Electronic device

Abstract

The present application relates to the technical field of electronic products. Disclosed is an electronic device. The electronic device comprises a main body portion and a decorative portion arranged on the main body portion, wherein the main body portion and the decorative portion jointly enclose a cavity; an air duct shell is arranged in the cavity, and divides the cavity into a first cavity and a second cavity which are not in communication with each other, the first cavity being a closed cavity; and the decorative portion is configured to form the second cavity, and the decorative portion is provided with an air inlet and an air outlet which are in communication with the second cavity and the outside of the electronic device. The orthographic projection of the first cavity on a first plane is at least partially overlapped with the orthographic projection of the second cavity on the first plane, the first plane being parallel to the thickness direction of the electronic device. A heat dissipation device is provided in the second cavity, and is configured to dissipate heat from a heat source in the first cavity. The electronic device can achieve a heat dissipation effect and the reliability of sealing and waterproofing, and also meet a miniaturization design requirement.

Description

electronic devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on February 7, 2024, with application number 202410176381.2 and application name “Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic products, and in particular to an electronic device. Background Art

[0003] The performance requirements of current electronic devices are becoming increasingly higher, and the power consumption of corresponding electronic components is rapidly increasing, resulting in higher and higher heat dissipation of electronic components. Air cooling has gradually become the mainstream heat dissipation solution for electronic devices due to its excellent heat dissipation effect.

[0004] Currently, air-cooled heat sinks are installed inside electronic devices. These devices have air inlets and outlets to allow air to circulate, thereby dissipating heat. Furthermore, these vents are covered with waterproof, breathable membranes to prevent moisture from entering. However, these membranes can obstruct air flow, resulting in poor heat dissipation.

[0005] Summary of the Invention

[0006] In order to solve the above technical problems, the present application provides an electronic device, including a heat dissipation device. By rationally arranging the position of the heat dissipation device, it can take into account the heat dissipation effect, sealing and waterproof reliability, and miniaturization design requirements at the same time.

[0007] The first aspect of the present application provides an electronic device. The electronic device includes a main body and a decorative part arranged on the main body, wherein the main body and the decorative part together form a cavity, an air duct housing is provided in the cavity, and the air duct housing separates the cavity into a first cavity and a second cavity that are not connected to each other. The first cavity is a sealed cavity, and the decorative part is used to form the second cavity, and the decorative part is provided with an air inlet and an air outlet connecting the second cavity and the outside of the electronic device. The orthographic projection of the first cavity on the first plane at least partially overlaps with the orthographic projection of the second cavity on the first plane, and the first plane is parallel to the thickness direction of the electronic device. A heat dissipation device is provided in the second cavity, and the heat dissipation device is used to dissipate heat from the heat source in the first cavity.

[0008] In the above-mentioned electronic device, since the first cavity is a closed cavity and the second cavity is an open cavity, and the first cavity and the second cavity are not connected to each other, the water outside the electronic device can only flow in the second cavity isolated from the first cavity, and cannot enter the first cavity, so that the first cavity can play a sealing and waterproof protection role for the electronic components inside it. At the same time, the open second cavity can provide a sufficiently large inlet and outlet air volume for the heat dissipation device, thereby effectively improving the heat dissipation effect of the heat dissipation device. Moreover, the use of existing structural parts of the electronic device (for example, decorative parts) to form an open second cavity can avoid additional increase in the overall dimensions of the electronic device. At the same time, the first cavity and the second cavity share part of the thickness space, so without additional increase in the overall dimensions of the electronic device, it can also ensure that the second cavity can have enough space to place the heat dissipation device, thereby making full use of the internal space of the electronic device itself. In summary, the electronic device takes into account the heat dissipation function, miniaturization design and waterproof sealing.

[0009] In a possible implementation of the first aspect, the decorative element is a camera back cover. Thus, the decorative element, while forming the second cavity, can also be used to protect the camera and have a decorative effect on the appearance, making the electronic device more stylish.

[0010] In one possible implementation of the first aspect, the air duct housing is a cylindrical structure including a first end and a second end, both of which are open. The first end is sealed to the decorative element, and the second end is sealed to the main body. Thus, the main body and the air duct housing together form a first cavity, and the main body, decorative element, and air duct housing together form a second cavity.

[0011] In one possible implementation of the first aspect, the main body includes a back shell and a middle frame, the middle frame including a support plate and a frame body surrounding the support plate. The back shell cover is disposed on the frame body and is sealed therewith. The back shell defines a first through hole, and the decorative member is sealed therewith. The first end of the duct housing is sealed therewith to the decorative member, and the second end is sealed therewith to the support plate.

[0012] In one possible implementation of the first aspect, the first through hole includes a first curved wall, and the decorative member includes a second curved wall. The first curved wall is disposed around the second curved wall and, together with the second curved wall, forms a waterproof adhesive receiving groove. For example, the waterproof adhesive receiving groove contains waterproof adhesive, thereby providing a sealing and waterproofing effect.

[0013] Because the waterproof adhesive receiving groove is enclosed by the first and second curved walls, its cross-section is also curved, allowing it to accommodate more waterproof adhesive, effectively improving the connection reliability between the main body and the decorative component. Furthermore, the first and second curved walls also create a smoother transition between the main body and the decorative component, effectively enhancing the aesthetics and refinement of the junction between the main body and the decorative component.

[0014] In a possible implementation of the first aspect above, the decorative component further includes a glue retaining wall connected to the second curved wall, and the glue retaining wall is in contact with the first curved wall to prevent the waterproof glue from leaking from the waterproof glue receiving groove.

[0015] In a possible implementation of the first aspect above, the hardness of the material of the glue retaining wall is less than the hardness of the material of the second curved wall.

[0016] Since the hardness of the material of the glue retaining wall is relatively small, the glue retaining wall can produce slight deformation during the pressure holding process after dispensing to release stress, thereby effectively avoiding the problem of the back shell being broken due to the concentrated force exerted by the decorative parts on the back shell, further reducing the difficulty of assembly.

[0017] In one possible implementation of the first aspect, the adhesive retaining wall and the second curved wall are made of a nano-injection molding material. That is, the second curved wall and the adhesive retaining wall can be integrally formed using a nano-injection molding process, which reduces molding difficulty and improves overall connection reliability in the finished product. For example, the second curved wall can be made of metal, and the adhesive retaining wall can be made of plastic.

[0018] In a possible implementation of the first aspect above, the main body also includes a temperature equalizing plate, and a second through hole connected to the second cavity is opened on the supporting plate of the middle frame. The temperature equalizing plate is located on the side of the supporting plate facing away from the back shell, and is covered on the second through hole and sealed with the second through hole.

