Circuit board assembly and electronic device

Abstract

Embodiments of the present application relate to the technical field of electronics, and provide a circuit board assembly and an electronic device. The circuit board assembly comprises a first circuit board and a first spring pin; part of the first circuit board is located in a clearance area of an antenna of the electronic device; the first spring pin is located in the clearance area; and the first spring pin has one end electrically connected to the part of the first circuit board located in the clearance area, and the other end used for grounding. The first spring pin is arranged in the circuit board assembly and grounding is implemented by means of the first spring pin, such that current flows back. The first spring pin is elastic, effectively enhancing the reliability and robustness of electrical connection between the first spring pin and the first circuit board, and effectively reducing the grounding impedance of the circuit board assembly. Moreover, the first spring pin can also avoid the problems such as poor contact of the circuit board assembly during grounding, and avoid the occurrence of a PIM effect caused by poor contact, thereby effectively improving the reliability and stability of antenna operation, and enhancing communication experience of users.

Description

Circuit board assembly and electronic device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on February 21, 2024, with application number 202410195712.7 and application name “A Circuit Board Assembly and Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to a circuit board assembly and an electronic device. Background Art

[0003] With the continuous development and update of electronic technology, electronic consumer products, such as mobile phones, tablets, laptops, etc., have become more and more common in people's lives. With the continuous development of terminal electronic equipment technology, communication function, as one of the main functions of electronic equipment, has always attracted people's attention.

[0004] Electronic devices often include communication antennas, which transmit and receive signals to enable communication. These antennas are often surrounded by electronic components such as circuit boards. Signals transmitted by the antennas radiate onto the circuit boards, impacting the antenna's radiation efficiency. Therefore, circuit boards are often grounded to allow current to flow back through them, reducing their impact on antenna radiation efficiency. Currently, circuit boards are typically grounded by bonding them to solder pillars to facilitate current flow.

[0005] However, in the above-mentioned circuit board grounding method, the circuit board grounding impedance is relatively large, and the reliability of the solder pillar connection is relatively poor, which may cause a passive intermodulation (PIM) effect, thereby reducing the radiation efficiency of the antenna. Summary of the Invention

[0006] The embodiments of the present application provide a circuit board assembly and an electronic device, which can effectively avoid problems such as poor contact of the circuit board assembly during the grounding process, avoid the PIM effect caused by poor contact, and thus effectively improve the reliability and stability of the antenna operation.

[0007] A first aspect of the present application provides a circuit board assembly, comprising a first circuit board and a first elastic foot, wherein the first circuit board is used to be installed in an electronic device, and a portion of the first circuit board is located in a clearance area of ​​an antenna of the electronic device; the first elastic foot is located in the clearance area, and one end of the first elastic foot is electrically connected to the portion of the first circuit board located in the clearance area, and the other end of the first elastic foot is used for grounding.

[0008] In this embodiment, a first elastic pin is provided in the circuit board assembly and grounded via the first elastic pin to facilitate current return. The first elastic pin has a spring force that effectively increases the reliability and robustness of the electrical connection between the first elastic pin and the first circuit board, effectively reducing the ground impedance of the circuit board assembly. Furthermore, the first elastic pin effectively prevents problems such as poor contact during the grounding process of the circuit board assembly, thus avoiding the PIM effect caused by poor contact. This effectively improves the reliability and stability of the antenna and enhances the user's communication experience.

[0009] In one possible implementation, a bracket is further included, the bracket including a first surface and a second surface relative to each other; at least a portion of the first circuit board is located on the first surface of the bracket, and the second surface faces the first elastic foot; the first circuit board is insulated and connected to the bracket.

[0010] The bracket can support the first circuit board so that the first circuit board is in a flat state, which can effectively reduce or avoid bending and deformation of the first circuit board. This can facilitate the arrangement of electronic components on the first circuit board and improve the reliability and stability of the arrangement of electronic components on the first circuit board.

[0011] In one possible implementation, the first circuit board includes a main body and an extension portion; the main body is located on the first surface and is insulated and connected to the first surface, and one end of the main body is located in the clearance area; one end of the extension is connected to one end of the main body located in the clearance area, and the other end of the extension extends toward the second surface of the bracket; one end of the first elastic foot is electrically connected to the extension portion.

[0012] The radiation signal on the antenna can be radiated to one end of the main body located in the antenna clearance area, and the current signal radiated to the main body can flow from the main body to the extension part, and then from the extension part to the first spring pin, and finally return through the first spring pin, thereby realizing the return of current on the first circuit board.

[0013] In one possible implementation, the extension portion includes a first extension portion and a second extension portion that are connected; one end of the first extension portion is connected to the main body portion, and the first extension portion extends from the first surface of the bracket toward the second surface; the second extension portion is located on the second surface of the bracket and is insulated and connected to the second surface; the first elastic foot is electrically connected to the second extension portion.

[0014] The signal current on the antenna can radiate to one end of the main body located in the clearance area, then flow from the main body to the first extension part and the second extension part in sequence, and finally flow from the second extension part to the first elastic foot, thereby flowing back through the first elastic foot.

[0015] In one possible implementation, a surface of the second extension facing the first elastic pin has a gold-leaking surface, and the first elastic pin is electrically connected to the gold-leaking surface. The gold-leaking surface can effectively improve the reliability and stability of the electrical connection between the first elastic pin and the first circuit board, effectively reducing or avoiding problems such as false connection or poor contact between the first elastic pin and the first circuit board, thereby effectively improving the stability of current return in the first circuit board.

[0016] In one possible implementation, the device further includes a reinforcement structure, located between the second extension and the second surface of the bracket, and connected to the second extension and the second surface of the bracket. The reinforcement structure has high rigidity and strength, effectively reducing or preventing deformation of the bracket under the elastic force of the first elastic pin, preventing deformation of the bracket from affecting the electrical connection between the second extension and the first elastic pin, and avoiding poor contact between the second extension and the first elastic pin, thereby preventing a false connection. The structure can effectively improve the reliability and stability of the electrical connection between the first elastic pin and the second extension, thereby effectively improving the stability of current conduction between the first circuit board and the first elastic pin, and enhancing the reliability of current return.

[0017] In one possible implementation, insulating adhesive is further included to insulate the reinforcement structure from the second extension. This effectively reduces or prevents separation between the second extension and the reinforcement structure, effectively improving the reliability and robustness of the connection between the second extension and the reinforcement structure, and contributing to improved structural stability of the circuit board assembly as a whole.

[0018] In one possible implementation, the reinforcement structure is insulated from the second surface of the bracket by an insulating adhesive layer. This can reduce or prevent separation between the reinforcement structure and the bracket, thereby effectively improving the reliability and firmness of the connection between the reinforcement structure and the bracket, and enhancing the structural stability of the circuit board assembly.

[0019] In one possible implementation, it further includes a conductive layer, one end of which is electrically connected to the first circuit board; the other end of which is electrically connected to the first elastic foot; and the conductive layer is at least partially located in the clearance area.

[0020] The current radiated from the antenna to the first circuit board can flow to the conductive layer, then through the conductive layer to the first spring pin, and finally return to ground through the first spring pin. The conductive layer has good conductivity and can effectively increase the ground impedance between the first circuit board and the first spring pin, thereby effectively improving the efficiency of current return on the first circuit board.

