I / O connector device with convention current path

Abstract

An input / output (I / O) connector for improved thermal performance is described. The I / O connector includes a backshell having connector electronics housed therein. The backshell has a proximal end and a distal end. The backshell comprises at least one air inlet positioned at the proximal end that creates a convection current path between the proximal end and an opening on the distal end of the backshell. A heat spreader is coupled to a heat generating element positioned within the backshell. A thermal interface material is coupled to the heat spreader. One or both of the heat spreader and the thermal interface material are positioned within the convection current path.

Description

I / O CONNECTOR DEVICE WITH CONVENTION CURRENT PATHBACKGROUND

[0001] Thermal problems with input / output (I / O) connectors can arise in various electronic and electrical systems. I / O connectors are used to establish electrical and data connections between different components in a system. These connectors can be susceptible to thermal-related issues that can affect performance of the system which can be caused due to overheating, thermal expansion and contraction, mismatched thermal expansion, insulation breakdown, increased contact resistance, corrosion, and so forth. In some instances, it can be desirable to provide thermal management components to maintain ideal operating temperatures.SUMMARY

[0002] Various embodiments are disclosed for an input / output connector having a convection current path, also referred to as a thermal flow region. According to a first aspect, an input / output connector is described, comprising: a backshell having various connector electronics housed therein, the backshell comprising a proximal end and a distal end. A top surface of the backshell comprises a first plurality of air inlets positioned at the proximal end, and a bottom surface of the backshell comprises a second plurality of air inlets positioned at the proximal end. The first and second plurality of air inlets together form or otherwise create a convection current path between the proximal end and an opening on the distal end of the backshell. A heat spreader is coupled to a heat generating element positioned within the backshell. A thermal interface material is coupled to the heat spreader. At least one of the heat spreader and the thermal interface material are positioned within the convection current path.

[0003] The heat generating element comprises processing circuitry positioned within the backshell of the input / output connector. The heat spreader is a first heat spreader, and the heat generating element is a first heat generating element. The input / output connector further comprises a second heat spreader coupled to a second heat generating element positioned within the backshell. The thermal interface material is a first thermal interface materialportion positioned on the first heat spreader. The input / output connector comprises a second thermal interface material portion positioned on the second heat spreader.

[0004] The first thermal interface material portion is positioned on the first heat spreader proximal to a first side of the backshell. The second thermal interface material portion is positioned on the second heat spreader proximal to a second side of the backshell opposite that of the first side. The input / output connector further comprises an air dam coupled to the first heat spreader and the second heat spreader that is configured to channel external air through the convection current path.

[0005] The input / output connector further comprises thermally conductive grease positioned between the first heat spreader and the first thermal interface material portion, and between the second heat spreader and the second thermal interface material portion. The heat spreader comprises a heat spreader body having a plurality of apertures extending through the heat spreader body. The heat spreader body is formed of a thermally conductive material. The backshell is formed of a thermally conductive material.

[0006] According to a second aspect, an input / output connector is described, comprising: a backshell having connector electronics housed therein, the backshell comprising a proximal end and a distal end, wherein the backshell comprises at least one air inlet positioned at the proximal end that defines a convection current path between the proximal end and an opening on the distal end of the backshell; a heat spreader coupled to a heat generating element positioned within the backshell; and a thermal interface material coupled to the heat spreader. At least one of the heat spreader and the thermal interface material are positioned within the convection current path.

[0007] The air inlet is one a plurality of air inlets, a first subset of the plurality of air inlets positioned in a top surface of the backshell and a second subset of the plurality of air inlets positioned on a bottom surface of the backshell. The heat generating element is a microchip of the connector electronics positioned within the backshell of the input / output connector.

[0008] The heat spreader is a first heat spreader, and the heat generating element is a first heat generating element; and the input / output connector further comprises a second heat spreader coupled to a second heat generating element positioned within the backshell. The thermal interface material is a first thermal interface material portion positioned on the firstheat spreader; and the input / output connector comprises a second thermal interface material portion positioned on the second heat spreader.

