Substrate support apparatus, substrate processing equipment and substrate processing method

Abstract

The present invention relates to a substrate support apparatus, substrate processing equipment and a substrate processing method, and, more specifically, to a substrate support apparatus, a substrate processing apparatus and a substrate processing method for rotating a substrate to the opposite surface. According to an embodiment of the present invention, the substrate support apparatus capable of gripping and flipping a substrate comprises: a gripping unit including a pair of arms that can be opened and closed to grip the edges of the substrate; a driving unit including a shaft extending in one direction, and a driving source capable of moving the shaft in one direction and rotating same around the one direction; and a connection unit for connecting the gripping unit and the driving unit so that the pair of arms are opened and closed in conjunction with the movement of the shaft in the one direction and are rotated in conjunction with the rotation of the shaft.

Description

Substrate support device, substrate processing equipment and substrate processing method

[0001] The present invention relates to a substrate support device, a substrate processing facility, and a substrate processing method, and more particularly, to a substrate support device, a substrate processing device, and a substrate processing method for rotating a substrate to the opposite side.

[0002] Typically, the substrate can be processed while being transported, and there are cases where the direction in which one side of the substrate faces must be changed in the process flow.

[0003] For example, in the case of a deposition process, there is an upward deposition process in which a deposition material is provided from the bottom to the top of the substrate, and a downward deposition process in which a deposition material is provided from the top to the bottom. Depending on each deposition process, it is necessary to flip the substrate so that the deposition surface faces the direction in which the deposition material is provided.

[0004] Furthermore, even when providing a deposition material in one direction, the need to flip the substrate still exists. For example, in semiconductor devices or display devices, thin films may need to be deposited on both sides of the substrate, i.e., on both sides of the substrate. In such cases, a method is used in which a thin film is deposited on one side of the substrate, then flipped over and deposited on the other side. Consequently, there is a growing need for a substrate support device capable of stably holding and flipping the substrate.

[0005] (Prior art literature)

[0006] Korean Patent No. 10-1384477

[0007] The present invention provides a substrate support device, a substrate processing facility, and a substrate processing method capable of stably holding and inverting a substrate.

[0008] In addition, the present invention provides a substrate support device, a substrate processing facility, and a substrate processing method capable of inverting a substrate within a vacuum processing space.

[0009] A substrate support device according to an embodiment of the present invention is a substrate support device capable of gripping and inverting a substrate, comprising: a gripping portion including a pair of arms that can be opened and closed so as to grip an edge of the substrate; a driving portion including a shaft extending in one direction and a driving source that can move the shaft along one direction and rotate around the one direction; and a connecting portion connecting the gripping portion and the driving portion so that the pair of arms are opened and closed in conjunction with movement of the shaft along one direction and rotate in conjunction with rotation of the shaft.

[0010] The above-mentioned grip portion may include a connecting member to which the pair of arms are hingedly connected.

[0011] The arm may include a first region capable of gripping an edge of the substrate; and a second region extending from the edge of the substrate between the first region and the bonding member.

[0012] The second region may be connected to the first region in a stepwise manner.

[0013] The above cancer may have an insertion groove formed on the inner surface facing the substrate into which an edge of the substrate can be inserted.

[0014] The above cancer may include a buffer member installed in the insertion groove.

[0015] The shaft may include a first shaft that can move along the one direction and can rotate around the one direction; and a second shaft that is coupled to the first shaft so as to rotate in conjunction with the rotation of the first shaft.

[0016] The driving source may include a first driving source connected to the first shaft so as to rotate the first shaft around the one direction; and a second driving source capable of moving the first driving source along the one direction so as to move the first shaft along the one direction.

[0017] It may further include a sensor unit capable of detecting the movement distance of the first shaft and the rotation angle of the second shaft.

[0018]

[0019] In addition, a substrate processing facility according to an embodiment of the present invention includes a chamber having a vacuum processing space therein; and one of the aforementioned substrate support devices installed in the chamber so as to be able to hold and invert a substrate provided in the processing space.

[0020]

[0021] In addition, a substrate processing method according to an embodiment of the present invention includes the steps of: preparing a substrate so that one surface faces upward; moving a shaft connected to a pair of arms in one direction to grip an edge of the substrate with the pair of arms; rotating the shaft around the one direction to flip the substrate so that the other surface faces upward with the pair of arms; and moving the shaft in the one direction to separate the substrate from the pair of arms.

[0022] The step of providing the substrate includes the step of arranging the substrate at the same height as the pair of arms; and the step of horizontally moving the substrate and providing it to the processing space; and the step of arranging the substrate at the same height as the pair of arms can be performed by measuring the height of the robot arm providing the substrate to the processing space.

