail below with reference to a specific structural schematic diagram.

[0145] FIG14a is a schematic structural diagram of a voltage conversion circuit and a first chip provided in an embodiment of the present application, and FIG14b is a schematic equivalent circuit diagram of the voltage conversion circuit and the first chip shown in FIG14a. Referring to FIG14a and FIG14b, in an embodiment of the present application, the voltage conversion circuit includes: a first substrate 221, a second substrate 222, a first chip 211 (i.e., a load), and a voltage conversion circuit 230. Among them, the second substrate 222 is arranged on the first substrate 221, and the first chip 211 is arranged on the side of the second substrate 222 facing away from the first substrate 221. The first chip 211 has a power pin, which can receive voltage and supply power to the first chip. Among them, the first substrate 221 can be a circuit board (such as a printed circuit board (PCB)), and the second substrate 222 is a carrier (such as a high-density carrier with memory of the first chip 211). In addition, FIG14b is illustrated by a switched capacitor module.

[0146] To power the first chip 211, the voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switched capacitor module 232. Both the DC-DC conversion circuit 231 and the switched capacitor module 232 are disposed on the side of the first substrate 221 facing away from the second substrate 222. Furthermore, the input end of the DC-DC conversion circuit 231 is used to receive an input voltage Uin. The output end of the DC-DC conversion circuit 231 is connected to the input end of the switched capacitor module 232. The output end of the switched capacitor module 232 is connected to a power pin of the first chip 211 and outputs a voltage Uout to the power pin.

[0147] To achieve vertical power supply and reduce losses in the PDN power supply link, referring to FIG14a , the orthographic projection of the first chip 211 on the first substrate 221 and the orthographic projection of the switched capacitor module 232 on the first substrate 221 can have an overlapping area. This configuration allows the first chip 211 to have an overlapping area in the stacking direction of the first substrate 221 and the second substrate 222, shortening the power supply path between the first chip 211 and the switched capacitor module 232 as much as possible, reducing path damage and voltage drop.

[0148] Typically, the power pins of the first chip 211 include a positive power pin and a negative power pin. To form a current path between the input end of the DC-DC converter circuit 231 and the switched capacitor module 232, as shown in Figures 14a and 14b, signal lines 261, 262, 263, and 264 are provided in the first substrate 221. The positive input end of the DC-DC converter circuit 231 can be connected to the first end of the signal line 261 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), and the negative input end of the DC-DC converter circuit 231 can be connected to the first end of the signal line 262 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). The second ends of the signal lines 261 and 262 are used to receive a power supply voltage, thereby allowing the power supply voltage to be input to the input end of the DC-DC converter circuit 231. In addition, the positive output end of the DC-DC conversion circuit 231 can be connected to the first end of the signal line 263 by means of solder, a solder ball (such as a tin solder ball) or a bump (such as a copper pillar micro-bump), and the negative output end of the DC-DC conversion circuit 231 can be connected to the first end of the signal line 264 by means of solder, a solder ball (such as a tin solder ball) or a bump (such as a copper pillar micro-bump), and the second end of the signal line 263 is connected to the positive input end of the switching capacitor module 232 by means of solder, a solder ball (such as a tin solder ball) or a bump (such as a copper pillar micro-bump), and the second end of the signal line 264 is connected to the negative input end of the switching capacitor module 232 by means of solder, a solder ball (such as a tin solder ball) or a bump (such as a copper pillar micro-bump), so that the voltage output by the DC-DC conversion circuit 231 can be transmitted to the input end of the switching capacitor module 232.