[0009] The first thermal interface material portion is positioned on the first heat spreader proximal to a first side of the backshell; and the second thermal interface material portion is positioned on the second heat spreader proximal to a second side of the backshell opposite that of the first side. The input / output connector further comprises an air dam coupled to the first heat spreader and the second heat spreader that is configured to channel external air through the convection current path. The input / output connector further comprises thermally conductive grease positioned between the first heat spreader and the first thermal interface material portion, and between the second heat spreader and the second thermal interface material portion.

[0010] The heat spreader comprises a heat spreader body having a plurality of apertures extending through the heat spreader body, the heat spreader body being formed of a thermally conductive material. The backshell is formed of a thermally conductive material. In some aspects, the heat spreader is a first heat spreader positioned on a first microchip located on a top surface of a substrate of the input / output connector; and the input / output connector comprises a second heat spreader positioned on a second microchip located on a button surface of the input / output connector. A first thermal interface material portion is positioned on the second heat spreader proximal to a first side of the backshell, and a second thermal interface material portion is positioned on the second heat spreader proximal to a second side of the backshell opposite that of the first side.

[0011] In a third aspect, a method, is described comprising: providing an input / output (I / O) connector, the I / O connector comprising a backshell having connector electronics housed therein, the backshell comprising a proximal end and a distal end, wherein a top surface of the backshell comprises a first plurality of air inlets positioned at the proximal end, and a bottom surface of the backshell comprises a second plurality of air inlets positioned at the proximal end, the first and second plurality of air inlets together forming a convection current path between the proximal end and an opening on the distal end of the backshell; coupling a heat spreader to a heat generating element positioned within the backshell; coupling a thermal interface material to the heat spreader, wherein at least one of the heatspreader and the thermal interface material are positioned within the convection current path; and positioning the I / O connector in an I / O connector receptacle.BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, with emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

[0013] FIG. 1 is a top perspective view of an input / output connector in accordance with various embodiments of the present disclosure.

[0014] FIG. 2 is a bottom perspective view of the input / output connector of FIG. 1 in accordance with various embodiments of the present disclosure.

[0015] FIG. 3 is a top perspective view of the input / output connector of FIG. 1 with its backshell being partially transparent in accordance with various embodiments of the present disclosure.

[0016] FIG. 4 is a bottom perspective view of the input / output connector of FIG. 1 with its backshell being partially transparent in accordance with various embodiments of the present disclosure.

[0017] FIG. 5 is a top view of the input / output connector of FIG. 1 with its backshell omitted in accordance with various embodiments of the present disclosure.

[0018] FIG. 6 is a top perspective view of the input / output connector of FIG. 1 with its backshell omitted in accordance with various embodiments of the present disclosure.

[0019] FIG. 7 is a top perspective view of the input / output connector of FIG. 1 with its backshell and bottom insert omitted in accordance with various embodiments of the present disclosure.

[0020] FIG. 8 is another enlarged perspective view of the input / output connector of FIG. 1 in accordance with various embodiments of the present disclosure.DETAILED DESCRIPTION

[0021] The present disclosure relates to an input / output connector having a convection current path, also referred to as a thermal flow region, in accordance with various embodiments. Input / output (I / O) connectors, such as small form-factor pluggable (SFP) connectors, quad small form-factor pluggable (QSFP) connectors, and like connectors, are generally available with a variety of transmitter and receiver types. In an effort to reduce size and increase performance (e.g., data transfer speeds), an increasing amount of processing circuitry is disposed within the connector, which can generate heat. Such connectors can be susceptible to thermal-related issues that can affect performance of a system in which the connectors are employed, which can be caused due to overheating, thermal expansion and contraction, mismatched thermal expansion, insulation breakdown, increased contact resistance, corrosion, and so forth.

[0022] Thus, it can be desirable to provide thermal management components to maintain ideal operating temperatures. In the related art, to conduct heat out of an I / O connector, microchips or other circuitry positioned within an I / O connector merely conduct heat through a thermal interface material to a backshell surface. Such solutions do not dissipate heat in an effective manner, and performance of such connectors is thereby affected due to overheating or limited use cases.