[0023] The step of gripping the edge of the substrate may grip a portion of the edge of the substrate.

[0024] The step of gripping the edge of the substrate can be performed by inserting the edge of the substrate into the inner surface of the pair of arms.

[0025] The step of gripping the edge of the substrate may be performed by advancing the shaft from the substrate, and the step of separating the substrate may be performed by advancing the shaft toward the substrate.

[0026] The step of gripping the edge of the substrate may include a step of detecting a distance by which the shaft has advanced; the step of reversing the substrate may include a step of detecting an angle by which the shaft has rotated; and the step of separating the substrate may include a step of detecting a distance by which the shaft has moved backward.

[0027] The step of gripping the edge of the substrate and the step of separating the substrate can be performed by rotating the pair of arms about the end.

[0028] Between the step of gripping the edge of the substrate and the step of separating the substrate, the step of moving the pair of arms in an up-and-down direction or rotating them about an up-and-down direction may be further included.

[0029] According to an embodiment of the present invention, a substrate can be stably held and flipped by driving a pair of arms by movement along one direction and rotation about one direction.

[0030] In addition, a pair of arms are placed in the processing space, and a driving source for driving the pair of arms is placed in a space isolated from the processing space, thereby preventing the vacuum state of the processing space from being broken, improving the space utilization inside the chamber, and minimizing the size of the chamber.

[0031] FIG. 1 is a schematic drawing showing a substrate support device according to an embodiment of the present invention.

[0032] Fig. 2 is a drawing schematically showing the internal structure of the substrate support device illustrated in Fig. 1.

[0033] FIG. 3 is a drawing showing an opening of a grip portion of a substrate support device according to an embodiment of the present invention.

[0034] FIG. 4 is a drawing showing a state in which a grip portion of a substrate support device according to an embodiment of the present invention is closed.

[0035] FIG. 5 is a drawing showing a rotating grip portion of a substrate support device according to an embodiment of the present invention.

[0036] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. These embodiments of the present invention are provided solely to ensure complete disclosure of the present invention and to fully inform those skilled in the art of the scope of the invention.

[0037] When a component, such as a layer, film, region or substrate, is referred to as being "on" another component throughout the specification, it can be interpreted that the component is either directly "on" the other component, or there may be other components intervening therebetween.

[0038] Additionally, relative terms such as "upper" or "lower" may be used herein to describe the relative relationship of certain elements to other elements as depicted in the drawings. It should be understood that relative terms are intended to encompass other orientations of the elements in addition to the orientation depicted in the drawings. To illustrate the invention in detail, the drawings may be exaggerated, and like reference numerals throughout the drawings designate like elements.

[0039]

[0040] FIG. 1 is a drawing schematically showing a substrate support device according to an embodiment of the present invention, and FIG. 2 is a drawing schematically showing the internal structure of the substrate support device illustrated in FIG. 1.

[0041] Referring to FIGS. 1 and 2, a substrate support device according to an embodiment of the present invention is a substrate support device capable of gripping and inverting a substrate, including a gripping portion (100) including a pair of arms (110) that can be opened and closed so as to grip an edge of the substrate, a driving portion (200) including a shaft (210) extending in one direction and a driving source (230, 240) that can move the shaft (210) along one direction and rotate it around the one direction, and a connecting portion (300) that connects the gripping portion (100) and the driving portion (200) so that the pair of arms (110) are opened and closed in conjunction with the movement of the shaft (210) along one direction and rotate in conjunction with the rotation of the shaft (210).

[0042] A substrate support device like this can be installed in various spaces where it is necessary to grip and invert a substrate. For example, the substrate support device can be installed in a chamber that provides a processing space for processing a substrate at atmospheric pressure or a set pressure. In addition, the substrate support device can be installed in a vacuum processing space. In this case, the substrate support device can be installed in the chamber so that the gripping unit (100) is placed in the vacuum processing space, and the driving sources (230, 240) are placed in a space isolated from the processing space, for example, a space isolated from the processing space and under atmospheric pressure rather than a vacuum. In order to install the substrate support device in such various spaces, the substrate support device can include a case unit (400) that can accommodate at least a portion of the driving unit (200) therein. The case part (400) may include a first case (410) that can be coupled to the chamber and accommodates at least a portion of the shaft (210) therein, a second case (430) that is spaced apart from the first case, and a bellows (420) that connects the first case (410) and the second case (430).