[0149] To form a current path between the switched capacitor module 232 and the first chip 211, referring to Figures 14a and 14b, a first through hole K1 is provided in the first substrate 221, penetrating the first substrate 221, and first conductive portions 241 and 242 are provided in the first through hole K1. A second through hole K2 is also provided in the second substrate 222, penetrating the second substrate 222, and second conductive portions 251 and 252 are provided in the second through hole K2. Among them, the first end of the first conductive part 241 can be connected to the positive output end of the switching capacitor module 232 by means of solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro-bumps), and the second end of the first conductive part 241 can be connected to the first end of the second conductive part 251 by means of solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro-bumps), and the second end of the second conductive part 251 can be connected to the positive power supply pin of the first chip 211 by means of solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro-bumps), thereby realizing the electrical connection between the positive output end of the switching capacitor module 232 and the positive power supply pin of the first chip 211. Furthermore, the first end of the first conductive portion 242 can be connected to the negative output terminal of the switched capacitor module 232 by means of solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), etc., the second end of the first conductive portion 242 can be connected to the first end of the second conductive portion 252 by means of solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), etc., and the second end of the second conductive portion 252 can be connected to the negative power supply pin of the first chip 211 by means of solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), etc., thereby achieving an electrical connection between the negative output terminal of the switched capacitor module 232 and the negative power supply pin of the first chip 211. With this arrangement, the voltage and current output by the switched capacitor module 232 can be input into the first chip 211 through the first conductive portions 241, 242 and the second conductive portions 251, 252, thereby providing current and voltage to the first chip 211. Furthermore, since the first conductive parts 241 and 242 extend from the first surface of the first substrate 221 to its second surface, and the second conductive parts 251 and 252 extend from the first surface of the second substrate 222 to its second surface, a vertical power supply path can be formed between the switching capacitor module 232 and the first chip 211, thereby further realizing vertical power supply, further shortening the power supply path between the first chip 211 and the switching capacitor module 232, reducing path damage and voltage drop, and further increasing the current flowing into the first chip 211.

[0150] Exemplarily, the first conductive part and the second conductive part are made of metal materials.

[0151] In addition, FIG14a uses the example of the first chip 211 corresponding to multiple DC-DC conversion circuits 231 and multiple switched capacitor modules 232 for illustration only. Based on this, referring to FIG14a, in order to improve the simplicity of the components in the voltage conversion circuit, the multiple DC-DC conversion circuits 231 can be arranged in a mirror-symmetrical manner, and the multiple switched capacitor modules 232 can be arranged in a mirror-symmetrical manner. Furthermore, the DC-DC conversion circuits 231 are arranged on both sides of the multiple switched capacitor modules 232.

[0152] Furthermore, in order to improve the output stability of the DC-DC conversion circuit and achieve filtering, referring to Figures 14a and 14b, the voltage conversion circuit 230 also includes a power output capacitor C1, which is connected between the positive output terminal and the negative output terminal of the output terminal of the DC-DC conversion circuit 231. For example, the power output capacitor C1 is integrated into the DC-DC conversion circuit 231, thereby reducing its occupied area on the first substrate. Moreover, in a specific implementation, the power output capacitor C1 can be set to one, two, three or more to meet the process requirements. In addition, the capacitance value of the power output capacitor C1 is determined according to the requirements of the actual application scenario and is not limited here.

[0153] In order to improve the input stability of the DC-DC conversion circuit and realize filtering, referring to Figures 14a and 14b, the voltage conversion circuit 230 also includes a power input capacitor C2, which is connected between the positive output terminal and the negative output terminal in the input terminal of the DC-DC conversion circuit 231. Exemplarily, the power input capacitor C2 is integrated into the DC-DC conversion circuit 231, thereby reducing its occupied area on the first substrate. Moreover, in a specific implementation, the power input capacitor C2 is set to one, two, three or more to meet the process requirements. In addition, the capacitance value of the power input capacitor C2 is determined according to the requirements of the actual application scenario and is not limited here.

[0154] In order to improve the input stability of the switching capacitor module and achieve filtering, referring to Figures 14a and 14b, the voltage conversion circuit 230 also includes an input filter capacitor C3, which is connected between the positive input terminal and the negative input terminal of the input terminal of the switching capacitor module 232. For example, the input filter capacitor C3 is integrated into the switching capacitor module 232, thereby reducing its occupied area on the first substrate. Moreover, in a specific implementation, the input filter capacitor C3 is set to one, two, three or more to meet the process requirements. In addition, the capacitance value of the input filter capacitor C3 is determined according to the requirements of the actual application scenario and is not limited here.

[0155] In order to improve the output stability of the switched capacitor module and achieve filtering, referring to Figures 14a and 14b, the voltage conversion circuit 230 also includes an output filter capacitor C4, which is connected between the positive output terminal and the negative output terminal of the output terminal of the switched capacitor module 232. For example, the output filter capacitor C4 is integrated into the switched capacitor module 232, thereby reducing its occupied area on the first substrate. Moreover, in a specific implementation, the output filter capacitor C4 is set to one, two, three or more to meet the process requirements. In addition, the capacitance value of the output filter capacitor C4 is determined according to the requirements of the actual application scenario and is not limited here.