[0023] Accordingly, various embodiments for an I / O connector for improved heat dissipation are described. Generally, the I / O connector can include a backshell having connector electronics housed therein. The backshell can include a proximal end and a distal end. At least one of a top surface of the backshell can include air inlets positioned at the proximal end, and a bottom surface of the backshell can include air inlets positioned at the proximal end. The air inlets together form or create a convection current path between the proximal end and an opening on the distal end of the backshell.

[0024] In further embodiments, a heat spreader can be coupled to a heat generating element positioned within the backshell. A thermal interface material can be coupled to the heat spreader. At least one of the heat spreader and the thermal interface material can be positioned within the convection current path, providing improved thermal performance as compared to connectors in the related art.

[0025] Turning now to the drawings, FIGS. 1 and 2 show a top perspective view and a bottom perspective view of an input / output connector 100, respectively, in accordance with various embodiments of the present disclosure. The I / O connector 100 generally includes a cable 103, a backshell 106, a latching mechanism 109, as well as other components not shown or described, as can be appreciated. The example drawings shown herein relate to a quad small form factor pluggable double density (QSFP-DD) connector; however, it is understood that the embodiments described herein can be applied to other types of connectors without deviating from the scope of the present disclosure. In some implementations, the QSFP-DD type of VO connector 100 can be backwards compatible with QSFP receptacles.

[0026] The backshell 106 can retain and enclose internal components of the I / O connector 100 and, in some implementations, can provide the physical structure for the VO connector 100. In some embodiments, the backshell 106 is formed of a conductive material, such as aluminum, copper, or other suitable conductive material, capable of providing structural support and electromagnetic interference (EMI) shielding. The latching mechanism 109 can include a release latch 112 that is configured to release the latching mechanism 109, which is provided to secure the VO connector 100 within to a port (not shown) and prevent disconnection therebetween. The release latch 112 can be pulled or otherwise manipulated to release the latching mechanism 109 of the I / O connector 100 from the port without damage occurring to either the I / O connector 100 or the port.

[0027] The I / O connector 100 can further include one or more substrates wholly or partially disposed within the I / O connector 100. For instance, as shown in FIG. 1, the VO connector 100 includes a substrate cantilevered with respect to the backshell 106. The substrate can include a printed circuit board (PCB), for example, among other types of substrates. The substrate can have connector electronics disposed thereon that provide pathways for signal transmission.

[0028] The backshell 106 can include a first end and a second end or, more specifically, a proximal end 115 and a distal end 118. The proximal end 115 can include the portion of the backshell 106 that is coupled to the cable 103, whereas the distal end 118 can be the portion of the backshell 106 opposite the proximal end 115 and / or the portion that is partially or fully inserted into a port. In some implementations, the backshell 106 can include a top surface 121 having one or more air inlets 124 and / or a bottom surface 127 having one or more airinlets 124. In other words, in some implementations, only the top surface 121 has one or more air inlets 124. In other implementations, only the bottom surface 127 has one or more air inlets 124. In other implementations, as shown in FIGS. 1 and 2, both the top surface 121 and the bottom surface 127 have one or more air inlets 124. While FIGS. 1 and 2 show five air inlets 124 on each of the top surface 121 and the bottom surface 127, it is understood that other numbers of air inlets 124 can be employed.

[0029] The air inlets 124 together create or otherwise form a convection current path Pi between the proximal end 115 and the distal end 118 or, more specifically, between the proximal end 115 and an opening 130 on the distal end 118 of the backshell 106. As such, external air can enter the air inlets 124, travel from the proximal end 115 to the distal end 118, and exit the opening 130 or other aperture at the distal end 118 of the backshell 106. In place of or in combination with the foregoing, external air can enter the opening 130 or other aperture, travel from the distal end 118 to the proximal end 115, and exit the air inlets 124 or other aperture at the proximal end 115 of the backshell 106. It is understood that heat is absorbed or carried away by the external air (which is at a temperature less than heat retained in the backshell 106), and the external air as heated is dispelled from the opening 130, thereby providing cooling to the I / O connector 100 and the components therein.

