A storage class memory system and a method for an advanced driver assistance system and a head unit of a vehicle

Abstract

A storage class memory system and a method for an advanced driver assistance system and a head unit of a vehicle Embodiments are disclosed for a memory device comprising a storage class memory and a method of using the storage class memory for an electronic device such as an advanced driver assistance system and a head unit of a vehicle. In one example, the memory device comprises an executable memory module having at least two parts, a general-purpose executable memory part and a purpose-specific executable memory part. The general-purpose executable memory part is configured to store executable instructions associated with at least an operating system of the electronic device. The general-purpose executable memory part is implemented as a storage class memory module. The purpose-specific executable memory part is configured to store executable instructions associated with computing and / or graphic rendering performed by the electronic device.

Description

[0001] A storage class memory system and a method for an advanced driver assistance system and a head unit of a vehicle

[0002] Technical Field

[0003] The present application relates to a storage class memory system, a method for an advanced driver assistance system, and a head unit of a vehicle.

[0004] Background

[0005] Current executable memory systems implemented as dynamic random-access memory (DRAM) can provide fast switching capabilities for an electronic device or an electronic system (e.g., withing tens of nanoseconds). However, DRAM memory modules are typically expensive to manufacture. Therefore, DRAM memory size is typically limited in an electronic device due to high manufacturing costs. In addition to that, power consumption by DRAM memory typically dominates in the power consumption of the entire electronic device, especially when the device enters a standby mode by suspending its state to RAM (DRAM). Moreover, with increasing data volumes to be processed by an electronic device, memory size requirements for fast executable memory also increases. However, with increasing memory density or size requirements, the power limit preferably should remain the same as well as a failure in time target.

[0006] Summary

[0007] In view of the above, there is a need for a memory device and a method that provides fast switching capabilities (e.g., less than one millisecond) and, at the same time, provides higher memory density or size, reduced manufacturing cost, reduced power consumption (especially relevant for a standby mode), reduced failure in time rates and increased robustness to external factors. These needs are met by the features defined in the independent claims. The dependent claims define additional embodiments.

[0008] A memory device for an electronic device or system is provided. The memory device comprises an executable memory module. The executable memory module comprises at least two parts. One part is a general-purpose executable memory part and the other part is a purpose-specific executable memory part. The general-purpose executable memory part is configured to store executable instructions associated with at least an operating system, OS, of the electronic device and is implemented as a storage class memory, SCM, module. The purpose-specific executable memory part is configured to store executable instructions associated with computing and / or graphic rendering performed by the electronic device.

[0009] According to some further aspects, a memory system for an electronic device or an electronic system is provided. The memory system comprises a memory device according to any of the above examples. The memory system further comprises a chipset. The chipset comprises a static random-access memory, SRAM, module and a CACHE memory module. The CACHE memory module comprises LI CACHE, L2 CACHE and L3 CACHE. The memory system may further comprise any one of a NAND memory module; a solid-state drive, SSD; and / or a hard disk drive, HDD.

[0010] According to some further aspects, an electronic system is provided. The electronic system comprises the memory device according to any one of the above examples. The memory device is configured to store computer readable instructions. Alternatively, the electronic system comprises the memory system according to the above aspects. The memory system is configured to store the computer readable instructions. The electronic system further comprises a computer processor. The computer processor is configured to execute the computer readable instructions.

[0011] According to some further aspects, a method of using a storage class memory is provided. The method comprises the steps of providing a storage class memory, SCM, module and a dynamic random-access memory, DRAM, module for manufacturing an executable memory module for a memory device or a memory system of an electronic system. The method further comprises configuring the SCM module for general-purpose executable instructions, wherein the general-purpose executable instructions are associated with an operative system, OS, of the electronic system. The method further comprises configuring the DRAM module for purpose-specific executable instructions, wherein the purpose-specific executable instructions are associated with computing and / or graphic rendering performed by the electronic system. The method further comprises providing at least one computer processor for executing the general-purpose executable instructions and the purpose-specific executable instructions directly in the SCM and the DRAM modules. The method further comprises configuring the at least one computer processor to enter a standby mode by suspending the processor’s system information to the SCM module before entering the standby mode, wherein the standby mode is a power state wherein one or more components of the electronic system are powered off.

[0012] The features set out above and those described below may be used not only in the corresponding combinations explicitly set out, but also in other combinations or in isolation, without departing from the scope of protection of the present disclosure.

[0013] Brief description of the Drawings

[0014] The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the disclosure are shown. However, this disclosure should not be construed being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Like numbers refer to like elements throughout.

[0015] FIG. 1 schematically shows a memory device 100 according to one of a number of embodiments;

[0016] FIG. 2 schematically shows a memory system 200 according to one of a number of embodiments; FIG. 3 schematically shows an electronic system 300 according to one of a number of embodiments; and

[0017] FIG. 4 shows a flowchart of a method 400 for using a storage class memory for an electronic device or a system according to one of a number of embodiments.

[0018] Detailed description

[0019] The properties, features and advantages of this disclosure described above and the way in which they are achieved will become clearer and more clearly understood in association with the following description of the exemplary embodiments which are explained in greater detail in connection with the drawings. For simplicity and illustrative purposes, the present disclosure is described by referring mainly to an exemplary embodiment thereof. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be readily apparent to one of ordinary skill in the art that the present disclosure may be practiced without limitation to these specific details. In this description, well known methods and structures have not been described in detail so as not to unnecessarily obscure the present disclosure.

[0020] Some examples of the present disclosure generally provide for a plurality of circuits or other electrical devices. All references to the circuits and other electrical devices and the functionality provided by each are not intended to be limited to encompassing only what is illustrated and described herein. While particular labels may be assigned to the various circuits or other electrical devices disclosed, such labels are not intended to limit the scope of operation for the circuits and the other electrical devices. Such circuits and other electrical devices may be combined with each other and / or separated in any manner based on the particular type of electrical implementation that is desired. It is recognized that any circuit or other electrical device disclosed herein may include any number of microcontrollers, a graphics processor unit (GPU), integrated circuits, memory devices (e.g., FLASH, random access memory (RAM), dynamic random access memory (DRAM), read only memory (ROM), electrically programmable read only memory (EPROM), electrically erasable programmable read only memory (EEPROM), storage class memory (SCM) or other suitable variants thereof), and software which co-act with one another to perform operation(s) disclosed herein. In addition, any one or more of the electrical devices may be configured to execute a program code that is embodied in a non-transitory computer readable medium programmed to perform any number of the functions as disclosed.

[0021] In the following, embodiments of the disclosure will be described in detail with reference to the accompanying drawings. It is to be understood that the following description of embodiments is not to be taken in a limiting sense. The scope of the disclosure is not intended to be limited by the embodiments described hereinafter or by the drawings, which are taken to be illustrative only.

[0022] The drawings are to be regarded as being schematic representations and elements illustrated in the drawings are not necessarily shown to scale. Rather, the various elements are represented such that their function and general purpose become apparent to a person skilled in the art. Any connection or coupling between functional blocks, devices, components, or other physical or functional units shown in the drawings or described herein may also be implemented by an indirect connection or coupling. A coupling between components may also be established over a wireless connection. Functional blocks may be implemented in hardware, firmware, software, or a combination thereof.

[0023] FIG. 1 schematically shows a memory device 100 according to one of a number of embodiments.

[0024] Memory device 100 may have several implementations. Memory device 100 may be memory device 100a; memory device 100b; or memory device 100c. Each of the memory devices 100, 100a, 100b or 100c comprises an executable memory module 102. The executable memory module comprises at least two parts, wherein one part is configured as a general-purpose executable memory part 102a and the other part is configured as a purpose-specific executable memory part 102b. The general -purpose executable memory part 102a is configured to store executable instructions associated with at least an operating system, OS, of an electronic device or system 300.

[0025] The variation of memory device 100a in fig. 1 illustrates an example wherein a DRAM module 106 is split in two parts, DRAM module 106a and DRAM module 106b. Each of DRAM module 106a and DRAM module 106b may be configured for different purposes. DRAM module 106a may be configured as a general -purpose executable memory part 102a. DRAM module 106b may be configured as a purpose-specific executable memory part 102b. DRAM modules 106a and 106b may be the same memory modules, or may be different memory modules, (i.e., DRAM module 106a may have a different memory size, may be made of a different memory type, DRAM module 106a may have a different number of memory submodules and / or alike).

