Atomization core and atomization device

Abstract

The present application relates to an atomization core and an atomization device. An atomization core (40) comprises a base (410) and an electrode portion (420). The electrode portion (420) comprises a first electrode layer (422), a first heating body layer (424), and a second electrode layer (426) which are stacked on the surface of the base (410).

Description

Atomizer core and atomizer device

[0001] Related applications

[0002] This application claims priority to Chinese patent application number 2024101535074, filed on February 2, 2024, entitled “Atomizer Core and Atomizer Device,” the entire text of which is hereby incorporated by reference. Technical Field

[0003] The present application relates to the field of atomization, and in particular to an atomization core and an atomization device. Background Art

[0004] In related technologies, electronic atomization devices include an atomization core, which includes a base and a heating structure. The base is used to guide the aerosol atomization matrix to the heating structure, and the aerosol atomization matrix is ​​atomized by the heating of the heating structure to produce an aerosol. The heating structure includes a heating element and an electrode electrically connected to the heating element. In the heating structure of a traditional atomization core, the actual heating power output of the heating part corresponding to the atomization core heating element is less than the actual power output of the power supply, that is, there is a certain power loss. Summary of the Invention

[0005] According to various embodiments of the present application, an atomizer core is provided.

[0006] In addition, some other embodiments of the present application further provide an atomization device including an atomization core.

[0007] An atomizing core, comprising:

[0008] matrix;

[0009] The electrode portion includes a first electrode layer, a first heating element layer, and a second electrode layer stacked on the surface of the substrate.

[0010] In some embodiments, the first heating element layer is in-situ grown on a surface of the first electrode layer away from the substrate.

[0011] In some embodiments, the first heating element layer is formed by physical vapor deposition.

[0012] In some embodiments, the first heating element layer is disposed on the surface of the first electrode layer, and the first heating element layer accounts for approximately 0.5 to 1 of the surface of the first electrode layer.

[0013] In some embodiments, the second electrode layer is disposed on a surface of the first heating element layer away from the first electrode layer and completely covers the first heating element layer.

[0014] In some embodiments, further comprising:

[0015] The heating portion includes a second heating element layer provided on the surface of the base; the heating portion is electrically connected to the electrode portion.

[0016] In some embodiments, the second heat-generating layer and the first heat-generating layer are integrally formed.

[0017] In some embodiments, the second heat-generating layer and the first heat-generating layer are each independently made of metal.

[0018] In some embodiments, the materials of the second heating element layer and the first heating element layer independently include at least one of titanium, zirconium, titanium-aluminum alloy, titanium-zirconium alloy, titanium-molybdenum alloy, titanium-niobium alloy, iron-aluminum alloy, tantalum-aluminum alloy or stainless steel.

[0019] In some embodiments, the heat generating portion and the electrode portion are disposed on the same surface of the substrate.

[0020] In some embodiments, the heating portion further includes a protective layer disposed on a surface of the second heating element layer that is away from the substrate.

[0021] In some embodiments, the material of the protective layer includes at least one of aluminum oxide, silicon oxide, or an inert metal.

[0022] In some embodiments, the heat generating portion further includes a bonding layer disposed between the second heat generating layer and the substrate.

[0023] In some embodiments, the bonding layer is made of glass.

[0024] In some embodiments, the thickness of the first electrode layer and the second electrode layer are each independently about 10 μm to about 200 μm.

[0025] In some embodiments, the materials of the first electrode layer and the second electrode layer independently include one metal or an alloy of several metals selected from Au, Ag, Pt, Al and Cu.

[0026] In some embodiments, the materials of the first electrode layer and the second electrode layer both include Ag.

[0027] In some embodiments, the first electrode layer includes two first electrodes, and the two first electrodes are spaced apart and arranged at two ends of the substrate.

[0028] In some embodiments, the second electrode layer includes two second electrodes, and the two second electrodes are spaced apart and arranged at two ends of the substrate.

[0029] In some embodiments, the substrate is a porous substrate.

[0030] In some embodiments, the substrate is a porous ceramic substrate.

[0031] In some embodiments, the substrate is activated.

[0032] An atomizing device comprises the atomizing core mentioned above.

[0033] The details of one or more embodiments of the present application are set forth in the following drawings and description. Other features, objects, and advantages of the present application will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the disclosed drawings without any creative work.