[0019] In this way, the temperature equalizer can be used to form a second cavity, which can transfer the heat from the heat source to the heat dissipation device located in the second cavity, and can also effectively diffuse the concentrated heat, thereby eliminating hot spots and equalizing the temperature, which plays an important role in the heat dissipation performance of electronic equipment.

[0020] In one possible implementation of the first aspect, the support plate is provided with a slot adapted to fit the second end of the air duct housing. The second end of the air duct housing is inserted into the slot and, together with the slot, forms a waterproof adhesive receiving groove. For example, the waterproof adhesive receiving groove may contain waterproof adhesive, thereby achieving a sealing and waterproofing effect.

[0021] It will be appreciated that the slot and the second end of the air duct housing have a clearance fit. Therefore, the assembly precision (or positioning accuracy) between the slot and the second end of the air duct housing is not required to be high, making assembly easier. Furthermore, the slot effectively prevents the waterproof adhesive from leaking from the waterproof adhesive receiving groove to the screen side, providing a reliable seal.

[0022] In a possible implementation of the first aspect, the slot has a chamfered opening, so that during assembly of the air duct housing and the middle frame, the second end of the air duct housing can be easily inserted into the slot, making assembly of the air duct housing and the middle frame easier.

[0023] In a possible implementation of the first aspect, the decorative element is raised relative to the back shell along the thickness direction of the electronic device. This can increase the volume of the second cavity to accommodate a larger heat dissipation device with better heat dissipation performance, thereby further improving the heat dissipation effect.

[0024] In one possible implementation of the first aspect, the duct housing has a groove-like structure, including a first end and a second end. The first end forms the groove opening, facing the decorative element and sealingly connected thereto, and the second end forms the groove bottom wall, facing the main body. Thus, the main body and the duct housing together form a first cavity, and the decorative element and the duct housing together form a second cavity.

[0025] Since the air duct housing is a groove-shaped structure, the air duct housing only needs to be sealed and connected to the decorative part at the first end to form a closed second cavity, without the need for a sealed connection with the main body. Secondly, there is no need to seal other components inside the main body (for example, between the temperature distribution plate and the middle frame). In other words, two sealing paths can be reduced: the sealing path between the air duct housing and the main body, and the sealing path between other components inside the main body (for example, between the temperature distribution plate and the middle frame), thereby further improving the waterproof sealing effect.

[0026] In a possible implementation of the first aspect, the electronic device further includes a battery and a connecting circuit board, wherein the battery is disposed in the first cavity, and the connecting circuit board is used to electrically connect the heat dissipation device to the battery.

[0027] Based on this, the heat dissipation device can be powered by the electronic device's own battery without the need for an external power source. This makes it simpler and more convenient to use and can be better adapted to various application scenarios.

[0028] In one possible implementation of the first aspect, a third through hole is defined in the air duct housing, through which the connecting circuit board extends from the first cavity to the second cavity, and the third through hole is sealed to the connecting circuit board. For example, a gap between the connecting circuit board and the third through hole is filled with waterproof glue to provide a waterproof seal.

[0029] The size of the third through hole can be set as small as possible, as long as it can allow the connection circuit board to pass through. In this way, the waterproof space that needs to be sealed can be made smaller, thereby further improving the waterproof effect.

[0030] In a possible implementation of the first aspect above, the first cavity is provided with a mainboard, which can control the working state of the heat dissipation device, such as starting and stopping the heat dissipation device, or adjusting the heat dissipation intensity of the heat dissipation device, so that the heat dissipation device can better meet the heat dissipation requirements in different application scenarios.

[0031] In a possible implementation of the first aspect, the heat dissipation device includes a heat dissipation fan that can blow heat from a heat source out of the electronic device to achieve heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] FIG1 shows an exemplary structure of a mobile phone in some embodiments, which is a front view of the mobile phone;

[0033] FIG2 shows an exemplary structure of another mobile phone in some embodiments, which is a side view of the mobile phone;

[0034] FIG3A shows a perspective view of a mobile phone in an embodiment of the present application;

[0035] FIG3B shows a cross-sectional view of the mobile phone along the AA section in FIG3A according to an embodiment of the present application;

[0036] FIG4 shows an exemplary structure of a mobile phone without a heat dissipation device in an embodiment of the present application;

[0037] FIG5A shows a cross-sectional view of the mobile phone along the AA section in FIG3A according to an embodiment of the present application, wherein the main board and the heat dissipation device are not shown;

[0038] FIG5B shows an exploded view of a mobile phone according to FIG5A ;

[0039] FIG6 shows an exemplary structure of a heat dissipation module in a mobile phone according to an embodiment of the present application;

[0040] FIG7 shows a partial enlarged view of the mobile phone at the M1 area in FIG5A in an embodiment of the present application;

[0041] FIG8A shows a partial enlarged view of the mobile phone at the M2 area in FIG7 in an embodiment of the present application;

[0042] FIG8B shows an exploded view of the main body and decorative parts of the mobile phone according to FIG8A ;

[0043] FIG9A shows a partial enlarged view of the M3 area in FIG7 in the mobile phone in an embodiment of the present application;

[0044] FIG9B shows an exploded view of the main body and the air duct housing of the mobile phone according to FIG9A ;

[0045] FIG10A shows a cross-sectional view of the mobile phone taken along line BB in FIG3A according to an embodiment of the present application;

[0046] FIG10B shows a cross-sectional view of the mobile phone taken along the CC line in FIG10A according to an embodiment of the present application;

[0047] FIG11A shows a cross-sectional view of a mobile phone 1′ according to an embodiment of the present application;

[0048] FIG11B shows an exploded view of the mobile phone 1 ′ according to FIG11A . DETAILED DESCRIPTION

[0049] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0050] The present application provides an electronic device including a heat dissipation device, wherein the heat dissipation device includes a heat dissipation fan for achieving air circulation to dissipate heat from a heat source in the electronic device.

[0051] It is understood that the electronic devices provided in this application include, but are not limited to, any of the electronic devices that require heat dissipation and waterproofing, such as mobile phones, tablet personal computers, e-book readers, televisions, laptop computers, personal digital assistants (PDAs), personal computers (PCs), notebook computers, vehicle-mounted devices, and wearable devices, and this application does not specifically limit this. In addition, it is understood that the heat source can be any of various electronic components, such as an application processor (multimedia application processor, MAP), a radio frequency amplifier (radio frequency amplifier, RFA), a power amplifier (power amplifier, PA), a battery management chip (power management IC, PMIC), a chip (e.g., a system on chip (SOC)), a central processing unit (CPU), or a battery.

