Circuit board assembly, electronic device, and manufacturing method for circuit board assembly

Abstract

The present application relates to the technical field of electronic devices. Provided are a circuit board assembly, an electronic device, and a manufacturing method for a circuit board assembly, which aim at solving the problem of how to improve the heat dissipation reliability of electronic elements. The circuit board assembly comprises a first circuit board, a first cover, a first electronic element and a sealing bag. The first circuit board has a first surface. The first cover is fixed to the first surface, and encloses a first accommodating cavity with the first surface. The first electronic element is arranged on the first surface and located in the first accommodating cavity. The sealing bag is configured to hold a filling material. The sealing bag comprises a sealing bag main body and a feeding cylinder which have internal spaces in communication with each other, the sealing bag main body is arranged in the first accommodating cavity, and the sealing bag main body is flexible. The first cover or the first circuit board has a first opening, and the end of the feeding cylinder away from the sealing bag main body is exposed out of the first accommodating cavity via the first opening. The circuit board assembly provided by the present application can improve the heat dissipation reliability of electronic elements.

Description

Circuit board assembly, electronic device, and method for manufacturing circuit board assembly

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on February 19, 2024, with application number 202410183366.0 and invention name “Circuit board assembly, electronic device and method for manufacturing circuit board assembly”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to a circuit board assembly, an electronic device, and a method for manufacturing the circuit board assembly. Background Art

[0003] With the advancement of technology, electronic devices have more and more functions, and more and more electronic components are arranged inside electronic devices. The heating problem of electronic devices has become more and more prominent.

[0004] In related technologies, thermally conductive adhesive is applied to the surface of electronic components to conduct heat generated by the components to the electronic device's heat sink for dissipation. Because some structural components surrounding the electronic components (such as shielding covers and frame plates) must be fixedly connected by welding, the high temperature of welding can cause the thermally conductive adhesive to lose contact with the electronic components, resulting in poor heat dissipation reliability of the electronic components. Summary of the Invention

[0005] Embodiments of the present application provide a circuit board assembly, an electronic device, and a method for manufacturing the circuit board assembly, which are used to solve the problem of how to improve the heat dissipation reliability of electronic components.

[0006] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, an embodiment of the present application provides a circuit board assembly, which includes a first circuit board, a first cover, a first electronic component, and a sealing bag. The first circuit board has a first surface. The first cover is fixed to the first surface and forms a first accommodating cavity with the first surface. The first electronic component is arranged on the first surface and is located in the first accommodating cavity. The sealing bag is used to accommodate filling material; the sealing bag includes a sealing bag main body and a feeding barrel connected to the internal space, the sealing bag main body is arranged in the first accommodating cavity, and the sealing bag main body is flexible. The first cover or the first circuit board has a first opening, and the end of the feeding barrel away from the sealing bag main body is exposed to the outside of the first accommodating cavity by the first opening.

[0008] The circuit board assembly provided in the embodiment of the present application is configured such that a first electronic component is disposed on the first surface of the first circuit board and is located within a first accommodating cavity enclosed by a first cover body and the first surface, and a sealing bag body is disposed within the first accommodating cavity. The sealing bag body is flexible, so that the sealing bag can accommodate a filling material. After accommodating the filling material, a heat-conducting component composed of the sealing bag and the filling material can be in contact with all outer surfaces of the first electronic component that do not face the first surface, so that a heat exchange area between the heat-conducting component and the first electronic component and the first surface can be as large as possible, thereby improving the heat dissipation efficiency of the first electronic component.

[0009] Furthermore, by allowing one end of the feed barrel, which communicates with the main body of the sealing bag, to be exposed outside the first accommodating cavity through a first opening formed in the first housing or the first circuit board, during assembly of the circuit board assembly, the first housing can be first soldered to the first circuit board, and then the filler material can be introduced into the sealing bag from outside the circuit board assembly through the feed barrel. This prevents the high temperatures generated when soldering the first housing to the first circuit board from causing the heat-conducting component to lose contact with the first electronic component, thereby ensuring reliable heat dissipation for the first electronic component.

[0010] The sealing bag also seals the filling material, preventing it from flowing into gaps within the first electronic component and potentially damaging it or causing short circuits between multiple first electronic components or between the first electronic component and the first housing. It also prevents the filling material from leaking outside the first housing cavity and potentially damaging other components. Furthermore, during maintenance, the heat-conducting component can be removed as a whole, eliminating the need for separate cleaning. This improves maintenance convenience and shortens the maintenance cycle.

[0011] Finally, the heat-conducting component can also provide support for the first electronic component to reduce the risk of the first electronic component falling off the first circuit board when the circuit board assembly is impacted.

[0012] In some possible implementations of the first aspect, the circuit board assembly further includes a filling material. The filling material is filled in the inner cavity of the sealing bag, and the filling material has fluidity such that the sealing bag body covers the outside of the first electronic component and the area on the first surface not covered by the first electronic component. The filling material is a thermally conductive material or a heat storage material.

[0013] In this way, when the filling material is a heat storage material, the filling material can absorb heat from the first electronic component and delay the time it takes for the heat to be transferred to the first housing and the housing of the electronic device to which the circuit board assembly is applied. This can not only dissipate heat for the first electronic component but also smooth out heat peaks and valleys. When the filling material is a thermally conductive material, the filling material can quickly transfer the heat generated by the first electronic component to the first housing and, through the thermally conductive structure, to the housing of the electronic device for heat dissipation.

[0014] In some possible implementations of the first aspect, at least a portion of the sealing bag body is elastic. Thus, in a natural state (i.e., when the sealing bag body is not elastically deformed), the volume of the inner cavity of the sealing bag body can be smaller than that of the first accommodating cavity. This reduces the volume of the sealing bag body, allows the sealing bag to accommodate first accommodating cavities of varying sizes, and reduces the difficulty of designing, processing, storing, and assembling the sealing bag.

[0015] In some possible implementations of the first aspect, the first cover includes a first frame and a first cover plate, the first cover plate being disposed opposite the first surface, the first frame being connected between the first cover plate and the first surface, and the first opening being defined in the first cover plate. The sealed bag body includes a main body portion and a raised portion that are interconnected, the main body portion being located within the first accommodating cavity, the raised portion being located within the first opening, and the feed barrel being connected to the raised portion. This minimizes thickness restrictions on the first electronic component corresponding to the raised portion, facilitating placement of the first electronic component.

[0016] In some possible implementations of the first aspect, the circuit board assembly further includes a second cover. The second cover is disposed at the first opening and blocks the first opening. The second cover is a metal structural member. The thickness of the second cover is less than that of the first cover. This shortens the heat conduction path between the heat-conducting component and the electronic device housing, thereby ensuring efficient heat dissipation from the first electronic component.

[0017] In some possible implementations of the first aspect, the circuit board assembly further includes a second cover. The second cover is disposed at the first opening and blocks the first opening. The second cover is a metal structural member. The thermal conductivity of the second cover is greater than that of the first cover. This reduces the thermal resistance between the heat-conducting component and the electronic device housing, thereby improving the heat dissipation efficiency of the first electronic component.

[0018] In some possible implementations of the first aspect, the circuit board assembly further includes a second cover plate. The second cover plate is disposed at the first opening and blocks the first opening, and the second cover plate is a metal structural member. The second cover plate has a thickness less than that of the first cover plate, and a thermal conductivity greater than that of the first cover plate.

[0019] In some possible implementations of the first aspect, the sealing bag further includes a metal layer structure, which is laminated and bonded to the outer surface of the raised portion. A portion of the raised portion protrudes from the surface of the first cover plate facing away from the first surface, and an outer side surface of the metal layer structure has a clearance between the inner sidewall of the first opening. In this manner, the raised portion and the metal layer structure can deform under external pressure, allowing the outer side surface of the metal layer structure to conform to the inner sidewall of the first opening, thereby forming a complete metal shielding structure with the metal first cover body to prevent interference between electronic components inside and outside the first accommodating cavity.

[0020] In some possible implementations of the first aspect, the sealing bag further includes a metal layer structure, the metal layer structure being laminated and bonded to the outer surface of the raised portion. The outer side surface of the metal layer structure is in contact with the inner sidewall of the first opening. In this way, the metal layer structure and the metal first cover form a complete metal shielding structure to prevent mutual interference between electronic components inside and outside the first accommodating cavity.

[0021] In some possible implementations of the first aspect, the first housing is a metal structure. This prevents the circuit inside the first housing from radiating electromagnetic waves outward and prevents electromagnetic waves outside the first housing from entering the first housing, thereby preventing electromagnetic interference between the first electronic component inside the first housing and the electronic component outside the first housing.

[0022] In some possible implementations of the first aspect, the first housing includes a second circuit board and a first frame. The second circuit board is disposed opposite the first surface. The first frame is connected between the first surface and the second circuit board, and the first frame is electrically connected to both the first and second circuit boards. This allows electronic components to be arranged simultaneously on the first and second circuit boards, enabling more electronic components to be arranged in a limited area, reducing the area occupied by the circuit board assembly, and thereby miniaturizing the electronic device as a whole.

[0023] In some possible implementations of the first aspect, the first frame includes a third circuit board, which is stacked between the first and second circuit boards. The third circuit board has a first through hole, and the wall of the first through hole forms part of the inner wall of the first accommodating cavity. In this way, the third circuit board provides structural and electrical connections between the first and second circuit boards, thereby further strengthening the structure of the circuit board assembly. Furthermore, circuits can be arranged on the third circuit board, thereby providing the circuit board assembly with more functionality.

[0024] In some possible implementations of the first aspect, the first frame includes a plurality of soldering structures, which are arranged at intervals around the first electronic component; the soldering structures include a first soldering pad, a second soldering pad, and a soldering material layer. The first soldering pad is disposed on the first circuit board. The second soldering pad is disposed on the second circuit board. The soldering material layer is disposed between the first soldering pad and the second soldering pad. In this way, in the first frame formed by the plurality of soldering structures, a gap is provided between two adjacent soldering structures, enabling heat generated by the first electronic component to be directly transferred from the heat-conducting component to the space outside the circuit board assembly, thereby improving the heat dissipation efficiency of the first electronic component.

[0025] In some possible implementations of the first aspect, the sealing bag body includes a first film layer and a second film layer laminated and joined from the outside to the inside. The first film layer is made of a non-conductive material, and the second film layer includes a polymer matrix and a thermally conductive filler. This maximizes the thermal conductivity of the sealing bag body while ensuring the strength of the sealing bag body and insulation of the outer surface, thereby effectively dissipating heat from the first electronic component.

[0026] In some possible implementations of the first aspect, the thermally conductive filler includes at least one of a metal material, a ceramic material, and a carbon-based material.

[0027] In some possible implementations of the first aspect, the sealing bag further includes an exhaust tube, which communicates with the interior space of the sealing bag body; an end of the exhaust tube, distal from the sealing bag body, is exposed to the outside of the first receiving cavity through the first opening. In this manner, when filling material is added to the sealing bag, air within the sealing bag can be discharged through the exhaust tube to the exterior of the circuit board assembly, thereby improving the overall thermal conductivity of the heat-conducting component and ensuring effective heat dissipation for the first electronic component.

[0028] In some possible implementations of the first aspect, the sealed bag further includes an exhaust pipe that communicates with the interior space of the sealed bag body. The first housing or the first circuit board has a second opening spaced apart from the first opening, and an end of the exhaust pipe, distal from the sealed bag body, is exposed to the outside of the first accommodating cavity through the second opening. This allows the first opening and the second opening to be spaced farther apart, facilitating exhaust of air from the sealed bag. Furthermore, the first opening and the second opening can both be relatively small. If the first housing is a metal structure, there is no need to provide metal shielding films at the first opening and the second opening to prevent interference between electronic components inside and outside the first accommodating cavity.

[0029] In some possible implementations of the first aspect, the sealed bag further includes at least one partition layer. The at least one partition layer is disposed on the inner wall of the sealed bag body to divide the inner cavity of the sealed bag into multiple sub-cavities. Each of the multiple sub-cavities is connected to the feed cylinder and the exhaust cylinder. This allows for more even distribution of the filling material within the sealed bag. When the circuit board assembly 30 is impacted, the filling material shakes less, thereby reducing the vibration felt by the user.

[0030] In some possible implementations of the first aspect, the sealing bag body includes a first bag wall and a second bag wall that are arranged opposite to each other. The partition layer includes a first partition layer and a second partition layer, and the first partition layer and the second partition layer are arranged alternately along a first direction, the first partition layer extends from the first bag wall to the direction close to the second bag wall, and the second partition layer extends from the second bag wall to the direction close to the first bag wall. The feed barrel and the exhaust barrel are respectively connected to the two ends of the sealing bag body along the first direction; the first direction is parallel to the first surface and intersects with the arrangement direction of the first bag wall and the second bag wall. In this way, when the filling material is filled into the inner cavity of the sealing bag, the filling material can flow and disperse along a serpentine path inside the sealing bag body, so that the filling material can be distributed more evenly inside the sealing bag body, and the air in the sealing bag can be removed as much as possible, thereby ensuring the overall reliability of the circuit board assembly.

[0031] In some possible implementations of the first aspect, the thermal conductivity of the separator layer is lower than that of the filler material. In this way, when there are multiple first electronic components and the operating powers of the different first electronic components vary significantly, the separator layer can prevent heat generated by the high-power first electronic component from being transferred to the low-power first electronic component via the heat-conducting component, thereby reducing the reliability of the first electronic component.

[0032] In some possible implementations of the first aspect, the circuit board assembly further includes a first heat conducting member. The first heat conducting member is disposed within the sealing bag body and in contact with the first housing. The first heat conducting member has a thermal conductivity greater than that of the filler material. This reduces the thermal resistance between the sealing bag body and the first housing, improves the efficiency of heat conduction between the heat conducting member and the first housing, and thereby improves the efficiency of heat dissipation from the first electronic component.

[0033] In some possible implementations of the first aspect, the first heat-conducting member extends along a serpentine path. Thus, when the sealing bag body is stretched and expanded by the filling material, the first heat-conducting member can also stretch accordingly, preventing the sealing bag body from being unable to adapt to the volume and shape of the first receiving cavity due to the first heat-conducting member being unable to deform.

