Module

Abstract

A module (101) comprises: a first substrate (51) having a first surface (41) and a second surface (42) facing away from each other; a second substrate (52) disposed parallel to the first substrate (51) and spaced apart from the first substrate (51) on the second surface (42) side of the first substrate (51); and a first component (31). The second substrate (52) has a third surface (43) facing the first substrate (51), and a fourth surface (44) facing away from the third surface (43). The first component (31) includes a first component body (311) having a first component body flat surface (311a), and a first component terminal (312) provided on a surface of the first component body (311) facing away from the first component body flat surface (311a). The first component (31) is mounted to the third surface (43) via the first component terminal (312), the second surface (42) is covered by a first resist film (71), the second surface (42) and the third surface (43) are electrically connected by a conductor, and the distance between the first component body flat surface (311a) and the second surface (42) is smaller than the thickness of the first resist film (71) in an area other than a projection area of the first component body flat surface (311a) of the second surface (42).

Description

Module

[0001] The present invention relates to a module.

[0002] U.S. Patent Application Publication US 2022 / 0053639 A1 (Patent Document 1) describes a package structure in which both sides of a substrate are covered with a resist film, electronic components are mounted on the substrate, and the substrate is further sealed with resin. In this package, the resist film covering the surface of the substrate on which the electronic components are mounted includes thick and thin portions.

[0003] U.S. Patent Application Publication US2022 / 0053639A1

[0004] In Patent Document 1, the product referred to as a package is referred to as a module here. Modules are required to be thin. Modules may include a structure in which electronic components abut against a resist film covering the surface of a substrate. In this case, the electronic components are located at a distance from the surface of the substrate by the thickness of the resist film. It is preferable to achieve even thinner modules.

[0005] Therefore, an object of the present invention is to further reduce the thickness of the module.

[0006] To achieve the above object, a module according to the present invention includes a first substrate having a first surface and a second surface facing opposite to each other, a second substrate disposed parallel to the first substrate and spaced apart from the first substrate on the second surface side of the first substrate, and a first component. The second substrate has a third surface facing the first substrate and a fourth surface facing away from the third surface. The first component includes a first component body having a first component body flat surface and a first component terminal provided on the surface of the first component body facing away from the first component body flat surface. The first component is mounted on the third surface via the first component terminal. The second surface is covered with a first resist film. The second surface and the third surface are electrically connected by a conductor. The distance between the first component body flat surface and the second surface is smaller than the thickness of the first resist film in a region of the second surface other than the projection region of the first component body flat surface.

[0007] According to the present invention, the distance between the flat surface of the first component body and the second surface is extremely short, which allows the module to be made even thinner.

[0008] 14 is a cross-sectional view of a module according to a first embodiment of the present invention. FIG. 15 is a cross-sectional view of a module according to a second embodiment of the present invention. FIG. 16 is a cross-sectional view of a module according to a third embodiment of the present invention. FIG. 17 is a cross-sectional view of a module according to a fourth embodiment of the present invention. FIG. 18 is a cross-sectional view of a module according to a fifth embodiment of the present invention. FIG. 19 is an explanatory plan view showing the positional relationship of a first component body, a pad member, a connection conductor, a heat dissipation member, etc. included in a module according to a fifth embodiment of the present invention. FIG. 19 is a cross-sectional view of a module according to a sixth embodiment of the present invention. FIG. 19 is an explanatory plan view showing the positional relationship of a first component body, a pad member, a connection conductor, a heat dissipation member, etc. included in a module according to a sixth embodiment of the present invention. FIG. 19 is a cross-sectional view of a modified example of the module according to the sixth embodiment of the present invention. FIG. 19 is an explanatory plan view showing the positional relationship of a first component body, a pad member, a connection conductor, a heat dissipation member, etc. included in a modified example of the module according to the sixth embodiment of the present invention. FIG. 19 is a cross-sectional view of a module according to a seventh embodiment of the present invention. FIG. 20 is an explanatory plan view showing the positional relationship of a first component body, a pad member, a connection conductor, a heat dissipation member, etc. included in a module according to a seventh embodiment of the present invention. FIG. 21 is a plan view of a pad member included in a module according to a seventh embodiment of the present invention. FIG. 22 is a cross-sectional view of a module according to an eighth embodiment of the present invention. FIG. 23 is an enlarged view of part Z in FIG. FIG. 13 is a cross-sectional view of a module in a ninth embodiment according to the present invention.

