Display panel and manufacturing method therefor, and display apparatus

Abstract

The present disclosure relates to the technical field of display, and to a display panel, a manufacturing method therefor, and a display apparatus. The display panel comprises: a display area, a light-transmitting area and an isolation area located therebetween, at least part of the isolation area being arranged around the light-transmitting area. The display panel comprises: a base substrate; supporting structures formed on a side of the base substrate, the adjacent supporting structures being spaced apart from each other; and metal isolation pillars formed on the side of the base substrate and covering part of the surface of the side of each supporting structure facing away from the base substrate, at least one side of some of the metal isolation pillars located on the surfaces of the supporting structures facing and / or facing away from the light-transmitting area being provided with recesses surrounding the light-transmitting area. In the display panel, optimization design is implemented for the structure of the isolation pillars, reducing the difficulty in manufacturing and improving the manufacturing effect. In addition, the structural design in the present disclosure can increase the top area of the isolation pillars to improve an adhesive force, and avoid a hollow structure when an encapsulation layer is formed, so as to improve the stress capability.

Description

Display panel and manufacturing method thereof, and display device

[0001] Cross-references

[0002] The present disclosure claims priority to Chinese patent application number 202410138442.6 filed on January 31, 2024, entitled “Display panel, preparation method thereof, and display device”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0004] With the continuous development of display technology, the application scenarios of display panels are gradually increasing, and the demand for display effects and performance of display panels is becoming increasingly higher. To adapt to different application scenarios, display devices often require perforations to facilitate the installation of devices such as cameras and sensors. However, perforations in display panels can easily cause GDSH (Growing Dark Spot at HIAA), which is water vapor oxidation in the light-transmitting area caused by cracks, scratches, or top damage caused by packaging or external forces.

[0005] Existing display panels usually block the connectivity of organic materials in the organic light-emitting material layer by setting isolation columns to prevent water vapor from entering the display area along the organic materials in the organic light-emitting material layer during laser drilling, thereby causing device failure and triggering the GDSH phenomenon of the display panel, affecting the display effect and service life of the display panel.

[0006] However, the top area of ​​the existing isolation column is limited, and the top layer of the isolation column is prone to peeling when the film is torn off, and the CVD (Chemical Vapor Deposition) layer used to encapsulate the isolation column is prone to cracking, which will result in incomplete power off of the isolation column and cause reliability failure.

[0007] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute relevant technology known to ordinary technicians in the field. Summary of the Invention

[0008] The purpose of the present disclosure is to overcome the deficiencies of the above-mentioned related technologies and to provide a display panel and a manufacturing method thereof, and a display device.

[0009] According to one aspect of the present disclosure, a display panel is provided, comprising: a display area, a light-transmitting area, and an isolation area between the display area and the light-transmitting area, wherein at least a portion of the isolation area is disposed around the light-transmitting area; wherein the display panel comprises:

[0010] substrate;

[0011] A support structure is formed on one side of the base substrate, and adjacent support structures are spaced apart;

[0012] A metal isolation column is located in the isolation area and is arranged around the light-transmitting area; the metal isolation column is formed on one side of the base substrate and covers a portion of the surface of the support structure facing away from the base substrate, and the portion of the metal isolation column located on the surface of the support structure is provided with a recess surrounding the light-transmitting area on at least one side facing and / or away from the light-transmitting area.

[0013] Optionally, the support structure includes two sloped areas arranged opposite to each other and a flat area located between the two sloped areas; the orthographic projection of the metal isolation column on the substrate overlaps with the orthographic projection of the sloped area on the substrate, and the orthographic projection of the metal isolation column on the substrate overlaps with part of the orthographic projection of the flat area on the substrate.

[0014] Optionally, adjacent metal isolation columns are spaced apart to form isolation trenches, and the orthographic projection of the isolation trench on the base substrate is located within the orthographic projection of the flat area on the base substrate.

[0015] Optionally, the depth of the recess is less than and greater than

[0016] Optionally, the metal isolation column includes a first metal layer, a second metal layer and a third metal layer, wherein:

[0017] A first metal layer is located on one side of the substrate;

[0018] a second metal layer, located on a side of the first metal layer facing away from the substrate;

[0019] a third metal layer, located on a side of the second metal layer facing away from the substrate;

[0020] The orthographic projection of the second metal layer on the base substrate is located within the orthographic projection of the third metal layer on the base substrate, and the orthographic projection of the second metal layer on the base substrate is located within the orthographic projection of the first metal layer on the base substrate, so as to form the recess.

[0021] Optionally, the material of the first metal layer includes titanium;

[0022] And / or, the material of the second metal layer includes aluminum;

[0023] And / or, the material of the third metal layer includes titanium.

[0024] Optionally, the isolation region includes a first sub-isolation region and a second sub-isolation region, the first sub-isolation region is arranged around the light-transmitting region, and the second sub-isolation region is arranged around the first sub-isolation region;

[0025] The metal isolation column located in the second sub-isolation region has a different structure from the metal isolation column located in the first sub-isolation region.

[0026] Optionally, the support structure includes an insulating layer; the insulating layer includes a plurality of insulating sublayers.

[0027] Optionally, the support structure comprises a metal layer.

[0028] Optionally, the metal layer of the support structure is in direct contact with the metal isolation column.

[0029] Optionally, the display panel also includes a driving circuit layer, the driving circuit layer includes a thin film transistor formed on the base substrate and located in the display area, the thin film transistor includes a gate and a source-drain electrode formed on the side of the gate away from the base substrate; the metal layer in the supporting structure is prepared on the same layer as the gate.

[0030] Optionally, the gate includes a first sub-gate and a second sub-gate, the second sub-gate is located on a side of the first sub-gate away from the first sub-gate, and the orthographic projection of the second sub-gate on the substrate is located within the orthographic projection of the first sub-gate on the substrate.

[0031] Optionally, an overlap width between an orthographic projection of a portion of the metal isolation column located between the recess and the base substrate and an orthographic projection of the second sub-gate on the base substrate is greater than 1.5 μm.

