Electronic device

The housing and cover design with protrusions and adhesive grooves addresses the challenge of maintaining conductivity and sealing force, enhancing electrical stability and adhesive bonding in electronic devices.

WO2025165080A1PCT designated stage Publication Date: 2025-08-07LG INNOTEK CO LTD
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Patent Information

Application Number
PCT/KR2025/001367
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-02-02
Filing Date
2025-01-23
Publication Date
2025-08-07

AI Technical Summary

Technical Problem

Existing electronic devices face a challenge in maintaining both thermal and electrical conductivity while ensuring a strong sealing force between the housing and cover, as increasing the contact area for conductivity compromises the sealing performance.

Method used

A housing and cover design featuring protrusions and adhesive receiving grooves that enhance electrical conductivity and adhesive bonding, with protrusions providing wider adhesive placement areas for improved bonding strength.

Benefits of technology

The design improves electrical conductivity and maintains firm adhesive bonding between the housing and cover, ensuring both thermal and electrical stability without compromising sealing performance.

✦ Generated by Eureka AI based on patent content.

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    Figure KR2025001367_07082025_PF_FP_ABST
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Abstract

The electronic device includes: a housing having a coupling groove formed on the upper surface thereof; and a cover coupled to the housing and including an upper surface portion and a side surface portion bent downward from an edge of the upper surface portion, a lower end of the side surface portion being coupled to the coupling groove. The housing includes a protrusion extending upward from a bottom surface of the coupling groove to be in contact with a lower surface of the side surface portion. The protrusion includes a plurality of unit protrusions and an adhesive receiving groove formed between the plurality of unit protrusions.
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Description

electronic devices

[0001] This embodiment relates to an electronic device.

[0002]

[0003] The controller mounted on the vehicle performs functions such as vehicle control, motor control, and charging control, and in particular, the motor controller controls various actuators according to preset control logic.

[0004] The controller may be externally formed by a housing forming a motor area and a cover covering one side of the housing and forming a control area. The housing and the cover are complementarily coupled through ribs and rib grooves, and may additionally be provided with a fastening means such as a screw.

[0005] Since numerous electronic components are placed within electronic devices, the contact area between the housing and cover must be increased to ensure thermally and electrically stable conductivity. However, as the contact area between the housing and cover increases, the sealing force between the housing and cover decreases.

[0006]

[0007] The present embodiment provides an electronic device capable of improving electrical conductivity between a housing and a cover along with sealing performance of an internal space.

[0008]

[0009] An electronic device according to the present embodiment comprises: a housing having a coupling groove formed on an upper surface; and a cover coupled to the housing, the cover including an upper surface portion and a side portion bent downward from an edge of the upper surface portion and having a lower end coupled to the coupling groove, wherein the housing includes a protrusion protruding upward from a bottom surface of the coupling groove and contacting a lower surface of the side portion, the protrusion including a plurality of unit protrusions and an adhesive receiving groove formed between the plurality of unit protrusions.

[0010] It includes an adhesive disposed in the above-mentioned joining groove, and the adhesive can be disposed on the upper surface of the plurality of unit protrusions, the side surface of the side portion, the adhesive receiving groove, and the lower surface of the side portion, respectively.

[0011] The above plurality of unit protrusions may each include a first unit protrusion and a second unit protrusion, and the first unit protrusion and the second unit protrusion may each include a first surface arranged parallel to each other and a second surface arranged on both sides of the first surface.

[0012] The second surface may be formed to be inclined so that the distance to the second surface of the adjacent unit protrusion increases as it goes toward the end.

[0013] The adhesive receiving groove includes a first groove arranged between a first surface of the first unit protrusion and a first surface of the second unit protrusion, and a second groove arranged between a second surface of the first unit protrusion and a second surface of the second unit protrusion, and the width of the first groove and the width of the second groove may be different from each other.

[0014] The thickness of the above side portion may be smaller than the width of the above joining groove.

[0015] A space in which a printed circuit board is placed is formed on the housing, a first side wall and a second side wall are placed on the outside of the space, the joining groove is placed between the first side wall and the second side wall, and the side portion can be spaced apart from the inner surface of the first side wall and the outer surface of the second side.