[0021] In one possible implementation, the conductive layer includes a first conductive layer and a second conductive layer, and the first conductive layer is electrically connected to the second conductive layer; the first conductive layer is located between the first surface of the bracket and the portion of the first circuit board located in the clearance area, and is electrically connected to the first circuit board; the second conductive layer is located between the second surface of the bracket and the first elastic foot, and is electrically connected to the first elastic foot.

[0022] The current radiated from the antenna to the first circuit board can first flow to the first conductive layer, then flow through the first conductive layer to the second conductive layer, then through the second conductive layer to the first spring pin, and finally return to ground through the first spring pin. The first and second conductive layers have good conductivity, which can reduce the connection impedance between the first circuit board and the first spring pin, helping to reduce the ground impedance of the circuit board assembly, thereby improving the efficiency of the circuit board assembly's ground return current.

[0023] In a possible implementation, the conductive layer is located on the second surface of the bracket and between the second surface of the bracket and the first elastic pin, and the conductive layer is electrically connected to the first elastic pin.

[0024] In one possible implementation, one end of the first circuit board located within the clearance area has a bent portion; the bent portion extends from the first side of the bracket toward the second side of the bracket, and one end of the conductive layer is electrically connected to the first circuit board via the bent portion. Current radiated from the antenna to the first circuit board can first flow through the bent portion of the first circuit board, then through the bent portion to the conductive layer, then through the conductive layer to the first spring pin, and finally return to ground through the first spring pin.

[0025] In one possible implementation, the conductive layer is a nickel-gold layer. The nickel-gold layer has excellent electrical conductivity and can effectively increase the ground impedance between the conductive layer and the first spring pin, thereby effectively improving the efficiency of current return on the first circuit board. Furthermore, the nickel-gold layer has excellent oxidation resistance, effectively reducing or preventing oxidation of the conductive layer, thereby helping to improve the stability and reliability of the conductive layer.

[0026] In one possible implementation, the bracket is a plastic bracket. Plastic brackets are lightweight and low-cost, effectively reducing the overall weight and material cost of the circuit board assembly. Furthermore, the plastic bracket has good insulation properties, insulating and isolating the first circuit board. This reduces or eliminates electrical conduction between the first circuit board and other devices, preventing the first circuit board from conducting with other devices and affecting the normal operation of the circuit board assembly, thereby improving the reliability and stability of the overall operation of the circuit board assembly.

[0027] In one possible implementation, a second circuit board is further included, the first elastic pin is located between the first circuit board and the second circuit board, and the other end of the first elastic pin is electrically connected to the second circuit board, and the first elastic pin is grounded through the second circuit board.

[0028] The second circuit board can be used to charge the charging coil on the first circuit board, and the first spring pin can be grounded through the second circuit board so that the radiation current on the first circuit board can flow back through the first spring pin and the second circuit board in turn, so as to avoid the radiation current on the first circuit board from adversely affecting the normal radiation of the antenna.

[0029] In one possible implementation, a second elastic pin is further included, one end of the second elastic pin being electrically connected to the second circuit board, and the other end of the second elastic pin being grounded to the middle frame of the electronic device. The second elastic pin has a spring force that effectively improves the reliability and stability of the electrical connection between the second elastic pin, the second circuit board, and the middle frame, effectively reducing or avoiding poor or loose contact between the second elastic pin, the second circuit board, and the middle frame, thereby effectively improving the reliability and stability of the second elastic pin's grounding.

[0030] In one possible implementation, the other end of the first elastic pin is electrically connected to the middle frame of the electronic device for grounding. Current radiated from the antenna to the first circuit board can flow to the first elastic pin and then to the middle frame of the electronic device through the first elastic pin, thereby achieving current return.

[0031] In one possible implementation, the first circuit board is a flexible circuit board. The flexible circuit board is flexible and can be bent and folded freely, and can be arranged and adjusted as needed. It can meet the needs of different scenarios and has high flexibility.

[0032] In one possible implementation, a charging coil is further included, located on the first circuit board, with at least a portion of the charging coil positioned within the clearance area. This reduces the distance between the charging coil and the frame of the electronic device, and reduces the distance between the charging coil and the stylus, thereby increasing the coupling between the charging coil and the stylus and effectively improving the charging efficiency of the charging coil.

[0033] In one possible implementation, the second circuit board is a printed circuit board.

[0034] A second aspect of the present application provides an electronic device, comprising: a housing, an antenna, and a circuit board assembly as described above, wherein the antenna includes a radiator having a clearance area; the circuit board assembly is located in the housing, and a portion of the first circuit board and the first spring foot in the circuit board assembly are located in the clearance area.

[0035] By making the electronic device include the above-mentioned circuit board assembly, the grounding impedance of the circuit board assembly is small, and the reliability of the grounding connection is high, and it is not easy to produce false connection or poor contact, etc., which can effectively reduce or avoid the poor contact of the antenna of the electronic device, thereby effectively improving the reliability and stability of the antenna operation in the electronic device and enhancing the user's communication experience.

[0036] In a possible implementation, the housing has a metal frame, and at least a portion of the metal frame forms the radiator;

[0037] One end of the first circuit board located in the clearance area is arranged close to the metal frame.

[0038] In one possible implementation, the housing includes a battery cover and a middle frame;

[0039] The battery cover is disposed on the middle frame, and the battery cover and the middle frame together enclose a receiving space, and the circuit board assembly is located in the receiving space;

[0040] The middle frame has the metal frame.

[0041] In one possible implementation, the middle frame includes the metal frame and the metal middle plate, the metal frame is insulated from the metal middle plate, and the first elastic foot is electrically connected to the metal middle plate; or, the first elastic foot is electrically connected to the second circuit board in the circuit board assembly.

[0042] In one possible implementation, the antenna is a high-power antenna with a power greater than or equal to 25 dB.

[0043] In one possible implementation, the antenna is a satellite communication antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0045] FIG2 is an exploded view of a circuit board assembly provided in an embodiment of the present application;

[0046] FIG3 is a cross-sectional view of section BB in FIG1 ;

[0047] FIG4 is a schematic diagram of a stack of layers of a first circuit board assembly provided in an embodiment of the present application;

[0048] FIG5 is a schematic structural diagram of a gold-leaking surface provided in an embodiment of the present application;

[0049] FIG6 is a schematic structural diagram of a second circuit board assembly provided in an embodiment of the present application;

[0050] FIG7 is a schematic diagram of a stacking diagram of a second circuit board assembly provided in an embodiment of the present application;

[0051] FIG8 is a schematic structural diagram of a third circuit board assembly provided in an embodiment of the present application;

[0052] FIG9 is a schematic diagram of a stacking diagram of a third circuit board assembly provided in an embodiment of the present application;

[0053] FIG10 is a schematic structural diagram of a fourth circuit board assembly provided in an embodiment of the present application;

[0054] FIG11 is a schematic diagram of a stacking diagram of a fourth circuit board assembly provided in an embodiment of the present application;

[0055] FIG12 is a schematic structural diagram of a fifth circuit board assembly provided in an embodiment of the present application;

[0056] FIG13 is a schematic diagram of a stacking diagram of a fifth circuit board assembly provided in an embodiment of the present application;

[0057] FIG14 is a schematic structural diagram of a sixth circuit board assembly provided in an embodiment of the present application;

[0058] FIG15 is a schematic structural diagram of the seventh circuit board assembly provided in an embodiment of the present application.