[0156] In addition, the DC-DC conversion circuit 231 may also be disposed on the side of the first substrate 221 facing the second substrate 222 , or the DC-DC conversion circuit 231 may be embedded in the first substrate 221 .

[0157] It is understandable that, in addition to the power pins, the first chip also has one or more signal pins, which are used to transmit information such as control instructions and data, so that the first chip can perform control and calculation. Based on this, the first substrate and the second substrate also include calculation signal lines for transmitting this information, and the signal pins of the first chip are connected to the calculation signal lines on the second substrate by means of solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro-bumps), and the calculation signal lines on the second substrate are further connected to the calculation signal lines on the first substrate by means of solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro-bumps), and the calculation signal lines on the first substrate are further connected to the external circuit, thereby realizing the function of the first chip performing control and calculation.

[0158] Figure 15a is another structural schematic diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application, and Figure 15b is an equivalent circuit schematic diagram of the voltage conversion circuit and the first chip shown in Figure 15a. Referring to Figures 15a and 15b, in an embodiment of the present application, the voltage conversion circuit includes: a first substrate 221, a second substrate 222, a first chip 211, and a voltage conversion circuit 230. The voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switching capacitor module 232. Among them, the DC-DC conversion circuit 231 and the switching capacitor module 232 are arranged on the side of the first substrate 221 facing away from the second substrate 222, and the power input capacitor C2 and the power output capacitor C1 are not integrated in the DC-DC conversion circuit 231, but are arranged on the first substrate 221, thereby improving the flexibility of the setting of the power input capacitor C2 and the power output capacitor C1. Specifically, the first end of the power input capacitor C2 is connected to the signal line 261 by means of solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), and the second end of the power input capacitor C2 is connected to the signal line 262 by means of solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). The first end of the power output capacitor C1 is connected to the signal line 263 by means of solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), and the second end of the power output capacitor C1 is connected to the signal line 264 by means of solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). Furthermore, the orthographic projection of the power output capacitor C1 on the first substrate 221 does not overlap with the orthographic projection of the DC-DC converter circuit 231 on the first substrate 221. Of course, the power input capacitor C2 can also be integrated into the DC-DC converter circuit 231, and the power output capacitor C1 can be externally located on the second surface of the first substrate 221. Alternatively, the power output capacitor C1 may be integrated into the DC-DC converter circuit 231, and the power input capacitor C2 may be externally mounted on the second surface of the first substrate 221. Furthermore, the input filter capacitor C3 and the output filter capacitor C4 may be integrated into the switched capacitor module 232. The remaining structures of this embodiment may also refer to the description of the above embodiment and will not be elaborated upon here.

[0159] Figure 16a is another structural schematic diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application, and Figure 16b is an equivalent circuit schematic diagram of the voltage conversion circuit and the first chip shown in Figure 16a. Referring to Figures 16a and 16b, in an embodiment of the present application, the voltage conversion circuit includes: a first substrate 221, a second substrate 222, a first chip 211, and a voltage conversion circuit 230. The voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switching capacitor module 232. Among them, the DC-DC conversion circuit 231 and the switching capacitor module 232 are arranged on the side of the first substrate 221 facing away from the second substrate 222, and the power output capacitor C1 is not integrated in the DC-DC conversion circuit 231, but is arranged on the first substrate 221, thereby improving the flexibility of the setting of the power output capacitor C1. Furthermore, the input filter capacitor C3 and the output filter capacitor C4 are not integrated into the switched capacitor module 232. Instead, the input filter capacitor C3 and the output filter capacitor C4 are disposed between the switched capacitor module 232 and the first substrate 221, thereby reducing the occupied area of ​​the input filter capacitor C3 and the output filter capacitor C4 on the first substrate and increasing the flexibility of the arrangement of the input filter capacitor C3 and the output filter capacitor C4. Specifically, the positive input terminal of the switched capacitor module 232 is connected to the first end of the input filter capacitor C3, which is further connected to the signal line 263 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). The negative input terminal of the switched capacitor module 232 is connected to the second end of the input filter capacitor C3, which is further connected to the signal line 264 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). The positive output terminal of the switched capacitor module 232 is connected to the first end of the output filter capacitor C4, which is further connected to the first end of the first conductive portion 241 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). The negative output terminal of the switched capacitor module 232 is connected to the second end of the output filter capacitor C4, which is further connected to the first end of the first conductive portion 242 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). Of course, the input filter capacitor C3 can also be integrated into the switched capacitor module 232, while the output filter capacitor C4 is externally located on the second surface of the first substrate 221. Alternatively, the output filter capacitor C4 can also be integrated into the switched capacitor module 232, while the input filter capacitor C3 is externally located on the second surface of the first substrate 221. Furthermore, the power input capacitor C2 can be omitted from the voltage conversion circuit 230, or the power input capacitor C2 can be integrated into the DC-DC conversion circuit 231. In addition, the remaining structures in this embodiment can also refer to the description in the above embodiment and will not be repeated here.