[0009] The dimensional ratios shown in the drawings do not necessarily represent the actual ratios, and may be exaggerated for the sake of convenience. In the following description, when the concepts of up and down are mentioned, they do not necessarily mean absolute up and down, but may mean relative up and down in the illustrated position.

[0010] (First Embodiment) A module according to a first embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 shows a cross-sectional view of a module 101 according to this embodiment.

[0011] The module 101 includes a first substrate 51, a second substrate 52, and a first component 31. The first substrate 51 has a first surface 41 and a second surface 42 that face opposite to each other. The second substrate 52 is disposed parallel to the first substrate 51 and spaced apart from the first substrate 51 on the second surface 42 side of the first substrate 51. The second substrate 52 has a third surface 43 that faces the first substrate 51 and a fourth surface 44 that faces away from the third surface 43. The first component 31 includes a first component body 311 having a first component body flat surface 311a and a first component terminal 312 provided on a surface of the first component body 311 that faces away from the first component body flat surface 311a.

[0012] The first component 31 is mounted on the third surface 43 via the first component terminals 312. The second surface 42 is covered with a first resist film 71. The third surface 43 is covered with a second resist film 72. The second surface 42 and the third surface 43 are electrically connected by a conductor. In the example shown here, the second surface 42 and the third surface 43 are electrically connected by a connecting conductor 9. The space between the second surface 42 and the third surface 43 is sealed with a sealing resin 6b.

[0013] The distance between the first component body flat surface 311a and the second surface 42 is smaller than the thickness of the first resist film 71 in an area of ​​the second surface 42 other than the projection area of ​​the first component body flat surface 311a. In the example shown in Fig. 1, the first component body flat surface 311a and the second surface 42 are in contact with each other, and therefore the distance between the first component body flat surface 311a and the second surface 42 is zero.

[0014] Several components 3 may be mounted on the first surface 41. The first surface 41 is covered with a resist film 7. A connection conductor 8 is connected to the first surface 41. The first surface 41 is sealed with a sealing resin 6a. The components 3 mounted on the first surface 41 may be completely covered by the sealing resin 6a, or may be partially exposed from the sealing resin 6a. The connection conductor 8 is a columnar conductor. The lower end of the connection conductor 8 is exposed from the sealing resin 6a. The part of the connection conductor 8 exposed from the sealing resin 6a serves as an external terminal of the module 101.

[0015] Several components 3 may be mounted on the fourth surface 44. The fourth surface 44 is covered with a resist film 7. The fourth surface 44 and the components 3 mounted on the fourth surface 44 are sealed with sealing resin 6c. The components 3 mounted on the fourth surface 44 may be completely covered with sealing resin 6c, or may be partially exposed from the sealing resin 6c.

[0016] In this embodiment, the distance between the first component body flat surface 311a and the second surface 42 is extremely short, which allows the module to be made even thinner. The sealing resin 6b does not need to be interposed between the first component body flat surface 311a and the second surface 42. In other words, the first component 31 and the first substrate 51 may be close enough to each other that the sealing resin 6b does not enter the gap.

[0017] As shown in this embodiment, it is preferable that the first resist film 71 has a first opening 61 corresponding to the projection area of ​​the first component body flat surface 311a onto the second surface 42, and the first component body flat surface 311a abuts against the second surface 42 through the first opening 61. By having the first component body flat surface 311a abut against the second surface 42 in this manner, the distance between the first component 31 and the first substrate 51 can be set to zero, and the module can be made even thinner.

[0018] Second Embodiment A module according to a second embodiment of the present invention will be described with reference to Fig. 2. Fig. 2 shows a cross-sectional view of a module 102 according to the present embodiment.

[0019] The basic configuration of the module 102 is the same as that of the module 101 described in the first embodiment. The module 102 further includes the following components.

[0020] The module 102 further includes a second component 32 and a bridge die 33. The second component 32 includes a second component body 321 having a second component body flat surface 321 a, and a second component terminal 322 provided on a surface of the second component body 321 facing away from the second component body flat surface 321 a.

[0021] The second component 32 is mounted on the third surface 43 via second component terminals 322. The bridge die 33 is electrically connected to the surface of the first component 31 facing the third surface 43. The bridge die 33 is electrically connected to the surface of the second component 32 facing the third surface 43.

