Image sensor module and camera module including same

Abstract

A camera module according to an embodiment of the present invention includes: a substrate; a sensor base disposed on the substrate; a shield can disposed to surround the sensor base; an adhesive disposed between the outer surface of the shield can and the substrate; and a corrosion prevention layer formed on the outer surface of the shield can, wherein a groove is formed to expose the shield can, the corrosion prevention layer of the shield can, and the sensor base, and the adhesive is disposed in the groove.

Description

Image sensor module and camera module including the same

[0001] The present invention relates to an image sensor module and a camera module including the same.

[0002] Mobile devices, computers, laptops, and vehicles are equipped with cameras that can display or capture images of their surroundings. As mobile devices become slimmer and computers and laptops become smaller, the demand for compact, lightweight, and high-quality cameras grows.

[0003] Camera devices require optical image stabilization (OIS) to compensate for image shake caused by the user's movements to enhance image quality. This is accomplished by moving the lens perpendicular to the optical axis.

[0004] The EMI shield (Electromagnetic Interference Shield) on a camera module is a protective device used to block electromagnetic interference. Inside electronic devices, multiple electronic components generate signals of different frequencies, which can cause mutual interference.

[0005] EMI shielding cans, usually made of metal, surround the camera module to block external electromagnetic interference from affecting the internal circuitry. They also prevent electromagnetic waves from escaping from the camera module, preventing them from affecting other electronic components. Especially for high-precision components like camera modules, electromagnetic interference is a major cause of performance degradation, so EMI shielding cans play a crucial role in maintaining camera image quality.

[0006] The technical problem that the invention seeks to solve is to provide an image sensor module and a camera module including the same.

[0007] In order to solve the above technical problem, a camera module according to the present embodiment includes a substrate; a sensor base disposed on the substrate; a shield can disposed to surround the sensor base; an adhesive disposed between an outer surface of the shield can and the substrate; and a corrosion-preventive layer formed on an outer surface of the shield can, wherein a groove is formed to expose the shield can, the corrosion-preventive layer of the shield can, and the sensor base, and the adhesive is disposed in the groove.

[0008] The above groove is formed in a cone shape, and the vertex of the cone-shaped groove can be formed on the sensor base.

[0009] In the cross-section of the above groove, the angle formed by one boundary surface and the other boundary surface that meet the vertex of the groove can be formed to be 10 to 120 degrees.

[0010] The shield can comprises copper, and the corrosion-preventing layer of the shield can comprises at least one of nickel, chromium, and stainless steel.

[0011] In order to solve the above technical problem, a camera module according to the present embodiment comprises: a substrate; a sensor base disposed on the substrate; a shield can disposed to surround the sensor base and having a corrosion-preventive layer formed on a surface thereof; and a groove formed to expose the shield can, the corrosion-preventive layer of the shield can, and the sensor base, and an adhesive is disposed between the groove, the surface of the corrosion-preventive layer of the shield can, and the substrate.

[0012] In the cross-section of the above groove, the angle formed by one boundary surface and the other boundary surface that meet the vertex of the groove can be formed to be 10 to 120 degrees.

[0013] The shield can may include copper, and the corrosion-preventing layer of the shield can may include at least one of nickel, chromium, and stainless steel.

[0014] It may include a lens module disposed on the sensor base; and an image sensor disposed on the substrate.

[0015] In order to solve the above technical problem, an image sensor module according to an embodiment of the present invention includes: a substrate; an image sensor fixed on the substrate with an adhesive member; an electronic component disposed on the substrate; and silk ink disposed between the image sensor and the electronic component.

[0016] The above silk ink can be arranged in a line shape in the outer area of ​​the image sensor.

[0017] The image sensor includes a first side, a second side opposite the first side, a third side, and a fourth side opposite the third side, and the silk ink can be arranged along at least one of the first to fourth sides of the image sensor.

[0018] The thickness of the adhesive member from the substrate can be formed to be 10 to 100 times greater than the thickness of the silk ink from the substrate.