[0034] In some possible implementations of the first aspect, the heat storage material (filling material) includes aerogel or cooling liquid.

[0035] In some possible implementations of the first aspect, the thermally conductive material includes a polymer matrix and a thermally conductive filler; and / or liquid metal.

[0036] In a second aspect, embodiments of the present application provide an electronic device comprising a housing, a circuit board assembly, and a thermally conductive structure. The housing includes a first wall panel. The circuit board assembly is a circuit board assembly according to any of the above implementations, wherein the first wall panel and the first circuit board are stacked and located on a side of the first housing facing away from the first surface. The thermally conductive structure is disposed between the first housing and the first wall panel and is thermally conductively connected to both the first housing and the first wall panel.

[0037] Since the electronic device provided in the embodiment of the present application includes a circuit board assembly of any of the above implementation methods, the two can solve the same problem and achieve the same effect, and will not be repeated here.

[0038] In a third aspect, an embodiment of the present application provides a method for manufacturing a circuit board assembly, the method comprising:

[0039] Providing a first circuit board, the first circuit board having a first surface, and a first electronic component is disposed on the first surface;

[0040] The sealing bag and the first cover are arranged on the side facing the first surface, and the first cover is fixed to the first surface so that the first cover and the first surface enclose a first accommodating cavity, and the first electronic component and the sealing bag body of the sealing bag are located in the first accommodating cavity, and the end of the sealing bag feeding barrel away from the sealing bag body is exposed to the outside of the first accommodating cavity through a first opening provided in the first circuit board or the first cover; wherein the sealing bag body is flexible, and the internal space of the sealing bag body is connected to the internal space of the feeding barrel;

[0041] Filling the inner cavity of the sealing bag with a filling material through the feeding cylinder so that the sealing bag body covers the outside of the first electronic component and the area on the first surface not covered by the first electronic component;

[0042] Close the opening of the feed barrel.

[0043] Since the method for manufacturing a circuit board assembly provided in the embodiment of the present application is used to manufacture a circuit board assembly formed in any of the above implementation methods, the two can solve the same problem and achieve the same effect, and will not be repeated here.

[0044] In some possible implementations of the third aspect, the sealing bag and the first cover body are arranged on the side facing the first surface, and the first cover body is fixed to the first surface, including: setting the sealing bag on the side facing the first surface; welding the first cover body to the first surface.

[0045] In some possible implementations of the third aspect, the sealing bag and the first cover body are arranged on the side facing the first surface, and the first cover body is fixed to the first surface, including: fixing the sealing bag body to the inner cavity of the first cover body; and welding the first cover body to the first surface.

[0046] In some possible implementations of the third aspect, the sealing bag and the first cover body are arranged on the side facing the first surface, and the first cover body is fixed to the first surface, including: placing the first cover body on the first surface to enclose a first accommodating cavity with the first surface; placing the sealing bag body into the first accommodating cavity through the first opening of the first cover body; and welding the first cover body to the first surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] FIG1 is a perspective view of an electronic device provided in some embodiments of the present application;

[0048] FIG2 is a schematic diagram of the exploded structure of the electronic device shown in FIG1 ;

[0049] FIG3 is a schematic structural diagram of a circuit board assembly of the electronic device shown in FIG2 ;

[0050] FIG4 is a cross-sectional structural diagram of the electronic device shown in FIG1 taken along line AA;

[0051] FIG5 is a schematic structural diagram of a circuit board assembly of the electronic device shown in FIG4 ;

[0052] FIG6 is a top view of a portion of the circuit board assembly shown in FIG5 when viewed from the shielding cover toward the first circuit board;

[0053] FIG7 is a schematic diagram of a process of filling the filling material into the circuit board assembly shown in FIG5 ;

[0054] FIG8 is another schematic structural diagram of the circuit board assembly of the electronic device shown in FIG4 ;

[0055] FIG9 is another structural schematic diagram of the circuit board assembly of the electronic device shown in FIG4 ;

[0056] FIG10 is a top view of a portion of the circuit board assembly shown in FIG9 when viewed from the first cover toward the first circuit board;

[0057] FIG11 is another structural schematic diagram of the circuit board assembly of the electronic device shown in FIG4 ;

[0058] FIG12 is a schematic structural diagram of the sealing bag body of the electronic device shown in FIG4 ;

[0059] FIG13 is a schematic diagram of another structure of the circuit board assembly of the electronic device shown in FIG4;

[0060] FIG14 is a top view of a portion of the circuit board assembly shown in FIG13 when viewed from the shielding cover toward the first circuit board;

[0061] FIG15 is a top view of another partial structure of the circuit board assembly of the electronic device shown in FIG4 when viewed from the shielding cover toward the first circuit board;

[0062] FIG16 is a top view of another partial structure of the circuit board assembly of the electronic device shown in FIG4 when viewed from the shielding cover toward the first circuit board;

[0063] FIG17 is another schematic cross-sectional view of the circuit board assembly of the electronic device shown in FIG2 ;

[0064] FIG18 is a schematic diagram of another cross-sectional structure of the circuit board assembly of the electronic device shown in FIG2 ;

[0065] FIG19 is a schematic diagram of a portion of the structure of the circuit board assembly shown in FIG18 as viewed from direction B;

[0066] FIG20 is a schematic diagram of a partial structure of a sealing bag of the circuit board assembly shown in FIG19;

[0067] FIG21 is a schematic diagram of the assembled structure of the circuit board assembly and the heat conducting structure shown in FIG18;

[0068] FIG22 is a schematic diagram of another cross-sectional structure of the electronic device shown in FIG1 taken along line AA;

[0069] FIG23 is a schematic structural diagram of a circuit board assembly of the electronic device shown in FIG22 ;

[0070] FIG24 is a schematic diagram of another cross-sectional structure of the electronic device shown in FIG1 taken along line AA;

[0071] FIG25 is a schematic diagram of a partial structure of a circuit board assembly of the electronic device shown in FIG24 ;

[0072] FIG26 is a schematic diagram of another cross-sectional structure of the electronic device shown in FIG1 taken along line AA;

[0073] FIG27 is a schematic diagram of a partial structure of a circuit board assembly of the electronic device shown in FIG26 ;

[0074] FIG28 is a structural diagram of a manufacturing process of the circuit board assembly shown in FIG5 ;

[0075] FIG29 is a structural schematic diagram of the disassembly process of the circuit board assembly shown in FIG28;

[0076] FIG30 is a structural diagram of another manufacturing process of the circuit board assembly shown in FIG5;

[0077] FIG31 is a structural diagram of the manufacturing process of the circuit board assembly shown in FIG25;

[0078] FIG32 is a structural schematic diagram of the manufacturing process of the circuit board assembly provided in some other embodiments of the present application.

[0079] Reference numerals: 100 - electronic device; 10 - display screen; 20 - housing; 21 - back cover; 22 - middle frame; 221 - frame; 222 - middle plate; 30-circuit board assembly; 301-lower circuit board; 302-middle circuit board; 303-upper circuit board; 304-heating device; 305-lower shielding cover; 306-upper shielding cover; 30a-first accommodating chamber; 30b-second accommodating chamber; 30c-third accommodating chamber; 31-first circuit board; 31a-first surface; 31b-second surface; 32-electronic component; 321-first electronic component; 322-second electronic component; 323-third electronic component; 324-fourth electronic component; 33-first shielding cover; 33a-first opening; 33b-second opening; 331-shielding frame; 332-shielding cover; 34-heat conducting component; 341-sealing bag; 341a-sub-accommodating chamber; 3411-sealing bag body; 341 11-first film layer; 34112-second film layer; 34113-first bag wall; 34114-second bag wall; 34115-main body; 34115a-communication port; 34116-raised portion; 3412-feeding barrel; 3413-exhaust barrel; 3414-separation layer; 34141-first separation layer; 34142-second separation layer; 3415-metal layer structure; 342-filling material; 343-first heat-conducting member; 35-second cover plate; 36-second shielding cover; 37-third cover plate; 38-second circuit board; 38a-third surface; 38b-fourth surface; 39-third circuit board; 39a-first through hole; 41-welding structure; 411-first soldering pad; 412-second soldering pad; 413-welding material layer; 50-heat-conducting structure; 200-production system; 210-filling equipment; 2101-silo; 2102-nozzle; 2103-piston; 220-sealing equipment; 2201-laser; 230-molding equipment; 2301-pressing head; 240-transmission equipment; 2401-conveyor belt; 2402-rotating shaft; DETAILED DESCRIPTION

[0080] In the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0081] In the embodiments of the present application, it should be understood that the directional terms mentioned, such as "up", "down", "left", "right", "inside", "outside", etc., are only references to the directions in the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0082] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of the features.

[0083] In the embodiments of the present application, the terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0084] In the embodiments of this application, "and / or" is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0085] In the embodiments of the present application, it should be noted that the descriptions "vertical" and "parallel" respectively represent approximately vertical and approximately parallel within a certain error range, and the error range can be a range where the deviation angle is less than or equal to 5°, 8° or 10° relative to absolute vertical and absolute parallel, respectively, and no specific limitation is made here.

[0086] The present application provides an electronic device, including but not limited to a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a personal computer, a notebook computer, an in-vehicle device, a wearable device, a server, a base station, etc. Among them, the wearable device includes but is not limited to a smart bracelet, a smart watch, a smart head-mounted display, smart glasses, etc.

[0087] Please refer to Figure 1, which is a three-dimensional diagram of the electronic device 100 provided in some embodiments of the present application. This embodiment and the embodiments below are exemplified by taking the electronic device 100 as a mobile phone. The electronic device 100 is approximately in the shape of a rectangular plate. On this basis, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established, and the width direction of the electronic device 100 is defined as the X-axis direction, the length direction of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs, and no specific limitation is made here. In some other embodiments, the shape of the electronic device 100 can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc., which are not specifically limited here.

[0088] Please refer to Figures 1 and 2 together. Figure 2 is a schematic diagram of the exploded structure of the electronic device 100 shown in Figure 1. The electronic device 100 may include a display screen 10, a housing 20, and a circuit board assembly 30. It should be understood that Figures 1 and 2 merely schematically illustrate some of the components of the electronic device 100, and the actual shape, size, location, and configuration of these components are not limited by Figures 1 and 2. In other embodiments, the electronic device 100 may not include the display screen 10.

[0089] The display screen 10 is used to display images, videos, etc.

[0090] The housing 20 is used to protect the internal electronic components of the electronic device 100. The housing 20 may include a back cover 21 and a middle frame 22. The back cover 21 is located on a side of the middle frame 22 away from the display screen 10 and is stacked with the display screen 10.

[0091] The middle frame 22 serves as the structural framework of the electronic device 100. The middle frame 22 includes a frame 221 and a middle plate 222. The frame 221 is fixed to the back cover 21. In some examples, the frame 221 can be fixed to the back cover 21 by means of adhesive, snap-fitting, or the like. In other examples, the frame 221 can be integrally formed with the back cover 21, i.e., the frame 221 and the back cover 21 form a single structural unit. The display 10 can be fixed to the frame 221 by means of adhesive or the like.

[0092] The middle plate 222 is arranged on the inner side of the frame 221, and the middle plate 222 is located between the display screen 10 and the back cover 21. The edge of the middle plate 222 is fixed to the frame 221. In some examples, the edge of the middle plate 222 is fixed to the frame 221 by gluing. In other examples, the middle plate 222 can also be an integrally formed structure with the frame 221, that is, the middle plate 222 and the frame 221 are a whole structural component. The middle plate 222, the back cover 21 and the frame 221 are arranged to form the internal accommodation space of the electronic device 100, and the circuit board assembly 30, the battery (not shown in the figure), the speaker module (not shown in the figure), the microphone (not shown in the figure), etc. are located in this part of the space. In some other embodiments, the shell 20 may not be provided with a middle plate 222.

[0093] The circuit board assembly 30 includes a circuit board and electronic components arranged on the circuit board. The electronic components include but are not limited to a processor, an antenna module, a Bluetooth module, a WiFi module, a GPS module, a power supply and charging module, a screen display and operation module, and a connector module. The screen display and operation module can be electrically connected to the aforementioned display screen 10 via the connector module to enable the display screen 10 to have display and operation functions. As the functions of the electronic device 100 increase, the number of electronic components arranged inside the electronic device 100 also increases. Accordingly, the space occupied by the circuit board assembly 30 in the electronic device 100 also increases, which is not conducive to the development trend of thinner and lighter electronic devices 100.

[0094] To address the above issues, please refer to Figures 2 and 3. Figure 3 is a schematic structural diagram of the circuit board assembly 30 of the electronic device 100 shown in Figure 2. The circuit board assembly 30 includes a lower circuit board 301, a middle circuit board 302, an upper circuit board 303, a heating element 304, a lower shielding cover 305, and an upper shielding cover 306. The lower circuit board 301, the middle circuit board 302, and the upper circuit board 303 are stacked in sequence, with the lower circuit board 301 and the upper circuit board 303 being fixed to opposite sides of the middle circuit board 302 via solder balls. The middle circuit board 302 has through holes, and the middle circuit board 302, the lower circuit board 301, and the upper circuit board 303 enclose a first storage space. The lower shielding cover 305 is fixed to the surface of the lower circuit board 301 facing away from the upper circuit board 303, and the lower shielding cover 305 and the lower circuit board 301 enclose a second storage space. The upper shielding cover 306 is fixed to the surface of the upper circuit board 303 facing away from the lower circuit board 301 . The upper shielding cover 306 and the upper circuit board 303 enclose a third receiving space.

[0095] There are multiple heating devices 304. Some heating devices 304 can be placed in the first accommodation space and fixed to the surface of the lower circuit board 301 and / or the surface of the upper circuit board 303; another portion of the heating devices 304 can be placed in the second accommodation space and fixed to the surface of the lower circuit board 301; and another portion of the heating devices 304 can be placed in the third accommodation space and fixed to the surface of the upper circuit board 303. In this way, by stacking multiple circuit boards, the heating devices 304 are centrally arranged, that is, by optimizing the structure of the circuit board assembly 30 and reducing the area occupied by the circuit board assembly 30, the space inside the electronic device 100 is fully utilized.