[0035] FIG1 is a schematic diagram of the structure of an atomizer core in some embodiments of the present application;

[0036] FIG2 is a schematic diagram of a structure of an atomizer core in some other embodiments of the present application;

[0037] FIG3 is a schematic diagram of the structure of an atomizer core in conventional technology;

[0038] FIG4 is a schematic diagram of a process flow of a method for preparing an atomizer core in some embodiments of the present application;

[0039] FIG5 is a schematic diagram of a structure of an electronic atomization device in some embodiments of the present application;

[0040] FIG6 is a schematic diagram of an exploded structure of the atomization component in the electronic atomization device shown in FIG5 ;

[0041] FIG7 is a schematic diagram of a partially enlarged cross-sectional view of the atomizing assembly shown in FIG6 ;

[0042] FIG8 is a curve showing the change in resistance of the atomizer core prepared in Comparative Example 1 when used in an electronic atomizer device with increasing the number of puffs;

[0043] FIG9 is a curve showing the change in resistance of the atomizer core prepared in Example 1 when used in an electronic atomizer device with the number of puffs;

[0044] FIG10 is a bar graph showing the smoke volume of different samples of the atomizer core prepared in Comparative Example 1 when used in an electronic atomizer device;

[0045] FIG11 is a bar graph showing the smoke volume of different samples of the atomizer core prepared in Example 1 when used in an electronic atomizer device;

[0046] FIG12 is a cross-sectional scanning electron microscope image of the atomizer core prepared in Example 1;

[0047] FIG13 is a cross-sectional view of the atomizer core corresponding to FIG12 .

[0048] Reference numerals: Atomizer assembly 100, power supply assembly 200, liquid storage chamber 10, upper cover 20, air flow channel 30, atomizer core 40, guide portion 22, mating portion 24, accommodating portion 26, liquid inlet 222, air outlet 224, accommodating chamber 262; Traditional atomizer core 50 includes: base 510, heating element 520, and electrode 530;

[0049] The atomizer core 40 in some embodiments of the present application includes: a base 410, an electrode portion 420 (including a first electrode layer 422, a first heating element layer 424, and a second electrode layer 426) and a heating portion 430 (including a second heating element layer 432, a protective layer 434 and a bonding layer 436). DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0052] Unless otherwise specified or incompatible therewith, terms and phrases used in this application shall have the following meanings:

[0053] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of the features.

[0054] In the description of the present application, “a plurality of” means at least two, for example, two, three, etc., unless otherwise clearly defined.

[0055] In this application, "one or several" refers to any one, any two, or any two or more of the listed items. Among them, "several" refers to any two or any two or more.

[0056] In this application, the percentage concentration involved, unless otherwise specified, refers to the final concentration. The final concentration refers to the percentage of the added component in the system after the addition of the component.

[0057] The words "optionally" and the like in this application refer to embodiments of the present application that may provide certain beneficial effects in certain circumstances. However, other embodiments may also be optional under the same circumstances or other circumstances. In addition, the statement of one or more optional embodiments does not imply that other embodiments are not available, nor is it intended to exclude other embodiments from the scope of this application.

[0058] When a numerical range is disclosed in this application, the range is considered continuous and includes the minimum and maximum values ​​of the range, as well as every value between such minimum and maximum values. Further, when a range refers to an integer, every integer between the minimum and maximum values ​​of the range is included. In addition, when multiple ranges are provided to describe a feature or characteristic, the ranges can be combined. In other words, unless otherwise indicated, all ranges disclosed in this application should be understood to include any and all subranges subsumed therein.

[0059] In this application, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0060] The terms "including," "having," and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or units is not limited to the listed steps or units but may optionally include steps or units not listed, or may optionally include other steps or components inherent to the process, method, product, or apparatus.

[0061] References to "embodiments" in this application mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0062] As mentioned above, in traditional atomizer core heating structures, the actual heating power output of the heating element corresponding to the atomizer core heating element is less than the actual power output of the power supply, which means that there is a certain amount of power loss. The inventors of this application have discovered that the main cause of this power loss is the high resistance of the electrode, which causes a certain amount of power loss in the electrode. Therefore, by reducing the resistance of the electrode, the power loss of the atomizer core can be reduced.

[0063] Referring to FIG. 1 and FIG. 2 , a first aspect of the present application provides an atomizer core 40 , comprising:

[0064] Base 410;

[0065] The electrode portion 420 includes a first electrode layer 422 , a first heating element layer 424 , and a second electrode layer 426 stacked on the surface of the base 410 .