[0019] The thickness of the adhesive member from the substrate may be formed to be 100 um to 1000 um, and the thickness of the silk ink from the substrate may be formed to be 8 um to 12 um.

[0020] The above adhesive material may include epoxy, and the silk ink may include plastic resin.

[0021] In order to solve the above technical problem, a camera module according to an embodiment of the present invention includes: a lens module; a lens driving device for driving the lens module; a substrate on which the lens driving device is disposed; an image sensor fixed on the substrate with an adhesive member; an electronic component disposed on the substrate; and silk ink disposed between the image sensor and the electronic component.

[0022] The thickness of the adhesive member from the substrate can be formed to be 10 to 100 times greater than the thickness of the silk ink from the substrate.

[0023] The thickness of the adhesive member from the substrate may be formed to be 100 um to 1000 um, and the thickness of the silk ink from the substrate may be formed to be 8 um to 12 um.

[0024] The above adhesive material may include epoxy, and the silk ink may include plastic resin.

[0025] According to the present embodiments, by forming a minimum notch structure on the surface of the shield can, the influence from an external electromagnetic field can be minimized, while the grounding efficiency can be increased, and electromagnetic interference between adjacent components inside can be minimized.

[0026] In addition, it can improve processability and reliability by blocking RBO (Resin Bleed Out) that may occur during the epoxy bonding process.

[0027] Figure 1 is an exploded perspective view of a camera module according to the present embodiment.

[0028] Fig. 2 is a cross-sectional view of a camera module according to the present embodiment.

[0029] Figure 3 is a cross-sectional view of the side of an existing camera module.

[0030] Figure 4 is an enlarged view of area A shown in Figure 2.

[0031] Figures 5 to 9 are drawings for explaining a camera module according to the present embodiment.

[0032] Figure 10 is an exploded perspective view of a camera module according to another embodiment of the present invention.

[0033] Figure 11 is a drawing to explain the existing RBO (Resin Bleed Out) phenomenon.

[0034] Figures 12 to 14 are drawings for explaining an image sensor module according to the present embodiment.

[0035] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0036] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0037] In addition, terms (including technical and scientific terms) used in this embodiment may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which this embodiment belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0038] Additionally, the terms used in this embodiment are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0039] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0040] Additionally, in describing the components of this embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0041] And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, it may include not only cases where the component is 'connected', 'coupled', or 'connected' directly to the other component, but also cases where the component is 'connected', 'coupled', or 'connected' by another component between the component and the other component.

[0042] Additionally, when described as being formed or arranged "above" or "below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," the meaning may include not only the upward direction but also the downward direction based on one component.

[0043] FIG. 1 is an exploded perspective view of a camera module according to the present embodiment, FIG. 2 is a cross-sectional view of a camera module according to the present embodiment, FIG. 3 is a cross-sectional view of a side of a conventional camera module, FIG. 4 is an enlarged view of area A shown in FIG. 2, and FIGS. 5 to 9 are drawings for explaining a camera module according to the present embodiment.

[0044] The camera module according to the present embodiment can capture at least one of an image and a video. The camera module may be a camera assembly. The camera module may be a camera unit. The camera module may include a lens driving device. The lens driving device can drive the lens module and move the lens module in the optical axis direction. The camera module may include a lens module (100) placed on a sensor base (200) without a lens driving device.

[0045] The camera module may include a lens module (100). The lens module (100) may be disposed on a sensor base (200). The lens module (100) may include at least one lens. The lens module (100) is coupled to the sensor base (200) and may include a plurality of lenses and a lens barrel. The lens module (100) may be alternatively referred to as a “lens,” a “lens unit,” or a “lens assembly.” The lens barrel may accommodate a plurality of lenses. The lenses may be disposed at a position corresponding to the image sensor (400).