[0032] Optionally, the display panel also includes: an organic light-emitting material layer formed on the side of the metal isolation column facing away from the base substrate; the organic light-emitting material layer is disconnected at the side of the metal isolation column having the recess, and the organic light-emitting material layer covers the surface of the support structure not covered by the metal isolation column.

[0033] Optionally, the display panel further includes: a cathode layer formed on a side of the organic light-emitting material layer facing away from the base substrate, and the cathode layer is disconnected at a side of the metal isolation column having the notch.

[0034] Optionally, the display panel further includes an encapsulation layer formed on a side of the cathode layer facing away from the base substrate, and the encapsulation layer forms a groove at a position corresponding to the support structure not covered by the metal isolation column.

[0035] Optionally, the display panel further includes a filling layer formed on a side of the encapsulation layer away from the base substrate, and the filling layer fills the groove.

[0036] According to another aspect of the present disclosure, the present disclosure provides a display device, comprising a display panel provided by any of the above technical solutions.

[0037] According to another aspect of the present disclosure, a method for manufacturing a display panel is provided. The display panel includes a display area, a light-transmitting area, and an isolation area between the display area and the light-transmitting area, wherein at least a portion of the isolation area is disposed around the light-transmitting area. The method includes:

[0038] providing a substrate;

[0039] forming a support structure on the base substrate, with adjacent support structures spaced apart;

[0040] A metal isolation column is formed in the isolation area of ​​the base substrate, and the isolation column is controlled to be arranged around the light-transmitting area. The metal isolation column covers a portion of the surface of the support structure facing away from the base substrate, and the portion of the metal isolation column located on the surface of the support structure is provided with a recess surrounding the light-transmitting area on at least one side facing and / or away from the light-transmitting area.

[0041] In the display panel provided by the present disclosure, metal isolation columns are arranged in the isolation area to surround the light-transmitting area and protect the display area to prevent the occurrence of the GDSH phenomenon. Part of the metal isolation columns are placed on the surface of the base substrate that is not covered by the supporting structure, and the metal isolation columns extend from the portion covering the base substrate to the portion of the surface of the support structure facing away from the base substrate. Accordingly, the coverage area of ​​the metal isolation columns in the present disclosure is increased, the top area of ​​the metal isolation columns is increased, and the adhesion is increased. Therefore, in the subsequent film tearing operation, peeling is not easy to occur on the top of the metal isolation columns, which can improve the structural performance and service life of the display panel.

[0042] At the same time, since the portion of the support structure not covered by the metal isolation column is relatively flat, the undercut structure is smoother when the notch is formed. Moreover, since part of the metal isolation column extends from the portion covering the base substrate to the portion covering the support structure, there is a climbing area in the metal isolation column. It is worth noting that since part of the metal isolation column located on the surface of the support structure is provided with a notch surrounding the light-transmitting area on at least one side facing and / or away from the light-transmitting area, when forming the subsequent organic light-emitting material layer, the organic light-emitting material layer can be interrupted on the side where the notch is formed by the metal isolation column to effectively isolate the organic light-emitting material layer.

[0043] Furthermore, when the encapsulation layer is used for encapsulation, it covers the metal isolation pillars and the portion of the support structure not covered by the metal isolation pillars. Because the portion of the support structure not covered by the metal isolation pillars is relatively flat, the encapsulation layer does not form a hollow structure when encapsulating this portion, which can improve stress resistance and prevent cracks.

[0044] Accordingly, the metal isolation column in the display panel provided by the present disclosure can effectively cut off power and ensure reliability.

[0045] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0047] FIG1 is a schematic plan view of a display panel in the related art;

[0048] FIG2 is a top view of the structure in the isolation area of ​​FIG1 ;

[0049] FIG3 is a schematic cross-sectional view of the display panel along line AA in FIG1 ;

[0050] FIG4 is a second cross-sectional schematic diagram of the display panel along line AA in FIG1 ;

[0051] FIG5 is a schematic plan view of a display panel provided by an embodiment of the present disclosure;

[0052] FIG6 is a top view of the structure in the isolation area of ​​FIG5;

[0053] FIG7 is a schematic cross-sectional view of the display panel along line BB in FIG5 ;

[0054] FIG8 is a second cross-sectional schematic diagram of the display panel along line BB in FIG5 ;

[0055] FIG9 is a third cross-sectional schematic diagram of the display panel along line BB in FIG5 ;

[0056] FIG10 is a fourth cross-sectional schematic diagram of the display panel along line BB in FIG5 ;

[0057] 11A to 11E are schematic diagrams of film layer changes during the manufacturing process of a display panel provided by an embodiment of the present disclosure;

[0058] 12A to 12E are schematic diagrams of another type of film layer changes during the preparation process of the display panel provided by an embodiment of the present disclosure.

[0059] Reference numerals: Related technology: 01, display area; 011, light-transmitting area; 012, isolation area; 1', substrate; 2', insulating layer; 3', SD metal layer; 4', organic light-emitting material layer; 5', cathode layer; 6', encapsulation layer; 7', metal layer;

[0060] The present disclosure: 100, display area; 110, light-transmitting area; 120, isolation area; 121, first sub-isolation area; 122, second sub-isolation area; 1, substrate; 2, buffer layer; 3, insulating layer; 4, metal isolation column; 41, first metal layer; 42, second metal layer; 421, notch; 43, third metal layer; 44, isolation groove; 5, organic light-emitting material layer; 6, cathode layer; 7, encapsulation layer; 8, filling layer; 9, metal layer; 91, first sub-gate; 92, second sub-gate; S, supporting structure; S1, slope area; S2, flat area. DETAILED DESCRIPTION

[0061] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent identical or similar structures, and thus their detailed descriptions will be omitted. Furthermore, the figures are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0062] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0063] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity thereof.

[0064] Figure 1 is a planar schematic diagram of a display panel in the related art. The structure of the display panel in the related art shown in Figure 1 is used for illustrative explanation. The display panel includes a display area 01, a light-transmitting area 011 is provided in the display area 01, and an isolation area 012 is provided around the light-transmitting area 011 to avoid the GDSH phenomenon caused by punching holes in the display panel.