[0096] Due to the large number of heating elements 304, the heating problem of the heating elements 304 is becoming increasingly prominent. Based on this, the first, second, and third accommodating spaces can be filled with thermally conductive adhesive. This can not only conduct the heat generated by the heating elements 304 to the portions of the housing 20 that are thermally connected to the upper shielding cover 306 and the lower shielding cover 305, but also improve the reliability of the connection between the upper circuit board 303 and the middle circuit board 302, as well as the reliability of the connection between the middle circuit board 302 and the lower circuit board 301, so as to prevent the two interconnected circuit boards from cracking and failing when the electronic device 100 is dropped and impacted, thereby reducing the reliability of the entire electronic device 100.

[0097] However, when assembling the circuit board assembly 30, the middle circuit board 302, the upper circuit board 303, and the lower circuit board 301, the upper shielding cover 306, the upper circuit board 303, and the lower shielding cover 305 and the lower circuit board 301 are typically fixed together by welding. The high temperature of welding (usually reaching 200°C-300°C) can cause the thermal conductive adhesive to lose contact with the heating element 304, thereby reducing the heat dissipation reliability of the heating element 304. In addition, when repairing the electronic device 100, the thermal conductive adhesive covering the surface of the heating element 304 must be cleaned first. This cleaning process is time-consuming and difficult, resulting in a long repair cycle.

[0098] To address the above issues, please refer to Figure 4, which shows a cross-sectional view of the electronic device 100 shown in Figure 1 along line AA. In the embodiment shown in Figure 4, the electronic device 100 includes a display screen 10, a housing 20, a circuit board assembly 30, and a heat-conducting structure 50. The circuit board assembly 30 includes a first circuit board 31, electronic components 32, a first shielding cover 33, and a heat-conducting component 34. The first circuit board 31 is fixed within the electronic device 100 and is stacked and spaced apart from the back cover 21 and the middle plate 222. Specifically, the first circuit board 31 can be secured to the middle plate 222 by screws, clips, or adhesives. If the housing 20 does not include a middle plate 222, the first circuit board 31 can also be secured to the display screen 10 or the back cover 21. The first circuit board 31 can be generally rectangular, with its length extending parallel to the Y-axis, its width extending parallel to the X-axis, and its thickness extending parallel to the Z-axis. In some other embodiments, the length of the first circuit board 31 may be parallel to the X-axis, and the width of the first circuit board 31 may be parallel to the Y-axis, and this application does not limit this. In some other embodiments, the first circuit board 31 may be square or shaped, and this application does not limit this.

[0099] The first circuit board 31 has a first surface 31a and a second surface 31b that face each other. The first surface 31a and the second surface 31b are distributed along the thickness direction of the first circuit board 31. The first surface 31a of the first circuit board 31 faces the back cover 21, and the second surface 31b faces the middle plate 222. In this case, the back cover 21 forms the first wall plate of the housing 20, that is, the first wall plate of the housing 20 is the back cover 21, and the first wall plate and the first circuit board 31 are stacked. In other embodiments, the first surface 31a may face the middle plate 222, and the second surface 31b may face the back cover 21. In this case, the middle plate 222 forms the first wall plate of the housing 20, that is, the first wall plate of the housing 20 is the middle plate 222.

[0100] The electronic component 32 includes a first electronic component 321, which is disposed on the first surface 31a. The first electronic component 321 can also be electrically connected to the first circuit board 31. In some examples, the first electronic component 321 can be disposed on the first surface 31a by welding. In other examples, the first electronic component 321 can also be disposed on the first surface 31a by bonding. In the embodiment shown in Figure 4, the number of first electronic components 321 is multiple, and the multiple first electronic components 321 are arranged at intervals. In some other embodiments, the number of first electronic components 321 can also be one, which is not limited in this application.

[0101] In the embodiment shown in Figure 4, the first shielding cover 33 can form a first cover body, that is, the first cover body is the first shielding cover 33. The first shielding cover 33 is located between the first circuit board 31 and the back cover 21, that is, the first wall panel is located on the side of the first cover body facing away from the first surface 31a. The first shielding cover 33 is fixed to the first surface 31a of the first circuit board 31, and encloses a first accommodating cavity 30a with the first surface 31a, that is, the first cover body is fixed to the first surface 31a and encloses a first accommodating cavity 30a with the first surface 31a. The aforementioned first electronic component 321 is located in the first accommodating cavity 30a. In some other embodiments, the electronic component 32 may also include a fourth electronic component 324 arranged on the first circuit board 31 and located outside the first accommodating cavity 30a. The fourth electronic component 324 may include a camera module, an inductor, a capacitor, etc.

[0102] The first shielding cover 33 includes a shielding frame 331 and a shielding cover 332. The shielding frame 331 forms a first frame, and the shielding cover 332 forms a first cover plate. Specifically, the first cover includes the first frame and the first cover plate, with the first frame being the shielding frame 331 and the first cover plate being the shielding cover 332. The shielding frame 331 is generally rectangular, and the shielding cover 332 is generally rectangular. One axial end of the shielding frame 331 can be secured to the first surface 31a of the first circuit board 31 by welding or adhesive bonding. The shielding cover 332 is disposed opposite the first surface 31a of the first circuit board 31 and secured to the other axial end of the shielding frame 331. Specifically, the first cover plate is disposed opposite the first surface 31a, with the first frame connected between the first cover plate and the first surface 31a. In some examples, the shielding frame 331 and the shielding cover 332 can be integrally formed, such that the first shielding cover 333 is a single, integral structural component. In other examples, the shielding frame 331 and the shielding cover 332 can be connected by welding, clamping, bonding, etc., which is not limited in this application. In other embodiments, the shielding frame 331 can also be in other shapes, which is not limited in this application.

[0103] Based on this, the thermally conductive structure 50 is disposed between the first shielding cover 33 and the back cover 21, and is thermally conductively connected to both the first shielding cover 33 and the back cover 21. Specifically, the thermally conductive structure 50 is disposed between the shielding cover 332 and the back cover 21. That is, the thermally conductive structure 50 is disposed between the first cover body and the first wall panel, and is thermally conductively connected to both the first cover body and the first wall panel. In some examples, the thermally conductive structure 50 may be a graphene layer. In other examples, the thermally conductive structure may be a graphene oxide layer. In yet other embodiments, the thermally conductive structure 50 may be a mixture layer of graphene and graphene oxide. In yet other examples, the thermally conductive structure 50 may be thermally conductive acrylic or thermally conductive gel. In other embodiments, when the first surface 31a of the first circuit board 31 faces the middle plate 222, the thermally conductive structure 50 is disposed between the first shielding cover 33 and the middle plate 222, and is thermally conductively connected to both the first shielding cover 33 and the middle plate 222. In this way, the heat conducting structure 50 can conduct the heat on the first shielding cover 33 to the housing 20 to dissipate heat from the circuit board assembly 30 .

[0104] The first shielding cover 33 is a metal structure, that is, the first cover body is a metal structure. The material of the first shielding cover 33 includes one or more of copper, copper alloy (such as nickel silver), aluminum, aluminum alloy, magnesium, magnesium alloy, etc. This prevents the circuit inside the first shielding cover 33 from radiating electromagnetic waves outward and prevents electromagnetic waves outside the first shielding cover 33 from entering the first shielding cover 33, thereby preventing electromagnetic interference between the first electronic component 321 inside the first shielding cover 33 and the electronic components outside the first shielding cover 33.

[0105] The thickness of the first shielding cover 33 is greater than or equal to 0.05 mm and less than or equal to 0.5 mm. For example, the thickness of the first shielding cover 33 can be 0.05 mm, 0.07 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, etc. In this way, the strength of the first shielding cover 33 can be ensured as much as possible, and the thickness of the first shielding cover 33 can be reduced as much as possible, which is conducive to the overall lightweight and thinness of the electronic device 100.

[0106] Please refer to Figures 4 and 5 together. Figure 5 is a schematic diagram of the structure of the circuit board assembly 30 of the electronic device 100 shown in Figure 4. The heat-conducting component 34 includes a sealing bag 341 and a filling material 342. The sealing bag 341 is used to accommodate the filling material 342. The sealing bag 341 includes a sealing bag body 3411, a feeding cylinder 3412, and an exhaust cylinder 3413, the internal spaces of which are connected. Specifically, the feeding cylinder 3412 is connected to the inner cavity of the sealing bag body 3411, and the exhaust cylinder 3413 is connected to the inner cavity of the sealing bag body 3411. The sealing bag body 3411 is disposed within the first accommodating chamber 30a. The sealing bag body 3411 is flexible, that is, it is relatively soft and can be deformed as needed. The feeding cylinder 3412 is used to fill the inner cavity of the sealing bag 341 with the filling material 342, and the exhaust cylinder 3413 is used to exhaust the gas within the sealing bag 341 when the filling material 342 is filled into the inner cavity of the sealing bag 341.

[0107] In some examples, the feed cylinder 3412 can be a flexible feed cylinder, and the exhaust cylinder 3413 can be a flexible exhaust cylinder, which facilitates the arrangement of the circuit board assembly 30 and the filling equipment for filling the filling material 342. In other examples, the feed cylinder 3412 can be a rigid feed cylinder, and the exhaust cylinder 3413 can be a rigid exhaust cylinder, which facilitates the assembly and coordination of the feed cylinder 3412 and the exhaust cylinder 3413 with other structures (such as the first opening 33a and the second opening 33b described below).

[0108] The diameter of the feed cylinder 3412 is greater than or equal to 0.1 mm and less than or equal to 5 mm. This facilitates the insertion of the filling material 342 into the inner cavity of the sealed bag 341 while also minimizing the size of the first opening 33a, thereby minimizing interference between the electronic components inside and outside the first accommodating cavity 30a. For example, the diameter of the feed cylinder 3412 can be 0.1 mm, 0.3 mm, 0.5 mm, 0.7 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, etc.

[0109] The diameter of the exhaust tube 3413 is greater than or equal to 0.05 mm and less than or equal to 5 mm. This facilitates the removal of air from the inner cavity of the sealing bag 341 while also minimizing the size of the first opening 33a or the second opening 33b, thereby minimizing interference between the electronic components inside and outside the first accommodating cavity 30a. For example, the diameter of the exhaust tube 3413 can be 0.05 mm, 0.07 mm, 0.1 mm, 0.3 mm, 0.5 mm, 0.7 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, etc.

[0110] Based on the above, the filling material 342 is filled into the inner cavity of the sealing bag 341. The filling material 342 has fluidity, allowing the sealing bag body 3411 to cover the outside of the first electronic component 321 and the area on the first surface 31a of the first circuit board 31 not covered by the first electronic component 321. The filling material 342 can also allow the sealing bag body 3411 to cover the inner wall of the first shielding cover 33. In other words, the filling material 342 and the sealing bag body 3411 can completely fill the area within the first accommodating cavity 30a except for the first electronic component 321.

[0111] In this way, the thermally conductive component 34 can be in contact with all outer surfaces of all first electronic components 321 that do not face the first surface 31a, thereby maximizing the heat exchange area between the thermally conductive component 34 and all first electronic components 321, thereby improving the heat exchange efficiency between the thermally conductive component 34 and the first electronic components 321, and thereby improving the heat dissipation efficiency of the first electronic components 321. Furthermore, the sealing bag 341 can also seal the filling material 342, preventing the filling material 342 from flowing into the gaps within the first electronic components 321 and damaging the first electronic components 321 or causing short circuits between multiple first electronic components 321, or between the first electronic components 321 and the first shielding cover 33. It can also prevent the filling material 342 from leaking outside the first accommodating cavity 30a and damaging other components of the electronic device 100. Finally, the thermally conductive component 34 can also provide support for the first electronic components 321, thereby reducing the risk of the first electronic components 321 falling off the first circuit board 31 when the electronic device 100 is impacted.

[0112] In some embodiments, the filler material 342 is a thermally conductive material. The thermal conductivity of the filler material can be greater than or equal to 1.5 W / mK. For example, the thermal conductivity of the filler material can be 1.5 W / mK, 4.5 W / mK, 8.3 W / mK, 43 W / mK, etc. In this way, the filler material 342 can quickly conduct the heat generated by the first electronic component 321 to the first shielding cover 33, and then conduct it to the back cover 21 through the heat-conducting structure 50 between the first shielding cover 33 and the back cover 21 for heat dissipation.

[0113] In some examples, the filling material 342 (thermal conductive material) can be liquid metal. Liquid metal is a metal that is initially in liquid form, that is, the liquid metal has a low melting point and remains liquid at room temperature. It should be noted that room temperature here refers to a temperature between 0°C and 35°C. In addition, the boiling point of the liquid metal must be lower than the operating temperature of the first electronic component 321 to prevent the liquid metal from absorbing heat and becoming gaseous, thereby expanding and squeezing the first electronic component 321 and the first shielding cover 33. For example, the liquid metal can include at least one of mercury, gallium, a gallium alloy, and an indium alloy. In this way, the liquid metal has a high thermal conductivity and can quickly transfer the heat generated by the first electronic component 321 to the first shielding cover 33, thereby improving the heat dissipation efficiency of the first electronic component 321. In addition, the liquid metal has good fluidity and is easier to fill into the inner cavity of the sealing bag 341.

[0114] In other examples, the filling material 342 (thermal conductive material) may be a composite material, including a polymer matrix and a thermal conductive filler. The polymer matrix may include one or more of polyurethane (PU), rubber, polyimide (PI), polyamide (PA), polyethylene (PE), polypropylene (PP), polybutylene (PB), polyvinyl chloride (PVC), polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polystyrene (PS), polyphenylene sulfide (PPS), and polycarbonate (PC).

[0115] The thermally conductive filler may include at least one of a metal material, a ceramic material, a carbon-based material, and a metal oxide. The metal material may include at least one of gold, silver, copper, and aluminum. The ceramic material may include at least one of magnesium oxide, aluminum oxide, silicon dioxide, boron nitride, silicon carbide, carbon nitride, and aluminum nitride. The carbon-based material may include at least one of graphene, carbon nanotubes, graphene nanosheets, and carbon fibers. The metal oxide may include at least one of aluminum oxide, zinc oxide, and beryllium oxide. In other embodiments, the metal oxide may also be other materials with higher thermal conductivity. In this case, the filling material 342 formed of the polymer matrix composite thermally conductive filler may be in a powdered or sol-like form to facilitate its insertion into the sealed bag 341.