[0059] Explanation of Reference Numerals: 100 - circuit board assembly; 110 - first circuit board; 111 - main body; 112 - extension portion; 1121 - first extension portion; 1122 - second extension portion; 113 - bending portion; 114 - metal layer; 115 - insulating layer; 116 - gold-leaking surface; 120 - first elastic foot; 130 - bracket; 131 - first surface; 132 - second surface; 140 - reinforcement structure; 150 - conductive layer; 151 - first conductive layer; 152 - second conductive layer; 160 - second circuit board; 170 - second elastic foot; 180 - insulating adhesive; 190 - charging coil; 200 - electronic device; 210 - housing; 211 - battery cover; 212 - middle frame; 2121 - metal middle plate; 2122 metal frame; 213 - receiving cavity; 220 - antenna; 230 - stylus; 240-display screen. DETAILED DESCRIPTION

[0060] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0061] Figure 1 is a structural schematic diagram of an electronic device provided in an embodiment of the present application, Figure 2 is a decomposition diagram of a circuit board assembly provided in an embodiment of the present application, Figure 3 is a sectional view of the BB section in Figure 1, and Figure 4 is a stacking schematic diagram of the first circuit board assembly provided in an embodiment of the present application.

[0062] An embodiment of the present application provides a circuit board assembly and an electronic device including the circuit board assembly, wherein the electronic device can be an electronic device with an antenna, such as a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a wearable device, a virtual reality device, an in-vehicle device, or the like.

[0063] The following description will be made using the electronic device 200 as an example of a tablet computer. As shown in FIG1 , the electronic device 200 may include a housing 210 and an antenna 220 . The housing 210 serves as a carrier of the electronic device 200 , and the components forming the electronic device 200 may all be arranged in or on the housing 210 .

[0064] For example, a display screen 240 may be provided on the housing 210. The display screen 240 may be used to display, for example, video, photos, and other image information for the user to view. As shown in FIG2 , the housing 210 may have a receiving cavity 213, and the circuit board assembly 100 may be located within the receiving cavity 213 of the housing 210. Components such as a battery (not shown) and a motherboard (not shown) may also be provided within the housing 210 to enable the complete functionality of the electronic device 200.

[0065] The antenna 220 may include a radiator, which may be used to transmit and receive signals so that the electronic device 200 can communicate. For example, as shown in conjunction with Figures 3 and 4 , the housing 210 may include a metal frame 2122, at least a portion of which may form the radiator of the antenna 220. The metal frame 2122, serving as the radiator of the antenna 220, may also be used to transmit and receive signals while fulfilling the carrying function of the housing 210, thereby eliminating the need for an additional radiator for the antenna 220 in the electronic device 200. This improves the utilization of the housing 210 and enhances the spatial layout of the electronic device 200.

[0066] For example, the housing 210 may include a battery cover 211 and a middle frame 212. The battery cover 211 may be the rear housing of the electronic device 200. The battery cover 211 may be placed on the middle frame 212. The battery cover 211 and the middle frame 212 may together form a housing space, and the circuit board assembly 100 may be located within the housing space. The middle frame 212 may have the aforementioned metal frame 2122 to form a radiator for the antenna 220.

[0067] For example, as shown in Figures 3 and 4, the middle frame 212 may include a metal frame 2122 and a metal middle plate 2121. The metal frame 2122 may be insulated from the metal middle plate 2121. For example, the metal frame 2122 and the metal middle plate 2121 may be formed into an integral structure by injection molding or other methods, and the metal frame 2122 and the metal middle frame 2121 are insulated by the injection molding structure. Alternatively, the metal frame 2122 and the metal middle plate 2121 may be separate structures, and an insulating strip, insulating member, or other structural member may be provided between the metal middle plate 2121 and the metal frame 2122 to isolate the metal frame 2122, which serves as the radiator of the antenna 220, from the metal middle plate 2121. This can reduce or avoid the influence of the metal middle plate 2121 on the radiation of the antenna 220, thereby improving the reliability and stability of the operation of the antenna 220.

[0068] The radiator may have a clearance area A. For example, the clearance area A may be the dotted box area A in Figures 1 and 2. The clearance area A of the antenna 220 refers to the area around the antenna where no ground is laid. The main function of the clearance area A is to keep the metal away from the antenna body (for example, the radiator), thereby preventing the metal from being too close to the antenna and affecting the radiation efficiency of the antenna.

[0069] Antenna 220 may be a high-power antenna, for example, with a power of 25 dB or greater. For example, antenna 220 may be a satellite communication antenna. Satellite communication has a wide range, enabling communication between any two points within the range of radio waves transmitted by the satellite. It is also less susceptible to land disasters and has high reliability.

[0070] Alternatively, in some examples, the antenna 220 may also be a conventional communication antenna, a Wi-Fi antenna, etc.

[0071] One end of the circuit board assembly 100 can be positioned near the metal frame 2122 of the housing 210. For example, a portion of the circuit board assembly 100 can be located within the clearance area A of the antenna 220. For example, the circuit board assembly 100 can be a wireless charging device, and the circuit board assembly 100 can be used to charge a stylus in the electronic device 200. For example, the electronic device 200 can also include a stylus 230 (see FIG. 2 ). During the charging process of the stylus 230, the stylus 230 can be positioned near the metal frame 2122 of the electronic device 200, thereby being close to the circuit board assembly 100, so that the circuit board assembly 100 can charge the stylus 230.

[0072] Circuit board assembly 100 is positioned near clearance area A of antenna 220. Due to the high power of antenna 220, signals transmitted or received by antenna 220 may radiate onto circuit board assembly 100, thereby affecting the radiation efficiency of antenna 220. Furthermore, the radiation of signals from antenna 220 onto circuit board assembly 100 may also adversely affect circuit board assembly 100. In related art, a tin pillar is provided in circuit board assembly 100, and the circuit board is grounded via the tin pillar to reflux current, thereby reducing the impact of circuit board assembly 100 on the radiation efficiency of antenna 220.

[0073] However, the aforementioned PCB assembly grounding method has a relatively high ground impedance. Furthermore, grounding the PCB assembly via solder pillars has poor connection reliability and is prone to poor contact, which can lead to passive intermodulation (PIM). This PIM effect occurs when two or more frequencies mix together in a nonlinear active device, generating spurious signals. When these spurious intermodulation signals fall within the antenna's receiving band, the antenna's sensitivity decreases, affecting its normal operation and degrading the user's communication experience.

[0074] To address the aforementioned issues, the present application improves the structure of the circuit board assembly by providing a first spring pin within the circuit board assembly and grounding the pin through the first spring pin to facilitate current return. The first spring pin possesses a spring force that effectively increases the reliability and robustness of the electrical connection between the first spring pin and the first circuit board, effectively reducing the grounding impedance of the circuit board assembly. Furthermore, the first spring pin effectively prevents problems such as poor contact during the grounding process of the circuit board assembly, thus avoiding the PIM effect caused by poor contact. This effectively improves the reliability and stability of the antenna and enhances the user's communication experience.

[0075] The circuit board assembly provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0076] An embodiment of the present application provides a circuit board assembly 100, as shown in Figures 3 and 4. The circuit board assembly 100 may include a first circuit board 110. The first circuit board 110 may be arranged in an electronic device 200. For example, the first circuit board 110 may be used for wireless charging, and the first circuit board 110 may charge a stylus 230 in the electronic device 200.