[0065] FIG2 is a top view of the structure within the isolation region 012 in FIG1 . As shown in FIG2 , an isolation column is generally provided within the isolation region. FIG2 exemplarily illustrates two types of isolation columns, an isolation column A and an isolation column B, wherein the structure of the isolation column A is shown in FIG3 , and the structure of the isolation column B is shown in FIG4 . As shown in FIG3 , the isolation column A includes an insulating layer 2' disposed on a base substrate 1' and an SD (source-drain) metal layer 3' located on the side of the insulating layer 2' facing away from the base substrate 1', wherein the insulating layer 2' is patterned, and the SD metal layer 3' is patterned and discontinuous. The difference between the isolation column B and the isolation column A is that the insulating layer 2' at the bottom of the SD metal layer 3' is changed into a metal layer 7'.

[0066] 3 and 4 , an organic light-emitting material layer 4 ', a cathode layer 5 ' and an encapsulation layer 6 ' are sequentially provided on the side of the isolation column A and the isolation column B facing away from the base substrate 1 ', wherein the organic light-emitting material layer 4 ' and the cathode layer 5 ' are disconnected at the SD metal layer 3 ' to avoid the GDSH phenomenon.

[0067] It is worth noting that when preparing the structures in Figures 3 and 4, the material layer forming the SD metal layer 3' needs to be etched to form an undercut structure. This structure is easily affected by the alignment of the Mask and falls on the climbing area of ​​the insulating layer 2' or the metal layer 7', resulting in the morphology of the formed isolation column being ever-changing, and thus unable to effectively isolate the material of the organic light-emitting material layer 4'.

[0068] Secondly, because the SD metal layer 3' is only positioned on top of the insulating layer 2' and metal layer 7', the top surface area of ​​the SD metal layer 3' is small, resulting in weak adhesion and easy peeling. Furthermore, the structure of the related art results in a long outer slope area of ​​the isolation column. During the deposition of the encapsulation layer 6', the material is mostly unable to fill the undercut structure, which is prone to cracking under external forces. This can lead to incomplete power-off of the isolation column and reliability failure.

[0069] Based on this, the disclosed embodiments optimize the structure of the spacer pillars, reducing the difficulty of manufacturing them and improving their effectiveness. Furthermore, the structural design in the disclosed embodiments increases the top area of ​​the spacer pillars to improve adhesion and avoids hollow structures when forming the encapsulation layer, thereby improving stress tolerance.

[0070] FIG5 is a planar schematic diagram of a display panel provided by an embodiment of the present disclosure. As shown in FIG5 , the present disclosure provides a display panel. In order to facilitate the subsequent processing of required components in various areas of the display panel, each area can be first defined on the base substrate 1. For example, the base substrate 1 can be first divided into a display area 100, a light-transmitting area 110, and an isolation area 120. The light-transmitting area 110 is used for allowing imaging or other sensing signals to pass through. Exemplarily, the light-transmitting area 110 is provided with an opening or is entirely an opening; at least a portion of the isolation area 120 is arranged around the light-transmitting area 110 to avoid the GDSH phenomenon caused by punching holes in the display panel.

[0071] Figure 6 is a top view of the structure within the isolation region 120 in Figure 5 ; Figure 7 is a schematic cross-sectional view of the display panel along line BB in Figure 5 ; and Figure 8 is a second schematic cross-sectional view of the display panel along line BB in Figure 5 . As shown in Figures 5 to 8 , the display panel includes: a base substrate 1, support structures S, and metal spacers 4. The support structures S are formed on one side of the base substrate 1, with adjacent support structures S spaced apart. The metal spacers 4 are formed on one side of the base substrate 1 and located within the isolation region 120 ; the metal spacers 4 are located within the isolation region 120 and surround the light-transmitting region 110 ; the metal spacers 4 are formed on one side of the base substrate 1 and cover a portion of the surface of the support structure S facing away from the base substrate 1 . A portion of the metal spacers 4 located on the surface of the support structure S is provided with a recess 421 surrounding the light-transmitting region 110 on at least one side facing and / or facing away from the light-transmitting region 110 .

[0072] In the display panel provided in the embodiment of the present disclosure, the metal isolation column 4 is arranged in the isolation area 120 to surround the light-transmitting area 110 and protect the display area 100 to prevent the occurrence of the GDSH phenomenon. Part of the metal isolation column 4 is placed on the surface of the base substrate 1 that is not covered by the support structure S, and the metal isolation column 4 extends from the part covering the base substrate 1 to the part of the surface of the support structure S that is away from the base substrate 1. Accordingly, in the embodiment of the present disclosure, the coverage area of ​​the metal isolation column 4 is increased, the top area of ​​the metal isolation column 4 is increased, and the adhesion is increased. Therefore, in the subsequent film tearing operation, peeling is not easy to occur on the top of the metal isolation column 4, which can improve the structural performance and service life of the display panel.

[0073] At the same time, since the portion of the support structure S not covered by the metal isolation column 4 is relatively flat, the undercut structure is smoother when the recess 421 is formed. Moreover, since part of the metal isolation column 4 extends from the portion covering the base substrate 1 to the portion covering the support structure S, there is a climbing area on the metal isolation column 4. It is worth noting that since part of the metal isolation column 4 located on the surface of the support structure S is provided with a recess 421 surrounding the light-transmitting area 110 on at least one side facing and / or away from the light-transmitting area 110, when the subsequent organic light-emitting material layer 5 is formed, the organic light-emitting material layer 5 can be interrupted on the side where the recess 421 is formed on the metal isolation column 4, so as to effectively isolate the organic light-emitting material layer 5.

[0074] Furthermore, as shown in FIG8 , when encapsulation layer 7 is used for encapsulation, it covers the metal spacers 4 and the portion of the support structure S not covered by the metal spacers 4. Because the portion of the support structure S not covered by the metal spacers 4 is relatively flat, no hollow structure is formed when encapsulating this portion, thereby improving stress tolerance and preventing cracks.

[0075] It is worth noting that the smaller the slope angle, the smoother the encapsulation layer 7 formed after evaporation, making it less likely to crack. In the embodiment of the present disclosure, the metal isolation columns 4 within the display panel are placed on the surface of the support structure S. When encapsulated using the encapsulation layer 7, the slope of the encapsulated structure is smaller than in related art. Therefore, the encapsulation layer 7 in the embodiment of the present disclosure achieves a better encapsulation effect.