[0043] The gripper (100) can grip the edge of the substrate. The substrate may have a circular or polygonal plate shape with a predetermined thickness, and such a substrate has one side and the other side facing each other. Here, at least one of the one side and the other side of the substrate may be a processing side on which substrate processing such as deposition, etching, annealing, hardening, cleaning, oxide removal, etc. is performed. If the gripper (100) grips the processing side of the substrate, the processing of the substrate may be adversely affected. That is, if the gripper (100) grips the processing side before processing the substrate, the substrate cannot be processed with the desired quality, and if the gripper (100) grips the processing side after processing the substrate, the condition of the already processed substrate may be deteriorated. Therefore, the gripper (100) can grip the edge of the substrate in order to minimize the adverse effect on the processing of the substrate.

[0044] The gripping unit (100) may include a pair of arms (110). Here, each arm (110) may include a gripping arm (112) capable of gripping an edge of a substrate and an operating arm (114) having one end connected to the gripping arm (112) and extending in a direction intersecting the one direction. In addition, the gripping unit (100) may further include a first connecting member (120) to which the other end of the operating arm (114) is hinge-connected.

[0045] The grip arm (112) can grip the edge of the substrate, and can be formed to extend in one direction while the substrate is gripped. For example, the grip arm (112) can be formed to extend in the Y-axis direction while the substrate is gripped, when a pair of arms (110) are spaced apart in the X-axis direction as illustrated in FIG. 1. However, the extension direction of the grip arm (112) is not limited thereto, and it goes without saying that it can be formed to extend in a direction in which one end opens or closes while the substrate is gripped.

[0046] The gripping arm (112) may be formed to a length capable of gripping the edge of the substrate. For example, when gripping a circular substrate, the gripping arm (112) may be formed to a length such that the center of the substrate can be placed between a pair of gripping arms (112). In addition, when gripping a rectangular substrate, the gripping arm (112) may be formed to a length capable of supporting at least a portion of the length of the edges on both sides of the substrate. In this case, the gripping arm (112) may be formed to various lengths capable of supporting all of the edges on both sides of the substrate. However, if the length of the gripping arm (112) is unnecessarily increased, the space required for driving the gripping unit (110) increases, and therefore, the gripping arm (112) may be formed to a minimum length capable of supporting all or a portion of the edges on both sides of the substrate.

[0047] Here, the gripping arm (112) may include a first region capable of gripping the edge of the substrate, and a second region extending between the first region and the first connecting member (120) to be spaced apart from the edge of the substrate. For example, in the case of gripping a rectangular substrate, a pair of gripping arms (112) may include a first region that grips the edges of both sides of the substrate, and a second region that extends from the first region to be spaced apart from the edges of both sides of the substrate so that the substrate can be accommodated in the space between the gripping arms (112). Hereinafter, the first region of the gripping arm (112) capable of gripping the edge of the substrate will be referred to as a gripper, and the second region of the gripping arm (112) that extends to be spaced apart from the edge of the substrate will be referred to as a spacer (112b).

[0048] The gripper arm (112) may include a gripper (112a) capable of gripping the edge of a substrate and a spacer (112b) connected to the gripper (112a) so as to be spaced apart from the edge of the substrate. For example, when gripping a rectangular substrate, the gripper (112a) may contact a first region, which is a portion of the edge areas on both sides of the substrate, for example, an area 1 / 2 to 2 / 3 of the edge areas on both sides from one end of the substrate, and the spacer (112b) may be connected to the gripper (112a) so as to be spaced apart from a second region, which is another portion of the edge areas on both sides of the substrate, for example, an area 1 / 2 to 1 / 3 of the edge areas on both sides from the other end of the substrate. For this purpose, the spacer (112b) may be connected to the gripper (112a) with a step so as to be spaced apart from the edge of the substrate, as illustrated in the drawing.

[0049] In this way, when the gripper arm (112) includes a gripper (112a) and a spacer (112b) connected to the gripper (112a), the opening angle of the pair of arms (110) required to grip the substrate can be minimized. For example, when the gripper arm (112) includes only grippers (112a) that contact both edges of the substrate, in order to place the substrate between the pair of arms (110) before the substrate is gripped, the pair of arms (110) must be opened to move to a position where the gripper (112a) does not contact the substrate. On the other hand, when the gripper (112) includes a spacer (112b) connected to the gripper (112a) so as to be spaced apart from the edge of the substrate, when the pair of arms (110) are opened to place the substrate, the substrate can be placed in the free space formed by the spacer (112b), thereby relatively reducing the opening angle of the pair of arms (110). Accordingly, the operating radius of the pair of arms (110) can be minimized when the substrate support device grips and reverses the substrate, and the space utilization inside the chamber can be maximized.