[0046] The camera module may include a filter (500). The filter (500) may block light of a specific frequency band from passing through the lens module (100) from being incident on the image sensor (400). The filter (500) may be arranged parallel to the xy plane. The filter (500) may be arranged between the lens module (100) and the image sensor (400). The filter (500) may be arranged on the sensor base (200). The filter (500) may include an infrared filter. The infrared filter may block light in the infrared region from being incident on the image sensor (400).

[0047] The camera module may include a sensor base (200). The sensor base (200) may be disposed on a substrate (300). The sensor base (200) may include a protrusion on which a filter (500) is disposed. An opening may be formed in a portion of the sensor base (200) on which the filter (500) is disposed so that light passing through the filter (500) may be incident on the image sensor (400).

[0048] The camera module may include a substrate (300). The substrate (300) may be a printed circuit board (PCB) or a circuit board. A sensor base (200) may be placed on the substrate (300). An image sensor (400) may be placed on the substrate (300). Various circuits, components, control units, etc. may be provided on the substrate (300) to convert an image formed on the image sensor (400) into an electrical signal and transmit it to an external device.

[0049] The camera module may include an image sensor (400). The image sensor (400) may be configured to form an image by receiving light that has passed through a lens and a filter (500). The image sensor (400) may be mounted on a substrate (300). The image sensor (400) may be electrically connected to the substrate (300). For example, the image sensor (400) may be coupled to the substrate (300) using surface mounting technology (SMT). As another example, the image sensor (400) may be coupled to the substrate (300) using flip chip technology. The image sensor (400) may be arranged such that its optical axis is aligned with that of the lens. That is, the optical axis of the image sensor (400) and the optical axis of the lens may be aligned. The image sensor (400) may convert light irradiated to an effective image area of ​​the image sensor (400) into an electrical signal. The image sensor (400) may be any one of a CCD (charge coupled device), a MOS (metal oxide semi-conductor), a CPD, and a CID.

[0050] The camera module may include a shield can (210) arranged to surround the sensor base (200). The shield can (210) may be arranged to surround the lens module (100) and the sensor base (200). The shield can (210) may be arranged on a substrate (300). The shield can (210) may be a shielding film for shielding EMI (Electromagnetic Interference). The shield can (210) is a protective device used to block electromagnetic interference. The shield can (210) may prevent electromagnetic waves inside the camera module from escaping to the outside and may block external electromagnetic interference from affecting the internal circuit of the camera module.

[0051] The shield can (210) may be made of a metal material. The shield can (210) may include copper (Cu). The shield can (210) may be made of a metal containing a lot of free electrons, and thus may improve its shielding function by being grounded. If the shield can (210) is made of a metal containing a lot of free electrons, there is a problem of it being easily corroded, so a corrosion-prevention layer (220) may be formed on the surface of the shield can (210) to prevent corrosion. The corrosion-prevention layer (220) may be formed on the outer surface of the shield can (210). The corrosion-prevention layer (220) of the shield can (210) may include at least one of nickel (Ni), chromium (Cr), and stainless steel (SUS). The metal forming the corrosion-prevention layer (220) does not contain a lot of free electrons, and thus has a disadvantage of low grounding efficiency even when directly grounded with the ground.

[0052] In order to solve this problem, the camera module according to the present embodiment may have a groove (g) formed through the shield can (210), the corrosion-preventing layer (220) of the shield can (210), and the sensor base (200). The groove (g) may expose the shield can (210), the corrosion-preventing layer (220), and the sensor base (200). An adhesive (10) may be disposed between the groove (g), the surface of the corrosion-preventing layer (220) of the shield can (210), and the substrate (300). The adhesive (10) may be disposed between the outer surface of the shield can (210) and the substrate (300). The adhesive (10) may be an epoxy containing silver (Ag) that contains more free electrons than copper (Cu) forming the shield can (210). The adhesive (10) may be in contact with the ground of the substrate (300).