[0160] FIG17 is another structural schematic diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. The equivalent circuit schematic diagram corresponding to FIG17 can be referred to FIG15 b. Referring to FIG17 , in an embodiment of the present application, the voltage conversion circuit includes: a first substrate 221, a second substrate 222, a first chip 211, and a voltage conversion circuit 230. The voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switching capacitor module 232. The DC-DC conversion circuit 231 and the switching capacitor module 232 are arranged on the side of the first substrate 221 facing away from the second substrate 222. The power input capacitor C2 and the power output capacitor C1 are not integrated in the DC-DC conversion circuit 231, but are arranged between the DC-DC conversion circuit 231 and the first substrate 221, thereby reducing the occupied area of ​​the power input capacitor C2 and the power output capacitor C1 on the first substrate 221 and improving the flexibility of the arrangement of the power input capacitor C2 and the power output capacitor C1. Specifically, the positive input terminal of the DC-DC conversion circuit 231 is connected to the first end of the power input capacitor C2, and the first end of the power input capacitor C2 is also connected to the signal line 261 through solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro bumps). The negative input terminal of the DC-DC conversion circuit 231 is connected to the second end of the power input capacitor C2, and the second end of the power input capacitor C2 is also connected to the signal line 262 through solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro bumps). The positive output terminal of the DC-DC conversion circuit 231 is connected to the first end of the power output capacitor C1, which is further connected to the signal line 263 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). The negative output terminal of the DC-DC conversion circuit 231 is connected to the second end of the power output capacitor C1, which is further connected to the signal line 264 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). The remaining structures of this embodiment can also refer to the description of the above embodiment and are not repeated here.

[0161] Figure 18 is another structural schematic diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. The equivalent circuit schematic diagram corresponding to Figure 18 can be referred to Figure 14b. Referring to Figure 18, in an embodiment of the present application, the voltage conversion circuit includes: a first substrate 221, a second substrate 222, a first chip 211 and a voltage conversion circuit 230. The voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switching capacitor module 232. Among them, the DC-DC conversion circuit 231 is arranged on the side of the first substrate 221 facing away from the second substrate 222, and the switching capacitor module 232 is arranged between the first substrate 221 and the second substrate 222, further shortening the power supply path between the switching capacitor module 232 and the first chip 211, reducing losses and improving efficiency. Specifically, the first end of the first conductive portion 241 is connected to the positive output end of the DC-DC conversion circuit 231 through solder, a solder ball (such as a tin solder ball) or a bump (such as a copper pillar micro-bump), and the first end of the first conductive portion 242 is connected to the negative output end of the DC-DC conversion circuit 231 through solder, a solder ball (such as a tin solder ball) or a bump (such as a copper pillar micro-bump). The second end of the first conductive portion 241 is connected to the positive input end of the switching capacitor module 232 through solder, a solder ball (such as a tin solder ball) or a bump (such as a copper pillar micro-bump), and the second end of the first conductive portion 242 is connected to the negative input end of the switching capacitor module 232 through solder, a solder ball (such as a tin solder ball) or a bump (such as a copper pillar micro-bump). In addition, the first end of the second conductive portion 251 is connected to the positive output end of the switch capacitor module 232 by means of solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro-bumps), and the first end of the second conductive portion 252 is connected to the negative output end of the switch capacitor module 232 by means of solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro-bumps). Furthermore, the DC-DC conversion circuit 231 is also integrated with a power input capacitor C2 and a power output capacitor C1, and the switch capacitor module 232 is also integrated with an input filter capacitor C3 and an output filter capacitor C4. Furthermore, the switch capacitor module 232 can be set to an ultra-thin hybrid ECP (embedded component package) structure to reduce the overall thickness of the voltage conversion circuit. In addition, the remaining structures in this embodiment can also refer to the description in the above embodiment and are not repeated here.