[0050] In this way, the gripper (112a) may have an insertion groove (H) formed on the inner surface facing the substrate, into which the edge of the substrate can be inserted. The insertion groove (H) may be formed by recessing the inner surface of the gripper (112a) and may extend along the extension direction of the gripper (112a). The thickness of the insertion groove (H) may be adjusted according to the thickness of the substrate, and may be formed to be the same thickness as the substrate to be gripped or thicker than the substrate to be gripped in order to minimize friction with the substrate.

[0051] The gripper (112a) may include a buffer member (C) installed in the insertion groove (H). That is, the gripper (112a) may include a buffer member (C) installed in the insertion groove (H) to stably support the edge of the substrate and minimize damage to the substrate before or after processing. A plurality of such buffer members (C) may be spaced apart from each other along the extension direction of the insertion groove (H) or may be formed to extend along the extension direction of the insertion groove (H). Such buffer members (C) may be formed of a material capable of minimizing friction, such as, for example, Teflon resin.

[0052] The operating arm (114) is connected at one end to the gripper arm (112). For example, the operating arm (114) may be formed integrally with the gripper arm (112) and connected to the gripper arm (112). Such an operating arm (114) extends between the gripper arm (112) and the first coupling member (120) and functions to open or close the pair of arms (110) by operating according to the movement or rotation of the shaft (210). For example, the operating arm (114) may be formed to extend in a direction crossing the direction in which the gripper arm (112) extends. When the gripper arm (112) extends in the Y-axis direction while the substrate is gripped, the operating arm (114) may be formed to be bent at an end of the gripper arm (112) and extend in the X-axis direction. However, the extension direction of the operating arm (114) is not limited thereto, and it is obvious that the pair of gripping arms (112) may be formed to extend in various directions spaced apart from each other within a range capable of gripping the substrate.

[0053] The other end of the operating arm (114) is hinge-coupled to the first connecting member (120). As described above, one end of the operating arm (114) is connected to the gripping arm (112), and the other end of the operating arm (114) on the opposite side thereof is hinge-coupled to the first connecting member (120). That is, the other ends of each of the pair of operating arms (114) are hinge-coupled to the first connecting member (120). The gripping arm (112) and the operating arm (114) can be rotated about the coupling position of the operating arm (114) and the first connecting member (120) as an axis, and thereby the pair of arms (110) can be opened or closed to grip a substrate or separate a gripped substrate. A first coupling member (120) like this can be connected to a second coupling member (220) installed at an end of a shaft (210) described later through a connecting portion (300).

[0054] The driving unit (200) includes a shaft (210) extending in one direction and a driving source (230, 240) that can move the shaft (210) along one direction and rotate it around the one direction.

[0055] The shaft (210) may be formed to extend in one direction, for example, in the Y-axis direction. Such a shaft (210) may include a first shaft (210a) that can move along the one direction and a second shaft (210b) that can rotate around the one direction and has an internal space formed penetrating in the one direction to accommodate the first shaft (210a). That is, the second shaft (210b) has an internal space penetrating the second shaft (210b) in the Y-axis direction, and the first shaft (210a) may be arranged in the internal space of the second shaft (210a) so as to be movable in the Y-axis direction. For example, the first shaft (210a) may have a longer length than the second shaft (210b), in which case the center of the first shaft (210a) may be accommodated in the internal space of the second shaft (210b) such that one end and the other end are exposed to the outside of the second shaft (210b).

[0056] Here, the second shaft (210b) may be driven independently, but the first shaft (210a) may rotate around one direction, and the second shaft (210b) may rotate in conjunction with the rotation of the first shaft (210a). That is, the first shaft (210a) may move in the Y-axis direction and simultaneously rotate around the Y-axis direction, and the second shaft (210b) may be coupled to the first shaft (210a) so as to not be coupled with the first shaft (210a) when the first shaft (210a) moves in the Y-axis direction, but to rotate in the Y-axis direction in conjunction with the first shaft (210a) when the first shaft (210a) rotates around the Y-axis direction. In this way, the second shaft (210b) can be coupled to the first shaft (210a) via a feather key so that the second shaft (210b) can accommodate the Y-axis movement of the first shaft (210a) and can be coupled to the rotation centered on the Y-axis. Meanwhile, a second coupling member (220) that can be connected to the first coupling member (120) can be installed at the end of the first shaft (210a), and the structure in which the second coupling member (220) is connected to the gripping portion (100) will be described later with respect to the connecting portion (300).