[0053] The groove (g) can be formed by piercing the outer surface of the shield can (210) with a sharp tool such as a needle. The groove (g) can be formed in a cone shape. The vertex of the cone-shaped groove (g) can be formed on the sensor base (200). The vertex of the cone-shaped groove (g) can be formed on the shield can (210). The shape of the groove (g) can be formed in various shapes such as a notch or a scratch. The angle formed between one boundary surface and the other boundary surface that meet the vertex of the groove (g) in the cross section of the groove (g) can be formed at 10 to 120 degrees. Through this, the contact area between the shield can (210) and the adhesive (10) can be expanded, and the grounding efficiency can be increased.

[0054] When an adhesive (10) is placed inside a home (g), it may include a surface (S1) where the sensor base (200) and the adhesive (10) come into contact, a surface (S2) where the shield can (210) and the adhesive (10) come into contact, a surface (S3) where the grounding prevention layer connected to the substrate (300) comes into contact with the adhesive (10), and a surface (S4) where the grounding prevention layer connected to the home (g) comes into contact with the adhesive (10). As the surface (S2) where the shield can (210) and the adhesive (10) come into contact becomes wider, the resistance decreases, and thus the grounding efficiency can be increased.

[0055]

[0056] Fig. 5(a) illustrates the mutual resistance measured on each surface of stainless steel and copper without applying epoxy, and Fig. 5(b) illustrates the mutual resistance measured on each surface of stainless steel and copper with epoxy applied. Fig. 6 is a graph showing the resistance values ​​measured in Fig. 5.

[0057] Referring to Fig. 6, since there is almost no difference in the resistance between copper (Cu) and copper (Cu) and between copper (Cu) and stainless steel (SUS) among the data without epoxy (Ag Epoxy), it can be confirmed that the contact resistance between copper (Cu) and stainless steel (SUS) is very low. However, since the resistance between copper (Cu) and copper (Cu) with epoxy (Ag Epoxy) applied is no different from before epoxy (Ag Epoxy) application, it can be estimated that the contact resistance between copper (Cu) and epoxy (Ag Epoxy) is very low. In addition, it can be seen that the resistance between copper (Cu) and stainless steel (SUS) and between stainless steel (SUS) and stainless steel (SUS) increases, which can be judged to be an increase in resistance caused by a high contact resistance between epoxy (Ag Epoxy) and stainless steel (SUS). Accordingly, it can be estimated that the grounding efficiency is lowered because the contact resistance between the stainless steel (SUS) and epoxy (Ag Epoxy), which form the corrosion-preventing layer (220) for corrosion prevention on the surface of the shield can (210), is high.

[0058]

[0059] Fig. 7(a) illustrates forming a notch groove in a shield can, and Fig. 7(b) illustrates forming a scratch in a shield can. [No Ag Epoxy] in Fig. 8 measures resistance by connecting stainless steel (SUS) together without epoxy (Ag Epoxy), [Base] measures resistance by connecting stainless steel (SUS) together after applying epoxy (Ag Epoxy), [Notch] measures resistance by applying epoxy (Ag Epoxy) to a notch groove penetrating stainless steel (SUS), copper (Cu), and glass, and [Scratch] measures resistance by scratching stainless steel (SUS) and copper (Cu) so that they are exposed and applying epoxy (Ag Epoxy). Fig. 9 is a graph showing the values ​​of resistance measured in Fig. 8.

[0060] Referring to FIG. 9, it can be confirmed that the resistance value measured by applying epoxy (Ag Epoxy) to the surface where copper (Cu) is exposed through a notch or scratch is significantly lower than the resistance value measured by applying epoxy (Ag Epoxy) to the stainless steel surface. That is, when epoxy (Ag Epoxy) is applied to the surface where copper (Cu) is exposed, since the resistance is low, the electromagnetic wave formed in the internal structure of the camera module can flow through the shield can (210) and escape to the ground well through the epoxy (Ag Epoxy). Therefore, the camera module according to the present embodiment can minimize deformation of the corrosion-preventing layer (220) of the shield can (210) while increasing the grounding efficiency.