[0052] For ease of description, the following text will describe this solution using the electronic device as a mobile phone and the heat source as a motherboard as an example, wherein the motherboard can integrate electronic components such as a processor, a memory, and a communication module.

[0053] In some embodiments, the heat dissipation device is disposed inside the mobile phone. Specifically, FIG1 shows an exemplary structure of a mobile phone 1a in some embodiments, which is a front view of the mobile phone 1a. Referring to FIG1 , the mobile phone 1a includes a mainboard 100a, a heat dissipation device 200a, and a housing 300a. The housing 300a forms a cavity S1a. The mainboard 100a is disposed at the top position P1 of the cavity S1a. The heat dissipation device 200a is an air-cooled heat dissipation device, including a heat dissipation fan 210a and heat dissipation fins 220a. The heat dissipation device 200a is disposed at the bottom position P2 of the cavity S1a. A through hole 310a is provided on the housing 300a at a position corresponding to the heat dissipation fan 210a, serving as an air inlet and outlet. Based on this, the cooling fan 210a can drive the gas to flow between the inside and outside of the mobile phone 1a through the through hole 310a, and the flowing gas can take away the heat absorbed by the cooling fins 220a from the mainboard 100a through the heat conducting plate 400a, thereby achieving heat dissipation of the mainboard 100a.

[0054] To provide a waterproof seal for the motherboard 100a, a waterproof, breathable membrane 320a is provided on the through hole 310a, making the cavity S1a waterproof and breathable. However, the airflow per unit time of the waterproof, breathable membrane 320a is relatively small, failing to meet the air inlet and outlet requirements of a normal air-cooled heat sink 200a, resulting in poor heat dissipation performance.

[0055] To this end, in some other embodiments, the heat dissipation device is provided on the outside of the mobile phone. Specifically, FIG2 shows an exemplary structure of another mobile phone 1b in some embodiments, which is a side view of the mobile phone 1b. Referring to FIG2 , the housing 300b of the mobile phone 1b forms a closed cavity S1b, and the mainboard 100b is provided in the cavity S1b. The front of the housing 300b is used to support the screen (not shown), and the back is provided with an open cavity S2b, and the cavity S2b is connected to the outside world through the through hole 230b. The cooling fan 210b and the cooling fins 220b of the heat dissipation device 200b are both provided in the cavity S2b, and the air inlet and outlet are achieved through the through hole 230b.

[0056] In the above solution, since heat sink 200b is directly disposed outside cavity S1b, cavity S1b is less susceptible to water vapor erosion, thereby resolving the problem of poor heat dissipation due to the waterproof and breathable membrane. However, heat sink 200b occupies a significant amount of additional space (e.g., the thickness along the Z direction), resulting in a larger overall size of mobile phone 1b (e.g., the size of mobile phone 1b along the Z direction), hindering the miniaturization of mobile phone 1b.

[0057] Based on this, the present application provides an electronic device. By rationally arranging the positions of the heat dissipation devices, the electronic device can simultaneously take into account the heat dissipation effect, the reliability of sealing and waterproofing, and the requirements of miniaturization. The following uses a mobile phone as an example to describe the technical solution of the present application in detail with reference to the accompanying drawings.

[0058] Figures 3A and 3B illustrate an exemplary structure of a mobile phone 1 according to an embodiment of the present application. Figure 3A is a perspective view of the mobile phone 1. Figure 3B is a cross-sectional view of the mobile phone 1 along the AA section in Figure 3A. Referring to Figures 3A and 3B, the mobile phone 1 includes a main body 01 and a decorative element 02.

[0059] The main body 01 can be shaped like a rectangular parallelepiped. The rectangular parallelepiped structure can include a rectangular parallelepiped structure and a structure similar to a rectangular parallelepiped (for example, the outer surface of the rectangular parallelepiped structure can be partially concave or partially convex). The main body 01 can include a screen 11. When a user holds the main body 01, they can use the screen 11 to view videos, images, or perform other touch operations.

[0060] Decorative piece 02 is provided on main body 01 to enhance the appearance and performance of mobile phone 1. For example, as shown in Figures 3A and 3B , decorative piece 02 can be provided on the back of main body 01, serving as a camera cover to protect the rear camera (not shown). It also serves as a decorative element, adding a more stylish look to the back of main body 01. The back of main body 01 refers to the surface of main body 01 facing away from the user when the user is holding main body 01 and facing screen 11.

[0061] The main body 01 and the decorative element 02 together form a cavity S0. An air duct housing 03 is provided in the cavity S0. The air duct housing 03 divides the cavity S0 into a first cavity S1 and a second cavity S2.

[0062] The first cavity S1 is a sealed cavity. A motherboard 100 is housed within the first cavity S1. It is understood that the first cavity S1 can serve as the main cavity of the mobile phone 1. The components housed within it are not limited to the motherboard 100. Other electronic components used to implement the functions of the mobile phone 1, such as a battery and a camera, may also be housed therein. These are not listed here.

[0063] The second cavity S2 is an open cavity. A heat sink 200 is provided in the second cavity S2. The heat sink 200 includes a heat dissipation fan 210 and heat dissipation fins 220. It is understood that the second cavity S2 is used to form an air duct to enable the heat sink 200 to dissipate heat from the motherboard 100.

[0064] For example, decorative member 02 is provided with a through hole 21, which connects second cavity S2 and the exterior of phone 1, serving as an air inlet and outlet. A cooling fan 210 can drive gas (e.g., air) through through hole 21 to flow between the interior and exterior of phone 1. FIG3B illustrates an exemplary flow direction of gas with wavy dashed arrows. The flowing gas can remove heat absorbed from motherboard 100 by heat sink fins 220, for example, lowering the temperature of heat sink fins 220, thereby achieving heat dissipation.

[0065] The first cavity S1 and the second cavity S2 are not connected to each other. In addition, the orthographic projection of the first cavity S1 on the first plane F1 at least partially overlaps with the orthographic projection of the second cavity S2 on the first plane F1. The first plane F1 is parallel to the thickness direction of the mobile phone 1 (for example, as shown in the Z direction in FIG3B ). For example, in this embodiment, the first plane F1 can be a plane where the thickness direction and the length direction of the mobile phone 1 (for example, as shown in the X direction in FIG3A , or the direction perpendicular to the paper in FIG3B ) are located. In other embodiments, the first plane F1 can also be a plane where the thickness direction and the width direction of the mobile phone 1 (for example, as shown in the Y direction in FIG3B ) are located. Exemplarily, the X direction, the Y direction, and the Z direction can be perpendicular to each other.

