Composition, cured body, display device, and solar cell

Abstract

Provided is a composition comprising a cationically polymerizable compound (A), a cationic polymerization initiator (B), and an inorganic filler (C), wherein the inorganic filler (C) comprises one or more components selected from talc, alumina, silica, zeolite, and titanium oxide and the total amount of one or more components selected from the talc and the alumina is 1-100 parts by mass when the total mass of the inorganic filler is set to 100 parts by mass.

Description

Composition, cured product, display device and solar cell

[0001] The present invention relates to a composition, a cured product, a display device, and a solar cell.

[0002] In recent years, research has been progressing on organic optical devices using organic thin film elements such as organic electroluminescence (organic EL) display elements and organic thin film solar cell elements. Organic thin film elements can be easily fabricated by vacuum deposition, solution coating, etc., and therefore have excellent productivity. Examples of technologies related to sealants for such organic electroluminescence display elements include those described in Patent Documents 1 and 2.

[0003] Patent Document 1 discloses a sealant for organic electroluminescence display elements, which contains a cationically polymerizable compound containing an epoxy compound having a hydrogenated bisphenol skeleton and a thermal cationic polymerization initiator having a cation moiety represented by a specific chemical formula, and is characterized in that the content of the thermal cationic polymerization initiator having a cation moiety represented by the specific chemical formula is less than 0.1 parts by weight relative to 100 parts by weight of the cationically polymerizable compound, and it is described as having excellent low-temperature curability, storage stability, and flatness of the cured film.

[0004] Patent Document 2 discloses a curable resin composition containing a cationically polymerizable resin, an acid generator, and a metal alkoxide, wherein the acid generator is a quaternary ammonium salt, and describes that the progress of the curing reaction is unlikely to be inhibited.

[0005] JP 2016-051602 A JP 2022-182017 A

[0006] The present invention provides a composition having improved adhesion to a substrate, and a cured product, a display device, and a solar cell using the composition.

[0007] The present inventors have conducted extensive research to achieve the above object, and as a result have found that the adhesiveness of a composition to a substrate can be improved by including a predetermined amount of one or more selected from talc and alumina, thereby completing the present invention.

[0008] According to the present invention, there are provided a composition, a cured product, a display device, and a solar cell as shown below.

[0009] [1] A composition comprising a cationically polymerizable compound (A), a cationic polymerization initiator (B), and an inorganic filler (C), wherein the inorganic filler (C) comprises one or more selected from talc, alumina, silica, zeolite, and titanium oxide, and wherein the total content of the one or more selected from talc and alumina is 1 part by mass to 100 parts by mass, relative to 100 parts by mass of the total amount of the inorganic filler (C). [2] The composition according to [1], wherein the inorganic filler (C) comprises one or more selected from talc and alumina. [3] The composition according to [2], wherein the inorganic filler (C) comprises talc and silica. [4] The composition according to [3], wherein the ratio of the silica content to the talc content in the inorganic filler (C) (the silica content / the talc content) is 1.0 or more. [5] The composition according to any one of [1] to [4], having a viscosity of 113,400 mPa·s or more and 1,134,000 mPa·s or less, measured under the following <Measurement Condition 1>. <Measurement Condition 1> Apparatus: Cone-plate viscometer Temperature: 25°C Cone: Radius 12 mm, angle 3° Shear rate: 0.0417 s －１ Sample volume: 0.5 mL Atmosphere: under air [6] The composition according to any one of [1] to [5], having a viscosity of 31,750 mPa·s or more and 317,000 mPa·s or less according to the following <Measurement Condition 2>. <Measurement Condition 2> Apparatus: Cone-plate viscometer Temperature: 25°C Cone: Radius 12 mm, angle 3° Shear rate: 0.0117 s －１ Sample volume: 0.5 mL Atmosphere: under air [7] Shear rate 0.0417 s under the following <Measurement Condition 3> －１ Viscosity η measured at １ (mPa·s) and a shear rate of 0.0117 s －１ Viscosity η measured at ２ (mPa s) １ / η ２The composition according to any one of [1] to [6], wherein the thixotropy index (expressed as a function of the viscosity of the viscometer) is 0.5 or more and 4.0 or less. <Measurement Condition 3> Apparatus: Cone-plate viscometer Temperature: 25°C Cone: Radius 12 mm, angle 3° Shear rate: 0.0417 s －１ or 0.0117s －１ Sample volume: 0.5 mL Atmosphere: under air [8] The composition was irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. ２ and then heated at 85°C for 1 hour, the resulting cured product has a glass transition temperature of 70°C or higher and 150°C or lower, as measured by dynamic viscoelasticity measurement at a heating rate of 5°C / min. [9] The composition according to any one of [1] to [7], wherein the composition is irradiated with light of 365 nm wavelength using a high-pressure mercury lamp at a rate of 6,000 mJ / cm. ２ and then heated at 85°C for 1 hour. The cured product had a moisture permeability of 40 g / (m2) as measured in accordance with JIS Z 0208:1976. ２

[10] The composition according to any one of [1] to [9], wherein the tensile shear strength according to the following <Tensile shear strength> is 15.0 MPa or more and 45.0 MPa or less. <Tensile shear strength> The composition is applied to the center of the surface of a 25 mm square piece of alkali-free glass to a diameter of 8 mm and a thickness of 8 mm, and another piece of alkali-free glass is attached to the applied composition. The two pieces of alkali-free glass are clamped together, and light of 365 nm wavelength is applied at 6,000 mJ / cm using a high-pressure mercury lamp. ２The composition is irradiated under the conditions of (1) to (10) above, and heated at 85°C for 1 hour to prepare a test piece, the clamps are removed, and SPCC plates having a length of 100 mm, a width of 25 mm, and a thickness of 1.6 mm are bonded to the alkali-free glass on both sides of the test piece using a two-component acrylic adhesive, and the tensile shear strength (MPa) is measured when the two SPCC plates are gripped and pulled at a temperature of 23°C and a pulling rate of 10 mm / min in accordance with JIS K 6850: 1999.

[11] The composition is described in any one of (1) to (10), wherein the tensile shear strength reduction rate (%) after storage in an environment of 85°C and 85% RH is 40% or less, as determined below in <Tensile shear strength reduction rate>. <Reduction Rate of Tensile Shear Strength> The composition was applied to the center of the surface of a 25 mm square non-alkali glass sheet to a diameter of 8 mm and a thickness of 8 mm, and another sheet of non-alkali glass was attached to the applied composition. The two sheets of non-alkali glass were then clamped together and irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. ２ The specimen was irradiated under the conditions of 100 mm in length, 25 mm in width, and 1.6 mm in thickness, and heated at 85°C for 1 hour to prepare a test piece. The clamps were removed, and SPCC plates each having a length of 100 mm, a width of 25 mm, and a thickness of 1.6 mm were attached to the alkali-free glass on both sides of the test piece using a two-component acrylic adhesive. The two SPCC plates were then pulled at a temperature of 23°C and a pulling rate of 10 mm / min in accordance with JIS K 6850:1999, and the tensile shear strength was measured as the initial tensile shear strength A. １ (MPa), and the test piece was left standing in an environment of a temperature of 85°C and a relative humidity of 85% RH for 7 days, and then the initial tensile shear strength A １ The tensile shear strength measured in the same manner as above was defined as tensile shear strength A ２ (MPa), and the reduction rate (%) of tensile shear strength before and after storage was calculated using the formula: ((A １ -A ２ ) / A １) × 100.

[12] The composition according to any one of [1] to

[11] , which can be applied using a dispenser.

[13] The composition according to any one of [1] to

[12] , wherein the content of the inorganic filler (C) is 10 parts by mass or more and 300 parts by mass or less relative to 100 parts by mass of the cationically polymerizable compound (A).

[14] The composition according to any one of [1] to

[13] , wherein the content of the cationically polymerizable compound (A) is 20% by mass or more and 90% by mass or less, when the total content of the composition is 100% by mass.

[15] The composition according to any one of [1] to

[14] , wherein the content of the cationically polymerizable compound (B) is 0.01 parts by mass or more and 5.0 parts by mass or less relative to 100 parts by mass of the cationically polymerizable compound (A).

[16] The composition according to any one of [1] to

[15] , wherein the cationically polymerizable compound (A) contains an epoxy group.

[17] The composition according to

[16] , wherein the cationically polymerizable compound (A) comprises one or more compounds selected from the group consisting of an alicyclic compound (A1) having an epoxy group, an aromatic compound (A2) having an epoxy group, and a glycidyl ether compound (A3).

[18] The composition according to any one of [1] to

[17] , wherein the cationically polymerizable compound (A) comprises a bromine atom.

[19] The composition according to any one of [1] to

[18] , wherein the cationically polymerizable compound (B) comprises one or more compounds selected from the group consisting of a photocationic polymerization initiator (B1) and a thermal cationic polymerization initiator (B2).

[20] The composition according to

[19] , wherein the cationically polymerizable compound (B) comprises an onium salt compound.

[21] The composition according to any one of [1] to

[20] , wherein the cationically polymerizable compound (A) comprises one or more compounds selected from the group consisting of a damming agent and a filling agent in a display device.

[22] The composition according to any one of [1] to

[21] , wherein the composition is usable for sealing a light-emitting diode element or a solar cell.

[23] The composition according to

[22] , wherein the light-emitting diode element comprises an organic electroluminescence display element or a micro LED.

[24] The composition according to

[22] , wherein the solar cell comprises a perovskite solar cell.

[25] A cured body obtained by curing the composition according to any one of [1] to

[24] .

[26] A display device comprising: a light-emitting diode element; a substrate; and a cured sealing layer between the light-emitting diode element and the substrate, the cured body according to

[25] .

[27] The display device according to

[26] , wherein the light-emitting diode element comprises an organic electroluminescence display element or a micro LED.

[28] A solar cell comprising: a solar cell; a substrate; and a cured sealing layer between the solar cell and the substrate, the cured body according to

[25] .

[29] The solar cell according to

[28] , wherein the solar cell comprises a perovskite solar cell.

[0010] According to the present invention, it is possible to provide a composition having improved adhesion to a substrate, and a cured product, a display device, and a solar cell using the composition.

[0011] 1. Composition The composition of the present embodiment includes a cationically polymerizable compound (A), a cationic polymerization initiator (B), and an inorganic filler (C), wherein the inorganic filler (C) includes one or more types selected from talc, alumina, silica, zeolite, and titanium oxide, and the total content of the one or more types selected from talc and alumina is 1 part by mass or more and 100 parts by mass or less, relative to 100 parts by mass of the total amount of the inorganic filler (C).

[0012] In organic electroluminescent display devices, an organic light-emitting material layer (organic electroluminescent display element) on a substrate is sealed with an inorganic film, a filler, a damming agent, etc. However, there is a problem in that if moisture penetrates into the organic light-emitting material layer through defects in the inorganic film or the electrode in contact with the organic electroluminescent display element, non-light-emitting areas (dark spots) are generated. Therefore, there is a problem in that the above-mentioned sealants such as the filler and damming agent need to improve and maintain adhesion to the substrate.