[0026] DRAM may be referred to as an executable, volatile memory. A controller can load executable instructions from non-executable non-volatile memory (hard disk drive, HDD) to DRAM for execution.

[0027] In implementation of memory device 100b, the general -purpose executable memory part 102a is implemented as a storage class memory, SCM, module 104.

[0028] SCM may be referred to as an executable non-volatile memory storing executable instructions that can be directly executed by a computer processor or a controller. SCM may have a performance similar to volatile memory but at the same time may provide persistent storage of data.

[0029] Thus, SCM may be advantageously utilized for memory device 100 or memory system 200. SCM module 104 may provide low-latency (e.g., from one millisecond to 5 ns) and persistent data storage. The characteristics of SCM module 104 (e.g., latency, endurance) may be between DRAM module 106 and a hard disk drive (HDD). The executable instructions stored in the SCM module 104 may be an operating system, OS, of an electronic device or an electronic system 300. The executable instructions stored in the SCM module 104 may be system files of the electronic device or electronic system 300. The executable instructions stored in the SCM module 104 may be application files of the electronic device or electronic system 300.

[0030] SCM module 104 may comprise a hardware interface, for example, similar to the interface of a DRAM module 106. SCM module 104 may have a similar or the same hardware interface as low power double data rate 5x DRAM memory module, LPDDR5x. Implementing SCM module 104 having a similar hardware interface and current DRAM modules may allow for easy assembly of memory device 100b and 100c. Memory modules 106 (DRAM module) and 104 (SCM module) may be easily exchanged with each other without a need for any hardware modifications or adaptations.

[0031] Purpose specific DRAM module 106 may be used, for example, as a video rendering buffer. When an electronic system 300 described in the context of fig. 3 comprises a video rendering device (e.g., displays), the purpose specific DRAM module 106 may be used for video rendering. When the electronic system 300 is set to a standby mode, it will not be necessary to keep video rendering information but only the system information and system files. Thus, using the SCM in combination with DRAM may be advantageous for reducing power consumption in standby mode due to suspending system information to SCM, providing instant switching time (less than one millisecond) due to that SCM is non-volatile memory, and, at the same time, providing fast video rendering due to that DRAM memory having low latency (e.g., typically between 100 ns and 10 ns).

[0032] In the context of the current disclosure fast or instant switching or instant on time may be defined as time that a human user of an electronic device does not notice, e.g., less than one millisecond. Thus, SCM having a latency of less than one millisecond can provide “instant switching” capabilities.

[0033] Using DRAM module 106 may be advantageous in combination with SCM module 104 when the latency of DRAM is less than the latency of SCM. In this case, implementing a part of executable memory as a SCM and a part of executable memory as DRAM may be advantageous. Combination of DRAM and SCM in an electronic device or electronic system 300 may be especially advantageous for applications that require fast video rendering or for other computation intense applications. Implementation of memory device 100b may provide an advantageous configuration for such electronic devices or electronic systems 300.

[0034] The instant or fast switching capabilities can particularly be achieved in memory device 100b and 100c by implementing the general -purpose executable memory part 102a as SCM module 104. Storage class memory SCM is faster than typical non-volatile memory (HHD) and may have comparable latency to volatile memory (DRAM).

[0035] Manufacturing resources required to produce SCM modules, especially concerning the cost, can be reduced as compared to producing typical DRAM. Thus, memory density or memory size in memory device 100 or memory system 200 or electronic system 300 can increase due to that the cost constraints can be avoided when SCM is used in addition to or instead of DRAM.

[0036] Since SCM is a non-volatile memory, the power consumption by a memory module comprising at least a part of SCM can be reduced. In standby mode system information can be suspended to SCM to reduce power consumption. At the same time, the electronic device or electronic system 300 can wake up faster from the standby mode when the electronic device or electronic system 300 is suspended to SCM, as compared to the scenario when the system information is suspended to HHD.

[0037] SCM may provide more robust memory having reduced failure in time (FIT) rate as compared to typical DRAM modules. In particular, the robustness to external disturbance factors such as elevated temperature, neutron flux and alike is better in SCM than it is in typical DRAM.

[0038] Therefore, using SCM module as an executable memory alone or in combination with DRAM may provide more robust memory module, fast switching capabilities (e.g., less than one millisecond), higher memory density or size, reduced manufacturing cost, reduced power consumption (especially in standby mode), reduced failure in time rates.

[0039] The SCM module may be implemented as SCM modules 104, 104a, 104b. In each variation of the SCM modules 104, 104a, 104b the parameters of the memory module (size, memory technology, latency, etc.) may be the same or different. The DRAM module 106 may have variations of DRAM modules 106, 106a, 106b. In each variation of DRAM modules 106, 106a, 106b parameters of the memory module (size, memory technology, latency, etc.) may be the same or different.

[0040] In fig. 1, the purpose-specific executable memory part 102b is configured to store executable instructions associated with computing and / or graphic rendering performed by the electronic device.

[0041] In variation of memory device 100b, the purpose-specific executable memory part 102b may be implemented as a dynamic random access memory, DRAM, module 106. A ratio of a memory size of the SCM module 104 to a memory size of the DRAM module 106 may be at least 1 : 1 or 2: 1.

[0042] For example, the DRAM part and the SCM module may comprise 16GB and 16GB, respectively, providing the ratio 1 : 1. However, the size of SCM module 104 may be larger than 16 GB (e.g., 32 GB, 64 GB, 128 GB, etc.) providing other ratios of SMC to DRAM, e.g., 2:1 or higher. Increased amount of SCM memory as compared to DRAM may be especially advantageous for applications when fast video rendering or computations may be less of a concern as compared to larger memory size, better robustness, reduced power consumption and reduced manufacturing cost.

[0043] In variation of memory device 100c, both parts of executable memory module 102, part 102a and part 102b are implemented as SCM modules 104a and 104b, respectively. The purposespecific executable memory part 102b may be a storage class memory, SCM, module 104b. In applications that do not require fast or intense video rendering (e.g., telematic system for vehicle connectivity that is an implementation of electronic system 300 as described in the context of fig. 3), purpose-specific DRAM module 106 may be less of a concern than larger memory size, better robustness, reduced power consumption and reduced manufacturing cost. In this case, implementing both parts of the executable memory module 102, part 102a and part 102b, as SCM modules 104a and 104b may be advantageous. Storage class memory, SCM, modules 104a and 104b may be the same modules or may be different modules (e.g., may have a different memory size, may be made of a different memory type, and / or alike).

[0044] The SCM module 104, 104a, and / or 104b may be a non-volatile memory having a latency equal to or less than one millisecond.

[0045] SCM module 104, 104a, and / or 104b may be at least in part made of or implemented as a phase change memory, PCM. PCM may be referred to as a non-volatile memory that uses the change in the physical state (usually crystalline and amorphous states) of a material to store binary data. PCM may be used as SCM an alternative to traditional flash memory or DRAM due to its fast read and write speeds.

[0046] SCM module 104, 104a, and / or 104b may be at least in part made of or implemented as a ferroelectric random-access memory, FeRAM. FeRAM may be referred to as a non-volatile memory that stores data using the ferroelectric properties of materials. FeRAM typically combines the speed of dynamic RAM (DRAM) with the non-volatility of flash memory, offering fast read and write speeds with the ability to retain data even when power is turned off (e.g., in standby mode).

[0047] SCM module 104, 104a, and / or 104b may be at least in part made of or implemented as a resistive random-access memory, ReRAM. ReRAM may be referred to as a non-volatile memory that stores data by changing the resistance of a material. In ReRAM, resistance can be altered by applying voltage, and this change can be used to represent binary data. ReRAM may offer advantages such as fast read and write speeds, high density, and low power consumption.

[0048] SCM module 104, 104a, and / or 104b may be at least in part made of or implemented as a 3DXPoint memory. 3DXPoint (three-dee cross point) memory may be referred to as a nonvolatile, persistent memory that combines elements of both NAND flash memory and traditional DRAM. 3D XPoint may offer high density, fast read and write speeds, and endurance. SCM module 104, 104a, and / or 104b may be at least in part made of or implemented as a scalable two-transistor memory, STTM. STTM may be referred to as a non-volatile memory based on a floating gate device with the writing mechanism of direct tunnelling through the multiple tunnel junction (MTJ). STTM may provide such advantages as scalability, high density, high speed, long data retention, low voltage operation, low power consumption, and endurability.