[0066] In the aforementioned mobile phone 1, since the first cavity S1 is a sealed cavity and the second cavity S2 is an open cavity, and the first cavity S1 and the second cavity S2 are not connected to each other, water outside the mobile phone 1 can only flow through the second cavity S2, which is isolated from the first cavity S1, and cannot enter the first cavity S1. As a result, the first cavity S1 can provide a sealed and waterproof protection for the electronic components (e.g., the motherboard 100) inside. At the same time, the open second cavity S2 can provide a sufficiently large air flow for the heat dissipation device 200, thereby effectively improving the heat dissipation effect of the heat dissipation device 200.

[0067] Secondly, existing structural components of the mobile phone 1 (e.g., decorative element 02) are used to form an open second cavity S2. This second cavity S2 shares some of the same thickness as the first cavity S1, ensuring heat dissipation without increasing the overall dimensions of the mobile phone 1. For example, Figure 4 shows an exemplary structure of a mobile phone 1c without a heat dissipation device 200 in accordance with the present invention. Comparing Figures 3B and 4, the only difference between the mobile phone 1 equipped with a heat dissipation device 200 and the mobile phone 1c without one is the addition of through holes 12 in the decorative element 02 for forming air inlets and outlets, without increasing the overall dimensions. Furthermore, the first cavity S1 and the second cavity S2 share some of the same thickness, ensuring that the second cavity S2 has sufficient space for the heat dissipation device 200 without increasing the overall dimensions of the mobile phone 1. This fully utilizes the internal space of the mobile phone 1, balancing the heat dissipation function with the compact design of the mobile phone 1.

[0068] Furthermore, the heat sink 200 provided in this application can be positioned closer to the motherboard 100, thereby achieving better heat dissipation. For example, as shown in Figure 1 above, to accommodate the layout of other components, the mobile phone 1a has a through-hole 310a at bottom position P2, which serves as an air inlet and outlet. Therefore, the heat sink 200a can only be positioned near bottom position P2. This distance between the heat sink 200a and the motherboard 100a is poor, resulting in poor heat dissipation. In this application, however, through-holes 21 are provided in the decorative member 02, serving as air inlet and outlet. Therefore, the position of the decorative member 02 can be flexibly adjusted according to actual conditions, placing the heat sink 200 closer to the motherboard 100 in the XY plane. Furthermore, the first cavity S1 and the second cavity S2 share a portion of the thickness space. Therefore, the heat sink 200 in the second cavity S2 can also be closer to the motherboard 100 in the first cavity S1 in the Z direction, achieving better heat dissipation.

[0069] It should be understood that Figures 3A and 3B above merely schematically illustrate the location of the decorative element 02. In other embodiments, the decorative element 02 may also be located elsewhere on the main body 01 (e.g., on the side or front), serving as a back cover for other electronic components (e.g., a fingerprint recognition module) within the phone 1. Alternatively, in other embodiments, the decorative element 02 may serve solely to decorate the phone 1 and not to protect other components within the phone 1, although this application is not limiting in this regard.

[0070] It is also understood that while the decorative piece 02 is used to enclose an open second cavity S2, it can also be used together with other parts to enclose a sealed cavity to accommodate electronic components. For example, when the decorative piece 02 is a camera back cover, it can also be used together with other shells to enclose a sealed cavity to accommodate the camera, thereby providing waterproof protection for the camera. In other words, a portion of the decorative piece 02 can be provided with a through hole 21 to enclose an open second cavity S2, while another portion does not have a through hole 21 and is used to enclose a sealed cavity. In other embodiments, the decorative piece 02 can also be used to enclose an open second cavity S2, and not used to enclose other sealed cavities. This application does not limit this.

[0071] Furthermore, the present application does not impose any restrictions on the shape of the decorative element 02. For example, in this embodiment, the overall shape of the decorative element 02 is similar to a cylinder. In other embodiments, the shape of the decorative element 02 can also be a cuboid, a hemisphere, a truncated cone, or other irregular shapes.

[0072] The following further describes the specific implementation of the first cavity S1 and the second cavity S2 in the mobile phone 1 and the specific implementation of the sealing and waterproofing with reference to the accompanying drawings.

[0073] In some possible implementations, the air duct housing 03 can be a cylindrical structure extending in the Z direction, with its two end openings sealedly connected to the main body 01 and the decorative member 02, respectively, thereby dividing the cavity S0 into a first cavity S1 and a second cavity S2. Specifically, the main body 01 and the air duct housing 03 together form the first cavity S1, while the main body 01, the decorative member 02, and the air duct housing 03 together form the second cavity S2.

[0074] For example, Figures 5A and 5B illustrate an exemplary structure of the first cavity S1 and the second cavity S2 in a mobile phone 1 according to an embodiment of the present application. Figure 5A is a cross-sectional view of the mobile phone 1 along the AA section in Figure 3A , excluding the motherboard 100 and the heat sink 200. Figure 5B is an exploded view of the mobile phone 1. Referring to Figures 5A and 5B , in some embodiments of the present application, the main body 01 further includes a back shell 12, a middle frame 13, and a vapor chamber 14 (VC).

[0075] The back shell 12 is placed on the middle frame 13 and is sealed with the middle frame 13. A through hole 121 (as an example of a first through hole) is opened in the back shell 12. The through hole 121 passes through the back shell 12 along the Z direction. The decorative member 02 is disposed in the through hole 121 and is sealed with the through hole 121. For example, the back shell 12 can serve as the battery back cover of the mobile phone 1, used to protect the battery (not shown) and other electronic components (e.g., the motherboard 100).

[0076] The middle frame 13 includes a support plate 13a and a frame body 13b. The support plate 13a is used to support electronic components (e.g., the motherboard 100) and enhance the overall strength of the phone 1. The frame body 13b surrounds the support plate 13a and is sealed to the screen 11 and back cover 12.

[0077] A through hole 131 (as an example of a second through hole) is provided on the supporting plate 13a. The through hole 131 passes through the middle frame 13 along the Z direction. The temperature equalizer 14 is located on the side of the supporting plate 13a facing away from the back shell 12, and is covered on the through hole 131 and sealed with the through hole 131. In this way, the temperature equalizer 14 can be exposed through the through hole 131. That is, when observing from the direction from the back shell 12 to the middle frame 13, the part of the temperature equalizer 14 that is not blocked by the middle frame 13 can be observed through the through hole 131. Among them, the temperature equalizer 14 is a phase change heat dissipation device without pump drive, which can effectively diffuse the concentrated heat, thereby eliminating hot spots and equalizing the temperature, and plays an important role in the heat dissipation performance of the mobile phone 1.

[0078] Based on this, the back shell 12, the middle frame 13, the temperature equalizing plate 14 and the decorative part 02 of the above-mentioned main body part 01 together form a cavity S0.