[0057] The driving source (230, 240) can move the first shaft (210a) in one direction and rotate the first shaft (210a) around the one direction. Here, the driving source (230, 240) can include a first driving source (230) connected to the first shaft (210a) so as to rotate the first shaft (210a) around the one direction, and a second driving source (240) that can move the first driving source (230) along the one direction so that the first shaft (210a) moves along the one direction.

[0058] The first driving source (230) is coupled to an end of the first shaft (210a) and rotates the first shaft (210a) about one direction. As described above, the substrate support device may include a case portion (400) that can accommodate at least a portion of the driving source (200) therein, and the case portion (400) may include a first case (410) that can accommodate at least a portion of the shaft (210) therein and be coupled to a chamber, a second case (430) spaced apart from the first case (410), and a bellows (420) that connects the first case (410) and the second case (430). Here, the first driving source (230) may be installed to be fixed to the second case (430) that exposes the end of the first shaft (210a). Such a first driving source (230) may include various driving devices capable of rotating the first shaft (210a), such as a rotary cylinder, a rotary motor, etc.

[0059] The second driving source (240) may be installed to move the first driving source (230) in one direction so that the first shaft (210a) moves in the one direction. To this end, the second driving source (240) may be installed to connect the first case (410) and the second case (420). That is, the first case (410) is coupled to the chamber, the first case (410) and the second case (420) are spaced apart from each other and are connected to each other through the bellows (420), and the second driving source (240) is installed to be able to change the distance between the first case (410) and the second case (420) so as to move the first driving source (230) in the Y-axis direction. The second driving source (240) may include various actuators that can change the distance between the first case (410) and the second case (420), such as a cylinder or a linear motor.

[0060] The connecting portion (300) connects the grip portion (100) and the driving portion (200) so that a pair of arms (110) are opened and closed in conjunction with movement along one direction of the shaft (210) and rotate in conjunction with rotation of the shaft (210). Such a connecting portion (300) may include a connecting member (310) having one end hingedly connected to the operating arm (114) and the other end hingedly connected to the first shaft (210a) described above, and a spacing member (320) having one end fixedly connected to the first connecting member (120) and the other end fixedly connected to the second shaft (210b) described above.

[0061] The linkage member (310) can connect the operating arm (114) and the first shaft (210a) such that one end is hingedly connected to the operating arm (114) and the other end is hingedly connected to the first shaft (210a). Here, one end of the linkage member (310) can be connected to an end of the operating arm (114) that is connected to the grip arm (112). In addition, the other end of the linkage member (310) can be hingedly connected to the first shaft (210a). As described above, a second linkage member (220) can be installed at the end of the first shaft (210a). At this time, the pair of linkage members (310) can be installed such that one end is hingedly connected to the operating arm (114) and the other end is hingedly connected to the second linkage member (220), thereby connecting the gripping unit (100) and the driving unit (200). Meanwhile, the gap maintaining member (320) may have one end fixedly connected to the first coupling member (120) and the other end fixedly connected to the second shaft (210b). Accordingly, the pair of arms (110) may be opened and closed by the Y-axis movement of the first shaft (210a) and rotated by the rotation of the second shaft (210b) around the Y-axis direction. The operating principle thereof will be described later with reference to FIGS. 3 to 5.

[0062] Meanwhile, the substrate support device according to an embodiment of the present invention may further include a sensor unit (not shown) capable of detecting the operating state of a pair of arms (110). Such a sensor unit may be installed on at least one of the pair of arms (110) to detect the operating state of the arms (110), but may also detect the operating state of the pair of arms (110) by detecting the moving distance of the first shaft (210a) and the rotation angle of the second shaft (210b). For example, the sensor unit may be installed on each of the first driving source (230) and the second driving source (240) to detect the moving distance of the first shaft (210a) and the rotation angle of the second shaft (210b), respectively.

[0063]

[0064] FIG. 3 is a drawing showing an opening of a grip portion of a substrate support device according to an embodiment of the present invention, and FIG. 4 is a drawing showing an opening of a grip portion of a substrate support device according to an embodiment of the present invention. In addition, FIG. 5 is a drawing showing an opening of a rotation of a grip portion of a substrate support device according to an embodiment of the present invention.