[0049] SCM module 104, 104a, and / or 104b may be at least in part made of or implemented as a magneto-resistive random-access memory, MRAM. MRAM (magneto resistive random access memory) may be referred to as a non-volatile memory that uses magnetic elements to store data. MRAM can combines the benefits of high-speed random access memory (RAM) with the non-volatility of flash memory. MRAM may have fast read and write speeds, endurance, and low power consumption, making it suitable for SCM.

[0050] SCM module 104, 104a, and / or 104b may be at least in part made of or implemented as a carbon nanotube, CNTs, based memory. CNT based memory may provide non-volatile memory. CNTs may be highly robust to external factors and particularly suitable for high density memory devices. CNTs may require less manufacturing resources, especially, when concerning costs. Thus, using CNTs may be particularly advantageous when manufacturing is of a concern, as well as improved robustness and FIT. CNTs can also provide reduced latency especially relevant for providing instant switching times and fast data processing. Thus, CNTs based memory may be particularly advantageous for SCM modules.

[0051] Carbon nanotube (CNT) based memory module serving as a storage class memory module SCM 104, 104a, and / or 104b may be a memory module that may include a substrate, a source electrode, a drain electrode, a carbon nanotube (CNT), a memory cell, and a gate electrode. The source electrode and the drain electrode may be arranged with a predetermined interval between them on the substrate and subjected to a voltage. The carbon nanotube may connect the source electrode to the drain electrode and may serve as a channel for charges. The memory cell may be located over the carbon nanotube and may store charges from the carbon nanotube. The gate electrode may be formed in contact with the upper surface of the memory cell and may control the amount of charge flowing from the carbon nanotube into the memory cell. The carbon nanotube memory module may include the carbon nanotube having a high conductivity and a high emissivity, and the memory cell having a superior charge storage capability, so that the memory device 100 can function as a fast, highly integrated memory device without errors.

[0052] SCM memory module 104, 104a, 104b implemented as CNT based memory module can provide a fast memory module which can prevent an increase in resistance due to miniaturization of the memory module, and can provide a low thermal loss, a low power consumption, stable electrical characteristics, and a low charge leakage.

[0053] In an example, a carbon nanotube based memory module serving as a storage class memory module 104, 104a, and / or 104b may include a substrate, a first electrode formed on the substrate, a charge trapping layer formed on the first electrode and comprised of carbon nanotubes to which nanoparticles may be attached, and a second electrode formed on the charge trapping layer. The nanoparticles attached to the surface of the CNTs may store a state.

[0054] Carbon nanotubes (CNTs) typically have high electric conductivity and high mechanical strength as compared to other materials (e.g., traditional semiconductors, metal-oxides, etc.), and thus CNTs, may be used to improve the performance of electronic devices and mechanical strength of composite materials. In addition, some materials can be attached to inner and outer sidewalls of CNTs providing a functional surface and thereby improving the characteristics of SCM even further.

[0055] CNTs may be used in a channel of a transistor by utilizing high electric conductivity of CNTs. CNTs have higher electric conductivity than, e.g., Si, and allowable maximum current density of CNTs is thus also higher, which can provide high current flow when memory device 100 is in use.

[0056] In an example, CNT based memory module serving as a storage class memory module SCM 104, 104a, and / or 104b may be a memory device having only one CNT in the channel of a transistor. CNTs may be contained in polymers to improve electric conductivity of polymers themselves or for utilizing CNTs in flexible electrodes by forming CNTs in a shape of a thin film on a flexible substrate.

[0057] In an example, SCM module 104, 104a, and / or 104b based on CNT memory may be a nonvolatile memory having a structure of a transistor or a crossed structure by using two CNTs. SCM module 104, 104a, and / or 104b based on CNT memory may operate by using electromechanical properties in which CNTs may be structurally bent due to an electrostatic potential generated by voltage applied to CNTs. If CNTs are bent, electric conductivity may vary, and a state of CNTs may be stored by using a difference in the electric conductivity. In the case of a memory device having one CNT, the CNT may be placed on a gate electrode to a predetermined height. In the case of a memory device having two CNTs, each of the CNTs may be cross perpendicular to each other.

[0058] In an example, CNT memory for a SCM module 104, 104a, 104b may be implemented by having a silicon (or other material) layered directly on top of a CNT layer. CNT memory module may be implemented by utilizing the 28 nm manufacturing technology. CNT memory modules may have 4Gbits per layer on a square millimetre. However, an alternative technology may be used.

[0059] In an example, CNT memory module as a SCM module 104, 104a, and / or 104b may be a resistive non-volatile random access memory (NVRAM), where an electrostatic charge may be setting and resetting each bit as “0” or “1.” In this example, CNTs may be coated on top of a base layers of logic (e.g., a layer forming an electrode for applying a voltage). When a voltage is applied to the logic layer, the electrostatic force may force at least two CNTs to connect. Once connected, CNTs may stay connected until an electrostatic force of the opposite charge breaks said connected CNTs apart. Said connection and disconnection of the at least two CNTs may form a basics for a switch (memory state 0 or 1) for SCM module 104, 104a, and / or 104b. The number of CNTs in one memory cell may be in an order of one hundred to one thousand. A plurality of such memory cells may form a network of resistive memory elements. The memory cells’ resistance may change based on the electrostatic force applied, that in turn may depend on a voltage applied. In this example, CNTs may provide desirable properties for a memory device 100. CNTs are typically stronger than many other materials and yet more elastic and lightweight then many other materials (e.g., in comparison to typical materials used in DRAM or other traditional memory technology). CNTs typically conduct heat and electricity better than, e.g. metal materials. Thus, SCM module 104, 104a and / or 104b implemented as CNTs memory module may allow to eliminate DRAM refresh rate and may store data permanently. CNT based memory for SCM module 104, 104a and / or 104b may even have better timing (e.g., 5 ns) than typical DRAM memory modules (e.g., 10 ns). CNT based memory for SCM module 104, 104a and / or 104b, in comparison to typical DRAM memory, may be more scalable, especially because CNTs may be layered on various materials easily (e.g., on silicon). CNT based memory may provide unlimited write endurance (e.g., 300 and 12,000 years) and fast latency, e.g., as fast as 5 ns.

[0060] Each embodiment (i.e., PCM, FeRAM, ReRAM, 3DXPoint, STTM, MRAM, and / or CNTs based memory) may be more suitable for a particular application. For example, while 3DXPoint memory may provide required latency and volatility, 3DXPoint may be less suitable for high temperatures. MRAM or FeRAM may provide required latency and volatility, however, may have memory size limitations. CNTs may be more advantageous when larger size is required alongside with other requirements such as robustness, speed, endurance, manufacturing costs, power consumption. CNTs based memory may be more temperature stable and robust. A memory based on CNTs may be insensitive for random bit flits due to high temperature, and thus, may be more suitable for applications wherein reduced FIT (failure in time) and increased robustness is required.

[0061] In some examples, SCM memory module of the present disclosure may be implemented using any memory technology (PCM, FeRAM, ReRAM, 3DXPoint, STTM, MRAM, CNTs and / or an alternative technology) as long as the memory technology provides a non-volatile memory having a latency equal to or less than a millisecond. In preferred embodiments, SCM memory module of the present disclosure may be implemented using any memory technology providing latency in the range 5-1000 nanoseconds, in the range 10-20 ns or in the range 5-10 ns. According to some examples of the current disclosure, CNT can provide SCM modules having latency equal to or less than 1 millisecond, or in some examples, even latency equal to 5 ns. CNTs based memory may be preferred over other memory technologies because of the robustness of CNTs to external factors, lower FIT and latency, higher memory density and lower power consumption.

[0062] CNTs module may be implemented in a similar way as DRAM modules, and thus, it may be easier to integrate the CNTs modules and the DRAM modules into a memory device 100 or memory system 200 that may be a modular assembly.

[0063] SCM module 104, 104a, and / or 104b may be configured to store system information associated with a current state of the electronic device before the electronic device or electronic system 300 enters a standby mode. The standby mode may be defined as a power state wherein one or more components of the electronic device or electronic system 300 are powered off.