[0030] FIGS. 3 and 4 show top and bottom perspective views of the I / O connector 100 of FIGS. 1 and 2, respectively. Specifically, in FIGS. 3 and 4, the backshell 106 is shown partially transparent, thereby permitting view of the internal components housed within the backshell 106. The VO connector 100 includes a substrate 133 having connector electronics disposed thereon or within the substrate 133. The substrate 133 can include a PCB, for example, and an insertion end of the PCB can include conductive pads that make electrical contact with corresponding terminals of a connector within an I / O port (not shown). The connector electronics of the substrate 133, or other connector electronics disposed within the backshell 106, can perform various signal modifications, such as amplification, multiplexing, conversion, and so forth. It is understood that such connector electronics generate heat which can impair performance of the I / O connector 100.

[0031] Thus, thermal management is an important consideration in high-speed connectors, such as SFP connectors. In some embodiments, the I / O connector 100 can include one or more heat spreaders 136, air dams 139, and regions of thermal interface material (TIM)142. The heat spreaders 136 can be coupled to heat generating elements positioned within the backshell 106. The heat generating element can include microchips or processing circuits (e.g., application-specific-integrated-circuits or ASICs), for example, or other elements having a surface area less than the heat spreader 136. The heat spreaders 136 can include a conventional heat sink in some implementations and thus can be formed of a thermally conductive material, such as aluminum, copper, brass, bronze, other conductive materials, or combinations thereof. Further, in some examples, one or more of the heat spreaders 136 can include one or more air passageways extending from one side of the heat spreader 136 to the other that permits air flow therethrough, providing cooling to the heat spreader 136.

[0032] The air dam 139 can include a projection within the backshell 106 that directs air. For instance, one or more air dams 139 can be positioned such that the air dams 139 channel external air through the convection current path. As external air travels through the convection current path Pi, heat accumulated and retained in the backshell 106 is routed by the air dam 139 and pushed out through the opening 130 at the distal end 118 of the I / O connector 100. The air dam 139 can include a projection positioned between, for example, a first heat spreader 136a and a second heat spreader 136b, depending on the particular configuration and arrangement of connector electronics. The air dam 139 can direct air into at least two different directions in some instances.

[0033] In some embodiments, the air dam 139 is formed of a thermally conductive material and can be thermally coupled to at least one of the first heat spreader 136a and the second heat spreader 136b. Thus, heat accumulated by the first heat spreader 136a and the second heat spreader 136b can be routed to the air dam 139. As external air is directed into the backshell 106, the external air will come into contact with the air dam 139 and cool the air dam 139, as well as the other components of the I / O connector 100.

[0034] In some embodiments, the thermal interface material 142 can be coupled to the heat spreaders 136. The thermal interface material 142 can enhance the thermal conductivity and transfer of heat between two surfaces within the I / O connector 100, such as between a heat spreader 136 and a surface of the backshell 106, among other arrangements. Thus, the thermal interface material 142 can further improve the efficiency of heat dissipation in the VO connector 100 and prevent overheating. At least one of the heat spreader 136 and the thermal interface material 142 can positioned within the convection current path Pi.

[0035] As shown in FIG. 3, the heat spreader 136 is a first heat spreader 136a, and the heat generating element is a first heat generating element (e.g., a first microchip or a first portion of the processing circuitry). The I / O connector 100 can further include a second heat spreader 136b coupled to a second heat generating element positioned within the backshell 106 (e.g., a second microchip or a second portion of the processing circuitry).

[0036] Further, as shown in FIG. 3, the thermal interface material 142 can be a first thermal interface material portion 142a positioned on the first heat spreader 136a, and the VO connector 100 can further a second thermal interface material portion 142b positioned on the second heat spreader 136b. The first thermal interface material portion 142a can be positioned on the first heat spreader 136a proximal to a first side 145 of the backshell 106 and the second thermal interface material portion 142b can be positioned on the second heat spreader 136b proximal to a second side 148 of the backshell 106 opposite that of the first side 145. The air dam 139 is shown being coupled to the first heat spreader 136a and the second heat spreader 136b in an offset arrangement. In some embodiments, thermally conductive paste, grease, epoxy, or a related conductive material (not shown) can be positioned between the first heat spreader 136a and the first thermal interface material portion, and / or between the second heat spreader 136b and the second thermal interface material portion, as can be appreciated.