[0061]

[0062] Fig. 10 is an exploded perspective view of a camera module according to another embodiment of the present invention. Hereinafter, a camera module according to another embodiment of the present invention will be described with reference to Fig. 10.

[0063] The camera device (1110A) may include a camera module. The camera device (1110A) may include a lens module (1120). The lens module (1120) may include at least one lens. The lens may be positioned corresponding to the image sensor (1130). The lens module (1120) may include a lens and a barrel. The lens module (1120) may be coupled to a bobbin of a lens driving device (1110B). The lens module (1120) may be coupled to the bobbin by screw coupling and / or adhesive. The lens module (1120) may move integrally with the bobbin.

[0064] The camera device (1110A) may include a filter (1400). The filter (1400) may block light of a specific frequency band from passing through the lens module (1120) from being incident on the image sensor (1130). The filter (1400) may be arranged parallel to the xy plane. The filter (1400) may be arranged between the lens module (1120) and the image sensor (1130). The filter (1400) may be arranged on the sensor base (1142). Alternatively, the filter (1400) may be arranged on the base of the lens driving device (1110B). The filter (1400) may include an infrared filter. The infrared filter may block light in the infrared region from being incident on the image sensor (1130).

[0065] The camera device (1110A) may include a sensor base (1142). The sensor base (1142) may be disposed between the lens driving device (1110B) and the printed circuit board (1150). The sensor base (1142) may include a protrusion (1141) on which a filter (1400) is disposed. An opening may be formed in a portion of the sensor base (1142) on which the filter (1400) is disposed so that light passing through the filter (1400) may be incident on the image sensor (1130). An adhesive member (1145) may couple or adhere the base of the lens driving device (1110B) to the sensor base (1142). The adhesive member (1145) may additionally serve to prevent foreign substances from entering the interior of the lens driving device (1110B). The adhesive member (1145) may include at least one of an epoxy, a thermosetting adhesive, and an ultraviolet-curable adhesive.

[0066] The camera device (1110A) may include a printed circuit board (1150) (PCB, Printed Circuit Board). The printed circuit board (1150) may be a substrate or a circuit board. A lens driving device (1110B) may be disposed on the printed circuit board (1150). A sensor base (1142) may be disposed between the printed circuit board (1150) and the lens driving device (1110B). The printed circuit board (1150) may be electrically connected to the lens driving device (1110B). An image sensor (1130) may be disposed on the printed circuit board (1150). Various circuits, components, control units, etc. may be provided on the printed circuit board (1150) to convert an image formed on the image sensor (1130) into an electrical signal and transmit the signal to an external device.

[0067] The camera device (1110A) may include an image sensor (1130). The image sensor (1130) may be configured to form an image by receiving light passing through a lens and a filter (1400). The image sensor (1130) may be mounted on a printed circuit board (1150). The image sensor (1130) may be electrically connected to the printed circuit board (1150). For example, the image sensor (1130) may be coupled to the printed circuit board (1150) using surface mounting technology (SMT). As another example, the image sensor (1130) may be coupled to the printed circuit board (1150) using flip chip technology. The image sensor (1130) may be arranged so that its optical axis is aligned with that of the lens. That is, the optical axis of the image sensor (1130) and the optical axis of the lens can be aligned. The image sensor (1130) can convert light irradiated to the effective image area of ​​the image sensor (1130) into an electrical signal. The image sensor (1130) can be any one of a CCD (charge coupled device), a MOS (metal oxide semi-conductor), a CPD, and a CID.

[0068] The camera device (1110A) may include a motion sensor (1170). The motion sensor (1170) may be mounted on a printed circuit board (1150). The motion sensor (1170) may be electrically connected to a control unit (1180) through a circuit pattern provided on the printed circuit board (1150). The motion sensor (1170) may output rotational angular velocity information due to the movement of the camera device (1110A). The motion sensor (1170) may include a two-axis or three-axis gyro sensor or an angular velocity sensor.