[0064] An advantage of a SCM module 104, 104a, and / or 104b storing the system information when the electronic device enters the standby mode may be such that the power consumption required by the standby mode may be reduced as compared to the scenario when the device is suspended to RAM. At the same time, when the electronic device or electronic system 300 is suspended to SCM instead of HDD, the device or system can wake up from the standby mode instantaneously (e.g., withing 1 millisecond) while when the device is suspended to HDD, it can take several seconds for the electronic device or electronic system 300 to wake up.

[0065] FIG. 2 schematically shows a memory system 200 according to one of a number of embodiments.

[0066] The memory system 200 comprises a memory device 100 as illustrated in fig. 1. The memory system 200 further comprises a chipset 206. The chipset 206 comprises a static random-access memory, SRAM, module 208. The chipset 206 further comprises a CACHE memory module 210. The CACHE memory module 210 comprises LI CACHE 210a, L2 CACHE 210b and L3 CACHE 210c. The memory system 200 may further comprise any one of a NAND memory module 212; a solid-state drive, SSD 214; and / or a hard disk drive, HDD 216.

[0067] By using the memory device 100 for the memory system 200, the memory system can provide an improved memory architecture having all the advantages as discussed in the context of fig. 1.

[0068] FIG. 3 schematically shows an electronic system 300 according to one of a number of embodiments.

[0069] The electronic system 300 may comprise a memory device 100 as described in the context of fig. 1 or memory system as described in the context of fig. 2. The electronic system 300 may further comprise a computer processor 318 configured to execute computer readable instructions 320. The electronic system 300 may further comprise a sensor and / or a receiver 322.

[0070] The sensor 322 may be a touch screen, a camera, an optical sensor, IR sensor, or any type of controller that a user can control to provide control input to the electronic system 300 (e.g., a mechanical or a voice controller).

[0071] The electronic system 300 may further comprise a computer interface 324. The electronic system 300 may further comprise a display 326.

[0072] The electronic system 300 may be an advanced driver assistance system, ADAS, for a vehicle, wherein the computer readable instructions 320 may comprise instructions for assisting a driver in a driving environment.

[0073] The electronic system 300 may be a head unit of a vehicle comprising at least one display 326, wherein the computer readable instructions 320 may comprise instructions for computing and / or graphical rendering for the at least one display 326. The electronic system 300 may be a telematic system for a vehicle comprising at least one antenna for vehicle connectivity, wherein the computer readable instructions 320 may comprise instructions for computing of data associated with the vehicle connectivity.

[0074] The electronic system 300 may be a medical system comprising at least one display 326, wherein the computer readable instructions 320 may comprise instructions for graphical rendering for the at least one display 326 and / or computations associated with medical data received by the medical system.

[0075] The electronic system 300 may be a system-on-chip component, SOC, wherein the computer readable instructions 320 may comprise instructions for at least one operation of the SOC;

[0076] The electronic system 300 may be a laptop or a netbook comprising a display 326, wherein the computer readable instructions 320 may comprise instructions for graphical rendering for the display 326 and / or computations by the laptop or the netbook.

[0077] The electronic system 300 may be a hardware component for internet of things, loT, wherein the computer readable instructions 320 may comprise instructions for computations of data associated with the loT.

[0078] The electronic system 300 may be an electronic ecosystem comprising an interconnected network of hardware, computer programs, cloud storage, and network components that work together to provide an integrated operation, wherein the computer readable instructions 320 may comprise instructions for computations and / or graphical rendering associated with the integrated operation.

[0079] The electronic system 300 that is ADAS may comprise an operative system, OS, that may be stored in the SCM module 104 or 104a. The ADAS may further comprise at least one computer interface 324 for providing the computer readable instructions 320 to the driver or a vehicle component. The ADAS may further comprise at least one sensor and / or camera 322 to detect obstacles and / or driving errors. The computer processor 318 of the ADAS may be further configured to operate the OS of the ADAS. The computer processor 318 of the ADAS may be further configured to receive data from the at least one sensor and / or camera 322 associated with the obstacles and / or driving errors and compute the received data. Based on the computing, the computer processor 318 of the ADAS may be further configured to generate the computer readable instructions 320. The computer processor 318 of the ADAS may be further configured to provide the computer readable instructions 320 via the at least one computer interface 324 to the driver to increase road safety and / or to the vehicle component for controlling the vehicle component automatically. The purpose-specific executable memory part 102b of the ADAS memory device 100 or memory system 200 may be configured to store the computer readable instructions 320.

[0080] The electronic system 300 that is the head unit of the vehicle may comprise an operative system, OS. The OS of the head unit of the vehicle may be stored in the SCM module 104 or 104a. The head unit may further comprise at least one vision, sound and / or a touch sensor 322 for receiving data associated with the vehicle, a driver and / or a passenger. The head unit may further comprise at least one computer interface 324. The computer processor 318 of the head unit may be further configured to operate the OS of the head unit, receive data from the at least one sensor 322, and compute the received data. Based on the computing, the computer processor 318 of the head unit, may be further configured to generate the computer readable instructions 320. The computer processor 318 of the head unit may be further configured to provide the computer readable instructions 320 via the at least one computer interface 324 to the driver, the passenger and / or to a vehicle component to control the vehicle component automatically. The computer processor 318 of the head unit may be further configured to render the computer readable instructions 320 on the at least one display 326. The purposespecific executable memory part 102b of the memory device 100 or memory system 200 of the head unit of the vehicle may be configured to store the computer readable instructions 320.

[0081] The electronic system 300 may comprise a plurality of electronic systems 300. For example, an electronic system 300 for a vehicle may comprise a head unit of the vehicle, an ADAS, a cockpit controller, an infotainment system, a telematic system, a computing system of the vehicle, a control system of the vehicle. Each of the head unit of the vehicle, the ADAS, the cockpit controller, the infotainment system, the telematic system, the computing system of the vehicle, the control system of the vehicle may be a sub system of the electronic system 300 or may be an implementation of the electronic system 300. In other words, electronic system 300 may comprise a plurality of electronic systems 300 and / or one or more sub electronic systems 300.

[0082] Each of the plurality of electronic systems 300 may comprise a computer processor 318 configured to generate and execute computer readable instructions 320 for each electronic system 300. The computer readable instructions 320 may be stored in the executable memory module 102. The plurality of electronic systems 300 may be operated by one computer processors 318 or by a plurality of computer processors 318. Computer readable instructions 320 may be one or more sets of computer readable instructions 320, wherein each set is adapted to a corresponding electronic system 300.

[0083] Similar to the computer processor 318 and computer readable instructions 320 that may be a plurality of computer processors 318 and a plurality of computer readable instructions 320, also a display 326 may be one or more displays 326; a sensor 322 may be one or more sensors 322; a computer interface 324 may be one or more computer interfaces 324. Each of the components of the memory device 100 or memory system 200 may be a plurality of components. For example, SCM module 104 may be a plurality of SCM modules 104. DRAM module 106 may be a plurality of DRAM modules. Each of the plurality of SCM modules 104 and / or DRAM modules 106 may be configured to a specific purpose, e.g., specific application files, system files and alike. Having a plurality of modules may provide a modular assembly that is easy to manufacture, configure, re-configure.

[0084] Some of the plurality of electronic systems 300 may be coupled into an integral electronic system 300 (ecosystem) via one or more communication interfaces 324 (e.g., a cockpit controller may be communicatively connected to the ADAS and the telematic system to provide a plurality of operations for the vehicle). Some of the plurality of operations of the electronic system 300 (ecosystem) may be mutually interlinked into an integral operation. For example, the telematic system may provide input to the ADAS for an integral operation, e.g., autonomous driving. The cockpit of the vehicle may comprise the cockpit controller being an implementation of the electronic system 300, instrument panel and other electronic systems 300 (a control system, a computing system, an ADAS, a telematic system, an infotainment system).

[0085] In another example, the head unit may provide sensor 322 input to cockpit controller to control infotainment system. In this example, the head unit of the vehicle may be communicatively coupled with cockpit controller of the vehicle via a communication interface 324, wherein the cockpit controller being an implementation of the electronic system 300. The cockpit controller may be communicatively coupled with the infotainment system via a communication interface 324. The infotainment system may be provided within a passenger cabin of the vehicle. For example, the infotainment system may be present at a dashboard compartment, where the infotainment system may be operated, e.g., controlled and monitored, by the cockpit controller comprising a computer processor 318 configured to generate and execute computer readable instructions 320 stored in the executable memory module 102.