[0066] The above-mentioned atomizer core 40 includes a base 410 and an electrode portion 420. By optimizing the structure of the atomizer core 40, the electrode portion 420 in the atomizer core 40 has good contact, reducing the resistance of the electrode portion 420 in the atomizer core 40 and reducing the power loss in the electrode portion 420. When the atomizer core 40 is applied to an atomization device, the battery output power efficiency is high and the smoke output is stable.

[0067] In some embodiments, the atomizer core 40 further includes a heating portion 430 , and the heating portion 430 includes a second heating element layer 432 disposed on the surface of the base 410 ; the heating portion 430 is electrically connected to the electrode portion 420 .

[0068] The atomizer core 40 includes a base 410, an electrode portion 420, and a heating portion 430. By optimizing the structure of the atomizer core 40, the electrode portion 420 and the heating portion 430 in the atomizer core 40 have good contact, thereby reducing the resistance of the electrode portion 420. When the atomizer core 40 is applied to an atomization device, the battery output power efficiency is high and the smoke output is stable.

[0069] In some embodiments, substrate 410 is a porous substrate. For example, substrate 410 can be a porous material with liquid adsorption capacity, such as a porous ceramic substrate, a porous metal substrate, a porous glass substrate, or a porous plastic substrate. In some embodiments, substrate 410 is a porous ceramic substrate. Porous ceramics allow the aerosol-generating matrix to penetrate the atomization surface and be heated and atomized by the heating element. Porous ceramics are also stable and resistant to high temperatures.

[0070] In some embodiments, the materials of the first electrode layer 422 and the second electrode layer 426 each independently include one metal or an alloy of Au, Ag, Pt, Al, and Cu. Alternatively, the materials of the first electrode layer 422 and the second electrode layer 426 both include Ag. Silver, as an electrode material, has the characteristics of low resistivity, good contact, and stable performance.

[0071] In some embodiments, the thickness of the first electrode layer 422 and the second electrode layer 426 is independently 10 μm to 200 μm. For example, the thickness of the first electrode layer 422 and the second electrode layer 426 can be independently, but not limited to, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 80 μm, 100 μm, 120 μm, 150 μm, 180 μm, 200 μm, or a range consisting of any two of these values.

[0072] In some embodiments, the first electrode layer 422 includes two first electrodes, which are spaced apart at two ends of the substrate 410. Similarly, the second electrode layer 426 includes two second electrodes, which are spaced apart at two ends of the substrate 410.

[0073] In some embodiments, the first heating element layer 424 is in-situ grown on the surface of the first electrode layer 422. In-situ growth of the first heating element layer 424 on the surface of the first electrode layer 422 can further improve the bonding strength between the first heating element layer 424 and the first electrode layer 422; at the same time, the in-situ growth method can eliminate the interface between the first electrode layer 422 and the first heating element layer 424, further reducing the contact resistance.

[0074] In some embodiments, the first heating element layer 424 is formed by physical vapor deposition (PVD).

[0075] The first heating element layer 424 is disposed between the first electrode layer 422 and the second electrode layer 426 and is primarily used for conductive connection. The heat generated is minimal, i.e., heating power loss is minimal. In some embodiments, the material of the first heating element layer 424 is metal. For example, the material of the first heating element layer 424 may be, but is not limited to, at least one of titanium, zirconium, titanium-aluminum alloy, titanium-zirconium alloy, titanium-molybdenum alloy, titanium-niobium alloy, iron-aluminum alloy, tantalum-aluminum alloy, stainless steel, and the like.

[0076] In some embodiments, the first heating element layer 424 is disposed on the surface of the first electrode layer 422 and partially covers the first electrode layer 422. This configuration is advantageous in increasing the contact area between the first electrode layer 422 and the first heating element layer 424 while electrically connecting the second electrode layer 426 to the first electrode layer 422. In some embodiments, the first heating element layer 424 is disposed on the surface of the first electrode layer 422, and the proportion of the first heating element layer 424 to the surface of the first electrode layer 422 is 0.5 to 1. A larger contact area can provide a more reliable electrical connection while further reducing resistance.

[0077] In some embodiments, the second electrode layer 426 is disposed on a surface of the first heating element layer 424 away from the first electrode layer 422 and completely covers the first heating element layer 424. This arrangement helps further increase the contact area between the second electrode layer 426 and the first heating element layer 424, enhance reliability, and reduce resistance.