[0065] Referring to FIG. 3, the gripping unit (100) first operates with a pair of arms (110) open in order to grip a substrate. To this end, the second driving source (240) operates to move the second case (430) away from the first case (410), and the bellows (420) extends accordingly. When the second case (430) moves away from the first case (410) by the second driving source (240), the first shaft (210a) moves backward in the Y-axis direction within the second shaft (201b). As a result, the linkage member (310) pulls the operating arm (112b), and the gripping arm (112a) connected to the operating arm (112b) is also pulled, so that the pair of arms (110) can be opened.

[0066] Referring to FIG. 4, when a substrate is brought into the processing space, the gripping unit (100) operates to close a pair of arms (110) to grip the substrate. To this end, the second driving source (240) operates to move the second case (430) toward the first case (410), and the bellows (420) contracts accordingly. When the second case (430) moves toward the first case (410) by the second driving source (240), the first shaft (210a) moves forward in the Y-axis direction within the second shaft (201b). As a result, the linkage member (310) pushes the operating arm (112b), and the gripping arm (112a) connected to the operating arm (112b) is also pushed, so that the pair of arms (110) can be closed.

[0067] Referring to FIG. 5, when the substrate is gripped, the gripping unit (100) operates to rotate a pair of arms (110) to invert the substrate. To this end, the first driving source operates to rotate the first shaft (210a), and the second shaft (210b) rotates in conjunction with the first shaft (210a). Here, since the second shaft (210b) and the first coupling member (210) are fixedly coupled by the gap maintaining member (320), the first coupling member (210) rotates in conjunction with the rotation of the second shaft (210b), and the pair of arms (110) coupled to the first coupling member (210) rotates simultaneously, so that the substrate (S) can be inverted from a direction in which one side (S1) faces upward to a direction in which the other side (S2) faces upward.

[0068] A substrate support device according to an embodiment of the present invention may be included in a substrate processing facility and may invert a substrate. That is, the substrate processing facility may include a chamber having a vacuum processing space inside, and a substrate support device installed in the chamber so as to hold and invert a substrate provided in the processing space.

[0069] For example, the substrate support device may be installed in a chamber so that the gripper (100) is placed in a vacuum processing space, and the driving source (230, 240) is placed in a space isolated from the processing space, for example, a space isolated from the processing space and not in a vacuum but in a normal pressure state. That is, the substrate processing equipment may include vacuum chambers that perform various functions, and the substrate support device may be installed in at least one of these vacuum chambers to invert the substrate. That is, the substrate support device may be installed in a chamber that provides a separate space for inverting the substrate. In addition, the substrate support device may be installed in a processing chamber where a substrate processing process is performed, or may be installed in a loadlock chamber for storing the substrate, etc. to invert the substrate. At this time, the substrate support device may be installed by penetrating the wall of various chambers so that the driving source (230, 240) is placed outside the chamber. Meanwhile, the substrate support device may be installed in a transport chamber for transporting the substrate. To this end, the substrate processing equipment may further include a housing provided inside the transport chamber to provide a receiving space isolated from the processing space inside the transport chamber, and the substrate support device may be installed by penetrating the wall of the housing so that the driving source (230, 240) is placed in the receiving space inside the housing. At this time, the housing may be installed so as to be able to move up and down inside the transport chamber or to be able to rotate around the up and down direction. In this case, when the housing is installed so as to be able to move up and down inside the transport chamber or to be able to rotate around the up and down direction, the gripping part (100) is exposed to the outside of the receiving space inside the transport chamber so as to move up and down according to the movement of the housing or to be able to rotate around the up and down direction, thereby replacing the function of the robot arm.

[0070]

[0071] Hereinafter, a substrate processing method according to an embodiment of the present invention will be described. The substrate processing method may be a method of processing a substrate using the substrate support device and substrate processing equipment described above. Therefore, any description overlapping with the above-described contents regarding the substrate support device and substrate processing equipment will be omitted.

[0072] A substrate processing method according to an embodiment of the present invention includes the steps of: providing a substrate (S) in a processing space with one side (S10) facing upward; moving a shaft (210) installed through the processing space along one direction to grip an edge of the substrate (S) with a pair of arms (110) connected to the shaft (210); rotating the shaft (210) around the one direction to flip the substrate (S) so that the other side (S2) faces upward with the pair of arms (110); and moving the shaft (210) along the one direction to separate the substrate (S) from the pair of arms (110).

[0073] The step of preparing the substrate (S) is to prepare the substrate (S) within the processing space with one side (S1) facing upward. Here, the step of preparing the substrate (S) may include the step of arranging the substrate (S) at the same height as a pair of arms (110) and the step of horizontally moving the substrate (S) and providing it to the processing space.