[0086] The cockpit controller may drive multiple functional domains within the vehicle (car), including center displays 326 for infotainment system, instrumentation clusters, audio and sound management, lighting, e-mirrors, navigation, drive assist (i.e., ADAS), an intelligent personal assistant, etc.

[0087] The infotainment system may include a plurality of different connections to communicatively couple to the cockpit controller via a number of BUS systems, including CAN and Ethernet (communication interface 324). A head-unit system 300 (coupled to the cockpit controller) may be configured to interface with the user, e.g., through the use of a touch screen (sensor 322) and / or display 326. The head unit may comprise the display 326, the touch screen (sensor 322), a connectivity architecture. The communication interface 324 may be a generic interface for communication between the cockpit controller and the head unit. The communication interface 324 may include the display 326 and the touch screen (sensor 322). The cockpit controller may be implemented as a computer processor 318 that may be configured to generate computer readable instructions 320 for controlling the infotainment system of the vehicle. Computer readable instructions 320 may be stored in the executable memory module 102.

[0088] The display 326 and the touch screen (sensor 322) may be located at a dashboard of a vehicle, allowing the display 326 and the touch screen (sensor 322) to be easily viewed and accessed by a driver or a passenger. In some examples, the display 326 and the touch screen (sensor 322) may be integrated with (e.g., a part of) the head unit. In other examples, the display 326 and the touch screen (sensor 322) may be separate from the head unit and may be located elsewhere relative to the head unit (e.g., mounted at a seat of the vehicle for back passenger use).

[0089] Further, in some examples, more than one of the displays 326 may be included in the vehicle where at least one display 326 may be incorporated into a vehicle computing system. The vehicle computing system may comprise an ADAS and / or telematic system. Each of the vehicle computing system, the ADAS and the telematic system may be an implementation of the electronic system 300. Each of the vehicle computing system, the ADAS and the telematic system may be a sub system of the electronic system 300. For example, the vehicle computing system may be an implementation of the electronic system, while the ADAS and / or the telematic system may be a sub system of the vehicle computing system (also referred to as computing system in the disclosure). The vehicle computing system may be coupled to the head unit and / or cockpit controller via a communication interface 324. Each of the head unit and the cockpit controller may be yet another implementation of the electronic system 300. Each of the implementation of the electronic systems 300 may be communicatively coupled with other electronic systems 300 via a communication interface 324 and may be controlled by a computer processor 318 generating and executing computer readable instructions 320 stored in the executable memory 120. In an example, the cockpit controller comprising a computer processor 318 may control the ADAS and / or the head unit via a communi cation / computer interface 324. However, in another example, each the ADAS and the head unit may comprise a dedicated computer processor 318 configured for controlling each electronic system 300. A vehicle may comprise an instrument panel having various displays 326 and controls (e.g., a touch screen) accessible to a human user (e.g., a driver or a passenger) of the vehicle. The instrument panel may be controlled by a cockpit controller comprising computer processor 318. For example, the instrument panel may include an infotainment system such as the touch screen (sensor 322) or a video monitor (display 326), an audio system control panel, and an instrument cluster. The instrument panel may be communicatively coupled with the head unit via a computer / communi cation interface 324 and controlled by the cockpit controller comprising computer processor 318. The touch screen (sensor 322) of the head unit may receive user input for controlling audio output, visual display output, user preferences, control parameter selection, etc. This input may be provided to the cockpit controller to control the infotainment system (e.g., choose a program, change volume).

[0090] In some examples, the instrument panel may include an input device for a user to transition the vehicle between an autonomous mode and anon-autonomous mode. The input device may be a sensor 322 receiving input from the user (e.g., touch screen, voice control, etc.) and providing this input to a control system of the vehicle.

[0091] In some examples, the instrument panel may include one or more controls such as touch screens or voice controls (sensors 322) for the control system, e.g., for selecting a destination, setting desired vehicle speeds, setting navigation preferences (e.g., a preference for highway roads over city streets), and the like.

[0092] Further still, in some examples, the instrument panel may be communicatively coupled with ADAS (being an implementation of the electronic system 300) via a computer / communi cation interface 324. ADAS may include one or more controls for driver assistance such as a cruise control system, a collision avoidance system, and the like.

[0093] Further, additional user interfaces, e.g., displays 326 and touchscreens (sensors 322), may be present in other portions of the vehicle, such as proximate to at least one passenger seat. For example, the vehicle may include a row of back seats comprising at least one touch screen (sensor 322) and / or display 326 controlling a computing system of the vehicle. The computing system of the vehicle (being an implementation of the electronic system 300) may comprise or may be connectively coupled to any one of the ADAS (being another implementation of the electronic system 300), the head unit (being yet another implementation of the electronic system 300), the telematic system (being yet another implementation of the electronic system 300) and / or the instrument panel via a computer / communi cation interface 324. Electronic systems 300 may comprise one or more computer processors 318 configured to generate and execute computer readable instructions 320 stored in the executable memory 120 for controlling each electronic system 300.

[0094] The vehicle’s computing system (or computing system) may store application data, including prerecorded sounds, to enable the vehicle’s computing system to run an application for connecting to a cloud-based server and / or collecting information for transmission to the cloud-based server. The application may retrieve information gathered by vehicle systems and sensors 322, input devices (e.g., the touch screen that may be located within the head unit), data stored in volatile memory, i.e., in DRAM module 106 and / or non-volatile memory, i.e., in SCM module 104, communicatively coupled with the vehicle computing system. For example, the computing system may comprise an application for connecting a mobile device via a Bluetooth link, etc., to the executable memory module 102 for controlling one or more components of the vehicle.

[0095] A head unit may require a bigger video rendering buffer for one or more displays 326, as compared to other systems (e.g., a telematic system). Thus, having a DRAM module 106b in the memory device 100b may be advantageous in this case. Nevertheless, if fast video rendering is not of a concern, having both parts of executable memory module 102, part 102a and part 102b implemented as SCM modules 104a and 104b could further reduce power consumption, manufacturing costs, and FIT.

[0096] Telematic system may comprise an operative system, OS. The OS of the telematic system may be stored in the SCM module 104 or 104a. The telematic system may further comprise at least one receiver 322 for receiving a telecommunication signal associated with at least vehicle's location and / or speed. The telematic system may further comprise at least one computer interface 324. The computer processor 318 of the telematic system may be further configured to operate the OS of the telematic system, receive data from the at least one receiver 322, wherein the data may be associated with the at least vehicle's location and / or speed in a driving environment. The computer processor 318 of the telematic system may be further configured compute the received data. Based on the computing, the computer processor 318 of the telematic system may be further configured to generate the computer readable instructions 320. The computer processor 318 of the telematic system may be further configured to provide the computer readable instructions 320 via the at least one computer interface 324 to the driver for assisting the driver in the driving environment. The purposespecific executable memory part 102b of the memory device 100 or the memory system 200 of the telematic system may be configured to store the computer readable instructions 320.

[0097] For the telematic system, a large video rendering buffer (as may be advantageous for the head unit), may not be required. Thus, memory device 100c may be advantageous in this case. In any case, having both parts of executable memory module 102, part 102a and part 102b, implemented as SCM modules 104a and 104b may further reduce power consumption, and in addition to that, manufacturing costs.