[0162] Figure 19 is another structural schematic diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. The equivalent circuit schematic diagram corresponding to Figure 19 can be referred to Figure 15b. Referring to Figure 19, in an embodiment of the present application, the voltage conversion circuit includes: a first substrate 221, a second substrate 222, a first chip 211, and a voltage conversion circuit 230. The voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switching capacitor module 232. Among them, the switching capacitor module 232 is arranged between the first substrate 221 and the second substrate 222, the DC-DC conversion circuit 231 is arranged on the side of the first substrate 221 facing away from the second substrate 222, and the power input capacitor C2 and the power output capacitor C1 are not integrated in the DC-DC conversion circuit 231, but are arranged on the first substrate 221. Specifically, the first end of the power input capacitor C2 is connected to the signal line 261 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), and the second end of the power input capacitor C2 is connected to the signal line 262 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). The first end of the power output capacitor C1 is connected to the first end of the first conductive portion 241 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), and the second end of the power output capacitor C1 is connected to the first end of the first conductive portion 242 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). In addition, the positive input terminal of the DC-DC conversion circuit 231 is connected to the signal line 263 by means of solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro-bumps), and the negative input terminal of the DC-DC conversion circuit 231 is connected to the signal line 264 by means of solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro-bumps). The signal line 263 is connected to the first conductive part 241 in the first substrate 221, and the signal line 264 is connected to the first conductive part 242 in the first substrate 221. Of course, the power input capacitor C2 and the power output capacitor C1 can also be integrated into the DC-DC conversion circuit 231 or directly not set, reducing the number of capacitor settings and reducing costs. Further, the switch capacitor module 232 can be set to the structure of ultra-thin hybrid ECP (embedded component package) to reduce the overall thickness of the voltage conversion circuit. In addition, the remaining structures in this embodiment can also refer to the description in the above embodiment and will not be repeated here.

[0163] Figure 20 is another structural schematic diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. The equivalent circuit schematic diagram corresponding to Figure 20 can be referred to Figure 15b. Referring to Figure 20, in an embodiment of the present application, the voltage conversion circuit includes: a first substrate 221, a second substrate 222, a first chip 211, and a voltage conversion circuit 230. The voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switching capacitor module 232. Among them, the switching capacitor module 232 is arranged between the first substrate 221 and the second substrate 222, the DC-DC conversion circuit 231 is arranged on the side of the first substrate 221 facing away from the second substrate 222, and the power input capacitor C2 and the power output capacitor C1 are not integrated in the DC-DC conversion circuit 231, but are arranged between the first substrate 221 and the DC-DC conversion circuit 231. In addition, the positive input terminal of the DC-DC conversion circuit 231 is connected to the first end of the power input capacitor C2, the negative input terminal of the DC-DC conversion circuit 231 is connected to the second end of the power input capacitor C2, the first end of the power input capacitor C2 is connected to the signal line 261 through solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro bumps), and the second end of the power input capacitor C2 is connected to the signal line 262 through solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro bumps). The positive output terminal of the DC-DC conversion circuit 231 is connected to the first end of the power output capacitor C1, and the negative output terminal of the DC-DC conversion circuit 231 is connected to the second end of the power output capacitor C1. The first end of the power output capacitor C1 is connected to the first end of the first conductive portion 241 by solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro bumps), and the second end of the power output capacitor C1 is connected to the first end of the first conductive portion 242 by solder, solder balls (such as tin solder balls) or bumps (such as copper pillar micro bumps). In addition, the power input capacitor C2 and the power output capacitor C1 can also be integrated into the DC-DC conversion circuit 231 or directly not set, reducing the number of capacitors set and reducing costs. Further, the power input capacitor C2 and the power output capacitor C1 can be connected based on RDL (Re-distributed layer, redistribution layer). Further, the switch capacitor module 232 can be set to an ultra-thin hybrid ECP (embedded component package) structure to reduce the overall thickness of the voltage conversion circuit. In addition, the remaining structures in this embodiment can also refer to the description in the above embodiment and will not be repeated here.