[0013] The present inventors have investigated the above-mentioned problems and found that the adhesive strength between a substrate and the composition can be improved by including a predetermined amount of one or more selected from talc and alumina in the composition. Although the reason for this is not clear, it is presumed that the inclusion of these inorganic fillers shortens the distance between oxygen and hydrogen in the hydrogen bonds on the surface of the inorganic filler, forming a strong hydrogen-bonded layer on the surface of the inorganic filler, thereby improving the adhesive strength between the substrate and the composition.

[0014] Below, the components contained in the composition of this embodiment will be further explained.

[0015] [Component (C): Inorganic Filler] In the composition of this embodiment, the inorganic filler (C) includes one or more selected from talc and alumina. In the composition of this embodiment, the total content of the one or more selected from talc and alumina is, from the viewpoint of improving adhesion to the substrate, 1 part by mass or more, preferably 3 parts by mass or more, more preferably 5 parts by mass or more, even more preferably 7 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 13 parts by mass or more, even more preferably 15 parts by mass or more, even more preferably 18 parts by mass or more, even more preferably 20 parts by mass or more, even more preferably 30 parts by mass or more, and 100 parts by mass or less, when the total amount of the inorganic filler (C) is 100 parts by mass. Furthermore, in the composition of the present embodiment, the total content of one or more selected from talc and alumina is, from the viewpoint of improving adhesion to the substrate, 1 part by mass or more and 100 parts by mass or less, preferably 3 parts by mass or more and 100 parts by mass or less, more preferably 5 parts by mass or more and 100 parts by mass or less, even more preferably 7 parts by mass or more and 100 parts by mass or less, even more preferably 10 parts by mass or more and 100 parts by mass or less, even more preferably 13 parts by mass or more and 100 parts by mass or less, even more preferably 15 parts by mass or more and 100 parts by mass or less, even more preferably 18 parts by mass or more and 100 parts by mass or less, even more preferably 20 parts by mass or more and 100 parts by mass or less, and even more preferably 30 parts by mass or more and 100 parts by mass or less, when the total amount of the inorganic filler (C) is taken as 100 parts by mass.

[0016] The inorganic filler (C) may also contain talc and silica. When the inorganic filler (C) contains talc, the adhesiveness to the substrate can be further improved. When the inorganic filler (C) contains silica, the water vapor barrier property can be further improved, and thus the penetration of moisture from the outside can be further suppressed. That is, when the inorganic filler (C) contains both talc and silica, the performance balance between the adhesiveness to the substrate and the moisture permeability can be further improved.

[0017] When the inorganic filler (C) contains talc and silica, the ratio of the silica content to the talc content in the inorganic filler (C) (silica content / talc content) is, from the viewpoint of further improving the performance balance between the adhesion to the substrate and the water vapor barrier property, preferably 1.0 or more, more preferably 1.5 or more, even more preferably 2.0 or more, and still more preferably 2.5 or more. The upper limit is not particularly limited, but may, for example, be 50.0 or less, 30.0 or less, 25.0 or less, 20.0 or less, 10.0 or less, 8.0 or less, 6.0 or less, or 4.0 or less. Furthermore, when the inorganic filler (C) contains talc and silica, the ratio of the silica content to the talc content in the inorganic filler (C) (silica content / talc content) is, from the viewpoint of further improving the performance balance between the adhesion to the substrate and the water vapor barrier property, preferably from 1.0 to 50.0, more preferably from 1.0 to 30.0, even more preferably from 1.5 to 25.0, even more preferably from 1.5 to 20.0, even more preferably from 2.0 to 10.0, even more preferably from 2.0 to 8.0, even more preferably from 2.5 to 6.0, and even more preferably from 2.5 to 4.0.

[0018] In the composition of this embodiment, the inorganic filler (C) preferably includes one or more selected from the group consisting of talc, alumina, silica, zeolite, and titanium oxide. In the composition of this embodiment, it is preferable to use a combination of two or more inorganic fillers (C). The combination of inorganic fillers (C) is preferably one selected from the group consisting of a combination of silica and talc, a combination of alumina and talc, a combination of titanium oxide and talc, and a combination of silica, talc, and zeolite. Among these, from the viewpoint of further improving the balance of adhesiveness to the substrate and water vapor barrier properties, it is more preferable that the inorganic filler (C) be a combination of silica and talc. On the other hand, from the viewpoint of further improving adhesiveness to the substrate, it is preferable that the inorganic filler (C) include talc alone. However, while talc can improve the adhesive strength to the substrate, it is difficult for it to improve the water vapor barrier property, and therefore, from the viewpoint of further improving the performance balance between adhesive strength and water vapor barrier property, it is preferable to combine talc with silica, alumina, etc., which can further improve the water vapor barrier property, as the inorganic filler (C). Although silica can further improve the water vapor barrier property, it is difficult for it to increase the adhesive strength to the substrate, so it is preferable to combine it with talc, alumina, etc., which can improve the adhesive strength. In the composition of the present embodiment, the content of talc, when the total amount of the inorganic filler (C) is taken as 100 parts by mass, is preferably 1 part by mass or more, more preferably 3 parts by mass or more, even more preferably 5 parts by mass or more, even more preferably 7 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 13 parts by mass or more, even more preferably 15 parts by mass or more, even more preferably 18 parts by mass or more, and even more preferably 20 parts by mass or more, from the viewpoint of further improving the adhesion to the substrate and further improving the viscosity and the thixotropy index; and is preferably 100 parts by mass or less, more preferably 80 parts by mass or less, even more preferably 50 parts by mass or less, and even more preferably 40 parts by mass or less, from the viewpoint of further improving the moisture permeability and further suppressing dripping.Furthermore, in the composition of the present embodiment, the content of talc, when the total amount of the inorganic filler (C) is taken as 100 parts by mass, is preferably 1 part by mass or more and 100 parts by mass or less, more preferably 3 parts by mass or more and 100 parts by mass or less, even more preferably 5 parts by mass or more and 80 parts by mass or less, even more preferably 7 parts by mass or more and 80 parts by mass or less, even more preferably 10 parts by mass or more and 80 parts by mass or less, even more preferably 13 parts by mass or more and 50 parts by mass or less, even more preferably 15 parts by mass or more and 50 parts by mass or less, even more preferably 18 parts by mass or more and 40 parts by mass or less, and even more preferably 20 parts by mass or more and 40 parts by mass or less, from the viewpoints of further improving adhesion to the substrate, further improving viscosity and thixotropy index, further improving moisture permeability, and further suppressing dripping.

[0047] In the composition of this embodiment, the content of silica is preferably 0 parts by mass or more, more preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, and even more preferably 70 parts by mass or more, from the viewpoint of further improving the balance of adhesion to the substrate and water vapor barrier property, when the total amount of the inorganic filler (C) is taken as 100 parts by mass, and from the viewpoint of further improving the adhesion to the substrate, it is preferably 99 parts by mass or less, more preferably 95 parts by mass or less, even more preferably 90 parts by mass or less, even more preferably 85 parts by mass or less, and even more preferably 80 parts by mass or less. In the composition of this embodiment, the content of alumina is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, and even more preferably 90 parts by mass or more, and preferably 100 parts by mass or less, from the viewpoint of further improving the adhesion to the substrate, when the total amount of the inorganic filler (C) is taken as 100 parts by mass. In the composition of this embodiment, the content of zeolite is preferably 0 part by mass or more, more preferably 0.1 part by mass or more, even more preferably 0.2 part by mass or more, and preferably 1 part by mass or less, from the viewpoint of further improving the balance of performance among adhesion to the substrate, curability, and storage stability, when the total amount of the inorganic filler (C) is taken as 100 parts by mass. In the composition of this embodiment, the content of titanium oxide is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and preferably 10 parts by mass or less, more preferably 8 parts by mass or less, from the viewpoint of further improving the adhesion to the substrate, when the total amount of the inorganic filler (C) is taken as 100 parts by mass.Surface-treated titanium oxide may also be used, and alumina-treated titanium oxide is particularly preferred.

[0019]

[0047] In the composition of the present embodiment, the content of the inorganic filler (C) is, relative to 100 parts by mass of the cationically polymerizable compound (A), preferably 10 parts by mass or more, more preferably 20 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 40 parts by mass or more, even more preferably 50 parts by mass or more, even more preferably 70 parts by mass or more, and even more preferably 90 parts by mass or more, and is preferably 300 parts by mass or less, more preferably 280 parts by mass or less, even more preferably 250 parts by mass or less, even more preferably 200 parts by mass or less, and even more preferably 150 parts by mass or less, from the viewpoint of further improving the adhesion to the substrate and further improving the water vapor barrier property.

[0083] Furthermore, in the composition of the present embodiment, the content of the inorganic filler (C) relative to 100 parts by mass of the cationically polymerizable compound (A), from the viewpoint of further improving the adhesion to the substrate and further improving the water vapor barrier property, is preferably from 10 parts by mass to 300 parts by mass, more preferably from 20 parts by mass to 280 parts by mass, even more preferably from 30 parts by mass to 250 parts by mass, even more preferably from 40 parts by mass to 200 parts by mass, even more preferably from 50 parts by mass to 200 parts by mass, even more preferably from 70 parts by mass to 150 parts by mass, and even more preferably from 90 parts by mass to 150 parts by mass.

[0020] [Component (A): Cationic Polymerizable Compound] Component (A) is a compound having cationic polymerizability, and can also be referred to as a compound having a cationically polymerizable group. Examples of the cationically polymerizable group include cyclic ether groups such as an epoxy group (oxirane ring) or an oxetane group (oxetane ring); and cationically polymerizable vinyl groups. Component (A) preferably contains an epoxy group. That is, component (A) preferably contains one or more compounds selected from the group consisting of epoxy compounds, oxetane compounds, and cationically polymerizable vinyl compounds, and more preferably contains an epoxy compound. Examples of epoxy compounds include an alicyclic compound (A1) having an epoxy group (alicyclic epoxy compound), an aromatic compound (A2) having an epoxy group (aromatic epoxy compound), and a glycidyl ether compound (A3).

[0021] The component (A) may be a compound having one cationically polymerizable group, or may be a compound having two or more cationically polymerizable groups. The component (A) preferably has two or more cationically polymerizable groups, and more preferably has two cationically polymerizable groups.

[0022] From the viewpoint of further improving the coatability and further improving the balance of the performance of adhesion to the substrate and transparency, the component (A) preferably contains one or more compounds selected from the group consisting of an alicyclic compound (A1) having an epoxy group, an aromatic compound (A2) having an epoxy group, and a glycidyl ether compound (A3), and more preferably contains an alicyclic compound (A1) having an epoxy group, an aromatic compound (A2) having an epoxy group, and a glycidyl ether compound (A3). Also, the component (A) preferably contains an alicyclic compound (A1) having an epoxy group and an aromatic compound (A2) having an epoxy group.

[0023] From the viewpoint of further improving the water vapor barrier property, the component (A) preferably contains a bromine atom. Here, "the component (A) contains a bromine atom" means that the component (A) contains a bromine atom-containing compound.

[0024] The component (A) is preferably thermally polymerizable.

