Electronic device

Abstract

The present embodiment relates to an electronic device that prevents damage to a heat dissipation member during the manufacture thereof, and thus can have improved heat dissipation efficiency, and comprises: a housing including a heat dissipation passage; and a heat dissipation member have at least one part arranged in the heat dissipation passage, wherein the top surface of the heat dissipation passage has a first hole for upwardly exposing the surface of the heat dissipation member, and the bottom surface of the heat dissipation passage has a second hole for downwardly exposing the surface of the heat dissipation member.

Description

electronic devices

[0001] This embodiment relates to an electronic device.

[0002]

[0003] Electronic devices such as a controller mounted on a vehicle perform functions such as vehicle control, motor control, and charging control, and in particular, the oil pump controller is configured to check the operating status of a high-voltage electric oil pump and then check the controllable status of the transmission system.

[0004] Recently, vehicles are increasingly using a large number of high-voltage electrical components, including electric motors, inverters, controllers, and high-voltage batteries. These electrical components include numerous heat-generating components. Accordingly, by connecting refrigerant pipes to the housing, heat dissipation from these heat-generating components can be achieved.

[0005] For example, a heat dissipation structure for an electronic device can be implemented by integrally forming a plastic housing and a metal refrigerant pipe through insert injection. However, in this case, there is a problem of manufacturing defects such as the refrigerant pipe bending or being crushed due to the high pressure generated during the injection process.

[0006]

[0007] The present embodiment provides an electronic device capable of improving heat dissipation efficiency by preventing damage to a heat dissipation member in advance during the manufacturing process.

[0008]

[0009] An electronic device according to the present embodiment comprises a housing including a heat dissipation passage; and a heat dissipation member at least partially disposed within the heat dissipation passage, wherein a first hole is formed on an upper surface of the heat dissipation passage to expose a surface of the heat dissipation member upward, and a second hole is formed on a lower surface of the heat dissipation passage to expose a surface of the heat dissipation member downward.

[0010] The material of the above housing may be plastic, and the material of the above heat dissipation member may be metal.

[0011] The first hole and the second hole may be arranged so that at least a portion thereof overlaps in the vertical direction.

[0012] It includes an electronic component arranged in the space within the housing, and the electronic component can overlap with the second hole in the vertical direction.

[0013] The above heat dissipation member includes a refrigerant inlet portion through which refrigerant is introduced, a refrigerant discharge portion through which the introduced refrigerant is discharged, and a first line disposed between the refrigerant inlet portion and the refrigerant discharge portion, the length of the first line being longer than the length of the refrigerant inlet portion or the refrigerant discharge portion, and the first hole can face the first line in a vertical direction.

[0014] Based on the flow direction of the refrigerant, the length of the first hole may be longer than half the length of the first line.

[0015] The surface of the heat dissipation member exposed to the outside through the first hole or the second hole may be a flat surface.

[0016] On the upper surface of the above heat dissipation passage, a groove with a concave shape is formed downward compared to other areas,

[0017] The bottom surface of the above-mentioned home can form the same plane as the surface of the heat dissipation member exposed to the outside through the first hole.

[0018] The cross-sectional area of ​​the first hole and the cross-sectional area of ​​the second hole may be different from each other.

[0019] The above first holes may be provided in multiple numbers and arranged to be spaced apart from each other along the length of the heat dissipation passage.

[0020]

[0021] In this embodiment, by minimizing the injection pressure applied to the heat dissipation member by having a plurality of hole structures that open the heat dissipation member to the outside based on the heat dissipation passage, deformation of the heat dissipation member can be prevented during the manufacturing process, and thus, production efficiency can be improved while heat dissipation efficiency can also be improved, which has the advantage of being able to be achieved.

[0022]

[0023] FIG. 1 is a perspective view showing the exterior of an electronic device according to a first embodiment of the present invention.

[0024] Figure 2 is a plan view showing the lower surface of a housing according to the first embodiment of the present invention.

[0025] Figure 3 is an exploded perspective view of an electronic device according to a first embodiment of the present invention.

[0026] Figure 4 is a perspective view showing the upper surface of a housing according to a second embodiment of the present invention.

[0027] FIG. 5 is a drawing for explaining the arrangement structure of a heat dissipation passage and a heat dissipation member according to a second embodiment of the present invention.

[0028]

[0029] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0030] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0031] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0032] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as "A and / or at least one (or more) of B, C," it may include one or more of all combinations that can be combined with A, B, and C.