[0037] FIG. 4 shows a bottom perspective view of the I / O connector 100 of FIG. 1 with a bottom portion of the I / O connector 100 opposite the backshell 106 being partially transparent in accordance with various embodiments of the present disclosure. More specifically, FIG. 4 shows an embodiment in which a single heat spreader 136 is disposed across a large portion of the connector electronics positioned on a bottom surface of the substrate 133 of the I / O connector 100. A thermal material portion 142c is disposed on the heat spreader 136 proximate to the first side 145 of the backshell 106, whereas a thermal material portion 142d is disposed on the heat spreader 136 proximate to the second side 148 of the backshell 106. Further, the thermal material portion 142c is disposed on the heat spreader 136 on the proximal end 115 of the backshell 106, whereas the thermal material portion 142d is disposed on the heat spreader 136 at the distal end 118 of the backshell 106.

[0038] FIGS. 5 and 6 are top and perspective views, respectively, of the I / O connector 100 with the backshell 106 and an outer sheath of the cable 103 omitted from view for explanatory purposes in accordance with various embodiments of the present disclosure. Thesubstrate 133 is partially supported by an insert 151 that can be coupled to or nested in the backshell 106. In some embodiments, the insert 151 is a U-shaped insert that defines a channel in which the substrate 133 can be affixed or otherwise positioned. Conductors 154 of the cable 103 are shown being coupled to conductive pads or traces on the substrate 133. The substrate 133 can includes one or more microchips 157 or like components that are coupled to traces on the substrate 133.

[0039] The microchips 157 and like circuitry can generate significant heat during operation of the I / O connector 100. Thus, the I / O connector 100 can include a heat spreader 136 coupled to all or a portion of the microchips 157. The heat spreaders 136 can include heat sinks or like devices that are thermally conductive. As shown in FIG. 6, one or more of the heat spreaders 136 can include air passageways 160 extending from one side of the heat spreader 136 to the other that permits air flow therethrough, providing cooling to the heat spreader 136. While the heat spreaders 136 shown in FIGS. 5 and 6 are generally rectangular that are positioned perpendicular to a longitudinal axis of the insert 151, it is understood that other orientations and configurations of heat spreaders 136 can be employed.

[0040] As shown in FIGS. 5 and 6, a first thermal interface material portion 142a can be positioned on the first heat spreader 136a proximal to a first side 145 of the backshell 106 and a second thermal interface material portion 142b can be positioned on the second heat spreader 136b proximal to a second side 148 of the backshell 106 opposite that of the first side 145. An air dam 139 is shown being thermally connected to both the first heat spreader 136a and the second heat spreader 136b. In some embodiments, thermally conductive grease (not shown) can be positioned between the first heat spreader 136a and the first thermal interface material portion 142a, and / or between the second heat spreader 136b and the second thermal interface material portion 142b.

[0041] Turning now to FIGS. 7 and 8, a bottom perspective view of the VO connector 100 of FIGS. 5 and 6 are shown in FIG. 7 where the insert 151 is further omitted for explanatory purposes. FIG. 8 is a top perspective view of the I / O connector 100 with the insert 151, the backshell 106, and the substrate 133 omitted for explanatory purposes. Referring to FIGS. 7 and 8 collectively, the I / O connector 100 can further include a heat spreader 136 in place of or in addition to the heat spreaders 136 described above with respect to FIGS. 5 and 6. The heat spreader 136 shown in FIGS. 7 and 8 can be thermally coupled tomicrochips 157, traces, contacts, or other electrical components located on a bottom surface of the substrate 133. In the embodiment shown in FIG. 7, a single heat spreader 136 can be thermally coupled to multiple microchips 157.