[0164] Figure 21 is another structural schematic diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. The equivalent circuit schematic diagram corresponding to Figure 21 can be referred to Figure 15b. Referring to Figure 21, in an embodiment of the present application, the voltage conversion circuit includes: a first substrate 221, a second substrate 222, a first chip 211 and a voltage conversion circuit 230. The voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switching capacitor module 232. Among them, the switching capacitor module 232 is embedded in the second substrate 222, the DC-DC conversion circuit 231 is arranged on the side of the first substrate 221 facing away from the second substrate 222, and the power input capacitor C2 and the power output capacitor C1 are not integrated in the DC-DC conversion circuit 231, but are arranged between the first substrate 221 and the DC-DC conversion circuit 231. Furthermore, the positive input terminal of the switch capacitor module 232 is connected to the second end of the first conductive portion 241 by means of solder, solder balls (e.g., tin solder balls) or bumps (e.g., copper pillar micro-bumps), and the negative input terminal of the switch capacitor module 232 is connected to the second end of the first conductive portion 242 by means of solder, solder balls (e.g., tin solder balls) or bumps (e.g., copper pillar micro-bumps), and the positive output terminal of the switch capacitor module 232 is connected to the first end of the second conductive portion 251 by means of a connecting line in the second substrate 222, and the negative output terminal of the switch capacitor module 232 is connected to the first end of the second conductive portion 252 by means of a connecting line in the second substrate 222. Furthermore, the switch capacitor module 232 can be set to an ultra-thin hybrid ECP (embedded component package) structure to reduce the overall thickness of the voltage conversion circuit. In addition, the remaining structures in this embodiment can also refer to the description in the above embodiment and are not repeated here.

[0165] Figure 22 is another structural schematic diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. The equivalent circuit schematic diagram corresponding to Figure 22 can refer to Figure 15b. Referring to Figure 22, in an embodiment of the present application, the voltage conversion circuit includes: a first substrate 221, a second substrate 222, a first chip 211 and a voltage conversion circuit 230. The voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switching capacitor module 232. Among them, the switching capacitor module 232 is embedded in the second substrate 222, the DC-DC conversion circuit 231 is arranged on the side of the first substrate 221 facing away from the second substrate 222, the power input capacitor C2 and the power output capacitor C1 are not integrated in the DC-DC conversion circuit 231, the power input capacitor C2 is arranged on the first substrate 221, and the power output capacitor C1 is arranged between the switching capacitor module 232 and the first substrate 221. Specifically, the second end of the first conductive portion 241 is connected to the first end of the power output capacitor C1 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), and the second end of the first conductive portion 242 is connected to the second end of the power output capacitor C1 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). Furthermore, the first end of the power output capacitor C1 is connected to the positive input end of the switch capacitor module 232 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), and the second end of the power output capacitor C1 is connected to the negative input end of the switch capacitor module 232 via solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). Furthermore, to reduce losses in the power supply link, the orthographic projection of the DC-DC converter circuit 231 on the first substrate 221 and the orthographic projection of the switch capacitor module 232 on the first substrate 221 have an overlapping area. Furthermore, the switch capacitor module 232 can be configured as an ultra-thin hybrid ECP (embedded component package) structure to reduce the overall thickness of the voltage conversion circuit.

[0166] Figure 23 is another structural schematic diagram of the voltage conversion circuit and the first chip provided in an embodiment of the present application. The equivalent circuit schematic diagram corresponding to Figure 23 can be referred to Figure 14b. Referring to Figure 23, in an embodiment of the present application, the voltage conversion circuit includes: a first substrate 221, a second substrate 222, a first chip 211 and a voltage conversion circuit 230. The voltage conversion circuit 230 includes a DC-DC conversion circuit 231 and a switching capacitor module 232. Among them, the switching capacitor module 232 is embedded in the first substrate 221, and the DC-DC conversion circuit 231 is arranged on the side of the first substrate 221 facing away from the second substrate 222. Specifically, the second end of the first conductive portion 241 is connected to the positive input end of the switching capacitor module 232, and the second end of the first conductive portion 242 is connected to the negative input end of the switching capacitor module 232. Furthermore, the positive input terminal of the switched capacitor module 232 is connected to the first end of the second conductive portion 251 by means of solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump), and the negative input terminal of the switched capacitor module 232 is connected to the first end of the second conductive portion 252 by means of solder, a solder ball (e.g., a tin solder ball), or a bump (e.g., a copper pillar micro-bump). Furthermore, the switched capacitor module 232 can be configured as an ultra-thin hybrid ECP (embedded component package) structure to reduce the overall thickness of the voltage conversion circuit. In addition, the remaining structures in this embodiment can refer to the description in the above embodiment and are not repeated here.