[0025] (Component (A1): Alicyclic Compound Having an Epoxy Group) The component (A1) is a compound having an epoxy group and an alicyclic group. The component (A1) may be a compound having one epoxy group, or may be a compound having two or more epoxy groups. The component (A1) preferably has two or more epoxy groups, and more preferably has two epoxy groups. The component (A1) may be a compound having no aromatic ring. The component (A1) can be used alone or in combination of two or more types.

[0026] Component (A1) may be, for example, a compound obtained by epoxidizing a compound having a cycloalkene ring, or a derivative thereof. Examples of cycloalkene rings include a cyclohexene ring, a cyclopentene ring, and a pinene ring. Epoxidation can be carried out, for example, using an oxidizing agent. Examples of oxidizing agents include hydrogen peroxide. Examples of such component (A1) include one or more compounds selected from the group consisting of 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexylalkyl(meth)acrylate (e.g., 3,4-epoxycyclohexylmethyl(meth)acrylate), and (3,3',4,4'-diepoxy)bicyclohexyl.

[0027] Component (A1) may be, for example, a compound obtained by hydrogenating a compound having an epoxy group and an aromatic ring, or a derivative thereof. Examples of compounds having an epoxy group and an aromatic ring include bisphenol A epoxy resins and bisphenol F epoxy resins. Examples of such component (A1) include hydrogenated bisphenol A epoxy resins and hydrogenated bisphenol F epoxy resins.

[0028] The component (A1) is preferably a compound having a 1,2-epoxycyclohexane structure. As the compound having a 1,2-epoxycyclohexane structure, for example, a compound represented by formula (A1-1) is preferred.

[0029]

[0030] In formula (A1-1), X represents a single bond or a linking group (a divalent group having one or more atoms).

[0031] When X is a single bond, the compound represented by formula (A1-1) is (3,3',4,4'-diepoxy)bicyclohexyl.

[0032] The linking group may be, for example, a divalent hydrocarbon group, a carbonyl group, an ether bond, an ester bond, a carbonate group, an amide bond, or a group in which a plurality of these are linked together. X is preferably a linking group. The linking group is preferably a group having an ester bond, and more preferably a group in which an ester bond and a divalent hydrocarbon group are linked together. An example of a compound having a group having an ester bond as a linking group is 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (molecular weight 252).

[0033] The divalent hydrocarbon group is preferably an alkanediyl group, more preferably an alkanediyl group having from 1 to 3 carbon atoms.

[0034] The compound represented by formula (A1-1) is preferably 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate.

[0035] From the viewpoint of further improving the coatability and the storage stability, the molecular weight of the component (A1) is preferably 1,000 or less, more preferably 800 or less, even more preferably 500 or less, and still more preferably 300 or less. The molecular weight of the component (A1) may be, for example, 100 or more, 150 or more, or 200 or more.

[0036] When component (A1) has a molecular weight distribution, the number average molecular weight of component (A1) is preferably within the above range. In this specification, the number average molecular weight refers to a polystyrene-equivalent value measured by gel permeation chromatography (GPC) under the following measurement conditions. Solvent (mobile phase): THF Degasser: ERC-3310 manufactured by ERMA Pump: PU-980 manufactured by JASCO Flow rate: 1.0 ml / min Autosampler: AS-8020 manufactured by Tosoh Corporation Column oven: L-5030 manufactured by Hitachi, Ltd. Set temperature: 40°C Column configuration: 2 columns of TSKguard column MP (x L) 6.0 mm ID x 4.0 cm manufactured by Tosoh Corporation and 2 columns of TSK-GELMULTIPORE HXL-M 7.8 mm ID x 30.0 cm manufactured by Tosoh Corporation, a total of 4 columns Detector: RI L-3350 manufactured by Hitachi, Ltd. Data processing: SIC480 data station

[0037] From the viewpoint of further improving the performance balance between coatability and durability, the content of component (A1) in the composition of this embodiment, relative to 100 parts by mass of the total amount of component (A) in the composition of this embodiment, is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, even more preferably 15 parts by mass or more, and even more preferably 20 parts by mass or more, and is preferably 60 parts by mass or less, more preferably 50 parts by mass or less, even more preferably 40 parts by mass or less, and even more preferably 30 parts by mass or less.

[0038] (Component (A2): Aromatic Compound Having an Epoxy Group) The component (A2) is a compound having an epoxy group and an aromatic ring. The component (A2) may be a compound having one epoxy group, or a compound having two or more epoxy groups. The component (A2) preferably has two or more epoxy groups, and more preferably has two epoxy groups. The component (A2) may be a compound having no alicyclic group. The component (A2) can be used alone or in combination of two or more types.

[0039] The (A2) component can be any monomer, oligomer, or polymer. Examples include one or more selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, biphenyl epoxy resins, naphthalene epoxy resins, fluorene epoxy resins, novolac phenol epoxy resins, cresol novolac epoxy resins, and modified versions thereof. Further examples of the (A2) component include one or more selected from the group consisting of halophenyl glycidyl ethers such as bromophenyl glycidyl ether and dibromophenyl glycidyl ether; bromine-containing epoxy resins such as brominated bisphenol A epoxy resins, brominated bisphenol F novolac epoxy resins, and brominated phenol novolac epoxy resins; and other bromine-containing aromatic epoxy compounds. Halophenyl glycidyl ethers are preferred as the bromine-containing aromatic epoxy compound. Dibromophenyl glycidyl ether is more preferred as the halophenyl glycidyl ether.

[0040] The component (A2) preferably comprises one or more compounds selected from the group consisting of compounds having a bisphenol structure (e.g., a bisphenol A structure, a bisphenol F structure, a bisphenol S structure, etc.) and bromine atom-containing aromatic epoxy compounds, more preferably one or more compounds selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and halophenyl glycidyl ethers, even more preferably one or more compounds selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and dibromophenyl glycidyl ethers, and even more preferably at least one compound selected from the group consisting of bisphenol F epoxy resins and dibromophenyl glycidyl ethers.

[0041] From the viewpoint of further improving the balance of application properties and storage stability, the molecular weight of the component (A2) is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, and even more preferably 300 or more, and is preferably 5,000 or less, more preferably 1,000 or less, even more preferably 800 or less, and even more preferably 700 or less.

[0042] When component (A2) has a molecular weight distribution, the number average molecular weight of component (A2) is preferably within the above range. In this specification, the number average molecular weight refers to a polystyrene-equivalent value measured by gel permeation chromatography (GPC) under the above-mentioned measurement conditions.

[0043] From the viewpoint of further improving the performance balance between coatability and durability, the content of component (A2) in the composition of this embodiment, relative to 100 parts by mass of the total amount of component (A) in the composition of this embodiment, is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, even more preferably 60 parts by mass or more, and even more preferably 70 parts by mass or more, and is preferably 90 parts by mass or less, more preferably 85 parts by mass or less.

[0044] (Component (A3): Glycidyl Ether Compound) The component (A3) is a compound having a glycidyl ether group. The component (A3) may be a compound having one epoxy group, or a compound having two or more epoxy groups. The component (A3) preferably has two or more epoxy groups, and more preferably has two epoxy groups. The component (A3) may be a compound having no alicyclic group or aromatic ring. The component (A3) can be used alone or in combination of two or more. The component (A3) preferably excludes the components (A1) and (A2).

[0045] The component (A3) preferably contains a diglycidyl ether compound. From the viewpoint of further improving coatability, the diglycidyl ether compound preferably contains one or more compounds selected from the group consisting of diglycidyl ethers of alkylene glycols such as diglycidyl ether of ethylene glycol, diglycidyl ether of propylene glycol, diglycidyl ether of 1,6-hexanediol, and diglycidyl ether of neopentyl glycol; polyglycidyl ethers of polyhydric alcohols such as di- or triglycidyl ethers of glycerin or its alkylene oxide adduct; and diglycidyl ethers of polyalkylene glycols such as diglycidyl ethers of polyethylene glycol or its alkylene oxide adducts, and diglycidyl ethers of polypropylene glycol or its alkylene oxide adducts, and preferably contains a diglycidyl ether of an alkylene glycol. The diglycidyl ether of alkylene glycol preferably includes one or more selected from the group consisting of diglycidyl ether of ethylene glycol, diglycidyl ether of propylene glycol, diglycidyl ether of 1,6-hexanediol, and diglycidyl ether of neopentyl glycol, and more preferably includes one or two selected from the group consisting of diglycidyl ether of 1,6-hexanediol and diglycidyl ether of neopentyl glycol. Examples of alkylene glycol include ethylene glycol, propylene glycol, 1,6-hexanediol, and neopentyl glycol. Examples of polyalkylene glycol include polyethylene glycol or its alkylene oxide adduct, and polypropylene glycol or its alkylene oxide adduct. Examples of alkylene oxide include ethylene oxide and propylene oxide.

[0046] From the viewpoint of further improving the performance balance between coatability and durability, the content of component (A3) in the composition of this embodiment, relative to 100 parts by mass of the total amount of component (A) in the composition of this embodiment, is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, even more preferably 0.5 parts by mass or more, even more preferably 1.0 part by mass or more, and even more preferably 1.5 parts by mass or more, and is preferably 20 parts by mass or less, more preferably 15 parts by mass or less, even more preferably 10 parts by mass or less, even more preferably 5 parts by mass or less, and even more preferably 3 parts by mass or less.

[0047] From the viewpoint of further improving the performance balance between coatability and durability, the total content of the component (A1), the component (A2), and the component (A3) in the composition of this embodiment is, when the total amount of the component (A) in the composition of this embodiment is taken as 100 parts by mass, preferably 60 parts by mass or more, more preferably 70 parts by mass or more, even more preferably 80 parts by mass or more, even more preferably 95 parts by mass or more, and still more preferably 98 parts by mass or more, and is, for example, 100 parts by mass or less.

[0048] In the composition of this embodiment, from the viewpoint of further improving the balance between coatability and durability, the content of the cationically polymerizable compound (A) is preferably 20% by mass or more, more preferably 25% by mass or more, even more preferably 30% by mass or more, even more preferably 35% by mass or more, even more preferably 40% by mass or more, and is preferably 90% by mass or less, more preferably 85% by mass or less, even more preferably 80% by mass or less, even more preferably 75% by mass or less, and even more preferably 70% by mass or less, based on 100% by mass of the entire composition. Furthermore, in the composition of this embodiment, from the viewpoint of further improving the balance between coatability and durability, the content of the cationically polymerizable compound (A) is preferably 20% by mass or more and 90% by mass or less, more preferably 25% by mass or more and 85% by mass or less, even more preferably 30% by mass or more and 80% by mass or less, even more preferably 35% by mass or more and 75% by mass or less, and even more preferably 40% by mass or more and 70% by mass or less, based on 100% by mass of the entire composition.

[0049] [Cationic Polymerization Initiator (B)] The component (B) includes one or more members selected from the group consisting of a photocationic polymerization initiator (B1) that can be activated by light to initiate the cationic polymerization of the component (A); and a thermal cationic polymerization initiator (B2) that can be activated by heat to initiate the cationic polymerization of the component (A), and preferably includes a photocationic polymerization initiator (B1).