[0022] The third surface 43 is covered with a second resist film 72. The distance between the second component body flat surface 321a and the second surface 42 is smaller than the thickness of the first resist film 71 in a region of the second surface 42 other than the projection region of the second component body flat surface 321a. The distance between the bridge die 33 and the third surface 43 is smaller than the thickness of the second resist film 72 in a region of the third surface 43 other than the projection region of the bridge die 33. The first component terminals 312 and the third surface may be electrically connected by first connecting conductors 11. The second component terminals 322 and the third surface may be electrically connected by second connecting conductors 12.

[0023] The first resist film 71 has a first opening 61 corresponding to the projection area of ​​the first component body flat surface 311a onto the second surface 42, as well as a second opening 62 corresponding to the projection area of ​​the second component body flat surface 321a onto the second surface 42. In the example shown here, the first opening 61 and the second opening 62 are connected. The two may also be connected in this manner.

[0024] In this embodiment, the distance between the bridge die 33 and the third surface 43 is extremely short, which allows the module to be made even thinner. The sealing resin 6 b does not need to be interposed between the bridge die 33 and the third surface 43.

[0025] As shown in this embodiment, it is preferable that the first resist film 71 has the second opening 62 corresponding to the projection area of ​​the second component body flat surface 321a onto the second surface 42, and the second component body flat surface 321a abuts against the second surface 42 through the second opening 62. By employing this configuration, the second component body flat surface 321a abuts against the second surface 42, so that the second component 32 also does not need to have an excessive thickness.

[0026] As shown in this embodiment, it is preferable that the second resist film 72 has a third opening 63 corresponding to the projection area of ​​the bridge die 33 onto the third surface 43, and the bridge die 33 abuts against the third surface 43 through the third opening 63. In this way, by having the bridge die 33 abut against the third surface 43 through the third opening 63 of the second resist film 72, it is possible to avoid introducing extra thickness around the bridge die 33, and to achieve further thinning of the module.

[0027] Third Embodiment A module according to a third embodiment of the present invention will be described with reference to Fig. 3. Fig. 3 shows a cross-sectional view of a module 103 according to this embodiment.

[0028] The module 103 includes a first substrate 51, a first component 31, a second component 32, and a bridge die 33. The first substrate 51 has a first surface 41 and a second surface 42 facing opposite to each other. The first component 31 is connected to the first surface 41 via a first connecting conductor 11 and is disposed spaced apart from the first surface 41. The second component 32 is connected to the first surface 41 via a second connecting conductor 12 and is disposed spaced apart from the first surface 41. The first surface 41 is covered with a first resist film 71.

[0029] The bridge die 33 is electrically connected to a surface of the first component 31 facing the first surface 41. The bridge die 33 is electrically connected to a surface of the second component 32 facing the first surface 41. The distance between the bridge die 33 and the first surface 41 is smaller than the thickness of the first resist film 71 in an area of ​​the first surface 41 other than the projection area of ​​the bridge die 33. The first component 31, the second component 32, and the bridge die 33 may be encapsulated by the encapsulating resin 6a. The first component 31 and the second component 32 may be completely covered by the encapsulating resin 6a. Alternatively, the surfaces of the first component 31 and the second component 32 farther from the first surface 41 may be exposed from the encapsulating resin 6a.

[0030] The connection conductor 8 is connected to the first surface 41. The connection conductor 8 is a columnar conductor. The lower end of the connection conductor 8 is exposed from the sealing resin 6 a. The part of the connection conductor 8 exposed from the sealing resin 6 a serves as an external terminal of the module 103.

[0031] Some components 3 may also be mounted on the second surface 42. The second surface 42 is covered with a second resist film 72. The second surface 42 and the components 3 mounted on the second surface 42 may be sealed with sealing resin 6b. The components 3 mounted on the second surface 42 may be completely covered with sealing resin 6b. Alternatively, some surfaces of the components 3 may be exposed from the sealing resin 6b.

[0032] The module 103 in this embodiment includes only one substrate, but even in this configuration, the distance between the bridge die 33 and the first surface 41 is extremely short, so the module can be made even thinner.

[0033] (Fourth Embodiment) A module according to a fourth embodiment of the present invention will be described with reference to Fig. 4. Fig. 4 shows a cross-sectional view of a module 104 according to this embodiment.

[0034] The module 104 includes a first substrate 51, a first component 31, a second component 32, and a bridge die 33. The first substrate 51 has a first surface 41 and a second surface 42 that face opposite to each other. Unlike the module 103 shown in the third embodiment, the module 104 has the first surface 41 as the upper surface of the first substrate 51 and the second surface 42 as the lower surface of the first substrate 52.