[0076] It should be understood that, since the SD metal layer 3' and the insulating layer 2' or the metal layer 7' in the related art form a structure to be packaged, multiple film layers are stacked in the structure to be packaged, and thus the slope of the structure to be packaged is relatively large.

[0077] Therefore, the metal isolation column 4 in the display panel provided by the embodiment of the present disclosure can effectively cut off power and ensure reliability.

[0078] It's worth noting that during the preparation of the metal spacers 4, a full metal layer must be laid down, followed by a patterning process to create the desired metal spacers 4. Compared to the SD metal layer 3' in related art solutions, the present embodiment forms the metal spacers 4 using a reversed metal layer, and notches 421 are formed on the side surfaces of the etched metal layer. Specifically, the fracture surface of the patterned metal layer is projected onto the support structure S, increasing the coverage area of ​​the metal spacers 4 and enhancing their adhesion.

[0079] Understanding it from another perspective, the patterned metal layer is mainly located in the gap of the support structure S, and part of the metal layer extends upward from the gap position to the support structure S to form a metal isolation column 4, thereby increasing the coverage area of ​​the metal isolation column 4 and increasing its adhesion.

[0080] It is worth noting that when the display panel is a flexible panel, the provided base substrate 1 can be a flexible substrate such as polyimide (PI), and when the display panel is a rigid substrate, the base substrate 1 can be a rigid substrate such as glass or quartz.

[0081] It is understood that other structural layers may be provided on the surface of the base substrate 1. For example, a buffer layer 2 (buffer) is provided on the surface of the base substrate 1, and structures such as the support structure S and the metal isolation column 4 can be provided on the surface of the buffer layer 2. In fact, the buffer layer 2 can serve as part of the support structure S. The specific configuration can be based on needs and will not be described here. The buffer layer 2 can be made of materials such as silicon nitride and silicon oxide. While achieving the effect of blocking water, oxygen and alkaline ions, it can also protect other structures on the base substrate 1.

[0082] As shown in Figures 7 to 10 , the support structure S includes two opposing sloped regions S1 and a flat region S2 located between the two sloped regions S1. The orthographic projection of the metal spacer 4 on the substrate 1 overlaps with the orthographic projection of the sloped region S1, and the orthographic projection of the metal spacer 4 on the substrate 1 partially overlaps with the orthographic projection of the flat region S2 on the substrate 1. It should be understood that the separation of the sloped region S1 and the flat region S2 in Figures 7 to 10 is schematic and not intended to be limiting.

[0083] It should be noted that, as shown in Figures 3 and 4 , the sloped areas of the insulating layer 2' and metal layer 7' in the related art do not cover the SD metal layer 3' used to form the isolation pillars. However, as shown in Figures 7 to 10 , the sloped area S1 of the support structure S in the structure provided by the present embodiment covers a large area of ​​the metal layer used to form the metal isolation pillars 4, improving the adhesion of the resulting metal isolation pillars 4 and preventing peeling.

[0084] In one embodiment of the present disclosure, as shown in FIG. 7 and FIG. 9 , adjacent metal isolation columns 4 are spaced apart to form isolation grooves 44 , and the orthographic projection of the isolation grooves 44 on the base substrate 1 is located within the orthographic projection of the flat area S2 on the base substrate 1 .

[0085] Specifically, the metal layer 9 used to prepare the metal isolation column 4 is interrupted at the isolation groove 44 and then an undercut structure is formed.

[0086] As shown in Figures 7 to 10, the display panel provided by the embodiment of the present disclosure also includes: an organic light-emitting material layer 5, formed on the side of the metal isolation column 4 facing away from the base substrate 1; the organic light-emitting material layer 5 is disconnected on the side of the metal isolation column 4 having the recess 421, and the organic light-emitting material layer 5 covers the surface of the support structure S that is not covered by the metal isolation column 4.

[0087] When preparing the organic light-emitting material layer 5, the entire layer of preparation material of the organic light-emitting material layer 5 covers the surface of the metal isolation column 4, wherein part of the organic light-emitting material layer 5 is interrupted at the position of the isolation groove 44, and the part of the organic light-emitting material layer 5 corresponding to the isolation groove 44 is covered on the surface of the support structure S.

[0088] Please refer to the structures shown in Figures 7 to 10. The display panel provided by the embodiment of the present disclosure also includes: a cathode layer 6, formed on the side of the organic light-emitting material layer 5 facing away from the base substrate 1, and the cathode layer 6 is disconnected on the side of the metal isolation column 4 having the recess 421.

[0089] During the process of preparing the cathode layer 6 , the cathode layer 6 covers the surface of the organic light-emitting material layer 5 . It is worth noting that the cathode layer 6 is interrupted at the position of the isolation groove 44 .

[0090] It should be noted that in the disclosed embodiment, metal spacers 4 and isolation trenches 44 are provided between the display area 100 and the light-transmitting area 110 to block the organic light-emitting material layer 5, thereby isolating the water and oxygen pathways and also blocking the cathode layer 6. The opening of the recess 421 on the metal spacer 4 can be oriented toward the isolation trench 44 to optimize the isolation effect of the isolation trench 44 on the organic light-emitting material layer 5 and the cathode layer 6, thereby ensuring reliability.

[0091] It is worth noting that the display panel includes a pixel unit located in the display area 100, and the pixel unit may include an anode layer, an organic light-emitting material layer 5 and a cathode layer 6. The anode layer may be formed on the planarization layer before the pixel defining layer. After the pixel defining layer is formed, the organic light-emitting material layer 5 may be evaporated on the entire surface. The organic light-emitting material layer 5 may be separated at the metal isolation column 4, as shown in Figures 7 to 10. After the organic light-emitting material layer 5 is evaporated on the entire surface, the cathode material may also be evaporated on the entire surface to form the above-mentioned cathode layer 6. The cathode material may also be separated at the metal isolation column 4, as shown in Figures 7 to 10.

[0092] It should be noted that the pixel unit may also include functional layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer, which are not shown in the figure. When these layers are formed in the display panel by evaporation, they can all be isolated at the metal isolation column 4.

