Production line and method for producing a metal product with removal of an organic material layer

Abstract

The invention relates to a production line comprising a plurality of treatment units for carrying out successive treatments of the metal product (4), the treatment units including a laser removal unit (44) configured for removing an organic material layer from one or more surfaces (4A) of the metal product (4), the removal unit (44) comprising at least one laser removal device (46), each laser removal device (46) being configured to generate a laser beam and direct it onto a surface (4A) so as to remove the organic material layer.

Description

[0001] Line and process for producing a metal product with removal of a layer of organic material

[0002] The present invention relates to a line and a method for producing a metal product, in particular made of steel, in particular stainless steel.

[0003] It is possible to carry out treatments on a metal product, such as annealing heat treatments, pickling treatments, shaping treatments or even cutting treatments.

[0004] Surfaces of the metal product may be covered with a layer of oil, for example to protect the metal product during storage or transport before processing, in particular to prevent oxidation of the metal product, and / or to protect the metal product during certain treatments, for example to limit friction during shaping treatments of the metal product.

[0005] However, for the performance of certain treatments of the metal product, it may be desirable or necessary to remove a layer of oil covering surfaces of the metal product.

[0006] In particular, when carrying out an annealing heat treatment, it is generally preferable to remove a layer of oil covering the surfaces of the metal product for better control of the heat treatment and / or to limit the risk of reaction between the metal product and the oil layer.

[0007] It may therefore be desirable to equip a production line comprising several processing units with a removal unit configured for the removal of a layer of organic material from one or more surfaces of the metal product.

[0008] However, such a removal unit complicates the processing of the metal product.

[0009] One of the aims of the invention is to propose a production line for the treatment of a metal product allowing efficient treatment of the metal product and which is simple to implement.

[0010] To this end, the invention provides a production line for processing a metal product, the production line comprising several processing units for carrying out successive processing of the metal product, the processing units including a laser removal unit configured for removing a layer of organic material from one or more surfaces of the metal product, the removal unit comprising at least one laser removal device, each laser removal device being configured to generate a laser beam and direct it onto a surface so as to remove the layer of organic material. Carrying out a laser organic material removal treatment allows simple, rapid and efficient processing of the metal product that can be easily integrated into a production line ensuring a flow of the metal product or a flow of metal product through the production line.

[0011] The removal of organic material can be adapted easily and very quickly depending on the metal product or a layer of organic material covering the metal product, for example by adapting the parameters of a laser beam produced for the removal of organic material from the surface to be treated or the orientation of the laser beam to cover a region of a surface to be treated of the metal product.

[0012] In exemplary embodiments, the production line comprises one or more of the following optional features, taken individually or in all technically possible combinations:

[0013] - the laser beam is generated in such a way as to vaporize the layer of organic matter covering the surface to be treated;

[0014] - the laser beam is generated in such a way as to push and / or scrape the layer of organic matter along the surface to be treated;

[0015] - the laser beam is generated so as to pass through the layer of organic matter and superficially heat the surface of the metal product to vaporize part of the organic matter at the interface between the layer of organic matter and the surface to be treated and push the other part of the organic matter away from the surface to be treated;

[0016] - the removal unit comprises a measuring device configured to measure parameters of the organic matter layer covering each surface, each laser removal device being configured to control parameters of the laser beam and the direction of the laser beam according to the measured parameters of the organic matter layer;

[0017] - the laser beam parameters include one or more of the following parameters: a wavelength of the laser beam, a frequency of the laser beam, a power density of the laser beam, an energy density of the laser beam, a pulse duration of the laser beam in the case of a pulsed laser removal device, a pulse energy of the laser beam, a scanning speed of the laser beam, an overlap rate between laser beams, a laser-material interaction time, the overlap between laser impacts of the laser beam emitted by the laser removal device;

[0018] - the parameters of the organic matter layer include a thickness of the organic matter layer, a weight of the organic matter layer, a composition of the organic matter and / or a rate of metallic or non-metallic particles contained in the organic matter;

[0019] - the measuring device comprises one or more fluorescence sensors;

[0020] - each fluorescence sensor comprises a radiation source, in particular in the ultraviolet frequency range, for generating excitation radiation towards the surface to be treated, and a photosensitive device configured to detect fluorescence radiation emitted by the layer of organic matter excited by the excitation radiation;

[0021] - the wavelength of the excitation radiation is for example located in a wavelength range between 1 nm and 380 nm, preferably between 300 nm and 380 nm, more preferably between 345 nm and 380 nm;

[0022] - the photosensitive device is for example sensitive to radiation in a wavelength range between 380 nm and 780 nm, preferably between 380 nm and 540 nm, more preferably between 420 nm and 500 nm;

[0023] - the measuring device comprises measuring sensors including one or more cameras, one or more laser-induced plasma atomic emission spectrometry devices and / or one or more Fourier transform infrared spectroscopy devices;

[0024] - the removal unit is configured for the evacuation of organic matter covering the surface to be treated by gravity;

[0025] - the removal unit is configured to remove a layer of organic matter from each surface to be treated when the surface to be treated extends along a plane inclined relative to a horizontal plane, in particular along a substantially vertical plane, so as to evacuate the organic matter removed from the surface to be treated by gravity;

[0026] - the production line is configured for the scrolling of the metal product along a scroll path during production;

[0027] - the treatment units comprise, along the scroll path, a heat treatment furnace, preferably induction, and / or a pickling unit, preferably laser, and / or a coil unwinding station located at the upstream end of the scroll path for unwinding the metal product from a coil, and / or a metal product winding station located at a downstream end of the scroll path for winding the metal product and forming a coil, and / or a de-strapping unit configured to cut one or more ligatures from a coil of metal product, in particular by cutting each ligature with a laser, and / or a cutting unit configured to cut a rear end of the metal product unwound from a coil, and / or a welding unit configured to weld a rear end of the metal product to a front end of another metal product,and / or a cutting unit for cutting the metal product, for example for cutting edges of the metal product, and, optionally, for cutting each cut edge into chips, preferably by laser;,

[0028] - the production line is configured for the production of a metal strip, a metal wire, a metal bar and / or a metal tube;

[0029] - the production line is configured for the production of metal parts from separate metal plates;

[0030] - the processing units comprise a shaping unit configured to shape each plate so as to form a metal part, for example by stamping and / or bending.

[0031] The invention also relates to a method for producing a metal product by passing the metal product through several processing units for carrying out successive treatments of the metal product, comprising the removal of a layer of organic material by laser from one or more surfaces of the metal product, the removal of the organic material from each surface being carried out by generating at least one laser beam and directing it onto the surface to be treated so as to remove the layer of organic material.

[0032] In particular embodiments, the method comprises one or more of the following optional features, taken individually or according to all technically possible features:

[0033] - the laser beam is generated in such a way as to vaporize the organic matter covering the surface to be treated;

[0034] - the laser beam is generated in such a way as to push and / or scrape the organic matter along the surface to be treated;

[0035] - the laser beam is generated so as to pass through the layer of organic matter and superficially heat the surface to be treated to vaporize part of the organic matter at the interface between the organic matter and the metal and generate vapor pushing the other part of the organic matter away from the surface to be treated;

[0036] - the production method comprises measuring parameters of the organic material layer covering each surface and controlling the parameters and direction of each laser beam directed onto the surface based on the measured parameters of the organic material layer;

[0037] - the parameters of the laser beam include one or more of the following parameters: a wavelength of the laser beam, a frequency of the laser beam, a power density of the laser beam, an energy density of the laser beam, a pulse duration of the laser beam in the case of a pulsed laser, a laser energy, a scanning speed of the laser beam, an overlap rate between laser beams, a laser-matter interaction time, the overlap between laser impacts of the laser beam;

[0038] - the parameters of a layer of organic matter include a thickness of the layer of organic matter, a weight of the layer of organic matter, a composition of the organic matter and / or a rate of metallic or non-metallic particles contained in the organic matter;

[0039] - measurements are carried out using one or more fluorescence sensors;

[0040] - each fluorescence sensor comprises a radiation source, in particular in the ultraviolet frequency range, for generating excitation radiation towards the surface to be treated, and a photosensitive device configured to detect fluorescence radiation emitted by the layer of organic matter excited by the excitation radiation;

[0041] - the wavelength of the excitation radiation is for example located in a wavelength range between 1 nm and 380 nm, preferably between 300 nm and 380 nm, more preferably between 345 nm and 380 nm;

[0042] - the photosensitive device is for example sensitive to radiation in a wavelength range between 380 nm and 780 nm, preferably between 380 nm and 540 nm, more preferably between 420 nm and 500 nm;

[0043] - the metal product is processed while it is being scrolled along a scroll path, the metal product being for example a metal strip, a metal wire, a metal bar or a metal tube;

[0044] - the metal product is a metal part obtained by shaping a metal plate.