[0098] A vehicle may comprise a cabin, in which a driver and / or one or more passengers may be seated. The vehicle may be a road automobile, among other types of vehicles. In particular, the vehicle may be a motor vehicle including drive wheels and a prime mover. In some examples, prime mover may be an internal combustion engine. In other examples, prime mover may include both an engine and an electric machine and vehicle may be a hybrid vehicle. For example, the vehicle may include a hybrid propulsion system including an energy conversion device, such as the electric machine, operable to absorb energy from vehicle motion and / or the engine and convert the absorbed energy to an energy form suitable for storage by an energy storage device. In another example, the vehicle may be a fully electric vehicle, with the prime mover configured as the electric machine, and, in some examples, may incorporate fuel cells, solar energy capturing elements, and / or other energy storage systems for powering the vehicle. Further, in some instances, the vehicle may be an autonomous vehicle. For example, the vehicle may be a fully autonomous vehicle (e.g., fully self-driving vehicle) configured to drive with reduced input from an operator. The vehicle may include a plurality of vehicle systems, including a braking system for decreasing vehicle speed, a propulsion system for providing motive power to wheels of the vehicle, a steering system for adjusting a direction of the vehicle, a transmission system for controlling a gear selection for the engine, an exhaust system for processing exhaust gases, and the like. Further, the vehicle may include a vehicle’s computing system. The electronic system 300 for the vehicle may comprise a memory device 100 or memory system 200. The electronic system 300 may comprise a computing system for the vehicle. The computing system of the vehicle may comprise the ADAS, the head unit, the cockpit controller, and / or the telematic system. The ADAS, the head unit, the cockpit controller and / or the telematic system may be communicatively coupled via a communication interface. Each of the computing system, the ADAS, the head unit, the cockpit controller, and the telematic system may be an implementation of the electronic system 300 or may be a sub system of the electronic system 300. The ADAS, the head unit, the cockpit controller and / or the telematic system may be communicatively coupled via a communication interface.

[0099] Each of the computing system of the vehicle, the control system of the vehicle, the ADAS, the head unit, the cockpit controller and the telematic system may be an implementation of electronic system 300 or a sub system of the electronic system 300.

[0100] Any one of the ADAS, the head unit, the cockpit controller and / or the telematic system may comprise one or more computer processors 318 generating and executing computer readable instructions 320 for each electronic system 300, wherein the executing computer readable instructions 320 can be stored in the executable memory module 102.

[0101] Each of the electronic systems 300 (i.e., the computing system of the vehicle, the control system of the vehicle, the ADAS, the head unit, the cockpit controller and / or the telematic system) may have a dedicated memory device 100 or memory system 200 and a processor 318 or may share a memory device 100 or memory system 200 and a computer processor 318 with another electronic system 300.

[0102] An electronic system 300 may be a vehicle control system comprising a computer processor 318 configured to generate and execute computer readable instructions 320 stored in executable memory module 102 for controlling one or more components of the vehicle. For example, vehicle data outputs may be output to vehicle control system, and vehicle control system may adjust vehicle controls based on the vehicle data outputs. For example, vehicle control system may retrieve from the engine MAY bus (communication interface 324) the current speed of the vehicle estimated by wheel sensors 322, a power state of the vehicle via a battery and / or power distribution sensor system of the vehicle (a plurality of sensors 322), an ignition state of the vehicle, etc. In addition, other interfacing means (computer / communi cation interface 324) such as Ethernet may be used. A memory device 100 or memory system 200 may be used for the vehicle control system to store data such as computer readable instructions 320 executable by the computer processors 318 in non-volatile form (i.e., in SCM module 104, 104a, 104b). The executable computer readable instructions 320 may be the vehicle controls (control instructions) generated by the control system based on the vehicle data outputs.

[0103] A memory device 100 or memory system 200 may store application data, including prerecorded sounds, to enable the vehicle’s computing system to run an application for connecting to a cloud-based server and / or collecting information for transmission to the cloud-based server. The application may retrieve information gathered by vehicle systems / sensors 322, input devices (e.g., the touch screen 322 within the head unit), data stored in volatile memory, i.e., in DRAM module 106 and / or non-volatile memory, i.e., in SCM module 104, devices in communication with the vehicle computing system (e.g., a mobile device connected via a Bluetooth link), etc.

[0104] Vehicle computing system may include memory device 100 that may store instructions and / or code (computer readable instructions 320) that, when executed by a computer processor 318, controls the vehicle computing system to perform one or more of the actions described in the disclosure. One or more additional sensors 322 may be included in a sensor subsystem of the vehicle computing system. For example, the sensor subsystem may include a plurality of sensors for monitoring an environment around the vehicle. For example, the sensor subsystem may include a plurality of cameras, one or more radars, one or more Lidar(s), and one or more ultrasonic sensors. For example, the sensors of sensor subsystem may be used for object detection by, e.g., an object detection system, wherein the object detection system may be a part of ADAS. ADAS may be communicatively coupled to the vehicle computing system via a communication interface 324. Sensor subsystem of the vehicle computing system may communicate with and receive inputs from various vehicle sensors 322 and may further receive user inputs. While certain vehicle system sensors 322 may communicate with sensor subsystem alone, other sensors 322 may communicate with both sensor subsystem and the vehicle control system, or may communicate with sensor subsystem indirectly via the vehicle control system.

[0105] For example, a microphone (sensor 322) may be included in the vehicle computing system to measure ambient noise in the vehicle, to measure ambient noise outside the vehicle, etc. One or more additional sensors 322 may be included in and / or communicatively coupled to sensor subsystem of the vehicle computing system. Sensor subsystem of vehicle computing system may communicate with and receive inputs from various vehicle sensors 322 and may further receive user inputs via one or more communication interfaces 324. While certain vehicle system sensors 322 may communicate with sensor subsystem alone, other sensors 322 may communicate with both sensor subsystem and vehicle control system, or may communicate with the sensor subsystem indirectly via vehicle control system. Sensor subsystem may serve as an interface (e.g., a hardware interface) and / or processing unit for receiving and / or processing received signals from one or more of the sensors 322 described in the disclosure.

[0106] An electronic system 300 for a vehicle may comprise a telematic system for navigation. The telematic system may generate and / or receive navigation information such as location information (e.g., via a GNSS / IMS sensor 322 and / or other sensors 322), route guidance, traffic information, point of-interest (POI) identification, and / or provide other navigational services for the user. The telematic system may include input / output data, including analogue to digital converters, digital inputs, digital outputs, network outputs, radio frequency transmitting devices, etc. In some examples, the telematic system may interface with the vehicle control system, the computing system, the ADAS (e.g., for autonomous driving assistance), the head unit and / or the cockpit controller. Each of the telematic system, the vehicle control system, the computing system, the ADAS, the head unit and the cockpit controller may be an implementation of the electronic system 300. Each of the telematic system, the vehicle control system, the computing system, the ADAS, the head unit and the cockpit controller may be a sub system of the electronic system 300. The memory system 200 or the memory device 100 of the electronic system 300, may provide fast or instant switching capabilities (less than one millisecond) and, at the same time, reduces manufacturing resources and power consumption, especially when the electronic system 300 comprising the memory system 200 or memory device 100 enters a standby mode. Storage class memory may be faster than typical non-volatile memory (e.g., NAND memory module 212; a solid-state drive, SSD 214; and / or a hard disk drive, HDD 216) and as fast as typical dynamic random-access memory, DRAM. When SCM module 104 is used for storing system information of the electronic system 300 in standby mode (instead of the slower non-volatile memory such as NAND memory module 212; a solid-state drive, SSD 214; and / or a hard disk drive, HDD 216), the electronic system 300 can wake up from the standby mode faster.

[0107] The manufacturing resources required to produce SCM modules for electronic system 300, especially concerning the cost, can be reduced as compared to producing typical DRAM modules. Thus, using at least a part of SMC module as the executable memory for the electronic system 300 may provide higher memory density while keeping manufacturing resources low.

[0108] Since DRAM module consumes the largest share of the overall power consumed by an electronic system 300, especially in the standby mode, using SCM module 104, 104a, 104b for the electronic system 300 may reduce power consumption.

[0109] SCM module may also provide more robust memory to external disturbance factors such as elevated temperature, neutron flux and alike may be increased. Therefore, using at least a part of SCM or using SCM alone as an executable memory may provide more robust memory device 100 or memory system 200 for the electronic system 300.

[0110] FIG. 4 shows a flowchart of a method 400 for using a storage class memory for an electronic device or a system according to one of a number of embodiments.

[0111] The method 400 of using a storage class memory comprises the steps S404 (configuring the SCM module); S406 (configuring the DRAM module); S408 (providing at least a computer processor for executing the general-purpose executable instructions and the purpose-specific executable instructions) and S410 (configuring an electronic system to enter a standby mode). In step S402, a storage class memory, SCM, module 104 and a dynamic random access memory, DRAM, module 106 are provided for manufacturing an executable memory module 102 for a memory device 10 or a memory system 200 of an electronic system 300.

[0112] In step S404, the SCM module 104 is configured for general -purpose executable instructions, wherein the general-purpose executable instructions are associated with an operative system, OS, of the electronic system 300.