[0079] The air duct shell 03 is a cylindrical structure and extends along the Z direction. The first end 31 and the second end 32 of the air duct shell 03 are both open openings. Among them, the first end 31 is sealed with the decorative part 02. The second end 32 is sealed with the supporting plate 13a of the middle frame 13. In this way, the cavity S0 can be divided into a first cavity S1 and a second cavity S2 by the air duct shell 03. Among them, the back shell 12 and the middle frame 13 of the main part 01 and the air duct shell 03 together form the first cavity S1. The temperature equalizing plate 14 of the main part 01, the decorative part 02 and the air duct shell 03 together form the second cavity S2. It can be understood that the first cavity S1 is arranged on the outer periphery of the second cavity S2 around the circumference of the air duct shell 03.

[0080] Referring to Figure 3B in conjunction with Figures 5A and 5B, the heat generated by the motherboard 100 in the first cavity S1 can be transferred to the vapor chamber 14 via the support plate 13a of the middle frame 13. Because the vapor chamber 14 is in contact with the heat dissipating fins 220, the vapor chamber 14 can conduct the heat directly to the heat dissipating fins 220 in the second cavity S2. Finally, the heat dissipating fan 210 dissipates the heat from the heat dissipating fins 220 to the outside of the mobile phone 1, thereby achieving heat dissipation from the heat dissipation device 200 to the motherboard 100.

[0081] In some embodiments of the present application, the above-mentioned second cavity S2 and the heat dissipation device 100 located in the second cavity S2 can together form a heat dissipation module. Figure 6 shows an exemplary structure of the heat dissipation module 04 in the mobile phone 1 in an embodiment of the present application. Referring to Figure 6 and in combination with Figures 3A and 3B, Figures 5A and 5B, the second cavity S2 is surrounded by the temperature equalizer 14, the decorative part 02 and the air duct housing 03 of the main body 01. Therefore, the temperature equalizer 14, the decorative part 02, the air duct housing 03 and the heat dissipation device 200 of the main body 01 can together form the heat dissipation module 04. The modular heat dissipation module 04 is conducive to rapid assembly, thereby effectively improving the assembly efficiency of the mobile phone 1. In addition, independent airtightness measurement can also be achieved, so that airtightness problems can be checked in modules before assembling the mobile phone 1.

[0082] In some embodiments of the present application, the decorative member 02 is raised relative to the back shell 12 of the main body 01 along the Z direction. In this way, the volume of the second cavity S2 is larger to accommodate the larger cooling fan 210 and the cooling fins 220 with better heat dissipation performance, thereby further improving the heat dissipation effect.

[0083] In some embodiments of the present application, the decorative member 02 may be provided with multiple through-holes 21 to form air inlets and outlets. This effectively increases the air inlet and outlet area, thereby enhancing the heat dissipation effect of the heat dissipation device 200. Comparing the air inlet and outlet arrangement schemes of the mobile phone 1 provided in this application and the mobile phone 1a in the example shown in FIG1 above, the mobile phone 1a has a single through-hole 310a as the air inlet and outlet, both of which are located on one side, resulting in a small air inlet and outlet area and poor heat dissipation effect. In contrast, the multiple through-holes 21 of the mobile phone 1 in this application can form air inlets and outlets with larger areas, resulting in better heat dissipation effect.

[0084] In some implementations, the plurality of through holes 21 are disposed around the outer circumference of the decorative member 02. Alternatively, in other alternative implementations, the plurality of through holes 21 may be disposed elsewhere on the decorative member 02, for example, on the end surface of the decorative member 02. This application does not impose any limitation thereto, as long as the air inlet and outlet requirements of the heat dissipation device 200 are met.

[0085] After introducing the exemplary structure of the first cavity S1 and the second cavity S2 of the mobile phone 1, the specific implementation method of sealing and waterproofing between the various components used to enclose the cavity S0, the first cavity S1 and the second cavity S2 in the mobile phone 1 is described below with reference to the accompanying drawings.

[0086] FIG7 shows a partial enlarged view of the mobile phone 1 at the M1 area in FIG5A in an embodiment of the present application. Referring to FIG7 , in the main body 01, the screen 11 and the frame 13b of the middle frame 13 are sealed together by waterproof glue 310. The back shell 12 and the frame 13b of the middle frame 13 are sealed together by waterproof glue 310. The through hole 131 on the temperature equalizer 14 and the supporting plate 13a of the middle frame 13 is sealed together by waterproof glue 320. The decorative part 02 is sealed together with the back shell 12 of the main body 01 by waterproof glue 320, thereby forming a cavity S0 together with the main body 01.

[0087] In some embodiments of the present application, the main body 01 and the decorative element 02 may be sealed by an arcuate wall. It can also be understood that the joint between the main body 01 and the decorative element 02 is provided with a rounded corner.

[0088] Specifically, Figures 8A and 8B illustrate the sealed connection between the decorative element 02 and the main body 01 in an embodiment of the present application. Figure 8A is an enlarged partial view of the mobile phone 1 at the M2 region in Figure 7, and Figure 8B is an exploded view of the main body 01 and decorative element 02 in Figure 8A. Referring to Figures 8A and 8B, the through-hole 121 in the back shell 12 of the main body 01 includes a first curved wall 122. The first curved wall 122 is raised relative to the flat portion 123 of the back shell 12 in the Z direction, giving the portion of the back shell 12 near the through-hole 121 a crater-like shape. The decorative element 02 includes a second curved wall 22. For example, the curvature of the second curved wall 22 can be greater than that of the first curved wall 22. In other words, the radius of curvature of the second curved wall 22 is smaller than that of the first curved wall 122. The first arc-shaped wall 122 is disposed around the outer periphery of the second arc-shaped wall 22 and together with the second arc-shaped wall 22 form a waterproof adhesive receiving groove 330. The waterproof adhesive receiving groove 330 contains waterproof adhesive 320, thereby achieving a sealing and waterproofing effect.

[0089] Because waterproof adhesive receiving groove 330 is enclosed by first curved wall 122 and second curved wall 121, its cross-section is also curved, allowing it to accommodate more waterproof adhesive 320, thereby effectively improving the connection reliability between main body 01 and decorative element 02. Furthermore, first curved wall 122 and second curved wall 121 also create a smoother transition between main body 01 and decorative element 02, effectively enhancing the aesthetics and refinement of the joint between main body 01 and decorative element 02.

[0090] In some embodiments of the present application, the decorative member 02 further includes a glue retaining wall 23 connected to the second curved wall 22. The glue retaining wall 23 is aligned with the first curved wall 122 to prevent the waterproof glue 320 from leaking from the waterproof glue receiving groove 330. The hardness of the material of the glue retaining wall 23 is less than that of the material of the second curved wall 22.