[0045] The invention and its advantages will be better understood upon reading the following description, given solely as a non-limiting example, and made with reference to the appended drawings, in which:

[0046] - Figure 1 is a schematic side view of a laser removal unit of a production line for a metal product, according to a first example;

[0047] - Figure 2 is a schematic side view of a laser removal unit of a production line for a metal product, according to a second example;

[0048] - Figure 3 is a schematic overview of a production line for a metal product comprising the removal unit of Figure 2;

[0049] - Figures 4 and 5 are schematic side and top views of a laser cutting unit of the production line of Figure 3; - Figure 6 is a schematic side view of a laser de-strapping unit of the production line of Figure 3;

[0050] - Figure 7 is a schematic side view illustrating laser devices of the production line of Figure 3;

[0051] - Figure 8 is a schematic overview of a production line for a metal product comprising the removal unit of Figure 1; and

[0052] - Figure 9 is a schematic side view of a laser removal unit of a production line of a metal product, using fluorescence sensors;

[0053] As illustrated in Figure 1, a production line 2 is configured to process a metal product 4, which is for example an elongated metal product such as a metal strip, a metal wire, a metal bar or a metal tube, or an individual metal part, such as a metal plate, the metal plate being for example planar or three-dimensionally shaped.

[0054] The metal product 4 has one or more surfaces 4A covered with a layer of organic material H.

[0055] Organic matter is present intentionally or unintentionally. Examples of organic matter include oil, a lubricant, particularly silane, or a deposit such as paint or varnish.

[0056] The layer of organic material H is for example applied to the metal product 4 to protect each surface 4A and / or to carry out treatment on the metal product, such as forming treatments by stamping, by limiting the friction between the metal product 4 and the stamping dies.

[0057] The metal product 4 comprises, for example, two opposing surfaces 4A. Such a metal product 4 is, for example, a metal strip or a metal plate.

[0058] The production line 2 comprises a plurality of treatment units, each treatment unit being configured to carry out a treatment on the metal product, the production line 2 being configured so that the metal product 4 passes successively through the treatment units by successively carrying out the treatments.

[0059] The treatments to be carried out include, for example, unwinding the metal product 4 from a coil, cutting the metal product, welding the metal product 4 to another metal product to ensure uninterrupted movement of metal products in the production line 2, removing a layer of organic material from one or more surfaces 4A of the metal product 4, heating the metal product 4, for example to carry out annealing, cooling the metal product 4, pickling surfaces 4A of the metal product 4, for example to remove an oxide layer forming after a heat treatment of the metal product 4, cutting the metal product 4, for example to cut edges of the metal product 4, slitting the metal product 4 or sectioning the metal product 4, winding the metal product 4 to form a coil, and / or one or more shapings of the metal product 4.

[0060] As illustrated in Figure 1, the processing units include a removal unit 32 configured to remove a layer of organic material from one or more surfaces 4A of the metal product 4.

[0061] The removal unit 32 is configured to laser remove a layer of organic material covering each surface 4A to be treated.

[0062] The removal unit 32 comprises one or more laser removal devices 34 arranged to remove a layer of organic material from at least a portion of each surface 4A to be treated of the metal product 4.

[0063] The removal unit 32 is for example configured for the removal of layers of organic material from two opposite surfaces 4A on a metal product 4. The removal unit 32 comprises laser removal devices 34 arranged on either side of the metal product 4 received in the removal unit 32.

[0064] The removal unit 32 comprises one or more removal laser devices 34 arranged on one side of the metal product 4 received in the removal unit 32 for treating a first surface 4A of the metal product 4 and one or more removal lasers 34 arranged on the other side of the metal product 4 received in the removal unit 32 for treating a second surface 4A of the metal product 4 opposite the first surface 4A.

[0065] Each laser removal device 34 is configured to generate a laser beam and project the laser beam onto a surface 4A of the metal product 4 to remove a layer of organic material H covering the surface 4A.

[0066] Each laser removal device 34 is for example configured to generate a laser beam having the effect of evaporating the layer of organic matter H covering the surface 4A.

[0067] In addition or as a variant, each laser removal device 34 is for example configured to generate a laser beam having the effect of pushing and / or scraping a layer of organic material H covering this surface 4A due to a movement of the metallic product 4 relative to the laser beam generated by the laser removal device 34, as illustrated by the arrow D in Figure 1.

[0068] The pushing or scraping of the layer of organic material H is in particular obtained using a laser beam configured to pass through the layer of organic material H, strike the surface 4A of the metal product 4 and heat said surface 4A of the metal product 4 in such a way as to cause local evaporation of the organic material at the interface with the surface 4A of the metal product 4 and generate an overpressure which lifts and pushes the layer of organic material H along the metal product 4 due to the movement of the metal product 4 relative to the laser beam generated by the laser removal device 34. This can be obtained without damaging the metal product 4, and in particular without damaging the surface 4A of the metal product 4.

[0069] Adjustable parameters of the laser beam include, for example, a wavelength of the laser beam emitted by the removal laser device 34, the frequency of the laser beam emitted by the removal laser device 34, the power of the laser beam emitted by the removal laser device 34, the pulse duration of the laser beam emitted by the removal laser device 34 (in the case of a laser pulsed removal laser device 34), the pulse energy of the laser beam emitted by the removal laser device 34 (in the case of a laser pulsed removal laser device 34), the scanning speed of the laser beam emitted by the removal laser device 34, the overlap ratio between the laser beams emitted by adjacent removal laser devices 34, the laser-material interaction time of the laser beam emitted by the removal laser device 34,the overlap parameters between the laser impacts of the laser beam emitted by the laser removal device 34.,

[0070] In exemplary embodiments, a removal laser device 34 is configured to project a continuous laser beam of wavelength 10 pm (CO2 laser) with an interaction time of between 0.3 ms and 0.5 ms and a laser power of between 2 kW and 10 kW. Such an adjustment makes it possible to evaporate a layer of organic material H covering a surface 4A of the metal product 4.

[0071] In exemplary embodiments, a removal laser device 34 is configured to project a continuous near-infrared laser beam with a power of between 1 and 5 kW and an interaction time of between 1 ps and 50 ps. Such an adjustment makes it possible to push or scrape off a layer of organic material H covering the surface 4A of the metal product 4.

[0072] As illustrated in Figure 1, each surface 4A is freed from the layer of organic matter H initially present downstream of the point of interaction between the laser beam generated by the removal laser device 34 and the surface 4A, considering the direction of movement of the surface 4A relative to the removal laser device 34.

[0073] Each laser removal device 34 preferably comprises a laser 34A for generating a laser beam, an optical device 34B configured to shape and direct the laser beam toward a surface 4A to be treated of the metal product 4, and an electronic control unit 34C configured to control the laser 34A and the optical device 34B to generate an appropriate laser beam, shape the beam appropriately, and direct the beam appropriately. The electronic control unit 34C in particular controls the laser 34A to obtain an appropriate laser beam power. The electronic control unit 34C, for example, controls the optical device 34B to scan a region of the surface 4A with the laser beam.