[0016] The above protrusions may be provided in multiple numbers and arranged to be spaced apart from each other along the perimeter of the above-mentioned joining groove.

[0017] The lower surface of the above side portion may be spaced apart from the bottom surface of the above joining groove in the vertical direction at least in part.

[0018] The lower surface of the above side portion can be in contact with the upper surface of each of the plurality of unit protrusions.

[0019]

[0020] This embodiment has the advantage of improving electrical conductivity between the housing and the cover due to the contact structure of the protrusion and the side surface.

[0021] In addition, since the adhesive placement area is formed wider through the adhesive receiving groove in the protrusion, there is an advantage in that the physical bonding through the adhesive in the contact area between the housing and the cover can be maintained more firmly.

[0022]

[0023] FIG. 1 is a plan view showing the appearance of an electronic device according to an embodiment of the present invention.

[0024] Figure 2 is a plan view showing the upper surface of a housing according to an embodiment of the present invention.

[0025] FIG. 3 is an enlarged view of a coupling groove of a housing according to an embodiment of the present invention.

[0026] Figure 4 is an enlarged view of A in Figure 2.

[0027] Fig. 5 is a cross-sectional view showing the combined structure of a housing and a cover according to an embodiment of the present invention.

[0028]

[0029] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0030] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0031] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0032] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as "A and / or at least one (or more) of B, C," it may include one or more of all combinations that can be combined with A, B, and C.

[0033] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0034] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0035] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0036] Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Also, when it is expressed as "above" or "below", it can include the meaning of the downward direction as well as the upward direction based on one component.

[0037] The electronic device according to the present embodiment is installed in a vehicle and may include a converter, an on-board charger (OBC), a power conversion device in which the converter and the OBC are arranged within a single housing, a pump, a motor, and an electronic control unit (ECU). However, this is exemplary, and the electronic device may include various devices having a refrigerant pipe, including at least one electronic component arranged within the housing.

[0038] FIG. 1 is a plan view showing the appearance of an electronic device according to an embodiment of the present invention, FIG. 2 is a plan view showing the upper surface of a housing according to an embodiment of the present invention, FIG. 3 is an enlarged view showing a coupling groove of a housing according to an embodiment of the present invention, FIG. 4 is an enlarged view showing A of FIG. 2, and FIG. 5 is a cross-sectional view showing a coupling structure of a housing and a cover according to an embodiment of the present invention.

[0039] Referring to FIGS. 1 to 5, an electronic device (10) according to an embodiment of the present invention may have an outer shape formed by combining a housing (100) and a cover (200). The housing (100) and the cover (200) may be combined in a vertical direction.

[0040] The housing (100) may include a motor region (110) and a control region (120). The control region (120) may be disposed on the motor region (110). The motor region (110) may have a circular cross-sectional shape. The cross-sectional area of ​​the control region (120) may be formed to be larger than the cross-sectional area of ​​the motor region (110). A partition wall is disposed between the motor region (110) and the control region (120), and the space within the motor region (110) and the space within the control region (120) may be mutually partitioned by the partition wall. A hole (not shown) is formed in the partition wall, so that a printed circuit board (190) to be described later and components within the motor region may be electrically connected.

[0041] A motor may be placed within the motor area (110). The motor may include a stator, a rotor placed within the stator, and a shaft. The stator may include a coil. The rotor may include a magnet. The rotor and the shaft may rotate due to electromagnetic interaction between the coil and the magnet. The lower end of the shaft may protrude downward from the housing (100) to provide a rotational driving force in a different configuration.

[0042] The above control area (120) may be positioned on the motor area (110). A space (122) may be formed within the control area (120). The space (122) may have a groove shape that is concave downward compared to other areas. The bottom surface of the space (122) may be defined as the upper surface of the partition wall. The upper surface of the space (122) may be covered by the cover (200).

[0043] A substrate joint (125) may be arranged in the space (122). The substrate joint (125) may have a shape that protrudes upward from the bottom surface of the space (122). The substrate joint (125) may be provided in multiple numbers and arranged along the edge of the space (122). A screw hole for fastening a screw may be formed on the upper surface of the substrate joint (125). Accordingly, the printed circuit board (190) may be screw-jointed onto the substrate joint (125).