[0033] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0034] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0035] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0036] Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Also, when it is expressed as "above" or "below", it can include the meaning of the downward direction as well as the upward direction based on one component.

[0037] The electronic device according to the present embodiment is installed in a vehicle and may include a converter, a pump, an electronic control unit (ECU), an oil pump control unit (OPU), and the like. However, this is merely exemplary, and the electronic device may include various devices that include at least one electronic component arranged within a housing and are electrically connected via external terminals and connectors.

[0038] FIG. 1 is a perspective view showing the exterior of an electronic device according to a first embodiment of the present invention, FIG. 2 is a plan view showing the lower surface of a housing according to the first embodiment of the present invention, and FIG. 3 is an exploded perspective view of an electronic device according to the first embodiment of the present invention.

[0039] Referring to FIGS. 1 to 3, an electronic device (10) according to an embodiment of the present invention may include a housing (100) and a heat dissipation member (170).

[0040] The housing (100) may form the outer shape of the electronic device (10). The housing (100) may be formed in a box shape with an open bottom. A space may be formed within the housing (100) in which electronic components (not shown) for driving the electronic device (10) are placed. The space is opened downwardly from the housing (100), and a base (not shown) may be coupled to the bottom surface of the housing (100) to cover the bottom surface of the space.

[0041] Meanwhile, the definition of the vertical direction of the electronic device (10) described above is exemplary, and the housing (100) may be formed in a box shape with an open upper surface. In this case, a cover (not shown) may be combined with the upper surface of the housing (100) to cover the upper surface of the space opened upward.

[0042] The above housing (100) may include a top plate (110) and a side plate (120).

[0043] The upper surface of the upper plate (110) may form the upper surface of the electronic device (10). The side plate (120) may form the side surface of the electronic device (10). The side plate (120) may have a shape extending downward from the edge of the upper plate (110). The space within the electronic device (10) may be formed by the lower surface of the upper plate (110) and the inner surface of the side plate (120).

[0044] The housing (100) may include a heat dissipation passage (130). The heat dissipation passage (130) may be arranged on one surface of the housing (100), and a heat dissipation space (135) may be formed therein so that the heat dissipation member (170) may be coupled thereto. The cross-sectional shape of the heat dissipation space (135) may be formed to correspond to the cross-sectional shape of the heat dissipation member (170). For example, the cross-sectional shape of the heat dissipation space (135) may be circular.

[0045] A first opening forming one end of the heat dissipation passage (130) may be formed on one side of the housing (100), and a second opening forming the other end of the heat dissipation passage (130) may be formed on the other side of the housing (100) adjacent to the one side. The heat dissipation passage (130) may be formed as a single line defined from the first opening to the second opening. One side of the housing (100) where the first opening is formed and the other side of the housing (100) where the second opening is formed may be arranged adjacent to each other. One side of the housing (100) where the first opening is formed and the other side of the housing (100) where the second opening is formed may be arranged perpendicular to each other.

[0046] The above heat dissipation passage (130) may have a region that is bent at least once. The above heat dissipation passage (130) may be arranged to overlap vertically with an electronic component (not shown) arranged in a space within the electronic device (10).

[0047] The surface of the heat dissipation passage (130) may be arranged at a step relative to the surface of the housing (100). In detail, the heat dissipation passage (130) may have a shape in which at least a portion thereof protrudes upward from the upper surface of the housing (100) more than other areas.

[0048] The material of the above housing (100) may be plastic. Accordingly, the electronic device (10) can be made lighter.

[0049] The heat dissipation member (170) may be coupled to the heat dissipation passage (130). The heat dissipation member (170) may have a flow path formed therein so that a refrigerant flows. The heat dissipation member (170) may be formed in a pipe shape. Accordingly, the heat dissipation member (170) may be called a heat dissipation pipe. The heat dissipation member (170) may have a circular cross-section. The heat dissipation member (170) may be arranged within the heat dissipation passage (130). Both ends of the heat dissipation member (170) may protrude outward from the side surface of the housing (100) through the first opening and the second opening of the heat dissipation passage (130).

[0050] The above heat dissipation member (170) may be formed of a metal material. The above heat dissipation member (170) may be integrally formed with the above housing (100) made of a plastic material through insert injection.