[0074] Advantageously, each laser removal device 34 comprises one or more removal sensors 34D, each removal sensor 34D being configured and arranged to measure a parameter of a layer of organic material H covering the surface 4A of the metal product 4 and to emit a corresponding measurement signal, the electronic control unit 34C being configured to control parameters of the laser beam and the direction of the laser beam emitted by the laser removal device 34 as a function of the measurement signal, in particular by controlling the laser 34A and the optical device 34B as a function of the measurement signal.

[0075] The parameters of the organic matter layer H include, for example, a thickness of the organic matter layer and / or a weight of the organic matter and / or a composition of the organic matter and / or a content of metallic or non-metallic particles (paper, dust, etc.).

[0076] The 34D removal sensor(s) include, for example, one or more cameras, one or more fluorescence sensors, one or more laser-induced breakdown spectroscopy (LIBS) devices, and / or one or more Fourier Transform InfraRed spectroscopy (FTIR) devices.

[0077] The laser parameters adjusted according to the measured parameter(s) of the organic matter layer H include, for example, one or more of the adjustable parameters indicated above.

[0078] As illustrated in Figure 9, the one or more withdrawal sensors 34D of each withdrawal device 34 preferably include one or more fluorescence sensors, hereinafter referred to as fluorescence sensors 34D.

[0079] Each fluorescence sensor 34D comprises for example a radiation source 112 for generating excitation radiation R1 in the direction of the surface to be treated 4A, and a photosensitive device 114 configured to detect fluorescence radiation R2 which is emitted by the layer of organic matter H and which results from the fluorescence of the layer of organic matter H excited by the excitation radiation R1.

[0080] The radiation source 112 is for example configured to emit excitation radiation R1 having a wavelength located in the ultraviolet (UV) wavelength range, i.e. between 1 nm and 380 nm.

[0081] Preferably, the radiation source 112 is configured to emit excitation radiation R1 having a wavelength in a wavelength range of between 300 nm and 380 nm, more preferably between 345 nm and 380 nm. In examples, the wavelength of the excitation radiation R1 is approximately 365 nm.

[0082] The photosensitive device 114 is for example sensitive in a wavelength range located in the visible light domain, i.e. between 380 nm and 780 nm.

[0083] In examples, the photosensitive device 114 is sensitive in a wavelength range between 380 nm and 540 nm, in particular between 420 nm and 500 nm. In examples, the photosensitive device 114 is sensitive to radiation of wavelength approximately equal to 460 nm.

[0084] The wavelength ranges indicated above allow efficient detection of the presence of the organic matter H layer, and allow detection of the thickness of the organic matter H layer, the fluorescence intensity being a function of the thickness of the organic matter H layer.

[0085] The photosensitive device 114 comprises for example one or more photosensitive elements 116, in particular one or more photosensitive diodes.

[0086] The photosensitive device 114 has, for example, a photosensitive surface 114A formed of several photosensitive elements 116 arranged in a matrix manner to form the photosensitive surface 114A.

[0087] Each photosensitive element 116 is sensitive to radiation in the sensitivity range of the photosensitive device 114.

[0088] Preferably, each fluorescence sensor 34D comprises an optical filter 118 arranged such that the excitation radiation R1 is emitted through the optical filter 118 and the fluorescence radiation R2 emitted by the layer of organic material H in response to the excitation radiation R1 and deflected by the optical filter 118 towards the photosensitive device 114.

[0089] Each fluorescence sensor 34D comprises, for example, an electrical control unit 120 configured to control the radiation source 112 and to recover an output signal from the photosensitive device 114 and to determine one or more parameters of the organic material layer H as a function of the measurement signal and transmit a corresponding measurement signal, for example to an electrical control unit 34C of the removal unit 34.

[0090] As illustrated in Figure 1, the removal unit 32 is for example configured to remove a layer of organic material H from each surface 4A of the metal product 4 when the surface 4A extends along a horizontal plane.

[0091] Advantageously, the removal unit 32 is configured for gravity evacuation of the layer of organic material H removed from one or each surface 4A of the metal product 4. This allows efficient removal and facilitates the recovery of the organic material removed from the surface 4A.

[0092] Optionally, the removal unit 32 comprises one or more tanks 36 for recovering the organic material removed from the metal product 4, in particular by gravity flow.

[0093] Alternatively, as illustrated in Figure 2, the removal unit 32 is configured so that each laser removal device 34 projects a laser beam onto a corresponding surface 4A of the metal product 4 when this surface 4A is inclined at a non-zero angle relative to a horizontal plane, in particular when this surface 4A extends substantially along a vertical plane. This makes it possible to evacuate the layer of organic matter by gravity.

[0094] In exemplary embodiments, as illustrated in Figure 2, the removal unit 32 comprises one or more guide rollers 35 arranged to deflect the metal product 4, each removal laser device 34 being arranged opposite a guide roller 35 to project a beam onto a surface 4A of the metal product 4 opposite the guide rollers 35 and inclined relative to a horizontal plane and preferably substantially parallel to a vertical plane.

[0095] Advantageously, the removal unit 32 comprises at least one guide roller 35 arranged to deflect the metal product 4 upwards, substantially vertically, a laser removal device 34 being arranged opposite the guide roller 35 to remove the organic matter from the surface 4A of the metal product 4A opposite the guide roller 35.

[0096] A collection tray 36 is preferably disposed beneath the guide roller 35 to collect the organic matter removed from the other surface 4A and flowing by gravity into the collection tray 36.

[0097] When the metal product 4 is a metal strip comprising two opposite surfaces 4A, the removal unit 32 comprises for example a plurality of guide rollers 35 arranged along a running path C of the metal product 4 and at least two laser removal devices 34 each associated with a guide roller 35, for the treatment of each of two opposite surfaces 4A of the metal product 4.

[0098] The removal unit 32 preferably comprises additional guide rollers 35 for guiding the metal product 4 upstream of and / or between and / or downstream of the guide rollers 35 associated with the laser removal device 34.

[0099] As illustrated in Figure 2, the removal unit 32 comprises for example two guide rollers 35 associated with two removal laser devices 34 arranged to treat the two opposite surfaces 4A of the metal product 4A and an intermediate guide roller 35 arranged between the two guide rollers 35 associated with the two removal laser devices 34. Each intermediate guide roller 35 makes it possible to orient the metal product 4 appropriately between a guide roller 35 associated with a removal laser device 34 and the next.

[0100] Optionally, the removal unit 32 comprises at least one input guide roller 35 located upstream of the first guide roller 35 associated with a removal laser device 34. Each input guide roller 35 makes it possible to orient the metal product 4 appropriately upstream of the first guide roller 35 associated with a removal laser device 34.

[0101] Optionally, the removal unit 32 comprises a suction device 37 configured for the suction of fumes or vapors generated by the evaporation of organic material covering the metal product 4 under the effect of the laser beam(s) of the laser removal device(s) 34.

[0102] In operation, the production line 2 implements a method for producing a metal product 4 comprising the removal of a layer of organic material H from one or more surfaces 4A of the metal product 4 covered with a layer of organic material H.

[0103] The removal of the organic matter is carried out using at least one laser removal device 34, each laser removal device 34 being arranged to remove a layer of organic matter H from a surface 4A of the metal product 4. The removal of the organic matter is for example carried out on two opposite surfaces 4A on the metal product 4.

[0104] The removal of the organic matter is preferably carried out on each surface 4A so as to allow evacuation of the organic matter from the surface 4A by gravity flow, for example when the surface 4A extends along a plane inclined at a non-zero angle relative to a horizontal plane, for example along a substantially vertical plane. In the case of a metal product 4 moving along a moving path C, the removal of the organic matter is preferably carried out on an upward portion of the moving path C.

[0105] Removing organic matter preferably includes recovering the organic matter removed from each surface 4A by gravity flow into one or more recovery tanks 36.

[0106] Advantageously, the production method comprises measuring one or more parameters of a layer of organic material H covering a surface 4A of the metal product 4, controlling parameters of a removal laser beam and the direction of the removal laser beam as a function of a measurement signal of each measured parameter of the layer of organic material H.