[0042] Further, as shown in FIGS. 7 and 8, a first thermal interface material portion 142a can be positioned on the heat spreader 136 proximal to a first side 145 of the backshell 106 and a second thermal interface material portion 142b can be positioned on the heat spreader 136 proximal to a second side 148 of the backshell 106 opposite that of the first side 145. The first thermal interface material portion 142a and the second thermal interface material portion 142b are also located on opposing ends of the heat spreader 136. For instance, the first thermal interface material portion 142a can be located near the proximal end 115 of the backshell 106, whereas the second thermal interface material portion 142b can be located near the distal end 118 of the backshell 106.

[0043] The design and internal structure of specific connectors, such as the double density QSFP (QSFP-DD), can vary between embodiments. In general, QSFP-DD connectors are designed to support higher data rates and increased density compared to standard QSFP connectors, but are susceptible to more heat. The QSFP-DD connector can have a modular design with multiple PCBs in some implementations to accommodate the increased number of electrical lanes for higher data throughput. In this case, the I / O connector 100 can have a primary substrate 133 (e.g., primary PCB) inside the backshell 106, which serves as the foundation for mounting electronic components and provides pathways for signal transmission. However, the exact number of substrates 133 (e.g., PCBs) can depend on the specific design and features of the I / O connector 100. Different configurations can be employed to meet performance requirements and accommodate various functionalities such as electrical and optical interfaces, thermal management, and signal integrity.

[0044] The features, structures, or characteristics described above may be combined in one or more embodiments in any suitable manner, and the features discussed in the various embodiments may be interchangeable, if possible. In the following description, numerous specific details are provided in order to fully understand the embodiments of the present disclosure. However, a person skilled in the art will appreciate that the technical solution of the present disclosure may be practiced without one or more of the specific details, or other methods, components, materials, and the like may be employed. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the present disclosure.

[0045] Although the relative terms such as “on,” “below,” “upper,” and “lower” are used in the specification to describe the relative relationship of one component to another component, these terms are used in this specification for convenience only, for example, as a direction in an example shown in the drawings. It should be understood that if the device is turned upside down, the “upper” component described above will become a “lower” component. When a structure is “on” another structure, it is possible that the structure is integrally formed on another structure, or that the structure is “directly” disposed on another structure, or that the structure is “indirectly” disposed on the other structure through other structures.

[0046] In this specification, the terms such as “a,” “an,” “the,” and “said” are used to indicate the presence of one or more elements and components. The terms “comprise,” “include,” “have,” “contain,” and their variants are used to be open ended, and are meant to include additional elements, components, etc., in addition to the listed elements, components, etc. unless otherwise specified in the appended claims.

[0047] The terms “first,” “second,” etc. are used only as labels, rather than a limitation for a number of the objects. It is understood that if multiple components are shown, the components may be referred to as a “first” component, a “second” component, and so forth, to the extent applicable.

[0048] The above-described embodiments of the present disclosure are merely possible examples of implementations set forth for a clear understanding of the principles of the disclosure. Many variations and modifications may be made to the above-described embodiment(s) without departing substantially from the spirit and principles of the disclosure. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims.

Claims

CLAIMSTherefore, the following is claimed:

1. An input / output connector, comprising: a backshell having connector electronics housed therein, the backshell comprising a proximal end and a distal end, wherein a top surface of the backshell comprises at least one first air inlet positioned at the proximal end, and a bottom surface of the backshell comprises at least one second air inlet positioned at the proximal end, the at least one first and second air inlets together forming a convection current path between the proximal end and an opening on the distal end of the backshell; a heat spreader coupled to a heat generating element positioned within the backshell; and a thermal interface material coupled to the heat spreader, wherein at least one of the heat spreader and the thermal interface material are positioned within the convection current path.

2. The input / output connector according to claim 1, wherein the heat generating element comprises processing circuitry positioned within the backshell of the input / output connector.

3. The input / output connector according to claim 1, wherein: the heat spreader is a first heat spreader, and the heat generating element is a first heat generating element; and the input / output connector further comprises a second heat spreader coupled to a second heat generating element positioned within the backshell.

4. The input / output connector according to claim 3, wherein: the thermal interface material is a first thermal interface material portion positioned on the first heat spreader; and the input / output connector comprises a second thermal interface material portion positioned on the second heat spreader.