[0050] Examples of the photocationic polymerization initiator (B1) include arylsulfonium salt derivatives (e.g., Cyracure UVI-6990 and Cyracure UVI-6974 manufactured by The Dow Chemical Company, Adeka Optomer SP-150, Adeka Optomer SP-152, Adeka Optomer SP-170 and Adeka Optomer SP-172 manufactured by ADEKA Corporation, CPI-100P, CPI-101A and CPI-102 manufactured by San-Apro Co., Ltd.), 200K, CPI-210S, CPI-310FG, LW-S1, Cibacur-1190 manufactured by Double Bond Corporation, etc.), aryl iodonium salt derivatives (for example, Irgacure 250 manufactured by Ciba Specialty Chemicals, RP-2074 manufactured by Rhodia Japan, etc.), allene-ion complex derivatives, diazonium salt derivatives, triazine initiators, acid generators such as other halides, etc.

[0051] Examples of the thermal cationic polymerization initiator (B2) include any thermal cationic polymerization initiator that is activated by heating to induce ring-opening of a ring-opening polymerizable group. Examples of the thermal cationic polymerization initiator include onium salt compounds such as quaternary ammonium salts, phosphonium salts, and sulfonium salts. Commercially available products of the thermal cationic polymerization initiator (B2) include Adekaopton CP-66 and Adekaopton CP-77 (manufactured by ADEKA Corporation), San-Aid SI-60L, San-Aid SI-80L, and San-Aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.), and the CI series (manufactured by Nippon Soda Co., Ltd.).

[0052] Component (B) preferably contains an onium salt compound from the viewpoints of further improving curability, further suppressing deterioration of the target to which the composition is applied, and further improving the durability of the cured product obtained from the composition. The onium salt compound preferably contains one or more compounds selected from the group consisting of aryl sulfonium salt derivatives, aryliodonium salt derivatives, and diazonium salt derivatives, more preferably an aryl sulfonium salt derivative. The anion preferably contains one or more compounds selected from the group consisting of antimonate and gallate.

[0053] Component (B) may be dissolved in a solvent in advance to facilitate mixing with other components such as component (A). The solvent is not particularly limited, but examples include carbonates such as propylene carbonate, ethylene carbonate, 1,2-butylene carbonate, dimethyl carbonate, and diethyl carbonate.

[0054] The content of component (B) in the composition of the present embodiment, relative to 100 parts by mass of component (A), is preferably 0.01 part by mass or more, more preferably 0.05 part by mass or more, even more preferably 0.10 part by mass or more, even more preferably 0.30 part by mass or more, even more preferably 0.50 part by mass or more, and even more preferably 0.80 part by mass or more, from the viewpoint of further improving the adhesive durability of the cured product, and is preferably 5.0 parts by mass or less, more preferably 4.0 parts by mass or less, even more preferably 3.0 parts by mass or less, and even more preferably 2.5 parts by mass or less, from the viewpoint of further improving the adhesive durability of the cured product. Furthermore, from the viewpoint of further improving the curability and further improving the adhesive durability of the cured product, the content of component (B) in the composition of the present embodiment is preferably from 0.01 to 5.0 parts by mass, more preferably from 0.05 to 5.0 parts by mass, even more preferably from 0.10 to 4.0 parts by mass, even more preferably from 0.30 to 3.0 parts by mass, even more preferably from 0.50 to 3.0 parts by mass, and even more preferably from 0.80 to 2.5 parts by mass, per 100 parts by mass of component (A).

[0055] [Component (X): Curing Retarder] The composition of the present embodiment preferably contains a curing retarder as component (X). From the viewpoint of further improving the performance balance between application ability and storage stability, component (X) preferably contains one or more selected from the group consisting of a phosphoric acid-based curing retarder (component (D)), an ether-based curing retarder (component (E)), a thioether-based curing retarder (component (F)), a metal complex-based curing retarder (component (G)), and a nitroxy radical-based curing retarder (component (H)), and more preferably contains one or more selected from the group consisting of a phosphoric acid-based curing retarder (component (D)) and an ether-based curing retarder (component (E)).

[0056] The content of the component (X) in the composition of the present embodiment, per 100 parts by mass of the component (A), is preferably 0.10 parts by mass or more, more preferably 0.20 parts by mass or more, even more preferably 0.50 parts by mass or more, even more preferably 0.80 parts by mass or more, even more preferably 1.0 part by mass or more, and even more preferably 2.0 parts by mass or more, from the viewpoint of obtaining a longer pot life; and is preferably 10.0 parts by mass or less, more preferably 8.0 parts by mass or less, and even more preferably 5.0 parts by mass or less, from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness of the cured product.

[0057] (Component (D): Phosphate-Based Curing Retarder) The phosphoric acid-based curing retarder is a curing retarder selected from the group consisting of phosphate esters (component (D1)) and phosphites (component (D2)). Component (D) can be used alone or in combination of two or more.

[0058] Examples of the component (D1) include diethylbenzyl phosphate, trimethyl phosphate, triethyl phosphate, tri-n-butyl phosphate, tris(butoxyethyl) phosphate, tris(2-ethylhexyl) phosphate, (RO) ３Examples of the component (D1) include P═O (wherein R is a lauryl group, a cetyl group, a stearyl group, or an oleyl group), tris(2-chloroethyl)phosphate, tris(2-dichloropropyl)phosphate, triphenyl phosphate, butyl pyrophosphate, tricresyl phosphate, trixylenyl phosphate, octyl diphenyl phosphate, cresyl diphenyl phosphate, xylenyl diphosphate, monobutyl phosphate, dibutyl phosphate, di-2-ethylhexyl phosphate, monoisodecyl phosphate, ammonium ethyl acid phosphate, and 2-ethylhexyl acid phosphate salts. The component (D1) can be used either alone or in combination of two or more.

[0059] From the viewpoints of appropriate reactivity with cations and reduced outgassing, the component (D1) preferably includes one or more compounds selected from the group consisting of compounds represented by formula (D1-1), compounds represented by formula (D1-2), and compounds represented by formula (D1-3), and more preferably includes a compound represented by formula (D1-2).

[0060]

[0061]

[0062]

[0063] In formula (D1-1), formula (D1-2) and formula (D1-3), R １ , R ２ , R ３ , R ４ , R ５ and R ６ each independently represents a hydrocarbon group which may have a substituent.

[0064] R in formula (D1-2) ２ , R ３ and R ４ and R in formula (D1-3). ５ and R ６ is preferably the same group in each formula.

[0065] R １ , R ２ , R ３, R ４ , R ５ and R ６ Examples of the substituent that the hydrocarbon group in R may have include an oxyalkyl group. １ , R ２ , R ３ , R ４ , R ５ and R ６ The hydrocarbon group in is preferably an unsubstituted hydrocarbon group.

[0066] R １ , R ２ , R ３ , R ４ , R ５ and R ６ The hydrocarbon group in is preferably an alkyl group or an aryl group, more preferably an alkyl group or a phenyl group, and even more preferably an alkyl group. The number of carbon atoms in the alkyl group may be, for example, 1 to 18, and preferably 4 to 13.

[0067] The compound represented by formula (D1-1) includes, for example, monoalkyl phosphate (i.e., R １ is an alkyl group), and specific examples include monoethyl phosphate, mono-n-butyl phosphate, mono(butoxyethyl) phosphate, mono(2-ethylhexyl) phosphate, and the like.

[0068] The compound represented by formula (D1-2) includes trialkyl phosphate (i.e., R ２ , R ３ and R ４ is an alkyl group). ２ , R ３ and R ４ The alkyl group preferably has 1 or more and 18 or less carbon atoms, more preferably 4 or more and 12 or less carbon atoms, and even more preferably 8 carbon atoms.

[0069] Specific examples of trialkyl phosphates include triethyl phosphate, tri-n-butyl phosphate, tris(butoxyethyl) phosphate, tris(2-ethylhexyl) phosphate, (RO)３ Examples include P=O (R is a lauryl group, a cetyl group, a stearyl group, or an oleyl group).

[0070] The compound represented by formula (D1-3) includes, for example, dialkyl phosphate (i.e., R ５ and R ６ is an alkyl group), etc. Specific examples of dialkyl phosphates include dibutyl phosphate and bis(2-ethylhexyl) phosphate.

[0071] Component (D2) is a phosphite ester. Examples of component (D2) include trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl) phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl)phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, tris(nonylphenyl)phosphite, tris(2,4-di-t-butylphenyl)phosphite, phenyl diisooctyl phosphite, phenyl diisodecyl phosphite, diphenyl mono(2-ethylhexyl) phosphite, diphenyl isooctyl phosphite, diphenyl monodecyl phosphite, diphenyl monoisodecyl phosphite, diphenyl mono(tridecyl)phosphite, bis(nonylphenyl)dinonylphenyl phosphite, tetraphenyl dipropylene glycol Examples of the component (D2) include bis(tridecyl)pentaerythritol diphosphite, poly(dipropylene glycol)phenyl phosphite, diisodecyl pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, tetraphenyltetra(tridecyl)pentaerythritol tetraphosphite, tetra(tridecyl)-4,4'-isopropylidene diphenyl phosphite, trilauryl trithiophosphite, dimethyl hydrogen phosphite, dibutyl hydrogen phosphite, di(2-ethylhexyl) hydrogen phosphite, dilauryl hydrogen phosphite, dioleyl hydrogen phosphite, diphenyl hydrogen phosphite, diphenyl mono(2-ethylhexyl) phosphite, and diphenyl mono(tridecyl) phosphite. Component (D2) can be used singly or in combination of two or more.

[0072] From the viewpoint of appropriate reactivity with cations, the component (D2) preferably includes one or more compounds selected from the group consisting of compounds represented by formula (D2-1), compounds represented by formula (D2-2), compounds represented by formula (D2-3), compounds represented by formula (D2-4), compounds represented by formula (D2-5), and compounds represented by formula (D2-6).

[0073]

[0074]

[0075]

[0076]

[0077]

[0078]

[0079] In formulas (D2-1) to (D2-6), R ７ , R ８ , R ９ , R １０ , R １１ , R １２ , R １３ , R １４ , R １５ , R １６ and R １７ each independently represents a hydrocarbon group which may have a substituent.

[0080] R ７ , R ８ , R ９ , R １０ , R １１ , R １２ , R １３ , R １４ , R １５ , R １６ and R １７ Examples of the substituent that the hydrocarbon group in R may have include an oxyalkyl group. ７ , R ８ , R ９ , R １０ , R １１ , R １２ , R １３ , R １４ , R１５ , R １６ and R １７ The hydrocarbon group in is preferably an unsubstituted hydrocarbon group.

[0081] R ７ , R ８ , R ９ , R １０ , R １１ , R １２ , R １３ , R １４ , R １５ , R １６ and R １７ The hydrocarbon group in is preferably an alkyl group or an aryl group, more preferably an alkyl group or a phenyl group, and even more preferably an alkyl group. The number of carbon atoms in the alkyl group may be, for example, 1 to 30, preferably 1 to 18. The aryl group is preferably a phenyl group.