[0077] Part of the first circuit board 110 can be located within the clearance area A of the antenna 220 of the electronic device 200, and the first circuit board 110 can be close to the frame of the electronic device 200. This can reduce the distance between the first circuit board 110 and the stylus 230, effectively increase the electromagnetic coupling amount of wireless charging between the stylus 230 and the first circuit board 110, thereby effectively improving the charging efficiency of the first circuit board 110 for the stylus 230 at the frame of the electronic device 200.

[0078] The circuit board assembly 100 may further include a first elastic pin 120. The first elastic pin 120 may be located within the clearance area A of the antenna 220. One end of the first elastic pin 120 may be electrically connected to the portion of the first circuit board 110 located within the clearance area A, and the other end of the first elastic pin 120 may be used for grounding. For example, the other end of the first elastic pin 120 may be electrically connected to the middle frame 212 of the electronic device 200 for grounding, or the other end of the first elastic pin 120 may be electrically connected to the mainboard of the electronic device 200 for grounding.

[0079] For example, the first elastic pin 120 may be an elastic member having elasticity. During the process of electrically connecting the first elastic pin 120 to the first circuit board 110, the first elastic pin 120 may be in a compressed state. The compressed first elastic pin 120 has a rebound force, which can drive the first elastic pin 120 into close contact with the first circuit board 110, thereby reducing or preventing separation of the first elastic pin 120 from the first circuit board 110, thereby effectively improving the reliability and stability of the electrical connection between the first elastic pin 120 and the first circuit board.

[0080] The signal from antenna 220 can be radiated to the portion of first circuit board 110 located within clearance area A. This signal current can then flow back through first spring pin 120, reducing or preventing the current on first circuit board 110 from adversely affecting the normal radiation of antenna 220, thereby effectively improving the radiation efficiency of antenna 220. Furthermore, the return of the current radiated from antenna 220 to first circuit board 110 can also reduce or prevent the radiated signal from adversely affecting circuit board assembly 100, thereby effectively improving the operational stability and reliability of circuit board assembly 100.

[0081] Compared to grounding methods in related arts, the present embodiment provides a first elastic pin 120 within the circuit board assembly 100 and uses this first elastic pin 120 for grounding, thereby enabling current return. The elastic force of the first elastic pin 120 effectively increases the reliability and robustness of the electrical connection between the first elastic pin 120 and the first circuit board 110, effectively reducing the grounding impedance of the circuit board assembly 100. Furthermore, the first elastic pin 120 effectively prevents problems such as poor contact during the grounding process of the circuit board assembly 100, avoiding the PIM effect caused by poor contact, thereby effectively improving the reliability and stability of the antenna 220 and enhancing the user's communication experience.

[0082] Continuing with Figures 3 and 4 , a charging coil 190 may be provided on the first circuit board 110. This charging coil 190 can be used to charge the stylus 230 of the electronic device 200. For example, the charging coil 190 may be a Hall element. The charging coil 190 may be located on the first circuit board 110, and at least a portion of the charging coil 190 may be located within the clearance area A of the antenna 220. This reduces the distance between the charging coil 190 and the frame of the electronic device 200, and also reduces the distance between the charging coil 190 and the stylus 230. This helps increase the coupling between the charging coil 190 and the stylus 230, thereby effectively improving the charging efficiency of the charging coil 190.

[0083] Continuing with reference to FIG. 3 and FIG. 4 , the circuit board assembly 100 may further include a bracket 130. The bracket 130 may include a first surface 131 and a second surface 132 that are opposite to each other. At least a portion of the first circuit board 110 may be located on the first surface 131 of the bracket 130. For example, a portion of the first circuit board 110 may be located on the first surface 131 of the bracket 130, while another portion may be located on one side of the second surface 132 of the bracket 130. The second surface 132 of the bracket 130 may face the first elastic foot 120. For example, the first surface 131 of the bracket 130 may face one side of the battery cover 211 of the electronic device 200, while the second surface 132 may face one side of the metal mid-plate 2121.

[0084] The first circuit board 110 and the bracket 130 can be connected in an insulated manner. For example, the first circuit board 110 and the bracket 130 can be bonded together by a layer of insulating glue 180. Alternatively, the bracket 130 can also be a plastic bracket 130. In this case, the bracket 130 itself has insulating properties and does not need to be bonded with insulating glue. For example, the first circuit board 110 and the bracket 130 can be connected by an ordinary adhesive layer to reduce the connection cost between the bracket 130 and the first circuit board 110.

[0085] It should be noted that the bracket 130 shown in cross section in FIG3 is in a suspended state. In actual use, the bracket 130 can be connected to other structural components in the electronic device 200 to achieve installation and fixation of the bracket 130. For example, the bracket 130 can be connected to the mainboard of the electronic device 200 via screws or other connectors to achieve installation and fixation of the bracket 130. Alternatively, in some examples, the bracket 130 can also be connected to the battery cover 211 in the electronic device 200 to achieve fixation of the bracket 130.

[0086] The bracket 130 can support the first circuit board 110 so that the first circuit board 110 is in a flat state, which can effectively reduce or avoid bending and deformation of the first circuit board 110. This can facilitate the arrangement of electronic components on the first circuit board 110 and improve the reliability and stability of the electronic components set on the first circuit board 110.

[0087] For example, the first circuit board 110 may be a flexible printed circuit (FPC). The flexible printed circuit is flexible and can be bent and folded freely. It can be arranged and adjusted arbitrarily according to usage requirements, and can meet the usage requirements of different scenarios with high flexibility.

[0088] In the embodiment of the present application, the bracket 130 may be a plastic bracket. For example, the bracket 130 may be formed of a material such as plastic by injection molding or stamping. The bracket 130 made of plastic is lightweight and low in cost, which can effectively reduce the overall weight of the circuit board assembly 100 and reduce the material cost of the circuit board assembly 100.

[0089] Moreover, the plastic bracket 130 has good insulation properties, which can insulate and isolate the first circuit board 110, reduce or avoid circuit conduction between the first circuit board 110 and other devices, and prevent the first circuit board 110 from being conducted with other devices and affecting the normal operation of the circuit board assembly 100, which is beneficial to improving the reliability and stability of the overall operation of the circuit board.

[0090] Continuing to refer to Figures 3 and 4, in one possible implementation, the first circuit board 110 may include a main body 111 and an extension portion 112, wherein the main body 111 may be located on the first surface 131 of the bracket 130 and insulated from and connected to the first surface 131 of the bracket 130, and one end of the main body 111 may be located within the clearance area A of the antenna 220, one end of the extension portion 112 may be connected to one end of the main body 111 located within the clearance area A, and the other end of the extension portion 112 may extend toward the second surface 132 of the bracket 130.

[0091] For example, the first circuit board 110 can be bent to form an extension portion 112 at one end of the main body portion 111. The first elastic leg 120 can be electrically connected to the extension portion 112. For example, the first elastic leg 120 can abut against the extension portion 112. The first elastic leg 120 has a rebound force that can press the first elastic leg 120 against the extension portion 112, so that current can be conducted between the extension portion 112 and the first elastic leg 120.

[0092] The radiation signal on the antenna 220 can be radiated to one end of the main body 111 located in the clearance area A of the antenna 220. The current signal radiated to the main body 111 can flow from the main body 111 to the extension part 112, and then flow from the extension part 112 to the first elastic foot 120, and finally flow back through the first elastic foot 120, thereby realizing the backflow of current on the first circuit board 110.