[0035] The first component 31 is connected to the first surface 41 via a first connecting conductor 11d and is disposed at a distance from the first surface 41. The second component 32 is connected to the first surface 41 via a second connecting conductor 12d and is disposed at a distance from the first surface 41. The first surface 41 is covered with a first resist film 71.

[0036] The bridge die 33 is electrically connected to the surface of the first component 31 facing the first surface 41. The bridge die 33 is electrically connected to the surface of the second component 32 facing the first surface 41. The first component 31, the second component 32, and the bridge die 33 are sealed with sealing resin 6a. The distance between the bridge die 33 and the first surface 41 is smaller than the thickness of the first resist film 71 in an area of ​​the first surface 41 other than the projection area of ​​the bridge die 33. The first component 31, the second component 32, and the bridge die 33 may be sealed with sealing resin 6a. The first component 31 and the second component 32 may be completely covered with sealing resin 6a. Alternatively, the surfaces of the first component 31 and the second component 32 farther from the first surface 41 may be exposed from the sealing resin 6a.

[0037] The connection conductor 8 is connected to the second surface 42. The connection conductor 8 is a columnar conductor. The lower end of the connection conductor 8 is exposed from the sealing resin 6b. The part of the connection conductor 8 exposed from the sealing resin 6b serves as an external terminal of the module 104.

[0038] Some components 3 may also be mounted on the second surface 42. The second surface 42 is covered with a second resist film 72. The second surface 42 and the components 3 mounted on the second surface 42 may be sealed with sealing resin 6b. The components 3 mounted on the second surface 42 may be completely covered with sealing resin 6b. Alternatively, some surfaces of the components 3 may be exposed from the sealing resin 6b.

[0039] In this embodiment, the upper side of the first substrate 51 is the first surface 41, but even in this configuration, the distance between the bridge die 33 and the first surface 41 is extremely short, so the module can be made even thinner.

[0040] 5 and 6, a module according to a fifth embodiment of the present invention will be described. A cross-sectional view of a module 105 according to the present embodiment is shown in FIG. 5. The basic configuration of module 105 is similar to that of module 101 described in the first embodiment. Module 105 further includes the following components.

[0041] In the module 105, the first substrate 51 incorporates a pad member 14. The pad member 14 is formed of a material that easily conducts heat. The pad member 14 is formed of, for example, metal. The pad member 14 is exposed on the second surface 42 in an area corresponding to the projection area of ​​the first component body flat surface 311a onto the second surface 42. A heat dissipation member 15 is connected to the first surface 41. The heat dissipation member 15 is arranged to penetrate the sealing resin 6a in the thickness direction. The heat dissipation member 15 is formed of, for example, metal. The heat dissipation member 15 is, for example, a columnar member. The heat dissipation member 15 may be a solder bump instead of a columnar member. The lower end of the heat dissipation member 15 is exposed on the first surface 41. The pad member 14 is connected to the heat dissipation member 15 via a heat transfer member 16 arranged within the first substrate 51. The first component 31 abuts against the pad member 14. The heat dissipation member 15 and the connecting conductor 8 may be formed of the same material. The heat transfer member 16 is made of, for example, metal and may be a wiring dedicated to heat transfer within the substrate, or may be a GND conductor pattern.

[0042] FIG. 6 shows a plan view of the positional relationship of the first component body 311, pad member 14, connecting conductor 8, heat dissipation member 15, and other components in the module 105. In FIG. 6, components that would not normally be visible at the same time are shown together to illustrate the positional relationship. The pad member 14 is slightly larger than the first component body 311. The pad member 14 is rectangular in shape. A total of four heat transfer members 16 are provided so as to protrude from two short sides of the pad member 14. Two heat transfer members 16 protrude from one short side of the pad member 14. The tip of each heat transfer member 16 is connected to one heat dissipation member 15.

[0043] In this embodiment, the same effects as in the first embodiment can be obtained. Furthermore, in this embodiment, the first substrate 51 incorporates a pad member 14, and the pad member 14 is exposed on the second surface 42 in an area corresponding to the projection area of ​​the first component body flat surface 311a onto the second surface 42. Since the first component body flat surface 311a and the second surface 42 are close to each other, heat generated in the first component 31 can be quickly conducted from the first component body flat surface 311a to the pad member 14. The heat is conducted from the pad member 14 to the heat dissipation member 15 via the heat transfer member 16. Since the lower end of the heat dissipation member 15 is exposed on the first surface 41, heat can be quickly dissipated. Therefore, in the module 105, heat generated in the first component 31 can be efficiently dissipated.

