Electronic device and radiator therefor

Abstract

An electronic device and a radiator (1) for the electronic device. The radiator (1) comprises: a radiator body (13) made of a thermally conductive material; and a heat dissipation tube (2) embedded in a groove on one surface (12) of the radiator body (13), wherein the heat dissipation tube (2) comprises: a tubular body, an accommodating cavity (20) in a length direction of the tubular body being defined inside the tubular body, and two ends of the accommodating cavity (20) being closed; and a refrigerant filling the accommodating cavity (20) of the tubular body. The radiator (1) improves the heat dissipation capability of the electronic device.

Description

Electronic device and heat sink therefor Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic devices, and more particularly, to a heat sink for electronic devices. Background Art

[0002] The inverter is used in the electric drive module of new energy vehicles. It is also called a motor controller. It can convert the high-voltage direct current of the power battery into three-phase alternating current with variable frequency and current. At the same time, it rectifies the three-phase alternating current generated by the motor into direct current to charge the power battery during energy recovery. The important component on the inverter is called the power module, which usually includes a ceramic substrate and a power chip. Power chips such as SiC power chips or IGBT power chips will emit a lot of heat when working. The power chip is generally brazed or sintered to the ceramic substrate. The ceramic substrate (AMB) generally includes a ceramic layer and a copper layer on both sides of the ceramic layer. It carries the power chip and provides heat conduction and electrical insulation. In existing designs, the chip module can be welded as a whole to a heat sink made of aluminum-based material. However, the power chip generates a lot of heat, and there are heat concentration points and large temperature gradients on the heat sink.

[0003] Graphene is a single layer of carbon molecules arranged in two dimensions. Due to its excellent electrical and thermal conductivity (typically 5200W / mK) and mechanical properties, graphene has been called the material of the future.

[0004] Summary of the Invention

[0005] The purpose of this application is to solve or at least alleviate the problems existing in the prior art.

[0006] In one aspect, a heat sink for an electronic device is provided, comprising:

[0007] a heat sink body made of a thermally conductive material; and

[0008] A heat dissipation pipe embedded in a groove on one surface of the heat sink body, the heat dissipation pipe comprising:

[0009] a tubular body, wherein the tubular body defines a cavity along the length of the tubular body, and both ends of the cavity are closed; and

[0010] A refrigerant is filled in the cavity of the tubular body.

[0011] Optionally, in the embodiment of the radiator, the radiator body further comprises a coolant pipeline formed inside the radiator body, and the coolant pipeline is arranged close to the heat dissipation pipe.

[0012] Optionally, in an embodiment of the radiator, the radiator body is made of an aluminum-based material, the coolant pipe and the groove are formed when the radiator body is formed, and the radiator body also includes a coolant pipe inlet and a coolant pipe outlet connected to the coolant pipe from one side of the radiator body.

[0013] Optionally, in an embodiment of the radiator, the heat pipe is a graphene heat pipe, and the tubular body has a multi-layer structure and includes: a support layer, a carbon fiber candle wick layer outside the support layer, and a graphene layer outside the carbon fiber candle wick layer.

[0014] Optionally, in the embodiment of the radiator, the support layer is a spiral structure, the carbon fibers in the carbon fiber layer are substantially oriented along the length direction of the tubular body, and the graphene layer is composed of one or more layers of graphene film.

[0015] Optionally, in the embodiment of the radiator, the heat dissipation pipe is arranged in a circuitous manner in a specific area of ​​a surface of the radiator body.

[0016] Optionally, in an embodiment of the radiator, one or more cover plates cover a partial section of the heat pipe, wherein the one or more cover plates are copper plates, and wherein the one or more cover plates are connected to the radiator body by multiple bolts to press the heat pipe between the radiator body and the one or more cover plates.

[0017] Optionally, in the embodiment of the heat sink, the heat dissipation pipe is bonded to the heat dissipation body by a thermally conductive adhesive, and the copper deposition layer is covered on a partial section of the heat dissipation pipe by vapor deposition.

[0018] An electronic device is also provided, comprising:

[0019] printed circuit boards;

[0020] one or more chips electrically connected to the printed circuit board; and

[0021] The heat sink according to various embodiments, wherein the one or more chips are thermally coupled to a heat pipe of the heat sink.

[0022] Optionally, in an embodiment of the electronic device, the one or more chips are brazed to a copper plate or copper deposit layer covering a portion of the heat pipe via a ceramic substrate, and the ceramic substrate is further connected to a printed circuit board via a wire.