[0093] Continuing with FIG. 3 and FIG. 4 , in one example, the extension portion 112 may include a first extension portion 1121 and a second extension portion 1122 connected to each other. One end of the first extension portion 1121 may be connected to the main body 111 of the first circuit board 110, and the first extension portion 1121 may extend from the first surface 131 of the bracket 130 toward the second surface 132 of the bracket 130. For example, it can be understood that the first extension portion 1121 is located on a side surface of the bracket 130.

[0094] The first extension portion 1121 can be connected to the side of the bracket 130. For example, the first extension portion 1121 and the side of the bracket 130 can be connected by bonding. This can effectively reduce or avoid bulging, warping, etc. in the area of ​​the first extension portion 1121, and help to improve the connection, firmness and reliability between the first circuit board 110 and the bracket 130, thereby effectively improving the overall structural stability of the circuit board assembly 100.

[0095] The second extension portion 1122 can be located on the second surface 132 of the bracket 130 and be insulated and connected to the second surface 132. For example, one end of the second extension portion 1122 can be connected to the first extension portion 1121, and the other end can extend from the first extension portion 1121 along the second surface 132 of the bracket 130, and the second extension portion 1122 can be located in the clearance area A of the antenna 220.

[0096] The first elastic foot 120 can be electrically connected to the second extension portion 1122. For example, the first elastic foot 120 can abut against the second extension portion 1122. The rebound force of the first elastic foot 120 can drive the first elastic foot 120 to be pressed against the second extension portion 1122, so that current can be conducted between the second extension portion 1122 and the first elastic foot 120.

[0097] The signal current on the antenna 220 can be radiated to one end of the main body 111 located in the clearance area A, and then flow from the main body 111 to the first extension part 1121 and the second extension part 1122 in sequence, and finally flow from the second extension part 1122 to the first elastic foot 120, thereby flowing back through the first elastic foot 120.

[0098] FIG5 is a schematic structural diagram of a gold-leaking surface provided in an embodiment of the present application.

[0099] As shown in FIG5 , a surface of the second extension portion 1122 facing the first elastic foot 120 may have a gold-leaking surface 116, and the first elastic foot 120 may be electrically connected to the gold-leaking surface 116. For example, as shown in FIG5 , the first circuit board 110 may include a metal layer 114 (e.g., a copper layer) and an insulating layer 115 coated on the surface of the metal layer 114. A portion of the insulating layer 115 on the second extension portion 1122 may be removed. For example, the insulating layer 115 may be ground away to expose the metal layer 114 below the insulating layer 115, thereby forming the gold-leaking surface 116. The first elastic foot 120 may abut against the exposed metal layer 114 (i.e., the gold-leaking surface 116) to electrically connect to the second extension portion 1122, thereby allowing current to flow between the second extension portion 1122 and the first elastic foot 120.

[0100] The radiated current from the main body 111 can flow to the second extension 1122, and then flow to the first elastic pin 120 through the gold-leaking surface 116 on the second extension 1122, and then return through the first elastic pin 120. The gold-leaking surface 116 can effectively improve the reliability and stability of the electrical connection between the first elastic pin 120 and the first circuit board 110, effectively reducing or preventing the occurrence of false connections or poor contact between the first elastic pin 120 and the first circuit board 110, thereby effectively improving the stability of the current return flow on the first circuit board 110.

[0101] 4 , the circuit board assembly 100 may further include a reinforcement structure 140. The reinforcement structure 140 may be located between the second extension 1122 and the second surface 132 of the bracket 130, and the reinforcement structure 140 may be connected to the second extension 1122 and the second surface 132 of the bracket 130. For example, one surface of the reinforcement structure 140 may be connected to the second surface 132 of the bracket 130, and the other surface may be connected to the second extension 1122.

[0102] During the electrical connection between the first elastic leg 120 and the second extension 1122, the elastic force of the first elastic leg 120 can be sequentially applied to the reinforcement structure 140 and the bracket 130. The reinforcement structure 140 has high rigidity and strength, is not easily deformed, and can provide rigid support for the bracket 130. This effectively reduces or prevents deformation of the bracket 130 and the second extension 1122 under the elastic force of the first elastic leg 120, effectively preventing deformation of the bracket 130 and the second extension 1122 from affecting the electrical connection between the second extension 1122 and the first elastic leg 120, and avoiding poor contact between the second extension 1122 and the first elastic leg 120, which could result in a false connection. This effectively improves the reliability and stability of the electrical connection between the first elastic leg 120 and the second extension 1122, thereby effectively enhancing the stability of current conduction between the first circuit board 110 and the first elastic leg 120 and helping to improve the reliability of current return.

[0103] For example, the reinforcement structure 140 can be a reinforcing steel sheet, which has high strength and rigidity, and can provide better rigid support for the bracket 130, which can effectively reduce or avoid deformation of the bracket 130, and prevent the bracket 130 from deforming and affecting the electrical connection between the first circuit board 110 and the first elastic foot 120, thereby effectively improving the reliability and stability of the electrical connection between the first elastic foot 120 and the first circuit board 110.

[0104] Continuing with FIG. 4 , the circuit board assembly 100 may further include insulating adhesive 180, which may be used to electrically insulate the reinforcement structure 140 and the second extension portion 1122. For example, the insulating adhesive 180 may be located between the reinforcement structure 140 and the second extension portion 1122, with one side of the insulating adhesive 180 bonded to the reinforcement structure 140 and the other side bonded to the second extension portion 1122, thereby connecting the reinforcement structure 140 and the second extension portion 1122 via the insulating adhesive 180.

[0105] The insulating adhesive 180 can effectively reduce or avoid separation between the second extension portion 1122 and the reinforcement structure 140 , and can effectively improve the reliability and firmness of the connection between the second extension portion 1122 and the reinforcement structure 140 , thereby effectively improving the overall structural stability of the circuit board assembly 100 .

[0106] The reinforcement structure 140 and the bracket 130 can also be insulated and connected by an insulating adhesive layer to reduce or avoid separation between the reinforcement structure 140 and the bracket 130, thereby effectively improving the reliability and firmness of the connection between the reinforcement structure 140 and the bracket 130 and enhancing the structural stability of the circuit board assembly 100.

[0107] Continuing with FIG. 4 , in one possible implementation, the other end of the first elastic leg 120 can be used to electrically connect to the middle frame 212 of the electronic device 200 to achieve grounding. For example, the first elastic leg 120 can be located between the first circuit board 110 and the metal middle plate 2121 of the middle frame 212. One end of the first elastic leg 120 can abut against the first circuit board 110 to achieve electrical connection with the first circuit board 110. The other end of the first elastic leg 120 can abut against the metal middle plate 2121 of the electronic device 200 to achieve electrical connection with the metal middle plate 2121.

[0108] The current radiated from the antenna 220 to the first circuit board 110 can flow to the first elastic pin 120 and then flow to the middle frame 212 of the electronic device 200 through the first elastic pin 120, thereby achieving current return.

[0109] Continuing with FIG. 4 , the circuit board assembly 100 may further include a second circuit board 160. The second circuit board 160 may be the mainboard of the electronic device 200. The second circuit board 160 may be located on the middle frame 212. The second circuit board 160 may be electrically connected to the first circuit board 110 to charge the charging coil 190 on the first circuit board 110. For example, the second circuit board 160 may be a printed circuit board. The charging coil 190 on the first circuit board 110 may be electrically connected to the second circuit board 160, so that the second circuit board 160 can supply power to the charging coil 190, thereby enabling the charging coil 190 to charge the stylus 230 in the electronic device 200.