[0078] In some embodiments, the heating portion 430 and the electrode portion 420 are disposed on the same surface of the substrate 410. In one example, the heating portion 430 and the electrode portion 420 are disposed on the atomized surface of the substrate 410. In other embodiments, the heating portion 430 and the electrode portion 420 may be disposed on different surfaces of the substrate 410, and it is sufficient that the heating portion 430 and the electrode portion 420 are electrically connected.

[0079] The second heating element layer 432 is configured to generate heat when powered on to heat and atomize the aerosol generating matrix to produce aerosol. The second heating element layer 432 may be a commonly used structure in the art, and those skilled in the art may design one based on actual needs. In some embodiments, the material of the second heating element layer 432 is metal. For example, the material of the second heating element layer 432 may be, but is not limited to, at least one of titanium, zirconium, titanium-aluminum alloy, titanium-zirconium alloy, titanium-molybdenum alloy, titanium-niobium alloy, iron-aluminum alloy, tantalum-aluminum alloy, stainless steel, and the like.

[0080] In some embodiments, the second heating element layer 432 is integrally formed with the first heating element layer 424. The integral forming method is beneficial to improving the bonding effect and electrical connection effect and avoiding the contact interface.

[0081] In some embodiments, please refer to Figure 2, the heating part 430 also includes a protective layer 434 provided on the surface of the second heating element layer 432 away from the substrate 410. The material of the protective layer 434 can be aluminum oxide, silicon oxide, etc.; or, the material of the protective layer 434 is an inert metal, which has better antioxidant properties than the second heating element layer 432. The inert metal may include at least one of gold (Au), silver (Ag), platinum (Pt), palladium (Pd), etc. Of course, in some embodiments, the protective layer 434 may be a composite material including two or more materials of aluminum oxide, silicon oxide or inert metals.

[0082] In some embodiments, the heating portion 430 further includes a bonding layer 436 disposed between the second heating element layer 432 and the substrate 410. The bonding layer 436 is used to improve the bonding strength between the second heating element layer 432 and the substrate 410. The bonding layer 436 can be made of glass or the like and can be used in a porous substrate.

[0083] The problem of poor contact between the electrode and the heating element can be improved to a certain extent by optimizing the electrode slurry formula, sintering process, and post-processing in related technologies, but it cannot be completely eradicated. Especially in the case of special e-liquids (pH value <5), as the number of times the atomizer core is used increases, the poor contact between the external electrode and the electrode portion of the atomizer core will become more prominent, affecting the sustainability of product performance. In some embodiments of the present application, by optimizing the structure of the atomizer core, the problem of poor contact between the external electrode and the atomizer core is significantly improved, and the stability is good, reducing the risk of poor contact exacerbated with the increase in the number of times the atomizer core is used.

[0084] In addition, please refer to Figure 3. The traditional atomizer core 50 includes a substrate 510, a heating element 520 formed on the surface of the substrate 510, and an electrode 530 formed on the surface of the heating element 520 away from the substrate 510. Since the surface of the substrate is rough and uneven, and the heating element is usually prepared by sputtering coating, the surface of the heating element is also prone to roughness and unevenness. When the electrode is formed, point contact is likely to occur between the electrodes, resulting in poor contact between the heating element and the electrode. A large part of the power output from the ejector pin is consumed at the interface between the ejector pin and the electrode part, and the electrode part and the heating part, resulting in a low actual output power of the heating part and a poor atomization effect.

[0085] In some embodiments of the present application, the atomizer core 40, as shown in Figures 1 and 2, has a first electrode layer 422 disposed on the surface of the substrate 410, and a first heating element layer 424 disposed on the first electrode layer 422. The first electrode layer 422 is typically prepared by printing and sintering. The roughness of the surface of the substrate 410 does not affect the surface of the first electrode layer 422, so that when the first heating element layer 424 is provided, the first heating element layer 424 and the first electrode layer 422 have advantages such as surface contact and high bonding force, thereby reducing contact resistance and improving heating efficiency. In some embodiments, the first heating element layer 424 is formed by in-situ growth, further improving the integrity of the first heating element layer 424 and the first electrode layer 422. The electrode portion 420 with better integrity can reduce the corrosion of the atomizing medium on the contact interface, especially in thermal shock application scenarios. Therefore, the above embodiments optimize the attenuation problem in the atomizer core application scenario. At the same time, the second electrode layer 426 is formed on the side of the first heating element layer 424 away from the first electrode layer 422, and cooperates with the first electrode layer 422 to form a sandwich-like structure, fully ensuring good contact between the heating element and the electrode. When the atomizer core 40 is applied to an atomizer device, the battery output power efficiency is high, the vapor output is stable, the customer has a good puffing experience, and the flavor consistency is good throughout the life of the atomizer core 40.