[0116] The ratio of the mass of the thermally conductive filler to the mass of the filling material 342 can be greater than or equal to 2% and less than or equal to 5%. For example, the ratio of the mass of the thermally conductive filler to the mass of the filling material 342 can be 2%, 3%, 4%, or 5%. In this way, the filling material 342 is based on a polymer and is compounded with the thermally conductive filler. This ensures that the thermal conductivity of the filling material 342 is maintained while the density of the filling material 342 is low, which contributes to the overall lightweighting of the circuit board assembly 30 and, in turn, the entire electronic device 100.

[0117] In some other examples, the filling material 342 may also be a mixture of the aforementioned composite material and liquid metal, which is not limited in this application.

[0118] In other embodiments, the filling material 342 is a heat storage material. This allows the first electronic component 321 to generate a large amount of heat when its power is high. The filling material 342 can absorb and store the heat from the first electronic component 321, delaying the transfer of heat to the first shielding cover 33 and the back cover 21. Therefore, when a user holds the electronic device 100, the housing 20 does not experience an unpleasant touch due to the high temperature generated by the first electronic component 321. In other words, the filling material 342 not only dissipates heat from the first electronic component 321 but also smoothes out heat peaks and valleys.

[0119] In some examples, filler material 342 may include aerogel. Filler material 342 may include one or more of silicon-based aerogel, carbon-based aerogel, polymer-based aerogel, and metal-based aerogel. Furthermore, filler material 342 may also include a phase change material, i.e., filler material 342 may be an aerogel-based composite phase change material. In this case, the aerogel may be in powder form to facilitate its filling within sealed bag 341. This reduces the density of filler material 342, contributing to the overall lightweighting of circuit board assembly 30 and, in turn, the overall lightweighting of electronic device 100.

[0120] In other examples, the filling material 342 may also be a coolant with a larger specific heat capacity. The specific heat capacity of the filling material 342 may be greater than or equal to 1 kJ / (kg·℃). For example, the specific heat capacity of the coolant may be 1 kJ / (kg·℃) or 2 kJ / (kg·℃) or 3 kJ / (kg·℃) or 4 kJ / (kg·℃), etc. The filling material 342 may be a single substance or a mixture of multiple substances. The filling material 342 may be either an insulating coolant or a non-insulating coolant. For example, the coolant may be water, or an organic liquid (such as acetone, biphenyl liquid), which is not limited in this application. In this way, the filling material 342 can better absorb heat, and the temperature rise is smaller, which delays the overall heating time of the circuit board assembly 30, and thereby delays the time for the heat of the circuit board assembly 30 to be transferred to the housing 20, thereby improving the user experience. In addition, the coolant has good fluidity, which makes it easy to fill the inner cavity of the sealing bag 341 and makes it easier for the sealing bag body 3411 to cover the outside of the first electronic component 321 and the area on the first surface 31a of the first circuit board 31 not covered by the first electronic component 321.

[0121] In other examples, the filler material 342 may also be other solid materials. For example, the filler material 342 may also be a mixed material formed by high-temperature sintering of materials such as lithium oxide, aluminum oxide, and titanium oxide. The filler material 342 may also be a mixed material formed by quartz, feldspar, and mica.

[0122] Based on the above, at least a portion of the sealing bag body 3411 is elastic. In some examples, a portion of the sealing bag body 3411 is elastic, specifically the portion of the sealing bag body 3411 that contacts the first electronic component 321 and the first surface 31a of the first circuit board 31. In other examples, the entire sealing bag body 3411 can be elastic. This allows the volume of the sealing bag body 3411 to be smaller than the volume of the first accommodating cavity 30a in its natural state (i.e., when the sealing bag body 3411 is not elastically deformed). This reduces the size of the sealing bag body 3411 and allows the sealing bag 341 to accommodate different sizes of first accommodating cavities 30a. This eliminates the need to tailor the sealing bag 341 to the specific structure and size of the circuit board assembly 30, thereby reducing the complexity of the design, processing, storage, and assembly of the sealing bag 341. In other embodiments, the sealing bag 341 may not be elastic, with the volume of the sealing bag 341's interior being greater than or equal to the volume of the first accommodating cavity 30a.

[0123] Based on the above, please continue to refer to Figure 5. The first shielding cover 33 has a first opening 33a and a second opening 33b spaced apart from each other, that is, the first cover body has a first opening 33a and a second opening 33b. Specifically, the first opening 33a and the second opening 33b are provided in the shielding cover 332. The feed cylinder 3412 is located on the side of the sealing bag body 3411 facing away from the first circuit board 31. The end of the feed cylinder 3412 away from the sealing bag body 3411 is exposed to the outside of the first accommodating chamber 30a through the first opening 33a. The exhaust cylinder 3413 is located on the side of the sealing bag body 3411 facing away from the first circuit board 31. The end of the exhaust cylinder 3413 away from the sealing bag body 3411 is exposed to the outside of the first accommodating chamber through the second opening 33b. Specifically, the end of the feeding tube 3412 away from the sealing bag body 3411 can be located in the first opening 33a, or it can be located on the side of the first opening 33a away from the first accommodating cavity 30a; the end of the exhaust tube 3413 away from the sealing bag body 3411 can be located in the second opening 33b, or it can be located on the side of the second opening 33b away from the first accommodating cavity 30a.

[0124] In this way, when assembling the circuit board assembly 30, the first shielding cover 33 can be first welded and fixed to the first circuit board 31 to form the first accommodating cavity 30a. The sealing bag body 3411 of the sealing bag 341 is then positioned within the first accommodating cavity 30a. Then, the filling material 342 is introduced into the sealing bag 341 from outside the first shielding cover 33 via the feeding cylinder 3412, and the air in the sealing bag 341 is expelled to the outside of the first accommodating cavity 30a. This prevents the high temperature generated when the first shielding cover 33 is welded to the first circuit board 31 from causing the heat conductive component 34 to lose contact with the first electronic component 321, thereby ensuring reliable heat dissipation for the first electronic component 321 and ensuring the operational reliability of the first electronic component 321.

[0125] Furthermore, when repairing the electronic device 100, the heat-conducting component 34 can be removed as a whole, eliminating the need for separate cleaning. This improves the convenience of repairing the electronic device 100 and shortens the repair cycle. Finally, the feed tube 3412 and the exhaust tube 3413 are exposed outside the first accommodating chamber 30a through the first opening 33a and the second opening 33b, respectively. This allows the first opening 33a and the second opening 33b to be spaced farther apart, facilitating the exhaust of air from the sealing bag 341. Furthermore, the first opening 33a and the second opening 33b can both be relatively small, eliminating the need for metal shielding films at the first opening 33a and the second opening 33b to prevent interference between electronic components inside and outside the first accommodating chamber 30a.

[0126] Please refer to Figures 5 and 6. Figure 6 is a top view of a portion of the circuit board assembly 30 shown in Figure 5, viewed from the shielding cover 332 toward the first circuit board 31. The first opening 33a is defined in the angled region defined by one long side and one short side of the shielding cover 332, while the second opening 33b is defined in the angled region defined by the other long side and the other short side of the shielding cover 332. This arrangement allows the first opening 33a and the second opening 33b to be as far apart as possible and positioned as close to the inner wall of the shielding frame 331 as possible. This facilitates exhaustion of air from the sealing bag 341 and the first accommodating chamber 30a, maximizing the contact area between the heat-conducting component 34, the shielding frame 331, and the shielding cover 332. This improves the heat exchange efficiency between the heat-conducting component 34 and the first shielding cover 33, thereby enhancing the heat dissipation efficiency of the first electronic component 321.

[0127] Please refer to Figure 7, which is a schematic diagram of the filling process of the filling material 342 of the circuit board assembly 30 shown in Figure 5. First, a production system 200 for the circuit board assembly 30 is provided. The production system 200 includes a filling device 210, a sealing device 220, a molding device 230, and a conveying device 240. The conveying device 240 includes a conveyor belt 2401 and two rotating shafts 2402 spaced apart from each other. The conveyor belt 2401 is sleeved on the two rotating shafts 2402 so that the two rotating shafts 2402 are transmission-connected. When the two rotating shafts 2402 rotate, they can drive the conveyor belt 2401 to rotate around the two rotating shafts 2402 to convey the components placed on the conveyor belt 2401 (such as the semi-finished products of the circuit board assembly 30) to different workstations.

[0128] Filling device 210 is located on one side of conveyor belt 2401. Filling device 210 includes a hopper 2101, a nozzle 2102, and a piston 2103. The hopper 2101 is fixed relative to the axis of the rotating shaft 2402. One end of the hopper 2101 is connected to the nozzle 2102. At least a portion of the piston 2103 is located within the hopper 2101. The piston 2103 can slide relative to the hopper 2101 to squeeze the filling material 342 in the hopper 2101 toward the nozzle 2102.

[0129] The sealing device 220 and the filling device 210 are located on the same side of the conveyor belt 2401 . The sealing device 220 includes a laser 2201 , which is used to emit a laser beam.

[0130] The molding device 230 and the filling device 210 are located on the same side of the conveyor belt 2401 . The molding device 230 includes a pressing head 2301 , which is used to apply pressure to the component to be processed (eg, the semi-finished product of the circuit board assembly 30 ).

[0131] Next, the semi-finished circuit board assembly 30 is placed on a conveyor belt 2401 and positioned near the outlet of the nozzle 2102 of the filling device 210, so that the nozzle 2102 is in communication with the inlet barrel 3412 of the sealing bag 341. The semi-finished circuit board assembly 30 includes the aforementioned first circuit board 31, the first electronic component 321, the first shielding cover 33, and the sealing bag 341. The structure of the semi-finished circuit board assembly 30 can be found in the previous description and will not be further described here.

[0132] Next, the piston 2103 of the filling device 210 is moved toward the nozzle 2102 so that the filling material 342 in the silo 2101 is filled into the inner cavity of the sealing bag 341 through the nozzle 2102. At the same time, the air in the inner cavity of the sealing bag 341 is discharged to the outside of the first accommodating cavity 30a of the circuit board assembly 30 through the exhaust tube 3413.

[0133] In some examples, the speed at which the filling material 342 is introduced from the feed barrel 3412 into the sealing bag 341 is greater than or equal to 3 cm / s and less than or equal to 10 cm / s. For example, the speed at which the filling material 342 is introduced from the feed barrel 3412 into the sealing bag 341 is 3 cm / s, 4 cm / s, 5 cm / s, 6 cm / s, 8 cm / s, 10 cm / s, etc. This allows the filling material to be introduced into the sealing bag 341 as quickly as possible while also preventing the filling material 342 in the sealing bag 341 from being unable to flow and disperse in time if the filling speed is too fast, thereby causing excessive compression of the first electronic component 321 or splashing of the filling material 342 from the exhaust barrel 3413 onto the outside of the circuit board assembly 30.

[0134] In other examples, when the filling material 342 is introduced into the sealing bag 341 from the feeding barrel 3412, the temperature of the filling material 342 is greater than or equal to 75°C and less than or equal to 90°C. For example, the temperature of the filling material 342 is 75°C, 80°C, 85°C, 90°C, etc. This allows the filling material 342 to have better fluidity, making it easier to fill and disperse within the sealing bag 341. It also prevents the filling material 342 from overheating and damaging the first electronic component 321.

[0135] Next, the conveyor belt 2401 is activated to transport the semi-finished circuit board assembly 30 filled with the filling material 342 to the sealing device 220. The laser 2201 of the sealing device 220 is activated to emit a high-energy laser beam toward the feeding cylinder 3412 and the exhaust cylinder 3413 of the sealing bag 341, softening the feeding cylinder 3412 and the exhaust cylinder 3413 so that their openings are closed.

[0136] Next, the conveyor belt 2401 is started to convey the semi-finished product of the circuit board assembly 30 to the molding device 230. The pressure head 2301 of the molding device 230 is moved in a direction close to the conveyor belt 2401, and the feed cylinder 3412 and the exhaust cylinder 3413 are hot-pressed to fit the first shielding cover 33, and the appearance of the circuit board assembly 30 is made smooth. In some examples, when the feed cylinder 3412 and the exhaust cylinder 3413 are hot-pressed, the temperature at which the feed cylinder 3412 and the exhaust cylinder 3413 are heated is greater than or equal to 80°C and less than or equal to 90°C. For example, the temperature can be 80°C, 85°C, 90°C, etc. When the feed cylinder 3412 and the exhaust cylinder 3413 are hot-pressed, the pressure applied to the feed cylinder 3412 and the exhaust cylinder 3413 is greater than or equal to 8 MPa and less than or equal to 12 MPa. For example, the pressure may be 8 MPa, 9 MPa, 10 MPa, 11 MPa, 12 MPa, etc. In this way, the reliability of hot pressing the feed cylinder 3412 and the exhaust cylinder 3413 can be guaranteed.

[0137] In other embodiments, please refer to FIG8 , which is another schematic diagram of the structure of the circuit board assembly 30 of the electronic device 100 shown in FIG4 . The embodiment shown in FIG8 differs from the embodiment shown in FIG5 in that the first opening 33a and the second opening 33b are respectively provided on two opposing side walls of the shielding frame 331 , that is, the first opening 33a and the second opening 33b are respectively provided on two opposing side walls of the first frame body. The first opening 33a is provided on one side wall of the shielding frame 331, close to the first circuit board 31 , and the second opening 33b is provided on the other side wall of the shielding frame 331, away from the first circuit board 31 . Accordingly, the feed cylinder 3412 is located on the side of the sealing bag body 3411 facing the aforementioned side wall, and the exhaust cylinder 3413 is located on the side of the sealing bag body 3411 facing the aforementioned side wall. In other embodiments, the first opening 33a and the second opening 33b may also be provided on two adjacent side walls of the shielding frame 331 .