[0110] It should be noted that the section shown in FIG4 shows a portion where the second circuit board 160 is disconnected from the first circuit board 110. In actual use, the second circuit board 160 and the first circuit board 110 may be electrically connected at other locations. For example, a connector may be provided between the first circuit board 110 and the second circuit board 160 to electrically connect the first circuit board 110 and the second circuit board 160.

[0111] FIG6 is a schematic structural diagram of the second circuit board assembly provided in an embodiment of the present application, and FIG7 is a schematic stacking diagram of the second circuit board assembly provided in an embodiment of the present application.

[0112] In another possible implementation, as shown in Figures 6 and 7 , the first elastic pin 120 can be located between the first circuit board 110 and the second circuit board 160, and the other end of the first elastic pin 120 can be electrically connected to the second circuit board 160. The first elastic pin 120 can be grounded through the second circuit board 160, so that the radiation current on the first circuit board 110 can flow back through the first elastic pin 120 and the second circuit board 160 in sequence, thereby preventing the radiation current on the first circuit board 110 from adversely affecting the normal radiation of the antenna 220.

[0113] Among them, the difference between the embodiment shown in Figure 6 and the embodiment shown in Figure 4 is that the first elastic pin 120 in Figure 4 is electrically connected to the metal middle plate 2121 in the middle frame 212 and grounded through the metal middle plate 2121, while the first elastic pin 120 in Figure 6 is electrically connected to the second circuit board 160 and grounded through the second circuit board 160 to achieve current return.

[0114] FIG8 is a schematic structural diagram of the third circuit board assembly provided in an embodiment of the present application, and FIG9 is a schematic stacking diagram of the third circuit board assembly provided in an embodiment of the present application.

[0115] Alternatively, in another possible implementation, as shown in Figures 8 and 9, the second circuit board 160 can also be electrically connected to the middle frame 212 to be grounded through the middle frame 212. For example, the circuit board assembly 100 can also include a second elastic pin 170, one end of which can be electrically connected to the second circuit board 160, and the other end of the second elastic pin 170 can be used to be grounded to the middle frame 212 of the electronic device 200. In this way, the current radiated from the antenna 220 to the first circuit board 110 can flow to the first elastic pin 120, flow to the second circuit board 160 through the first elastic pin 120, and then flow back to the middle frame 212 through the second elastic pin 170. This prevents the radiation current on the first circuit board 110 from adversely affecting the normal radiation of the antenna 220.

[0116] For example, the second elastic foot 170 can be located between the second circuit board 160 and the middle frame 212 of the electronic device 200. The second elastic foot 170 can be an elastic member, and the second elastic foot 170 can be in a compressed state between the second circuit board 160 and the middle frame 212. The second elastic foot 170 in the compressed state has an elastic force, which can drive the second elastic foot 170 to press against the second circuit board 160 and the middle frame 212, so as to fit tightly with the second circuit board 160 and the middle frame 212, thereby establishing an electrical connection with the second circuit board 160 and the middle frame 212.

[0117] This can effectively improve the reliability and stability of the electrical connection between the second elastic pin 170 and the second circuit board 160 and the middle frame 212, and can effectively reduce or avoid poor contact or false connection between the second elastic pin 170 and the second circuit board 160 and the middle frame 212, thereby effectively improving the reliability and stability of the grounding of the second elastic pin 170.

[0118] The embodiment shown in FIG8 differs from the embodiment shown in FIG6 in that the first elastic pin 120 in FIG6 is electrically connected to the second circuit board 160 and grounded through the second circuit board 160 to achieve current return. In contrast, the second circuit board 160 in FIG8 is also electrically connected to the middle frame 212 via the second elastic pin 170 and ultimately grounded through the middle frame 212 to achieve current return.

[0119] FIG10 is a schematic structural diagram of the fourth circuit board assembly provided in an embodiment of the present application, and FIG11 is a schematic stacking diagram of the fourth circuit board assembly provided in an embodiment of the present application.

[0120] In another possible implementation, as shown in Figures 10 and 11, the circuit board assembly 100 may further include a conductive layer 150. One end of the conductive layer 150 may be electrically connected to the first circuit board 110, and the other end may be electrically connected to the first elastic pin 120. At least a portion of the conductive layer 150 may be located within the clearance area A of the antenna 220. For example, the first elastic pin 120 may be electrically connected to the portion of the conductive layer 150 located within the clearance area A of the antenna 220.

[0121] For example, one end of the conductive layer 150 can be located between the first circuit board 110 and the first surface 131 of the bracket 130 and electrically connected to the first circuit board 110. For example, the conductive layer 150 and the first circuit board 110 can be electrically connected by welding. For example, the insulating layer 115 on the first circuit board 110 can be removed to expose the metal layer 114 (i.e., the copper layer) beneath the insulating layer 115. The conductive layer 150 can then be welded to the copper layer to achieve electrical connection with the first circuit board 110, thereby allowing current to flow between the conductive layer 150 and the first circuit board 110.

[0122] The other end of the conductive layer 150 can be folded over onto the second surface 132 of the bracket 130 and connected to the second surface 132 of the bracket 130. For example, the conductive layer 150 can be connected to the first surface 131 and the second surface 132 of the bracket 130 by adhesive bonding. The portion of the conductive layer 150 located on the second surface 132 of the bracket 130 can be electrically connected to the first elastic pin 120. For example, the first elastic pin 120 can be pressed against the surface of the conductive layer 150 facing away from the bracket 130 under the action of elastic force, so that current can be conducted between the first elastic pin 120 and the conductive layer 150.

[0123] The current radiated from the antenna 220 to the first circuit board 110 can flow to the conductive layer 150, then flow through the conductive layer 150 to the first elastic pin 120, and finally return to the ground through the first elastic pin 120. The conductive layer 150 has good conductivity and can effectively increase the ground impedance between the first circuit board 110 and the first elastic pin 120, thereby effectively improving the efficiency of current return on the first circuit board 110.

[0124] In the above-mentioned circuit board assembly 100, the reinforcement structure 140 is omitted, which can reduce the structural layer in the circuit board assembly 100 and effectively reduce the overall thickness of the circuit board assembly 100, which is beneficial to the thinning design of the circuit board assembly 100 and can effectively reduce the space occupied by the circuit board assembly 100 in the electronic device 200, thereby facilitating the lightweight and thin design of the electronic device 200.

[0125] For example, the conductive layer 150 may be a nickel-gold layer, which has excellent electrical conductivity and can effectively increase the ground impedance between the conductive layer 150 and the first spring pin 120, thereby effectively improving the efficiency of current return on the first circuit board 110. Furthermore, the nickel-gold layer has excellent oxidation resistance and can effectively reduce or prevent oxidation of the conductive layer 150, thereby helping to improve the stability and reliability of the conductive layer 150.

[0126] The embodiment shown in FIG10 differs from the embodiment shown in FIG8 in that: in FIG8 , the first circuit board 110 is extended and folded onto the second surface 132 of the bracket 130 to form an extension 112, and then the electrical connection is achieved through the abutment between the extension 112 and the first elastic foot 120. In contrast, in the circuit board assembly 100 shown in FIG10 , a conductive layer 150 is provided on the first surface 131 and the second surface 132 of the bracket 130, and then the first circuit board 110 and the first elastic foot 120 are electrically connected to the conductive layer 150, thereby achieving electrical connection between the first circuit board 110 and the first elastic foot 120.