[0093] For example, the anode layer can be made of materials such as ITO (indium tin oxide), indium zinc oxide (IZO), and zinc oxide (ZnO); the organic light-emitting material layer 5 can include small molecule organic materials or polymer molecule organic materials, which can be fluorescent materials or phosphorescent materials, and can emit red light, green light, blue light, or white light, etc.; the cathode layer 6 can be made of metal materials such as lithium (Li), aluminum (Al), magnesium (Mg), and silver (Ag).

[0094] Please refer to the structures shown in Figures 7 to 10. The display panel provided by the embodiment of the present disclosure also includes an encapsulation layer 7, which is formed on the side of the cathode layer 6 facing away from the base substrate 1, and the encapsulation layer 7 forms a groove at the position where the corresponding support structure S is not covered by the metal isolation column 4.

[0095] It should be understood that the encapsulation layer 7 can be a single-layer structure or a multi-layer structure. Exemplarily, the encapsulation layer 7 includes a first sub-encapsulation layer and a second sub-encapsulation layer. The specific configuration can be based on the needs and will not be described in detail here.

[0096] After the encapsulation layer 7 is undercut, a filling layer 8 as shown in Figures 8 and 10 may be formed. The filling layer 8 is formed on the side of the encapsulation layer 7 facing away from the substrate 1. For example, the filling layer 8 may be an OC (Overcoat) glue or a polyimide (PI) glue.

[0097] It should be noted that after the isolation trench 44 is filled with the organic light-emitting material layer 5, cathode layer 6, and encapsulation layer 7, the encapsulation layer 7 forms a groove on the side facing away from the base substrate 1. When the filling layer 8 completely fills this groove, the isolation trench 44 is essentially completely leveled. When the isolation trench 44 is effectively filled with the filling layer 8, the formation of an undercut hollow structure is avoided, effectively offsetting external forces, thereby improving the mechanical performance of the display panel and reducing the risk of CVD cracks caused by external forces, which can lead to encapsulation failure and GDSH.

[0098] In one embodiment of the present disclosure, as shown in FIG. 7 , the depth a of the notch 421 is less than and greater than

[0099] It should be understood that if the depth of the recess 421 is too deep, it will affect the structural strength of the metal isolation column 4, resulting in the metal isolation column 4 being unable to effectively perform the isolation effect; if the depth of the recess 421 is too shallow, the organic light-emitting material layer 5 and the cathode layer 6 will not be effectively isolated at the isolation groove 44, and there will still be a risk of power failure.

[0100] It should be noted that, in the embodiment of the present disclosure, the depth a of the notch 421 is set to be less than (Angstroms), the structural strength of the metal isolation column 4 can be controlled to be in a better state, and the isolation effect of the isolation groove 44 on the organic light-emitting material layer and the cathode layer 6 can be guaranteed.

[0101] In one embodiment of the present disclosure, as shown in Figures 7 to 10, the metal isolation column 4 includes a first metal layer 41, a second metal layer 42 and a third metal layer 43, wherein: the first metal layer 41 is located on one side of the base substrate 1; the second metal layer 42 is located on the side of the first metal layer 41 away from the base substrate 1; the third metal layer 43 is located on the side of the second metal layer 42 away from the base substrate 1; the orthographic projection of the second metal layer 42 on the base substrate 1 is located within the orthographic projection of the third metal layer 43 on the base substrate 1, and the orthographic projection of the second metal layer 42 on the base substrate 1 is located within the orthographic projection of the first metal layer 41 on the base substrate 1, so as to form a recess 421.

[0102] It should be noted that, when the metal isolation column 4 is configured to include different metal layers, it is convenient to form the notch 421 in the subsequent manufacturing process, thereby reducing the manufacturing difficulty and improving the manufacturing efficiency.

[0103] It is worth noting that the metal isolation column 4 may also include only one metal layer, two metal layers, or more than three metal layers. The specific configuration can be made according to requirements and will not be elaborated herein.

[0104] In one embodiment of the present disclosure, the material of the first metal layer 41 includes titanium; the material of the second metal layer 42 includes aluminum; and the material of the third metal layer 43 includes titanium. Of course, the metals in the first metal layer 41, the second metal layer 42, and the third metal layer 43 can also be set to other materials as needed, and the details are not repeated here.

[0105] It is worth noting that the second metal layer 42 may be side-etched during a subsequent etching process to form a notch 421 structure.

[0106] It is worth noting that the support structure S can be divided into various structural forms according to the material.

[0107] In a specific embodiment, as shown in Figures 7 and 8, the support structure S includes an insulating layer 3. The insulating layer 3 can be a single-layer structure or include multiple insulating sublayers. It is worth noting that during the preparation of the support structure S formed by the insulating layer 3, EBB (Etch Bending B) etching can be used.

[0108] It should be understood that the surface of the substrate 1 may also be provided with several structural layers that play an isolation role, for example, a gate insulating layer (GI) and an interlayer dielectric layer (ILD) provided on the surface of the buffer layer 2, wherein the gate insulating layer and the interlayer dielectric layer can serve as part of the support structure S. Furthermore, the buffer layer 2 can also serve as part of the support structure S together with the gate insulating layer and the interlayer dielectric layer. It is worth noting that in Figures 9 and 10, the gate insulating layer and the buffer layer 2 are shown with the same filler, without distinct regions being demarcated.

[0109] In one embodiment of the present disclosure, as shown in Figures 9 and 10, the support structure S includes a metal layer 9. The metal layer 9 can enhance mechanical properties and prevent cracks from entering the display area 100 along the edge of the hole. It should be understood that in this embodiment, the metal layer 9 can be a single layer or a multi-layer structure.

[0110] In addition, several structural layers that play an isolation role need to be provided between the metal layers 9 or between the metal layer 9 and the metal isolation column 4 . These structural layers can also be understood as part of the support structure S.

[0111] When the support structure S includes a metal layer 9 , in a specific embodiment, the metal layer 9 of the support structure S may be in direct contact with the metal isolation column 4 to further reduce the possibility of peeling and improve the structural performance and service life of the display panel.