[0138] In the circuit board assembly 30 shown in Figure 8, the filling process of the filling material 342 can refer to the filling process shown in Figure 7. The difference from the filling process shown in Figure 7 is that: after one of the feed cylinder 3412 and the exhaust cylinder 3413 is hot-pressed by the molding equipment 230, the semi-finished product of the circuit board assembly 30 needs to be flipped 180° by the jig, and then the other of the feed cylinder 3412 and the exhaust cylinder 3413 is hot-pressed.

[0139] In yet other embodiments, please refer to Figures 9 and 10. Figure 9 is a schematic diagram of another structure of the circuit board assembly 30 of the electronic device 100 shown in Figure 4, and Figure 10 is a top view of a portion of the circuit board assembly 30 shown in Figure 9, viewed from the shielding cover 332 toward the first circuit board 31. The embodiment shown in Figures 9 and 10 differs from the embodiment shown in Figure 5 in that the first opening 33a is defined in the shielding cover 332, and the second opening 33b is defined in a sidewall of the shielding frame 331. Specifically, the first opening 33a is defined in the first cover, and the second opening 33b is defined in the first frame. Accordingly, the feed tube 3412 is located on the side of the sealing bag body 3411 facing away from the first circuit board 31, and the exhaust tube 3413 is located on the side of the sealing bag body 3411 facing this sidewall. In yet other embodiments, the first opening 33a may also be defined in a sidewall of the shielding frame 331, and the second opening 33b may be defined in the shielding cover 332.

[0140] In the circuit board assembly 30 shown in Figure 10, the filling process of the filling material 342 can refer to the filling process shown in Figure 7. The difference from the filling process shown in Figure 7 is that: after one of the feed cylinder 3412 and the exhaust cylinder 3413 is hot-pressed by the molding equipment 230, the semi-finished product of the circuit board assembly 30 needs to be flipped 90° by the jig, and then the other of the feed cylinder 3412 and the exhaust cylinder 3413 is hot-pressed.

[0141] In yet other embodiments, please refer to FIG. 11 , which is a schematic diagram of another structure of the circuit board assembly 30 of the electronic device 100 shown in FIG. 4 . The embodiment shown in FIG. 11 differs from the embodiment shown in FIG. 5 in that the second opening 33b is provided in the shielding cover 332, and the first opening 33a is provided in the first circuit board 31, i.e., the first circuit board 31 has a first opening 33a. Accordingly, the feed cylinder 3412 is located on the side of the sealing bag body 3411 facing the first circuit board 31, and the exhaust cylinder 3413 is located on the side of the sealing bag body 3411 facing away from the first circuit board 31. In yet other embodiments, the first opening 33a is provided in the shielding cover 332, and the second opening 33b is provided in the first circuit board 31, i.e., the first circuit board 31 has a second opening 33b. Accordingly, the feed cylinder 3412 is located on the side of the sealing bag body 3411 facing away from the first circuit board 31, and the exhaust cylinder 3413 is located on the side of the sealing bag body 3411 facing the first circuit board 31. In some other embodiments, the first circuit board 31 has a first opening 33 a and a second opening 33 b . Accordingly, the feeding cylinder 3412 and the exhaust cylinder 3413 are both located on the side of the sealing bag body 3411 facing the first circuit board 31 .

[0142] In the circuit board assembly 30 shown in Figure 11, the filling process of the filling material 342 can refer to the filling process shown in Figure 7. The difference from the filling process shown in Figure 7 is that: after one of the feed cylinder 3412 and the exhaust cylinder 3413 is laser-irradiated and sealed or hot-pressed by the sealing device 220 or the molding device 230, the semi-finished product of the circuit board assembly 30 needs to be flipped 180° by a jig, and then the other of the feed cylinder 3412 and the exhaust cylinder 3413 is laser-irradiated and sealed or hot-pressed.

[0143] Based on the above, please refer to Figure 12, which is a schematic diagram of the structure of the sealing bag body 3411 of the electronic device 100 shown in Figure 4. The sealing bag body 3411 includes a first film layer 34111 and a second film layer 34112 laminated and joined from the outside to the inside. The first film layer 34111 is made of a non-conductive material. As such, the first film layer 34111 is an insulating film layer, which prevents short circuits between the first electronic component 321 and the first shielding cover 33, and between two adjacent first electronic components 321, which could lead to low reliability of the circuit board assembly 30 and, consequently, low reliability of the electronic device 100 as a whole.

[0144] In some examples, the material of the first film layer 34111 may be a polymer. For example, the material of the first film layer 34111 may include one or more of polyurethane (PU), rubber, polyimide (PI), polyamide (PA), polyethylene (PE), polypropylene (PP), polybutylene (PB), polyvinylchloride (PVC), polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polystyrene (PS), polyphenylene sulfide (PPS), polycarbonate (PC), etc.

[0145] In other examples, the material of the first film layer 34111 may include a polymer matrix and a thermally conductive filler, wherein the thermally conductive filler is a non-conductive thermally conductive filler. Specifically, the composition of the polymer matrix can refer to the composition of the polymer of the first film layer 34111 described above and will not be further described here. The thermally conductive filler can include at least one of a ceramic material and a metal oxide. The specific composition of the ceramic material can refer to the above and will not be further described here. The specific composition of the metal oxide can refer to the above and will not be further described here.

[0146] On this basis, the material of the second film layer 34112 includes a polymer matrix and a thermally conductive filler. Specifically, the composition of the polymer matrix can refer to the composition of the polymer of the first film layer 34111, and will not be repeated here. The thermally conductive filler includes one or more of a metal material, a ceramic material, a carbon-based material, and a metal oxide. The specific composition of the thermally conductive filler can refer to the specific composition of the thermally conductive filler in the filling material 342, and will not be repeated here. In this way, by making the first film layer 34111 and the second film layer 34112 include polymers, the first film layer 34111 and the second film layer 34112 can have better insulation, elasticity and softness, so that the contact area between the sealing bag body 3411 and the first electronic component 321 and the first surface 31a can be as large as possible; by adding thermally conductive fillers in the polymer matrix, the thermal conductivity of the first film layer 34111 and the second film layer 34112 can be improved, thereby improving the heat exchange efficiency between the thermally conductive component 34 and the first electronic component 321 and the first shielding cover 33, so as to ensure the heat dissipation efficiency of the first electronic component 321.

[0147] The thickness of the first film layer 34111 can be less than the thickness of the second film layer 34112. The sum of the thicknesses of the first film layer 34111 and the second film layer 34112 (the thickness of the sealing bag body 3411) is greater than or equal to 0.01 mm and less than or equal to 3 mm. For example, the thickness of the sealing bag body 3411 can be 0.01 mm, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.7 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3 mm, etc.

[0148] On this basis, the material of the feeding tube 3412 and the exhaust tube 3413 can be the same as that of the sealing bag body 3411, and the three can be integrally formed to reduce the difficulty of manufacturing the sealing bag 341. The material of the feeding tube 3412 and the exhaust tube 3413 can also be different from that of the sealing bag body 3411, and the feeding tube 3412 and the exhaust tube 3413 can be connected to the sealing bag body 3411 by bonding or other means, which is not limited in this application.

[0149] Based on the above, please refer to Figures 13 and 14. Figure 13 is a schematic diagram of another structure of the circuit board assembly 30 of the electronic device 100 shown in Figure 4. Figure 14 is a top view of the circuit board assembly 30 shown in Figure 13, viewed from the shielding cover 332 toward the first circuit board 31. The embodiment shown in Figures 13 and 14 differs from the embodiment shown in Figure 9 in that the sealing bag 341 further includes at least one partition layer 3414, which is disposed on the inner wall of the sealing bag body 3411 to divide the inner cavity of the sealing bag 341 into multiple sub-cavities 341a. Each of the multiple sub-cavities 341a is connected to the feeding cylinder 3412 and the exhaust cylinder 3413. This ensures a more even distribution of the filling material 342 within the sealing bag 341. When the circuit board assembly 30 is impacted, the filling material 342 sways less, resulting in a lesser vibration felt by the user.

[0150] On this basis, the thermal conductivity of the separation layer 3414 is less than the thermal conductivity of the filling material 342. Specifically, the material of the separation layer 3414 can be a polymer. The specific composition of the separation layer 3414 can refer to the composition when the material of the first film layer 34111 is a polymer, and will not be repeated here. In some examples, the separation layer 3414 can be connected to the inner wall of the sealing bag body 3411 by hot pressing or bonding with plastic glue. In other examples, when the sealing bag body 3411 does not include the second film layer 34112 and the material of the first film layer 34111 is a polymer, the material of the separation layer 3414 can be the same as that of the first film layer 34111, and the separation layer 3414 and the sealing bag body 3411 are integrally formed. In this way, the thermal conductivity of the separation layer 3414 is low, which can reduce the heat transfer efficiency between different sub-cavities 341a. In this way, when there are multiple first electronic components 321 and the working powers of different first electronic components 321 differ greatly, the separation layer 3414 can prevent the heat generated by the high-power first electronic component 321 from being transferred to the low-power first electronic component 321 through the heat-conducting component 34, thereby reducing the reliability of the first electronic component 321.

[0151] Referring to Figures 13 and 14 , the sealing bag body 3411 includes a first bag wall 34113 and a second bag wall 34114 disposed opposite each other. The partition layer 3414 includes a first partition layer 34141 and a second partition layer 34142, which are arranged alternately along a first direction, wherein the first direction is parallel to the first surface 31a of the first circuit board 31 and intersects with the arrangement direction of the first bag wall 34113 and the second bag wall 34114. In the embodiment shown in Figures 13 and 14 , the arrangement direction of the first bag wall 34113 and the second bag wall 34114 is parallel to the Y-axis, and the first direction is parallel to the X-axis. In other embodiments, referring to Figure 15 , Figure 15 is a top view of another partial structure of the circuit board assembly 30 of the electronic device 100 shown in Figure 4 , viewed from the shielding cover 332 toward the first circuit board 31. In the embodiment shown in FIG. 15 , the arrangement direction of the first bag wall 34113 and the second bag wall 34114 is parallel to the X-axis direction, and the first direction is parallel to the Y-axis direction.

[0152] Based on this, the first partition layer 34141 extends from the first bag wall 34113 toward the second bag wall 34114, forming a channel between the first partition layer 34141 and the second bag wall 34114. The second partition layer 34142 extends from the second bag wall 34114 toward the first bag wall 34113, forming a channel between the second partition layer 34142 and the first bag wall 34113. The feeding tube 3412 and the exhaust tube 3413 are respectively connected to the two ends of the sealing bag body 3411 along the first direction.

[0153] In the embodiment shown in Figures 13 to 15, the number of first partition layers 34141 and second partition layers 34142 is the same, the partition layer 3414 adjacent to the feed barrel 3412 can be the first partition layer 34141, and the feed barrel 3412 is connected to the first bag wall 34113 or the other bag walls of the sealing bag body 3411 close to the first bag wall 34113. Correspondingly, the partition layer 3414 adjacent to the exhaust tube 3413 is the second partition layer 34142, and the exhaust tube 3413 is connected to the second bag wall 34114 or the other bag walls of the sealing bag body 3411 close to the second bag wall 34114. In some other embodiments, the number of first separation layers 34141 and second separation layers 34142 may be different. In this case, the separation layer 3414 adjacent to the exhaust tube 3413 is also the first separation layer 34141, and the exhaust tube 3413 is connected to the first bag wall 34113 or to another bag wall of the sealing bag body 3411 in an area close to the first bag wall 34113. In this way, when the filling material 342 is filled into the inner cavity of the sealing bag 341, the filling material 342 can flow and disperse along a serpentine path within the sealing bag body 3411, making the filling material 342 more evenly distributed within the sealing bag body 3411 and maximally excluding air from the sealing bag 341, thereby ensuring the overall reliability of the circuit board assembly 30.

[0154] The thickness of the first separator layer 34141 is greater than or equal to 0.1 mm and less than or equal to 3 mm. For example, the diameter of the first separator layer 34141 can be 0.1 mm, 0.3 mm, 0.5 mm, 0.7 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3 mm, etc. The thickness of the second separator layer 34142 is greater than or equal to 0.1 mm and less than or equal to 3 mm. The thickness of the second separator layer 34142 can refer to the thickness of the first separator layer 34141. The thickness of the second separator layer 34142 can be the same as or different from the thickness of the first separator layer 34141, and this is not limited in this application.

[0155] In some other embodiments, the number of the partition layer 3414 can also be one, and the partition layer 3414 can divide the inner cavity of the sealing bag body 3411 into two sub-accommodation cavities. In some other embodiments, the plurality of partition layers 3414 can also be arranged in other ways.

[0156] Based on the above, please refer to Figure 16, which is a top view of another partial structure of the circuit board assembly 30 of the electronic device 100 shown in Figure 4, viewed from the shielding cover 332 toward the first circuit board 31. The embodiment shown in Figure 16 differs from the embodiment shown in Figure 10 in that the heat-conducting component 34 further includes a first heat-conducting member 343, which is disposed within the sealing bag body 3411 and contacts the first shielding cover 33. Specifically, the first heat-conducting member 343 contacts the first cover. The thermal conductivity of the first heat-conducting member 343 is greater than the thermal conductivity of the filler material 342. In some examples, the first heat-conducting member 343 may be a graphene film layer. In other examples, the first heat-conducting member 343 may be a graphene oxide film layer. In yet other examples, the first heat-conducting member 343 may be a mixture of graphene and graphene oxide. The first heat-conducting member 343 may be bonded to the outer wall of the sealing bag body 3411. In this way, the thermal resistance between the sealing bag body 3411 and the first shielding cover 33 can be reduced, the efficiency of heat conduction between the heat conducting component 34 and the first shielding cover 33 can be improved, and the heat dissipation efficiency of the first electronic component 321 can be improved.

[0157] In the embodiment shown in Figure 16, the first heat conductor 343 is disposed between the sealing bag body 3411 and the shielding cover 332. In other embodiments, the first heat conductor 343 may also be disposed between the sealing bag body 3411 and the sidewalls of the shielding frame 331. In still other embodiments, the first heat conductor 343 may also be disposed between both the sealing bag body 3411 and the shielding cover 332 and the sidewalls of the shielding frame 331.