[0023] The electronic device according to the embodiments of the present application provides improved heat dissipation capability. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The disclosure of this application will be more easily understood with reference to the accompanying drawings. Those skilled in the art will readily appreciate that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the figures represent similar components, where:

[0025] FIG1 shows a cross-sectional view of an electronic device according to an embodiment;

[0026] FIG2 illustrates a partial top view of a heat sink according to an embodiment; and

[0027] FIG3 is a schematic diagram showing the working principle of a graphene heat pipe according to an embodiment. DETAILED DESCRIPTION

[0028] First, referring to Figures 1 to 3, an electronic device and a heat sink used therein according to an embodiment are shown. The electronic device includes a printed circuit board 5, one or more chips 4 electrically connected to the printed circuit board 5, and a heat sink 1 according to an embodiment thermally coupled to the one or more chips 4 to dissipate heat generated by the chips 4. The heat sink 1 includes a heat sink body 13 made of a thermally conductive material, and a heat pipe 2 embedded in a groove on one surface 12 (the top surface in the figure) of the heat sink body 13. As shown in Figure 3, the heat pipe 2 includes a tubular body defining a cavity 20 along the length of the tubular body, with both ends of the cavity 20 sealed, and a refrigerant filled in the cavity 20 of the tubular body. The refrigerant is, for example, a refrigerant capable of undergoing a gas-liquid phase transition, such as ethanol. According to an embodiment of the present invention, by using a heat pipe with a refrigerant to dissipate heat from the chips 4, such as the power module chips of an inverter, heat can be dissipated more efficiently and quickly, avoiding heat concentration points or excessive temperature gradients.

[0029] In some embodiments, the radiator body 13 further includes a coolant line 11 formed within the radiator body. The coolant line 11 is positioned adjacent to the heat pipe 2. For example, in the illustrated embodiment, the coolant line 11 and the heat pipe 2 lie parallel to each other and in close proximity, thereby enhancing heat exchange between the two. In some embodiments, the coolant line 11 and the heat pipe 2 lie parallel to the surface 12 of the radiator body. In some embodiments, the radiator body 13 can be made of an aluminum-based material, such as aluminum or an aluminum alloy. The coolant line 11 and the groove for arranging the heat pipe 2 are formed during the molding of the radiator body 13, for example, by casting. The radiator body 13 further includes a coolant line inlet 111 and a coolant line outlet 112, connected to the coolant line 11 on the same side of the radiator body (the right side in the figure). Coolant can enter the coolant line 11 through the coolant line inlet 111 and exit through the coolant line outlet 112, thereby dissipating heat from the radiator 1.

[0030] In some embodiments, the heat pipe 2 may be a graphene heat pipe. In some embodiments, the tubular body has a multilayer structure and includes: a support layer 22, a carbon fiber wick layer 21 outside the support layer 22, and a graphene layer 23 outside the carbon fiber wick layer. In some embodiments, the support layer 22 may be a spiral structure, serving as a structural support and may be made of metal or plastic. The carbon fibers in the carbon fiber layer 21 are generally oriented along the length of the tubular body, while the graphene layer 23 is composed of one or more layers of graphene film. As an example, the heat pipe 2 can be manufactured as follows: first, carbon fibers are obtained, for example, by soaking a carbon fiber bundle in acetone for 48 hours to remove the surface polymer coating. Subsequently, the carbon fiber bundle is oxidized, for example, by placing it in an ion chamber for several minutes. Subsequently, the carbon fiber bundle is bonded to the graphene film using a waterproof adhesive. A spiral structure, such as a copper bolt structure, may be provided in the heat pipe to maintain the structural stability of the heat pipe when a vacuum is generated. Subsequently, one end of the heat pipe is sealed with epoxy resin, and the other end can be connected to a vacuum device and a filling device via a Y-shaped pipe. The air in the pipe is first evacuated using the vacuum device, and then filled with a refrigerant, such as an ethanol solution. After filling, the other end is also sealed. The heat pipe can then be bent into the desired shape to be attached to the radiator body. The finished heat pipe can be tested for its sealing properties by immersing it in water.

[0031] In some embodiments, as shown in FIG2 , the heat pipes 2 are arranged in a serpentine manner in a specific region 121 of one surface 12 of the heat sink body 13. Although the heat pipes 2 are arranged in a serpentine manner in the embodiment of FIG2 , in alternative embodiments, the heat pipes 2 may be arranged in the specific region 121 of one surface 12 of the heat sink body 13 in other suitable manners or patterns.

[0032] In some embodiments, one or more cover plates 31, 32 cover a portion of the heat pipe 2. In some embodiments, the one or more cover plates 31, 32 are copper plates, for example, to facilitate thermal coupling to the one or more chips 4. In some embodiments, the one or more cover plates 31, 32 can be connected to the heat sink body 13 by a plurality of bolts 27 to compress the heat pipe 2 between the heat sink body 13 and the one or more cover plates 31, 32. In some embodiments, the bottom of the one or more cover plates 31, 32 has a shape that matches the heat pipe 2 to fully contact and exchange heat with the heat pipe 2. Similarly, the groove of the heat sink body 13 has a shape that matches the heat pipe 2 to fully contact and exchange heat with the heat pipe 2. Providing a plurality of bolts 27 can maintain sufficient contact between the heat pipe 2 and the one or more cover plates 31, 32 and the heat sink body 13.