[0112] In one embodiment of the present disclosure, as shown in FIG. 6 , the isolation region 120 includes a first sub-isolation region 121 and a second sub-isolation region 122 . The first sub-isolation region 121 is disposed around the light-transmitting region 110 , and the second sub-isolation region 122 is disposed around the first sub-isolation region 121 .

[0113] It should be understood that the structure of the metal isolation pillars 4 located in the second sub-isolation region 122 can be the same as or different from that of the metal isolation pillars 4 located in the first sub-isolation region 121. In one specific embodiment, the bottom support structure S of the metal isolation pillars 4 in the first sub-isolation region 121 includes a metal layer 9 to enhance support. Preferably, the metal isolation pillars 4 in the second sub-isolation region 122 include an insulating layer 3 to facilitate fabrication.

[0114] In one embodiment of the present disclosure, the display panel provided by the embodiment of the present disclosure also includes a driving circuit layer, and the driving circuit layer includes SD metal traces as channels for transmitting electrical signals. Some products use one layer of metal SD1, some products use two layers of metal SD1 / SD2, and some products use three layers of metal SD1 / SD2 / SD3. The metal isolation column 4 can be made of the top metal located on the side of the display panel away from the base substrate 1, such as using SD3 in SD1 / SD2 / SD3 as the metal isolation column 4.

[0115] The driving circuit layer includes a thin film transistor formed on the base substrate 1 and located in the display area 100. The thin film transistor includes a gate electrode and a source / drain electrode formed on the side of the gate electrode facing away from the base substrate 1. The metal layer 9 within the support structure S is formed on the same layer as the gate electrode. It should be understood that the gate electrode can have a single-layer structure or a multi-layer structure.

[0116] In one embodiment of the present disclosure, the gate includes a first sub-gate 91 and a second sub-gate 92, the second sub-gate 92 is located on the side of the first sub-gate 91 away from the first sub-gate 91, and the orthographic projection of the second sub-gate 92 on the substrate 1 is located within the orthographic projection of the first sub-gate 91 on the substrate 1.

[0117] Specifically, the thin film transistor may include a first sub-gate 91, a gate insulating layer, an interlayer dielectric layer, and source / drain electrodes, which are formed sequentially. Specifically, the first sub-gate 91 may be formed on a base substrate 1. Subsequently, a gate insulating layer may be formed on a side of the first sub-gate 91 away from the base substrate 1, an interlayer dielectric layer may be formed on a side of the gate insulating layer away from the base substrate 1, and source / drain electrodes may be formed on a side of the interlayer dielectric layer away from the base substrate 1. The metal spacer 4 shown in FIG. 9 may be fabricated on the same layer as the first sub-gate 91 and / or the second sub-gate 92.

[0118] It should be noted that in the embodiments of the present disclosure, the thin film transistor may further include a semiconductor layer. The aforementioned source and drain electrodes include a source electrode and a drain electrode disposed in the same layer, which may be connected to both ends of the semiconductor layer respectively through vias in the interlayer dielectric layer and the gate insulating layer.

[0119] For example, the gate insulation layer and interlayer dielectric layer mentioned in the embodiments of the present disclosure can be made of inorganic insulating materials, such as silicon oxide, silicon nitride and other inorganic insulating materials; the semiconductor layer can be made of materials such as polysilicon and metal oxide.

[0120] The source and drain can be made of metal materials or alloy materials, such as a metal single layer or multilayer structure formed by molybdenum, aluminum and titanium; among them, when the source and drain are multilayer structures, the multilayer structure can be a multi-metal layer stack, such as a three-layer metal stack of titanium, aluminum and titanium (Ti / Al / Ti).

[0121] In the display panel of the present embodiment, the metal spacers 4 within the first sub-isolation region 121 can be referred to as inner spacers, and the metal spacers 4 within the second sub-isolation region 122 can be referred to as outer spacers. For example, the first sub-gate 91 is named Gate1, and the second sub-gate 92 is named Gate2. The combination of the support structure S with the inner and outer spacers, depending on the material of the support structure S, can be seen in Table 1 below.

[0122] Table 1

[0123] It should be noted that the inner isolation columns and outer isolation columns in the embodiment of the present disclosure are not limited to the above-mentioned combination design. For example, multiple inner isolation columns can be provided, and each has a different structure, etc. Similarly, multiple outer isolation columns can be provided, and each has a different structure.

[0124] In one embodiment of the present disclosure, as shown in FIG9 , the overlap width b between the orthographic projection of the portion of the metal spacer 4 located between the recess 421 and the base substrate 1 and the orthographic projection of the second sub-gate 92 on the base substrate 1 is greater than 1.5 μm. It will be appreciated that when the metal spacer 4 includes the first metal layer 41, the second metal layer 42, and the third metal layer 43, the overlap width b can be understood as the overlap width between the third metal layer 43 and the second sub-gate 92 on the base substrate 1.

[0125] It should be noted that this structural arrangement can optimize the supporting effect of the support structure S on the metal isolation column 4 , as well as optimize the coverage area of ​​the support structure S by the metal isolation column 4 .

[0126] It should be understood that if the overlap width b is too small, the metal isolation column 4 will cover too little area on the top of the support structure S, causing the adhesion of the top structure inside the metal isolation column 4 to decrease, resulting in peeling when tearing the film.

[0127] Of course, the overlap width b has an upper limit, which can be set as needed. When setting the upper limit of the overlap width, it is necessary to ensure that the overlap width b is not too large to prevent the metal spacers 4 from covering too much of the top area of ​​the support structure S, thereby affecting the size of the isolation grooves 44 between the metal spacers 4. This can result in the organic light-emitting material layer 5 not being effectively isolated at the isolation grooves 44, resulting in incomplete power outage and affecting the reliability of the display panel.

[0128] According to another aspect of the embodiments of the present disclosure, a display device is provided, which includes a display panel provided by any of the above technical solutions.