[0158] Continuing with Figure 16 , the first heat-conducting member 343 extends along a serpentine path. In some examples, the first heat-conducting member 343 is a continuously extending heat-conducting film layer. In other examples, the first heat-conducting member 343 can also be a discontinuously extending heat-conducting film layer. This allows the first heat-conducting member 343 to stretch and expand as the sealing bag body 3411 is stretched and expanded by the filling material 342, preventing the sealing bag body 3411 from being unable to adapt to the volume and shape of the first accommodating cavity 30a due to the first heat-conducting member 343 being unable to deform.

[0159] The above embodiments are described using as examples a case where the first shielding cover 33 or the first circuit board 31 has a second opening 33b, the feed tube 3412 of the sealing bag 341 is exposed from the first opening 33a to the outside of the first accommodating chamber 30a, and the exhaust tube 3413 is exposed from the second opening 33b to the outside of the first accommodating chamber 30a. In other embodiments, please refer to FIG. 17 , which is a schematic diagram of another cross-sectional structure of the circuit board assembly 30 of the electronic device 100 shown in FIG. The embodiment shown in FIG. 17 differs from the embodiment shown in FIG. 5 in that the sealing bag body 3411 includes a connected main portion 34115 and a raised portion 34116. The main portion 34115 is located within the first accommodating chamber 30a, and the raised portion 34116 is located within the first opening 33a. Based on this, the feed tube 3412 is connected to the raised portion 34116, and the exhaust tube 3413 is connected to the raised portion 34116. That is, neither the first housing nor the first circuit board 31 has the second opening 33b, and the exhaust tube 3413 is also exposed outside the first accommodating chamber 30a through the first opening 33a. In this way, by having both the feed tube 3412 and the exhaust tube 3413 exposed outside the first accommodating chamber 30a through the first opening 33a, the difficulty of assembling the sealing bag 341 and the first shielding cover 33 can be reduced.

[0160] In some examples, the main body 34115 may have a communication opening 34115a, and the protrusion 34116 may be connected to the edge of the communication opening 34115a of the main body 34115. In other examples, if the sealing bag main body 3411 is elastic, the sealing bag main body 3411 may be elastically deformed by the filling material 342, with a portion of the sealing bag main body 3411 protruding into the first opening 33a to form the protrusion 34116, and another portion being located in the first accommodating cavity 30a to form the main body 34115.

[0161] Continuing with FIG17 , the circuit board assembly 30 further includes a second cover plate 35 , which is positioned at and blocks the first opening 33a. The second cover plate 35 is a metal structural member. In the embodiment shown in FIG17 , the second cover plate 35 defines escape openings corresponding to the feed tube 3412 and the exhaust tube 3413 , respectively. The feed tube 3412 and the exhaust tube 3413 are exposed at the two escape openings. In this case, the second cover plate 35 can be first adhesively secured to the shielding cover 332 before the filling material 342 is filled into the sealing bag 341 . In other embodiments, the second cover plate 35 may not define an escape opening. In this case, the filling material 342 can be first filled into the sealing bag 341, and then the feed tube 3412 and the exhaust tube 3413 are sealed before the second cover plate 35 is adhesively secured to the shielding cover 332 . In this way, the first shielding cover 33 and the second cover plate 35 can form a complete metal shielding structure to prevent the electronic components inside and outside the first accommodating cavity 30 a from interfering with each other.

[0162] In some embodiments, the thickness of the second cover plate 35 is less than that of the shielding cover 332, that is, the thickness of the second cover plate 35 is less than that of the first cover plate. The ratio of the area of ​​the orthographic projection of the first opening 33a on the first surface 31a to the outer contour area of ​​the orthographic projection of the shielding cover 332 on the first surface 31a is greater than or equal to 0.1 and less than or equal to 0.9. For example, this ratio can be 0.1, 0.3, 0.5, 0.6, 0.7, 0.8, or 0.9. This reduces the thickness of the second cover plate 35, allowing the distance between the second cover plate 35 and the first circuit board 31 to be greater than the distance between the shielding cover 332 and the first circuit board 31. This reduces the thickness restriction on the first electronic component 321 between the second cover plate 35 and the first circuit board 31, facilitating the placement of the first electronic component 321. Furthermore, the heat conduction path between the heat-conducting component 34 and the heat-conducting structure 50 is short, ensuring efficient heat dissipation for the first electronic component 321.

[0163] In other embodiments, the thermal conductivity of the second cover 35 is greater than that of the shielding cover 332, that is, the thermal conductivity of the second cover 35 is greater than that of the first cover. This improves the heat transfer efficiency between the heat-conducting component 34 and the heat-conducting structure 50, thereby improving the heat dissipation efficiency of the first electronic component 321.

[0164] The thickness of the second cover plate 35 is greater than or equal to 0.01 mm and less than or equal to 2 mm. For example, the thickness of the second cover plate 35 can be 0.01 mm, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.7 mm, 1.0 mm, 1.5 mm, 2.0 mm, etc.

[0165] In yet other embodiments, the thickness of the second cover plate 35 is less than the thickness of the shielding cover 332, and the thermal conductivity of the second cover plate 35 is greater than the thermal conductivity of the shielding cover 332. Specifically, the thickness of the second cover plate 35 is less than the thickness of the first cover plate, and the thermal conductivity of the second cover plate 35 is greater than the thermal conductivity of the first cover plate. The material of the second cover plate 35 includes one or more of copper, gold, a gold alloy, silver, and a silver alloy. In this way, the thickness of the second cover plate 35 can be less than that of the first cover plate, and the thermal conductivity of the second cover plate 35 can be greater than that of the first cover plate.

[0166] In yet other embodiments, please refer to Figures 18-20. Figure 18 is another schematic cross-sectional view of the circuit board assembly 30 of the electronic device 100 shown in Figure 2. Figure 19 is a schematic partial structural view of the circuit board assembly 30 shown in Figure 18 as viewed from direction B. Figure 20 is a schematic partial structural view of the sealing bag 341 of the circuit board assembly 30 shown in Figure 19. The partial structure of the sealing bag 341 shown in Figure 20 is the partial structure at the raised portion 34116. The embodiment shown in Figures 18-20 differs from the embodiment shown in Figure 17 in that the sealing bag 341 further includes a metal layer structure 3415, which is laminated and bonded to the outer surface of the raised portion 34116. Specifically, the metal layer structure 3415 is laminated and bonded to the surface of the first film layer 34111 of the raised portion 34116 that faces away from the second film layer 34112. It should be noted that the outer surface of the raised portion 34116 refers to the surface of the raised portion 34116 that faces away from the receiving cavity of the raised portion 34116.

[0167] The material of the metal layer structure 3415 may include one or more of copper, gold, a gold alloy, silver, a silver alloy, etc. The thickness of the metal layer structure 3415 is greater than or equal to 0.01 mm and less than or equal to 2 mm. For example, the thickness of the metal layer structure 3415 may be 0.01 mm, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.7 mm, 1.0 mm, 1.5 mm, 2.0 mm, etc. The metal layer structure 3415 may be formed by bonding a metal material to the outer surface of the protrusion 34116 through a deposition process. For example, the deposition process may be a chemical vapor deposition (CVD) process, a high-density plasma chemical vapor deposition (HDPCVD) process, a spin coating process, a sputtering process, or other suitable processes. The metal layer structure 3415 can also be formed by bonding a metal material to the outer surface of the protrusion 34116 through processes such as electroplating and chemical plating, and this application does not limit this.

[0168] Continuing with Figures 18 and 19 , a portion of the raised portion 34116 protrudes from the surface of the shielding cover 332 facing away from the first surface 31a of the first circuit board 31. A clearance exists between the outer side surface of the metal layer structure 3415 and the inner sidewall of the first opening 33a. The clearance between the outer side surface of the metal layer structure 3415 and the inner sidewall of the first opening 33a can be greater than or equal to 0.05 mm and less than or equal to 0.5 mm. For example, the clearance between the outer side surface of the metal layer structure 3415 and the inner sidewall of the first opening 33a can be 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, etc.

[0169] In this case, please refer to Figure 21, which is a schematic diagram of the assembly structure of the circuit board assembly 30 and the heat-conducting structure 50 shown in Figure 18. When the circuit board assembly 30 is assembled inside the housing 20, the protrusion 34116 and the metal layer structure 3415 can be deformed under the action of external pressure (for example, pressure from the heat-conducting structure 50), so that the outer side surface of the metal layer structure 3415 can be in contact with the inner side wall of the first opening 33a, thereby forming a complete metal shielding structure with the first shielding cover 33 to prevent the electronic components inside and outside the first accommodating cavity 30a from interfering with each other. Therefore, while ensuring the shielding effect of the electromagnetic signals inside and outside the first accommodating cavity 30a and the heat dissipation effect of the first electronic component 321, the design and assembly of the second cover 35 can be reduced, simplifying the overall structural design and assembly difficulty of the circuit board assembly 30.

[0170] In some other embodiments, the protrusion 34116 may not protrude from the shielding cover 332, and the outer side surface of the metal layer structure 3415 may directly fit with the inner wall of the first opening 33a, so that the metal layer structure 3415 can form a complete metal shielding structure with the first shielding cover 33 to prevent the electronic components inside and outside the first accommodating cavity 30a from interfering with each other.

[0171] Please refer to Figures 22 and 23. Figure 22 is another schematic cross-sectional view of the electronic device 100 shown in Figure 1 at line AA, and Figure 23 is a schematic structural view of the circuit board assembly 30 of the electronic device 100 shown in Figure 22. In the embodiment shown in Figures 22 and 23, the circuit board assembly 30 includes a first circuit board 31, an electronic component 32, a first shielding cover 33, a heat-conducting component 34, and a second shielding cover 36. The embodiment shown in Figure 22 differs from the embodiment shown in Figure 4 in that the electronic component 32 includes a first electronic component 321 and a second electronic component 322, and the second electronic component 322 is disposed on the second surface 31b of the first circuit board 31. The second electronic component 322 can also be electrically connected to the first circuit board 31. The manner in which the second electronic component 322 is disposed on the first circuit board 31 can refer to the manner in which the first electronic component 321 is disposed on the first circuit board 31, and will not be repeated here.

[0172] The second shielding cover 36 can form a second cover body, that is, the second cover body is the second shielding cover 36. The second shielding cover 36 is fixed to the second surface 31b and encloses a second accommodating cavity 30b with the second surface 31b. The aforementioned second electronic component 322 is located in the second accommodating cavity 30b. The structure of the second shielding cover 36 and the way it is arranged on the second surface 31b can refer to the structure of the first shielding cover 33 and the way it is arranged on the first surface 31a, and will not be repeated here. In the embodiment shown in Figure 23, the structure of the second shielding cover 36 can refer to the structure of the first shielding cover 33 in the circuit board assembly 30 shown in Figure 17. In this case, the electronic device 100 also includes a third cover plate 37. The connection structure between the third cover plate 37 and the second shielding cover 36 can refer to the connection structure between the second cover plate 35 and the first shielding cover 33, and will not be repeated here.

[0173] On this basis, the number of heat-conducting components 34 is multiple. In the embodiment shown in Figures 22 and 23, the number of heat-conducting components 34 is two, and the first heat-conducting component 34 is used to dissipate heat for the first electronic component 321. The connection structure between the first heat-conducting component 34 and the first circuit board 31, the first electronic component 321, and the first shielding cover 33 can refer to the above. The connection structure between the second heat-conducting component 34 and the first circuit board 31, the second electronic component 322, and the second shielding cover 36 can refer to the connection structure between the first heat-conducting component 34 and the first circuit board 31, the first electronic component 321, and the first shielding cover 33, and will not be repeated here. In some other embodiments, the number of heat-conducting components 34 can also be one, and one heat-conducting component 34 is used to dissipate heat for the first electronic component 321 or the second electronic component 322.

[0174] In the embodiment shown in Figures 22 and 23, the first surface 31a of the first circuit board 31 faces the back cover 21, and the second surface 31b faces the middle plate 222. The back cover 21 forms the first wall of the housing 20, and the middle plate 222 forms the second wall of the housing 20. That is, the housing 20 of the electronic device 100 may include a first wall and a second wall, the first wall being the back cover 21, and the second wall being the middle plate 222. There are multiple thermally conductive structures 50. The first thermally conductive structure 50 is disposed between the first shielding cover 33 and the back cover 21. The sealing bag 341 of the first thermally conductive component 34 is thermally conductively connected to the back cover 21 through the first thermally conductive structure 50. The second thermally conductive structure 50 is disposed between the second shielding cover 36 and the middle plate 222. The second shielding cover 36 is thermally conductively connected to the middle plate 222 through the second thermally conductive structure 50. In some other embodiments, the second surface 31b of the first circuit board 31 faces the back cover 21, and the first surface 31a faces the middle plate 222. In this case, the first wall plate of the electronic device 100 is the middle plate 222, and the second wall plate is the back cover 21.

[0175] Please refer to Figures 24 and 25. Figure 24 is another schematic cross-sectional view of the electronic device 100 shown in Figure 1 at line AA, and Figure 25 is a schematic partial structural view of the circuit board assembly 30 of the electronic device 100 shown in Figure 24. In the embodiment shown in Figures 24 and 25, the circuit board assembly 30 includes a first circuit board 31, an electronic component 32, a first shielding cover 33, a heat-conducting component 34, a second shielding cover 36, a second circuit board 38, and a third circuit board 39. The embodiment shown in Figure 24 differs from the embodiment shown in Figure 23 in that the electronic component 32 includes a first electronic component 321, a second electronic component 322, and a third electronic component 323. The second circuit board 38 forms a first cover, and the third circuit board 39 forms a first frame. The second circuit board 38 and the third circuit board 39 form a first cover, that is, the first cover includes the second circuit board and the first frame, and the first frame is the third circuit board 39.

[0176] The second circuit board 38 is stacked with the first circuit board 31. The second circuit board 38 as a whole can be roughly rectangular. One of the length direction and the width direction of the second circuit board 38 can be the same as the length direction of the first circuit board 31, and the other can be the same as the width direction of the first circuit board 31. In some other embodiments, the second circuit board 38 can also be a square plate or an irregular plate, which is not limited in this application.