[0113] In step S406, the DRAM module 106 is configured for purpose-specific executable instructions, wherein the purpose-specific executable instructions are associated with computing and / or graphic rendering performed by the electronic system 300.

[0114] In step S408, at least one computer processor 318 is provided for executing the general- purpose executable instructions and the purpose-specific executable instructions directly in the SCM memory module 104 and DRAM module 106.

[0115] In step S410, the at least one computer processor 318 is configured to enter a standby mode by suspending the processor’s system information to the SCM module 104 before entering the standby mode, wherein the standby mode is defined as a power state wherein one or more components of the electronic system 300 are powered off.

[0116] Steps S402-S410 of the method 400 may be carried out in any order, in addition to the order described in this application, in parallel, and / or simultaneously.

[0117] Using a SCM module 104, 104a, 104b according to method 400 can provide fast switching capabilities for an electronic device or electronic system 300 (e.g., less than one millisecond) and, at the same time, can provide higher memory density or size, reduced manufacturing cost, reduced power consumption (especially relevant for a standby mode), reduced failure in time rates, increased robustness to external factors. It may be understood from the current disclosure that features of embodiments described in the context of figs. 1, 2, 3 and 4 are combinable, except for variations of memory devices 100a, 100b and 100c being alternative implementations. However, the features of each of the variations of the memory devices 100a, 100b and 100c described in the context of fig. 1 are combinable with the features of embodiments described in the context of figs. 2, 3 and 4.

[0118] The description of embodiments has been presented for purposes of illustration and description. Suitable modifications and variations to the embodiments may be performed in light of the above description or may be acquired from practicing the methods. For example, unless otherwise noted, one or more of the described methods may be performed by a suitable device and / or combination of devices. The methods may be performed by executing stored instructions with one or more logic devices (e.g., processors) in combination with one or more additional hardware elements, such as storage devices, memory, hardware network interfaces / antennae, switches, actuators, clock circuits, etc. The described methods and associated actions may also be performed in various orders in addition to the order described in this application, in parallel, and / or simultaneously. The described systems are exemplary in nature, and may include additional elements and / or omit elements. The subject matter of the present disclosure includes all novel and non-obvious combinations and sub-combinations of the various systems and configurations, and other features, functions, and / or properties disclosed.

[0119] As used in this application, an element or step recited in the singular and proceeded with the word “a” or “an” should be understood as not excluding plural of said elements or steps, unless such exclusion is stated. Furthermore, references to “one embodiment” or “one example” of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. The terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements or a particular positional order on their objects. The following claims particularly point out subject matter from the above disclosure that is regarded as novel and non-obvious. In view of the above, general conclusions can be drawn that may be summarised by the following examples.

[0120] In some examples, the purpose-specific executable memory part may be a dynamic random access memory, DRAM, module.

[0121] According to various examples, a ratio of a memory size of the SCM module to a memory size of the DRAM module may be at least 1 : 1 or 2: 1.

[0122] According to various examples, the SCM module may be a storage class memory, SCM, module and the purpose-specific executable memory part may be a storage class memory, SCM, module.

[0123] According to various examples, the SCM module may be a non-volatile memory having a latency equal to or less than one millisecond.

[0124] According to various examples, the SCM module may be at least in part made of any one of: a phase change memory, PCM; a ferroelectric random-access memory, FeRAM; a resistive random-access memory, ReRAM; a 3DXPoint memory; a scalable two-transistor memory, STTM; a magneto-resistive random-access memory, MRAM; and / or a carbon nanotubes, CNTs, based memory.

[0125] According to an example, the SCM module may be at least in part made of the carbon nanotubes, CNTs, based memory.

[0126] According to various examples, the SCM module may be configured to store system information associated with a current state of the electronic device before the electronic device enters a standby mode, wherein the standby mode is a power state wherein one or more components of the electronic device are powered off. In some examples, the electronic system may be an advanced driver assistance system, ADAS, for a vehicle, wherein the computer readable instructions comprise instructions for assisting a driver in a driving environment.

[0127] In some examples, the electronic system may be a head unit of a vehicle comprising at least one display, wherein the computer readable instructions comprise instructions for computing and / or graphical rendering for the at least one display.

[0128] In some examples, the electronic system may be a telematic system for a vehicle comprising at least one antenna for vehicle connectivity, wherein the computer readable instructions comprise instructions for computing of data associated with the vehicle connectivity.

[0129] In some examples, the electronic system may be a medical system comprising at least one display, wherein the computer readable instructions comprise instructions for graphical rendering for the at least one display and / or computations associated with medical data received by the medical system.

[0130] In some examples, the electronic system may be a system-on-chip component, SOC, wherein the computer readable instructions comprise instructions for at least one operation of the SOC.

[0131] In some examples, the electronic system may be a laptop or a netbook comprising a display, wherein the computer readable instructions comprise instructions for graphical rendering for the display and / or computations by the laptop or the netbook.

[0132] In some examples, the electronic system may be a hardware component for internet of things, loT, wherein the computer readable instructions comprise instructions for computations of data associated with the loT.

[0133] In some examples, the electronic system may be an electronic ecosystem comprising an interconnected network of hardware, computer programs, cloud storage, and network components that work together to provide an integrated operation, wherein the computer readable instructions comprise instructions for computations and / or graphical rendering associated with the integrated operation.

[0134] According to various examples, the ADAS electronic system may comprise an operative system, OS, that may be stored in the SCM module. The ADAS may further comprise at least one computer interface for providing the computer readable instructions to the driver or a vehicle component. The ADAS may further comprise at least one sensor and / or camera to detect obstacles and / or driving errors. The computer processor of the ADAS may be further configured to operate the OS of the ADAS. The computer processor of the ADAS may be further configured to receive data from the at least one sensor and / or camera associated with the obstacles and / or driving errors. The computer processor of the ADAS may be further configured to compute the received data, and based on the computing, generate the computer readable instructions. The computer processor of the ADAS may be further configured to provide the computer readable instructions via the at least one computer interface to the driver to increase road safety and / or to the vehicle component for controlling the vehicle component automatically. The purpose-specific executable memory part of the ADAS may be configured to store the computer readable instructions.

[0135] According to various examples, the electronic system that is the head unit of the vehicle may comprise an operative system, OS. The OS of the head unit of the vehicle may be stored in the SCM module. The head unit of the vehicle may further comprise at least one vision, sound and / or a touch sensor for receiving data associated with the vehicle, a driver and / or a passenger. The head unit of the vehicle may further comprise at least one computer interface. The computer processor of the head unit of the vehicle may be further configured to operate the OS of the head unit, receive data from the at least one sensor and compute the received data. The computer processor of the head unit of the vehicle may be further configured to, based on the computing, generate the computer readable instructions, and provide the computer readable instructions via the at least one computer interface to the driver, the passenger and / or to a vehicle component to control the vehicle component automatically. The computer processor of the head unit of the vehicle may be further configured to render the computer readable instructions on the at least one display. The purpose-specific executable memory part of the head unit of the vehicle may be configured to store the computer readable instructions.

[0136] According to various examples, the telematic system may comprise an operative system, OS. The OS of the telematic system may be stored in the SCM module. The telematic system may further comprise at least one receiver for receiving a telecommunication signal associated with at least vehicle's location and / or speed. The telematic system may further comprise at least one computer interface. The computer processor of the telematic system may be further configured to operate the OS of the telematic system. The computer processor of the telematic system may be further configured to receive data from the at least one receiver, wherein the data associated with the at least vehicle's location and / or speed in a driving environment. The computer processor of the telematic system may be further configured to compute the received data, and based on the computing, generate the computer readable instructions. The computer processor of the telematic system may be further configured to provide the computer readable instructions via the at least one computer interface to the driver for assisting the driver in the driving environment. The purpose-specific executable memory part of the telematic system may be configured to store the computer readable instructions.