[0107] The measurement of one or more parameters of the organic matter layer H is for example carried out using one or more 34D fluorescence sensors. Each 34D fluorescence sensor provides for example a measurement signal representative in particular of a thickness of the organic matter layer H.

[0108] The removal of organic matter from the metal product 4 by laser allows for efficient and easily adaptable removal of organic matter, for example depending on the parameter of a layer of organic matter covering a surface 4A of the metal product 4. The removal of organic matter from the metal product 4 by laser allows for the removal of organic matter from flat or non-flat surfaces.

[0109] The production line 2, and in particular the removal unit 34, can be configured for the processing of an elongated metal product 4 such as a metal strip, a metal wire, a metal bar or a metal tube, moving in the production line 2 or of a metal product 4 such as a metal part, in particular a flat or three-dimensionally shaped plate.

[0110] The production line 2 illustrated in Figure 3 integrating the removal unit 34 is for example a production unit 2 configured for the processing of an elongated metal product 4 such as a metal strip, a metal wire, a metal bar or a metal tube.

[0111] Production line 2 is configured to scroll the metal product 4 along a scroll path C.

[0112] The production line 2 comprises, for example, in a known manner, guide rollers 6 distributed along the scroll path C and making it possible to define the scroll path C. The metal product 4 rests on the guide rollers 6. The guide rollers 6 comprise guide rollers 6 arranged to deflect the metal product 4 and possibly pinching guide rollers 6 which are associated in pairs, the two pinching guide rollers 6 of each pair defining between them a slot through which the metal product 4 passes.

[0113] The production line 2 comprises processing units arranged upstream of the removal unit 34 and / or processing units arranged downstream of the removal unit 34 along the scroll path C.

[0114] The production line 2 is for example configured to carry out a heat treatment of the metal product 4, in particular an annealing heat treatment, and a surface stripping treatment 4A of the metal product 4.

[0115] The treatment units comprise a furnace 8 configured for the heat treatment of the metal product as it passes (i.e. during the passage of the metal product 4) and a pickling unit 10 configured for the pickling of at least one surface 4A of the metal product 4 as it passes. The pickling unit 10 is located downstream of the furnace 8 along the passage path C.

[0116] The furnace 8 is preferably an induction furnace configured to heat the metal product by electromagnetic induction as the metal product 4 passes through.

[0117] The furnace 8 is configured to generate an electromagnetic field crossed by the metal product 4 during the movement of the metal product 4 in the furnace 8, so as to generate induced electric currents circulating in the metal product 4, the circulation of the induced electric currents generating heat in the metal product 4 by Joule effect, so that the metal product 4 is heated.

[0118] The furnace 8 comprises electromagnetic inductors 12. Each electromagnetic inductor 12 is capable of generating an electromagnetic field crossed by the metal product 4 during the movement of the metal product 4 in the furnace 8. Each electromagnetic inductor 12 is for example an electromagnet.

[0119] In exemplary embodiments, the furnace 8 comprises one or more electromagnetic inductors 12 which are each configured to generate a variable electromagnetic field during the movement of the metal product 4.

[0120] Thus, the metallic product 4 passes through the variable electromagnetic field of each of these electromagnetic inductors 12, which generates the circulation of induced electric currents in the metallic product 4 and causes the heating of the metallic product 4.

[0121] Alternatively or optionally, the furnace 8 comprises several electromagnetic inductors 12 distributed along the scroll path C, being configured to generate identical and different electromagnetic fields from one electromagnetic inductor 12 to another during the scrolling of the metal product 4. Thus, the metal product 4 scrolling opposite these electromagnetic inductors 12 is exposed to an electromagnetic field of variable intensity, which generates the circulation of induced electric currents in the metal product 4 and causes the heating of the metal product 4.

[0122] An example of an induction furnace for heating a metal product while this metal product is being rolled is described in FR2808163A1.

[0123] The stripping unit 10 is configured to be traversed by the metal product 4 during the scrolling of the metal product 4 along the scrolling path C.

[0124] The stripping unit 10 is preferably configured for laser stripping each surface 4A to be stripped of the metal product 4.

[0125] The stripping unit 10 comprises at least one laser device 14, and preferably several laser devices 14, each laser device 14 being configured to strip at least one surface of the metal product 4 moving in the stripping unit 10.

[0126] A unit for stripping a scrolling metal product is disclosed for example in WO2018096382.

[0127] In exemplary embodiments, the stripping unit 10 comprises several laser devices 14 distributed along the travel path C so as to strip several surfaces of the metal product 4.

[0128] In exemplary embodiments, the stripping unit 10 comprises several laser devices 14 arranged on either side of the travel path C so as to strip two opposite surfaces of the metal product 4.

[0129] In particular, when the metal product 4 is a metal strip, it comprises two opposite surfaces, and the stripping unit 10 preferably comprises laser devices 14 arranged on either side of the travel path C so as to strip the two opposite surfaces of the metal product 4.

[0130] In exemplary embodiments, the stripping unit 10 comprises several laser devices 14 distributed along the travel path C to strip the same surface of the metal product 4.

[0131] The provision of several laser stripping devices 14 distributed along the travel path C for stripping the same surface of the metal product 4 makes it possible to strip this surface of the metal product 4 in several passes.

[0132] Preferably, the stripping unit 10 comprises several laser stripping devices 14 distributed along the travel path C opposite each surface of the metal product 4. In particular, the stripping unit 10 comprises several laser stripping devices 14 distributed along the travel path C opposite each of two opposite surfaces of the metal product 4.

[0133] Optionally, the stripping unit 10 comprises support rollers 16 arranged to guide the metal product 4 in the stripping unit 10, each stripping laser device 14 being arranged to strip a portion of the metal product 4 resting on a support roller 16. This makes it possible to control the flatness of the surface to be stripped opposite each stripping laser device 14, and thus to guarantee the quality of the stripping.

[0134] In exemplary embodiments, as illustrated in Figure 3, the support rollers 16 are arranged for a zig-zag movement of the metal product 4 in the stripping unit 10, with an alternation of left turns and right turns in which the metal product 4 is curved, stripping laser devices 14 being distributed along the movement path alternately on one side and the other of the movement path C, each stripping laser device 14 pointing at a portion of the metal product resting on a support roller 16.

[0135] Preferably, the production line 2 has an oxide measuring unit 72 arranged along the travel path between the furnace 8 and the pickling unit 10, the oxide measuring unit 72 being configured to measure one or more parameters of the oxide layer of one or more surfaces of the metal product 4, the pickling unit 10 being configured to adjust the laser pickling parameters as a function of the oxidation parameter(s) measured for said surface(s) of the metal product 4.

[0136] Oxide layer parameters include, for example, oxide composition, ablation threshold (laser energy density required to strip the oxide), oxide thickness, and / or emissivity.

[0137] The laser stripping parameters adjusted according to the parameters of the oxide layer comprise, for example, one or more of the following parameters: a wavelength of the laser beam emitted by each stripping laser device 14, the frequency of the laser beam emitted by each stripping laser device 14, the power of the laser beam emitted by each stripping laser device 14, the pulse duration of the laser beam emitted by each stripping laser device 14 (in the case of a pulsed stripping laser device 14), the pulse energy of the laser beam emitted by each stripping laser device 14 (in the case of a pulsed stripping laser device 14), the scanning speed of the laser beam emitted by each stripping laser device 14, the overlap rate between the laser beams emitted by adjacent stripping laser devices 14,the laser-material interaction time of the laser beam emitted by each stripping laser device 14 and / or the overlap parameters between the laser impacts of the laser beam emitted by each stripping laser device 14,

[0138] The oxide measuring unit 72 comprises for example a characterization device for characterizing the oxide layer, for example a sensor, for measuring one or more parameters of the oxide layer of each surface of the metal product 4 stripped by the stripping unit 10.

[0139] In particular, when the metal product 4 is a metal strip, the oxide measurement unit 72 comprises, for example, a characterization device which is an oxide measurement sensor 74 for measuring one or more parameters of the oxide layer of each of the two opposite surfaces of the metal product 4.