5. The input / output connector according to claim 4, wherein: the first thermal interface material portion is positioned on the first heat spreader proximal to a first side of the backshell; and the second thermal interface material portion is positioned on the second heat spreader proximal to a second side of the backshell opposite that of the first side.

6. The input / output connector according to claim 5, further comprising an air dam thermally coupled to the first heat spreader and the second heat spreader.

7. The input / output connector according to claim 5, further comprising thermally conductive grease positioned between the first heat spreader and the first thermal interface material portion, and between the second heat spreader and the second thermal interface material portion.

8. The input / output connector according to claim 1, wherein the heat spreader comprises a heat spreader body having at least one aperture extending through the heat spreader body, the heat spreader body being formed of a thermally conductive material.

9. The input / output connector according to claim 1, wherein the backshell is formed of a thermally conductive material.

10. An input / output connector, comprising: a backshell having connector electronics housed therein, the backshell comprising a proximal end and a distal end, wherein the backshell comprises at least one air inlet positioned at the proximal end that defines a convection current path between the proximal end and an opening on the distal end of the backshell; a heat spreader coupled to a heat generating element positioned within the backshell; anda thermal interface material coupled to the heat spreader, wherein at least one of the heat spreader and the thermal interface material are positioned within the convection current path.

11. The input / output connector according to claim 10, wherein the air inlet is one a plurality of air inlets, a first subset of the plurality of air inlets positioned in a top surface of the backshell and a second subset of the plurality of air inlets positioned on a bottom surface of the backshell.

12. The input / output connector according to claim 10, wherein the heat generating element is a microchip of the connector electronics positioned within the backshell of the input / output connector.

13. The input / output connector according to claim 10, wherein: the heat spreader is a first heat spreader, and the heat generating element is a first heat generating element; and the input / output connector further comprises a second heat spreader coupled to a second heat generating element positioned within the backshell.

14. The input / output connector according to claim 13, wherein: the thermal interface material is a first thermal interface material portion positioned on the first heat spreader; and the input / output connector comprises a second thermal interface material portion positioned on the second heat spreader.

15. The input / output connector according to claim 14, wherein: the first thermal interface material portion is positioned on the first heat spreader proximal to a first side of the backshell; and the second thermal interface material portion is positioned on the second heat spreader proximal to a second side of the backshell opposite that of the first side.

16. The input / output connector according to claim 15, further comprising an air dam coupled to the first heat spreader and the second heat spreader that is configured to channel external air through the convection current path.

17. The input / output connector according to claim 15, further comprising thermally conductive grease positioned between the first heat spreader and the first thermal interface material portion, and between the second heat spreader and the second thermal interface material portion.

18. The input / output connector according to claim 10, wherein the heat spreader comprises a heat spreader body having at least one aperture extending through the heat spreader body, the heat spreader body being formed of a thermally conductive material.

19. The input / output connector according to claim 10, wherein the backshell is formed of a thermally conductive material.

20. The input / output connector according to claim 10, wherein: the heat spreader is a first heat spreader positioned on a first microchip located on a top surface of a substrate of the input / output connector; and the input / output connector comprises a second heat spreader positioned on a second microchip located on a button surface of the input / output connector.

21. The input / output connector according to claim 20, wherein: a first thermal interface material portion is positioned on the second heat spreader proximal to a first side of the backshell; and a second thermal interface material portion is positioned on the second heat spreader proximal to a second side of the backshell opposite that of the first side.

22. A method, comprising: providing an input / output (I / O) connector, the I / O connector comprising a backshell having connector electronics housed therein, the backshell comprising a proximalend and a distal end, wherein a top surface of the backshell comprises at least one first air inlet positioned at the proximal end, and a bottom surface of the backshell comprises at least one second air inlet positioned at the proximal end, the at least one first and second air inlets together forming a convection current path between the proximal end and an opening on the distal end of the backshell; coupling a heat spreader to a heat generating element positioned within the backshell; coupling a thermal interface material to the heat spreader, wherein at least one of the heat spreader and the thermal interface material are positioned within the convection current path; and positioning the I / O connector in an I / O connector receptacle.

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