[0167] The above content is only a specific implementation method of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed in this application, and they should all be covered by the protection scope of the present application.

Claims

1. A switched capacitor module, characterized in that: The device comprises Q switched capacitor modules, wherein the input ends of the Q switched capacitor modules are connected in parallel to serve as the input end of the switched capacitor module, and the output ends of the Q switched capacitor modules are connected in parallel to serve as the output end of the switched capacitor module, wherein Q is an integer and Q≥1; and the output end of the switched capacitor module is used to connect to a load; The switched capacitor module includes N switched capacitor circuits, input ends of the N switched capacitor circuits are connected to the input end of the switched capacitor module, and output ends of the N switched capacitor circuits are connected to the output end of the switched capacitor module, where N is an integer and N≥1; The Q switched capacitor modules are used to respond to out-of-phase control, and the inverse of the change time of the load current is less than Q*N*Fsw; or, the Q switched capacitor modules are used to respond to in-phase control, and the inverse of the change time of the load current is less than N*Fsw; wherein Fsw represents the switching frequency of the switched capacitor circuit.

2. The switched capacitor module according to claim 1, wherein: The switched capacitor circuit is a resonant switched capacitor circuit.

3. The switched capacitor module according to claim 2, wherein: The resonant switched capacitor circuit includes: a first switching tube, a second switching tube, a third switching tube, a third switching tube, an energy storage capacitor, a first filter capacitor, a second filter capacitor and an inductor; The control electrode of the first switching tube is used to receive a first switching signal, the first electrode of the first switching tube is connected to the positive input terminal of the input terminal of the resonant switched capacitor circuit and the first electrode of the first filter capacitor, and the second electrode of the first switching tube is connected to the first electrode of the second switching tube and the first electrode of the energy storage capacitor; The control electrode of the second switching tube is used to receive a second switching signal, and the second electrode of the second switching tube is connected to the first electrode of the third switching tube and the first end of the inductor; The control electrode of the third switching tube is used to receive a third switching signal, and the second electrode of the third switching tube is connected to the first electrode of the fourth switching tube and the second electrode of the energy storage capacitor; The control electrode of the fourth switch tube is used to receive a fourth switching signal, and the second electrode of the fourth switch tube is connected to the second electrode of the second filter capacitor and the negative input terminal of the input terminal of the resonant switch capacitor circuit; The second electrode of the first filter capacitor is connected to the first electrode of the second filter capacitor and the second end of the inductor.

4. The switched capacitor module according to claim 2, wherein: The resonant switched capacitor circuit includes: a first switching tube, a second switching tube, a third switching tube, a third switching tube, an energy storage capacitor, a first filter capacitor, a second filter capacitor and an inductor; The control electrode of the first switching transistor is used to receive a first switching signal, the first electrode of the first switching transistor is connected to the positive input terminal of the input terminal of the resonant switched capacitor circuit and the first electrode of the first filter capacitor, and the second electrode of the first switching transistor is connected to the first electrode of the second switching transistor and the first end of the inductor; The second end of the inductor is connected to the first electrode of the energy storage capacitor; The control electrode of the second switching tube is used to receive a second switching signal, and the second electrode of the second switching tube is connected to the first electrode of the third switching tube, the second electrode of the first filter capacitor, and the first electrode of the second filter capacitor; The control electrode of the third switching tube is used to receive a third switching signal, and the second electrode of the third switching tube is connected to the first electrode of the fourth switching tube and the second electrode of the energy storage capacitor; The control electrode of the fourth switch tube is used to receive a fourth switching signal, and the second electrode of the fourth switch tube is connected to the second electrode of the second filter capacitor and the negative input end of the input end of the resonant switch capacitor circuit.