[0044] The module 105 can be made even thinner, and furthermore, since the module 105 includes structures such as the pad member 14, the heat generated in the first component 31 can be dissipated efficiently.

[0045] 7 and 8, a module according to a sixth embodiment of the present invention will be described. A cross-sectional view of a module 106 according to the present embodiment is shown in FIG. 7. The basic configuration of module 106 is similar to that of module 105 described in the fifth embodiment. Module 106 further includes the following components.

[0046] The first component 31 is an IC. The first component 31 has a VBAT area 25 that handles the voltage supplied from the battery. Typically, the VBAT area handles a higher voltage than other areas, and therefore generates a greater amount of heat. When viewed perpendicularly to the first component body flat surface 311a, the VBAT area 25 is partially positioned at a biased position within the first component 31. The first substrate 51 incorporates a pad member 14. The pad member 14 is exposed on the second surface 42. A plurality of heat dissipation members 15 are connected to the first surface 41. The pad member 14 is connected to each of the plurality of heat dissipation members 15 via a plurality of heat transfer members 16 arranged within the first substrate 51. The first component 31 abuts against the pad member 14. When viewed from a direction perpendicular to the first component body flat surface 311a, the multiple heat transfer members 16 are distributed in the first component 31 so that a greater number are arranged near the side on which the VBAT region 25 is located than near the side on the opposite side from the side on which the VBAT region 25 is located.

[0047] FIG. 8 shows a planar representation of the positional relationship of the first component body 311, pad member 14, connecting conductor 8, heat dissipation member 15, and the like in the module 106. In FIG. 8, elements that would not normally be visible at the same time are shown together to illustrate the positional relationship. The pad member 14 is slightly larger than the first component body 311. The pad member 14 is rectangular in shape. Two heat transfer members 16 are provided so as to protrude from one short side of the pad member 14. This short side is the short side of the first component 31 on which the VBAT region 25 is located. The tip of each heat transfer member 16 is connected to one heat dissipation member 15. In the example shown here, the heat transfer members 16 protrude from only one short side of the pad member 14.

[0048] In this embodiment, the module can be made even thinner, and further, since the multiple heat transfer members 16 are distributed so that a greater number are placed near the side on which the VBAT area 25 is located, the heat generated in the VBAT area 25 can be dissipated efficiently.

[0049] 9 and 10 may also be used. In module 106, heat transfer member 16 extends from only one side of rectangular pad member 14, but as in module 107, heat transfer members 16 may extend from multiple sides, and the overall distribution may be such that a greater number of heat transfer members 16 are disposed on the side of first component 31 where VBAT region 25 is located than on the side opposite to the side where VBAT region 25 is located.

[0050] 11 and 12, a module according to a seventh embodiment of the present invention will be described. A cross-sectional view of a module 108 according to this embodiment is shown in FIG. 11. The basic configuration of module 108 is similar to that of modules 106 and 107 described in the sixth embodiment. Module 108 further includes the following components.

[0051] In the module 108 , the pad member 14 includes a first portion corresponding to the VBAT region 25 and a second portion extending linearly from the first region along the outer edge of the first component 31 .

[0052] FIG. 12 shows a planar representation of the positional relationship of the first component body 311, pad member 14, connecting conductor 8, heat dissipation member 15, and other components in the module 108. In FIG. 12, components that would not normally be visible at the same time are shown together to illustrate their positional relationship. FIG. 13 shows the pad member 14 alone, extracted from FIG. 12. The pad member 14 has an opening 14a. Of the pad member 14 shown in FIG. 12, the portion surrounded by the dashed line in the VBAT region 25 corresponds to the first portion, and the remaining portion corresponds to the second portion. The second portion is linear. The second portion is arranged to connect one point on the outer edge of the first portion to another point. The first and second portions are joined together to form the pad member 14 in a ring shape.