[0129] In the display device provided by the embodiment of the present disclosure, the metal isolation column 4 in the display panel is arranged in the isolation area 120 to surround the light-transmitting area 110 and protect the display area 100 to prevent the occurrence of the GDSH phenomenon. Part of the metal isolation column 4 is placed on the surface of the base substrate 1 that is not covered by the support structure S, and the metal isolation column 4 extends from the part covering the base substrate 1 to the part of the surface of the support structure S that is away from the base substrate 1. Accordingly, in the embodiment of the present disclosure, the coverage area of ​​the metal isolation column 4 is increased, the top area of ​​the metal isolation column 4 is increased, and the adhesion is increased. Therefore, in the subsequent film tearing operation, peeling is not easy to occur on the top of the metal isolation column 4, which can improve the structural performance and service life of the display panel.

[0130] At the same time, since the portion of the support structure S not covered by the metal isolation column 4 is relatively flat, the undercut structure is smoother when the recess 421 is formed. Moreover, since part of the metal isolation column 4 extends from the portion covering the base substrate 1 to the portion covering the support structure S, there is a climbing area on the metal isolation column 4. It is worth noting that since part of the metal isolation column 4 located on the surface of the support structure S is provided with a recess 421 surrounding the light-transmitting area 110 on at least one side facing and / or away from the light-transmitting area 110, when the subsequent organic light-emitting material layer 5 is formed, the organic light-emitting material layer 5 can be interrupted on the side where the recess 421 is formed on the metal isolation column 4, so as to effectively isolate the organic light-emitting material layer 5.

[0131] Furthermore, when encapsulating the support structure S using the encapsulation layer 7, the encapsulation layer 7 covers the metal spacers 4 and the portion of the support structure S not covered by the metal spacers 4. Because the portion of the support structure S not covered by the metal spacers 4 is relatively flat, the encapsulation layer 7 does not form a hollow structure when encapsulating this portion, thereby improving stress tolerance and preventing cracks.

[0132] Accordingly, in the display device provided by the embodiment of the present disclosure, the metal isolation column 4 in the display panel can effectively cut off the power supply to ensure reliability.

[0133] According to another aspect of the present disclosure, an embodiment of the present disclosure provides a method for manufacturing a display panel. Referring to the structures shown in Figures 11A to 11E and Figures 12A and 12E in conjunction with Figures 5 to 10 , the display panel includes a display area 100, a light-transmitting area 110, and an isolation area 120 located between the display area 100 and the light-transmitting area 110. The isolation area 120 is at least partially disposed around the light-transmitting area 110. The manufacturing method includes:

[0134] Providing a substrate 1;

[0135] A support structure S is formed on the base substrate 1, with adjacent support structures S spaced apart;

[0136] A metal isolation column 4 is formed in the isolation area 120 of the base substrate 1, and the isolation column is controlled to be arranged around the light-transmitting area 110. The metal isolation column 4 covers a portion of the surface of the support structure S facing away from the base substrate 1, and a portion of the metal isolation column 4 located on the surface of the support structure S is provided with a recess 421 surrounding the light-transmitting area 110 on at least one side facing and / or away from the light-transmitting area 110.

[0137] In the display panel prepared by the preparation method provided by the embodiment of the present disclosure, the metal isolation column 4 is arranged in the isolation area 120 to surround the light-transmitting area 110 and protect the display area 100 to prevent the occurrence of the GDSH phenomenon. Part of the metal isolation column 4 is placed on the surface of the base substrate 1 that is not covered by the support structure S, and the metal isolation column 4 extends from the part covering the base substrate 1 to the part of the surface of the support structure S that is away from the base substrate 1. Accordingly, in the embodiment of the present disclosure, the coverage area of ​​the metal isolation column 4 is increased, the top area of ​​the metal isolation column 4 is increased, and the adhesion is increased. Therefore, in the subsequent film tearing operation, peeling is not easy to occur on the top of the metal isolation column 4, which can improve the structural performance and service life of the display panel.

[0138] At the same time, since the portion of the support structure S not covered by the metal isolation column 4 is relatively flat, the undercut structure is smoother when the recess 421 is formed. Moreover, since part of the metal isolation column 4 extends from the portion covering the base substrate 1 to the portion covering the support structure S, there is a climbing area on the metal isolation column 4. It is worth noting that since part of the metal isolation column 4 located on the surface of the support structure S is provided with a recess 421 surrounding the light-transmitting area 110 on at least one side facing and / or away from the light-transmitting area 110, when the subsequent organic light-emitting material layer 5 is formed, the organic light-emitting material layer 5 can be interrupted on the side where the recess 421 is formed on the metal isolation column 4, so as to effectively isolate the organic light-emitting material layer 5.

[0139] Furthermore, when encapsulating the support structure S using the encapsulation layer 7, the encapsulation layer 7 covers the metal spacers 4 and the portion of the support structure S not covered by the metal spacers 4. Because the portion of the support structure S not covered by the metal spacers 4 is relatively flat, the encapsulation layer 7 does not form a hollow structure when encapsulating this portion, thereby improving stress tolerance and preventing cracks.

[0140] Accordingly, in the display panel manufactured using the manufacturing method provided by the embodiment of the present disclosure, the metal isolation column 4 can effectively cut off power and ensure reliability.

[0141] It should be understood that the TSP process includes a process for manufacturing the touch layer 30 .

[0142] In one embodiment of the present disclosure, the support structure S includes two oppositely disposed slope regions S1 and a flat region S2 located between the two slope regions S1. A method for forming a metal isolation column 4 in the isolation region 120 of the substrate 1 includes:

[0143] A metal isolation layer is formed on the support structure S, and a portion of the metal isolation layer corresponding to the flat area S2 is removed by a patterning process to form an initial metal isolation column 4;

[0144] The initial metal isolation column 4 is side-etched to form a notch 421 and form the metal isolation column 4 .

[0145] For example, the manufacturing process of the display panel in the embodiment of the present disclosure is shown in Figures 11A to 11E and Figures 12A to 12E, which is consistent with the etching of the display panel in the related art, and no mask is added. First, after the interlayer dielectric layer is completed, a metal layer is deposited on the large plate to form the structure shown in Figure 11A, and then the glue is applied, exposed, developed, and etched to form the initial metal isolation column 4 as shown in Figure 11D. It is worth noting that the glue layer needs to be peeled off later, and in the exposure / development / peeling process, if the adhesion of the metal isolation column 4 is insufficient during peeling, the metal on its top may be taken away.