[0074] The step of placing the substrate (S) at the same height as a pair of arms (110) and the step of horizontally moving the substrate (S) and providing it to a processing space can be performed by a robot arm that provides the substrate to a substrate support device. At this time, the substrate (S) provided by the robot arm needs to be provided at the same height as the pair of arms (110) in order for the substrate support device to accurately grip the substrate. To this end, the step of placing the substrate (S) at the same height as the pair of arms (110) can be performed by measuring the height of the robot arm that provides the substrate (S) to the processing space, and providing the substrate (S) at the same height as the pair of arms (110).

[0075] The step of gripping the edge of the substrate (S) can be performed by moving a shaft (210) installed through the processing space in one direction, and gripping the edge of the substrate (S) with a pair of arms (110) connected to the shaft (210). First, the pair of arms (110) can operate from an open state to a closed state. To this end, the second driving source (240) operates to move the second case (430) toward the first case (410), and the bellows (420) contracts accordingly. When the second case (430) moves toward the first case (410) by the second driving source (240), the first shaft (210a) advances from the substrate (S) within the second shaft (201b). Accordingly, the linkage member (310) pushes the operating arm (112b), and the grip arm (112a) connected to the operating arm (112b) is also pushed, so that the pair of arms (110) can be closed. Here, the substrate (S) can be inserted into and coupled to the insertion groove (H) formed on the inner surface of the pair of arms (110).

[0076] Here, the step of gripping the edge of the substrate (S) may include a step of detecting the distance that the shaft (210) has advanced. That is, in order to confirm that the substrate (S) has been accurately gripped by the pair of arms (110), it may be confirmed through a sensor unit whether the shaft (210) has moved to a distance that allows the pair of arms (110) to close. Such a sensor unit may be installed in the second driving source (240) to detect the movement distance of the first shaft (210a).

[0077] The step of inverting the substrate (S) is to invert the substrate (S) by rotating the shaft (210) around the one direction so that the surface (S2) facing upwards is faced with the pair of arms (110). To this end, the first driving source operates to rotate the first shaft (210a), and the second shaft (210b) rotates in conjunction with the first shaft (210a). Here, since the second shaft (210b) and the first coupling member (210) are fixedly coupled by the gap maintaining member (320), the first coupling member (210) rotates in conjunction with the rotation of the second shaft (210b). In addition, the second coupling member (220) rotates in conjunction with the rotation of the first shaft (210a), and the coupling member (310) connected to the second coupling member (220) also rotates together with the second coupling member (220). Accordingly, a pair of arms (110) coupled to the first coupling member (210) and the linkage member (310) can rotate around one direction to flip the substrate (S) from a direction in which one side (S1) faces upward to a direction in which the other side (S2) faces upward.

[0078] Here, the step of reversing the substrate (S) may include a step of detecting the angle at which the shaft (210) rotates. That is, in order to confirm whether the substrate (S) has been accurately rotated from a direction in which one side (S1) faces upward to a direction in which the other side (S2) faces upward, it may be confirmed through a sensor unit whether the shaft (210) has rotated at an angle capable of reversing a pair of arms (110). Such a sensor unit may be installed in the first driving source (230) and detect the rotation angle of the first shaft (210a).

[0079] The step of separating the substrate (S) is to move the shaft (210) along the one direction to separate the substrate (S) from the pair of arms (110). To this end, the second driving source (240) operates to move the second case (430) away from the first case (410), and the bellows (420) extends accordingly. When the second case (430) is moved away from the first case (410) by the second driving source (240), the first shaft (210a) moves backward in the Y-axis direction within the second shaft (201b). As a result, the linkage member (310) pulls the operating arm (112b), and the grip arm (112a) connected to the operating arm (112b) is also pulled, so that the pair of arms (110) can be opened.

[0080] Here, the step of separating the substrate (S) may include a step of detecting the distance that the shaft (210) has moved backwards. That is, in order to confirm whether the substrate (S) has been accurately separated from the pair of arms (110), it may be confirmed through a sensor unit whether the shaft (210) has moved to a distance that allows the pair of arms (110) to open. Such a sensor unit may be installed in the second driving source (240) to detect the movement distance of the first shaft (210a).