[0140] Each oxide measurement sensor 74 comprises for example a specific camera arranged to take images of an associated surface of the metal product 4, the oxide measurement unit 72 being configured for the automatic analysis of the images captured by each camera to determine the parameters of the oxide layer.

[0141] Preferably, the furnace 8 and the pickling unit 10 are arranged vertically, that is to say so that the metal product 4 passes vertically through the furnace 8 and the pickling unit 10. This makes it possible to limit the horizontal size of the production line 2.

[0142] The vertical scrolling of the metal product 4 in the furnace 8 also makes it possible to limit the number of guide rollers 6 required in the furnace 8 and thus to limit the risk of marking the metal product 4 with the guide rollers 6 in the furnace 8 or at the outlet of the furnace 8, when the metal product 4 is hot and sensitive to marking.

[0143] The vertical scrolling of the metal product 4 in the furnace 8 still allows good control of the position of the metal product 4 relative to the electromagnetic inductors 12, which makes it possible to arrange the electromagnetic inductors 12 close to the metal product 4 for good efficiency of the induction heating.

[0144] Advantageously, the oven 8 and the pickling unit 10 are arranged side by side. This makes it possible to limit the horizontal space requirement of the production line 2.

[0145] Preferably, the furnace 8 and the pickling unit 10 are arranged one on an upward section of the scroll path C, in which the metal product 4 rises vertically, and the other on a downward section of the scroll path C, in which the metal product 4 descends vertically. In exemplary embodiments, the furnace 8 is arranged on an upward section C1 of the scroll path C, and the pickling unit 10 is arranged on a downward section C2 of the scroll path C.

[0146] If necessary, intermediate guide rollers 6 are arranged between the furnace 8 and the stripping unit 10 to effect a change in direction of the scroll path between the furnace 8 and the stripping unit 10.

[0147] Optionally, such intermediate guide rollers 6 are cooled, for example by air and / or by water. This makes it possible to cool the metal product 4 guided by these intermediate guide rollers 6.

[0148] In exemplary embodiments, the production line 2 comprises a cooling unit 18 configured to actively cool the metal product 4 as the metal product 4 moves.

[0149] The cooling unit 18 is for example configured to force air circulation along the metal product 4 to cool the metal product 4.

[0150] Optionally or alternatively, the cooling unit 18 is for example configured to cool the metal product 4 by water, for example by spraying water onto the metal product 4, in particular atomized or non-atomized water.

[0151] The cooling unit 18 is arranged along the scroll path C downstream of the furnace 8 and, preferably, upstream of the pickling unit 10.

[0152] In exemplary embodiments, the cooling unit 18 is arranged on the same ascending or descending section of the scroll path C on which the oven 8 is arranged.

[0153] In particular, and as illustrated in Figure 3, the cooling unit 18 is arranged on an upward section C1 of the scroll path C on which the furnace 8 is arranged, before a change of direction towards a downward section C2 of the scroll path C on which the pickling unit 10 is arranged.

[0154] Air cooling is more suitable than water cooling when the cooling unit 18 is located on the same vertical section of the scroll path as the furnace 8.

[0155] The provision of cooled intermediate guide rollers 6 as mentioned above makes it possible to limit the length or the cooling capacity of the cooling unit 18.

[0156] Optionally, the production line 2 comprises a defect correction unit 80 arranged along the scroll path C downstream of the pickling unit 10 and configured to detect and treat surface defects of one or more surfaces of the metal product 4, in particular oxide points not pickled or insufficiently pickled by the pickling unit 10.

[0157] The defect correction unit 80 is for example configured to detect and treat surface defects on each surface of the metal product 4 stripped by the stripping unit 10.

[0158] In particular, when the metal product 4 is a metal strip, the defect correction unit 80 is configured to detect and process defects on each of the two opposing surfaces of the metal product 4.

[0159] The defect correction unit 80 comprises, for example, for each etched surface of the metal product 4, one or more defect sensors 82 and one or more laser correction devices 84, each laser correction device 84 being configured to emit a laser beam towards the surface of the metal product 4 to remove a possible surface defect, for example to remove one or more oxide points present on the surface of the metal product 4.

[0160] In particular, when the metal product 4 is a metal strip, the defect correction unit 80 comprises one or more defect sensors 82 and one or more correction laser devices 84 for detecting and treating surface defects on each of the two opposite surfaces of the metal product 4.

[0161] Each defect sensor 82 is for example a camera configured to take images of the associated surface of the metal product 4, the defect correction unit being configured to automatically analyze the images taken by each defect sensor 82 to determine the possible presence of surface defects to be treated.

[0162] In exemplary embodiments, the production line 2 comprises an unwinding station 20 located at the upstream end of the scroll path C for unwinding the metal product 4 from an input coil 22.

[0163] In exemplary embodiments, the production line 2 comprises a winding station 24 located at a downstream end of the scroll path C for winding the metal product 4 to form one or more output coils 26.

[0164] In exemplary embodiments, the production line 2 comprises a welding unit 28 configured to weld a rear end of the metal product 4 of a previous input coil 22 to a front end of another metal product 4 of a subsequent input coil 22.

[0165] This allows the production of metal products 4 continuously from several successive input coils 22 by connecting the input coils 22 to each other. Preferably, the production line 2 comprises a cutting unit 30 configured for cutting a rear end of a previous input coil 22 and / or cutting a front end of a subsequent input coil 22.

[0166] The cutting unit 30 is located along the scroll path C upstream of the welding unit 28.

[0167] Cutting a rear end of a previous input coil 22 and / or cutting a front end of a subsequent input coil 22 allows for clean welding of the two coils 22.

[0168] The removal unit 32 is for example located along the scroll path C upstream of the furnace 8, and, where appropriate, downstream of a welding unit 28 and / or a cutting unit 30.

[0169] In exemplary embodiments, the production line 2 comprises a planing unit 38 located along the scroll path C downstream of the stripping unit 10.

[0170] The planing unit 38 is configured to flatten the metal product 4, in particular to flatten deformations which could have been caused by the passage of the metal product 4 along the scroll path C.

[0171] The planing unit 38 comprises, for example, in a known manner, planing rollers 40 arranged to reduce deformations of the metal product 4, for example thanks to a particular arrangement and / or rollers with external diameters that vary from one planing roller 40 to another.

[0172] Alternatively, the planishing unit 38 is a skin pass mill comprising a pair of skin pass rolls arranged for the passage of the metal product 4 between the two skin pass rolls while being pressed between the two skin pass rolls.

[0173] In exemplary embodiments, the production line 2 comprises an inspection unit 42 configured for the inspection of the metal product 4.

[0174] The inspection unit 42 is for example configured for an optical inspection of the metal product 4.

[0175] The inspection unit 42 comprises for example one or more image capture devices arranged to capture images of the metal product 4 and a data processing unit (not shown) configured to automatically analyze the captured images.

[0176] The inspection unit 42 is arranged along the scroll path C downstream of the stripping unit 10, and, where appropriate, downstream of the planing unit 38.

[0177] In exemplary embodiments in which the production line 2 is configured for the production of a metal product 4 which is a metal strip, the production line 2 comprises a cutting unit 44 configured to laser cut the metal product 4.

[0178] The cutting unit 44 is for example configured to cut edges of the metal product 4, and, optionally, to cut into fragments the offcuts resulting from the cutting of each edge and / or to slit the metal product 4, i.e. to cut it lengthwise, and / or to section the metal product 4, i.e. to cut it widthwise, and / or to cut shapes in the metal product 4.

[0179] Cutting the edges of the metal product 4 makes it possible, for example, to obtain a suitable finish for the edges of the metal product 4.

[0180] Cutting the scraps resulting from cutting the edges into fragments avoids the problems of jamming and removing the scraps. Cutting into small fragments also allows for better material recovery by allowing its injection further upstream in the production process, for example for the production and refining of metal.

[0181] Slitting the metal product 4 makes it possible, for example, to form several narrow metal strips from a wide metal strip. Each narrow metal strip can be wound to form a coil.