[0044] The printed circuit board (190) may be placed in the space (122). A number of electronic components for driving the electronic device (10) may be placed on the surface of the printed circuit board (190). The printed circuit board (190) is electrically connected to the motor, and thus, the operation of the motor can be controlled.

[0045] A coupling groove (136) may be formed on the upper surface of the housing (100) to which the cover (200) is coupled, and on the upper surface of the control area (120). The coupling groove (136) may have a concave shape that is lower than other areas from the upper surface of the housing (100). The coupling groove (136) may have a closed loop shape that forms an edge of the upper surface of the housing (100). With respect to the coupling groove (136), a first side wall (132) may be arranged on the outer side, and a second side wall (134) may be arranged on the inner side. It may be understood that the coupling groove (136) is arranged between the first side wall (132) and the second side wall (134). The upper surface of the first side wall (132) and the upper surface of the second side wall (134) may be defined as the upper surface of the housing (100). The above first side wall (132), the above second side wall (134), and the above joining groove (136) can be called a cover joining portion (130).

[0046] The cover (200) may be coupled to the housing (100). The upper surface of the space (122) may be covered by coupling the cover (200). The cover (200) may cover the upper surface of the printed circuit board (190). The cover (200) may include an upper surface portion (210) and a side surface portion (220). The upper surface portion (210) may be disposed on the space (122). A groove or pin may be formed on the upper surface portion (210) to increase the surface area of ​​the cover (200). The side surface portion (220) may have a shape that extends downwardly by bending from an edge of the upper surface portion (210). The lower end of the side surface portion (220) may be coupled to the coupling groove (136). Based on the horizontal direction perpendicular to the vertical direction, the thickness of the side portion (220) may be smaller than the width of the joining groove (136). Accordingly, when the side portion (220) is joined to the joining groove (136), the inner or outer surface of the side portion (220) may be horizontally spaced apart from the outer surface of the second side wall (134) or the inner surface of the first side wall (132), which face each other in the horizontal direction.

[0047] When the lower end of the side portion (220) is coupled to the joining groove (136), the lower end of the side portion (220) may have an area where at least a portion is spaced apart from the bottom surface of the joining groove (136) in the vertical direction.

[0048] The housing (100) may include a protrusion (150). The protrusion (150) may be formed to protrude upward from the bottom surface of the coupling groove (136). The upper surface of the protrusion (150) may be in contact with the lower end of the side portion (220). The protrusions (150) may be provided in multiple numbers and may be arranged to be spaced apart from each other along the perimeter of the coupling groove (136).

[0049] In detail, the protrusion (150) may include a plurality of unit protrusions (152) and adhesive receiving grooves (158, 159) formed between the plurality of unit protrusions (152). When the first side wall (132) and the second side wall (136) face each other in a first direction, the plurality of unit protrusions (152) may be arranged to face each other in the first direction, and the adhesive receiving grooves (158, 159) may be formed between the plurality of unit protrusions (152). One of the plurality of unit protrusions (152) may have a shape protruding inward from the inner surface of the first side wall (132). Another of the plurality of unit protrusions (152) may have a shape protruding outward from the outer surface of the second side wall (134).

[0050] As illustrated in FIG. 4, each side surface of the plurality of unit protrusions (152) may include a first surface (153) and a plurality of second surface surfaces (154) arranged on both sides of the first surface (153). When the plurality of unit protrusions (152) are respectively named a first unit protrusion and a second unit protrusion, the first surface (153) of the first unit protrusion and the first surface (153) of the second unit protrusion may be arranged to be parallel to each other. The second surface (154) may be formed to be inclined so that the distance to the second surface (154) of the adjacent unit protrusion increases as it goes toward the end of the unit protrusion (152).

[0051] The bottom surface of the adhesive receiving groove (158, 159) may be the bottom surface of the joining groove (136). The adhesive receiving groove (158, 159) may include a first groove (158) formed between the first surface (153) of the first unit protrusion and the first surface (153) of the second unit protrusion, and a second groove (159) formed between the second surface (154) of the first unit protrusion and the second surface (154) of the second unit protrusion. The first groove (158) may have a rectangular cross-sectional shape. The second groove (159) may have a shape in which the width increases toward the end.