[0091] Since the hardness of the material of the glue retaining wall 23 is relatively small, during the process of maintaining pressure after the back shell 12 and the decorative part 02 are glued together with the waterproof glue 320, the glue retaining wall 23 can produce slight deformation to release stress, thereby effectively avoiding the problem of the back shell 12 being broken due to the concentrated force exerted by the decorative part 02 on the back shell 12, further reducing the difficulty of assembly.

[0092] In some embodiments of the present application, the second curved wall 22 and the adhesive retaining wall 23 can be made of nano-molding technology (NMT) materials. That is, the second curved wall 22 and the adhesive retaining wall 23 can be integrally formed using the nano-molding process, which is relatively easy to form and provides improved overall connection reliability in the finished product. For example, the second curved wall 22 can be made of metal, and the adhesive retaining wall 23 can be made of plastic. Nano-molding technology is a method that combines metal and plastic using nanotechnology. After the metal surface is nano-processed, plastic is directly injection-molded onto the metal surface, allowing the metal and plastic to be integrally formed.

[0093] In some embodiments of the present application, the waterproof glue 310 and the waterproof glue 320 can be different types of glue to achieve better waterproofing effects for different types of structures. For example, the joint surfaces between the frame 13b of the middle frame 13 and the screen 11 and the back shell 12 are mostly large planes, so the waterproof glue 310 can be a solid waterproof backing glue. However, the joint gap between the through hole 131 on the supporting plate 13a of the middle frame 13 and the temperature plate 14 is small, and the joint gap between the decorative part 02 and the back shell 12 is an arc-shaped gap. Therefore, the waterproof glue 320 can be a waterproof hot melt adhesive. Waterproof hot melt adhesive can more fully fill such irregular (e.g., arc-shaped) and narrow gaps, thereby effectively ensuring waterproof reliability.

[0094] In some embodiments of the present application, the two ends of the air duct housing 02 can be sealed with the supporting plate 13a of the middle frame 13 of the main body 01 and the decorative part 02 through waterproof glue 320, thereby separating the cavity S0 into a first cavity S1 and a second cavity S2.

[0095] Continuing to refer to Figure 8A and in combination with Figure 7, in some embodiments of the present application, the joint surface between the first end 31 of the air duct housing 03 and the decorative part 02 is roughly flat, and the waterproof glue 320 is arranged between the first end 31 and the decorative part 02 to glue the air duct housing 03 and the decorative part 02 together, thereby achieving a sealed connection between the air duct housing 03 and the decorative part 02.

[0096] Figures 9A and 9B illustrate schematic diagrams of the sealed connection between the air duct housing 03 and the main body 01 in embodiments of the present application. Figure 9A is a partially enlarged view of the mobile phone 1 at the M3 region in Figure 7 , and Figure 9B is an exploded view of the main body 01 and air duct housing 03 in the mobile phone 1 in Figure 9A . Referring to Figures 9A and 9B , in some embodiments of the present application, the air duct housing 03 is sealedly connected to the main body 01 via a slot.

[0097] Specifically, a slot 132 is provided on the supporting plate 13a of the middle frame 13. The slot 132 surrounds the outer periphery of the through hole 131 on the middle frame 13 and opens toward the air duct housing 03. The slot 132 is adapted to the second end 32 of the air duct housing 03. For example, the orthographic projection of the second end 32 of the air duct housing 03 on a plane perpendicular to the Z direction (i.e., the XY plane, such as shown in the second plane F2 in Figures 9A and 9B) is a rectangular ring. The orthographic projection of the slot 132 in the second plane F2 can also be a rectangular ring, and the slot width D1 of the slot 132 is slightly larger than the wall thickness D2 of the second end 32 of the air duct housing 03.

[0098] The second end portion 32 of the air duct housing 03 is inserted into the slot 132 and together with the slot 132 form a waterproof glue receiving groove 340. The waterproof glue receiving groove 340 contains waterproof glue 320, thereby achieving a sealing and waterproofing effect.

[0099] It will be appreciated that the slot 132 and the second end 32 of the air duct housing 03 have a clearance fit. Therefore, the assembly precision (or positioning accuracy) between the slot 132 and the second end 32 of the air duct housing 03 is not required to be high, making assembly easier. Furthermore, the slot 132 effectively prevents the waterproof adhesive 320 from leaking from the waterproof adhesive receiving groove 340 to the screen side, providing a reliable seal.

[0100] In some embodiments of the present application, a guide portion 133 is further provided on the slot 132 for guiding the second end portion 32 of the air duct housing 03 to be inserted into the slot 132 to reduce the difficulty of assembly.

[0101] Specifically, the guide portion 133 is connected to the slot 132, and the width of the guide portion 133 gradually increases in the direction away from the slot 132, so that the whole is similar to a trumpet shape. Alternatively, it can also be understood that the opening of the slot 132 is provided with a chamfer (for example, a bevel or a rounded corner). In this way, during the assembly of the air duct housing 03 and the middle frame 13, the second end 32 of the air duct housing 03 can be more easily inserted into the guide portion 133, and then inserted into the slot 132 through the guide portion 133, making the assembly of the air duct housing 03 and the middle frame 13 relatively easy.

[0102] In some embodiments of the present application, the mobile phone 1 further includes a connecting circuit board for connecting the heat sink 200 to the battery inside the mobile phone 1. In this way, the battery inside the mobile phone 1 can power the heat sink 200, and the heat sink 200 does not need to be connected to another power source outside the mobile phone 1 before dissipating heat. This makes it simple and convenient to use and has a wide range of applications.

[0103] Specifically, Figure 10A shows a cross-sectional view of the mobile phone 1 according to an embodiment of the present application, taken along line BB in Figure 3A. Figure 10B shows a cross-sectional view of the mobile phone 1 according to an embodiment of the present application, taken along line CC in Figure 10A. Referring to Figures 10A and 10B, a battery 300 is provided in the first cavity S1. The battery 300 can power the electronic components (e.g., the motherboard 100) in the mobile phone 1, ensuring proper operation of the mobile phone 1. A through hole 33 (as an example of a third through hole) is provided in the air duct housing 03. A connecting circuit board 400 extends from the first cavity S1 to the second cavity S2 via the through hole 33. Furthermore, one end of the connecting circuit board 400 is electrically connected to the battery 300 in the first cavity S1, and the other end is electrically connected (e.g., spot welded) to battery contacts within the cooling fan 210 in the second cavity S2. In this way, the battery 300 can transmit electrical energy to the cooling fan 210 via the connecting circuit board 400, ensuring that the cooling fan 210 can operate normally to dissipate heat.