[0177] The second circuit board 38 has a third surface 38a and a fourth surface 38b that face each other. The third surface 38a and the fourth surface 38b are arranged along the thickness direction of the second circuit board 38. The third surface 38a faces the first surface 31a, and the fourth surface 38b faces away from the first surface 31a and faces the back cover 21. That is, the second circuit board 38 is arranged opposite the first surface 31a. The third electronic component 323 can be arranged on the fourth surface 38b. The manner in which the third electronic component 323 is arranged on the fourth surface 38b can be similar to the manner in which the first electronic component 321 is arranged on the first surface 31a, and will not be repeated here. In some other embodiments, the electronic component 32 may further include a fifth electronic component (not shown in the figure), which is arranged on the third surface 38a. In this way, by stacking the second circuit board 38 and the first circuit board 31, electronic components can be arranged on both the first circuit board 31 and the second circuit board 38 at the same time, achieving the centralized arrangement of more electronic components within a limited area, reducing the area occupied by the circuit board assembly 30, and thus achieving the overall miniaturization of the electronic device 100.

[0178] The third circuit board 39 can also be referred to as a frame board. Specifically, the third circuit board 39 is stacked between the first circuit board 31 and the second circuit board 38. The third circuit board 39 can be fixed to the first surface 31a of the first circuit board 31 and the third surface 38a of the second circuit board 38 by welding. The third circuit board 39 can also be electrically connected to both the first circuit board 31 and the second circuit board 38 to achieve electrical connection between the first circuit board 31 and the second circuit board 38, thereby enabling signal transmission between the first circuit board 31 and the second circuit board 38. In other words, the first frame is connected between the first surface 31a and the second circuit board 38, and the first frame is electrically connected to both the first circuit board 31 and the second circuit board 38. The third circuit board 39 has a first through hole 39a. The wall of the first through hole 39a, a portion of the first surface 31a, and a portion of the third surface 38a enclose a first accommodating cavity 30a. The wall of the first through hole 39a forms a portion of the inner wall of the first accommodating cavity 30a.

[0179] In this way, the third circuit board 39 provides structural and electrical connections between the first circuit board 31 and the second circuit board 38, making the structure of the circuit board assembly 30 more stable and the signal transmission between the first circuit board 31 and the second circuit board 38 more reliable. In addition, circuits can also be arranged on the third circuit board 39, giving the circuit board assembly 30 more functions.

[0180] In the embodiment shown in Figure 24 , the first shielding cover 33 can form a third housing, that is, the third housing is the first shielding cover 33. The first shielding cover 33 can be mounted on the fourth surface 38b of the second circuit board 38. The manner in which the first shielding cover 33 is mounted on the fourth surface 38b can be similar to the manner in which the first shielding cover 33 is mounted on the first surface 31a of the first circuit board 31, and will not be further described here. The first shielding cover 33 is fixed to the fourth surface 38b of the second circuit board 38 and, together with the fourth surface 38b, defines a third accommodating cavity 30c. The third electronic component 323 is located within the third accommodating cavity 30c.

[0181] In the embodiment shown in Figure 24, the first circuit board 31 can be an application processor (AP) board, the first electronic component 321 and the second electronic component 322 can be a system on a chip (SoC), a dynamic random access memory, a power management chip (PMIC), etc.; the second circuit board 38 can be a radio frequency chip (RF) board, and the third electronic component 323 can be a radio frequency power amplifier (RFPA), a wireless fidelity (WIFI) chip, etc.

[0182] On this basis, the number of heat-conducting components 34 can be one. In the embodiments shown in Figures 24 and 25 , the heat-conducting component 34 is used to dissipate heat for the first electronic component 321. The connection structure between the heat-conducting component 34 and the first housing formed by the first circuit board 31, the second circuit board 38, and the third circuit board 39, and the first electronic component 321 can refer to the connection structure between the heat-conducting component 34 and the first housing formed by the first circuit board 31 and the first shielding cover 33, and the first electronic component 321, and will not be repeated here.

[0183] In other embodiments, there may be two heat-conducting components 34, with the first heat-conducting component 34 used to dissipate heat for the first electronic component 321. The second heat-conducting component 34 is used to dissipate heat for the third electronic component 323. The connection structure between the second heat-conducting component 34, the third housing formed by the second circuit board 38 and the first shielding cover 33, and the first electronic component 321 can refer to the connection structure between the heat-conducting component 34, the first circuit board 31, the first shielding cover 33, and the first electronic component 321 described above, and will not be further described here. In this case, the first shielding cover 33 and the heat-conducting film layer disposed between the first shielding cover 33 and the back cover 21 can form a heat-conducting structure 50.

[0184] In this case, if the structure of the first cover plate formed by the second circuit board 38 is the same as the structure of the first cover plate formed by the shielding cover 332 in the embodiment shown in FIG17 , the circuit board assembly 30 may further include a fourth cover plate (not shown in the figure). The connection structure between the fourth cover plate and the second circuit board 38 can refer to the connection structure between the second cover plate 35 and the first cover plate in the embodiment shown in FIG17 . If the structure of the first cover plate formed by the second circuit board 38 and the structure of the first heat-conducting component 34 are the same as the structure of the first cover plate formed by the shielding cover 332 and the heat-conducting component 34 in the embodiment shown in FIG18 , the metal layer structure 3415 of the first heat-conducting component 34 can directly contact the second heat-conducting component 34. In this way, the heat generated by the first electronic component 321 can be quickly transferred from the first heat-conducting component 34 to the second heat-conducting component 34 and the first shielding cover 33, thereby improving the heat dissipation efficiency of the first electronic component 321.

[0185] In yet other embodiments, the second heat-conducting component 34 may also be used to dissipate heat for the second electronic component 322. In yet other embodiments, the third electronic component 323 may also be disposed on the third surface 38a of the second circuit board 38 and located within the first accommodating cavity 30a. In this case, the circuit board assembly 30 may also not include the first shielding cover 33, and the heat-conducting film layer disposed between the second circuit board 38 and the back cover 21 forms the heat-conducting structure 50.

[0186] In some other embodiments, the number of heat-conducting components 34 may also be three, the first heat-conducting component 34 is used to dissipate heat for the first electronic component 321 , the second heat-conducting component 34 is used to dissipate heat for the third electronic component 323 , and the third heat-conducting component 34 is used to dissipate heat for the second electronic component 322 .

[0187] Please refer to Figures 26 and 27. Figure 26 is another schematic cross-sectional view of the electronic device 100 shown in Figure 1 at line AA, and Figure 27 is a schematic partial structural view of the circuit board assembly 30 of the electronic device 100 shown in Figure 26. The embodiment shown in Figures 26 and 27 differs from the embodiment shown in Figures 24 and 25 in that the circuit board assembly 30 includes a plurality of welding structures 41, which form a first frame, that is, the first frame includes a plurality of welding structures 41. The plurality of welding structures 41 are arranged at intervals around the first electronic component 321. The surfaces of the plurality of welding structures 41 facing the first electronic component 321, the first surface 31a of the first circuit board 31, and the third surface 38a of the second circuit board 38 enclose the aforementioned first accommodating cavity 30a.

[0188] Specifically, the welding structure 41 includes a first welding pad 411, a second welding pad 412 and a welding material layer 413. The first welding pad 411 is arranged on the first circuit board 31. The first welding pad 411 can be formed on the first surface 31a of the first circuit board 31 by a process method such as electroplating or deposition. The surface of the first welding pad 411 along the thickness direction of the first circuit board 31 can also be coplanar with the first surface 31a, which is not limited in this application. The second welding pad 412 is arranged on the second circuit board 38. The second welding pad 412 can be formed on the third surface 38a of the second circuit board 38 by a process method such as electroplating or deposition. The surface of the second welding pad 412 along the thickness direction of the second circuit board 38 can also be coplanar with the third surface 38a, which is not limited in this application. The welding material layer 413 is arranged between the first welding pad 411 and the second welding pad 412, and the first welding pad 411 and the second welding pad 412 are welded and fixed by the welding material layer 413.

[0189] In this way, relative to the first frame formed by the third circuit board 39 (frame board), in the first frame formed by multiple welding structures 41, there is a gap between two adjacent welding structures 41, which can enable the heat generated by the first electronic component 321 to be directly conducted from the heat-conducting component 34 to the space outside the circuit board assembly 30, thereby improving the heat dissipation efficiency of the first electronic component 321.

[0190] The above embodiment is described using the example of a sealed bag 341 including a sealed bag body 3411, a feeding tube 3412, and an exhaust tube 3413. In other embodiments, the sealed bag 341 may not include the exhaust tube 3413. In this case, the sealed bag 341 is in a vacuum state when not filled with the filling material 342. In some examples, the natural shape of the sealed bag body 3411 (the shape when filled with air but not elastically deformed) can be substantially the same as the shape of the first accommodating cavity 30a, and the initial volume of the sealed bag body 3411 (the volume when not elastically deformed) can also be similar to the volume of the first accommodating cavity 30a. In other examples, the initial volume of the sealing bag body 3411 can be much smaller than the volume of the first receiving cavity 30a, at least if the sealing bag body 3411 is made of a highly elastic material. For example, the first film layer 34111 and the second film layer 34112 of the sealing bag body 3411 can be made of 1 part by weight of polyurethane, 3 parts by weight of polyimide, and 2 parts by weight of polyamide. This allows the sealing bag body 3411 to have good elasticity, making its volume in its natural state much smaller than the volume of the first receiving cavity 30a, thereby facilitating storage and assembly with other components of the circuit board assembly 30.

[0191] The above describes in detail the specific structure of the circuit board assembly 30 provided in the embodiment of the present application. The following describes in detail the method for manufacturing the circuit board assembly 30.

[0192] Please refer to FIG28, which is a structural diagram of a manufacturing process of the circuit board assembly 30 shown in FIG5. The manufacturing method of the circuit board assembly 30 includes the following steps:

[0193] S10 : providing a first circuit board 31 , wherein the first circuit board 31 has a first surface 31 a , which is a surface of the first circuit board 31 distributed along a thickness direction thereof, and a first electronic component 321 is provided on the first surface 31 a .

[0194] S20: The sealing bag 341 and the first shielding cover 33 are arranged on the side facing the first surface 31a, and the first shielding cover 33 is fixed to the first surface 31a, so that the first shielding cover 33 and the first surface 31a enclose a first accommodating cavity 30a, and the sealing bag body 3411 of the sealing bag 341 and the first electronic component 321 are located in the first accommodating cavity 30a, and the feeding barrel 3412 of the sealing bag is exposed to the outside of the first accommodating cavity 30a from the first opening 33a opened on the first circuit board 31 or the first shielding cover 33, and the exhaust pipe 3413 is exposed to the outside of the first accommodating cavity 30a from the second opening 33b opened on the first circuit board 31 or the first shielding cover 33; wherein, the sealing bag 341 is a flexible sealing bag, and the internal space of the sealing bag body 3411 is connected to the internal space of the feeding barrel 3412 and the exhaust pipe 3413.

[0195] That is, the sealing bag 341 and the first cover are positioned on the side facing the first surface 31a, and the first cover is fixed to the first surface 31a so that the first cover and the first surface 31a enclose a first accommodating cavity 30a, and the first electronic component 321 and the sealing bag body 3411 of the sealing bag 341 are positioned within the first accommodating cavity 30a, with the end of the feeding barrel 3412 of the sealing bag 341 away from the sealing bag body 3411 exposed to the outside of the first accommodating cavity through the first circuit board 31 or the first opening 33a of the first cover. The structure, material, etc. of the first shielding cover 33 can be referred to above and will not be repeated here. The structure, material, etc. of the sealing bag 341 can be referred to above and will not be repeated here.

[0196] Specifically, step S20 may include step S21 and step S22.

[0197] S21: Place the sealing bag 341 on the side facing the first surface 31a. Specifically, the sealing bag 341 can be stacked on the first electronic component 321. The sealing bag 341 is initially compressed. The inner cavity of the sealing bag 341 can be in a perfect vacuum state or contain a small amount of air, which is not limited in this application.

[0198] S22: Weld the first shielding cover 33 to the first surface 31a, that is, weld the first cover body to the first surface 31a. Specifically, the first shielding cover 33 can be welded to the first surface 31a by reflow soldering to fix the first shielding cover 33 to the first surface 31a.

[0199] S30: Filling material 342 is introduced into the inner cavity of sealing bag 341 via feeding cylinder 3412, so that sealing bag body 3411 covers the outside of first electronic component 321 and the area on first surface 31a not covered by first electronic component 321. In this case, if a small amount of air initially remains in the inner cavity of sealing bag 341, the air is exhausted from exhaust cylinder 3413.

[0200] S40: Close the opening of the feed cylinder 3412 and the opening of the exhaust cylinder 3413. Specifically, the process of filling the sealing bag 341 with the filling material 342 via the feed cylinder 3412 in step S30, and the process of closing the feed cylinder 3412 and the exhaust cylinder 3413 in step S40, can be referred to the filling process shown in FIG7 , and will not be further described here. Possible materials for the filling material 342 are described above and will not be further described here.

[0201] In this way, by first welding and fixing the first shielding cover 33 to the first surface 31a of the first circuit board 31, and then filling the filling material 342 into the sealing bag 341, the high temperature of welding the first shielding cover 33 to the first surface 31a will not affect the area covered by the sealing bag body 3411 on the first electronic component 321 and the first surface 31a, thereby ensuring the heat dissipation effect of the heat-conducting component 34 formed by the sealing bag 341 and the filling material 342 on the first electronic component 321.

[0202] Please refer to FIG29, which is a schematic diagram of the structure of the disassembly process of the circuit board assembly 30 shown in FIG28. The specific steps include:

[0203] S100: Open the sealed end of the feed cylinder 3412 exposed at the first opening 33a, and open the sealed end of the exhaust cylinder 3413 exposed at the second opening 33b. Specifically, the sealed ends of the feed cylinder 3412 and the exhaust cylinder 3413 can be softened by laser irradiation to form openings.

[0204] S200: Using a suction device to extract the filling material 342 from the opening of the feeding cylinder 3412 and / or the opening of the exhaust cylinder 3413 until all the filling material 342 is out of the sealing bag 341. Specifically, the filling material 342 can be extracted by a piston-type extraction device.