[0086] Referring to FIG4 , the second aspect of the present application provides a method for preparing an atomizer core, comprising the following steps:

[0087] Step S310: forming a first electrode layer on the surface of the substrate.

[0088] In some embodiments, the substrate is as described above and will not be described again herein.

[0089] In some embodiments, the step of forming the first electrode layer on the surface of the substrate includes: printing the first electrode paste on the surface of the substrate, and sintering to form the first electrode layer on the surface of the substrate.

[0090] The specific printing parameters can be adjusted according to the slurry properties and the screen, and are not particularly limited here.

[0091] In some embodiments, the sintering temperature is 500° C. to 650° C. For example, the sintering temperature can be, but is not limited to, 500° C., 520° C., 550° C., 580° C., 600° C., 620° C., 640° C., 650° C., or a range consisting of any two of these values.

[0092] Step S320: forming a first heating element layer on a surface of the first electrode layer away from the substrate.

[0093] In some embodiments, before forming the first heating element layer on the surface of the first electrode layer away from the substrate, the step of activating the surface of the first electrode layer away from the substrate is further included. Activating the surface of the first electrode layer removes any micro-nano oxides or dirt on the surface of the first electrode layer, exposing a fresh, more active surface of the first electrode layer. This helps improve the bonding strength between the first electrode layer and the first heating element layer. Furthermore, it facilitates in-situ growth of the first heating element layer.

[0094] In some embodiments, the surface of the first electrode layer away from the substrate is activated by plasma etching. In other embodiments, the activation method is not limited to plasma etching, and chemical, physical, mechanical, and laser methods can also be used to activate the surface of the first electrode layer.

[0095] In one embodiment, in the plasma etching step, the voltage is 500V to 1500V, the current is 1A to 5A, and the time is 30s to 180s. For example, in the plasma etching step, the voltage may be, but is not limited to, 500V, 600V, 700V, 800V, 900V, 1000V, 1100V, 1200V, 1300V, 1400V, 1500V, or a range consisting of any two of these values. In the plasma etching step, the current may be, but is not limited to, 1A, 1.5A, 2A, 2.5A, 3A, 3.5A, 4A, 4.5A, 5A, or a range consisting of any two of these values. In the plasma etching step, the time may be, but is not limited to, 30s, 60s, 90s, 120s, 150s, 180s, or a range consisting of any two of these values.

[0096] In an optional example, vacuum plasma etching is used to activate the surface of the first electrode layer. This method can not only activate the first electrode layer, but also perform the subsequent step of coating to form the first heating element layer, thus completing etching and coating at one time.

[0097] In some embodiments, in the step of forming the first heating element layer on the surface of the first electrode layer away from the substrate, the first heating element layer is in-situ grown on the surface of the first electrode layer away from the substrate.

[0098] Optionally, the first heating element layer is formed by physical vapor deposition (PVD).

[0099] Step S330: forming a second heating element layer on the surface of the substrate to prepare a heating portion.

[0100] In some embodiments, the second heating element layer is in-situ grown on the substrate surface. In one example, the second heating element layer is formed on the substrate surface by physical vapor deposition (PVD).

[0101] In some embodiments, before forming the second heating element layer on the substrate surface, the step of activating the substrate surface is also included. Activating the substrate surface removes micro-nano oxides or dirt on the substrate surface, exposing a fresh, more active substrate surface. This helps improve the bonding strength between the substrate and the second heating element layer. This also facilitates the in-situ growth of the second heating element layer. The specific activation method is as described above and will not be repeated here.

[0102] In some embodiments of the present application, step S320 and step S330 can be performed simultaneously, or step S320 can be performed first and then step S330, or step S330 can be performed first and then step S320, etc. In some embodiments, step S320 and step S330 are performed simultaneously, so that the first heating element layer and the second heating element layer are integrally formed, which is beneficial to improving the bonding effect and electrical connection effect and avoiding the occurrence of a contact interface.

[0103] Step S340: forming a second electrode layer on a surface of the first heating element layer away from the first electrode layer; the first electrode layer, the first heating element layer and the second electrode layer constitute an electrode portion, and the electrode portion is electrically connected to the heating portion to prepare an atomizing core.