[0104] [Corrected 25.10.2024 in accordance with Rule 91] Furthermore, the sealed connection between the connecting circuit board 400 and the through hole 33 ensures that the first cavity S1 and the second cavity S2 are not interconnected, thereby ensuring the waterproof reliability of the mobile phone 1. For example, as shown in Figures 10A and 10B, the gap between the connecting circuit board 400 and the through hole 33 is filled with waterproof glue 320 to achieve a waterproof seal.

[0105] The size of the through hole 33 can be set as small as possible, as long as it can allow the connection circuit board 400 to pass through. In this way, the waterproof space that needs to be sealed can be made smaller, thereby further improving the waterproof effect.

[0106] Comparing the configuration of the heat dissipation device 200b in the mobile phone 1 provided in this application with that in the mobile phone 1b shown in FIG2 , the heat dissipation device 200b in the mobile phone 1b is independently disposed on the outside of the mobile phone 1b and requires an external power supply for heat dissipation, which is inconvenient to use and has a limited scope of application. In contrast, in this application, the heat dissipation device 200 is integrated into the mobile phone 1 and is powered by the mobile phone 1's own battery 300, eliminating the need for an external power supply. This makes it simpler and more convenient to use and better suited for various application scenarios.

[0107] In some embodiments of the present application, the working state of the cooling fan 210 can also be controlled by the mainboard 100 (for example, starting and stopping the cooling fan 210 or adjusting the wind speed of the cooling fan 210, etc.). Continuing to compare the setting scheme of the heat dissipation device 200b in the mobile phone 1 provided in this application and the mobile phone 1b in the example shown in Figure 2 above, the mobile phone 1b cannot directly control the start and stop of the cooling fan 210b through its internal mainboard 100b. The use flexibility of the cooling device 200b is poor and the scope of application is limited. In the present application, the cooling device 200 is integrated into the interior of the mobile phone 1, and different signals can be sent to the battery 300 through the mainboard 100 to control the working state of the cooling fan 210, thereby enabling the cooling device 200 to better meet the heat dissipation requirements in different application scenarios. For example, the mainboard 100 can send a signal to the battery 300 to indicate that the cooling fan 210 is started. After receiving the signal, the battery 300 supplies power to the cooling fan 210, causing the cooling fan 210 to start working. For another example, the motherboard 100 may send a signal to the battery 300 instructing the cooling fan 210 to stop. After receiving the signal, the battery 300 stops supplying power to the cooling fan 210, causing the cooling fan 210 to stop operating. For another example, the motherboard 100 may send a signal to the battery 300 instructing the cooling fan 210 to adjust its speed, thereby increasing or decreasing the current supplied by the battery 300 to the cooling fan 210, thereby controlling the cooling fan 210 to increase or decrease its speed.

[0108] In some embodiments of the present application, the connection circuit board 400 may be a flexible printed circuit (FPC). A flexible printed circuit is typically made of polyimide or polyester film and has the characteristics of being able to bend, fold, and twist freely, so as to more fully utilize the internal space of the mobile phone 1 for wiring.

[0109] It will be understood that in the above embodiment, the back shell 12 and middle frame 13 of the main body 01, and the cylindrical air duct housing 03 together form the first cavity S1. The heat dissipation plate 14 of the main body 01, the decorative member 02, and the cylindrical air duct housing 03 together form the second cavity S2. This is merely an example, and the present application is not limited thereto. In other embodiments, the first cavity S1 can also be formed by other components of the main body 01 and the cylindrical air duct housing 03. Similarly, the second cavity S2 can also be formed by other components of the main body 01, the decorative member 02, and the cylindrical air duct housing 03.

[0110] For example, in some alternative embodiments, a through hole is provided on the support plate 13a of the middle frame 13 at a position corresponding to the mainboard 100, so that the heat spreader 14 can be attached to the mainboard 100. In this way, the back shell 12 of the main body 01, the middle frame 13, the heat spreader 14, and the air duct housing 03 form a first cavity S1. The heat generated by the mainboard 100 in the first cavity S1 can be directly transferred to the heat spreader 14. The heat spreader 14 then transfers the heat to the heat dissipation fins 220, thereby facilitating the heat dissipation of the mainboard 100 by the heat dissipation device 200.

[0111] For another example, in some other alternative embodiments, the support plate 13a of the middle frame 13 may not be provided with the through hole 131. That is to say, the temperature equalizing plate 14 and the heat dissipating fins 220 are separated by the support plate 13a. In this way, the middle frame 13 of the main body 01, the decorative part 02 and the air duct housing 03 form a second cavity S2. The heat dissipating fins 220 located in the second cavity S2 absorb the heat from the temperature equalizing plate 14 through the middle frame 13, or directly absorb the heat generated by the main board 100 through the middle frame 13, and then dissipate the heat to the outside of the mobile phone 1. In this way, one sealing path can be reduced: the sealing path between the temperature equalizing plate 14 and the support plate 13a of the middle frame 13, thereby further improving the waterproof sealing effect.

[0112] 11A and 11B show another exemplary structure of the first cavity S1 and the second cavity S2 in the mobile phone 1 ' in an embodiment of the present application, wherein FIG11A is a cross-sectional view of the mobile phone 1 ', and FIG11B is an exploded view of the mobile phone 1 ', wherein the heat dissipation device 200 is not shown.

[0113] Compared with the mobile phone 1 shown in Figures 5A and 5B, the difference between the mobile phone 1' shown in Figures 11A and 11B is that the structure of the air duct housing 03 is different, which results in a different way of enclosing the second cavity S2 and a different number of sealing paths, which is described in detail below with reference to the accompanying drawings.

[0114] Referring to Figures 11A and 11B , the air duct housing 03 has a groove-like structure. Specifically, the first end 31 of the air duct housing 03 includes an open opening 34, and the second end 32 forms a groove bottom wall. The opening 34 faces the decorative element 02 and is sealed therewith. The main body 01 and the air duct housing 03 together form a first cavity S1. The decorative element 02 and the air duct housing 03 together form a second cavity S2.

[0115] Since the air duct housing 03 is a groove-shaped structure, the air duct housing 03 only needs the opening 34 to be sealed with the decorative part 02 to form a sealed second cavity S2, without the need for a sealed connection with the supporting plate 13a of the middle frame 13. Secondly, in the main body 01, only the screen 11 and the frame 13b of the middle frame 13, and the back shell 12 and the frame 13b of the middle frame 13 need to be sealed to form a sealed first cavity S1 together with the air duct housing 13. The temperature equalizer 14 inside it does not need to be sealed with the supporting plate 13a of the middle frame 13. That is, the mobile phone 1' can reduce two sealing paths: the sealing path between the temperature equalizer 14 and the supporting plate 13a of the middle frame 13, and the sealing path between the air duct housing 03 and the supporting plate 13a of the middle frame 13, thereby further improving the waterproof sealing effect.