[0052] The electronic device (10) may include an adhesive (300, see FIG. 5). The adhesive (300) may be placed in the joining groove (136) and may join the housing (100) and the cover (200). The adhesive (300) may be placed between the bottom surface of the joining groove (136) and the outer surface of the side portion (220). The adhesive (300) may be placed to surround the lower surface and a portion of the side surface of the side portion (220).

[0053] As illustrated in Fig. 5, based on the formation area of ​​the protrusion (150), the adhesive (300) can be placed on the upper surfaces of the plurality of unit protrusions (152) and the adhesive receiving grooves (158, 159), respectively. Accordingly, while the lower end of the side portion (220) and the upper surface of the protrusion (150) come into contact, the bonding state of the side portion (220) within the bonding groove (136) can be firmly maintained through the adhesive (300).

[0054] According to the above structure, there is an advantage in that electrical conductivity between the housing and the cover can be improved due to the contact structure of the protrusion and the side surface.

[0055] In addition, since the adhesive placement area is formed wider through the adhesive receiving groove in the protrusion, there is an advantage in that the physical bonding through the adhesive in the contact area between the housing and the cover can be maintained more firmly.

[0056] Although all components constituting the embodiments of the present invention have been described above as being combined or operating in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined and operated one or more times. In addition, terms such as "include," "comprise," or "have" described above, unless specifically stated to the contrary, mean that the corresponding component may be inherent, and therefore should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related technology, and shall not be interpreted in an ideal or excessively formal sense, unless explicitly defined in the present invention.

[0057] The above description is merely an illustrative description of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A housing having a joining groove formed on the upper surface; and A cover is coupled to the housing and includes an upper surface and a side surface that is bent downward from the edge of the upper surface and has a lower surface coupled to the coupling groove. The housing includes a protrusion that protrudes upward from the bottom surface of the coupling groove and comes into contact with the lower surface of the side surface, An electronic device comprising a plurality of unit protrusions and an adhesive receiving groove formed between the plurality of unit protrusions.

2. In paragraph 1, Including an adhesive placed in the above-mentioned bonding groove, An electronic device in which the adhesive is disposed on the upper surface of the plurality of unit protrusions, the side surface of the side portion, the adhesive receiving groove, and the lower surface of the side portion.

3. In paragraph 1, The above plurality of unit protrusions each include a first unit protrusion and a second unit protrusion, An electronic device in which the first unit protrusion and the second unit protrusion each include a first surface arranged parallel to each other and a second surface arranged on both sides of the first surface.

4. In paragraph 3, An electronic device in which the second surface is formed to be inclined so that the distance to the second surface of the adjacent unit protrusion increases as it goes toward the end.

5. In paragraph 3, The adhesive receiving groove includes a first groove arranged between a first surface of the first unit protrusion and a first surface of the second unit protrusion, and a second groove arranged between a second surface of the first unit protrusion and a second surface of the second unit protrusion. An electronic device in which the width of the first groove and the width of the second groove are different from each other.

6. In paragraph 1, An electronic device in which the thickness of the above side portion is smaller than the width of the above joining groove.

7. In paragraph 1, A space is formed on the above housing in which a printed circuit board is placed, A first side wall and a second side wall are arranged on the outside of the above space, The above-mentioned joining groove is arranged between the first side wall and the second side wall, An electronic device in which the side surface is spaced apart from the inner surface of the first side wall and the outer surface of the second side wall.

8. In paragraph 1, An electronic device in which the above protrusions are provided in multiple numbers and are arranged spaced apart from each other along the periphery of the above-mentioned joining groove.

9. In paragraph 1, An electronic device in which the lower surface of the above side portion is spaced apart from the bottom surface of the above-mentioned joining groove in the vertical direction at least in part.

10. In paragraph 1, An electronic device in which the lower surface of the above side part is in contact with the upper surface of each of the plurality of unit protrusions.

Citation Information

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