[0127] Continuing to refer to Figures 10 and 11, in one possible implementation, the conductive layer 150 may include a first conductive layer 151 and a second conductive layer 152, the first conductive layer 151 may be electrically connected to the second conductive layer 152, the first conductive layer 151 may be located between the first surface 131 of the bracket 130 and the portion of the first circuit board 110 located in the clearance area A, and electrically connected to the first circuit board 110.

[0128] For example, the first conductive layer 151 can be electrically connected to the portion of the first circuit board 110 located in the clearance area A. For example, the first conductive layer 151 and the portion of the first circuit board 110 located in the clearance area A can be electrically connected by welding.

[0129] The second conductive layer 152 can be located between the second surface 132 of the bracket 130 and the first elastic foot 120, and be electrically connected to the first elastic foot 120. For example, one side of the second conductive layer 152 can be bonded to the second surface 132 of the bracket 130, and the first elastic foot 120 can abut and be pressed against the other side of the second conductive layer 152 to be electrically connected to the second conductive layer 152.

[0130] It should be noted that the first conductive layer 151 and the second conductive layer 152 are disconnected in the cross-section of Figure 10. In actual application, the conductive layer 150 can be an integrated structure, and a part of the conductive layer 150 can be located on the first surface 131 of the bracket 130 and form the first conductive layer 151. The other part of the conductive layer 150 can pass through the side of the bracket 130 and fold to the second surface 132 of the bracket 130 to form the second conductive layer 152.

[0131] Alternatively, the conductive layer 150 can also be a gold-plated layer. For example, the conductive layer 150 can be plated on the first surface 131, the side surface and the second surface 132 of the bracket 130 by electroplating or the like, and the gold-plated layers on the first surface 131, the side surface and the second surface 132 of the bracket 130 are connected to each other so that the gold-plated layers on the first surface 131 and the second surface 132 of the bracket 130 can be conductive to achieve current conduction.

[0132] When the conductive layer 150 is a gold-plated layer, the gold-plated layer is plated on the surface of the bracket 130 and hardly increases the thickness of the bracket 130. This can make the circuit board assembly 100 thinner as a whole, and can effectively improve the thinning design of the circuit board assembly 100.

[0133] In this way, the current radiated from antenna 220 to first circuit board 110 can first flow to first conductive layer 151, then flow through first conductive layer 151 to second conductive layer 152, then flow through second conductive layer 152 to first elastic pin 120, and finally return to ground through first elastic pin 120. First conductive layer 151 and second conductive layer 152 have good conductivity and low impedance, which can reduce the connection impedance between first circuit board 110 and first elastic pin 120, helping to reduce the ground impedance of circuit board assembly 100, thereby improving the efficiency of ground return of circuit board assembly 100.

[0134] Continuing with reference to FIG. 10 and FIG. 11 , in this embodiment, the first elastic pin 120 can be grounded by being electrically connected to the middle frame 212 of the electronic device 200 as shown in FIG. 10 , so as to be grounded through the middle frame 212 of the electronic device 200. In this case, the current radiated from the antenna 220 to the first circuit board 110 flows to the first elastic pin 120 and can then flow to the middle frame 212 of the electronic device 200 through the first elastic pin 120, thereby achieving current return. Alternatively, the first elastic pin 120 can also be grounded by being electrically connected to the second circuit board 160 as shown in FIG. 6 , and then grounded through the second circuit board 160.

[0135] Figure 12 is a structural schematic diagram of the fifth circuit board assembly provided in an embodiment of the present application, and Figure 13 is a stacking schematic diagram of the fifth circuit board assembly provided in an embodiment of the present application.

[0136] Alternatively, referring to Figures 12 and 13, the first elastic pin 120 in this embodiment can also be electrically connected to the second circuit board 160 as shown in Figure 12, and the second circuit board 160 can be electrically connected to the middle frame 212 of the electronic device 200 to be grounded through the middle frame 212. In this case, the current radiated from the antenna 220 to the first circuit board 110 flows to the first elastic pin 120, then flows through the first elastic pin 120 to the second circuit board 160, and then flows through the second circuit board 160 to the middle frame 212 of the electronic device 200, thereby achieving current return.

[0137] For example, as shown in FIG12 , the second circuit board 160 can be electrically connected to the middle frame 212 of the electronic device 200 via the second spring pins 170, so that the second circuit board 160 and the middle frame 212 can be tightly connected. This can effectively improve the reliability and stability of the electrical connection between the second circuit board 160 and the middle frame 212, effectively reduce or avoid poor connection or loose connection between the second circuit board 160 and the middle frame 212, and thus effectively improve the reliability of current return in the first circuit board 110.

[0138] The embodiment shown in FIG12 differs from the embodiment shown in FIG10 in that the grounding method of the first elastic pin 120 is different. The first elastic pin 120 in FIG10 is electrically connected to the middle frame 212 for grounding. The first elastic pin 120 in FIG12 is electrically connected to the second circuit board 160, which is in turn electrically connected to the middle frame 212 for grounding.

[0139] FIG14 is a schematic structural diagram of a sixth circuit board assembly provided in an embodiment of the present application.

[0140] In another possible implementation, as shown in FIG14 , the conductive layer 150 can be located on the second surface 132 of the bracket 130 and between the second surface 132 of the bracket 130 and the first elastic leg 120. One side of the conductive layer 150 can be connected to the second surface 132 of the bracket 130. For example, the conductive layer 150 and the second surface 132 of the bracket 130 can be connected by bonding. The side of the conductive layer 150 facing away from the second surface 132 of the bracket 130 can be electrically connected to the first elastic leg 120 to be grounded through the first elastic leg 120. For example, the first elastic leg 120 can abut against the side of the conductive layer 150 facing away from the second surface 132 of the bracket 130 and be electrically connected to the conductive layer 150.

[0141] Among them, one end of the conductive layer 150 can be electrically connected to the first circuit board 110, so that the current radiated from the antenna 220 to the first circuit board 110 can first flow to one end of the conductive layer 150, then flow through the conductive layer 150 to the first elastic pin 120, and finally be grounded and returned through the first elastic pin 120.

[0142] For example, as shown in FIG14 , one end of the first circuit board 110 located within the clearance area A of the antenna 220 may have a bent portion 113. The bent portion 113 may extend from the first surface 131 of the bracket 130 toward the second surface 132 of the bracket 130. One end of the conductive layer 150 may be electrically connected to the first circuit board 110 via the bent portion 113. For example, the bent portion 113 may be located on a side surface of the bracket 130 to electrically connect the conductive layer 150 to the bent portion 113. Alternatively, the conductive layer 150 may extend to the side surface of the bracket 130 to electrically connect to the bent portion 113.

[0143] For example, one end of the conductive layer 150 can be connected to the bending portion 113 by welding. For example, the insulating layer 115 on the bending portion 113 can be removed to expose the copper layer under the insulating layer 115. One end of the conductive layer 150 can be welded to the copper layer to achieve electrical connection with the bending portion 113.

[0144] In this way, the current radiated from the antenna 220 to the first circuit board 110 can first flow to the bent portion 113 of the first circuit board 110, then flow to the conductive layer 150 through the bent portion 113 of the first circuit board 110, then flow to the first elastic pin 120 through the conductive layer 150, and finally be grounded and returned through the first elastic pin 120.

[0145] Among them, the difference between the embodiment shown in Figure 14 and the embodiment shown in Figure 10 is that the conductive layer 150 is arranged on the bracket 130 in a different way. The conductive layer 150 in Figure 10 is arranged on both the first surface 131 and the second surface 132 of the bracket 130, while the conductive layer 150 in Figure 14 is only arranged on the second surface 132 of the bracket 130.