[0104] In some embodiments, the step of forming the second electrode layer on the surface of the first heating element layer away from the first electrode layer includes: printing the second electrode paste on the surface of the first heating element layer away from the first electrode layer, sintering, and forming the second electrode layer on the surface of the first heating element layer. In some embodiments, the sintering temperature is 500°C to 650°C. For example, the sintering temperature can be, but is not limited to, 500°C, 520°C, 550°C, 580°C, 600°C, 620°C, 640°C, 650°C, or a range consisting of any two of these values.

[0105] The sintering temperature in the step of forming the first electrode layer may be the same as or different from the sintering temperature in the step of forming the second electrode layer.

[0106] In some embodiments, after the step of forming the second electrode layer on the surface of the first heating element layer away from the first electrode layer, a vacuum annealing step is further included.

[0107] Optionally, the vacuum annealing temperature is 500° C. to 800° C., and the time is 1 hour to 5 hours. For example, the vacuum annealing temperature may be, but is not limited to, 500° C., 520° C., 550° C., 580° C., 600° C., 620° C., 650° C., 680° C., 700° C., 720° C., 750° C., 780° C., 800° C., or a range consisting of any two of these values.

[0108] Figure 4 is a schematic process flow diagram of a method for preparing an atomizer core according to an embodiment of the present application. Although the steps in the flow chart shown in Figure 4 are displayed in sequence as indicated by the arrows, these steps are not necessarily performed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction for the execution of these steps, and they can be performed in other orders. Moreover, at least part of the steps in Figure 4 may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily performed and completed at the same time, but can be performed at different times. Their execution order is not necessarily sequential, but can be performed in turn or alternating with other steps or at least part of other sub-steps or stages.

[0109] A third aspect of the present application provides an atomization device, comprising the atomization core described above.

[0110] In some embodiments, referring to FIG5 , the atomization device includes an atomization assembly 100 and a power supply assembly 200 . The power supply assembly 200 is electrically connected to the atomization assembly 100 to provide power to the atomization assembly 100 .

[0111] Please refer to Figures 6 and 7 together. The atomizer assembly 100 includes a liquid storage chamber 10, an upper cover 20, an air flow channel 30, and an atomizer core 40. The atomizer core 40 is disposed within the upper cover 20. The upper cover 20 is used to guide the smoke in the liquid storage chamber 10 into the atomizer core 40. The air flow channel 30 is connected to the atomizing surface of the atomizer core 40 to deliver the atomized smoke.

[0112] In this embodiment, the upper cover 20 may include a guide portion 22, a mating portion 24, and a receiving portion 26, which are connected in sequence. The guide portion 22 is provided with a liquid inlet 222 and an air outlet 224. The liquid inlet 222 communicates with the liquid storage chamber 10, and the air outlet 224 communicates with the air flow channel 30. The receiving portion 26 is formed with a receiving cavity 262 for accommodating the atomizer core 40. The atomizer core 40 is accommodated within the receiving cavity 262. The mating portion 24 is used to connect the guide portion 22 with the receiving portion 26, thereby transferring the smoke liquid in the liquid inlet 222 to the atomizer core 40.

[0113] The atomizer core 40 is used to convert the smoke liquid into smoke by generating heat. The air outlet 224 is connected to the atomizing surface of the atomizer core 40. The smoke liquid is heated on the atomizing surface and atomized into smoke. The smoke is then transmitted from the air outlet 224 through the air flow channel 30.

[0114] In some embodiments, please refer to Figures 6 and 7, the upper cover 20 is an integrally formed component. In one embodiment, a liquid inlet hole 222 and an air outlet 224 are respectively provided on the end face of the upper cover 20 close to the liquid storage chamber 10, and a receiving chamber 262 is formed on the end face of the receiving portion 26 away from the liquid storage chamber 10, and finally a through hole is provided on the matching portion 24 to connect the liquid inlet hole 222 with the receiving chamber 262. Of course, other processing sequences or processing methods can also be used to process the guide portion 22, the matching portion 24 and the receiving portion 26 on the upper cover 20, which are not specifically limited here. The use of an integrated structure of the guide portion 22, the matching portion 24 and the receiving portion 26 can reduce the number of components of the atomizer assembly 100, making installation more convenient and the related sealing performance better.