[0081] As described above, such a substrate processing method can be performed in various spaces for inverting the substrate. In addition, the substrate processing method can be performed in a transfer chamber. For this purpose, the substrate processing method according to an embodiment of the present invention can further include a step of moving the pair of arms (110) up and down or rotating them about the up and down direction between the step of holding the edge of the substrate (S) and the step of separating the substrate (S). For this purpose, the inside of the transfer chamber can further include a housing that provides a receiving space isolated from the processing space within the transfer chamber, and the substrate support device can be installed by penetrating the wall of the housing so that the driving source (230, 240) is arranged in the receiving space within the housing. At this time, the housing is installed so as to be able to move up and down or rotate about the up and down direction within the transfer chamber, so that the pair of arms (110) are exposed to the outside of the receiving space within the transfer chamber and can move up and down or rotate about the up and down direction according to the movement of the housing, thereby replacing the function of a robot arm.

[0082]

[0083] While the preferred embodiments of the present invention have been described and illustrated using specific terms above, such terms are solely for the purpose of clearly describing the present invention, and it is to be understood that various modifications and variations may be made to the embodiments and terms described herein without departing from the spirit and scope of the appended claims. Such modified embodiments should not be construed individually from the spirit and scope of the present invention, but should be considered to fall within the scope of the claims.

Claims

1. A substrate support device capable of breaking and inverting the substrate, A gripping portion including a pair of arms that can be opened and closed to grip the edge of the substrate; A driving unit including a shaft extending in one direction and a driving source capable of moving the shaft along the one direction and rotating the shaft around the one direction; and A substrate support device including a connecting portion connecting the grip portion and the driving portion so that the pair of arms are opened and closed in conjunction with movement along one direction of the shaft and rotate in conjunction with rotation of the shaft.

2. In claim 1, The above-mentioned part, A substrate support device comprising a connecting member to which the pair of arms are hingedly connected.

3. In claim 2, The above cancer, a first region capable of gripping the edge of the substrate; and A substrate support device comprising a second region extending from an edge of the substrate between the first region and the bonding member.

4. In claim 3, The second region is a substrate support device that is connected to the first region in a stepwise manner.

5. In claim 3, The above cancer, A substrate support device having an insertion groove formed on the inner surface facing the substrate into which an edge of the substrate can be inserted.

6. In claim 5, The above cancer, A substrate support device including a buffer member installed in the above insertion groove.

7. In claim 2, The above shaft, A first shaft capable of moving along the above direction and rotating around the above direction; and A substrate support device comprising a second shaft coupled to the first shaft so as to rotate in conjunction with the rotation of the first shaft.

8. In claim 7, The above driving force is, A first driving source connected to the first shaft so as to rotate the first shaft around the one direction; and A substrate support device comprising a second driving source capable of moving the first driving source along the one direction so that the first shaft moves along the one direction.

9. In claim 7, A substrate support device further comprising a sensor unit capable of detecting a movement distance of the first shaft and a rotation angle of the second shaft.

10. A chamber having a vacuum processing space inside; and A substrate processing facility comprising a substrate support device according to any one of claims 1 to 9, which is installed in the chamber so as to be able to hold and invert a substrate provided in the processing space.

11. Step of preparing the substrate with one side facing upward; A step of moving a shaft connected to a pair of arms in one direction to grip the edge of the substrate with the pair of arms; A step of rotating the shaft around the one direction to invert the substrate so that the surface of the pair of arms faces upward; and A substrate processing method comprising: a step of moving the shaft along the one direction to separate the substrate from the pair of arms; 12. In claim 11, The step of preparing the above substrate is: a step of placing the substrate at the same height as the pair of arms; and A step of horizontally moving the substrate and providing it to the processing space; The step of arranging the above pair of arms at the same height is: A substrate processing method performed by measuring the height of a robot arm that provides the substrate to the processing space.

13. In claim 11, The step of piercing the edge of the above substrate is: A substrate processing method for wiping a portion of an edge of the substrate.

14. In claim 11, The step of piercing the edge of the above substrate is: A substrate processing method performed by inserting the edge of the substrate into the inner surface of the pair of arms.

15. In claim 11, The step of gripping the edge of the substrate is performed by advancing the shaft from the substrate, A substrate processing method in which the step of separating the substrate is performed by moving the shaft backward toward the substrate.

16. In claim 15, The step of gripping the edge of the substrate includes the step of detecting the distance the shaft has advanced; The step of inverting the substrate includes a step of detecting the angle at which the shaft rotates; A substrate processing method, comprising: a step of separating the substrate; a step of detecting a distance by which the shaft has moved backwards.

17. In claim 11, The step of breaking the edge of the substrate and the step of separating the substrate are: A substrate processing method performed by rotating the above pair of arms around the end.

18. In claim 11, Between the step of gripping the edge of the substrate and the step of separating the substrate, A substrate processing method further comprising a step of moving the pair of arms in an up-and-down direction or rotating them about an up-and-down direction.

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