[0033] In some embodiments, the heat pipe 2 is bonded to the heat sink body 13 using a thermally conductive adhesive, and then a copper deposition layer can be covered on a portion of the heat pipe by vapor deposition. One or more chips 4 are thermally coupled to the heat pipe 2 via the copper deposition layer. In some embodiments, as shown in FIG1 , one or more chips 4 are brazed to the copper plates 31, 32 or the copper deposition layer covering a portion of the heat pipe via a ceramic substrate 4. The ceramic substrate 4 is also connected to the printed circuit board 5 via a wire 42, such as a flexible wire. The ceramic substrate 4 may include a ceramic sheet 411 and copper bonding layers 412, 413 on both sides of the ceramic sheet 411. One or more chips 40 can be brazed or sintered to the copper bonding layer above the ceramic sheet 411, while the copper bonding layer below can be brazed to the copper plates 31, 32 or the copper deposition layer. The ceramic sheet 411 serves as a heat conductor and insulator.

[0034] Continuing to refer to Figure 3, the working method of the heat pipe 2 is described. Section A1 where the load is located in the figure can be called the evaporation section, which corresponds to the section covered by the copper plate or copper deposit layer. This section receives the heat generated by the load, such as the chip 4, causing the refrigerant in the cavity 20 to evaporate. The evaporated refrigerant passes through the insulation section A2 and condenses in the condensation section A3 and fully dissipates the heat through the radiator body. Under the action of the capillary force of the carbon fiber candle wick layer 21, the condensed refrigerant returns to the evaporation section A1 along the carbon fiber candle wick layer 21 and circulates in sequence. The addition of the heat pipe 2 effectively reduces the generation of heat concentration points in the radiator.

[0035] The specific embodiments described above are intended only to more clearly illustrate the principles of the present invention, wherein the various components are clearly shown or described to facilitate understanding of the principles of the present invention. Those skilled in the art may readily make various modifications or variations to the present invention without departing from the scope of the present invention. It should be understood that such modifications or variations are intended to be encompassed within the scope of the present invention.

Claims

1. A heat sink for an electronic device, comprising: a heat sink body (13) made of a heat-conducting material; as well as A heat dissipation pipe (2) embedded in a groove on a surface (12) of the heat dissipation body (13), the heat dissipation pipe (2) comprising: A tubular body, wherein the interior of the tubular body defines a cavity (20) along the length direction of the tubular body, and the cavity (20) is closed at both ends; as well as A refrigerant is filled in the cavity (20) of the tubular body.

2. The radiator according to claim 1, characterized in that The radiator body further comprises a coolant pipeline (11) formed inside the radiator body, and the coolant pipeline (11) is arranged close to the heat dissipation pipe (2).

3. The radiator according to claim 2, characterized in that The radiator body (13) is made of an aluminum-based material, the coolant pipeline (11) and the groove are formed when the radiator body (13) is formed, and the radiator body also includes a coolant pipeline inlet (111) and a coolant pipeline outlet (112) connected to the coolant pipeline (11) from one side of the radiator body.

4. The radiator according to claim 1, wherein The heat dissipation pipe (2) is a graphene heat pipe, and the tubular body has a multi-layer structure and comprises: a support layer (22), a carbon fiber candle wick layer (21) outside the support layer (22), and a graphene layer (23) outside the carbon fiber candle wick layer (21).

5. The radiator according to claim 4, characterized in that The supporting layer (22) is a spiral structure, the carbon fibers in the carbon fiber layer (21) are substantially oriented along the length direction of the tubular body, and the graphene layer (23) is composed of one or more layers of graphene film.

6. The radiator according to any one of claims 1 to 5, characterized in that: The heat dissipation pipe (2) is arranged in a circuitous manner in a specific area (121) of a surface (12) of the radiator body.

7. The radiator according to any one of claims 1 to 5, characterized in that: One or more cover plates (31, 32) cover a partial section of the heat pipe, wherein the one or more cover plates (31, 32) are copper plates, and wherein the one or more cover plates (31, 32) are connected to the radiator body via a plurality of bolts (27) to press the heat pipe between the radiator body and the one or more cover plates.

8. The radiator according to any one of claims 1 to 5, characterized in that: The heat dissipation pipe (2) is bonded to the radiator body (13) by means of a heat-conducting adhesive, and a copper deposition layer is covered on a partial section of the heat dissipation pipe (2) by means of vapor deposition.

9. An electronic device, characterized in that: The electronic device comprises: Printed circuit board (5); one or more chips (4) electrically connected to the printed circuit board (5); and The heat sink (1) according to any one of claims 1 to 8, wherein the one or more chips (4) are thermally coupled to a heat pipe (2) of the heat sink (1).

10. The electronic device according to claim 9, wherein: The one or more chips (4) are soldered to a copper plate (31, 32) or a copper deposit layer covering a partial section of the heat pipe (2) via a ceramic substrate (41), and the ceramic substrate (41) is also connected to a printed circuit board (5) via a wire (42).

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