[0115] In order to make the purpose and advantages of this application clearer, the atomizer core of this application and its effects are further described in detail below in conjunction with specific examples. It should be understood that the specific examples described here are only used to explain this application and shall not be used to limit this application. Unless otherwise specified, the following examples do not include other components except unavoidable impurities. Unless otherwise specified, the drugs and instruments used in the examples are all conventionally selected in the art. Experimental methods for which specific conditions are not specified in the examples are implemented according to conventional conditions, such as those described in literature and books or methods recommended by manufacturers.

[0116] Example 1

[0117] This embodiment provides an atomizer core, the structure of which is shown in FIG1 , and the preparation steps are as follows:

[0118] (1) Screen-print silver paste on part of the surface of the clean ceramic substrate and mask the other parts.

[0119] (2) The ceramic substrate with the silver paste printed on it is sintered at a temperature of 450°C for 30 minutes to allow the paste to solidify and fully remove the volatiles in the paste to avoid affecting the subsequent vacuum coating process, thereby obtaining a first electrode layer with a thickness of about 100 μm.

[0120] (3) Plasma etching is performed on the ceramic substrate with the first electrode sintered at a voltage of 1000 V, a current of 2 A, and a time of 120 s. A first heating element layer and a second heating element layer are then in situ grown on the etched ceramic substrate. The first heating element layer is disposed on the surface of the first electrode layer, and the second heating element layer is disposed on the surface of the ceramic substrate. The materials of the first heating element layer and the second heating element layer are stainless steel.

[0121] (4) Silk-screen silver paste on the surface of the first heating element layer and mask the second heating element layer.

[0122] (5) The ceramic substrate with the silver paste printed on it is sintered at a temperature of 450°C for 30 minutes to solidify the paste and remove volatiles from the paste to prevent it from affecting the subsequent vacuum annealing process. A second electrode layer with a thickness of approximately 100 μm is obtained.

[0123] (6) The ceramic substrate formed with the second electrode layer is subjected to vacuum annealing at an annealing temperature of 700° C. and a holding time of 2.5 h to obtain the atomizer core of this embodiment.

[0124] Comparative Example 1

[0125] Comparative Example 1 provides a traditional atomizer core, the structure of which is shown in FIG3 , and the preparation steps are as follows:

[0126] (1) Plasma etching is performed on the ceramic substrate at a voltage of 1000 V, a current of 2 A, and a time of 120 s. A heating element is then grown on the etched ceramic substrate. The heating element is made of stainless steel.

[0127] (2) Screen print silver paste on part of the surface of the heating element.

[0128] (3) The ceramic substrate with the silver paste printed on it was sintered at a temperature of 450°C and a holding time of 30 minutes. This allowed the electrode paste to solidify and set while fully removing the volatiles in the paste to avoid affecting the subsequent vacuum annealing process, resulting in an electrode with a thickness of approximately 100 μm.

[0129] (4) The sintered ceramic substrate is vacuum annealed at a temperature of 700°C and a holding time of 2.5 hours to obtain an atomizing core.

[0130] The resistance values ​​of the atomizer core of Comparative Example 1 at different puff times are shown in Table 1 below:

[0131] Table 1

[0132] The resistance of the atomizer core of Example 1 at different puff times is shown in Table 2 below:

[0133] Table 2

[0134] The resistance values ​​of the atomizer cores prepared in Comparative Example 1 and Example 1 at different puff times are shown in Figures 8 and 9, respectively. In the figures, the horizontal axis represents the number of puffs, and the vertical axis represents the resistance value, in Ω.

[0135] It can be seen from FIG8 and FIG9 that the resistance of the atomizer core obtained in Example 1 is lower.

[0136] The atomizer cores prepared in Comparative Example 1 and Example 1 were used in an atomizer device. Multiple puffs were performed to obtain the average smoke volume, which is shown in Table 3, Figures 10, and 11. Figure 10 corresponds to the smoke volume for Comparative Example 1, and Figure 11 corresponds to the smoke volume for Example 1. In Figures 10 and 11, the abscissa represents the sample number, and the ordinate represents the smoke volume, in mg / puff.

[0137] Table 3

[0138] It can be seen from Table 3 and Figures 10 and 11 that the atomizer core prepared in Example 1 is used in an atomizer device. Under the same test conditions, the amount of smoke is larger and more stable.