[0051] A refrigerant inlet (172) for introducing refrigerant into the passage may be formed at one end of the heat dissipation member (170), and a refrigerant discharge (174) for discharging the refrigerant circulated through the passage may be formed at the other end of the heat dissipation member (170). The refrigerant inlet (172) and the refrigerant discharge (174) may be arranged in parallel. The heat dissipation member (170) may be formed as a single line defined from the refrigerant inlet (172) to the refrigerant discharge (174). As described above, an area of ​​the side surface of the housing (100) where the refrigerant inlet (172) is arranged and an area where the refrigerant discharge (174) is arranged may be perpendicular to each other.

[0052] The above heat dissipation member (170) may have a region that is bent at least once.

[0053] The thickness of the above heat dissipation member (170) may be 1 / 10 or more of the diameter of the above heat dissipation member (170).

[0054] In detail, the heat dissipation member (170) may include a first line (177) arranged between the refrigerant inlet (172) and the refrigerant discharge (174). The first line (177) may be bent from an end of the refrigerant inlet (172) and may extend toward the refrigerant discharge (174). The first line (177) may be arranged to have an obtuse angle with the refrigerant inlet (172) or the refrigerant discharge (220). The first line (177) may be arranged to connect one side and the other side of the housing (100) that are arranged adjacent to each other. A first bent part (179) may be formed between the first line (177) and the refrigerant inlet (172).

[0055] The first line (177) may be arranged within the heat dissipation passage (130). A second hole (117, see FIG. 3) may be formed on the bottom surface of the heat dissipation passage (130) to expose the heat dissipation member (170), i.e., the first line (177) downward. The second hole (117) may have a shape penetrating from the upper surface to the lower surface of the housing (100). The second hole (117) may have a rectangular cross-sectional shape. Through the second hole (117), the lower surface of the first line (177) may be exposed downward, which is a placement area of ​​the space within the housing (100). The second hole (117) may be arranged between the upper surface of the electronic component and the lower surface of the first line (177). The second hole (117) may be arranged to overlap the electronic component in the vertical direction. The electronic component and the first line (177) can be in contact through the second hole (117). Accordingly, heat dissipation efficiency can be improved.

[0056] Based on the flow direction of the refrigerant, the length of the first line (177) may be longer than the length of any one of the refrigerant inlet (172), the refrigerant discharge (174), and the second line (175) described later.

[0057] The lower surface of the first line (177) exposed to the space within the housing (100) through the second hole (117) may be a flat surface. Accordingly, the contact area with the electronic component may increase.

[0058] The heat dissipation member (170) may include a second line (175) in addition to the first line (177), and the second line (175) may have both ends connected to the first line (177) and the refrigerant discharge unit (174), respectively. The second line (175) may be arranged perpendicular to the refrigerant inlet unit (172) or the refrigerant discharge unit (174). The second line (175) may be arranged to form an obtuse angle with the first line (177). At least a portion of the second line (175) is arranged within the heat dissipation passage (130), and the other portion is arranged within the heat dissipation passage (130).

[0059] The housing (100) may include a first hole (150). The first hole (150) may be arranged on the heat dissipation passage (130). The first hole (150) may have a shape that penetrates from the outer surface to the inner surface of the heat dissipation passage (130). At least a portion of the heat dissipation member (170) may be exposed upward through the first hole (150). A portion of the upper surface of the first line (177) may be exposed upward through the first hole (150). The cross-sectional area of ​​the first hole (150) may be larger than the cross-sectional area of ​​the second hole (117). Due to the formation area of ​​the first hole (150), the upper surface of the heat dissipation passage (130) may include a plurality of regions that are spaced apart from each other based on the flow direction of the refrigerant. The first hole (150) may be arranged between the plurality of regions.

[0060] Based on the flow direction of the refrigerant, the length of the first line (177) may be longer than the length of the first hole (150). The length of the first hole (150) may be longer than half the length of the first line (177).

[0061] Meanwhile, although not shown, the first hole (150) may be provided in multiple numbers and arranged to be spaced apart from each other along the length of the heat dissipation passage (130).

[0062] In the case of a structure in which a heat dissipation passage (130) formed on the surface of a housing (100) is arranged to surround the outer surface of a heat dissipation member (170), there is a problem of manufacturing defects due to deformation of the heat dissipation member (170) according to the injection pressure during the insert injection process of the housing (100) and the heat dissipation member (170).