[0069] The camera device (1110A) may include a control unit (1180). The control unit (1180) may be disposed on a printed circuit board (1150). The control unit (1180) may be electrically connected to the AF coil and the OIS coil of the lens driving device (1110B). The control unit (1180) may individually control the direction, intensity, amplitude, etc. of the current supplied to the AF coil and the OIS coil. The control unit (1180) may control the lens driving device (1110B) to perform an autofocus function and / or an image stabilization function. Furthermore, the control unit (1180) may perform autofocus feedback control and / or image stabilization feedback control for the lens driving device (1110B).

[0070] The camera device (1110A) may include a connector (1190). The connector (1190) may be electrically connected to a printed circuit board (1150). The connector (1190) may include a port for electrically connecting to an external device.

[0071]

[0072] Fig. 11(a) illustrates the occurrence of the RBO phenomenon (arrow part) in the process of mounting an image sensor on a substrate, and Fig. 11(b) illustrates the occurrence of the RBO phenomenon (arrow part) in the process of mounting a housing on a substrate. The RBO (Resin Bleed Out) phenomenon refers to a phenomenon in which the volatile components of the epoxy used in the substrate manufacturing process spread to the substrate surface under conditions such as high temperature or high pressure. In the process of mounting electronic components on a substrate using epoxy, the RBO phenomenon occurs depending on the characteristics of the epoxy or the characteristics of the surface to which the epoxy is to be applied. The RBO phenomenon causes surface defects on the substrate, and can lower the performance or reliability of electronic products due to poor bonding.

[0073] Figures 12 to 14 are drawings for explaining an image sensor module according to the present embodiment.

[0074] An image sensor module according to the present embodiment may include a substrate (1150), an image sensor (1130), an electronic component (1152), and silk ink (1160).

[0075] The image sensor (1130) may be fixed on a substrate (1150) using an adhesive member (1131). The adhesive member (1131) may be placed between the image sensor (1130) and the substrate (1150). The adhesive member (1131) may be applied to an area (S) on the substrate (1150) where the image sensor (1130) is placed. The adhesive member (1131) may be epoxy. The adhesive member (1131) may include epoxy.

[0076] An electronic component (1152) may be placed in an area adjacent to the image sensor (1130). The electronic component (1152) may be placed on the substrate (1150). The electronic component (1152) may be a plating pad area connected to the image sensor (1130) by a wire. The image sensor (1130) may include a first side, a second side opposite the first side, a third side, and a fourth side opposite the third side. The electronic component (1152) may be placed on at least one side among the first to fourth sides of the image sensor (1130).

[0077] The silk ink (1160) may be disposed between the image sensor (1130) and the electronic component (1152). The silk ink (1160) may be disposed in a line shape on the outer area of ​​the image sensor (1130). The silk ink (1160) may be disposed in a square ring shape on the outer area of ​​the image sensor (1130). The silk ink (1160) may be disposed along at least one side of the first to fourth side surfaces of the image sensor (1130). The silk ink (1160) may be disposed along the side surface of the electronic component (1152) facing the image sensor (1130).

[0078] Silk ink (1160) is an ink used in the silk screen printing process in the substrate manufacturing process, and can be used to print information such as part numbers, circuit diagrams, logos, and warning signs on the surface of the substrate. Silk ink (1160) may include plastic resins and dyes. Silk ink (1160) has high adhesive strength and chemical resistance, and can be cured through heat or UV light after being applied to the substrate.

[0079] Referring to FIG. 13, a dam phenomenon occurs in which the adhesive (1131) does not spread beyond the silk ink (1160) due to a surface energy barrier between the adhesive (1131) and the silk ink (1160). Surface energy refers to the energy that appears when molecules existing on the surface of a specific material interact with the surrounding environment. Materials with high surface energy can easily adhere to or mix with other materials. There is a difference in surface energy between the adhesive (1131) containing epoxy and the silk ink (1160), which forms a surface energy barrier. Due to the surface energy barrier, the adhesive (1131) and the silk ink (1160) do not mix, and the adhesive (1131) cannot disperse beyond the silk ink (1160).