[0053] In this embodiment, the module can also be made even thinner. Furthermore, in this embodiment, since the pad member 14 includes a first portion corresponding to the VBAT region 25, heat generated in the VBAT region 25 can be efficiently dissipated, and since the pad member 14 includes a second portion extending linearly along the outer edge of the first component 31, heat can also be sufficiently dissipated around the outer periphery of the first component 31. Heat generated during operation of the first component 31 tends to cause large stresses in the first component 31, which tends to place a burden on the first component 31. However, in this embodiment, heat can be smoothly dissipated around the outer periphery of the first component 31, thereby reducing the burden on the first component 31.

[0054] Eighth Embodiment A module according to an eighth embodiment of the present invention will be described with reference to Figures 14 and 15. Figure 14 shows a cross-sectional view of module 109 according to this embodiment. Figure 15 shows an enlarged view of part Z in Figure 14. The basic configuration of module 109 is the same as that of module 102 described in the second embodiment. Module 109 further includes the following components.

[0055] In the module 109, the first resist film 71 has a first thin portion that is locally thinned in correspondence with the projection area of ​​the first component body flat surface 311a onto the second surface 42. The first component body flat surface 311a abuts against the first thin portion.

[0056] In the example shown here, a first thin-walled portion that is locally thinned to correspond to the projection area of ​​the first component body flat surface 311a onto the second surface 42 is provided next to a second thin-walled portion that is locally thinned to correspond to the projection area of ​​the second component body flat surface 321a onto the second surface 42, and the first thin-walled portion and the second thin-walled portion are connected.

[0057] 15 shows a part of the first thin film portion. In the first thin film portion, first resist film 71 does not disappear completely but remains thinly, so that surface wiring 18 may be disposed below the thinned first resist film 71 in this manner.

[0058] 15 shows an enlarged view of a portion of the first thin film portion, but the same applies to the second thin film portion. Surface wiring 18 may be disposed in this manner below first resist film 71, which is thinned as the second thin film portion.

[0059] In this embodiment, a first thin portion is locally provided in the first resist film 71, and the first component 31 abuts against this first thin portion, thereby enabling the module to be made thinner. Although the degree of thinning is smaller than when an opening is provided in the first resist film 71 and the first component 31 is inserted into this opening to bring the first component 31 into abutment against the second surface 42, the thinner first resist film 71 as the first thin portion can contribute to making the entire module thinner compared to when the first resist film 71 remains at its normal thickness.

[0060] 15 , surface wiring 18 can be placed under the first thin portion of first resist film 71. Because first thin portion has thinned first resist film 71, surface wiring 18 can be placed without directly contacting first component 31. Surface wiring 18 and first component 31 are separated by thinned first resist film 71. In this way, many locations for placing surface wiring 18 can be secured regardless of the placement of first component 31, ensuring a high degree of design freedom.

[0061] Ninth Embodiment A module according to a ninth embodiment of the present invention will be described with reference to Fig. 16. Fig. 16 shows a cross-sectional view of a module 110 according to the present embodiment. The basic configuration of module 110 is similar to that of module 106 (see Fig. 7) described in the sixth embodiment. Module 110 further includes the following components.

[0062] In the module 110, the first component 31 abuts against the pad member 14 via a TIM film 17 that is thinner than the first resist film 71. The TIM film 17 is a film formed from a thermal interface material.

[0063] This embodiment can achieve the same effects as those described in embodiment 6. Furthermore, the presence of the TIM film 17 between the first component 31 and the pad member 14 can promote heat dissipation.

[0064] It should be noted that a plurality of the above-described embodiments may be appropriately combined and employed. The above-described embodiments disclosed herein are illustrative in all respects and are not limiting. The scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims.

[0065] (Supplementary Note 1) A module comprising: a first substrate having a first surface and a second surface facing opposite to each other; a second substrate disposed parallel to the first substrate and spaced apart from the first substrate on the second surface side of the first substrate; and a first component; wherein the second substrate has a third surface facing the first substrate and a fourth surface facing away from the third surface; the first component includes a first component body having a first component body flat surface and a first component terminal provided on a surface of the first component body facing away from the first component body flat surface; the first component is mounted on the third surface via the first component terminal; the second surface is covered with a first resist film; the second surface and the third surface are electrically connected by a conductor; and a distance between the first component body flat surface and the second surface is smaller than a thickness of the first resist film on a region of the second surface other than a projection region of the first component body flat surface.

[0066] (Supplementary Note 2) The module described in Supplementary Note 1, wherein the first resist film has a first opening corresponding to a projection area of ​​the first component body flat surface onto the second surface, and the first component body flat surface abuts the second surface through the first opening.