[0063] However, according to the present embodiment, by minimizing the injection pressure applied to the heat dissipation member (170) with a plurality of hole structures that open the heat dissipation member (170) to the outside based on the heat dissipation passage (130), deformation of the heat dissipation member (170) can be prevented during the manufacturing process, and thus, there is an advantage in that production efficiency can be improved while heat dissipation efficiency can also be improved.

[0064] FIG. 4 is a perspective view showing the upper surface of a housing according to a second embodiment of the present invention, and FIG. 5 is a drawing for explaining the arrangement structure of a heat dissipation passage and a heat dissipation member according to the second embodiment of the present invention.

[0065] This embodiment is otherwise identical to the first embodiment, with the exception of some differences in the shapes of the heat dissipation member and heat dissipation passage. Therefore, only the characteristic parts of this embodiment will be described below, and the description of the first embodiment will be used for the remaining parts.

[0066] Referring to FIGS. 4 and 5, an electronic device according to a second embodiment of the present invention may include a heat dissipation passage (230) formed in a housing and a heat dissipation member (170) coupled to at least a portion of the heat dissipation passage (230).

[0067] The above heat dissipation passage (230) may include a first hole (236) for exposing the upper surface of the heat dissipation member (170) upward, and a second hole (117) for exposing the lower surface of the heat dissipation member (170) to the space within the housing.

[0068] The upper surface of the heat dissipation member (170) may be a flat surface, the surface exposed upward through the first hole (236) and the surface exposed downward through the second hole (117). In this case, when the surface of the heat dissipation member (170) exposed through the first hole (236) is referred to as a first flat surface (177a), and the surface exposed through the second hole (117) is referred to as a second flat surface (177b), the first flat surface (177a) and the second flat surface (177b) may be arranged to overlap in the vertical direction. The second flat surface (177b) may be in contact with an electronic component within the housing. The length of the second flat surface (177b) may be longer than the length of the first flat surface (177a).

[0069] A groove (232) that is concave downward compared to other areas may be formed on the upper surface of the heat dissipation passage (170). The first hole (236) may have a shape that penetrates a portion of the bottom surface of the groove (232). The surface of the heat dissipation member (170) exposed upward through the first hole (236) may form the same plane as the bottom surface (234) of the groove (232).

[0070] Although all components constituting the embodiments of the present invention have been described above as being combined or operating in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined and operated one or more times. In addition, terms such as "include," "comprise," or "have" described above, unless specifically stated to the contrary, mean that the corresponding component may be inherent, and therefore should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related technology, and shall not be interpreted in an ideal or excessively formal sense, unless explicitly defined in the present invention.

[0071] The above description is merely an illustrative description of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A housing including a heat dissipation passage; and Including a heat dissipation member that is at least partially disposed within the above heat dissipation passage, A first hole is formed on the upper surface of the heat dissipation passage to expose the surface of the heat dissipation member upwards, An electronic device in which a second hole is formed on the lower surface of the heat dissipation passage to expose the surface of the heat dissipation member downward.

2. In paragraph 1, The material of the above housing is plastic, An electronic device in which the material of the above heat dissipation member is metal.

3. In paragraph 1, An electronic device in which the first hole and the second hole are arranged to overlap at least partially in the vertical direction.

4. In paragraph 1, Including electronic components arranged in the space within the housing, The above electronic component is an electronic device that overlaps the second hole in the vertical direction.

5. In paragraph 1, The above heat dissipation member includes a refrigerant inlet through which refrigerant is introduced, a refrigerant discharge port through which the introduced refrigerant is discharged, and a first line disposed between the refrigerant inlet port and the refrigerant discharge port. The length of the first line is longer than the length of the refrigerant inlet or the refrigerant discharge, The above first hole is an electronic device that faces the above first line in the vertical direction.

6. In paragraph 5, An electronic device in which the length of the first hole is longer than half the length of the first line, based on the flow direction of the refrigerant.

7. In paragraph 1, An electronic device in which the surface of the heat dissipation member exposed to the outside through the first hole or the second hole is a flat surface.

8. In paragraph 7, On the upper surface of the above heat dissipation passage, a groove with a concave shape is formed downward compared to other areas, An electronic device in which the bottom surface of the above home forms the same plane as the surface of the heat dissipation member exposed to the outside through the first hole.

9. In paragraph 1, An electronic device in which the cross-sectional areas of the first hole and the second hole are different from each other.

10. In paragraph 1, An electronic device in which the first hole is provided in plurality and is arranged spaced apart from each other along the length of the heat dissipation passage.

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