5. A voltage conversion circuit, characterized in that: include: A DC-DC conversion circuit and a switched capacitor module according to any one of claims 1 to 4; The input end of the DC-DC conversion circuit is used to receive an input voltage, the output end of the DC-DC conversion circuit is connected to the input end of the switch capacitor module, and the output end of the switch capacitor module is used to connect to a load; The DC-DC conversion circuit is used to step down the input voltage and output it to the switched capacitor module; The switch capacitor module is used to step down the input voltage and output it to the load.

6. The voltage conversion circuit according to claim 5, wherein: The DC-DC conversion circuit is further configured to adjust the voltage at the output terminal of the DC-DC conversion circuit in response to the voltage at the output terminal of the DC-DC conversion circuit not meeting the first voltage threshold; The switched capacitor module is configured to adjust the voltage at the output terminal of the switched capacitor module in response to the voltage at the output terminal of the switched capacitor module not meeting a second voltage threshold.

7. The voltage conversion circuit according to claim 5, wherein: The DC-DC conversion circuit is further configured to adjust the voltage at the output end of the DC-DC conversion circuit in response to the voltage at the output end of the switched capacitor module not meeting the second voltage threshold; The switched capacitor module is configured to adjust the voltage at the output terminal of the switched capacitor module in response to the voltage at the output terminal of the switched capacitor module not meeting a second voltage threshold.

8. The voltage conversion circuit according to claim 6 or 7, wherein: The switched capacitor module is further configured to: in response to the switched capacitor module adjusting the voltage at its output end, send a linkage voltage regulation instruction to the DC-DC conversion circuit; The DC-DC conversion circuit is further configured to adjust the voltage at the output end of the DC-DC conversion circuit in response to the linked voltage regulation instruction.

9. The voltage conversion circuit according to claim 8, wherein: The switch capacitor module is further configured to: in response to the switch capacitor module adjusting the voltage reduction at its output end, send a linkage voltage regulation instruction carrying voltage reduction information to the DC-DC conversion circuit; The DC-DC conversion circuit is further configured to reduce the voltage at the output end of the DC-DC conversion circuit in response to a linked voltage regulation instruction carrying the voltage reduction information.

10. The voltage conversion circuit according to claim 8 or 9, wherein: The switched capacitor module is further configured to: in response to the switched capacitor module adjusting the voltage at its output terminal to increase, send a linkage voltage regulation instruction carrying voltage boost information to the DC-DC conversion circuit; The DC-DC conversion circuit is further configured to increase the voltage at the output end of the DC-DC conversion circuit in response to a linked voltage regulation instruction carrying the voltage boost information.

11. The voltage conversion circuit according to any one of claims 8 to 10, wherein: The switched capacitor module is further configured to: in response to a voltage at the output end of the switched capacitor module not meeting a second voltage threshold, control one or more of the phase, switching frequency, and duty cycle corresponding to the switched capacitor circuit to be adjusted from a set value to a target value, thereby adjusting the voltage at its output end; and after the DC-DC conversion circuit adjusts the voltage at its output end in response to the linked voltage regulation instruction, adjust one or more of the phase, switching frequency, and duty cycle from the target value to the set value.

12. The voltage conversion circuit according to claim 5, wherein: The DC-DC conversion circuit is further configured to adjust the voltage at the output end of the DC-DC conversion circuit in response to the voltage at the output end of the switched capacitor module not meeting a second voltage threshold.

13. The voltage conversion circuit according to claim 5, wherein: The DC-DC conversion circuit is further configured to adjust the voltage at the output end of the DC-DC conversion circuit based on the current at the output end of the switched capacitor module.

14. The voltage conversion circuit according to claim 5, wherein: The DC-DC conversion circuit is further configured to adjust the voltage at the output end of the DC-DC conversion circuit based on the current at the output end of the switched capacitor module and the first voltage regulation instruction output by the load.

15. The voltage conversion circuit according to any one of claims 5 to 14, wherein: The DC-DC conversion circuit includes: an LLC resonant converter or a current-doubler rectification converter.

16. An electronic device, characterized in that: include: A circuit board and a voltage conversion circuit as described in any one of claims 5 to 15, wherein the voltage conversion circuit is arranged on the circuit board.

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