[0082] R in formula (D2-2) ８ and R ９ , R in formula (D2-3) １０ , R １１ and R １２ , R in formula (D2-4) １３ and R １４ and R in formula (D2-5) １５ and R １６ are preferably the same in each formula.

[0083] The compound represented by formula (D2-1) is, for example, a monoalkyl phosphite (i.e., R ７ is an alkyl group).

[0084] Examples of the compound represented by formula (D2-2) include dialkyl phosphites (i.e., R ８ and R ９ is an alkyl group).

[0085] Examples of the compound represented by formula (D2-3) include trialkyl phosphites (i.e., R １０ , R １１ and R １２is an alkyl group), phenyl phosphite (i.e., compounds where R １０ , R １１ and R １２ wherein one or more of the groups are phenyl groups). Specific examples of trialkyl phosphites include triethyl phosphite, tris(2-ethylhexyl) phosphite, tridecyl phosphite, trilauryl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, etc. Specific examples of phenyl phosphites include diphenyl monodecyl phosphite, etc.

[0086] Examples of the compound represented by formula (D2-4) include bis(alkyl)pentaerythritol diphosphites (i.e., R １３ and R １４ is an alkyl group), etc. Specific examples of the compound represented by formula (D2-4) include bis(decyl)pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, distearylpentaerythritol diphosphite, etc.

[0087] The compound represented by formula (D2-5) is, for example, a dialkyl hydrogen phosphite (i.e., R １５ and R １６ is an alkyl group), etc. Specific examples of the compound represented by formula (D2-5) include diethyl hydrogen phosphite, bis(2-ethylhexyl) hydrogen phosphite, dilauryl hydrogen phosphite, and dioleyl hydrogen phosphite.

[0088] Examples of the compound represented by formula (D2-6) include monoalkyl hydrogen phosphites (i.e., R １７ is an alkyl group), etc. Specific examples of the compound represented by formula (D2-6) include monoethyl hydrogen phosphite, mono(2-ethylhexyl) hydrogen phosphite, monolauryl hydrogen phosphite, and monooleyl hydrogen phosphite.

[0089] Examples of the component (D2) include trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl) phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, tris(nonylphenyl) phosphite, diisodecyl pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, dimethyl hydrogen phosphite, and dibutyl phosphate. It is preferable that the phosphate ester compound contains one or more selected from the group consisting of hydrogen phosphite, di(2-ethylhexyl)hydrogen phosphite, dilauryl hydrogen phosphite, and dioleyl hydrogen phosphite, and it is more preferable that the phosphate ester compound contains one or more selected from the group consisting of trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl)phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl)phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, and tris(nonylphenyl)phosphite.

[0090] When the composition of the present embodiment contains the component (D), the content of the component (D) in the composition of the present embodiment is, per 100 parts by mass of the component (A), preferably at least 0.001 parts by mass, more preferably at least 0.005 parts by mass, even more preferably at least 0.01 parts by mass, even more preferably at least 0.02 parts by mass, even more preferably at least 0.05 parts by mass, even more preferably at least 0.10 parts by mass, and even more preferably at least 0.30 parts by mass, from the viewpoint of obtaining a longer pot life; and is preferably at most 5.0 parts by mass, more preferably at most 3.0 parts by mass, and even more preferably at most 2.0 parts by mass, from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness of the cured product.

[0091] (Component (E): Ether-Based Cure Retarder) Component (E) is a cure retarder having an ether bond. Component (E) can be used alone or in combination of two or more.

[0092] Component (E) may be a chain ether or a cyclic ether. Examples of chain ethers include polyalkylene oxides such as polyethylene glycol, polypropylene glycol, and polyoxytetramethylene glycol. Examples of polyalkylene oxides include polyoxyethylene-dimethyl ether. Examples of cyclic ethers include crown ethers. Examples of crown ethers include 18-crown-6-ether and 15-crown-5-ether.

[0093] From the viewpoint of appropriate reactivity with cations, the component (E) is preferably a cyclic ether, more preferably a crown ether, and even more preferably 18-crown-6-ether.

[0094] When the composition of the present embodiment contains the component (E), the content of the component (E) in the composition of the present embodiment is, per 100 parts by mass of the component (A), preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.10 parts by mass or more, even more preferably 0.50 parts by mass or more, even more preferably 0.80 parts by mass or more, and still more preferably 1.0 part by mass or more, from the viewpoint of obtaining a longer pot life; and, from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness, the content of the component (E) in the composition of the present embodiment is preferably 10.0 parts by mass or less, more preferably 8.0 parts by mass or less, even more preferably 5.0 parts by mass or less, and still more preferably 3.0 parts by mass or less.

[0095] (Component (F): Thioether-based cure retarder) The component (F) is a cure retarder having a thioether bond. The component (F) can be used alone or in combination of two or more.

[0096] Component (F) may be a chain thioether or a cyclic thioether. Examples of chain thioethers include diethyl thioether, isobutyl sulfide, and dithiaoctanediol. Examples of cyclic thioethers include 1,3-dithiane, 1,3,5-trithiane, 1,4,7-trithiacyclononane, and 1,4,8,11-tetrathiacyclotetradecane.

[0097] (Component (G): Metal Complex-Based Cure Retarder) The component (G) may be any metal complex that functions as a cure retarder. Examples of the component (G) include metal acetylacetonates. The component (G) may be used alone or in combination of two or more.

[0098] Examples of metal acetylacetonates include acetylacetonates of aluminum, titanium, zinc, zirconium, and copper. Among these, acetylacetonates of aluminum and zinc are preferred, and aluminum acetylacetonate is more preferred.

[0099] (Component (H): Nitroxy Radical Cure Retarder) Component (H) is a cure retarder having a nitroxide group. Component (H) can be used alone or in combination of two or more.

[0100] Examples of the component (H) include 2,2,6,6-tetramethyl-1-piperidinyloxy (hereinafter referred to as TEMPO) or its derivatives such as 4-benzooxyloxy-TEMPO, 4-methoxy-TEMPO, 4-carboxyl-4-amino-TEMPO, 4-chloro-TEMPO, 4-hydroxylimine-TEMPO, 4-hydroxy-TEMPO, 4-oxo-TEMPO, and 4-amino-TEMPO; 2,2,5,5-tetramethyl-1-pyrrolidinyloxy (hereinafter referred to as PROXYL) or its derivatives such as 3-carboxyl-PROXYL, 3-carbamoyl-PROXYL, 2,2-dimethyl-4,5-cyclohexyl-PROXYL, 3-oxo-PROXYL, and 3-hydroxylimine- PROXYL, 3-aminomethyl-PROXYL, 3-methoxy-PROXYL, 3-t-butyl-PROXYL, 3-maleimido-PROXYL, 3,4-di-t-butyl-PROXYL, 3-carboxylic-2,2,5,5-tetramethyl-1-pyrrolidinyloxy, etc.; dialkyl nitroxide radicals or derivatives thereof such as di-t-butyl nitroxide and t-butyl-t-amyl nitroxide; diaryl nitroxide radicals or derivatives thereof such as diphenyl nitroxide; 4,4-dimethyl-1-oxazolidinyloxy (DOXYL) or derivatives thereof such as 2-di-t-butyl-DOXYL, 5-decane-DOXYL, 2-cyclohexane-DOXYL, etc.; and the like.

[0101] As component (H), 2,2,6,6-tetramethyl-1-piperidinyloxy is preferred.

[0102] When the composition of the present embodiment contains the component (H), the content of the component (H) in the composition of the present embodiment is preferably at least 0.01 part by mass, and more preferably at least 0.02 part by mass, per 100 parts by mass of the component (A), from the viewpoint of obtaining a longer pot life, and is preferably at most 2.0 parts by mass, and more preferably at most 1.0 part by mass, from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness.

[0103] The composition of this embodiment preferably contains the component (D) and the component (E) as the component (X). When the composition of this embodiment contains the component (D) and the component (E), the content E of the component (E) １ The content of component (D) D １ Mass ratio (D １ / E １ ) is preferably 0.001 or more, more preferably 0.005 or more, even more preferably 0.01 or more, even more preferably 0.05 or more, even more preferably 0.10 or more, and even more preferably 0.20 or more from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness, and is preferably 2.0 or less, more preferably 1.5 or less, and even more preferably 1.0 or less from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness.

[0104] The total content of components (A), (B), and (X) in the composition of this embodiment, when the total amount of the composition of this embodiment is taken as 100 mass%, is preferably 20 mass% or more, more preferably 25 mass% or more, even more preferably 30 mass% or more, even more preferably 35 mass% or more, even more preferably 40 mass% or more, and even more preferably 45 mass% or more, and is preferably 100 mass% or less, more preferably 90 mass% or less, and even more preferably 80 mass% or less. Furthermore, the total content of components (A), (B), and (X) in the composition of this embodiment, when the total amount of the composition of this embodiment is taken as 100 mass%, is preferably 20 mass% or more and 100 mass% or less, more preferably 25 mass% or more and 100 mass% or less, even more preferably 30 mass% or more and 90 mass% or less, even more preferably 35 mass% or more and 90 mass% or less, even more preferably 40 mass% or more and 80 mass% or less, and even more preferably 45 mass% or more and 80 mass% or less, from the viewpoint of further improving coatability.

[0105] [Component (I): Photosensitizer] The composition of the present embodiment preferably contains a photosensitizer as component (I). The photopolymerization property can be further improved by using the cationic photopolymerization initiator (B1) in combination with the photosensitizer (I). The photosensitizer (I) is not particularly limited, and known ones can be used, for example, 9-hydroxymethylanthracene, 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, 9,10-dimethoxy-2-ethylanthracene, 9,10-diethoxy-2-ethylanthracene, 9,10-dipropoxy-2-ethylanthracene, 9,10-dimethoxy-2-chloroanthracene, 9,10-bis(octanoyloxy)anthracene, 9,10-dimethoxy ... Examples thereof include helical 2-sulfonic acid methyl ester, 9,10-diethoxyanthracene-2-sulfonic acid methyl ester, 9,10-dimethoxyanthracene-2-carboxylic acid methyl ester, thioxanthone, 2-isopropyl thioxanthone, 4-isopropyl thioxanthone, 2-chlorothioxanthone, 2,4-dimethyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, anthraquinone, 1,2-dihydroxyanthraquinone, 2-ethylanthraquinone, and 1,4-diethoxynaphthalene.

[0106] In the composition of the present embodiment, the content of the photosensitizer (I), when the total amount of the composition is taken as 100 mass%, is preferably 0.01 mass% or more, more preferably 0.03 mass% or more, even more preferably 0.05 mass% or more, and even more preferably 0.08 mass% or more, and is preferably 5 mass% or less, more preferably 3 mass% or less, even more preferably 1.5 mass% or less, and even more preferably 1 mass% or less, from the viewpoint of further improving curability.

[0107] [Component (J): Silane Coupling Agent] The composition of this embodiment preferably includes a silane coupling agent as component (J). Examples of component (J) include epoxy silane, isocyanate silane, amino silane, mercapto silane, epoxy silane, vinyl silane, and methacryl silane. Among these, from the viewpoint of further improving adhesion, component (J) preferably includes one or two selected from the group consisting of epoxy silane and amino silane.