[0139] Please refer to Figures 12 and 13. Figure 12 is a scanning electron microscope image of the cross-section of the atomizer core prepared in Example 1 shown in Figure 13. The specific corresponding cross-sectional position is shown in Figure 13. In Figure 12, the atomizer core includes a substrate 410, a first electrode layer 422, a first heating element layer 424 and a second electrode layer 426 stacked in sequence. As shown in Figure 12, the flatness of the porous substrate 410 is poor, but through the arrangement of the first electrode layer 422, the first heating element layer 424 and the second electrode layer 426, the surface of the second electrode layer 426 that is in electrical contact with the external electrode / elastic pin ultimately has a good surface flatness, thereby achieving better electrical contact with the external electrode / elastic pin and reducing the contact resistance between the two. Furthermore, the atomizer core also includes a second heating element layer 432 arranged on the surface of the substrate 410. In Figure 12, the second heating element layer 432 is directly arranged on the surface of the substrate 410, the first heating element layer 424 is directly arranged on the side surface of the first electrode layer 422 away from the substrate 410, and the second electrode layer 426 is arranged on the side surface of the first heating element layer 424 away from the first electrode layer 422.

[0140] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0141] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An atomizing core, wherein: include: matrix; The electrode portion includes a first electrode layer, a first heating element layer, and a second electrode layer stacked on the surface of the substrate.

2. The atomizer core according to claim 1, wherein: The first heating element layer is in-situ grown on a surface of the first electrode layer that is away from the substrate.

3. The atomizer core according to claim 2, wherein: The first heating element layer is formed by physical vapor deposition.

4. The atomizer core according to any one of claims 1 to 3, wherein: The first heating element layer is disposed on the surface of the first electrode layer, and the first heating element layer accounts for approximately 0.5 to 1 of the surface of the first electrode layer.

5. The atomizer core according to any one of claims 1 to 4, wherein: The second electrode layer is disposed on a surface of the first heating element layer away from the first electrode layer and completely covers the first heating element layer.

6. The atomizer core according to any one of claims 1 to 5, wherein: Also includes: The heating portion includes a second heating element layer provided on the surface of the base; the heating portion is electrically connected to the electrode portion.

7. The atomizer core according to claim 6, wherein: The second heat generating layer is integrally formed with the first heat generating layer.

8. The atomizer core according to claim 7, wherein: The second heat generating layer and the first heat generating layer are each independently made of metal.

9. The atomizer core according to claim 8, wherein: The materials of the second heating element layer and the first heating element layer independently include at least one of titanium, zirconium, titanium-aluminum alloy, titanium-zirconium alloy, titanium-molybdenum alloy, titanium-niobium alloy, iron-aluminum alloy, tantalum-aluminum alloy or stainless steel.

10. The atomizer core according to any one of claims 6 to 9, wherein: The heat generating portion and the electrode portion are provided on the same surface of the base.

11. The atomizer core according to any one of claims 6 to 10, wherein: The heating portion further includes a protective layer provided on a surface of the second heating element layer on a side away from the base.

12. The atomizer core according to claim 11, wherein: The material of the protective layer includes at least one of aluminum oxide, silicon oxide or an inert metal.

13. The atomizer core according to any one of claims 6 to 12, wherein: The heat generating portion further includes a bonding layer provided between the second heat generating layer and the base.

14. The atomizer core according to claim 13, wherein: The material of the bonding layer includes glass.

15. The atomizer core according to any one of claims 1 to 14, wherein: The thickness of the first electrode layer and the second electrode layer are each independently about 10 μm to about 200 μm.

16. The atomizer core according to any one of claims 1 to 15, wherein: The materials of the first electrode layer and the second electrode layer each independently include one metal or an alloy of several metals selected from Au, Ag, Pt, Al and Cu.

17. The atomizer core according to claim 16, wherein: Materials of the first electrode layer and the second electrode layer both include Ag.

18. The atomizer core according to any one of claims 1 to 17, wherein: The first electrode layer includes two first electrodes, and the two first electrodes are spaced apart and arranged at two ends of the substrate.

19. The atomizer core according to any one of claims 1 to 18, wherein: The second electrode layer includes two second electrodes, and the two second electrodes are spaced apart and arranged at two ends of the substrate.

20. The atomizer core according to any one of claims 1 to 19, wherein: The matrix is a porous matrix.

21. The atomizer core according to claim 20, wherein: The substrate is a porous ceramic substrate.

22. The atomizer core according to any one of claims 1 to 21, wherein: The matrix is activated.

23. An atomizing device, wherein: Comprising the atomizer core according to any one of claims 1 to 22.

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