[0205] S300: removing the first shielding cover 33 from the first circuit board 31. Specifically, the first shielding cover 33 can be removed from the first circuit board 31 by a thermal shearing method, a mechanical separation method, a chemical stripping method, or the like.

[0206] S400: removing the sealing bag 341 .

[0207] In the above disassembly steps, steps S300 and S400 can be performed simultaneously. That is, after removing the filling material 342, the first shielding cover 33 and the sealing bag 341 can be removed from the first circuit board 31. This prevents direct contact between the filling material 342 and the first electronic component 321, eliminating the need to clean the filling material 342 from the surface of the first electronic component 321 before repairing it, thus reducing the difficulty of disassembly and the maintenance cycle.

[0208] In some other embodiments, please refer to FIG30, which is a schematic structural diagram of another manufacturing process of the circuit board assembly 30 shown in FIG5. In the embodiment shown in FIG30, steps S10, S30, and S40 are the same as those in the embodiment shown in FIG28. The embodiment shown in FIG30 differs from the embodiment shown in FIG28 in that step S20 includes step S21 and step S22.

[0209] S21: Secure the sealing bag 341 to the inner cavity of the first shielding cover 33, that is, secure the sealing bag 341 to the inner cavity of the first cover body. Specifically, the sealing bag body 3411 can be bonded to the shielding cover 332 of the first shielding cover 33 using a thermally conductive adhesive. The thermally conductive adhesive can be thermally conductive acrylic or thermally conductive gel. The thickness of the thermally conductive adhesive can be greater than or equal to 0.01 mm and less than or equal to 3 mm. For example, the thickness of the thermally conductive adhesive can be 0.01 mm, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.7 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3 mm, etc.

[0210] S22: Weld the first shielding cover 33 to the first surface 31a, that is, weld the first cover body to the first surface 31a. Specifically, the first shielding cover 33 can be welded to the first surface 31a by reflow soldering to fix the first shielding cover 33 to the first surface 31a.

[0211] In some other embodiments, please refer to FIG31, which is a structural diagram of the manufacturing process of the circuit board assembly 30 shown in FIG25. The manufacturing method of the circuit board assembly 30 includes the following steps:

[0212] S10: Provide a first circuit board 31, the first circuit board 31 has a first surface 31a and a second surface 31b opposite to each other, the first surface 31a and the second surface 31b are two surfaces distributed along the thickness direction of the first circuit board 31, the first surface 31a is provided with a first electronic component 321, and the second surface 31b is provided with a second electronic component 322.

[0213] S20: The sealing bag 341, the second circuit board 38 and the third circuit board 39 are arranged on the side facing the first surface 31a, and the third circuit board 39 is fixed between the first surface 31a and the second circuit board 38, so that the second circuit board 38, the third circuit board 39 and the first surface 31a enclose a first accommodating cavity 30a, and the sealing bag body 3411 of the sealing bag 341 and the first electronic component 321 are located in the first accommodating cavity 30a, and the end of the sealing bag feeding barrel 3412 away from the sealing bag body 3411 is exposed to the outside of the first accommodating cavity 30a from the first opening 33a opened on the first circuit board 31 or the second circuit board 38 or the third circuit board 39, and the exhaust pipe 3413 is exposed to the outside of the first accommodating cavity from the second opening 33b opened on the first circuit board 31 or the second circuit board 38 or the third circuit board 39; wherein, the sealing bag 341 is a flexible sealing bag, and the sealing bag body 3411 and the feeding barrel 3412 and the exhaust pipe 3413 are all connected.

[0214] The second circuit board 38 and the third circuit board 39 may form a first housing, that is, the first housing includes the second circuit board 38 and the third circuit board 39, and the third circuit board 39 is connected between the first surface 31a and the second circuit board 38. The connection structure of the second circuit board 38, the third circuit board 39, and the first circuit board 31 can be referred to above and will not be repeated here.

[0215] Specifically, step S20 may include step S21 and step S22.

[0216] S21: Secure the sealing bag 341 to the inner cavity defined by the second and third circuit boards 38 and 39. Specifically, the sealing bag body 3411 can be bonded to the third surface 38a of the second circuit board 38 using a thermally conductive adhesive. The composition and thickness of the thermally conductive adhesive are as described above and are not further detailed here.

[0217] S22: Solder the third circuit board 39 to the first surface 31a. Specifically, the third circuit board 39 can be soldered to the first surface 31a by reflow soldering to fix the third circuit board 39 and the second circuit board 38 to the first surface 31a.

[0218] S30: Solder the second shielding cover 36 to the second surface 31b of the first circuit board 31, and position the second electronic component 322 within the second receiving cavity 30b defined by the second shielding cover 36 and the second surface 31b. Step S30 can be performed simultaneously with step S22, before step S22, or after step S22, as is not limited in this application.

[0219] S40: This step can refer to step S30 in the embodiment shown in FIG28 and will not be described in detail here.

[0220] S50: This step can refer to step S40 in the embodiment shown in FIG28 and will not be described in detail here.

[0221] In some other embodiments, please refer to FIG32, which is a structural diagram of the manufacturing process of the circuit board assembly 30 provided in some other embodiments of the present application. The manufacturing method of the circuit board assembly 30 includes the following steps:

[0222] S10: This step can refer to step S10 in the embodiment shown in FIG28 and will not be described in detail here.

[0223] S20: This step differs from step S20 in the embodiment shown in FIG28 in that the sealing bag 341 does not include the exhaust tube 3413, and only the feeding tube 3412 is exposed from the first opening 33a to the outside of the first accommodating chamber 30a. Based on this, step S20 includes steps S21-S23:

[0224] S21: placing the first shielding cover 33 on the first surface 31 a, that is, first placing the first cover body on the first surface 31 a to enclose the first accommodating cavity 30 a with the first surface 31 a.

[0225] S22: Place the sealing bag body 3411 into the first accommodating cavity 30a through the first opening 33a.

[0226] S23: Weld the first shielding cover 33 to the first surface 31 a.

[0227] It should be noted that step S23 can be performed after step S21 or after step S22, and this application does not limit this.

[0228] S30: This step can refer to step S30 in the embodiment shown in FIG28 and will not be described in detail here.

[0229] S40: This step can refer to step S40 in the embodiment shown in FIG. 28 , except that this step only closes the opening of the feed barrel 3412 .

[0230] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0231] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that: include: a first circuit board having a first surface; a first cover body, the first cover body being fixed to the first surface and forming a first accommodating cavity with the first surface; a first electronic component, the first electronic component being disposed on the first surface and located in the first accommodating cavity; A sealing bag, the sealing bag being used to accommodate a filling material; the sealing bag comprising a sealing bag body and a feeding cylinder, the internal spaces of which are connected, the sealing bag body being arranged in the first accommodating cavity, and the sealing bag body being flexible; The first cover or the first circuit board has a first opening, and one end of the feeding cylinder away from the sealing bag body is exposed to the outside of the first accommodating cavity through the first opening.

2. The circuit board assembly according to claim 1, wherein: The circuit board assembly further comprises: A filling material is filled in the inner cavity of the sealing bag, and the filling material has fluidity so that the sealing bag body covers the outside of the first electronic component and the area on the first surface not covered by the first electronic component; the filling material is a thermal conductive material or a heat storage material.

3. The circuit board assembly according to claim 2, wherein: At least a portion of the sealing bag body has elasticity.

4. The circuit board assembly according to claim 2, wherein: The first cover includes a first frame and a first cover plate, the first cover plate is arranged opposite to the first surface, the first frame is connected between the first cover plate and the first surface, and the first opening is opened in the first cover plate; The sealing bag body includes a main body portion and a convex portion that are connected. The main body portion is located in the first accommodating cavity, the convex portion is located in the first opening, and the feeding cylinder is connected to the convex portion.

5. The circuit board assembly according to claim 4, wherein: The circuit board assembly further comprises: a second cover plate, the second cover plate being arranged at the first opening and blocking the first opening, the second cover plate being a metal structural member; the thickness of the second cover plate being smaller than the thickness of the first cover plate, and / or the thermal conductivity of the second cover plate being greater than the thermal conductivity of the first cover plate.

6. The circuit board assembly according to claim 4, wherein: The sealing bag further comprises a metal layer structure, wherein the metal layer structure is laminated and bonded to the outer surface of the protrusion; A portion of the protrusion protrudes from the surface of the first cover plate facing away from the first surface, and a fitting gap exists between the outer side surface of the metal layer structure and the inner side wall of the first opening; or The outer side surface of the metal layer structure is in contact with the inner side wall of the first opening.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that: The first cover is a metal structural component.

8. The circuit board assembly according to any one of claims 1 to 6, characterized in that: The first cover comprises: a second circuit board, the second circuit board being arranged opposite to the first surface; The first frame is connected between the first surface and the second circuit board, and the first frame is electrically connected to both the first circuit board and the second circuit board.

9. The circuit board assembly according to claim 8, wherein: The first frame includes a third circuit board, which is stacked between the first circuit board and the second circuit board. The third circuit board has a first through hole, and a hole wall of the first through hole forms a part of the inner wall of the first accommodating cavity.

10. The circuit board assembly according to claim 8, wherein: The first frame includes a plurality of welding structures, which are arranged at intervals around the first electronic component; the welding structures include: a first soldering pad, the first soldering pad being disposed on the first circuit board; a second soldering pad, the second soldering pad being disposed on the second circuit board; A welding material layer is provided between the first welding pad and the second welding pad.

11. The circuit board assembly according to any one of claims 1 to 6, wherein: The sealing bag body includes a first film layer and a second film layer stacked and joined from the outside to the inside. The first film layer is made of a non-conductive material, and the second film layer is made of a polymer matrix and a thermally conductive filler.

12. The circuit board assembly according to claim 11, wherein: The thermally conductive filler includes at least one of a metal material, a ceramic material and a carbon-based material.

13. The circuit board assembly according to claim 2, wherein: The sealing bag further includes an exhaust tube, which is communicated with the inner space of the sealing bag body; one end of the exhaust tube away from the sealing bag body is exposed to the outside of the first accommodating cavity through the first opening.

14. The circuit board assembly according to claim 2, wherein: The sealing bag further includes an exhaust cylinder, which is communicated with the internal space of the sealing bag body; The first cover or the first circuit board has a second opening, the second opening is spaced apart from the first opening, and one end of the exhaust pipe away from the sealing bag body is exposed to the outside of the first accommodating cavity through the second opening.

15. The circuit board assembly according to claim 13 or 14, characterized in that: The sealed bag also includes: At least one partition layer is provided on the inner wall of the sealing bag body to divide the inner cavity of the sealing bag into a plurality of sub-accommodating cavities, and the plurality of sub-accommodating cavities are all connected to the feeding cylinder and the exhaust cylinder.

16. The circuit board assembly according to claim 15, wherein: The sealed bag body comprises a first bag wall and a second bag wall arranged opposite to each other; The separation layer includes a first separation layer and a second separation layer, the first separation layer and the second separation layer are alternately arranged along a first direction, the first separation layer extends from the first bag wall to the direction close to the second bag wall, and the second separation layer extends from the second bag wall to the direction close to the first bag wall; The feeding cylinder and the exhaust cylinder are respectively connected to two ends of the sealing bag body along the first direction; The first direction is parallel to the first surface and intersects with the arrangement direction of the first bag wall and the second bag wall.

17. The circuit board assembly according to claim 15, wherein: The thermal conductivity of the separation layer is lower than the thermal conductivity of the filling material.

18. The circuit board assembly according to any one of claims 1 to 6, characterized in that: The circuit board assembly further comprises: A first heat-conducting member is provided on the sealing bag body and in contact with the first cover body, and a thermal conductivity coefficient of the first heat-conducting member is greater than a thermal conductivity coefficient of the filling material.

19. The circuit board assembly according to claim 18, wherein: The first heat conducting member extends along a serpentine path.

20. The circuit board assembly according to any one of claims 2 to 6, wherein: The thermal storage material includes aerogel or cooling liquid; The thermally conductive material includes a polymer matrix and a thermally conductive filler; and / or liquid metal.

21. An electronic device, characterized in that: include: a housing, the housing comprising a first wall panel; A circuit board assembly, wherein the circuit board assembly is the circuit board assembly according to any one of claims 1 to 20, wherein the first wall plate and the first circuit board are stacked and located on a side of the first cover facing away from the first surface; The heat-conducting structure is disposed between the first cover and the first wall plate, and is thermally conductive with both the first cover and the first wall plate.

22. A method for manufacturing a circuit board assembly, characterized in that: include: Providing a first circuit board, the first circuit board having a first surface, the first surface being provided with a first electronic component; The sealing bag and the first cover are arranged on the side facing the first surface, and the first cover is fixed to the first surface so that the first cover and the first surface enclose a first accommodating cavity, and the first electronic component and the sealing bag body of the sealing bag are located in the first accommodating cavity, so that the end of the sealing bag feeding barrel away from the sealing bag body is exposed to the outside of the first accommodating cavity through a first opening provided in the first circuit board or the first cover; wherein the sealing bag body is flexible, and the internal space of the sealing bag body is connected to the internal space of the feeding barrel; Filling the inner cavity of the sealing bag with a filling material through the feeding cylinder so that the sealing bag body covers the outside of the first electronic component and the area on the first surface not covered by the first electronic component; The opening of the feeding barrel is closed.

23. The manufacturing method according to claim 22, characterized in that: The method comprises: arranging a sealing bag and a first cover body on the side facing the first surface, and fixing the first cover body to the first surface, comprising: placing the sealed bag on the side facing the first surface; The first cover is welded to the first surface.

24. The manufacturing method according to claim 22, characterized in that: The method comprises: arranging a sealing bag and a first cover body on the side facing the first surface, and fixing the first cover body to the first surface, comprising: Fixing the sealing bag body to the inner cavity of the first cover body; The first cover is welded to the first surface.

25. The manufacturing method according to claim 22, characterized in that: The method comprises: arranging a sealing bag and a first cover body on the side facing the first surface, and fixing the first cover body to the first surface, comprising: placing the first cover on the first surface to enclose the first accommodating cavity with the first surface; Place the sealing bag body into the first accommodating cavity through the first opening of the first cover; The first cover is welded to the first surface.

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