[0108] Examples of epoxy silanes include 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxypropylmethyldiethoxysilane. Examples of amino silanes include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2(aminoethyl)3-aminopropylmethyldimethoxysilane, N-2(aminoethyl)3-aminopropyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysilane.

[0109] In the composition of the present embodiment, the content of the silane coupling agent (J), when the total amount of the composition is taken as 100% by mass, is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, even more preferably 0.5% by mass or more, and even more preferably 0.8% by mass or more, and is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, and even more preferably 1.5% by mass or less, from the viewpoint of further improving adhesiveness.

[0110] (Other Components) The composition of the present embodiment may further contain other components in addition to the component (A), the component (B), and the component (X).

[0111] Examples of other components include antioxidants, resin particles, metal deactivators, fillers, stabilizers, neutralizers, lubricants, and antibacterial agents.

[0112] The method for producing the composition of this embodiment is not particularly limited as long as it can sufficiently mix the above components. The method for mixing the components is not particularly limited, but examples include a stirring method that utilizes the stirring force associated with the rotation of a propeller, and a method that uses a conventional disperser such as a planetary stirrer that revolves around its axis. These mixing methods are preferred because they are low-cost and allow stable mixing.

[0113] The composition of the present embodiment can be cured by a curing method appropriate for the composition.

[0114] For example, in the case of a thermosetting composition, the composition may be cured by heating. The heating temperature of the composition is, from the viewpoint of further improving curability, preferably 45°C or higher, more preferably 50°C or higher, even more preferably 55°C or higher, even more preferably 60°C or higher, even more preferably 65°C or higher, even more preferably 70°C or higher, even more preferably 75°C or higher, even more preferably 80°C or higher, and even more preferably 85°C or higher, and from the viewpoint of preventing deterioration, for example, 200°C or lower, preferably 150°C or lower, more preferably 120°C or lower, even more preferably 110°C or lower, even more preferably 105°C, even more preferably 100°C or lower, and even more preferably 95°C or lower.

[0115] For example, in the case of a photocurable composition, the composition may be cured by light irradiation. The light source for the irradiation light is not particularly limited, and examples thereof include a halogen lamp, a metal halide lamp, a high-power metal halide lamp (containing indium, etc.), a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a xenon excimer lamp, a xenon flash lamp, and an LED. The above light sources each have different emission wavelengths and energy distributions. Therefore, the light source can be appropriately selected depending on the reaction wavelength of the photocationic polymerization initiator. Natural light (sunlight) can also be used as a reaction initiation light source. Irradiation methods may include direct irradiation, focused irradiation using a reflector, etc., or focused irradiation using an optical fiber, etc. Irradiation can also be performed using a low-wavelength cut filter, a heat-cut filter, a cold mirror, etc.

[0116] The amount of light irradiation is not particularly limited and may be adjusted appropriately depending on the thickness of the coating film of the composition, etc. The amount of light irradiation is, for example, 50 mJ / cm ２ More than 20000mJ / cm ２ may be less than or equal to 100 mJ / cm ２ More than 10000mJ / cm ２ The following is the result.

[0117] Next, the physical properties of the composition of this embodiment will be described.

[0118] In the composition of this embodiment, the shear rate is 0.0417 s －１ Viscosity η measured at １ From the viewpoint of further improving the coatability, the viscosity is preferably 113,400 mPa·s or more, more preferably 130,000 mPa·s or more, even more preferably 150,000 mPa·s or more, and even more preferably 180,000 mPa·s or more, and is preferably 1,134,000 mPa·s or less, more preferably 1,000,000 mPa·s or less, even more preferably 900,000 mPa·s or less, even more preferably 800,000 mPa·s or less, even more preferably 700,000 mPa·s or less, and even more preferably 600,000 mPa·s or less. －１ Viscosity η measured at １ From the viewpoint of further improving the coatability, the viscosity is preferably 113,400 mPa·s or more and 1,134,000 mPa·s or less, more preferably 113,400 mPa·s or more and 1,000,000 mPa·s or less, even more preferably 130,000 mPa·s or more and 900,000 mPa·s or less, even more preferably 150,000 mPa·s or more and 800,000 mPa·s or less, even more preferably 180,000 mPa·s or more and 700,000 mPa·s or less, and even more preferably 180,000 mPa·s or more and 600,000 mPa·s or less.

[0119] In the composition of this embodiment, the shear rate is 0.0117 s －１ Viscosity η measured at ２From the viewpoint of further improving the coatability, the viscosity is preferably 31,750 mPa·s or more, more preferably 50,000 mPa·s or more, even more preferably 80,000 mPa·s or more, even more preferably 100,000 mPa·s or more, and even more preferably 120,000 mPa·s or more, and is preferably 317,000 mPa·s or less, more preferably 300,000 mPa·s or less. －１ Viscosity η measured at ２ From the viewpoint of further improving the coatability, the viscosity is preferably 31,750 mPa·s or more and 317,000 mPa·s or less, more preferably 50,000 mPa·s or more and 317,000 mPa·s or less, even more preferably 80,000 mPa·s or more and 317,000 mPa·s or less, even more preferably 100,000 mPa·s or more and 300,000 mPa·s or less, and even more preferably 120,000 mPa·s or more and 300,000 mPa·s or less.

[0120] In the composition of this embodiment, the shear rate is 0.0417 s －１ Viscosity η measured at １ (mPa·s) and a shear rate of 0.0117 s －１ Viscosity η measured at ２ (mPa s) １ / η ２ From the viewpoint of further improving the coatability and further suppressing sagging, the thixotropy index, represented by (1 / (2 / 2) / (3 / 4)), is preferably 0.5 or more, more preferably 0.7 or more, even more preferably 1.0 or more, and is preferably 4.0 or less, more preferably 3.5 or less, even more preferably 3.0 or less, even more preferably 2.5 or less, even more preferably 2.0 or less. －１ Viscosity η measured at １ (mPa·s) and a shear rate of 0.0117 s －１ Viscosity η measured at ２ (mPa s) １ / η ２From the viewpoint of further improving the coatability and further suppressing sagging, the thixotropy index, represented by (2) above, is preferably 0.5 or more and 4.0 or less, more preferably 0.5 or more and 3.5 or less, even more preferably 0.7 or more and 3.0 or less, even more preferably 0.7 or more and 2.5 or less, and even more preferably 1.0 or more and 2.0 or less.

[0121] The viscosity and thixotropy index of the composition of this embodiment described above can be adjusted by adjusting the type and content of the inorganic filler (C) in the composition of this embodiment. By having the viscosity and thixotropy index within the above-described ranges, the composition of this embodiment has improved applicability and can be used for dispenser application. More specifically, an optimal balance can be achieved between good spreadability during application and suppression of sagging after application.

[0122] The viscosity and thixotropy index of the composition of the present embodiment described above are measured under the following conditions: shear rate of 0.0417 s －１ Viscosity η １ and 0.0117s －１ Viscosity η at ２ is measured as follows: Apparatus: Cone-plate viscometer Temperature: 25°C Cone: Radius 12 mm, angle 3° Shear rate: 0.0417 s －１ or 0.0117s －１ Sample volume: 0.5 mL Atmosphere: under air Also, the obtained η １ and η ２ From the above, the thixotropy index (η １ / η ２ As the cone-plate viscometer, for example, a cone-plate type DV3T manufactured by BROOKFIELD can be used, and CPA-52Z can be used as the cone-plate, and CPA-44YZ (standard cup) can be used as the cup.

[0123] In the composition of this embodiment, the glass transition temperature measured by dynamic viscoelasticity measurement is, from the viewpoint of further improving heat resistance, preferably 70° C. or higher, more preferably 75° C. or higher, even more preferably 80° C. or higher, even more preferably 85° C. or higher, and even more preferably 90° C. or higher, and is preferably 150° C. or lower, more preferably 145° C. or lower, and even more preferably 140° C. or lower. In addition, in the composition of this embodiment, the glass transition temperature measured by dynamic viscoelasticity measurement is, from the viewpoint of further improving heat resistance, preferably 70° C. or higher and 150° C. or lower, more preferably 75° C. or higher and 150° C. or lower, even more preferably 80° C. or higher and 145° C. or lower, even more preferably 85° C. or higher and 145° C. or lower, and even more preferably 90° C. or higher and 140° C. or lower. The glass transition temperature of the composition of this embodiment is measured as follows. The composition of this embodiment is applied to a substrate (for example, a polyethylene terephthalate film), and the same substrate is placed on top of it and sandwiched between them. The composition is then spread out to form a circle with a thickness of 100 μm and a diameter of 9 cm, and light of 365 nm wavelength is irradiated at 6,000 mJ / cm using a high-pressure mercury lamp. ２ The composition is then heated at 85°C for 1 hour to obtain a cured product. The glass transition temperature (°C) of the cured product obtained is measured by dynamic viscoelasticity measurement at a temperature rise rate of 5°C / min.

[0124] In the composition of this embodiment, the moisture permeability measured in accordance with JIS Z 0208:1976 is preferably 40 g / (m ２ 24h) or less, more preferably 38g / (m ２ 24h) or less, more preferably 35g / (m ２ 24h) or less, more preferably 33g / (m ２ 24h) or less, more preferably 30g / (m ２ In the composition of the present embodiment, there is no lower limit for the moisture permeability measured in accordance with JIS Z 0208:1976. ２ ・24h) or more, and 5g / (m ２ ・24h) or more, and 10g / (m ２In addition, in the composition of the present embodiment, the moisture permeability measured in accordance with JIS Z 0208:1976 is preferably 1 g / (m ２ ・24h) or more 40g / (m ２ 24h) or less, more preferably 1g / (m ２ ・24h) or more 38g / (m ２ 24h) or less, more preferably 5g / (m ２ ・24h) or more 35g / (m ２ 24h) or less, more preferably 5g / (m ２ ・24h) or more 33g / (m ２ 24h) or less, more preferably 10g / (m ２ ・24h) or more 30g / (m ２ The moisture permeability of the composition is measured as follows: The composition of this embodiment is applied to a substrate (for example, a polyethylene terephthalate film), and the same substrate is placed on top of the composition and sandwiched between them. The composition is then spread out to form a circle having a thickness of 100 μm and a diameter of 9 cm. A high-pressure mercury lamp is used to irradiate the composition with light of a wavelength of 365 nm at 6,000 mJ / cm. ２ The cured product was then heated at 85°C for 1 hour to obtain a cured product. The moisture permeability (g / (m ２ ・Measure 24h).

[0125] In the composition of this embodiment, the tensile shear strength A １ From the viewpoint of further improving the adhesion to the substrate, the tensile shear strength A is preferably 15.0 MPa or more, more preferably 20.0 MPa or more, even more preferably 23.0 MPa or more, and even more preferably 25.0 MPa or more, and is preferably 45.0 MPa or less, more preferably 40.0 MPa or less, even more preferably 38.0 MPa or less, and even more preferably 35.0 MPa or less. １From the viewpoint of further improving the adhesion to the substrate, the compressive strength is preferably 15.0 MPa or more and 45.0 MPa or less, more preferably 20.0 MPa or more and 40.0 MPa or less, even more preferably 23.0 MPa or more and 38.0 MPa or less, and even more preferably 25.0 MPa or more and 35.0 MPa or less.