[0146] In this embodiment, referring to FIG14 , the first elastic foot 120 can be electrically connected to the middle frame 212 of the electronic device 200 as shown in FIG14 , so as to be grounded through the middle frame 212 of the electronic device 200. At this time, the current radiated from the antenna 220 to the first circuit board 110 can flow to the bending portion 113 and the conductive layer 150 in sequence, and then flow to the first elastic foot 120. The current flowing to the first elastic foot 120 can reach the middle frame 212 of the electronic device 200 to realize the return of current.

[0147] FIG15 is a schematic structural diagram of the seventh circuit board assembly provided in an embodiment of the present application.

[0148] Alternatively, as shown in FIG15 , the first elastic pin 120 in this embodiment can also be electrically connected to the second circuit board 160 as shown in FIG15 , and then grounded through the second circuit board 160. For example, the second circuit board 160 can be electrically connected to the middle frame 212 of the electronic device 200 to be grounded through the middle frame 212. In this case, the current radiated from the antenna 220 to the first circuit board 110 flows to the first elastic pin 120, and can then flow through the first elastic pin 120 to the second circuit board 160, and then through the second circuit board 160 to the middle frame 212 of the electronic device 200, thereby achieving current return.

[0149] For example, as shown in FIG15 , the second circuit board 160 can be electrically connected to the middle frame 212 of the electronic device 200 via the second spring pins 170, so that the second circuit board 160 and the middle frame 212 can be tightly connected. This can effectively improve the reliability and stability of the electrical connection between the second circuit board 160 and the middle frame 212, effectively reduce or avoid poor connection or loose connection between the second circuit board 160 and the middle frame 212, and thus effectively improve the reliability of current return in the first circuit board 110.

[0150] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances. The terms "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0151] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that: include: a first circuit board, configured to be disposed in an electronic device, wherein a portion of the first circuit board is located within a clearance area of ​​an antenna of the electronic device; A first elastic foot is located in the clearance area, one end of the first elastic foot is electrically connected to the portion of the first circuit board located in the clearance area, and the other end of the first elastic foot is used for grounding.

2. The circuit board assembly according to claim 1, wherein: Also included is a bracket comprising opposing first and second sides; At least a portion of the first circuit board is located on the first surface of the bracket, and the second surface faces the first elastic foot; The first circuit board is insulated and connected to the bracket.

3. The circuit board assembly according to claim 2, wherein: The first circuit board includes a main body portion and an extension portion; The main body is located on the first surface and is insulated and connected to the first surface, and one end of the main body is located in the clearance area; One end of the extension portion is connected to the end of the main body portion located in the clearance area, and the other end of the extension portion extends toward the second surface of the bracket; One end of the first elastic foot is electrically connected to the extending portion.

4. The circuit board assembly according to claim 3, wherein: The extension portion includes a first extension portion and a second extension portion connected to each other; One end of the first extension portion is connected to the main body portion, and the first extension portion extends from the first surface of the bracket toward the second surface; The second extension portion is located on the second surface of the bracket and is insulated and connected to the second surface; The first elastic foot is electrically connected to the second extending portion.

5. The circuit board assembly according to claim 4, wherein: A surface of the second extension portion facing the first elastic foot has a gold-leaking surface, and the first elastic foot is electrically connected to the gold-leaking surface.

6. The circuit board assembly according to claim 4 or 5, characterized in that: It also includes a reinforcement structure, which is located between the second extension portion and the second surface of the bracket and is connected to the second extension portion and the second surface of the bracket.

7. The circuit board assembly according to claim 6, wherein: It also includes insulating glue, and the reinforcing structure and the second extension part are insulated and connected by the insulating glue.

8. The circuit board assembly according to claim 2, wherein: It also includes a conductive layer, one end of which is electrically connected to the first circuit board; The other end of the conductive layer is electrically connected to the first elastic pin; The conductive layer is at least partially configured to be located within the clearance area.

9. The circuit board assembly according to claim 8, wherein: The conductive layer includes a first conductive layer and a second conductive layer, and the first conductive layer is electrically connected to the second conductive layer; The first conductive layer is located between the first surface of the bracket and the portion of the first circuit board located in the clearance area, and is electrically connected to the first circuit board; The second conductive layer is located between the second surface of the bracket and the first elastic foot, and is electrically connected to the first elastic foot.

10. The circuit board assembly according to claim 8, wherein: The conductive layer is located on the second surface of the bracket and between the second surface of the bracket and the first elastic foot; The conductive layer is electrically connected to the first elastic pin.

11. The circuit board assembly according to claim 10, wherein: One end of the first circuit board located in the clearance area has a bent portion; The bending portion extends from the first surface of the bracket toward the second surface of the bracket, and one end of the conductive layer is electrically connected to the first circuit board through the bending portion.

12. The circuit board assembly according to any one of claims 8 to 11, characterized in that: The conductive layer is a nickel-gold layer.

13. The circuit board assembly according to any one of claims 2 to 12, characterized in that: The bracket is a plastic bracket.

14. The circuit board assembly according to any one of claims 1 to 13, characterized in that: It also includes a second circuit board, the first elastic pin is located between the first circuit board and the second circuit board, and the other end of the first elastic pin is electrically connected to the second circuit board, and the first elastic pin is grounded through the second circuit board.

15. The circuit board assembly according to claim 14, wherein: It also includes a second elastic pin, one end of which is electrically connected to the second circuit board, and the other end of which is used to be grounded to the middle frame of the electronic device.

16. The circuit board assembly according to any one of claims 1 to 13, characterized in that: The other end of the first elastic foot is used to be electrically connected to the middle frame of the electronic device to achieve grounding.

17. The circuit board assembly according to any one of claims 1 to 16, characterized in that: The first circuit board is a flexible circuit board.

18. The circuit board assembly according to any one of claims 1 to 17, characterized in that: A charging coil is also included. The charging coil is located on the first circuit board, and at least a portion of the charging coil is configured to be located within the clearance area.

19. The circuit board assembly according to claim 14 or 15, characterized in that: The second circuit board is a printed circuit board.

20. An electronic device, characterized in that: include; case; An antenna, the antenna comprising a radiator, the radiator having a clearance area; The circuit board assembly described in any one of claims 1 to 19 is located in the housing, and the portion of the first circuit board and the first elastic foot in the circuit board assembly are located in the clearance area.

21. The electronic device according to claim 20, characterized in that The housing has a metal frame, and at least a portion of the metal frame forms the radiator; One end of the first circuit board located in the clearance area is arranged close to the metal frame.

22. The electronic device according to claim 21, wherein: The housing includes a battery cover and a middle frame; The battery cover is disposed on the middle frame, and the battery cover and the middle frame together enclose a receiving space, and the circuit board assembly is located in the receiving space; The middle frame has the metal frame.

23. The electronic device according to claim 22, wherein: The middle frame includes the metal frame and the metal middle plate, the metal frame is insulated from the metal middle plate, and the first elastic foot is electrically connected to the metal middle plate; Alternatively, the first elastic pin is electrically connected to the second circuit board in the circuit board assembly.

24. The electronic device according to any one of claims 20 to 23, characterized in that: The antenna is a high-power antenna with a power greater than or equal to 25dB.

25. The electronic device according to any one of claims 20 to 24, characterized in that: The antenna is a satellite communication antenna.

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