[0182] The sectioning of the metal product 4 makes it possible, for example, to form products of the desired length or to separate, at the output of the production line 2, coils previously assembled at the input of the production line 2 for their passage into the production line 2 one after the other.

[0183] Cutting shapes makes it possible to obtain plates or sides of the desired contour directly from production line 2.

[0184] Such a laser cutting unit 44 replaces in particular a mechanical cutting unit configured to cut the metal product by shearing using knives, the latter having to be replaced regularly, which requires stopping the production line and negatively impacts productivity. Furthermore, in such a mechanical cutting unit, the position of the knives is fixed during operation of the production line and can only be adjusted during a stoppage of the production line.

[0185] The cutting unit 44 is arranged along the scroll path C downstream of the stripping unit 10, and, where appropriate, downstream of the planing unit 38 and / or downstream of the inspection unit 42.

[0186] The cutting unit 44 is preferably configured for laser cutting. The cutting unit 44 comprises one or more laser cutting devices 46. In Figure 5 which represents the cutting unit 44 in top view, the laser beam L of each laser cutting device 46 is symbolized by a point corresponding to the focal spot of the laser beam L on the metal product 4.

[0187] As illustrated, the cutting unit 44 comprises for example two laser cutting devices 46, each arranged to cut a respective edge 48 of the metal product 4.

[0188] Optionally, the cutting unit 44 comprises two laser cutting devices 46, each arranged to cut a respective bank 48 into fragments 50.

[0189] Optionally, the cutting unit 44 comprises one or more laser cutting devices 46 arranged for slitting and / or sectioning the metal product 4.

[0190] Each laser cutting device 46 arranged to perform slitting performs a cut of the metal product 4 along a longitudinal cutting line LL extending along the length of the metal product 4.

[0191] Each laser cutting device 46 cuts the metal product along a transverse cutting line LT extending along the width of the metal product 4.

[0192] As illustrated in Figure 5, the cutting unit 44 comprises a laser cutting device 46 arranged for slitting the metal product 4 into two portions.

[0193] Each portion can form a coil of narrower width than that of the metal product 4 (or coil) exiting production line 2.

[0194] In other examples, the cutting unit 44 is configured for slitting the metal product 4 into more than two portions, i.e., into three or more portions.

[0195] Each laser cutting device 46 is dedicated to edge cutting, dedicated to slitting or dedicated to sectioning or is controllable to perform at least two different operations among edge cutting, slitting and sectioning. Laser cutting allows very rapid adaptation of the cuts.

[0196] Returning to Figure 3, the production line 2 optionally comprises a position adjustment device 54 configured to adjust the position of a length portion of the metal product 4 in an adjustment section of the travel path C, the metal product 4 remaining stationary along the travel path C upstream and downstream of the adjustment section.

[0197] The position adjustment device 54 is in particular configured to advance or retreat said length portion of the metal product 4 in the adjustment section, the movement of the rest of the metal product 4 being interrupted upstream and downstream of the adjustment section. The adjustment section comprises for example the furnace 8 and the pickling unit 10. The position adjustment device 54 makes it possible to adjust the position of the length portion of the metal product located in the furnace 8 and the pickling unit 10. The adjustment section here comprises the first section C1 and the second section C2.

[0198] The adjustment of the position of said portion of the metal product 4 makes it possible, for example, when an unplanned interruption of the movement of the metal product 4 occurs, to move said portion of length of the metal product 4 back several meters in the adjustment section, to reposition it relative to the furnace 8 and to the pickling unit 10, so as to resume production without having to reject the metal product 4.

[0199] The position adjustment device 54 preferably makes it possible to move the length portion of the metal product 4 located in the adjustment section with a maximum amplitude of movement at least equal to the length of the furnace 8.

[0200] The position adjustment device 54 is for example configured to jointly modify the length of the scrolling path in an upstream section C3 located upstream of the adjustment section and a downstream section C4 located downstream of the adjustment section, an elongation of the upstream section C3 causing a shortening of the downstream section C4 and, conversely, a shortening of the upstream section C3 causing an elongation of the downstream section C4.

[0201] Preferably, the position adjustment device 54 is configured in such a way that an elongation of the upstream section C3 by a certain length causes a shortening of the downstream section C4 by the same length and, conversely, that a shortening of the upstream section C3 by a certain length causes an elongation of the downstream section C4 by the same length.

[0202] A joint lengthening of the upstream section C3 and shortening of the downstream section C4 makes it possible to pull the metal product 4 backwards into the adjustment section, and therefore to move the metal product 4 back into the adjustment section, the metal product 4 remaining stationary upstream and downstream of the adjustment section.

[0203] A joint shortening of the upstream section C3 and lengthening of the downstream section C4 makes it possible to pull the metal product forward in the adjustment section, and therefore to advance the metal product 4 in the adjustment section, the metal product 4 remaining stationary upstream and downstream of the adjustment section.

[0204] The length adjustment device 54 comprises for example a mobile assembly 56 carrying a first roller 58 for guiding the metal product 4 in the upstream section C3 and a second roller 56 for guiding the metal product 4 in the downstream section C4, a first movement of the mobile assembly 56 (Arrow F1 in Figure 3) jointly causing an elongation of the upstream section C3 and a shortening of the downstream section C4, and a second movement of the mobile assembly 56 (Arrow F2 in Figure 3) jointly causing a shortening of the upstream section C3 and an elongation of the downstream section C4.

[0205] The mobile assembly 56 is for example mobile along a trajectory, the first movement and the second movement being movements of the mobile assembly 56 along the trajectory in a first direction of movement and a second opposite direction of movement.

[0206] The moving assembly 56 is for example movable in translation along a direction of movement. The trajectory of the moving assembly 56 is then rectilinear. The direction of movement is for example vertical.

[0207] Advantageously, the mobile assembly 56 is vertically movable with a displacement amplitude at least equal to the length of the first section C1 and / or the length of the second section C2. This allows a displacement of the portion of length of the metal product located in the adjustment section by a length at least equal to that of the furnace 8.

[0208] When adjusting the position of the metal product 4 in the adjustment section when the movement of the metal product 4 in the production line 2 is interrupted, the metal product 4 remains stationary in an input section C5 located between the upstream end of the movement path C and the upstream section C3 and in an output section C6 located between the downstream section C4 and the downstream end of the movement path C.

[0209] It is possible to carry out a position adjustment of the metal product 4 during a movement of the metal product 4 in the production line 2, for example during a restart of the production line 2, the position adjustment device 54 being for example used to move back the portion of length of the metal product 4 present in the adjustment section.

[0210] As illustrated in Figure 6, an input spool 22 is generally provided with one or more ligatures 90 (or "banding") wrapped around the input spool 22 to retain the wound input spool 22 during handling of the input spool 22.

[0211] Optionally, the production line 2 includes a de-strapping unit 92 configured to cut each ligature (or tie) 20 arranged on the input reel 22.

[0212] The de-strapping unit 92 comprises for example one or more de-strapping laser devices 94, each de-strapping laser device 94 being configured to generate a laser beam for cutting at least one ligature 90 surrounding an input coil 22 received in the de-strapping unit 92.

[0213] In a manner similar to what has already been indicated for the laser removal device(s) 34, each laser device, whether it is a stripping laser device 14, a cutting laser device 46 or a correction laser device 84 or a de-stripping laser device 94 comprises for example, in a known manner, a laser 14A, 46A, 84A, 94A for generating a laser beam, an optical device 14B, 46B, 84B, 94B configured to shape and direct the laser beam towards a surface to be treated of the metal product 4, and an electronic control unit 14C, 46C, 84C, 94C configured to control the laser 14A, 46A, 84A, 94A and the optical device 14B, 46B, 84B, 94B to generate an appropriate laser beam, put the beam in a suitable shape and direct the beam in a suitable manner.

[0214] The electronic control unit 14C, 46C, 84C, 94C controls in particular the laser 14A, 46A, 84A, 94A to obtain an appropriate laser beam power depending on the application (stripping, cutting or removal of organic material).