[0126] In the composition of this embodiment, the tensile shear strength A after storage at 85°C and 85% RH for 7 days ２ From the viewpoint of further improving the adhesion to the substrate after storage, the tensile shear strength A of the composition of the present embodiment after storage at 85°C and 85% RH for 7 days is preferably 16.0 MPa or more, more preferably 20.0 MPa or more, even more preferably 23.0 MPa or more, and even more preferably 25.0 MPa or more. ２ There is no upper limit to the tensile shear strength A after storage at 85°C and 85% RH for 7 days. ２ From the viewpoint of further improving the adhesion to the substrate after storage, the stress is preferably 16.0 MPa or more and 45.0 MPa or less, more preferably 20.0 MPa or more and 45.0 MPa or less, even more preferably 23.0 MPa or more and 40.0 MPa or less, and even more preferably 25.0 MPa or more and 40.0 MPa or less.

[0127] In the composition of the present embodiment, from the viewpoint of further improving adhesion to a substrate, the rate of decrease in tensile shear strength before and after 7 days of storage at 85°C and 85% RH is preferably 40% or less, more preferably 38% or less, even more preferably 35% or less, even more preferably 30% or less, even more preferably 25% or less, even more preferably 20% or less, even more preferably 15% or less, even more preferably 10% or less, and even more preferably 6% or less, and may be, for example, −50% or more, −35% or more, −10% or more, −5% or more, or 0% or more. Furthermore, in the composition of the present embodiment, from the viewpoint of further improving the adhesion to the substrate, the rate of decrease in tensile shear strength before and after storage at 85°C and 85% RH for 7 days is preferably from −50% to 40%, more preferably from −50% to 38%, even more preferably from −35% to 35%, even more preferably from −35% to 30%, even more preferably from −10% to 25%, even more preferably from −10% to 20%, even more preferably from −5% to 15%, even more preferably from −5% to 10%, and even more preferably from 0% to 6%.

[0128] Tensile shear strength A of the composition of this embodiment １ Tensile shear strength A after storage at 85°C and 85% RH for 7 days ２ The reduction rate of tensile shear strength before and after storage at 85°C and 85% RH for 7 days was measured as follows: The composition of this embodiment was applied to the center of the surface of a 25 mm square non-alkali glass sheet to a diameter of 8 mm and a thickness of 8 mm, and another non-alkali glass sheet was attached to the coated surface. The two non-alkali glass sheets were then clamped together and irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. ２Then, the clamps were removed, and cold-rolled steel plates (SPCC-SD in accordance with JIS G3141) each having a length of 100 mm, a width of 25 mm, and a thickness of 1.6 mm were bonded to the alkali-free glass on both sides of the test piece using a two-component acrylic adhesive. The two SPCC plates were then gripped and pulled using a tensile tester in accordance with JIS K 6850:1999 at a temperature of 23°C, a pulling rate of 10 mm / min, and a jig distance of 70 mm, and the initial tensile shear strength A １ The test piece was left standing in an environment of 85°C and 85% RH for 7 days, and then the initial tensile shear strength A １ Similarly, tensile shear strength A ２ (MPa) is measured. １ and A ２ From the values, the reduction rate (%) of tensile shear strength before and after storage was calculated using the formula: ((A １ -A ２ ) / A １ ) x 100.

[0129] The composition of the present embodiment has excellent applicability and can be applied using a dispenser. More specifically, the composition of the present embodiment has the above-described viscosity and thixotropy index, and is therefore suitable for dispenser application.

[0130] The use of the composition of this embodiment is not particularly limited. However, since the composition of this embodiment has good adhesion to the substrate, it can be used as one or both of a damming agent and a filler in a display device. The composition of this embodiment can also be used to encapsulate a light-emitting diode element. The light-emitting diode element preferably includes an organic electroluminescence display element or a micro LED. The composition of this embodiment can also be used to encapsulate a solar cell. The solar cell preferably includes a perovskite solar cell.

[0131] The composition of the present embodiment may be cured into a predetermined shape (e.g., a film, a sheet, etc.) to form a cured encapsulating layer having a predetermined shape. In this case, for example, when assembling a display device, the cured encapsulating layer can be disposed on a light-emitting diode element to encapsulate the light-emitting diode element.

[0132] 2. Cured Product The cured product of this embodiment is obtained by curing the composition of this embodiment.

[0133] The composition of the present embodiment has good adhesion to a substrate, and therefore, the cured product of the present embodiment obtained by curing the composition of the present embodiment can be suitably used as a cured encapsulating layer (particularly, a cured encapsulating layer for a light-emitting diode element).

[0134] The conditions for obtaining the cured product of this embodiment are not particularly limited, and the conditions described above can be applied as the conditions for curing the composition of this embodiment.

[0135] 3. Display Device The display device of the present embodiment includes a light-emitting diode element, a substrate, and a cured sealing layer containing the above-described cured body between the light-emitting diode element and the substrate.

[0136] The light-emitting diode element included in the display device of this embodiment preferably includes an organic electroluminescence display element or a micro LED, and more preferably includes a micro LED.

[0137] The substrate provided in the display device of this embodiment includes, for example, one or more types selected from the group consisting of a color filter, a glass substrate, a silicon substrate, a plastic substrate, and the like, and preferably includes a color filter.

[0138] 4. Solar Cell The solar cell of the present embodiment includes a solar cell, a substrate, and a cured encapsulating layer including the cured body of the present embodiment between the solar cell and the substrate. The solar cell of the present embodiment preferably includes a perovskite solar cell.

[0139] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention.

[0140] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, the examples were tested at 23°C and a relative humidity of 50% RH.

[0141] (Examples 1 to 17, Comparative Examples 1 and 2) <Preparation of Compositions> Compositions of the Examples and Comparative Examples were prepared by mixing the components shown in Tables 1 to 3 in the composition ratios (parts by mass) shown in Tables 1 to 3. The components shown in Tables 1 to 3 have the following meanings.

[0142] (Component (A1): Alicyclic Compound Having an Epoxy Group) (a1-1) (3,3',4,4'-diepoxy)bicyclohexyl ("Celloxide 8010" manufactured by Daicel Chemical Industries, Ltd.) (a1-2) 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ("Celloxide 2021P" manufactured by Daicel Chemical Industries, Ltd., molecular weight: 252.31)

[0143] (Component (A2): Aromatic compound having an epoxy group) (a2-1) Dibromophenyl glycidyl ether ("BR-250H" manufactured by Nippon Kayaku Co., Ltd., molecular weight 308) (a2-2) Tetrabromobisphenol A type epoxy resin ("EPICLON 152" manufactured by DIC Corporation) (a2-3) Tetrabromobisphenol A type epoxy resin ("EPICLON 153" manufactured by DIC Corporation, molecular weight 636) (a2-4) Phenol novolac type epoxy resin ("N-775" manufactured by DIC Corporation) (a2-5) Bisphenol F type epoxy resin (molecular weight: 320 to 340, "jER806" manufactured by Mitsubishi Chemical Corporation) (a2-6) Bisphenol A type epoxy resin (molecular weight: 360 to 390, "jER828" manufactured by Mitsubishi Chemical Corporation)

[0144] (Component (B): Cationic polymerization initiator) (Component (B1): Photocationic polymerization initiator) (b1-1) Triarylsulfonium tetrakispentafluorophenyl gallate ("CPI-310FG" manufactured by San-Apro Co., Ltd.) (b1-2) Triarylsulfonium salt hexafluoroantimonate ("ADEKA Optomer SP-170" manufactured by ADEKA Corporation, anion species is hexafluoroantimonate)

[0145] (Component (C): inorganic filler) (Component (C1)) (c-1) spherical alumina (manufactured by Denka Co., Ltd., "DAW-03") (c-2) spherical alumina (manufactured by Denka Co., Ltd., "DAW-05") (c-3) flaky talc (manufactured by Matsumura Sangyo Co., Ltd., "Hifiller 5PA") (c-4) talc (manufactured by Matsumura Sangyo Co., Ltd., "MY4000") (c-5) nano-sized zeolite (manufactured by Nakamura Choukou Co., Ltd., "Zeoal (registered trademark) 5A", primary particle diameter: 300 nm, Ca ２＋ Ion coordination) (Component (C) other than (C1)) (c-6) Spherical silica ("FB-5SDC" manufactured by Denka Co., Ltd.)

[0146] (Component (X): cure retarder) (Component (D): phosphoric acid-based cure retarder) (d-1) phosphoric acid-based cure retarder, tris(2-ethylhexyl)phosphate ("TOP" manufactured by Daihachi Chemical Industry Co., Ltd.) (Component (E): ether-based cure retarder) (e-1) ether-based cure retarder, 18-crown-6-ether ("Crown Ether O-18" manufactured by Tokyo Chemical Industry Co., Ltd.)

[0147] (Component (I): Sensitizer) (i-1) Photosensitizer, 9,10-diethoxyanthracene (manufactured by Air Water Performance Chemicals Inc., "Anthracure (registered trademark) UVS-1101")

[0148] (Component (J): Silane Coupling Agent) (j-1) Epoxy silane coupling agent, 3-glycidoxypropyltrimethoxysilane ("KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.)

[0149] The resulting compositions of each example were measured for glass transition temperature, viscosity, thixotropy index, moisture permeability, and tensile shear strength, and were also evaluated for interfacial adhesion, as described below.

[0150] <Glass Transition Temperature> The composition of each example was applied to a polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., E7002, thickness: 38 μm), and the same polyethylene terephthalate film was placed on top and sandwiched between the films. The film was then spread out to a circle having a thickness of 100 μm and a diameter of 9 cm, and irradiated with light of 365 nm at 6,000 mJ / cm using a high-pressure mercury lamp. ２ and then heated at 85°C for 1 hour to obtain a cured product. The glass transition temperature (°C) of the obtained cured product was measured using a dynamic viscoelasticity measuring device (DMS7100 (EXSTAR), manufactured by Hitachi High-Tech Corporation) at a heating rate of 5°C / min.

[0151] <Viscosity and Thixotropy Index> For each composition, the viscosity and thixotropy index were measured under the following <Measurement Condition 1> at a shear rate of 0.0417 s －１ Viscosity η １ <Measurement Condition 1> Apparatus: Cone and plate viscometer (manufactured by BROOKFIELD, product name "Cone and plate type DV3T") Temperature: 25°C Cone and plate: CPA-52Z (manufactured by Eiko Seiki Co., Ltd.) Cone: radius 12 mm, angle 3° Cup: CPA-44YZ (standard cup) Shear rate: 0.0417 s －１ Sample volume: 0.5 mL Atmosphere: under air Also, under the above <Measurement condition 1>, the shear rate was 0.0117 s －１ The same conditions as in <Measurement Condition 1> were used except that the shear rate was 0.0117 s －１ Viscosity η at ２ The obtained η １ and η ２ From the above, the thixotropy index (η １ / η ２ ) was calculated.