[0067] (Supplementary Note 3) The module described in Supplementary Note 1 or 2, further comprising: a second component; and a bridge die, wherein the second component includes a second component body having a second component body flat surface, and a second component terminal provided on a surface of the second component body facing away from the second component body flat surface, wherein the second component is mounted on the third surface via the second component terminal, wherein the bridge die is electrically connected to a surface of the first component facing the third surface, wherein the bridge die is electrically connected to a surface of the second component facing the third surface, wherein the third surface is covered with a second resist film, wherein the distance between the second component body flat surface and the second surface is smaller than the thickness of the first resist film in a region of the second surface other than a projection region of the second component body flat surface, and wherein the distance between the bridge die and the third surface is smaller than the thickness of the second resist film in a region of the third surface other than a projection region of the bridge die.

[0068] (Supplementary Note 4) The module described in Supplementary Note 3, wherein the first resist film has a second opening corresponding to a projection area of ​​the second component body flat surface onto the second surface, and the second component body flat surface abuts the second surface through the second opening.

[0069] (Supplementary Note 5) The module described in Supplementary Note 3 or 4, wherein the second resist film has a third opening corresponding to a projection area of ​​the bridge die onto the third surface, and the bridge die abuts the third surface through the third opening.

[0070] (Appendix 6) A module described in any one of Appendices 1 to 5, wherein the first substrate has a built-in pad member, the pad member is exposed on the second surface in an area corresponding to a projection area of ​​the flat surface of the first component body onto the second surface, a heat dissipation member is connected to the first surface, the pad member is connected to the heat dissipation member via a heat transfer member arranged in the first substrate, and the first component abuts against the pad member.

[0071] (Supplementary Note 7) The module described in any one of Supplementary Notes 1 to 5, wherein the first component is an IC, the first component has a VBAT area that handles voltage supplied from a battery, and when viewed from a direction perpendicular to a flat surface of the first component body, the VBAT area is partially arranged at a biased position within the first component, the first substrate has a pad member built in, the pad member is exposed on the second surface, and a plurality of heat dissipation members are connected to the first surface, and the pad member is connected to each of the plurality of heat dissipation members via a plurality of heat transfer members arranged in the first substrate, the first component abuts against the pad member, and when viewed from a direction perpendicular to the flat surface of the first component body, the plurality of heat transfer members are distributed so that a greater number of them are arranged near the side of the first component on the side on which the VBAT area is located than near the side opposite to the side on which the VBAT area is located.

[0072] (Supplementary Note 8) The module according to Supplementary Note 6 or 7, wherein the first component is in contact with the pad member via a TIM film that is thinner than the first resist film.

[0073] (Supplementary Note 9) The module described in Supplementary Note 7, wherein the pad member includes a first portion corresponding to the VBAT region and a second portion extending linearly from the first region to follow an outer edge of the first component.

[0074] (Supplementary Note 10) The module described in Supplementary Note 1, wherein the first resist film has a first thin-walled portion that is locally thinned corresponding to a projection area of ​​the first component body flat surface onto the second surface, and the first component body flat surface abuts the first thin-walled portion.

[0075] (Supplementary Note 11) A module comprising: a first substrate having a first surface and a second surface facing opposite to each other; a first component connected to the first surface via a first connecting conductor and arranged at a distance from the first surface; a second component connected to the first surface via a second connecting conductor and arranged at a distance from the first surface; and a bridge die, wherein the first surface is covered with a first resist film, the bridge die is electrically connected to a surface of the first component facing the first surface, and the bridge die is electrically connected to a surface of the second component facing the first surface, and a distance between the bridge die and the first surface is smaller than a thickness of the first resist film in a region of the first surface other than a projection region of the bridge die.

[0076] 3 Components, 6a, 6b, 6c Sealing resin, 7 Resist film, 8, 9 Connecting conductors, 11, 11d First connecting conductors, 12, 12d Second connecting conductors, 14 Pad member, 14a Opening, 15 Heat dissipation member, 16 Heat transfer member, 17 TIM film, 18 Surface wiring, 25 VBAT area, 31 First component, 32 Second component, 33 Bridge die, 41 First surface, 42 Second surface, 43 Third surface, 44 Fourth surface, 51 First substrate, 52 Second substrate, 61 First opening, 62 Second opening, 63 Third opening, 71 First resist film, 72 Second resist film, 101, 102, 103, 104, 105, 106, 107, 108, 109, 110 Module, 311 First component body, 311a First component body flat surface, 312 first component terminal, 321 second component body, 321a second component body flat surface, 322 second component terminal.