[0137] Reference signs

[0138] 100; 100a; 100b; 100c: a memory device;

[0139] 102: an executable memory module;

[0140] 102a: a general -purpose executable memory part;

[0141] 102b: a purpose-specific executable memory part;

[0142] 104, 104a, 104b: a storage class memory, SCM, module;

[0143] 106, 106a, 106b: a dynamic random access memory, DRAM, module;

[0144] 200: a memory system;

[0145] 206: a chipset;

[0146] 208: a static random-access memory, SRAM, module;

[0147] 210: a CACHE memory module;

[0148] 210a: LI CACHE; 210b: L2 CACHE;

[0149] 210c: L3 CACHE;

[0150] 212: a NAND memory module;

[0151] 214: a solid-state drive, SSD; 216: a hard disk drive, HDD;

[0152] 300: an electronic system;

[0153] 318: a computer processor;

[0154] 320: computer readable instructions.

[0155] 322: a sensor / receiver / camera; 324: a computer interface / communication interface;

[0156] 326: a display;

[0157] 400: a method of using a storage class memory SCM;

[0158] S402: providing a storage class memory, SCM, module and a dynamic random access memory, DRAM, module for manufacturing a memory device or a memory system; S404: configuring the SCM module;

[0159] S406: configuring the DRAM module;

[0160] S408: providing at least a computer processor for executing the general -purpose executable instructions and the purpose-specific executable instructions;

[0161] S410: configuring an electronic system to enter a standby mode.

Claims

C LAIM S1. A memory device 100, the memory device comprising: an executable memory module (102) comprising at least two parts: a general -purpose executable memory part (102a) and a purpose-specific executable memory part (102b), wherein: the general-purpose executable memory part (102a) is configured to store executable instructions associated with at least an operating system, OS, of an electronic device and is implemented as a storage class memory, SCM, module (104), and the purpose-specific executable memory part (102b) is configured to store executable instructions associated with computing and / or graphic rendering performed by the electronic device.

2. The memory device 100 of claim 1, wherein the purpose-specific executable memory part (102b) is a dynamic random access memory, DRAM, module (106).

3. The memory device 100 of claim 1 or 2, wherein a ratio of a memory size of the SCM module (104) to a memory size of the DRAM module (106) is at least 1 : 1 or 2: 1.

4. The memory device 100 of claim 1, wherein the SCM module (104) is a storage class memory, SCM, module (104a) and the purpose-specific executable memory part (102b) is a storage class memory, SCM, module (104b).

5. The memory device 100 of any one of claims 2-4, wherein the SCM module (104, 104a, 104b) is a non-volatile memory having a latency equal to or less than one millisecond.

6. The memory device 100 of any one of claims 2-5, wherein the SCM module (104, 104a, 104b) is at least in part made of any one of:- phase change memory, PCM;- ferroelectric random-access memory, FeRAM;- resistive random-access memory, ReRAM;- 3DXPoint memory;- scalable two-transistor memory, STTM;- magneto-resistive random-access memory, MRAM; and / or- carbon nanotubes, CNTs, based memory.

7. The memory device 100 of claim 6, wherein the SCM module (104, 104a, 104b) is at least in part made of the carbon nanotubes, CNTs, based memory.

8. The memory device 100 of any one of claims 2-7, wherein the SCM module (104, 104a, 104b) is configured to store system information associated with a current state of the electronic device before the electronic device enters a standby mode, wherein the standby mode is a power state wherein one or more components of the electronic device are powered off.

9. A memory system (200) comprising: a memory device 100 of any one of claims 1-8, and further comprising a chipset (206) comprising a static random-access memory, SRAM, module (208), a CACHE memory module (210), wherein the CACHE memory module (210) comprises LI CACHE (210a), L2 CACHE (210b) and L3 CACHE (210c), and wherein, optionally, the memory system (200) further comprises any one of a NAND memory module (212); a solid-state drive, SSD (214); and / or a hard disk drive, HDD (216).

10. An electronic system (300) comprising: a memory device (100) of any one of claims 1-8 configured to store computer readable instructions (320), or a memory system (200) of claim 9 configured to store the computer readable instructions (320); and a computer processor (318) configured to execute the computer readable instructions (320).

11. An electronic system (300) of claim 10, wherein the electronic system (300) is any one of:- an advanced driver assistance system, ADAS, for a vehicle, wherein the computer readable instructions (320) comprise instructions for assisting a driver in a driving environment;- a head unit of a vehicle comprising at least one display (326), wherein the computer readable instructions (320) comprise instructions for computing and / or graphical rendering for the at least one display (326);- a telematic system for a vehicle comprising at least one antenna for vehicle connectivity, wherein the computer readable instructions (320) comprise instructions for computing of data associated with the vehicle connectivity;- a medical system comprising at least one display (326), wherein the computer readable instructions (320) comprise instructions for graphical rendering for the at least one display (326) and / or computations associated with medical data received by the medical system;- a system-on-chip component, SOC, wherein the computer readable instructions (320) comprise instructions for at least one operation of the SOC;- a laptop or a netbook comprising a display (326), wherein the computer readable instructions (320) comprise instructions for graphical rendering for the display (326) and / or computations by the laptop or the netbook;- a hardware component for internet of things, loT, wherein the computer readable instructions (320) comprise instructions for computations of data associated with the loT; and / or- an electronic ecosystem comprising an interconnected network of hardware, computer programs, cloud storage, and network components that work together to provide an integrated operation, wherein the computer readable instructions (320) comprise instructions for computations and / or graphical rendering associated with the integrated operation.

12. An electronic system (300) of 11, wherein: the OS is an operative system of the ADAS, and the OS is stored in the SCM module (104; 104a); and wherein the ADAS further comprises:at least one computer interface (324) for providing the computer readable instructions (320) to the driver or a vehicle component; at least one sensor and / or camera (322) to detect obstacles and / or driving errors, wherein the computer processor (318) is further configured to: operate the OS of the ADAS, receive data from the at least one sensor and / or camera (322) associated with the obstacles and / or driving errors, compute the received data, based on the computing, generate the computer readable instructions (320), and provide the computer readable instructions (320) via the at least one computer interface (324) to the driver to increase road safety and / or to the vehicle component for controlling the vehicle component automatically, and wherein the purpose-specific executable memory part (102b) is configured to store the computer readable instructions (320).

13. An electronic system (300) of 11, wherein: the OS is an operative system of the head unit, and the OS is stored in the SCM module (104; 104a); and wherein the head unit further comprises: at least one vision, sound and / or a touch sensor (322) for receiving data associated with the vehicle, a driver and / or a passenger, at least one computer interface (324); wherein the computer processor (318) is further configured to: operate the OS of the head unit, receive data from the at least one sensor (322), compute the received data, based on the computing, generate the computer readable instructions (320), provide the computer readable instructions (320) via the at least one computer interface (324) to the driver, the passenger and / or to a vehicle component to control the vehicle component automatically, and render the computer readable instructions (320) on the at least one display (326), and wherein the purpose-specific executable memory part (102b) is configured to store the computer readable instructions (320).

14. An electronic system (300) of 11, wherein the OS is an operative system of the telematic system, the OS is stored in the SCM module (104; 104a), and wherein the telematic system further comprises: at least one receiver (322) for receiving a telecommunication signal associated with at least vehicle's location and / or speed; and at least one computer interface (324); wherein the computer processor (318) is further configured to: operate the OS of the telematic system, receive data from the at least one receiver (322), the data associated with the at least vehicle's location and / or speed in a driving environment, compute the received data, based on the computing, generate the computer readable instructions (320), and provide the computer readable instructions (320) via the at least one computer interface (324) to the driver for assisting the driver in the driving environment, and wherein the purpose-specific executable memory part (102b) is configured to store the computer readable instructions (320).

15. A method (400) of using a storage class memory (400), the method comprising steps of:- providing (S402) a storage class memory, SCM, module (104) and a dynamic random access memory, DRAM, module (106) for manufacturing an executable memory module (102) for a memory device (100) or a memory system (200) of an electronic system (300);- configuring (S404) the SCM module (104) for general -purpose executable instructions, wherein the general-purpose executable instructions are associated with an operative system, OS, of the electronic system (300);- configuring (S406) the DRAM module (106) for purpose-specific executable instructions, wherein the purpose-specific executable instructions are associated with computing and / or graphic rendering performed by the electronic system (300);- providing (S408) at least one computer processor (318) for executing the general- purpose executable instructions and the purpose-specific executable instructions directly in the memory modules (104) and (106); and- configuring (S410) the at least one computer processor (318) to enter a standby mode by suspending the processor’s system information to the SCM module (104) before entering the standby mode, wherein the standby mode is a power state wherein one or more components of the electronic system (300) are powered off.

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