[0215] In operation, the production line 2 implements a method for producing a metal product 4 in which the metal product 4 is moving along the moving path C, the production method comprising the removal of a layer of organic material H from one or more surfaces 4A of the metal product 4 covered with a layer of organic material H.

[0216] The removal of the organic material is carried out using at least one laser removal device 34, each laser removal device 34 being arranged for the removal of a layer of organic material from a surface 4A of the metal product 4. The removal of the organic material is for example carried out on two opposite surfaces 4A on the metal product 4.

[0217] The removal of the organic matter is preferably carried out on each surface 4A so as to allow evacuation of the organic matter from the surface 4A by gravity flow, for example when the surface extends along a plane inclined at a non-zero angle relative to a horizontal plane, for example along a substantially vertical plane.

[0218] In the case of a metal product 4 moving along a moving path C, the removal of the organic material is preferably carried out on an upward portion of the moving path C.

[0219] Removing the organic material preferably comprises recovering the organic material removed from each surface 4A by gravity flow into one or more recovery tanks 36. In exemplary embodiments, the production method comprises induction heat treating the metal product 4 in the furnace 8 and then laser stripping at least one surface of the metal product 4 in the stripping unit 10.

[0220] The production method advantageously comprises the detection of surface defects, in particular oxide points, downstream of the pickling unit 10, for example by capturing and analyzing images of each pickled surface on the metal product 4, and the laser treatment of each detected surface defect, for example in a laser defect correction unit 80.

[0221] The production method preferably comprises unwinding the metal product 4 from an input coil 22 upstream of the scroll path C, for example in an unwinding station 20, possibly after unstrapping the input coil 22 in a unstrapping unit, in particular a laser unstrapping unit, and / or winding the metal product 4 to form an output coil 26 downstream of the scroll path C, for example in a winding station 24.

[0222] The production method preferably comprises cutting a rear end of the metal product 4 and / or welding a rear end of the metal product 4 to a front end of a subsequent metal product 4.

[0223] The production method advantageously comprises the active cooling of the metal product 4 between the induction heat treatment and the laser stripping, for example by passing through a cooling unit 18 located along the scroll path C between the furnace 8 and the stripping unit 10.

[0224] The production method preferably comprises the planing of the metal product 4 downstream of the pickling unit 10 along the scroll path C. The planing is carried out in a planing unit 38, which is for example a finishing rolling mill (or “skin pass” rolling mill) or a planer.

[0225] The production method preferably comprises cutting edges 48 of the metal product 4, preferably by laser, with optionally cutting into fragments 52 each cut edge 48, preferably by laser.

[0226] The production method advantageously comprises adjusting the position of a length portion of the metal product 4 in the furnace 8 and the pickling unit 10 by jointly adjusting the length of an upstream section C3 of the travel path C located upstream of the furnace 8 and the length of a downstream section C4 of the travel path C located downstream of the pickling unit 10, an elongation of the upstream section C3 being accompanied by a shortening of the downstream section C4 and vice versa.

[0227] The adjustment is carried out using the mobile assembly 56 carrying a roller 58 for guiding the metal product 4 in the upstream section C3 and a roller 58 for guiding the metal product 4 in the downstream section C4, a movement of the mobile assembly 56 in a first direction jointly causing an elongation of the upstream section C3 and a shortening of the downstream section C4, a movement of the mobile assembly 56 in a second direction jointly causing a shortening of the upstream section C3 and an elongation of the downstream section C4.

[0228] Production line 2, combining an induction furnace 8 and a laser stripping unit 10, enables efficient production with a reduced footprint.

[0229] The induction furnace 8 has low inertia, particularly lower than that of a gas furnace. An induction furnace 8 allows the heating temperature of the metal product 4 to be changed quickly and can be stopped and started quickly.

[0230] A laser stripping unit 10 also has the advantage of being able to be stopped and started quickly, unlike a stripping unit by passing through one or more stripping baths, requiring the metal product 4 to be kept in each stripping bath for a given time.

[0231] Thus, for the welding of a following metal product coil to a previous metal coil, it is possible to stop the production line 2, in particular by stopping the furnace 8, the pickling unit 10 and the movement of the metal product 4 during the welding of the following metal product 4, then to restart the production line 2 once the welding has been carried out.

[0232] Production line 2, combining an induction furnace 8 and a laser stripping unit 10, eliminates the need for accumulators, or at least limits the range of length adjustments.

[0233] Preferably, the production line 2 is devoid of an accumulator for accumulating a length of the metal product 4.

[0234] The absence of an accumulator allows for a compact production line 2, and limits maintenance of production line 2.

[0235] The speed of modification of the settings of the induction furnace 8 and the laser stripping unit 10 and their fine adjustment make it possible to use the production line 2 to treat different metal products 4 by connecting them one behind the other for their passages in the production line 2 or to carry out different heat treatments and / or strippings on two separate sections of the same metal product 4.

[0236] The production line 2 makes it possible to process 4 different metal products one after the other, with very rapid adaptation of the operating parameters of the furnace 8 and the pickling unit 10. It is not necessary to carry out production campaigns of the same metal product 4 by operating the production line 2 for a long period of time with the same settings, as may be the case with a gas furnace or a dip pickling unit.

[0237] Since production can be changed quickly, there is no need to have a large stock of the same metal product to carry out a long production campaign. There is also no need to provide transition metal products to carry out production campaign changes.

[0238] It is also possible to limit losses around a welding zone of a metal product 4 and another metal product 4 processed one after the other in the production line.

[0239] The stop and restart capacity of production line 2 makes it possible to limit the waste produced, for example, such as that produced during the shutdown of a gas furnace whose cooling inertia is very high.

[0240] Furthermore, the induction furnace 8 and the pickling unit 10 use electricity as an energy source, which makes it possible to have a production line 2 powered exclusively by electricity, without the need for a gas supply, for example.

[0241] Each of the additional processing units performing laser processing (removal unit 32, correction unit 80, cutting unit 40) allows great flexibility and ease of use, with the possibility of interrupting and resuming the operation of production line 2 or modifying the production carried out using production line 2, and easy maintenance.

[0242] In particular, a laser removal unit 32 makes it possible to remove a layer of organic material easily, by quickly adapting the operating parameters of the laser removal unit 32 according to the metal product 4 being treated, in particular according to the type of organic material present on the metal product 4 or a thickness of the layer of organic material.

[0243] A laser cutting unit 42 allows various cuts to be made, for example with the possibility of slitting the metal product 4, sectioning the metal product 4 or cutting shapes in the metal product 4.

[0244] Cutting is easily adapted and maintenance is easy, especially compared to a shear cutting unit using knives that perform a predetermined cut and that wear out and must be changed regularly. As illustrated in Figure 8, a production line 2 comprising a laser removal unit 32 can also be configured for processing a stream of separate metal products 4, such as metal plates, each metal product 4 being processed individually by successively passing through a plurality of processing units including the removal unit 32.

[0245] In exemplary embodiments, the processing units comprise a shaping unit 100 configured to shape the metal product 4. The shaping unit 100 is for example configured to plastically deform the metal product 4 to give it a desired three-dimensional shape. The shaping unit 100 is for example configured to receive the flat metal product 4 or already shaped for example in another shaping unit of the production line, comprising several successive shaping units.

[0246] The shaping unit 100 comprises one or more shaping tools 102 configured to bear on surfaces 4A of the metal product 4 to shape it by plastic deformation.

[0247] The presence of a layer of organic material such as a lubricant on the surfaces 4A makes it possible to limit the friction between the surfaces 4A and the shaping elements 102 and to limit the risks of damaging or marking the metal product 4 in an unwanted manner.

[0248] The shaping unit 100 is for example a stamping unit, configured to shape the metal product by pressing the metal product 4 between two shaping elements 102 which are stamping dies.

[0249] The removal unit 34 is arranged in the production line downstream of the shaping unit to remove the layer of organic material covering the surfaces 4A of the metal product 4.