[0152] <Moisture Permeability> The composition of each example was applied to a polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., E7002, thickness: 38 μm), and the same polyethylene terephthalate film was placed on top and sandwiched between the films. The film was then spread out to form a circle with a thickness of 100 μm and a diameter of 9 cm, and light of 365 nm was irradiated at 6,000 mJ / cm using a high-pressure mercury lamp. ２The cured product was then heated at 85°C for 1 hour to obtain a cured product. The moisture permeability (g / (m) of the cured product obtained was measured in accordance with JIS Z 0208:1976. ２ The measurement was performed for 24 hours. The average value of the results of two measurements was used as the measurement value.

[0153] <Tensile shear strength> The tensile shear strength of each example composition was measured as follows: The composition of each example was applied to the center of the surface of a 25 mm square piece of alkali-free glass to a diameter of 8 mm and a thickness of 8 mm, and another piece of alkali-free glass was attached to it. The two pieces of alkali-free glass were clamped together, and light with a wavelength of 365 nm was irradiated at 6,000 mJ / cm using a high-pressure mercury lamp. ２ Then, the test piece was heated at 85°C for 1 hour to prepare a test piece. Next, the clamps were removed, and cold-rolled steel plates (SPCC-SD in accordance with JIS G3141) each having a length of 100 mm, a width of 25 mm, and a thickness of 1.6 mm were bonded to the alkali-free glass on both sides of the test piece using a two-component acrylic adhesive (SGA adhesive, manufactured by Cemedine Co., Ltd.). The two SPCC plates were then gripped and pulled using a tensile tester (Autograph AGX-VD, manufactured by Shimadzu Corporation) in accordance with JIS K 6850:1999 under conditions of a temperature of 23°C, a pulling speed of 10 mm / min, and a jig distance of 70 mm, to measure the initial tensile shear strength A １ The initial tensile shear strength A (MPa) was measured. The average value of the five measurements was used as the measured value. The state of failure of the test piece (cohesive failure or interfacial failure) was also evaluated. The test piece was left standing in an environment of 85°C and 85% RH for 7 days, and then the initial tensile shear strength A １ Similarly, tensile shear strength A ２ The fracture state of the test piece (cohesive failure or interfacial failure) was also evaluated. １ and A ２ From the values, the reduction rate (%) of tensile shear strength before and after storage was calculated using the formula: ((A １ -A ２ ) / A １) × 100. Regarding the state of failure, "cohesive failure" refers to a state of failure occurring inside the cured composition of the test piece. "Interface failure" refers to a state of failure occurring at the interface between the cured composition of the test piece and the alkali-free glass of the test piece. Furthermore, "thin layer cohesion" refers to a cohesive failure occurring in a portion very close to the alkali-free glass, as opposed to "cohesive failure" which occurs in the center of the cured product, and refers to a state in which the cured product is attached to the extent that the alkali-free glass is visible through the surface. Furthermore, "substrate cracking" refers to a state in which the alkali-free glass is cracked. Furthermore, in the table, for example, "cohesive 9 / interface 1" indicates that 90% of the area of ​​the test piece was cohesive failure and 10% was interfacial failure. Cohesive failure is preferred because it results in small variations in tensile shear strength and enables high-quality adhesion, and it is preferable that the ratio of the area of ​​the cohesive failure portion to the area ratio is large.

[0154]

[0155]

[0156]

[0157] This application claims priority based on Japanese Patent Application No. 2024-021485, filed February 15, 2024, the disclosure of which is incorporated herein in its entirety by reference.

Claims

1. A composition comprising: a cationically polymerizable compound (A); a cationic polymerization initiator (B); and an inorganic filler (C), wherein the inorganic filler (C) comprises one or more types selected from talc, alumina, silica, zeolite, and titanium oxide, and the total content of the one or more types selected from talc and alumina is 1 part by mass to 100 parts by mass, where the total amount of the inorganic filler (C) is 100 parts by mass.

2. The composition according to claim 1, wherein the inorganic filler (C) comprises one or more selected from talc and alumina.

3. The composition of claim 2, wherein the inorganic filler (C) comprises talc and silica.

4. The composition according to claim 3, wherein the ratio of the silica content to the talc content in the inorganic filler (C) (silica content / talc content) is 1.0 or more.

5. The composition according to claim 1 or 2, having a viscosity of 113,400 mPa·s or more and 1,134,000 mPa·s or less, measured under the following <Measurement Condition 1>. <Measurement Condition 1> Apparatus: Cone-plate viscometer Temperature: 25°C Cone: Radius 12 mm, angle 3° Shear rate: 0.0417 s －１ Sample volume: 0.5 mL Atmosphere: under air 6. The composition according to claim 1 or 2, having a viscosity of 31,750 mPa·s or more and 317,000 mPa·s or less, measured under the following <Measurement Condition 2>. <Measurement Condition 2> Apparatus: Cone-plate viscometer Temperature: 25°C Cone: Radius 12 mm, angle 3° Shear rate: 0.0117 s －１ Sample volume: 0.5 mL Atmosphere: under air 7. Shear rate 0.0417 s under the following <Measurement Condition 3> －１ Viscosity η measured at １ (mPa·s) and a shear rate of 0.0117 s －１ Viscosity η measured at ２ (mPa s) １ / η ２ 3. The composition according to claim 1, wherein the thixotropy index (expressed as a function of the thixotropy index) is 0.5 or more and 4.0 or less. <Measurement Condition 3> Apparatus: Cone-plate viscometer Temperature: 25°C Cone: Radius 12 mm, angle 3° Shear rate: 0.0417 s －１ or 0.0117s －１ Sample volume: 0.5 mL Atmosphere: under air 8. The composition was irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. ２ and subsequently heating at 85°C for 1 hour, the cured product has a glass transition temperature of 70°C or higher and 150°C or lower, as measured by dynamic viscoelasticity measurement at a heating rate of 5°C / min.

9. The composition was irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. ２ and then heated at 85°C for 1 hour. The cured product had a moisture permeability of 40 g / (m2) as measured in accordance with JIS Z 0208:1976. ２ 3. The composition according to claim 1, wherein the storage time is 24 hours or less.

10. The composition according to claim 1 or 2, which has a tensile shear strength of 15.0 MPa or more and 45.0 MPa or less, as determined below in the section <Tensile shear strength>. <Tensile shear strength> The composition is applied to the center of the surface of a 25 mm square piece of alkali-free glass to a diameter of 8 mm and a thickness of 8 mm, and another piece of alkali-free glass is attached to the composition. The two pieces of alkali-free glass are clamped together, and light of 365 nm wavelength is applied at 6,000 mJ / cm using a high-pressure mercury lamp. ２ and heated at 85°C for 1 hour to prepare a test piece, the clamps were removed, and SPCC plates 100 mm in length, 25 mm in width, and 1.6 mm in thickness were attached to the alkali-free glass on both sides of the test piece using a two-component acrylic adhesive, and then the tensile shear strength (MPa) was measured when the two SPCC plates were gripped and pulled at a temperature of 23°C and a pulling rate of 10 mm / min in accordance with JIS K 6850:1999.

11. The composition according to claim 1 or 2, wherein the tensile shear strength reduction rate (%) after storage in an environment of 85°C and 85% RH, as determined below as <tensile shear strength reduction rate>, is 40% or less. <Tensile shear strength reduction rate> The composition is applied to the center of the surface of a 25 mm square piece of alkali-free glass to a diameter of 8 mm and a thickness of 8 mm, and another piece of alkali-free glass is attached to the applied composition. The two pieces of alkali-free glass are clamped together, and light of 365 nm wavelength is irradiated at 6,000 mJ / cm using a high-pressure mercury lamp. ２ The specimen was irradiated under the conditions of 100 mm in length, 25 mm in width, and 1.6 mm in thickness, and heated at 85°C for 1 hour to prepare a test piece. The clamps were removed, and SPCC plates each having a length of 100 mm, a width of 25 mm, and a thickness of 1.6 mm were attached to the alkali-free glass on both sides of the test piece using a two-component acrylic adhesive. The two SPCC plates were then pulled at a temperature of 23°C and a pulling rate of 10 mm / min in accordance with JIS K 6850:1999, and the tensile shear strength was measured as the initial tensile shear strength A. １ (MPa), and the test piece was left standing in an environment of a temperature of 85°C and a relative humidity of 85% RH for 7 days, and then the initial tensile shear strength A １ The tensile shear strength measured in the same manner as above was defined as tensile shear strength A ２ (MPa), and the reduction rate (%) of tensile shear strength before and after storage was calculated using the formula: ((A １ -A ２ ) / A １ ) x 100.

12. The composition according to claim 1 or 2, which can be applied using a dispenser.

13. The composition according to claim 1 or 2, wherein the content of the inorganic filler (C) is 10 parts by mass or more and 300 parts by mass or less per 100 parts by mass of the cationically polymerizable compound (A).

14. The composition according to claim 1 or 2, wherein the content of the cationically polymerizable compound (A) is 20% by mass or more and 90% by mass or less, when the total mass of the composition is 100% by mass.

15. The composition described in claim 1 or 2, wherein the content of the cationic polymerization initiator (B) is 0.01 parts by mass or more and 5.0 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A).

16. The composition of claim 1 or 2, wherein the cationically polymerizable compound (A) contains an epoxy group.

17. The composition according to claim 16, wherein the cationically polymerizable compound (A) comprises one or more compounds selected from the group consisting of an alicyclic compound (A1) having an epoxy group, an aromatic compound (A2) having an epoxy group, and a glycidyl ether compound (A3).

18. The composition according to claim 1 or 2, wherein the cationically polymerizable compound (A) contains a bromine atom.

19. The composition according to claim 1 or 2, wherein the cationic polymerization initiator (B) comprises one or more selected from the group consisting of a photocationic polymerization initiator (B1) and a thermal cationic polymerization initiator (B2).

20. The composition of claim 19, wherein the cationic polymerization initiator (B) comprises an onium salt compound.

21. The composition according to claim 1 or 2, which can be used as one or both of the damming and filling agents in a display device.

22. The composition according to claim 1 or 2, wherein the composition can be used to encapsulate a light-emitting diode device or a solar cell.

23. The composition of claim 22, wherein the light-emitting diode element comprises an organic electroluminescent display element or a microLED.

24. The composition of claim 22, wherein the solar cell comprises a perovskite solar cell.

25. A cured product obtained by curing the composition according to claim 1 or 2.

26. A display device comprising a light-emitting diode element, a substrate, and a cured sealing layer between the light-emitting diode element and the substrate, the cured body according to claim 25.

27. The display device of claim 26, wherein the light-emitting diode elements comprise organic electroluminescent display elements or micro LEDs.

28. A solar cell comprising a solar cell, a substrate, and a cured encapsulating layer between the solar cell and the substrate, the cured body according to claim 25.

29. The solar cell of claim 28, wherein the solar cell comprises a perovskite solar cell.

Images