[0146] Afterwards, the initial metal spacer 4 is side-etched to form a metal spacer 4 with a notch 421, as shown in FIG11E . Next, as shown in FIG7 , an organic light-emitting material layer 5 and a cathode layer 6 are deposited, followed by an encapsulation layer 7 for encapsulation. Finally, a filler is applied to flatten the grooves of the encapsulation layer 7, forming the structure shown in FIG8 , in preparation for the TSP process.

[0147] It is worth noting that before preparing the organic light-emitting material layer 5, an anode layer needs to be prepared, which is not shown in Figures 11A to 11E and Figures 12A and 12E. However, the recess 421 of the display panel is formed simultaneously when etching the anode layer.

[0148] It should be noted that although the steps of the method for manufacturing a display panel in the present disclosure are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in this specific order, or that all steps must be performed to achieve the desired results. Additionally or alternatively, certain steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps.

[0149] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A display panel, characterized in that: include: A display area, a light-transmitting area, and an isolation area between the display area and the light-transmitting area, wherein at least a portion of the isolation area surrounds the light-transmitting area; wherein the display panel comprises: substrate; A support structure is formed on one side of the base substrate, and adjacent support structures are spaced apart; A metal isolation column is located in the isolation area and is arranged around the light-transmitting area; the metal isolation column is formed on one side of the base substrate and covers a portion of the surface of the support structure facing away from the base substrate, and the portion of the metal isolation column located on the surface of the support structure is provided with a recess surrounding the light-transmitting area on at least one side facing and / or away from the light-transmitting area.

2. The display panel according to claim 1, wherein: The supporting structure includes two slope areas arranged opposite to each other and a flat area located between the two slope areas; the orthographic projection of the metal isolation column on the base substrate overlaps with the orthographic projection of the slope area on the base substrate, and the orthographic projection of the metal isolation column on the base substrate overlaps with part of the orthographic projection of the flat area on the base substrate.

3. The display panel according to claim 2, wherein: Adjacent metal isolation columns are spaced apart to form isolation grooves, and the orthographic projection of the isolation groove on the base substrate is located within the orthographic projection of the flat area on the base substrate.

4. The display panel according to any one of claims 1 to 3, wherein: The depth of the notch is less than and greater than 5. The display panel according to claim 4, wherein: The metal isolation column includes a first metal layer, a second metal layer and a third metal layer, wherein: A first metal layer is located on one side of the substrate; a second metal layer, located on a side of the first metal layer facing away from the substrate; a third metal layer, located on a side of the second metal layer facing away from the substrate; The orthographic projection of the second metal layer on the base substrate is located within the orthographic projection of the third metal layer on the base substrate, and the orthographic projection of the second metal layer on the base substrate is located within the orthographic projection of the first metal layer on the base substrate, so as to form the recess.

6. The display panel according to claim 5, wherein: The material of the first metal layer includes titanium; And / or, the material of the second metal layer includes aluminum; And / or, the material of the third metal layer includes titanium.

7. The display panel according to any one of claims 1 to 3, characterized in that: The isolation region includes a first sub-isolation region and a second sub-isolation region, the first sub-isolation region is arranged around the light-transmitting region, and the second sub-isolation region is arranged around the first sub-isolation region; The metal isolation column located in the second sub-isolation region has a different structure from the metal isolation column located in the first sub-isolation region.

8. The display panel according to any one of claims 1 to 3, characterized in that: The support structure includes an insulating layer; the insulating layer includes a plurality of insulating sublayers.

9. The display panel according to any one of claims 1 to 3, wherein: The support structure includes a metal layer.

10. The display panel according to claim 9, wherein: The metal layer of the support structure is in direct contact with the metal isolation column.

11. The display panel according to claim 9, wherein The display panel also includes a driving circuit layer, which includes a thin film transistor formed on the base substrate and located in the display area, and the thin film transistor includes a gate and a source-drain electrode formed on the side of the gate facing away from the base substrate; the metal layer in the supporting structure is prepared on the same layer as the gate.

12. The display panel according to claim 11, wherein: The gate includes a first sub-gate and a second sub-gate, the second sub-gate is located on a side of the first sub-gate away from the first sub-gate, and the orthographic projection of the second sub-gate on the substrate is located within the orthographic projection of the first sub-gate on the substrate.

13. The display panel according to claim 12, wherein: An overlap width of an orthographic projection of a portion of the metal isolation column located between the recess and the base substrate on the base substrate and an orthographic projection of the second sub-gate on the base substrate is greater than 1.5 μm.

14. The display panel according to any one of claims 1 to 3, characterized in that: The display panel also includes: an organic light-emitting material layer formed on the side of the metal isolation column facing away from the base substrate; the organic light-emitting material layer is disconnected at the side of the metal isolation column having the recess, and the organic light-emitting material layer covers the surface of the support structure not covered by the metal isolation column.

15. The display panel according to claim 14, wherein: The display panel further includes a cathode layer formed on a side of the organic light-emitting material layer facing away from the base substrate, and the cathode layer is disconnected at a side of the metal isolation column where the notch is formed.

16. The display panel according to claim 15, wherein: The display panel further includes an encapsulation layer formed on a side of the cathode layer facing away from the base substrate, and the encapsulation layer forms a groove at a position corresponding to the support structure not covered by the metal isolation column.

17. The display panel according to claim 16, wherein: The display panel further includes a filling layer formed on a side of the encapsulation layer facing away from the base substrate, and the filling layer fills the groove.

18. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 17.

19. A method for manufacturing a display panel, the display panel comprising a display area, a light-transmitting area, and an isolation area between the display area and the light-transmitting area, wherein at least a portion of the isolation area surrounds the light-transmitting area, wherein: The preparation method comprises: providing a substrate; forming a support structure on the base substrate, with adjacent support structures spaced apart; A metal isolation column is formed in the isolation area of the base substrate, and the isolation column is controlled to be arranged around the light-transmitting area. The metal isolation column covers a portion of the surface of the support structure facing away from the base substrate, and the portion of the metal isolation column located on the surface of the support structure is provided with a recess surrounding the light-transmitting area on at least one side facing and / or away from the light-transmitting area.

Images