[0250] The removal unit 34 allows the removal of the layer of organic matter from each surface 4A although the surfaces 4A are no longer flat but three-dimensional in shape.

Claims

CLAIMS 1. Production line for the treatment of a metal product (4), the production line comprising several treatment units for carrying out successive treatments of the metal product (4), the treatment units including a laser removal unit (32) configured for the removal of a layer of organic material from one or more surfaces (4A) of the metal product (4), the removal unit (32) comprising at least one laser removal device (34), each laser removal device (34) being configured to generate a laser beam and direct it onto a surface (4A) to be treated so as to remove the layer of organic material.

2. Production line according to claim 1, in which the laser beam is generated so as to vaporize the layer of organic material covering the surface (4A) to be treated.

3. Production line according to claim 1 or claim 2, wherein the laser beam is generated so as to push and / or scrape the layer of organic matter along the surface (4A) to be treated.

4. Production line according to claim 3, wherein the laser beam is generated so as to pass through the layer of organic material and superficially heat the surface (4A) of the metal product (4) to vaporize a portion of the organic material at the interface between the layer of organic material and the surface (4A) to be treated and push the other portion of the organic material away from the surface (4A) to be treated.

5. Production line according to any one of the preceding claims, wherein the removal unit (32) comprises a measuring device configured to measure parameters of the organic material layer covering each surface (4A), each laser removal device (34) being configured to control parameters of the laser beam and the direction of the laser beam according to the parameters of the organic material layer measured.

6. A production line according to any preceding claim, wherein the parameters of the laser beam include one or more of the following parameters: a wavelength of the laser beam, a frequency of the laser beam, a power density of the laser beam, an energy density of the laser beam, a pulse duration of the laser beam in the case of a pulsed laser removal device, a pulse energy of the laser beam, a scanning speed of the laser beam, an overlap rate between laser beams, an interaction time laser-material, the overlap between the laser impacts of the laser beam emitted by the laser removal device.

7. Production line according to claim 5 or claim 6, wherein the parameters of the organic material layer include a thickness of the organic material layer, a weight of the organic material layer, a composition of the organic material and / or a rate of metallic or non-metallic particles contained in the organic material.

8. Production line according to any one of claims 5 to 7, wherein the measuring device comprises one or more fluorescence sensors.

9. Production line according to claim 8, wherein each fluorescence sensor comprises a radiation source (112), in particular in the ultraviolet frequency range, for generating excitation radiation (R1) towards the surface to be treated, and a photosensitive device (114) configured to detect fluorescence radiation (R2) emitted by the layer of organic matter excited by the excitation radiation.

10. Production line according to claims 8 and 9, wherein the wavelength of the excitation radiation is for example located in a wavelength range between 1 nm and 380 nm, preferably between 300 nm and 380 nm, more preferably between 345 nm and 380 nm.

11. Production line according to claim 9 or 10, wherein the photosensitive device (114) is for example sensitive to radiation in a wavelength range between 380 nm and 780 nm, preferably between 380 nm and 540 nm, more preferably between 420 nm and 500 nm.

12. Production line according to any one of claims 5 to 11, wherein the measuring device comprises measuring sensors (34D) including one or more cameras, one or more laser-induced plasma atomic emission spectrometry devices and / or one or more Fourier transform infrared spectroscopy devices.

13. Production line according to any one of the preceding claims, in which the removal unit (32) is configured for the evacuation of the organic matter covering the surface (4A) to be treated by gravity.

14. Production line according to any one of the preceding claims, wherein the removal unit (32) is configured to remove a layer of organic matter from each surface (4A) to be treated when the surface (4A) to be treated extends along a plane inclined relative to a horizontal plane, in particular along a plane substantially vertical, so as to evacuate the organic matter removed from the surface to be treated by gravity.

15. Production line according to any one of the preceding claims, configured for the scrolling of the metal product (4) along a scroll path during production, the removal unit (32) being configured to remove the layer of organic material from each surface to be treated during the scrolling of the metal product.

16. Production line according to claim 8, wherein the processing units comprise, along the scroll path, a heat treatment furnace (8), preferably induction, and / or a pickling unit (10), preferably laser, and / or a coil unwinding station (20) located at the upstream end of the scroll path for unwinding the metal product from a coil, and / or a metal product winding station (24) located at a downstream end of the scroll path for winding the metal product and forming a coil, and / or a de-strapping unit (92) configured to cut one or more ligatures from a coil of metal product, in particular by cutting each ligature with a laser, and / or a cutting unit configured for cutting a rear end of the metal product unwound from a coil,and / or a welding unit configured to weld a rear end of the metal product to a front end of another metal product, and / or a cutting unit (44) configured to cut the metal product, for example edges of the metal product, and, optionally, to cut each cut edge into chips, preferably by laser., 17. Production line according to any one of the preceding claims, configured for the production of a metal strip, a metal wire, a metal bar and / or a metal tube.

18. Production line according to any one of claims 1 to 16, configured for the production of metal parts from separate metal plates.

19. Production line according to claim 18, wherein the processing units comprise a shaping unit (100) configured for shaping each plate so as to form a metal part, for example by stamping and / or bending.

20. Method for producing a metal product by passing the metal product through several processing units for carrying out successive treatments of the metal product, comprising the removal of a layer of organic material by laser from one or more surfaces (4A) of the metal product, the removal of the organic material of each surface (4A) being carried out by generating at least one laser beam and directing it onto the surface to be treated so as to remove the layer of organic matter.

21. Production method according to claim 20, wherein the laser beam is generated so as to vaporize the organic material covering the surface (4A) to be treated.

22. Production method according to claim 20, wherein the laser beam is generated in such a way as to push and / or scrape the organic matter along the surface (4A) to be treated.

23. A production method according to claim 22, wherein the laser beam is generated so as to pass through the layer of organic matter and superficially heat the surface (4A) to be treated to vaporize a portion of the organic matter at the interface between the organic matter and the metal and generate vapor pushing the other portion of the organic matter away from the surface (4A) to be treated.

24. A production method according to any one of claims 20 to 23, comprising measuring parameters of the organic material layer covering each surface and controlling the parameters and direction of each laser beam directed onto the surface as a function of the measured organic material layer parameters.

25. The production method of claim 24, wherein the parameters of the laser beam include one or more of the following: a wavelength of the laser beam, a frequency of the laser beam, a power density of the laser beam, an energy density of the laser beam, a pulse duration of the laser beam in the case of a pulsed laser, a laser energy, a scanning speed of the laser beam, an overlap rate between laser beams, a laser-matter interaction time, and the overlap between laser impacts of the laser beam.

26. A production method according to claim 24 or claim 25, wherein the parameters of a layer of organic material include a thickness of the layer of organic material, a basis weight of the layer of organic material, a composition of the organic material and / or a rate of metallic or non-metallic particles contained in the organic material.

27. Production method according to any one of claims 24 to 26, wherein the measurement is carried out using one or more fluorescence sensors.

28. Production method according to claim 27, wherein each fluorescence sensor comprises a radiation source, in particular in the ultraviolet frequency range, for generating excitation radiation towards the surface to be treated, and a photosensitive device configured to detect excitation radiation. fluorescence emitted by the layer of organic matter excited by the excitation radiation.

29. Production method according to claim 28, wherein the wavelength of the excitation radiation is for example in a wavelength range between 1 nm and 380 nm, preferably between 300 nm and 380 nm, more preferably between 345 nm and 380 nm.

30. Production method according to claim 28 or 29, wherein the photosensitive device (114) is for example sensitive to radiation in a wavelength range between 380 nm and 780 nm, preferably between 380 nm and 540 nm, more preferably between 420 nm and 500 nm.

31. A production method according to any one of claims 20 to 30, wherein the metal product is processed while it is being scrolled along a scroll path, the metal product being for example a metal strip, a metal wire, a metal bar or a metal tube.

32. Production method according to any one of claims 20 to 31, in which the metal product is a metal part obtained by shaping a metal plate.

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