[0080] Referring to FIG. 14, the thickness (L1) of the adhesive member (1131) from the substrate (1150) can be formed to be 10 to 100 times greater than the thickness (L2) of the silk ink (1160) from the substrate (1150), and preferably, 80 to 90 times greater. The thickness of the adhesive member (1131) from the substrate (1150) can be formed to be 100 um to 1000 um, and preferably, 800 um to 900 um. The thickness of the silk ink (1160) from the substrate (1150) can be formed to be 8 um to 12 um, and preferably, 9 to 11 um. The width (L3) of the silk ink (1160) may be formed to be 30 um to 50 um, and preferably, 35 um to 45 um. The adhesive member (1131) and the silk ink (1160) may be spaced apart from each other. The adhesive member (1131) and the silk ink (1160) may be arranged to be in contact with each other.

[0081] Through this, the adhesive member (1131) is applied in a sufficient amount to fix the image sensor (1130) to the substrate (1150), but is prevented from spreading by the silk ink (1160), so as not to affect the electronic component (1152). In addition, the silk ink (1160) can prevent the RBO phenomenon of the adhesive member (1131) even with an amount and area much smaller than the amount of the adhesive member (1131) applied, so it is advantageous in design for the arrangement and space utilization of the electronic component (1152) on the substrate (1150).

[0082] Those skilled in the art will appreciate that the present invention can be implemented in modified forms without departing from the essential characteristics of the above-described description. Therefore, the disclosed methods should be considered illustrative rather than restrictive. The scope of the present invention is set forth in the claims, not the foregoing description, and all differences within the scope equivalent thereto should be construed as being encompassed by the present invention.

Claims

1. Substrate; A sensor base disposed on the above substrate; A shield can arranged to surround the above sensor base; An adhesive disposed between the outer surface of the shield can and the substrate; and Including a corrosion-preventing layer formed on the outer surface of the shield can, A groove is formed to expose the shield can, the corrosion-preventing layer of the shield can, and the sensor base, The above adhesive is a camera module placed in the above groove.

2. In paragraph 1, The above home is formed in a cone shape, A camera module in which the vertex of the above cone-shaped groove is formed on the sensor base.

3. In paragraph 1, A camera module in which the angle formed between one boundary surface and the other boundary surface that meets the vertex of the groove in the cross-section of the groove is 10 to 120 degrees.

4. In paragraph 1, The above shield can contains copper, A camera module wherein the corrosion-preventing layer of the shield can comprises at least one of nickel, chromium, and stainless steel.

5. Substrate; A sensor base disposed on the above substrate; A shield can arranged to surround the sensor base and having a corrosion-preventing layer formed on the surface; and A groove is formed to expose the shield can, the corrosion-preventing layer of the shield can, and the sensor base, A camera module in which an adhesive is placed between the surface of the corrosion-preventing layer of the above-mentioned home, the above-mentioned shield can, and the above-mentioned substrate.

6. In paragraph 5, A camera module in which the angle formed between one boundary surface and the other boundary surface that meets the vertex of the groove in the cross-section of the groove is 10 to 120 degrees.

7. In paragraph 5, The above shield can may contain copper, A camera module wherein the corrosion-preventing layer of the shield can comprises at least one of nickel, chromium, and stainless steel.

8. In paragraph 5, a lens module disposed on the sensor base; and A camera module including an image sensor disposed on the above substrate.

9. Substrate; An image sensor fixed on the above substrate with an adhesive member; Electronic components arranged on the substrate; and An image sensor module comprising silk ink disposed between the image sensor and electronic components.

10. In paragraph 9, An image sensor module in which the above silk ink is arranged in a line shape in the outer area of the image sensor.

Images