[0116] Several exemplary implementations of forming the first cavity S1 are introduced below.

[0117] Continuing with Figures 11A and 11B , in some implementations, the support plate 13a of the middle frame 13 is not provided with a through hole. In other words, when viewed from the direction of the back shell 12 toward the middle frame 13, the heat spreader 14 is completely obscured by the middle frame 13. Thus, the back shell 12, middle frame 13, and air duct housing 03 of the main body 01 collectively form a first cavity S1.

[0118] At this point, the heat generated by the motherboard 100 in the first cavity S1 can be transferred to the air duct housing 03 via the middle frame 13. The air duct housing 03 then transfers the heat to the heat sink fins 220 in the second cavity S2. The heat sink fan 210 then dissipates the heat from the heat sink fins 220 to the exterior of the phone 1, allowing the heat sink 200 to dissipate heat from the motherboard 100. Simultaneously, the heat generated by the motherboard 100 can also be transferred to the vapor chamber 14 via the middle frame 13. The vapor chamber 14 diffuses the concentrated heat, eliminating hot spots and balancing the temperature, thus facilitating heat dissipation.

[0119] In some other implementations, the support plate 13a of the middle frame 13 is provided with a through hole. The heat spreader 14 can be exposed through the through hole to facilitate heat conduction. Thus, the screen 11, back shell 12, middle frame 13, and air duct housing 03 of the main body 01 together form a first cavity S1.

[0120] For example, a through hole can be formed on the supporting plate 13a of the middle frame 13 at a position corresponding to the mainboard 100, so that the heat spreader 14 can fit closely with the mainboard 100. In this case, the heat generated by the mainboard 100 in the first cavity S1 can be diffused through the heat spreader 14, achieving better heat dissipation.

[0121] For another example, a through hole may be provided on the support plate 13a of the middle frame 13 at a position corresponding to the bottom of the air duct housing 03, so that the heat spreader 14 can fit snugly against the air duct housing 03. In this case, the heat dissipation fins 220 in the second cavity S2 can absorb heat from the heat spreader 14 through the air duct housing 03 and then dissipate the heat to the outside of the mobile phone 1'.

[0122] The above describes the implementation methods of the present application by means of specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation methods. On the contrary, the purpose of introducing the application in conjunction with the implementation methods is to cover other options or modifications that may be extended based on the claims of the present application. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details are omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other unless there is a conflict.

[0123] In the description of this application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "outside", "inside", "circumferential", "radial", "axial", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0124] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "dispose," "install," "connect," and "fit" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0125] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. An electronic device, characterized in that: It comprises a main body and a decorative piece arranged on the main body, wherein: The main body and the decorative member together form a cavity, an air duct housing is provided in the cavity, and the air duct housing divides the cavity into a first cavity and a second cavity that are not connected to each other, the first cavity is a sealed cavity, the decorative member is used to form the second cavity, and the decorative member is provided with an air inlet and an air outlet that connect the second cavity and the outside of the electronic device; An orthographic projection of the first cavity on a first plane at least partially overlaps with an orthographic projection of the second cavity on the first plane, and the first plane is parallel to a thickness direction of the electronic device; A heat dissipation device is provided in the second cavity, and the heat dissipation device is used to dissipate heat from the heat source in the first cavity.

2. The electronic device according to claim 1, wherein The decorative piece is a camera back cover.

3. The electronic device according to claim 1, wherein The air duct housing is a cylindrical structure, including a first end and a second end, the first end and the second end are both open, the first end is sealed to the decorative component, and the second end is sealed to the main body.

4. The electronic device according to claim 3, wherein: The main body includes a back shell and a middle frame, and the middle frame includes a supporting plate and a frame body arranged around the supporting plate; The back shell cover is arranged on the frame body and is sealed with the frame body. A first through hole is opened on the back shell. The decorative member cover is arranged on the first through hole and is sealed with the first through hole. The first end of the air duct housing is sealed to the decorative component, and the second end is sealed to the supporting plate.

5. The electronic device according to claim 4, characterized in that The hole wall of the first through hole includes a first arc-shaped wall, and the decorative component includes a second arc-shaped wall. The first arc-shaped wall is arranged around the outer periphery of the second arc-shaped wall and together with the second arc-shaped wall forms a waterproof glue receiving groove.

6. The electronic device according to claim 5, characterized in that The decorative component further includes a glue retaining wall connected to the second curved wall, and the glue retaining wall is in contact with the first curved wall.

7. The electronic device according to claim 6, wherein: The hardness of the material of the glue retaining wall is less than the hardness of the material of the second arc-shaped wall.

8. The electronic device according to claim 6, wherein: The material of the glue retaining wall and the second curved wall is nano injection molding material.

9. The electronic device according to claim 4, wherein: The main body also includes a temperature averaging plate. A second through hole communicating with the second cavity is provided on the supporting plate of the middle frame. The temperature averaging plate is located on the side of the supporting plate facing away from the back shell, and covers the second through hole and is sealed with the second through hole.

10. The electronic device according to claim 4, wherein: The supporting plate is provided with a slot adapted to the second end of the air duct housing. The second end of the air duct housing is inserted into the slot and together with the slot forms a waterproof glue receiving groove.

11. The electronic device according to claim 10, wherein: The opening of the slot is provided with a chamfer.

12. The electronic device according to claim 4, wherein: The decorative element protrudes relative to the back shell along the thickness direction of the electronic device.

13. The electronic device according to claim 1, wherein The air duct housing is a groove-shaped structure, including a first end and a second end. The first end is a groove opening facing the decorative element and sealed with the decorative element, and the second end is a groove bottom wall facing the main body.

14. The electronic device according to claim 1, wherein The electronic device further includes a battery and a connecting circuit board, wherein the battery is disposed in the first cavity, and the connecting circuit board is used to electrically connect the heat dissipation device and the battery.

15. The electronic device according to claim 14, characterized in that The air duct housing is provided with a third through hole, the connecting circuit board extends from the first cavity to the second cavity via the third through hole, and the third through hole is sealedly connected to the connecting circuit board.

16. The electronic device according to claim 1, wherein The first cavity is provided with a mainboard, and the mainboard can control the working state of the heat dissipation device.

17. The electronic device according to claim 1, wherein: The heat dissipation device includes a heat dissipation fan.

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