Claims

1. A module comprising: a first substrate having a first surface and a second surface facing opposite to each other; a second substrate disposed parallel to the first substrate and spaced apart from the first substrate on the second surface side of the first substrate; and a first component; wherein the second substrate has a third surface facing the first substrate and a fourth surface facing away from the third surface; the first component includes a first component body having a first component body flat surface and a first component terminal provided on the first component body surface facing away from the first component body flat surface; the first component is mounted on the third surface via the first component terminal; the second surface is covered with a first resist film; the second surface and the third surface are electrically connected by a conductor; and the distance between the first component body flat surface and the second surface is smaller than the thickness of the first resist film on the second surface other than the projection area of the first component body flat surface.

2. The module described in claim 1, wherein the first resist film has a first opening corresponding to a projection area of the flat surface of the first component body onto the second surface, and the flat surface of the first component body abuts against the second surface through the first opening.

3. The module described in claim 1 or 2, further comprising: a second component; and a bridge die, wherein the second component includes a second component body having a flat second component body surface, and a second component terminal provided on a surface of the second component body facing away from the flat second component body surface, wherein the second component is mounted on the third surface via the second component terminal, wherein the bridge die is electrically connected to a surface of the first component facing the third surface, wherein the bridge die is electrically connected to a surface of the second component facing the third surface, wherein the third surface is covered with a second resist film, wherein the distance between the flat second component body surface and the second surface is smaller than the thickness of the first resist film in an area of the second surface other than the projection area of the flat second component body surface, and wherein the distance between the bridge die and the third surface is smaller than the thickness of the second resist film in an area of the third surface other than the projection area of the bridge die.

4. The module described in claim 3, wherein the first resist film has a second opening corresponding to a projection area of the flat surface of the second component body onto the second surface, and the flat surface of the second component body abuts against the second surface through the second opening.

5. The module described in claim 3 or 4, wherein the second resist film has a third opening corresponding to a projection area of the bridge die onto the third surface, and the bridge die abuts against the third surface through the third opening.

6. A module described in any one of claims 1 to 5, wherein the first substrate incorporates a pad member, the pad member is exposed on the second surface in an area corresponding to the projection area of the flat surface of the first component body onto the second surface, a heat dissipation member is connected to the first surface, the pad member is connected to the heat dissipation member via a heat transfer member arranged within the first substrate, and the first component abuts against the pad member.

7. A module as claimed in any one of claims 1 to 5, wherein the first component is an IC, the first component has a VBAT area that handles voltage supplied from a battery, and when viewed from a direction perpendicular to the flat surface of the first component body, the VBAT area is partially arranged at a biased position within the first component, the first substrate has a built-in pad member that is exposed on the second surface and has a plurality of heat dissipation members connected to the first surface, the pad member being connected to each of the plurality of heat dissipation members via a plurality of heat transfer members arranged within the first substrate, the first component abuts against the pad member, and when viewed from a direction perpendicular to the flat surface of the first component body, the plurality of heat transfer members are distributed so that a greater number of them are arranged near the side of the first component on the side where the VBAT area is located than near the side opposite the side where the VBAT area is located.

8. The module according to claim 6 or 7, wherein the first component is in contact with the pad member via a TIM film that is thinner than the first resist film.

9. The module described in claim 7, wherein the pad member includes a first portion corresponding to the VBAT area and a second portion extending from the first area and extending linearly along the outer edge of the first component.

10. The module described in claim 1, wherein the first resist film has a first thin-walled portion that is locally thinned in accordance with the projection area of the first component body flat surface onto the second surface, and the first component body flat surface abuts against the first thin-walled portion.

11. A module comprising: a first substrate having a first surface and a second surface facing opposite to each other; a first component connected to the first surface via a first connecting conductor and arranged at a distance from the first surface; a second component connected to the first surface via a second connecting conductor and arranged at a distance from the first surface; and a bridge die, wherein the first surface is covered with a first resist film; the bridge die is electrically connected to a surface of the first component facing the first surface; and the bridge die is electrically connected to a surface of the second component facing the first surface; and the distance between the bridge die and the first surface is smaller than the thickness of the first resist film in an area of the first surface other than the projection area of the bridge die.

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